JP7340388B2 - soldering equipment - Google Patents

Description

The present invention relates to a soldering device.

2. Description of the Related Art Conventionally, there is a soldering device that solders a substrate by jetting solder from a nozzle. In this type of soldering apparatus, a technique has been proposed in which the outer periphery of the nozzle is tapered to widen the inlet at the base end of the nozzle in order to suppress a drop in temperature of the solder flowing into the solder.

Japanese Patent Application Publication No. 2004-106004

However, in the conventional technology, since the internal space through which the solder passes tapers toward the jet nozzle, for example, when flushing is performed to remove an oxide film formed at the jet nozzle, the flow of solder becomes uneven. There was a possibility that the oxide film could not be removed with high precision.

The present invention has been made in view of the above, and an object of the present invention is to provide a soldering device that can remove, with high precision, an oxide film formed at the spout of a nozzle.

In order to solve the above-mentioned problems and achieve the objects, a soldering device according to the present invention includes a nozzle and a plate member. The nozzle has a tapered outer circumferential portion such that a portion of the internal space through which the solder passes tapers toward the tip. The plate member divides the tapered internal space into a first space corresponding to the tapered portion and a second space corresponding to the size of the ejection port in the nozzle.

According to the present invention, it is possible to remove the oxide film formed at the ejection port of the nozzle with high precision.

FIG. 1 is a diagram showing the configuration of a nozzle included in a soldering apparatus according to an embodiment. FIG. 2 is a diagram showing the configuration of a nozzle included in the soldering apparatus according to the embodiment. FIG. 3 is a side view of the nozzle according to the embodiment. FIG. 4 is a bottom view of the nozzle according to the embodiment. FIG. 5 is a bottom view of a nozzle according to a modification.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a soldering apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the embodiments described below.

The soldering device 1 according to the embodiment is a so-called nozzle flow type soldering device that locally solders the substrate by jetting the solder stored in the solder tank from the nozzle 10.

1 and 2 are diagrams showing the configuration of a nozzle 10 included in a soldering apparatus 1 according to an embodiment. FIG. 1 shows a perspective view showing the appearance of the nozzle 10. As shown in FIG. Further, FIG. 2 shows a cross-sectional view taken from the direction A of a cross section cut along the dashed-dotted line in FIG.

Although FIGS. 1 and 2 only show the nozzle 10 included in the soldering device 1, the soldering device 1 also includes a solder tank that stores molten solder, and a solder tank that transfers solder from the solder tank to the nozzle 10. It is equipped with a pump for pressure feeding, a heater for heating and melting the solder, etc. Note that the configuration of the nozzle 10 will be specifically described below.

As shown in FIGS. 1 and 2, the nozzle 10 is a substantially rectangular tube member, and has a spout 120 through which solder flows and an inlet 121 through which solder flows from the solder bath. In this embodiment, the spout 120 and the inlet 121 are approximately rectangular, but the opening shapes of the spout 120 and the inlet 121 are not limited to the rectangular shape, but may be circular, triangular, L-shaped, or V-shaped. It may be any shape such as a letter.

Further, as shown in FIGS. 1 and 2, the nozzle 10 has an outer peripheral portion 101 having a rectangular external shape and a base portion 104 connected to a solder bath (not shown). Further, the outer peripheral portion 101 has a tapered portion 102 (hereinafter referred to as a tapered portion 102).

Specifically, the tapered portion 102 is provided at a position corresponding to one side of the nozzle 10, which has a rectangular shape when viewed from above, and the internal space 20 (see FIG. 2) tapers from the base end to the tip end of the nozzle 10. This is the part that is formed like this.

Note that in this embodiment, the tapered portion 102 is provided only at a position corresponding to one side of the nozzle 10 that is rectangular in top view; It may be provided at a position corresponding to the above.

Further, as shown in FIG. 2, a part of the nozzle 10 near the spout 120 has a double tube structure, and the solder that has returned without being soldered passes through the inside of the double tube structure. It is configured to run along the outside of the tapered portion 102 and return to the solder bath. The size of the spout 120 is such that the solder jet is not biased, that is, the straightness of the solder is not impaired.

Here, the flow of solder will be explained using FIG. 2. As shown in FIG. 2, the solder flows into the internal space 20 from the inlet 121 of the nozzle 10 when it is pumped from the solder bath by a pump (not shown).

At this time, since the inlet port 121 of the nozzle 10 is wider than the jet port 120 due to the tapered portion 102, the temperature of the solder passing through the nozzle 10 is less likely to drop. In other words, the tapered portion 102 can prevent the temperature of the solder from decreasing by expanding the internal space 20.

The solder that has flowed into the internal space 20 is pushed up toward the spout 120 of the nozzle 10 and is jetted from the spout 120, thereby being soldered to the substrate. Furthermore, the solder that has not been soldered to the board flows along the outside of the tapered portion 102 and returns to the solder bath. In other words, the tapered portion 102 also serves as a buffer material when the solder returns to the solder bath, and prevents the returned solder from splashing.

Here, since the ejection port 120 of the nozzle 10 is constantly exposed to the atmosphere, an oxide film may be formed on the solder surface near the ejection port 120. Therefore, a method called flushing is used to remove the oxide film by increasing the force of the jet stream.

However, in conventional soldering equipment, when flushing is performed using a nozzle having a tapered portion, the flow of solder becomes uneven and there is a risk that the oxide film cannot be removed with high precision.

Specifically, during flushing, among the solder that passes through the internal space, the solder that passes near the tapered part flows along the tapered shape, so the flow rate is lower than that of solder that passes in a straight line away from the tapered part. becomes late.

Furthermore, since solder having different flow speeds flows simultaneously in the internal space, the solder no longer flows in a straight line at the spout, resulting in areas where the oxide film cannot be removed.

Therefore, in the soldering apparatus 1 according to the embodiment, a current plate (plate member 103) is provided in the internal space 20 of the nozzle 10 to adjust the flow of solder.

Specifically, the soldering device 1 according to the embodiment has an internal space 20 tapered by the tapered portion 102, a first space 210 corresponding to the tapered portion (the tapered portion 102), and a spout in the nozzle 10. A plate member 103 is provided that divides the space into a second space 220 corresponding to the size of 120. Although the details will be described later, the tip of the spout 120 has a double pipe structure, and the second space 220 is the same size as the inner pipe (in top view) of the spout 120 with the double pipe structure. be.

In other words, the plate member 103 partitions the internal space 20 into a first space 210 and a second space 220 in which the solder flow speeds are different. As a result, the solder flowing in the first space 210 and the second space 220 does not mix in the internal space 20, so that the flow of the solder flowing linearly in the second space 220 is less likely to be disturbed.

Therefore, the solder that has passed through the second space 220 in a straight line is jetted in a straight line without being biased at the jetting port 120, so that the oxide film generated at the jetting port 120 can be removed with high precision.

Note that gaps are formed at the left and right ends of the plate member 103, and the first space and the second space 220 are connected through the gaps. In other words, the solder that has passed through the first space 210 moves from the gap to the second space 220 and is finally jetted out from the spout 120, so that the solder does not stay in the first space 210.

Furthermore, since the amount of solder that moves from the first space 210 to the second space 220 is small, the flow of solder flowing linearly in the second space 220 is unlikely to be disturbed. This point will be explained using FIG. 3.

FIG. 3 is a side view of the nozzle 10 according to the embodiment. The left view in FIG. 3 shows a part of the cross-sectional view shown in FIG. 2, and the right view in FIG. FIG.

As shown in the left diagram of FIG. 3, the vicinity of the ejection port 120 of the nozzle 10 has a double pipe structure. Specifically, in the double tube structure of the nozzle 10, the outer tube (outer tube) is formed by the outer circumferential part 101a and the outer circumferential part 101b, and the inner tube (inner tube) is formed by the outer circumferential part 101a and the outer circumferential part. 101c.

The outer tube formed by the outer circumferential part 101a and the outer circumferential part 101b is a part for preventing solder jetted during soldering from jumping out to the outside. Further, the inner tube (inner tube) formed by the outer circumferential portion 101a and the outer circumferential portion 101c functions as a guide portion for returning unsoldered solder to the solder bath.

Specifically, the outer peripheral part 101c is connected to the tapered part 102, so that the solder flows to the outside of the tapered part 102 through between the outer peripheral part 101c and the outer peripheral part 101b, and finally returns to the solder bath.

Further, as shown in the left diagram of FIG. 3, the plate member 103 extends straight in the extending direction of the nozzle 10 (the extending direction of the outer circumferential portion 101c) from the connecting position of the tapered portion 102 and the outer circumferential portion 101c. .

In other words, the plate member 103 is placed at a position where the size (area) of the second space 220 when viewed from above is the same as the size of the inner tube (the opening formed by the outer peripheral portion 101a and the outer peripheral portion 101c) when viewed from above. provided.

Thereby, the solder passing through the second space 220 can be jetted without loss, and it is possible to prevent a turbulent flow when the solder moves from the second space 220 to the spout 120. That is, solder can be jetted in a straight line without loss.

Further, as shown in the left and right figures of FIG. 3, the end 103a of the plate member 103 on the jet port 120 side is in contact with the nozzle 10 (outer circumference 101c). Thereby, the flow of solder that has the most force (flows quickly) in the first space 210 can be stopped at the end portion 103a.

That is, by moving the solder that has the most momentum from the first space 210 to the second space 220 while maintaining a fast flow, it is possible to reduce the possibility that the straightness of the solder is hindered.

Note that the end portion 103a of the plate member 103 does not necessarily need to come into contact with the nozzle 10 (outer peripheral portion 101c) as long as the flow of solder passing through the first space 210 can be stopped.

Further, as shown in the left diagram of FIG. 3, the contact position between the plate member 103 and the nozzle 10 is the end of the tapered portion 102 on the spout 120 side. Thereby, the solder passing through the second space 220 can smoothly flow to the spout 120. That is, it is possible to prevent the straightness of solder passing through the second space 220 from being hindered.

Further, as shown in the right view of FIG. 3, a gap 300 is provided between the left and right ends of the plate member 103 and the outer peripheral portion 101. In other words, the length of the plate member 103 in the width direction perpendicular to the height direction is shorter than the length of the outer peripheral portion 101a in the width direction.

That is, both ends of the plate member 103 in the width direction perpendicular to the height direction of the nozzle 10 are separated from the nozzle 10 (outer peripheral portion 101a). Thereby, the solder that has flowed into the first space 210 can be prevented from staying in the first space 210.

Note that since the amount of solder that moves from the first space 210 to the second space 220 through the gap 300 is small, even if the solder moves from the first space 210 to the second space 220, the second space 220 cannot be moved in a straight line. Obstruction of the flow of solder can be minimized.

Next, the bottom surface of the nozzle 10 will be described using FIG. 4. FIG. 4 is a diagram showing a bottom view of the nozzle 10 according to the embodiment. As shown in FIG. 4, the inlet 121 of the nozzle 10 has a substantially rectangular shape if it is not blocked by the plate member 103.

If the inlet 121 of the nozzle 10 is rectangular, the amount of solder flowing into the first space 210 will be large, so that it will not be able to move from the first space 210 to the second space 220 through the gap 300 described above. Unused solder ends up remaining.

Therefore, as shown in FIG. 4, the plate member 103 partially closes the opening corresponding to the first space 210 of the inlet 121 of the nozzle 10. Specifically, the plate member 103 extends from the end of the tapered portion 102 to the inlet 121, and is bent toward the first space 210 to partially block the inlet 121.

More specifically, the plate member 103 closes a part of the opening corresponding to the first space 210 and does not block the opening corresponding to the second space 220, so that the inflow port 121 can be viewed from the bottom. Make it look like this.

As a result, the amount of solder flowing into the first space 210 can be reduced without reducing the amount of solder flowing into the second space 220, so that it is possible to suppress the solder from remaining in the first space 210. .

Furthermore, the plate member 103 protrudes from the first space 210 side of the inlet 121 toward the base 104 side when viewed from the bottom. That is, the plate member 103 is configured as an L-shaped member. Thereby, for example, the plate member 103 can be easily fixed to the base 104 or the like.

As described above, the soldering device 1 according to the embodiment includes the nozzle 10 and the plate member 103. The nozzle 10 has a tapered outer peripheral portion 101 such that a portion of the internal space 20 through which the solder passes tapers toward the tip. The plate member 103 divides the tapered internal space 20 into a first space 210 corresponding to the tapered portion 102 and a second space 220 corresponding to the size of the ejection port 120 in the nozzle 10 . As a result, the oxide film formed on the ejection port 120 of the nozzle 10 can be removed with high precision.

In addition, although the plate member 103 was configured as an L-shaped member in the above example, it is not limited to this. Another example of the plate member 103 will be described using FIG. 5.

FIG. 5 is a bottom view of the nozzle 10 according to a modification. As shown in FIG. 5, the plate member 103 partially closes the opening corresponding to the first space 210 of the inlet 121 of the nozzle 10, similarly to FIG.

In FIG. 5, the plate member 103 is formed to surround the inlet 121 of the nozzle 10, unlike in FIG. Specifically, the plate member 103 surrounds the four sides of the rectangular inlet 121 when viewed from the bottom, and is connected to a portion that closes the inlet 121 corresponding to the first space 210 .

The plate member 103 is fixed to the base 104 at a portion surrounding the four sides of the inlet 121. Thereby, the plate member 103 can be firmly fixed to the base 104.

Further advantages and modifications can be easily deduced by those skilled in the art. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

1 Soldering device 10 Nozzle 20 Internal space 101 Outer peripheral part 102 Tapered part 103 Plate member 104 Base 120 Spout 121 Inflow port 210 First space 220 Second space 300 Gap

Claims (2)

a nozzle having a tapered outer periphery such that a part of the internal space through which the solder passes tapers toward the tip;
a plate member that partitions the tapered internal space into a first space corresponding to the tapered portion and a second space corresponding to the size of the ejection port in the nozzle ;
The plate member has both ends in a width direction perpendicular to the height direction of the nozzle separated from the nozzle,
The first space and the second space are connected through a gap provided between both ends of the plate member and the nozzle,
The contact position between the plate member and the nozzle is the end of the tapered portion on the spout side.
A soldering device characterized by: The plate member is
The soldering apparatus according to claim 1 , wherein an opening corresponding to the first space among the inflow ports of the nozzle is partially closed.

Images