JP7464838B2 - Method for manufacturing light-emitting device and light-emitting module - Google Patents

Description

This disclosure relates to a method for manufacturing a light emitting device and a light emitting module.

Conventionally, light-emitting devices have been configured with LEDs mounted on a flexible printed circuit (FPC) with through-holes for positioning. In this light-emitting device, misalignment is prevented by inserting pins on the base into the through-holes in the FPC (see Patent Document 1). Also, an LED lamp with a magnet mounted below the board has been disclosed (see Patent Document 2).

JP 2007-73723 A JP 2004-15012 A

An object of the present disclosure is to provide a method for manufacturing a light emitting device and a light emitting module that facilitates the positioning of element structures.

A light emitting device according to an embodiment of the present disclosure includes a substrate having wiring formed on a stretchable sheet, a plurality of element structures arranged on the upper surface of the substrate, and an engagement portion provided on the substrate directly below the element structures, the wiring being formed on the upper surface of the stretchable sheet or being formed so as to be conductive to the lower surface, the element structures having a light emitting element electrically connected via the wiring, and a covering member that abuts against or is spaced from the light emitting element and covers the periphery.

A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes a preparation step of preparing a light-emitting device and a housing in which the light-emitting device is to be mounted, a temporary fixing step of temporarily fixing one end of a substrate of the light-emitting device by fixing the substrate to an end of a housing surface of the housing in which the light-emitting device is to be mounted, and an engagement step of pulling the other end other than the end fixed to the housing surface, thereby stretching the substrate, and engaging the engagement portion with a corresponding engagement portion provided in advance on the housing surface.

A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes the steps of preparing a light-emitting device and a housing having a through hole and recesses at a predetermined interval formed in a concave surface facing a substrate of the light-emitting device, temporarily fixing a flat portion around the concave surface to at least a portion of the periphery of the substrate, and engaging the substrate directly below and directly below the element structure by vacuum suction through the through hole, and storing at least a portion of the side surface of the element structure together with the substrate in the recess against the elastic force of the substrate, and adhering the adhesive layer to the bottom surface of the recess, which is the corresponding engaging portion.

A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes the steps of preparing a light-emitting device and a housing having a through hole formed in a concave surface facing a substrate of the light-emitting device, a temporary fixing step of temporarily fixing a flat portion around the concave surface to at least a portion of the periphery of the substrate, and an engagement step of bonding an adhesive layer of the substrate to the concave surface while stretching the substrate by vacuum suction through the through hole.

In the light emitting device according to the embodiment of the present disclosure, the positioning of the light emitting element is easy. Furthermore, in the manufacturing method of the light emitting module according to the embodiment of the present disclosure, a light emitting module in which the positioning of the light emitting element is easy can be manufactured.

1 is a schematic perspective view showing, from above, a configuration of a light-emitting device of a light-emitting module according to a first embodiment, with a portion in cross section. 1 is a perspective view showing a schematic configuration of a light-emitting device according to a first embodiment, viewed from below, with a portion in cross section. 1 is a plan view illustrating a schematic configuration of a light emitting device according to a first embodiment. FIG. 2 is a bottom view illustrating the light emitting device according to the first embodiment. FIG. 1E is a cross-sectional view taken along line 1E-1E of FIG. 1C. 3 is a plan view showing a schematic diagram of a housing used for using the light emitting device of the first embodiment as a light emitting module. FIG. 4 is a flowchart showing the steps of a method for manufacturing a light-emitting module using the light-emitting device according to the first embodiment. 3 is a cross-sectional view illustrating a light emitting device and a housing in a manufacturing method for a light emitting module according to the first embodiment. FIG. 1A is a schematic diagram showing a state in which a substrate of the light emitting device is temporarily fixed to a housing and an engagement portion of the substrate is aligned with a corresponding engagement portion of the housing in a manufacturing method for the light emitting module according to the first embodiment. FIG. 4 is a schematic diagram showing a state in which a substrate for a light emitting device is mounted on a housing surface of a housing in a manufacturing method for a light emitting module according to a first embodiment. FIG. 3A to 3C are schematic diagrams showing a method for manufacturing the light-emitting module according to the first embodiment. 10 is a schematic diagram showing a state in which a substrate of the light emitting device is temporarily fixed to a housing in a case where the housing surface of the housing is a convex curved surface in the manufacturing method of the light emitting module according to the first embodiment. FIG. 13 is a schematic diagram showing a state in which a substrate of the light emitting device is temporarily fixed and engaged with a housing when the housing surface of the housing is a convex curved surface in the manufacturing method of the light emitting module according to the first embodiment. FIG. 10 is a schematic diagram showing a state in which a substrate for a light emitting device is mounted on a housing in a case where the housing surface of the housing is a convex curved surface in the manufacturing method for the light emitting module according to the first embodiment. FIG. 11 is a cross-sectional view of a light-emitting device of a light-emitting module according to a second embodiment. FIG. 13 is a bottom view of the light emitting device of the light emitting module according to the second embodiment. FIG. 5A to 5C are schematic diagrams showing a method for manufacturing a light-emitting module according to a second embodiment. 13 is a schematic diagram showing a state in which a substrate of a light emitting device is temporarily fixed to a housing in a manufacturing method of a light emitting module according to a second embodiment when the housing surface of the housing is a convex curved surface. FIG. This is a schematic diagram showing a state in which, in a manufacturing method of a light-emitting module according to a second embodiment, the substrate of the light-emitting device is temporarily fixed to the housing and the engagement portion is engaged with the corresponding engagement portion when the housing surface of the housing is a convex curved surface. 13 is a schematic diagram showing a state in which a substrate for a light emitting device is mounted on a housing in a manufacturing method for a light emitting module according to a second embodiment, in a case in which the housing surface of the housing is a convex curved surface. FIG. 13A to 13C are schematic diagrams showing a light emitting device and a housing in a manufacturing method for a light emitting module according to a third embodiment. 13 is a schematic diagram showing a state in which a substrate of the light emitting device is temporarily fixed to a housing in a manufacturing method of a light emitting module according to a third embodiment. FIG. 13 is a schematic diagram showing a state in which a substrate of the light emitting device is engaged along a housing surface of the housing in a manufacturing method of the light emitting device according to the third embodiment. FIG. 13 is a schematic diagram showing a state in which a through hole in a housing is covered with a lid in a manufacturing method of a light emitting device according to a third embodiment. FIG. 13A to 13C are schematic diagrams showing a light emitting device and a housing in a manufacturing method for a light emitting module according to a fourth embodiment. 13 is a schematic diagram showing a state in which a substrate of a light emitting device is temporarily fixed to a housing in a manufacturing method of a light emitting module according to a fourth embodiment. FIG. 13 is a schematic diagram showing a state in which a substrate of the light emitting device is engaged along a housing surface of the housing in a manufacturing method of the light emitting device according to the fourth embodiment. FIG. FIG. 13 is a plan view illustrating a light-emitting module according to a fourth embodiment. 11 is a schematic cross-sectional view showing a modified example of the light emitting device of the light emitting module according to each embodiment. FIG. 9B is an explanatory diagram showing a state in which the light emitting device of FIG. 9A is mounted in a housing. FIG.

The embodiments will be described below with reference to the drawings. However, the forms shown below are merely examples of methods for manufacturing light emitting devices and light emitting modules to embody the technical ideas of the present embodiments, and are not limited to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described in the embodiments are merely examples and are not intended to limit the scope of the present invention thereto. Note that the sizes and positional relationships of the components shown in each drawing may be exaggerated for clarity of explanation.

<Light-emitting module according to the first embodiment>
[Light-emitting device of the light-emitting module according to the first embodiment]
First, the light emitting device and the housing of the light emitting module will be described with reference to Figs. 1A to 1F. Fig. 1A is a perspective view showing the configuration of the light emitting device of the light emitting module according to the first embodiment, partially in section, from above. Fig. 1B is a perspective view showing the configuration of the light emitting device according to the first embodiment, partially in section, from below. Fig. 1C is a plan view showing the configuration of the light emitting device according to the first embodiment. Fig. 1D is a bottom view showing the light emitting device according to the first embodiment. Fig. 1E is a cross-sectional view taken along line 1E-1E in Fig. 1C. Fig. 1F is a plan view showing a housing used to use the light emitting device of the first embodiment as a light emitting module.

The light emitting device 100 includes a substrate 20 having wiring 25 formed on an elastic sheet 23, a plurality of element structures 10 formed on the upper surface of the substrate 20, and a pin 8 as an engagement portion provided on the substrate 20 directly below the element structure 10. The wiring 25 is formed on the upper surface of the elastic sheet 23 or is formed so as to be conductive to the lower surface, and here, the via wiring 21, 22 is formed so as to be conductive to the wiring pads 31, 33 formed on the lower surface of the elastic sheet 23. The element structure 10 also includes a light emitting element 1 electrically connected through the wiring 25, and a covering member 5 that abuts against or is spaced from the light emitting element 1 to cover the periphery. As an example, the light emitting device 100 will be described as having a configuration in which four element structures 10 are arranged in a matrix direction of two rows and two columns.
Hereinafter, the configurations of the light emitting device 100 and the housing 200 will be described first, and then a method for manufacturing the light emitting module 300 including the light emitting device 100 and the housing 200 will be described.

The substrate 20 includes a stretchable sheet 23 and wiring 25 formed on the stretchable sheet 23 .
The elastic sheet 23 may be any material that has an elongation rate sufficient to ensure the desired clearance (the distance between the element structures 10) and can mount the element structures 10 without any problems. Examples of materials for the elastic sheet 23 include UV tape, various plastics, rubber, and the like. The thickness of the elastic sheet 23 is preferably, for example, 10 μm or more and 500 μm or less, and more preferably, 20 μm or more and 200 μm or less. The elongation rate of the elastic sheet 23 is preferably 700% or less, more preferably 500% or less, and particularly preferably 300% or less. By using an elastic sheet 23 with an elongation rate of more than 500%, the element structures 10 can be arranged at a high density. In addition, by suppressing the elongation rate of the elastic sheet 23 to 300% or less, the elastic sheet 23 can be used for wiring, etc., and breakage of the elastic sheet 23 can be suppressed.

The wiring 25 includes via wiring 21, 22 and wiring pads 31, 32. The via wiring 21, 22 are formed to penetrate the elastic sheet 23 in the thickness direction at the position where the element structure 10 is mounted. The via wiring 21, 22 are joined to the element electrodes 3, 4 of the light-emitting element 1 in the element structure 10, and electrically connected to the wiring pads 31, 32 formed on the back surface of the elastic sheet 23. The via wiring 21, 22 are formed by filling a conductive material into a through hole (via) formed in the thickness direction of the elastic sheet 23. The conductive material used here can be the same as the material used for the wiring pads 31, 32. For example, a conductive paste can be used as the conductive material. The conductive paste is a mixture of a binder and metal powder, and is formed by filling the via with the binder in an uncured liquid or paste form and then curing it. The conductive paste is made by mixing, for example, a metal powder such as silver or copper powder with a polymer binder, and the polymer binder is cured to form the conductive via wiring 21, 22. The conductive paste may also use an ultraviolet curing resin or a light curing resin as the binder. This conductive paste can be irradiated with ultraviolet light or light of a specific wavelength in the applied state to cure the binder in a short time. The conductive paste is applied so as to fill the vias using a metal mask. The applied conductive paste is irradiated with ultraviolet light or light to cure in a short time to form the via wiring 21, 22.

The wiring pads 31, 32 are formed on the back surface of the elastic sheet 23, directly below the element structure 10. The wiring pads 31, 32 are formed as a pair, spaced apart from one another, within an area inside the outer periphery of the element structure 10. When viewed from below, the wiring pads 31, 32 are formed in a rectangular shape with rounded corners, and are formed in parallel at a distance that does not cause an electrical short circuit. The wiring pads 31, 32 are formed from a material that can be electrically connected.
The substrate 20 in the light emitting device is provided with a pin 8 as an engagement portion that penetrates the substrate 20 and is provided approximately in the center of the wiring pads 31 and 32. The configuration of this pin 8 will be described later.

The element structure 10 includes a light emitting element 1, a wavelength conversion member 2 bonded to the light extraction surface of the light emitting element 1, and a covering member 5 provided around the light emitting element 1 and the wavelength conversion member 2, and further includes a sealing member 6 formed inside the covering member 5 so as to cover the light emitting element 1. The element structures 10 are arranged on a substrate 20 in two rows and two columns in the matrix direction at predetermined intervals.
The covering member 5 is formed in a frame shape protruding upward from the substrate 20 so as to surround the periphery of the light-emitting element 1. The covering member 5 reflects light emitted by the light-emitting element 1 and traveling laterally or downward so as to extract the light from the light-emitting surface of the light-emitting device 100. As an example, the covering member 5 is formed at a predetermined distance around the light-emitting element 1. A space having a trapezoidal cross section is formed inside this covering member 5, and the space is formed so that the opening widens as it goes upward from the surface of the substrate 20.
The covering member 5 has an upper end peripheral surface 5a, which is the upper surface of the element structure 10, formed in a ring-shaped rectangle in a plan view. The covering member 5 has a lower end peripheral surface 5b, which is the lower surface of the element structure 10, formed in a ring-shaped rectangle parallel to the upper end peripheral surface 5a and having a width greater than that of the ring-shaped rectangle of the upper end peripheral surface 5a. The covering member 5 has an inner peripheral wall surface 5c that continues from the inner peripheral side of the upper end peripheral surface 5a to the inner peripheral side of the lower end peripheral surface 5b, and an outer peripheral wall surface 5d that continues from the outer peripheral side of the upper end peripheral surface 5a to the outer peripheral side of the lower end peripheral surface 5b.
Furthermore, the covering member 5 has an inner peripheral wall surface 5c formed into an inclined surface such that the inclination angle increases from the lower end peripheral surface 5b toward the upper end peripheral surface 5a.
Furthermore, the covering member 5 is formed with an inclined surface such that the inner peripheral wall surface 5c is inclined from the lower end peripheral surface 5b toward the upper end peripheral surface 5a so that the opening widens.

The covering member 5 is preferably formed of a reflective material, for example, formed by using a resin material as a base material and containing a light-reflecting material within the base material. Examples of the base material that can be used include thermoplastic resins such as polyamide (PA), polyphthalamide (PPA), polyphenylene sulfide (PPS), or liquid crystal polymer, and thermosetting resins such as epoxy resin, silicone resin, modified epoxy resin, urethane resin, or phenolic resin. Examples of light-reflecting materials include titanium oxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, and mullite. These may be in any shape, such as granular, fibrous, or thin plate-like.

(Engagement part: pin)
Furthermore, support holes for supporting the pins 8 as engagement portions are formed, for example, at two opposing locations on the lower end peripheral surface 5b of the covering member 5. The covering member 5 supports the pins 8 in the support holes formed on the lower end peripheral surface 5b, and supports the pins 8 so as to penetrate the substrate 20 and protrude from the substrate 20.
The pin 8 is used for positioning the light emitting device 100 in a corresponding engagement portion when the light emitting device 100 is mounted on an external housing (see FIG. 1F). The pin 8 is made of, for example, resin or metal, and is formed to protrude from the wiring pads 31 and 32 of the substrate 20. The pin 8 is formed in a quadrangular prism shape, but the shape is not limited to a round prism, a triangular prism, a polygonal prism, a cylinder, or the like. In addition, the pin 8 is illustrated as being provided with two pins for one element structure 10 in the drawings, but the number may be one to four, etc. The pin 8 is illustrated as having a uniform shape from the base end to the tip, but the tip may be formed to be sharp. For example, when the length and width of the covering member 5 are 3×3 mm, the diameter of the pin 8 is about 0.5 mm or more and 1 mm or less. The length of the pin 8 is preferably 5 mm to 10 mm. Furthermore, as an example, a plurality of the pins 8 are arranged at equal intervals for each element structure 10.

(Sealing member)
The sealing member 6 is made of a light-transmitting member and is formed on the substrate inside the covering member 5 so as to cover the light-emitting element 1 and the wavelength conversion member 2 in order to protect the light-emitting element 1 and the like from the external environment and to optically control the light output from the wavelength conversion member 2 and the like. The sealing member 6 is provided between the lower surface of the light-emitting element 1 and the substrate surface and also to cover the side surfaces of the element electrodes 3 and 4.
The material of the sealing member 6 may be an epoxy resin, a silicone resin, or a mixture of these, or a light-transmitting material such as glass. Of these, it is preferable to select a silicone resin in consideration of light resistance and ease of molding. In addition to a light diffusing material, a colorant may also be contained in the sealing member 6. When these materials are contained in the sealing member 6, it is preferable to use materials that have as little effect on the light distribution characteristics as possible. For example, it is preferable that the particle size of the material to be contained is 0.2 μm or less, since it has little effect on the light distribution characteristics.

(Light Emitting Element)
A semiconductor light-emitting element is used as an example of the light-emitting element 1. The light-emitting element 1 may be any element structure made of various semiconductors and provided with a pair of positive and negative element electrodes 3, 4. In particular, the light-emitting element 1 is preferably a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0≦x, 0≦y, x+y≦1) capable of efficiently exciting a phosphor. Alternatively, the light-emitting element 1 may be a zinc sulfide-based semiconductor, a zinc selenide-based semiconductor, or a silicon carbide-based semiconductor.
The light-emitting element 1 may be, for example, a regular square with each side having a length of 100 μm or more and 2 mm or less in a planar view. However, polygons such as triangles, squares, pentagons, hexagons, and octagons may also be used, and various combinations of these polygons may also be used.

(Wavelength conversion member)
The wavelength conversion member 2 is formed on the light extraction surface of the light emitting element 1 and contains a wavelength conversion substance that absorbs a part of the light of a wavelength emitted by the light emitting element 1 and converts it into light of a different wavelength and emits it. The wavelength conversion substance used in the wavelength conversion member 2 is, for example, a phosphor.
The base material or binder of the wavelength conversion member 2 is preferably made of a light-transmitting resin. Examples of the resin include resins that serve as base materials or binders. Among them, silicone resins or modified resins thereof are preferred because they have excellent heat resistance and light resistance and have little volumetric shrinkage after curing. The base material or binder of the wavelength conversion member 2 may be made of glass in addition to resin.

Examples of phosphors contained in the wavelength conversion member 2 include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, terbium aluminum garnet activated with cerium, nitrogen-containing calcium aluminosilicate activated with one or two of europium and chromium, europium-activated sialon, europium-activated silicate, manganese-activated potassium fluorosilicate, and europium-activated nitride phosphors.

As described above, the light emitting device 100 has pins 8 that protrude downward from the substrate 20, so that the light emitting device 100 can be mounted on an object, for example, the curved housing surface 201 of the housing 200, by stretching the elastic sheet 23 of the substrate 20 along the curved housing surface 201, and the light emitting element 1 of the element structure 10 can be positioned accurately. The stretching direction is one direction opposite to the temporary fixing position, or one direction and another direction perpendicular to the one direction, or a radial direction from the temporary fixing position, etc.

[Housing of the Light-Emitting Module According to the First Embodiment]
The housing 200 used in the light emitting module 300 mainly includes a housing surface 201 for connecting the substrate 20 of the light emitting device 100, a connection wiring 202 for electrically connecting the wiring pads 31 and 32 of the light emitting device 100, and a pinhole 203 as an engagement corresponding portion for engaging the pin 8 of the light emitting device 100. As an example, the housing 200 is formed in a rectangular parallelepiped shape, and the housing surface 201 is a flat rectangle. The housing 200 is formed of an insulating material such as resin, and its shape is set according to the shape of the structure in which the light emitting module 300 is installed. The connection wiring 202 is formed so as to turn on and off the light emitting element 1 mounted on the substrate 20 alone or in multiple units. The pinhole 203 has a size and depth that allows the pin 8 to be inserted, and is preferably formed to a size that makes it difficult for the pin 8 to come out when inserted into the pinhole 203, that is, it is preferable that the size of the pinhole 203 is smaller than the size of the pin 8. This pinhole 203 is formed at a position where the element structure 10 and the light emitting element 1 are positioned.

<First embodiment of the manufacturing method of the light emitting module>
A method for manufacturing a light emitting module using the light emitting device 100 will be described below with reference to FIG. 2 and FIGS. 3A to 3C.
Fig. 2 is a flow chart showing the steps of the method for manufacturing the light-emitting module. Fig. 3A is a cross-sectional view showing a light-emitting device and a housing in the method for manufacturing the light-emitting module according to the first embodiment. Fig. 3B is a schematic diagram showing a state in which a substrate of the light-emitting device is temporarily fixed to the housing and an engagement portion of the substrate is aligned with a corresponding engagement portion of the housing in the method for manufacturing the light-emitting module according to the first embodiment. Fig. 3C is a schematic diagram showing a state in which the substrate of the light-emitting device is mounted on the housing surface of the housing in the method for manufacturing the light-emitting module according to the first embodiment.

First, the manufacturing method of the light emitting module includes a preparation step S11 of preparing the light emitting device 100 and preparing the housing 200 in which the light emitting device 100 is to be mounted, a temporary fixing step S12 of temporarily fixing one end of the substrate 20 of the light emitting device 100 to an end of the housing surface 201 of the housing 200 in which the substrate 20 is to be mounted, and an engagement step S13 of pulling the other end of the substrate 20 other than the end fixed to the housing surface 201 to stretch the substrate 20, while engaging the pin 8, which is an engagement portion, with the pinhole 203, which is an engagement corresponding portion provided in advance on the housing surface 201.

(Preparation process)
The preparation process S11 is a process of preparing a light emitting device 100 including a substrate 20 having wiring 25 formed on an elastic sheet 23, a plurality of element structures 10 formed on the upper surface of the substrate 20, and a pin 8 as an engagement portion provided on the substrate 20 directly below the element structures 10, and also preparing a housing 200 in which the light emitting device 100 will be placed.
In the preparation step S11, as an example, a light emitting device 100 is prepared in which element structures 10, each having one light emitting element 1 arranged therein, are arranged on a substrate 20 in two rows and two columns in the matrix direction with a predetermined interval between them. In this light emitting device 100, a pin 8 is formed protruding downward from the substrate 20 at a position corresponding to the lower end peripheral surface 5b of the covering member 5 of the element structure 10. For this light emitting device 100, one having the configuration already described can be used.
The housing 200 is formed in a rectangular parallelepiped shape and includes a rectangular housing surface 201 , connection wiring 202 formed on the housing surface 201 , and pinholes 203 corresponding to the pins 8 of the light emitting device 100 .

(Temporary fixing process)
The temporary fixing step S12 is a step of fixing one end of the substrate 20 of the light emitting device 100 to one end of the housing surface 201 of the housing 200 to temporarily fix the substrate 20. In the temporary fixing step S12, one end of the substrate 20 is fixed to the housing surface 201 by a temporary fixing member (here, a joining member 50) such as a joining member such as an adhesive or a mounting member such as a support pin, or a clamping jig for clamping. As an example, in the light emitting device 100, the substrate 20 is formed in a rectangular shape in a plan view, so that one side of the substrate 20 is fixed to one side of the housing surface 201 via the joining member 50, which is a temporary fixing member, to temporarily fix the substrate 20.

(Engagement process)
The engagement step S13 is a step of engaging the pin 8 protruding from the substrate 20 with the pin hole 203, which is an engagement corresponding portion formed on the housing surface 201, while the substrate 20 is being stretched. In the engagement step S13, the pin 8 is engaged with the pin hole 203 while pulling the substrate 20 in the direction of stretching by grasping at least the side opposite the fixed side among the three sides not fixed in the temporary fixation S12. Note that in the engagement step S13, the pin 8 may be engaged with the pin hole 203 while simultaneously pulling the three sides of the substrate 20 that are not fixed and stretching the substrate 20. Also, in the engagement step S13, the pin 8 may be engaged with the pin hole 203 by pulling the corner portions of the substrate that are both ends of the opposite sides that are not fixed in a direction inclined with respect to the direction opposite the temporary fixation. In the engagement process S13, sensors for detecting the positions of the pin 8 and the pinhole 203 may be arranged in three directions, namely, a direction opposite to the fixed position and a direction perpendicular to the corresponding direction, and when the positions of the pin 8 and the pinhole 203 are aligned, the pin 8 may be engaged so as to be inserted into the pinhole 203.

A bonding material may be applied in advance to the back surface of the substrate 20 of the light emitting device 100, excluding the wiring pads, and to the portion of the housing surface 201 of the housing 200 that is not electrically connected. Also, the three free sides of the substrate 20 may be bonded to the housing surface 201 of the housing 200 via a bonding material. Since the pins 8 are aligned with the pinholes 203 and engaged with the housing surface 201 of the housing 200 while the substrate 20 is being extended in the engagement step S13, the element structure 10 and the light emitting element 1 can be accurately positioned at the desired mounting position.

When the pins 8 finish engaging with the pinholes 203, the substrate 20 of the light-emitting device 100 is subjected to a fixing step S14 in which the ends other than the first fixed end are fixed to the corresponding ends of the housing surface 201 of the housing 200 via a bonding member 51 such as an adhesive. It is preferable that a member capable of electrical connection such as solder paste is provided in advance on either or both of the wiring pads 31, 32 exposed on the back surface of the substrate 20 and the connection wiring 202 formed on the housing surface 201. In addition, when a member such as solder paste is provided, it is preferable that it is provided so that the pins 8 can be exposed and the pinholes 203 are not filled.
An emitting module 300 having a housing 200 in which a substrate 20 of the emitting device 100 is mounted on a housing surface 201 can be operated to turn on and off the light-emitting element 1 of the emitting device 100 connected to a connection wiring 202 by operating an external power supply.

(The housing surface is a convex curved surface)
(Modification of the manufacturing method of the light emitting module according to the first embodiment)
In addition, although the housing 200 has been described with the housing surface 201 being a flat surface, it may be formed into a convex curved surface. Hereinafter, the description will be made with reference to Figs. 4A to 4D. Fig. 4A is a schematic diagram showing a manufacturing method of a light-emitting module according to the first embodiment. Fig. 4B is a schematic diagram showing a state in which a substrate of a light-emitting device is temporarily fixed to a housing in a case where the housing surface of the housing is a convex curved surface in the manufacturing method of a light-emitting module according to the first embodiment. Fig. 4C is a schematic diagram showing a state in which a substrate of a light-emitting device is temporarily fixed to a housing and engaged in a case where the housing surface of the housing is a convex curved surface in the manufacturing method of a light-emitting module according to the first embodiment. Fig. 4D is a schematic diagram showing a state in which a substrate of a light-emitting device is mounted on a housing in a case where the housing surface of the housing is a convex curved surface in the manufacturing method of a light-emitting module according to the first embodiment.
The housing 210 has a housing surface 211 that is a convex curved surface, and connection wiring 212 and pinholes 213 are formed on the convex curved housing surface 211. In this embodiment, the housing 200 has the housing surface 211 formed to be a cylindrical surface that is curved in one direction.

The light emitting module 310 is formed by the light emitting device 100 and the housing 210 having a convex curved housing surface 211. The light emitting module 310 can be manufactured by the same process as the light emitting module of the first embodiment described above, and includes a preparation process S11 for preparing the light emitting device 100 and the housing 210, a temporary fixing process S12 for temporarily fixing the substrate 20 by fixing one end of the substrate 20 of the light emitting device 100 to one end of the housing surface 211 of the mounting housing 210, and an engagement process S13 for pulling the other end of the substrate 20 along the convex curved surface and engaging the pin 8, which is the engagement portion, with the pinhole 213, which is the engagement corresponding portion, while stretching the elastic sheet 23.

In the preparation step S11, the light emitting device 100 already described and the housing 210 having the housing surface 211 that is a convex curved surface are prepared.
In the temporary fixing step S12, one end of the substrate 20 is fixed to one end side of the housing surface 211 that is curved in one direction by a joining member 50 that is a temporary fixing member such as an adhesive.
In the engagement step S13, the elastic sheet 23 is stretched while pulling the other end of the substrate 20 that was not fixed in the temporary fixing step S12, and the positions of the pins 8 are aligned with the positions of the pinholes 213. The pins 8 on the fixed end side of the substrate 20 are engaged with the pinholes 213, and the pins 8 are gradually engaged with the pinholes 213 toward the other end side. Then, when all the pins 8 have been engaged with the pinholes 213, a fixing step S14 is performed in which the other end and other ends of the substrate 20 are fixed to the ends of the housing surface 211 to fix the substrate 20 to the housing surface 211.
In addition, the housing 210 having a convex curved housing surface 211 makes it easy to check the state in which the pin 8 is inserted into the pinhole 213 and engaged while the elastic sheet is being pulled and stretched, for example, by sensors installed in three locations on the left and right front sides of the housing 210, making it possible to perform the engagement process S13 more accurately and quickly.

<Light-emitting module according to the second embodiment>
Next, the light emitting device of the light emitting module according to the second embodiment will be described with reference to Fig. 5A and Fig. 5B. Fig. 5A is a cross-sectional view showing the light emitting device of the light emitting module according to the second embodiment. Fig. 5B is a bottom view showing the light emitting device of the light emitting module according to the second embodiment from the bottom.
[Light-emitting device of the light-emitting module according to the second embodiment]
In the light-emitting device 120 of the second embodiment, the only difference is that the engaging portion is a magnet instead of a pin, and the other configurations are the same as those of the first embodiment, so that the description of each configuration of the light-emitting device and the configuration of the housing will be omitted as appropriate. The light-emitting device 120 includes a substrate 20 having via wirings 21 and 22 formed on an elastic sheet 23, a plurality of element structures 10 formed on the upper surface of the substrate 20, a pair of wiring pads 31 and 32 formed for each element structure 10 on the lower surface of the substrate 20 so as to be electrically connected to the via wirings 21 and 22, and a magnet 8B formed on the lower surface of the substrate 20 as an engaging portion. The element structure 10 has a light-emitting element 1 electrically connected to the wiring pads 31 and 32, and a covering member 5 that abuts against or is spaced from the light-emitting element 1 to cover the periphery. As an example, the light-emitting device 120 will be described as having four element structures 10 arranged in a matrix direction of two rows and two columns.

The magnet 8B is formed on the back surface of the substrate 20 between the wiring pads 31 and 32 so that there is one magnet 8B per element structure 10. The magnet 8B is formed in a flat shape, for example, in a plate shape such as a disk shape or a rectangular plate shape. The magnets 8B may be formed so that all the magnets 8B provided on the underside of the substrate 20 on which each element structure 10 is mounted have an S pole, or the magnets 8B may be formed so that the S pole and the N pole are alternately arranged. The magnets 8B are formed at a distance and size that does not cause an electrical short circuit between the wiring pads 31 and 32. For example, two magnets 8B may be formed in a pair on one element structure 10 at a position on the substrate directly below the element structure 10, on one side and the other side of the space between the opposing wiring pads 31 and 32.

The magnet 8B is formed, for example, containing rare earth elements. The magnet 8B is a permanent magnet made of rare earth elements including group 3 elements other than actinium and lanthanoids. For example, the magnet 8B is a samarium cobalt magnet ( _SmCo5 and _Sm2Co17 ) with excellent heat resistance and corrosion resistance, a _neodymium magnet ( _Nd2Fe14B ), a _praseodymium magnet ( _PrCo5 ) with high mechanical strength, or a _{samarium iron nitrogen magnet (Sm2Fe17N3 , etc.} , Sm-Fe-N).
Moreover, the size of the magnet 8B is preferably 5 mm to 10 mm.

[Housing of the Light-Emitting Module According to the Second Embodiment]
The housing 220 used in the light-emitting module 320 mainly includes a housing surface 221 for connecting the substrate 20 of the light-emitting device 120, a connection wiring 222 for electrically connecting the wiring pads 31, 32 of the light-emitting device 120, and a receiving magnet 223 having a polarity opposite to that of the magnet 8B as an engagement corresponding portion for engaging with the magnet 8B of the light-emitting device 120. As an example, the housing 220 may be formed in a rectangular parallelepiped shape with the housing surface 221 being flat, or the housing surface 221 may be formed as a convex curved surface, and the housing surface 221 may be rectangular in plan view.
Since the light-emitting device 120 is equipped with a magnet 8B as an engagement portion, it engages with a receiving magnet 223 with a different magnetic pole provided on the housing surface 221 of the housing 220 as a corresponding engagement portion, thereby making it possible to mount the substrate 20 on the housing surface 221 of the housing 220 with accurate alignment.

<Second embodiment of the manufacturing method of the light emitting module>
Next, the manufacturing method of the light emitting module will be described with reference to Fig. 6A to Fig. 6D. Fig. 6A is a schematic diagram showing a manufacturing method of the light emitting module according to the second embodiment. Fig. 6B is a schematic diagram showing a state in which the substrate of the light emitting device is temporarily fixed to the housing when the housing surface of the housing is a convex curved surface in the manufacturing method of the light emitting module according to the second embodiment. Fig. 6C is a schematic diagram showing a state in which the substrate of the light emitting device is temporarily fixed to the housing and the engagement portion is engaged with the engagement corresponding portion in the manufacturing method of the light emitting module according to the second embodiment when the housing surface of the housing is a convex curved surface. Fig. 6D is a schematic diagram showing a state in which the substrate of the light emitting device is mounted on the housing when the housing surface of the housing is a convex curved surface in the manufacturing method of the light emitting module according to the second embodiment.
As already explained, the manufacturing method of this light-emitting module 320 can be manufactured by the same steps as the manufacturing method, and includes a preparation step S11 of preparing the light-emitting device 120 having the magnet 8B on the substrate 20 and the housing 220 having the receiving magnet 223 on the housing surface 221, a temporary fixing step S12 of fixing one end of the substrate 20 on which the light-emitting device 120 is mounted to an end of the housing surface 221 of the housing 220 on which it is mounted, and an engagement step S13 of pulling the other end of the substrate 20 along the housing surface 221 and stretching the elastic sheet 23 to magnetically attach and engage the magnet 8B, which is the engagement part, to the receiving magnet 223, which is the engagement corresponding part.

In the engagement step S13, the operation of magnetically attracting and engaging the magnet 8B with the magnet 223 on the receiving side of the housing surface 221 while stretching the elastic sheet 23 is performed in order from the magnet 8B closest to the fixed side to the magnet 8B furthest from the fixed side. Note that in the engagement step S13, the magnet 8B of the substrate 20 and the magnet 223 on the receiving side of the housing surface 221 try to be magnetically attracted to each other as they approach each other. Therefore, the magnet 8B of the substrate 20 and the magnet 223 on the receiving side of the housing surface 221 can easily engage with each other, and it becomes possible to arrange the element structure in an accurate position.
Furthermore, by arranging the magnet 8B so that its magnetic poles alternate as south poles or north poles, when the magnet 8B is magnetically attached to the receiving magnet 223 of the housing surface 221, which also has its magnetic poles arranged as alternating north poles or south poles, even if the board 20 and the housing surface 221 are misaligned, the magnetic poles at the misaligned positions will become south poles and south poles or north poles and north poles and will not engage, making positioning even easier.

[Modification of the manufacturing method of the light-emitting module according to the second embodiment]
The housing surface 221 of the housing 220 may be formed as a convex curved surface as shown in Fig. 6A to Fig. 6D. In such a convex curved housing surface 221, as already described, the magnet 8B can be magnetically attracted to the magnet 223 on the receiving side of the housing surface 221 from one end side to the other end side and engaged. When the magnets 8B of the board and the magnets 223 on the receiving side of the housing surface 221 are all engaged with each other and the board 20 and the housing surface 221 are in contact with each other, the three ends of the board 20 are fixed to the three ends of the housing 220 facing each other, thereby mounting the board 20 of the light emitting device 120 on the housing surface of the housing 220, thereby manufacturing the light emitting module 320.

<Light-emitting module according to the third embodiment>
Next, the light emitting device 130 and the housing 230 of the light emitting module 330 according to the third embodiment will be described with reference to Figs. 7A to 7D. Fig. 7A is a schematic diagram showing the light emitting device and the housing in the manufacturing method of the light emitting module according to the third embodiment. Fig. 7B is a schematic diagram showing a state in which the substrate of the light emitting device is temporarily fixed to the housing in the manufacturing method of the light emitting module according to the third embodiment. Fig. 7C is a schematic diagram showing a state in which the substrate of the light emitting device is engaged along the housing surface of the housing in the manufacturing method of the light emitting device according to the third embodiment. Fig. 7D is a schematic diagram showing a state in which the through hole of the housing is blocked with a lid in the manufacturing method of the light emitting device according to the third embodiment.
The light emitting module 330 includes a light emitting device 130 and a housing 230 .

[Light-emitting device of the light-emitting module according to the third embodiment]
The light emitting device 130 includes a substrate 20c having wiring 21c formed on the upper surface of an elastic sheet 23c, and a plurality of element structures 10c formed on the upper surface of the substrate 20c. The substrate 20c is formed so that the wiring 21c formed on its surface and the light emitting element 1 of the element structure 10c are electrically connected, and has an adhesive layer 8c formed on the back surface as an engagement portion. The element structure 10c also includes the light emitting element 1 electrically connected via the wiring 21c, and a covering member 5 that abuts against the light emitting element 1 or is spaced apart from it to cover the periphery.
In the light emitting device 130, the wiring 21c formed on the upper surface of the elastic sheet 23c is, for example, one and other wirings connected to the element electrodes 3, 4 of the light emitting element 1. Note that the wiring 21c may have wiring pads with a larger line width formed at the ends of the one and other wirings. As an example, the wiring 21c is connected in series to the element electrodes 3, 4 of the four light emitting elements 1, and is formed on the upper surface of the elastic sheet 23c so that the four light emitting elements are arranged in parallel.

In the light emitting device 130, an adhesive layer 8c is provided as an engagement portion. This adhesive layer 8c is provided on at least the substrate directly below the light emitting element 1, and in this case, is formed on the entire lower surface of the substrate 20c.
The adhesive layer 8c may be made of an adhesive material made of various thermosetting resins, such as epoxy, silicone, polyimide, polyester, acrylic, urethane, phenol, or a composite of these. The thickness of the adhesive layer 8c is preferably 10 μm or more and 20 μm or less.

[Housing of the Light-Emitting Module According to the Third Embodiment]
The housing 230 has a concave surface formed on a housing surface 231, and a through hole 234 is formed in the center of the housing surface 231. The housing 230 is engaged so that all of the element structures 10c provided on the substrate 20c are housed in the concave surface of the housing surface 231. Here, the element structures 10c are bonded so as to be arranged approximately evenly within the housing surface 231, so that the adhesive layer 8c, which is the engaging portion, engages with the concave surface, which is the corresponding engaging portion.
The through hole 234 is for performing vacuum suction from a vacuum suction device connected to the outside. After the substrate 20c is bonded along the housing surface 231, the through hole 234 is closed by a lid 236 from the outside.

<Third embodiment of the manufacturing method of the light emitting module>
Next, a manufacturing method of the light emitting module according to the third embodiment will be described with reference to Fig. 7A to Fig. 7D. The manufacturing method of the light emitting module includes a preparation step S11 in which a light emitting device 130 is prepared and a housing 230 having a through hole in a concave surface facing the substrate 20c of the light emitting device 130 is prepared, a temporary fixing step S12 in which a flat portion around the concave surface and at least a part of the periphery of the substrate are fixed to temporarily fix the substrate, and an engagement step S13 in which the substrate is bonded along the concave housing surface 231 by vacuum suction through the through hole.

In the preparation step S11, wiring 21c and element structure 10c are formed on the upper surface of stretchable sheet 23c, adhesive layer 8c is formed on the lower surface of stretchable sheet 23c to prepare light emitting device 130, and a housing 230 is prepared having a concave housing surface 231 and a through hole 234 formed in the center of housing surface 231. Then, housing 230 is arranged in a fixed state with a suction hose PS of an external vacuum suction device connected to through hole 234.
In the temporary fixing step S12, at least two opposing sides of the periphery of the substrate 20c are fixed to at least a part of the flat portion around the periphery of the housing surface 231 of the housing 230, thereby temporarily fixing the substrate 20c to the housing 230. Note that in the temporary fixing step S12, since the adhesive layer 8c is formed on the entire lower surface of the substrate 20c, the entire periphery of the substrate 20c is adhered to the flat portion around the periphery of the housing surface 231.

In the engagement step S13, the air in the space VA formed by the substrate 20c facing the housing surface 231 and blocking the concave surface is vacuum-suctioned through the suction hose PS. Therefore, in the engagement step S13, the space VA is made negative pressure, so that the substrate 20c is brought into contact with the concave surface of the housing surface 231 and bonded to the housing surface 231 by the adhesive layer 8c. By making the space VA negative pressure, the elastic sheet 23c of the substrate 20c is brought into contact with the housing surface 231 while uniformly stretching toward the housing surface 231, and the adhesive layer 8c provided on the lower surface of the elastic sheet (the lower surface of the substrate) is bonded to the housing surface 231, so that the adhesive layer 8c, which is the engagement portion, is engaged with the concave surface, which is the engagement corresponding portion. In order to engage the adhesive layer 8c with the concave surface using vacuum suction, it is preferable to appropriately adjust the thickness and hardness of the elastic sheet used for the substrate. The hardness of the elastic sheet is preferably soft. If the substrate is soft, the adhesive layer 8c can be engaged with the concave surface, which is the corresponding engagement portion, in one go when vacuum suction is performed in the engagement step S13.
After the engaging step S13 is completed, it is preferable to perform a step of removing the suction hose PS inserted into the through hole 234 from the bottom surface of the housing 230 and providing a cover 236 on the through hole 234 to close the through hole 234. In this light-emitting module 330, the wiring 21c is formed on the top surface of the stretchable sheet 23c, so that the wiring 21c located on the peripheral side of the housing 230 can be connected to external wiring.

(Light-emitting module according to the fourth embodiment)
Next, the light emitting device 140 according to the fourth embodiment will be described with reference to Figs. 8A and 8D. Fig. 8A is an explanatory diagram showing a light emitting device and a housing in the manufacturing method of the light emitting module according to the fourth embodiment. Fig. 8B is an explanatory diagram showing a state in which the substrate of the light emitting device is temporarily fixed to the housing in the manufacturing method of the light emitting module according to the fourth embodiment. Fig. 8C is an explanatory diagram showing a state in which the substrate of the light emitting device is engaged along the housing surface of the housing in the manufacturing method of the light emitting device according to the fourth embodiment. Fig. 8D is a plan view showing a light emitting module according to the fourth embodiment.
The light emitting module 340 includes a light emitting device 140 and a housing 240 .

[Light-emitting device of the light-emitting module according to the fourth embodiment]
The light emitting device 140 includes a substrate 20d having via wirings 21d and 22d penetrating an elastic sheet 23d and wirings 31d formed on the lower surface of the elastic sheet 23d, and a plurality of element structures 10d formed on the upper surface of the substrate 20d. In the light emitting device 140, as an example, the number of element structures 10d corresponding to the number of recesses 245 of the housing 240 are formed on the upper surface of the substrate 20d. As an example, the element structures 10d are formed on the upper surface of the substrate 20d with a predetermined interval therebetween, that is, two, four, four, and two element structures 10d in total, from the left end side to the right end side. The substrate 20d is formed so that the wirings 31d formed on its lower surface and the light emitting element 1 of the element structure 10c are electrically connected via the via wirings 21d and 22d. Furthermore, the substrate 20d has an adhesive layer 8d formed as an engagement portion on the lower surface. The adhesive layer 8d is not formed on the outer periphery of the substrate 20d, and is formed so that the wirings 31d are exposed at the outer periphery. The element structure 10d also includes a light emitting element 1 electrically connected to a wiring 31d through via wirings 21d and 22d, and a covering member 5 that covers the periphery of the light emitting element 1 in contact with or spaced apart from it.

In the light emitting device 140, the wiring 31d formed on the lower surface of the elastic sheet 23d is, for example, a pair of wirings, one and the other, connected to the via wirings 21d, 22d. The wiring 31d may be formed as wiring pads by widening the line width at the ends of the one and the other wirings. As an example, the wiring 31d is connected in series to the element electrodes 3 and 4 of the light emitting element 1, and is formed on the upper surface of the elastic sheet 23c so that the series lines of the light emitting element 1 are arranged in parallel.
In the light emitting device 140, an adhesive layer 8d is provided as an engagement portion. This adhesive layer 8d is provided on at least the substrate 20d directly below the light emitting element 1, and here, is formed in an area excluding the outer periphery of the lower surface of the substrate 20d. The adhesive layer 8d has the same material and thickness as those already described.

[Housing of the Light-Emitting Module According to the Fourth Embodiment]
The housing 240 has a housing surface 241 formed as a concave surface, and a through hole 244 is formed in the center of the housing surface 241. The housing 240 has a recess 245 formed in the concave surface of the housing surface 241 as an engagement corresponding portion in which each of the element structures 10d provided on the substrate 20d is accommodated. The recess 245 is formed to a size capable of accommodating the element structure 10d together with a part of the substrate 20d immediately below and in the vicinity of the element structure 10d. Here, the element structure 10d and a part of the substrate 20d are accommodated in the recess 245 of the housing surface 241, thereby being positioned and engaged.
The through hole 244 is for performing vacuum suction from a vacuum suction device connected to the outside. A suction hose is connected to the through hole 244 from the outside, and after the suction operation is completed, the through hole 244 is closed from the outside by a lid 246.

<Fourth embodiment of the manufacturing method of the light-emitting module>
Next, a manufacturing method of the light emitting module according to the fourth embodiment will be described with reference to Fig. 8A to Fig. 8D. The manufacturing method of the light emitting module includes a preparation step S11 in which a light emitting device 140 is prepared and a housing 240 having a through hole 244 and a recess 245 in a recessed surface facing the substrate 20d of the light emitting device 140 is prepared, a temporary fixing step S12 in which a flat portion around the recessed surface of a housing surface 241 is fixed to at least two opposing sides of the periphery of the substrate 20d to temporarily fix the substrate 20d, and an engagement step S13 in which a vacuum is applied from the through hole 244 to accommodate a part of the element structure 10d and the substrate 20d in the recess 245 of the housing surface 241 and bond them along the housing surface 241 of the recessed surface. The steps are performed in this order.

In the preparation step S11, a light emitting device 140 is prepared in which an element structure 10d and wiring 31d are formed on the upper surface of an elastic sheet 23d and an adhesive layer 8d is formed on the lower surface of the elastic sheet 23d, and a housing 240 is prepared in which a through hole 244 is formed in the center of a concave housing surface 241 and a recess 245 is formed in the housing surface 241. Then, the housing 240 is arranged in a fixed state with a suction hose PS of an external vacuum suction device connected to the through hole 244.
In the temporary fixing step S12, at least two opposing sides of the periphery of the substrate 20d are fixed to the peripheral flat portion of the housing surface of the housing 240, thereby temporarily fixing the substrate 20d to the housing 240. Note that, here, since the adhesive layer 8d is formed on the entire surface of the lower surface of the substrate 20d except for the peripheral edge, the entire peripheral edge of the substrate 20d is adhered to the peripheral flat portion of the housing surface 241.

In the engagement step S13, a suction operation is performed to vacuum-suck the air in the space VA formed by the substrate 20d that faces the housing surface 241 and blocks the concave surface through the suction hose PS. Therefore, in the engagement step S13, the space VA is made negative pressure, so that the substrate 20d is brought into contact with the concave surface of the housing surface 241, and the element structure 10d and a part of the substrate 20d immediately below the element structure 10d are accommodated in the concave portion 245 of the housing surface 241 to engage with the substrate 20d. In this engagement step S13, the adhesive layer 8d of the substrate 20d is bonded to the inner surface of the concave portion 245 and the housing surface 241. In the engagement step S13, the element structure 10d and a part of the substrate 20d immediately below and immediately below the element structure 10d are forcibly accommodated in the concave portion 245 to be positioned and engaged with each other. By creating a negative pressure in the space VA, the elastic sheet 23d of the substrate 20d stretches evenly toward the housing surface 241 while abutting against the housing surface 241, and the element structure 10d and a portion of the substrate 20d are forcibly stored in the recess 245.
After the engagement step S13 is completed, it is preferable to remove the suction hose PS that was inserted into the through hole 244 from the underside of the housing 240, and then perform a step of closing the through hole 244 by providing a lid 246 on the through hole 244.

[Applications of the embodiment]
The element structure may have the engaging portion and the covering member configured as shown in Fig. 9A and Fig. 9B. Fig. 9A is a cross-sectional view showing a modified example of the light emitting device of the light emitting module according to each embodiment. Fig. 9B is a side view showing the state in which the light emitting device of Fig. 9A is mounted in a housing.
The light emitting device 100N includes a plurality of element structures 10N on the upper surface of a substrate 20N on which wiring is formed on a stretchable sheet 23N, and an engagement portion on the lower surface of the substrate 20N. The element structure 10N includes a wavelength conversion member 2N bonded to the light extraction surface side of the light emitting element 1N via a bonding member 6N, and a covering member 5N covering the lower surface of the wavelength conversion member 2N and the side surface of the light emitting element 1N via the bonding member 6N. The light emitting element 1N is disposed with the element electrodes 3N and 4N facing the stretchable sheet 23N. The element electrodes 3N and 4N are connected to via wirings 21N and 22N formed to penetrate the stretchable sheet 23N.

The via wirings 21N, 22N are connected to wiring pads 31N, 32N formed on the lower surface of the elastic sheet 23N. Furthermore, on the lower surface of the elastic sheet 23N, directly below the covering member 5N, a pin 8N1 as an engagement portion is formed so as to protrude from the wiring pads 31N, 32N. Also, on the lower surface of the elastic sheet 23N, directly below the light-emitting element 1N, a magnet 8N2 as an engagement portion is formed. In other words, the lower surface of the substrate 20N is provided with two types of engagement portions, the pin 8N1 as an engagement portion already described and the magnet 8N2 as an engagement portion already described.
The housing 200N on which the substrate 20N of the light emitting device 100N is mounted includes connection wiring 202N formed on a housing surface 201N, a pinhole 203N1 as an engagement corresponding portion, and a receiving magnet 203N2.
Here, the configuration includes both the pin 8N1 and the magnet 8N2, but as in the first to fourth embodiments, there may be only one type of engaging portion and corresponding engaging portion.

In the light emitting module 300N including the light emitting device 100N having a plurality of such element structures 10N and the housing 200N, the light emitting module 300N can be manufactured by facilitating the alignment of the light emitting element 1N in a procedure including a preparation process, a temporary fixing process, and an engagement process, as described above. That is, when the pin 8N1 of the light emitting device 100N is aligned with the pinhole 203N1 in the engagement process, the magnet 8N2 is guided by the magnetic force of the receiving magnet 203N2, making it easier to position the pin 8N1 in the pinhole 203N1. Therefore, the engagement between the pin 8N1 and the pinhole 203N1, and the engagement between the magnet 8N2 and the receiving magnet 203N2 can be performed more smoothly and easily. The configurations of the pin N1 and the magnet 8N2, and the pinhole 203N1 and the receiving magnet 203N2 are the same as those already described.

As described above, the light emitting device of each embodiment is provided with an engagement portion, which allows the light emitting device to be aligned with and engaged with a corresponding engagement portion of the housing, thereby facilitating positioning of the light emitting element provided in the element structure. Also, in a method for manufacturing a light emitting module, for example, positioning of the light emitting element is facilitated when mounting a substrate on a housing.
Furthermore, when an adhesive layer is used as the engagement portion, it is sufficient that the adhesive layer is formed in at least an area equivalent to the area of the light emitting element in a plan view.
When the engaging parts are pins and magnets, since a substrate having wiring formed on an elastic sheet is used, it is possible to improve the orientation of the light-emitting module by adjusting the positions at which the engaging parts are provided without changing the mounting interval of the element structures 10 on the substrate. For example, if it is desired to extract strong light from the end of the light-emitting module, many engaging parts are provided around the end of the housing surface, and conversely, the engaging parts are provided farther apart near the center of the housing. Since the substrate is elastic, it is possible to engage the engaging parts and the engaging parts while pulling the substrate near the center, so there is no need to change the mounting interval of the element structures 10 on the substrate.
Furthermore, when the engaging portion is concave, the engaging portion extends evenly toward the housing surface while contacting the housing surface in order to perform vacuum suction, which makes it possible to mount the element structure 10 on the side surface of the concave surface, where mounting of the element structure 10 is normally difficult, thereby increasing the emission intensity.
Although the manufacturing method of the light emitting device and the light emitting module according to each embodiment has been specifically described in the description for carrying out the invention, the gist of the present invention is not limited to these descriptions and should be broadly interpreted based on the claims. In addition, various changes, modifications, etc. based on these descriptions are also included in the gist of the present invention.

For example, the light-emitting elements have been described as being arranged in a matrix direction with each set consisting of four element structures, each having one light-emitting element 1, but the light-emitting elements may be arranged in a row with multiple element structures 10 aligned, or in groups of two or more element structures 10 aligned in a matrix direction.

The direction in which the stretchable sheet is stretched in the engagement step may be, for example, in two directions along the X direction, or in two directions along the Y direction perpendicular to the X direction. The stretchable sheet 23 may be stretched in a radial direction from one end of the stretchable sheet 23.
Furthermore, the method for manufacturing a light emitting module may include other steps between, before, or after each of the steps, as long as they do not adversely affect the steps. For example, the method may include a foreign matter removal step for removing foreign matter that has been mixed in during the manufacturing process.

1,1N Light emitting element 2,2N Wavelength conversion member 3,3N Element electrode 5,5N Covering member 5a Upper end peripheral surface 5b Lower end peripheral surface 5c Inner peripheral side wall surface 5d Outer peripheral side wall surface 6 Sealing member 6N Joining member 8,8N1 Pin (engagement portion)
8B, 8N2 Magnet (engagement part)
8c, 8d Adhesive layer (engagement portion)
10, 10c, 10d, 10N Element structure 20, 20c, 20d, 20N Substrate 21, 21c, 21d, 21N Via wiring 22, 22c, 22d, 22N Via wiring 23, 23c, 23d, 23N Elastic sheet 25 Wiring 31, 32, 31N Wiring pad 31d Wiring 100, 120, 130, 140, 100N Light-emitting device 200, 220, 230, 240, 200N Housing 201, 221, 231, 241, 201N Housing surface 202, 202N Connection wiring 203, 203N1 Pinhole 203, 203N2 Magnet 234, 243 Through hole 236, 246 Lid 300, 310, 320, 330, 340, 300N Light emitting module 300N Light emitting module PS Suction hose S11 Preparation step S12 Temporary fixing step S13 Engagement step

Claims (21)

A substrate having wiring formed on a stretchable sheet;
A plurality of element structures disposed on an upper surface of the substrate;
an engagement portion provided on the substrate directly below the element structure;
The wiring is formed on the upper surface of the stretchable sheet, or is formed so as to be conductive to the lower surface,
The element structure is a light emitting device having a light emitting element electrically connected via the wiring, and a covering member that abuts against the light emitting element or that is spaced apart from the light emitting element and covers the periphery of the light emitting element. The light-emitting device according to claim 1, wherein the wiring includes a via wiring that penetrates the elastic sheet, and a pair of wiring pads formed on the lower surface of the elastic sheet for each of the element structures so as to be electrically connected to the via wiring. The light-emitting device according to claim 1 or 2, wherein the engagement portion is a pin that protrudes downward from the substrate. The light-emitting device according to claim 3, wherein the pin is formed by penetrating the substrate from below the covering member. The light-emitting device according to claim 3 or 4, wherein the pin is inserted through the substrate into a recess formed in the bottom surface of the covering member facing the substrate. 6. The light emitting device according to claim 3, wherein a plurality of the pins are arranged at equal intervals for each element structure . The light-emitting device according to any one of claims 3 to 6, wherein the pin is made of resin or metal. The light-emitting device according to claim 1, wherein the engagement portion is a magnet provided on the underside of the substrate. The light-emitting device according to claim 2, wherein the engagement portion is a magnet and is formed on the underside of the substrate between the wiring pads and spaced apart from the wiring pads. The light-emitting device according to claim 8 or 9, wherein the magnets are arranged with alternating south and north poles for the multiple element structures. The light-emitting device according to any one of claims 8 to 10, wherein the magnet is formed by containing a rare earth element. The light-emitting device according to claim 1, wherein the engagement portion is an adhesive layer provided on the underside of the substrate. The light-emitting device according to claim 12, wherein the adhesive layer is provided on the substrate directly below the light-emitting element. The light-emitting device according to claim 12 or 13, wherein the adhesive layer is provided at least in an area equivalent to the area of the light-emitting element in a plan view. a preparation step of preparing the light emitting device according to any one of claims 1 to 14 and preparing a housing in which the light emitting device is to be mounted;
a temporary fixing step of temporarily fixing one end of a substrate of the light emitting device to an end of a housing surface of a mounting housing;
and an engagement process for engaging the engagement portion with a corresponding engagement portion that is pre-formed on the housing surface while pulling the other end other than the one end fixed to the housing surface and stretching the substrate. The housing has a surface facing the substrate that is formed into a convex curved surface,
The method for manufacturing a light-emitting module according to claim 15 , wherein the engaging step pulls the other end of the substrate along the convex curved surface, and engages the engaging portion with the corresponding engaging portion while stretching the elastic sheet. The method for manufacturing a light-emitting module according to claim 15 or 16, wherein when the engagement portion is a pin, the corresponding engagement portion is a pinhole that accommodates the pin. The method for manufacturing a light-emitting module according to claim 15 or 16, wherein when the engaging portion is a magnet, the corresponding engaging portion is a magnet with a magnetic pole to which the magnet is magnetically attracted. preparing a light emitting device according to any one of claims 12 to 14, and preparing a housing having a through hole and recesses at a predetermined interval formed in a concave surface facing a substrate of the light emitting device;
a step of temporarily fixing a flat portion around the concave surface and at least a part of a periphery of the substrate;
and an engagement process in which a vacuum is drawn through the through hole to accommodate the substrate directly below and immediately surrounding the element structure, as well as at least a portion of the side surface of the element structure, in the recess against the elastic force of the substrate, and the adhesive layer is adhered to the bottom surface of the recess, which is the corresponding engagement portion. A step of preparing the light emitting device according to any one of claims 12 to 14 and a housing having a through hole formed in a concave surface facing a substrate of the light emitting device;
a temporary fixing step of temporarily fixing a flat portion around the concave surface and at least a part of a periphery of the substrate;
and an engagement step of adhering an adhesive layer of the substrate to a concave surface while stretching the substrate by vacuum suction through the through hole. The method for manufacturing a light-emitting module according to claim 19 or 20, further comprising a step of sealing the through-hole after the engagement step.

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