JP7375413B2 - Base for piezoelectric vibration devices - Google Patents

Description

The present invention relates to a base for a piezoelectric vibrating device that is shared by a piezoelectric oscillator and a piezoelectric vibrator with functional components.

Conventionally, various types of piezoelectric vibrating devices are known, such as piezoelectric vibrators, piezoelectric oscillators, and the like. Moreover, as a piezoelectric vibration device base used in such a piezoelectric vibration device, one having an H-shaped cross-sectional structure is known (see, for example, Patent Document 1).

The base for a piezoelectric vibrating device having such an H-shaped structure has a box-like structure having a first recess that is opened at the upper side of the base and a second recess that is opened at the lower side of the base. ing. When the piezoelectric vibrating device base having an H-shaped structure is used for a piezoelectric oscillator, the piezoelectric vibrating piece is accommodated in the first recess, and the IC is accommodated in the second recess. Furthermore, when the base for a piezoelectric vibrating device having an H-shaped structure is used for a piezoelectric vibrator with a functional component, the first recess accommodates a piezoelectric vibrating piece, and the second concave accommodates a functional component such as a thermistor. Ru.

Patent No. 5104867 Japanese Patent Application Publication No. 2010-252051

Conventionally, a dedicated piezoelectric vibration device base has been used for each piezoelectric vibration device. In the case of the above-mentioned H-shaped structure piezoelectric vibrating device base, different piezoelectric vibrating device bases were used for the piezoelectric oscillator and the piezoelectric vibrator with functional components. Therefore, if the piezoelectric oscillator and the piezoelectric vibrator with functional components can share the H-shaped piezoelectric vibrating device base, manufacturing costs can be reduced. However, in this case, there is a concern that the internal wiring etc. will become complicated and the number of manufacturing steps will increase.

The present invention has been made in consideration of the above-mentioned circumstances, and has an H-shaped structure that can be used commonly for a piezoelectric oscillator and a piezoelectric vibrator with functional components without complicating internal wiring etc. The purpose of the present invention is to provide a base for a piezoelectric vibration device.

The present invention constitutes means for solving the above-mentioned problems as follows. That is, the present invention provides a base for a piezoelectric vibrating device that is shared by a piezoelectric oscillator and a piezoelectric vibrator with a functional component, the base having a first recess that is open on the upper side of the base, and a base on the lower side of the base. the first recess and the second recess are formed into a substantially rectangular shape in a plan view, and a piezoelectric vibrating piece for a piezoelectric oscillator is mounted on a bottom surface of the first recess. and a pair of second internal terminals on which a piezoelectric vibrating piece for a piezoelectric vibrator with a functional component is mounted. The pair of second internal terminals are provided on one end side of the bottom surface, and the pair of second internal terminals are provided on the other end side of the bottom surface of the first recess. A pair of third internal terminals on which a functional component is mounted, and four fourth internal terminals on which a functional component for a piezoelectric vibrator with a functional component is not mounted are provided, and the third internal terminal and the fourth internal terminal are , are also used as terminals on which an IC for a piezoelectric oscillator is mounted, the pair of third internal terminals are provided at one diagonal position on the bottom surface of the second recess, and two of the fourth internal terminals are , the remaining two of the fourth internal terminals are provided in two opposing regions other than the four corners of the bottom surface of the second recess, and One of the two internal terminals and one of the fourth internal terminals provided at a diagonal position of the other internal terminal are connected via a through hole provided in the base portion.

According to the above configuration, while effectively utilizing the areas on the bottom surface of the first recess and the bottom of the second recess as arrangement spaces for the respective internal terminals, The remaining area can be used as a space for arranging wiring patterns, through holes, etc. The through hole connects one of the second internal terminals provided on the other end side of the bottom surface of the first recess and one of the fourth internal terminals provided at a diagonal position on the bottom surface of the second recess. can be connected efficiently. Thereby, the base for a piezoelectric vibrating device having an H-shaped structure can be efficiently shared by a piezoelectric oscillator and a piezoelectric vibrator with a functional component without complicating internal wiring or the like.

In the above configuration, the other of the second internal terminals and the other of the fourth internal terminals provided at a diagonal position of the other are provided on the bottom surface of the first recess or inside the base portion. It is preferable that the connection be made via an internal wiring and another through hole provided in the base portion. According to this configuration, a pair of second internal terminals provided on the other end side of the bottom surface of the first recess and two terminals provided at diagonal positions on the bottom surface of the second recess are formed by the through holes and internal wiring. The fourth internal terminal can be efficiently connected to the fourth internal terminal. As a result, the functional component for the piezoelectric vibrator with a functional component can be mounted on the pair of third internal terminals provided at diagonal positions on the bottom surface of the second recess. can be accommodated along the direction, allowing larger sized functional components to be used.

In the above configuration, it is preferable that the pair of third internal terminals be larger than all of the fourth internal terminals. According to this configuration, it is possible to secure a larger mounting area (bonding area) for functional components using conductive bonding material such as solder, and it is possible to more easily mount functional components on the pair of third internal terminals. It can be done reliably.

In the above configuration, it is preferable that all of the pair of first internal terminals are different from all of the pair of second internal terminals in at least one of size and shape. According to this configuration, the first internal terminal and the second internal terminal can be easily distinguished from each other in appearance, so it is possible to determine whether the mounted piezoelectric vibrating piece is for a piezoelectric oscillator or a piezoelectric vibrator with a functional component. It is possible to distinguish between these and install them without fail. In other words, it is possible to mount a piezoelectric vibrating piece for a piezoelectric oscillator on a pair of first internal terminals, and a piezoelectric vibrating piece for a piezoelectric vibrator with a functional component on a pair of second internal terminals. Misloading can be prevented.

According to the present invention, while effectively utilizing the above regions on the bottom surface of the first recess and the bottom surface of the second recess as arrangement spaces for the respective internal terminals, The remaining area can be used as a space for arranging through holes. The through hole connects one of the second internal terminals provided on the other end side of the bottom surface of the first recess and one of the fourth internal terminals provided at a diagonal position on the bottom surface of the second recess. can be connected efficiently. Thereby, the base for a piezoelectric vibrating device having an H-shaped structure can be efficiently shared by a piezoelectric oscillator and a piezoelectric vibrator with a functional component without complicating internal wiring or the like.

FIG. 1 is a side sectional view showing a schematic configuration of a base for a piezoelectric vibrating device according to the present embodiment. FIG. 2 is a view taken along the line X1-X1 in FIG. FIG. 3 is a view taken along the line X2-X2 in FIG. FIG. 4 is a view taken along the line X3-X3 in FIG. FIG. 5 is a view taken along the line X4-X4 in FIG. FIG. 6 is a diagram showing a schematic configuration of a crystal oscillator to which the piezoelectric vibrating device base according to the present embodiment is applied. FIG. 7 is a diagram corresponding to FIG. 2 showing the wiring in the piezoelectric vibration device base of the crystal oscillator of FIG. 6 and the connection relationship of each terminal. FIG. 8 is a diagram corresponding to FIG. 4 showing the wiring in the piezoelectric vibrating device base of the crystal oscillator of FIG. 6 and the connection relationship of each terminal. FIG. 9 is a diagram showing a schematic configuration of a thermistor-equipped crystal resonator to which the piezoelectric vibrating device base according to the present embodiment is applied. FIG. 10 is a diagram corresponding to FIG. 2 showing the wiring in the piezoelectric vibrating device base of the thermistor-equipped crystal resonator of FIG. 9 and the connection relationship of each terminal. FIG. 11 is a diagram corresponding to FIG. 4 showing the wiring in the piezoelectric vibrating device base of the thermistor-equipped crystal resonator of FIG. 9 and the connection relationship of each terminal.

Embodiments of the present invention will be described in detail below with reference to the drawings. In the following embodiments, the piezoelectric vibrating devices to which the piezoelectric vibrating device base according to the present embodiment is applied are a crystal oscillator 100 (see FIG. 6) and a thermistor-equipped crystal resonator 200 (see FIG. 9). I will explain about it.

A piezoelectric vibrating device base (hereinafter simply referred to as "base") 10 according to the present embodiment is configured as a common base that is shared by both a crystal oscillator 100 and a thermistor-equipped crystal resonator 200. FIG. 1 is a side sectional view showing a schematic configuration of the base 10. As shown in FIG. FIG. 2 is a view taken along the line X1-X1 in FIG. 1, and is a view of the base 10 seen from above. FIG. 3 is a view taken along the line X2-X2 in FIG. 1, and shows a cross section of the base 10 taken at the boundary between the bottom portion (base portion) 11 and the first outer wall portion 12. As shown in FIG. FIG. 4 is a view taken along the line X3-X3 in FIG. 1, and is a view of the base 10 seen from below. FIG. 5 is a view taken along the line X4-X4 in FIG. 1, and shows a cross section of the base 10 taken at the boundary between the bottom portion 11 and the second outer wall portion 13. As shown in FIG. Note that in FIG. 1, illustrations of terminals, wiring, etc. are omitted.

As shown in FIGS. 1 to 5, the base 10 is formed as a rectangular parallelepiped as a whole, and has a structure in which a ceramic such as alumina and a conductive material such as tungsten or molybdenum are laminated as appropriate. The base 10 is made by stacking ceramic rectangular parallelepipeds on the upper and lower sides of a single ceramic plate, and is integrally fired to have an H-shaped cross section with an open top and bottom. The base 10 includes a flat bottom portion 11, a first outer wall portion (peripheral wall portion) 12 extending upward from the bottom portion 11 along the outer periphery of one main surface of the base 10, and an outer periphery of the other main surface of the base 10. and a second outer wall portion (peripheral wall portion) 13 extending downward from the bottom portion 11 along. In this way, the base 10 having an H-shaped cross-sectional shape is formed by the bottom portion 11, the first outer wall portion 12, and the second outer wall portion 13. Note that each wiring pattern, each terminal, etc., which will be described later, is formed by forming nickel plating on the top of a metallized material such as tungsten or molybdenum, and gold plating on the top surface.

The bottom portion 11 and the first outer wall portion 12 form a first recess (cavity) 14 that is open upward. The first recess 14 is formed into a substantially rectangular shape in plan view. As will be described later, in the first recess 14, a crystal resonator piece 110 for the crystal oscillator 100 (see FIG. 6) or a crystal resonator piece 210 for the thermistor-equipped crystal resonator 200 (see FIG. 9) is mounted in a different direction. It can be stored in a closed position.

A bottom surface 14a of the first recess 14 (that is, one main surface of the bottom portion 11) is formed flat. A pair of first internal terminals 21a, 21b and a pair of second internal terminals 22a, 22b are formed in the four corner regions of the bottom surface 14a. The pair of first internal terminals 21a, 21b are provided on one end side of the bottom surface 14a (the left end side in FIGS. 2 and 3), and the pair of second internal terminals 22a, 22b are provided on the other end side of the bottom surface 14a. (On the right end side in FIGS. 2 and 3). The pair of second internal terminals 22a, 22b are formed larger than the pair of first internal terminals 21a, 21b.

A crystal vibrating piece 110 for the crystal oscillator 100 can be mounted on the pair of first internal terminals 21a, 21b via, for example, a conductive bonding material 120. It can be electrically connected to an excitation electrode (not shown) of the vibrating piece 110. A crystal resonator piece 210 for the thermistor-equipped crystal resonator 200 can be mounted on the pair of second internal terminals 22a, 22b via, for example, a conductive bonding material 220. 22b can be electrically connected to an excitation electrode (not shown) of the crystal vibrating piece 210.

The upper surface (top surface) 12a of the first outer wall portion 12 is formed flat. As will be described later, a lid 300 (see FIGS. 6 and 9) for hermetically sealing the first recess 14 can be attached to the upper surface 12a of the first outer wall 12. A sealing member 310 made of metal, for example, is interposed between the upper surface 12a of the lid 300 and the lid 300.

The bottom portion 11 and the second outer wall portion 13 form a second recess (cavity) 15 that is open downward. The second recess 15 is formed into a substantially rectangular shape in plan view. As described later, the second recess 15 can accommodate an IC 130 for the crystal oscillator 100 (see FIG. 6) or a thermistor 230 for the thermistor-equipped crystal resonator 200 (see FIG. 9). The IC 130 for the crystal oscillator 100 can be accommodated along the second recess 15, while the thermistor 230 for the thermistor-equipped crystal resonator 200 can be accommodated in the diagonal direction (oblique direction) of the second recess 15 in plan view. It is possible to accommodate along.

A bottom surface 15a of the second recess 15 (that is, the other main surface of the bottom portion 11) is formed flat. A pair of third internal terminals 23a, 23b and two fourth internal terminals 24a, 24b are formed in the four corner regions of the bottom surface 15a. The pair of third internal terminals 23a, 23b are provided at one diagonal position of the bottom surface 14a, and the two fourth internal terminals 24a, 24b are provided at the other diagonal position of the bottom surface 14a. Furthermore, two fourth internal terminals 24c and 24d are formed in two opposing regions of the bottom surface 15a. The fourth internal terminal 24c is provided between the third internal terminal 23b and the fourth internal terminal 24a, and the fourth internal terminal 24d is provided between the third internal terminal 23a and the fourth internal terminal 24b. There is. Three internal terminals are provided in line along the longitudinal direction of the second recess 15. The pair of third internal terminals 23a, 23b are formed larger than the four fourth internal terminals 24a, 24b, 24c, 24d.

The third internal terminal 23a is provided on the back side (directly below) of the first internal terminal 21b, and the first internal terminal 21b and the third internal terminal 23a are provided at substantially the same position in plan view. The third internal terminal 23b is provided on the back side (directly below) of the second internal terminal 22a, and the second internal terminal 22a and the third internal terminal 23b are provided at substantially the same position in plan view. The fourth internal terminal 24a is provided on the back side (directly below) of the first internal terminal 21a, and the first internal terminal 21a and the fourth internal terminal 24a are provided at substantially the same position in plan view. The fourth internal terminal 24b is provided on the back side (directly below) of the second internal terminal 22b, and the second internal terminal 22b and the fourth internal terminal 24b are provided at substantially the same position in plan view. An area above the fourth internal terminals 24c and 24d is a region where no terminals are provided.

A thermistor 230 for the thermistor-equipped crystal resonator 200 can be mounted on the pair of third internal terminals 23a, 23b via, for example, a conductive bonding material 240. It can be electrically connected to a pair of electrodes (not shown) of the thermistor 230. An IC 130 for the crystal oscillator 100 can be mounted on the pair of third internal terminals 23a, 23b and the four fourth internal terminals 24a, 24b, 24c, 24d, for example, via metal bumps 140. The third internal terminals 23a, 23b and the four fourth internal terminals 24a, 24b, 24c, 24d can be electrically connected to electrodes (not shown) of the IC 130.

The bottom surface 13a of the second outer wall portion 13 is formed flat. A pair of first external terminals 25a, 25b and a pair of second external terminals 26a, 26b are formed in the four corner areas of the bottom surface 13a. The pair of first external terminals 25a, 25b are provided at one diagonal position of the bottom surface 13a, and the pair of second external terminals 26a, 26b are provided at the other diagonal position of the bottom surface 13a. The pair of first external terminals 25a, 25b and the pair of second external terminals 26a, 26b are formed to have substantially the same size.

The pair of first external terminals 25a, 25b and the pair of second external terminals 26a, 26b are provided as terminals for mounting the piezoelectric vibration device on an external circuit board (not shown). The pair of first external terminals 25a, 25b can be electrically connected to the excitation electrode of the crystal vibrating piece 210 for the thermistor-equipped crystal resonator 200, and the pair of second external terminals 26a, 26b can be electrically connected to the excitation electrode of the crystal vibrating piece 210 for the thermistor-equipped crystal resonator 200. It can be electrically connected to a pair of electrodes of a thermistor 230 for the crystal resonator 200. Further, the pair of first external terminals 25a, 25b and the pair of second external terminals 26a, 26b can be electrically connected to the IC 130 for the crystal oscillator 100.

The internal terminals and external terminals described above are connected to each other via a wiring pattern provided on the base 10, a through hole, or the like. The wiring in the base 10 and the connection relationship of each terminal will be explained with reference to FIGS. 1 to 5.

A plurality of (for example, six) castellations are formed on the side surface of the base 10. In plan view, castellations 31a, 31b, 31c, and 31d are formed at four corners (corners) of the outer periphery of the base 10, and castellations 31e and 31f are formed on a pair of opposing sides of the outer periphery of the base 10. has been done. The castellations 31a to 31f extend in the vertical direction from the lower end to the upper end of the base 10. That is, the castellations 31a to 31f are continuously provided on the second outer wall section 13, the bottom section 11, and the first outer wall section 12 of the base 10. External wiring patterns (side terminals) can be formed on the castellations 31a to 31f, and electrical connections can be made using these external wiring patterns.

A plurality of (for example, two) through holes 32 and 33 are formed in the bottom portion 11 of the base 10 . The first recess 14 and the second recess 15 communicate with each other through the through holes 32 and 33. The through holes 32 and 33 can be filled with a conductor, and electrical connection can be made using the conductors in the through holes 32 and 33. The through hole 32 is provided at a position overlapping the second internal terminal 22b and the fourth internal terminal 24b in plan view. The conductor in the through hole 32 electrically connects the second internal terminal 22b and the fourth internal terminal 24b. The through hole 33 is provided at a position overlapping the fourth internal terminal 24a and an internal wiring pattern 35, which will be described later, in plan view. The fourth internal terminal 24a and the internal wiring pattern 35 are electrically connected by the conductor in the through hole 33. Note that, when viewed from the bottom, a portion of the conductor inside the through hole 33 is covered by the fourth internal terminal 24a, but the remaining portion of the conductor inside the through hole 33 is not covered by the fourth internal terminal 24a. No, it's exposed.

Furthermore, a through hole 34 is formed inside the base 10. The through hole 34 extends in the vertical direction from the lower end to the upper end of the base 10. That is, the through hole 34 is provided continuously in the second outer wall portion 13, the bottom portion 11, and the first outer wall portion 12 of the base 10. The through hole 34 can be filled with a conductor, and electrical connection can be made using the conductor inside the through hole 34. The through hole 34 is provided at a position overlapping the second external terminal 26b in plan view. The second external terminal 26b is a ground terminal for ground connection, and is electrically connected to the lid 300 via a conductor in the through hole 34 as a ground wiring. It looks like this.

Furthermore, a plurality of internal wiring patterns are formed on the base 10. An internal wiring pattern 35 is formed on the bottom surface 14a of the first recess 14 of the base 10. The internal wiring pattern 35 has an elongated shape extending along the longitudinal direction of the first recess 14 at the center of the bottom surface 14a. One end of the internal wiring pattern 35 is connected to the second internal terminal 22a. The other end of the internal wiring pattern 35 is connected to a fourth internal terminal 24a provided on the back side of the internal wiring pattern 35 via a conductor in the through hole 33.

A plurality of (for example, two) internal wiring patterns 36a and 36b are formed between the bottom portion 11 and the first outer wall portion 12. The internal wiring patterns 36a and 36b are sandwiched between the bottom portion 11 and the first outer wall portion 12, and are embedded inside the base 10. One end of the internal wiring pattern 36a is connected to the first internal terminal 21b. The other end of the internal wiring pattern 36a is connected to an external wiring pattern (side terminal) formed on the castellation 31e. One end of the internal wiring pattern 36b is connected to the first internal terminal 21a. The other end of the internal wiring pattern 36b is connected to an external wiring pattern (side terminal) formed on the castellation 31f. The internal wiring patterns 35, 36a, 36b are formed on the same plane as the pair of first internal terminals 21a, 21b and the pair of second internal terminals 22a, 22b, and are formed in the same process. The internal terminals 21a, 21b, the pair of second internal terminals 22a, 22b, and the internal wiring patterns 35, 36a, 36b can be formed all at once.

Further, between the bottom portion 11 and the second outer wall portion 13, a plurality of (for example, six) internal wiring patterns 37a, 37b, 37c, 37d, 37e, and 37f are formed. The internal wiring patterns 37a to 37f are sandwiched between the bottom portion 11 and the second outer wall portion 13, and are embedded inside the base 10. One end of the internal wiring pattern 37a is connected to the third internal terminal 23a. The other end of the internal wiring pattern 37a is connected to an external wiring pattern (side terminal) formed on the castellation 31a. One end of the internal wiring pattern 37b is connected to the fourth internal terminal 24a. The other end of the internal wiring pattern 37b is connected to an external wiring pattern (side terminal) formed on the castellation 31b. One end of the internal wiring pattern 37c is connected to the fourth internal terminal 24b. The other end of the internal wiring pattern 37c is connected to an external wiring pattern (side terminal) formed on the castellation 31c. One end of the internal wiring pattern 37d is connected to the third internal terminal 23b. The other end of the internal wiring pattern 37d is connected to an external wiring pattern (side terminal) formed on the castellation 31d. One end of the internal wiring pattern 37e is connected to the fourth internal terminal 24d. The other end of the internal wiring pattern 37e is connected to an external wiring pattern (side terminal) formed on the castellation 31e. One end of the internal wiring pattern 37f is connected to the fourth internal terminal 24c. The other end of the internal wiring pattern 37f is connected to an external wiring pattern (side terminal) formed on the castellation 31f. Note that the internal wiring patterns 37a to 37f are formed on the same plane as the pair of third internal terminals 23a and 23b and the four fourth internal terminals 24a to 24d, and are formed in the same process. 23a, 23b, four fourth internal terminals 24a to 24d, and internal wiring patterns 37a to 37f can be formed all at once.

The connection relationship of each terminal on the base 10 is as follows. The first internal terminal 21a and the fourth internal terminal 24c are connected to each other via an internal wiring pattern 36b, an external wiring pattern formed on the castellation 31f, and an internal wiring pattern 37f. The first internal terminal 21b and the fourth internal terminal 24d are connected to each other via an internal wiring pattern 36a, an external wiring pattern formed on the castellation 31e, and an internal wiring pattern 37e.

The second internal terminal 22a, the fourth internal terminal 24a, and the first external terminal 25a are connected via the internal wiring pattern 35, the conductor in the through hole 33, the internal wiring pattern 37b, and the external wiring pattern formed in the castellation 31b. are connected to each other. The second internal terminal 22b, the fourth internal terminal 24b, and the first external terminal 25b are connected to each other via the conductor in the through hole 32, the internal wiring pattern 37c, and the external wiring pattern formed in the castellation 31c. There is.

Further, the third internal terminal 23a and the second external terminal 26a are connected to each other via an internal wiring pattern 37a and an external wiring pattern formed on the castellation 31a. The third internal terminal 23b and the second external terminal 26b are connected to each other via an internal wiring pattern 37d and an external wiring pattern formed on the castellation 31d.

Next, a case where the base 10 having the above configuration is applied to the crystal oscillator 100 and a case where the base 10 having the above configuration is applied to the thermistor-equipped crystal resonator 200 will be described. First, a case where the base 10 is applied to the crystal oscillator 100 will be described with reference to FIGS. 6 to 8. Note that in FIGS. 7 and 8, terminals, wiring patterns, etc. that contribute to electrical connection are shown in solid lines, and terminals, wiring patterns, etc. that do not contribute to electrical connection are shown in broken lines.

As shown in FIGS. 6 to 8, in the crystal oscillator 100, the crystal vibrating piece 110 is housed in the first recess 14 of the base 10, and the IC 130 is housed in the second recess 15. The IC 130 is accommodated along the substantially rectangular second recess 15 .

The crystal vibrating piece 110 is mounted on a pair of first internal terminals 21a and 21b via a conductive bonding material 120. The IC 130 is mounted on a pair of third internal terminals 23a, 23b and four fourth internal terminals 24a, 24b, 24c, 24d via metal bumps 140. The excitation electrode of the crystal vibrating piece 110 is connected to the IC 130 via a pair of first internal terminals 21a, 21b and a pair of fourth internal terminals 24c, 24d. The IC 130 is connected to a pair of first external terminals 25a, 25b and a pair of second external terminals 26a, 26b via a pair of third internal terminals 23a, 23b and two fourth internal terminals 24a, 24b. . The pair of first external terminals 25a, 25b and the pair of second external terminals 26a, 26b are connected to a circuit board (not shown). In this case, for example, the first external terminal 25a is used as a VCON terminal, the first external terminal 25b is used as an OUT terminal, the second external terminal 26a is used as a VCC terminal, and the second external terminal 26b is used as a ground terminal. The second external terminal 26b as a ground terminal is electrically connected to the lid 300 via a conductor in the through hole 34 as a ground wiring.

In the crystal oscillator 100, as shown by broken lines in FIGS. 7 and 8, the pair of second internal terminals 22a and 22b are terminals that do not contribute to electrical connection. Furthermore, the conductors in the through holes 32 and 33 and the internal wiring pattern 35 do not contribute to electrical connection. On the other hand, other terminals, wiring patterns, etc. contribute to electrical connections in the crystal oscillator 100.

Next, a case where the base 10 is applied to a thermistor-equipped crystal resonator 200 will be described with reference to FIGS. 9 to 11. Note that in FIGS. 10 and 11, terminals, wiring patterns, etc. that contribute to electrical connection are shown in solid lines, and terminals, wiring patterns, etc. that do not contribute to electrical connection are shown in broken lines.

As shown in FIGS. 9 to 11, in the thermistor-equipped crystal resonator 200, a crystal vibrating piece 210 is accommodated in the first recess 14 of the base 10, and a thermistor 230 as a functional component is accommodated in the second recess 15. . The thermistor 230 is housed in the substantially rectangular second recess 15 along the diagonal direction.

The crystal vibrating piece 210 is mounted on a pair of second internal terminals 22a and 22b via a conductive bonding material 220. The excitation electrodes of the crystal vibrating piece 210 are connected to a pair of first external terminals 25a, 25b via a pair of second internal terminals 22a, 22b. In the case of the thermistor-equipped crystal resonator 200 and the case of the above-described crystal oscillator 100, the mounting directions of the crystal vibrating pieces 110 and 210 are opposite to each other. That is, in the case of the crystal oscillator 100 described above, the crystal vibrating piece 110 is mounted on the pair of first internal terminals 21a and 21b provided on one end side of the bottom surface 14a of the base 10, whereas 200, the crystal vibrating piece 210 is mounted on a pair of second internal terminals 22a, 22b provided on the other end side of the bottom surface 14a of the base 10.

The thermistor 230 is mounted on a pair of third internal terminals 23a and 23b via a conductive bonding material 240. A pair of electrodes of the thermistor 230 are connected to a pair of second external terminals 26a, 26b via a pair of third internal terminals 23a, 23b. The pair of first external terminals 25a, 25b and the pair of second external terminals 26a, 26b are connected to a circuit board (not shown). In this case, the second external terminal 26b is used as a ground terminal and is electrically connected to the lid 300 via a conductor in the through hole 34 as a ground wiring.

In the thermistor-equipped crystal resonator 200, as shown by broken lines in FIGS. 10 and 11, the pair of first internal terminals 21a, 21b and the two fourth internal terminals 24c, 24d are terminals that do not contribute to electrical connection. It becomes. Moreover, the external wiring patterns formed on the internal wiring patterns 36a, 36b, 37e, and 37f and the castellations 31e and 31f do not contribute to electrical connection. On the other hand, other terminals, wiring patterns, etc. contribute to electrical connections in the thermistor-equipped crystal resonator 200.

According to this embodiment, the base 10 having an H-shaped structure can be efficiently shared by the crystal oscillator 100 and the thermistor-equipped crystal resonator 200 without complicating internal wiring or the like. Specifically, on the bottom surface 14a of the first recess 14, a pair of first internal terminals 21a, 21b on which the crystal resonator piece 110 for the crystal oscillator 100 is mounted, and a crystal resonator piece 210 for the thermistor-equipped crystal resonator 200 are installed. A pair of second internal terminals 22a and 22b to be mounted are provided. On the bottom surface 15a of the second recess 15, there are a pair of third internal terminals 23a and 23b on which the thermistor 230 for the thermistor-equipped crystal resonator 200 is mounted, and four third internal terminals 23a and 23b on which the thermistor 230 for the thermistor-equipped crystal resonator 200 is not mounted. Four internal terminals 24a to 24d are provided, and these third internal terminals 23a, 23b and fourth internal terminals 24a to 24d are also used as terminals on which an IC 130 for the crystal oscillator 100 is mounted. On the bottom surface 13a of the second outer wall 13 surrounding the second recess 15, a pair of first external terminals 25a and 25b connected to a crystal resonator piece 210 for the thermistor-equipped crystal resonator 200, and a thermistor-equipped crystal resonator 200 are provided. A pair of second external terminals 26a, 26b are provided to be connected to a thermistor 230 for the crystal oscillator 100, and a pair of first external terminals 25a, 25b and a pair of second external terminals 26a, 26b are It is also shared as a connecting terminal.

In this way, each terminal of the base 10 (in this case, the third internal terminals 23a, 23b, the first external terminals 25a, 25b, and the second external terminals 26a, 26b) is connected to the crystal oscillator 100 and the thermistor-equipped crystal resonator 200. By sharing the base 10 with the crystal oscillator 100 and the thermistor-equipped crystal resonator 200, the base 10 can be efficiently shared. In addition, it is only necessary to accommodate the crystal resonator piece 110 for the crystal oscillator 100 or the crystal resonator piece 210 for the thermistor-equipped crystal resonator 200 in the first recess 14 with different mounting directions. The base 10 can be easily shared by the crystal oscillator 100 and the thermistor-equipped crystal resonator 200.

Further, the first recess 14 and the second recess 15 are formed into a substantially rectangular shape in plan view, and the pair of first internal terminals 21a, 21b and the pair of second internal terminals 22a, 22b are connected to the bottom surface 14a of the first recess 14. A pair of third internal terminals 23a, 23b and two fourth internal terminals 24a, 24b are provided in four corner areas of the bottom surface 15a of the second recess 15, and the remaining two Fourth internal terminals 24c and 24d are provided in two opposing regions other than the four corners of the bottom surface 15a of the second recess 15. Further, the pair of first internal terminals 21a and 21b are provided at one end of the bottom surface 14a of the first recess 14, and the pair of second internal terminals 22a and 22b are provided at the other end of the bottom surface 14a of the first recess 14. A pair of third internal terminals 23a, 23b are provided at one diagonal position of the bottom surface 15a of the second recess 15, and two fourth internal terminals 24a, 24b are provided at the bottom surface 15a of the second recess 15. It is provided at the other diagonal position of 15a. One second internal terminal 22b and one fourth internal terminal 24b provided at a diagonal position are connected via a conductor in a through hole 32 provided in the bottom portion 11.

As a result, while effectively utilizing the areas of the bottom surface 14a of the first recess 14 and the bottom surface 15a of the second recess 15 as the arrangement space for each internal terminal, the bottom surface 14a of the first recess 14 and the bottom surface of the second recess 15 can be effectively utilized. The remaining area of 15a other than the above can be used as a space for arranging wiring patterns, through holes, and the like. Through the through hole 32, one second internal terminal 22b provided on the other end side of the bottom surface 14a of the first recess 14 and one second internal terminal 22b provided at a diagonal position of the bottom surface 15a of the second recess 15 are connected. 4 internal terminal 24b can be efficiently connected. Therefore, the base 10 having an H-shaped structure can be efficiently shared by the crystal oscillator 100 and the thermistor-equipped crystal resonator 200 without complicating internal wiring or the like.

Further, the other second internal terminal 22a and the other fourth internal terminal 24a provided diagonally are connected to the internal wiring pattern 35 provided on the bottom surface 14a of the first recess 14 and the internal wiring pattern 35 provided on the bottom surface 11. It is connected via a conductor in the through hole 33. In this way, the pair of second internal terminals 22a, 22b provided on the other end side of the bottom surface 14a of the first recess 14 and the bottom surface 15a of the second recess 15 are connected by the through holes 32, 33 and the internal wiring pattern 35. The two fourth internal terminals 24a and 24b provided at diagonal positions can be efficiently connected. As a result, the thermistor 230 for the thermistor-equipped crystal resonator 200 can be mounted on the pair of third internal terminals 23a and 23b provided at diagonal positions on the bottom surface 15a of the second recess 15. The thermistor 230 can be accommodated along the diagonal direction of the two recesses 15, and a larger size thermistor 230 can be used.

Further, since the pair of third internal terminals 23a and 23b are formed larger than the fourth internal terminals 24a to 24d, the mounting area (bonding area) of the thermistor 230 using the conductive bonding material 240 such as solder, for example, A larger area can be secured, and the thermistor 230 can be more reliably mounted on the pair of third internal terminals 23a, 23b.

Further, one of the pair of first external terminals 25a, 25b and the pair of second external terminals 26a, 26b (in this case, the second external terminal 26b) is used as a ground terminal for ground connection, and from the ground terminal , a ground wiring extending toward the upper surface 12a of the first outer wall portion 12 surrounding the first recess 14 is provided. The ground wiring is a conductor in the through hole 34 and is provided across the inside of the second outer wall portion 13, the inside of the bottom portion 11, and the inside of the first outer wall portion 12. As a result, the conductor in the through hole 34 as a ground wiring is provided inside the second outer wall portion 13, so that the conductive bonding material 240, such as solder, used for mounting the thermistor 230 gets wet and spreads. Even so, it is possible to reliably prevent a short circuit between the ground wiring and the pair of third internal terminals 23a and 23b. Similarly, since the conductor in the through hole 34 as the ground wiring is provided inside the first outer wall portion 12, even if the conductive bonding material 240, such as solder, gets wet and spreads, the conductor is not connected to the ground wiring. Short circuits between the pair of first internal terminals 21a, 21b and the pair of second internal terminals 22a, 22b can be reliably prevented.

Further, since the pair of second internal terminals 22a, 22b are formed larger than the pair of first internal terminals 21a, 21b, the pair of first internal terminals 21a, 21b and the pair of second internal terminals 22a, 22b Since these can be easily distinguished visually, it is possible to distinguish whether the piezoelectric vibrating piece to be mounted is for a piezoelectric oscillator or a piezoelectric vibrator with a functional component, and to mount it without fail. In other words, it is possible to mount a piezoelectric vibrating piece for a piezoelectric oscillator on a pair of first internal terminals 21a, 21b, and a piezoelectric vibrating piece for a piezoelectric vibrator with a functional component on a pair of second internal terminals 22a, 22b, respectively. This makes it possible to prevent the piezoelectric vibrating piece from being incorrectly mounted. For example, in the manufacturing process of a piezoelectric oscillator, by recognizing the difference in appearance between a pair of first internal terminals 21a, 21b and a pair of second internal terminals 22a, 22b, piezoelectric It is possible to prevent the vibrating piece from being installed incorrectly.

The embodiments disclosed this time are illustrative in all respects, and are not the basis for restrictive interpretation. Therefore, the technical scope of the present invention should not be interpreted only by the above-described embodiments, but should be defined based on the claims. In addition, all changes within the meaning and scope of the claims are included.

In the above embodiment, among the four fourth internal terminals 24a to 24d on which the thermistor 230 for the thermistor-equipped crystal resonator 200 is not mounted (not connected), the third internal terminals 23a and 23b are located in the longitudinal direction of the second recess 15. The thermistor 230 may also be arranged at the fourth internal terminals 24c and 24d adjacent to each other. That is, the thermistor 230 may be mounted across the third internal terminal 23a and the fourth internal terminal 24d, and the thermistor 230 may be mounted across the third internal terminal 23b and the fourth internal terminal 24c. In the case of the thermistor-equipped crystal resonator 200, the fourth internal terminals 24c and 24d are not connected to the crystal resonator piece 210, so by disposing the thermistor 230 also on the fourth internal terminals 24c and 24d, it is possible to connect the fourth internal terminals 24c and 24d with solder, etc. The mounting area (bonding area) of the thermistor 230 using the conductive bonding material 240 can be increased, and the thermistor 230 can be mounted more reliably.

In the embodiment described above, the internal wiring pattern 35 is formed on the bottom surface 14a of the first recess 14, but the present invention is not limited thereto, and the internal wiring pattern 35 may be formed inside the bottom portion 11.

In the embodiment described above, a plurality of castellations 31a to 31f are formed on the side surface of the base 10, and each terminal is connected via an external wiring pattern (side surface terminal) formed on the castellations 31a to 31f. However, the present invention is not limited to this, and each terminal may be connected by something other than castellations 31a to 31f. Instead of the castellations 31a to 31f, for example, a plurality of vias (through holes) or half vias may be provided inside the base 10, and the terminals may be connected using these vias or half vias. Alternatively, each terminal may be connected using a combination of castellations, vias, and half vias.

Further, the castellations 31a to 31f do not need to be provided continuously on the second outer wall 13, the bottom 11, and the first outer wall 12 of the base 10, and may be formed on the second outer wall 13, the bottom 11, and the first outer wall. It may be provided in a part of the section 12. For example, for the second outer wall portion 13 and the first outer wall portion 12, only the castellations 31a to 31d at the four corners may be provided.

In the embodiment described above, each terminal is connected through the conductors in the plurality of through holes 32 to 34 provided in the base 10. However, the present invention is not limited to this, and the terminals may be connected by other means than the through holes 32 to 34. Instead of the through holes 32 to 34, the terminals may be connected by, for example, castellations provided on the side surface of the base 10 or half vias provided inside the base 10. For example, instead of the through hole 32, the second internal terminal 22b and the fourth internal terminal 24b may be connected via a castellation 31c formed in the bottom portion 11.

In the above embodiment, the pair of second internal terminals 22a, 22b are formed larger than the pair of first internal terminals 21a, 21b, but conversely, the pair of first internal terminals 21a, 21b are formed to be larger than the pair of first internal terminals 21a, 21b. It may be formed larger than the pair of second internal terminals 22a, 22b. Further, the pair of first internal terminals 21a, 21b and the pair of second internal terminals 22a, 22b may have mutually different shapes. That is, the pair of first internal terminals 21a, 21b may be different from the pair of second internal terminals 22a, 22b in at least one of size and shape. For example, the pair of first internal terminals 21a, 21b may be rectangular, and the pair of second internal terminals 22a, 22b may be substantially rectangular with a chamfered shape or an R shape. Note that, as described above, when the internal wiring pattern 35 connected to the second internal terminal 22a is provided on the bottom surface 14a of the first recess 14, by checking whether or not the internal wiring pattern 35 is connected, , it becomes possible to distinguish between the pair of first internal terminals 21a, 21b and the pair of second internal terminals 22a, 22b.

In the above embodiment, the case where the functional component is a thermistor has been described, but the functional component is not particularly limited, and may be, for example, a diode, a heater element, an inductance, or the like. Note that the mounting direction of the functional component in the second recess 15 can be set as appropriate depending on the size and shape of the functional component.

10 Base (base for piezoelectric vibration device)
11 Bottom (basal part)
12 First outer wall portion 13 Second outer wall portion 13a Bottom surface 14 First recessed portion 14a Bottom surface 15 Second recessed portion 15a Bottom surface 21a, 21b First internal terminal 22a, 22b Second internal terminal 23a, 23b Third internal terminal 24a, 24b, 24c , 24d Fourth internal terminal 25a, 25b First external terminal 26a, 26b Second external terminal 100 Crystal oscillator (piezoelectric oscillator)
110 Crystal vibrating piece (piezoelectric vibrating piece for piezoelectric oscillator)
130 IC (IC for piezoelectric oscillator)
200 Crystal resonator with thermistor (piezoelectric resonator with functional parts)
210 Crystal vibrating piece (piezoelectric vibrating piece for piezoelectric vibrator with functional parts)
230 Thermistor (functional component for piezoelectric vibrator with functional component)

Claims (4)

A base for a piezoelectric vibration device that is shared by a piezoelectric oscillator and a piezoelectric vibrator with functional components,
It has a first recess that is open to the upper side of the base, and a second recess that is opened to the lower side of the base;
The first recess and the second recess are formed into a substantially rectangular shape in plan view,
A pair of first internal terminals on which a piezoelectric vibrating piece for a piezoelectric oscillator is mounted, and a pair of second internal terminals on which a piezoelectric vibrating piece for a piezoelectric vibrator with a functional component is mounted on the bottom surface of the first recess. is established,
The pair of first internal terminals are provided on one end side of the bottom surface of the first recess, and the pair of second internal terminals are provided on the other end side of the bottom surface of the first recess,
A pair of third internal terminals on which functional parts for the piezoelectric vibrator with functional parts are mounted, and four fourth internal terminals on which functional parts for the piezoelectric vibrator with functional parts are not mounted on the bottom surface of the second recess. and the third internal terminal and the fourth internal terminal are also used as terminals on which an IC for a piezoelectric oscillator is mounted,
The pair of third internal terminals are provided at one diagonal position on the bottom surface of the second recess, and two of the fourth internal terminals are provided at the other diagonal position on the bottom surface of the second recess. , the remaining two of the fourth internal terminals are provided in two opposing regions other than the four corners of the bottom surface of the second recess,
One of the second internal terminals and one of the fourth internal terminals provided at a diagonal position of the other internal terminal are connected via a through hole provided in the base portion. Base for piezoelectric vibration devices. The base for a piezoelectric vibration device according to claim 1,
The other of the second internal terminals and the other of the fourth internal terminals provided at a diagonal position of the other internal terminal are internal wiring provided on the bottom surface of the first recess or inside the base portion, A base for a piezoelectric vibrating device, characterized in that the base is connected to another through hole provided in the base. The base for a piezoelectric vibration device according to claim 1 or 2 ,
The base for a piezoelectric vibrating device, wherein the pair of third internal terminals are formed larger than all of the fourth internal terminals. The base for a piezoelectric vibration device according to any one of claims 1 to 3 ,
A base for a piezoelectric vibrating device, wherein all of the pair of first internal terminals are different from all of the pair of second internal terminals in at least one of size and shape.

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