JP7400528B2 - IC card with self-diagnosis function and IC card self-diagnosis method - Google Patents

Description

The present invention relates to an IC card, which is a card medium mounted with an IC chip (semiconductor integrated circuit), and more particularly relates to self-diagnosis performed by the IC card.

IC cards, which are card media mounted with IC chips (semiconductor integrated circuits), are often placed in wallets or bags and handled in physically harsh environments, so the IC chips mounted on the IC cards may malfunction. There is a risk of doing so. Therefore, it has become common for IC cards to perform a self-diagnosis at startup to check the operation of the circuits integrated in the IC chip.

It is sufficient if all self-diagnosis can be completed when the IC card is started, but in recent years, IC cards have become more multifunctional, and the number of functions integrated into the IC chip and the memory capacity tend to increase. As the number of functions integrated into an IC chip increases, the time required for the IC chip's self-diagnosis also increases, so with IC cards that have startup time constraints, it may not be possible to complete all self-diagnosis processing at startup. be.

To solve this problem, the IC card disclosed in Patent Document 1 is designed to be able to perform self-diagnosis not only at startup but also while waiting to receive commands from a host device, in order to efficiently perform self-diagnosis. It is configured.

Japanese Patent Application Publication No. 2014-59731

On the other hand, in recent years, it has become common to implement multiple applications on a single IC card. Since the functions of IC chips used by applications differ depending on the application, it may be possible to reduce the time required for self-diagnosis if the content of self-diagnosis can be managed for each application.

Therefore, the present invention proposes an IC card and method that can manage the content of self-diagnosis for each application.

A first invention for solving the above-mentioned problems is activated upon receiving a command message of a select command used for selecting an application stored in NVM, and is activated when a command message of a select command used for selecting an application stored in NVM is received, and the application The present invention is characterized by comprising a self-diagnosis management module that self-diagnoses only the IC chip functions used by the application indicated by the select command by referring to a self-diagnosis management table in which IC chip functions used by the application are recorded for each application. This is an IC card.

A second invention for solving the above-mentioned problem is activated upon receiving a command message of a select command used for selecting an application stored in NVM, and is activated when a command message of a select command used for selecting an application stored in NVM is received, and the application The IC is equipped with a self-diagnosis management module in its memory that refers to a self-diagnosis management table in which the IC chip functions used by the application are recorded for each application, and self-diagnoses only the IC chip functions used by the application indicated by the select command. This is an IC chip for cards.

A third invention for solving the above-mentioned problems includes a step in which an IC card receives a command message of a select command used to select an application stored in NVM, and a step in which the IC card is used in common by all the applications. a step of self-diagnosing the IC chip functions used by the application indicated by the select command by referring to a self-diagnosis management table in which the IC chip functions used by the application other than the IC chip functions used by the application are recorded for each application; This is a self-diagnosis method for an IC card, which is characterized in that it is executed in sequence.

The present invention described above provides self-diagnosis management in which the IC chip functions used by applications are described for each application in addition to the IC chip functions commonly used by all applications, so that the contents of self-diagnosis can be managed for each application. Based on the table, it is configured to self-diagnose only the IC chip functions used by the application indicated by the select command.

FIG. 1 is a schematic configuration diagram of an IC card according to the present embodiment. A schematic configuration diagram of an IC chip. FIG. 3 is a diagram illustrating a self-diagnosis management table. FIG. 3 is a diagram illustrating the operation of a self-diagnosis management module.

From here, embodiments according to the present invention will be described. This embodiment is provided to facilitate understanding of the present invention, and the present invention is not limited to this embodiment. Further, unless otherwise specified, the drawings are schematic diagrams drawn to facilitate understanding of the present invention.

FIG. 1 is a schematic configuration diagram of an IC card 1 according to this embodiment, and FIG. 2 is a schematic configuration diagram of an IC chip 2. In FIG. 1, an IC card 1 according to the present embodiment is a dual interface card having two interfaces: contact and non-contact. The IC card 1 has a contact pad 211 used for contact communication mounted on its surface, and an antenna coil 212 used for non-contact communication mounted inside. In the IC card 1 illustrated in FIG. 1, the IC chip 2 included in the IC card 1 is mounted on the back surface of the contact pad 211.

As shown in FIG. 1, the IC card 1 includes an IC chip 2 serving as hardware, an operating system 3 that operates directly on the IC chip 2, and at least one operating system based on the operating system 3 (here, , two) applications 4.

Various functions are integrated into the IC chip 2 mounted on the IC card 1. As illustrated in FIG. 2, in this embodiment, the IC chip 2 has a CPU 200 (Central Processing Unit), which is a central processing unit, and a specific function other than the memory function used for data storage. A co-processor 204 (Co-processor), which has a function of performing cryptographic calculation processing, and a CRC calculation circuit (CRC) 206 (CRC), which has a function of performing calculation processing of error codes related to cyclic redundancy check, are connected to the bus 210. ing. Furthermore, the IC chip 2 has a UART 205 (Universal Asynchronous Receiver/Transmitter) that connects to the I/O terminal of the contact pad 211 and executes processing related to contact communication, and is connected to the antenna coil 212 as an IC chip function. An RFI (Radio Frequency Interface) 209 (RFI), which has a function of executing processing related to contactless communication, is connected to the bus 210 . Furthermore, the IC chip 2 has a random number generator 207 (RNG), which is a circuit that generates pseudo-random numbers, and a timer 208 (Timer), which is a circuit that measures time, as IC chip functions, and is connected to the bus 210. Connected.

Furthermore, in FIG. 2, the IC chip 2 has a ROM 201 (ROM: Read Only Memory), which is a memory that can only be read, and a RAM 202 (RAM: Random Access Memory), which is a volatile memory, as memory functions used for storing data. Memory) and NVM203 (NVM: Non-volatile memory), which is electrically rewritable non-volatile memory, are integrated. The RAM 202 stores data temporarily stored by the operating system 3 and applications 4. The ROM 201 stores program codes for the operating system 3 and the like. The NVM 203 stores data of the operating system 3 and program codes and data of the application 4.

The operating system 3 is a computer program that provides the basic functions of the IC card 1 and the functions used by the application 4 to the application 4. In this embodiment, the operating system 3 has two basic functions of the IC card 1: a select command 30, which is a command used to select an application 4, etc., and a select command, which is a computer program that performs self-diagnosis of the IC chip function. A diagnosis management module 31 (Self-Test Management Module) is provided.

The select command 30 is a command for starting the application 4 indicated by the command message of the select command 30. The operating system 3 has an application table 32 that shows applications 4 that can be selected by a select command 30, and this application table 32 includes at least an area of the NVM 203 that stores application identifiers (AIDs) and applications 4. It is listed every 4.

Generally, self-diagnosis regarding the IC chip functions of the IC chip 2 is executed when the IC card 1 is activated. However, when a plurality of applications 4 are installed on the IC card 1, the IC chip functions used by the applications 4 may differ for each application 4. The system is structured so that the content of implementation can be managed.

In order to manage the implementation content of self-diagnosis for each application 4, the self-diagnosis management module 31 according to the present embodiment has IC chip functions used by the application 4, in addition to the IC chip functions commonly used by all applications 4. A self-diagnosis management table 310 is provided for each application 4, and a function-specific diagnosis module 311 for performing self-diagnosis of the IC chip function is provided for each IC chip function.

FIG. 3 is a diagram illustrating the self-diagnosis management table 310. As illustrated in FIG. 3, the self-diagnosis management table 310 is a table in which IC chip functions used by the applications 4 are written for each application 4, other than the IC chip functions commonly used by all the applications 4. In FIG. 3, the row is application 4 and the column is IC chip function.

The IC chip functions corresponding to the columns of the self-diagnosis management table 310 are IC chip functions other than those commonly used by all applications 4. In the IC chip functions illustrated in FIG. 2, the CPU 200 and memory functions (ROM 201, RAM 202, NVM 203) are IC chip functions commonly used by all applications 4, so the self-diagnosis management table 310 illustrated in FIG. , no columns corresponding to these are provided.

In FIG. 3, "1" is assigned to the IC chip functions used by the application 4, and "0" is assigned to the IC chip functions not used by the application 4. For example, in the row corresponding to application 4A, the IC chip function corresponding to the column with "1" is the IC chip function used by application 4A. According to FIG. 3, the IC chip functions used by the application 4A that operates on contact are a timer 208 and a UART 205. Further, the IC chip functions used by the application 4B that operates without contact are a coprocessor 204, a CRC calculation circuit 206, an RFI 209, a random number generator 207, and a timer 208.

The functional diagnostic module 311 is a module that performs self-diagnosis in units of IC chip functions, and the content of self-diagnosis differs depending on the IC chip function. The functional diagnostic module 311 may be a hardware module dedicated to self-diagnosis, such as BIST (Built-In Self-Test), or a software module for self-diagnosing IC chip functions.

FIG. 4 is a diagram illustrating the operation of the self-diagnosis management module 31. The explanation with reference to FIG. 4 also serves as an explanation of the self-diagnosis method according to the invention.

When the operating system 3 of the IC card 1 receives the command message of the select command 30 for selecting the application 4 from the host device (step S1), the self-diagnosis management module 31 is activated (step S2).

The self-diagnosis management module 31 activated by the IC card 1 first self-diagnoses the area of the NVM 203 corresponding to the application 4 indicated by the select command 30 (step S3). The area of NVM 203 corresponding to application 4 is listed in the application table 32, and the error code stored in the area of NVM 203 corresponding to application 4 is used for this self-diagnosis. The reason why the area of the NVM 203 corresponding to the application 4 is self-diagnosed when the command message of the select command 30 is received is that the area of the NVM 203 corresponding to the application 4 is different for each application 4.

The self-diagnosis management module 31 checks the self-diagnosis result regarding the area of the NVM 203 corresponding to the application 4 indicated by the select command 30 (step S4). If this self-diagnosis result is abnormal, the self-diagnosis abnormality process (step S9) is performed without executing the function-specific self-diagnosis process (step S5) that is repeatedly executed for each IC chip function listed in the self-diagnosis management table 310. ) is executed, and the procedure in FIG. 4 ends.

If the self-diagnosis result regarding the area of the NVM 203 corresponding to the application 4 indicated by the select command 30 is normal, the self-diagnosis management module 31 repeatedly executes each IC chip function listed in the self-diagnosis management table 310. Functional self-diagnosis processing is executed (step S5).

In the function-specific self-diagnosis process (step S5), the self-diagnosis management module 31 determines whether the IC chip function targeted for the function-specific self-diagnosis process is the self-diagnosis target of the application 4 indicated by the select command 30. Confirm (step S6). This means that in the self-diagnosis management table 310, the value specified in the row corresponding to application 4 indicated by the select command 30 and the column corresponding to the IC chip function targeted for the self-diagnosis process by function is "1". You can check whether it is.

If the IC chip function that is the target of the functional self-diagnosis process is not the self-diagnostic target of the application 4 indicated by the select command 30, the self-diagnosis management module 31 selects the IC chip function that is the target of the functional self-diagnostic process. Ends self-diagnosis related to chip functions.

In FIG. 4 (step S6), if the IC check function that is the target of the function-specific self-diagnosis process is the self-diagnosis target of the application 4 indicated by the select command 30, the self-diagnosis management module 31 The functional diagnostic module 311 corresponding to the IC chip function to be subjected to separate self-diagnosis processing is activated to self-diagnose the IC chip function to be subjected to functional self-diagnosis processing (step S7).

Next, the self-diagnosis management module 31 checks the self-diagnosis result of the IC chip function executed by the functional diagnosis module 311 (step S8). If the self-diagnosis result is normal, the self-diagnosis management module 31 ends the self-diagnosis related to the IC chip function that is the target of the functional self-diagnosis process.

If the self-diagnosis result is abnormal, the self-diagnosis management module 31 performs the function-specific self-diagnosis process (S5), which is a loop process, regardless of whether or not there is an IC chip function that is not subject to the function-specific self-diagnosis process (S5) in the self-diagnosis management table 310. The self-diagnosis processing is exited, and the self-diagnosis abnormality processing (step S9) is executed, and the procedure of FIG. 4 ends. The content of the process when a self-diagnosis abnormality occurs is arbitrary. As a process when the self-diagnosis is abnormal, a response APDU of the select command 30 indicating an abnormality in the IC chip function may be returned, or the IC chip 2 may be transitioned to a state in which no further processing is executed.

When the self-diagnosis of the IC chip function that is the target of the function-specific self-diagnosis process is completed, the self-diagnosis management module 31 checks whether there is an IC chip function that is not the target of the function-specific self-diagnosis process in the self-diagnosis management table 310. , in some cases, one of the IC chip functions that has not been subjected to the functional self-diagnosis processing is made the next functional self-diagnosis processing target. Furthermore, if the self-diagnosis management table 310 does not include any IC chip functions that are not subject to the functional self-diagnosis processing, the functional self-diagnosis processing ends, and the procedure of FIG. 4 ends.

If the IC chip function used by the application 4 or the capacity of the application 4 is large, the time required for the processing illustrated in FIG. 4 may be longer than the response waiting time specified by the IC card 1 standard. However, by performing function-specific self-diagnosis processing when receiving the command message of the select command 30, even if the time required for the processing illustrated in FIG. 4 is longer than the response waiting time, the time extension request (for example, By using the S (WTX request) block defined in, for example, the process related to self-diagnosis can be completed.

Note that the IC chip functions commonly used by all applications 4 are self-diagnosed without referring to the self-diagnosis management table 310. For example, the CPU 200 and some of the memory functions (ROM 201 and RAM 202) may self-diagnose when the IC card 1 is started, rather than when the command message of the select command 30 is received.

Furthermore, the present invention can be applied to cards other than dual interface cards (for example, contact cards).

1 IC card 2 IC chip 3 Operating system 30 Select command 31 Self-diagnosis management module 310 Self-diagnosis management table 311 Diagnosis module by function 32 Application table 4 Application

Claims (3)

It is activated when a command message of a select command used to select an application stored in NVM is received, and the IC chip function used by the application is specified for each application, except for the IC chip function commonly used by all the applications. An IC card comprising: a self-diagnosis management module that self-diagnoses only the IC chip functions used by the application indicated by the select command by referring to the self-diagnosis management table described above. It is activated when a command message of a select command used to select an application stored in NVM is received, and the IC chip function used by the application is specified for each application, except for the IC chip function commonly used by all the applications. An IC chip for an IC card, in which a self-diagnosis management module is mounted in a memory, which self-diagnoses only the IC chip functions used by the application indicated by the select command by referring to the self-diagnosis management table described above. a step in which the IC card receives a command message of a select command used to select an application stored in NVM; The IC card is characterized in that it refers to a self-diagnosis management table in which the IC chip functions to be used are recorded for each application, and sequentially executes steps for self-diagnosing the IC chip functions used by the application indicated by the select command. Self-diagnosis method.

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