JP7469864B2 - Positioning apparatus, exposure apparatus, and method for manufacturing article - Google Patents

Description

The present invention relates to a positioning device that positions a plate, an exposure device that includes the same, and a method for manufacturing an article.

One type of equipment used in the manufacturing process (lithography process) of liquid crystal panels and semiconductor devices is an exposure apparatus that exposes a substrate by scanning the original and substrate relative to one another. In such exposure apparatus, in order to form a pattern on the substrate with high precision, there is a demand for improved positioning precision of the stage that holds the original and substrate, which requires that the position of the stage be measured with high precision.

A laser interferometer is generally used to measure the stage position, but in a laser interferometer, changes in the refractive index on the measurement optical path due to fluctuations in the temperature, pressure, humidity, etc. of the gas on the measurement optical path can cause a decrease in measurement accuracy (measurement error). For example, the original is illuminated during exposure of the substrate and the temperature rises, and if the heat generated in the original spreads to the surroundings as the original stage moves and enters the measurement optical path, the measurement accuracy of the original stage position can decrease. In addition, to prevent the original from fogging up, the space in which the original is placed may be filled with a gas (purge gas) that has a lower humidity than the surrounding area. Even in this case, if low-humidity gas enters the measurement optical path as the original stage moves, the measurement accuracy of the original stage position can decrease.

Patent Document 1 discloses a measurement device equipped with an interferometer that emits light toward a reflecting mirror attached to the side of a stage and receives interference light between the light reflected by the reflecting mirror and a reference light to detect the position of the stage. In the measurement device disclosed in Patent Document 1, a structure (rectifying plate) for rectifying and efficiently directing the gas blown from the gas blowing section toward the stage into the optical path of the interferometer is provided so as to sandwich part of the optical path and the reflecting mirror from above and below.

JP 2012-209401 A

In a configuration in which a reflecting mirror and a structure are provided on the side of a stage as disclosed in Patent Document 1, gas on the stage (e.g., on the original) may flow into the side of the stage as the stage moves. In this case, turbulence (gas fluctuations) occurs in the measurement optical path near the side of the stage due to the gas blown out from the gas blowing section and guided by the structure and the gas flowing in from above the stage, which can reduce the measurement accuracy of the stage position.

The present invention aims to provide an advantageous technique for measuring the stage position with high accuracy.

One aspect of the present invention relates to a positioning device for positioning a plate, the positioning device having a stage capable of holding the plate and moving in a first direction, a measurement unit that emits light in the first direction and measures the position of the stage in the first direction based on the light reflected by a reflective member provided on an upper surface of the stage, and a wall portion provided on the upper surface of the stage between the plate and the reflective member in the first direction, the wall portion having a portion extending along a second direction perpendicular to the first direction in a plane parallel to the upper surface of the stage and two ends, the wall portion having an upper end configured to be higher than the upper surface of the plate and being positioned at a distance from the plate and the reflective member, the distance between the two ends in the second direction being greater than or equal to the length of the plate in the second direction.

Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments thereof with reference to the accompanying drawings.

The present invention can provide, for example, an advantageous technique for measuring the position of a stage with high accuracy.

Schematic diagram showing the configuration of an exposure apparatus FIG. 1 is a schematic diagram showing a configuration of a positioning device according to a first embodiment; FIG. 1 is a diagram for explaining the effect of the positioning device of the first embodiment; FIG. 13 shows a modified example of the wall portion FIG. 13 is a schematic diagram showing a configuration of a positioning device according to a second embodiment; FIG. 13 is a schematic diagram showing a configuration of a positioning device according to a third embodiment; FIG. 13 is a schematic diagram showing a configuration of a positioning device according to a fourth embodiment; FIG. 13 is a schematic diagram showing a modification of the positioning device of the fourth embodiment;

The following embodiments are described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe multiple features, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicate explanations are omitted.

First Embodiment
[Configuration of Exposure Apparatus]
A first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing the overall configuration of an exposure apparatus 100 of this embodiment. The exposure apparatus 100 of this embodiment is a step-and-scan type exposure apparatus that transfers a pattern of the original M onto the substrate by exposing the substrate W while scanning the original M and the substrate W. Such an exposure apparatus 100 is also called a scanning exposure apparatus or a scanner. In this embodiment, the original M is, for example, a quartz mask (reticle), and a circuit pattern to be transferred is formed in each of a plurality of shot areas on the substrate W. The substrate W is a wafer coated with photoresist, and for example, a single crystal silicon substrate or the like can be used.

The exposure apparatus 100 may include an illumination optical system IO, an original stage 11 capable of moving while holding an original M, a projection optical system PO, a substrate stage 21 capable of moving while holding a substrate W, and a controller CNT. The controller CNT is configured, for example, by a computer having a CPU and memory, and is electrically connected to each part in the apparatus to centrally control the operation of the entire apparatus. Here, in the following description, the axial direction parallel to the optical axis of the light emitted from the illumination optical system IO and incident on the original M is defined as the Z-axis direction, and two axial directions perpendicular to each other in a plane perpendicular to the optical axis are defined as the X-axis direction and the Y-axis direction.

The illumination optical system IO shapes the light emitted from a light source LS, such as a mercury lamp, an ArF excimer laser, or a KrF excimer laser, into, for example, a strip-shaped or arc-shaped slit light, and illuminates a part of the original M with the slit light. The light that has passed through a part of the original M is incident on the projection optical system PO as a pattern light that reflects the pattern of the part of the original M. The projection optical system PO has a predetermined projection magnification, and projects the pattern of the original M onto a substrate (specifically, a resist on the substrate) using the pattern light. The original M and the substrate W are held by the original stage 11 and the substrate stage 21, respectively, and are disposed at optically conjugate positions (the object plane and the image plane of the projection optical system PO), respectively, via the projection optical system PO. The control unit CNT relatively scans the original stage 11 and the substrate stage 21 at a speed ratio according to the projection magnification of the projection optical system PO while synchronizing with each other (in this embodiment, the scanning direction of the original M and the substrate W is the Y-axis direction (first direction)). This allows the pattern of the original M to be transferred onto the substrate.

[Configuration of Positioning Device]
Next, a positioning device for positioning the plate will be described. In this embodiment, a positioning device 10 for positioning the original M as the plate will be described, but a positioning device with a similar configuration can also be applied when positioning the substrate W as the plate.

Figure 2 is a schematic diagram showing the configuration of the positioning device 10A of this embodiment. Figure 2(a) shows a side view of the positioning device 10A, and Figure 2(b) shows a top view of the positioning device 10A. The positioning device 10A can include, for example, an original stage 11 that holds an original M and is movable at least in the Y-axis direction (first direction), and a measurement unit 12 that measures the position of the original stage 11 in the Y-axis direction.

The measuring unit 12 is, for example, a laser interferometer, and emits light toward a reflecting member 13 (mirror) provided on the master stage 11, and can measure the position of the master stage 11 in the Y-axis direction based on the interference between the reflected light from the reflecting member 13 and the reference light. In the example shown in FIG. 2, multiple (two) measuring units 12 are arranged at a distance in the X-axis direction. By using multiple measuring units 12 in this way, it is also possible to measure the rotation of the master stage 11 in the θ direction (rotation direction around the Z axis). In addition, the reflecting member 13 can be provided on the upper surface S of the master stage 11. In this embodiment, the reflecting member 13 is supported by a support portion 16 protruding from the upper surface S of the master stage 11 in the +Z direction, as shown in FIG. 2. Here, the upper surface S of the master stage 11 refers to, for example, a surface including a holding surface that holds the master M on the master stage 11.

In the positioning device 10A, when fluctuations (atmosphere fluctuations) such as gas temperature and humidity occur in the optical path (measurement optical path) 12a of the light emitted from the measurement unit 12, the refractive index of the measurement optical path 12a changes due to the fluctuations, and measurement accuracy may decrease (measurement error). For this reason, the positioning device 10A of this embodiment may be provided with a blowing unit 14 that blows out gas 14a to stabilize the atmosphere of the measurement optical path 12a. The blowing unit 14 may be configured to blow out gas toward the original stage 11 so that a gas flow along the Y-axis direction is formed in the measurement optical path 12a of the measurement unit 12, for example. The gas 14a blown out from the blowing unit 14 may be used to prevent fogging of the original M and to cool the original stage 11 in addition to stabilizing the atmosphere of the measurement optical path 12a. The gas 14a blown out from the blowing section 14 may be, for example, clean air, clean dry air, nitrogen gas, or other clean gas whose temperature and humidity are kept (adjusted) within a predetermined range.

The original M is illuminated during exposure of the substrate W and its temperature rises. If the heat generated in the original M spreads to the surroundings as the original stage 11 moves and enters the measurement optical path 12a, the measurement accuracy of the position of the original stage 11 by the measurement unit 12 may decrease. In addition, to prevent fogging of the original M, the arrangement space of the original M may be filled with gas (purge gas) that has a lower humidity than the surroundings. Even in this case, if low-humidity gas enters the measurement optical path as the original stage 11 moves, the measurement accuracy of the position of the original stage 11 by the measurement unit 12 may decrease. In the following, the heated gas from the original M and the gas (purge gas) supplied to the arrangement space of the original M may be collectively referred to as the "ambient gas of the original M".

Therefore, in the positioning device 10A of this embodiment, a wall 17 is provided between the reflecting member 13 (supporting portion 16) on the upper surface S of the original stage 11 and the original M. By providing the wall 17 in this manner, it is possible to reduce the movement of the ambient gas around the original M into the measurement optical path 12a as the original stage 11 moves. Specifically, as shown in FIG. 3, when the original stage 11 moves according to the arrow V, the ambient gas around the original M starts to move in the direction toward the measurement optical path 12a (-X direction). However, the ambient gas around the original M that has started to move collides with the wall 17 as shown by the arrow A, and its movement direction (flow direction) is changed to a direction away from the measurement optical path 12a. Therefore, it is possible to reduce (prevent) the ambient gas around the original M from entering the measurement optical path 12a.

The wall portion 17 is configured so that its height (Z-axis direction) is higher than the top surface of the original M. The higher the wall portion 17, the more it can guide (convert) the movement direction of the gas surrounding the original M away from the measurement optical path 12a, thereby increasing the distance between the flow of the gas surrounding the original M and the measurement optical path 12a. Increasing the distance between the flow of the gas surrounding the original M and the measurement optical path 12a in this manner can reduce the intrusion of the gas surrounding the original M into the measurement optical path 12a. In this case, the gas 14a blown out from the blowing unit 14 can move the flow of the gas surrounding the original M further away from the measurement optical path 12a, thereby further reducing the intrusion of the gas surrounding the original M into the measurement optical path 12a.

The width (length in the X-axis direction) of the wall 17 is preferably equal to or greater than the width (length in the X-axis direction) of the original M. The wider the width of the wall 17, the more the ambient gas around the moving original M can be guided away from the measurement optical path 12a, thereby increasing the distance between the ambient gas flow and the measurement optical path 12a. The X-axis direction can be defined as a direction (second direction) perpendicular to the scanning direction (X-axis direction, first direction) in a plane parallel to the upper surface S of the original stage 11. Here, as described above, the higher the height of the wall 17, the better, and the wider the width of the wall 17, the better, but the height and width of the wall 17 can be determined, for example, according to the size of the original stage 11 or the size of the space in which the original stage 11 can move.

The wall 17 is not limited to a rectangular shape when viewed from the Z-axis direction (in a plan view), and may have other shapes that can increase the effect of changing the movement direction of the gas around the original M. Figures 4(a) to 4(d) show examples of the shape of the wall 17. The wall 17 shown in Figure 4(a) has an "L"-shaped shape in which the end on the X-axis direction is bent in a direction away from the original M (+Y direction). The wall 17 shown in Figure 4(b) has an "L"-shaped shape in which the end on the X-axis direction is bent in a direction toward the original M (-Y direction). The wall 17 shown in Figure 4(c) has an "L"-shaped shape in which the end on the X-axis direction is bent in a direction away from the original M (+Y direction). The wall 17 shown in Figure 4(d) has a shape with an inclined side surface on the X-axis direction (i.e., the shape in a plan view is trapezoidal). The shape of the wall 17 is not limited to the shape shown in Figure 4, and may have a curvature or a thickness that varies partially. Furthermore, if air resistance at the wall 17 affects the movement of the original stage 11, the wall 17 may be inclined so that the air resistance is smaller than a desired value.

On the other hand, the flow of the gas 14a blown out from the blowing unit 14 may also change due to the wall 17. As described above, the gas 14a is supplied to the measurement optical path 12a to stabilize the atmosphere of the measurement optical path 12a and reduce the decrease in measurement accuracy. Therefore, if the flow of the gas 14a changes partially in the measurement optical path 12a, the refractive index may change in that part, and the measurement accuracy may decrease. For example, when the gas 14a blown out from the blowing unit 14 hits the wall 17, the flow of the gas 14a may change in the vicinity of the wall 17. In addition, the gas 14a near the wall 17 may become a disturbed flow (turbulent flow) because it is pushed or pulled by the wall 17 as the original stage 11 moves. If such a change in the flow of the gas 14a or turbulent flow occurs in the measurement optical path 12a, a decrease in the measurement accuracy may be caused.

Therefore, the wall 17 in this embodiment is disposed away from the reflecting member 13 (support 16) in the Y-axis direction. For example, the wall 17 may be disposed closer to the original (plate) side than the intermediate position between the original M and the reflecting member 13 (support 16) in the Y-axis direction. By disposing the wall 17 away from the reflecting member 13 (support 16) in this way, the influence of changes in the flow of the gas 14a and turbulence in the vicinity of the wall 17 on the measurement optical path 12a can be reduced, and a decrease in measurement accuracy can be reduced. Furthermore, the direction in which the flow of the gas 14a is changed by the wall 17 is a direction away from the measurement optical path 12a, so that the flow of the gas 14a after such a change can increase the effect of moving the surrounding gas of the original M that has crossed the wall 17 away from the measurement optical path 12a.

Next, the results of a simulation confirming the effect of providing a wall portion 17 between the original M and the reflecting member 13 (support portion 16) will be described. In the simulation, the size of the original M was 152 mm x 152 mm. The wall portion 17 was 180 mm wide (length in the X-axis direction) and 26 mm high, and was provided at a position 35 mm from the edge of the original M on the upper surface S of the original stage 11. In this case, when the temperature of the original M rose by 1.4°C during exposure of the substrate W, the fluctuation of the measurement optical path 12a caused by the temperature of the original M was improved by 45% compared to the case where the wall portion 17 was not provided.

As described above, in the positioning device 10A of this embodiment, the wall portion 17 is provided between the original M and the reflecting member 13 on the upper surface of the original stage 11. The upper end of the wall portion 17 is configured to be higher than the upper surface of the original M, and is disposed at a distance from the original M and the reflecting member 13 (support portion 16). This configuration can reduce the intrusion of the ambient gas of the original M, such as heat generated in the original M during exposure and purge gas supplied to the original M, into the measurement optical path 12a of the measurement unit 12. Therefore, the measurement error of the measurement unit 12 caused by the atmospheric fluctuation of the measurement optical path 12a can be reduced, and the original M can be positioned with high accuracy. Here, in the configuration of this embodiment, the positions of the measurement unit 12 and the reflecting member 13 may be interchanged. That is, in this embodiment, the reflecting member 13 is provided on the upper surface S of the original stage 11, but the measurement unit 12 may be provided on the upper surface S of the original stage 11.

Second Embodiment
A second embodiment of the present invention will be described. This embodiment basically follows on from the first embodiment, but differs from the first embodiment in that it further includes a cover member 18 that surrounds a part of the measurement optical path 12a of the measurement unit 12. Below, a positioning device 10B of this embodiment that includes the cover member 18 will be described.

Figure 5 is a schematic diagram showing the configuration of the positioning device 10B of this embodiment. Figure 5(a) shows a side view of the positioning device 10B, and Figure 5(b) shows a top view of the positioning device 10B. The original stage 11 of this embodiment has a cover member 18 that surrounds (covers) a part of the measurement optical path 12a on its upper surface S. The cover member 18 can be provided to further reduce the influence of the ambient gas around the original M that has passed over the wall portion 17 on the measurement optical path 12a, i.e., to regulate the flow of gas on the original stage 11 and stabilize the atmosphere of the measurement optical path 12a.

The cover member 18 of this embodiment can be placed on the upper surface S of the original stage 11 so that a gap 19 is formed between the cover member 18 and the wall portion 17. By placing the cover member 18 with a gap 19 from the wall portion 17 in this manner, the gas 14a blown out from the blowing section 14 and passing through the cover member 18 can be exhausted from the gap 19 and made to flow along the wall portion 17. In other words, the effect of keeping the ambient gas around the original M that has moved beyond the wall portion 17 away from the measurement optical path 12a can be further increased.

The narrower the gap 19 between the cover member 18 and the wall portion 17, the greater the flow rate of the gas 14a discharged from the gap 19, and the greater the effect of moving the ambient gas of the original M away from the measurement optical path 12a. On the other hand, if the gap 19 is narrowed, the gas 14a blown out from the blowing portion 14 may stagnate inside the cover member 18, causing atmospheric fluctuations in the measurement optical path 12a. For this reason, the cover member 18 of this embodiment has an opening 18a on the side surface on the X-axis direction side for discharging the gas that has passed through the inside. The opening 18a is preferably formed on the wall portion 17 side, and preferably formed between the reflecting member 13 and the wall portion 17 in the Y-axis direction. In addition, it is preferable that the opening 18a is disposed in a position as far away from the reflecting member 13 as possible in the Y-axis direction. This is to reduce the influence on the measurement optical path 12a even if the ambient gas of the original M enters the inside of the cover member 18 from the opening 18a beyond the wall portion 17.

Here, the cover member 18 may be configured integrally with the wall portion 17. Even in this case, openings, notches, etc. corresponding to the gap 19 and the opening 18a may be formed in the integrally configured member. Also, the opening 18a may be formed regardless of the narrowness of the gap 19 between the cover member 18 and the wall portion 17. Furthermore, the cover member 18 in this embodiment is configured to surround multiple reflecting members 13 (measurement optical paths 12a) arranged at a distance in the X-axis direction as shown in FIG. 5, but is not limited thereto and may be configured to surround each of the multiple reflecting members 13 individually.

As described above, the positioning device 10B of this embodiment has a cover member 18 provided on the upper surface S of the original stage 11 with a gap 19 from the wall portion 17. The cover member 18 may also have an opening 18a formed on the side surface on the X-axis direction side. With this configuration, the gas 14a blown out from the blowing section 14 and passing through the cover member 18 can be exhausted from the gap 19 and flow along the wall portion 17, further reducing the intrusion of the gas around the original M into the measurement optical path 12a of the measurement section 12.

Third Embodiment
A third embodiment of the present invention will be described. In this embodiment, an example of the configuration of a positioning device 10C configured to supply purge gas to a space in which an original M is placed (hereinafter, referred to as the placement space of the original M) will be described. Note that this embodiment basically inherits the first and second embodiments, unless otherwise specified.

Figure 6 is a schematic diagram showing the configuration of the positioning device 10C of this embodiment. Figure 6(a) shows a side view of the positioning device 10C, and Figure 6(b) shows a top view of the positioning device 10C. The positioning device 10C of this embodiment is useful, for example, when supplying a purge gas (low humidity gas as an example) to the placement space of the original M.

The positioning device 10C of this embodiment is configured so that the original stage 11 moves between the first surface member 31 and the second surface member 32. The first surface member 31 is a member supported by, for example, the illumination optical system IO and extending in the XY directions, and the second surface member 32 is a member supported by, for example, the projection optical system PO and extending in the XY directions. The first surface member 31 and the second surface member 32 are positioned so that the gap between them and the original stage 11 is as narrow as possible. This makes it possible to reduce the amount of purge gas 33 supplied to the arrangement space of the original M escaping from the gap between the first surface member 31 and the original stage 11, and the gap between the second surface member 32 and the original stage 11.

The original stage 11 also has a reflecting member 13 (supporting portion 16), a wall portion 17, a cover member 18, and a gap regulating member 34. The reflecting member 13 (supporting portion 16) and the wall portion 17 are provided on the upper surface S of the original stage 11 as described in the first and second embodiments. The cover member 18 is provided on the upper surface S of the original stage 11 so as to form a gap 19 with respect to the wall portion 17 as described in the second embodiment, and has an opening 18a on the side surface on the X-axis direction side. In this embodiment, the cover member 18 can be configured to have the same height as the wall portion 17 so as to form a narrow gap with respect to the first surface member 31. The gap regulating member 34 is a member for forming a narrow gap with respect to the first surface member 31, and is disposed on the opposite side of the wall portion 17 and the cover member 18 (the -Y direction side of the arrangement space of the original M) with respect to the arrangement space of the original M as the reference (center). The gap regulating member 34 can be configured to have the same height as the wall portion 17 and the cover member 18.

By configuring the original stage 11 in this way, it is possible to reduce the escape of the purge gas 33 supplied to the arrangement space of the original M. Also, it is possible to reduce the intrusion of the purge gas 33 into the measurement optical path 12a through the gap between the wall portion 17 and the first surface member 31 and the gap between the wall portion 17 and the cover member 18. Here, it is preferable that the area (total area) of the opening 18a of the cover member 18 is larger than the area (total area) of the gap between the wall portion 17 and the cover member 18. In the configuration of this embodiment, since the gas 14a is difficult to discharge from the gap between the wall portion 17 and the cover member 18, the gas 14a stagnates inside the cover member 18, which is likely to cause atmospheric fluctuations in the measurement optical path 12a. Also, it is preferable that the opening 18a is formed between the reflecting member 13 and the wall portion 17 in the Y-axis direction. In this case, it is preferable that the opening 18a is formed in a position as far away from the reflecting member 13 as possible in the Y-axis direction. This is to suppress sudden changes in the flow velocity of the gas 14a in the measurement light path 12a near the reflecting member 13 and reduce atmospheric fluctuations in the measurement light path 12a.

Fourth Embodiment
A fifth embodiment of the present invention will be described. In this embodiment, a configuration example of a positioning device 10D in which the original stage 11 includes a coarse movement stage 11a and a fine movement stage 11b will be described. This embodiment basically follows on from the first embodiment unless otherwise specified. This embodiment may also apply a configuration including the cover member 18 described in the second embodiment, and/or a configuration including the first surface member 31 and the second surface member 32 described in the third embodiment.

Figure 7 is a schematic diagram showing the configuration of the positioning device 10D of this embodiment. Figure 7(a) shows a side view of the positioning device 10D, and Figure 7(b) shows a top view of the positioning device 10D. The original stage 11 in the positioning device 10D of this embodiment can include a coarse movement stage 11a and a fine movement stage 11b.

The coarse movement stage 11a has a drive mechanism 42 (actuator) for moving at least in the Y-axis direction relative to the base 41. The position of the coarse movement stage 11a in the Y-axis direction is measured by a second measurement unit 43. The second measurement unit 43 is composed of, for example, a laser interferometer, and can emit light toward a reflecting member 44 provided on the coarse movement stage 11a, and measure the position of the coarse movement stage 11a in the Y-axis direction based on the interference between the reflected light from the reflecting member 44 and the reference light. In FIG. 7, the measurement optical path 43a of the second measurement unit 43 is shown. Here, in this embodiment, the reflecting member 44 is provided on the side of the coarse movement stage 11a, but it may be provided on the top surface of the coarse movement stage 11a.

Fine movement stage 11b holds original M and has a drive mechanism 45 (actuator) for moving relative to coarse movement stage 11a at least in the Y-axis direction. In this embodiment, reflecting member 13 (supporting portion 16) and wall portion 17 are provided on the upper surface S of fine movement stage 11b. Wall portion 17 is supported by fine movement stage 11b between reflecting member 13 (supporting portion 16) and original M so as to be spaced apart from reflecting member 13 and original M.

Here, as shown in FIG. 8, the wall portion 17 may be supported by the coarse movement stage 11a instead of the fine movement stage 11b. FIG. 8 is a schematic diagram showing the configuration of a positioning device 10E in which the wall portion 17 is supported by the coarse movement stage 11a. FIG. 8(a) shows a side view of the positioning device 10E, and FIG. 8(b) shows a top view of the positioning device 10E. In the positioning device 10E shown in FIG. 8, the wall portion 17 is supported by the coarse movement stage 11a via a support member 46. Specifically, the wall portion 17 is supported by the coarse movement stage 11b via the support member 46 between the reflecting member 13 (support portion 16) and the original M so as to be spaced apart from the reflecting member 13 and the original M.

The configuration of the positioning devices 10D to 10E of this embodiment also reduces the intrusion of ambient gas around the original M into the measurement optical path 12a of the measurement unit 12. This reduces the measurement error of the measurement unit 12 caused by atmospheric fluctuations in the measurement optical path 12a, and allows the original M to be positioned with high precision.

<Embodiments of a method for manufacturing an article>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above-mentioned exposure apparatus (a step of exposing the substrate) and a step of developing (processing) the substrate on which the latent image pattern has been formed in the step. Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

The invention is not limited to the above-described embodiment, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the following claims are appended to disclose the scope of the invention.

10: Positioning device, 11: Original stage, 12: Measurement unit, 13: Reflection member, 16: Support unit, 17: Wall unit, 18: Cover member

Claims (13)

A positioning device for positioning a plate, comprising:
a stage capable of holding the plate and moving in a first direction;
a measurement unit that emits light in the first direction and measures a position of the stage in the first direction based on the light reflected by a reflecting member provided on an upper surface of the stage;
a wall portion provided on an upper surface of the stage between the plate and the reflecting member in the first direction , the wall portion having a portion extending along a second direction perpendicular to the first direction in a plane parallel to the upper surface of the stage and two ends ;
having
A positioning device characterized in that the upper end of the wall portion is configured to be higher than the upper surface of the plate and is positioned at a distance from the plate and the reflective member , and the distance between the two ends in the second direction is greater than or equal to the length of the plate in the second direction . The positioning device according to claim 1, characterized in that the wall portion is disposed closer to the plate than a midpoint between the plate and the reflecting member in the first direction. the reflecting member is supported by a support portion protruding from an upper surface of the stage,
3. The positioning device according to claim 1, wherein the wall portion is disposed at a distance from the support portion. The positioning device according to any one of claims 1 to 3, characterized in that the upper surface of the stage is a surface including a holding surface that holds the plate. 5. The positioning device according to claim 1, wherein the length of the wall portion in the second direction is equal to or greater than the length of the plate. the stage has a cover member that surrounds a part of the optical path of the measurement unit,
6. The positioning device according to claim 1, wherein a gap is formed between the cover member and the wall portion for discharging gas from inside the cover member. A positioning device for positioning a plate, comprising:
a stage capable of holding the plate and moving in a first direction;
a measurement unit that emits light in the first direction and measures a position of the stage in the first direction based on the light reflected by a reflecting member provided on an upper surface of the stage;
a wall portion provided on an upper surface of the stage between the plate and the reflecting member in the first direction;
having
The wall portion has an upper end higher than an upper surface of the plate and is disposed at a distance from the plate and the reflecting member,
the stage has a cover member that surrounds a part of the optical path of the measurement unit,
a gap is formed between the cover member and the wall portion to allow gas to be discharged from inside the cover member;
The positioning device according to claim 1, wherein the cover member has an opening for discharging gas from inside the cover member on a side surface facing a second direction perpendicular to the first direction. The positioning device according to claim 7, characterized in that the cover member has the opening between the reflecting member and the wall portion in the first direction. the stage includes a coarse movement stage and a fine movement stage that holds the plate and moves relatively with respect to the coarse movement stage;
9. The positioning device according to claim 1, wherein the wall portion is supported by the fine movement stage. A positioning device for positioning a plate, comprising:
a stage capable of holding the plate and moving in a first direction;
a measurement unit that emits light in the first direction and measures a position of the stage in the first direction based on the light reflected by a reflecting member provided on an upper surface of the stage;
a wall portion provided on an upper surface of the stage between the plate and the reflecting member in the first direction;
having
The wall portion has an upper end higher than an upper surface of the plate and is disposed at a distance from the plate and the reflecting member,
the stage includes a coarse movement stage and a fine movement stage that holds the plate and moves relatively with respect to the coarse movement stage;
A positioning device, wherein the wall portion is supported by the coarse movement stage. The positioning device according to any one of claims 1 to 10, further comprising a blowing unit that blows gas toward the stage so as to form a gas flow along the first direction in the optical path of the measurement unit. 1. An exposure apparatus that exposes a substrate while scanning an original and the substrate, comprising:
A positioning device according to any one of claims 1 to 11,
An exposure apparatus, wherein the positioning device positions at least one of the original and the substrate as the plate. exposing a substrate using the exposure apparatus according to claim 12;
developing the substrate exposed in the step;
A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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