JP7438009B2 - laser processing equipment - Google Patents

Description

The present invention relates to a laser processing device.

Patent Document 1 describes a laser processing apparatus that includes a holding mechanism that holds a workpiece, and a laser irradiation mechanism that irradiates the workpiece held by the holding mechanism with laser light. In the laser processing apparatus described in Patent Document 1, a laser irradiation mechanism having a condensing lens is fixed to a base, and the workpiece is moved in a direction perpendicular to the optical axis of the condensing lens by a holding mechanism. Implemented.

Patent No. 5456510

Incidentally, in the laser processing apparatus as described above, it is desired to improve the processing speed. To this end, it is conceivable to increase the moving speed of the workpiece by the holding mechanism. However, there is a limit to the increase in the movement speed of the workpiece by the holding mechanism. On the other hand, it is conceivable to improve the moving speed of the focal point of the laser beam with respect to the workpiece, for example, by moving the laser irradiation mechanism in the opposite direction as the workpiece is moved by the holding mechanism. However, as described above, in the laser processing apparatus described in Patent Document 1, since the laser irradiation mechanism is fixed to the base, it is difficult to move the laser irradiation mechanism. Therefore, in the laser processing apparatus as described in Patent Document 1, it is difficult to further improve the processing speed.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a laser processing apparatus that can improve processing speed.

A laser processing device according to the present invention applies a laser beam along the lines to an object on which a plurality of lines are set, which extend along a first direction and are arranged along a second direction that intersects the first direction. A laser processing device for forming a modified region on a target object along a line by irradiating the target object, the device includes a support part for supporting the target object, and a laser beam applied to the target object supported by the support part. a first laser processing head for irradiating light; a camera for capturing an image of the object supported by the support; a first movement mechanism for moving the support in the first direction; a second moving mechanism for moving the first laser processing head along the first direction and the second direction; a control unit that performs an irradiation process of irradiating a target object with laser light along a line by controlling the first moving mechanism and the second moving mechanism to move the first laser processing head in opposite directions; , the second moving mechanism extends along the first direction and is attached with the first laser processing head, and the second moving mechanism includes a first moving section for moving the first laser processing head along the first direction. , a second moving section extending along the second direction and having the first moving section attached thereto, for moving the first moving section along the second direction; It is attached to the second moving part via a member different from that of the second moving part.

In this laser processing device, the support part for supporting the object is movable in at least the first direction by the first moving mechanism, and the laser beam is emitted to the object supported by the support part. A first laser processing head for irradiation is movable in a first direction and a second direction by a second moving mechanism. The first direction is a direction in which the extending direction of lines to be processed set on the object is set, and the second direction is a direction in which the lines are arranged. As a result, in this laser processing apparatus, under the control of the control section, the support section and the first laser processing head are moved in mutually opposite directions along the first direction, and the target object is moved along the line. Irradiation treatment that irradiates laser light can be performed. Therefore, processing speed can be improved compared to the case where only the object side is moved during irradiation with laser light.

In particular, in this laser processing apparatus, a camera for capturing an image of the object is attached to the second moving part via a member different from the first moving part responsible for moving the first laser processing head in the first direction. ing. Therefore, during the irradiation process, only the first laser processing head (and the support section) can be moved along the first direction without accompanying the camera. Therefore, the moving speed of the first laser processing head along the first direction can be further improved, and the processing speed can be reliably improved.

As mentioned above, in this laser processing device, by moving the support part and the first laser processing head in opposite directions during the irradiation process, the moving speed of the focal point of the laser beam on the target object is improved. It can be done. In other words, the target moving speed of the condensing point is shared between the support section and the first laser processing head. For this reason, it is possible to suppress the movement speed of each of the support section and the first laser processing head compared to the case where either one is moved. As a result, the time and distance involved in accelerating and decelerating the support section and the first laser processing head can be reduced.

Furthermore, according to the laser processing device, it is possible to reduce the footprint in the first direction. That is, when only the support part is moved during the irradiation process, the moving distance of the support part is at least the length of the line of the object supported by the support part. On the other hand, as described above, when the support part and the first laser processing head are moved in opposite directions to each other during the irradiation process, the movement distance of the support part is calculated by subtracting the movement distance of the support part from the length of the line concerned. can be reduced to a distance. In other words, in this case, the sum of the moving distance of the support portion and the moving distance of the first laser processing head only needs to be equal to or longer than the length of the line. Therefore, according to the laser processing apparatus, it is possible to reduce the footprint in the first direction.

In the laser processing device according to the present invention, the second moving mechanism includes a pair of second moving parts arranged opposite to each other in the first direction, and the first moving part spans the pair of second moving parts. may be supported. In this case, the first laser processing head is reliably supported.

Here, the weight of the laser processing head is generally lighter than the weight of the support section. Therefore, when moving the focal point at the target moving speed, it is a good idea to move the first laser processing head faster than the support (that is, to relatively increase the speed burden on the first laser processing head). It will be done.

On the other hand, in the laser processing apparatus according to the present invention, the first laser processing head is connected to an optical fiber for introducing the laser light output from the light source, and the control section is configured to The speed of the first laser processing head along the first direction may be smaller than the speed of the support section along the first direction. In this way, when an optical fiber for introducing laser light from a light source is connected to the first laser processing head, regardless of the weight relationship between the first laser processing head and the support part, By making the first laser processing head relatively slow (that is, making the speed burden on the first laser processing head relatively small), it is possible to protect the optical fiber.

In the laser processing apparatus according to the present invention, the second moving mechanism extends along the first direction and is attached with a camera, and the third moving section for moving the camera along the first direction is configured as described above. It may be included as a different member. In this case, the camera becomes movable in the first direction and the second direction.

The laser processing apparatus according to the present invention includes a second laser processing head for irradiating a laser beam onto an object supported by a support part, and the second moving mechanism extends along the first direction and has a second laser processing head. 2 laser processing heads are attached, the second laser processing head includes a fourth moving section for moving the second laser processing head along the first direction, the second moving section is attached with the fourth moving section, and the second moving section includes a fourth moving section for moving the second laser processing head along the first direction. The control unit has a function of moving the four moving parts along the second direction, and the control part is configured to move the first laser beam from the first laser processing head to one line of the plurality of lines in the irradiation process. The first process and the second process of irradiating another line of the plurality of lines with laser light from the second laser processing head are performed so as to overlap at least part of the time, and the first process , the control unit controls the first movement mechanism and the second movement mechanism to move the support unit and the first laser processing head in mutually opposite directions along the first direction, and in the second process, the control unit The first moving mechanism and the second moving mechanism may be controlled to move the support part and the second laser processing head in opposite directions along the first direction. In this case, throughput is improved by causing the first laser processing head and the second laser processing head to cooperate at least part of the time.

According to the present invention, it is possible to provide a laser processing device that enables improvement in processing speed.

FIG. 1 is a plan view of a laser processing apparatus according to an embodiment. FIG. 2 is a partial side view of the laser processing apparatus shown in FIG. FIG. 3 is a front view of the laser processing head of the laser processing apparatus shown in FIG. FIG. 4 is a side view of the laser processing head shown in FIG. 3. FIG. 5 is a configuration diagram of the optical system of the laser processing head shown in FIG. 3. FIG. 6 is a configuration diagram of an optical system of a modified laser processing head. FIG. 7 is a configuration diagram of an optical system of a laser processing head according to a modified example. FIG. 8 is a schematic top view showing the operation of the laser processing device. FIG. 9 is a schematic top view showing the operation of the laser processing device. FIG. 10 is a schematic top view showing the operation of the laser processing device. FIG. 11 is a schematic top view showing a modified example of the laser processing apparatus. FIG. 12 is a schematic top view showing a modified example of the laser processing apparatus. FIG. 13 is a schematic top view showing a modified example of the laser processing apparatus.

Embodiments of the present invention will be described in detail below with reference to the drawings. In each figure, the same or corresponding parts are denoted by the same reference numerals, and redundant explanations will be omitted. Note that each figure may show an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis. The X direction is an example of a first direction, and is a first horizontal direction. The Y direction is an example of a second direction that intersects with the first direction, and is a second horizontal direction. The Z direction is an example of a third direction that intersects the first direction and the second direction, and is a vertical direction.
[Configuration of laser processing equipment]

As shown in FIGS. 1 and 2, the laser processing apparatus 1 includes a moving mechanism 5 (first moving mechanism), a moving mechanism 6 (second moving mechanism), a support section 7, a light source unit 8, a control section 9, a laser It includes a processing head 10A (first laser processing head), a laser processing head 10B (second laser processing head), and a camera unit 10C.

The moving mechanism 5 includes a fixed part 51, a moving part 53, and a mounting part 55. The fixing part 51 is attached to the device frame 1a. The moving part 53 is attached to a rail provided on the fixed part 51 and can move along the Y direction. The attachment part 55 is attached to a rail provided on the moving part 53, and can be moved along the X direction. The support part 7 is attached to a rotating shaft provided on the attachment part 55, and can rotate about an axis parallel to the Z direction. That is, the moving mechanism 5 has a function of moving the support part 7 along the X direction and the Y direction, and a function of rotating the support part 7 around an axis along the Z direction.

The moving mechanism 6 includes a pair of Y-axis moving parts (second moving parts) 61, X-axis moving parts (first moving parts) 62A, X-axis moving parts (fourth moving parts) 62B, and X-axis moving parts (third moving parts). It has a moving part) 62C, Z-axis moving parts 63, 64, 68, and attachment parts 65, 66, 67A, 67B, 67C, 69. The pair of Y-axis moving parts 61 are arranged to face each other in the X direction, and extend along the Y direction (here, substantially parallel). The X-axis moving section 62A extends along the X direction, and is attached to rails provided on the Y-axis moving section 61 via attachment sections 67A at both ends in the X direction. That is, the X-axis moving section 62A is supported by being spanned by the pair of Y-axis moving sections 61. Thereby, the X-axis moving section 62A is movable along the Y direction by the Y-axis moving section 61. That is, the Y-axis moving section 61 has a function of moving the X-axis moving section 62A in the Y direction.

The Z-axis moving section 63 extends along the Z direction, and is attached to a rail provided on the X-axis moving section 62A. Thereby, the Z-axis moving section 63 is movable along the X direction by the X-axis moving section 62A. A laser processing head 10A is attached to the Z-axis moving section 63 via a mounting section 65. Therefore, the X-axis moving section 62A has a function of moving the laser processing head 10A together with the Z-axis moving section 63 along the X direction. The laser processing head 10A is attached to a rail provided on the Z-axis moving section 63 via an attachment section 65. Thereby, the laser processing head 10A is movable along the Z direction by the Z-axis moving section 63. That is, the Z-axis moving section 63 has a function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10A so as to be movable three-dimensionally along the X direction, the Y direction, and the Z direction.

The X-axis moving section 62B extends along the X direction, and is attached to rails provided on the Y-axis moving section 61 via attachment sections 67B at both ends in the X direction. That is, the X-axis moving section 62B is supported by being spanned by the pair of Y-axis moving sections 61. Thereby, the X-axis moving section 62B is movable along the Y direction by the Y-axis moving section 61. That is, the Y-axis moving section 61 has a function of moving the X-axis moving section 62B in the Y direction.

The Z-axis moving section 64 extends along the Z direction and is attached to a rail provided on the X-axis moving section 62B. Thereby, the Z-axis moving section 64 is movable along the X direction by the X-axis moving section 62B. A laser processing head 10B is attached to the Z-axis moving section 64 via a mounting section 66. Therefore, the X-axis moving section 62B has a function of moving the laser processing head 10B together with the Z-axis moving section 64 along the X direction. The laser processing head 10B is attached to a rail provided on the Z-axis moving section 64 via a mounting section 66. Thereby, the laser processing head 10B is movable along the Z direction by the Z-axis moving section 64. That is, the Z-axis moving section 64 has a function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10B so that it can move three-dimensionally along the X direction, the Y direction, and the Z direction.

The X-axis moving section 62C extends along the X direction, and is attached to rails provided on the Y-axis moving section 61 via attachment sections 67C at both ends in the X direction. That is, the X-axis moving section 62C is supported by being spanned by the pair of Y-axis moving sections 61. Thereby, the X-axis moving section 62C is movable along the Y direction by the Y-axis moving section 61. That is, the Y-axis moving section 61 has a function of moving the X-axis moving section 62C in the Y direction.

The Z-axis moving section 68 extends along the Z direction and is attached to a rail provided on the X-axis moving section 62C. Thereby, the Z-axis moving section 68 is movable along the X direction by the X-axis moving section 62C. A camera unit 10C is attached to the Z-axis moving section 68 via an attachment section 69. Therefore, the X-axis moving section 62C has a function of moving the camera unit 10C along with the Z-axis moving section 68 along the X direction. The camera unit 10C is attached to a rail provided on the Z-axis moving section 68 via an attachment section 69. Thereby, the camera unit 10C is movable along the Z direction by the Z-axis moving section 68. That is, the Z-axis moving section 68 has a function of moving the camera unit 10C along the Z direction. In this way, the moving mechanism 6 holds the camera unit 10C so as to be able to move three-dimensionally along the X direction, the Y direction, and the Z direction.

Here, the X-axis moving section 62A, the X-axis moving section 62B, and the X-axis moving section 62C are arranged in order along the Y direction. Therefore, when viewed from the Z direction, the laser processing head 10A, the laser processing head 10B, and the camera unit 10C are also arranged in order along the Y direction. Therefore, in the laser processing apparatus 1, the laser processing head 10A and the laser processing head 10B are movable in the Y direction so as to approach each other without the camera unit 10C being interposed therebetween.

As described above, the support part 7 is attached to the rotating shaft provided on the attachment part 55 of the moving mechanism 5, and can rotate about an axis parallel to the Z direction. That is, the support part 7 can move along each of the X direction and the Y direction, and can rotate about an axis parallel to the Z direction as a center line. The support section 7 supports the object 100 along the X direction and the Y direction. The target object 100 is, for example, a wafer.

The laser processing head 10A is for irradiating a target object 100 supported by the support part 7 with a laser beam L1 while facing the support part 7 in the Z direction. The laser processing head 10B is for irradiating the object 100 supported by the support part 7 with laser light L2 while facing the support part 7 in the Z direction.

Camera unit 10C includes a pair of cameras AC. The pair of cameras AC have mutually different magnifications and are used to image the object 100 supported by the support 7 while facing the support 7 in the Z direction. For example, the camera AC can image the device pattern of the object 100, the modified region, the formation state of cracks extending from the modified region, etc. using the light that passes through the object 100. The image obtained by the camera AC is used, for example, to align the irradiation positions of the laser beams L1 and L2 on the object 100 and to adjust the irradiation conditions of the laser beams L1 and L2.

The light source unit 8 has a pair of light sources 81 and 82. Light source 81 outputs laser light L1. The laser beam L1 is emitted from the emission part 81a of the light source 81, and guided to the laser processing head 10A by the optical fiber 2. That is, the optical fiber 2 for introducing the laser beam L1 output from the light source 81 is connected to the laser processing head 10A. The light source 82 outputs laser light L2. The laser beam L2 is emitted from the emission part 82a of the light source 82, and guided to the laser processing head 10B by another optical fiber 2. That is, the laser processing head 10B is provided with an optical fiber 2 for introducing the laser beam L2 output from the light source 82.

The control unit 9 controls each part of the laser processing apparatus 1 (the plurality of moving mechanisms 5 and 6, the laser processing heads 10A and 10B, the camera unit 10C, the light source unit 8, etc.). The control unit 9 is configured as a computer device including a processor, memory, storage, communication device, and the like. In the control unit 9, the software (program) read into the memory or the like is executed by the processor, and the processor controls reading and writing of data in the memory and storage, and communication by the communication device. Thereby, the control unit 9 realizes various functions.

An example of processing by the laser processing apparatus 1 configured as above will be explained. An example of this processing is an example in which modified regions are formed inside the object 100 along each of a plurality of lines set in a grid pattern in order to cut the object 100, which is a wafer, into a plurality of chips. be.

First, the moving mechanism 5 moves the support part 7 along the X direction and the Y direction so that the support part 7 supporting the object 100 faces the pair of laser processing heads 10A and 10B in the Z direction. move. Subsequently, the moving mechanism 5 rotates the support part 7 about an axis parallel to the Z direction as a center line so that a plurality of lines extending in one direction in the target object 100 are along the X direction. As a result, a plurality of lines (line C shown in FIG. 1) extending along the X direction and arranged along the Y direction are set on the object 100.

Subsequently, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the focal point of the laser beam L1 is located on one line extending in one direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the focal point of the laser beam L2 is located on another line extending in one direction. Subsequently, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the focal point of the laser beam L1 is located inside the object 100. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the focal point of the laser beam L2 is located inside the object 100.

Subsequently, the light source 81 outputs the laser beam L1, and the laser processing head 10A irradiates the object 100 with the laser beam L1, and the light source 82 outputs the laser beam L2, and the laser processing head 10B irradiates the object 100 with the laser beam L1. Light L2 is irradiated. At the same time, the condensing point of the laser beam L1 moves relatively along one line extending in one direction (the laser beam L1 is scanned), and along another line extending in one direction. The moving mechanism 5 moves the support part 7 along the X direction so that the focal point of the laser beam L2 moves relatively (the laser beam L2 is scanned), and the moving mechanism 6 moves the supporting part 7 along the X direction. The laser processing heads 10A and 10B are moved in the direction opposite to the support section 7 along the direction. In this way, the laser processing apparatus 1 forms modified regions at least inside the object 100 along each of a plurality of lines extending in one direction in the object 100.

Next, the moving mechanism 5 rotates the support part 7 about the axis parallel to the Z direction so that the plurality of lines extending in the other direction orthogonal to one direction in the target object 100 are along the X direction. . As a result, a plurality of other lines (line C shown in FIG. 1) extending along the X direction and arranged along the Y direction are set on the object 100.

Subsequently, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the focal point of the laser beam L1 is located on one line extending in the other direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the focal point of the laser beam L2 is located on another line extending in the other direction. Subsequently, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the focal point of the laser beam L1 is located inside the object 100. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the focal point of the laser beam L2 is located inside the object 100.

Subsequently, the light source 81 outputs the laser beam L1, and the laser processing head 10A irradiates the object 100 with the laser beam L1, and the light source 82 outputs the laser beam L2, and the laser processing head 10B irradiates the object 100 with the laser beam L1. Light L2 is irradiated. At the same time, the focal point of the laser beam L1 moves relatively along one line extending in the other direction (laser beam L1 is scanned), and the condensing point of the laser beam L1 moves along another line extending in the other direction. The moving mechanism 5 moves the support part 7 along the X direction so that the focal point of the laser beam L2 moves relatively (the laser beam L2 is scanned), and the moving mechanism 6 moves the supporting part 7 along the X direction. The laser processing heads 10A and 10B are moved in the direction opposite to the support section 7 along the direction. In this way, the laser processing apparatus 1 forms modified regions at least inside the object 100 along each of a plurality of lines extending in the other direction orthogonal to one direction in the object 100.

In the example of processing described above, the light source 81 outputs the laser beam L1 that is transparent to the object 100 using, for example, a pulse oscillation method, and the light source 82 outputs the laser beam L1 that is transparent to the object 100 using, for example, a pulse oscillation method. A laser beam L2 that is transparent to the laser beam L2 is output. When such a laser beam is focused inside the object 100, the laser beam is particularly absorbed in a portion corresponding to the focal point of the laser beam, and a modified region is formed inside the object 100. A modified region is a region that differs in density, refractive index, mechanical strength, and other physical properties from the surrounding unmodified region. Examples of the modified region include a melt-treated region, a crack region, a dielectric breakdown region, and a refractive index change region.

When the target object 100 is irradiated with a laser beam outputted by the pulse oscillation method and the focal point of the laser beam is relatively moved along the line set on the target object 100, a plurality of modified spots form a line. They are formed in a line along the One modification spot is formed by irradiation with one pulse of laser light. A row of modified regions is a collection of a plurality of modified spots arranged in one row. Adjacent modification spots may be connected to each other or separated from each other depending on the relative moving speed of the focal point of the laser beam with respect to the object 100 and the repetition frequency of the laser beam.
[Laser processing head configuration]

Subsequently, the configuration of the laser processing head will be specifically explained. As shown in FIGS. 3 and 4, the laser processing head 10A includes a housing 11, an incident section 12, a laser beam adjustment section 13, and a condensing section 14. The housing 11 has a first wall 21 and a second wall 22, a third wall 23 and a fourth wall 24, and a fifth wall 25 and a sixth wall 26. The first wall portion 21 and the second wall portion 22 face each other in the X direction. The third wall portion 23 and the fourth wall portion 24 face each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 face each other in the Z direction.

The distance between the third wall 23 and the fourth wall 24 is smaller than the distance between the first wall 21 and the second wall 22. The distance between the first wall 21 and the second wall 22 is smaller than the distance between the fifth wall 25 and the sixth wall 26. Note that the distance between the first wall 21 and the second wall 22 may be equal to the distance between the fifth wall 25 and the sixth wall 26, or the distance between the fifth wall 25 and the sixth wall 26 may be equal to the distance between the fifth wall 25 and the sixth wall 26. The distance may be greater than the distance to the portion 26.

In the laser processing head 10A, the first wall portion 21 is located on the side opposite to the Y-axis moving portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the Y-axis moving portion 61 side. The third wall portion 23 is located on the side of the mounting portion 65 of the moving mechanism 6, and the fourth wall portion 24 is located on the side opposite to the mounting portion 65 and on the side of the laser processing head 10B (Fig. (see 2). That is, the fourth wall portion 24 is an opposing wall portion that faces the casing (second casing) of the laser processing head 10B along the Y direction. The fifth wall portion 25 is located on the opposite side to the support portion 7, and the sixth wall portion 26 is located on the support portion 7 side.

The casing 11 is configured such that the casing 11 is attached to the attachment portion 65 with the third wall portion 23 disposed on the attachment portion 65 side of the moving mechanism 6 . Specifically, it is as follows. The mounting portion 65 includes a base plate 65a and a mounting plate 65b. The base plate 65a is attached to a rail provided on the Z-axis moving section 63 (see FIG. 2). The mounting plate 65b is erected at the end of the base plate 65a on the laser processing head 10B side (see FIG. 2). The housing 11 is attached to the mounting portion 65 by screwing bolts 28 to the mounting plate 65b via the pedestal 27 with the third wall portion 23 in contact with the mounting plate 65b. The pedestal 27 is provided on each of the first wall portion 21 and the second wall portion 22. The housing 11 is removable from the mounting portion 65.

The incidence section 12 is arranged on the fifth wall section 25. The incidence section 12 allows the laser beam L1 to enter the housing 11. The incident portion 12 is biased toward the first wall portion 21 in the X direction, and biased toward the fourth wall portion 24 in the Y direction. That is, the distance between the entrance part 12 and the first wall part 21 in the X direction is smaller than the distance between the entrance part 12 and the second wall part 22 in the X direction, and the distance between the entrance part 12 and the fourth wall part 24 in the Y direction The distance therebetween is smaller than the distance between the entrance section 12 and the third wall section 23 in the X direction.

The output end 2 a of the optical fiber 2 is connected to the input section 12 . Specifically, the incident portion 12 is a portion including a hole 25a formed in the fifth wall portion 25. The fifth wall portion 25 is provided with a mounting portion 25b. The main body portion 2b of the output end portion 2a is attached to the attachment portion 25b with a bolt or the like. In this state, the tip portion 2c of the output end portion 2a is inserted into the hole 25a. Thereby, the output end 2a of the optical fiber 2 can be attached to and detached from the input section 12. A cover 25c is arranged between the fifth wall portion 25 and the main body portion 2b. The cover 25c covers the gap formed between the hole 25a and the tip portion 2c. As an example, in the emission end 2a, an isolator for suppressing return light is disposed within the main body portion 2b, and a collimator lens for collimating the laser beam L1 is disposed within the tip portion 2c. Incidentally, the entrance section 12 may be a connector or the like configured to connect the output end 2a of the optical fiber 2.

The laser light adjustment section 13 is arranged inside the housing 11. The laser beam adjustment section 13 adjusts the laser beam L1 that has entered from the incidence section 12. The laser beam adjustment section 13 is arranged within the housing 11 on the fourth wall section 24 side with respect to the partition wall section 29. The laser beam adjustment section 13 is attached to the partition wall section 29. The partition wall 29 is provided inside the housing 11 and partitions the area inside the housing 11 into an area on the third wall 23 side and an area on the fourth wall 24 side. The partition wall portion 29 is configured as a part of the housing 11. Each component included in the laser beam adjustment section 13 is attached to the partition wall section 29 on the fourth wall section 24 side. The partition wall section 29 functions as an optical base that supports each component of the laser beam adjustment section 13.

The light condensing section 14 is arranged on the sixth wall section 26. Specifically, the light condensing part 14 is disposed in the sixth wall part 26 so as to be inserted into a hole 26a formed in the sixth wall part 26. The condensing section 14 condenses the laser beam L1 adjusted by the laser beam adjusting section 13 and emits it to the outside of the housing 11. The light condensing portion 14 is biased toward the second wall portion 22 in the X direction, and biased toward the fourth wall portion 24 in the Y direction. That is, the distance between the light condensing part 14 and the second wall part 22 in the X direction is smaller than the distance between the light condensing part 14 and the first wall part 21 in the The distance to the wall portion 24 is smaller than the distance between the light condensing portion 14 and the third wall portion 23 in the X direction.

As shown in FIG. 5, the laser beam adjustment section 13 includes a reflection section (first reflection section) 31, an attenuator 32, and an optical axis adjustment section 33. The reflection section 31, the attenuator 32, and the optical axis adjustment section 33 are arranged on the first straight line A1 extending along the X direction. The reflecting section 31 faces the incident section 12 in the Z direction. That is, the reflection section 31 faces the output end 2a of the optical fiber 2 in the Z direction. The reflecting section 31 reflects the laser beam L1 that has entered from the incident section 12 toward the second wall section 22 side. The reflecting section 31 is, for example, a mirror or a prism. The attenuator 32 adjusts the output of the laser beam L1 reflected by the reflection section 31. The optical axis adjustment section 33 reflects the laser beam L1 whose output has been adjusted by the attenuator 32 toward the sixth wall section 26 side.

The optical axis adjustment section 33 is a section for adjusting the optical axis of the laser beam L1 incident from the incidence section 12. In this embodiment, the optical axis adjustment section 33 includes a first steering mirror 331, a reflecting member 332, and a second steering mirror 333.

The first steering mirror 331 is arranged on the first straight line A1. The first steering mirror 331 includes a mirror 331a and a holder 331b. Mirror 331a is attached to holder 331b. The holder 331b is attached to the partition wall portion 29. The holder 3331 holds the mirror 331a so that the orientation of the mirror 331a can be adjusted. The first steering mirror 331 reflects the laser beam L1, the output of which has been adjusted by the attenuator 32, toward the sixth wall portion 26 side.

The reflecting member 332 reflects the laser beam L1 reflected by the first steering mirror 331 toward the second wall portion 22 side. The reflective member 332 is, for example, a mirror or a prism.

The second steering mirror 333 is arranged on the second straight line A2. The second steering mirror 333 includes a mirror 333a and a holder 333b. Mirror 333a is attached to holder 333b. The holder 333b is attached to the partition wall portion 29. The holder 333b holds the mirror 333a so that the orientation of the mirror 333a can be adjusted. The second steering mirror 333 reflects the laser beam L1 reflected by the reflection member 332 toward the sixth wall portion 26 side.

As an example, each holder 331b, 333b can be accessed by a tool through an opening with a lid (not shown) formed in the second wall portion 22. As a result, by operating the tool while viewing an image etc. acquired by the observation unit 17, which will be described later, the optical axis of the laser beam L1 incident on the condensing unit 14 can be aligned with the optical axis of the condensing unit 14. , the orientation of each mirror 331a, 333a can be adjusted.

The laser beam adjustment section 13 further includes a beam expander 34 and a reflection section (second reflection section) 35. The optical axis adjustment section 33, the beam expander 34, and the reflection section 35 are arranged on the second straight line A2 extending along the Z direction. The beam expander 34 expands the diameter of the laser beam L1 reflected by the optical axis adjustment section 33. The reflecting section 35 reflects the laser beam L1 whose diameter has been expanded by the beam expander 34 toward the first wall section 21 side and the fifth wall section 25 side. The reflecting section 35 is, for example, a mirror or a prism.

The laser beam adjustment section 13 further includes a reflective spatial light modulator 36 and an imaging optical system 37. The reflective spatial light modulator 36, the imaging optical system 37, and the condensing section 14 are arranged on the third straight line A3 extending along the Z direction. The reflective spatial light modulator 36 modulates the laser beam L1 reflected by the reflection section 35 and reflects it toward the sixth wall section 26 side. The reflective spatial light modulator 36 is, for example, a reflective liquid crystal (LCOS) spatial light modulator (SLM). The imaging optical system 37 constitutes a double-sided telecentric optical system in which the reflective surface 36a of the reflective spatial light modulator 36 and the entrance pupil plane 14a of the condenser 14 are in an imaging relationship. The imaging optical system 37 is composed of three or more lenses.

The first straight line A1, the second straight line A2, and the third straight line A3 are located on a plane perpendicular to the Y direction. The second straight line A2 is located on the second wall portion 22 side with respect to the third straight line A3. In the laser processing head 10A, the laser beam L1 that enters into the housing 11 from the incidence section 12 along the Z direction is reflected by the reflection section 31 and travels on the first straight line A1. The laser beam L1 that has traveled on the first straight line A1 is reflected by the optical axis adjustment section 33 and travels on the second straight line A2. The laser beam L1 that has traveled on the second straight line A2 is sequentially reflected by the reflection section 35 and the reflective spatial light modulator 36, and travels on the third straight line A3. The laser beam L1 that has traveled on the third straight line A3 is emitted from the condensing section 14 to the outside of the housing 11 along the Z direction.

The laser processing head 10A further includes a dichroic mirror 15, a measurement section 16, an observation section 17, a drive section 18, and a circuit section 19.

The dichroic mirror 15 is arranged between the imaging optical system 37 and the light condensing section 14 on the third straight line A3. That is, the dichroic mirror 15 is disposed within the housing 11 between the laser beam adjustment section 13 and the light condensing section 14 . The dichroic mirror 15 is attached to the partition wall 29 on the fourth wall 24 side. Dichroic mirror 15 transmits laser light L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 is preferably, for example, cube-shaped or two plate-shaped arranged in a twisted relationship.

The measuring section 16 is arranged within the housing 11 on the first wall section 21 side with respect to the third straight line A3. That is, the measuring section 16 is arranged on the first wall section 21 side with respect to the light condensing section 14 in the X direction. The measuring section 16 is attached to the partition wall section 29 on the fourth wall section 24 side. The measurement unit 16 outputs measurement light L10 for measuring the distance between the surface of the object 100 (for example, the surface on which the laser beam L1 enters) and the light condensing unit 14. , detects the measurement light L10 reflected on the surface of the object 100. That is, the measurement light L10 output from the measurement unit 16 is irradiated onto the surface of the object 100 via the light collection unit 14, and the measurement light L10 reflected from the surface of the object 100 is irradiated via the light collection unit 14. is detected by the measuring section 16.

More specifically, the measurement light L10 output from the measurement section 16 is sequentially reflected by the beam splitter 20 attached to the partition wall section 29 on the fourth wall section 24 side and the dichroic mirror 15, and is reflected at the light condensing section. The light is emitted from 14 to the outside of the housing 11. The measurement light L10 reflected on the surface of the target object 100 enters the housing 11 from the condensing section 14, is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, enters the measurement section 16, and enters the measurement section 16. Detected in

The observation section 17 is arranged within the housing 11 on the first wall section 21 side with respect to the third straight line A3. That is, the observation section 17 is arranged on the first wall section 21 side with respect to the light condensing section 14 in the X direction. The observation section 17 is attached to the partition wall section 29 on the fourth wall section 24 side. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (for example, the surface on which the laser beam L1 enters), and reflects it on the surface of the object 100 via the condensing unit 14. The observed observation light L20 is detected. In other words, the observation light L20 output from the observation section 17 is irradiated onto the surface of the object 100 via the light condensing section 14, and the observation light L20 reflected from the surface of the object 100 is irradiated via the light condensing section 14. is detected by the observation unit 17.

More specifically, the observation light L20 output from the observation section 17 passes through the beam splitter 20, is reflected by the dichroic mirror 15, and is emitted from the condensing section 14 to the outside of the housing 11. The observation light L20 reflected by the surface of the object 100 enters the housing 11 from the light condensing section 14, is reflected by the dichroic mirror 15, passes through the beam splitter 20, enters the observation section 17, and enters the observation section 17. Detected at 17. Note that the wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least their center wavelengths are shifted from each other).

The drive section 18 is attached to the partition wall section 29 on the fourth wall section 24 side. The drive section 18 moves the light condensing section 14 disposed on the sixth wall section 26 along the Z direction, for example, by the driving force of a piezoelectric element.

The circuit section 19 is arranged within the housing 11 on the third wall section 23 side with respect to the partition wall section 29. That is, the circuit section 19 is arranged within the housing 11 on the third wall section 23 side with respect to the laser beam adjustment section 13, the measurement section 16, and the observation section 17. The circuit section 19 is spaced apart from the partition wall section 29. The circuit section 19 is, for example, a plurality of circuit boards. The circuit section 19 processes the signal output from the measurement section 16 and the signal input to the reflective spatial light modulator 36. The circuit section 19 controls the drive section 18 based on the signal output from the measurement section 16. As an example, the circuit section 19 controls the distance between the surface of the object 100 and the light collecting section 14 to be maintained constant (i.e., the distance between the surface of the object 100 and the condensing section 14 based on the signal output from the measurement section 16). The driving unit 18 is controlled so that the distance to the focal point of the laser beam L1 is maintained constant.

Note that the partition wall section 29 has cutouts and holes through which wiring for electrically connecting each of the measurement section 16, observation section 17, drive section 18, and reflective spatial light modulator 36 to the circuit section 19 passes. etc. (not shown) are formed. Furthermore, the housing 11 is provided with a connector (not shown) to which wiring and the like for electrically connecting the circuit section 19 and the control section 9 (see FIG. 1) are connected.

The laser processing head 10B, like the laser processing head 10A, includes a housing 11, an entrance section 12, a laser beam adjustment section 13, a condensing section 14, a dichroic mirror 15, a measurement section 16, and an observation section 17. , a driving section 18 , and a circuit section 19 . However, as shown in FIG. 2, each configuration of the laser processing head 10B is different from that of the laser processing head 10A with respect to a virtual plane that passes through the midpoint between the pair of attachment parts 65 and 66 and is perpendicular to the Y direction. They are arranged so as to have a plane symmetrical relationship with.

For example, in the case 11 of the laser processing head 10A, the fourth wall 24 is located on the laser processing head 10B side with respect to the third wall 23, and the sixth wall 26 is supported on the fifth wall 25. It is attached to the attachment part 65 so as to be located on the part 7 side. On the other hand, in the case 11 of the laser processing head 10B, the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23, and the sixth wall portion 26 is located on the side of the laser processing head 10A with respect to the fifth wall portion 25. It is attached to the attachment part 66 so as to be located on the supporting part 7 side.

The casing 11 of the laser processing head 10B is configured such that the casing 11 is attached to the attachment portion 66 with the third wall portion 23 disposed on the attachment portion 66 side. Specifically, it is as follows. The mounting portion 66 includes a base plate 66a and a mounting plate 66b. The base plate 66a is attached to a rail provided on the Z-axis moving section 63. The mounting plate 66b is erected at the end of the base plate 66a on the laser processing head 10A side. The housing 11 of the laser processing head 10B is attached to the attachment portion 66 with the third wall portion 23 in contact with the attachment plate 66b. The housing 11 of the laser processing head 10B is removable from the mounting portion 66.
[Functions and effects of laser processing head]

In the laser processing head 10A, an optical axis adjustment section 33 for adjusting the optical axis of the laser beam L1 incident from the incident section 12 is arranged on the optical path of the laser beam L1 from the incident section 12 to the condensing section 14. There is. As a result, for example, when the output end 2a of the optical fiber 2 is removed from the housing 11 for maintenance or the like and the output end 2a of the optical fiber 2 is connected to the input section 12 again, the light condensing section 14 The optical axis of the incident laser beam L1 can be made to coincide with the optical axis of the condenser 14. Further, the incident part 12 is biased toward the first wall 21 of the housing 11 in the X direction, and the light condensing part 14 is biased toward the second wall 22 of the housing 11 in the X direction. Thereby, it is possible to suppress the optical path of the laser beam L1 from the incident section 12 to the optical axis adjustment section 33 from becoming long, and as a result, the optical axis of the laser beam L1 that enters the condensing section 14 is focused. It is possible to suppress deviation from the optical axis of the portion 14. Therefore, according to the laser processing head 10A, the laser beam L1 can be focused with high precision.

In addition, in the laser processing head 10A, the incident part 12 is arranged on the fifth wall part 25 of the housing 11, and in the laser beam adjustment part 13, the optical axis adjustment part 33 is located at the rear stage of the reflection part 31 and the attenuator 32 ( (on the downstream side in the traveling direction of the laser beam L1), and before the beam expander 34, the reflecting section 35, the reflective spatial light modulator 36, and the imaging optical system 37 (on the upstream side in the traveling direction of the laser beam L1). has been done. It is arranged before the beam expander 34, the reflecting section 35, the reflective spatial light modulator 36, and the imaging optical system 37 (on the upstream side in the traveling direction of the laser beam L1). As a result, the optical axis of the laser beam L1 that enters the "beam expander 34, reflection section 35, reflective spatial light modulator 36, imaging optical system 37, and condensing section 14" which is a configuration related to the shaping of the laser beam L1. can be adjusted, so the laser beam L1 can be focused with higher precision. Further, the incidence section 12 is arranged on the fifth wall section 25, and in the laser beam adjustment section 13, the attenuator 32 is arranged between the reflection section 31 and the optical axis adjustment section 33. Thereby, it is possible to suppress the increase in size of the housing 11 due to the application of the attenuator 32.

Furthermore, in the laser processing head 10A, since a light source that outputs the laser beam L1 is not provided in the housing 11, the housing 11 can be made smaller. Further, in the case 11, the distance between the third wall 23 and the fourth wall 24 is smaller than the distance between the first wall 21 and the second wall 22, and the distance between the third wall 23 and the fourth wall 24 is smaller than the distance between the first wall 21 and the second wall 22, The light section 14 is biased toward the fourth wall section 24 in the Y direction. As a result, when moving the housing 11 along the Y direction in which the third wall 23 and the fourth wall 24 face each other, for example, other structures (for example, a laser processing head) are placed on the fourth wall 24 side. 10B), the light condensing unit 14 can be brought close to the other configuration. Further, since the distance between the third wall 23 and the fourth wall 24 is smaller than the distance between the first wall 21 and the second wall 22, the third wall 23 and the fourth wall 24 face each other. When moving the housing 11 along the Y direction, the space occupied by the housing 11 can be reduced. Furthermore, since the incident part 12 and the condensing part 14 are biased towards the fourth wall part 24 in the Y direction, the area in the housing 11 that is closer to the third wall part 23 with respect to the laser beam adjusting part 13 is The area can be effectively utilized by arranging other components (for example, the circuit section 19) in the area.

Further, in the laser processing head 10A, the circuit section 19 is arranged within the housing 11 on the third wall section 23 side with respect to the laser beam adjustment section 13. Thereby, the area on the third wall part 23 side with respect to the laser beam adjustment part 13 out of the area inside the housing 11 can be effectively used.

Furthermore, in the laser processing head 10A, the laser beam adjustment section 13 is disposed within the housing 11 on the fourth wall section 24 side with respect to the partition wall section 29, and the circuit section 19 is disposed within the housing 11 on the fourth wall section 24 side with respect to the partition wall section 29. , are arranged on the third wall portion 23 side with respect to the partition wall portion 29. This makes it difficult for the heat generated in the circuit section 19 to be transmitted to the laser beam adjustment section 13, so that distortion in the laser beam adjustment section 13 due to the heat generated in the circuit section 19 can be suppressed, and the laser beam L1 can be adjusted appropriately. Further, the circuit section 19 can be efficiently cooled in the region inside the housing 11 on the third wall section 23 side, for example, by air cooling or water cooling.

Further, in the laser processing head 10A, the laser beam adjustment section 13 is attached to the partition wall section 29. Thereby, the laser beam adjustment section 13 can be supported reliably and stably within the housing 11.

Further, in the laser processing head 10A, the circuit section 19 is spaced apart from the partition wall section 29. Thereby, it is possible to more reliably suppress the heat generated in the circuit section 19 from being transmitted to the laser beam adjustment section 13 via the partition wall section 29.

Furthermore, in the laser processing head 10A, the measurement section 16 and the observation section 17 are arranged in a region within the housing 11 on the first wall section 21 side with respect to the light condensing section 14, and the circuit section 19 , is arranged on the third wall 23 side with respect to the laser beam adjustment section 13 in the area inside the housing 11, and the dichroic mirror 15 connects the laser beam adjustment section 13 and the condensing section 14 within the housing 11. is located between. Thereby, the area within the housing 11 can be used effectively. Furthermore, in the laser processing apparatus 1, processing can be performed based on the measurement result of the distance between the surface of the object 100 and the condensing section 14. Furthermore, the laser processing apparatus 1 can perform processing based on the observation results of the surface of the object 100.

Further, in the laser processing head 10A, the circuit section 19 controls the drive section 18 based on the signal output from the measurement section 16. Thereby, the position of the condensing point of the laser beam L1 can be adjusted based on the measurement result of the distance between the surface of the object 100 and the condensing section 14.

The above operations and effects are similarly achieved by the laser processing head 10B.

Furthermore, in the laser processing apparatus 1, the laser beam L1 is focused with high accuracy by each of the laser processing heads 10A and 10B, so that the object 100 can be processed efficiently and accurately.

Moreover, in the laser processing apparatus 1, each of the pair of attachment parts 65 and 66 moves along each of the Y direction and the Z direction. Thereby, the target object 100 can be processed more efficiently.

Moreover, in the laser processing apparatus 1, the support part 7 moves along each of the X direction and the Y direction, and rotates about an axis parallel to the Z direction as a center line. Thereby, the target object 100 can be processed more efficiently.
[Modified example of laser processing head]

As shown in FIG. 6, the incidence section 12 is arranged on the first wall section 21 of the housing 11, and in the laser beam adjustment section 13, the optical axis adjustment section 33 is located downstream of the attenuator 32 and at the beam expander. 34, the reflecting section 35, the reflective spatial light modulator 36, and the imaging optical system 37. In the laser processing head 10A shown in FIG. 6, the incidence section 12, the attenuator 32, and the optical axis adjustment section 33 (specifically, the first steering mirror 331 of the optical axis adjustment section 33) are arranged on the first straight line A1. (Others are the same as the laser processing head 10A shown in FIG. 5). In the laser processing head 10A shown in FIG. 6, the attenuator 32 adjusts the output of the laser beam L1 that has entered from the incidence section 12. According to this, the laser beam L1 that is incident on "the beam expander 34, the reflection section 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condensing section 14" which are the configurations related to the shaping of the laser beam L1. Since the optical axis can be adjusted, the laser beam L1 can be focused more accurately. Further, since the attenuator 32 is disposed between the incident section 12 and the optical axis adjustment section 33, it is possible to suppress the size of the housing 11 due to the application of the attenuator 32. Furthermore, the height of the laser processing apparatus 1 can be reduced. The above configuration is also applicable to the laser processing head 10B.

Further, in the laser processing head 10A, as shown in FIG. 32, the reflecting section 31, the beam expander 34, the reflecting section 35, the reflective spatial light modulator 36, and the imaging optical system 37. In the laser processing head 10A shown in FIG. 7, the optical axis adjustment section 33 (specifically, the second steering mirror 333 of the optical axis adjustment section 33), the attenuator 32, and the reflection section 31 are arranged on the first straight line A1. The optical axis adjustment section 33 (specifically, the first steering mirror 331 of the optical axis adjustment section 33) faces the incidence section 12 in the Z direction, and the reflection section 31 faces the beam expander in the Z direction. 34 (the rest is the same as the laser processing head 10A shown in FIG. 5). In the laser processing head 10A shown in FIG. 33, the reflecting section 31 reflects the laser beam L1 whose output was adjusted by the attenuator 32 toward the sixth wall section 26 of the housing 11, and the beam expander 34 adjusts the output of the laser beam L1 reflected by the attenuator 33. , the diameter of the laser beam L1 reflected by the reflection section 31 is expanded. According to this, the laser beam L1 that is incident on "the beam expander 34, the reflection section 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condensing section 14" which are the configurations related to the shaping of the laser beam L1. Since the optical axis can be adjusted, the laser beam L1 can be focused more accurately. Further, since the attenuator 32 is disposed between the optical axis adjustment section 33 and the reflection section 31, it is possible to suppress the case 11 from increasing in size due to the application of the attenuator 32. The above configuration is also applicable to the laser processing head 10B.

Further, in the laser processing head 10A shown in each of FIGS. 5 and 6, the attenuator 32 may be disposed between the optical axis adjustment section 33 and the beam expander 34. Furthermore, in the laser processing head 10A shown in FIG. 7, the attenuator 32 may be arranged between the reflection section 31 and the beam expander 34. In addition, in the laser processing head 10A shown in each of FIGS. 5, 6, and 7, the attenuator 32 is located downstream of the beam expander 34 (for example, between the reflective section 35 and the reflective spatial light modulator 36). may be placed. Each of the above configurations can also be applied to the laser processing head 10B.

Further, the optical axis adjustment section 33 is not limited to having the first steering mirror 331, the reflecting member 332, and the second steering mirror 333. The optical axis adjustment section 33 only needs to have a configuration for adjusting the optical axis of the laser beam L1 incident from the incidence section 12. As an example, the optical axis adjustment section 33 includes a first steering mirror 331 that reflects the laser beam L1 incident from the first wall section 21 side along the X direction toward the first wall section 21 side and the fifth wall section 25 side. , and a second steering mirror 333 that reflects the laser beam L1 reflected by the first steering mirror 331 toward the sixth wall portion 26 along the Z direction. Furthermore, each of the first steering mirror 331 and the second steering mirror 333 may be an electrically operated mirror. In that case, the first steering mirror 331 and the second steering mirror 333 may be configured to automatically adjust the orientation of each mirror 331a, 333a based on the image acquired by the observation unit 17.

Further, in the case 11, at least one of the first wall 21, the second wall 22, the third wall 23, and the fifth wall 25 is located on the side of the mounting section 65 (or mounting section 66) of the laser processing device 1. It is sufficient that the housing 11 is configured so that it can be attached to the attachment part 65 (or the attachment part 66) in the arranged state.

Further, the circuit section 19 is not limited to one that processes the signal output from the measurement section 16 and/or the signal input to the reflective spatial light modulator 36, but is one that processes some kind of signal in the laser processing head. That's fine.

Moreover, the light source unit 8 may have one light source. In that case, the light source unit 8 only needs to be configured so that a part of the laser light output from one light source is emitted from the emitting part 81a, and the remaining part of the laser light is emitted from the emitting part 82a.
[About the operation of laser processing equipment]

Subsequently, the operation of the laser processing apparatus 1 will be explained. FIG. 8 is a schematic top view showing the operation of the laser processing device. In FIG. 1 and subsequent figures, the interiors of the laser processing heads 10A and 10B are schematically shown. As shown in FIGS. 1 and 8, a target object 100 is supported by the support section 7. As shown in FIGS. Note that the symbol S in the figure represents an optical system other than the optical system related to the irradiation of the laser beams L1 and L2 for forming the modified region, such as the measurement section 16 and observation section 17 described above. ing.

As described above, the object 100 has a plurality of lines C extending along the X direction and arranged along the Y direction. Although the line C is a virtual line, it may be an actually drawn line. Although a plurality of lines extending along the Y direction and arranged along the X direction are also set on the object 100, illustration thereof is omitted.

The laser processing apparatus 1 performs an irradiation process in which laser processing is performed along each line C under the control of the control unit 9. In the irradiation process, the control unit 9 at least moves the support unit 7 by the moving mechanism 5, moves the laser processing heads 10A and 10B by the moving mechanism 6, and controls the laser beam L1 from the laser processing head 10A and the laser processing head 10B. , L2 irradiation. In the laser processing apparatus 1, the control unit 9 executes a first process and a second process as the irradiation process (the irradiation process includes the first process and the second process).

The first process is a process of scanning one line C of the plurality of lines C with the laser beam L1 from the laser processing head 10A in the X direction. The second process is a process of scanning another line C among the plurality of lines C with the laser beam L2 from the laser processing head 10B in the X direction.

When the control unit 9 scans the laser beams L1 and L2 in the X direction, it means to move the respective focal points along the X direction by the following operation. That is, first, the laser processing heads 10A and 10B are moved in the Y direction and the Z direction via the Y-axis moving section 61 and the Z-axis moving sections 63 and 64 of the moving mechanism 6, and the laser beams L1 and L2 are focused. The light spots are positioned on each line C and inside the object 100. In this state, the support section is moved along the X direction via the moving mechanism 5, and the laser processing heads 10A, 10B are moved along the X direction via the X-axis moving sections 62A, 62B. By moving in the opposite direction, the condensing points of the laser beams L1 and L2 are moved within the object 100 along the line C in the X direction.

In particular, here, the control unit 9 executes the first process and the second process so as to overlap at least part of the time. That is, the control unit 9 controls the control unit 9 so that a state in which the laser light L1 is scanned along one line C and a state in which the laser light L2 is scanned along another line C are simultaneously realized. do. That is, the control unit 9 operates the laser processing head 10A and the laser processing head 10B at the same time. As a result, throughput can be clearly improved compared to processing using a single laser processing head.

When the scanning of the laser beams L1 and L2 along one line C is completed, the control unit 9 independently moves each of the laser processing heads 10A and 10B in the Y direction (Z direction as necessary) by the distance of the line C. direction), and scanning of the laser beams L1 and L2 along the next line C (ie, the first process and the second process) is continued. The control unit 9 forms modified regions M along all the lines C by continuously performing this operation approximately for the number of lines C.

At this time, the control unit 9 sequentially executes the first process from the line C located at one end of the target object 100 in the Y direction among the plurality of lines C toward the inner line C in the Y direction. At the same time, the control unit 9 sequentially executes the second process from the line C located at the other end of the object 100 in the Y direction among the plurality of lines C toward the inner line in the Y direction. (referred to as main processing). The line C located at one end in the Y direction and the line C located at the other end in the Y direction have the same length in the X direction.

This point will be explained in more detail. In the main processing, the control section 9 first moves the laser processing head 10A in the Y direction and the Z direction by controlling the Y-axis moving section 61 and the Z-axis moving section 63. Thereby, the condensing point of the laser beam L1 is placed on the line C located at one end of the object 100 in the Y direction and at a position inside the object 100. At the same time, the control unit 9 controls the Y-axis moving unit 61 and the Z-axis moving unit 64 to move the laser processing head 10B in the Y direction and the Z direction. Thereby, the condensing point of the laser beam L2 is placed on the line C located at the other end of the object 100 in the Y direction and at a position inside the object 100. At this time, the position of the focal point of the laser beam L1 in the X direction and the position of the focal point of the laser beam L2 in the X direction, for example, match.

In this state, the control section 9 controls the moving section 53 of the moving mechanism 5 to move the support section 7 along the X direction. Furthermore, in this state, the control section 9 moves the laser processing head 10A in the direction opposite to the support section 7 along the X direction by controlling the X-axis moving section 62A. Further, in this state, the control section 9 moves the laser processing head 10B in the direction opposite to the support section 7 along the X direction by controlling the X-axis moving section 62B. As a result, the focal points of the laser beams L1 and L2 are moved within the object 100 along the respective lines C in the X direction.

That is, the control unit 9 moves the support unit 7 and the laser processing heads 10A, 10B in mutually opposite directions along the X direction in a state where the laser beams L1, L2 are output from the laser processing heads 10A, 10B. By controlling the moving mechanisms 5 and 6 in this manner, the object 100 is irradiated with the laser beams L1 and L2 along the respective lines C (irradiation processing is performed).

In particular, as the first process, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving unit 62A) to move the supporting unit 7 and the laser processing head 10A in opposite directions along the X direction. The moving mechanism 5 and the moving mechanism 6 ( X-axis moving unit 62B). As a result, the first process and the second process for each line C are started and completed at the same time. That is, here, the first process and the second process overlap in their entirety. Thereby, a modified region M is formed inside the object 100 along the line C.

Note that the relationship between the speed of movement of the support part 7 along the X direction in the irradiation process and the speed of movement of the laser processing heads 10A and 10B along the X direction is that the total speed is the same as the movement of the focal point. The control unit 9 can arbitrarily set the speed within a range that reaches the target value. As an example, here, the control section 9 makes the speed of the laser processing heads 10A, 10B along the X direction smaller than the speed of the support section 7 along the X direction. Further, the speed of the laser processing head 10A and the speed of the laser processing head 10B can be made the same when the lengths of the lines C to which the laser beams L1 and L2 are irradiated are the same. However, if, for example, the length of the line C to be irradiated with the laser beam L1 and the length of the line C to be irradiated with the laser beam L2 are different from each other, the speed of the laser processing head 10A The speed of the processing head 10B may be made different from each other.

Subsequently, the control unit 9 controls the Y-axis moving unit 61 to move the laser processing head 10A in the Y direction. As a result, the condensing point of the laser beam L1 is located on the line C that is located one line inward from one end of the object 100 in the Y direction, and is located inside the object 100. state. At the same time, the control section 9 controls the Y-axis moving section 61 to move the laser processing head 10B. As a result, the condensing point of the laser beam L2 is located on the line C that is located only one line inward from the other end of the object 100 in the Y direction, and is located inside the object 100. state. At this time, the position of the focal point of the laser beam L1 in the X direction and the position of the focal point of the laser beam L2 in the X direction, for example, match.

In this state, the control unit 9 controls the moving mechanisms 5 and 6 to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions along the The condensing points of the laser beams L1 and L2 are moved along the line C in the X direction. As a result, the first process and the second process for each line C are started and completed simultaneously here as well. That is, here as well, the first process and the second process overlap in their entirety. By repeating this operation of the control unit 9, the laser processing head 10A and the laser processing head 10B can be operated simultaneously to perform laser processing without waste until reaching the inner line C of the object 100.

Note that in each figure, the modified region M is shown as a solid line for the sake of explanation, but it is not necessary that the modified region M is actually visible from the surface of the object 100.

Here, as shown in FIG. 9, as the above operation is repeated, the positional relationship between the laser processing head 10A and the laser processing head 10B becomes smaller in the Y direction in the inner region of the object 100. The unprocessed line C remains in the area of the object 100 where the positional relationship does not shrink any further (for example, they are in close contact with each other) and corresponds to the distance D between the respective light condensing parts 14. There may be cases where In this case, it becomes difficult to simultaneously execute the first process and the second process as described above. Therefore, in this case, the control unit 9 executes the following post-processing process.

That is, as shown in FIG. 10, when the laser processing head 10A and the laser processing head 10B come closest to each other in the Y direction as a result of the main processing, the control unit 9 controls the respective light condensing parts of the object 100. When some lines C remain in the area between 14 and 14, the laser beam L2 from the laser processing head 10B is directed to the part of the lines C while retracting the laser processing head 10A from the area of the object 100. A post-processing process of scanning in the X direction (executing the second process) is executed. Note that the laser processing head 10A and the laser processing head 10B may be reversed.

As a result, laser processing for all lines C is completed. After that, if necessary, by rotating the support part 7, a line intersecting the line C can be set along the X direction, and the above operation can be repeated.
[Actions and effects of laser processing equipment]

As explained above, in the laser processing apparatus 1, the support part 7 for supporting the object 100 is movable in the X direction by the moving mechanism 5, and the object supported by the support part 7 is A laser processing head 10A for irradiating the laser beam L1 onto the laser beam L1 is movable in the X direction and the Y direction by a moving mechanism 6. As a result, in the laser processing apparatus 1, under the control of the control section 9, the support section 7 and the laser processing head 10A are moved in mutually opposite directions along the X direction, while the object 100 is moved along the line C. An irradiation process (first process) in which the laser beam L1 is irradiated can be performed. Therefore, the processing speed can be improved compared to the case where only the object 100 side (support part 7) is moved during irradiation with the laser beam L1.

In particular, in the laser processing apparatus 1, the camera AC for capturing an image of the target object 100 is connected to the X-axis moving section 62A, which is responsible for moving the laser processing head 10A in the , are attached to the Y-axis moving section 61. Therefore, during the irradiation process, only the laser processing head 10A (and the support section 7) can be moved along the X direction without accompanying the camera AC. Therefore, the moving speed of the laser processing head 10A along the X direction can be further improved, and the processing speed can be reliably improved.

In addition, in the laser processing apparatus 1, as described above, by moving the support part 7 and the laser processing head 10A in mutually opposite directions during the irradiation process, the moving speed of the condensing point of the laser beam L1 with respect to the object 100 can be adjusted. can be improved. In other words, the target moving speed of the condensing point is shared between the support section 7 and the laser processing head 10A. Therefore, compared to the case where one of the support section 7 and the laser processing head 10A is moved, it is possible to suppress the maximum value of each moving speed. As a result, the time and distance involved in accelerating and decelerating the support portion 7 and the laser processing head 10A can be reduced.

Furthermore, in the laser processing apparatus 1, the moving mechanism 6 includes a pair of Y-axis moving parts 61 disposed opposite to each other in the X direction, and the X-axis moving part 62A spans the pair of Y-axis moving parts 61. may be supported. In this case, the laser processing head 10A is reliably supported.

Here, the weight of the laser processing head 10A is generally lighter than the weight of the support section 7. Therefore, when moving the focal point at the target moving speed, it is conceivable to move the laser processing head 10A faster than the support section 7 (that is, to relatively increase the speed burden on the laser processing head 10A). .

On the other hand, in the laser processing apparatus 1, the control section 9 makes the speed of the laser processing head 10A along the X direction smaller than the speed of the support section 7 along the X direction in the irradiation process. In this way, when the optical fiber 2 for introducing the laser beam L1 from the light source 81 is connected to the laser processing head 10A, regardless of the weight relationship between the laser processing head 10A and the support section 7, First, it is possible to protect the optical fiber 2 by making the laser processing head 10A relatively slow (that is, by making the speed burden on the laser processing head 10A relatively small).

Further, the laser processing apparatus 1 includes a laser processing head 10B for irradiating the object 100 supported by the support section 7 with the laser beam L2. The moving mechanism 6 extends along the X direction, has the laser processing head 10B attached thereto, and includes an X-axis moving section 62B for moving the laser processing head 10B along the X direction. The Y-axis moving section 61 has an X-axis moving section 62B attached thereto, and has a function of moving the X-axis moving section 62B along the Y direction. In the irradiation process, the control unit 9 performs a first process of irradiating one line C of the plurality of lines C with the laser beam L1 from the laser processing head 10A, and a first process of irradiating one line C of the plurality of lines C with the laser beam L1. The second process of irradiating C with the laser beam L2 from the laser processing head 10B is performed so as to overlap at least part of the time. In this way, by operating the laser processing head 10A and the laser processing head 10B simultaneously at least part of the time, throughput is improved.

In addition, in the first process, the control unit 9 causes the moving mechanism 5 and the moving mechanism 6 (X-axis moving unit 62A) to move the supporting unit 7 and the laser processing head 10A in mutually opposite directions along the X direction. In the second process, the control section 9 moves the moving mechanism 5 and the moving mechanism 6 (X-axis moving section 62B) so as to move the supporting section 7 and the laser processing head 10B in mutually opposite directions along the X direction. control.
[Modified example of laser processing equipment]

The above embodiment describes one embodiment of the laser processing apparatus according to the present invention. Therefore, the above laser processing apparatus 1 can be modified as desired.

For example, as shown in FIG. 11, the laser processing apparatus 1 does not need to include the laser processing head 10B. Further, in accordance with this, the moving mechanism 6 does not need to include the X-axis moving section 62B, the Z-axis moving section 64, etc. for moving the laser processing head 10B. Even in this case, in the irradiation process, it is possible to improve the processing speed by irradiating the laser beam L1 while moving the support part 7 and the laser processing head 10A in mutually opposite directions. In particular, even in this case, since only the laser processing head 10A (and the support part 7) can be moved along the X direction without accompanying the camera AC during the irradiation process, the laser processing head 10A can be moved in the X direction. It is possible to improve the movement speed along the line and more reliably increase the processing speed. Note that in FIGS. 11 to 13, illustration of the mounting portion 55 is omitted.

Further, as shown in FIGS. 12 and 13, in the laser processing apparatus 1, the camera AC is connected to the laser processing head in the X-axis moving section 62A for moving the laser processing head 10A along the X direction. By being attached together with 10A, it may be attached to the Y-axis moving section 61 via the X-axis moving section 62A. In the example of FIG. 12, the laser processing head 10B is not provided, and in the example of FIG. 13, the laser processing head 10B is provided. In these cases, there is no need for a separate configuration for attaching the camera AC to the Y-axis moving unit 61, and the device configuration can be simplified. Regarding this case, reference may be made to the additional notes below.

Furthermore, in the above example, the X-axis moving parts 62A, 62B, and 62C are supported by being spanned by a pair of Y-axis moving parts 61. However, the moving mechanism 6 includes a single Y-axis moving section 61, and the X-axis moving sections 62A, 62B, and 62C may be supported by the single Y-axis moving section 61 in a cantilevered state. good.

In addition, in the example of FIG. 1, in the Y direction, the X-axis moving section 62C is provided outside the mutually adjacent X-axis moving sections 62A and 62B, that is, when viewed from the Z direction, the laser processing head 10A, the laser processing An example is shown in which the head 10B and the camera AC are arranged in this order in the Y direction. However, the arrangement of the X-axis moving parts 62A to 62C, the laser processing heads 10A and 10B, and the camera AC is not limited to this. That is, in the Y direction, the X-axis moving section 62C may be disposed between the X-axis moving section 62A and the X-axis moving section 62B. In this case, when viewed from the Z direction, the laser processing head 10A, camera AC, and laser processing head 10B are arranged in this order in the Y direction.

Furthermore, in the embodiment described above, the laser processing device 1 (moving mechanism 5) does not need to have a function (moving section 53) for moving the support section 7 in the Y direction. In this case, by reducing the weight of the support part 7, the distance required for acceleration and deceleration of the support part 7 can be reduced and the speed of the support part 7 can be increased. According to this, the processing speed can be improved under the condition that the speed of the laser processing heads 10A, 10B is made smaller than the speed of the support section 7 as described above.

The above embodiments will be additionally described below.
[Additional note 1]
By irradiating a target object with a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction with a laser beam along the lines, the line A laser processing device for forming a modified region in the object along the
a support part for supporting the object;
a first laser processing head for irradiating the target object supported by the support section with the laser beam;
a first moving mechanism for moving the support part along a first direction;
a second movement mechanism for moving at least the first laser processing head along the first direction and the second direction;
the first moving mechanism so as to move the support part and the first laser processing head in mutually opposite directions along the first direction in a state in which the laser beam is output from the first laser processing head; and a control unit that performs an irradiation process of irradiating the object with the laser beam along the line by controlling the second moving mechanism;
Equipped with
The second moving mechanism is
a first moving unit that extends along the first direction and is attached to the first laser processing head, and is configured to move the first laser processing head along the first direction;
a second moving section that extends along the second direction, is attached to the first moving section, and is configured to move the first moving section along the second direction;
including;
An optical fiber for introducing the laser beam output from a light source is connected to the first laser processing head,
The control section makes the speed of the first laser processing head along the first direction smaller than the speed of the support section along the first direction in the irradiation process.
Laser processing equipment.
[Additional note 2]
The second moving mechanism includes a pair of second moving parts arranged opposite to each other in the first direction,
The first moving section is supported by being spanned by the pair of second moving sections.
The laser processing device according to Supplementary Note 1.
[Additional note 3]
comprising a camera for capturing an image of the object supported by the support section,
The camera is attached to the second moving unit via a member different from the first moving unit.
The laser processing device according to supplementary note 1 or 2.
[Additional note 4]
The second moving mechanism extends along the first direction and is attached with the camera, and includes a third moving section as the different member for moving the camera along the first direction.
The laser processing device according to appendix 3.
[Additional note 5]
comprising a second laser processing head for irradiating the object supported by the support section with a laser beam,
The second moving mechanism extends along the first direction and is attached with the second laser processing head, and includes a fourth moving section for moving the second laser processing head along the first direction. including;
The second moving unit has the fourth moving unit attached thereto and has a function of moving the fourth moving unit along the second direction,
In the irradiation process, the control unit includes a first process of irradiating one line of the plurality of lines with the laser beam from the first laser processing head, and a second process of irradiating one line of the plurality of lines with the laser beam, and another line of the plurality of lines. performing a second process of irradiating the laser beam from the second laser processing head to overlap at least part of the time;
In the first process, the control section causes the first moving mechanism and the second moving mechanism to move the support section and the first laser processing head in mutually opposite directions along the first direction. control,
In the second process, the control section causes the first moving mechanism and the second moving mechanism to move the support section and the second laser processing head in mutually opposite directions along the first direction. Control,
The laser processing device according to any one of Supplementary Notes 1 to 4.

DESCRIPTION OF SYMBOLS 1... Laser processing device, 5... Movement mechanism (1st movement mechanism), 6... Movement mechanism (2nd movement mechanism), 7... Support part, 9... Control part, 10A... Laser processing head (1st laser processing head) , 10B...Laser processing head (second laser processing head), 61...Y-axis moving section (second moving section), 62A...X-axis moving section (first moving section), 62B...X-axis moving section (fourth moving section) ), 62C...X-axis moving unit (third moving unit), 100...object, AC...camera.

Claims (5)

By irradiating a target object with a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction with a laser beam along the lines, the line A laser processing device for forming a modified region in the object along the
a support part for supporting the object;
a first laser processing head for irradiating the target object supported by the support section with the laser beam;
a camera for capturing an image of the object supported by the support section;
a first moving mechanism for moving the support part along a first direction;
a second movement mechanism for moving at least the first laser processing head along the first direction and the second direction;
the first moving mechanism so as to move the support part and the first laser processing head in mutually opposite directions along the first direction in a state in which the laser beam is output from the first laser processing head; and a control unit that performs an irradiation process of irradiating the object with the laser beam along the line by controlling the second moving mechanism;
Equipped with
The second moving mechanism is
a first moving unit that extends along the first direction and is attached to the first laser processing head, and is configured to move the first laser processing head along the first direction;
a second moving section that extends along the second direction, is attached to the first moving section, and is configured to move the first moving section along the second direction;
including;
The camera is attached to the second moving unit via a member different from the first moving unit.
Laser processing equipment. The second moving mechanism includes a pair of second moving parts arranged opposite to each other in the first direction,
The first moving section is supported by being spanned by the pair of second moving sections.
The laser processing device according to claim 1. An optical fiber for introducing the laser beam output from a light source is connected to the first laser processing head,
The control section makes the speed of the first laser processing head along the first direction smaller than the speed of the support section along the first direction in the irradiation process.
A laser processing apparatus according to claim 1 or 2. The second moving mechanism extends along the first direction and is attached with the camera, and includes a third moving section as the different member for moving the camera along the first direction.
A laser processing apparatus according to any one of claims 1 to 3. comprising a second laser processing head for irradiating the object supported by the support section with a laser beam,
The second moving mechanism extends along the first direction and is attached with the second laser processing head, and includes a fourth moving section for moving the second laser processing head along the first direction. including;
The second moving unit has the fourth moving unit attached thereto and has a function of moving the fourth moving unit along the second direction,
In the irradiation process, the control unit includes a first process of irradiating one line of the plurality of lines with the laser beam from the first laser processing head, and a first process of irradiating one line of the plurality of lines with the laser beam, and another line of the plurality of lines. performing a second process of irradiating the laser beam from the second laser processing head to overlap at least part of the time;
In the first process, the control section causes the first moving mechanism and the second moving mechanism to move the support section and the first laser processing head in mutually opposite directions along the first direction. control,
In the second process, the control section causes the first moving mechanism and the second moving mechanism to move the support section and the second laser processing head in mutually opposite directions along the first direction. Control,
A laser processing device according to any one of claims 1 to 4.

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