JP7400284B2 - electronic component module - Google Patents

Description

The present invention relates to an electronic component module.

In an electronic component module in which electronic components are mounted on a substrate, a heat sink for dissipating heat from the electronic components may be connected to the substrate, as disclosed in Patent Document 1, for example. In Patent Document 1, a thermal via is provided on a substrate, and a heat sink is connected to the thermal via.

Japanese Patent Application Publication No. 2007-208123

In the case of double-sided mounting, electronic components are also placed between the board and the heat sink. For this reason, in Patent Document 1, in the case of double-sided mounting, thermal vias for connection with a heat sink cannot be brought close to electronic components, and as a result, heat from the electronic components cannot be sufficiently dissipated.

In order to solve the above problems, an electronic component module according to one aspect of the present invention includes a substrate having a first surface and a second surface opposite to the first surface, and a substrate mounted on the first surface. a first electronic component that generates heat; a second electronic component that overlaps part or all of the first electronic component when viewed from the thickness direction of the substrate and is mounted on the second surface and generates heat; a heat dissipation member connected to a second portion of the substrate, which is closer to at least one of the first electronic component and the second electronic component than the first portion of the substrate, and a heat conduction member connected to the heat dissipation member; , has.

FIG. 1 is a perspective view showing a schematic configuration of an electronic component module according to a first embodiment. FIG. 2 is a plan view of the electronic component module according to the first embodiment. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. FIG. 3 is a cross-sectional view of an electronic component module according to a second embodiment. FIG. 7 is a cross-sectional view of an electronic component module according to a third embodiment. FIG. 7 is a cross-sectional view of an electronic component module according to a fourth embodiment. FIG. 7 is a cross-sectional view of an electronic component module according to a modification.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the dimensions or scale of each part may be different from the actual size, and some parts are shown schematically to facilitate understanding. Further, the scope of the present invention is not limited to these forms unless there is a statement that specifically limits the present invention in the following description.
1. First Embodiment FIG. 1 is a perspective view showing a schematic configuration of an electronic component module 1 according to a first embodiment. In FIG. 1, the outer shape of a substrate 2 included in an electronic component module 1 is illustrated by a chain double-dashed line. In the following, for convenience of explanation, "X axis", "Y axis", and "Z axis" which are orthogonal to each other will be used as appropriate. Further, one direction along the X axis is referred to as the "X1 direction", and the direction opposite to the X1 direction is referred to as the "X2 direction". Similarly, one direction along the Y axis is referred to as the "Y1 direction", and the direction opposite to the Y1 direction is referred to as the "Y2 direction". One direction along the Z axis is referred to as the "Z1 direction", and the direction opposite to the Z1 direction is referred to as the "Z2 direction". Here, the Z axis is an axis along the thickness direction of the substrate 2, which will be described later. Furthermore, viewing from the Z1 direction or the Z2 direction is referred to as "planar view."

As shown in FIG. 1, the electronic component module 1 includes a substrate 2, a plurality of first electronic components 3, a plurality of second electronic components 4, a heat radiation member 5, a plurality of heat conduction members 6, and a plurality of screws 7. .

First, to explain the outline of the electronic component module 1, a plurality of first electronic components 3 are mounted on one surface of the substrate 2. On the other hand, a plurality of second electronic components 4 are mounted on the other surface of the substrate 2. The substrate 2 is fixed to the heat dissipation member 5 by screwing with a plurality of screws 7. The heat radiation member 5 radiates heat from the plurality of first electronic components 3 and the plurality of second electronic components 4.

Moreover, the plurality of heat conductive members 6 conduct heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 to the heat radiating member 5 . Here, each heat conductive member 6 is connected to a portion of the substrate 2 that is closer to the plurality of first electronic components 3 and the plurality of second electronic components 4 than the portion connected to the heat dissipation member 5 . Therefore, the thermal resistance from the plurality of first electronic components 3 and the plurality of second electronic components 4 to the heat dissipation member 5 can be significantly reduced compared to the case where the plurality of heat conductive members 6 are not used. Therefore, the heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 can be efficiently radiated by the heat radiating member 5 compared to the case where the plurality of heat conductive members 6 are not used. Each part of the electronic component module 1 will be explained in detail below.

FIG. 2 is a plan view of the electronic component module 1 according to the first embodiment. FIG. 3 is a cross-sectional view taken along line AA in FIG. As shown in FIGS. 2 and 3, a plurality of first electronic components 3 are mounted on the first surface F1, which is the surface in the Z1 direction of the substrate 2. On the other hand, a plurality of second electronic components are mounted on the second surface F2, which is the surface in the Z2 direction of the substrate 2.

Each of the first electronic component 3 and the second electronic component 4 is an active component or a passive component that generates heat when energized. Examples of the active components include transistors, semiconductor integrated circuits, diodes, and operational amplifiers. Examples of the passive components include resistors, coils, and capacitors. The types of the plurality of first electronic components 3 mounted on the board 2 are not particularly limited, and may be the same or different. Similarly, the types of the plurality of second electronic components 4 mounted on the board 2 are not particularly limited, and may be the same or different. Moreover, the type of the first electronic component 3 and the type of the second electronic component 4 may be the same or different. In FIG. 2, the number of first electronic components 3 and second electronic components 4 is three. Note that the number of each of the first electronic component 3 and the second electronic component 4 may be two or less or four or more. Further, the arrangement of the first electronic component 3 or the second electronic component 4 with respect to the substrate 2 is not limited to the example shown in FIG. 2, but is arbitrary. Further, the first electronic component 3 and the second electronic component 4 may include, for example, a relay, a switch, a connector, a board, a terminal, a wire, or the like.

The substrate 2 includes a base material 21, a first wiring 22a, a second wiring 22b, thermally conductive layers 23a and 23b, and protective films 24a and 24b.

Base material 21 has insulating layers 21a, 21b and 21c. These are stacked in this order toward the Z2 direction. Each of the insulating layers 21a, 21b, and 21c is a layer in which a fiber base material is impregnated with a resin material and then cured or solidified. Note that the number of insulating layers that the base material 21 has is not limited to three layers, and may be two or less layers or four or more layers.

The fiber base material is not particularly limited, but includes, for example, woven fabrics, nonwoven fabrics, and mats made of glass fibers, organic fibers, metal fibers, carbon fibers, mineral fibers, and the like. These may be used alone or in combination of two or more. Among these, a glass fiber base material is preferably used as the fiber base material.

Examples of the resin material include, but are not particularly limited to, thermosetting resins such as epoxy resins, phenol resins, urea resins, melamine resins, polyester resins, polyimide resins, silicone resins, and polyurethane resins. These can be used alone or in combination of two or more. Among these, epoxy resin is preferably used as the resin material. Note that the resin material contains electrically insulating and highly thermally conductive fillers such as metal oxides such as alumina, metal hydroxides such as aluminum hydroxide, and nitrides such as boron nitride. Good too.

The first wiring 22a is a conductor pattern arranged on the surface of the above-mentioned insulating layer 21a opposite to the insulating layer 21b and connected to the first electronic component 3. On the other hand, the second wiring 22b is a conductor pattern arranged on the surface of the above-mentioned insulating layer 21c opposite to the insulating layer 21b and connected to the second electronic component 4. Each of the first wiring 22a and the second wiring 22b is made of, for example, a metal material. Examples of the metal materials include copper, iron, aluminum, indium, tin, lead, silver, zinc, bismuth, antimony, etc., and one of these may be used alone or in combination of two or more. I can do it. Among these, copper, aluminum, or an alloy of any of these is preferably used as the metal material because of its excellent thermal conductivity and electrical conductivity. Note that the first wiring 22a may include a dummy wiring that is not connected to the first electronic component 3. The dummy wiring contributes to heat radiation from the first electronic component 3. Similarly, the second wiring 22b may include a dummy wiring that is not connected to the second electronic component 4.

The thermally conductive layer 23a is a layer that is disposed between the above-described insulating layer 21a and insulating layer 21b and conducts heat along the surface direction of the substrate 2. Similarly, the thermally conductive layer 23b is a layer that is disposed between the above-described insulating layer 21b and insulating layer 21c and conducts heat along the surface direction of the substrate 2. Although not shown, each of these layers has an appropriately patterned shape in plan view, and increases the thermal conductivity in the planar direction of the substrate 2. Furthermore, since the thermally conductive layers 23a and 23b overlap in the thickness direction of the substrate 2, the thermal conductivity in the thickness direction of the substrate 2 is also increased. The heat conductive layers 23a and 23b of this embodiment have not only heat conductivity but also electrical conductivity. Further, a reference potential such as an installation potential is supplied to the thermally conductive layers 23a and 23b. For this reason, the heat conductive layers 23a and 23b are used, for example, as a ground. Each of the thermally conductive layers 23a and 23b is made of a metal material, for example, like the first wiring 22a and second wiring 22b described above. As a specific example of the metal material, copper, aluminum, or an alloy thereof is preferably used because of its excellent thermal conductivity. Note that the heat conductive layers 23a and 23b may be provided as necessary, and one or both of the heat conductive layers 23a and 23b may be omitted.

The protective film 24a is an insulating film made of a solder resist or the like and placed on the surface of the insulating layer 21a opposite to the insulating layer 21b so as to cover a part of the first wiring 22a. Here, the protective film 24a covers a wide range of the first wiring 22a while allowing connection between the first wiring 22a and the first electronic component 3 described above. Similarly, the protective film 24b is an insulating film made of a solder resist or the like disposed on the surface of the insulating layer 21c opposite to the insulating layer 21b so as to cover a part of the second wiring 22b. Here, the protective film 24b covers the second wiring 22b over a wide area while allowing the connection between the second wiring 22b and the second electronic component 4 described above.

Further, the base material 21 is provided with a plurality of through holes 25 and a plurality of through holes 26 as thermal vias that penetrate the base material 21 in the thickness direction. As shown in FIG. 2, each of the plurality of through holes 25 is located in a pair of first portions P1, which are portions of the substrate 2 that come into contact with the heat dissipation member 5. On the other hand, each of the plurality of through holes 26 is located in a second portion P2 of the substrate 2 that is closer to the first electronic component 3 and the second electronic component 4 than the first portion P1. Here, the distance L2 between the second portion P2 and the first electronic component 3 and the second electronic component 4 is smaller than the distance L1 between the first portion P1 and the first electronic component 3 and the second electronic component 4. It's also short. In FIG. 2, the number of through holes 25 and 26 is eight each. Note that the number, arrangement, etc. of the through holes 25 and 26 are not limited to the example shown in FIG. 2, and are arbitrary.

A metal film 27 is provided on the wall surface of each through hole 25 . Similarly, a metal film 28 is provided on the wall surface of each through hole 26 . Metal films 27 and 28 are connected to the aforementioned thermally conductive layers 23a and 23b, respectively. The constituent materials of the metal films 27 and 28 include, for example, copper, iron, aluminum, indium, tin, lead, silver, zinc, bismuth, and antimony, as well as the aforementioned thermally conductive layers 23a and 23b, respectively. Among these, one kind can be used alone or two or more kinds can be used in combination. Among these, copper, aluminum, or an alloy of any of these is preferably used as the metal material because of its excellent thermal conductivity. In addition, when the above-mentioned first wiring 22a and second wiring 22b have a dummy wiring, each of the metal films 27 and 28 may be connected to the dummy wiring.

A heat transfer body 29 is inserted into each of some (four in the example shown in FIG. 2) of the plurality of through holes 25 described above. The heat transfer body 29 is a heat transfer post that conducts heat in the thickness direction of the substrate 2. The heat transfer body 29 conducts the heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 described above to the heat radiating member 5 along a path H1 shown in FIG. Here, the heat transfer body 29 is in contact with the aforementioned metal film 27 and receives heat from the heat conductive layers 23a and 23b. The cross-sectional shape of the heat transfer body 29 may be the same as or different from the cross-sectional shape of the through hole 25. When a gap is formed between the heat transfer body 29 and the wall surface of the through hole 25, the gap may be filled with a filler having excellent thermal conductivity such as conductive grease or conductive filler. As the constituent material of the heat transfer body 29, for example, copper, aluminum, or an alloy of any of these is preferably used because of its excellent thermal conductivity.

Further, the screws 7 are inserted into each of the remaining (four in the example shown in FIG. 2) through holes 25. The screw 7 is a male screw for fixing the substrate 2 to the heat radiation member 5 by screwing. Further, the screw 7 conducts heat in the thickness direction of the substrate 2, similar to the heat transfer body 29 described above. When a gap is formed between the screw 7 and the wall surface of the through hole 25, the gap may be filled with a filler having excellent thermal conductivity such as conductive grease or conductive filler. The constituent material of the screw 7 is not particularly limited and various metal materials can be used, but it is preferable to use copper, aluminum, or an alloy of any of these materials because of its excellent thermal conductivity.

The heat conductive member 6 is inserted into each of the plurality of through holes 26 described above. Each of the plurality of heat conductive members 6 is a rod-shaped member that conducts heat in the thickness direction of the substrate 2. The heat conduction member 6 conducts the heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 described above to the heat radiation member 5 along a path H2 shown in FIG. Here, the thermal resistance of path H2 is smaller than the thermal resistance of path H1 described above. Therefore, the thermal resistance from the plurality of first electronic components 3 and the plurality of second electronic components 4 to the heat dissipation member 5 can be significantly reduced compared to the case where the plurality of heat conductive members 6 are not used. The heat conductive member 6 of this embodiment is in contact with the aforementioned metal film 28 and receives heat from the heat conductive layers 23a and 23b. Further, the heat conductive member 6 protrudes from the first surface F1 of the substrate 2 by a length L that is larger than the thickness T of the first electronic component 3. Therefore, the heat conductive member 6 and the heat radiating member 5 can be brought into contact without bringing the heat radiating member 5 and the first electronic component 3 into contact. In FIG. 2, the cross-sectional shape of the heat conductive member 6 is circular. Note that the cross-sectional shape of the heat conductive member 6 is not limited to the example shown in FIG. 2, and may be, for example, a polygon or an ellipse. Further, the cross-sectional shape of the heat conductive member 6 may be the same as or different from the cross-sectional shape of the through hole 26. When a gap is formed between the heat conductive member 6 and the wall surface of the through hole 26, the gap may be filled with a filler having excellent thermal conductivity such as conductive grease or conductive filler.

As the constituent material of the thermally conductive member 6, a material having a higher thermal conductivity than that of the material constituting the base material 21 of the substrate 2 described above is used. In particular, as the constituent material of the heat conductive member 6, it is preferable to use, for example, copper, aluminum, or an alloy of any of these, since it has excellent thermal conductivity.

In this embodiment, one end surface of the heat conductive member 6 contacts the heat radiating member 5. This contact thermally connects the heat conductive member 6 and the heat radiating member 5. Here, from the viewpoint of increasing the heat conduction efficiency between the heat conduction member 6 and the heat radiation member 5, it is preferable to make the contact area between the heat conduction member 6 and the heat radiation member 5 as large as possible. Further, from the same viewpoint, a filler having excellent thermal conductivity such as conductive grease or conductive filler may be interposed between the heat conductive member 6 and the heat radiating member 5.

The heat radiation member 5 is a heat sink. As shown in FIG. 3, the heat dissipation member 5 includes a main body 51, a plurality of fins 52, and a pair of spacers 53. These are composed of, for example, copper, aluminum or an alloy of any of these. The main body 51 has a flat plate shape. A plurality of fins 52 are provided on one surface of the main body 51. The shape, number, etc. of the plurality of fins 52 are not limited to the example shown in FIG. 3, and are arbitrary. The pair of spacers 53 define the distance between the main body 51 and the substrate 2 so as to prevent the first electronic component 3 from coming into contact with the heat dissipation member 5 . Here, the pair of spacers 53 are in contact across the first portion P1 of the substrate 2 described above. Note that the space S between the pair of spacers 53 can also be referred to as a recess provided in the heat radiating member 5. Further, instead of the pair of spacers 53, for example, a frame-shaped spacer may be used. The space S may be filled with a filler having excellent conductivity such as silicone resin.

The electronic component module 1 described above includes the substrate 2, a plurality of first electronic components 3, a plurality of second electronic components 4, a heat dissipation member 5, and a plurality of heat conduction members 6, as described above. The substrate 2 has a first surface F1 and a second surface F2 opposite to the first surface F1. Each of the plurality of first electronic components 3 is mounted on the first surface F1 and generates heat. Each of the plurality of second electronic components 4 overlaps a part or all of the first electronic component 3 when viewed from the thickness direction of the substrate 2, is mounted on the second surface F2, and generates heat. The heat radiating member 5 is connected to the first portion P1 of the substrate 2 and radiates heat from the plurality of first electronic components 3 and the plurality of second electronic components 4. Each of the plurality of heat conductive members 6 conducts heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 to the heat radiating member 5 . In particular, each of the plurality of heat conductive members 6 is connected to the second portion P2 of the substrate 2, which is closer to at least one of the first electronic component 3 and the second electronic component 4 than the first portion P1, and to the heat radiating member 5. Therefore, the thermal resistance from the plurality of first electronic components 3 and the plurality of second electronic components 4 to the heat dissipation member 5 can be significantly reduced compared to the case where the plurality of heat conductive members 6 are not used. As a result, the heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 can be efficiently radiated by the heat radiating member 5 compared to the case where the plurality of heat conductive members 6 are not used.

Here, as described above, the substrate 2 has the insulating base material 21. The heat conductive member 6 has higher thermal conductivity than the base material 21. Therefore, compared to the case where the thermal conductive member 6 has a lower thermal conductivity than the base material 21, the thermal conductive member 6 efficiently transfers heat from the plurality of first electronic components 3 and the plurality of second electronic components 4. can be conducted to

Further, the base material 21 is configured by laminating a plurality of insulating layers 21a, 21b, and 21c. The substrate 2 further includes thermally conductive layers 23a and 23b, which are arranged between the plurality of insulating layers 21a, 21b, and 21b, and are made of a material having higher thermal conductivity than the material constituting the base material 21. Thermal conductive member 6 is connected to thermally conductive layers 23a and 23b. Therefore, compared to the case where the heat conductive member 6 is not connected to the heat conductive layers 23a and 23b, the heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 can be efficiently transferred by the heat conductive member 6. Can be conducted.

Furthermore, the first portion P1 is provided with a plurality of through holes 25, which are thermal vias connected to the heat conductive layers 23a and 23b. Therefore, heat can be directly conducted from the substrate 2 to the heat radiating member 5 at the portion of the substrate 2 that comes into contact with the heat radiating member 5 .

Further, each of the thermally conductive layers 23a and 23b has electrical conductivity. A reference potential is supplied to the thermally conductive layers 23a and 23b. Therefore, the heat conductive layers 23a and 23b can be used as a ground, an electromagnetic shield, or the like.

Furthermore, a metal film 28 is disposed on the wall surface of the through hole 26 of the substrate 2 through which the heat conductive member 6 passes. Therefore, compared to the case where the metal film 28 is omitted, the thermal connection between the heat conductive layers 23a and 23b and the heat conductive member 6 can be stabilized.

Further, the distance L2 between the second portion P2 and the first electronic component 3 and the second electronic component 4 is relative to the insulation distance, which is the minimum distance required for insulation between the heat conductive member 6 and the first electronic component 3. It is preferable that it is within the range of 1.0 times or more and 2.0 times or less. When the distance L2 is within this range, the distance L2 can be shortened while maintaining insulation between the heat conductive member 6 and the first electronic component 3. Note that the distance L2 corresponds to "the distance between the heat conductive member 6 and the first electronic component 3" and "the distance between the heat conductive member 6 and the second electronic component 4."

2. Second Embodiment A second embodiment of the present invention will be described below. In the embodiments exemplified below, for elements whose actions and functions are similar to those in the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

FIG. 4 is a sectional view of an electronic component module 1A according to the second embodiment. An electronic component module 1A shown in FIG. 4 is the same as the electronic component module 1 of the first embodiment described above, except that it includes a heat radiating member 5A instead of the heat radiating member 5 of the first embodiment.

The heat dissipation member 5A includes a main body 51A, a plurality of fins 52, and a pair of spacers 53. The main body 51A has a flat plate shape, and a plurality of fins 52 are provided on one surface of the main body 51A, and a pair of spacers 53 are provided on the other surface of the main body 51A. A plurality of recesses 54 are provided on the one surface of the main body 51A of this embodiment, corresponding to the plurality of heat conductive members 6. A portion of the corresponding heat conductive member 6 is inserted into each of the plurality of recesses 54 .

The recess 54 has a shape that follows the part of the heat conductive member 6 . The recess 54 may have a shape that fits into the part of the heat conduction member 6, or may have a shape that has a gap between it and the part of the heat conduction member 6. Note that the gap may be filled with a filler having excellent thermal conductivity, such as conductive grease or conductive filler.

The second embodiment described above also provides the same effects as the first embodiment described above. Further, the heat dissipation member 5A is provided with a recess 54 into which a part of the heat conduction member 6 is inserted. Therefore, even without increasing the cross-sectional area of the heat conduction member 6, the contact area between the heat dissipation member 5A and the heat conduction member 6 can be increased compared to the case where the recess 54 is not provided. As a result, the thermal resistance between the heat dissipation member 5A and the heat conduction member 6 can be reduced compared to the case where the recess 54 is not provided. Note that the heat dissipation member 5A may be provided with a hole into which a part of the heat conduction member 6 is inserted instead of the recess 54.

3. Third Embodiment A third embodiment of the present invention will be described below. In the embodiments exemplified below, for elements whose actions and functions are similar to those in the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

FIG. 5 is a sectional view of an electronic component module 1B according to the third embodiment. The electronic component module 1B shown in FIG. 5 is the electronic component module of the first embodiment described above, except that it has a heat dissipation member 5B and a heat conduction member 6B instead of the heat dissipation member 5 and the heat conduction member 6 of the first embodiment. It is the same as 1.

The heat radiation member 5B includes a first heat radiation member 5a and a second heat radiation member 5b. The first heat radiating member 5a is arranged on the first electronic component 3 side with respect to the substrate 2. The first heat radiating member 5a in this embodiment is configured similarly to the heat radiating member 5A in the second embodiment described above. On the other hand, the second heat radiating member 5b is arranged on the second electronic component 4 side with respect to the substrate 2. The second heat radiating member 5b in this embodiment is configured similarly to the heat radiating member 5 in the first embodiment described above. The heat conductive member 6B penetrates the substrate 2 and protrudes in both the Z1 direction and the Z2 direction. The heat conducting member 6B is connected to both the first heat radiating member 5a and the second heat radiating member 5b. Therefore, compared to the case where either one of the first heat radiating member 5a and the second heat radiating member 5b is omitted, the heat from the plurality of first electronic components 3 and the plurality of second electronic components 4 is absorbed by the heat radiating member 5B. Heat can be dissipated efficiently.

4. Fourth Embodiment A fourth embodiment of the present invention will be described below. In the embodiments exemplified below, for elements whose actions and functions are similar to those in the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

FIG. 6 is a sectional view of an electronic component module 1C according to the fourth embodiment. The electronic component module 1C shown in FIG. 6 is the electronic component module of the first embodiment described above, except that it has a heat dissipation member 5C and a heat conduction member 6C instead of the heat dissipation member 5 and the heat conduction member 6 of the first embodiment. It is the same as 1.

The heat dissipation member 5C has a main body 51C, a plurality of fins 52, and a pair of spacers 53. The main body 51C has a flat plate shape, and a plurality of fins 52 are provided on one surface of the main body 51C, and a pair of spacers 53 are provided on the other surface of the main body 51C. A plurality of recesses 54C are provided on the one surface of the main body 51C of this embodiment, corresponding to the plurality of heat conductive members 6C. A portion of the corresponding heat conductive member 6 is inserted into each of the plurality of recesses 54C.

A female screw 55 is provided in the recess 54C of this embodiment. Further, the heat conduction member 6C is provided with a male screw 61 that fits into the female screw 55. Therefore, the substrate 2 can be fixed to the heat dissipation member 5C using the heat conduction member 6C. This fixation may be used in combination with the fixation using the screws 7 described above, or may be used in place of the fixation using the screws 7. Further, fluctuations in the contact area between the heat dissipation member 5C and the heat conduction member 6C due to external force or the like are reduced.

5. Modifications Each of the embodiments exemplified above can be modified in various ways. Specific modifications that can be applied to each of the above embodiments are illustrated below. Two or more aspects arbitrarily selected from the examples below may be combined as appropriate to the extent that they do not contradict each other.

For example, the number of through holes 26 in each of the above embodiments is not limited to eight, and may be seven or less, or nine or more. Further, the heat conductive member 6, 6B, or 6C may not be inserted into some of the through holes 26 among the plurality of through holes 26.

Further, in each of the above-described embodiments, a configuration is exemplified in which the thermally conductive member 6, 6B, or 6C penetrates the substrate 2, but the structure is not limited to this, and the thermally conductive member 6, 6B, or 6C is connected to the substrate 2 via a thermally conductive member that does not penetrate the substrate 2. The heat dissipating member 5, 5A, 5B, or 5C may be thermally connected. An example of this will be explained below based on FIG. 7.

FIG. 7 is a sectional view of an electronic component module 1D according to a modification. The electronic component module 1D shown in FIG. 7 is the same as that of the third embodiment described above, except that it has a plurality of heat conductive members 6D and a plurality of heat transfer bodies 30 instead of the plurality of heat conductive members 6B of the third embodiment described above. This is similar to the electronic component module 1B of the form. The plurality of heat transfer bodies 30 correspond to the plurality of through holes 26, and each heat transfer body 30 is inserted into the corresponding through hole 26 and is configured in the same manner as the heat transfer body 29 described above. That is, in this modification, a substrate 2D in which a plurality of heat transfer bodies 30 are added to the substrate 2 described above is used.

The heat conductive member 6D includes a first heat conductive member 6a and a second heat conductive member 6b. The first heat conductive member 6a is connected to the second portion P2 and the first heat radiating member 5a. On the other hand, the second heat conductive member 6b is connected to the second portion P2 and the second heat radiating member 5b. Each of the first heat conductive member 6a and the second heat conductive member 6b is configured similarly to the above-described heat conductive member 6, 6B, or 6C, except that they are not inserted into the through hole 26. In this embodiment, each of the first heat conductive member 6a and the second heat conductive member 6b is connected to the heat transfer body 30 described above. Here, a filler having excellent thermal conductivity such as conductive grease or conductive filler may be filled between the first heat conductive member 6a or the second heat conductive member 6b and the substrate 2D.

The modification shown in FIG. 7 described above also provides the same effects as the above-described embodiments. Note that the first heat conductive member 6a or the second heat conductive member 6b and the heat transfer body 30 may be configured integrally. Further, each of the first heat conductive member 6a and the second heat conductive member 6b may be connected to a portion of the substrate 2D other than the heat transfer body 30. In this case, the through hole 26 and the heat transfer body 30 can be omitted. Further, the portion of the substrate 2D that connects to the first heat conductive member 6a and the portion of the substrate 2D that connects to the second heat conductive member 6b may be at different positions in plan view. Furthermore, the first heat dissipation member 5a and the first heat conduction member 6a may be integrally constituted, or the second heat dissipation member 5b and the second heat conduction member 6b may be constituted integrally.

Further, the number of through holes 25 in each of the above embodiments is not limited to eight, and may be seven or less, or nine or more. Further, the through hole 25 may be omitted. In this case, for example, the substrate 2 and the heat radiating member 5 are bonded together using an adhesive or the like, or the positional relationship between the substrate 2 and the heat radiating member 5 is fixed using a fixing member such as a clip. However, by providing the through holes 25 in the substrate 2, there is an advantage that the thermal conductivity from the substrate 2 to the heat dissipation member 5 can be increased using the heat transfer body 29 or the screw 7 as described above. Fixing the substrate 2 and the heat dissipating member 5 using the screws 7 also has the advantage that it is easier to downsize and simplify the electronic component module 1 compared to using a fixing member such as a clip.

DESCRIPTION OF SYMBOLS 1... Electronic component module, 1A... Electronic component module, 1B... Electronic component module, 1C... Electronic component module, 1D... Electronic component module, 2... Board, 3... First electronic component, 4... Second electronic component, 5... Heat dissipation member, 5A... Heat dissipation member, 5B... Heat dissipation member, 5C... Heat dissipation member, 5a... First heat dissipation member, 5b... Second heat dissipation member, 6... Heat conduction member, 6a... First heat conduction member, 6b... Second Heat conduction member, 6B... Heat conduction member, 6C... Heat conduction member, 6D... Heat conduction member, 7... Screw, 21... Base material, 21a... Insulating layer, 21b... Insulating layer, 21c... Insulating layer, 23a... Heat conduction Layer, 23b...Heat conductive layer, 25...Through hole, 26...Through hole, 27...Metal film, 28...Metal film, 29...Heat conductor, 54...Recess, 54C...Recess, 55...Female screw, 61...Male Screw, F1...first surface, F2...second surface, H1...route, H2...route, L1...distance, L2...distance, P1...first part, P2...second part, T...thickness.

Claims (9)

a substrate having a first surface and a second surface opposite to the first surface;
a first electronic component that is mounted on the first surface and generates heat;
a second electronic component that overlaps part or all of the first electronic component when viewed from the thickness direction of the substrate, is mounted on the second surface, and generates heat;
a heat dissipation member connected to a first portion of the substrate;
a second portion of the substrate closer to at least one of the first electronic component and the second electronic component than the first portion; and a heat conductive member connected to the heat dissipation member;
The substrate is provided with a through hole into which the thermally conductive member is inserted,
The heat dissipation member is provided with a hole or a recess into which a part of the heat conduction member is inserted,
The hole or the recess is provided with a female thread,
The thermally conductive member is provided with a male screw that fits into the female screw.
Electronic component module. The substrate has an insulating base material,
The thermally conductive member has higher thermal conductivity than the base material.
The electronic component module according to claim 1 . The base material is constituted by laminating a plurality of insulating layers,
The substrate further includes a thermally conductive layer disposed between the plurality of insulating layers and made of a material having higher thermal conductivity than the material constituting the base material,
the thermally conductive member is connected to the thermally conductive layer;
The electronic component module according to claim 2 . The first portion is provided with a thermal via connected to the thermally conductive layer.
The electronic component module according to claim 3 . The thermally conductive layer has electrical conductivity,
A reference potential is supplied to the thermally conductive layer,
The electronic component module according to claim 3 or 4 . The heat dissipation member is
a first heat dissipation member disposed on the first electronic component side with respect to the substrate;
a second heat dissipation member disposed on the second electronic component side with respect to the substrate,
The heat conductive member is connected to both the first heat radiating member and the second heat radiating member.
The electronic component module according to any one of claims 1 to 5 . The heat dissipation member is
a first heat dissipation member disposed on the first electronic component side with respect to the substrate;
a second heat dissipation member disposed on the second electronic component side with respect to the substrate,
The thermally conductive member is
a first heat conductive member connected to the second portion and the first heat radiating member;
a second heat conductive member connected to the second portion and the second heat radiating member;
The electronic component module according to any one of claims 1 to 6 . A metal film is disposed on the wall surface of the through hole of the substrate through which the thermally conductive member passes.
The electronic component module according to any one of claims 1 to 7 . The distance between the heat conductive member and the first electronic component is at least 1.0 times the insulation distance, which is the minimum distance required for insulation between the heat conductive member and the first electronic component. is within the range of 0 times or less,
The distance between the heat conductive member and the second electronic component is at least 1.0 times the insulation distance, which is the minimum distance required for insulation between the heat conductive member and the second electronic component. Within the range of 0 times or less,
The electronic component module according to any one of claims 1 to 8 .

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