JP7439634B2 - Thermal transfer sheet, method for manufacturing thermal transfer sheet, and method for manufacturing transfer material - Google Patents

Description

The present disclosure relates to a thermal transfer sheet, a method for manufacturing a thermal transfer sheet, and a method for manufacturing a transfer material.

Conventionally, as a method for manufacturing a transfer material by forming an antenna wire or the like on a transfer target, a thermal transfer sheet comprising a base material and a transfer layer having a vapor-deposited film is superimposed on the transfer target, and then thermal transfer is performed. A method is known in which a transfer layer is transferred onto an object by passing the thermal transfer sheet between a thermal head and a platen roller provided in a printer and heating the thermal transfer sheet by the thermal head (Patent Document 1). .

High conductivity is required for antenna wires and the like formed using such thermal transfer sheets. In addition, if the transfer layer is transferred by peeling off part of the base material or the release layer provided between the base material and the transfer layer, there is a risk that the conductivity of the formed antenna wire etc. will be reduced. Therefore, the transfer layer is required to have high transferability.
In addition, when the transfer layer includes a release layer as the layer closest to the base material, the release layer is present on the outermost surface of the transferred transfer layer, so the conductivity of the formed antenna wire etc. There was a risk that this would lead to a decline in sexual performance.

JP2003-243918A

The problem to be solved by the present disclosure is to provide a thermal transfer sheet that has a transfer layer with high transferability and can form highly conductive antenna wires and the like.
The problem to be solved by the present disclosure is to provide a method for manufacturing the thermal transfer sheet and a method for manufacturing a transfer product using the thermal transfer sheet.

The thermal transfer sheet of the present disclosure includes a base material, a release layer, a transfer layer,
The transfer layer includes at least a vapor deposited film,
A vapor deposited film is provided adjacent to the release layer,
The release layer contains silicone resin.

The method for manufacturing a thermal transfer sheet of the present disclosure includes the steps of preparing a base material;
forming a release layer on the base material;
forming a vapor deposited film on the release layer;
The release layer contains silicone resin.

The method for producing a transcript of the present disclosure includes:
a step of preparing the thermal transfer sheet and the transfer target;
a step of transferring a transfer layer provided in a thermal transfer sheet onto a transfer target;
Equipped with

According to the present disclosure, it is possible to provide a thermal transfer sheet in which the transferability of the transfer layer is high and a highly conductive antenna wire or the like can be formed. According to the present disclosure, it is possible to provide a method for manufacturing the thermal transfer sheet and a method for manufacturing a transfer product using the thermal transfer sheet.

1 is a schematic cross-sectional view showing an embodiment of a thermal transfer sheet of the present disclosure. 1 is a schematic cross-sectional view showing an embodiment of a thermal transfer sheet of the present disclosure. 1 is a schematic cross-sectional view showing an embodiment of a thermal transfer sheet of the present disclosure. FIG. 3 is a front view of a barcode pattern formed in an example.

<Thermal transfer sheet>
The thermal transfer sheet 10 according to the present disclosure includes a base material 11, a release layer 12, and a transfer layer 13, as shown in FIG. The transfer layer 13 includes at least a vapor deposited film 14 .
In one embodiment, the transfer layer 13 includes an adhesive layer 15 on the deposited film 14, as shown in FIG.
In one embodiment, as shown in FIG. 3, the thermal transfer sheet 10 includes an anchor coat layer 15 between the base material 11 and the release layer 12.
In one embodiment, the thermal transfer sheet 10 includes a back layer 16 on the surface of the substrate 11 opposite to the surface on which the transfer layer 13 is provided, as shown in FIGS. 1-3.

The surface electrical resistivity of the transfer layer side surface of the thermal transfer sheet is preferably 5×10 ⁻³ Ω/□ or more and less than 5×10 ⁻¹ Ω/□, and 1×10 ⁻² Ω/□ or more and 1×10 ⁻¹ More preferably, it is less than Ω/□. As a result, antenna wires and the like having high conductivity can be formed using the thermal transfer sheet of the present disclosure.
In the present disclosure, the surface electrical resistance value is measured using a low resistivity meter (manufactured by Mitsubishi Chemical Corporation, Loresta-GP MCP-T610) or an equivalent device.

Each layer included in the thermal transfer sheet of the present disclosure will be described below.

(Base material)
The base material can be used without any particular limitations as long as it has heat resistance to the thermal energy applied during thermal transfer and has mechanical strength and solvent resistance that can support the transfer layer etc. provided on the base material.

As the base material, a film made of a resin material (hereinafter simply referred to as "resin film") can be used. For example, polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), 1,4-polycyclohexylene dimethylene terephthalate, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, nylon polyamides such as 6 and nylon 6,6, polyolefins such as polyethylene (PE), polypropylene (PP) and polymethylpentene, polyvinyl chloride, polyvinyl alcohol (PVA), polyvinyl acetate, vinyl chloride-vinyl acetate copolymers, and Vinyl resins such as polyvinylpyrrolidone (PVP), vinyl acetal resins such as polyvinyl acetoacetal and polyvinyl butyral, (meth)acrylic resins such as polyacrylate and polymethacrylate, imide resins such as polyimide and polyetherimide, cellophane, cellulose acetate, Examples include cellulose resins such as nitrocellulose, cellulose acetate propionate (CAP) and cellulose acetate butyrate (CAB), styrene resins such as polystyrene (PS), polycarbonate, and ionomer resins.
Among the above resin materials, from the viewpoint of heat resistance and mechanical strength, polyester is preferable, PET or PEN is more preferable, and PET is particularly preferable.
Note that in the present disclosure, "(meth)acrylic" includes both "acrylic" and "methacrylic". Furthermore, "(meth)acrylate" includes both "acrylate" and "methacrylate."

Furthermore, a laminate of the resin films described above can also be used as a base material. The resin film laminate can be produced by using a dry lamination method, a wet lamination method, an extrusion method, or the like.

When the base material is a resin film, the resin film may be a stretched film or an unstretched film, but from the viewpoint of strength, a stretched film stretched in a uniaxial direction or biaxial direction is preferred. It is preferable to use

The thickness of the base material is preferably 3 μm or more and 25 μm or less. This makes it possible to improve the mechanical strength of the base material and the transmission of thermal energy during thermal transfer.

(Release layer)
The release layer contains at least one silicone resin. Thereby, the transferability of the transfer layer can be improved, and an antenna wire or the like having high conductivity can be formed.

In the present disclosure, the silicone resin is a resin having a siloxane bond in its molecular structure, and includes unmodified polysiloxane, modified polysiloxane, and silicone modified resin.
Polysiloxane means a resin material whose main chain is composed of siloxane bonds.
Moreover, the silicone-modified resin means, for example, a polymer of a polysiloxane group-containing monomer and another monomer, that is, a resin material having a side chain constituted by a siloxane bond.
Note that in the present disclosure, the silicone resin includes a resin that is cured in the presence of a curing catalyst or the like.

In one embodiment, the silicone resin has monofunctional (R ₃ SiO _1/2 ) _n , difunctional (R ₂ SiO) _n , and trifunctional (RSiO _{3/ 2} ) It has _n or tetrafunctional (SiO ₂ ) _n .
Preferably, the silicone resin is a silsesquioxane having trifunctional type (RSiO _3/2 ) _n as a basic structural unit or a cured product thereof. Thereby, the transferability of the transfer layer can be further improved. Moreover, the foil tearability of the transfer layer can be improved. In the present disclosure, the foil cutting property of the transfer layer refers to the degree of suppression of trailing when transferring the transfer layer onto a transfer target, and when the foil cutting property is good, the occurrence of trailing is This means that it is possible to suppress Furthermore, by improving the foil cutting properties, it is possible to suppress a decrease in conductivity of antenna wires and the like. Furthermore, the thickness of the vapor deposited film formed on the release layer can be made uniform, and the retention of the vapor deposited film can be improved.

The structures of silsesquioxane include random structure, complete cage structure, incomplete cage structure, and ladder structure. Among these, silsesquioxane with random structure Sun is preferred.

In the above basic structural unit, R is an organic group, and the organic group may have a substituent.
Examples of the substituent include an epoxy group, a hydroxyl group, an amino group, and a mercapto group. Among these, epoxy groups are preferred. Thereby, the transferability and foil tearability of the transfer layer can be further improved.
In formula (1), n is an integer of 2 or more.

In one embodiment, the silicone resin is a silicone-modified resin having siloxane bonds as crosslinks. An example of a preferable resin is a resin (cured product) obtained by curing an alkoxysilyl group-containing resin in the presence of a curing catalyst or the like. In one embodiment, the cured product is obtained by forming a crosslinked structure of "Si-O-Si" through hydrolysis and silanol reaction of two or more alkoxysilyl groups possessed by the alkoxysilyl group-containing resin. It is a resin that can be used. In one embodiment, the cured product is a resin obtained by forming an "Si-O-Si" crosslinked structure between an alkoxysilyl group-containing resin and another compound.

Examples of alkoxysilyl group-containing resins include alkoxysilyl group-containing acrylic resins, alkoxysilyl group-containing polyesters, alkoxysilyl group-containing epoxy resins, alkoxysilyl group-containing alkyd resins, alkoxysilyl group-containing fluororesins, alkoxysilyl group-containing polyurethanes, and alkoxysilyl group-containing resins. Examples include group-containing phenol resins and alkoxysilyl group-containing melamine resins. An alkoxysilyl group-containing (meth)acrylic resin is preferred because of the transferability of the transfer layer and the foil tearability.
Examples of the alkoxysilyl group include trialkoxysilyl group, dimethoxysilyl group, and monoalkoxysilyl group.

The content of silicone resin in the release layer is preferably 50% by mass or more and 99.5% by mass or less, and more preferably 70% by mass or more and 95% by mass or less. Thereby, the transferability and foil tearability of the transfer layer can be further improved.

In one embodiment, the release layer includes a curing catalyst. Thereby, the transferability of the transfer layer and the foil breakage can be further improved.
Examples of the curing catalyst include aluminum-based catalysts, tin-based catalysts, titanium-based catalysts, and zirconia-based catalysts.

The content of the curing catalyst in the release layer is preferably 0.5 parts by mass or more and 20 parts by mass or less, and more preferably 5 parts by mass or more and 15 parts by mass or less, based on 100 parts by mass of the silicone resin content. Thereby, the transferability and foil tearability of the transfer layer can be further improved.

In one embodiment, the release layer includes a resin material other than silicone resin (other resin material). Examples include polyester, polyamide, polyolefin, vinyl acetal resin of vinyl resin, (meth)acrylic resin, imide resin, cellulose resin, styrene resin, polycarbonate, and ionomer resin.

The release layer may contain additives. Examples include fillers, plasticizers, antistatic materials, ultraviolet absorbers, organic particles, inorganic particles, mold release agents, and dispersants.

The thickness of the release layer is preferably 0.1 μm or more and 3 μm or less, more preferably 0.3 μm or more and 2.0 μm or less. Thereby, the transferability and foil tearability of the transfer layer can be further improved.

(transfer layer)
The transfer layer includes at least a vapor deposited film. In one embodiment, the transfer layer includes an adhesive layer on the deposited film.

(deposited film)
The deposited film can be formed from a metal such as aluminum, silver, zinc, silicon, magnesium, calcium, potassium, tin, sodium, titanium, lead, indium, or zirconium.

The thickness of the deposited film is preferably 5 nm or more and 500 nm or less, more preferably 25 nm or more and 300 nm or less, and particularly preferably 30 nm or more and 200 nm or less. Thereby, the transferability and foil tearability of the transfer layer can be further improved.

(Adhesive layer)
The adhesive layer contains at least one thermoplastic resin that softens and exhibits adhesive properties when heated.
Examples of the thermoplastic resin include polyester, vinyl resin, (meth)acrylic resin, polyurethane, cellulose resin, polyamide, polyolefin, polystyrene, and chlorinated resins thereof. Among these, polyester or chlorinated polyolefin is preferable from the viewpoint of adhesion with the deposited film and foil cutting properties, and it is more preferable to use these in combination. As the chlorinated polyolefin, chlorinated polypropylene is preferred. The chlorinated polyolefin may be a modified product or an unmodified product, but from the viewpoint of adhesion with the deposited film and foil tearability, a modified product is preferable, and an acid-modified chlorinated polyolefin such as maleic acid is preferred. Particularly preferred are polyolefins.

When polyester and chlorinated polyolefin are used together, their content ratio (polyester content/chlorinated polyolefin content) is preferably 4/6 or more and 9/1 or less, and 5/5 or more and 9/1 or less, based on mass. /1 or less is more preferable.

The content of the thermoplastic resin in the adhesive layer is preferably 50% by mass or more and 100% by mass or less, more preferably 70% by mass or more and 95% by mass or less.

In one embodiment, the adhesive layer includes at least one electrically conductive material. Thereby, the surface electrical resistivity of the surface of the thermal transfer sheet on the transfer layer side can be reduced, and an antenna or the like having high conductivity can be formed. Examples of the conductive material include carbon black, tin oxide, indium oxide, zinc oxide, titanium oxide, potassium titanate, and conductive polymer resin.

The content of the conductive material in the adhesive layer is preferably 0.1% by mass or more and 50% by mass or less, and more preferably 1% by mass or more and 30% by mass or less. Thereby, the surface electrical resistivity of the surface of the thermal transfer sheet on the transfer layer side can be reduced, and an antenna or the like having high conductivity can be formed.

The adhesive layer may contain the above additive.

1
The thickness of the adhesive layer is preferably 0.1 μm or more and 5 μm or less, more preferably 0.3 μm or more and 3 μm or less. Thereby, the surface electrical resistivity of the surface of the thermal transfer sheet on the transfer layer side can be reduced, and an antenna or the like having high conductivity can be formed.

(Anchor coat layer)
In one embodiment, the thermal transfer sheet includes an anchor coat layer between the base material and the release layer. Thereby, the adhesion between the base material and the release layer can be improved, and the transferability and foil tearability of the transfer layer can be further improved.

The anchor coat layer includes at least one resin material. Examples include polyester, polyamide, polyolefin, vinyl resin, vinyl acetal resin, (meth)acrylic resin, imide resin, urethane resin, epoxy resin, cellulose resin, styrene resin, polycarbonate, and ionomer resin.

The anchor coat layer may contain the above-mentioned additives.

The thickness of the anchor coat layer is preferably 0.1 μm or more and 1 μm or less, more preferably 0.2 μm or more and 0.5 μm or less. Thereby, the adhesion between the base material and the release layer can be further improved.

(back layer)
In one embodiment, the thermal transfer sheet includes a backing layer on the opposite side of the substrate from the side on which the transfer layer is provided. This can prevent sticking and wrinkles from occurring due to heating during thermal transfer.

In one embodiment, the back layer includes at least one resin material. Examples include vinyl resin, vinyl acetal resin, polyester, polyamide, polyolefin, (meth)acrylic resin, polyolefin, polyurethane, cellulose resin, and phenol resin.

In one embodiment, the back layer includes at least one isocyanate compound. Examples include xylene diisocyanate, toluene diisocyanate, isophorone diisocyanate, and hexamethylene diisocyanate.

The back layer may contain the above mold release agent and additives.

The thickness of the back layer is, for example, 0.3 μm or more and 3.0 μm or less.

<Method for manufacturing thermal transfer sheet>
The method for manufacturing a thermal transfer sheet of the present disclosure includes:
a step of preparing a base material;
forming a release layer on the base material;
The method includes at least a step of forming a vapor deposited film on the release layer.
In one embodiment, a method for manufacturing a thermal transfer sheet includes a step of forming an adhesive layer on a vapor deposited film.
In one embodiment, the release layer is formed on the surface of the anchor coat layer of the base material on which the anchor coat layer is formed.
In one embodiment, the method for manufacturing a thermal transfer sheet includes the step of forming a back layer on the surface of the base material opposite to the surface on which the release layer is provided.

Hereinafter, each step included in the method for manufacturing a thermal transfer sheet of the present disclosure will be described.

(Process of preparing base material)
The base material may be obtained by manufacturing the above-mentioned resin film by a conventionally known method, or a commercially available product may be purchased.

(Step of forming a release layer)
The release layer can be formed by dispersing or dissolving the above materials in an appropriate solvent to create a coating solution, coating it on the base material or anchor coat layer to form a coating film, and drying this. . As a coating method, a known method such as a roll coating method, a reverse roll coating method, a gravure coating method, a reverse gravure coating method, a bar coating method, or a rod coating method can be used. By heating the coating film after drying, the silicone resin can be effectively cured, and the transferability of the transfer layer can be further improved. Moreover, you may preserve|save after heating.
The anchor coat layer is prepared by dispersing or dissolving the above materials in a suitable solvent to create a coating solution, and applying the coating solution using the above coating method onto the base material before forming the release layer to form a coating film. , can be formed by drying this.

(Step of forming a vapor deposited film)
The deposited film can be deposited using a physical vapor deposition method (PVD method) such as a vacuum evaporation method, a sputtering method, or an ion plating method, or a chemical vapor deposition method such as a plasma chemical vapor deposition method, a thermochemical vapor deposition method, or a photochemical vapor deposition method. It can be formed on the release layer using a vapor phase growth method (CVD method).

(Step of forming adhesive layer)
In one embodiment, the method for manufacturing a thermal transfer sheet of the present disclosure includes a step of forming an adhesive layer on the deposited film.
The adhesive layer is formed by dispersing or dissolving the above material in an appropriate solvent to create a coating solution, applying it on the vapor deposited film using the above coating method to form a coating film, and drying this. can.

(Step of forming back layer)
In one embodiment, the method for manufacturing a thermal transfer sheet of the present disclosure includes a step of forming a back layer on the surface of the base material opposite to the surface on which the release layer is provided.
The back layer can be formed by dispersing or dissolving the above material in an appropriate solvent to create a coating solution, applying it onto the base material using the above coating means to form a coating film, and drying this. .

<Method for producing transfer material>
The transcription method of the present disclosure includes:
a step of preparing the thermal transfer sheet and the transfer target;
The method includes a step of transferring a transfer layer included in a thermal transfer sheet onto an object to be transferred.

(Preparation process)
The thermal transfer sheet can be manufactured by the following method.
As the object to be transferred, a paper base material or the above-mentioned resin film can be used. Examples of the paper base material include wood-free paper, art paper, coated paper, resin coated paper, cast coated paper, paperboard, synthetic paper, and impregnated paper.

Furthermore, a laminate made of two or more types of paper base materials, a laminate made of two or more types of resin films, or a laminate of a paper base material and a resin film can be used.

(Transfer process)
The transfer method of the present disclosure includes a step of transferring a transfer layer from a thermal transfer sheet onto an object to be transferred, and thereby an antenna wire or the like having high conductivity can be formed on the object to be transferred.

The surface electrical resistivity of the transfer layer transferred onto the object to be transferred is preferably less than 1.0×10 ² Ω/□, more preferably less than 1.0×10 Ω/□. Further, the surface electrical resistivity is preferably 1.0×10 ⁻³ Ω/□ or more.

<Transcript>
The transfer product of the present disclosure includes a transfer target and a transfer layer. More specifically, the transfer object includes at least a transfer target and a vapor deposited film. In one embodiment, the transfer material includes a transfer target, an adhesive layer, and a deposited film. Since each layer has been described above, description thereof will be omitted here.

Hereinafter, one embodiment of a thermal transfer sheet, a transfer method, and a method for manufacturing a thermal transfer sheet of the present disclosure will be illustrated. Note that the thermal transfer sheet of the present disclosure is not limited to these.

The thermal transfer sheet of the present disclosure includes a base material, a release layer, a transfer layer,
The transfer layer includes at least a vapor deposited film,
A vapor deposited film is provided adjacent to the release layer,
The release layer contains silicone resin.

In one embodiment, the release layer includes silsesquioxane represented by the formula (RSiO _3/2 ) _n as the silicone resin.
(In the formula,
R is an organic group,
n is an integer of 2 or more. )

In one embodiment, the organic group has an epoxy group.

In one embodiment, the release layer contains a cured product of an alkoxysilyl group-containing resin as the silicone resin.

In one embodiment, the alkoxysilyl group-containing resin is an alkoxysilyl group-containing (meth)acrylic resin.

In one embodiment, the release layer includes a curing catalyst.

In one embodiment, the thickness of the deposited film is 5 nm or more and 500 nm or less.

In one embodiment, the thickness of the release layer is 0.1 μm or more and 3 μm or less.

In one embodiment, the surface electrical resistivity of the surface of the transfer layer is 5×10 ⁻³ Ω/□ or more and less than 5×10 ⁻¹ Ω/□.

In one embodiment, the transfer layer includes an adhesive layer on the deposited film.

In one embodiment, the adhesive layer includes at least one of polyester and chlorinated polyolefin.

In one embodiment, the adhesive layer includes an electrically conductive material.

In one embodiment, the thermal transfer sheet includes an anchor coat layer between the base material and the release layer.

The method for manufacturing a thermal transfer sheet of the present disclosure includes the steps of preparing a base material;
forming a release layer on the base material;
forming a vapor deposited film on the release layer;
The release layer contains silicone resin.

The method for producing a transcript of the present disclosure includes:
a step of preparing the thermal transfer sheet and the transfer target;
a step of transferring a transfer layer provided in a thermal transfer sheet onto a transfer target;
Equipped with

In one embodiment, the surface electrical resistivity of the transfer layer transferred onto the transfer target is less than 1.0×10 ² Ω/□.

Next, the thermal transfer sheet of the present disclosure will be described in more detail with reference to Examples, but the thermal transfer sheet of the present disclosure is not limited to these Examples. Note that the displayed content is a value after converting to solid content, excluding the solvent.

Example 1
[Preparation of thermal transfer sheet]
A coating solution for an anchor coat layer having the following composition was applied to one side of a PET film having a thickness of 6 μm and dried to form an anchor coat layer having a thickness of 0.3 μm.
(Coating liquid for anchor coat layer)
- Urethane resin 78.8 parts by mass (DIC Corporation, Hydran (registered trademark) AP-40N)
・Epoxy resin 16.8 parts by mass (DIC Corporation, Watersol (registered trademark) WSA-950)
・Antistatic material 4.4 parts by mass (manufactured by Mitsubishi Chemical Corporation, aquaPASS-01x)
・Ion exchange water 300 parts by mass ・Solvent 1200 parts by mass (Solmix A-11, manufactured by Nippon Alcohol Sales Co., Ltd.)

A release layer coating solution having the following composition was applied onto the anchor coat layer and dried to form a release layer with a thickness of 0.65 μm. It was stored for a certain period of time in a high temperature environment.
<Coating liquid for release layer>
・88 parts by mass of epoxy group-containing silsesquioxane (manufactured by Arakawa Chemical Co., Ltd., Compoceran SQ502-8)
・Curing catalyst 8 parts by mass (manufactured by Daicel Corporation, Celltop (registered trademark) CAT-A, aluminum-based catalyst)
・4 parts by mass of urethane-modified polyester (manufactured by Toyobo Co., Ltd., Byron (registered trademark) UR-1700)
・Toluene 80 parts by mass ・Methyl ethyl ketone (MEK) 160 parts by mass

An aluminum vapor deposited film with a thickness of 30 nm was formed on the release layer by the PVD method.

A coating solution for an adhesive layer having the following composition was applied onto the deposited film and dried to form an adhesive layer with a thickness of 0.5 μm. In this example, the transfer layer is composed of a vapor deposited film and an adhesive layer.
(Coating liquid for adhesive layer)
・Polyester 8 parts by mass (manufactured by Toyobo Co., Ltd., Byron (registered trademark) GK250, Mn 10000, Tg 60°C)
- 2 parts by mass of maleic acid-modified chlorinated polypropylene (manufactured by Nippon Paper Industries Co., Ltd., Superchron (registered trademark) 3221S, Mn 50000, softening point 70°C)
・Toluene 80 parts by mass ・MEK 20 parts by mass

A coating solution for a back layer having the following composition was applied to the opposite side of the PET film from the side on which the transfer layer was formed, and dried to form a back layer with a thickness of 0.3 μm, and the thermal transfer sheet of the present disclosure was applied. Obtained.
(Coating liquid for back layer)
- Styrene-acrylonitrile copolymer 11 parts by mass - Linear saturated polyester 0.3 parts by mass - Zinc stearyl phosphate 6 parts by mass - Melamine resin powder 3 parts by mass - MEK 80 parts by mass

Examples 2 to 5
A thermal transfer sheet was produced in the same manner as in Example 1, except that the thickness and type of the deposited film were changed as shown in Table 1.

Test example 6
A thermal transfer sheet was produced in the same manner as in Example 1, except that the coating liquid for the release layer was changed to the following composition.
(Coating liquid for mold release layer)
・Methylphenyl silicone resin 10 parts by mass (manufactured by Shin-Etsu Chemical Co., Ltd., KR-300)
・Curing catalyst 0.5 parts by mass (manufactured by Nitto Kasei Co., Ltd., U-830, dioctyltin-based catalyst)
・MEK 45 parts by mass ・Toluene 45 parts by mass

Test example 7
A thermal transfer sheet was produced in the same manner as in Example 1, except that the coating liquid for the release layer was changed to the following composition.
(Coating liquid for mold release layer)
・Alkoxysilyl group-containing acrylic resin 10 parts by mass (manufactured by Taisei Fine Chemical Co., Ltd., 8SQ-1020)
・Curing catalyst 0.5 parts by mass (manufactured by Nitto Kasei Co., Ltd., U-830, dioctyltin catalyst)
・MEK 45 parts by mass ・Toluene 45 parts by mass

Example 8
A thermal transfer sheet was produced in the same manner as in Example 1, except that the adhesive layer coating liquid was changed to the following composition and the thickness of the deposited film was changed to 60 nm.
(Coating liquid for adhesive layer)
・Polyester 10 parts by mass (manufactured by Toyobo Co., Ltd., Byron (registered trademark) GK250, Mn 10000, Tg 60°C)
・Toluene 80 parts by mass ・MEK 20 parts by mass

Examples 9 and 10
Thermal transfer sheets were manufactured in the same manner as in Examples 1 and 2, respectively, except that the anchor coat layer was not formed.

Example 11
A thermal transfer sheet was produced in the same manner as in Example 1, except that the adhesive layer coating liquid was changed to the following composition.
(Coating liquid 2 for adhesive layer)
・Polyester 8 parts by mass (manufactured by Toyobo Co., Ltd., Byron (registered trademark) GK250, Mn 10000, Tg 60°C)
- 2 parts by mass of maleic acid-modified chlorinated polypropylene (manufactured by Nippon Paper Industries Co., Ltd., Superchron (registered trademark) 3221S, Mn 50000, softening point 70°C)
・Carbon black 1 part by mass ・Toluene 80 parts by mass ・MEK 20 parts by mass

Comparative example 1
Example except that instead of the anchor coat layer and the release layer, a release layer coating solution having the following composition was applied to one side of the PET film and dried to form a release layer with a thickness of 0.65 μm. A thermal transfer sheet was produced in the same manner as in Example 1. In this comparative example, the transfer layer is composed of a release layer, a vapor deposited film, and an adhesive layer.
(Coating liquid for release layer)
・Acrylic resin 29 parts by mass (Dyanal (registered trademark) BR-87, manufactured by Mitsubishi Chemical Corporation)
・1 part by mass of polyester (manufactured by Toyobo Co., Ltd., Byron (registered trademark) 200)
・Toluene 35 parts by mass ・MEK 35 parts by mass

Comparative example 2
A thermal transfer sheet was produced in the same manner as in Example 1, except that the coating liquid for the release layer was changed to the following composition.
(Coating liquid for mold release layer)
・30 parts by mass of epoxy melamine copolymer (manufactured by Tanaka Chemical Co., Ltd., 4800-612 Clear)
・Isocyanate compound 7.5 parts by mass (Mitsui Takeda Chemical Co., Ltd., Takenate D110N)
・Copper phthalocyanine dye (manufactured by BASF, Neozapon Blue FLE) 1 part by mass ・Toluene 50 parts by mass ・MEK 50 parts by mass

<<Transferability evaluation-1>>
A coated paper with a thickness of 100 μm was prepared as a transfer target.
A barcode pattern (15 mm in length and 40 mm in width) shown in FIG. 4 was formed on coated paper by transferring the transfer layer included in the thermal transfer sheets of Examples and Comparative Examples using the following test printer.
(test printer)
・Thermal head: Kyocera Corporation, KEE-57-12GAN2-STA
・Heating element average resistance value: 3303Ω
・Main scanning direction resolution: 300 dpi (dots per inch)
・Sub-scanning direction resolution: 300dpi
・Line speed: 3.0msec. /line
・Printing start temperature: 35℃
・Pulse duty ratio: 70%

The transfer layer on the coated paper was visually observed and evaluated based on the following evaluation criteria. The results are shown in Table 1.
(Evaluation criteria)
A: Excellent transferability with no scratching or sticking B: Transferable, but peeling is heavy and sticking occurs in some areas C: Transferable, but fading occurs in some areas D :Cannot be transferred

<<Transferability evaluation-2>>
Evaluation was carried out in the same manner as in Transferability Evaluation-1 except that the transfer target was changed to a white PET film with a thickness of 150 μm. The results are shown in Table 1.

<<Surface electrical resistivity evaluation-1>>
The surface electrical resistivity (Ω/□) of the transfer layer side of the thermal transfer sheets of Examples and Comparative Examples was measured using a low resistivity meter (Loresta-GP MCP-T610, manufactured by Mitsubishi Chemical Corporation) under the following conditions. It was measured. Evaluation was made based on the following evaluation criteria, and the results are shown in Table 1.
(Measurement condition)
・Measurement mode: Fixed constant method ・Probe: ASP (four probes)
・Correction coefficient: 4.532
・Thickness: 1μm
(Evaluation criteria)
A: Less than 4.0 x 10 ^-2 Ω/□ B: More than 4.0 x 10 ^-2 Ω/□ and less than 1.0 x 10 ^-1 Ω/□ C: More than 1.0 x 10 ^-1 Ω/□ Less than 1.0 D: 1.0Ω/□ or more

<<Surface electrical resistivity evaluation-2>>
For the transfer material created in Transferability Evaluation-2, the surface electrical resistivity (Ω/□) of the transfer layer side was measured using a low resistivity meter (Mitsubishi Chemical Corporation, Loresta-GP MCP-T610). did. Evaluation was made based on the following evaluation criteria, and the results are shown in Table 1.
(Evaluation criteria)
A: Less than 1.0 x 10 Ω/□ B: 1.0 x 10 Ω/□ or more and less than 1.0 x 10 ² Ω/□ C: 1.0 x 10 ² Ω/□ or more and less than 1.0 x 10 ⁴ D : 1.0×10 ⁴ Ω/□ or more

＜＜Evaluation of foil cutting performance＞＞
After visually checking the transferred material created in Transferability Evaluation-2 for residual peeling, reading was performed using a barcode checker (Quick Check 850, manufactured by Honeywell) in accordance with ANSI X3.182. . Evaluation was made based on the following evaluation criteria, and the results are shown in Table 1.
(Evaluation criteria)
A: It was visually confirmed that there was no excess peeling, and the reading result of the barcode checker was B or higher. B: The occurrence of excess peeling was visually confirmed, but the reading result of the barcode checker was B or higher. C: Occurrence of excess peeling was visually confirmed, but the reading result of the barcode checker was C. D: Occurrence of excess peeling was visually confirmed, and the reading result of the barcode checker was below D. there were

10: thermal transfer sheet, 11: base material, 12: release layer, 13: transfer layer, 14: vapor deposited film, 15: anchor coat layer, 16: back layer

Claims (13)

Comprising a base material, a release layer, and a transfer layer,
The transfer layer includes at least a vapor deposited film,
the vapor deposited film is provided adjacent to the release layer,
A thermal transfer sheet, wherein the release layer contains, as a silicone resin, at least one of silsesquioxane represented by the formula (RSiO _1.5 ) _n and a cured product thereof .
(In the above formula,
R is an organic group,
n is an integer of 2 or more. ) The thermal transfer sheet according to claim 1 , wherein the organic group has an epoxy group. The thermal transfer sheet according to claim 1 or 2 , wherein the release layer contains a curing catalyst. The thermal transfer sheet according to any one of claims 1 to 3 , wherein the thickness of the vapor deposited film is 5 nm or more and 500 nm or less. The thermal transfer sheet according to any one of claims 1 to 4 , wherein the thickness of the release layer is 0.1 μm or more and 3 μm or less. The thermal transfer sheet according to any one of claims 1 to 5 , wherein the surface of the transfer layer has a surface electrical resistivity of 5×10 ⁻³ Ω/□ or more and less than 5×10 ⁻¹ Ω/□. The thermal transfer sheet according to any one of claims 1 to 6 , wherein the transfer layer includes an adhesive layer on the vapor deposited film. The thermal transfer sheet according to claim 7 , wherein the adhesive layer contains at least one of polyester and chlorinated polyolefin. The thermal transfer sheet according to claim 7 or 8 , wherein the adhesive layer contains a conductive material. The thermal transfer sheet according to any one of claims 1 to 9 , comprising an anchor coat layer between the base material and the release layer. a step of preparing a base material;
forming a release layer on the base material;
forming a vapor deposited film on the release layer,
A method for producing a thermal transfer sheet, wherein the release layer contains at least one of silsesquioxane represented by the formula (RSiO _1.5 ) _n and a cured product thereof as a silicone resin .
(In the above formula,
R is an organic group,
n is an integer of 2 or more. ) A step of preparing a thermal transfer sheet and a transfer object according to any one of claims 1 to 10 ,
a step of transferring a transfer layer included in the thermal transfer sheet onto the transfer target;
A method for producing a transcription material, comprising: The method for manufacturing a transfer product according to claim 12 , wherein the transfer layer transferred onto the transfer target has a surface electrical resistivity of less than 1.0×10 ² Ω/□.