JP7363579B2 - Thermal conductivity controls, bulkheads, and structures - Google Patents

Description

The present invention relates to a thermal conductivity control body capable of changing thermal conductivity depending on temperature, a partition wall provided with this thermal conductivity control body, and a structure provided with this thermal conductivity control body.

A structure whose thermal conductivity changes depending on the load has been proposed (Non-Patent Document 1). This structure is a structure in which multiple metal plates are laminated with an air layer in between.In order to maintain the distance between the metal plates, the sides of the opposing metal plates are shaped like a U-shape in cross section. It is held in place by resin parts.
This structure has low thermal conductivity when no load is applied because the metal plates are separated by air spaces, but when a load is applied, the metal plates come into contact and conduct heat. rate increases. For example, the thermal conductivity of a configuration in which eight copper plates with a thickness of 1 mm are separated by an air layer of 0.25 mm ranges from 0.001 W/(m・K) to 100 W/(m・K) depending on the presence or absence of a load. It changes by about 100,000 times.

Phoenix et al. "Adaptive Thermal Conductivity Metamaterials: Enabling Active and Passive Thermal Control" Journal of Thermal Science and Engineering Applications, October 2018, Vol.10, 051020-1

The thermal conductivity of the above structure changes depending on the load, but does not change depending on the temperature. An object of the present invention is to provide a thermal conductivity control body that can change thermal conductivity depending on temperature. Furthermore, it is an object of the present invention to provide a partition wall provided with this thermal conductivity control body and a structure provided with this thermal conductivity control body.

In a first invention, a plurality of thermally conductive material plates are arranged in a stacked manner with a spaced layer interposed therebetween, and the plurality of thermally conductive material plates change from a spaced state to a contact state and from a contact state to a spaced state. A first bimetal plate is disposed above the top of the thermally conductive material plate in the stacking direction so as to face the thermally conductive material plate, and A second bimetallic plate is arranged below the lowest part in the stacking direction of the plates so as to face the thermally conductive material plate, and the first bimetallic plate is arranged under the opposite thermally conductive material plate. A first metal material layer having a small coefficient of thermal expansion is provided on the side opposite to the side thereof, and a second metal material layer having a large coefficient of thermal expansion is provided on the opposite side of the thermally conductive material plate. The second bimetallic plate has a third metal material layer having a small coefficient of thermal expansion on the opposite side of the thermally conductive material plate, and has a third metal material layer having a small coefficient of thermal expansion on the side opposite to the thermally conductive material plate. , the first bimetal plate has a fourth metal material layer having a large coefficient of thermal expansion, and the first bimetal plate changes from a separated state to a contact state with respect to the uppermost thermally conductive material plate in the stacking direction; , the second bimetal plate is held so as to be able to change from a contact state to a separated state, and the second bimetal plate changes from a contact state to a separated state with respect to the lowermost thermally conductive material plate in the stacking direction; This is a thermal conductivity control body that is held so that it can change from a separated state to a contact state.

A second invention is the thermal conductivity control body according to the first invention, wherein at a first temperature, the first bimetal plate is separated from the uppermost thermally conductive material plate in the stacking direction. and the second bimetal plate is in contact with the lowest thermally conductive material plate in the stacking direction, and at a second temperature that is higher than the first temperature, The first bimetal plate is in contact with the thermally conductive material plate at the top in the stacking direction, and the second bimetal plate is in contact with the thermally conductive material plate at the bottom in the stacking direction. and the first bimetal plate is in contact with the uppermost thermally conductive material plate in the stacking direction at a third temperature that is higher than the second temperature, Further, the second bimetal plate is a thermal conductivity control body that is spaced apart from the lowest thermally conductive material plate in the stacking direction.

A third invention is the thermal conductivity control body according to the first or second invention, wherein the plurality of thermally conductive material plates are made of a material having a lower thermal conductivity than the thermally conductive material plates. This is a thermal conductivity control body that is held so that it can change from a separated state to a contact state and from a contact state to a separated state by a holding part that is attached to the heat conductivity control body.

A fourth invention is the thermal conductivity control body according to any one of the first to third inventions, wherein the first bimetal plate is attached to the uppermost thermally conductive material plate in the lamination direction. A plurality of the second bimetal plates, which are paired with the first bimetal plate, are arranged with respect to the thermally conductive material plate at the bottom in the stacking direction, and When viewed from above in the stacking direction of the conductive material plates, the pair of the first bimetal plate and the second bimetal plate at least partially overlap, or the pair of the first bimetal plate and the second bimetal plate overlap, or This is a thermal conductivity control body in which either the first bimetal plate or the second bimetal plate includes the other.

A fifth invention is the thermal conductivity control body according to the fourth invention, in which at least one of the plurality of first bimetal plates arranged is different from the other one of the first bimetal plates. This is a thermal conductivity control body made of a material different from that of the bimetal plate No. 1.

A sixth invention is the thermal conductivity control body according to the fourth invention, in which at least one of the plurality of second bimetal plates arranged is different from the other one of the second bimetal plates. This is a thermal conductivity control body made of a different material from the bimetal plate No. 2.

A seventh invention is the thermal conductivity control body according to the fourth invention, in which at least one of the plurality of first bimetal plates arranged is different from the other one of the first bimetal plates. This is a thermal conductivity control body that is different in size from the bimetal plate of No. 1.

An eighth invention is the thermal conductivity control body according to the fourth invention, in which at least one of the plurality of second bimetal plates arranged is different from the other second bimetal plates. This is a thermal conductivity control body that is different in size from the bimetal plate No. 2.

A ninth invention is comprised of a thermal conductivity control body according to any one of the first to eighth inventions, and a material having a thermal conductivity lower than that of the thermal conductivity control body. A partition wall including a heat insulating section.

A tenth invention is a structure having an internal space separated from the outside via a partition, wherein at least a part of the partition is provided with the thermal conductivity control according to any one of the first to eighth inventions. A structure in which a body is installed.

In the thermal conductivity control body of the present invention, the thermal conductivity can be changed depending on the temperature.
Moreover, in the partition wall provided with the thermal conductivity control body of the present invention, heat transfer can be controlled depending on the temperature via the partition wall.
Further, in a structure including the thermal conductivity control body of the present invention, heat transfer between the internal space and the outside of the structure can be controlled depending on the temperature.

A perspective view showing an example of a first embodiment of a thermal conductivity control body according to the present invention Front view of the thermal conductivity control body shown in Figure 1 A front view showing modification 1 of the first embodiment of the thermal conductivity control body according to the present invention A front view showing modification 2 of the first embodiment of the thermal conductivity control body according to the present invention Diagram showing the action of the thermal conductivity control body shown in FIG. 2 Diagram showing the action of the thermal conductivity control body following FIG. 5 Diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body shown in Figure 2 A sectional view showing an example of a partition wall according to the present invention A sectional view showing a configuration example of a structure according to the present invention Diagram showing the effect of the partition wall according to the present invention A plan view showing an example of a second embodiment of the thermal conductivity control body according to the present invention A plan view showing modification 1 of the second embodiment of the thermal conductivity control body according to the present invention A plan view showing modification 2 of the second embodiment of the thermal conductivity control body according to the present invention

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the drawings, for convenience of illustration and ease of understanding, the scale, vertical and horizontal dimension ratios, etc. are appropriately changed and exaggerated from those of the actual objects.

In addition, terms used in this specification to specify shapes, geometric conditions, physical properties, and their degrees, such as terms such as "flat" and "same", lengths, angles, and values of physical properties, etc. shall be interpreted to include the extent to which similar functions can be expected, without being bound by a strict meaning. Furthermore, in the drawings, for clarity, the shapes of multiple parts that can be expected to have similar functions are shown in a regular manner, but without being bound by a strict meaning, it is possible to expect the functions The shapes of the portions may be different from each other as long as the shapes can be different from each other. In addition, in the drawings, boundaries indicating bonding surfaces between members are shown as simple straight lines for convenience, but they are not restricted to exact straight lines and can be used to achieve the desired bonding performance. The shape of the boundary line is arbitrary within the range possible.

In this specification, the term "separated state" refers to a state in which two plates facing each other in the stacking direction are not in contact with each other and are physically separated.
Moreover, "separating" refers to changing two plates facing each other in the stacking direction from a state in which they were in contact with each other to a state in which they are physically separated.

<First embodiment>
(Thermal conductivity control body)
First, a first embodiment of a thermal conductivity control body according to the present invention will be described using FIGS. 1 to 4.
Here, FIG. 1 is a perspective view showing an example of a first embodiment of a thermal conductivity control body according to the present invention, and FIG. 2 is a front view of the thermal conductivity control body shown in FIG. 1. Moreover, FIG. 3 is a front view showing a modification 1 of the first embodiment of the thermal conductivity control body according to the present invention, and FIG. 4 is a front view showing a first embodiment of the thermal conductivity control body according to the present invention. It is a front view which shows the modification 2 of a form.

As shown in FIGS. 1 and 2, in the thermal conductivity control body 1 according to the present embodiment, three thermally conductive material plates 11A, 11B, and 11C are stacked with a spacer layer 12 in between. .
A first bimetal plate 14 is arranged above the top of the thermally conductive material plates 11A, 11B, and 11C in the stacking direction (Z direction in FIGS. 1 and 2) so as to face the thermally conductive material plate 11A. has been done.
Further, a second bimetal plate 15 is arranged below the lowest part of the thermally conductive material plates 11A, 11B, and 11C in the stacking direction so as to face the thermally conductive material plate 11C.

In the thermal conductivity control body 1 shown in FIGS. 1 and 2, the first bimetal plate 14 is separated from the uppermost thermally conductive material plate 11A in the stacking direction, and the second bimetal plate 15 is separated from the uppermost thermally conductive material plate 11A in the stacking direction. , is in contact with the lowest thermally conductive material plate 11C in the stacking direction.

Here, the first bimetal plate 14 and the second bimetal plate 15 are two metal material layers having different coefficients of thermal expansion bonded together.
In the thermal conductivity control body 1 shown in FIGS. 1 and 2, the first bimetal plate 14 has a first metal material layer 14L having a small coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate 11A. However, a second metal material layer 14H having a large coefficient of thermal expansion is provided on the side of the thermally conductive material plate 11A.
Further, the second bimetal plate 15 has a third metal material layer 15L having a small coefficient of thermal expansion on the side of the thermally conductive material plate 11C, and on the side opposite to the side of the thermally conductive material plate 11C, It has a fourth metal material layer 15H with a large coefficient of thermal expansion.

In the thermal conductivity control body 1 shown in FIGS. 1 and 2, the three thermally conductive material plates 11A, 11B, 11C, the first bimetal plate 14, and the second bimetal plate 15 are attached to It is held by 13.
The holding part 13 is made of a material whose thermal conductivity is lower than that of the thermally conductive material plates 11A, 11B, and 11C, and the three thermally conductive material plates 11A, 11B, and 11C are , are maintained so that they can change from a separated state to a contact state, and from a contact state to a separated state.

Further, the first bimetal plate 14 is moved from a separated state to a contact state and from a contact state to a separated state with respect to the thermally conductive material plate 11A, which is the uppermost thermally conductive material plate in the stacking direction, by the holding portion 13. Similarly, the second bimetal plate 15 is held by the holding portion 13 with respect to the thermally conductive material plate 11C, which is the lowest thermally conductive material plate in the stacking direction. , are maintained so that they can change from a separated state to a contact state, and from a contact state to a separated state.

Here, in the thermal conductivity control body 1 shown in FIGS. 1 and 2, three thermally conductive material plates 11A, 11B, and 11C are arranged in a laminated manner with a spacing layer 12 in between, to avoid complications. However, in the present invention, the number of thermally conductive material plates may be at least two, and may be four or more. In either case, the plurality of thermally conductive material plates are arranged in a stacked manner with the spacing layer 12 in between.

Note that normally, the larger the number of thermally conductive material plates stacked with the spacing layer 12 in between, the greater the amount of change in the thermal conductivity of the thermal conductivity control body 1 (i.e., the maximum value of the thermal conductivity that changes). (difference between minimum values) can be increased. However, if the number of thermally conductive material plates is large and the thickness of the thermally conductive material plates is the same, the thickness of the thermal conductivity control body 1 will also be large. Moreover, the structure may also become complicated.
Therefore, the number of thermally conductive material plates stacked and arranged with the spacing layer 12 in between is appropriately selected depending on the application and the like. Although it depends on the application, a preferable number of thermally conductive material plates is 6 to 10.
For example, if eight copper plates with a thickness of 1 mm are used as the thermally conductive material plates and an air layer with a thickness of 0.25 mm is used as the separation layer 12, the thermal conductivity of the thermal conductivity control body 1 is increased by about 100,000 times. It is possible to change it.

In addition, in the thermal conductivity control body 1 shown in FIGS. 1 and 2, the holding portion 13 includes three thermally conductive material plates 11A, 11B, and 11C, a first bimetal plate 14, and a second bimetal plate. 15 is illustrated as an example of a holding portion having a U-shaped cross section, which holds the holding portion on each side, but the present invention is not limited to this.
For example, like the holding part 13a of the thermal conductivity control body 2 shown in FIG. (so-called spacer form).
In such a form, the thickness of the spacing layer 12 (that is, the spacing distance) is the same as the thickness of the holding portion 13a, so the spacing distance between each bimetal plate and the opposing thermally conductive material plate and the stacking arrangement are the same. This has the advantage that it is easy to control the distance between the thermally conductive material plates.

Further, like the holding part 13b of the thermal conductivity control body 3 shown in FIG. The respective ends of each thermally conductive material plate and each bimetallic plate may be held by fitting the corresponding outer edges thereof.
In the case of this form as well, since the holding part 13b has a so-called spacer-shaped part, it has the advantage that the thickness (separation distance) of the spacing layer 12 can be easily controlled, similar to the above-mentioned holding part 13a. There is.
In addition, the holding part 13b holds each thermally conductive material plate and each bimetal plate from the top to the bottom in the stacking direction in one wall-like form, so that the thermal conductivity control body 3 as a whole is , a more robust configuration can be achieved.

Each component that constitutes the thermal conductivity control body 1 will be explained below.
(Thermal conductive material plate)
The thermally conductive material plates 11A, 11B, and 11C are plate-shaped substances made of a thermally conductive material. In the present invention, it is usually preferable that the thermal conductivity of the thermally conductive material plates 11A, 11B, and 11C is large.
Although it depends on the application, the thermal conductivity of the thermally conductive material plates 11A, 11B, and 11C is preferably 80 W/(m・K) or more at around 20° C., and 200 W/(m・K). ) or more is more preferable, and even more preferably 400 W/(m·K) or more.

In addition, in the present invention, the thermally conductive material plates 11A, 11B, and 11C are elastically deformable, and are deformed by pressure from the first bimetal plate 14 and the second bimetal plate 15, and the thermally conductive material plates 11A, 11B, and 11C are deformed by pressure from the first bimetal plate 14 and the second bimetal plate 15 to When the first bimetal plate 14 and the second bimetal plate 15 are released from the pressure, the first bimetal plate 14 and the second bimetal plate 15 restore the original shape and become separated from the opposing heat conductive material plate.
The thermally conductive material plates 11A, 11B, and 11C arranged in a laminated manner can provide a heat insulation effect when they are separated from each other, and can provide a heat transfer effect when they are in contact with each other.

In the present invention, metal plates can be suitably used as the thermally conductive material plates 11A, 11B, and 11C. Examples of metal plates include those made of copper (Cu), aluminum (Al), gold (Au), silver (Ag), nickel (Ni), iron (Fe), and alloys containing these. be able to.
For example, at around 20° C., the thermal conductivity of copper (Cu) is 403 W/(m·K).
Further, the thermal conductivity of aluminum (Al) is 236 W/(m·K).
Similarly, the thermal conductivity of gold (Au) is 319 W/(m・K), the thermal conductivity of silver (Ag) is 428 W/(m・K), and the thermal conductivity of nickel (Ni) is 94 W/(m・K).・K), the thermal conductivity of iron (Fe) is 84 W/(m・K).

Further, as for the thickness of the metal plate, the smaller the thickness, the higher the heat transfer effect in the contact state. Note that the larger the thickness of the metal plate, the stronger the force required to transform it into a contact state. Further, as the thickness increases, the thickness of the entire thermal conductivity control body 1 may also increase. In the present invention, the preferred thickness is, for example, 0.5 mm or more and 2 mm or less, and more preferably 0.8 mm or more and 1.2 mm or less, although it depends on the application.

(separation layer)
The spacing layer 12 is a layer interposed between mutually opposing thermally conductive material plates in the separated state. Furthermore, in the thermal conductivity control body 1, the spacing layer 12 is formed between the first bimetal plate 14 and the opposing thermally conductive material plate 11A, and between the thermally conductive material plate 11C facing the second bimetal plate 15. It also intervenes in between.
The spacing layer 12 does not inhibit these deformations when each bimetal plate deforms or each thermally conductive material plate deforms, and as each bimetal plate deforms, the thermally conductive material plate facing each bimetal plate or The opposing thermally conductive material plates can change from a separated state to a contact state, and from a contact state to a separated state.
A substance may be present in the spacing layer 12, or a vacuum state in which no substance is present may be provided. If a material is present, the material is comprised of a material that has a lower thermal conductivity than the thermally conductive material plate. Although it depends on the application, it is preferable that the thermal conductivity of the spacing layer 12 is, for example, 1/1000 or less of that of the thermally conductive material plate.
In the present invention, the substance normally present in the spacing layer 12 is air. For example, at around 20° C., the thermal conductivity of air is 0.024 W/(m·K).

The spacing layer 12 separates the thermally conductive material plates facing each other and each bimetal plate and the thermally conductive material plates in the separated state, but the distance (separation distance) may be the same or different. You can leave it there. Further, for example, in thermally conductive material plates facing each other, the distance (separation distance) may be different between the inner side and the outer edge side of the facing surfaces.
The thickness of the spacing layer 12 (that is, the spacing distance) is determined by the deformation of the first bimetal plate 14 and the second bimetal plate 15, so that each bimetal plate and the thermally conductive material plate, or the thermally conductive material plates facing each other, The size is such that it can be changed from a separated state to a contact state and from a contact state to a separated state, and the heat insulation property of the thermal conductivity control body 1 in the separated state and the heat conductivity of the thermal conductivity control body 1 in the contact state are determined to meet the purpose.
The thickness of the spacing layer 12 (that is, the spacing distance) depends on the material and thickness of the thermally conductive material plates to be laminated, but for example, it can be in the range of 0.1 mm or more and 0.5 mm or less.

(holding part)
The holding part 13 (the above-mentioned holding parts 13a and 13b are also the same) holds the mutually opposing thermally conductive material plates so that they can be changed from a separated state to a contact state and from a contact state to a separated state.
In the thermal conductivity control body 1, the holding part 13 also holds the first bimetal plate 14 and the second bimetal plate 15, and brings each bimetal plate and the opposing thermally conductive material plate into contact with each other from a separated state. state, and maintains it so that it can change from a contact state to a separation state.
The holding portion 13 is made of a material whose thermal conductivity is lower than that of the thermally conductive material plate, and is elastically deformable. Although it depends on the application, it is preferable that the thermal conductivity of the holding part 13 is, for example, 1/100 or less of that of the thermally conductive material plate.
Various resins and rubbers can be used as the material constituting the holding part 13. For example, at around 20° C., the thermal conductivity of epoxy resin is 0.21 W/(m·K).
The holding portion 13 may include a sintered body such as ceramics. For example, by including a sintered body such as ceramics, the thermal conductivity can be reduced.

(First bimetal plate, second bimetal plate)
The first bimetal plate 14 and the second bimetal plate 15 are made by bonding two types of metal material layers each having a different coefficient of thermal expansion. Therefore, the first bimetal plate 14 and the second bimetal plate 15 also have thermal conductivity like the thermally conductive material plates 11A, 11B, and 11C.
In the thermal conductivity control body 1, the first bimetal plate 14 and the second bimetal plate 15 press the opposing thermally conductive material plates by deformation, thereby separating the opposing thermally conductive material plates from each other. to contact state.

However, the temperature range in which the first bimetal plate 14 contacts the opposing thermally conductive material plate 11A and the temperature range in which the second bimetal plate 15 contacts the opposing thermally conductive material plate 11C are overlapping temperatures. Although it has a range, it is designed to be a different range.
More specifically, for example, in the thermal conductivity control body 1 shown in FIGS. 1 and 2, at the first temperature, the first bimetal plate 14 is in contact with the uppermost thermally conductive material plate 11A in the stacking direction. The second bimetal plate 15 is spaced apart and comes into contact with the lowest thermally conductive material plate 11C in the stacking direction, and at a second temperature that is higher than the first temperature, the first bimetal plate 15 At the third temperature, where the plate 14 is in contact with the thermally conductive material plate 11A and the second bimetallic plate 15 is in contact with the thermally conductive material plate 11C, the temperature is higher than the second temperature. The first bimetal plate 14 is designed to be in contact with the thermally conductive material plate 11A, and the second bimetal plate 15 is spaced apart from the thermally conductive material plate 11C.
In the present invention, as the first bimetal plate 14 and the second bimetal plate 15, there are no particular restrictions, and any commercially available plates can be used as long as they have the above-mentioned effects. Depending on the temperature to be used, various bimetallic plates can be selected as appropriate.

The first bimetal plate 14 and the second bimetal plate 15 are made by adding manganese (Mn), chromium (Cr), copper (Cu), etc. to an alloy of iron (Fe) and nickel (Ni), for example. An example is one in which two types of metal plates with different coefficients of thermal expansion are made and bonded together by rolling. An alloy (referred to as Invar) of 36 wt% nickel (Ni) and 64 wt% iron (Fe) may be used as the metal material layer having a small coefficient of thermal expansion.

(Effects of thermal conductivity control body)
Next, the functions and effects of the thermal conductivity control body 1 will be explained using FIGS. 5 to 7.
Here, FIGS. 5 and 6 are diagrams showing the action of the thermal conductivity control body shown in FIG. 2, and FIG. 7 is a diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body shown in FIG. It is.
Note that FIG. 5(a) is the same as FIG. 2 and shows the state of the thermal conductivity control body 1 at the above-mentioned first temperature. FIG. 5(b) shows the state of the thermal conductivity control body 1 at the second temperature. Moreover, FIG. 6(a) is the same as FIG. 5(b), and shows the state of the thermal conductivity control body 1 at the above-mentioned second temperature. FIG. 6(b) shows the state of the thermal conductivity control body 1 at the third temperature.

In addition, with the deformation of the thermal conductivity control body 1 from FIG. 5(a) to FIG. 5(b) and the deformation of the thermal conductivity control body 1 from FIG. 6(a) to FIG. 6(b), Strictly speaking, the holding part 13 also deforms, but to avoid complication, description and illustration of the deformation of the holding part 13 are omitted.

First, with reference to FIG. 5, the action and effect of the thermal conductivity control body 1 when the temperature rises from the first temperature to the second temperature will be described.

In the state shown in FIG. 5(a), that is, in the state of the thermal conductivity control body 1 at the above-mentioned first temperature, the thermally conductive material plate 11A facing the first bimetallic plate 14 and the thermally conductive material The plate 11A and the thermally conductive material plate 11B are each in a separated state.
On the other hand, the second bimetal plate 15 has an upwardly convex shape and is in contact with the lowest thermally conductive material plate 11C. Furthermore, the lowest thermally conductive material plate 11C is also pressed by the second bimetal plate 15 to have an upwardly convex shape, and is in contact with the thermally conductive material plate 11B located second from the lowest. It has become.

Here, the first bimetal plate 14 included in the thermal conductivity control body 1 shown in FIG. A second metal material layer 14H having a large coefficient of thermal expansion is provided on the side of the thermally conductive material plate 11A.
Therefore, when the temperature of the first bimetal plate 14 rises from the first temperature to the second temperature, the second metal material layer 14H having a large coefficient of thermal expansion changes to the first metal material layer 14H having a small coefficient of thermal expansion. Expanding more than the layer 14L, the first bimetal plate 14 is deformed to be convex downward as shown in FIG. 5(b), and comes into contact with the uppermost thermally conductive material plate 11A.
Then, the uppermost thermally conductive material plate 11A is also pressed by the deformation of the first bimetallic plate 14 and deforms into a downwardly convex shape, and the thermally conductive material plate 11A located second from the uppermost It comes into contact with the plate 11B.

On the other hand, the second bimetal plate 15 has a third metal material layer 15L with a small coefficient of thermal expansion on the side of the thermally conductive material plate 11C, and on the opposite side to the side of the thermally conductive material plate 11C. Since the fourth metal material layer 15H has a large coefficient of thermal expansion, when the temperature rises from the first temperature to the second temperature, the state shown in FIG. Although the convex shape on the upper side has become flatter than in the state shown in FIG. It maintains a contact state with the material plate 11C. The lowest thermally conductive material plate 11C also maintains contact with the second thermally conductive material plate 11B from the lowest position.

In this way, the first bimetallic plate 14, the thermally conductive material plate 11A, the thermally conductive material plate 11B, the thermally conductive material plate 11C, and the second bimetallic plate 15 of the thermal conductivity control body 1 are A contact state is established as shown in 5(b). Therefore, the thermal conductivity control body 1 shown in FIG. 5(b) has a higher thermal conductivity than the thermal conductivity control body 1 shown in FIG. 5(a).

Next, the operation and effect of the thermal conductivity control body 1 when the temperature rises from the second temperature to the third temperature will be explained using FIG. 6.

As described above, the first bimetal plate 14 has the first metal material layer 14L having a small coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate 11A, and A second metal material layer 14H having a large coefficient of thermal expansion is provided on the side.
Therefore, when the temperature rises from the second temperature to the third temperature, the first bimetal plate 14 protrudes lower than the state shown in FIG. 6(a) (that is, the state at the second temperature). It takes on the form of a mold, and the contact area with the uppermost thermally conductive material plate 11A increases. Then, the uppermost thermally conductive material plate 11A is also pressed by the deformation of the first bimetallic plate 14 and deforms to become more convex downward, and the thermally conductive material plate 11A located second from the uppermost The contact area with the material plate 11B will increase.

On the other hand, as described above, the second bimetal plate 15 has the third metal material layer 15L having a small coefficient of thermal expansion on the side of the thermally conductive material plate 11C, and has the third metal material layer 15L on the side of the thermally conductive material plate 11C. has a fourth metal material layer 15H with a large coefficient of thermal expansion on the opposite side, so when the temperature rises from the second temperature to the third temperature, the state shown in FIG. 6(a) (i.e., (the state at the second temperature), the upwardly convex form becomes flat (although not shown, depending on the metal material layer used, it may further deform and become a downwardly convex form), In the state shown in FIG. 6(b) (that is, the state at the third temperature), it is separated from the lowest thermally conductive material plate 11C. Then, since the lowermost thermally conductive material plate 11C is no longer pressed by the second bimetal plate 15, it is separated from the thermally conductive material plate 11B located second from the lowest.

In this way, in the state shown in FIG. 6(b), that is, in the state of the thermal conductivity control body 1 at the third temperature, the thermally conductive material plate 11C facing the second bimetal plate 15, and , the thermally conductive material plate 11C and the thermally conductive material plate 11B are each in a separated state. Therefore, the thermal conductivity control body 1 shown in FIG. 6(b) has a lower thermal conductivity than the thermal conductivity control body 1 shown in FIG. 6(a).

As described above, the thermal conductivity control body 1 can change the thermal conductivity depending on the temperature. That is, the thermal conductivity control body 1 can change from an adiabatic state to a heat transfer state, or from a heat transfer state to an adiabatic state, depending on the temperature.
More specifically, in the thermal conductivity control body 1, when the temperature rises from the first temperature to the second temperature, the thermal conductivity can be changed from a small value to a large value, and further, When the temperature increases from the second temperature to the third temperature, the thermal conductivity can be changed from a large value to a small value.

FIG. 7 is a diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body 1. As shown in FIG. 7, in the thermal conductivity control body 1, the thermal conductivity of the thermal conductivity control body 1 is a small value (K1) at a low temperature T1 (first temperature); At temperature T2 (second temperature), the thermal conductivity of the thermal conductivity control body 1 becomes a large value (K2), and at an even higher temperature T3 (third temperature), the thermal conductivity of the thermal conductivity control body 1 increases again. The conductivity becomes a small value (K1).

Therefore, for example, in a partition wall including the thermal conductivity control body 1, heat transfer can be controlled depending on the temperature via the partition wall. Furthermore, in a structure including the thermal conductivity control body 1, heat transfer between the internal space and the outside of the structure can be controlled depending on the temperature.
By controlling heat transfer between the substances separated by the thermal conductivity control body 1, the temperature of one substance can be maintained at a certain temperature or higher without requiring a separate energy supply or the like.

For example, in a structure having an internal space separated from the outside via a partition wall, when the thermal conductivity control body 1 is provided in at least a part of the partition wall, the temperature outside the structure is Even when the temperature changes from the third temperature to the third temperature (or from the third temperature to the first temperature), the temperature of the internal space of the structure can be maintained at a constant temperature (second temperature).

Therefore, even in a place where there is a large difference in temperature during the day, such as a desert, for example, a structure equipped with the thermal conductivity control body 1 will be in a heat transfer state from morning to noon, and the warm outside air will be transferred. Temperature is taken into the internal space, and when the temperature is subsequently high or cold, it becomes an insulated state and can maintain the temperature of the internal space at a constant temperature without consuming energy for cooling or heating.

(bulkheads and structures)
FIG. 8 is a sectional view showing an example of a partition wall according to the present invention. As shown in FIG. 8, the partition wall 20 includes a thermal conductivity control body 1 and a heat insulating portion 21 made of a material having a thermal conductivity lower than that of the thermal conductivity control body 1. ing.

Moreover, FIG. 9 is a sectional view showing an example of the structure of the structure according to the present invention. For example, as shown in FIG. 9(a), the structure 30A is a structure having an internal space separated from the outside via a partition, and the thermal conductivity control body 1 is provided in at least a part of the partition. It is provided.
Here, the partition wall configuring the structure 30A may be the partition wall 20 shown in FIG. 8. That is, the partition wall constituting the structure 30A includes a thermal conductivity control body 1 and a heat insulating portion 21 made of a material having a thermal conductivity lower than that of the thermal conductivity control body 1. You can leave it there.
In the example shown in FIG. 9(a), the thermal conductivity control body 1 is provided at one location, but the thermal conductivity control body 1 is not limited to this and may be provided at multiple locations. Further, although not shown, all of the partition walls forming the structure 30A may be formed of the thermal conductivity control body 1.

The structure according to the present invention may have any three-dimensional shape as long as it can have an internal space separated from the outside via a partition wall. For example, it can also have a cylindrical shape or a conical shape. In addition, the shape may be a pyramidal shape, a truncated cone shape, a spherical shape, various polyhedral shapes, or a three-dimensional shape composed of various flat surfaces and curved surfaces.

Here, the structure according to the present invention has a partition wall and an internal space as a minimum configuration, and may include other configurations in addition to these. For example, a structure 30B shown in FIG. 9(b) may include a main body portion 32 and an opening/closing portion 31. By providing the opening/closing part 31, it is possible to put things into the internal space of the structure 30B through the opening/closing part 31, or to take things out from the internal space.

There is no particular limitation on the size of the structure 30B, and for example, the height may be on the order of several millimeters or on the order of several hundred meters. Examples of the structures 30B include various housings, various containers, various aircraft bodies, and various buildings.

FIG. 10 is a diagram showing the function of the partition wall according to the present invention.
As described above, in the partition wall 20 provided with the thermal conductivity control body 1, heat transfer through the partition wall 20 can be controlled depending on the temperature.
For example, at the above-mentioned first temperature, the thermal conductivity control body 1 includes a thermally conductive material plate 11A facing the first bimetallic plate 14, and a thermally conductive material plate 11A, as shown in FIG. 5(a). The plate 11A and the thermally conductive material plate 11B are each in a separated state, and as shown in FIG. 7, the thermal conductivity of the thermal conductivity control body 1 is a small value (K1). That is, at the above-mentioned first temperature, the thermal conductivity control body 1 exhibits the effect of heat insulation.
Therefore, as shown in FIG. 10(a), at the above-mentioned first temperature, the partition wall 20 provided with the thermal conductivity control body 1 blocks or suppresses heat transfer between the outside and the inside via the partition wall 20. It acts like this.

On the other hand, at the above-mentioned second temperature, the thermal conductivity control body 1 includes the first bimetal plate 14, the thermally conductive material plate 11A, the thermally conductive The thermally conductive material plate 11B, the thermally conductive material plate 11C, and the second bimetallic plate 15 are in contact with each other, and as shown in FIG. )become. That is, at the above second temperature, the thermal conductivity control body 1 exhibits the effect of heat transfer.
Therefore, as shown in FIG. 10(b), at the second temperature, the partition wall 20 provided with the thermal conductivity control body 1 promotes heat transfer from the outside to the inside through the partition wall 20. It works like this.

Further, at the third temperature, the thermal conductivity control body 1 includes a thermally conductive material plate 11C facing the second bimetallic plate 15, and a thermally conductive material plate 11C facing the second bimetallic plate 15, as shown in FIG. The plate 11C and the thermally conductive material plate 11B are separated from each other, and as shown in FIG. 7, the thermal conductivity of the thermal conductivity control body 1 becomes a small value (K1). That is, at the third temperature described above, the thermal conductivity control body 1 exhibits the effect of heat insulation.
Therefore, as shown in FIG. 10(c), at the third temperature, the partition wall 20 provided with the thermal conductivity control body 1 blocks or suppresses heat transfer between the outside and the inside via the partition wall 20. It works like this.

As described above, in the partition wall 20 provided with the thermal conductivity control body 1, heat transfer can be controlled via the partition wall 20 according to the temperature. Furthermore, in a structure constituted by the partition wall 20, heat transfer between the internal space and the outside of the structure can be controlled depending on the temperature.
By controlling heat transfer between the substances separated by the thermal conductivity control body 1, the temperature of one substance can be maintained at a certain temperature or higher without requiring a separate energy supply or the like.
For example, in a structure having an internal space separated from the outside via a partition wall 20, the temperature outside the structure changes from a first temperature to a third temperature (or from the third temperature to the first temperature). The temperature of the internal space of the structure can be maintained at a constant temperature (second temperature).

<Second embodiment>
(Thermal conductivity control body)
Next, a second embodiment of the thermal conductivity control body according to the present invention will be described using FIGS. 11 to 13.
Here, FIG. 11 is a plan view showing an example of the second embodiment of the thermal conductivity control body according to the present invention, and FIG. 12 is a plan view showing an example of the second embodiment of the thermal conductivity control body according to the present invention. FIG. 13 is a plan view showing a modification 1 of the second embodiment of the thermal conductivity control body according to the present invention.

In the thermal conductivity control body 1 described above, one first bimetal plate 14 is arranged above the top of the thermal conductive material plates 11A, 11B, and 11C in the stacking direction, and the thermal conductive material plates Although the embodiment in which one second bimetal plate 15 is disposed below the lowest part in the stacking direction of 11A, 11B, and 11C is illustrated, the present invention is not limited to this, and the bimetal plate is A plurality of them may be arranged on the conductive material plate.

For example, in the thermal conductivity control body 50 shown in FIG. 11, six first bimetal plates 52 are arranged with respect to the thermally conductive material plate 51. In addition, in FIG. 11, to avoid complication, the illustration of the holding part that holds the first bimetal plate 52, etc. is omitted.
Here, the thermally conductive material plate 51 corresponds to the uppermost thermally conductive material plate in the stacking direction of the plurality of thermally conductive material plates in the thermal conductivity control body 50.
Although not shown, a second bimetal plate that is paired with each of the six first bimetal plates 52 is connected to the lowest thermally conductive material plate in the stacking direction of the plurality of thermally conductive material plates. There are 6 pieces arranged.
For example, when viewed from above the thermally conductive material plate 51, the pair of first bimetal plate 52 and second bimetal plate are arranged so as to overlap each other.
Note that the pair of first bimetal plate 52 and second bimetal plate at least partially overlap when viewed from above the thermally conductive material plate 51, or the pair of first bimetal plate 52 and second bimetal plate Either the bimetal plate 52 or the second bimetal plate may include the other.
With such an arrangement relationship, the first bimetal plate 52 and the second bimetal plate forming a pair are similar to the first bimetal plate 52 and the second bimetal plate in the thermal conductivity control body 1 of the first embodiment described above. Similar to the bimetal plate No. 2, the thermal conductivity can be changed depending on the temperature by sandwiching the thermally conductive material plate.

By arranging a plurality of pairs of the first bimetal plate and the second bimetal plate on the thermally conductive material plate in this way, even when the thermally conductive material plate has a large area, thermal conductivity can be improved. Thermal conductivity can be changed depending on the temperature over the entire area of the flexible material plate.

In the thermal conductivity control body 50 shown in FIG. 11, six first bimetal plates 52 are arranged with respect to the uppermost thermally conductive material plate 51 in the stacking direction, but In this embodiment, the number of first bimetal plates 52 may be two or more, and may be more than six. The number and placement locations are appropriately selected depending on the purpose.
In this case, the number and location of the second bimetal plates are also determined in accordance with the pair of first bimetal plates.

(Modification 1)
In this embodiment, the plurality of bimetal plates arranged on the thermally conductive material plate are not limited to having the same configuration.
For example, a plurality of bimetal plates arranged on the heat conductive material plate may be made of different materials. That is, each of the plurality of bimetal plates arranged on the thermally conductive material plate may be composed of metal material layers each having a different coefficient of thermal expansion.
For example, in the thermal conductivity control body 60 shown in FIG. 12, three types of first bimetal plates 62A, 62B, and 62C are arranged with respect to the uppermost thermally conductive material plate 61 in the stacking direction.

Although not shown in the drawings, also in this modification, the second bimetal plates that are paired with each of the first bimetal plates 62A, 62B, and 62C are in contact with the lowest thermally conductive material plate in the stacking direction. , placed at a predetermined location.
These second bimetal plates may also be composed of metal material layers having different coefficients of thermal expansion. For example, among the plurality of second bimetal plates arranged, at least one second bimetal plate may be made of a different material from the other second bimetal plates.

By arranging a plurality of bimetal plates made of different materials on the thermally conductive material plate 61 in this way, the thermal conductivity can be changed in each region of the thermally conductive material plate 61 according to different temperatures. be able to.
For example, in the thermal conductivity control body 60 shown in FIG. 12, the region where the first bimetal plate 62A is arranged can be changed from an adiabatic state to a heat transfer state at a lower temperature, and the first bimetal plate 62C is In the region where it is located, it is possible to change from an adiabatic state to a heat conductive state at a higher temperature.

In the thermal conductivity control body 60 shown in FIG. 12, a total of six first bimetal plates 62A, 62B, and 62C of three types are arranged with respect to the uppermost thermally conductive material plate 61 in the stacking direction. However, this modification is not limited to this.
For example, it is sufficient that at least one of the plurality of bimetal plates arranged is made of a different material from the other bimetal plates. Further, the number of each bimetal plate may be two or more, and may be more than six. The number and placement locations are appropriately selected depending on the purpose.

(Modification 2)
Further, in this embodiment, the plurality of bimetal plates arranged on the thermally conductive material plate are not limited to the same size.
For example, in the thermal conductivity control body 70 shown in FIG. 13, three types of first bimetal plates 72A, 72B, and 72C having different sizes (areas) are placed on the uppermost thermally conductive material plate 71 in the stacking direction. It is placed against.

Although not shown in the drawings, also in this modification, the second bimetal plates that are paired with each of the first bimetal plates 72A, 72B, and 72C are placed in a position relative to the lowest thermally conductive material plate in the stacking direction. , placed at a predetermined location.
These second bimetal plates may also have different sizes (areas). For example, among the plurality of second bimetal plates arranged, at least one second bimetal plate may be different in size from the other second bimetal plates.

By arranging a plurality of first bimetal plates of different sizes on the thermally conductive material plate 71 in this way, the thermal conductivity can be changed in each region of the thermally conductive material plate 71 according to different temperatures. be able to.
For example, in the thermal conductivity control body 70 shown in FIG. 13, the area where the first bimetal plate 72C, which is larger than the first bimetal plate 72B, is arranged is larger than the area where the first bimetal plate 72B is arranged. The region where the first bimetal plate 72A, which is smaller than the first bimetal plate 72B and which can be changed from an adiabatic state to a heat conductive state at a low temperature, is disposed has a lower temperature than the region where the first bimetal plate 72B is disposed. It can change from an adiabatic state to a heat transfer state at high temperatures.

In addition, in the thermal conductivity control body 70 shown in FIG. 13, three types of first bimetal plates 64A, 64B, and 64C having different sizes have a total amount of Although the configuration in which six pieces are arranged is shown, the present modification is not limited to this.
For example, when viewed from above in the stacking direction of the thermally conductive material plates, at least one of the plurality of bimetal plates may have a different size from the other bimetal plates. Further, the number of each bimetal plate may be two or more, and may be more than six. The number and placement locations are appropriately selected depending on the purpose.
Further, the plurality of bimetal plates arranged on the heat conductive material plate may have different sizes and may be made of different materials.

(bulkheads and structures)
Similarly to the first embodiment described above, in the partition wall provided with the thermal conductivity control body of the second embodiment and its modifications 1 and 2, heat transfer is performed depending on the temperature via the partition wall. can be controlled. Furthermore, even in structures including these thermal conductivity control bodies, heat transfer between the internal space and the outside of the structure can be controlled depending on the temperature.

Although the embodiments of the thermal conductivity control body, the partition wall, and the structure according to the present invention have been described above, the present invention is not limited to the above embodiments. The above-mentioned embodiments are illustrative, and any embodiment that has substantially the same configuration as the technical idea stated in the claims of the present invention and has similar effects will be covered by the present invention in any case. covered within the technical scope of

1, 2, 3 Thermal conductivity control body 11A, 11B, 11C Thermal conductive material plate 12 Spacing layer 13, 13a, 13b Holding part 14 First bimetal plate 14L First metal material layer 14H Second metal material layer 15 Second bimetal plate 15L Third metal material layer 15H Fourth metal material layer 20 Partition wall 21 Heat insulating parts 30A, 30B Structure 31 Opening/closing part 32 Main body parts 50, 60, 70 Thermal conductivity control bodies 51, 61, 71 Thermal conductive material plates 52, 62A, 62B, 62C, 72A, 72B, 72C First bimetal plate

Claims (10)

A plurality of thermally conductive material plates are stacked with spaced layers in between,
The plurality of thermally conductive material plates are held so as to be able to change from a separated state to a contact state and from a contact state to a separated state,
A first bimetal plate is arranged above the top of the thermally conductive material plate in the stacking direction so as to face the thermally conductive material plate,
A second bimetal plate is arranged below the lowest part of the thermally conductive material plate in the stacking direction so as to face the thermally conductive material plate,
The first bimetal plate is
having a first metal material layer with a small coefficient of thermal expansion on the side opposite to the opposing side of the thermally conductive material plate;
A second metal material layer having a large coefficient of thermal expansion is provided on the opposing side of the thermally conductive material plate,
The second bimetal plate is
A third metal material layer having a small coefficient of thermal expansion is provided on the opposing side of the thermally conductive material plate,
A fourth metal material layer having a large coefficient of thermal expansion is provided on the side opposite to the side of the thermally conductive material plate,
The first bimetal plate is
It is held so that it can change from a separated state to a contact state and from a contact state to a separated state with respect to the uppermost thermally conductive material plate in the stacking direction,
The second bimetal plate is
A thermal conductivity control body held so as to be able to change from a contact state to a separated state and from a separated state to a contact state with respect to the lowermost thermally conductive material plate in the stacking direction. At the first temperature,
The first bimetal plate is spaced apart from the thermally conductive material plate at the top in the stacking direction, and the second bimetal plate is spaced apart from the thermally conductive material plate at the bottom in the stacking direction. is in contact with
At a second temperature that is higher than the first temperature,
The first bimetal plate is in contact with the thermally conductive material plate at the top in the stacking direction, and the second bimetal plate is in contact with the thermally conductive material plate at the bottom in the stacking direction. is in contact with
At a third temperature that is higher than the second temperature,
The first bimetal plate is in contact with the thermally conductive material plate at the top in the stacking direction, and the second bimetal plate is in contact with the thermally conductive material plate at the bottom in the stacking direction. The thermal conductivity control body according to claim 1, which is spaced apart from. The plurality of thermally conductive material plates are
Claim 1 or 2, wherein the holding portion is made of a material having a lower thermal conductivity than the thermally conductive material plate, and is held so as to be able to change from a separated state to a contact state and from a contact state to a separated state. The thermal conductivity control body according to claim 2. The first bimetal plate is
A plurality of them are arranged with respect to the topmost thermally conductive material plate in the stacking direction,
The second bimetal plate paired with the first bimetal plate,
A plurality of thermally conductive material plates are arranged at the bottom of the thermally conductive material plate in the stacking direction,
When viewed from above in the stacking direction of the thermally conductive material plates,
The pair of the first bimetal plate and the second bimetal plate are
at least partially overlap, or
The thermal conductivity control body according to any one of claims 1 to 3, wherein one of the pair of the first bimetal plate and the second bimetal plate includes the other. The heat exchanger according to claim 4, wherein at least one of the plurality of first bimetal plates arranged is made of a different material from the other first bimetal plates. Conductivity control body. The heat exchanger according to claim 4, wherein at least one of the plurality of second bimetal plates arranged is made of a different material from the other second bimetal plates. Conductivity control body. The thermal conductivity control body according to claim 4, wherein at least one of the plurality of first bimetal plates arranged has a different size from the other first bimetal plates. . The thermal conductivity control body according to claim 4, wherein at least one of the plurality of second bimetal plates arranged has a different size from the other second bimetal plates. . The thermal conductivity control body according to any one of claims 1 to 8,
a heat insulating section made of a material having a thermal conductivity lower than the thermal conductivity of the thermal conductivity control body;
A bulkhead with a A structure having an internal space separated from the outside via a partition wall,
A structure, wherein at least a portion of the partition wall is provided with the thermal conductivity control body according to any one of claims 1 to 8.