JP7448970B2 - Board breaking device and board breaking method - Google Patents

Description

The present invention relates to a breaking device and a breaking method for cutting a glass substrate on which a scribe line (cut groove) has been formed in advance along the scribe line. INDUSTRIAL APPLICATION This invention is applied to the processing of the glass substrate etc. used for the flat panel display (FPD) etc. which are employ|adopted, for example in a television, a mobile terminal, a game device, etc.

Conventionally, scribe lines are formed on the surface of a glass substrate by mechanical scribing using a scribing wheel or by laser scribing (scribe process), and the substrate is broken along the scribe lines in the next process (breaking process). It is done by dividing and processing. In this breaking process, a long break bar with a downwardly tapered shape is pressed along the scribe line of the board to bend the board in a V-shape and break it (for example, see Patent Document 1), or a method of applying steam or the like to the scribe line. A known method is to blow a heating medium to generate thermal stress to penetrate cracks in the scribe line in the thickness direction of the substrate, thereby dividing the substrate (see Patent Document 2).

Japanese Patent Application Publication No. 2016-120725 WO2004/067243 publication

However, in the breaking method by pressing a knife-shaped break bar as described in Patent Document 1, when the upper surface of the board is bent into a V shape by pressing, the adjacent divided end surface may be damaged depending on how the pressing load is applied. The upper edges may press against each other and cause chipping, which could cause problems such as cracks on the board surface and deterioration of the edge strength. . In addition, the scribe line to be broken is basically a straight line like the break bar, and the break bar needs to be accurately aligned with the straight scribe line to break.

On the other hand, in the breaking method using thermal stress described in Patent Document 2, breaking is performed without contacting the substrate, so there is no risk of chipping due to pressing of the cut end surfaces together due to deflection. However, since heat is transferred by blowing a heat medium such as steam toward the scribe line from a nozzle that is spatially distant from the scribe line, it is not economical due to poor heat utilization efficiency. The spraying raises the atmospheric gas, and if the atmospheric gas contains dust, there is a risk that the yield of the product will be adversely affected. Further, there were also problems in that the assembly structure of the heating mechanism including the heat source was complicated and increased in size.

Therefore, in view of the above problems, the present invention eliminates the risk of chipping on the divided end face and employs a break that utilizes thermal stress, but it also efficiently applies thermal stress to the scribe line without spraying a heating medium. It is an object of the present invention to provide a substrate breaking device and a substrate breaking method capable of breaking a substrate and having a compact structure.

In order to achieve the above object, the present invention takes the following technical measures. That is, the breaking device of the present invention is a substrate breaking device that breaks a substrate on which a scribe line is formed along the scribe line, and includes a substrate support on which the substrate is placed, and a substrate supporting body on which the substrate is placed, and the scribe line of the substrate. a break bar that is brought into contact with the substrate, and a contact surface of the break bar with the substrate includes a plurality of thermal regions set at a first temperature and a plurality of cold regions set at a second temperature lower than the first temperature. are arranged so as to be adjacent to each other alternately, and the heating area and the cooling area are simultaneously brought into surface contact along the scribe line to cause breakage.

According to the present invention, when breaking, the break bar is brought into contact with the scribe line of the substrate. The contact surface of the break bar with the substrate has a structure in which a hot region at a first temperature T1 and a cold region at a second temperature T2 (however, T1>T2) are arranged alternately, so that heat is generated along the scribe line. The hot and cold regions come into contact with each other alternately, and heating regions at a high temperature (T1) and cooling regions at a lower temperature (T2) are alternately formed in the scribe line on the substrate due to thermal conduction. As a result, compressive stress occurs in the heating region and tensile stress occurs in the cooling region, resulting in a strong separation force that tends to tear the scribe line at the boundary where the stress reverses. , the substrate is broken by this separation force.

According to the present invention, when cutting the substrate, the break bar is brought into contact with the substrate, but it is only necessary to bring them into surface contact so that heat conduction occurs between the substrate and the hot and cold regions of the break bar. Therefore, it is not necessary to press the break bar with a pressing force that would cause the substrate to bend, so that it is possible to obtain a high-quality end surface without defects such as chips on the broken section surface. Furthermore, since thermal stress is applied to the substrate through thermal conduction, there is no problem of dust being thrown up, which occurs when a break is caused by blowing steam or the like.

Furthermore, according to the present invention, since it is sufficient to bring the break bar into surface contact with the substrate surface near the scribe line, the shape of the scribe line does not have to be limited to a straight line, but may include a curved line. It is also possible to break while maintaining a high quality end surface.

In the above invention, each of the heating and cooling regions of the break bar may have a rectangular plane, and may be formed in a band-like surface contact with the substrate.
According to this, when breaking a straight scribe line, by bringing the boundary between the adjacent rectangular heating area and rectangular cold area into contact perpendicularly to the scribe line, a separation force is generated at the boundary part. The separation force can be effectively exerted by applying the force that tears the scribe line in a direction perpendicular to the scribe line.

In the above invention, the heat source in the hot region may be an electric heater, and the cold source in the cold region may be a Peltier element.
By using an electric heater as the heat source and a Peltier element as the cold source, the size of the hot and cold areas can be freely and compactly designed, and the set temperature of the hot and cold areas can be easily adjusted. You can also do this.

In the above invention, the heating heat conductive element is provided with a heating surface forming the heating region on the lower surface and is provided with a heating source thereof, and a heating heat conductive element is provided with a heating surface forming the cooling region on the lower surface and is provided with the cooling source. A plurality of cooling heat conductive elements may be formed, and the break bar may be formed by arranging a plurality of the heating heat conductive elements and the cooling heat conductive elements alternately and incorporating them into the frame of the break bar. .
This allows break bars of different lengths to be easily composed by increasing or decreasing the number of heat transfer elements.

In the above invention, a vertical movement mechanism is provided for holding the cooling heat source element so as to be able to rise and fall with respect to the frame of the break bar, and when the break bar is floating away from the substrate and on standby, the cooling heat source element The cooling surface of the heating element may be formed at a position lower than the heating surface of the heating heat conductive element.
As a result, when the break bar is in the standby position, the cold surface of the cooling heat conductive element is separated from the hot surface of the heating heat conductive element, so that the cooling heat conductive element absorbs radiant heat from the heating heat conductive element. It can be made less susceptible to thermal effects due to heat transfer.

In the above invention, a vertical adjustment mechanism is provided that holds the heating heat source element movably up and down in a vertical range smaller than the vertical movement mechanism with respect to the frame of the break bar, and The heating surfaces may be adjusted to be flush with each other when the surfaces contact the substrate.
As a result, each heating surface can be brought into surface contact with the substrate while always being lined up in a line, and heat can be transferred evenly.

In the above invention, the cooling heat conductive element and the heating heat conductive element may be formed so as to be vertically movably suspended from a portion of the break bar that is connected to the frame body through a pin member and a guide hole.
Thereby, the elevating mechanism can be formed with an extremely simple structure without using a special elevating member such as a cylinder.

Moreover, the breaking method of the present invention made from another viewpoint is a substrate breaking method in which a substrate on which a scribe line is formed is broken along the scribe line, the heating area being set at a first temperature; Prepare break bars arranged side by side so that cold and hot regions set at a second temperature lower than the first temperature are alternately adjacent to each other, and the hot and cold regions of the break bar are arranged along the scribe line of the substrate. By bringing them into surface contact at the same time, breaks are made along the scribe line.

Furthermore, in the breaking method of the present invention, which has been made from another point of view, the cold area is held in the frame of the break bar so as to be movable up and down, first the cold area is brought into surface contact with the substrate, and then the cold area is brought into surface contact with the substrate. Breaking is achieved by bringing the heat area into surface contact at the same time.

FIG. 1 is a perspective view of a breaking device that is an embodiment of the present invention. The perspective view showing the inside of the break bar in the above-mentioned break device. A perspective view of a heat transfer unit (heating heat transfer element and cooling heat transfer element) incorporated in the break bar. FIG. 7 is an explanatory diagram showing the correspondence between the heating area and the cooling area in the break bar and the heating area and cooling area formed on the substrate. The perspective view which shows another aspect of a heat transfer unit. FIG. 7 is a front view showing another embodiment of the break bar in the present invention. FIG. 7 is a perspective view showing how the cooling heat conductive element and the heating heat conductive element are attached to the break bar shown in FIG. 6; FIG. 7 is a partially enlarged front view of the break bar shown in FIG. 6;

Hereinafter, details of the present invention will be explained with reference to the drawings.
FIG. 1 is a perspective view of a substrate breaking device that is an embodiment of the present invention. The substrate breaking device A includes a horizontal substrate support 1 on which a substrate W to be separated is placed. In this embodiment, the substrate support 1 is constituted by a conveyor, and is configured to place a substrate W in a horizontal position and move it in the Y direction in FIG.

Further, a gate-shaped frame 2 is provided so as to straddle the substrate support 1, and a long break bar 4 extending in the X direction is held on a beam (horizontal frame) 3 of this frame 2. The break bar 4 can be raised and lowered toward the substrate support 1 via a lift shaft 6 driven by a lift drive mechanism 5 such as an air cylinder. Although not shown, the break bar 4 may be attached to the tip of a robot arm and moved up and down by the movement of the robot arm.

Further, as shown in FIGS. 2 and 3, the break bar 4 has a heating heat transfer element 7 having a heating surface 7a on its lower surface and a cooling heat transfer element 8 having a cold surface 8a adjacent to each other in a straight line. It is arranged in a shape. In this embodiment, as shown in FIG. 3, a heat transfer unit 9 including heating heat transfer elements 7 on the left and right sides of one cooling heat transfer element 8 is formed, and a plurality of heat transfer units 9 are provided, for example. As shown in FIG. 2, ten units are arranged and assembled in the frame 4a of the break bar 4.
In this case, as shown in FIG. 4(a), the heating heat transfer elements 7, 7 on one side of two adjacent heat transfer units 9 cooperate to form one thermal region H, and each heat transfer The cooling heat transfer element 8 of the unit 9 forms one cold region L, so that the hot region H and the cold region L are arranged alternately in a straight line. In addition, instead of the heat transfer unit 9, as shown in FIG. 5, it is also possible to use a heat transfer unit 9' formed by arranging one cooling heat transfer element 8' and one heating heat transfer element 7'. be.

The lower surfaces (thermal surface 7a, cold surface 8a) of the heating heat conductive element 7 and the cooling heat conductive element 8 are formed as rectangular planes, and are configured to come into surface contact with the substrate W when the break bar 4 is lowered. is formed. Thereby, heat can be transferred by a thermal conduction phenomenon, and the substrate W can be efficiently heated and cooled with little heat loss.

A Peltier element is used for each cooling heat conductive element 8 of the break bar 4, and the cooling surface 8a is cooled to a desired temperature by the cooling effect due to the Peltier effect. Note that an air supply path for air cooling and a heat radiation space (fin) are provided in the upper part of the Peltier element (on the heat radiation side of the back surface of the element) for dissipating the heat generated by the Peltier element. In the embodiment, as shown in FIG. 2, compressed air drawn in from the air supply inlet 10 is introduced into each heat transfer unit 9 via a common duct 11 and branch pipe 12, and a cooling heat transfer element 8 (Peltier element) is used. I am trying to air cool it.

Further, the heating heat conductive element 7 of the break bar 4 has an electric heater wire (not shown) wound therein and is connected to a power source.

Here, the set temperature T1 of the heating heat conductive element 7 and the set temperature T2 of the cooling heat conductive element 8 will be explained. In the present invention, a break bar is brought into contact along the scribe line of the glass substrate to be broken, and thermal stress (compressive stress and tensile stress) in opposite directions is generated at the boundary between the hot region H and the cold region L, resulting in strong separation. Since a force is generated, a stronger separation force can be generated by providing a large temperature difference between the set temperatures of the heating heat conductive element 7 and the cooling heat conductive element 8.
However, in substrates such as liquid crystal panels, the temperature that can be heated is limited by other materials (circuits, adhesives, etc.) provided on the substrate, and it is necessary to keep the temperature below the allowable temperature. It is also desirable to cool the device within a range that does not cause condensation.
Therefore, the set temperatures T1 and T2 are set within the temperature range allowed for the substrate to be processed. For example, the set temperature T2 of the cooling heat conductive element 8 is set to 20°C, which is surely higher than the dew point temperature, and the set temperature T1 of the heating heat conductive element 7 is set to a range of 110 to 60°C, which is sufficiently higher than that temperature. I am trying to set it with .

Next, the operation of cutting the substrate W by the breaking device A described above will be explained.
First, a shallow groove-shaped scribe line S is processed in advance on the surface of the substrate W. The scribe line can be formed by a mechanical scribe in which a scribing wheel is pressed against the substrate surface while rolling, but it can also be formed by a laser scribe instead.

Next, the substrate W on which the scribe line S has been formed is placed on the table 1. At this time, the scribe line S to be divided is made parallel to the long break bar 4 and positioned directly below it.

Next, the break bar 4 is lowered to bring the thermal surface 7a (thermal region H) of the lower heating heat conductive element 7 and the cold surface 8a (cold region L) of the cooling heat conductive element 8 into surface contact with the substrate surface, Heating and cooling the areas on the substrate in contact. The contact time varies depending on the thickness of the substrate, but about 2 seconds is sufficient for a typical glass substrate. Since the break bar 4 has a plurality of heating heat conduction elements 7 and cooling heat conduction elements 8, the hot region H and the cold region L are arranged adjacent to each other alternately. ), a plurality of heating regions corresponding to the hot region H and a plurality of cooling regions corresponding to the cold region L are formed adjacent to each other along the scribe line S in an alternating manner.
As a result, compressive stress is generated in the scribe line S in the heating region of the substrate W due to thermal expansion, and tensile stress is generated in the cooling region due to thermal contraction. At multiple boundary areas where compressive stress and tensile stress are adjacent to each other, a strong separation force (a force that tears the scribe line) occurs at the same time, causing cracks in the scribe line S to penetrate in the thickness direction of the substrate, and as a result, the scribe line The substrate W is completely separated along the line S.

After dividing one scribe line in this way, the break bar 4 is raised and the substrate support 1 (conveyor) is moved so that the next scribe line is directly below the break bar 4. The substrate W is sequentially divided along the scribe line using a similar method.

Incidentally, in the above embodiment, the explanation has been made about dividing the scribe line along the X direction of the substrate W, but when dividing the substrate W along the scribe line in the Y direction, the substrate support 1 is further extended and the downstream side thereof is A break bar 4 oriented in the Y direction is placed above the break bar 4, and the scribe line in the Y direction can be broken by the same means as described above. Furthermore, when the break bar 4 is raised and lowered by a robot arm, the scribe lines in the X direction and the Y direction can be divided by changing the direction of the break bar held by the robot arm.

As described above, in the breaking device according to the present invention, the plurality of heating heat conductive elements 7 and cooling heat conductive elements 8 are incorporated into the break bar 4, so that it is different from the conventional knife-shaped break bar. It has a similar appearance and can be configured compactly. In addition, since the heating heat conductive element 7 and the cooling heat conductive element 8 contact the substrate W and transfer heat by a thermal conduction phenomenon, thermal stress can be efficiently generated inside the substrate with little heat loss. Can be done. Further, as shown in the above embodiment, the break bar 4 is constructed by forming the heat transfer unit 9 including the cooling heat transfer element 8 and the heating heat transfer element 7, and combining a plurality of these units. Therefore, by increasing or decreasing the number of heat transfer units 9, break bars of different lengths can be easily composed.

In the above embodiment, the substrate W is separated by bringing the break bar 4 into contact with the substrate only once, but as will be explained below, the break bar 4 may be moved and brought into contact again. That is, the break bar 4 is configured to be movable in the X direction along the scribe line S, and after the first contact is completed, the cooling heat conductive element 8 is placed in the heating area heated by the previous contact. The break bar 4 is moved along the scribe line direction so that the cold surface 8a faces the cooling area and the hot surface 7a of the heating heat conductive element 7, and the break bar is brought into contact with the lower part once again. Thereby, both compressive stress due to thermal expansion and tensile stress due to thermal contraction can be generated within the same area, and the substrate can be divided more effectively. However, in this case, the width L1 of the heating area (and the corresponding heating area) and the width L2 of the cooling area (and the corresponding cooling area) need to be the same dimension.

(Second embodiment of break bar)
6 to 8 show modified embodiments of the break bar 4 in the present invention. In this modified embodiment, the cooling heat conductive element 8 and the heating heat conductive element 7 are formed separately and arranged alternately. A predetermined interval L3 is provided between the cooling heat conductive element 8 and the heating heat conductive element 7, respectively, to alleviate the thermal influence due to heat transfer and the influence due to radiant heat, and to reduce loss of thermal energy. More specifically, as will be described later, when the cold surface 8a and the hot surface 7a are in a flush position, the distance between the cold surface 8a and the hot surface 7a is 0.5 mm or more so that the temperature gradient does not decrease due to direct contact between the cold surface 8a and the hot surface 7a. I am trying to set it up.

In addition, in this modified embodiment, when the break bar 4 is in a floating state (standby position) where it floats away from the substrate W, as shown in FIG. 6(a), the cooling surface 8a of the cooling heat transfer element 8 It is formed so that it can be moved to a position lower than the heating surface 7a of the heating heat conductive element 7 in a stepped manner. When the break bar 4 is lowered, the cold surface 8a of the cooling heat conductive element 8 comes into contact with the top surface of the substrate W first, and then the hot surface of the heating heat conductive element 7, as shown in FIG. 6(b). 7a is flush with the cooling/heating surface 8a, and both are formed to contact the substrate W at the same time.

Specifically, as shown in FIG. 7, a pair of front and rear vertical support plates 14 are provided on the frame 4a of the break bar 4 through horizontal bars 13, and the cooling heat transfer element 8 is attached to these supports. It is suspended so as to be movable vertically relative to the plate 14, and serves as a mechanism for vertically moving the cooling thermoelectric element 8.

Specifically, a guide hole 15 is provided in the support plate 14, and a pin member 16 attached to the cooling heat conductive element 8 is fitted so as to be able to slide only in the vertical direction along the guide hole 15. As a result, when the break bar 4 is in the floating state (standby position), the pin member 16 moves downward under the weight of the cooling heat transfer element 8 until it touches the lower side of the guide hole 15, and the cooling heat transfer element 8 moves downward. The cold surface 8a of the heating element 8 is located at a lower position than the thermal surface 7a of the heating heat conductive element 7.

On the other hand, when the break bar 4 is lowered and the heating surface 7a of the heating thermoelectric element 7 is in contact with the substrate W, the pin member 16 is moved upward until it approaches the upper side of the guide hole 15, and the Both the cold surface 8a of the heat conductive element 8 and the hot surface 7a of the heat conductive element 7 for heating come into contact with the substrate W and are flush with each other.

Note that, similar to the embodiment shown in FIG. 2, this modified embodiment also includes an air-cooling air discharge nozzle and a conduit that are incorporated inside the cooling heat transfer element 8, but for convenience of explanation, illustration thereof is omitted here. are doing.

Further, the heating heat conductive element 7 is suspended from the break bar 4 via a connecting bracket 17. Specifically, the connecting bracket 17 is provided with a pair of front and rear vertical mounting plates 19 having guide holes 18, and screws provided on the support plates 14 of the adjacent cooling heat transfer elements 8 at both ends of the guide holes 18 are provided. By screwing the pin member 21 into the hole 20, the heating thermoconductive element 7 is held in a suspended state by the pin member 21 (see FIGS. 7 and 8). At this time, the pin member 21 is configured to be able to relatively move slightly only in the vertical direction along the guide hole 18, thereby providing a vertical adjustment mechanism for the heating heat transfer element 7. The amount of movement is small compared to the amount of vertical movement of the cooling heat transfer element 8 described above, and when the heating surface 7a comes into contact with the substrate W, each heating surface 7a The level is set to a level (for example, about 1 mm) that can be adjusted to cancel out the flatness when the flatness of the planes is aligned on the horizontal line. With this vertical adjustment mechanism, each heating surface 7a can always be brought into surface contact with the substrate in a flush position, and heat can be transferred evenly.

Next, the operation will be explained. When the break bar 4 having the above structure moves down from the raised standby position (floating state), the cooling surface 8a of the cooling heat conductive element 8, which is lowered by its own weight, comes into contact with the substrate W first, and the cooling area of the substrate W ( (see FIG. 4(b)). Next, the heating heat conductive element 7 is lowered so that the heating surface 7a comes into contact with the heating area, and the heating area is heated by the heating surface 7a and the cooling area is cooled by the cold surface 8a at the same time. At this time, by adjusting the speed at which the break bar 4 is moved downward or controlling the downward movement to be temporarily stopped after the cold surface 8a makes contact, the hot surface 7a contacts the substrate W after the cold surface 8a contacts the substrate W. Since the time required for cooling can be adjusted, the contact portion can be cooled for a suitable cooling time depending on the thermal conductivity and thickness of the substrate W.

As a result, the cooling area can be reliably cooled by the cold surface 8a, and the above-mentioned tensile stress due to thermal contraction in the cooling area and compressive stress due to thermal expansion in the heating area create scribe lines at the boundary. A strong separation force that tries to tear S is generated, and the substrate W can be completely separated along the scribe line S with high accuracy.

Further, in this modified embodiment, when the break bar 4 is in a floating state (standby position) away from the substrate W, the cold surface 8a of the cold heat transfer element 8 is higher than the hot surface 7a of the heating heat transfer element 7. Since the cooling heat conductive element 8 is spaced apart at a low level in a stepped manner, it can be made less susceptible to thermal effects due to radiant heat and heat transfer from the heating heat conductive element 7, and the cooling heat conductive element 8 can be used for cooling or heating during standby. The cooling efficiency of the thermoelectric element 8 can be increased, and the loss of thermal energy between the cooling thermoelectric element 8 and the heating thermoelectric element 7 can be reduced to save energy.

Although typical embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and can be modified and changed as appropriate within the scope of achieving the object and not departing from the scope of the claims. It is possible to do so.

INDUSTRIAL APPLICATION This invention can be utilized for the breaking apparatus and breaking method which cut the glass substrate in which the scribe line was formed along the scribe line.

A Break device S Scribe line W Substrate H Hot area L Cold area 1 Substrate support 4 Break bar 4a Break bar frame 7 Heating heat transfer element 8 Cooling heat transfer element 14 Support plate 15, 18 Guide hole 16, 21 Pin member 17 Connection bracket

Claims (9)

A substrate breaking device that breaks a substrate on which a scribe line is formed along the scribe line,
a substrate support on which the substrate is placed;
a break bar brought into contact with the scribe line of the substrate,
The contact surface of the break bar with the substrate is arranged so that a plurality of hot regions set at a first temperature and a plurality of cold regions set at a second temperature lower than the first temperature are alternately adjacent to each other. is,
A substrate breaking device that breaks the hot region and the cold region by simultaneously bringing them into surface contact along the scribe line. 2. The substrate breaking device according to claim 1, wherein each of the hot and cold regions of the break bar has a rectangular plane and is formed in a band-like surface contact with the substrate. 3. The substrate breaking device according to claim 1, wherein the heat source of the hot region is an electric heater, and the cold source of the cold region is a Peltier element. A heating heat conductive element having a heating surface forming the heating area on the lower surface and having a heating source therefor, and a cooling heat conducting element having a heating surface forming the cooling area on the lower surface and having the cooling source. A heat conductive element is formed, and the break bar is formed by a plurality of the heating heat conductive elements and the cooling heat conductive elements being arranged alternately and assembled in the frame of the break bar. 3. The substrate breaking device according to any one of 3. A vertical movement mechanism is provided for holding the cooling heat source element so as to be able to rise and fall relative to the frame of the break bar, and when the break bar is floating away from the substrate during standby, the cooling surface of the cooling heat transfer element is 5. The substrate breaking device according to claim 4, wherein the substrate breaking device is formed at a position lower than the thermal surface of the heating heat conductive element. A vertical adjustment mechanism is provided for holding the heating heat source element so as to be movable up and down within a vertical range smaller than the vertical movement mechanism with respect to the frame of the break bar, and each thermal surface of the heating heat transfer element is attached to the substrate. 6. The substrate breaking device according to claim 5, wherein the heating surfaces are adjusted to be flush with each other when brought into contact. The vertical movement mechanism of the cooling heat conductive element and the vertical adjustment mechanism of the heating heat conductive element are vertically movably suspended from a portion of the break bar connected to the frame through a pin member and a guide hole. The substrate breaking device according to claim 6, wherein the substrate breaking device is formed. A substrate breaking method for breaking a substrate on which a scribe line is formed along the scribe line, the method comprising:
Prepare break bars arranged side by side so that hot areas set at a first temperature and cold areas set at a second temperature lower than the first temperature are alternately adjacent to each other,
A method of breaking a substrate by simultaneously bringing a hot region and a cold region of the break bar into surface contact along a scribe line of the substrate. The breaking is performed by holding the cold region in a vertically movable manner on the frame of the break bar, first bringing the cold region into surface contact with the substrate, and then bringing the cold region and the hot region into surface contact at the same time. 8. The substrate breaking method according to 8.

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