JP7479072B2 - ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア - Google Patents
ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア Download PDFInfo
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- JP7479072B2 JP7479072B2 JP2022166720A JP2022166720A JP7479072B2 JP 7479072 B2 JP7479072 B2 JP 7479072B2 JP 2022166720 A JP2022166720 A JP 2022166720A JP 2022166720 A JP2022166720 A JP 2022166720A JP 7479072 B2 JP7479072 B2 JP 7479072B2
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- wafer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3311—Horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
30 :台座
32 :長手溝
321:第一端部
323:第二端部
40 :軸棒
50 :連動板
52 :板体
54 :穿孔
60 :アーム
70 :伸縮ユニット
71 :連結側壁
72 :連行ブロック
721:スリーブ
73 :弾性部材
74 :ねじ切りボルト
75 :ボール
80 :ウェハ出入アセンブリ
90 :ウェハキャリア97:スロット
100:ウェハキャリア
W :ウェハ
Claims (11)
- 長手溝を有する台座と、
摺動可能に前記長手溝内に挿入されている軸棒と、
前記軸棒に被嵌された複数の連動板であって、各々が、板体と、前記板体に設けられて前記軸棒が挿通されている穿孔とを有する複数の連動板と、
各々が各前記連動板の前記板体の端部から延出している複数のアームと、
複数の連結側壁を含む伸縮ユニットであって、各前記連結側壁は、各前記連動板にそれぞれ設けられて隣接する前記連動板を互いに連結させ、且つ、各前記連結側壁は、伸縮することによって隣接する前記連動板の間の距離を変更可能である伸縮ユニットと、を備えるウェハ出入装置。 - 前記伸縮ユニットは、
上下移動可能に前記軸棒に設けられ、最上部の前記連動板を連行して上下移動させることができるように最上部の前記連動板に連結されている連行ブロックを更に含んでいる、請求項1に記載のウェハ出入装置。 - 前記伸縮ユニットは、
前記軸棒内に設けられて前記連行ブロックに当接している弾性部材を更に含んでいる、請求項2に記載のウェハ出入装置。 - 前記弾性部材は、前記連行ブロックを上方へ移動させるための回復力を前記連行ブロックに与える圧縮ばねである、請求項3に記載のウェハ出入装置。
- 前記弾性部材は、前記連行ブロックを下方へ移動させるための回復力を前記連行ブロックに与える引っ張りばねである、請求項3に記載のウェハ出入装置。
- 前記伸縮ユニットは、前記軸棒内に収容されたねじ切りボルトを更に含み、
前記連行ブロックは、前記軸棒と前記ねじ切りボルトとの間に位置するように前記軸棒内に挿設されたスリーブを含み、
前記ねじ切りボルトが回転すると前記連行ブロックは上下移動させられる、請求項2に記載のウェハ出入装置。 - 前記伸縮ユニットは、前記軸棒内に設けられて前記連行ブロックに当接している弾性部材を更に含んでいる、請求項6に記載のウェハ出入装置。
- 前記伸縮ユニットは、前記スリーブと前記ねじ切りボルトとの間に設けられた複数のボールを更に含んでいる、請求項6に記載のウェハ出入装置。
- ウェハを搬送するためのウェハ出入アセンブリであって、
請求項1から8のいずれか一項に記載のウェハ出入装置と、
前記ウェハ出入装置によってウェハが取り出されたり載置されたりするウェハキャリアと、を備え、
前記ウェハキャリアは複数のスロットを有している、ウェハ出入アセンブリ。 - 隣接する二つの前記スロットの間の距離は3mm~10mmの範囲にある、請求項9に記載のウェハ出入アセンブリ。
- 隣接する二つの前記スロットの間の距離は5mmである、請求項10に記載のウェハ出入アセンブリ。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111240012.8A CN116031184B (zh) | 2021-10-25 | 2021-10-25 | 晶圆存取总成及其晶圆存取装置与晶圆载具 |
| CN202111240012.8 | 2021-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023064071A JP2023064071A (ja) | 2023-05-10 |
| JP7479072B2 true JP7479072B2 (ja) | 2024-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2022166720A Active JP7479072B2 (ja) | 2021-10-25 | 2022-10-18 | ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11817342B2 (ja) |
| JP (1) | JP7479072B2 (ja) |
| KR (1) | KR20230059168A (ja) |
| CN (1) | CN116031184B (ja) |
| TW (1) | TWI826056B (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7610943B2 (ja) * | 2020-09-18 | 2025-01-09 | ニデックインスツルメンツ株式会社 | 産業用ロボット |
| KR102628389B1 (ko) * | 2021-11-04 | 2024-01-23 | 주식회사 유케이로보틱스 | 반도체 웨이퍼를 이송하기 위한 장치 |
| CN116534424A (zh) * | 2023-05-11 | 2023-08-04 | 大庆溢泰半导体材料有限公司 | 一种利于回收的卡塞及回收方法 |
| CN116902471B (zh) * | 2023-08-21 | 2026-03-20 | 上海广川科技有限公司 | 一种层距可调的晶圆存储设备 |
| CN119275141B (zh) * | 2024-09-29 | 2025-07-15 | 苏州尤诺克机电科技有限公司 | 晶圆生产装置载具及其工作方法 |
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-
2021
- 2021-10-25 CN CN202111240012.8A patent/CN116031184B/zh active Active
-
2022
- 2022-10-18 JP JP2022166720A patent/JP7479072B2/ja active Active
- 2022-10-19 TW TW111139651A patent/TWI826056B/zh active
- 2022-10-25 KR KR1020220138402A patent/KR20230059168A/ko not_active Ceased
- 2022-10-25 US US17/972,946 patent/US11817342B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174099A (ja) | 1998-12-01 | 2000-06-23 | Koyo Thermo System Kk | 薄板状部材移載装置 |
| JP2001210696A (ja) | 2000-01-28 | 2001-08-03 | Ohkura Electric Co Ltd | ウェーハ移載機のピッチ変換機構 |
| WO2013021645A1 (ja) | 2011-08-10 | 2013-02-14 | 川崎重工業株式会社 | エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット |
| JP2020061400A (ja) | 2018-10-05 | 2020-04-16 | 川崎重工業株式会社 | 基板保持装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US11817342B2 (en) | 2023-11-14 |
| CN116031184B (zh) | 2026-02-10 |
| TW202318557A (zh) | 2023-05-01 |
| KR20230059168A (ko) | 2023-05-03 |
| CN116031184A (zh) | 2023-04-28 |
| JP2023064071A (ja) | 2023-05-10 |
| US20230128509A1 (en) | 2023-04-27 |
| TWI826056B (zh) | 2023-12-11 |
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