JP7423924B2 - Light source unit and lighting device - Google Patents

Description

The present invention relates to a light source unit and a lighting device.

2. Description of the Related Art Illumination devices are known that use a plurality of laser beams as excitation light to excite a phosphor, and reflect the fluorescence emitted from the phosphor by the excitation on a reflective surface for illumination. In this type of lighting device, a semiconductor laser is used as a laser light source (see, for example, Patent Document 1).

Japanese Patent Application Publication No. 2018-166064

Since laser light is highly directional, if each semiconductor laser is not fixed at an appropriate position when assembling a lighting device, the laser light will not enter the phosphor, which tends to result in relatively noticeable leakage light.

An object of the present invention is to provide a light source unit and a lighting device that can easily position each semiconductor laser at an appropriate position.

The present invention includes a plurality of laser semiconductors that emit laser light, and a metal base to which each of the laser semiconductors is attached, the metal base positions each of the laser semiconductors, and the metal base positions each of the laser semiconductors to emit the laser light. A light source unit is formed with a mounting hole portion that is held in a posture according to the irradiation direction of the light source unit, wherein a lead member extending from the laser semiconductor extends inside the mounting hole portion without contacting the metal base; A dielectric strength voltage that is connected to a lead wire connected to a high-voltage side line and a low-voltage side line of DC power for lighting the laser semiconductor, and applies a high voltage to a lighting circuit of a device in which the light source unit is incorporated. The metal base is provided with an insulating plate that electrically insulates between the metal base and the housing of the device to be incorporated so as to prevent damage to the laser semiconductor during testing, and the metal base is connected to the high voltage side of the DC power. , or maintained at a potential on the low voltage side.

The present invention is characterized in that, in the light source unit, the laser semiconductor has a metal plate-shaped base portion, and the base portion is attached to the attachment hole portion in contact with the base portion.

In the light source unit of the present invention, each of the plurality of laser semiconductors is provided with a lens for controlling laser light, and the back surface of the lens closes the mounting hole and makes surface contact with the periphery of the mounting hole. It is characterized by

The present invention is characterized in that, in the light source unit, the metal base is maintained at an equal potential with a metal base of another light source unit incorporated in the device.

The present invention is characterized in that, in the light source unit, either a high potential side line or a low potential side line of the DC power is connected to the metal base.

The present invention provides that, in the light source unit, a lead wire accommodating recess in which the lead wire is housed is provided in the back surface of the metal base, and the lead wire accommodating recess is closed by the insulating plate. Features.

The present invention includes any one of the above light source units, a phosphor that is excited by the laser light of the light source unit and emits fluorescence, and a reflective surface that reflects the fluorescent light, and the present invention is provided with the following: Provided is a lighting device characterized by lighting.

According to the present invention, each semiconductor laser can be easily positioned at an appropriate position.

1 is a perspective view showing the overall configuration of a light projecting device according to an embodiment of the present invention. FIG. 3 is a perspective view of the light projecting device viewed from the back side. It is a front view of a light projector. 4 is a diagram illustrating a schematic configuration taken along a cross-sectional line IV-IV in FIG. 3. FIG. FIG. 3 is a perspective view showing the internal configuration of the light projecting device with the front cover, the laser light shielding unit, and one of the reflecting mirrors removed. 5 is an enlarged view of the light source unit shown in FIG. 4. FIG. FIG. 3 is an exploded view showing a metal base, a ceramic plate, and an optical plate. FIG. 2 is a perspective view showing the configuration of a light source unit. It is a top view of a light source unit. It is a side view of a light source unit. FIG. 9 is a sectional view taken along line XI-XI in FIG. 9; FIG. 2 is a perspective view showing the configuration of a laser diode. FIG. 2 is a cross-sectional view of a laser diode.

Embodiments of the present invention will be described below with reference to the drawings. Below, as one aspect of the lighting device, a floodlighting device suitably used for landscape lighting will be exemplified.

FIG. 1 is a perspective view showing the overall configuration of a light projecting device 1 according to this embodiment, and FIG. 2 is a perspective view of the light projecting device 1 viewed from the back side. Moreover, FIG. 3 is a front view of the light projecting device 1.
As shown in FIGS. 1 to 3, the light projecting device 1 includes a substantially box-shaped device main body 2 that emits illumination light, and a mounting arm 4 that supports the device main body 2. The mounting arm 4 includes an arm portion 5 that supports both side surfaces of the device body 2, and a fixing piece 6 provided on the arm portion 5, and the fixing piece 6 is fixed to the installation location of the projector 1. be done. The arm portion 5 rotatably (tilts) the device main body 2, so that the mounting angle of the device main body 2 can be changed.

The device body 2 has a substantially box-shaped casing 8 with an open front (also referred to as the front). The housing 8 is formed by die-casting using metal (for example, aluminum), which is a material with high thermal conductivity, and as shown in FIG. It is formed of.

A flange 10 is formed at the edge of the front opening of the housing 8, and a front cover 12 is fixed to this flange 10, as shown in FIGS. 1 and 3. The front cover 12 has a substantially rectangular plate shape made of a transparent material (for example, glass or transparent resin), and has silk printing (silk printing) on its surface 12A, except for the emission area 16 that emits illumination light. A light-shielding coating (black ink coating in this embodiment) is applied using screen printing (also called screen printing).

As shown in FIG. 3, the emission area 16 is a transparent area that has a circular shape when viewed from the front, and through this emission area 16, substantially parallel light with a circular cross section and white light is emitted from the device main body 2 as illumination light. be done. In the light projection device 1 of this embodiment, two emission areas 16 are provided side by side on the front cover 12, and substantially parallel illumination light is emitted from each emission area 16.

FIG. 4 is a diagram showing a schematic configuration along the IV-IV cross-sectional line in FIG. 3. FIG. 5 is a perspective view showing the internal configuration of the light projection device 1 with the front cover 12, the laser light blocking unit 160, and one of the reflecting mirrors 24 removed. FIG. 6 is an enlarged view of the light source unit 20 shown in FIG. 4.
The light projection device 1 of this embodiment is a device that obtains white light by mixing blue laser light that excites a phosphor 22 and yellow fluorescence excited and generated by the laser light. Specifically, as shown in FIG. 4, the device main body 2 includes a light source unit 20, a phosphor 22, a reflecting mirror 24, and a laser light shielding unit 160, which are provided for each emission area 16. It is being

The light source unit 20 is a unit that irradiates the phosphor 22 with blue laser light. The phosphor 22 is a member that is excited by laser light irradiation and emits yellow fluorescence toward the reflecting mirror 24 . The phosphor 22 of this embodiment uses an extremely thin film-like material (LAG-Sc) produced by mixing LAG-based phosphor particles with an inorganic binder made of scandium or the like. The phosphor 22 is formed on the surface of the phosphor holding portion 27 by printing. Note that YAG-Ce single crystal or the like can also be used as the phosphor 22.
The reflecting mirror 24 is a reflective optical member having a parabolic reflecting surface 24A that converts the light from the focal point f into parallel light parallel to the optical axis K. The phosphor 22 is placed at the focal point f of the parabolic reflecting surface 24A, facing the parabolic reflecting surface 24A. Specifically, the device main body 2 includes a rod-shaped phosphor holding bar 28 having a phosphor holding portion 27 that holds the phosphor 22, as shown in FIG. The phosphor holding bar 28 is attached to the housing 8 with the phosphor 22 of the phosphor holding portion 27 (more precisely, a planar reflective surface 27A to be described later) positioned at the focal point f and extending in the direction orthogonal to the optical axis K. Fixed.

As shown in FIG. 4, the phosphor holding portion 27 has a flat reflective surface 27A that holds the phosphor 22, and this flat reflective surface 27A reflects the laser light incident on the phosphor 22. It is reflected toward the parabolic reflecting surface 24A. As a result, white light, which is a mixture of fluorescence and laser light, is emitted from the phosphor 22 toward the parabolic reflection surface 24A in a substantially Lambertian distribution. When this white light enters the parabolic reflecting surface 24A, it is collimated into light parallel to the optical axis K of the parabolic reflecting surface 24A, and passes through the output area 16 of the front cover 12 as illumination light for the device. The light is emitted from the main body 2.

The light source unit 20 irradiates the phosphor 22 with a plurality of laser beams from around the optical axis K, and as shown in FIG. 32 and a ceramic plate 33.
The laser light source unit 30 is a unit that emits laser light whose light distribution is controlled.
The metal base 32 is a member to which the laser light source unit 30 is assembled, and has a rectangular plate shape in plan view.As shown in FIG. , the four corners of the ceramic plate 33 are attached and fixed by fixtures 37 with the ceramic plate 33 in between.

Both the metal base 32 and the optical plate 34 are made of a highly thermally conductive material such as aluminum. The amount of heat generated by the laser light source unit 30 is transmitted to the housing 8 via the ceramic plate 33 and the optical plate 34, and is smoothly radiated from the heat radiation fins 14 on the back surface of the housing 8. Further, as shown in FIG. 5, on the surface of the optical plate 34, a large number of heat pipes 35 are arranged, which extend radially from the light source unit 20 as a starting point and transport the amount of heat generated by the laser light source unit 30 to a distant place from the starting point. It is set up. Since heat is transmitted to a wide range of the housing 8 by these heat pipes 35, heat dissipation efficiency is improved.

FIG. 7 is an exploded view of the metal base 32, ceramic plate 33, and optical plate 34. As shown in FIG.
The ceramic plate 33 is a rectangular plate material large enough to cover the entire back surface of the metal base 32 of the light source unit 20, and is attached to the back surface with an adhesive or the like. This ceramic plate 33 functions as an insulating material that electrically insulates the metal base 32 and the housing 8. Further, the ceramic plate 33 is made of a material having high thermal conductivity (for example, alumina etc.). Note that an appropriate insulating material having electrical insulation and high thermal conductivity may be used instead of the ceramic plate 33.

The laser light blocking unit 160 is a unit that blocks leakage light components. The leakage light component is a component of the laser light emitted from the laser light source unit 30 that deviates from the phosphor 22, and is caused by variations in the laser light source unit 30, reflection at the through hole 46, diffraction, etc. described later. This is the resulting non-parallel light.

The laser light shielding unit 160 includes a honeycomb structure 161, as shown in FIG. 3 above. As shown in FIG. 4, this honeycomb structure 161 has a large number of cylindrical bodies 163 (regular hexagonal cross section in this embodiment) extending parallel to the optical axis K on the same plane (in this embodiment, a parabolic reflecting surface). 24A (on the open end surface 29) of the tubular bodies 163 without any gaps, and anti-reflection treatment is applied to the side surfaces of each cylindrical body 163. When the illumination light passes through the laser light shielding unit 160, the leakage light component, which is non-parallel light, enters the side surface of each cylindrical body 163 and is thus shielded.

FIG. 8 is a perspective view showing the configuration of the light source unit 20, and FIG. 9 is a plan view of the light source unit 20. 10 is a side view of the light source unit 20, and FIG. 11 is a sectional view taken along line XI-XI in FIG.
As shown in FIG. 11, the laser light source unit 30 includes a laser diode 36, which is a laser semiconductor that outputs laser light, and a lens 38 that controls the laser light.
The lens 38 is a biconic lens, which is a type of convex lens, made of a resin material or a glass material, and as shown in FIG. Shine. Further, the lens 38 has a cross-sectional shape of the laser beam emitted from the laser diode 36 when the phosphor 22 is irradiated with a shape such as a perfect circle or a square (according to the shape of the phosphor 22 in plan view). It has the function of reshaping to approximate the shape

FIG. 12 is a perspective view showing the structure of the laser diode 36, and FIG. 13 is a cross-sectional view of the laser diode 36.
As shown in these figures, the laser diode 36 includes a substantially disk-shaped base portion 50, a pedestal portion 52 provided on the upper surface of the base portion 50, and a case portion 54 that covers and seals the pedestal portion 52. and an LD chip 56 (FIG. 13) which is an element that emits laser light. The LD chip 56 is attached to the side surface of the pedestal part 52, and the pedestal part 52 functions as a heat sink and absorbs the amount of heat generated by the LD chip 56, thereby suppressing a rise in temperature of the LD chip 56.

As shown in FIG. 12, two lead members 58 and 59 penetrate inside the base part 50 from the bottom side, and the tip 58A of one lead member 58 is disposed at a position facing the LD chip 56. The tip 58A and the LD chip 56 are electrically connected by a conductive wire 53.
At least the base portion 50 and the pedestal portion 52 are molded from a conductive material (metal in this embodiment), and the other lead member 59 is electrically connected to the base portion 50 and the pedestal portion 52. This keeps them at equal potential. When the potential difference between the lead members 58 and 59 is applied to the LD chip 56, the LD chip 56 emits a laser beam toward the upper surface 54A of the case portion 54.

As shown in FIG. 12, the case portion 54 has a substantially cylindrical shape, and the inside thereof is filled with an appropriate gas such as an inert gas. An emission opening 55 having a predetermined size and a circular shape in plan view is formed in the center of the upper surface 54A of the case part 54, and a transparent cover member 57 is fitted into the emission opening 55 so that the LD chip 56 can emit radiation. The laser beam is emitted from the emission aperture 55.
The lens 38 is fixed to the upper surface 54A of the case portion 54 of the laser diode 36, and the laser light emitted from the emission aperture 55 directly enters the lens 38, and the light distribution is controlled by the lens 38.

As shown in FIG. 8, the surface of the metal base 32 is recessed into a cup shape, and as shown in FIG. They are formed around the axis K at approximately equal intervals. The respective mounting holes 40 are formed so that the respective laser light source units 30 are arranged at the same incident angle and at the same distance when viewed from the focal point f. In this embodiment, each laser light source unit 30 is arranged on the back side of the parabolic reflecting surface 24A when viewed from the focal point f, and as shown in FIG. A through hole 46 is provided through which the laser beam passes. In this embodiment, the angle of incidence of each laser beam with respect to the optical axis K when it enters the phosphor 22 is set to a predetermined angle (30 degrees in this embodiment) that is at least larger than zero degrees.

In this embodiment, the base portion 50 of the laser light source unit 30 is fitted and fixed into the mounting hole 40, and the laser light source unit 30 is positioned at an accurate position on the surface of the metal base 32, and the laser beam is focused at f. It is designed to be held in a position pointing towards the Specifically, as shown in FIG. 11, the mounting hole 40 has a cylindrical fitting part 40A and a communication part 40B whose diameter is smaller than that of the fitting part 40A, and the base of the laser diode 36 is connected to the base of the laser diode 36. The portion 50 is fitted into the fitting portion 40A. Further, the back surface of the lens 38 closes the mounting hole 40 and comes into surface contact with the surface of the metal base 32 around the mounting hole 40 . This surface contact maintains the posture of the laser light source unit 30 appropriately. Further, the lens 38 is pressed against the metal base 32 by the pressing plate 42, so that the laser light source unit 30 cannot fall out from the mounting hole 40.
With this configuration, each of the plurality of laser light source units 30 is held at an appropriate position and in an appropriate posture, and positional displacement due to vibrations when the projector 1 is transported or used can be suppressed.

Further, when the laser diode 36 is in a fixed state, the circumferential surface and the bottom surface of the base portion 50 are in contact with the fitting portion 40A, and the amount of heat generated by the laser diode 36 is efficiently transmitted to the metal base 32.

Further, as shown in FIG. 11, the communication portion 40B of each attachment hole 40 communicates with a lead wire accommodating recess 63 formed on the back surface of the metal base 32. The lead wire accommodating recess 63 is a recess for accommodating the lead wires 64 and 65 for wiring the laser diode 36, and its open end is closed by the ceramic plate 33, and as shown in FIG. The lead wire 64 is communicated with the lead wire pull-out hole 69 , and the lead wire 64 is pulled out from the lead wire pull-out hole 69 .
In each mounting hole 40, as shown in FIG. 11, each lead member 58, 59 of the laser diode 36 extends inside the communication portion 40B without contacting the metal base 32 and enters into the lead wire accommodation recess 63. , where it is connected to lead wires 64 and 65. Each laser diode 36 is electrically connected in series by lead wires 64 and 65, and these lead wires 64 and 65 form a lighting power line that transmits DC power from a DC power source, as shown in FIG. The high potential side line 71 and the low potential side line 72 of 70 are connected to each other.

By the way, when the laser light source unit 30 is attached to the metal base 32, the entire circumference of the base portion 50 of the laser diode 36 comes into contact with the attachment hole portion 40 of the metal base 32. As described above, in the laser diode 36, at least the base portion 50 and the pedestal portion 52 are molded of metal and are in a conductive state, so that the base portion 50 and the pedestal portion 52 are maintained at approximately the same potential as the metal base 32. . In this embodiment, the case portion 54 of the laser diode 36 is also made of metal, and is maintained at the same potential as the base portion 50 and the like.

When the metal base 32 is directly fixed to the housing 8, heat dissipation is excellent, but if a dielectric strength test is performed in this state by applying a high voltage to the lighting circuit of the light projector 1, the LD chip 56 will be damaged. As a result, the laser diode 36 is destroyed. This is because the LD chip 56 will be damaged if a current or voltage that is larger than the rating is applied to it, and since the pedestal part 52 is at the same potential as the casing 8 through the metal base 32, the LD chip 56 will be damaged in the dielectric strength test. This is because dielectric breakdown occurred between the chip 56 and the pedestal 52 (or the base 50 or the case 54), and the test voltage was applied directly between the LD chip 56 and the pedestal 52.
Therefore, as a method for preventing the laser diode 36 from being destroyed due to the dielectric strength test, a configuration in which the metal base 32 and the housing 8 are insulated may be considered.

As mentioned above, the back surface of the metal base 32 is covered with the ceramic plate 33 which is an insulating material. It has an electrically insulated structure.
However, the inventor has found that when a dielectric strength test is performed with this configuration, the laser diode 36 is damaged in the same way as when the metal base 32 is directly fixed to the housing 8.
That is, a thin plate (thickness: 1 mm) is used for the ceramic plate 33, which is an insulating material, in order to enhance heat conduction from the metal base 32 to the optical plate 34. Stray capacitance occurs due to the ceramic plate 33. In this embodiment, since the bottom area of the metal base 32 is approximately 9000 mm ² , a stray capacitance of approximately 0.7 μF is generated.
If a dielectric strength test is performed in this state, the insulation performance between the metal base 32 and the casing 8 will decrease due to stray capacitance, and a voltage will be applied between the LD chip 56 and the pedestal 52. Damage to the laser diode 36 occurs.

Therefore, in this embodiment, the high potential side line 71 or the low potential side line 72 of the lighting power line 70 connected to the light source unit 20 is electrically connected to the metal base 32 in advance. Specifically, as shown in FIG. 8, a wire connection end stop 80 is provided on the surface of the metal base 32. The connection end portion 80 has a lead wire 64 or a lead wire 65 (in this embodiment) that connects the high potential side line 71 or the low potential side line 72 (high potential side line 71 in this embodiment) and each laser diode 36. Then, the lead wire 64) is connected. This wire connection end stop 80 has a connection tool 81 that connects the high potential side line 71 or the low potential side line 72 and the lead wire 64 or the lead wire 65 in a conductive state, and this connection tool 81 is made of metal or the like. By being fixed to the metal base 32, the metal base 32 is electrically connected to the high potential side line 71 or the low potential side line 72 via the connection tool 81.

By electrically connecting the metal base 32 to the high potential side line 71 or the low potential side line 72 of the lighting power line 70 using the connection tool 81, the LD chip 56 and the pedestal section 52 are kept at the same potential. Therefore, no potential difference occurs between the LD chip 56 and the pedestal portion 52 during the dielectric strength test, so damage to the LD chip 56 can be prevented.

Note that although the thicker the ceramic plate 33 is, the higher the insulation properties are, the heat conduction from the metal base 32 to the optical plate 34 is inhibited, so the thickness should be approximately 2 mm or less, although it depends on the thermal conductivity of the ceramic plate 33. is preferred.

In the light projection device 1 of this embodiment, as described above, a plurality of (two in this embodiment) light source units 20 are provided in the housing 8. In this case, it is preferable that each of the metal bases 32 included in each light source unit 20 is maintained at an equal potential. By maintaining the plurality of metal bases 32 at equal potential, even if a user touches two or more metal bases 32 at the same time while driving the laser diode 36, electric shock due to the potential difference between the metal bases 32 is avoided. can.
The following configuration can be cited as a configuration for maintaining the metal base 32 of each light source unit 20 at an equal potential. That is, when each light source unit 20 is provided with a lighting power line 70, all the metal bases 32 are connected to the high potential side line 71 or the low potential side line 72, or a plurality of light source units 20 are connected in parallel. For example, one metal base 32 connected to the high potential side line 71 or the low potential side line 72 is connected to 32 other metal bases.

According to this embodiment, the following effects are achieved.

In the light projecting device 1 of this embodiment, the metal base 32 of the light source unit 20 is formed with a mounting hole 40 for positioning each of the plurality of laser light source units 30 and holding it in an attitude corresponding to the laser beam irradiation direction. ing.
Thereby, each of the plurality of laser light source units 30 is held at an appropriate position and in an appropriate posture, and positional displacement due to vibrations during transportation or use of the projector 1 is also suppressed.

In the light projection device 1 of this embodiment, the laser diode 36 included in the light source unit 20 has a metal plate-shaped base portion 50, and the base portion 50 is attached to the attachment hole portion 40 in a state of contact. The amount of heat generated by the laser diode 36 can be efficiently transferred to the metal base 32 and radiated.

In the light projection device 1 of this embodiment, the back surface of the lens 38 closes the attachment hole 40 and makes surface contact with the periphery of the attachment hole 40 . This surface contact state allows the posture of the light source unit 20 to be maintained appropriately.

The light projecting device 1 of this embodiment includes a ceramic plate 33 that electrically insulates between the housing 8 of the device to be incorporated and the metal base 32, and the metal base 32 is used for lighting the laser light source unit 30. The potential is maintained at the high voltage side or the low voltage side of the lighting power line 70.
Thereby, while insulating the housing 8 and the metal base 32 with the ceramic plate 33, the influence of the electric potential on the laser diode 36 due to the stray capacitance of the ceramic plate 33 can be suppressed. Therefore, in each laser diode 36, regardless of the magnitude of the potential applied to the lighting circuit in the dielectric strength test, the potential of the base portion 50 and the pedestal portion 52 is increased to a high level of the lighting power line 70 through the metal base 32. Since the potential is maintained at the potential side or the low potential side, the pedestal portion 52 and the LD chip are kept at the same potential, so that an excessive voltage is not applied to the LD chip 56, and the LD chip It is possible to reliably prevent the chip 56 from being damaged.

In the light projecting device 1 of this embodiment, a lead wire housing recess 63 is provided in the back surface of the metal base 32 in which the lead wires 64 and 65 that connect the plurality of laser light source units 30 in series are accommodated. The wire receiving recess 63 is closed by the ceramic plate 33.
Thereby, the lead wires 64 and 65 do not get in the way when the light source unit 20 is attached to the housing 8.

In the light projector 1 of this embodiment, the mounting hole 40 has a communication part 40B that communicates with the lead wire accommodation recess 63, and the lead members 58 and 59 extending from the laser diode 36 are connected to the metal base in the communication part 40B. 32 in a non-contact state and are connected to lead wires 64 and 65 housed in lead wire accommodating recess 63.
Thereby, the lead members 58 and 59 of the laser diode 36 can be protected within the metal base 32 without being exposed.

The embodiment described above is merely an example of one aspect of the present invention, and can be arbitrarily modified and applied without departing from the spirit of the present invention.

For example, the present invention is applicable not only to the floodlighting device 1 but also to various lighting devices.

1 Lighting device (lighting device)
2 Device body 8 Housing 20 Light source unit 22 Phosphor 24 Reflector 30 Laser light source unit 32 Metal base 33 Ceramic plate (insulating plate)
34 Optical plate 36 Laser diode (laser semiconductor)
38 Lens 40 Mounting hole portion 40A Fitting portion 40B Communication portion 50 Base portion 52 Pedestal portion 53 Wire 54 Case portion 56 LD chip 57 Cover member 58, 59 Lead member 63 Lead wire storage recess 64, 65 Lead wire 69 Lead wire extraction hole 70 Power line for lighting 71 High potential side line 72 Low potential side line 80 Wiring end stop 81 Wiring tool K Optical axis f Focus

Claims (7)

multiple laser semiconductors that emit laser light;
a metal base made of metal to which each of the laser semiconductors is attached;
The metal base is a light source unit in which a mounting hole is formed for positioning each of the laser semiconductors and holding them in a posture according to the irradiation direction of the laser beam,
A lead member extending from the laser semiconductor extends inside the mounting hole without contacting the metal base, and is connected to a high voltage side line and a low voltage side line of DC power for lighting the laser semiconductor. Each lead wire is connected to the
In order to prevent damage to the laser semiconductor during a dielectric strength test in which a high voltage is applied to the lighting circuit of the device in which the light source unit is incorporated, electrical connection is established between the housing of the device in which the light source unit is incorporated and the metal base. An insulating plate is provided, and the metal base is maintained at a potential on the high voltage side or the low voltage side of the DC power.
A light source unit characterized by: The laser semiconductor is
It has a metal plate-shaped base part,
The base portion is attached in contact with the attachment hole portion,
The light source unit according to claim 1, characterized in that: Each of the plurality of laser semiconductors is provided with a lens for controlling laser light,
3. The light source unit according to claim 2, wherein a back surface of the lens closes the mounting hole and makes surface contact with the periphery of the mounting hole. The metal base is
maintained at an equipotential with a metal base of another light source unit incorporated in the device;
The light source unit according to any one of claims 1 to 3, characterized in that: 5. The light source unit according to claim 1, wherein either a high potential side line or a low potential side line of the DC power is connected to the metal base. In the back surface of the metal base,
A lead wire accommodating recess is provided in which the lead wire is housed,
the lead wire accommodating recess is closed by the insulating plate;
The light source unit according to any one of claims 1 to 5. The light source unit according to any one of claims 1 to 6,
a phosphor that is excited by the laser light of the light source unit and emits fluorescence;
a reflective surface that reflects the fluorescence;
An illumination device characterized by illuminating with light reflected by the reflective surface.

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