JP7361906B2 - LED light emitting device and lighting equipment using it - Google Patents

Description

The present invention relates to an LED light emitting device in which a COB module is mounted on a circuit board, and a lighting fixture using the same.

2. Description of the Related Art LED light emitting devices are known in which a plurality of COB (chip on board) modules are mounted on the top surface of a single circuit board.

For example, Japanese Unexamined Patent Publication No. 2018-206708 (FIGS. 1 to 5) describes an LED light emitting device in which a COB module is mounted in each of a plurality of openings penetrated through a circuit board. This LED light emitting device has a COB module placed below a circuit board, and a power supply electrode (power supply electrode) provided on the bottom surface of the circuit board and a submount board on which the light emitting part of the COB module is mounted. The light emitting section emits light upward through the opening of the circuit board.

Note that the LED light emitting device described in Japanese Patent Application Publication No. 2018-206708 (FIGS. 1 to 5) includes a lens above the opening and a heat sink (heat dissipation board) below the COB module. In addition, in order to improve color mixing, this LED light emitting device employs a COB module in which the light emitting section has multiple areas with different emission colors, and furthermore, the azimuth of one COB module is set to the azimuth of another COB module. It is different from that.

In the LED light emitting device described in Japanese Unexamined Patent Publication No. 2018-206708 (FIGS. 1 to 5), the optical axis of each COB module is limited to a direction perpendicular to the circuit board. Furthermore, the height position of the light emitting surface is fixed near the bottom surface of the circuit board. Therefore, when the COB module is mounted on a circuit board, it is not possible to easily finely adjust the angle of the optical axis or the height position of the light emitting surface.

In order to solve the above problems, the present invention provides an LED light emitting device and an LED light emitting device that can easily finely adjust the angle of the optical axis and the height position of the light emitting surface when a COB module is mounted on a single circuit board. The purpose is to provide lighting equipment that uses

In order to solve the above problems, the LED light emitting device disclosed in the present application includes a circuit board having at least one opening, a COB module disposed in the opening, and a flexible conductive material connecting the COB module and the circuit board. A COB module is supported by the circuit board via a flexible conductive member and is movable relative to the circuit board.

Moreover, the lighting fixture disclosed in the present application includes the LED light emitting device and a heat sink in contact with the bottom surface of the COB module included in the LED light emitting device.

According to the LED light emitting device disclosed in the present application, since the COB module is supported in a structure that allows movement relative to the circuit board, the optical axis angle of the COB module and the height position of the light emitting surface can be finely adjusted. Can be done.

Furthermore, since the lighting fixture disclosed in this application includes a heat sink that is in contact with the bottom surface of the COB module, the illumination of the lighting fixture can be adjusted by changing the inclination angle and height position of the contact surface of the heat sink that is in contact with the bottom surface of the COB module. The range can be easily fine-tuned.

FIG. 1 is a perspective view of an LED light emitting device according to a first embodiment of the present application. FIG. 2 is a plan view of essential parts of the LED light emitting device shown in FIG. 1. FIG. FIG. 2 is a plan view of a COB module used in the LED light emitting device of the present application. It is a principal part top view of the LED light emitting device based on 2nd Embodiment of this application. It is a principal part top view of the LED light emitting device based on 3rd Embodiment of this application. It is a principal part top view which shows the modification of the LED light emitting device based on 3rd Embodiment of this application. It is a principal part top view of the LED light emitting device based on 4th Embodiment of this application. FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 7 showing one embodiment of a fixing means using an elastic adhesive. FIG. 9 is a sectional view similar to FIG. 8 showing another embodiment of fixing means using an elastic adhesive. FIG. 9 is a sectional view similar to FIG. 8 showing another embodiment of the fixing means using an elastic adhesive. It is a top view which shows the modification of a screw hole. It is a sectional view taken along the line XII-XII in FIG. 11. FIG. 7 is a sectional view of a main part of a lighting fixture according to a fifth embodiment of the present application. It is a principal part sectional view of the lighting fixture concerning a 6th embodiment of this application. FIG. 7 is a sectional view of a main part of a lighting fixture according to a seventh embodiment of the present application. FIG. 7 is a sectional view of a main part of a lighting fixture according to an eighth embodiment of the present application.

EMBODIMENT OF THE INVENTION Hereinafter, the LED light emitting device and lighting fixture disclosed in this application will be described based on embodiments with reference to the accompanying drawings. Note that the drawings schematically represent each component of the LED light emitting device and the lighting fixture, and the dimensions and dimensional ratios of the actual products do not necessarily match the dimensions and dimensional ratios on the drawings. Furthermore, unless otherwise specified, in this specification, for convenience, directions such as left, right, up, down, inside and outside are expressed based on the orientation of the LED light emitting device shown in FIG. Furthermore, duplicate explanations may be omitted as appropriate, and the same members may be denoted by the same reference numerals.

(First embodiment: LED light emitting device)
1 and 2 show a first embodiment of the LED light emitting device disclosed in the present application. The LED light emitting device 10 according to the first embodiment includes a circuit board 11 having a plurality of rectangular openings 11a, a COB module 12 disposed inside each opening 11a, and a COB module 12 and the circuit board 11. A pair of flexible conductive members 13 are provided. In this embodiment, the circuit board 11 is made of a material such as aluminum and has a rectangular planar shape, and an electrical wiring (not shown) for supplying electricity to the COB module 12 is provided on the insulated surface of the board. It is being Note that the circuit board 11 may be a resin board such as a glass epoxy board or a glass composite board. Further, the circuit board 11 is provided with a pair of power supply electrodes 11c disposed facing each other in the vicinity of each of the two opposing left and right inner sides 11d among the four inner sides of each opening 11a. There is. The pair of power supply electrodes 11c are part of the electrical wiring, one of which is on the + side and the other on the - side. In this embodiment, the pair of power supply electrodes 11c are provided around the middle position between the lengths of the left and right inner sides 11d of the opening 11a, but the locations where they are set are not particularly limited. For example, it is sufficient that it is provided within the length of the inner side 11d, and in such a case, the flexible conductive member 13, which will be described later, may be made longer without expanding the area occupied by the power supply electrode 11c. can. Further, in this embodiment, four identical rectangular openings 11a are provided at each of the four corners of the circuit board 11, but the opening positions and number of the openings 11a relative to the circuit board 11 are not particularly limited. For example, it may be at least one opening 11a provided in the center of the circuit board 11. Note that semicircular screw holes 11b are formed in two diagonally opposite corners of the opening 11a.

The COB module 12 is formed into a rectangular shape smaller than the size of the opening 11a and corresponding to the shape of the opening 11a so as to fit inside each opening 11a provided in the circuit board 11. Therefore, as shown in FIG. 2, when placed inside the opening 11a, a gap 14 is created between the COB module and the inner side 11d of the opening 11a along the entire 12 outer sides 12f of the COB module. This gap 14 allows movement of the COB module 12 within the opening 11a. Enabling movement of the COB module 12 means that the COB module 12 can rotate in the horizontal direction with respect to the circuit board 11 within the opening 11a, or can move vertically with respect to the circuit board 11. It is to have movement in a direction. The width of the gap 14 is, for example, as shown in FIG. 2, where D is the distance between the left and right inner sides 11d of the opening 11a of the circuit board 11, and L is the distance between the left and right outer sides 12f of the COB module 12. In this case, a value calculated by the formula L<D<4L/3 is desirable.

In one example, as shown in FIGS. 2 and 3, the COB module 12 includes a submount board 12a having an outer side 12f opposite to an inner side 11d of an opening 11a of the circuit board 11, and a central portion of the submount board 12a. A circular light emitting part 12d provided in the circular light emitting part 12d is provided. The submount substrate 12a is made of a ceramic material such as alumina, and metal wiring (not shown) is provided on its surface. The submount substrate 12a may be a resin substrate such as a glass epoxy substrate or a glass composite substrate, or may be a substrate made of a material with excellent thermal conductivity such as aluminum. Furthermore, triangular power supply electrodes 12b are provided at two diagonally opposite corners of the submount substrate 12a, forming a pair of power supply electrodes 12b. A quarter-circular notch 12e is formed at two other diagonally opposite corners. When the COB module 12 is placed in the opening 11a of the circuit board 11, the notch 12e is placed so as to face the screwed part 11b of the circuit board 11. The pair of power supply electrodes 12b are part of the metal wiring, and one is on the + side and the other is on the - side.

A light emitting section 12d surrounded by an annular dam 12c is provided at the center of the submount substrate 12a. The dam 12c is formed of, for example, white silicone resin kneaded with fine particles of titanium oxide, and is, for example, a circular ring having a dome-shaped cross section with a width of about 0.7 to 1.3 mm and a height of about 0.5 to 0.8 mm. Consisting of The light emitting section 12d is configured to emit high output light with high luminous density by arranging a plurality of LED chips 15 vertically and horizontally in the inner region of the dam 12c and connecting these LED chips 15 with gold wires or the like. This is what I did. The LED chips 15, gold wires, etc. arranged in the light emitting part 12d are sealed with silicone resin containing phosphor particles filled inside the dam 12c.

The flexible conductive member 13 that connects the COB module 12 and the circuit board 11 is, for example, a lead wire that electrically connects the two. One end of the flexible conductive member 13 is soldered (not shown) to a power supply electrode 12b provided on the submount board 12a of the COB module 12, and the flexible conductive member 13 is soldered to a power supply electrode 11c of an electric circuit provided on the surface of the circuit board 11. The other end of the COB module 12 is soldered (not shown), and the two opposing flexible conductive members 13 support the COB module 12 as a pair. Note that since the flexible conductive member 13 has flexibility, it follows the movement of the COB module 12. Further, the flexible conductive member 13 is covered with an insulating film. The flexible conductive member 13 is not limited to general lead wires such as vinyl wires, tin-plated wires, and enameled wires, but may also be electrically conductive and flexible, such as metal helical springs or plate springs. It may also be a member that has spring properties.

As shown in FIG. 2, each of the flexible conductive members 13 is arranged on the COB module 12, the gap 14, and the circuit board 11, and extends from the power supply electrode 12b of the COB module 12 to the outer side 12f of the submount board 12a. The end portion is connected to the power supply electrode 11c in a state in which it extends in a straight line diagonally across the inner side 11d of the opening 11a to the power supply electrode 11c of the circuit board 11. Note that the flexible conductive member 13 may be wired in a straight line with some slack. In this way, the power supply electrode 12b of the COB module 12 and the power supply electrode 11c of the circuit board 11 are provided at positions shifted from each other, and they are connected by the flexible conductive member 13 extending diagonally, so that the flexible conductive It becomes possible to ensure a certain length of the member 13, and it is possible to make the flexible conductive member 13 follow the movement of the COB module 12 within the opening 11a. That is, since the COB module 12 is connected to and supported by the circuit board 11 only by the flexible conductive member 13, movement of the COB module 12 is possible. For example, by pushing the COB module 12 vertically out of the opening 11a of the circuit board 11, the optical axis angle and the height position of the light emitting surface of the COB module 12 can be easily finely adjusted. In addition, in the first embodiment, since four COB modules 12 are arranged on one circuit board 11, the optical axis and the height position of the light emitting surface of each COB module 12 can be finely adjusted individually. , it becomes possible to make more fine-grained light emission adjustments.

(Second embodiment: LED light emitting device)
FIG. 4 shows main parts of an LED light emitting device according to a second embodiment of the present application. In the LED light emitting device 20 according to this embodiment, the width of the gap 14 between the inner side 11d of the opening 11a of the circuit board 11 and the outer side 12f of the submount board 12a of the COB module 12 is that of the first embodiment. The first embodiment is different from the first embodiment except that it is formed narrower, the position of the power supply electrode 11c provided near the opening 11a of the circuit board 11, and the flexible conductive member 13 are wired in a curved shape. It has the same configuration as the LED light emitting device 10. Therefore, detailed explanation will be omitted by using the same reference numerals for the same configurations.

In the second embodiment, the size of the opening 11a of the circuit board 11 is made smaller than that of the first embodiment, so that there is a gap between the inner side 11d of the opening 11a and the outer side 12f of the submount board 12a. The width of the gap 14 is narrowed. This is to suppress horizontal rotation of the COB module 12 that is likely to occur when the COB module 12 and circuit board 11 are screwed to the heat sink (see FIG. 13). By narrowing the width of the gap 14, the outer side 12f of the submount board 12a to be rotated is brought into contact with the inner side 11d of the opening 11a, and the rotation is restricted, thereby suppressing horizontal rotation. be able to. The width of the gap 14 is, for example, a value calculated by the formula L<D<L+0.5 mm, preferably a value calculated by the formula L<D<L+0.3 mm.

Further, in the second embodiment, power supply electrodes 11c are provided in the vicinity of the upper and lower inner sides 11d of the opening 11a of the circuit board 11, forming a pair. The distance between this power supply electrode 11c and the power supply electrode 12b on the COB module 12 side is shorter than that in the first embodiment, but there is a curved state between both power supply electrodes 11c and 12b at least in plan view. A flexible conductive member 13 is spanned. By curving the flexible conductive member 13 at least in plan view, the flexibility and springiness of the flexible conductive member 13 can be increased while ensuring the length of the flexible conductive member 13.

(Third embodiment: LED light emitting device)

FIG. 5 shows main parts of an LED light emitting device according to a third embodiment of the present application. The LED light emitting device 30 according to this embodiment has a point that a closing member is disposed in the gap 14 formed between the 12 outer sides 12f of the COB module and the inner side 11d of the opening 11a of the circuit board 11. Except for this, the structure is the same as that of the LED light emitting device according to the first embodiment. Therefore, detailed explanation will be omitted by using the same reference numerals for the same configurations.

In this embodiment, the closing member is a projection that projects from each of the two inner sides 11d located above and below the opening 11a toward the two outer sides 12f located above and below the submount board 12a of the COB module 12. 11e. By abutting the tip of the protrusion 11e against the outer side 12f of the submount substrate 12a, rotation of the COB module 12 in the horizontal direction can be suppressed. Horizontal rotation is likely to occur when the COB module 12 and circuit board 11 are screwed to a heat sink (see FIG. 13). The protrusions 11e are arranged diagonally opposite each other on the inner side 11d facing the protrusions 11e. Note that the position of the protrusion 11e is not particularly limited, and may be provided at a position facing the power supply electrode 12b of the COB module 12, for example, as shown in FIG.

(Fourth embodiment: LED light emitting device)

7 and 8 show main parts of an LED light emitting device according to a fourth embodiment of the present application. The LED light emitting device 40 according to this embodiment has the following points: the COB module 12 and the circuit board 11 are fixed by a flexible adhesive 16 that connects them, and the COB module 12 is supported by the circuit board 11. , has the same configuration as the LED light emitting device 10 according to the first embodiment, except that it includes a screw hole 18a and a washer hole 18b. Therefore, detailed explanation will be omitted by using the same reference numerals for the same configurations.

In the fourth embodiment, the flexible adhesive 16 includes a power supply electrode 12b provided on the submount substrate 12a of the COB module 12, one end of the flexible conductive member 13 connected to the power supply electrode 12b, solder 17, etc. is covered. Further, part or all of the flexible conductive member 13 may be coated with the flexible adhesive 16. The flexible adhesive 16 is made of an elastic silicone adhesive or the like, and is applied onto the power supply electrode 12b and the solder 17. Moreover, the flexible conductive member 13 may also be coated. For example, as shown in FIG. 8, this flexible adhesive 16 includes a case where it is stretched between the submount board 12a and the circuit board 11, spanning the gap 14 while also covering the gap 14 of the opening 11a. In addition, as shown in FIG. 9, when the gap 14 of the opening 11a is also filled, the fixation of both becomes more secure. Further, as shown in FIG. 10, even when the flexible adhesive 16 is filled only into the gap 14 of the opening 11a, the COB module 12 is fixed to the circuit board 11.

In this way, in the LED light emitting device 40 according to the fourth embodiment, the COB module 12 and the flexible conductive member 13 are supported on the circuit board 11 by the flexible adhesive 16. Although the movement of the COB module 12 is somewhat restricted compared to the LED light emitting device 10 in the embodiment, this will reduce the risk of misalignment of the COB module 12 and the flexible conductive member 13 that may occur during transportation or handling of the LED light emitting device 40. This can prevent wire breakage, etc. On the other hand, since the flexible adhesive 16 has elasticity and flexibility, the COB module 12 and the flexible conductive member 13 are not fixed to the circuit board 11 at all, and the circuit board The COB module 12 is allowed to move to some extent within the opening 11a of the COB module 11.

In addition, in the fourth embodiment, a case has been described in which the flexible adhesive 16 is applied on the solder 17 applied to the power supply electrode 12b of the COB module 12, but in addition to application on the power supply electrode 12b, In the case where a protrusion 11e as a closing member is disposed in the gap 14 of the opening 11a as in the LED light emitting device 30 shown in FIG. The COB module 12 and the circuit board 11 can be fixed by applying the flexible adhesive 16 so as to also touch the tip of the protrusion 11e near the outer side 12f of the COB module 12a. Note that, as shown in FIG. 6, when the protrusion 11e is provided at a position facing the power supply electrode 12b of the COB module 12, when applying the flexible adhesive 16 to the power supply electrode 12b, the protrusion 11e is Since at least the tip portion is applied together, the adhesive application process can be simplified. The location where the flexible adhesive 16 is applied is not limited to the power supply electrode 12b as described above. For example, the flexible adhesive 16 may be applied at a location different from the power supply electrode 12b in order to fix the COB module 12 and the circuit board 11. It is not necessary to fix the COB module 12 and the circuit board 11 at two places, but it is sufficient that they are fixed at at least one place.

Furthermore, in the fourth embodiment, screw holes 18a are provided in two diagonally opposite corners of the opening 11a of the circuit board 11, but the screw holes 18a are different from those in the first embodiment. Unlike the screw holes 11b, one washer hole 18b is provided on each of the left and right sides of the corner of the submount board 12a. As described above, since the screw hole 18a has washer holes 18b on the left and right sides, as shown in FIGS. 11 and 12, the COB module 12 and circuit board 11 are attached to the heat sink (see FIG. Even if there is some height deviation between the COB module 12 and the circuit board 11 when fixing them with washers, a part of the washer is placed diagonally inside the washer hole 18b, so that Both can be securely fixed. In addition, as shown in FIG. 12, the washer may be a combination of a flat washer 19a and a spring washer 19b.

(Fifth Embodiment: Lighting Fixture) FIG. 13 shows main parts of a lighting fixture 50 using the LED light emitting device 10 according to the first embodiment. A lighting fixture 50 according to the fifth embodiment includes the above-described LED light emitting device 10 and a heat sink 51 that is in contact with the bottom surface of the submount substrate 12a of the COB module 12. The heat sink 51 has a convex portion in a portion corresponding to the opening 11a of the circuit board 11. In the two adjacent openings 11a, a pair of protrusions 51a is formed in one opening 11a, and a protrusion 51b is formed in the other opening 11a. These convex portions 51a and 51b are rectangular projections in plan view that substantially correspond to the shape of the opening 11a. The upper surfaces of the convex portions 51a and 51b are flat so as to be in contact with the bottom surface of the submount substrate 12a as a whole, but are inclined in one direction. In this embodiment, the convex portions 51a and 51b have different directions in which their upper surfaces are inclined, and the convex portion 51a on the left side in FIG. 13 has its upper surface inclined to the left side (normal line A); The upper surface of the convex portion 51b is inclined to the right (normal line A'). In this way, the normal A direction of the upper surface of one convex portion 51a is different from the normal A' direction of the upper surface of the other convex portion 51b.

When the heat sink 51 described above is placed on the back side of the LED light emitting device 10, the COB module 12 is pushed by the protrusions 51a and 51b of the heat sink 51, respectively. At this time, the flexible conductive member 13 connecting the COB module 12 and the circuit board 11 is bent, and the COB module 12 is pushed out from the opening 11a. As a result, the COB module 12 is arranged in accordance with the slope of the upper surface of the corresponding convex portions 51a and 51b. Specifically, the COB module 12 placed on the top surface of the left convex portion 51a is arranged so that the optical axis of the light emitting portion 12d coincides with the direction of the normal A, and the COB module 12 is placed on the top surface of the right convex portion 51b. The placed COB module 12 is placed so that the optical axis of the light emitting part 12d coincides with the direction of the normal line A'. As a result, the lighting fixture 50 in this embodiment can illuminate a wide range by directing the light emitted from the adjacent COB modules 12 slightly outward.

In the lighting fixture 50 of the fifth embodiment, in the two adjacent openings 11a, one opening 11a has a protrusion 51a, and the other opening 11a has a protrusion 51b. Although the case has been described in which the normal A direction of the top surface of one convex portion 51a is different from the normal A′ direction of the top surface of the other convex portion 51b, in the lighting fixture of the present application, the circuit board 11 When the heat sink 51 includes a plurality of openings 11a and has a convex portion in a portion corresponding to the plurality of openings 11a of the circuit board 11, one or more of the plurality of convexities The heat sink may be formed such that the normal direction of the top surface of the convex portion is different from the normal direction of the top surface of one or more other convex portions. That is, when the heat sink has a plurality of convex portions, the normal directions of the upper surfaces of the plurality of convex portions may be in the same direction or in different directions.

(Sixth Embodiment: Lighting Fixture) FIG. 14 shows main parts of a lighting fixture 60 according to a sixth embodiment of the present application. The lighting fixture 60 according to this embodiment has the same configuration as the lighting fixture 50 according to the fifth embodiment, except that the heat sink 61 has a different shape and each COB module 12 is provided with a lens 62. . Therefore, detailed explanation will be omitted by using the same reference numerals for the same configurations. Note that the lens 62 can be a TIR (Total Internal Reflection) lens.

In the sixth embodiment, the convex portion 61a of the heat sink 61 is provided only for the right COB module 12 among the two COB modules 12 adjacent to each other in the left and right directions in FIG. Further, the upper surface of the convex portion 61a is a horizontal surface. Therefore, compared to the light emitting surface of the right COB module 12 placed on the top surface of the convex portion 61a, the top surface of the light emitting portion 12d of the left COB module 12 placed on the top surface of the heat sink 61 without a convex portion is , is lowered by the height of the convex portion 61a. Further, the light emitting surface of the COB module 12 placed on the upper surface of the convex portion 61a faces directly upward. Furthermore, a lens 62 is arranged above each COB module 12. This lens 62 is, for example, a TIR lens. The TIR lens is arranged so that the output surface 62a is at the same height as the COB module 12 placed on the heat sink 61.

Due to the above-mentioned features, in the lighting fixture 60 according to the sixth embodiment, the light ray B' emitted at a low angle from the right COB module 12 placed on the upper surface of the convex portion 61a of the heat sink 61 is emitted through the lens 62. On the other hand, the light ray B emitted from the COB module 12 on the left at a low angle is emitted without passing through the lens 62, so compared to a lighting fixture in which only the light ray B' is focused by the lens 62. This avoids the problem of darkening of the surrounding areas.

In addition, in the lighting fixture 60 of the sixth embodiment, a case has been described in which the convex portion 61a of the heat sink 61 is provided only for the right COB module 12 among the two COB modules 12 adjacent to each other on the left and right. In the lighting fixture of the present application, when a plurality of openings 11a are provided in the circuit board 11 and a COB module 12 is arranged in each opening 11a, the protrusion 61a of the heat sink 61 is connected to a plurality of COB modules. 12, but not the remaining COB modules 12.

Furthermore, in the lighting fixture 60 of the sixth embodiment, a convex portion having a different height from the convex portion 61a of the heat sink 60 is provided for the left COB module 12 among the two COB modules 12 adjacent on the left and right sides. You can also do it. Furthermore, in the lighting fixture of the present application, when the circuit board 11 is provided with a plurality of openings 11a and the heat sink 60 has a convex portion in a portion corresponding to the plurality of openings 11a of the circuit board 11, a plurality of convex portions are provided. The heat sink includes a heat sink formed such that the height position of the top surface of one or more of the protrusions is different from the height position of the top surface of the other one or more protrusions. be able to. That is, when the heat sink has a plurality of convex portions, there are a plurality of convex portions having different height positions on the upper surface.

(Seventh Embodiment: Lighting Fixture) FIG. 15 shows main parts of a lighting fixture 70 according to a seventh embodiment of the present application. The lighting fixture 70 according to this embodiment is the same as that according to the fifth embodiment, except that the shape of the heat sink 71 is different, and the heat conductive members 71a and 71b are arranged between the COB module 12 and the heat sink 71. It has the same configuration as the lighting fixture 50. Therefore, detailed explanation will be omitted by using the same reference numerals for the same configurations.

The heat sink 71 according to the seventh embodiment has a flat top surface. Sheet-shaped heat conductive members 71a and 71b are arranged between the flat top surface and the bottom surface of the COB module 12. The thermally conductive members 71a and 71b are sheet-like members made of gel-type silicone having an ASKER C of 20 or less, for example, and have a thickness of about 0.3 mm. The heat conductive members 71a, 71b are arranged alternately for each COB module 12, and the entire lower surface of the submount substrate 12a of each COB module 12 is placed on the heat conductive members 71a, 71b. By closely contacting the heat sink 71 and the heat conductive members 71a, 71b, and the COB module 12 and the heat conductive members 71a, 71b, and creating a structure that does not create an air layer between them, it is possible to prevent a decrease in heat transfer efficiency. . Note that the heat conductive members 71a and 71b are not limited to sheet-like ones, but may be paste-like ones arranged for each COB module 12.

In the lighting fixture 70 according to the seventh embodiment, the heat conductive members 71a and 71b are arranged between the COB module 12 and the heat sink 71, so that heat generated from the COB module 12 can be efficiently transmitted to the heat sink 71. . Further, since the heat conductive members 71a and 71b are arranged only on the lower surface of the COB module 12, the heat conductive effect is large even though the material is small. Furthermore, when fixing the COB module 12 and the heat sink 71 via the heat conductive members 71a and 71b, even if there is a difference in the thickness of the heat conductive members 71a and 71b, the COB module 12 and the circuit board 11 cannot be connected. By bending the flexible conductive member 13, the COB module 12 and the heat sink 71 can be properly fixed via the heat conductive members 71a and 71b.

(Eighth Embodiment: Lighting Fixture) FIG. 16 shows main parts of a lighting fixture according to an eighth embodiment of the present application. The lighting fixture 80 according to this embodiment uses the LED light emitting device 40 according to the fourth embodiment, and the upper surfaces of the pair of convex portions 81a and 81b provided on the heat sink 81 are both flat surfaces. Except for this, the lighting fixture 50 has the same configuration as the lighting fixture 50 according to the fifth embodiment. Therefore, detailed explanation will be omitted by using the same reference numerals for the same configurations.

In the eighth embodiment, as shown in FIG. 16, the left and right convex portions 81a and 81b provided on the heat sink 81 have the same height, and both have flat upper surfaces. The COB module 12 is placed on the top surface of the convex portions 81a and 81b, and the COB module 12 is raised from the top surface of the circuit board 11 to raise the position of the light emitting portion 12d, so that a lens (not shown) placed above is formed. The incidence efficiency is improved. Further, in the LED light emitting device 40 of this embodiment, the submount board 12a of the COB module 12 is fixed to the circuit board 11 with a flexible adhesive 16. However, since the flexible adhesive 16 has elasticity and flexibility, the movement of placing the COB module 12 on the upper surface of the convex portions 81a and 81b of the heat sink 81, and the movement of the flexible conductive member 13, It is possible to follow.

In any of the above-mentioned LED light emitting devices and lighting equipment, one COB module 12 is arranged in each of the openings 11a provided in the circuit board 11, but in the LED light emitting device and lighting equipment disclosed in this application, , it is also possible to arrange multiple COB modules in one opening. For example, it is also possible to provide a rectangular opening in the circuit board and arrange a plurality of COB modules in a line along the long side of the opening. At this time, each power supply electrode of each COB module and each power supply electrode provided along the long side of the opening of the circuit board are connected by flexible conductive members, respectively.

Furthermore, in the LED light emitting device and the lighting fixture using this LED light emitting device disclosed in this application, several types of COB modules with different characteristics can be mounted on one circuit board. In other words, the characteristics may be changed for each COB module mounted on a circuit board. For example, COB modules that emit light of different colors can be arranged in units of openings provided in the circuit board of the LED light emitting device. In this way, a lighting fixture exhibiting an intermediate luminescent color can be obtained. Further, it is also possible to make the forward voltage (Vf) of the COB module different for each opening. In other words, when using a COB module with 6 stages in series and a COB module with 10 stages (the forward voltage is expressed by the number of stages of LED chips in series), connect the two COB modules in series on the circuit board, The LED light emitting device 10 with directional voltage (Vf) of 12 stages, 16 stages, or 20 stages can be easily configured. Furthermore, the size of the COB module may be different for each opening. In this way, the light distribution angle of the irradiation surface can be adjusted. Further, some of the plurality of openings provided in the circuit board may not have a COB module disposed therein.

Claims (21)

a circuit board having an opening;
A COB module placed in the opening,
a flexible conductive member connecting the COB module and the circuit board;
Equipped with
The COB module is supported by the circuit board via a flexible conductive member, and by making the flexible conductive member flexibly follow the movement of the COB module, the COB module can move relative to the circuit board. LED light emitting device. The COB module includes a submount board having an outer side facing the inner side of the opening of the circuit board with a predetermined gap, and a light emitting section provided on the upper surface of the submount board,
A power supply electrode provided on the COB module and a power supply electrode provided on the circuit board are provided at positions shifted from each other, and both power supply electrodes are connected to the outer side of the submount board and the inner side of the opening of the circuit board. The LED light emitting device according to claim 1, wherein the LED light emitting device is connected by a flexible conductive member extending linearly across the LED. The COB module includes a submount board having an outer side facing the inner side of the opening of the circuit board with a predetermined gap, and a light emitting section provided on the upper surface of the submount board. 2. The LED light emitting device according to claim 1, wherein the power supply electrode provided on the circuit board and the power supply electrode provided on the circuit board are connected by a flexible conductive member arranged in a curved state. 4. The LED light emitting device according to claim 2, wherein horizontal rotation of the submount board is suppressed by an inner side of the opening of the circuit board. A horizontal rotation of the submount board is suppressed by a closing member disposed in the predetermined gap between an inner side of the opening of the circuit board and an outer side of the submount board. 3. The LED light emitting device according to 2 or 3. 6. The LED light emitting device according to claim 5, wherein the closing member is a protrusion that projects from an inner side of the opening of the circuit board toward an outer side of the submount board. a circuit board having an opening;
A COB module placed in the opening,
a flexible conductive member connecting the COB module and the circuit board;
Equipped with
LED light emission in which a COB module is supported by a circuit board via a flexible conductive member, and the circuit board and the COB module placed in the opening of the circuit board are fixed by a flexible adhesive that connects them. Device. The COB module includes a submount substrate having an outer side opposite to an inner side of the opening of the circuit board, and a light emitting section provided on the upper surface of the submount substrate,
8. The LED light emitting device according to claim 7, wherein the flexible conductive member extends from a power supply electrode provided on the COB module diagonally across an outer side of the submount board to a power supply electrode provided on the circuit board. The flexible conductive member is arranged in a linearly extending state or in a curved state between a power supply electrode provided on the COB module and a power supply electrode provided on the circuit board. The LED light emitting device according to claim 7 or 8. 9. The LED light emitting device according to claim 8, wherein horizontal rotation of the submount board is suppressed by an inner side of the opening of the circuit board. A predetermined gap is provided between the inner side of the opening of the circuit board and the outer side of the submount board, and horizontal rotation of the submount board is suppressed by a closing member placed in this gap. The LED light emitting device according to claim 8. The LED light emitting device according to claim 11, wherein the closing member is a protrusion that projects from an inner side of the opening of the circuit board toward an outer side of the submount board. 8. The LED light emitting device according to claim 7, wherein the flexible adhesive covers a power electrode of the COB module to which the flexible conductive member is connected. 13. The flexible adhesive contacts at least a portion of the closing member disposed in a gap between the inner side of the opening of the circuit board and the outer side of the submount board. LED light emitting device. 15. The opening of the circuit board is provided in a rectangular shape, and screw holes are provided at two diagonally opposite corners of the opening, and the screw holes are provided with adjacent washer holes. The LED light emitting device according to any one of the above. Any one of claims 1 to 15, wherein the circuit board is provided with a plurality of openings, the COB module is disposed in each opening, and each COB module and the circuit board are connected by the flexible conductive member. 1. The LED light emitting device according to item 1. The LED light emitting device according to any one of claims 1 to 16,
A lighting fixture comprising: a heat sink in contact with the bottom surface of the COB module included in the LED light emitting device. 18. The lighting fixture according to claim 17, wherein the heat sink is provided with a convex portion in a portion that contacts the bottom surface of the COB module.
The heat sink includes a plurality of convex portions,
Claim 18: Among the plurality of protrusions, the normal direction of the upper surface of one or more protrusions is different from the normal direction of the upper surface of the other one or more protrusions. Lighting equipment described in. The heat sink includes a plurality of convex portions,
Claim 18: Among the plurality of protrusions, the height position of the upper surface of one or more protrusions is different from the height position of the upper surface of the other one or more protrusions. Lighting equipment described in. The lighting fixture according to any one of claims 17 to 20, wherein a thermally conductive member is arranged between the heat sink and the COB module.

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