JP7419981B2 - Manufacturing method of sensor device and sensor device - Google Patents

Description

The present invention relates to a method of manufacturing a sensor device and a sensor device.

Conventionally, a sensor device is known that includes a sensor that measures a physical quantity to be detected, a board on which the sensor is mounted, and an inner case that houses the board (for example, see Patent Document 1).

JP2019-74365A

Incidentally, in this type of sensor device, the outer case may be formed by molding the outside of the inner case. In this case, the inner case is placed in a mold and molten resin is injection molded, but the inner case is deformed by the resin pressure during injection molding, and there is a risk that the substrate or sensor may be damaged.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a sensor device and a sensor device that can suppress damage to a substrate and a sensor due to resin pressure during molding of an outer case.

In order to solve the above-mentioned problems, the present invention provides an inner case made of resin that includes a sensor that measures a physical quantity to be detected, a board on which the sensor is mounted, and a board rest on which the board is placed. and an outer case formed by molding a resin so as to cover the substrate and the inner case, the manufacturing method of a sensor device comprising: a molded outer case made of resin so as to cover the substrate and the inner case, A method of manufacturing a sensor device is provided, in which the outer case is formed by molding a resin while placing a part of the mold.

Further, in order to solve the above problems, the present invention provides a sensor made of resin that has a sensor that measures a physical quantity to be detected, a board on which the sensor is mounted, and a board rest on which the board is placed. an inner case, and an outer case formed by molding a resin so as to cover the substrate and the inner case, and a surface of the substrate opposite to the substrate mounting portion and an inner surface of the outer case, Sensor devices are provided that are directly opposed via a hollow part.

According to the present invention, it is possible to provide a method for manufacturing a sensor device and a sensor device that can suppress damage to a substrate and a sensor due to resin pressure during molding of an outer case.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a sensor device according to an embodiment of the present invention, in which (a) is a perspective view showing the external appearance, and (b) is a perspective view with a lid omitted. (a) and (b) are perspective views of the sensor device with an outer case omitted. It is a figure explaining a detected unit. FIG. 3 is an exploded perspective view of FIG. 2; FIG. 3 is an exploded perspective view of FIG. 2; (a), (b) is a figure explaining the manufacturing method of a sensor device. It is a figure explaining the manufacturing method of a sensor device. It is a figure which shows the sensor device based on other embodiment of this invention, (a) is a perspective view which shows an external appearance, (b) is a perspective view which abbreviate|omits a lid part. (a) and (b) are perspective views showing a lower divided inner case and a board. (a) is a perspective view of a substrate platform, and (b) is a perspective view of a substrate placed on the substrate platform. It is a top view of FIG.8(b). (a) is a figure explaining the manufacturing method of a sensor device, (b) is a perspective view of a slide mold.

[Embodiment]
Embodiments of the present invention will be described below with reference to the accompanying drawings.

(Overall configuration of sensor device)
FIG. 1 is a diagram showing a sensor device according to the present embodiment, in which (a) is a perspective view showing the external appearance, and (b) is a perspective view with a lid omitted. FIGS. 2(a) and 2(b) are perspective views of the sensor device with the outer case omitted. FIG. 3 is a diagram illustrating a detected unit. 4 and 5 are exploded perspective views of FIG. 2. Although the case where the sensor device of the present invention is used for torque detection will be described below as an example, the use of the sensor device is not limited to this.

As shown in FIGS. 1 to 5, the sensor device 1 includes a magnetic detection element 2 as a sensor for measuring a physical quantity to be detected, a substrate 3 on which the magnetic detection element 2 is mounted, and a substrate mount on which the substrate 3 is mounted. An inner case 4 made of resin and having a mounting portion 42, an outer case 5 made of resin molded to cover the substrate 3 and the inner case 4, and a pair of magnetism collecting rings 6 integrally provided on the inner case 4. 7.

In the sensor device 1, a through hole 8 is formed so as to pass through the inner case 4 and the outer case 5, and a shaft (not shown) whose torque is to be detected and a detected unit 10 (not shown) are inserted into the through hole 8. 3) are placed. The shaft is, for example, an automobile steering shaft.

The detected unit 10 includes a ring-shaped permanent magnet 11 and first and second yokes 12 and 13 that form a magnetic path for the magnetic force generated by the permanent magnet 11. The permanent magnet 11 has a plurality of magnetic poles having different magnetic properties formed along the circumferential direction around the rotation axis O thereof. Hereinafter, for convenience of explanation, the direction parallel to the rotational axis O will be simply referred to as the axial direction. The permanent magnet is connected to the input shaft of the shaft and rotates together with the input shaft.

The first and second yokes 12 and 13 are arranged around the outer periphery of the permanent magnet 11 with a predetermined gap, and are held by a holding member (not shown) made of resin or the like. The first and second yokes 12 and 13 are connected to the output shaft of the shaft and rotate together with the output shaft. The input shaft and output shaft of the shaft are connected via a torsion bar. The first and second yokes 12 and 13 integrally include annular portions 12a and 13a formed in an annular shape and a plurality of tooth portions 12b and 13b that protrude in the axial direction from the annular portion 12a. There is. The first and second yokes 12 and 13 are provided facing each other in the axial direction, with the teeth 12b of the first yoke 12 facing the second yoke 13, and the teeth 13b of the second yoke 13 facing the first yoke 13. It is provided so as to protrude toward the yoke 12 side. The tooth portions 12b and 13b of the first and second yokes 12 and 13 are provided alternately and at equal intervals in the circumferential direction, and when no torque is input to the shaft, the N and S poles of the permanent magnet 11 are connected to each other. (a position where the area of the teeth 12b, 13b facing the north pole is equal to the area facing the south pole).

In the detected unit 10, when the torsion bar that connects the input shaft and the output shaft of the shaft is twisted, the relative positional relationship between the permanent magnet 11 and the first and second yokes 12, 13 changes, and the teeth In the portions 12b and 13b, the ratio of the area facing the north pole to the area facing the south pole changes, and the strength of the magnetic field between the first and second yokes 12 and 13 changes. The sensor device 1 detects the torque input to the input shaft by detecting a change in the strength of the magnetic field with the magnetic detection element 2 via the magnetic collecting rings 6 and 7. Note that the permanent magnet 11 corresponds to the detection target in the present invention, and the first and second yokes are detected based on the positional relationship between the permanent magnet 11 and the first and second yokes 12 and 13 (or based on the torque input to the input shaft). The strength of the magnetic field between the two yokes 12 and 13 corresponds to the "physical quantity to be detected" in the present invention.

(Description of magnetic detection element 2 and substrate 3)
The magnetic detection element 2 is, for example, a Hall IC that detects the strength of a magnetic field using the Hall effect. In this embodiment, two magnetic detection elements 2 are provided for redundancy.

A plurality of electronic components including two magnetic detection elements 2 are mounted on the substrate 3. Two notches 31 are formed at the end of the substrate 3 on the ring portion 41 side, and the magnetic detection elements 2 are mounted so as to straddle the two notches 31, respectively. The board 3 also has a plurality of connection holes 32 to which a plurality of terminals 91 are electrically connected, and a plurality of connection holes 32 for positioning the board 3 by accommodating a plurality of protrusions 421 provided on the board mounting part 42. A through hole 33 is formed. The connection hole 32 and the through hole 33 are formed to penetrate the substrate 3 in the thickness direction.

(Description of inner case 4)
The inner case 4 is made of resin, and includes an annular ring part 41 into which the detected unit 10 including the permanent magnet 11 is inserted, and a board mounting part provided so as to protrude outward in the radial direction from the ring part 41. It has a section 42. A hollow portion located at the center of the ring portion 41 serves as a through hole 8 in which the detected unit 10 is placed.

Moreover, the inner case 4 is divided into two parts in the axial direction. One (upper side in FIG. 4) of the inner case 4 divided into two parts is referred to as an upper divided inner case 4a, and the other (lower side in FIG. 4) inner case 4 is referred to as a lower divided inner case 4b. Hereinafter, for convenience of explanation, the upper divided inner case 4a side in the axial direction will be referred to as upper side, and the lower divided inner case 4b side will be referred to as lower side.

The substrate mounting part 42 is formed in a substantially rectangular parallelepiped shape, and is formed in the lower divided inner case 4b, which is one of the two divided inner cases 4, so as to protrude outward in the radial direction from the ring part 41. ing. Note that the board mounting portion 42 is not formed in the upper divided inner case 4a. A connector 9 having a plurality of terminals 91 and a support body 90 that supports the plurality of terminals 91 is attached to the end of the substrate mounting portion 42 on the opposite side from the ring portion 41 . The support body 90 is provided so as to protrude downward from the lower surface of the substrate platform 42 . The terminal 91 is provided to penetrate the support body 90 and the substrate platform 42 , and both ends thereof protrude below the support body 90 and above the substrate platform 42 . The connector 9 is provided integrally with the board mounting portion 42 by, for example, insert molding.

Further, the substrate mounting section 42 is provided with a plurality of projections 421 that protrude upward, and the substrate 3 is placed on the substrate mounting section 42 while inserting the projections 421 into the through holes 33 of the substrate 3. In this manner, the substrate 3 is positioned with respect to the substrate mounting section 42. Further, the substrate 3 is fixed to the substrate mounting portion 42 by performing heat crimping to heat and deform the tip portions of some of the plurality of projections 421 to form the large diameter portions 421a. The substrate mounting portion 42 is formed to have a sufficient thickness so as not to be deformed by resin pressure during molding of the outer case 5.

A plurality of fitting protrusions 41a projecting downward are formed on the lower surface of the ring portion 41 of the upper divided inner case 4a, and fitting protrusions 41a are formed on the upper surface of the ring portion 41 of the lower divided inner case 4b. A plurality of fitting holes 41b are formed. By fitting the fitting projections 41a into the corresponding fitting holes 41b, the upper divided inner case 4a and the lower divided inner case 4b are fixed to each other.

Magnetic collecting rings 6 and 7 are integrally provided in the upper divided inner case 4a and the lower divided inner case 4b, respectively, by insert molding or the like. The magnetic flux collecting rings 6 and 7 include annular portions 61 and 71 provided in a substantially annular shape (C-shaped when viewed in the axial direction) along the inner circumferential surface of the ring portion 41, and annular portions 61 and 71 provided radially outward from the annular portions 61 and 71. It has protruding portions 62 and 72 provided so as to protrude. The annular portions 61 and 71 are provided so as to face the first and second yokes 12 and 13 in the radial direction when the detected unit 10 is placed in the through hole 8.

In this embodiment, the magnetic flux collecting rings 6 and 7 have two protrusions 62 and 72 corresponding to the two magnetic detection elements 2. The two protruding portions 62 and 72 are provided so as to protrude toward the board mounting portion 42 side, and when both the split inner cases 4a and 4b are integrated, the protruding portions of both magnetic flux collecting rings 6 and 7 The magnetic detection element 2 is sandwiched between the upper and lower portions 62 and 72, respectively. When the two divided inner cases 4a and 4b are integrated, a part or the whole of the protruding portion 62 of the magnetic flux collecting ring 6 provided on the upper divided inner case 4a is accommodated in the notch 31 of the substrate 3. Ru.

Although details will be described later, in this embodiment, by molding the resin while placing a part of the mold (slide mold 100) so as to cover the substrate 3 placed on the substrate placement part 42, An outer case 5 is formed. At this time, a contact portion 411 against which the tip of the mold abuts is formed on the outer circumferential surface of the ring portion 41 of the upper divided inner case 4a. The contact portion 411 is formed in a planar shape perpendicular to the radial direction (the sliding direction of the slide mold 100). In addition, since the mold is also abutted against an end surface 422 of the substrate mounting section 42 on the opposite side to the ring section 41, this end surface 422 is also formed into a planar shape perpendicular to the radial direction (the sliding direction of the mold). has been done. Note that a pin-shaped protrusion may be provided on the distal end surface of the slide mold 100, and a hole that fits this protrusion may be provided on the contact portion 411 side (not shown). This allows the slide mold 100 and the contact portion 411 to fit together, making positioning and holding possible during insert molding.

As described above, in this embodiment, the inner case 4 is divided into two in the axial direction, and the magnetic flux collecting rings 6 and 7 are integrally provided in both divided inner cases 4a and 4b. After the substrate 3 is placed on the inner case 42, the two divided inner cases 4a and 4b are integrated. With such a configuration, the magnetic detection element 2 can be placed between the protrusions 62 and 72 of the pair of magnetic flux collecting rings 6 and 7 before the outer case 5 is formed. Note that, for example, in order to suppress damage to the magnetic detection element 2 and the substrate 3 during the formation of the outer case 5, it is conceivable to place the substrate 3 after the formation of the outer case 5. However, in this case, when inserting the magnetic sensing element 2 between the protrusions 62 and 72 of the magnetic collecting rings 6 and 7, the board 3 interferes with the terminal 91 of the connector 9, causing the magnetic sensing element 2 to collect. It becomes difficult to arrange the magnetic rings 6, 7 between the protruding portions 62, 72. Therefore, for example, a part of one magnetic flux collecting ring 6 near the protruding part 62 is divided and formed as a separate member, and after the board 3 is placed on the board mounting part 42, the separate member is attached to detect the magnetic field. It is necessary to sandwich the element 2 between the protrusions 62 and 72, which may complicate the assembly process and increase the number of parts. In this embodiment, although the details will be described later, a resin is molded while a part of the mold (slide mold 100) is placed so as to cover the substrate 3 placed on the substrate placement part 42, thereby forming an outer layer. Since the case 5 is formed, it is possible to prevent the magnetic detection element 2 and the substrate 3 from being damaged during the formation of the outer case 5. Therefore, the substrate 3, magnetic flux collecting rings 6, 7, and connector 9 can be assembled in advance, and the outer case 5 can be molded to cover the periphery thereof. Further, according to the present embodiment, the magnetic detection element 2 can be placed between the protrusions 62 and 72 by simply integrating the divided inner cases 4a and 4b after placing the board 3 on the board placement part 42. Therefore, the assembly process is easy and an increase in the number of parts can be suppressed.

(Description of outer case 5)
The outer case 5 includes a main body part 51 provided to cover the substrate 3 and the inner case 4, and a lid part 52 provided to cover an opening after removing a part of the mold (slide mold 100), which will be described later. It has .

The main body portion 51 includes a cylindrical portion 511 having a through hole 8 into which the detected unit 10 is inserted, and a flange portion 512 that protrudes radially outward from a position facing the cylindrical portion 511 across the central axis thereof. , a board accommodating part 513 provided to cover the board 3 and the board mounting part 42 , and a connector accommodating part 514 provided to protrude downward from the board accommodating part 513 and covering the periphery of the connector 9 are integrated. has. A bolt hole 512a for bolt fixing is formed in the flange portion 512. Furthermore, in order to suppress creep deformation of the flange portion 512 when bolted, a cylindrical metal collar 512b is provided along the inner peripheral surface of the bolt hole 512a. The lid portion 52 is provided so as to close an opening formed at the end of the substrate accommodating portion 513 on the opposite side to the cylindrical portion 511 . The lid portion 52 is provided integrally with the main body portion 51 by, for example, laser welding.

In the sensor device 1 according to the present embodiment, the surface of the substrate 3 opposite to the substrate mounting section 42 and the inner surface of the outer case 5 (the inner surface of the substrate accommodating section 513) are directly opposed to each other via the hollow section 5a. are doing. That is, other members such as the inner case 4 are not disposed between the surface of the substrate 3 and the inner surface of the outer case 5 (the inner surface of the substrate accommodating portion 513). The hollow part 5a between the substrate 3 and the outer case 5 is a space in which a part of the mold (slide mold 100) is placed when molding the outer case 5, and by removing the mold, the hollow part 5a will be formed.

(Method for manufacturing sensor device 1)
When manufacturing the sensor device 1, first, prepare the upper divided inner case 4a in which the magnetic flux collecting ring 6 is integrally provided by insert molding or the like, and then integrally integrate the magnetic flux collecting ring 7 and the connector 9 by insert molding or the like. A preparation process is performed in which the provided lower divided inner case 4b is prepared, and the board 3 on which electronic components including the magnetic detection element 2 are mounted is prepared.

After the preparation step, a substrate mounting step is performed in which the substrate 3 is placed on the substrate mounting portion 42 of the lower divided inner case 4b. At this time, the substrate 3 is positioned on the substrate mounting section 42 by inserting the protrusion 421 into the through hole 33 of the substrate 3 and placing the substrate 3 on the substrate mounting section 42 . After that, the substrate 3 is fixed to the substrate mounting part 42 by heating and deforming the tips of some of the plurality of protrusions 421 and performing thermal crimping to form the large diameter part 421a. Further, the terminals 91 of the connector 9 are inserted into the connection holes 32, and the terminals 91 are electrically connected to the substrate 3 by soldering or the like. Note that, before soldering to the terminal 91, it is preferable to first thermally tighten the second protrusion 421c. Since the position of the board 3 is fixed before soldering, the load applied during soldering can be suppressed.

After the substrate mounting step, an inner case assembly step is performed to integrate the two divided inner cases 4a and 4b. At this time, the fitting projections 41a of the upper divided inner case 4a are fitted into the fitting holes 41b of the lower divided inner case 4b, thereby integrating the two divided inner cases 4a and 4b. Thereby, the magnetic detection element 2 is arranged between the protrusions 62 and 72 of the pair of magnetic flux collecting rings 6 and 7.

After the inner case assembly process, an outer case forming process for forming the outer case 5 is performed. In the outer case molding step, the substrate 3 and the inner case 4 are placed in a mold, and the outer case 5 is formed by pouring molten resin into the mold.

In the method for manufacturing a sensor device according to the present embodiment, as shown in FIGS. 6(a) and 6(b), in the outer case forming process, a metal plate is placed so as to cover the substrate 3 placed on the substrate mounting section 42. Outer case 5 is formed by molding resin while placing a part of the mold (hereinafter referred to as slide mold 100).

The slide mold 100 is provided so as to be slidable along the radial direction of the ring portion 41 (the direction in which the substrate mounting portion 42 projects with respect to the ring portion 41). A notch 101 is formed at the tip of the slide mold 100 so as to avoid the substrate placement part 42 when the slide mold 100 is slid forward (toward the ring part 41 side). In addition, a recess 102a for avoiding the substrate 3 placed on the substrate mounting part 42 is provided on the lower surface 102 (the surface on the substrate mounting part 42 side, the surface above the notch 101) at the tip of the slide mold 100. is formed to be concave upward. The recess 102a is formed to open downward and forward (toward the substrate placement part 42 and the ring part 41) so that the substrate 3 can be accommodated in the recess 102a when the slide mold 100 is slid forward. ing. A pair of pillar portions 102b are formed on the bottom surface of the recess 102a and project downward from the bottom surface.

When forming the outer case 5, the slide mold 100 is advanced forward (towards the ring portion 41). At this time, the distal end surface of the slide mold 100 (the front end surface in the sliding direction, the end surface on the ring part 51 side) is brought into contact with the contact part 411 provided on the ring part 41 of the inner case 4, and the recess 102a The lower surface 102 of the peripheral edge (the edge portion of the lower surface 102 where the recess 102a is not formed) is brought into contact with the upper surface of the substrate mounting part 42 of the peripheral edge of the substrate 3 (see FIG. 6(b)). Further, at this time, the step surface at the rear of the notch 101 also comes into contact with the end surface 422 of the substrate mounting section 42 . Furthermore, in this embodiment, when the slide mold 100 is advanced forward and the substrate 3 is accommodated in the recess 102a, the end surface (lower surface) of the column 102b formed on the bottom surface of the recess 102a is formed by heat crimping. The large diameter portion 421a (or the tip of the protrusion 421) is configured to come into contact with the large diameter portion 421a (or the tip of the protrusion 421). Here, the two large diameter portions 421a are configured to abut on each of the pair of pillar portions 102b, but a pillar portion 102b may be provided for each large diameter portion 421a. Further, a column portion 102b may be further formed to abut the protrusion 421 that does not form the large diameter portion 421a. This makes it possible for the slide mold 100 to receive the force exerted on the substrate mounting part 42 by the resin pressure during molding of the outer case 5 via the protrusion 421 (large diameter part 421a). It is possible to suppress deformation due to resin pressure, and to suppress damage to the substrate 3 and the magnetic detection element 2 due to deformation of the substrate mounting portion 42.

By molding the resin in this state, the main body portion 51 of the outer case 5 is formed as shown in FIG. After forming the main body portion 51, the slide mold 100 is removed while sliding (retracted). Then, as shown in FIG. 1(b), the end portion of the substrate accommodating portion 513 is in an open state. At this time, a hollow part 5a, which is a space from which the slide mold 100 is removed, is formed between the surface of the substrate 3 and the inner surface of the outer case 5, and the outer case 5 and the substrate 3 are connected to each other via the hollow part 5a. They will be directly facing each other.

After forming the main body part 51 of the outer case 5, a lid part 52 is provided so as to close the opening from which the slide mold 100 was removed, and the lid part 52 is integrated with the main body part 51 of the outer case 5 by laser welding or the like. Through the above steps, the sensor device 1 shown in FIG. 1(a) is obtained.

(Actions and effects of embodiments)
As explained above, in the method for manufacturing a sensor device according to the present embodiment, a part of the mold (slide mold 100) is arranged so as to cover the substrate 3 placed on the substrate placement part 42, and The outer case 5 is formed by molding resin.

This allows part of the mold (slide mold 100) to receive the resin pressure during molding of the outer case 5, making it possible to suppress damage to the substrate 3 and magnetic sensing element 2 due to resin pressure. become.

(Other embodiments)
Next, another embodiment of the present invention will be described. FIG. 8 is a diagram showing a sensor device 1a according to another embodiment of the present invention, in which (a) is a perspective view showing the external appearance, and (b) is a perspective view with the lid portion 52 omitted. 9A and 9B are perspective views showing the lower divided inner case 4b and the board 3. FIG. FIG. 10A is a perspective view of the substrate platform 42, and FIG. 10B is a perspective view of the substrate 3 placed on the substrate platform 42.

As shown in FIGS. 8 to 10, the sensor device 1a has basically the same configuration as the sensor device 1 described in FIGS. The differences are in the fixing structure of the board 3, the arrangement of electronic components on the board 3, and that the lid part 52 of the outer case 5 is provided at an angle. Furthermore, although the details will be described later, the shape of the slide mold 100 used for manufacturing the sensor device 1a is different, and the procedure for manufacturing the sensor device 1a is also different. These differences will be explained in detail below.

In the following explanation, the protruding direction of the substrate mounting part 42 with respect to the ring part 41 (the radial direction of the ring part 41) is referred to as the length direction, and the ring part 41 side in the length direction is the proximal end, and the opposite side to the ring part 41 is the proximal end. The side is called the tip side. Further, the direction perpendicular to the length direction and the up-down direction (the axial direction of the ring portion 41) is referred to as the width direction.

First, the shape of the substrate platform 42 and the structure for fixing the substrate 3 in the substrate platform 42 will be described. A connector 9 having eight terminals 91 is integrally provided at the center in the width direction at the tip of the board rest 42 . The terminals 91 are arranged in two rows in the length direction, and in each row, four terminals 91 are arranged in alignment in the width direction. A pedestal portion 423 that contacts the bottom surface of the board 3 and supports the board 3 is provided so as to sandwich the connector 9 in the width direction. Similarly, pedestals 424 that come into contact with the bottom surface of the substrate 3 and support the substrate 3 are also provided at both widthwise ends of the base end portion of the substrate platform 42 . The pedestals 423 and 424 are formed in a rectangular shape when viewed from above, and are formed so that the surfaces thereof are flat.

Six protrusions 421 that protrude upward are formed on the substrate platform 42 . The six protrusions 421 include four first protrusions 421b for positioning the substrate 3 and a pair (two) of second protrusions 421c for thermally tightening the substrate 3. Both the first protrusion 421b and the second protrusion 421c are formed in a cylindrical shape.

In order to stably fix the substrate 3 by heat crimping, the pair of second protrusions 421c are provided to protrude upward from the center of the pedestal portion 423. The distal end portion of the second protrusion 421c is crushed by heat crimping to form a large diameter portion 421a (see FIG. 8(b)). By sandwiching the substrate 3 between the large diameter portion 421a and the pedestal portion 423, it becomes possible to stably fix the substrate 3 to the substrate mounting portion 42. Note that since the tip portion is crushed by heat crimping, the protrusion length of the second protrusion 421c is longer than the protrusion length of the first protrusion 421b.

In this embodiment, the board 3 is fixed to the board rest 42 by heat-stamping only the pair of second protrusions 421c provided to sandwich the eight terminals 91 in the width direction. . Although the details will be described later, in this embodiment, the terminals 91 are soldered and the second protrusions 421c are heat-soldered after the outer case 5 is formed. 421c on the tip side of the board mounting part 42, the terminal 91 can be easily soldered and the second protrusion 421c can be thermally tightened through the opening after removing the slide mold 100. .

The first protrusion 421b positions the substrate 3 on the substrate platform 42 by restricting movement of the substrate 3 in the width direction and length direction. The first protrusion 421b is fitted into the through hole 33 of the substrate 3. The clearance between the first protrusion 421b and the through hole 33 is set as small as possible, thereby improving the positioning accuracy of the substrate 3. Further, by providing the first protrusions 421b at a plurality of locations, rotation of the substrate 3 is prevented.

Three first protrusions 421b are formed in the vicinity of the connector 9 so as to be aligned in the width direction. In order to suppress positional displacement during soldering and heat crimping, it is desirable that the three first protrusions 421b be provided as close to the connector 9 and the second protrusions 421c as possible. Further, one first protrusion 421b is formed at a position shifted toward the base end side from the three first protrusions 421b. This one first protrusion 421b is for suppressing the displacement of the base end side of the substrate 3, and is located at a position shifted toward the base end side from the central part in the length direction of the substrate mounting part 42. It is provided at the center in the width direction.

Further, the tip of the first protrusion 421b is brought into contact with the lower surface of the slide mold 100 when the outer case 5 is formed. As a result, the first protrusion 421b is supported by the slide mold 100 during the formation of the outer case 5, and deformation of the substrate mounting portion 42 due to resin pressure during the formation of the outer case 5 is suppressed. Therefore, the first protrusion 421b is provided so as to protrude slightly above the surface of the substrate 3 when the substrate 3 is placed on the substrate mounting section 42. Further, the tip of the first protrusion 421b is chamfered (or rounded) so that the first protrusion 421b does not get caught when the slide mold 100 slides. In this embodiment, the tip of the second protrusion 421c is also configured to abut against the slide mold 100, and is configured to further suppress deformation of the substrate mounting portion 42 due to resin pressure when forming the outer case 5. are doing.

Further, as shown in FIG. 10(b), a downwardly recessed recess 425 is formed at the tip of the substrate mounting section 42 and at the center in the width direction. When placed on the portion 42, the gap below the substrate 3 can be seen through the recess 425. As a result, when fixing the terminal 91 with solder, it can be easily checked whether the solder has passed through the connection hole 32 and reached the bottom of the board 3, and the terminal 91 can be reliably fixed to the board 3 with solder. It becomes possible.

Rib-shaped guide protrusions 426 that protrude upward are formed at both ends in the width direction of the substrate platform 42 so as to extend along the length direction. This guide protrusion 426 serves to guide the sliding movement of the slide mold 100, which will be described later.

Further, in this embodiment, the electronic component 34 is mounted on the lower surface (back surface) of the board 3 (see FIG. 9(b)), and the electronic component 34 is not mounted on the upper surface (front surface) of the board 3. This is a contrivance to prevent the slide mold 100 from interfering with the electronic component 34.

Furthermore, in this embodiment, the lid part 52 of the outer case 5 is provided so as to be inclined so that the higher it is, the closer it is to the base end side (the ring part 41 side). In other words, in a state in which the slide mold 100 is removed after molding the outer case 5 (a state before the lid portion 52 is provided), the outer case 5 at the periphery of the opening from which the slide mold 100 has been removed has a proximal end toward the top. (ring part 41 side).

As a result, as shown in FIG. 11, the front ends of the substrate 3 and the substrate mounting section 42 are opened upward. As a result, the terminal 91 and the second protrusion 421c are exposed, and the terminal 91 can be easily soldered and the second protrusion 421c can be thermally tightened.

Next, the method for manufacturing the sensor device 1a and the shape of the slide mold 100 used will be described. FIG. 12(a) is a diagram illustrating a method of manufacturing the sensor device 1a, and FIG. 12(b) is a perspective view of the slide mold 100.

After a preparation process of preparing each component such as the board 3, a board mounting process of placing the board 3 on the board mounting section 42 is performed. At this time, each protrusion 421 is inserted into the corresponding through hole 33 of the substrate 3, and the terminal 91 is inserted into the connection hole 32. By fitting the first protrusion 421b into the through hole 33, the substrate 3 is positioned with respect to the substrate mounting section 42. Note that, at this time, soldering of the terminal 91 and heat tightening of the second protrusion 421c are not performed.

After the substrate mounting step, an inner case assembly step is performed to integrate the two divided inner cases 4a and 4b. Thereby, the magnetic detection element 2 is arranged between the protrusions 62 and 72 of the pair of magnetic flux collecting rings 6 and 7.

After the inner case assembly process, an outer case forming process for forming the outer case 5 is performed. In the outer case molding step, the substrate 3 and the inner case 4 are placed in a mold, and the outer case 5 is formed by pouring molten resin into the mold.

As shown in FIGS. 12(a) and 12(b), a slide mold 100 used in the outer case molding process has guide grooves 103 formed on both sides of its lower surface, and a substrate mounting portion is formed in this guide groove 103. The slide mold 100 can be slid with the 42 guide protrusions 426 accommodated. A terminal avoidance groove 104 for avoiding interference with the terminal 91 and a pair of protrusion avoidance grooves 105 for avoiding interference with the pair of second protrusions 421c are formed on the lower surface of the slide mold 100. . The terminal avoidance groove 104 is divided into two in the width direction, and is provided between the terminal avoidance grooves 104 and between the terminal avoidance groove 104 and the protrusion avoidance groove 105, and protrudes downward to contact the tip of the first protrusion 421b. A support protrusion 106 that contacts and supports is formed.

When the slide mold 100 is slid toward the ring portion 41 along the guide protrusion 426, the tip of the first protrusion 421b comes into contact with the end surface of the support protrusion 106 of the slide mold 100. Further, the tip of the second protrusion 421c abuts the upper bottom of the protrusion avoidance groove 105. That is, when the slide mold 100 is advanced toward the ring part 41 side, the slide mold 100 is moved to the tips of the first and second protrusions 421b and 421c and the edges of the substrate mounting part 42 (the edges on both sides in the width direction). and the edge on the tip side). By molding the outer case 5 in this state, the slide mold 100 supports the tips of the first and second protrusions 421b and 421c and the edge of the substrate mounting part 42, and by this support, Deformation of the substrate mounting portion 42 due to resin pressure during formation of the outer case 5 is suppressed. In this embodiment, since the first protrusion 421b protrudes higher than the substrate 3, even if the substrate mounting part 42 is pressed against the slide mold 100 side by the resin pressure, the pressing force is The load is applied to the first and second protrusions 421b and 421c, and the load is less likely to be applied to the substrate 3. Therefore, it is possible to suppress damage to the substrate 3 due to resin pressure and improve yield. The main body portion 51 of the outer case 5 is formed by performing resin molding with the slide mold 100 advanced toward the ring portion 41 side.

After forming the main body portion 51 of the outer case 5, the slide mold 100 is removed by sliding it backward, and the terminals 91 are soldered and the second projections 421c are heat-stamped. In this embodiment, the tips of the board 3 and the board mounting part 42 are opened upward, and the terminals 91 and the second protrusions 421c are exposed. 421c can be easily heated. After heat-stamping the second protrusion 421c, the terminal 91 was soldered.

Thereafter, after forming the main body part 51, a lid part 52 is provided so as to close the opening from which the slide mold 100 was removed, and the lid part 52 is integrated with the main body part 51 of the outer case 5 by laser welding or the like. Through the above steps, the sensor device 1a shown in FIG. 8(a) is obtained.

In this embodiment, after the outer case 5 is formed, the terminals 91 are soldered and the second protrusions 421c are heat-stamped. That is, when the outer case 5 is molded, the substrate 3 is not fixed to the terminal 91 or the second protrusion 421c. Therefore, even if the resin pressure during molding of the outer case 5 is applied to the substrate 3, the substrate 3 can absorb the applied resin pressure. In addition, by supporting the protrusion 421 with the slide mold 100, deformation of the substrate mounting portion 42 due to resin pressure during molding of the outer case 5 can be suppressed, so that no load is applied to the substrate 3. As a result, it becomes possible to suppress deformation of the board 3 and damage to the soldered portion.

(Summary of embodiments)
Next, technical ideas understood from the embodiments described above will be described using reference numerals and the like in the embodiments. However, each reference numeral in the following description does not limit the constituent elements in the claims to those specifically shown in the embodiments.

[1] A resin having a sensor (2) that measures a physical quantity to be detected, a substrate (3) on which the sensor (2) is mounted, and a substrate placement part (42) on which the substrate (3) is placed. A method for manufacturing a sensor device (1) comprising: an inner case (4) made of a synthetic resin, and an outer case (5) formed by molding a resin so as to cover the substrate (3) and the inner case (4). The outer case (5) is molded by placing a part of the mold (100) so as to cover the substrate (3) placed on the substrate placement part (42) and molding the resin. A method of manufacturing a sensor device.

[2] The sensor (2) is a magnetic detection element, and the inner case (4) has an annular ring portion (41) into which a detected unit (10) including an annular permanent magnet (11) is inserted. and is divided into two parts in the axial direction, and one of the two parts, the inner case (4b), has the substrate mounting part (4b) so as to protrude outward in the radial direction from the ring part (41). 42) are formed, and each of the two divided inner cases (4a, 4b) has an annular part (61, 71) provided along the inner peripheral surface of the ring part (41), and an annular part (61, 71) provided along the inner peripheral surface of the ring part (41). A step of integrally providing magnetic flux collecting rings (6, 7) having protruding portions (62, 72) provided so as to protrude radially outward from the portions (61, 71); ) by placing the substrate (3) on which the sensor (2) is mounted, and integrating the inner case (4a, 4b) divided into two, the pair of magnetic flux collecting rings ( 6, 7) of arranging the sensor (2) between the protruding parts (62, 72); forming the outer case (5) by molding a resin so as to cover the substrate (3) and the inner case (4) while arranging a part (100) of the 1].The method for manufacturing the sensor device according to item 1.

[3] The part (100) of the mold has a lower surface (102), which is a surface on the substrate resting part (42) side of the distal end thereof, on the substrate resting part (42) side and the ring part. It has a concave part (102a) having an opening on the (41) side and for accommodating the substrate (3), and the end face of the ring part (41) side of the part (101) of the mold is connected to the inner The ring portion (41) of the case (4) is brought into contact with the lower surface (102) on the periphery of the recess (102a), and the lower surface (102) on the periphery of the substrate (3) is brought into contact with the substrate mounting portion (42) on the periphery of the substrate (3). The method for manufacturing a sensor device according to [2], wherein the outer case (5) is formed by molding resin in a state in which they are in contact with each other.

[4] The method for manufacturing a sensor device according to [3], further comprising a step of sliding and removing a portion of the mold (100) after forming the outer case (5).

[5] After forming the outer case (5), a lid part (52) is provided so as to close the opening where the part (100) of the mold has been removed, and the lid part (52) is attached to the outer case (5). ) The method for manufacturing a sensor device according to any one of [1] to [4], further comprising a step of integrating the sensor device with the sensor device.

[6] When forming the outer case (5), the protrusion (421) formed on the substrate mounting part (42) is fitted into the through hole (33) of the substrate (3), so that the outer case (5) is formed. The substrate (3) is positioned relative to the substrate rest (42), and after forming the outer case (5) and removing a portion (100) of the mold, one of the protrusions (421) is positioned. According to any one of [1] to [5], the substrate (3) is fixed to the substrate mounting part (42) by performing thermal crimping to heat and deform the tip of the part. A method for manufacturing a sensor device.

[7] The board mounting part (42) is provided with a connector (9) having a terminal (91) protruding from the surface on which the board (3) is mounted, and the connector (9) is formed on the board (3). The outer case (5) is formed with the terminal (91) inserted into the connection hole (32) for connecting the terminal (91), which is formed, and the outer case (5) is formed. The method for manufacturing a sensor device according to [6], wherein the terminal (91) is soldered to the substrate (3) after removing a part (100) of the mold.

[8] The part (100) of the mold comes into contact with the tip of the protrusion (421) and the edge of the substrate placement part (42), and the part (100) of the mold contacts the tip of the protrusion (421) and the edge of the substrate placement part (42). The substrate mounting portion (42) is configured to support the edge thereof, and this support suppresses deformation of the substrate mounting portion (42) due to resin pressure during formation of the outer case (5). The method for manufacturing a sensor device according to [6] or [7], comprising:

[9] A resin having a sensor (2) that measures a physical quantity to be detected, a substrate (3) on which the sensor (2) is mounted, and a substrate placement part (42) on which the substrate (3) is placed. and an outer case (5) molded with resin so as to cover the substrate (3) and the inner case (4), A sensor device (1) in which a surface opposite to the mounting portion (42) and an inner surface of the outer case (5) directly face each other via a hollow portion (5a).

[10] The substrate (3) is configured such that the protrusion (421) formed on the substrate platform (42) is fitted into the through hole (33) of the substrate (3), and the protrusion (421) The substrate (3) is fixed to the substrate resting part (42) by heating and deforming the tip of a part of the substrate (3). A connector (9) having a terminal (91) protruding from the side on which the A terminal (91) is inserted and fixed, and by heat-stamping only the pair of protrusions (421c) provided to sandwich the terminal (91), the board (3) is mounted on the board. The sensor device (1a) according to [9], which is fixed to the mounting section (42).

Although the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. Furthermore, it should be noted that not all combinations of features described in the embodiments are essential for solving the problems of the invention. Moreover, the present invention can be implemented with appropriate modifications within a range that does not depart from the spirit thereof.

1...Sensor device 2...Magnetic detection element (sensor)
3... Board 4... Inner case 4a... Upper split inner case 4b... Lower split inner case 5... Outer case 5a... Hollow part 6, 7... Magnetism collecting ring 41... Ring part 42... Board mounting part 100... Slide mold (Part of the mold)

Claims (8)

A sensor that measures a physical quantity to be detected;
a board on which the sensor is mounted;
an inner case made of resin having a substrate placement part on which the substrate is placed;
A method for manufacturing a sensor device, comprising: an outer case formed by molding a resin to cover the substrate and the inner case,
forming the outer case by molding a resin while arranging a part of the mold so as to cover the substrate placed on the substrate mounting part ;
The sensor is a magnetic detection element,
The inner case has an annular ring portion into which a detected unit including an annular permanent magnet is inserted, and is divided into two parts in the axial direction, and the ring part is attached to one of the two divided inner case parts. the substrate mounting portion is formed to protrude radially outward from the substrate mounting portion;
A magnetism collecting ring having an annular portion provided along the inner circumferential surface of the ring portion, and a protruding portion provided so as to protrude radially outward from the annular portion, in each of the two divided inner cases. a step of providing the
placing the substrate on which the sensor is mounted on the substrate mounting section;
arranging the sensor between the protruding portions of the pair of magnetic flux collecting rings by integrating the inner case divided into two;
forming the outer case by molding a resin so as to cover the substrate and the inner case while arranging a part of the mold so as to cover the substrate placed on the substrate mounting part; ,including,
A method for manufacturing a sensor device. The part of the mold has an opening on the substrate resting part side and the ring part side, and a recessed part for accommodating the substrate, on the lower surface of the distal end thereof, which is the surface on the substrate resting part side. have,
An end surface of the part of the mold on the ring part side is brought into contact with the ring part of the inner case, and the lower surface of the periphery of the recess is brought into contact with the substrate mounting part on the periphery of the substrate. forming the outer case by molding the resin in the
A method for manufacturing a sensor device according to claim 1 . After forming the outer case, the method further includes a step of sliding and removing a part of the mold.
A method for manufacturing a sensor device according to claim 2 . A sensor that measures a physical quantity to be detected;
a board on which the sensor is mounted;
an inner case made of resin having a substrate placement part on which the substrate is placed;
A method for manufacturing a sensor device, comprising: an outer case formed by molding a resin to cover the substrate and the inner case,
forming the outer case by molding a resin while arranging a part of the mold so as to cover the substrate placed on the substrate mounting part;
After forming the outer case, the method further includes a step of providing a lid so as to close an opening from which a portion of the mold has been removed, and integrating the lid with the outer case.
A method for manufacturing a sensor device. A sensor that measures a physical quantity to be detected;
a board on which the sensor is mounted;
an inner case made of resin having a substrate placement part on which the substrate is placed;
A method for manufacturing a sensor device, comprising: an outer case formed by molding a resin to cover the substrate and the inner case,
forming the outer case by molding a resin while arranging a part of the mold so as to cover the substrate placed on the substrate mounting part;
When forming the outer case, the substrate is positioned with respect to the substrate rest by fitting a protrusion formed on the board rest into a through hole of the board;
After the outer case is formed and a portion of the mold is removed, the substrate is fixed to the substrate mounting portion by performing heat crimping to heat and deform the tips of some of the protrusions. ,
A method for manufacturing a sensor device. The board mounting section is provided with a connector having a terminal protruding from a surface on which the board is mounted,
Forming the outer case with the terminal inserted into a connection hole for connecting the terminal formed on the substrate,
After forming the outer case and removing a portion of the mold, fixing the terminal to the board by soldering;
A method for manufacturing a sensor device according to claim 5 . A part of the mold is configured to come into contact with a tip of the protrusion and an edge of the substrate placement part to support the tip of the protrusion and the edge of the substrate placement part. , the support is configured to suppress deformation of the substrate mounting section due to resin pressure during formation of the outer case;
A method for manufacturing a sensor device according to claim 5 or 6 . A sensor that measures a physical quantity to be detected;
a board on which the sensor is mounted;
an inner case made of resin having a substrate placement part on which the substrate is placed;
an outer case formed by molding a resin so as to cover the substrate and the inner case,
A surface of the substrate opposite to the substrate mounting portion and an inner surface of the outer case are directly opposed to each other with a hollow portion interposed therebetween;
The substrate is formed by fitting the protrusions formed on the substrate mounting portion into the through-holes of the substrate, and performing thermal crimping to heat and deform the tips of some of the protrusions. It is fixed to the board rest,
The board mounting section is provided with a connector having a terminal protruding from the surface on which the board is mounted, and the terminal is inserted and fixed into a connection hole formed in the board for connection of the terminal. has been
The substrate is fixed to the substrate mounting portion by heat-stamping only the pair of protrusions provided to sandwich the terminal;
sensor device.

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