JP7417844B2 - Manufacturing method of electronic components - Google Patents

Description

The present invention relates to a method for manufacturing electronic components, and more specifically, a process of cutting a long green sheet formed on a carrier film to form a rectangular green sheet, and a process of cutting a rectangular green sheet onto a carrier film. The present invention relates to a method of manufacturing an electronic component, which includes a step of peeling off the film.

A method of manufacturing electronic components that has been widely practiced in the past is disclosed in Patent Document 1 (Japanese Unexamined Patent Publication No. 8-162364). The method for manufacturing electronic components disclosed in Patent Document 1 includes the steps of cutting a long green sheet formed on a carrier film to form a rectangular green sheet, and cutting the rectangular green sheet onto a carrier film. and a step of peeling it off. The method for manufacturing an electronic component disclosed in Patent Document 1 will be explained with reference to FIGS. 9(A) to 9(C).

First, as shown in FIG. 9A, a long carrier film (carrier tape) 102 having a long green sheet 101 formed on its main surface is placed between a punching table 103 and a transport unit 104. supply

The punching table 103 is formed with a ventilation hole (intake port) 103a for sucking the carrier film 102, and a heat source (electric heater) 103b for heating the punching table 103 itself.

A pair of cut blades (rectangular blades) 104a are formed on both sides of the transport unit 104. Further, the transport unit 104 has a ventilation hole (intake port) 104b formed on the bottom surface.

Next, as shown in FIG. 9(B), the transport unit 104 is lowered toward the punching table 103. As a result, the long green sheet 101 is cut by the cut blade 104a, and a rectangular green sheet 105 is formed on the carrier film 102.

Next, as shown in FIG. 9C, the punching table 103 is horizontally moved in a direction away from the transport unit 104 (to the left in FIG. 9C). As a result, the rectangular green sheet 105 that was sucked into the ventilation hole 104b and held on the bottom surface of the transport unit 104 is peeled off from the carrier film 102.

As described above, in the manufacturing method of Patent Document 1, the punching table 103 is heated by the heat source 103b. Several reasons can be considered for heating the punching table 103.

The first reason is that the binder of the green sheet 105 is softened by the heat of the punching table 103 to facilitate cutting.

The second reason is that the green sheets 105 can be heat-pressed well in the lamination process that will be performed later. That is, the green sheets 105 are laminated and heat-pressed to produce a laminate in a later lamination step. However, if the green sheets 105 remain at room temperature, there is a risk that the green sheets 105 to be stacked will absorb heat from the already stacked laminates in the stacking process, and the heat and pressure bonding will not be performed well. Therefore, in the method of Patent Document 1, the green sheet 105 is heated (preheated) by the punching table 103, and it is considered that the heat and pressure bonding in the lamination process is improved.

Japanese Patent Application Publication No. 8-162364

The electronic component manufacturing method disclosed in Patent Document 1 has the following problems.

First, in the manufacturing method disclosed in Patent Document 1, the rectangular green sheet 105 that is cut by the cut blade 104a of the transport unit 104 and held on the bottom surface of the transport unit 104 may be turned over, torn, wrinkled, etc. There was a problem that there was a possibility that This will be explained with reference to FIG. Note that FIG. 10 was created by the applicant for explanation purposes and is not described in Patent Document 1.

The transport unit 104 is made of metal. The ventilation hole 104b is usually formed in the transport unit 104 by mechanical processing. Therefore, in the transport unit 104, there is a limit to reducing the distance X between the cutting blade 104a and the ventilation hole 104b. For example, with currently commonly used mechanical processing techniques, it is difficult to reduce the distance X to less than 100 μm.

If the distance X between the cut blade 104a and the ventilation hole 104b is large, the tip P of the rectangular green sheet 105 held on the bottom surface of the transport unit 104 may be turned over from the bottom surface of the transport unit 104. there were. Alternatively, the leading end P of the green sheet 105 may be torn or the leading end P of the green sheet 105 may be wrinkled.

If the tip part P of the green sheet 105 is turned over, torn, wrinkled, etc., a lamination failure occurs in the subsequent process of laminating the green sheets 105 and heat-pressing them to produce a laminate, and the fabricated There were cases in which the laminate became a defective product.

Furthermore, the manufacturing method disclosed in Patent Document 1 has a problem in that the carrier film 102 may be damaged during the process.

That is, in the manufacturing method disclosed in Patent Document 1, as shown in FIGS. 9B and 9C, a carrier film 102 made of PET (polyethylene terephthalate) or the like is placed on a punching table heated by a heat source 103b. 103 for a certain long period of time. Therefore, the carrier film 102 may be damaged due to heat. For example, the carrier film 102 may be partially torn or torn over its entire width, making it impossible to convey the carrier film 102.

Furthermore, in the manufacturing method disclosed in Patent Document 1, wrinkles are generated in the carrier film 102 due to the heat of the heated punching table 103, and as a result, the green sheet 105 formed on the main surface of the carrier film 102 is wrinkled. There is a problem that wrinkles may occur on part or all of the surface. If wrinkles occur in the green sheets 105, lamination defects will occur during the subsequent process of laminating the green sheets 105 and heat-pressing them to produce a laminate, resulting in the produced laminate becoming a defective product. There was a case.

The present invention has been made in order to solve the above-mentioned conventional problems, and as a means thereof, a method for manufacturing an electronic component according to an embodiment of the present invention includes a method in which a conductive paste for internal electrodes is printed. A preparation step of preparing a long carrier film with a long green sheet formed on one main surface , and cutting the long green sheet to form a rectangular green sheet on the carrier film. A peeling process in which a rectangular green sheet is peeled from a carrier film by a peeling roller, and a peeling roller has the function of laminating rectangular green sheets. , a lamination step of laminating the layers on a lamination stage , and the peeling roller has ventilation holes formed on its surface and has a multi-chamber suction roller structure, and the peeling roller has a rectangular shape formed by the ventilation holes. The peeling roller is equipped with a suction function that suctions the green sheet and an exhaust function that releases the rectangular green sheet from the ventilation hole. The distance between the tip of the green sheet and the leading ventilation hole provided on the peeling roller is set to 10 μm or less, and the green sheet is sucked by the ventilation hole and peeled off from the carrier film as the peeling roller rotates, and the surface of the peeling roller is During the lamination process, the peeling roller exhausts air through the ventilation holes, and the rectangular green sheet is heated by the heat source .

According to the method for manufacturing an electronic component of the present invention, a rectangular green sheet can be successfully peeled off from a carrier film using a peeling roller.

FIG. 1 is a schematic diagram of main parts of an electronic component manufacturing apparatus 1000 used in an electronic component manufacturing method according to an embodiment. 3 is a cross-sectional view showing a peeling roller 4 of the electronic component manufacturing apparatus 1000. FIG. FIGS. 3A to 3C are front views showing a peeling process in the method for manufacturing an electronic component according to the first embodiment, respectively. FIGS. 4(A) to 4(C) are explanatory views showing the peeling process of the electronic component manufacturing method according to the first embodiment, respectively. FIGS. 5A to 5C are front views showing the lamination process of the method for manufacturing an electronic component according to the first embodiment, respectively. FIGS. 6(A) to 6(C) are explanatory diagrams showing the lamination process of the electronic component manufacturing method according to the first embodiment, respectively. FIGS. 7A to 7C are front views showing the peeling process of the electronic component manufacturing method according to the second embodiment, respectively. FIGS. 8(A) to 8(C) are explanatory diagrams each showing a peeling process in the method for manufacturing an electronic component according to the second embodiment. FIGS. 9A to 9C are cross-sectional views showing each step in the method for manufacturing an electronic component disclosed in Patent Document 1. FIG. 2 is an explanatory diagram for explaining the problems of the electronic component manufacturing method disclosed in Patent Document 1.

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated with drawing.

Note that each embodiment is an exemplary embodiment of the present invention, and the present invention is not limited to the content of the embodiment. Further, it is also possible to implement the contents described in different embodiments in combination, and the implementation contents in that case are also included in the present invention. In addition, the drawings are intended to aid understanding of the specification and may be drawn schematically, and the drawn components or the dimensional ratios between the components may be different from those described in the specification. The proportions of those dimensions may not match. In addition, there are cases where constituent elements described in the specification are omitted in the drawings or drawn with their numbers omitted.

[First embodiment]
FIG. 1 shows a schematic diagram of the main parts of an electronic component manufacturing apparatus 1000 used in the electronic component manufacturing method of this embodiment.

As will be described later, a long carrier film 5 having a long green sheet 6 formed on its main surface is supplied to the electronic component manufacturing apparatus 1000 and transported. During the conveyance of the carrier film 5, the long green sheet 6 is cut to form a rectangular green sheet 7 on the carrier film 5. Peeled off.

The electronic component manufacturing apparatus 1000 includes a first drive roller 1a and a second drive roller 1b on the conveyance path of the carrier film 5. The first drive roller 1a and the second drive roller 1b are for actively conveying the carrier film 5.

In this embodiment, suction rollers are used as the first drive roller 1a and the second drive roller 1b. That is, although not shown in the drawings, the first drive roller 1a and the second drive roller 1b have ventilation holes formed on their surfaces, and in the portions where the carrier film 5 is in contact with the first drive roller 1a and the second drive roller 1b, the carrier film 5 is Can be inhaled. The first drive roller 1a and the second drive roller 1b can convey the carrier film 5 by rotating while sucking the carrier film 5.

Note that the first drive roller 1a and the second drive roller 1b may include a nip roller or the like that sandwiches and conveys the carrier film 5 and the green sheet 6, or that sandwiches and conveys the carrier film 5, instead of the suction roller. May be used.

The first drive roller 1a and the second drive roller 1b are controlled to rotate synchronously. That is, when the first drive roller 1a and the second drive roller 1b have the same diameter, they rotate by the same amount at the same timing and convey the carrier film 5 with high precision.

The electronic component manufacturing apparatus 1000 is further provided with transport rollers 2a and 2b on the transport path of the carrier film 5. The conveyance rollers 2a, 2b are provided between the first drive roller 1a and the second drive roller 1b. The conveyance rollers 2a and 2b are provided when it is desired to change the conveyance direction of the carrier film 5 or when it is desired to apply tension to the carrier film 5.

In this embodiment, auxiliary drive rollers having a function of actively transporting the carrier film 5 are used as the transport rollers 2a and 2b. The conveyance rollers 2a and 2b rotate themselves in synchronization with the first drive roller 1a and the second drive roller 1b. Note that the conveyance rollers 2a and 2b may be rollers that passively rotate as the carrier film 5 is conveyed, instead of being auxiliary drive rollers.

The electronic component manufacturing apparatus 1000 includes a cutting area A1 and a peeling area A2 on the conveyance path of the carrier film 5. The cutting area A1 and the peeling area A2 are provided between the first drive roller 1a and the second drive roller 1b.

The cutting area A1 is an area where the long green sheet 6 is cut to form a rectangular green sheet 7 on the carrier film 5. In the cutting area A1, a pair of cutting blades 3a and 3b are provided at a predetermined interval.

The peeling area A2 is an area where the rectangular green sheet 7 is peeled from the carrier film 5. A peeling roller 4 is provided in the peeling area A2.

As shown in the cross-sectional view of FIG. 2, the peeling roller 4 of this embodiment has a plurality of ventilation holes 4a formed in approximately one third of the outer circumference. The ventilation holes 4a are each connected to a predetermined ventilation pipe provided on the peeling roller 4. In this embodiment, the ventilation holes 4a are provided in approximately 1/3 of the outer circumference of the peeling roller 4 to match the length of the rectangular green sheet 7. The width is arbitrary; for example, the ventilation holes 4a may be provided on approximately 1/2 of the outer periphery, or the ventilation holes 4a may be provided on the entire outer periphery. Note that although the ventilation holes 4a provided along the outer periphery of the peeling roller 4 are shown in FIG. 4, the ventilation holes 4a are also provided in the width direction of the peeling roller 4.

In this embodiment, the peeling roller 4 has a multi-chamber suction roller structure, and the state of the ventilation hole 4a is changed to a suction state, an exhaust state ( It can be in any state such as blowing state) or open to atmosphere state. Furthermore, the strength of the suction state and the exhaust state can be set for each region of the surface of the peeling roller 4.

The peeling roller 4 is provided with a heat source 4b for heating (preheating) the peeled green sheet 7. Although the type of heat source 4b is arbitrary, for example, a resistance heating method such as a cartridge heater or a plate heater, an induction heating method, a dielectric heating method, a heat pump method using a heating medium, etc. can be used.

The material of the peeling roller 4 is arbitrary, and for example, aluminum, carbon, SUS, etc. can be used. Although the diameter of the peeling roller 4 is arbitrary, it can be, for example, 50 mm or more and 1000 mm or less.

Below, a method for manufacturing an electronic component according to this embodiment, which is carried out using the electronic component manufacturing apparatus 1000, will be described. Although the type of electronic component to be manufactured is arbitrary, in this embodiment, a multilayer ceramic capacitor is manufactured as an example.

First, a carrier film 5 is prepared. Although the material of the carrier film 5 is arbitrary, for example, PET can be used. Furthermore, the length, width, thickness, and other dimensions of the carrier film 5 are arbitrary, and any desired dimensions can be used.

Next, dielectric ceramic powder, binder resin, solvent, etc. made of materials and particle sizes depending on the electronic component to be manufactured are prepared, and these are wet mixed to produce a ceramic slurry.

Next, a ceramic slurry is applied in a sheet form onto the carrier film 5 using a die coater, a gravure coater, a microgravure coater, etc., and is dried. Note that the thickness of the ceramic slurry to be applied is arbitrary, and is appropriately set depending on the desired thickness of the green sheet 6.

Through the above steps, a long carrier film 5 having a long green sheet 6 formed on one main surface is completed.

Next, if necessary, a conductive paste is printed in a desired pattern on the main surface of the long green sheet 6 in order to form internal electrodes.

Next, as shown in FIG. 1, the elongated carrier film 5 on which the elongated green sheet 6 is formed is sequentially supplied to the electronic component manufacturing apparatus 1000. In this embodiment, the carrier film 5 is supplied to a path passing through the first drive roller 1a, the cutting area A1, the peeling area A2, the conveyance roller 2a, the conveyance roller 2b, and the second drive roller 1b in this order. The carrier film 5 is controlled and conveyed with high precision by a first drive roller 1a, a second drive roller 1b, and conveyance rollers 2a and 2b, which are auxiliary drive rollers.

Next, the long green sheet 6 is cut into rectangular green sheets 7. Specifically, first, conveyance of the carrier film 5 is stopped. Next, in the cutting area A1, the cutting blades 3a and 3b are lowered to cut the long green sheet 6 into rectangular green sheets 7 of desired dimensions. At this time, the cut blades 3a and 3b cut only the green sheet 6 and do not cut the carrier film 5. As a result, a rectangular green sheet 7 is formed on the long carrier film 5.

Next, the carrier film 5 is intermittently conveyed, and the cut rectangular green sheet 7 is conveyed in the direction of the peeling area A2. Transport parts.

The above-described cutting of the long green sheet 6 into rectangular green sheets 7 and intermittent conveyance of the carrier film 5 are repeated in sequence.

Note that an unused portion (a rectangular portion) of the long green sheet 6 is placed on the carrier film 5 between the first cut rectangular green sheet 7 and the next cut rectangular green sheet 7. Although there may be cases where a portion (uncut as the green sheet 7) remains, illustration of such unused portion is omitted in FIG. 1 and the like.

Next, as shown in FIGS. 3(A) to 4(C) and 4(A) to (C), the rectangular green sheet 7 formed on the carrier film 5 is removed from the carrier film in the peeling area A2. Peel off from 5. Note that FIGS. 3(A) to 4(C) are front views, and FIGS. 4(A) to 4(C) are explanatory views. (B), FIG. 3(C), and FIG. 4(C) each show the same point in time. Note that FIGS. 4A to 4C show the states of the ventilation hole 4a of the peeling roller 4 (suction state, atmosphere open state, exhaust state).

First, as shown in FIGS. 3(A) and 4(A), a rectangular green sheet 7 is conveyed to the peeling area A2 by the carrier film 5, and its leading end contacts the lowest part of the peeling roller 4. At this point, the ventilation hole 4a of the peeling roller 4 is open to the atmosphere (or exhausted) and is not drawing suction.

Next, as shown in FIGS. 3(B) and 4(B), the rectangular green sheet 7 is further transported by the carrier film 5, and the peeling roller 4 is rotated in synchronization with this. At this time, when the ventilation hole 4a passes the lowest part of the peeling roller 4, it sequentially switches from the atmosphere open state (or exhaust state) to the suction state and sucks the rectangular green sheet 7. Then, as the peeling roller 4 rotates, the rectangular green sheet 7 is peeled off from the carrier film 5.

Next, as shown in FIGS. 3(C) and 4(C), the rectangular green sheet 7 is completely peeled off from the carrier film 5, and the rectangular green sheet 7 is held on the surface of the peeling roller 4. Ru.

In this embodiment, the rectangular green sheet 7 held on the surface of the peeling roller 4 is heated (preheated) by the heat source 4b of the peeling roller 4. Further, in this embodiment, the peeling roller 4 also serves as a lamination roller that laminates rectangular green sheets 7 in the next step, which is a lamination step. Therefore, when the rectangular green sheet 7 is held on the surface of the peeling roller 4, the carrier film 5 and the conveying roller 2a are temporarily moved from below the peeling roller 4 in order to secure a space for carrying out the lamination process. Retreat. Note that instead of retracting the carrier film 5 and the conveying roller 2a, the peeling roller 4 holding the rectangular green sheet 7 may be moved to another location.

Next, as shown in FIGS. 5(A) to 6(C) and 6(A) to (C), the rectangular green sheet 7 held by the peeling roller 4 which also serves as a laminating roller is placed on the laminating stage 8. are laminated to produce a laminate 9. 5(A) to 6(C) are front views, and FIGS. 6(A) to 6(C) are explanatory views. (B), FIG. 5(C), and FIG. 6(C) each show the same point in time. Note that FIGS. 6A to 6C show the states (suction state, atmosphere open state, and exhaust state) of the ventilation hole 4a of the peeling roller 4, which also serves as a lamination roller.

In this step, a lamination stage 8 is used. A heat source 8 a is provided inside the lamination stage 8 to heat the laminated body 9 .

First, as shown in FIGS. 5A and 6A, the lamination stage 8 is moved below the peeling roller 4, which also serves as a lamination roller, and holds the rectangular green sheet 7. In FIGS. 5(A) and 6(A), a plurality of rectangular green sheets 7 are already stacked on the stacking stage 8 and bonded under heat and pressure to form a laminate 9 that is in the process of being produced. However, when stacking the first layer of green sheets 7, the stack 9 (green sheets 7) is not present on the stacking stage 8.

At the bottom of the peeling roller 4, the tip of the green sheet 7 held by the peeling roller 4 and the tip of the green sheet 7 laminated on the top layer of the laminate 9 are aligned. At this point, the ventilation hole 4a of the peeling roller 4 is in a suction state, and the rectangular green sheet 7 is held by the peeling roller 4.

Next, as shown in FIGS. 5(B) and 6(B), the peeling roller 4, which also serves as a laminating roller, is rotated, and in synchronization with this, the laminating stage 8 is rotated in the same direction as the rotation (FIG. 5(B), (to the right in FIG. 6(B)). At this time, when the ventilation hole 4a passes the lowest part of the peeling roller 4, it sequentially switches from the suction state to the exhaust state (or the atmosphere open state). As a result, the green sheet 7 held by the peeling roller 4, which also serves as a lamination roller, is laminated on the top layer of the laminate 9 on the lamination stage 8 and bonded under heat and pressure.

At this time, since the rectangular green sheet 7 held by the peeling roller 4 which also serves as a lamination roller is heated (preheated) by the heat source 4b of the peeling roller 4, the green sheet 7 removes heat from the laminate 9. The green sheet 7 is successfully heat-pressed onto the uppermost layer of the laminate 9 without any problems.

Next, as shown in FIGS. 5(C) and 6(C), the rectangular green sheet 7 is completely heat-pressed onto the stacked body 9, and the stacking of the green sheets 7 is completed.

The above-described stacking of rectangular green sheets 7 is repeated a desired number of times to complete the stacked body 9.

Next, if necessary, the laminate 9 is divided into a plurality of individual pieces of unfired ceramic bodies.

Next, the unfired ceramic body is fired in a predetermined profile to produce a ceramic body. At this time, the conductive paste provided between the layers of the green sheet 7 is also fired, and internal electrodes are formed between the layers of the ceramic body.

Next, external electrodes are formed on the surface of the ceramic body to complete the electronic component (multilayer ceramic capacitor) according to this embodiment.

In the electronic component manufacturing method of this embodiment, since the rectangular green sheet 7 is peeled off from the carrier film 5 by the peeling roller 4, the rectangular green sheet 7 can be separated from the carrier film 5 very well. Can be peeled off.

That is, as shown in FIG. 10, in the conventional method of peeling a rectangular green sheet 105 using a conveying unit 104 whose bottom surface is flat, a cut blade 104a and a sheet formed on the conveying unit 104 by mechanical processing are used. Since the distance X from the green sheet 105 to the ventilation hole 104b is large, the leading end P of the green sheet 105 may be turned over from the bottom surface of the conveyance unit 104, torn, or wrinkled. In some cases, the laminate produced by laminating the green sheets 105 becomes a defective product.

On the other hand, in the present embodiment, the long green sheet 6 is cut into a rectangular green sheet 7 in the cutting area A1, and the carrier film 5 is conveyed by the first drive roller 1a and the second drive roller 1b. If the rotation of the peeling roller 4 in the peeling area A2 is synchronized and controlled at accurate timing, as shown in FIG. The distance Y between the air hole 4a and the air hole 4a can be made extremely small, for example, 10 μm or less.

In this embodiment, in the peeling area A2, the distance Y between the tip of the rectangular green sheet 7 and the leading ventilation hole 4a provided in the peeling roller 4 can be made extremely small. The tip end P of the peeling roller 4 will not be rolled up, torn, or wrinkled from the surface of the peeling roller 4. Therefore, the laminate does not become a defective product due to curling, tearing, wrinkles, etc. of the tip portion P of the green sheet 7.

Further, in this embodiment, each part of the carrier film 5 is in contact with the peeling roller 4 for a short time, and since the parts are in contact with the peeling roller 4 indirectly via the green sheet 7, the parts of the carrier film 5 are not provided on the peeling roller 4. The carrier film 5 will not be damaged by the heat from the heat source 4b. In addition, since wrinkles are not generated in the carrier film 5 due to the heat from the heat source 4b provided on the peeling roller 4, the green sheet formed on the carrier film 5 due to the wrinkles generated in the carrier film 5 is prevented. 7. No wrinkles occur. Therefore, the laminate does not become a defective product due to wrinkles generated in the green sheet 7.

[Second embodiment]
A method for manufacturing an electronic component according to a second embodiment will be implemented with some changes to the first embodiment. Specifically, in the first embodiment, the peeling roller 4 also served as a lamination roller. In the second embodiment, this is modified and a dedicated peeling roller 14 and a dedicated lamination roller 24 are used. Note that both the peeling roller 14 and the laminating roller 24 have a multi-chamber suction roller structure, and the state of the ventilation holes formed on the surface can be switched to a suction state, an atmosphere open state, an exhaust state, etc. .

7(A) to (C) and FIG. 8(A) to (C) show the peeling of the rectangular green sheet 7 by the peeling roller 14 and the peeling of the rectangular green sheet 7 from the peeling roller 14 to the lamination roller 24 in this embodiment. The delivery of the shaped green sheet 7 is shown. Note that FIGS. 7(A) to (C) are front views, and FIGS. 8(A) to (C) are explanatory views. (B), FIG. 7(C), and FIG. 8(C) each show the same point in time. Note that FIGS. 8A to 8C show the states (suction state, atmosphere open state, and exhaust state) of the ventilation holes formed on the surfaces of the peeling roller 14 and the lamination roller 24.

First, the long green sheet 6 is cut into rectangular green sheets 7 using the same method as in the first embodiment.

Next, as shown in FIGS. 7A and 8A, the rectangular green sheet 7 is peeled off from the carrier film 5 using a dedicated peeling roller 14 in the same manner as in the first embodiment. The peeled rectangular green sheet 7 is held on the surface of the peeling roller 14. At this time, the ventilation holes of the peeling roller 14 are in a suction state.

Next, as shown in FIGS. 7(B) and 8(B), the peeling roller 14 and the laminating roller 24 are synchronized and rotated in opposite directions to remove the rectangular shape held on the surface of the peeling roller 14. The green sheet 7 is delivered to the surface of the lamination roller 24. More specifically, when the ventilation holes formed on the surface of the peeling roller 14 pass over the top of the peeling roller 14, they sequentially switch from a suction state to an exhaust state (or an atmosphere open state). On the other hand, when the ventilation holes formed on the surface of the laminating roller 24 pass the lowest part of the laminating roller 24, they sequentially switch from the atmosphere open state (or exhaust state) to the suction state. As a result, the rectangular green sheets 7 held on the surface of the peeling roller 14 are sequentially delivered to the surface of the lamination roller 24.

Next, as shown in FIGS. 7(C) and 8(C), when the transfer of the rectangular green sheet 7 from the peeling roller 14 to the laminating roller 24 is completed, the carrier film 5, the conveying roller 2a, and the peeling roller 14 temporarily retreats from under the laminating roller 24. Note that instead of retreating the carrier film 5, the conveying roller 2a, and the peeling roller 14, the laminating roller 24 holding the rectangular green sheet 7 may be moved to another location.

Next, the rectangular green sheets 7 held on the surface of the laminating roller 24 are laminated by the laminating roller 24 in the same manner as in the first embodiment, and the laminated body 9 is produced by heat-pressing.

The following steps are the same as in the first embodiment.

The method for manufacturing an electronic component according to the first embodiment and the method for manufacturing an electronic component according to the second embodiment have been described above. However, the present invention is not limited to the content described above, and various changes can be made in accordance with the spirit of the invention.

For example, in the above embodiment, a multilayer ceramic capacitor was manufactured as an electronic component, but the type of electronic component to be manufactured is arbitrary, and other types of electronic components such as a multilayer ceramic thermistor, a multilayer ceramic inductor, a multilayer ceramic composite component, etc. It may be.

In addition, in the above embodiment, the ventilation hole 4a was formed in approximately 1/3 of the outer circumference of the peeling roller 4 (or 14), but the area in which the ventilation hole 4a is provided can be of any size, for example. , the ventilation holes 4a may be provided on approximately 1/2 of the outer periphery, or the ventilation holes 4a may be provided on the entire outer periphery.

Further, in the above embodiment, the peeling rollers 4 and 14 have a multi-chamber suction roller structure, but this structure is not essential.

Further, in the second embodiment, the rectangular green sheet 7 was directly transferred from the peeling roller 14 to the laminating roller 24, but between the peeling roller 14 and the laminating roller 24, one or more A holding roller may be interposed, and the rectangular green sheet 7 may be transferred from the peeling roller 14 to the lamination roller 24 with the holding roller interposed.

A method for manufacturing an electronic component according to an embodiment of the present invention is as described in the column of "Means for Solving the Problems."

In this method for manufacturing electronic components, ventilation holes are formed on the surface of the peeling roller, and in the peeling process, the rectangular green sheet is sucked by the ventilation holes and peeled off from the carrier film as the peeling roller rotates. It may also be held on the surface of a roller. In this case, the rectangular green sheet is reliably peeled off from the carrier film.

Alternatively, the peeling roller may be provided with a heat source, and the rectangular green sheet may be heated by the heat source. In this case, in the lamination process, the newly laminated rectangular green sheet does not absorb heat from the previously laminated laminate, and the rectangular green sheet becomes the topmost layer of the laminate. Good heat and pressure bonding.

In addition, the peeling roller has a multi-chamber suction roller structure, and has a suction function that suctions the rectangular green sheet through the ventilation hole, and an exhaust function or atmosphere release function that releases the rectangular green sheet from the ventilation hole. It may be something like that. In this case, the peeling roller can effectively peel off the rectangular green sheet, hold it, transfer it to another roller, and stack it into a laminate.

Further, the cutting step is performed in the cutting region, the peeling step is performed in the peeling region, and the carrier film is conveyed in a direction from the cutting region to the peeling region, and is placed in front of the cutting region and behind the peeling region, respectively. , a drive roller is provided for transporting the carrier film, and the drive roller may be a suction roller or a nip roller. In this case, the carrier film can be conveyed with high precision by the drive roller.

Furthermore, at least one conveyance roller is provided between the drive roller in front of the cutting area and the drive roller behind the peeling area, and at least one of the conveyance rollers is an auxiliary drive roller that actively conveys the carrier film. It may be. In this case, the carrier film can be transported with even higher accuracy.

Further, the diameter of the peeling roller may be 50 mm or more and 1000 mm or less. In this case, the rectangular green sheet can be easily peeled off from the carrier film. Furthermore, it becomes easy to align the tip of the rectangular green sheet to be peeled with the ventilation holes formed in the peeling roller.

Moreover, after the peeling process, a lamination process of laminating rectangular green sheets may be provided. In this case, electronic components can be manufactured with high productivity using a series of process lines.

Further, the peeling roller may also have the function of laminating rectangular green sheets, and the laminating step may be performed using the peeling roller. In this case, the step of transferring the rectangular green sheet from the peeling roller to the laminating roller or the like can be omitted, so electronic components can be manufactured with high productivity.

The lamination step may also be carried out using a lamination roller, such that the rectangular green sheet is transferred from the peeling roller to the lamination roller either directly or via at least one holding roller. You may also do so. In this case, the rectangular green sheets can be stacked with high precision by the stacking roller.

In addition, at least one of the laminating roller and the holding roller has a ventilation hole and a multi-chamber suction roller structure, and has a suction function that sucks the rectangular green sheet through the ventilation hole, and an exhaust function that releases the rectangular green sheet from the ventilation hole. It may also be equipped with a function or an atmosphere opening function. In this case, the rectangular green sheet can be transferred favorably between the peeling roller and the laminating roller, between the peeling roller and the holding roller, and between the holding roller and the laminating roller.

1a...First drive roller 1b...Second drive rollers 2a, 2b...Conveyance rollers 3a, 3b...Cut blade 4...Peeling roller (also serves as a lamination roller)
4a... Vent hole 4b... Heat source 5... Carrier film 6... Long green sheet 7... Rectangular green sheet 8... Lamination stage 8a... Heat source 9... - Laminated body 14...Peeling roller 24...Lamination roller A1...Cutting area A2...Peeling area

Claims (5)

a preparation step of preparing a long carrier film having a long green sheet printed with a conductive paste for internal electrodes formed on one main surface ;
a cutting step of cutting the long green sheet to form a rectangular green sheet on the carrier film;
a peeling step of peeling the rectangular green sheet from the carrier film with a peeling roller;
The method for manufacturing an electronic component includes a laminating step in which the peeling roller has a function of laminating the rectangular green sheets, and the peeling roller laminates the rectangular green sheets on a lamination stage. hand,
The peeling roller has ventilation holes formed on its surface and has a multi-chamber suction roller structure, and has a suction function that sucks the rectangular green sheet through the ventilation hole, and a suction function that sucks the rectangular green sheet from the ventilation hole. Equipped with an exhaust function that opens the
The peeling roller is provided with a heat source,
In the peeling step,
The rectangular green sheet is
The distance between the tip of the rectangular green sheet and the leading ventilation hole provided in the peeling roller is set to 10 μm or less, and the green sheet is suctioned by the ventilation hole,
Peeled from the carrier film as the peeling roller rotates,
held on the surface of the peeling roller and heated by the heat source;
In the lamination step,
The peeling roller performs exhaust from the ventilation hole,
In the method of manufacturing an electronic component , the rectangular green sheet is heated by the heat source . the cutting step is performed in a cutting region;
the stripping step is performed in a stripping region;
The carrier film is conveyed in a direction from the cutting area to the peeling area,
Drive rollers for transporting the carrier film are provided in front of the cutting area and behind the peeling area, respectively,
The method for manufacturing an electronic component according to claim 1 , wherein the drive roller is a suction roller or a nip roller. at least one transport roller is provided between the drive roller before the cutting area and the drive roller after the peeling area;
The method for manufacturing an electronic component according to claim 2 , wherein at least one of the conveyance rollers is an auxiliary drive roller that actively conveys the carrier film. The method for manufacturing an electronic component according to any one of claims 1 to 3 , wherein the peeling roller has a diameter of 50 mm or more and 1000 mm or less. The method for manufacturing an electronic component according to any one of claims 1 to 4 , wherein the electronic component to be manufactured is a multilayer ceramic capacitor.

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