JP7348018B2 - processing equipment - Google Patents

Description

The present invention relates to a processing apparatus for processing semiconductor wafers and the like.

A grinding device uses a grinding wheel to grind a wafer held on the holding surface of a chuck table.A robot takes out a wafer from a wafer cassette and temporarily places it on a temporary holding table.The temporary holding table detects the center of the wafer, and then The wafer ID (recognition mark), which is an individual identification number formed on the wafer, is read. Thereafter, the conveying means suction-holds the upper surface of the wafer temporarily placed on the temporary holding table with a suction pad, and conveys the wafer from the temporary holding table to the holding surface of the chuck table.

The ID is often printed on the outer periphery of the bottom surface of the wafer, where no devices are formed, so that it can be read even after grinding. It is located below the temporary placement surface on which wafers are temporarily placed on the table. The temporary holding table has a temporary holding surface having a diameter smaller than the diameter of the wafer, and is rotatable by a rotating means, and the reading section reads the temporary holding surface of the lower surface of the wafer rotated by the rotating means. It is possible to read the ID on the outer peripheral portion that protrudes from the placement surface (for example, see Patent Document 1).

Japanese Patent Application Publication No. 2015-099814

Since the reader for reading the ID is located below the outer periphery of the bottom surface of the temporarily placed wafer, if there is dust on the wafer, etc. There is a problem in that dust adhering to the placed wafer falls onto the reading section, making it impossible to read the ID.
Therefore, in a processing apparatus equipped with a reading section that reads a wafer ID, there is a problem of preventing ID reading errors from occurring.

In order to solve the above problems, the present invention provides a temporary holding means for temporarily placing a wafer having a recognition mark on the lower surface on a temporary holding surface, a holding means for holding the wafer, and a holding means for holding the wafer, and a holding means for holding the wafer. A processing device comprising a processing means for processing the wafer, and a conveying means for transporting the wafer from the temporary holding means to the holding means, the temporary holding means being able to protrude the outer peripheral portion of the wafer. a temporary holding table having a surface, and a temporary holding table disposed at a position below the temporary holding surface and directly below the conveyance path of the conveyance means, and a temporary holding table having a surface, and a temporary holding table provided with a temporary holding surface, and a temporary holding table provided with a surface below the temporary holding surface and directly below the conveyance path of the conveyance means, and a temporary holding table having a temporary holding surface. a reading section that reads the recognition mark, and the conveying means includes a suction pad having an opening formed on the lower surface, a suction tube that communicates the opening with a suction source, and a branching section that branches the suction tube. , an air supply pipe that communicates the branch part with an air supply source, a first valve disposed between the branch part of the suction pipe and the suction source, and a first valve disposed in the air supply pipe. 2 valves, horizontal moving means for horizontally moving the suction pad between above the temporary placement means and above the holding means, and control for positioning the suction pad above the reading section using the horizontal moving means. and a second control unit that controls to close the first valve and open the second valve to inject air from the opening of the suction pad. This is a processing device that cleans the reading section with air.

In the processing apparatus according to the present invention, the temporary holding means includes a temporary holding table having a temporary holding surface capable of protruding the outer peripheral portion of the wafer, and a temporary holding table disposed directly below the conveyance path of the conveyance means at a position below the temporary holding surface. , a reading unit that reads a recognition mark on the bottom surface of the wafer that is temporarily placed on the temporary placement surface and protrudes from the temporary placement surface, and the conveyance means includes a suction pad having an opening formed on the bottom surface, and a suction pad using the opening as a suction source. A suction pipe that communicates with each other, a branch part that branches the suction pipe, an air supply pipe that communicates the branch part with an air supply source, and a first valve that is disposed between the branch part of the suction pipe and the suction source; A second valve disposed on the air supply pipe, a horizontal moving means for horizontally moving the suction pad between above the temporary placement means and above the holding means, and a horizontal moving means for moving the suction pad above the reading section. The first control section performs positioning control, and the second control section performs control to close the first valve, open the second valve, and inject air from the opening of the suction pad, thereby injecting air from the opening of the suction pad. It becomes possible to clean the reading section with air. That is, for example, when the transport means is not transporting a wafer and the wafer is not temporarily placed on the temporary storage table, the reading section (camera) is cleaned with air jetted from the opening of the suction pad. By keeping it in a clean state, it is possible to prevent misreading of recognition marks from occurring, and to avoid situations where wafer transport, etc. stops due to misreading, and the processing means is put on standby. Become.

It is a perspective view showing an example of a processing device. FIG. 3 is an enlarged perspective view for explaining temporary storage means and conveyance means. FIG. 3 is a cross-sectional view illustrating a case where a recognition mark on a wafer placed on a temporary holding table is read, the wafer is centered, and then the wafer is transferred from the temporary holding table to a holding means. FIG. 7 is a cross-sectional view illustrating a case where the reading section is cleaned with air jetted from the opening of the suction pad.

The processing apparatus 1 shown in FIG. 1 is an apparatus for grinding a wafer W held on a holding means 30 by the processing means 16, and the front (-Y direction side) on the apparatus base 10 of the processing apparatus 1 is This is an attachment/detachment area where the wafer W is attached to and detached from the means 30, and the rear (+Y direction side) on the device base 10 is where the grinding process of the wafer W held on the holding means 30 is performed by the processing means 16. This is the processing area.
Note that the processing apparatus according to the present invention is not limited to a grinding apparatus in which the processing means 16 is uniaxial like the processing apparatus 1, but is equipped with a rough grinding means and a finish grinding means, and is capable of grinding a wafer with a rotating turntable. A two-axis grinding device or the like may be used in which W can be positioned below each grinding means. Further, the processing device may be a polishing device that performs polishing on the wafer W using a processing means provided with a polishing pad.

The wafer W is, for example, a circular semiconductor wafer made of a silicon base material, but is not limited thereto, and may be made of gallium arsenide, sapphire, ceramics, resin, gallium nitride, silicon carbide, or the like.

The upper surface Wb facing the upper side (+Z direction side) of the wafer W becomes a surface to be ground to be ground. The lower surface Wa, which is the opposite surface to the upper surface Wb, is provided with a device area Wa1 and an outer peripheral surplus area Wa2 surrounding the device area Wa1. The device area Wa1 is partitioned into a grid pattern by a plurality of streets S that intersect at right angles, and a device D such as an IC is formed in each area partitioned into a grid pattern. The lower surface Wa is protected by, for example, pasting a protective tape (not shown). A recognition mark M indicating the material of the wafer W, etc. is printed in the outer peripheral surplus area Wa2.
Note that the wafer W may be a wafer on which the device D is not formed.

As shown in FIG. 1, a box-shaped device casing 11 is disposed on the device base 10 of the processing device 1, and the processing means 16 and the holding means 30 are disposed inside the device casing 11. ing.
For example, a touch panel 12 is disposed on the front surface of the apparatus housing 11 in the -Y direction, through which an operator inputs processing conditions for the wafer W, etc. to the processing apparatus 1.

A first cassette mounting section 150 and a second cassette mounting section 151 are provided on the front side (-Y direction side) of the apparatus base 10. A first cassette 150a that accommodates wafers W is placed therein, and a second cassette 151a that accommodates processed wafers W is placed on the second cassette placement portion 151.

A robot 155 is disposed behind the opening of the first cassette 150a to carry out unprocessed wafers W from the first cassette 150a and carry processed wafers W into the second cassette 151a. Temporary placement means 2 is provided at a position adjacent to robot 155.

Temporary placement means 2 for temporarily placing a wafer W on a temporary placement surface 200 with the bottom surface Wa of the wafer W provided with a recognition mark M in an outer peripheral excess area Wa2 of the bottom surface Wa in contact with the temporary placement surface 200 is shown in FIGS. As shown in the figure, a temporary holding table 20 having a diameter smaller than that of the wafer W is provided, and the flat upper surface of the temporary holding table 20 serves as a temporary holding surface 200 on which the wafer W is temporarily placed while causing the outer peripheral portion of the wafer W to protrude. Become. Around the temporary table 20, a plurality of positioning pins 21 are arranged at equal intervals in an annular shape and are movable in the radial direction of the temporary table 20 to reduce or expand the diameter. The wafer W temporarily placed on the placing table 20 is aligned (centered) at a predetermined position by the diameter-reducing alignment pin 21, and its center is grasped by a control means (not shown) of the processing apparatus 1.

For example, as shown in FIG. 3, the upper end side of a spindle 23 whose axial direction is the Z-axis direction is connected to the lower surface of the temporary table 20, and the lower end side of the spindle 23 is connected via a coupling 231. A rotary motor 24 is connected.
A spindle 23 that rotates the temporary table 20 is rotatably supported by a table base 203 disposed on the device base 10 via a bearing 230.

As shown in FIG. 2, the wafer W aligned in the temporary holding means 2 is placed in a position adjacent to the temporary holding means 2, and the upper surface Wb of the wafer W is held by suction from the temporary holding means 2 to the holding means 30. A conveying means 4 for conveying is provided.
The conveyance means 4 includes a horizontal movement means 40 that horizontally moves the suction pad 42 between above the temporary placement means 2 and above the holding means 30. The horizontal moving means 40 includes an arm part 400 that extends parallel to the horizontal direction and has a suction pad 42 attached to the lower surface of its tip, and an arm part whose axial direction is the Z-axis direction and which is connected to the base of the arm part 400. 400 in the horizontal direction. As shown in FIG. 3, the pivot shaft portion 405 is rotatable by a driving force generated by a rotary motor 405a, and is also movable up and down in the Z-axis direction by a shaft vertical movement means 47 such as an electric cylinder mechanism.

As shown in FIG. 2, the transport means 4 includes a suction pad 42 that suction-holds the upper surface Wb of the wafer W. The suction pad 42 is formed, for example, in a circular shape in plan view, and the lower surface It becomes an adsorption surface that absorbs. As shown in FIG. 3, an opening 421 is formed through the center of the lower surface of the suction pad 42 in the thickness direction, and the opening 421 communicates with a suction source 49 such as a vacuum generator or an ejector mechanism. A deformable rubber suction cup or the like may be provided on the lower surface of the suction pad 42.

For example, a substantially cylindrical arm connecting portion 401 is attached to the upper surface of the suction pad 42, and the arm connecting portion 401 penetrates the arm portion 400 in the thickness direction (Z-axis direction) at the tip of the arm portion 400. It loosely fits into the through hole formed in this manner. The upper part of the arm connecting part 401 is a retaining part 401a whose diameter is enlarged to be larger than that of the through hole.

For example, a coil spring 402 is disposed between the lower surface of the arm section 400 and the upper surface of the suction pad 42, with the arm connecting section 401 inserted and sandwiched between the arm section 400 and the suction pad 42. The impact when the suction pad 42 contacts the wafer W is absorbed by the coil spring 402.

The suction pad 42 holding the wafer W by suction transports the wafer W while forming a substantially arc-shaped transport path L shown in FIG. .

The temporary storage means 2 described above is disposed directly below the transport path L of the wafer W by the suction pad 42 of the transport means 4 at a height below the temporary storage surface 200 of the temporary storage table 20. The wafer W is temporarily placed on the temporary placement surface 200 and has a reading section 29 for reading the recognition mark M on the lower surface Wa of the wafer W whose outer peripheral portion protrudes from the temporary placement surface 200.
In this embodiment, for example, the reading unit 29 is disposed on the table base 203, and includes an optical system such as a lens that captures reflected light from the wafer W, and an imaging unit that outputs a subject image formed by the optical system. It is a camera composed of elements, etc., and can read the recognition mark M on the wafer W by performing image processing on the captured image formed. Further, for example, on the table base 203, a light irradiation unit (not shown) that irradiates the lower surface Wa of the wafer W temporarily placed on the temporary placement table 20 with visible light is arranged in line with the reading unit 29.

As shown in FIGS. 2 and 3, one end of a suction tube 44 that communicates the opening 420 with a suction source 49 communicates with the opening 420 of the suction pad 42 of the conveying means 4 via the arm connecting portion 401. In the middle of the suction tube 44 made of a flexible resin tube or the like, a branch portion 440 such as a three-way tube that branches the suction tube 44 is disposed. One end of an air supply pipe 45 serving as a flow path branched from the suction pipe 44 communicates with the branch portion 440, and the other end of the air supply pipe 45 communicates with an air supply source 48 consisting of a compressor or the like. .

As shown in FIGS. 2 and 3, a first valve 441 is disposed between the branch portion 440 of the suction pipe 44 and the suction source 49. As shown in FIGS. The first valve 441 is, for example, a solenoid valve, and is electrically connected to a second control section 462 that can energize the first valve 441 to switch between opening and closing. Note that the first valve 441 is not limited to a solenoid valve.

A second valve 452 is disposed between the air supply pipe 45 and the air supply source 48. The second valve 452 is, for example, a solenoid valve, and is electrically connected to a second control unit 462 that can energize the second valve 452 to switch between opening and closing. Note that the second valve 452 is not limited to a solenoid valve.

The conveyance means 4 includes a first control section 461 that controls the horizontal movement means 40 to position the suction pad 42 above the reading section 29 . The first control unit 461 is composed of a CPU, etc., and is electrically connected to the horizontal movement means 40.
As an example of the operation control of the horizontal moving means 40 by the first control unit 461, for example, when the rotary motor 405a of the horizontal moving means 40 is a servo motor, the rotary encoder of the servo motor also has a function as a servo amplifier. It is connected to the first control section 461, and after an operation signal is supplied to the servo motor from the first control section 461, the rotation speed of the servo motor is outputted to the first control section 461 as an encoder signal. After receiving the encoder signal, the first control section 461 sequentially recognizes the rotation angle of the rotation shaft section 405 from the origin position, in other words, the position of the suction pad 42 in the horizontal plane (in the X-axis and Y-axis plane). At the same time, the suction pad 42 can be positioned at a desired position.

The conveying means 4 includes a second control section 462 including a CPU and the like that controls closing the first valve 441 and opening the second valve 452 to inject air from the opening 420 of the suction pad 42 . Further, for example, the first control section 461 and the second control section 462 are electrically connected and can mutually transmit and receive information.

As shown in FIG. 1, next to the transport means 4, there is provided an unloading means 154 that rotates while holding the processed wafer W. A single-wafer type cleaning means 156 that cleans the processed wafer W transported by the unloading means 154 is arranged at a position close to the unloading means 154 . The cleaning means 156 holds the lower surface Wa of the wafer W facing downward on a spinner table 156a, and sprays cleaning water onto the upper surface Wb of the wafer W from a cleaning nozzle 156b that moves above the held wafer W. The upper surface Wb is cleaned.

As shown in FIG. 1, a holding means 30 for sucking and holding the lower surface Wa of the wafer W is provided within the movement range of the carrying-out means 154. The holding means 30 is, for example, a chuck table having a circular outer shape, and includes a holding surface 300 made of a porous member or the like and holding the wafer W by suction. The holding means 30 is rotatable about a rotating shaft whose axial direction is the Z-axis direction (vertical direction), and is surrounded by a cover 39, and is connected to the cover 39 and rotates in the Y-axis direction. It is possible to reciprocate on the device base 10 in the Y-axis direction by a Y-axis direction moving means (not shown) disposed under the expandable bellows cover 39a.

A column 100 is erected on the rear side (+Y direction side) of the device base 10, and a ball screw mechanism or the like that feeds the processing means 16 in the Z-axis direction (vertical direction) is installed on the front side of the column 100. A processing feed means 17 is provided.

The processing means 16 that processes the upper surface Wb of the wafer W held by the holding means 30 has a rotating shaft 160 whose axial direction is the Z-axis direction orthogonal to the holding surface 300 of the holding means 30, and a rotating shaft 160 that is rotatable. It includes a housing 161 for supporting, a motor 162 for rotationally driving the rotating shaft 160, a mount 163 attached to the lower end of the rotating shaft 160, and a processing tool 164 detachably connected to the mount 163. The processing tool 164 is a grinding wheel, and includes a wheel base and a plurality of grinding wheels having a substantially rectangular parallelepiped outer shape and arranged in a plurality of rings on the lower surface of the wheel base.

For example, a grinding water flow path (not shown) extending in the Z-axis direction is formed inside the rotating shaft 160, and a grinding water supply means (not shown) is communicated with through a grinding water supply pipe 166 inserted into this grinding water flow path. are doing. Grinding water supplied from the grinding water supply means to the rotating shaft 160 is jetted downward toward the processing tool 164 from the opening at the lower end of the grinding water flow path, and reaches the contact area between the processing tool 164 and the wafer W. .

At a position adjacent to the holding means 30 positioned below the processing means 16, for example, a thickness measuring means 38 for measuring the thickness of the wafer W held by the holding means 30 during grinding by a contact method is provided. It is arranged.

The operation of the processing apparatus 1 shown in FIG. 1 when grinding the wafer W held by the holding means 30 will be described below.
For example, first, the wafer W is unloaded from the first cassette 150a by the robot 155, and the robot 155 moves the wafer W above the temporary storage means 2. Then, the robot 155 places the wafer W on the temporary placement surface 200 of the temporary placement table 20 with the lower surface Wa facing downward. The outer periphery surplus area Wa2, which is the outer periphery of the wafer W, protrudes from the temporary placement surface 200 of the temporary placement table 20.

For example, as shown in FIG. 3, as the temporary table 20 on which the wafer W is placed rotates at a low speed, the recognition mark M formed in the outer peripheral surplus area Wa2 of the lower surface Wa of the wafer W is readable. By passing through the imaging area of the section 29, a captured image in which the recognition mark M is captured is formed by the reading section 29. Then, the reading unit 29 executes image processing using the captured image and reads the recognition mark M on the wafer W. As a result, the processing apparatus 1 recognizes the type of wafer W to be loaded into the holding means 30. Note that in FIG. 3, the holding means 30 is shown in a simplified manner.

After the rotation of the temporary holding table 20 is stopped, the wafer W is moved horizontally on the temporary holding surface 200 by the diameter-reducing positioning pins 21 shown in FIG. 2, and is aligned at a predetermined position (centering). be done.

Next, the transport means 4 shown in FIGS. 2 and 3 transports the centered wafer W to the holding means 30. Specifically, under the control of the first control unit 461, the center of the upper surface Wb of the wafer W facing upward on the temporary storage table 20 is adjusted such that the center of the suction pad 42 is approximately aligned with the center of the upper surface Wb of the wafer W facing upward on the temporary storage table 20. Then, the suction pad 42 is horizontally moved by the horizontal moving means 40 and positioned above the wafer W.

Next, the suction pad 42 is lowered by the shaft vertical movement means 47, and the lower surface, which is the suction surface, of the suction pad 42 comes into contact with the upper surface Wb of the wafer W. Further, under the control of the second control unit 462, the first valve 441 shown in FIG. The suction force generated by the operation of the suction source 49 is transmitted to the lower surface of the suction pad 42 through the suction tube 44, the arm connecting portion 401, and the opening 420 of the suction pad 42. Then, the suction pad 42 suction-holds the wafer W with the upper surface Wb facing upward. Note that the second valve 452 is in a closed state.

The suction pad 42 holding the wafer W by suction rises, moves horizontally, and descends, and the wafer W is transported to the holding means 30 by the transport means 4 . Then, the wafer W is placed on the holding surface 300 with the upper surface Wb facing upward, so that the center of the holding surface 300 of the holding means 30 and the already recognized center of the wafer W substantially match, Furthermore, it is held by suction on the holding surface 300.

Next, the holding means 30 shown in FIG. 1 holding the wafer W moves in the +Y direction to below the processing means 16. The processing means 16 is sent in the -Z direction by the processing feed means 17, and the processing tool 164, which rotates as the rotation shaft 160 rotates, comes into contact with the upper surface Wb of the wafer W, thereby performing grinding. During grinding, as the holding means 30 rotates, the wafer W held on the holding surface 300 also rotates, so the processing tool 164 grinds the entire top surface Wb of the wafer W. Further, grinding water is supplied to the contact area between the grinding wheel and the wafer W, and the contact area is cooled and cleaned.

After grinding the wafer W to a desired thickness, the processing means 16 is raised by the processing feed means 17 to be separated from the wafer W, and the holding means 30 is further moved in the -Y direction and positioned near the unloading means 154. . Next, the wafer W, whose upper surface Wb facing upward is held by suction by the unloading means 154, is transported to the cleaning means 156. After the upper surface Wb of the wafer W is spin-cleaned by the cleaning means 156, the wafer W is dried by ejecting air from the cleaning nozzle 156b, for example.
The wafer W cleaned and dried by the cleaning means 156 is carried into the second cassette 151a by the robot 155.

In the processing apparatus 1, in order to improve the throughput of grinding a plurality of wafers W stored in a shelf shape in the first cassette 150a, for example, one wafer W is held by the holding means 30 and ground. During this process, a new wafer W is pulled out from the first cassette 150a by the robot 155, and the centering of the wafer W for grinding and the like are performed in the same manner as described above.

However, since there is a timing when the transport means 4 is not transporting the wafer W and the wafer W is not temporarily placed on the temporary holding table 20, the air cleaning of the reading section 29 is performed by the transport means 4 at this timing. Implemented by.

In order to carry out air cleaning, first, as shown in FIG. ) and positioned above the reading section 29 disposed directly below the conveyance path L (see FIG. 2) of the suction pad 42 of the conveyance means 4 at a height below the temporary placement surface 200 of the temporary placement table 20. It will be done. Further, for example, the suction pad 42 is lowered by the shaft vertical movement means 47, and an appropriate gap is formed between the suction pad 42 and the reading section 29 in the Z-axis direction. Further, the first control section 461 sends information to the second control section 462 regarding the appropriate positioning of the suction pad 42 with respect to the reading section 29 during air cleaning.

Under the control of the second control unit 462, the first valve 441 is closed, the second valve 452 shown in FIG. 4 is energized, the second valve 452 is opened, and the air supply source 48 and air supply pipe and the suction pipe 44 on the downstream side of the branch part 440 communicate with each other, and the compressed air sent out by the air supply source 48 passes through the air supply pipe 45, the suction pipe 44, and the arm connecting part 401, and is released from the opening 420 of the suction pad 42. It is injected toward the reading section 29. Then, the compressed air blows off dust that has fallen from the wafer W and adhered to a lens (not shown) of the reading section 29, thereby cleaning the reading section 29.

When the reading section 29 is cleaned for a predetermined period of time, the air supply source 48 stops supplying air, and under the control of the second control section 462, the power supply to the second valve 452 shown in FIG. 4 is cut off. Then, the second valve 452 is closed and the injection of air from the opening 420 is stopped.

Note that the timing at which the reading section 29 is cleaned is not limited to the present embodiment, and may be, for example, while the processing apparatus 1 is being warmed up (idling) or when a desired number of wafers W are being ground. The cleaning may be performed before stopping the processing apparatus 1 after processing, or before grinding the wafer W after warming up.

As described above, in the processing apparatus 1 according to the present invention, the temporary holding means 2 includes a temporary holding table 20 having a temporary holding surface 200 capable of protruding the outer circumferential portion of the wafer W, and a temporary holding table 20 that is transported at a position below the temporary holding surface 200. The reading unit 29 is disposed directly below the transport path L of the means 4 and reads the recognition mark M on the lower surface Wa of the wafer W that is temporarily placed on the temporary holding surface 200 and protrudes from the temporary holding surface 200. includes a suction pad 42 having an opening 420 formed on the lower surface, a suction pipe 44 that communicates the opening 420 with a suction source 49, a branch part 440 that branches the suction pipe 44, and a branch part 440 that connects the branch part 440 with an air supply source 48. An air supply pipe 45 communicating with each other, a first valve 441 disposed between the branch portion 440 of the suction pipe 44 and the suction source 49, a second valve 452 disposed on the air supply pipe 45, and a suction pad. 42 horizontally between the upper part of the temporary storage means 2 and the upper part of the holding means 30; and a first control section that controls the horizontal movement means 40 to position the suction pad 42 above the reading section 29. 461 and a second control unit 462 that controls to close the first valve 441 and open the second valve 452 to inject air from the opening 420 of the suction pad 42. To maintain a clean state by cleaning the reading section 29 with air jetted from the opening 420 of the suction pad 42 at a time when the wafer W is not being transported and the wafer W is not temporarily placed on the temporary placement table 20. Next, the reading error of the recognition mark M of the wafer W placed on the temporary holding table 20 by the reading unit 29 is prevented from occurring, and the processing means 16 is This makes it possible to prevent situations such as waiting.

The processing device 1 according to the present invention is not limited to this embodiment, and the shape of the structure of the processing device 1 illustrated in the attached drawings is not limited to this, and the effects of the present invention can be realized. It can be changed as appropriate within the range that can be achieved.

W: Wafer Wb: Upper surface of wafer Wa: Lower surface of wafer D: Device M: Recognition mark 1: Processing equipment 10: Equipment base 100: Column 11: Equipment housing 12: Touch panel 150a: First cassette 151a: Second cassette Cassette 155: Robot 2: Temporary storage means 20: Temporary storage table 200: Temporary storage surface 203: Table base 23: Spindle 24: Rotating motor 29: Reading section 4: Transport means 40: Horizontal movement means 400: Arm section 405: Swivel Shaft portion 405a: Rotating motor 401: Arm connection portion 402: Coil spring 47: Shaft vertical movement means 42: Suction pad 420: Opening 44: Suction pipe 440: Branch portion 441: First valve 49: Suction source 45: Air supply pipe 452 : Second valve 48: Air supply source 461: First control section 462: Second control section 154: Carrying out means 156: Cleaning means 30: Holding means 300: Holding surface 16: Processing means 17: Processing feeding means 38: Thickness measurement means

Claims (1)

Temporary holding means for temporarily placing a wafer having a recognition mark on the lower surface on a temporary holding surface, holding means for holding the wafer, processing means for processing the wafer held by the holding means, and from the temporary holding means. A processing device comprising: a transport means for transporting the wafer to the holding means,
The temporary holding means includes a temporary holding table having a temporary holding surface that is capable of protruding the outer peripheral portion of the wafer, and a temporary holding table that is located below the temporary holding surface and directly below the transfer path of the transfer means. a reading unit that reads the recognition mark on the lower surface of the wafer that is temporarily placed on a holding surface and protrudes from the temporary holding surface;
The conveyance means includes a suction pad having an opening formed on the lower surface, a suction tube that communicates the opening with a suction source, a branching section that branches off the suction tube, and an air supply that communicates the branching section with an air supply source. a supply pipe, a first valve disposed between the branch part of the suction pipe and the suction source, a second valve disposed on the air supply pipe, and the temporary placement means for placing the suction pad. a horizontal moving means for horizontally moving the suction pad between the upper side and the upper side of the holding means; a first control section that controls positioning of the suction pad above the reading section using the horizontal moving means; A processing device that cleans the reading section with air jetted from the opening of the suction pad, the processing device comprising: a second control section that closes the second valve and controls the opening of the suction pad to jet air from the opening of the suction pad.

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