JP7430293B2 - Printing device and unit consumption calculation method for printing device - Google Patents

Description

This invention relates to a printing technique in which a squeegee is slid against a mask to print a coating material on a mask onto a substrate through an opening provided in the mask, and in particular the consumption of coating material per substrate. It relates to techniques for calculating quantities.

By placing a substrate on the underside of a mask that has been supplied with a coating material such as cream solder, and sliding a squeegee over the mask, the coating material is printed on the substrate in a pattern that corresponds to the openings provided in the mask. Printing devices are known. In this printing device, the coating material on the mask is gradually consumed as printing is repeated. Therefore, in order to control the amount of coating material on the mask, it is desirable to accurately grasp the coating material consumed per substrate and to replenish the appropriate amount of coating material at the appropriate timing.

Therefore, in the printing system described in Patent Document 1, for example, when the number of printed substrates reaches a set number, the width of the solder roll existing on the mask is detected by a photoelectric switch. The solder consumption amount is estimated based on the roll width detection result, and the solder replenishment timing is controlled based on this.

Japanese Patent Application Publication No. 2008-74054

In the printing system described in Patent Document 1, the solder roll on the mask has a cylindrical shape, and the solder volume is calculated on the assumption that the shape is maintained. However, the solder roll has a characteristic of being easily deformed in the width direction, and when the roll width is detected by the photoelectric switch, the solder roll may be deformed in the width direction more than expected. As a result, the measurement error in the amount of solder consumed becomes large, making it difficult to accurately calculate the amount of solder consumed per one board (corresponding to the "unit consumption" of the present invention).

This invention was made in view of the above-mentioned problem, and is a printing device that prints the coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask. The purpose is to calculate accurately.

A first aspect of the present invention is a printing apparatus that prints a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask, a coating material transfer section that scoops up the coating material from the mask and returns the scooped coating material onto the mask; a first weight measurement section that is connected to the coating material transfer section and measures the weight; Before performing the first printing of printing the coating material on the mask onto m substrates (m is a natural number of 1 or more), a first weight measurement is performed on the coating material transfer unit that scoops up the coating material from the mask. A pre-print information acquisition unit that acquires pre-print information indicating the weight of the coating material before the first printing based on the pre-print measurement value obtained by measuring the coating material in the first printing section; Post-printing information acquisition that obtains post-printing information indicating the weight of the coating material after the first printing based on the post-printing measurement value obtained by measuring the coating material transfer unit that has scooped up the coating material with the first weight measurement unit. The amount of coating material consumed per substrate can be calculated by dividing the decrease in coating material before and after the first printing by the number m of substrates printed in the first printing based on the pre-printing information and post-printing information. A unit consumption amount calculation unit that calculates a unit consumption amount of.

Further, a second aspect of the present invention is a printing apparatus that prints a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask, in which the consumption per substrate is reduced. A method for calculating unit consumption of a coating material for calculating a unit consumption of a coating material, the method comprising: performing a first printing of printing the coating material on a mask onto m substrates (m is a natural number of 1 or more); and a pre-print measurement value obtained by scooping up the coating material from the mask with the coating material transfer section and then measuring the coating material transfer section with the first weight measurement section before the first printing. a step of acquiring pre-printing information indicating the weight of the coating material before the first printing based on the first printing; and a step of scooping up the coating material from the mask with the coating material transfer section after the first printing. a step of obtaining post-printing information indicating the weight of the coating material after the first printing based on a post-printing measurement value obtained by measuring the amount of the coating material with a first weight measurement unit; The present invention is characterized by comprising a step of calculating a unit consumption amount by dividing the amount of decrease in the coating material before and after the first printing by the number m of substrates printed in the first printing.

In the invention configured in this way, before the first printing in which the coating material is printed on m substrates (m is a natural number of 1 or more) using the coating material on the mask, The coating material transfer section that has scooped up the coating material is measured by the first weight measurement section. Based on the pre-print measurement value, pre-print information indicating the weight of the coating material before the first printing is acquired. After the first printing, post-printing information indicating the weight of the coating material after the first printing is acquired in the same manner. The difference between these pre-printing information and post-printing information corresponds to the amount of reduction in coating material due to the first printing, that is, the consumption amount, and by dividing the consumption amount by the number of substrates printed in the first printing (m), the unit of coating material Consumption is calculated accurately.

Here, when the coating material transfer section that has scooped up the coating material is measured by the first weight measurement section, the measured value includes the weight of the scooped coating material and the weight of the coating material transfer section. Therefore, in determining the amount of decrease in the coating material in the first printing, the measured value before printing and the measured value after printing may be used as pre-printing information and post-printing information, respectively, and may be calculated from the difference between the two. In addition, since the first weight measuring section is connected to the coating material transfer section, the weight of the coating material transfer section is subtracted in advance, so-called zero point adjustment, and then the coating material is scooped up. The coating material transfer section may also be measured. In this case, the measured value by the first weight measurement unit is the weight of the scooped coating material itself, and similarly to the above, the pre-print measured value and the post-print measured value are used as pre-print information and post-print information, respectively. I can do it.

Moreover, when the above-mentioned zero point adjustment is not performed, it may be considered that the weight of the coating material transfer section is included in the measured value by the first weight measurement section. In other words, by subtracting the weight of the coating material transfer section from the measured value before printing, the pre-printing weight of the coating material is obtained as pre-printing information, and by subtracting the weight of the coating material transfer section from the measured value after printing, the weight of the coating material after printing is calculated. As information, the weight of the coating material after printing may be determined. Thereby, the weight of the coating material before and after the first printing can be accurately acquired, and the unit consumption of the coating material can be accurately calculated.

Further, while repeatedly scooping up the coating material and returning it onto the mask, the coating material may remain attached to the coating material transfer portion, and the amount of the coating material remaining attached may vary. In this case, it is preferable to consider the weight of the remaining coating material. More specifically, regarding the pre-printing information acquisition unit, before the first printing and before the coating material transfer unit scoops up the coating material from the mask, the pre-printing information acquisition unit collects the coating material that adheres to the coating material transfer unit before printing. The configuration may be such that the pre-printing total value of the deposited weight and the weight of the coating material on the mask is acquired as the pre-printing information. In addition, the post-printing information acquisition unit calculates the post-printing weight of the coating material that adheres to the coating material transfer unit after the first printing and before the coating material transfer unit scoops up the coating material from the mask. , and the weight of the coating material on the mask after printing may be configured to be acquired as the pre-printing information. By doing this, the weight of the coating material before and after the first printing can be obtained with high accuracy without being affected by the residual coating material, and the unit consumption of the coating material can be calculated more accurately. be able to.

In order to obtain the pre-printing total value in this way, the weight of the coating material transfer section may be subtracted from the pre-printing measured value. Furthermore, in order to obtain the post-printing total value, the weight of the coating material transfer section may be subtracted from the post-printing measured value. The difference between the pre-printing total value and the post-printing total value obtained in this way is the reduction amount, and by dividing the above difference by the number of printed sheets m, the amount of coating material, including the amount of coating material attached to the coating material transfer section, is reduced. Unit consumption can be determined accurately.

In addition, a squeegee may be included in the solder attachment destination. If the weight of the solder attached to the squeegee varies before and after the first printing, the amount of variation may affect the calculation of the unit consumption amount. Taking this point into consideration, a second weight measurement unit that is connected to the squeegee and measures the weight is further provided, and the pre-print information acquisition unit measures the second weight of the squeegee separated from the mask before performing the first printing. The pre-print information obtained by measuring the squeegee in the section is added to the pre-print information to correct the pre-print information, and the post-print information acquisition section performs a second weight measurement of the squeegee separated from the mask after performing the first printing. The post-printing information obtained by measuring the squeegee in the unit is added to the post-printing information to correct the post-printing information, and the unit consumption calculation unit calculates the amount of coating based on the corrected pre-printing information and the corrected post-printing information. It is desirable to configure the system to calculate the unit consumption of materials. As a result, the weight of the solder adhering to the squeegee is taken into consideration, and as a result, it becomes possible to calculate the unit consumption amount with higher accuracy.

Further, when the solder is scooped up from the mask, the solder may remain on the mask, and the amount of the remaining solder may vary. In consideration of this point, a third weight measurement unit is further provided to measure the total weight of the mask and the coating material attached to the mask, and the pre-printing information acquisition unit is configured to measure the total weight of the mask and the coating material attached to the mask. After the coating material is scooped up from the mask by the loading section, the mask pre-printing information measured by the third weight measuring section is added to the pre-printing information to correct the pre-printing information, and the post-printing information acquisition section After executing one printing and after scooping up the coating material from the mask by the coating material transfer section, the post-mask printing information measured by the third weight measuring section is added to the post-printing information to obtain the post-printing information. It is desirable that the unit consumption amount calculation unit calculates the unit consumption amount of the coating material based on the corrected pre-print information and the corrected post-print information. As a result, the weight of the solder remaining on the mask when the solder is scooped up from the mask is taken into consideration, and as a result, it becomes possible to calculate the unit consumption amount with higher accuracy.

It also includes a storage unit that stores a threshold value of the total amount of coating material consumed, a total consumption calculation unit that calculates the total consumption of coating material based on the unit consumption and the number of substrates printed, and a consumption amount calculated by the total consumption calculation unit. A replenishment requesting section that requests replenishment of the coating material when the total amount exceeds a threshold value may be provided. Thereby, the coating material is replenished at an appropriate timing, the coating material can be printed on the substrate smoothly, and the operating rate of the printing apparatus can be increased.

In addition, in the second printing after the first printing, there is no timing to directly measure the weight of the coating material, so each time the coating material on the mask is printed on the substrate, the total consumption amount is compared with the threshold value and the total consumption amount is calculated. It is desirable to request replenishment only when a threshold is exceeded. As a result, in the second printing, the coating material is replenished at an appropriate timing, the coating material can be smoothly printed on the substrate, and the operating rate of the printing apparatus can be increased.

Furthermore, when requesting replenishment of the coating material, the amount obtained by multiplying the unit consumption amount calculated by the unit consumption amount calculation unit by the total number of substrates printed in the first printing and the second printing is used as replenishment information. It is desirable to add. Such a replenishment request makes it possible to optimize the amount of coating material on the mask after replenishment, resulting in high print quality.

According to the present invention, in a printing device that prints a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask, the unit consumption of the coating material is accurately calculated. can do.

1 is a schematic plan view showing the overall configuration of a first embodiment of a printing device according to the present invention. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1. FIG. FIG. 3 is a block diagram showing the electrical configuration of the printing apparatus shown in FIGS. 1 and 2. FIG. 2 is a flowchart showing a printing process executed by the printing apparatus shown in FIG. 1. FIG. 5 is a flowchart showing a unit consumption amount acquisition process executed in the print process of FIG. 4. FIG. FIG. 7 is a diagram showing a unit consumption table that associates the mask type of production masks with the solder consumption per mask. FIG. 3 is a diagram showing the relationship between the number of printed sheets and the total amount of solder consumed in the first embodiment. FIG. 7 is a schematic diagram showing a solder scooping operation in a fourth embodiment of the printing apparatus according to the present invention. 12 is a flowchart illustrating a unit consumption amount acquisition process in a fourth embodiment of the printing apparatus according to the present invention. FIG. 7 is a diagram showing the relationship between the number of printed sheets and the total amount of solder consumed in the fifth embodiment of the printing apparatus according to the present invention. FIG. 7 is a schematic diagram showing an information acquisition operation in a sixth embodiment of the printing apparatus according to the present invention. FIG. 7 is a schematic diagram showing an information acquisition operation in an eighth embodiment of the printing apparatus according to the present invention.

FIG. 1 is a schematic plan view showing the overall configuration of a first embodiment of a printing apparatus according to the present invention. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. FIG. 3 is a block diagram showing the electrical configuration of the printing apparatus shown in FIGS. 1 and 2. As shown in FIG. 1, the printing device 1 transports a substrate B (see FIG. 2) in the X1 direction by a pair of conveyors 12, and prints solder (symbols S1 and S2 in FIG. 8) on the substrate B at a printing position. It is a device that does Board B is a printed circuit board on which components (electronic components) are mounted. Further, solder is a bonding material for bonding components onto the board B. In addition, in the following description, the conveyance direction (X1 direction) and the opposite direction (X2 direction) of the substrate B by the pair of conveyors 12 (belt conveyors) are referred to as the X direction, and the direction substantially orthogonal to the X direction in the horizontal plane is referred to as the Y direction. direction. Further, a direction substantially orthogonal to the X direction and the Y direction is defined as the Z direction (vertical direction).

The printing apparatus 1 carries in a substrate B by a carry-in conveyor 1a, performs a printing process on the surface of the carried-in board B using a printing pattern Pa formed on a mask M, and then prints the substrate B on which the printing process has been performed. It is configured to be carried out by a carrying out conveyor 1b. In the first embodiment, as will be described in detail later, in addition to the mask M used for printing to produce the substrate B as described above, there is a dedicated mask used for solder rolling. Therefore, when explaining the two while distinguishing between them, the mask used directly for producing the board B will be referred to as the "production mask Mp," and the mask specifically used for solder rolling will be referred to as the "rolling mask Mr." to be called. On the other hand, when explaining the two without distinguishing them, they will simply be referred to as "mask M."

Of these two mask types, the production mask Mp has a rectangular flat plate shape in plan view (as viewed from the Z1 direction side), as shown in FIG. The production mask Mp has a plurality of openings P1 that form a printing pattern Pa, and a non-opening section P2 that is an area other than the plurality of openings P1. Further, a frame F is attached to the outer peripheral portion of the production mask Mp. Note that FIGS. 1 to 3 illustrate a state in which the production mask Mp is moved from a work position W for performing printing processing using the production mask Mp to a mask exchange unit 7, which will be described later. On the other hand, the rolling mask Mr has a flat plate shape having the same planar size as the production mask Mp. However, the rolling mask Mr does not have an opening and is thicker than the production mask Mp, and as a result has relatively high rigidity.

As shown in FIG. 2, the printing apparatus 1 includes a base 2, a printing table unit 3, a camera unit 4, a mask clamp member 5, a squeegee unit 6, a mask exchange unit 7, and detection sensors 81, 82. and a control unit 9 (see FIG. 3).

The printing table unit 3 is provided on the base 2 and is configured to hold the substrate B and align it with the production mask Mp. Specifically, the print table unit 3 includes an X-axis moving mechanism (not shown), a Y-axis moving mechanism (not shown), an R-axis moving mechanism (not shown), and a Z-axis moving mechanism (not shown). (not shown), a printing table 11, and a pair of conveyors 12 (see FIG. 1).

The X-axis moving mechanism has an X-axis drive unit 13 (see FIG. 3) as a drive source, and moves the printing table 11 in the X direction. The Y-axis moving mechanism has a Y-axis drive unit 14 (see FIG. 3) as a drive source, and moves the printing table 11 in the Y direction. The R-axis moving mechanism has an R-axis drive unit 15 (see FIG. 3) as a drive source, and rotates the printing table 11 around a rotation axis extending in the Z direction. The Z-axis moving mechanism has a Z-axis drive unit 16 (see FIG. 3) as a drive source, and moves the printing table 11 in the Z direction.

The printing table 11 includes a table main body 21, a pair of bracket members 22 provided on the table main body 21, a support plate 23 on which a plurality of backup pins 23a are arranged, and a support plate drive that moves the support plate 23 in the Z direction. 24. A conveyor 12 (see FIG. 1) is provided above each of the pair of bracket members 22. The backup pins 23a are configured to support the substrate B from below when the support plate 23 is moved in the Z1 direction (upward) by the support plate drive unit 24.

As shown in FIG. 1, the pair of conveyors 12 are provided so as to extend along the X direction. Further, the pair of conveyors 12 are arranged parallel to each other with a predetermined distance apart in the Y direction. Further, the pair of conveyors 12 are configured so that the interval in the Y direction can be adjusted in accordance with the width of the substrate B to be conveyed. Specifically, the pair of conveyors 12 are configured such that the interval (width) in the Y direction is adjusted by a substrate width axis drive unit 12a (see FIG. 3).

The camera unit 4 is configured to image the production mask Mp and the substrate B, as shown in FIGS. 2 and 3. Specifically, the camera unit 4 includes a camera X-axis moving mechanism 31, a camera Y-axis moving mechanism 32, and an imaging section 33 having a substrate camera 33a and a mask camera 33b. The camera X-axis moving mechanism 31 includes an X-axis motor 31a and a ball screw 31b extending in the X direction. The camera Y-axis moving mechanism 32 includes a Y-axis motor 32a and a ball screw 32b extending in the Y direction. The board camera 33a is configured to image the board B and recognize the relative position of the board B with respect to the printing table 11. The mask camera 33b is configured to image the mask M and recognize the position of the mask M.

In this way, in the printing apparatus 1, after the relative position of the substrate B with respect to the production mask Mp is recognized using the substrate camera 33a and the mask camera 33b, the X-axis moving mechanism, the Y-axis moving mechanism and the The relative position (position and inclination within the horizontal plane) of the substrate B with respect to the production mask Mp is accurately determined by the R-axis moving mechanism. Then, in the printing apparatus 1, with the relative position of the substrate B with respect to the production mask Mp accurately determined, the substrate B is raised by the Z-axis movement mechanism of the printing table unit 3 and comes into contact with the lower surface of the production mask Mp. be done. Moreover, after confirming that the rolling mask Mr is located at the work position W using the mask camera 33b, the rolling process is executed.

As shown in FIG. 3, the mask clamp member 5 is used to hold the mask M when printing solder on the substrate B according to the printing pattern Pa using the production mask Mp or when performing rolling processing using the rolling mask Mr. It is configured to be held at the working position W. Specifically, the mask clamp member 5 includes a first mask holding part 41 that holds the end of the mask M in the X1 direction, and a second mask holding part 42 that holds the end of the mask M in the X2 direction. , a pressing part (not shown) provided in the first mask holding part 41 and pressing the mask M in the X2 direction.

As shown in FIG. 2, the squeegee unit 6 is configured to move the solder supplied onto the upper surface of the mask M while scraping it along the upper surface of the mask M by reciprocating in the Y direction. Specifically, the squeegee unit 6 includes a squeegee 51, a squeegee Y-axis drive unit 52 that moves the squeegee 51 in the printing direction (Y direction), and a squeegee Z-axis drive that moves the squeegee 51 in the vertical direction (Z direction). 53 (see FIG. 3), and a squeegee R-axis drive section 54 (see FIG. 3) that rotates the squeegee 51 around a rotation axis extending in the X direction.

The squeegee 51 is formed to extend in the X direction. The squeegee 51 is configured to print the solder supplied to the production mask Mp while applying a predetermined printing pressure (load) to the mask M, and knead the solder supplied to the rolling mask Mr. . The squeegee Y-axis drive unit 52 includes a Y-axis motor 52a and a ball screw 52b extending in the Y direction. Although not shown in the drawings, the squeegee Z-axis drive unit 53 includes a Z-axis motor, a belt, and a ball screw extending in the Z direction.

The squeegee unit 6 includes a mask slider 55 that slides the mask M in the Y direction and performs an exchange operation of exchanging the mask M, as shown in FIG. Here, a single mask slider 55 is arranged in the squeegee unit 6. The mask slider 55 includes a slide portion 55a that is movable in the Z direction (vertical direction) and a housing portion 55b that accommodates the slide portion 55a. The mask slider 55 is configured by, for example, an air cylinder, the slide portion 55a is configured by the rod of the air cylinder, and the housing portion 55b is configured by the cylinder of the air cylinder.

The mask slider 55 is configured to move integrally in the Y direction by moving the squeegee 51 in the Y direction by the squeegee Y-axis drive unit 52. The mask slider 55 also moves in the Z2 direction ( (downward). The mask slider 55 moves in the Z1 direction (upwards) so that the slide part 55a is accommodated in the housing part 55b until the slide part 55a does not come into contact with the frame F of the mask M at the working position W in the horizontal direction (Y direction). direction).

In this way, the squeegee 51 and the mask slider 55 are integrally provided in the squeegee unit 6. Further, as the squeegee unit 6 moves, the squeegee 51 and the mask slider 55 are configured to move integrally in the Y direction. The slide portion 55a of the mask slider 55 comes into contact with the frame F of the mask M from the Y1 direction or the Y2 direction, and moves the mask M in the Y1 direction or the Y2 direction.

Squeegee unit 6 includes a solder scooping unit 56 that scoops up solder on mask M. The solder scooping unit 56 has a scooping portion 56a that scoops up and holds solder on the mask M. The scooping part 56a is arranged between a lowered position for scooping up the solder on the mask M or lowering the scooped solder onto the mask M, and an elevated position for not scooping up the solder on the mask M. It is configured to be movable in the vertical direction. The solder scooping unit 56 is configured to move integrally in the Y direction by moving the squeegee 51 in the Y direction by the squeegee Y-axis drive section 52. The solder scooping unit 56 is moved in the Y2 direction with the scooping section 56a disposed in the lowered position, thereby scooping up and holding the solder on the mask M in the scooping section 56a. Further, the solder scooping unit 56 is moved in the Y1 direction with the scooping portion 56a disposed at the lowered position, thereby lowering the scooped solder onto the mask M from the scooping portion 56a. Thus, in this embodiment, the scooping part 56a corresponds to an example of the "coating material transfer part" of the present invention.

Further, a first weight measuring section 56b (FIG. 3) configured with a load cell or the like is connected to the scooping section 56a. When the scooping section 56a is scooping up solder on the mask M, the first weight measuring section 56b measures the total weight of the weight Ws0 of the scooping section 56a alone and the weight of the solder. On the other hand, when the scooped up solder is lowered onto the mask M and when the solder on the mask M is not scooped up, the first weight measuring section 56b measures only the weight Ws0 of the scooped up section 56a. In this embodiment, the weight Ws0 of the scooping part 56a is measured by the first weight measurement part 56b immediately after installation of a new product or immediately after replacement/repair, and is stored in the storage part 92 of the control unit 9.

The mask exchange unit 7 is configured to be able to accommodate a plurality of (two) masks M. Specifically, the mask exchange unit 7 includes a first storage section 61, a second storage section 62, and an elevating section 63 (FIG. 3). The first storage section 61 and the second storage section 62 are each configured to be able to store one mask M. The first storage section 61 and the second storage section 62 are arranged side by side in the vertical direction. The first storage section 61 is an upper storage section arranged above the second storage section 62 . The second storage section 62 is a lower storage section arranged below the first storage section 61 . The elevating section 63 is configured to move the first storage section 61 and the second storage section 62 in the vertical direction. In the mask exchange unit 7, an elevating section 63 is attached to the base 2. In the mask exchange unit 7, the second storage section 62 is attached to the elevating section 63. In the mask exchange unit 7, a first storage section 61 is attached to a second storage section 62. Thereby, the first storage section 61 and the second storage section 62 are raised and lowered integrally as the elevating section 63 moves up and down.

The first storage section 61 and the second storage section 62 have a lowered position for loading and unloading the production mask Mp into the first storage section 61 and a raised position for loading and unloading the rolling mask Mr into the second storage section 62. It is configured to be movable in the Z direction (vertical direction) between the two.

The detection sensor 81 is configured to detect the production mask Mp in a state spanning the mask clamp member 5 and the mask exchange unit 7, as shown in FIG. Further, the detection sensor 82 is configured to detect the rolling mask Mr in a state astride the mask clamp member 5 and the mask exchange unit 7, as shown in FIG. Specifically, when moving the production mask Mp between the work position W and the first storage section 61, the detection sensor 81 provided in the first storage section 61 detects the presence of the mask clamp member 5 and the first storage section. The production mask Mp is configured to detect the production mask Mp stopped while straddling the mask 61. When the rolling mask Mr is moved between the working position W and the second storage section 62, the detection sensor 82 provided in the second storage section 62 straddles the mask clamp member 5 and the second storage section 62. The rolling mask Mr is configured to detect the rolling mask Mr stopped in this state. The detection sensors 81 and 82 are, for example, transmission type sensors, and include a light projecting section (not shown) that emits light and a light receiving section (not shown) that receives the light emitted from the light projecting section. have

Although not shown in FIGS. 1 to 3, the cleaning unit 10 (FIG. 3) is provided for cleaning the lower surface of the production mask Mp fixed at the working position W by the mask clamp member 5. ing. This cleaning unit 10 includes a cleaner (not shown) and a cleaner Y-axis moving mechanism 102 (FIG. 3). The cleaner is placed at a height where it can come into contact with the lower surface of the production mask Mp, and is placed at a cleaning standby position away from the production mask Mp fixed at the working position W in the Y2 direction and at a position directly below the production mask Mp. It is provided so that it can be moved back and forth between the two. A cleaner Y-axis moving mechanism 102 is connected to this cleaner, and the cleaner Y-axis moving section (not shown) of the cleaner Y-axis moving mechanism 102 operates in response to a command from the drive control section 93 of the control unit 9. to move the cleaner in the Y direction. The cleaner is moved by the cleaner Y-axis moving mechanism 102 while contacting the lower surface of the production mask Mp fixed at the work position W, thereby cleaning the lower surface of the production mask Mp.

The control unit 9 includes a main control section 91, a storage section 92, a drive control section 93, an IO control section 94, and a camera control section 95, as shown in FIG. The main control unit 91 is configured by a computer including a CPU (Central Processing Unit). The storage unit 92 includes a hard disk device, etc., and stores the weight Ws0 of the scooping unit 56a described above, various data tables including a unit consumption table, various data set by the operator, board data, machine data, printing programs, etc. are doing. The main control section 91 has a function of controlling each section of the printing apparatus 1 based on a printing program stored in the storage section 92. Here, the board data includes information on the type of board B, information on the size of board B, information corresponding to the type of board B, information on rolling mask Mr used for rolling solder, and printing for each type of board B. Contains information such as number of sheets. The machine data includes information on the movement limit position of the squeegee unit 6 in the Y direction, information on the movement limit position of the camera unit 4 in each of the X and Y directions, information on the movement limit position of the cleaner in the Y direction, and the like.

The main control section 91 is configured to control the squeegee unit 6 by a drive control section 93. Specifically, the drive control unit 93 controls the drives of the squeegee Y-axis drive unit 52, the squeegee Z-axis drive unit 53, and the squeegee R-axis drive unit 54, and the squeegee 51 is moved in the Y direction and the Z direction. At the same time, the squeegee 51 is rotated around a rotation axis extending in the X direction.

The main control section 91 is configured to control the print table unit 3 by means of a drive control section 93 . Specifically, the main control unit 91 causes the drive control unit 93 to drive the X-axis drive unit 13, the Y-axis drive unit 14, the R-axis drive unit 15, and the Z-axis drive unit 16, so that the Then, while moving the substrate B in the Z direction, the substrate B is rotated around a rotation axis extending in the Z direction. Further, the main control unit 91 causes the drive control unit 93 to drive the support plate drive unit 24 to move the support plate 23, thereby moving the backup pin 23a in the Z direction (vertical direction). Further, the main control section 91 causes the drive control section 93 to drive the substrate width axis drive section 12a to adjust the distance (width) between the pair of conveyors 12 in the Y direction. Further, the main control section 91 causes the drive control section 93 to drive the substrate transport shaft drive section 17 to transport the substrate B in the X direction.

The main control section 91 is configured to control the camera unit 4 by a drive control section 93. Specifically, the main control unit 91 causes the drive control unit 93 to drive the camera X-axis moving mechanism 31 and camera Y-axis moving mechanism 32 to move the imaging unit 33 (board camera 33a and mask Move the camera 33b).

The main control section 91 is configured to control the cleaning unit 10 by a drive control section 93. Specifically, the main control section 91 causes the drive control section 93 to drive a cleaner Y-axis drive section (not shown) of the cleaner Y-axis movement mechanism 102 to reciprocate the cleaner in the Y direction.

The main control section 91 is configured to control the camera unit 4 by a camera control section 95. Specifically, the main control unit 91 controls the imaging operation of the board B by the board camera 33a using the camera control unit 95. The main control unit 91 controls the imaging operation of the mask M by the mask camera 33b using the camera control unit 95.

Further, the main control section 91 is configured to control the squeegee unit 6 using the IO control section 94 . Specifically, the main control unit 91 controls the vertical movement of the slide portion 55a of the mask slider 55 using the IO control unit 94. Further, the main control unit 91 obtains, via the IO control unit 94, information regarding the scooping unit 56a measured by the first weight measuring unit 56b and the weight of the solder scooped up by the scooping unit 56a.

Further, the main control section 91 is configured to control the mask exchange unit 7 using the IO control section 94 . Specifically, the main control section 91 controls the lifting and lowering operations of the first storage section 61 and the second storage section 62 of the mask exchange unit 7 by the lifting section 63 using the IO control section 94 . In addition, the main control unit 91 receives, by the IO control unit 94, a detection signal from the detection sensor 81 when the production mask Mp stopped while straddling the mask clamp member 5 and the first storage portion 61 is detected. It is configured as follows. The main control unit 91 is configured to receive a detection signal from the detection sensor 82 when the rolling mask Mr stopped in a state straddling the mask clamp member 5 and the second storage part 62 is detected by the IO control unit 94. It is configured.

The main control unit 91 is configured to control each part of the apparatus in this way, and as explained later with reference to FIGS. Pre-print information and post-print information are acquired before and after the first printing is performed on m sheets (m is a natural number of 1 or more, and is a value specified by the operator). The pre-printing information is pre-printing information indicating the weight W1 of the solder on the production mask Mp before the first printing. On the other hand, the post-printing information is pre-printing information indicating the weight W2 of the solder on the production mask Mp after the first printing. In this way, the main control section 91 functions as a "pre-print information acquisition section" and a "post-print information acquisition section" of the present invention.

Furthermore, the main control unit 91 calculates the amount of solder decrease before and after the first printing based on the pre-printing information (solder weight W1) and the post-printing information (solder weight W2), and determines the amount of solder reduced before and after the first printing. Divide by the number of sheets m, that is,
Wu=(W1-W2)/m
Accordingly, the unit consumption amount Wu of solder consumed per one board is calculated. In this way, the main control section 91 also functions as the "unit consumption calculation section" of the present invention.

Further, the main control unit 91 calculates the total amount of solder consumed based on the total number of printed circuit boards B in the first printing and the second printing performed subsequent to the first printing, and the unit consumption amount Wu. It has a function of requesting replenishment of solder when the total amount consumed exceeds a threshold value Wth (see FIG. 7) stored in advance in the storage unit 92. In this way, the main control section 91 also functions as the "total consumption calculation section" and the "replenishment requesting section" of the present invention.

Further, reference numerals 96 and 97 in FIG. 3 are an input section and a display section, respectively. The input unit 96 is comprised of various switches, touch panels, etc., and receives various input setting instructions such as the number of prints m for the first printing and the threshold value Wth set by the operator. The display section 97 is composed of a liquid crystal display device, a lamp, etc., and displays various information under the control of the main control section 91.

FIG. 4 is a flowchart showing print processing executed by the printing apparatus shown in FIG. FIG. 5 is a flowchart showing the unit consumption amount acquisition process executed in the print process of FIG. FIG. 6 is a diagram showing an example of a unit consumption table that associates the mask type of a production mask with the solder consumption per mask, and the unit consumption table is stored in the storage unit 92. Further, FIG. 7 is a diagram showing the relationship between the number of printed sheets and the total amount of solder consumed.

In this printing apparatus 1, the main control part 91 controls each part of the apparatus as follows in accordance with the printing program stored in the storage part 92 to repeatedly print solder on the board B. Upon receiving the print command, the main control unit 91 acquires print conditions (step S1). The printing conditions include information regarding the type of production mask Mp to be used, in addition to the type of substrate B and solder. Based on this mask type information, the main control unit 91 determines whether the unit consumption amount Wu corresponding to the production mask Mp used for printing is recorded in the unit consumption amount table shown in FIG. 6 (step S2).

Here, if the unit consumption amount Wu corresponding to the production mask Mp is recorded ("YES" in step S2), the process skips the unit consumption amount acquisition process (step S3) and proceeds to step S4. On the other hand, if the unit consumption amount Wu corresponding to the production mask Mp is unknown ("NO" in step S2), the main control unit 91 controls each part of the apparatus as shown in FIG. In this procedure, the first printing, the calculation of solder weights W1 and W2 before and after the first printing, and the calculation of the unit consumption amount are executed.

In the unit consumption acquisition process, the scooping unit 56 scoops up solder (step S31). More specifically, the main control unit 91 moves the scooping unit 56 in the Y direction and positions it above the edge region of the production mask Mp placed at the work position W where the solder is located. Then, the main control section 91 lowers the scooping section 56a of the solder scooping unit 56 to the lowered position. Further, the main control section 91 moves the solder scooping unit 56 in the Y2 direction (direction for scooping up the solder S) with the scooping section 56a placed in the lowered position. As a result, the solder S on the production mask Mp moves onto the scooping part 56a of the solder scooping unit 56 and is held there. Thereafter, the main control section 91 raises the scooping part 56a of the solder scooping unit 56 holding the solder S to the raised position. In this way, all the solder on the production mask Mp is transferred to the scooping part 56a.

The main control unit 91 receives the measurement result of the load cell constituting the first weight measurement unit 56b as a measurement value before the first printing (hereinafter referred to as "preprint measurement value"). This pre-print measurement value is the sum of the weight Ws0 of the scooping part 56a and the weight W1 of the solder. Therefore, the main control unit 91 reads the weight Ws0 from the storage unit 92, and calculates the weight W1 of the solder by subtracting the weight Ws0 from the measured value before printing (step S32).

In this way, when the weight W1 of the roll-shaped solder existing on the production mask Mp is determined before performing the first printing, the scooped up solder is unloaded onto the production mask Mp by the scooping unit 56. (Step S33). More specifically, the main control section 91 lowers the scooping section 56a of the solder scooping unit 56 to the lowered position. Further, the main control section 91 moves the solder scooping unit 56 in the Y1 direction (the direction in which the solder S is lowered) with the scooping section 56a placed in the lowered position. As a result, the solder on the scooping portion 56a of the solder scooping unit 56 is taken down onto the production mask Mp. After that, the main control section 91 raises the scooping part 56a of the solder scooping unit 56, which has removed the solder, to the raised position.

In the next step S34, the main control section 91 executes printing of the substrate B by the number m of prints specified in advance by the operator via the input section 96. In other words, each time one piece of solder is printed on the board B using the production mask Mp (step S34a), the main control unit 91 increments the total number of prints by "1" and then determines whether the total number of prints is the specified number. It is determined whether the number m of printed sheets has been reached (step S34b). Then, while the total number of prints does not reach the number m of prints, printing is repeated. In this way, while the first printing is being performed, solder is consumed by the unit consumption amount Wu every time one board B is printed, as shown in FIG. 7, for example. Therefore, when printing is completed for the specified number of sheets m, the total solder consumption Wm becomes (Wu×m), while the weight W2 of the solder on the production mask Mp is the weight W1 before printing. decreases more than

Therefore, in this embodiment, the main control unit 91 calculates the unit consumption amount Wu by executing steps S35 to S38 below. That is, when the total number of prints reaches the specified number of prints m, steps similar to steps S31 and S32 (steps S35 and S36) are executed to calculate the weight W2 of the solder after the first printing. That is, after scooping up the solder by the scooping unit 56 (step S35), the main control section 91 converts the measurement results of the load cells constituting the first weight measurement section 56b into the measurement values after the first printing (hereinafter referred to as (referred to as "measured value after printing"). Since this post-printing measured value is the sum of the weight Ws0 of the scooping unit 56a and the weight W2 of the solder, the main control unit 91 reads the weight Ws0 from the storage unit 92 and uses this from the post-printing measured value. The weight W2 of the solder is calculated by subtracting the weight Ws0 (step S36).

In this way, when the weight W2 of the roll-shaped solder existing on the production mask Mp is determined after performing the first printing, the scooped up solder is unloaded onto the production mask Mp by the scooping unit 56. (Step S37). In parallel, the main control unit 91 executes the following equation,
Wu=(W1-W2)/m
Accordingly, the unit consumption amount Wu of solder consumed per one board is calculated (step S38). Furthermore, the main control unit 91 additionally records the unit consumption amount Wu in the unit consumption table shown in FIG. 6 while associating it with the type of production mask Mp, and updates the unit consumption table in the storage unit 92 (step S39). .

When the unit consumption acquisition process (step S3) is completed, as shown in FIG. 4, printing of the (m+1)th and subsequent sheets is continued using the production mask Mp. On the other hand, if the unit consumption amount Wu has been recorded ("YES" in step S2), the first printing is passed and the second printing is executed. Although the presence or absence of the first printing is different in this way, the second printing (step S4) is executed while always monitoring the total amount of solder consumed based on the unit consumption amount Wu. That is, when the solder printing on the board B (step S4a) is completed in step S4, the main control unit 91 uses the following formula (total solder consumption) = unit consumption Wu x (number of printed sheets)
The total amount of solder consumed is calculated based on and compared with the threshold value Wth (step S4b). Here, for example, as shown in FIG. 7, if the total amount of solder consumption W(n-1) when the number of printed sheets is (n-1) is less than or equal to the threshold value Wth ("YES" in step S4b), the main control unit 91 determines that enough solder remains on the production mask Mp to print at least one substrate B, and repeats the second printing (step S4a).

On the other hand, as shown in the figure, if the total amount of solder consumption Wn when the number of printed sheets is n exceeds the threshold value Wth ("NO" in step S4), the main control unit 91 controls the production mask Mp to It is determined that there is not enough solder left to print the next board B, that is, the (n+1)th board B, and the second printing (step S4a) is canceled. Then, the main control unit 91 calculates the weight Wn (=Wu×n) of the same solder as that consumed to print n substrates B as the replenishment amount (step S5). Subsequently, the main control section 91 instructs the operator to replenish solder by displaying on the display section 97 that the weight of solder corresponding to the total consumed amount Wn calculated in step S5 is to be replenished (step S6).

Note that, as shown in FIG. 7, when printing is restarted after solder replenishment based on the instruction, the main control unit 91 does not perform the first printing and reduces the unit consumption. The second printing is repeatedly executed while monitoring the total amount of solder consumption based on the total consumption amount Wn recorded in the amount table. For example, as shown in the figure, when p sheets are printed after printing is resumed and the total solder consumption Wp exceeds the threshold value Wth, the main control unit 91 calculates the solder replenishment amount (step S5) and The operator is instructed to replenish solder (step S6).

As described above, in this embodiment, the solder weights W1 and W2 before and after the first printing are calculated as pre-printing information and post-printing information, respectively, and the difference between them is divided by the number of sheets printed in the first printing, m. The unit consumption amount of solder Wu is calculated. Therefore, it is possible to calculate the amount of solder consumed each time one board B is printed, that is, the unit consumption amount Wu, with higher accuracy than in the prior art.

Furthermore, the total amount of solder consumed is calculated for each second printing, and the solder replenishment timing is determined by comparing this with a threshold value Wth. Therefore, solder can be replenished at appropriate timing. As a result, solder can be printed on the substrate B smoothly, and the operating rate of the printing device 1 can be increased.

Furthermore, when requesting solder replenishment, the replenishment request is made using the amount obtained by multiplying the unit consumption amount calculated by the unit consumption amount calculation unit by the total number of boards printed in the first printing and the second printing as replenishment information. It is preferable to notify the operator at the same time. By such a replenishment request with replenishment information, the amount of solder on the production mask Mp after replenishment is optimized, and high print quality can be obtained.

In this way, in the first embodiment, the production mask Mp corresponds to an example of the "mask" of the present invention. Moreover, solder corresponds to an example of the "coating material" of the present invention. Furthermore, the solder weights W1 and W2 correspond to examples of the "pre-printing weight of the coating material" and the "post-printing weight of the coating material" of the present invention, respectively.

Note that the present invention is not limited to the above-described embodiments, and various changes can be made to the above-described embodiments without departing from the spirit thereof. For example, in the above embodiment, the measurement results of the load cell are used as they are as pre-print measurement values and post-print measurement values, but since the load cell is always connected to the scooping section 56a, even when zero point adjustment is performed, Good (second embodiment). In this case, the measurement results of the load cell directly become the weights W1 and W2 of the solder, and the pre-printing measurement value and the post-printing measurement value correspond to "pre-printing information" and "post-printing information", respectively.

In addition, since the weight change over time of the scooping part 56a is zero or very small, the pre-printing measured value (=W1+Ws0) and post-printing measured value (=W2+Ws0) of the load cell are used as "pre-printing information" and "post-printing information". It may also be used as "information" (third embodiment).

Further, in the embodiment described above, it is assumed that no solder remains or adheres to the scooping portion 56a before scooping up the solder, or even if solder does adhere, the amount of residual adhesion is extremely small. However, the amount of residual adhesion is relatively large, or, for example, as shown in FIG. and may be different. In these cases, it is desirable to obtain the unit consumption amount after considering residual adhesion of solder (fourth embodiment). Note that the weight Ws1 and the weight Ws2 correspond to examples of the "adhesion weight before printing" and the "adhesion weight after printing" of the present invention, respectively.

FIG. 9 is a flowchart showing the unit consumption amount acquisition process in the fourth embodiment of the printing apparatus according to the present invention. The fourth embodiment will be described below with reference to FIGS. 8 and 9. The fourth embodiment differs greatly from the first embodiment in that the weight of the solder is calculated not only by the solder on the production mask Mp but also by including the solder attached to the scooped-up portion 56a. be. The other configurations are basically the same as those in the first embodiment. Hereinafter, the explanation will focus on the differences, while the same components will be given the same reference numerals and the explanation will be omitted.

In the unit consumption amount acquisition process in the fourth embodiment, similarly to the first embodiment, the scooping unit 56 scoops up solder (step S31). The main control section 91 receives the measurement result of the load cell forming the first weight measurement section 56b as a pre-print measurement value. Here, as shown in FIG. 8(a), solder Ss1 is attached to the scooped-up portion 56a immediately before the scooped-up portion 56a. Therefore, the pre-printing measurement values measured by the first weight measuring section 56b immediately after scooping up the solder are the weight Ws0 of the scooping section 56a, the weight Ws1 of the residual adhering solder Ss1, and the weight of the scooped solder S1. The total value with W1 (hereinafter referred to as "pre-print total value") becomes WL1. Therefore, the main control unit 91 calculates the weight of the solder (W1+Ws1) by subtracting the weight Ws0 from the pre-print measurement value (step S32A).

Subsequently, similarly to step S33, the scooped up solder (S1+Ss1) by the scooping unit 56 is unloaded onto the production mask Mp. However, some of the solder remains attached to the scooped-up portion 56a, as shown in the column "Immediately before scooping up" in FIG. It may be different.

Subsequently, as in the first embodiment, the main control unit 91 executes first printing, in which the number of substrates B to be printed is m specified in advance by the operator (step S34). As a result, as shown in FIG. 8, a part of the solder S1' is used for printing, and the weight W2 of the solder S2 on the production mask Mp is smaller than the weight of the solder S1' before printing. On the other hand, the weight Ws2 of the solder Ss2 remaining attached to the scooped-up portion 56a varies depending on the viscosity of the solder, the wettability of the solder to the scooped-up portion 56a, and the like.

Therefore, in the fourth embodiment, the main control unit 91 uses the scooping unit 56 to scoop up the solder S2 on the production mask Mp, as in step S35 of the first embodiment. As a result, the solder held in the scooped-up portion 56a becomes solder S2 and residual adhered solder Ss2, as shown in the column "Immediately after scooped up" in FIG. 8(b). Then, the main control section 91 receives the measurement result of the load cell forming the first weight measurement section 56b as a post-print measurement value. Here, as shown in the same column, solder Ss2 is attached to the scooped-up portion 56a immediately before the scooped-up portion 56a. Therefore, the pre-printing measurement values measured by the first weight measuring section 56b immediately after scooping up the solder are the weight Ws0 of the scooping section 56a, the weight Ws2 of the remaining solder Ss2, and the weight of the scooped solder S2. The total value with W2 (hereinafter referred to as "post-printing total value") is WL2. Therefore, the main control unit 91 calculates the weight of the solder (W2+Ws2) by subtracting the weight Ws0 from the measured value after printing (step S36A).

In this way, when the weight (W2+Ws2) of the solder (S2+Ss2) after the first printing is determined, the scooped up solder is unloaded onto the production mask Mp by the scooping unit 56 (step S37). In parallel, the main control unit 91 uses the following formula Wu=((W1+Ws1)-(W2+Ws2))/m
The unit consumption amount Wu is calculated (step S38A). Furthermore, the main control unit 91 additionally records the unit consumption amount Wu in the unit consumption table shown in FIG. 6 while associating it with the type of production mask Mp, and updates the unit consumption table in the storage unit 92 (step S39). .

As described above, according to the fourth embodiment, the unit consumption amount Wu of solder can be calculated more accurately without being influenced by the remaining solder Ss1 and Ss2.

Furthermore, in the above embodiment, the total solder consumption Wm does not exceed the threshold value Wth at the time when the first printing is performed, as shown in FIG. However, as shown in FIG. 10, for example, the total consumption amount Wm may exceed the threshold value Wth. Therefore, after calculating the post-print information (step S36), it is determined whether the total consumption amount Wm exceeds the threshold value Wth, and if it does, the second printing (step S4) is skipped and the replenishment amount calculation ( Step S5) and solder replenishment instruction (step S6) may be executed (fifth embodiment). According to the fifth embodiment, solder is replenished at appropriate timing, solder can be printed on the board B smoothly, and the operating rate of the printing apparatus 1 can be increased.

In addition, in the first to third embodiments, the unit consumption amount is calculated based on the pre-printing information and post-printing information corresponding to the weight of the solder scooped up from the production mask Mp before and after the first printing, and the unit consumption amount is calculated in the fourth embodiment. In the configuration, the unit consumption amount is calculated based on the pre-printing total value and the post-printing total value, which correspond to the total value of the solder scooped up from the production mask Mp before and after the first printing and the solder attached to the scooped-up portion 56a. . Here, the squeegee 51 may be included in the solder attachment destination. Therefore, if the weight of the solder attached to the squeegee 51 changes before and after the first printing, the amount of change may affect the calculation of the unit consumption amount.

Therefore, the unit consumption may be determined in consideration of this point. For example, as shown in FIG. 11, by connecting a second weight measurement unit 51a composed of a load cell or the like to the squeegee 51, information ( It becomes possible to acquire information related to the weight of the solder S51' attached to the squeegee 51 after the first printing (hereinafter referred to as "post-squeegee printing information"). Therefore, in the first to third embodiments, the unit consumption is calculated based on the value corrected by adding the squeegee pre-print information to the pre-print information and the corrected value by adding the squeegee post-print information to the post-print information. You can also ask for the quantity. More specifically, the unit consumption amount may be calculated based on the difference between the corrected pre-print information and the corrected post-print information (sixth embodiment). Furthermore, in the fourth embodiment, the unit consumption may be calculated based on a value corrected by adding the squeegee pre-print information to the pre-print total value and a corrected value by adding the squeegee print information to the post-print total value. Good (seventh embodiment). In this way, by further taking into account the information before squeegee printing and the information after squeegee printing, it becomes possible to calculate the unit consumption amount with higher accuracy.

Furthermore, when the solder is scooped up from the production mask Mp, the unit consumption amount is calculated by correcting the solder remaining in the production mask Mp (for example, the symbols Smp and Smp' in FIG. 12). is suitable. For example, as shown in FIG. 12, by providing a third weight measuring section 57 configured with a load cell or the like capable of measuring the weight of the production mask Mp and the solder attached to the production mask Mp, scooping before the first printing can be performed. Information related to the weight of the solder Smp remaining on the production mask Mp in the lifting operation (hereinafter referred to as "pre-mask printing information"), and information related to the weight of the solder Smp' remaining on the production mask Mp in the scooping operation after the first printing. It becomes possible to acquire information related to weight (hereinafter referred to as "post-mask printing information"). In the first to third embodiments and the sixth embodiment, the value corrected by further adding the pre-mask printing information (corresponding to the "corrected pre-printing information" of the present invention) and the value after the mask printing The unit consumption amount may be determined based on the difference from a value corrected by further adding information (corresponding to the "corrected post-print information" of the present invention) (eighth embodiment). In addition, in the fourth embodiment and the seventh embodiment, a value corrected by further adding mask pre-printing information (corresponding to "corrected pre-printing information" of the present invention) and a value corrected by further adding mask printing information The unit consumption amount may be calculated based on the calculated value (corresponding to the "corrected post-print information" of the present invention) (9th embodiment). In this way, by further taking into account the information before mask printing and the information after mask printing, the unit consumption amount can be calculated with even higher accuracy.

Further, in the above embodiment, the present invention is applied to a printing device that uses solder as the "coating material" of the present invention, but it is also applicable to a printing device that applies a coating material other than solder, such as a printing material such as ink. The present invention can be applied.

The present invention can be applied to general printing techniques in which a squeegee is slid against a mask to print a coating material on a mask onto a substrate through an opening provided in the mask.

1...Printing device 51a...Second weight measurement section 56a...Scooping section (applying material transfer section)
56b...First weight measurement section 57...Third weight measurement section 91...Main control section (pre-print information acquisition section, post-print information acquisition section, unit consumption calculation section, total consumption calculation section, replenishment request section)
92...Storage part B...Substrate m...Number of printed sheets P1...Opening S1, S1', S2...Solder (on the production mask) S51, S51'...Solder (attached to the squeegee) Ss1...(Residual adhesion before printing) ) Solder Ss2...(Residual adhesion after printing) Solder Smp, Smp'...(Residual adhesion to the mask after scooping up the solder) Solder W1...Weight before printing W2...Weight after printing WL1...Total value before printing WL2 ...Total value after printing Mp...Mask (for production) Ws0...Weight (of the scooping part) Ws1...Adhering weight before printing Ws2...Adhering weight after printing Wu...Unit consumption Wth...Threshold value

Claims (11)

A printing device that prints a coating material on the mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask,
a coating material transfer unit that scoops up a coating material from above the mask and returns the scooped coating material onto the mask;
a first weight measuring section that is connected to the coating material transfer section and measures weight;
Transferring the coating material by scooping up the coating material from the mask before performing the first printing of printing the coating material on the mask onto m sheets (m is a natural number of 1 or more) of the substrates. a pre-print information acquisition unit that acquires pre-print information indicating the weight of the coating material before the first printing based on a pre-print measurement value obtained by measuring the weight of the coating material with the first weight measurement unit;
After performing the first printing, the first printing is performed based on a post-printing measurement value obtained by measuring the coating material transfer section that scooped up the coating material from the mask with the first weight measurement section. a post-printing information acquisition unit that acquires post-printing information indicating a subsequent weight of the coating material;
Based on the pre-printing information and the post-printing information, the reduction amount of the coating material before and after the first printing is divided by the number m of printed substrates in the first printing to calculate the amount consumed per substrate. a unit consumption amount calculation unit that calculates a unit consumption amount of the coating material;
A printing device comprising: The printing device according to claim 1,
The pre-print information acquisition unit uses the pre-print measurement value as the pre-print information,
The post-printing information acquisition unit uses the post-printing measurement value as the pre-printing information,
The unit consumption amount calculation unit sets the difference between the pre-print measurement value and the post-print measurement value as the reduction amount.
Printing device. The printing device according to claim 1,
The pre-printing information acquisition unit obtains the pre-printing weight of the coating material as the pre-printing information by subtracting the weight of the coating material transfer unit from the pre-printing measurement value,
The post-printing information acquisition unit obtains the post-printing weight of the coating material as the post-printing information by subtracting the weight of the coating material transfer unit from the post-printing measurement value,
The unit consumption amount calculation unit sets the difference between the pre-printing weight and the post-printing weight as the reduction amount.
Printing device. The printing device according to claim 1,
The pre-printing information acquisition unit is configured to acquire pre-printing information about the coating material that adheres to the coating material transfer unit before the first printing and before the coating material transfer unit scoops up the coating material from above the mask. obtaining a pre-printing total value of the adhesion weight and the weight of the coating material on the mask as the pre-printing information;
After the first printing and before the coating material transfer section scoops up the coating material from above the mask, the post-printing information acquisition section is configured to detect the post-printing information of the coating material that adheres to the coating material transfer section after the first printing and before the coating material transfer section scoops up the coating material from above the mask. obtaining a post-printing total value of the adhesion weight and the weight of the coating material on the mask as the pre-printing information;
Printing device. 5. The printing device according to claim 4,
The pre-print information acquisition unit calculates the pre-print total value by subtracting the weight of the coating material transfer unit from the pre-print measurement value,
The post-printing information acquisition unit obtains the post-printing total value by subtracting the weight of the coating material transfer unit from the post-printing measurement value,
The unit consumption amount calculation unit sets the difference between the pre-printing total value and the post-printing total value as the reduction amount.
Printing device. The printing device according to any one of claims 1 to 4,
further comprising a second weight measurement unit connected to the squeegee to measure weight,
The pre-print information acquisition section adds, to the pre-print information, squeegee pre-print information obtained by measuring the squeegee separated from the mask with the second weight measurement section before performing the first printing. correcting the pre-print information;
The post-printing information acquisition section adds post-printing information obtained by measuring the squeegee separated from the mask with the second weight measurement section to the post-printing information after performing the first printing. Correct the information after printing,
The unit consumption calculation unit calculates the unit consumption of the coating material based on the corrected pre-printing information and the corrected post-printing information.
Printing device. The printing device according to any one of claims 1 to 4 and 6,
further comprising a third weight measurement unit that measures the total weight of the mask and the coating material attached to the mask,
The pre-printing information acquisition unit may measure the mask measured by the third weight measurement unit before performing the first printing and after the coating material transfer unit scoops up the coating material from above the mask. correcting the pre-print information by adding pre-print information to the pre-print information;
The post-printing information acquisition unit may measure the mask measured by the third weight measuring unit after the first printing is performed and after the coating material is scooped up from above the mask by the coating material transfer unit. correcting the post-print information by adding post-print information to the post-print information;
The unit consumption calculation unit calculates the unit consumption of the coating material based on the corrected pre-printing information and the corrected post-printing information.
Printing device. The printing device according to any one of claims 1 to 7,
a storage unit that stores a threshold value of the total consumption amount of the coating material;
a total consumption calculation unit that calculates the total consumption of the coating material based on the unit consumption and the number of printed sheets of the substrate;
a replenishment requesting unit that requests replenishment of the coating material when the total consumption calculated by the total consumption calculating unit exceeds the threshold;
Printing device. 9. The printing device according to claim 8,
In a second printing after the first printing, the replenishment requesting unit compares the total consumption amount with the threshold value each time the coating material on the mask is printed on the substrate, and determines whether the total consumption amount exceeds the threshold value. requesting said replenishment only when exceeding the
Printing device. The printing device according to claim 9,
When the replenishment request unit determines that the total consumption exceeds the threshold, the replenishment request unit adds the unit consumption calculated by the unit consumption calculation unit to the substrate printed in the first printing and the second printing. requesting replenishment of the coating material in an amount multiplied by the total number of
Printing device. In a printing device that prints a coating material on the mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask, a unit of the coating material consumed per one substrate. A unit consumption calculation method for calculating consumption,
performing a first printing of printing the coating material on the mask onto m sheets (m is a natural number of 1 or more) of the substrates;
Before the first printing, a pre-print measurement value obtained by scooping up the coating material from the mask with a coating material transfer section and then measuring the coating material transfer section with a first weight measurement section. acquiring pre-printing information indicating the weight of the coating material before the first printing based on the first printing;
After the first printing, a post-printing measurement value obtained by scooping up the coating material from the mask with a coating material transfer section and then measuring the coating material transfer section with the first weight measurement section. acquiring post-printing information indicating the weight of the coating material after the first printing based on the first printing;
The unit consumption is calculated by dividing the reduction amount of the coating material before and after the first printing by the number m of printed sheets of the substrate in the first printing based on the pre-printing information and the post-printing information. process and
A method for calculating unit consumption in a printing device, comprising:

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