JP7426833B2 - Manufacturing method of sheet body - Google Patents

Description

The technology disclosed in this specification relates to a method for manufacturing a sheet body.

Conventionally, as a method for manufacturing a wiring board manufactured using a transfer sheet on which a conductive circuit is formed, a manufacturing method described in Japanese Patent Laid-Open No. 2003-273497 (Patent Document 1 below) is known. The transfer sheet includes a metal layer formed in a circuit pattern and a support that functions as a support member for transferring the metal layer. The base material that becomes the metal layer is a metal foil formed by rolling, a metal thin film formed by known plating, sputtering, or the like. By performing laser processing on such metal foil or metal thin film, a metal layer in the shape of a circuit pattern is formed. Next, the metal layer is embedded in the precursor sheet by mechanical pressure, the metal layer is transferred to the precursor sheet by peeling off the support, and finally heated and cured to produce a wiring board with conductor circuits. can do.

Japanese Patent Application Publication No. 2003-273497

According to the manufacturing method described in Japanese Patent Application Laid-open No. 2003-273497, although it has the advantage of being able to form fine circuit patterns by laser processing, since the necessary and unnecessary parts are formed at the same time by laser processing, it is difficult to remove the unnecessary parts. Removal work will be required. Furthermore, as the necessary portions of the circuit pattern become finer, the unnecessary portions will also become finer, and it is expected that the task of removing the unnecessary portions will become extremely difficult.

Furthermore, Japanese Patent Laid-Open No. 2003-273497 also describes that after removing the metal layer other than the minute portions of the circuit pattern by photolithography, only the minute portions are formed by laser processing. However, removing the metal layer by photolithography requires steps such as exposure, development, and etching, which increases the number of steps. Furthermore, depending on the etching conditions, there is a risk that the cross-sectional shape of the circuit will become undercut, and there is also a risk that residue will remain between the circuits during development, resulting in insufficient etching and short circuits between the circuits.

A method for manufacturing a sheet body according to the present disclosure includes a sheet body having a front surface and a back surface and made of an insulating material, and a wiring layer made of a conductive material and arranged on the surface of the sheet body. A method for manufacturing a sheet body, comprising: a wiring pattern forming step of preparing a transfer sheet on the surface of which the wiring layer and a spacing layer spaced from the wiring layer are formed; a transfer sheet arranging step of arranging the transfer sheet overlapping the sheet main body in a position facing the main body; and a transfer sheet arranging step of arranging the transfer sheet overlapping the sheet main body in a position facing the main body, and corresponding to a portion of the front surface of the back surface of the transfer sheet on which the wiring layer is formed. This method includes a wiring layer transfer step of transferring the wiring layer to the sheet main body by pressing a portion with a letterpress jig while leaving the spacing layer on the transfer sheet.

According to the method for manufacturing a sheet body of the present disclosure, it is possible to eliminate the work of removing the spacing layer from the transfer sheet.

FIG. 1 is a flowchart showing a method for manufacturing a sheet body. FIG. 2 is a diagram showing a wiring pattern forming process. FIG. 3 is a diagram showing the transfer sheet arrangement process. FIG. 4 is a diagram showing the wiring layer transfer process. FIG. 5 is an enlarged view of a part of FIG. 4. FIG. 6 is a cross-sectional view of the wiring board. FIG. 7 is a perspective sectional view showing the internal structure of the electrostatic chuck.

[Description of embodiments of the present disclosure]
First, embodiments of the present disclosure will be listed and described.
(1) A method for producing a sheet body according to the present disclosure includes a sheet body having a front surface and a back surface and made of an insulating material, and a wiring layer disposed on the surface of the sheet body and made of a conductive material. A sheet body manufacturing method for manufacturing a sheet body, comprising: a wiring pattern forming step of preparing a transfer sheet on the surface of which the wiring layer and a spacing layer spaced from the wiring layer are formed; and the wiring layer. a transfer sheet arranging step of arranging the transfer sheet overlapping the sheet main body in such a manner that the transfer sheet faces the sheet main body, and a portion of the front surface of the back surface of the transfer sheet on which the wiring layer is formed; and a wiring layer transfer step of transferring the wiring layer to the sheet main body while leaving the spacing layer on the transfer sheet by pressing a corresponding portion with a letterpress jig.

A wiring layer is formed on the surface of the transfer sheet in the wiring pattern forming process, the transfer sheet is placed over the sheet body in the transfer sheet placement process, and the wiring layer is placed on the transfer sheet using a letterpress jig in the wiring layer transfer process. By transferring the separation layer from the transfer sheet to the sheet main body, it becomes unnecessary to remove the spacing layer from the transfer sheet. That is, instead of removing the spacing layer from the surface of the transfer sheet, leaving only the wiring layer on the surface of the transfer sheet, and then transferring the wiring layer to the sheet body, the wiring layer and the spacing layer are transferred to the transfer sheet. It is possible to transfer only the wiring layer to the sheet body while coexisting with the wiring layer. Moreover, since the spacing layer remaining on the transfer sheet can be collected and reused, material loss can be reduced.

(2) The letterpress jig has a convex portion that presses the transfer sheet, and in the wiring layer transfer step, the contact surface of the convex portion is pressed against the back surface of the transfer sheet. In this case, it is preferable that the wiring layer is located inside the outline of the contact surface in plan view, and the spacing layer is located outside of the outline of the contact surface in plan view.
When pressing a transfer sheet with a letterpress jig, it is necessary to position the letterpress jig and the transfer sheet. In the above manufacturing method, since the wiring layer is located inside the outline of the contact surface in plan view, the wiring layer can be pushed and transferred to the sheet body by the entire contact surface. By reliably transferring the wiring layer in this manner, it is possible to prevent a portion of the wiring layer from floating away from the sheet body. Further, since the spacing layer is located outside the outline of the contact surface in plan view, it is possible to avoid pushing the spacing layer adjacent to the wiring layer by the contact surface.

(3) In the wiring layer transfer step, it is preferable to press the letterpress jig so that a part of the wiring layer is embedded in the sheet body.
If a part of the wiring layer is not embedded in the sheet body, the difference in level between the wiring layer and the sheet body will be approximately the same as the thickness of the wiring layer, so the sheet body is manufactured by laminating another sheet body on the sheet body. In this case, air bubbles tend to form at the difference in level. According to the above manufacturing method, since a portion of the wiring layer is embedded in the sheet body, the difference in level between the wiring layer and the sheet body can be made smaller than the thickness of the wiring layer. Therefore, when manufacturing a sheet body, air bubbles are less likely to be generated at the level difference.

(4) It is preferable that the letterpress jig has a convex portion that is a part that presses the transfer sheet, and that the height of the convex portion is equal to or greater than the thickness of the wiring layer before the wiring layer transfer step. .
Since the height of the convex portion is greater than or equal to the thickness of the wiring layer, the wiring layer can be completely embedded in the sheet body.

(5) Preferably, the wiring layer is made of a resistor material.
When a sheet body is manufactured using a resistor material for the wiring layer, the wiring layer generates heat when electricity is applied, so that the sheet body functions as a heater. Further, in a heater, if the thickness of the wiring layer varies, the amount of heat generated varies, so it is desirable to minimize the variation in the thickness of the wiring layer. If the present invention is applied to a method for manufacturing such a heater, a conductive paste is applied to a transfer sheet with a substantially uniform thickness, a wiring layer is formed using the conductive paste, and the wiring layer is transferred to the sheet body. Therefore, the thickness of the wiring layer can be made substantially uniform. As a result, variations in the amount of heat generated by the heater can be suppressed.

[Details of embodiments of the present disclosure]
A specific example of the method for manufacturing a sheet body of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is indicated by the scope of the claims, and is intended to include all changes within the meaning and range equivalent to the scope of the claims.

<Overall configuration of sheet body>
As shown in FIG. 1, the sheet body 10 of the present disclosure is configured by a wiring pattern forming step S10, a transfer sheet arrangement step S20, a wiring layer transfer step S30, a sheet main body lamination step S40, a sheet main body baking step S50, etc. Manufactured by a manufacturing method. As shown in FIG. 6, an example of the sheet body 10 is a wiring board 100 that includes a sheet body 20 made of an insulating material and a wiring layer 30 made of a conductive material.

The seat body 20 includes, in order from the lowest layer, a first sheet body 21, a second sheet body 22, a third sheet body 23, a fourth sheet body 24, and a fifth sheet body 25. On the other hand, the wiring layer 30 includes a first wiring layer 31 arranged on the first sheet main body 21 and a fifth wiring layer 35 arranged on the fifth sheet main body 25.

The sheet body 20 has a front surface 20A and a back surface 20B, and is mainly made of ceramic. "Main component" means a component contained in an amount of 50% by mass or more. Examples of the ceramic forming the sheet body 20 include alumina, beryllia, aluminum nitride, boron nitride, silicon nitride, silicon carbide, and low-temperature fired ceramics. These ceramics can be used alone or in combination of two or more.

The wiring layer 30 has conductivity and contains metal as a main component. Examples of this metal include copper (Cu), aluminum (Al), silver (Ag), gold (Au), platinum (Pt), nickel (Ni), titanium (Ti), iron (Fe), and chromium (Cr). ), molybdenum (Mo), tungsten (W), alloys thereof, and the like. The wiring layer 30 of the present disclosure may be made of a resistor material, configured of a heating element containing W, and used as a heater that generates heat when energized.

The first wiring layer 31 and the fifth wiring layer 35 are wiring patterns formed by the wiring pattern forming step S10 shown in FIG. On the other hand, the second conductor layer 32 arranged on the second sheet main body 22, the third conductor layer 33 arranged on the third sheet main body 23, and the fourth conductor layer 34 arranged on the fourth sheet main body 24 are This is a connection conductor that electrically connects the first wiring layer 31 and the fifth wiring layer 35. This connection conductor is composed of, for example, silver solder and a copper chip. As a bonding material other than silver solder, for example, a metal brazing material such as a silver-copper alloy or a solder material such as a tin-silver-copper alloy may be used.

The transfer sheet 40 of the present disclosure is made of a sheet material made of PET. As the material other than PET, resin, glass, metal, ceramic, etc. may be used. The thickness of the transfer sheet 40 of the present disclosure is 0.1 mm.

<Method for manufacturing sheet body>
Next, a method for manufacturing the sheet body 10 will be described with reference to the drawings of FIGS. 1 to 6. In the wiring pattern forming step S10 shown in FIG. 1, the transfer sheet 40 shown in FIG. 2 is prepared, and a conductive paste 41 is printed on the surface 40A of the transfer sheet 40. The conductive paste 41 is printed with a substantially uniform thickness. The conductive paste 41 is made by adding a solvent or the like to the metal powder that constitutes the wiring layer 30. Examples of the material of this metal powder include W, Mo, a mixture of W and Mo, Cu, Ag, Ti, and alloys thereof. The thickness of the conductive paste 40 of the present disclosure is 30 μm.

Next, the conductive paste 41 is irradiated with a laser beam 42 to form a laser groove 43 from which the conductive paste 41 has been removed. Since the laser beam 42 is irradiated substantially perpendicularly to the surface 40A of the transfer sheet 40, the inner wall of the laser groove 43 is formed substantially perpendicularly to the surface 40A of the transfer sheet 40. The conductive paste 41 is separated into the wiring layer 30 and the spacing layer 60 by forming the laser grooves 43 . Thereby, the wiring layer 30 and the spacing layer 60 spaced apart from the wiring layer 30 are formed on the surface 40A of the transfer sheet 40.

In the transfer sheet arrangement step S20 shown in FIG. 1, the sheet main body 20 shown in FIG. 3 is prepared. Next, the transfer sheet 40 is turned upside down so that the wiring layer 30 faces the surface 20A of the sheet main body 20, and then the transfer sheet 40 is placed over the sheet main body 20. Thereby, the transfer sheet 40 is arranged with the wiring layer 30 and the spacing layer 60 in contact with the front surface 20A of the sheet main body 20, and the back surface 40B of the transfer sheet 40 facing upward.

In the wiring layer transfer step S30 shown in FIG. 1, a letterpress jig 50 shown in FIG. 4 is prepared. The relief jig 50 is a half-etched metal plate, and is made of, for example, SUS. The relief jig 50 has a convex portion 51 that is a portion that presses the transfer sheet 40, and the convex portion 51 has a contact surface 52 that contacts the back surface 40B of the transfer sheet 40.

Here, the shape and arrangement of the convex portion 51 will be explained with reference to the drawing of FIG. 5. Let the height of the convex portion 51 be H1, and the width of the contact surface 52 of the convex portion 51 be W1. Further, the thickness of the wiring layer 30 is set to H2, the width of the wiring layer 30 is set to W2, and the distance between the pair of spacing layers 60 arranged on both sides of the wiring layer 30 is set to D. At this time, before the wiring layer transfer step S30, the height H1 of the convex portion 51 and the width W1 of the contact surface 52 are set so as to satisfy both relational expressions 1 and 2 below.
Relational expression 1: D>W1≧W2
Relational expression 2: H1≧H2

When the outline of the contact surface 52 of the convex portion 51 is O, a pair of outlines O exist on both sides of the contact surface 52 in the width direction. In plan view, the wiring layer 30 is located inside a perpendicular line O1 drawn perpendicularly from the outline O to the spacing layer 60 side (an area on the side of the other perpendicular line O1 with one perpendicular line O1 as a reference), and The letterpress jig is positioned outside a perpendicular line O1 drawn perpendicularly from the outline O to the spacing layer 60 side (an area opposite to the other perpendicular line O1 with one perpendicular line O1 as a reference) in plan view. The tool 50 is positioned with respect to the transfer sheet 40. As a result, a portion 40B1 of the back surface 40B of the transfer sheet 40 corresponding to the portion of the front surface 40A where the wiring layer 30 is formed is pressed with the letterpress jig 50, and the wiring layer 30 is surface-pressed with its entire width. I can do it.

Next, the letterpress jig 50 is pressed onto the transfer sheet 40 so that the wiring layer 30 is embedded in the sheet body 20. Then, the wiring layer 30 is transferred to the sheet main body 20, and the spacing layer 60 remains on the transfer sheet 40. Although the entire wiring layer 30 is embedded in the sheet body 20 in FIG. 4, a part of the wiring layer 30 may be embedded in the sheet body 20, or the wiring layer 30 may be embedded in the sheet body 20. The image may be transferred in a manner that does not affect the image.

In the sheet main body stacking step S40 shown in FIG. 1, other sheet main bodies (for example, the second sheet main body 22 to the fourth sheet main body 24 shown in FIG. 6) are stacked on the sheet main body 20. When laminating the second sheet main body 22 to the fourth sheet main body 24, the second conductor layer 32 to the fourth conductive layer 34 are arranged in advance in the through holes of the second sheet main body 22 to the fourth sheet main body 24. Thereby, the sheet body 10 before firing is formed. Next, in the sheet body firing step S50 shown in FIG. 1, the sheet body 10 before firing is fired. Thereby, the sheet body 10 before firing is cured, and the sheet body 10 is formed.

[Operations and effects of embodiments of the present disclosure]
(1) The manufacturing method of the sheet body 10 of the present disclosure includes a sheet body 20 having a front surface 20A and a back surface 20B and made of an insulating material, and a wiring layer 30 disposed on the surface 20A of the sheet body 20 and made of a conductive material. A method for manufacturing a sheet body 10 comprising: preparing a transfer sheet 40 having a wiring layer 30 and a spacing layer 60 spaced apart from the wiring layer 30 formed on the surface thereof; Among the wiring pattern forming step S10, the transfer sheet arrangement step S20 in which the transfer sheet 40 is placed over the sheet main body 20 with the wiring layer 30 facing the sheet main body 20, and the back surface 40B of the transfer sheet 40, A wiring layer transfer step in which the wiring layer 30 is transferred to the sheet body 20 by pressing a portion 40B1 corresponding to the portion on the surface 40A where the wiring layer 30 is formed, with a letterpress jig 50, while leaving the spacing layer 60 on the transfer sheet 40. S30.

The wiring layer 30 is formed on the surface 40A of the transfer sheet 40 in the wiring pattern forming step S10, the transfer sheet 40 is placed over the sheet body 20 in the transfer sheet placement step S20, and a letterpress cure is applied in the wiring layer transfer step S30. By transferring the wiring layer 30 from the transfer sheet 40 to the sheet body 20 using the tool 50, it becomes unnecessary to remove the spacing layer 60 from the transfer sheet 40. That is, instead of removing the spacing layer 60 from the surface 40A of the transfer sheet 40 and leaving only the wiring layer 30 on the surface 40A of the transfer sheet 40, and then transferring the wiring layer 30 to the sheet body 20, the wiring Only the wiring layer 30 can be transferred to the sheet main body 20 while the layer 30 and the spacing layer 60 coexist on the transfer sheet 40. Further, since the spacing layer 60 remaining on the transfer sheet 40 can be collected and reused, material loss can be reduced.

(2) The letterpress jig 50 has a convex portion 51 that is a part that presses the transfer sheet 40, and in the wiring layer transfer step S30, the contact surface 52 of the convex portion 51 is pressed against the back surface 40B of the transfer sheet 40. , the wiring layer 30 is located inside the outline O of the contact surface 52 in a plan view, and the spacing layer 60 is located outside the outline O of the contact surface 52 in a plan view. is preferred.
When pressing the transfer sheet 40 with the letterpress jig 50, it is necessary to position the letterpress jig 50 and the transfer sheet 40. In the above manufacturing method, since the wiring layer 30 is located inside the outline O of the contact surface 52 in plan view, even if a positional deviation occurs during positioning, the wiring layer 30 is contacted while absorbing the positional deviation. The entire wiring layer 30 can be pressed and transferred to the sheet body 20 by the surface 52. By reliably transferring the wiring layer 30 in this manner, it is possible to prevent a portion of the wiring layer 30 from floating off the sheet body 20. Moreover, since the spacing layer 60 is located outside the outline O of the contact surface 52 in plan view, it is possible to avoid pushing the spacing layer 60 adjacent to the wiring layer 30 by the contact surface 52.

(3) In the wiring layer transfer step S30, it is preferable to press the letterpress jig 50 so that a part of the wiring layer 30 is embedded in the sheet body 20.
If a part of the wiring layer 30 is not embedded in the sheet body 20, the difference in level between the wiring layer 30 and the sheet body 20 will be approximately the same as the thickness of the wiring layer 30, so another sheet body 20 will be laminated on the sheet body 20. When manufacturing the sheet body 10, air bubbles are likely to be generated at the step. According to the above manufacturing method, since a portion of the wiring layer 30 is embedded in the sheet body 20, the difference in level between the wiring layer 30 and the sheet body 20 can be made smaller than the thickness of the wiring layer 30. Therefore, when manufacturing the sheet body 10, bubbles are less likely to be generated at the difference in level.

(4) The letterpress jig 50 has a convex portion 51 that is a part that presses the transfer sheet 40, and the height H1 of the convex portion 51 is greater than or equal to the thickness H2 of the wiring layer 30 before the wiring layer transfer step S30. It is preferable.
Since the height H1 of the convex portion 51 is greater than or equal to the thickness H2 of the wiring layer 30, the wiring layer 30 can be completely embedded in the sheet body 20.

(5) It is preferable that the wiring layer 30 is made of a resistor material.
When the sheet body 10 is manufactured using a resistor material for the wiring layer 30, the sheet body 10 functions as a heater because the wiring layer 30 generates heat when electricity is applied. Further, in the heater, if the thickness of the wiring layer 30 varies, the amount of heat generated will vary, so it is desirable to minimize the variation in the thickness of the wiring layer 30. If the present disclosure is applied to a method of manufacturing such a heater, a conductive paste 41 is applied to a transfer sheet 40 with a substantially uniform thickness, and then the wiring layer 30 is formed using the conductive paste 41, Since the wiring layer 30 can be transferred to the sheet main body 20, the thickness of the wiring layer 30 can be made substantially uniform. As a result, variations in the amount of heat generated by the heater can be suppressed.

[Example of application to electrostatic chuck]
Next, an electrostatic chuck 110 shown in FIG. 7 will be illustrated as a heater manufactured by the method for manufacturing the sheet body 10 of the present disclosure. The electrostatic chuck 110 is a device that attracts and holds semiconductor wafers, glass substrates, etc. (hereinafter referred to as "wafers"), and is a table on which wafers are placed during processes such as etching using plasma in a reduced pressure chamber. used as. The electrostatic chuck 110 has a chuck surface 121 capable of adsorbing a wafer to be heated, and includes a disc-shaped heater member 120 with a diameter of 300 mm and a thickness of 3 mm, for example, and a disc-shaped base member 150 with a diameter of 340 mm and a thickness of 20 mm, for example. are bonded using a bonding material 160.

The heater member 120 includes a ceramic substrate 130 made of an insulator, a heater electrode 140 arranged inside the ceramic substrate 130, and a chuck electrode arranged between the heater electrode 140 and the chuck surface 121 inside the ceramic substrate 130. 141. Here, the heater member 120 corresponds to the sheet body of the present disclosure, the ceramic substrate 130 corresponds to the sheet body of the present disclosure, and the heater electrode 140 corresponds to the wiring layer of the present disclosure.

The heater electrode 140 and the chuck electrode 141 are arranged side by side in the vertical direction, the chuck electrode 141 is arranged on the side closer to the chuck surface 121, and the heater electrode 140 is arranged below the chuck electrode 141. Terminals 142 are connected to the heater electrode 140 and the chuck electrode 141, respectively. Each terminal 142 is arranged to vertically penetrate the base member 150, and the lower end of each terminal 142 is exposed on the lower surface of the base member 150. Each terminal 142 is connected to a power source (not shown), and power from each power source can be supplied to the chuck electrode 141 and the heater electrode 140 through each terminal 142.

The heater electrode 140 is mainly composed of tungsten, molybdenum, an alloy thereof, or a carbide thereof. Although the heater electrode 140 in FIG. 7 is placed inside the ceramic substrate 130, it may be placed on the surface of the ceramic substrate 130 or inside a heater member (polyimide heater) separate from the ceramic substrate 130. As the heater electrode 140 in FIG. 7, a conductive paste is sintered and metalized on the surface of the ceramic substrate 130.

[Other embodiments]
(1) In the above embodiment, although the wiring layer 30 is located inside the perpendicular line O1 of the outline O of the contact surface 52 in plan view, the wiring layer 30 is positioned within the range where lifting of the wiring layer does not occur. The wiring layer may be located outside the perpendicular to the outline of the contact surface.

(2) In the above embodiment, although the spacing layer 60 is located outside the perpendicular line O1 of the outline O of the contact surface 52 in plan view, within the range where transfer of the spacing layer does not occur, The spacing layer may be located inside a line perpendicular to the outline of the contact surface.

(3) In the above embodiment, the height H1 of the convex portion 51 is greater than or equal to the thickness H2 of the wiring layer 30, but the height of the convex portion is within the range where the wiring layer 30 can be transferred. It may be less than the thickness of the layer.

(4) In the above embodiment, the wiring layer 30 is made of a resistor material, but when manufacturing something other than a heater (for example, a chuck electrode), the material of the wiring layer may not be a resistor material. Good too.

DESCRIPTION OF SYMBOLS 10... Sheet body 20... Sheet body 20A... Front side 20B... Back side 21... First sheet main body 22... Second sheet main body 23... Third sheet main body 24... Fourth sheet main body 25... Fifth sheet main body 30... Wiring layer 31... First wiring layer 32... Second conductor layer 33... Third conductor layer 34... Fourth conductor layer 35... Fifth wiring layer 40... Transfer sheet 40A... Front surface 40B... Back surface 40B1... Corresponding portion 41... Conductive paste 42... Laser light 43... Laser groove 50... Letterpress jig 51... Convex portion 52... Contact surface 60... Separation layer 100... Wiring board 110... Electrostatic chuck 120... Heater member 121... Chuck surface 130... Ceramic substrate 140... Heater electrode 141... Chuck electrode 142... Terminal 150... Base member 160... Bond material D... Separation distance between a pair of spacing layers H1... Height of convex portion H2... Thickness of wiring layer O... Outline O1... Perpendicular line S10... Wiring pattern forming step S20... Transfer sheet arrangement process S30...Wiring layer transfer process S40...Sheet main stacking process S50...Sheet main body firing process W1...width of contact surface W2...width of wiring layer

Claims (4)

A sheet body manufacturing method for manufacturing a sheet body comprising a sheet body having a front surface and a back surface and made of an insulating material, and a wiring layer disposed on the surface of the sheet body and made of a conductive material. ,
a wiring pattern forming step of preparing a transfer sheet on the surface of which the wiring layer and a spacing layer spaced from the wiring layer are formed;
a transfer sheet arrangement step of arranging the transfer sheet so as to overlap the sheet main body with the wiring layer facing the sheet main body;
By pressing a part of the back surface of the transfer sheet that corresponds to the part on the front surface where the wiring layer is formed with a letterpress jig, the wiring layer is transferred to the sheet main body while the spacing layer is transferred to the sheet body. A wiring layer transfer process to be left on the sheet for use ,
The letterpress jig has a convex portion that is a portion that presses the transfer sheet,
In the wiring layer transfer step, when the contact surface of the convex portion is pressed against the back surface of the transfer sheet,
The wiring layer is located inside the outline of the contact surface in plan view,
The method for manufacturing a sheet body, wherein the spacing layer is located outside the outline of the contact surface in plan view . 2. The method for manufacturing a sheet body according to claim 1 , wherein in the wiring layer transfer step, the relief jig is pressed so that a part of the wiring layer is embedded in the sheet body. The letterpress jig has a convex portion that is a portion that presses the transfer sheet,
Before the wiring layer transfer step,
The method for manufacturing a sheet body according to claim 1 or 2 , wherein the height of the convex portion is greater than or equal to the thickness of the wiring layer. The method for manufacturing a sheet body according to any one of claims 1 to 3 , wherein the wiring layer is made of a resistor material.

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