JP7360426B2 - Resin molding equipment and method for manufacturing resin molded products - Google Patents

Description

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

Japanese Unexamined Patent Publication No. 2012-045839 (Patent Document 1) discloses a conveying device for resin-sealed substrates. In this transport device, the resin-sealed substrate is transported with the resin-sealed substrate being attracted to the cooling plate. As a result, the resin-sealed substrate is cooled and warpage of the resin-sealed substrate is prevented (see Patent Document 1).

Japanese Patent Application Publication No. 2012-045839

In the conveyance device disclosed in Patent Document 1, the resin-sealed substrate is cooled while being adsorbed by a cooling plate while the resin-sealed substrate is being conveyed. However, since cooling of the resin-sealed substrate is not completed when the resin-sealed substrate starts to be transported, it may not be possible to sufficiently prevent warping of the resin-sealed substrate. For example, when a molded object is resin-molded using a thermosetting resin, the resin-molded molded object (hereinafter also referred to as "resin molded product") may warp immediately after the start of transportation. can also be considered. For example, when the object to be molded includes a fragile member such as a wafer, clamping and straightening a once warped resin molded product may have an adverse effect on the resin molded product.

The present invention has been made in order to solve such problems, and its purpose is to provide a resin molding device capable of suppressing warping of resin molded products while suppressing adverse effects on the resin molded products, and An object of the present invention is to provide a method for manufacturing a molded article.

A resin molding apparatus according to an aspect of the present invention is configured to perform resin molding of a molding object by using a thermosetting resin. This resin molding apparatus includes a mold, a mold clamping mechanism, and a temperature adjustment mechanism. The mold clamping mechanism is configured to clamp the mold. The temperature adjustment mechanism is configured to adjust the temperature of the mold. The temperature adjustment mechanism is configured to heat the mold when mold clamping is completed during resin molding, and cool the mold while maintaining the mold clamping completed state after resin molding.

A method for manufacturing a resin molded article according to another aspect of the present invention is a method for manufacturing a resin molded article using the resin molding apparatus described above. The manufacturing method of this resin molded product consists of a step of supplying the molding object to the mold, a step of performing resin molding by clamping the mold heated by a temperature control mechanism, and a step of clamping the mold after resin molding. and cooling the mold by a temperature control mechanism while maintaining the completed state.

According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that can suppress warping of the resin molded product while suppressing adverse effects on the resin molded product.

FIG. 2 is a diagram schematically showing a plane of a resin molding device. It is a figure which shows the side surface of a discharge mechanism typically. It is a figure which shows typically the side surface of a part of compression molding module. 4 is a diagram partially including a diagram schematically showing a cross section taken along the line IV-IV in FIG. 3. FIG. It is a figure which shows typically the side surface of a part of compression molding module at the time of compression molding. FIG. 3 is a diagram showing an example of temperature transition of a mold. It is a flowchart which shows an example of the operating procedure of a resin molding apparatus. It is a figure which shows typically the cross section of the 1st upper mold member in a 1st modification. It is a figure which shows typically the structure connected to piping in a 2nd modification.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment (hereinafter also referred to as "this embodiment") according to one aspect of the present invention will be described in detail below with reference to the drawings. In addition, the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated. Further, each drawing is schematically drawn with objects omitted or exaggerated as appropriate for ease of understanding.

[1. Configuration of resin molding equipment]
FIG. 1 is a schematic plan view of a resin molding apparatus 10 according to the present embodiment. The resin molding apparatus 10 is configured to resin-seal an object to be molded using a thermosetting resin to produce a resin molded product. An example of the object to be molded is a resin-molded substrate 144A (substrate 144) on which electronic components such as semiconductor chips are mounted. For example, in the resin molding apparatus 10, the surface of the pre-resin molded substrate 144A on which electronic components are mounted is sealed with resin. In this embodiment, the substrate 144 before resin molding is referred to as a pre-resin molded substrate 144A, and the resin molded substrate 144 is referred to as a resin molded substrate 144B.

The substrate 144 is composed of, for example, a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, or a ceramic substrate. The substrate 144 may be configured with a carrier used for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging), for example. The substrate 144 may already have wiring or may not have wiring.

As shown in FIG. 1, the resin molding apparatus 10 includes a release film cutting module 110, a resin material supply module 120, a compression molding module 130, a conveyance module 140, and a control section 150. Each module is configured to be attachable to and detachable from adjacent modules.

In the release film cutting module 110, a release film 11 having a desired shape is produced, and in the resin material supply module 120, a liquid resin (thermosetting resin) is supplied as a resin material onto the release film 11. Note that the viscosity of the liquid resin is not particularly limited, but in this embodiment, a relatively high viscosity liquid resin is used.

In the compression molding module 130, compression molding is performed with the pre-resin molding substrate 144A transported by the transport module 140 and the mold release film 11 supplied with liquid resin placed at predetermined positions in the mold 231. It will be done. As a result, a resin molded product (resin molded substrate 144B) is manufactured. Note that in this specification, "predetermined" means preset. For example, "predetermined position" means a preset position. The manufactured resin molded product is transported by the transport module 140 and stored in a predetermined position (molded substrate storage section 146). Each module will be explained in detail below.

The release film cutting module 110 is configured to cut and separate the circular release film 11 from the long release film. The release film 11 is used to prevent resin from adhering to the mold 231 after compression molding in the compression molding module 130 and to facilitate removal of the resin molded product from the mold 231. As the material for the release film, resin materials with properties such as heat resistance, mold release properties, flexibility, and extensibility are used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene and tetrafluoroethylene) are used. Polymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene/hexafluoropropylene copolymer), polypropylene, polystyrene, or polyvinylidene chloride is used.

The release film cutting module 110 includes a film fixing table moving mechanism 111, a roll release film 112, and a film gripper 113. The film fixing table moving mechanism 111 is located between the roll-shaped release film 112 and the film gripper 113 in the arrow Y direction.

The film fixing table moving mechanism 111 is configured to move between the release film cutting module 110 and the resin material supplying module 120. The film fixing table moving mechanism 111 is movable, for example, in each of the arrow X direction and the arrow Y direction.

A table 12 is arranged on the top surface of the film fixing table moving mechanism 111. The table 12 is a fixing base for fixing the release film 11. A release film pulled out from a roll release film 112 is fixed on the table 12. The film gripper 113 is configured to pull out the release film from the rolled release film 112 and to fix the tip of the pulled out release film. On the film fixing table moving mechanism 111, the release film is cut by a cutter (not shown) to produce a circular release film 11. For example, the release film 11 may be fixed to the top surface of the table 12 by performing suction using a suction mechanism (not shown) such as a vacuum pump through a suction hole (not shown) formed on the top surface of the table 12. good.

The resin material supply module 120 is configured to supply liquid resin onto the mold release film 11 and to transport the mold release film 11 supplied with the liquid resin to a predetermined position of the mold 231. The resin material supply module 120 includes a discharge mechanism 17, a resin loader 121, and a post-processing mechanism 122.

FIG. 2 is a diagram schematically showing a side surface of the discharge mechanism 17. As shown in FIG. 2, the discharge mechanism 17 includes a dispenser 13 and a nozzle 14 attached to the tip of the dispenser 13. The discharge mechanism 17 is configured to discharge liquid resin toward the release film 11 placed on the table 12 with the film fixing table moving mechanism 111 (table 12) positioned below. The liquid resin is discharged from the tip of the nozzle 14 and supplied onto the release film 11 .

The discharge mechanism 17 (dispenser 13 and nozzle 14) is movable, for example, in each of the arrow X direction and the arrow Y direction. For example, by moving the discharge mechanism 17 while discharging the liquid resin, the discharge position of the liquid resin on the release film 11 is adjusted. Moreover, the discharge position of the liquid resin on the release film 11 may be adjusted by moving the film fixing table moving mechanism 111 (table 12) while the liquid resin is being discharged.

Referring to FIG. 1 again, the resin loader 121 and the post-processing mechanism 122 are, for example, integrally configured. The resin loader 121 and the post-processing mechanism 122 are configured to move between the resin material supply module 120, the compression molding module 130, and the transport module 140 via the rails 142.

The resin loader 121 holds the release film 11 by suctioning the peripheral edge of the release film 11 supplied with liquid resin from above, and also transports the release film 11 from the film fixing table moving mechanism 111 to the mold 231. It is configured to be moved to a predetermined position (inside the lower mold cavity 132). The post-processing mechanism 122 is configured to clean the mold 231 and remove the mold release film 11 from the mold 231 after compression molding by the mold 231.

The transport module 140 transports the resin-molded substrate 144A accommodated in the unmolded substrate storage section 145 to a predetermined position of the mold 231, and also transports the resin-molded substrate 144B (resin molded product) manufactured in the compression molding module 130. It is configured to transport the molded substrate to the molded substrate storage section 146. The transport module 140 includes a substrate loader 141 , a rail 142 , a robot arm 143 , an unformed substrate storage section 145 , and a formed substrate storage section 146 . In the transport module 140, the substrate 144 is transported by, for example, moving the substrate loader 141 that holds the substrate 144 (substrate 144A before resin molding or resin molded board 144B) on the rails 142.

The pre-molded substrate accommodating section 145 is configured to accommodate the resin-molded substrate 144A, and the molded substrate accommodating section 146 is configured to accommodate the resin-molded substrate 144B. The robot arm 143 takes out the resin-molded substrate 144A from the pre-molded substrate storage section 145, turns the resin-molded substrate 144A upside down, and holds the resin-molded substrate 144A on the lower surface of the substrate loader 141. As a result, the pre-resin-molded substrate 144A is held by the substrate loader 141 with the electronic component mounting surface facing downward.

Further, the robot arm 143 takes out the resin-molded substrate 144B from the substrate loader 141 after compression molding by the mold 231, turns the resin-molded substrate 144B upside down, and transfers the resin-molded substrate 144B to the molded substrate storage section 144. to be accommodated. As a result, the resin-molded substrate 144B is accommodated in the molded-substrate accommodating portion 146 with the resin-molded surface facing upward.

The rail 142 extends across the areas of the transport module 140, the compression molding module 130, and the resin material supply module 120. The substrate loader 141 is configured to transport the substrate 144 by moving on the rails 142. For example, the substrate loader 141 transports the resin-molded substrate 144A from a predetermined position near the robot arm 143 to a predetermined position of the mold 231, and transports the resin-molded substrate 144B from the predetermined position of the mold 231 to a predetermined position near the robot arm 143. The device is configured to be transported to a location.

The control unit 150 is configured to control the entire resin molding apparatus 10. The control unit 150 controls each of the release film cutting module 110, the resin material supply module 120, the compression molding module 130, and the conveyance module 140, for example. The control unit 150 includes a CPU (Central Processing Unit), which is a hardware processor, a RAM (Random Access Memory), a ROM (Read Only Memory), etc., and is configured to execute information processing based on programs and various data. ing. Note that the control unit 150 may be placed anywhere within the resin molding apparatus 10, or may be configured by a plurality of computers.

FIG. 3 is a diagram schematically showing a side surface of a part of the compression molding module 130. The compression molding module 130 is configured to manufacture a resin molded product (resin molded substrate 144B) by using a so-called compression molding method.

1 and 3, the compression molding module 130 includes a base 213, a tie bar 214, a fixed platen 211, a movable platen 212, a mold clamping mechanism 215, a mold 231, and a temperature controller 133. Contains.

The base 213 is a plate-like member that is rectangular in plan view. Each of the plurality of (four) tie bars 214 is a rod-shaped member that extends in the vertical direction. A plurality of tie bars 214 are fixed to each of the four corners of the base 213. The fixed platen 211 is a plate-like member having a rectangular shape in plan view, and is fixed to the upper part of the plurality of tie bars 214. The movable platen 212 is a plate-like member having a rectangular shape in plan view, and is attached to the tie bar 214 between the base 213 and the fixed platen 211 in a vertically movable state. Movable platen 212 faces both fixed platen 211 and base 213 in compression molding module 130 .

The mold clamping mechanism 215 is fixed to each of the upper surface of the base 213 and the lower surface of the movable platen 212. The mold clamping mechanism 215 includes a drive source 216 and a transmission member 217 that transmits the driving force of the drive source 216. The drive source 216 is fixed to the upper surface of the base 213, and the transmission member 217 is fixed to the lower surface of the movable platen 212.

The driving force of the drive source 216 is transmitted to the movable platen 212 via the transmission member 217, and the movable platen 212 is raised, thereby clamping the mold 231. Furthermore, the driving force of the drive source 216 is transmitted to the movable platen 212 via the transmission member 217, and the movable platen 212 is lowered, thereby opening the mold 231. The mold clamping mechanism 215 is configured to raise and lower the movable platen 212 in order to clamp and open the mold 231. That is, the mold clamping mechanism 215 is configured to clamp and open the mold 231.

For example, the drive source 216 may be configured with an electric motor such as a servo motor, and the transmission member 217 may be configured with a ball screw. Furthermore, the drive source 216 may be configured with a hydraulic cylinder, and the transmission member 217 may be configured with a rod. Moreover, the mold clamping mechanism 215 may be configured by using a toggle link mechanism.

The mold 231 includes a metal upper mold 201 and a metal lower mold 202 facing the upper mold 201. The upper mold 201 is fixed to the lower surface of a fixed platen 211 via a plurality of (for example, four) heat insulating mechanisms 210, and the lower mold 202 is fixed to the lower surface of a fixed platen 211 through a plurality of (for example, four) heat insulating mechanisms 209. is fixed on the top surface.

The upper mold 201 includes a first upper mold member 203 and a second upper mold member 205 connected to the lower surface of the first upper mold member 203. The first upper die member 203 is a metal member having a rectangular shape in plan view, and is fixed to the lower surface of the fixed platen 211 via a plurality of heat insulating mechanisms 210 . Each heat insulation mechanism 210 is made of metal, for example, and has a pillar shape. For example, a heat insulating mechanism 210 is disposed near each of the four corners of the upper surface of the first upper mold member 203. Further, inside the first upper mold member 203, a pipe 204 is arranged.

FIG. 4 is a diagram partially including a diagram schematically showing a cross section taken along the line IV-IV in FIG. As shown in FIG. 4, a pipe 204 connected to the temperature controller 133 is arranged inside the first upper mold member 203.

The temperature controller 133 supplies a heat medium to the pipe 204 (or the pipe 207 (FIG. 3)) and circulates the heat medium in the pipe 204 (or the pipe 207), thereby controlling the temperature of the upper mold 201 (or the lower mold 202). Configured to regulate temperature. The heat medium may be a liquid such as water or oil, or a gas. The temperature controller 133 raises the temperature of the upper mold 201 by, for example, making the temperature of the heat medium higher than the temperature of the upper mold 201 and circulating the heat medium in the piping 204 . Further, the temperature controller 133 lowers the temperature of the upper mold 201 by, for example, making the temperature of the heat medium lower than the temperature of the upper mold 201 and circulating the heat medium in the piping 204 . In the compression molding module 130, by adjusting the temperature of the mold 231, the temperature of the substrate 144 is indirectly adjusted.

The temperature sensor 250 is configured, for example, to detect the temperature of the second upper mold member 205 connected to the first upper mold member 203. The control unit 150 controls the temperature regulator 133 based on the detection result by the temperature sensor 250, for example. Note that since a plurality of heat insulating mechanisms 210 are arranged between the first upper mold member 203 and the fixed platen 211, a space is formed between the first upper mold member 203 and the fixed platen 211. Since this space functions as a heat insulating layer, heat conduction between the upper die 201 and the fixed platen 211 is suppressed. As a result, temperature control of the upper mold 201 is relatively easy.

Referring again to FIG. 3, the second upper mold member 205 is a metal member having a circular shape in plan view, and is connected to the lower surface of the first upper mold member 203. The second upper mold member 205 is configured to hold the substrate 144. Before compression molding, a pre-resin molding substrate 144A is attached to the lower surface of the second upper mold member 205.

The lower mold member 202 includes a first lower mold member 206 and a second lower mold member 208 connected to the upper surface of the first lower mold member 206. The first lower die member 206 is a metal member having a rectangular shape in plan view, and is fixed to the upper surface of the movable platen 212 via a plurality of heat insulating mechanisms 209 . Each heat insulating mechanism 209 may be the same as or different from the heat insulating mechanism 210, for example. For example, a heat insulating mechanism 209 is arranged near each of the four corners of the lower surface of the first lower mold member 206.

Further, a pipe 207 is arranged inside the first lower mold member 206. Like the pipe 204, the temperature regulator 133 is connected to the pipe 207. Like the upper mold 201, the temperature of the lower mold 202 is regulated by the temperature controller 133. The control unit 150 controls the temperature regulator 133, for example, based on the detection result of a temperature sensor (not shown) that detects the temperature of the second lower mold member 208. Note that since a plurality of heat insulating mechanisms 209 are arranged between the first lower mold member 206 and the movable platen 212, a space is formed between the first lower mold member 206 and the movable platen 212. Since this space functions as a heat insulating layer, heat conduction between the lower die 202 and the movable platen 212 is suppressed. As a result, temperature control of the lower mold 202 is relatively easy.

The second lower mold member 208 is a metal member having a circular shape in plan view, and is connected to the upper surface of the first lower mold member 206. A lower mold cavity 132 is formed on the upper surface of the second lower mold member 208 . Before compression molding, the release film 11 supplied with liquid resin is placed in the lower mold cavity 132. The mold 231 is clamped with the liquid resin placed in the lower mold cavity 132 of the second lower mold member 208 and the pre-resin molding substrate 144A attached to the lower surface of the second upper mold member 205. , compression molding is performed.

[2. Suppression of warping of resin molded products]
As described above, in the resin molding apparatus 10, compression molding is performed using a thermosetting liquid resin. That is, in the resin molding apparatus 10, compression molding is performed by heating and hardening the liquid resin.

FIG. 5 is a diagram schematically showing a side surface of a part of the compression molding module 130 during compression molding (a cross section is included in part). As shown in FIG. 5, the substrate 144A before resin molding on which the chip 15 is mounted is held in the upper mold 201, and the liquid resin 16 is placed in the lower mold 202 via the release film 11. The mold 231 is clamped. For example, when the mold 231 is clamped, each of the upper mold 201 and the lower mold 202 is heated. By clamping the heated upper mold 201 and lower mold 202, the liquid resin 16 is cured, and a resin molded substrate 144B (resin molded product) is manufactured.

Assume that the mold 231 is opened immediately after the liquid resin 16 is cured. In this case, the clamp (hereinafter also simply referred to as "clamp") of the resin-molded substrate 144B by the mold 231 is released while the resin-molded substrate 144B is at a high temperature. "Clamp" refers to fixing the substrate 144 by sandwiching the substrate 144 between the upper mold 201 and the lower mold 202. For example, consider a case where the substrate 144 is made of a silicon wafer. In this case, since the thermal contraction rate of the resin is larger than that of the silicon wafer, the silicon wafer is pulled in the warp direction due to the thermal contraction of the resin. That is, when the clamp is released while the resin-molded substrate 144B is at a high temperature, the resin-molded substrate 144B warps due to the force generated due to thermal contraction of the resin.

In order to suppress such warpage of the resin-molded substrate 144B, the temperature of the upper mold 201 and the lower mold 202 during compression molding is not set to a high temperature (for example, 120° C. or higher), but is kept at a relatively low temperature (for example, 100° C. to 120° C. or higher). ℃). However, in this case, it takes a long time to cure the resin, and as a result, it takes a long time to manufacture the resin molded product.

In order to solve such problems, in the resin molding apparatus 10 according to the present embodiment, the control unit 150 heats the mold 231 in a state where the mold 231 is clamped during compression molding, and performs compression molding. Afterwards, the temperature controller 133 is controlled to cool the mold 231 while the mold 231 continues to be clamped. That is, the temperature controller 133 heats the mold 231 while the mold 231 is clamped during compression molding, and cools the mold 231 while the mold 231 continues to be clamped after compression molding. do.

In the resin molding apparatus 10 according to the present embodiment, the mold 231 is cooled while the mold 231 continues to be clamped after compression molding. Since the resin-molded substrate 144B is cooled while the resin-molded substrate 144B is clamped by the mold 231, even if compression molding is performed at high temperatures, the resin-molded substrate 144B is cooled due to thermal contraction of the resin. The occurrence of warpage is suppressed. Moreover, since compression molding is performed at high temperature, the resin is cured in a short time, and the manufacturing speed of the resin-molded substrate 144B is improved.

Furthermore, since the warp of the resin-molded substrate 144B is not straightened out once the resin-molded substrate 144B is warped, the adverse effects that occur in the resin-molded substrate 144B due to stretching the warp are suppressed. For example, the occurrence of failures of the resin-molded substrate 144B due to stretching the warp is suppressed. Furthermore, since the resin-molded substrate 144B is transported after cooling, the requirements for heat resistance in the transport module 140 are relaxed. As a result, the resin-molded substrate 144B can be easily transported and can be transported at high speed.

FIG. 6 is a diagram showing an example of temperature transition of the mold 231 (upper mold 201 and lower mold 202). Referring to FIG. 6, the horizontal axis represents time, and the vertical axis represents the temperature of mold 231. A line L1 indicates the temperature transition of the mold 231 in the resin molding apparatus 10 according to the present embodiment, and a line L2 indicates the temperature transition of the mold 231 in the comparison target. Note that in FIG. 6, the specific numerical values of time and temperature are merely examples.

Referring to the transition of line L1, from time 0 to time t1, for example, the resin-molded substrate 144A is transported to the mold 231. Then, the resin-molded substrate 144A is attached to the upper mold 201. From time 0 to time t1, the temperature of the mold 231 is H1. An example of the temperature H1 is 50°C. Although the lower limit of the temperature H1 is not particularly limited, the upper limit of the temperature H1 is, for example, preferably 60°C or lower, more preferably 50°C or lower, and more preferably 40°C or lower.

From time t1 to time t2, for example, the temperature controller 133 increases the temperature of the mold 231 (upper mold 201 and lower mold 202). The temperature regulator 133 adjusts the temperature of the heat medium so that the temperature of the mold 231 becomes the target temperature H3. Temperature H3 is higher than temperature H1. An example of temperature H3 is 180°C. For example, the temperature H3 is preferably 120°C or more and 200°C or less, more preferably 160°C or more and 200°C or less, and more preferably 160°C or more and 180°C or less.

From time t2 to time t3, for example, the release film 11 supplied with liquid resin is conveyed to the mold 231. Then, the release film 11 supplied with the liquid resin is placed on the lower mold 202 (inside the lower mold cavity 132). The liquid resin placed on the lower mold 202 is heated to reduce its viscosity. After the liquid resin is placed on the lower mold 202, the mold is clamped by raising the lower mold 202 using the mold clamping mechanism 215. When the mold clamping is completed, a predetermined force is applied to the upper mold 201 and the lower mold 202, and the lower mold 202 stops rising. Note that the gas present in the liquid resin may be removed by reducing the pressure inside the mold 231 after the liquid resin is placed on the lower mold 202 and until the mold clamping is completed.

The period from time t3 to time t4 is the so-called cure time. Cure time refers to the time from the timing when mold clamping is completed until the liquid resin hardens to the extent that the resin molded product can be appropriately released at least when the mold is opened. From time t2 to time t4, the temperature controller 133 continues to heat the mold 231 so that the temperature of the mold 231 is maintained at H3. Since the temperature of the mold 231 is high, the resin hardens in a relatively short time, and as a result, compression molding is completed in a short time. Note that the timing of starting the curing time does not have to be exactly the timing at which the mold clamping is completed, and may be, for example, the timing immediately after the mold clamping is completed.

After time t4 (after compression molding), for example, the temperature regulator 133 lowers the temperature of the mold 231 while the mold 231 is maintained in a clamped state. The temperature regulator 133 adjusts the temperature of the heat medium so that the temperature of the mold 231 becomes the target temperature H1. Note that the target temperature during cooling of the mold 231 does not necessarily have to be H1. The target temperature during cooling may be, for example, a temperature higher than H1 or a temperature lower than H1. When the temperature of the mold 231 falls to the target temperature, the mold 231 is opened and the resin-molded substrate 144B is transported.

On the other hand, referring to the transition of the line L2, in the comparison target, for example, the temperature of the mold 231 is kept constant at H2 (for example, 120° C.). For example, in the present embodiment, when mold clamping is completed when the temperature of the mold 231 is 175° C., the cure time (time t3 to time t4) is about 120 seconds. On the other hand, when mold clamping is completed when the temperature of the mold 231 is 120° C., the curing time is about 600 seconds. That is, when the temperature of the mold 231 is 120°C, the curing time is approximately 5 times longer than when the temperature of the mold 231 is 175°C. As a result, when the temperature of the mold 231 is kept constant at 120°C, the time required to manufacture a resin molded product (the time required for temperature rise, transportation, mold clamping, and cooling of the mold 231) is This is approximately 1.5 times longer than the time required to manufacture a resin molded product in the resin molding apparatus 10 according to the embodiment.

[3. Operation of resin molding equipment]
FIG. 7 is a flowchart showing an example of the operating procedure of the resin molding apparatus 10. The processing shown in this flowchart is executed, for example, by the control unit 150 in a predetermined cycle.

Referring to FIG. 7, control unit 150 controls transport module 140 to transport the object to be molded (substrate 144A before resin molding) to a predetermined position of mold 231 (step S100). The control unit 150 controls the temperature regulator 133 to start heating the mold 231 (step S110). The control unit 150 determines whether the temperature of the mold 231 (upper mold 201 and lower mold 202) has risen to a first predetermined temperature based on the detection results of the temperature sensor 250 and the like (step S120). The first predetermined temperature (for example, temperature H3 in FIG. 6) is, for example, a temperature at which the liquid resin (thermosetting resin) hardens relatively smoothly.

If it is determined that the temperature of the mold 231 has not risen to the first predetermined temperature (NO in step S120), the control unit 150 controls the temperature regulator 133 so that the temperature of the mold 231 increases at a predetermined rate. Continue control.

On the other hand, if it is determined that the temperature of the mold 231 has risen to the first predetermined temperature (YES in step S120), the control unit 150 adjusts the temperature so that the temperature of the mold 231 is maintained at the first predetermined temperature. While continuing to control the machine 133, the resin material supply module 120 is controlled to transport the release film 11 supplied with liquid resin to a predetermined position of the mold 231 (step S130). Note that the liquid resin is supplied to the release film 11, for example, in the resin material supply module 120, in parallel with the processing shown in this flowchart.

After that, the control unit 150 controls the mold clamping mechanism 215 to start clamping the mold 231 (step S140). Note that even when the mold 231 is completely clamped (during compression molding), the temperature controller 133 continues to heat the mold 231, and the temperature of the mold 231 is maintained at, for example, a first predetermined temperature. In addition, each of the "mold clamping completed state", "mold clamping completed state", and "mold clamping completed state" refers to, for example, two molds (for example, mold 231) facing each other constituting a mold (for example, mold 231). For example, the upper mold 201 and the lower mold 202) move relatively toward each other, a predetermined force is applied to these two molds, and the relative movement of these two molds is stopped.

The control unit 150 determines whether a predetermined time has elapsed since the mold clamping was completed (step S150). Note that the predetermined time is a time period during which the liquid resin (thermosetting resin) is sufficiently cured to the extent that at least the mold can be opened and the resin molded product can be appropriately released from the mold when heated at the first predetermined temperature. If it is determined that the predetermined time has not elapsed (NO in step S150), the control unit 150 controls the mold clamping mechanism 215 to maintain the mold clamping completed state, and also controls the mold clamping mechanism 215 so that the temperature of the mold 231 reaches the first temperature. 1. Control the temperature regulator 133 so that the temperature is maintained at a predetermined temperature.

On the other hand, if it is determined that the predetermined time has elapsed (YES in step S150), the control unit 150 controls the mold clamping mechanism 215 to maintain the completed state of mold clamping, and starts cooling the mold 231. The temperature regulator 133 is controlled so as to (step S160). For example, the control unit 150 controls the temperature regulator 133 so that the temperature of the mold 231 decreases at a predetermined rate.

The control unit 150 determines whether the temperature of the mold 231 has decreased to a second predetermined temperature based on the detection results of the temperature sensor 250 and the like (step S170). The second predetermined temperature (eg, temperature H1 in FIG. 6) is, for example, a temperature at which almost no thermal contraction of the resin or the like occurs. If it is determined that the temperature of the mold 231 has not decreased to the second predetermined temperature (NO in step S170), the control unit 150 controls the mold clamping mechanism 215 to maintain the mold clamping completed state. , the temperature regulator 133 is controlled so that the temperature of the mold 231 continues to decrease.

On the other hand, if it is determined that the temperature of the mold 231 has decreased to the second predetermined temperature (YES in step S170), the control unit 150 controls the mold clamping mechanism 215 to open the mold 231 ( Step S180). When the mold opening is completed, the control unit 150 controls the transport module 140 to transport the manufactured resin molded product (resin molded substrate 144B) (step S190).

[4. Features]
As described above, in the resin molding apparatus 10 according to the present embodiment, the control unit 150 heats the mold 231 in a state where the clamping of the mold 231 is completed during compression molding, and after the compression molding is performed , the control unit 150 The temperature controller 133 is controlled so as to cool the mold 231 while maintaining the mold 231 in a closed state. That is, the temperature controller 133 heats the mold 231 in a state where the mold 231 is completely clamped during compression molding, and heats the mold 231 in a state where the clamped state of the mold 231 is maintained after compression molding. to cool down.

In this way, in the resin molding apparatus 10, the mold 231 is cooled while the mold 231 is maintained in a completely clamped state after compression molding. Therefore, according to the resin molding apparatus 10, since the resin molded board 144B is cooled while being clamped by the mold 231, even if compression molding is performed at a high temperature, the heat of the resin It is possible to suppress the occurrence of warpage of the resin-molded substrate 144B due to shrinkage.

Note that the resin molding apparatus 10 is an example of the "resin molding apparatus" of the present invention. The mold 231 is an example of the "mold" of the present invention. The mold clamping mechanism 215 is an example of the "mold clamping mechanism" of the present invention. The configuration consisting of the temperature controller 133 and the pipes 204 and 207 is an example of the "temperature adjustment mechanism" of the present invention. The liquid resin 16 is an example of the "thermosetting resin" of the present invention. The substrate 144A before resin molding is an example of the "molding object" of the present invention. Pipes 204 and 207 are examples of "pipes" of the present invention. The transport module 140 is an example of the "transport mechanism" of the present invention.

[5. Other embodiments]
The idea of the above embodiments is not limited to the embodiments described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.

<5-1>
In the resin molding apparatus 10 according to the embodiment described above, pipes 204 and 207 are arranged inside the upper mold 201 and the lower mold 202, respectively, and the temperature controller 133 supplies a heat medium into each pipe, thereby controlling the upper mold Each of the mold 201 and the lower mold 202 was heated. However, the heating method for the upper mold 201 and the lower mold 202 is not limited to this.

FIG. 8 is a diagram schematically showing a cross section of the first upper mold member 203A in the first modification. As shown in FIG. 8, in addition to the pipe 204, a plurality of heaters 300 are arranged inside the first upper mold member 203A. The heater 300 is a heater for heating metal. By arranging the heater 300 in addition to the pipes 204 and 207 inside the upper mold and the lower mold, the rate of temperature rise of the upper mold and the lower mold can be further increased.

<5-2>
In the resin molding apparatus 10 according to the embodiment described above, the temperature of the heat medium supplied to the pipes 204 and 207 is lowered by the temperature controller 133. However, the method of lowering the temperature of the heat medium is not limited to this.

FIG. 9 is a diagram schematically showing a configuration connected to the pipes 204 and 207 in the second modification. As shown in FIG. 9, a temperature regulator 133 and an oil cooler 350 are connected to the pipes 204 and 207. That is, the heat medium flowing in the pipes 204 and 207 is cooled by the temperature controller 133 and the oil cooler 350. Thereby, the temperature reduction rate of the upper mold and the lower mold can be further increased.

<5-3>
In the resin molding apparatus 10 according to the embodiment described above, resin molding was performed by a compression molding method. However, the resin molding method is not limited to this. For example, resin molding may be performed by a transfer molding method. Even when resin molding is performed by the transfer molding method, warping of the substrate is suppressed by cooling the mold while maintaining the completed mold clamping state. Furthermore, since the substrate is transported after being cooled, the requirements for heat resistance in the transport module 140 are relaxed. As a result, the resin molded product can be easily transported and can be transported at high speed.

<5-4>
In the resin molding apparatus 10 according to the embodiment described above, the heat insulating mechanisms 209 and 210 do not need to be pillar-shaped and may be plate-shaped. In this case, the heat insulating mechanisms 209 and 210 may be made of a heat insulating material, for example. The heat insulating mechanisms 209 and 210 may be made of, for example, a metal material and a ceramic material. As the ceramic material, for example, zirconia, alumina, etc. may be used.

<5-5>
In the resin molding apparatus 10 according to the embodiment described above, resin molding was performed using liquid resin. However, the resin used for resin molding is not limited to liquid resin. For example, in the resin molding apparatus 10 according to the embodiment described above, resin molding may be performed using powdered resin (granular resin).

<5-6>
In the resin molding apparatus 10 according to the embodiment described above, heating of the mold 231 was started before conveyance of the release film 11 supplied with liquid resin and before clamping of the mold 231. However, the timing to start heating the mold 231 is not limited to this. For example, conveyance of the mold release film 11 supplied with liquid resin is performed before heating of the mold 231 is started, mold clamping of the mold 231 is started before heating of the mold 231 is started, and mold clamping of the mold 231 is performed before heating of the mold 231 is started. Heating of the mold 231 may be started during the process. Further, the mold release film 11 supplied with the liquid resin is transported before the heating of the mold 231 starts, and then the heating of the mold 231 is started, and the temperature of the mold 231 is set to the target temperature (the first predetermined temperature). ) may start clamping of the mold 231.

<5-7>
The resin molding apparatus 10 according to the embodiment described above included one compression molding module 130. However, the number of compression molding modules 130 included in the resin molding apparatus 10 is not limited to this. For example, the resin molding apparatus 10 may include two or more compression molding modules 130.

<5-8>
In the resin molding apparatus 10 according to the embodiment described above, each of the discharge mechanism 17 and the film fixing table moving mechanism 111 may be movable in each of the arrow X direction, the arrow Y direction, and the arrow Z direction.

<5-9>
In the resin molding apparatus 10 according to the embodiment described above, the first upper mold member 203 and the second upper mold member 205 may be integrally formed, and the first lower mold member 206 and the second lower mold member 208 may be integrally formed. It may be formed as follows.

The embodiments of the present invention have been exemplarily described above. That is, the detailed description and accompanying drawings have been disclosed for purposes of illustration. Therefore, some of the components described in the detailed description and the attached drawings may not be essential for solving the problem. Therefore, just because non-essential components are described in the detailed description and accompanying drawings, such non-essential components should not be immediately identified as essential.

Furthermore, the above embodiments are merely illustrative of the present invention in all respects. Various improvements and changes can be made to the above embodiments within the scope of the present invention. That is, in implementing the present invention, specific configurations can be adopted as appropriate depending on the embodiment.

10 resin molding device, 11 release film, 12 table, 13 dispenser, 14 nozzle, 15 chip, 16 liquid resin, 17 discharge mechanism, 110 release film cutting module, 111 film fixing base moving mechanism, 112 roll release film , 113 film gripper, 120 resin material supply module, 121 resin loader, 122 post-processing mechanism, 130 compression molding module, 132 lower mold cavity, 133 temperature controller, 140 transport module, 141 substrate loader, 142 rail, 143 robot arm, 144 substrate, 144A substrate before resin molding, 144B resin molded substrate, 145 unmolded substrate accommodating section, 146 molded substrate accommodating section, 150 control section, 201 upper mold, 202 lower mold, 203, 203A first upper mold member, 204, 207 piping, 205 second upper mold member, 206 first lower mold member, 208 second lower mold member, 209, 210 heat insulation mechanism, 211 fixed platen, 212 movable platen, 213 base, 214 tie bar, 215 mold clamping mechanism , 216 drive source, 217 transmission member, 231 mold, 250 temperature sensor, 300 heater, 350 oil cooler, L1, L2 line.

Claims (5)

A resin molding device configured to perform resin molding of a molded object by using a thermosetting resin,
A mold and
a mold clamping mechanism configured to clamp the mold with the molding object placed therein ;
and a temperature adjustment mechanism configured to adjust the temperature of the mold,
The temperature adjustment mechanism is configured to heat the mold in a state in which the mold clamping is completed during the resin molding, and cool the mold in a state in which the mold clamping is completed after the resin molding. has been
The molding target includes a substrate on which electronic components are mounted on one side,
A resin molding apparatus, wherein a surface of the substrate on which the electronic component is mounted is sealed with resin. The mold is
an upper mold that holds the object to be molded;
The resin molding apparatus according to claim 1, further comprising a lower mold that faces the upper mold and in which a resin used for the resin molding is placed. Piping is arranged inside the mold,
The resin molding apparatus according to claim 1 or 2, wherein the temperature adjustment mechanism is configured to adjust the temperature of the mold by supplying a heat medium to the piping. The resin molding apparatus according to any one of claims 1 to 3, further comprising a transport mechanism configured to transport the resin-molded object. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 4, comprising:
supplying the molding object to the mold;
performing the resin molding by clamping the mold heated by the temperature adjustment mechanism;
A method for manufacturing a resin molded product, comprising the step of cooling the mold by the temperature adjustment mechanism while maintaining the completed mold clamping state after the resin molding.

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