JP7369916B2 - Component mounting system and component mounting method - Google Patents

Description

The present disclosure relates to a component mounting system and a component mounting method for mounting electronic components on a board.

The component mounting device includes a head moving section and a mounting head that is horizontally moved by the mounting head moving section. The component holding nozzle of the mounting head takes out electronic components supplied by a component supply device such as a tape feeder and mounts them on the board. In this type of apparatus, an electronic component may be mounted at a position deviated from a target mounting position due to temporal fluctuations caused by heat generation in the mounting head moving section. Conventionally, measures have been taken to improve the mounting accuracy by detecting such deviations in the mounting position (hereinafter referred to as mounting deviations). For example, in Patent Document 1, an inspection device or the like inspects the deviation of the mounting position of an electronic component mounted on a board, and the mounting of the component mounting device is performed using calibration data calculated based on this deviation of the mounting position. Changes in motion over time are corrected.

In the component mounting system of Patent Document 1, a detection camera included in an inspection device disposed downstream of a component mounting device photographs an electronic component mounted on a board. Based on this imaging data, the mounting misalignment of electronic components mounted on the board is detected.

Unexamined Japanese Patent Publication No. 2016-58603

The component mounting system of the present disclosure is a component mounting system including a component mounting device. The component mounting device includes a mounting head, a mounting head moving section, a component recognition camera, a component recognition section, and a control section. The mounting head holds a first surface of an electronic component having a first surface and a second surface on the back side of the electronic component and mounts the electronic component on the substrate. This electronic component has a group of terminals that are provided on the second surface and cannot be detected from the first surface . The mounting head moving section moves the mounting head. The component recognition camera photographs the second surface of the electronic component held by the mounting head. The component recognition unit processes the image taken by the component recognition camera and recognizes the position of the terminal group. The control unit controls the mounting head moving unit to move the mounting head based on the position of the terminal group recognized by the component recognition unit, and moves the electronic component held by the mounting head to a predetermined target mounting position on the board. be installed on. The component mounting system further includes a component measurement section, a mounted component inspection device, and a calculation section. The component measurement unit measures the positional relationship between the terminal group of the electronic component and the external shape of the electronic component before mounting the electronic component on the board. The mounted component inspection device inspects the appearance of each of a plurality of component-mounted boards, each of which is manufactured by the component mounting device mounting electronic components on the board. Furthermore, based on the position of a predetermined portion of the electronic component on each of the plurality of component-mounted boards, which is determined from the external shape of the electronic component, and the positional relationship between the terminal group of the electronic component and the external shape of the electronic component, The mounting position of the electronic component on each of the plurality of component-mounted boards is measured. Then, the deviation of the mounting position of the electronic component from the target mounting position on each of the plurality of component-mounted boards is inspected. The calculation unit calculates calibration data for correcting deviations in mounting positions caused by changes in the component mounting device over time, based on deviations in mounting positions of the plurality of component-mounted boards.

The component mounting method of the present disclosure mounts an electronic component on a board, which has a first surface, a second surface on the back side thereof, and a group of terminals provided on the second surface and which cannot be detected from the first surface. This is a method of mounting parts on the machine. In this method , the mounting head holds the first side of the electronic component. On the other hand, the second surface of the electronic component held by the mounting head is photographed by the component recognition camera. The captured images are then processed to recognize the positions of the terminal groups. Then, the positional relationship between the terminal group of the electronic component and the external shape of the electronic component is measured. Based on the recognized position of the terminal group, the mounting head is moved and the electronic component held by the mounting head is mounted at a mounting target position determined on the board. Thereafter, a visual inspection is performed on each of the plurality of component-mounted boards, each of which is manufactured by mounting electronic components on the board. Then, based on the position of a predetermined portion of the electronic component on each of the plurality of component-mounted boards, which is determined from the external shape of the electronic component, and the positional relationship between the terminal group of the electronic component and the external shape of the electronic component, The mounting position of the electronic component on each of the plurality of component-mounted boards is measured. Thereby, the deviation of the mounting position of each of the plurality of component-mounted boards with respect to the mounting target position of the electronic component is inspected. Furthermore, based on the deviations in the mounting positions of the plurality of boards, calibration data for correcting deviations in the mounting positions of electronic components due to changes over time is calculated. This calibration data is used to correct the stop position of the mounting head when mounting the next electronic component at the mounting target position of the next board.

According to the present disclosure, it is possible to accurately correct mounting displacement of back terminal components due to changes over time in the component mounting device.

Schematic diagram showing the configuration of a component mounting system according to an embodiment of the present disclosure Front view of the screen printing device in the component mounting system shown in Figure 1 Function explanatory diagram of the screen printing device shown in FIG. 2 A front view of the board measuring device, solder part inspection device, mounted component inspection device, and mounted board inspection device in the component mounting system shown in Figure 1. Side view of the component mounting device in the component mounting system shown in Figure 1 An explanatory diagram of photographing a chip component by the component recognition camera of the component mounting device shown in FIG. An explanatory diagram of photographing a back terminal component by the component recognition camera of the component mounting device shown in FIG. A functional block diagram showing the configuration of the information management device and the control system of the component mounting device in the component mounting system shown in Figure 1. A diagram showing an example of component information used in a component mounting system according to an embodiment of the present disclosure An explanatory diagram of the chip component recognition process by the component mounting device shown in FIG. An explanatory diagram of the recognition process of back terminal components by the component mounting device shown in FIG. 5 Flowchart showing processing in the board measuring device shown in FIG. 4 An explanatory diagram of the processing in the board measuring device shown in FIG. 4 Flowchart showing processing in the screen printing device shown in FIG. 2 An explanatory diagram of processing in the screen printing device shown in FIG. 2 Flowchart showing processing in the solder part inspection device shown in FIG. 4 An explanatory diagram of the processing in the solder part inspection device shown in Fig. 4 Partially enlarged view of Figure 15A Flowchart showing processing in the information management device shown in FIG. 7 An explanatory diagram of processing in the information management device shown in FIG. 7 Partially enlarged view of Figure 17A Flowchart showing processing in the component mounting device shown in FIG. 5 An explanatory diagram of the processing in the component mounting device shown in FIG. Flowchart showing the processing in the mounted component inspection device shown in FIG. 4 An explanatory diagram of the processing in the mounted component inspection device shown in FIG. 4 Partially enlarged view of Figure 21A Flowchart showing processing in the mounted board inspection device shown in FIG. 4 An explanatory diagram of the processing in the mounted board inspection apparatus shown in FIG. 4

Prior to describing the embodiments of the present disclosure, the circumstances that led to the idea of the present disclosure will be briefly explained. Electronic components include back terminal components such as CSP (Chip Size Package) in which a plurality of terminals are formed on the back surface of the electronic component. In back terminal components, the positions of the terminal groups on the back surface with respect to the external shape vary due to processing precision during manufacturing, so the positions of the terminal groups of the individual back terminal components are mounted on the board as a reference. In conventional techniques including Patent Document 1, an inspection device can detect the external shape of an electronic component mounted on a board. However, the position of the terminal group on the back surface of the back terminal component mounted on the board cannot be detected. Therefore, the back terminal components are excluded from the calibration of changes over time, and there is still room for further improvement in order to improve the mounting accuracy of the back terminal components.

The present disclosure provides a component mounting system and a component mounting method that can accurately correct mounting displacement of back terminal components due to changes over time in a component mounting device.

Next, embodiments of the present disclosure will be described with reference to the drawings. First, with reference to FIG. 1, the configuration and functions of a component mounting system 1 in this embodiment will be described. The component mounting system 1 mounts electronic components on a board to manufacture a mounted board. The component mounting system 1 mainly includes a component mounting line 1a that connects a plurality of component mounting devices. The devices constituting the component mounting line 1a are connected to each other by a communication network 2, and are also connected to an information management device 3 via the communication network 2.

In the component mounting line 1a, in order from upstream, there are a board supply device M1, a board identification information providing device M2, a board measurement device M3, a screen printing device M4, a solder part inspection device M5, component mounting devices M6 and M7, and a mounted component inspection device. M8, a reflow device M9, a mounted board inspection device M10, and a board recovery device M11 are connected in series along the board transport direction (X-axis). These component mounting devices include component mounting devices M6 and M7. The component mounting devices M6 and M7 hold the electronic component with component holding nozzles and mount the electronic component on the mounting point of the board on which the solder portion is formed.

The board supply device M1 supplies an unmounted board 4 (see FIG. 2) to be produced to a downstream device. The substrate identification information providing device M2 provides unique identification information for identifying the substrate 4 to the substrate 4 supplied from the substrate supply device M1. As an example, a laser marker that prints an identification code, which is identification information, on the board 4 using a laser is used as the board identification information adding device M2.

The board measuring device M3 actually measures the position of the reference mark formed on the board 4 and the land (land position) and the size of the land by photographing the board 4. Then, the land measurement data including the measured land position and size is fed forward together with the identification information of the board 4 to the solder portion inspection device M5. Further, the board measuring device M3 calculates the position of the mounting point from the measurement result. The position of the mounting point is specified by the relative positional relationship with the reference mark on the board 4.

The board measuring device M3 calculates mounting point position data including the positional relationship between the reference mark on the board 4 and the mounting point from the measurement results. Then, the mounting point position data is associated with the identification information of the board 4 and fed forward via the communication network 2 to the information management device 3 and downstream devices. The downstream devices refer to the screen printing device M4, the solder part inspection device M5, the component mounting devices M6 and M7, the mounted component inspection device M8, and the mounted board inspection device M10.

In this embodiment, the board measuring device M3 functions as a mounting point position data acquisition unit that obtains mounting point position data regarding the positional relationship between the reference mark of the board 4 and the mounting point obtained by actual measurement. Note that a device other than the board measuring device M3 (for example, the information management device 3) may perform the calculation and feedforward of the mounting point position data. In this case, the board measuring device M3 and other devices function as a mounting point position data acquisition section.

Further, mounting point position data is not essential for the screen printing device M4, the component mounting devices M6 and M7, and the mounted component inspection device M8, and may be excluded from feedforward targets. In this way, the mounting point position data acquisition section acquires mounting point position data based on the measurement results obtained by actual measurements. Therefore, it is possible to eliminate positional errors caused by deformation of the board 4 during the manufacturing process, and to accurately determine the positional relationship between the mounting point and the reference mark on the board 4.

The screen printing device M4 forms a solder portion on each of a plurality of lands (land group) provided on the substrate 4 by screen printing. That is, the screen printing device M4 forms a solder group. A plurality of terminals (terminal group) of the electronic component are connected to the land group. Therefore, the screen printing device M4 functions as a solder portion forming device that forms solder portions on the lands of the substrate 4. Note that as the solder portion forming device, in addition to the screen printing device, a solder coating device that forms the solder portion by applying solder to the lands can be used.

The solder portion inspection device M5 measures the position of the solder portion group formed on the substrate 4 by the screen printing device M4, which is a solder portion forming device. Then, solder group position data including the positional relationship between the reference mark and the solder group is created. The solder part inspection device M5 associates the created solder part group position data with the identification information of the board 4 and feeds it forward to the information management device 3 and downstream devices via the communication network 2. The downstream devices refer to the component mounting devices M6 and M7, the mounted component inspection device M8, and the mounted board inspection device M10. Note that a device other than the solder portion inspection device M5 (for example, the information management device 3) may perform the calculation and feedforward of the solder portion group position data.

The component mounting devices M6 and M7 each include a component holding nozzle that holds an electronic component, and mount the electronic component at a mounting point on a board on which a group of solder parts has been formed by the screen printing device M4 (a board with solder parts formed thereon). The component mounting devices M6 and M7 recognize the position of the terminal (terminal group) of the electronic component held by the component holding nozzle, and perform a process based on the recognized position of the terminal before mounting the electronic component on the board on which the solder portion has been formed. Then, electronic components are mounted on the solder-formed board.

Furthermore, in this embodiment, when the electronic component to be mounted on the board with solder parts formed thereon is a back terminal part having terminals on the back side, the component mounting devices M6 and M7 mount the back terminal part on the board with solder parts formed thereon. First, the terminal group and external shape of the back terminal component are recognized. Then, the back terminal position, which is the positional relationship between the terminal group and the external shape, is measured. The component mounting devices M6 and M7 send this back terminal position to the information management device 3 and downstream via the communication network 2 as back terminal position data in which the back terminal position is associated with the identification information of the board 4 and the identification information of the electronic component (back terminal component). feed forward to the device. The downstream devices refer to the mounted component inspection device M8 and the mounted board inspection device M10.

In this embodiment, unique identification information is given to the board 4 included in the solder-formed board to be worked by the component mounting devices M6 and M7 by the board identification information giving device M2. As a result, the correspondence between the solder group position data, the mounting point position data, the back surface terminal position data, and the board 4 is correctly determined via the identification information given to the board 4.

The mounted component inspection device M8 measures the mounting position of the electronic component by inspecting the appearance of the component-mounted board produced by mounting the electronic component on the solder-formed board by the component mounting devices M6 and M7. Then, the mounted component inspection device M8 inspects the deviation of the mounting position of the electronic component (hereinafter referred to as mounting deviation) based on the measurement results. At this time, if the inspection target is a back terminal component, the mounted component inspection device M8 detects the back terminal based on the recognized external shape position and the back terminal position transmitted from the component mounting devices M6, M7 or the information management device 3. Inspect components for misalignment. The back terminal position means the positional relationship between the terminal group of the back terminal component and the external shape of the back terminal component, as described above.

In the present embodiment, by feeding back component mounting misalignment data regarding mounting misalignment to the component mounting devices M6 and M7, calibration is performed to correct mounting misalignment of electronic components caused by changes over time in the component mounting devices M6 and M7. executed. In addition, when measuring the mounting deviation of the electronic component on the above-mentioned component-mounted board, the mounted component inspection device M8 uses the mounting target position data associated with the identification information of the used board 4 to determine the mounting deviation of the electronic component. Used as a standard for measurement.

The reflow apparatus M9 heats the component-mounted board according to a predetermined heating profile to melt and solidify the solder portions on the lands and solder-bond the electronic components to the board 4, thereby producing a mounting board. The mounted board inspection apparatus M10 performs an inspection to determine the quality of the mounted board based on an image obtained by photographing the mounted board produced by reflow. That is, the mounted board inspection apparatus M10 performs recognition processing on the acquired image to inspect the quality of the mounting state of the electronic components on the mounted board, that is, the position and orientation of the electronic components after soldering. The board collection device M11 collects the completed mounted board after the mounted board inspection device M10 has inspected the mounted board.

Next, with reference to FIGS. 2 to 6B, the configuration of each of the devices that make up the above-mentioned component mounting line 1a will be explained. Of these devices, only the screen printing device M4, the board measuring device M3, the solder part inspection device M5, the mounted component inspection device M8, the mounted board inspection device M10, and the component mounting devices M6 and M7 will be explained here. Descriptions of other devices will be omitted.

First, with reference to FIG. 2, the configuration of the screen printing apparatus M4 will be described. Screen printing apparatus M4 includes a screen printing control section 10, a substrate positioning section 11, a printing stage 13, a substrate support section 14, a substrate transport section 15, and a screen printing section 16. The substrate positioning unit 11 includes a printing stage table 11a, which is an alignment mechanism, and a lifting mechanism 11b provided on the top surface of the printing stage table 11a. The print stage table 11a has a built-in screen printing control section 10 that controls each section described below. The printing stage 13 is held by a lifting mechanism 11b on a lifting table 13a.

By driving the print stage table 11a, the print stage 13 moves horizontally along the X-axis and the Y-axis, and rotates horizontally around the Z-axis. The printing stage 13 is raised and lowered by driving the raising and lowering mechanism 11b. A substrate support section 14 having substrate support pins 14a is provided on the upper surface of the lifting table 13a. The substrate support section 14 is raised and lowered by a raising and lowering mechanism 14b.

Furthermore, the elevating table 13a supports a second conveyor 15b that constitutes the substrate transport section 15 from below. The substrate transport section 15 further includes a first conveyor 15a and a third conveyor 15c located upstream and downstream of the second conveyor 15b, respectively. The substrate 4 carried into the first conveyor 15a from upstream is transferred to the second conveyor 15b, and screen printing is performed on the substrate 4 by the screen printing section 16 described below. The board 4 after screen printing is carried downstream via the third conveyor 15c.

A screen printing section 16 is arranged above the printing stage 13. The screen printing unit 16 includes a screen mask 18 provided with a printing pattern for printing solder on the substrate 4. Above the screen mask 18, a squeegee 17 and a drive mechanism 17a for bringing the squeegee 17 into contact with the screen mask 18 to perform a squeezing operation are provided.

A camera unit 19 including a mask camera 19a and a substrate camera 19b is arranged between the print stage 13 and the screen mask 18. The camera unit 19 is movable along the X-axis and the Y-axis by a camera movement mechanism (not shown). Thereby, the mask camera 19a and the board camera 19b can photograph desired positions of the screen mask 18 and the board 4, respectively. The screen printing control unit 10 detects the positions of the screen mask 18 and the substrate 4 in the horizontal direction by performing recognition processing on the image obtained by this photographing. By horizontally moving the printing stage 13 based on the position detection result, the screen printing control unit 10 aligns the substrate 4 and the screen mask 18.

During solder screen printing by the screen printing device M4, the screen printing control section 10 moves the camera unit 19 out of the position between the screen mask 18 and the substrate 4. Then, as shown in FIG. 3, while the second conveyor 15b holds the substrate 4, the screen printing control unit 10 drives the lifting mechanism 11b to raise the printing stage 13 as indicated by arrow a. At the same time, the lifting mechanism 14b is driven to raise the board support part 14 together with the board support pin 14a as shown by arrow b. As a result, the substrate support pins 14a support the substrate 4 from below and press it against the lower surface of the screen mask 18.

In this state, the screen printing control unit 10 lowers the squeegee 17 as shown by arrow c to bring it into contact with the screen mask 18. Next, the squeegee 17 is moved in the squeezing direction along the Y axis. As a result, solder is screen printed on the substrate 4 through the pattern holes formed in the screen mask 18, and a solder portion is formed on each land of the substrate 4.

Next, with reference to FIG. 4, the configurations and functions of the board measuring device M3, the solder part testing device M5, the mounted component testing device M8, and the mounted board testing device M10 will be described. Note that these devices have different objects for inspection and measurement, so the detailed configuration differs from device to device. However, since the inspection/measurement target is photographed with a camera and recognized optically, it will be explained using the same drawing for convenience.

A processing section 20 is built into the base 21 of the substrate measuring device M3. In the case of the solder part inspection device M5, the mounted component inspection device M8, and the mounted board inspection device M10, processing units 20A, 20B, and 20C are built into the base 21, respectively. The processing units 20 to 20C control various work operations and processes in the respective devices, such as a substrate transport operation, a photographing process, a recognition process of an image obtained by photographing, and an inspection/measurement process based on the image. On the upper surface of the base 21, a substrate transport section 22 is arranged. A substrate transport section 22 is arranged on the upper surface of the base 21 . The substrate transport unit 22 transports the substrate 4 to be inspected and measured, which has been carried in from upstream, and positions the substrate at a position where an inspection head 24, which will be described below, performs inspection and measurement. In the board measuring device M3, the target of inspection and measurement is the board 4 before the solder group is formed, in the solder part inspection device M5, the board 4S on which the solder part has been formed, and in the mounted component inspection device M8, the board 4 is This is a mounted board 4M, and in the mounted board inspection apparatus M10, it is a mounted board 4F that has undergone a reflow process.

The inspection head 24 includes a lens barrel portion 24a, a camera 26 built into the lens barrel portion 24a with the photographing direction facing downward, and an illumination unit 24b provided at the lower end of the lens barrel portion 24a. The inspection head 24 is horizontally moved along the X and Y axes by a moving mechanism 25 having an XY table. The moving mechanism 25 can position the camera 26 above a desired portion of the substrate 4. The lighting unit 24b includes an upper lighting 28b and a lower lighting 28a.

When photographing with the camera 26, either or both of the upper stage illumination 28b and the lower stage illumination 28a are turned on according to illumination conditions suitable for the subject to be photographed. Further, a coaxial illumination 28c is provided on the side surface of the lens barrel section 24a, and by turning on the coaxial illumination 28c, the board 4 can be photographed by the camera 26 through a half mirror 27 disposed inside the lens barrel section 24a. It is now possible to illuminate from the same direction as the direction. The upper stage illumination 28b, the lower stage illumination 28a, and the coaxial illumination 28c constitute the illumination light source section 28.

In this way, by switching the illumination conditions, the same camera 26 can perform inspections and measurements for different purposes. The board measuring device M3 acquires mounting point position data, and the solder part inspection device M5 acquires solder part group position data. Then, the mounted component inspection device M8 acquires component mounting deviation data, and the mounted board inspection device M10 acquires mounted board inspection data.

Next, with reference to FIG. 5, the configuration and functions of the component mounting devices M6 and M7 will be explained. In the component mounting devices M6 and M7, the component holding nozzle 37b holds an electronic component and mounts it on a mounting point of a solder-formed board (hereinafter referred to as a board) 4S that is given unique identification information. The base 31 has a built-in mounting control unit 30 that has a function of controlling the work operations of the component mounting devices M6 and M7, which will be described below, and performing recognition processing of images captured by cameras included in each device. The mounting control unit 30 controls, for example, the board transport operation, the component mounting work by the component mounting mechanism, the recognition process by the first camera 36 that recognizes electronic components, and the second camera 39 that recognizes the board 4S.

On the upper surface of the base 31, a substrate transport section 35 having a pair of substrate transport conveyors is arranged along the transport direction of the substrates 4. That is, the substrate transport section 35 is arranged along the X axis. The substrate transport unit 35 transports the work target board 4S along the X-axis. A substrate lower receiving section 34 is arranged between the substrate transport sections 35 on the upper surface of the base 31 . In the substrate lower receiving part 34, an elevating mechanism 34b moves the plurality of support pins 34a up and down. In the state where the board 4S is carried into the mounting work position, the mounting control section 30 drives the lifting mechanism 34b to raise the support pin 34a. Thereby, the plurality of support pins 34a support the lower surface of the substrate 4S.

Carts 32 for supplying components are set on both sides of the base 31 on the Y axis. A tape feeder 33, which is a parts supply unit, is mounted on the upper surface of the cart 32. The tape feeder 33 feeds the electronic components to a component extraction position by the component mounting mechanism described below by pitch-feeding a carrier tape containing electronic components to be mounted on the board 4S.

Next, the configuration of the component mounting mechanism will be explained. A head moving section 38 having an XY table is disposed on a frame section (not shown) supported by the base 31. The mounting head 37 is attached to the head moving section 38 via a moving member 37a. By driving the head moving section 38, the mounting head 37 moves along the X-axis and the Y-axis. As a result, the mounting head 37 moves between the tape feeder 33 and the substrate 4S, which is positioned and held by the substrate transport section 35. The mounting head 37 mounts the electronic component taken out from the tape feeder 33 onto the substrate 4S using a component holding nozzle 37b provided at its lower end. In this way, the head moving unit 38 moves the mounting head 37 that holds the electronic component and mounts it on the substrate 4.

A first camera 36 is arranged between the substrate transport section 35 and the tape feeder 33. By positioning the mounting head 37 that has taken out the electronic component from the tape feeder 33 above the first camera 36, the first camera 36 photographs the electronic component held by the mounting head 37 from below. As a result, the electronic component held by the mounting head 37 is recognized, identification of the electronic component, detection of displacement in the holding position, detection of the external shape of the electronic component, and detection of the position of the terminal (terminal group) are performed.

Here, with reference to FIGS. 6A and 6B, photographing of electronic components by the first camera 36 will be described. Here, a chip component P shown in FIG. 6A and a back terminal component Pb shown in FIG. 6B will be described as electronic components. As the component holding nozzle 37b, a plurality of component holding nozzles 37b having different nozzle diameters are prepared depending on the size of the electronic component to be held. The component holding nozzle 37b shown in FIG. 6A holds the top surface (first surface) of the chip component P by vacuum suction, and the component holding nozzle 37b shown in FIG. 6B holds the top surface (first surface) of the back terminal component Pb. ) is held by vacuum suction. A plurality of bumps B (hereinafter referred to as "terminal group Bb") which are terminals are provided on the back surface (second surface) of the back terminal component Pb. In this way, the first camera 36 photographs the back surface (second surface) of the surface (first surface) where the electronic components (chip component P, back terminal component Pb) held by the mounting head 37 are held. do.

As shown in FIG. 5, a second camera 39 is arranged on the moving member 37a with the photographing direction facing downward. By moving the second camera 39 together with the mounting head 37 and positioning it above the substrate 4S, the second camera 39 photographs the substrate 4S held by the substrate transport section 35. By performing recognition processing on the identification information and images of the reference marks and mounting points acquired through this photographing, it is possible to identify the board 4 and detect the positions of the reference marks and mounting points. In the component mounting by the component mounting devices M6 and M7, the component mounting operation by the component mounting mechanism is corrected based on the thus obtained identification results and position detection results of the board 4.

In the above configuration, the substrate transport section 35 has the following functions. First, the board transport unit 35 receives the board 4S on which the solder parts have been formed by the screen printing device M4 and the solder part group has been measured by the solder part inspection device M5, and positions it at the mounting work position. Next, the component-mounted board 4M on which electronic components have been mounted by the component holding nozzle 37b is carried out from the mounting work position to a downstream device.

Next, with reference to FIG. 7, the configuration of the control system of the information management device 3 and the component mounting devices M6 and M7 among the devices constituting the component mounting system 1 will be described. The information management device 3 includes a first storage section 41, a second storage section 42, a third storage section 43, a creation section 44, and a fourth storage section 45 as internal processing functions. The first storage unit 41 stores mounting point position data fed forward from the board measuring device M3. That is, the first storage unit 41 stores data regarding the positional relationship between the reference mark and the mounting point of the board 4 (board 4S) obtained by actually measuring the board 4S in association with identification information that individually identifies the board 4. do.

The second storage unit 42 stores solder group position data. The solder group position data is the positional relationship between the reference mark on the board 4 and the solder group, which is obtained by measuring the position of the solder group formed on the board 4 by the screen printing device M4 using the solder test device M5. including. The third storage unit 43 stores component information in association with identification information of electronic components mounted on the board 4S. The component information includes conditions for calculating the mounting target position of the electronic component created by the creation unit 44 and conditions for performing calibration in the component mounting devices M6 and M7.

Here, with reference to FIG. 8, an example of component information stored in the third storage section 43 will be described. The component information includes component identification information 62, component type 63, self-alignment consideration flag 64, and calibration target flag 65 for each mounting point number 61 that specifies the mounting point of the electronic component mounted on the board 4S. The component identification information 62 is identification information that specifies the type of electronic component, and stores identification numbers, component names, and the like.

The component type 63 is information that specifies the type of electronic component such as a square chip (chip component) or CSP. Note that the creation unit 44, which will be described later, switches the calculation method of the mounting target position based on whether the electronic component is the back terminal component Pb or not. In addition to the component type 63, or as the component type 63, the third storage unit 43 may store the component information using information as to whether the electronic component is a back terminal component Pb as a flag. In the example of FIG. 8, CSP is the back terminal component Pb.

Next, the self-alignment consideration flag 64 will be explained. The electronic component may move toward the land due to the surface tension of the solder melted by heating the component-mounted board 4M in the reflow device M9. "1" is set for electronic components that take self-alignment into consideration to correct such mounting deviations, and "0" is set for electronic components that do not take self-alignment into consideration. Electronic components that do not take self-alignment into consideration include heavy electronic components that are difficult to move due to surface tension, electronic components whose terminals are inserted into the board 4, and electronic components that are fixed to the board 4 with adhesive or the like before reflow.

In the example of FIG. 8, the CSP whose mounting point number 61 is "7" is large and heavy. Further, the terminals of the connector whose mounting point number 61 is "9" are inserted into the board 4. Therefore, both electronic components are designed without taking self-alignment into consideration. Note that since the CSP with the mounting point number 61 of "5" is small in size and moves by the surface tension of melted solder, it is set as an electronic component that takes self-alignment into consideration. In this way, the third storage unit 43 stores component information including information (self-alignment consideration flag 64) as to whether or not to take into account the influence of the surface tension of the melted solder portion.

Next, the calibration target flag 65 will be explained. Misalignment of electronic components may occur due to changes over time in the component mounting devices M6 and M7. "1" is set for electronic components that require calibration to correct such mounting misalignment, and "0" is set for electronic components that do not require calibration. Electronic components that do not require calibration include electronic components whose positions are determined by inserting terminals into the board 4, and electronic components mounted on the board 4 that have a large tolerance for positional deviation. In the example of FIG. 8, the connector whose mounting point number 61 is "9" is set as an electronic component that does not require calibration because its terminals are inserted into the board 4.

The creation unit 44 shown in FIG. 7 creates electronic components on the board 4S specified by predetermined identification information based on mounting point position data, solder group position data, and component information specified by the same board identification information. Create onboard target position data including the onboard target position. The fourth storage unit 45 stores the mounting target position data created by the creation unit 44.

More specifically, in the case of an electronic component in which the self-alignment consideration flag 64 included in the component information is "1" and the influence of surface tension is considered, the creation unit 44 creates mounting point position data and solder group position data. Determine the loading target position based on The mounting point position data indicates the position of the land group, and the solder part group position data indicates the position of the solder part group. Further, in the case of an electronic component in which the self-alignment consideration flag 64 included in the component information is "0" and the influence of surface tension is not considered, the creation unit 44 determines the mounting target position based on the mounting point position data. In this way, the creation unit 44 determines the mounting target position for each board 4S based on the position of the land group (mounting point position data) and the position of the solder part group (solder part group position data). Functions as a decision-making unit.

During the component mounting work by the component mounting devices M6 and M7, the mounting control unit 30 positions the board 4S, whose position of the solder parts has been measured by the solder part inspection device M5, at the mounting work position, and then uses the second camera 39 to The board 4S is photographed. Thereby, the mounting control unit 30 detects the position of the reference mark on the board 4 (board 4S), and based on the detected position of the reference mark and the mounting target position data associated with the board identification information, the mounting control unit 30 detects the position of the board 4S. Recognizes the target mounting position of electronic components at the mounting work position. That is, the mounting control unit 30 estimates the mounting target position associated with the reference mark on the board 4 via the solder position data and the mounting point position data that are associated with the board identification information. Then, the electronic component is mounted on the board 4S by controlling the component holding nozzle 37b, aiming at this mounting target position.

As shown in FIG. 7, the information management device 3 further includes a first information processing section 46, a second information processing section 47, and a third information processing section 48. Each of these information processing units is configured to be able to communicate with a specific device in the component mounting line 1a, and exchanges specific data with the specific device. The first information processing unit 46 is capable of communicating with the solder part inspection device M5 and the component mounting devices M6 and M7.

That is, the solder group position data created by the solder part inspection device M5 is stored in the first information processing section 46 as internal data. Then, the identification information of the target board 4 is sent from the component mounting devices M6 and M7, and the mounting point position data is sent from the board measuring device M3, so that the first information processing section 46 uses the function of the creation section 44. The created mounting target position data is output to the component mounting devices M6 and M7.

The second information processing unit 47 is capable of communicating with two or more component mounting devices (here, two component mounting devices M6 and M7) and a mounted component inspection device M8. The second information processing unit 47 provides the mounting target position data referenced by each of the two or more component mounting devices described above to the mounted component inspection device M8. Similarly, the third information processing section 48 can communicate with two or more component mounting devices (here, two component mounting devices M6 and M7) and the mounted component inspection device M8. The third information processing unit 48 then distributes and provides the component mounting deviation data output from the mounted component inspection device M8 to the component mounting device that has executed the mounting of the electronic component related to the component mounting deviation data.

Note that the configuration and division of the first information processing section 46, second information processing section 47, and third information processing section 48 described above are arbitrary. For example, as shown in this embodiment, the first information processing section 46, the second information processing section 47, and the third information processing section 48 may each be a single information processing device having a dedicated function, or The functions of the second information processing section 47 and the third information processing section 48 may be combined into a single information processing device. Furthermore, the functions of the first information processing section 46, the second information processing section 47, and the third information processing section 48 may all be combined to form one information processing device as a whole.

The information management device 3 is connected to the mounting control section 30 of each of the component mounting devices M6 and M7 via the communication network 2. The mounting control section 30 is connected to the mounting head 37, head moving section 38, and substrate transport section 35, and controls these. Further, the mounting control unit 30 receives the photographic results obtained by the first camera 36 and the second camera 39.

The mounting control section 30 includes a board recognition section 51, a component recognition section 52, a processing section 54, a data acquisition section 55, a calculation section 56, an acquisition section 57, and a data output section 58 as internal processing functions. Furthermore, the mounting control section 30 includes a fifth storage section 53, a sixth storage section 55a, a seventh storage section 55b, an eighth storage section 55c, a ninth storage section 55d, and a tenth storage section 57a as internal memories.

The component recognition unit 52 and the board recognition unit 51 perform recognition processing on images acquired by the first camera 36 and the second camera 39, respectively. Thereby, the board recognition unit 51 detects the identification information of the board 4S (board 4) transported by the board transport unit 35 and held in position on the board lower receiving part 34, and recognizes the position of the reference mark and mounting point. The component recognition unit 52 identifies the electronic component held by the mounting head 37 and detects the state of displacement of the holding position.

Here, with reference to FIGS. 9A and 9B, processing of an image of an electronic component taken by the first camera 36 by the component recognition unit 52 will be described. FIG. 9A shows an image 36a taken by the first camera 36 of the chip component P held by the component holding nozzle 37b shown in FIG. 6A. If the component type 63 (see FIG. 8) included in the component information is not the back terminal component Pb, the component recognition unit 52 processes the image 36a and extracts the external shape of the chip component P. Then, the center of the external shape is recognized as the reference position PC of the chip component P. The reference position PC of the chip component P is acquired as relative coordinates with respect to the reference position of the component holding nozzle 37b that holds the chip component P (for example, the center of the component holding nozzle 37b). The component recognition unit 52 temporarily stores this relative coordinate as a nozzle holding position in a built-in storage unit. The component recognition unit 52 also acquires an angle in a horizontal plane from the external shape of the chip component P, and temporarily stores this angle in a built-in storage unit.

FIG. 9B shows an image 36b taken by the first camera 36 of the back terminal component Pb held by the component holding nozzle 37b shown in FIG. 6B. When the component type 63 (see FIG. 8) included in the component information is the back terminal component Pb, the component recognition unit 52 processes the image 36b and extracts the external shape and bumps B of the back terminal component Pb. The component recognition unit 52 then recognizes the center of the outer shape as the reference position PCb1 of the outer shape of the back terminal component Pb. The component recognition unit 52 also recognizes the geometric center of the plurality of bumps B as the reference position PCb2 of the terminal group Bb of the back terminal component Pb.

The reference position PCb2 of the terminal group Bb of the back terminal component Pb is acquired as relative coordinates with respect to the reference position of the component holding nozzle 37b that holds the back terminal component Pb. The component recognition unit 52 temporarily stores these relative coordinates as the nozzle holding position in its built-in storage unit. The component recognition unit 52 also acquires the angle in the horizontal plane from the arrangement of the plurality of bumps B, and temporarily stores this angle in the built-in storage unit. Note that the reference position PCb2 may be recognized based on the positions of some terminals (bumps B) representing the terminal group Bb. For example, in the case of the terminal group Bb in a matrix arrangement, the position of the terminal group Bb may be determined based on the position of the terminal located at the corner portion.

As shown in FIG. 7, the component recognition section 52 includes a component measurement section 52a as an internal processing function. In FIG. 9B, the component measurement unit 52a calculates the back terminal position (ΔXc, ΔYc) is calculated (measured). The component measuring unit 52a stores the back terminal position (ΔXc, ΔYc) in the ninth storage unit 55d as a back terminal position associated with the identification information of the board 4 and the mounting point number 61 included in the component information. In this way, the component measurement unit 52a measures the positional relationship (back terminal position) between the terminal group Bb and the external shape of the electronic component (back terminal component Pb) before mounting the electronic component on the board 4S.

In this embodiment, the component measuring section 52a is included in the component recognizing section 52 included in the component mounting devices M6 and M7, but the component measuring section 52a is not limited to this. For example, apart from the first camera 36, a third camera and a fourth camera for component measurement are arranged on the component mounting device, and an image of the top surface of the back terminal component Pb obtained by the third camera and an image obtained by the fourth camera are The configuration may be such that the back surface terminal positions (ΔXc, ΔYc) are acquired from the back surface image. Further, a device including the component measuring section 52a and a camera that recognizes components may measure the back terminal position (ΔXc, ΔYc) before storing the back terminal component Pb in the carrier tape. In that case, when attaching the carrier tape to the tape feeder 33 mounted on the component mounting devices M6 and M7, the back terminal positions (ΔXc, ΔYc) measured in advance may be stored in the ninth storage unit 55d.

The data acquisition unit 55 shown in FIG. 7 acquires the mounting point position data fed forward from the board measuring device M3 and stores it in the sixth storage unit 55a. The mounting point position data may be obtained directly from the board measuring device M3 or via the information management device 3. Furthermore, the data acquisition unit 55 acquires the component information stored in the third storage unit 43 of the information management device 3 and stores it in the seventh storage unit 55b. The component information is stored in the seventh storage unit 55b before the production of the mounting board starts.

Furthermore, the data acquisition unit 55 acquires the loading target position data created by the creation unit 44 of the information management device 3, and stores it in the eighth storage unit 55c. When acquiring component information and mounting target position data from the information management device 3, the data acquisition unit 55 acquires only the information necessary for the device, even if it acquires information regarding all component mounting devices M6 and M7 together. It may be extracted and obtained.

The acquisition unit 57 shown in FIG. 7 acquires component mounting deviation data regarding the mounting deviation of electronic components measured by the mounted component inspection device M8 for the plurality of component-mounted boards 4M, and stores the data in the tenth storage unit 57a. let In acquiring this component mounting deviation data, when acquiring component mounting deviation data using two or more component mounting apparatuses, the function of the third information processing section 48 described above is used. That is, the third information processing unit 48 distributes and provides the component mounting deviation data to the component mounting apparatus that has executed the mounting of the electronic component related to the component mounting deviation data.

The calculation unit 56 calculates calibration data for correcting the mounting deviation of electronic components caused by temporal fluctuations of the component mounting devices M6 and M7, based on the component mounting deviation data stored in the tenth storage unit 57a. The calculation unit 56 calculates calibration data only for electronic components for which the calibration target flag 65 included in the component information stored in the seventh storage unit 55b is “1”. The calculation unit 56 does not calculate calibration data for electronic components whose calibration target flag 65 is "0".

Further, the calculation unit 56 calculates calibration data when component mounting deviation data of a predetermined number (for example, 10) of component-mounted boards 4M is accumulated in the tenth storage unit 57a. That is, the calculation unit 56 calculates the calibration data based on the mounting deviation of the plurality of component-mounted boards 4M.

The processing section 54 shown in FIG. 7 controls the substrate transport section 35, the mounting head 37, and the head moving section 38 and causes them to perform a component mounting process of mounting electronic components on the loaded board 4S. Various production-related data such as mounting data referred to in the component mounting process are stored in the fifth storage unit 53. The processing unit 54 causes the electronic component held by the component holding nozzle 37b to be mounted on the board 4S based on the nozzle holding position recognized by the component recognition unit 52 and the mounting target position stored in the eighth storage unit 55c. The head moving unit 38 is controlled so as to land at the target position.

That is, when the electronic component held by the component holding nozzle 37b is a chip component P, the processing section 54 (control section) controls the head moving section 38 based on the reference position PC recognized by the component recognition section 52. Thereby, the processing unit 54 moves the mounting head 37 and mounts the chip component P held by the mounting head 37 at a predetermined mounting target position on the substrate 4 (substrate 4S). Further, when the electronic component held by the component holding nozzle 37b is a back terminal component Pb, the processing unit 54 (control unit) uses the reference position PCb2 (position of the terminal group) of the terminal group Bb recognized by the component recognition unit 52 to to control the head moving section 38. As a result, the processing unit 54 moves the mounting head 37 and mounts the back terminal component Pb held by the mounting head 37 at a predetermined mounting target position on the substrate 4 (substrate 4S).

At this time, the processing unit 54 refers to the calibration target flag 65 included in the component information stored in the seventh storage unit 55b. In the component mounting process for an electronic component for which the calibration target flag 65 is "1", the processing unit 54 uses the calculated calibration data to control the head moving unit 38 when mounting the electronic component at the target mounting position. The stopping position of the mounting head 37 is corrected. Thereby, it is possible to accurately correct mounting deviations of electronic components (chip components P, back terminal components Pb) caused by changes over time in the component mounting devices M6 and M7.

The data output unit 58 shown in FIG. 7 outputs component mounting target position data regarding the mounting target position in association with the board identification information of the board 4 (board 4S). The component mounting target position data is used by the mounted component inspection device M8 as a reference for measuring component mounting deviation. In outputting this component mounting target position data, when the component mounting target position data referenced by each of two or more component mounting devices is to be output, the function of the second information processing section 47 described above is used. That is, the mounting target position data referenced by each of the two or more component mounting devices is provided to the mounted component inspection device M8. In addition, when the mounting target position data includes the mounting target position of the back terminal component Pb, the data output unit 58 outputs the back terminal position (ΔXc, ΔYc) of the back terminal component Pb mounted at the mounting target position to the mounting target position. It is included in the position data and output to the mounted component inspection device M8 and the mounted board inspection device M10.

In the above configuration, the mounting head 37, the second camera 39, the head moving unit 38, the first camera 36, the board recognition unit 51, the component recognition unit 52, the component measurement unit 52a, the fifth storage unit 53, and the processing unit 54 are A loading work unit is configured to carry out the work of loading parts. That is, the mounting work unit detects the position of the reference mark on the substrate 4 located at the work position of the mounting head 37. Then, based on the position of the detected reference mark and the target mounting position data associated with the identification information of the board 4, the target mounting position of the electronic component at the work position is recognized. On the other hand, the position of the electronic component held by the component holding nozzle 37b (nozzle holding position) is recognized, and the electronic component is mounted by the component holding nozzle 37b aiming at this target mounting position.

Note that the first storage section 41 to the tenth storage section 57a are composed of a rewritable RAM (random access memory), a flash memory, or a hard disk. The board recognition section 51, the component recognition section 52, the processing section 54, the data acquisition section 55, the calculation section 56, the income section 57, and the data output section 58 are composed of a CPU (central processing unit) or an LSI (large scale integrated circuit). ing. Further, the information management device 3 also includes a CPU or an LSI. That is, the creation unit 44 and the first information processing unit 46 to the third information processing unit 4 include a CPU or an LSI. Further, the screen printing control section 10 and the processing sections 20 to 20C also include the above-mentioned storage device (memory) and a processor such as a CPU. The configuration other than the storage unit may be configured by a dedicated circuit, or may be implemented by controlling general-purpose hardware with software read from a temporary or non-transitory storage device. Moreover, two or more of these may be configured integrally.

Next, with reference to FIGS. 10 to 23, the flow of processing in each of the board measurement device M3 to the mounted board inspection device M10 and the contents of the work performed in these processing will be described. Here, the following processes are sequentially performed on the substrate 4 that has been supplied from the substrate supply device M1 and has been given an identification code as identification information by the board identification information giving device M2. These processes show a component mounting method in a component mounting device in which the component holding nozzle 37b holds an electronic component and mounts it on a mounting point of the board 4S, and a mounting board manufacturing method using the component mounting device. An example in which a chip component P and a back terminal component Pb are mounted on the substrate 4S will be described below.

First, with reference to FIGS. 10 and 11, processing in the substrate measuring device M3 will be described. In FIG. 10, the substrate transport section 22 shown in FIG. 4 positions the loaded substrate 4 directly below the inspection head 24 (ST1). Next, the reference mark is measured (ST2). That is, the camera 26 photographs the reference mark on the substrate 4, and the processing section 20 performs recognition processing on the acquired image, thereby detecting the position of the reference mark. Note that in FIG. 11, illustration of the reference mark is omitted.

Next, the land is measured (ST3). That is, as shown in FIG. 11, the processing unit 20 measures the positions and dimensions of lands provided on the board 4 for soldering electronic components based on the image acquired by the camera 26 shown in FIG. In FIG. 11, the land (L) and mounting point (J) corresponding to the chip component P on the design data, and the land group (Lb) and mounting point (Jb) corresponding to the back terminal component Pb are shown by broken lines, respectively. . Furthermore, in FIG. 11, the land L and mounting point J corresponding to the chip component P on the actual board 4, and the land group Lb and mounting point Jb corresponding to the back terminal component Pb are shown by solid lines, respectively.

The mounting point J of the chip component P is determined by the positions of a plurality of lands L that are soldered to the chip component P mounted at the mounting point J. As an example, the chip component P is a rectangular square chip having connection terminals at both ends, and a pair of lands L are provided as a pattern of a plurality of lands to which the chip component P is soldered. In this example, the midpoint of the straight line connecting the pair of lands L is determined as the mounting point J.

The mounting point Jb of the back terminal component Pb is determined by the positions of a plurality of lands (land group Lb) that are soldered to the back terminal component Pb mounted at the mounting point Jb. In this example, the geometric centers of the plural lands are determined as the mounting point Jb. The positions of the land L and the land group Lb do not match and often deviate from the positions of the land (L) and the land group (Lb) on the design data due to factors such as errors in the manufacturing process.

Next, based on the measured positions of the land L and the land group Lb, the processing unit 20 calculates the positions of the mounting points J and Jb (ST4 in FIG. 10). That is, the midpoint of the straight line connecting the land positions L1 and L2 of the pair of lands L determined by measurement and the geometric center of the land group Lb are calculated. Then, the calculated midpoint is specified as the mounting point J, and the geometric center is specified as the mounting point Jb. The positions of the identified mounting points J and Jb are associated with the identification information of the board 4 subjected to measurement, and are uploaded as mounting point position data via the communication network 2 (ST5 in FIG. 10).

The uploaded mounting point position data is fed forward to downstream post-processing devices and stored in each device. For example, in the component mounting apparatuses M6 and M7, the mounting point position data is stored in the sixth storage unit 55a. That is, the sixth storage unit 55a stores mounting point position data regarding the positional relationship between the reference mark of the board 4 and the mounting point obtained by actually measuring the board 4 in association with identification information that individually identifies the board 4. . Thereafter, the substrate 4 is carried out downstream (ST6 in FIG. 10), and the processing by the substrate measuring device M3 is completed. In this embodiment, the board measuring device M3 calculates the position of the mounting point (ST4) and uploads (ST5), but other devices other than the board measuring device M3 (for example, the information management device 3) You may perform ST4 and ST5.

Next, processing in the screen printing device M4 will be described with reference to FIGS. 12 and 13. In FIG. 12, the substrate 4 carried into the first conveyor 15a shown in FIG. 2 is delivered to the second conveyor 15b. The second conveyor 15b positions the received substrate 4 at a printing work position by the screen printing unit 16 (ST11). Next, the screen printing control unit 10 acquires the mounting point position data fed forward from the board measuring device M3 (ST12 in FIG. 12). Next, the screen printing control unit 10 recognizes the board 4 and recognizes the mounting points J and Jb at the printing work position (ST13 in FIG. 12). That is, the board camera 19b photographs the reference mark on the board 4 and detects the position of the reference mark at the printing work position. Then, based on the detected position of the reference mark and the acquired mounting point position data, the screen printing control unit 10 calculates mounting points J and Jb at the printing work position shown in FIG. 13.

As shown in FIG. 12, the screen mask 18 and the substrate 4 are then aligned (ST14). That is, the mask camera 19a and the board camera 19b respectively photograph the screen mask 18 and the board 4 and recognize their positions. Based on the position recognition results, the screen printing control unit 10 controls the second conveyor 15b to print the board 4. are aligned with respect to the screen mask 18. Thereby, the substrate 4 is aligned with the lower surface of the screen mask 18 in contact with it. Furthermore, the screen printing control unit 10 controls the printing stage table 11a based on the mounting points J and Jb specified by recognizing the board 4. This allows the lands L and land groups Lb of the substrate 4 to be aligned with the pattern holes of the screen mask 18 with high precision.

Next, printing is executed (ST15). That is, as shown in FIG. 3, with the substrate 4 in contact with the lower surface of the screen mask 18, the screen printing control unit 10 causes the squeegee 17 to squeeze the upper surface of the screen mask 18 to which the solder paste has been supplied. As a result, solder is printed on the substrate 4 through the pattern holes formed in the screen mask 18, and a solder portion is formed (ST15). At this time, as shown in FIG. 13, the positions of the solder parts S and Sb formed by printing do not necessarily correspond to the positions of the land L and land group Lb on the upper surface of the substrate 4, and the positions of the land L , there are cases where the solder pattern is shifted from the land group Lb (solder pattern shift). This solder pattern deviation is measured in the solder inspection by the solder part inspection device M5 in the next step.

After screen printing is completed in this manner, plate separation is performed to separate the screen mask 18 and the substrate 4 (ST16 in FIG. 12). That is, the screen printing control unit 10 lowers the substrate 4 held on the printing stage 13 together with the printing stage 13, thereby extracting the solder portions S and Sb printed on the substrate 4 from the pattern holes of the screen mask 18. As a result, the processing in the substrate measuring device M3 is completed, and a solder portion-formed substrate (hereinafter referred to as a substrate) 4S is completed. Thereafter, the substrate 4S is carried out downstream (ST17 in FIG. 12).

Next, with reference to FIGS. 14 to 15B, processing in the solder portion inspection apparatus M5 will be described. FIG. 15B is an enlarged view of region Z1 indicated by a dashed line in FIG. 15A. As shown in FIG. 14, after the substrate 4S is carried in, it is positioned (ST21). That is, as shown in FIG. 4, the substrate 4S carried into the substrate transport section 22 is positioned at the inspection/measurement work position. Next, the processing unit 20A of the solder part inspection device M5 acquires the land measurement data and the mounting point position data fed forward from the board measurement device M3 (ST22 in FIG. 14).

Next, the processing unit 20A recognizes the board 4S and recognizes the land position and mounting point at the inspection/measurement work position (ST23 in FIG. 14). At this time, the camera 26 detects the position of the reference mark on the board 4S placed at the inspection/measurement work position. Based on the detected position of the reference mark, the acquired land measurement data, and the mounting point position data, the processing unit 20A determines the actual land L at the inspection/measurement work position, as shown in FIGS. 15A and 15B. , land group Lb and mounting points J, Jb are calculated. Note that the acquisition of mounting point position data in the solder part inspection device M5 is not essential and may be omitted.

Next, the positions of the solder parts are measured (ST24 in FIG. 14). That is, by processing the image acquired by the camera 26 photographing the board 4S on which the solder parts have been formed, the processing part 20A determines the position of the group of solder parts S and Sb formed on the board 4 (solder pattern position). SP, SPb), area, and volume if three-dimensional measurement is possible. That is, here, the position of the group of solder parts S and Sb formed on the substrate 4 in the solder part forming process is measured, and solder part group position data including the positional relationship between the reference mark and the group of solder parts S and Sb is obtained. Create.

In FIG. 15A, specifically, the processing unit 20A calculates the midpoint of the line segment connecting the positions S1 and S2 of the solder portion S of the chip component P as the solder pattern position SP. Furthermore, the respective positional deviations of the solder pattern position SP from the mounting point J in the X-axis and Y-axis are calculated as the solder pattern deviations (ΔX, ΔY) of the chip component P. In FIG. 15B, the processing unit 20A calculates the geometric center of the plurality of solder portions Sb of the back terminal component Pb as the solder pattern position SPb. Further, the respective positional deviations of the solder pattern position SPb from the mounting point Jb in the X-axis and Y-axis are calculated as the solder pattern deviations (ΔXb, ΔYb) of the back terminal component Pb. The solder pattern position SPb can be calculated using either a statistical method based on the positions of all the solder parts Sb constituting the solder pattern or a method calculated from the positions of some solder parts Sb. may be adopted.

Solder pattern deviations (ΔX, ΔY) and (ΔXb, ΔYb) indicate deviations of solder pattern positions SP and SPb with respect to mounting points J and Jb. That is, the solder pattern deviation indicates the amount of deviation between the position where the group of solder parts S and Sb should originally be formed and the position of the group of solder parts S and Sb that are actually formed. If the solder parts S and Sb are formed on the lands L and Lb without positional deviation, the mounting points J and Jb and the solder pattern positions SP and SPb will be at the same position, and the solder pattern deviations (ΔX, ΔY), (ΔXb, ΔYb) also becomes zero. Conversely, as the positional deviation between the group of solder parts S and Sb and the group of lands L and Lb increases, the solder pattern deviations (ΔX, ΔY) and (ΔXb, ΔYb) also increase.

In FIG. 14, the solder group position data created in this way is associated with the identification information of each board 4S, is uploaded to the information management device 3 via the communication network 2 (ST25), and is stored in the second memory. It is stored in the unit 42 in association with the identification information of each board 4S. Thereby, the processing in the solder portion inspection device M5 is completed, and the substrate 4S is carried out downstream (ST26).

Next, processing in the information management device 3 will be explained with reference to FIGS. 16 to 17B. FIG. 17B is an enlarged view of region Z2 indicated by a dashed line in FIG. 17A. As shown in FIG. 16, first, mounting point position data, solder group position data, and component information are read (ST31). That is, the creation unit 44 reads the mounting point position data stored in the first storage unit 41 and the solder group position data stored in the second storage unit 42. The creation unit 44 also reads component information stored in the third storage unit 43. That is, the creation unit 44 acquires component information including information (self-alignment consideration flag 64 shown in FIG. 8) as to whether or not the influence of the surface tension of the melted solder portion is to be considered.

Note that in the present embodiment, the creation unit 44 acquires the solder pattern deviations (ΔX, ΔY) and (ΔXb, ΔYb) calculated by the solder part inspection device M5. However, when the solder part inspection device M5 only measures the position of each solder part, the creation part 44 calculates the solder pattern deviations (ΔX, ΔY) and (ΔXb, ΔYb) instead. Good too. That is, the solder part inspection device M5 uploads solder part group position data including the positions of individual solder parts to the information management device 3 in association with the identification information of the board 4S. The creation unit 44 then calculates the solder pattern shift using the positions of the individual solder parts included in the uploaded solder part group position data.

Next, calculation of the loading target position is performed by the processing function of the creation unit 44 (ST34 in FIG. 16). The method of calculating the mounting target position is switched by a self-alignment consideration flag 64 included in the component information of the electronic component to be calculated. First, a case where the self-alignment consideration flag 64 shown in FIG. 8 is "1", that is, a case where self-alignment is considered will be described. As shown in FIG. 17A, in the case of a chip component P, the creation unit 44 sets a mounting target position MP, which is a target when mounting the chip component P on the board 4, between the mounting point J and the solder pattern position SP. do. As shown in FIG. 17B, in the case of the back terminal component Pb, the creation unit 44 creates a mounting target position MPb, which is a target when mounting the back terminal component Pb on the board 4, between the mounting point Jb and the solder pattern position SPb. Set.

As mentioned above, the case where self-alignment is considered is the case where the influence of the surface tension of the molten solder is considered. In this case, the creation unit 44 determines the mounting target positions MP and MPb on the board 4S specified by the identification information, based on the mounting point position data and the solder group position data specified by the same board identification information. . The mounting point position data is the position of the land L and the land group Lb, and the solder part group position data is the solder pattern positions SP and SPb of the solder parts S and Sb. Note that the creation unit 44 appropriately sets mounting target positions MP and MPb between the mounting points J and Jb and the solder pattern positions SP and SPb, taking into account the behavior of the components due to solder melting during the reflow process by the reflow device M9. do. In the example shown here, the mounting target positions MP, MPb are set at substantially intermediate positions between the mounting points J, Jb and the solder pattern positions SP, SPb.

As described above, the case where the self-alignment consideration flag 64 is "0" means that self-alignment is not considered. In this case, the creation unit 44 sets the mounting points J and Jb given by the mounting point position data as the mounting target positions MP and MPb. That is, when self-alignment is not considered, the creation unit 44 does not take into account the solder part group position data (solder parts S, Sb), and creates the mounting point position data (land L, land group) specified by the same board identification information. Based on the position of Lb), the target mounting positions MP and MPb on the board 4S specified by the identification information are determined. The set target mounting positions MP and MPb are associated with the identification information of each board 4 (substrate 4S) and stored in the fourth storage unit 45 as target mounting position data (ST35 in FIG. 16).

Next, processing in the component mounting device M6 will be described with reference to FIGS. 18 and 19. Note that since the processing of the component mounting device M7 is the same, only the processing of the component mounting device M6 will be described here. As shown in FIG. 18, the board 4S is first carried into the component mounting device M6 and positioned (ST41). That is, the board transfer unit 35 shown in FIG. 5 receives the board 4S from the solder part inspection device M5, which is an upstream device, and positions it at a work position for mounting the component by the component holding nozzle 37b of the mounting head 37.

Next, the mounting control unit 30 acquires mounting point position data (ST42 in FIG. 18). That is, the data acquisition unit 55 shown in FIG. 7 acquires mounting point position data regarding the positional relationship between the reference mark on the board 4 and the mounting point obtained by actual measurement with the board measuring device M3. Note that the timing of acquiring the mounting point position data is not particularly limited, and may be any timing before the board 4S reaches the work position. Furthermore, acquisition of mounting point position data in the component mounting apparatus M6 is not essential and may be omitted.

Next, the loading control unit 30 acquires loading target position data (ST43 in FIG. 18). That is, the data acquisition unit 55 acquires the mounting target position data created by the information management device 3. Next, the mounting control unit 30 updates the component mounting deviation data and calculates the calibration data (ST44 in FIG. 18. That is, in ST44, the mounting control unit 30 updates the In order to obtain and update the component mounting deviation data of , and to correct the mounting deviation of electronic components due to changes over time using the calculation unit 56 shown in FIG. 7 based on the updated mounting deviation of the plurality of boards 4. Calculate the calibration data for.

In FIG. 18, board recognition is then executed, and the target mounting position of the component at the mounting work position is recognized (ST45). In board recognition, the mounting target positions MP and MPb at the mounting work position are calculated based on the position of the reference mark detected by recognition and the positional relationship between the reference mark and the mounting target position given by the mounting target position data. . This calculation is executed by the creation unit 44 of the information management device 3. Next, the mounting control unit 30 controls the mounting head 37 to hold the upper surface (first surface) of the electronic component (chip component P, back terminal component Pb). Then, the first camera 36 is caused to photograph the back surface (second surface) of the electronic component held by the mounting head 37.

The component recognition unit 52 processes the photographed image and recognizes the reference position PC of the chip component P shown in FIG. 19, the reference position PCb1 of the outer shape of the back terminal component Pb, and the reference position PCb2 of the terminal group Bb. (ST46 in FIG. 18). Further, when the component type 63 included in the component information is a back terminal component Pb, the component measuring unit 52a calculates the deviation (ΔXc, ΔYc) between the reference position PCb1 of the outer shape of the back terminal component Pb and the reference position PCb2 of the terminal group. is calculated (measured) (ST47 in FIG. 18). This deviation indicates the positional relationship between the terminal group Bb and the outer shape of the back terminal component Pb, and is referred to as a back terminal position. The calculated back surface terminal positions (ΔXc, ΔYc) are stored in the ninth storage unit 55d as back surface terminal position data.

After this, component mounting is executed (ST48 in FIG. 18). In ST48, the processing section 54 controls the head moving section 38 and the mounting head 37 to mount the electronic components (chip component P, back terminal component Pb) on the substrate 4S. At this time, as shown in FIG. 19, the reference position PC of the chip component P and the reference position PCb2 of the terminal group Bb of the back terminal component Pb are made to coincide with the mounting target positions MP and MPb. The head moving unit 38 is controlled. That is, the processing unit 54 moves the mounting head 37 based on the recognized position of the terminal group Bb (reference position PCb2), and moves the back terminal component Pb held by the mounting head 37 to the position defined on the board 4. It is loaded at the loading target position MPb.

At that time, when mounting a chip component P whose calibration target flag 65 included in the component information is "1" on the board 4S, the chip component P is mounted at the mounting target position MP using the calibration data. The stop position of the mounting head 37 by the head moving unit 38 at this time is corrected. Similarly, when mounting a back terminal component Pb whose calibration target flag 65 included in the component information is "1" on the board 4S, the calibration data is used to move the back terminal component Pb to the mounting target position MPb. The stopping position of the mounting head 37 by the head moving section 38 during mounting is corrected. Further, the chip component P whose calibration target flag 65 is "0" is mounted so that the reference position PC of the chip component P matches the mounting target position MP without using the calibration data. The back terminal component Pb whose calibration target flag 65 is "0" is mounted without using calibration data so that the reference position PCb2 of the terminal group Bb of the back terminal component Pb matches the mounting target position MPb. . As a result, it is possible to accurately correct the mounting deviation of the back terminal component Pb due to changes over time in the component mounting device M6.

When the mounting of all electronic components by the component mounting device M6 is completed, the data output unit 58 uploads the used mounting target position data and the calculated back surface terminal position (ST49 in FIG. 18). The uploaded mounting target position data and back surface terminal positions are sent to the mounted component inspection device M8 and the mounted board inspection device M10. By this upload, the mounting target position MPb used as the mounting target in the component mounting devices M6 and M7 and the measured back terminal position (ΔXc, ΔYc) are changed to the mounting position deviation measurement of the mounted component inspection device M8. It is used for the mounting position deviation inspection of the mounting board inspection apparatus M10. Thereafter, the component-mounted board (hereinafter referred to as a board) 4M is carried out (ST50 in FIG. 18), and the processing by the component mounting devices M6 and M7 is completed.

Next, with reference to FIGS. 20 to 21B, processing in the mounted component inspection apparatus M8 shown in FIG. 4 will be described. FIG. 21B is an enlarged view of region Z3 indicated by a dashed line in FIG. 21A. As shown in FIG. 20, the board transport section 22 shown in FIG. 4 carries the board 4M into the mounted component inspection apparatus M8, and positions it at the inspection/measurement work position (ST51). Next, the processing unit 20B acquires the mounting point position data fed forward from the board measuring device M3 (ST52 in FIG. 20), and further acquires the mounting target position data output from the data output unit 58 of the component mounting devices M6 and M7. , acquires the rear surface terminal position (ST53 in FIG. 20).

Next, the processing unit 20B executes board recognition to recognize the mounting points J and Jb at the inspection/measurement work position and the mounting target position (ST54 in FIG. 20). In board recognition, the camera 26 shown in FIG. 4 photographs the reference mark on the board 4M, and detects the position of the reference mark at the inspection/measurement work position. Based on the detected position of the reference mark and the acquired mounting point position data, the processing unit 20B calculates the positions of the mounting points J and Jb at the inspection/measurement work position. Further, based on the detected position of the reference mark and the acquired mounting target position data, the processing unit 20B calculates the mounting target positions MP and MPb at the inspection/measurement work position.

Next, the processing unit 20B measures the mounted component position (ST55 in FIG. 20). Here, as shown in FIGS. 21A and 21B, the processing unit 20B first determines the center position of each of the mounted chip components P* and the mounted back terminal components Pb* mounted by the component mounting devices M6 and M7. Find the component center PC* and PCb1* shown. Then, based on this measurement result, component mounting deviation is calculated (ST56 in FIG. 20).

In the case of a mounted chip component P*, as shown in FIG. 21A, the processing unit 20B calculates the deviation between the mounting target position MP and the component center PC* as a mounting deviation (ΔX*, ΔY*). Note that the mounting target position MP is given to the processing unit 20B based on the mounting target position data fed forward from the component mounting devices M6 and M7. That is, the processing unit 20B measures (inspects) the mounting deviation (ΔX*, ΔY*) of the mounted chip component P* on the component-mounted board 4M on which the chip component P is mounted in ST48 by the component mounting devices M6 and M7. do.

In the case of the mounted back terminal component Pb*, as shown in FIG. 21B, the processing unit 20B divides the terminal group of the mounted back terminal component Pb* based on the component center PCb1* and the back terminal positions (ΔXc, ΔYc). A reference position PCb2* of (a plurality of bumps B*) is determined. The component center PCb1* indicates the position of the measured outer center of the mounted back terminal component Pb*. Further, the rear surface terminal positions (ΔXc, ΔYc) are feedforwarded from the component mounting devices M6 and M7. Further, the processing unit 20B calculates the deviation between the mounting target position MPb and the reference position PCb2* of the terminal group Bb of the mounted back terminal component Pb* as a mounting deviation (ΔXb*, ΔYb*). The target mounting position MPb is given to the processing unit 20B based on the target mounting position data fed forward from the component mounting devices M6 and M7.

That is, the processing unit 20B inspects the appearance of the board 4M on which the back terminal component Pb is mounted. Then, mounting is performed based on the positional relationship between the component center PCb1* determined from the measured external shape of the mounted back terminal component Pb* and the terminal group Bb of the back terminal component Pb and the external shape (back terminal position (ΔXc, ΔYc)). Measure (inspect) the deviation (ΔXb*, ΔYb*). Note that the position determined from the external shape of the mounted back terminal component Pb* is not limited to the component center PCb1*, but may be any position in a predetermined portion. For example, it may be located at one predetermined position among the four corners of the back terminal component Pb.

Next, the processing unit 20B associates the mounting deviation with the identification information of the board 4M and the mounting point number 61 included in the component information, and uploads it as component mounting deviation data (ST57 in FIG. 20). Thereafter, the board transport unit 22 transports the board 4M downstream (ST58 in FIG. 20), completing the processing in the mounted component inspection device M8. The component mounting deviation data uploaded in ST57 is fed back to the component mounting devices M6 and M7, and used for calculation of calibration data by the calculation unit 56 (ST44 in FIG. 18). That is, the component mounting devices M6 and M7 acquire component mounting deviation data regarding the mounting deviation of electronic components (chip components P, back terminal components Pb) measured by the mounted component inspection device M8 on the plurality of component-mounted boards 4M. .

Then, the calculation units 56 of each of the component mounting devices M6 and M7 calculate calibration data based on the acquired component mounting deviation data regarding the mounting deviation of the electronic component (ST44 in FIG. 18). In other words, in this embodiment, the calibration data for correcting the mounting misalignment of electronic components due to changes over time is related to the mounting misalignment of electronic components measured by the mounted component inspection device M8 on a plurality of component-mounted boards 4M. Calculated based on data.

Note that when the component mounting line 1a has two or more component mounting apparatuses M6 and M7 as in this embodiment, calibration data is calculated for each of these plurality of component mounting apparatuses. In the measurement of the position of the mounted component described above (ST55 in FIG. 20), the mounting target position data referenced by each component mounting device is used as a reference for measuring the mounting deviation. In addition, when performing the above-mentioned component mounting (ST48 in Fig. 18) using two or more component mounting devices, the mounting deviation data measured in ST55 in Fig. Distribute and provide to parts mounting equipment.

Next, with reference to FIGS. 22 and 23, processing in the mounted board inspection apparatus M10 shown in FIG. 4 will be described. The mounted board inspection device M10 inspects the quality of the mounting state including the position of the mounted electronic components (mounted chip components P*, mounted back terminal components Pb*) that are soldered together by reflow in the reflow device M9. . As shown in FIG. 22, the board transport section 22 shown in FIG. 4 carries the mounted board 4F into the mounted board inspection apparatus M10, and positions it at an inspection/measurement work position (ST61). Next, the processing unit 20C acquires the mounting point position data fed forward from the board measuring device M3 and the back electrode positions output from the data output units 58 of the component mounting devices M6 and M7 (ST62 in FIG. 22).

Next, the processing unit 20C executes board recognition and recognizes the mounting points J and Jb at the inspection/measurement work position (ST63 in FIG. 22). In board recognition, the camera 26 shown in FIG. 4 photographs the reference mark on the mounting board 4F, and detects the position of the reference mark at the inspection/measurement work position. Based on the detected position of the reference mark and the acquired mounting point position data, the processing unit 20C calculates the positions of the mounting points J and Jb at the inspection/measurement work position. Next, the mounting board 4F is inspected (ST64 in FIG. 22).

In the case of a mounted chip component P*, as shown in FIG. It is obtained as deviation data (ΔXm, ΔYm). The component mounting position Pm corresponds to the component center of the mounted chip component P*. In addition, in the case of the mounted back terminal component Pb*, the processing unit 20C calculates the deviation between the position Pbm of the terminal group (a plurality of bumps B) of the mounted back terminal component Pb and the mounting point Jb using the mounting position deviation data ( ΔXbm, ΔYbm). The mounting points J and Jb are obtained from the mounting point position data obtained by the board measuring device M3. Therefore, the mounting position deviation data (ΔXm, ΔYm) and (ΔXbm, ΔYbm) are not the mounting position deviations from the mounting points (J) and (Jb) on the design data, but from the mounting points J and Jb obtained by measurement. This is due to mounting position misalignment. Note that the positions of the terminal group (a plurality of bumps B) of the mounted back terminal component Pb* are between the reference position PCb1 of the external shape of the mounted back terminal component Pb* and the back terminals fed forward from the component mounting devices M6 and M7. It is determined from the position (ΔXc, ΔYc). The coordinates of the component mounting position Pbm correspond to the position Pcb2 of the terminal group Bb of the mounted back terminal component Pb*.

As shown in FIG. 23, in the image obtained by photographing the board 4 after reflow, the solder portion S formed on the land L melts and solidifies, and the mounted chip component P* is soldered to the land L. A solder portion S* is formed. At this time, due to the behavior of the molten solder in the reflow process, the component mounting position Pm corresponding to the component center of the mounted chip component P* does not necessarily coincide with the mounting point J, and there is a mounting position shift. If the mounting position shift data (ΔXm, ΔYm) is greater than or equal to the allowable value, the processing unit 20C determines that the inspected board 4F is defective. The same applies to the mounted back terminal component Pb*. When the inspection process is completed for all parts to be inspected, the inspection results are uploaded (ST65 in FIG. 22), and the board 4F is carried out downstream (ST66 in FIG. 22).

As explained above, the component mounting system 1 shown in this embodiment includes component mounting devices M6 and M7. Each of the component mounting devices M6 and M7 includes a mounting head 37, a head moving section 38, a first camera 36 as a component recognition camera, a component recognition section 52, and a processing section 54 as a control section. The mounting head 37 holds the upper surface of the back terminal component Pb, which is an electronic component, and mounts it on the substrate 4S. The back terminal component Pb has an upper surface as a first surface and a lower surface as a second surface on the back side, and the terminal group Bb is provided on the lower surface. The head moving unit 38 moves the mounting head 37. The first camera 36 photographs the lower surface of the back terminal component Pb held by the mounting head 37. The component recognition unit 52 processes the image taken by the first camera 36 and recognizes the position of the terminal group Bb on the bottom surface (reference position PCb2). The processing unit 54 controls the head moving unit 38 to move the mounting head 37 based on the position of the terminal group Bb recognized by the component recognition unit 52. Then, the back terminal component Pb held by the mounting head 37 is mounted at a predetermined mounting target position MPb on the board 4S.

The component mounting system 1 further includes a component measurement section 52a, a mounted component inspection device M8, and a calculation section 56. The component measurement unit 52a measures the positional relationship (back terminal position (ΔXc, ΔYc)) between the terminal group Bb of the back terminal component Pb and the external shape of the back terminal component Pb before mounting the back terminal component Pb on the board 4S. do. The mounted component inspection device M8 inspects the appearance of each of the plurality of component-mounted boards 4M, each of which is produced by the component mounting devices M6 and M7 mounting the back terminal components Pb on the board 4S. Furthermore, based on the position of a predetermined portion of the back terminal component Pb on each of the plurality of component-mounted boards 4M, and the positional relationship between the terminal group Bb of the back terminal component Pb and the external shape of the back terminal component Pb, The mounting position of the back terminal component Pb on each of the plurality of component-mounted boards is measured. The position of the predetermined portion of the back terminal component Pb is, for example, the component center PCb1*. The mounting position of the back terminal component Pb is the reference position PCb2* of the terminal group. Then, the deviation (ΔXb*, ΔYb*) of the mounting position of the back terminal component Pb from the mounting target position on each of the plurality of component-mounted boards 4M is inspected. The calculation unit 56 calculates calibration data for correcting deviations in the mounting positions caused by changes over time in the component mounting devices M6 and M7, based on deviations in the mounting positions of the plurality of component-mounted boards 4M.

Then, the processing unit 54 uses the calibration data to correct the stop position of the mounting head 37 by the head moving unit 38 when mounting the back terminal component Pb at the mounting target position MPb. With this configuration, it is possible to accurately correct mounting deviations (ΔXb*, ΔYb*) of the back terminal components Pb caused by changes over time in the component mounting devices M6 and M7.

Note that in FIG. 7, the calculation unit 56 is provided in the component mounting devices M6 and M7, but the calculation unit 56 is not limited thereto. For example, the calculation unit 56 may be included in the information management device 3.

INDUSTRIAL APPLICABILITY The component mounting system and component mounting method of the present disclosure have the effect of being able to accurately correct mounting misalignment of back terminal components caused by changes over time in a component mounting device, and are useful in the field of mounting electronic components on a board. Useful.

1 Component mounting system 1a Component mounting line 2 Communication network 3 Information management device 4 Board 4S Board with solder parts formed (board)
4M Parts mounted board (board)
4F Mounting board 10 Screen printing control unit 11 Board positioning unit 11a Printing stage tables 11b, 14b Lifting mechanism 13 Printing stage 13a Lifting table 14 Board support unit 14a Board support pins 15, 22, 35 Board transport unit 15a First conveyor 15b Second Conveyor 15c Third conveyor 16 Screen printing section 17 Squeegee 17a Drive mechanism 18 Screen mask 19 Camera unit 19a Mask camera 19b Board cameras 20, 20A, 20B, 20C Processing sections 21, 31 Base 24 Inspection head 24a Lens barrel section 24b Lighting unit 25 Moving mechanism 26 Camera 27 Half mirror 28 Illumination light source section 28a Lower stage illumination 28b Upper stage illumination 28c Coaxial illumination 30 Mounting control section 32 Dolly 33 Tape feeder 34 Board lower receiving section 34a Support pin 34b Lifting mechanism 36 First camera 36a, 36b Image 37 Mounting head 37a Moving member 37b Component holding nozzle 38 Head moving section 39 Second camera 41 First storage section 42 Second storage section 43 Third storage section 44 Creation section 45 Fourth storage section 46 First information processing section 47 Second Information processing unit 48 Third information processing unit 51 Board recognition unit 52 Component recognition unit 52a Component measurement unit 53 Fifth storage unit 54 Processing unit 55 Data acquisition unit 55a Sixth storage unit 55b Seventh storage unit 55c Eighth storage unit 55d Ninth storage unit 56 Calculation unit 61 Mounting point number 62 Component identification information 63 Component type 64 Self-alignment consideration flag 65 Calibration target flag B, B* Bump Bb Terminal group J, Jb Mounting point L Land Lb Land group L1, L2 Land position M1 Board supply device M2 Board identification information adding device M3 Board measuring device M4 Screen printing device M5 Solder part inspection device M6, M7 Component mounting device M8 Mounted component inspection device M9 Reflow device M10 Mounted board inspection device MP, MPb Mounting target Position P Chip component P* Mounted chip component Pb Back terminal component Pb* Mounted back terminal component PC*, PCb1* Component center PC, PCb1, PCb2 Reference position PCb2* Reference position Pm, Pbm Component mounting position S, Sb Solder part S1, S2 Position SP, SPb Solder pattern position ΔX, ΔY, ΔXb, ΔYb Solder pattern deviation ΔXc, ΔYc Back terminal position ΔXm, ΔYm, ΔXbm, ΔYbm Mounting position deviation data ΔX*, ΔY*, ΔXb*, ΔYb* Mounting deviation Z1, Z2, Z3 area

Claims (8)

A component mounting system including a component mounting device,
The component mounting device is
The electronic component has a first surface and a second surface on the back side of the first surface, and has a terminal group provided on the second surface and not detectable from the first surface. a mounting head that holds one side and mounts it on the board;
a mounting head moving unit that moves the mounting head;
a component recognition camera that photographs the second surface of the electronic component held by the mounting head;
a component recognition unit that processes an image taken by the component recognition camera to recognize the position of the terminal group;
Based on the position of the terminal group recognized by the component recognition unit, the mounting head moving unit is controlled to move the mounting head to mount the electronic component held by the mounting head on the board at a predetermined location. A control unit mounted at the target position,
The component mounting system is
a component measuring unit that measures the positional relationship between the terminal group of the electronic component and the external shape of the electronic component before mounting the electronic component on the board;
The component mounting device inspects the appearance of each of a plurality of component-mounted boards each manufactured by mounting the electronic component on the board, and determines the appearance of the plurality of components determined from the external shape of the electronic component. Based on the position of a predetermined portion of the electronic component on each of the mounted boards and the positional relationship, the mounting position of the electronic component on each of the plurality of component-mounted boards is measured, and the plurality of parts are a mounted component inspection device that inspects a deviation of the mounting position of the electronic component on each of the mounted boards with respect to the mounting target position;
a calculation unit that calculates calibration data for correcting the deviation of the mounting position caused by temporal fluctuations of the component mounting device, based on the deviation of the mounting position of the plurality of component-loaded boards; Furthermore,
The control unit uses the calibration data to correct a stop position of the mounting head by the mounting head moving unit when mounting the electronic component on the board.
Parts mounting system. The component measurement unit is included in the component recognition unit, and measures the positional relationship between the terminal group of the electronic component and the external shape of the electronic component from the image taken by the component recognition camera. ,
The component mounting system according to claim 1. a solder part forming device that forms a solder part group by forming a solder part on each of a plurality of lands constituting a land group of the board to which the terminal group is connected;
a solder part inspection device that measures the position of the solder part group formed on the substrate;
further comprising: a mounting target position determination unit that determines the mounting target position on the board based on the position of the land group and the position of the solder part group;
The component mounting system according to claim 1 or 2. further comprising a component information storage unit storing component information including information on whether or not to consider the influence of surface tension of the melted solder portion,
When considering the influence of the surface tension on the electronic component, the target mounting position determining unit determines the target mounting position based on the position of the land group and the position of the solder group,
When the influence of the surface tension on the electronic component is not considered, the target mounting position determination unit determines the target mounting position based only on the position of the land group.
The component mounting system according to claim 3. An electronic component having a first surface and a second surface on the back side of the first surface, and having a group of terminals provided on the second surface and not detectable from the first surface. A method of mounting parts to be mounted ,
causing a mounting head to hold the first surface of the electronic component;
a step of causing a component recognition camera to photograph the second surface of the electronic component held by the mounting head;
processing the photographed image to recognize the position of the terminal group;
measuring the positional relationship between the terminal group of the electronic component and the external shape of the electronic component;
moving the mounting head based on the recognized position of the terminal group to mount the electronic component held by the mounting head at a predetermined target mounting position on the board;
Inspecting the appearance of each of a plurality of component-loaded boards each produced by mounting the electronic component on the board, and determining the appearance of each of the plurality of component-loaded boards determined from the external shape of the electronic component. Based on the position of a predetermined portion of the electronic component and the positional relationship, the mounting position of the electronic component on each of the plurality of component-mounted boards is measured, and the mounting position of the electronic component on each of the plurality of component-mounted boards is measured. Inspecting the deviation of the mounting position of the electronic component from the target mounting position;
Calculating calibration data for correcting the deviation of the mounting position due to fluctuations over time based on the deviation of the mounting position of the plurality of component-loaded boards;
using the calibration data to correct the stop position of the mounting head when mounting the next electronic component at the mounting target position of the next board;
How to mount parts. measuring the positional relationship between the terminal group of the electronic component and the external shape of the electronic component from an image obtained by photographing the second surface of the electronic component with the component recognition camera;
The component mounting method according to claim 5. forming a solder portion group by forming a solder portion on each of a plurality of lands constituting the land group of the substrate to which the terminal group is connected;
Measuring the position of the solder group formed on the substrate;
The method further comprises the step of determining the target mounting position on the board based on the position of the land group and the position of the solder part group.
The component mounting method according to claim 5 or 6. further comprising the step of acquiring component information including information on whether or not to consider the influence of surface tension of the melted solder portion,
When considering the influence of the surface tension on the electronic component, determining the target mounting position based on the position of the land group and the position of the solder part group,
determining the target mounting position based only on the position of the land group when the influence of the surface tension on the electronic component is not considered;
The component mounting method according to claim 7.

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