JP7490692B2 - Organic Film Forming Equipment - Google Patents

Description

An embodiment of the present invention relates to an organic film forming apparatus.

Organic films are used as substrates for organic electroluminescence displays and the like. For example, an organic film is a polyimide film. For example, a polyimide film is formed by heating a workpiece having a substrate and a solution containing polyamic acid applied to the upper surface of the substrate to approximately 100°C to 600°C to imidize the polyamic acid. The formed polyimide film is peeled off from the substrate and used, for example, in organic electroluminescence displays and the like.

As an apparatus for forming organic films such as polyimide films, an organic film forming apparatus has been proposed that includes a chamber capable of maintaining an atmosphere at a reduced pressure below atmospheric pressure, and a heater provided inside the chamber for heating the workpiece.

Here, when manufacturing or maintaining the organic film forming apparatus, it is necessary to remove the heater from inside the chamber or install a heater inside the chamber. Therefore, simply installing a heater inside the chamber makes it difficult to manufacture or maintain the organic film forming apparatus.

Therefore, there was a need to develop an organic film formation device that allows the heater to be easily attached and detached from the chamber.

JP 2019-205991 A

The problem that this invention aims to solve is to provide an organic film forming apparatus that allows the heater to be easily attached and detached from the chamber.

The organic film forming apparatus according to the embodiment is capable of heating a workpiece having a substrate and a solution containing an organic material and a solvent applied to an upper surface of the substrate in an atmosphere reduced in pressure below atmospheric pressure, the organic film forming apparatus comprising: a chamber capable of maintaining the atmosphere reduced in pressure below atmospheric pressure;
The apparatus comprises a first exhaust section capable of exhausting the inside of the chamber, a guide section facing the work supported in the chamber , having a cylindrical shape and extending in one direction, with both open ends provided inside the chamber, a support section provided inside the guide section and having a first hole penetrating in the axial direction, and a heater which is detachably provided in the first hole and has a heat generating section extending along the guide section.

According to an embodiment of the present invention, an organic film forming apparatus is provided that allows the heater to be easily attached and detached from the chamber.

1 is a schematic perspective view illustrating an organic film forming apparatus according to an embodiment of the present invention; 4 is a schematic cross-sectional view illustrating a temperature control unit. FIG. 1A to 1C are schematic cross-sectional views illustrating the positional relationship between a support portion and a workpiece. 1 is a graph illustrating a process of forming an organic film. 11A and 11B are schematic cross-sectional views illustrating a temperature control unit according to another embodiment. 10A to 10C are schematic cross-sectional views illustrating a support portion according to another embodiment. 7 is a schematic cross-sectional view of the support part in FIG. 6 taken along line AA. 7 is a schematic cross-sectional view of the opening and closing door in the direction of line BB in FIG. 6. 11A and 11B are schematic cross-sectional views illustrating a temperature control unit according to another embodiment. 5A and 5B are schematic diagrams for illustrating the operation of a fluid control unit. FIG.

Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.
In the following, an organic film forming apparatus will be described which forms an organic film by baking a solution containing an organic material applied to the upper surface of a substrate in a reduced pressure atmosphere.

FIG. 1 is a schematic perspective view illustrating an organic film forming apparatus 1 according to the present embodiment.
1, the X direction, the Y direction, and the Z direction represent three directions that are perpendicular to one another. In this specification, the up-down direction can be regarded as the Z direction.

The workpiece 100 has a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate.
The substrate may be, for example, a glass substrate, a semiconductor wafer, etc. However, the substrate is not limited to the examples given.
The solution contains an organic material and a solvent. The organic material is not particularly limited as long as it can be dissolved by the solvent. The solution can be, for example, a varnish containing polyamic acid. However, the solution is not limited to the exemplified ones.

The organic film forming apparatus 1 can heat the workpiece 100 in an atmosphere that is reduced in pressure below atmospheric pressure.
As shown in FIG. 1, the organic film forming apparatus 1 includes a chamber 10 , an exhaust unit 20 (corresponding to an example of a first exhaust unit), a processing unit 30 , a cooling unit 40 , and a controller 50 .
The chamber 10 has a box shape. The chamber 10 has an airtight structure capable of maintaining an atmosphere at a reduced pressure lower than atmospheric pressure. There is no particular limitation on the external shape of the chamber 10. The external shape of the chamber 10 may be, for example, a rectangular parallelepiped. The chamber 10 has, for example, a main body 10a, an opening/closing door 13, and a lid 15.

The main body 10a is cylindrical. A flange 11 can be provided at one end of the main body 10a. A flange 14 can be provided at the other end of the main body 10a. The main body 10a, the flange 11, and the flange 14 are formed from a metal such as stainless steel. The outer wall connecting both ends of the main body 10a is called the side surface 10a1.

The flange 11 can be provided with a sealing material 12 such as an O-ring. The opening of the main body 10a on the side where the flange 11 is provided can be opened and closed by an opening and closing door 13.

The opening/closing door 13 is plate-shaped and made of a metal such as stainless steel. A drive device (not shown) presses the opening/closing door 13 against the flange 11 (sealing material 12), closing the opening on the side of the main body 10a where the flange 11 is provided so that it is airtight. A drive device (not shown) separates the opening/closing door 13 from the flange 11, allowing the workpiece 100 to be loaded or unloaded through the opening of the chamber 10.

The flange 14 can be provided with a sealing material 12 such as an O-ring. The opening of the main body 10a on the side where the flange 14 is provided is closed by a lid 15.

The lid 15 is plate-shaped and made of a metal such as stainless steel. The lid 15 is provided with holes 15a. The lid 15 is also provided with holders 32d for mounting heaters 32a (described later) (see FIG. 2). For example, the number of holders 32d and holes 15a can be the same as the number of heaters 32a (described later).
Alternatively, a hole similar to the hole 15a may be provided in the door 13 or the side surface 10a1 of the main body 10a, and the heater 32a may be attached to the hole.

When the lid 15 is attached to the flange 14 using a fastening member such as a screw, the lid 15 is pressed against the flange 14 (sealing material 12). In addition, the heater 32a is airtightly connected to the holder 32d provided on the lid 15, so that the opening on the side of the body 10a where the flange 14 is provided is closed so as to be airtight (see FIG. 2).

Furthermore, when performing maintenance, the opening of the main body 10a on the side where the flange 14 is provided can be exposed by removing the lid 15. The lid 15 is not necessarily required, and for example, the lid 15 and the main body 10a may be integrated together. In other words, the main body 10a may be cylindrical with one end closed.
Furthermore, when performing maintenance, the heater 32a can be removed and the lid 15 can be removed.

A cooling section 16 can be provided on the side surface 10a1 of the main body 10a. The cooling section 16 can also be provided on the opening and closing door 13 and the lid 15. A cooling water supply section (not shown) is connected to the cooling section 16. The cooling section 16 can be, for example, a water jacket. If the cooling section 16 is provided, it is possible to prevent the temperature of the outer wall of the chamber 10 from rising above a predetermined temperature.

The exhaust unit 20 exhausts the internal space of the chamber 10. Therefore, the workpiece 100 is heated by radiated thermal energy in an atmosphere reduced in pressure below atmospheric pressure.
The exhaust section 20 may have a first exhaust section 21 , a second exhaust section 22 , and a third exhaust section 23 .
The first exhaust unit 21 is connected to an exhaust port 17 provided on the bottom surface of the chamber 10. The first exhaust unit 21 may include an exhaust pump 21a and a pressure control unit 21b. The exhaust pump 21a may be, for example, a dry vacuum pump.
The pressure control unit 21b is provided between the exhaust port 17 and the exhaust pump 21a. The pressure control unit 21b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10. The pressure control unit 21b can be, for example, an APC (Auto Pressure Controller).

A cold trap 24 for trapping the exhausted sublimate can be provided between the exhaust port 17 and the first exhaust section 21 (pressure control section 21b). A valve 25 can be provided between the exhaust port 17 and the cold trap 24. The valve 25 is provided to prevent the fluid 101 from flowing into the cold trap 24 in the cooling process described below.

The second exhaust section 22 is connected to an exhaust port 18 provided on the bottom surface of the chamber 10. The second exhaust section 22 can have an exhaust pump 22a and a pressure control section 22b. The second exhaust section 22 has an exhaust capacity capable of exhausting up to a molecular flow region of high vacuum. The exhaust pump 22a can be, for example, a turbo molecular pump (TMP).

The pressure control unit 22b is provided between the exhaust port 18 and the exhaust pump 22a. The pressure control unit 22b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10. The pressure control unit 22b can be, for example, an APC.

As in the case of the first exhaust section 21, a cold trap 24 can be provided between the exhaust port 18 and the second exhaust section 22 (pressure control section 22b). A valve 25 can be provided between the exhaust port 18 and the cold trap 24.

The third exhaust section 23 is connected between the exhaust port 18 and the valve 25 of the second exhaust section 22. The third exhaust section 23 is connected to an exhaust pipe of a factory or the like. The third exhaust section 23 can be, for example, a pipe made of stainless steel or the like. A valve 25 can be provided between the third exhaust section 23 and the exhaust pipe of the factory.

When reducing the pressure in the internal space of the chamber 10, first, the internal pressure of the chamber 10 is adjusted to about 10 Pa by the first exhaust part 21. Next, the internal pressure of the chamber 10 is adjusted to about 10 Pa to 1×10 ⁻² Pa by the second exhaust part 22.

The first exhaust section 21 performs rough exhaust from atmospheric pressure to a predetermined internal pressure, so the exhaust volume of the first exhaust section 21 is greater than the exhaust volume of the second exhaust section 22. In addition, after rough exhaust is completed, the second exhaust section 22 performs exhaust to an even lower predetermined internal pressure. The third exhaust section 23 is used to exhaust the fluid 101 to the factory exhaust pipe in the cooling process described below.

The processing section 30 has a frame 31 , a temperature control section 32 , a workpiece support section 33 , a heat equalizing section 34 , a heat equalizing plate support section 35 , and a cover 36 .
The processing section 30 is provided with a processing region 30a and a processing region 30b. The processing regions 30a and 30b are spaces for subjecting the workpiece 100 to a heat treatment. The workpiece 100 is supported inside the processing regions 30a and 30b. The processing region 30b is provided above the processing region 30a. Note that, although the case where two processing regions are provided is illustrated, the present invention is not limited to this. Only one processing region may be provided. Also, three or more processing regions may be provided. In FIG. 1, the case where two processing regions are provided is illustrated as an example, but the basic configuration is the same in the case where one processing region and three or more processing regions are provided.

The processing areas 30a, 30b are surrounded by a heat equalizing section 34 (upper heat equalizing plate 34a, lower heat equalizing plate 34b, side heat equalizing plate 34c, side heat equalizing plate 34d). The processing areas 30a, 30b are connected to the space inside the chamber 10 outside the processing areas 30a, 30b via the gaps between the upper heat equalizing plates 34a, the gaps between the lower heat equalizing plates 34b, the gaps between the covers 36, and holes and slits provided in the cover 36. Therefore, when the pressure in the space inside the chamber 10 outside the processing areas 30a, 30b is reduced, the pressure in the processing areas 30a, 30b is also reduced.

In addition, if the pressure in the space outside the processing regions 30a, 30b inside the chamber 10 is reduced, the amount of heat released from the processing regions 30a, 30b to the outside can be reduced. This improves the heat storage efficiency, allowing the power applied to the heater 32a to be reduced. Reducing the applied power can save energy and extend the life of the heater 32a. Furthermore, improved heat storage efficiency makes it easier to handle processes that require a rapid increase in temperature. Furthermore, the temperature of the outer wall of the chamber 10 can be prevented from rising, allowing the cooling section 16 to be simplified.

The frame 31 has a framework structure using elongated plate materials, shaped steel, etc. The external shape of the frame 31 can be the same as the external shape of the chamber 10. The external shape of the frame 31 can be, for example, a rectangular parallelepiped.

Furthermore, the frame 31 is provided with a plurality of beams 31a. The plurality of beams 31a extend in the longitudinal direction (X direction in FIG. 1) of the processing regions 30a and 30b. The beams 31a provided on the opening/closing door 13 side of the frame 31 face the beams 31a provided on the lid 15 side of the frame 31. A plurality of heat equalizing plate support parts 35 can be provided on the beams 31a in a line at a predetermined interval.

A plurality of temperature control units 32 may be provided. The plurality of temperature control units 32 are arranged in the longitudinal direction (X direction in FIG. 1) of the processing regions 30a and 30b. The temperature control units 32 heat the workpiece 100. The number and spacing of the temperature control units 32 may be changed as appropriate depending on the composition of the solution to be heated (such as the required heating temperature of the solution) and the size of the workpiece 100. The number and spacing of the temperature control units 32 may be determined as appropriate by performing simulations, experiments, etc.

The temperature control unit 32 can be provided at the bottom of the processing areas 30a, 30b and at the top of the processing areas 30a, 30b. The temperature control unit 32 provided at the bottom of the processing areas 30a, 30b faces the temperature control unit 32 provided at the top of the processing areas 30a, 30b.

When multiple processing regions are stacked vertically, the temperature control unit 32 provided between the lower processing region and the upper processing region can be used to control the temperature of the workpiece 100 in the upper and lower processing regions. In other words, the temperature control unit 32 is provided between processing region 30a and processing region 30b. In this way, the number of temperature control units 32 can be reduced, which can reduce power consumption during heating, reduce the consumption of fluid 101 (described later) during cooling, reduce manufacturing costs, and save space.

The lower surface (back surface of the substrate) of the workpiece 100 supported inside the processing area 30a is heated or cooled by a plurality of temperature control units 32 (temperature control group 3a) provided at the bottom of the processing area 30a. The upper surface (solution) of the workpiece 100 supported inside the processing area 30a is heated or cooled by a plurality of temperature control units 32 (temperature control group 3ab) shared by the processing area 30a and the processing area 30b. The lower surface (back surface of the substrate) of the workpiece 100 supported inside the processing area 30b is heated or cooled by the temperature control group 3ab. The upper surface (solution) of the workpiece 100 supported inside the processing area 30b is heated or cooled by a plurality of temperature control units 32 (temperature control group 3b) provided at the top of the processing area 30b. When the temperature control groups are not distinguished, they are simply called the temperature control group 3.

FIG. 2 is a schematic cross-sectional view illustrating the temperature control unit 32.
As shown in FIG. 2, the temperature control unit 32 includes, for example, a heater 32a, a guide unit 32b, a support unit 32c, and a holder 32d.
The heater 32a includes, for example, a heat generating portion 32a1, a flange 32a2, and a terminal 32a3.
The heat generating portion 32a1 is detachably provided inside the guide portion 32b. The heat generating portion 32a1 extends along the guide portion 32b. The heat generating portion 32a1 converts electric power into heat. The heat generating portion 32a1 may be, for example, a sheath heater, a ceramic heater, a cartridge heater, or the like. A quartz cover may also be provided to cover the outer surface of the heat generating portion 32a1.

The flange 32a2 is plate-shaped and is provided near one end of the heat generating portion 32a1. The flange 32a2 can be airtight welded to the outer surface of the heat generating portion 32a1, for example. This allows the heat generating portion 32a1 to be airtightly connected via the holder 32d provided on the lid 15 and the flange 32a2. The material of the flange 32a2 can be, for example, a metal such as stainless steel.

Outside the chamber 10, the flange 32a2 is detachably attached to the flange 32d1 of the holder 32d using a fastening member such as a screw. When the flange 32a2 of the heater 32a is attached to the flange 32d1 of the holder 32d, the internal space of the chamber 10 is sealed so as to be airtight.

The terminal 32a3 is provided at the end of the heating section 32a1 on the side where the flange 32a2 is provided. The terminal 32a3 is electrically connected to the heating element provided in the heating section 32a1. A power source, a control device, or the like provided outside the organic film forming apparatus 1 is electrically connected to the terminal 32a3. That is, power is supplied to the heating element provided in the heating section 32a1 via the terminal 32a3. In this case, the terminal 32a3 is exposed to the outside of the lid 15, i.e., the outside of the organic film forming apparatus 1 (chamber 10). This makes it easy to attach and detach the power cable to the terminal 32a3. An insulating cover that covers the terminal 32a3 can also be provided.

The guide portion 32b is provided so as to face the substrate surface of the workpiece 100. The guide portion 32b has a cylindrical shape and has a shape extending in one direction. Both ends of the guide portion 32b are provided inside the chamber 10 (processing regions 30a, 30b). Both ends of the guide portion 32b are open. The guide portion 32b extends in the short direction (Y direction in FIG. 2) of the processing regions 30a, 30b. A pair of brackets 32b1 can be provided on the guide portion 32b. For example, the brackets 32b1 can be welded to each of the both ends of the guide portion 32b. The brackets 32b1 are attached to the beams 31a of the frame 31 using, for example, fastening members such as screws.
The guide portion 32b is made of a material having high thermal conductivity and heat resistance, for example, a metal such as stainless steel.
By providing this guide portion 32b, the heat generating portion 32a1 can be inserted and removed without interfering with other members within the chamber 10.

The support portion 32c is provided inside the guide portion 32b. The support portion 32c supports the heater 32a (heat generating portion 32a1) inside the guide portion 32b. For example, the support portion 32c is provided with a hole 32c1 (corresponding to an example of a first hole) that penetrates in the axial direction. The heat generating portion 32a1 is provided in the hole 32c1 so as to be detachable. Therefore, a small gap can be provided between the inner wall of the hole 32c1 and the heat generating portion 32a1.

The internal space of the guide portion 32b and the internal space of the chamber 10 (processing regions 30a, 30b) are connected via the gap between the inner wall of the hole 32c1 and the heat generating portion 32a1, or the gap between the inner wall of the guide portion 32b and the support portion 32c. Therefore, it is possible to suppress the occurrence of a pressure difference between the internal space of the guide portion 32b and the internal space of the chamber 10.

At least one support portion 32c can be provided. For example, one support portion 32c can be provided near the end of the guide portion 32b opposite the holder 32d side. In this way, the heat generating portion 32a1 can be supported by one support portion 32c and the holder 32d.

If multiple support parts 32c are provided, the distance between the inner wall of the guide part 32b and the heat generating part 32a1 can be made approximately constant in the area between the support parts 32c. Therefore, for example, it is possible to suppress the occurrence of temperature variations on the outer surface of the guide part 32b.

However, as the heater 32a heats up and cools down, the heat generating portion 32a1 expands and contracts, which may cause friction between the heat generating portion 32a1 and the support portion 32c. Also, as described below, the temperature of the region of the guide portion 32b facing the support portion 32c increases. Therefore, if the number of support portions 32c is increased, particles are more likely to be generated, and there is a risk that the temperature variation within the surface of the workpiece 100 may increase.
Furthermore, if the support portion 32c is provided in the central region of the guide portion 32b, the heat of the heater 32a is easily transferred to the vicinity of the center of the workpiece 100, and the purpose of making the temperature variation in the surface of the workpiece 100 closer to uniform cannot be achieved. Therefore, it is most preferable that the support portions 32c are provided on both ends of the guide portion 32b avoiding the central portion, in a number (e.g., one each) that is unlikely to generate particles.

Furthermore, a tapered surface 32c2 may be provided at the opening of the hole 32c1 of the support portion 32c on the holder 32d side. If the tapered surface 32c2 is provided, it becomes easy to insert the heater 32a (heat generating portion 32a1) into the hole 32c1.
The support portion 32c is made of a material having high thermal conductivity and heat resistance, for example, a metal such as stainless steel.
The shape of the support portion 32c may be, for example, semicircular (a shape that supports only the lower part of the heat generating portion 32a1) other than the example in which the support portion 32c is provided along the circular cross-sectional shape of the guide portion 32b.

The holder 32d has a flange 32d1 and is provided on the outer surface of the lid 15. When performing the heat treatment, the internal space of the chamber 10 has an atmosphere reduced below atmospheric pressure. Therefore, the holder 32d is, for example, welded to the lid 15 so as to be airtight. The material of the holder 32d can be, for example, a metal such as stainless steel.

The holder 32d is provided with a hole 32d2 that communicates with a hole 15a provided in the lid 15. The heater 32a can be inserted from outside the chamber 10 into a hole 32c1 of the support portion 32c via the hole 32d2 and the hole 15a.
Furthermore, the flange 32a2 of the heater 32a is detachably attached to a flange 32d1 of the holder 32d using a fastening member such as a screw.

As described above, according to the organic film forming apparatus 1 of this embodiment, the heater 32a can be easily attached and detached to and from the chamber 10 by having the guide portion 32b. This makes it easier to assemble and maintain the organic film forming apparatus 1.

A seal member can be provided between the flange 32a2 of the heater 32a and the flange 32d1 of the holder 32d. If a seal member is provided, it becomes easier to keep the internal space of the chamber 10 airtight.

In addition, heat generated in the heater 32a (heat generating portion 32a1) is transferred to the holder 32d. Therefore, a cooling portion can be provided in the holder 32d. The cooling portion can be, for example, a portion that blows gas onto the holder 32d, or a portion that flows gas or liquid through a flow path provided inside the holder 32d. If a cooling portion is provided, the temperature of the holder 32d, and therefore the temperature of the lid 15, can be prevented from becoming too high.

As described above, the heat generating portion 32a1 is provided in the internal space of the guide portion 32b. In the area where there is a space between the inner wall of the guide portion 32b and the heat generating portion 32a1, the heat generated in the heat generating portion 32a1 is transferred to the guide portion 32b by radiation. In the area where the support portion 32c is located between the inner wall of the guide portion 32b and the heat generating portion 32a1, the heat generated in the heat generating portion 32a1 is transferred to the guide portion 32b by thermal conduction via the support portion 32c. In this case, since heat is transferred more easily by thermal conduction than by radiation, the temperature of the area of the guide portion 32b facing the support portion 32c becomes higher than the temperature of the area of the guide portion 32b not facing the support portion 32c.

On the other hand, the peripheral region of the workpiece 100 is located closer to the inner wall of the chamber 10 than the central region of the workpiece 100. Therefore, the heat of the peripheral region of the workpiece 100 is more easily transferred to the inner wall of the chamber 10 than the heat of the central region of the workpiece 100. As a result, the temperature of the peripheral region of the workpiece 100 is more likely to be lower than the temperature of the central region of the workpiece 100.

As described above, the temperature of the area of guide portion 32b facing support portion 32c is higher than the temperature of the area of guide portion 32b not facing support portion 32c. Therefore, if the area of guide portion 32b facing support portion 32c is provided near the peripheral region of workpiece 100, the temperature of the peripheral region of workpiece 100 can be increased. As a result, the difference in temperature between the peripheral region of workpiece 100 and the central region of workpiece 100 can be reduced, so that workpiece 100 is heated evenly over its entire surface, improving the quality of the organic film that is formed.

3A to 3C are schematic cross-sectional views illustrating the positional relationship between the support portion 32c and the workpiece 100. FIG.
3(a) to 3(c) depict one peripheral side of the workpiece 100, but the same is true for the other peripheral side of the workpiece 100. Also, while Figures 3(a) to 3(c) depict a case in which the support portion 32c is provided above the workpiece 100, the same is true for a case in which the support portion 32c is provided below the workpiece 100.

3A, in a plan view (viewed from a direction perpendicular to the surface of the substrate of the workpiece 100), the support portion 32c can be provided outside the periphery of the workpiece 100. In this way, the temperature of the peripheral region of the lower heat equalizer plate 34b or the upper heat equalizer plate 34a can be increased. Since the heat of the peripheral region of the workpiece 100 is transferred to the inner wall of the chamber 10 via the lower heat equalizer plate 34b or the upper heat equalizer plate 34a, if the temperature of the peripheral region of the lower heat equalizer plate 34b or the upper heat equalizer plate 34a increases, the heat that is lost to the inner wall of the chamber 10 can be compensated for.
Therefore, the difference in temperature between the peripheral region of the workpiece 100 and the central region of the workpiece 100 can be reduced.

As shown in Fig. 3(b) , in a plan view, the support portion 32c can be provided inside the periphery of the workpiece 100. In this way, the temperature of the peripheral region of the lower heat equalizing plate 34b or the upper heat equalizing plate 34a becomes high, as in Fig. 3(a) , and this makes it possible to compensate for the temperature of the peripheral region of the workpiece 100, which is easily lost heat.
Therefore, the difference in temperature between the peripheral region of the workpiece 100 and the central region of the workpiece 100 can be reduced.

As shown in Fig. 3(c), in a plan view, the support portion 32c can be provided at a position overlapping the periphery of the workpiece 100. In this way, even if heat in the peripheral region of the workpiece 100 is lost to the inner wall of the chamber 10 as explained in Fig. 3(a), this can be compensated for. Furthermore, as explained in Fig. 3(b), the temperature of the peripheral region of the workpiece 100, from which heat easily escapes, can be increased.
Therefore, it becomes easier to reduce the difference in temperature between the peripheral region of the workpiece 100 and the central region of the workpiece 100 .

As mentioned above, the position of the support portion 32c is most preferably the position shown in FIG. 3(c) (a position overlapping the periphery of the workpiece 100) although the positions shown in FIG. 3(a) and FIG. 3(b) are also effective to a certain extent. In the case of the position shown in FIG. 3(a), the lower heat equalizer plate 34b (upper heat equalizer plate 34a) is close to the inner wall of the chamber 10, so the heat of the peripheral region of the lower heat equalizer plate 34b (upper heat equalizer plate 34a) is easily taken away. In addition, in the case of the position shown in FIG. 3(b), the peripheral position of the workpiece 100 is close to the inner wall of the chamber 10, so the heat of the peripheral region of the workpiece 100 is easily taken away. Therefore, it is most effective to provide the support portion 32c in the position shown in FIG. 3(c) (a position overlapping the periphery of the workpiece 100).

In addition, by changing the length of the support portion 32c in the axial direction of the guide portion 32b, the size of the area of the workpiece 100 that is heated by the support portion 32c can be changed. For example, the length of the support portion 32c can be changed depending on the size of the low-temperature area near the periphery of the workpiece 100.

As shown in FIG. 1, the work support portion 33 supports the underside of the work 100 inside the processing regions 30a and 30b. A plurality of work support portions 33 may be provided. The plurality of work support portions 33 are provided below the processing region 30a and below the processing region 30b. The plurality of work support portions 33 may be rod-shaped.

The upper ends of the multiple work support parts 33 are located inside the processing regions 30a, 30b and contact the underside of the work 100. For this reason, it is preferable that the shape of the upper ends of the multiple work support parts 33 is hemispherical or the like. In this way, damage to the underside of the work 100 can be suppressed. In addition, since the contact area between the underside of the work 100 and the multiple work support parts 33 can be reduced, heat is less likely to be transferred from the work 100 to the multiple work support parts 33.

The number, arrangement, spacing, etc. of the multiple work support parts 33 can be changed as appropriate depending on the size and rigidity (deflection) of the work 100. The number, arrangement, spacing, etc. of the multiple work support parts 33 can be appropriately determined by performing simulations, experiments, etc.

The heat equalizing section 34 has a plurality of upper heat equalizing plates 34a, a plurality of lower heat equalizing plates 34b, a plurality of side heat equalizing plates 34c, and a plurality of side heat equalizing plates 34d. The plurality of upper heat equalizing plates 34a, the plurality of lower heat equalizing plates 34b, the plurality of side heat equalizing plates 34c, and the plurality of side heat equalizing plates 34d are plate-shaped.

The upper heat equalizing plates 34a are provided between the workpiece 100 and the temperature control units 32 provided above the workpiece 100. The upper heat equalizing plates 34a are spaced apart from the temperature control units 32. The upper heat equalizing plates 34a are arranged in the direction in which the temperature control units 32 are arranged (the X direction in FIG. 1).

The multiple lower heat equalizing plates 34b are provided between the workpiece 100 and the multiple temperature control units 32 provided below the workpiece 100. The multiple lower heat equalizing plates 34b are spaced apart from the multiple temperature control units 32. The multiple lower heat equalizing plates 34b are arranged in the direction in which the multiple temperature control units 32 are arranged (the X direction in FIG. 1).

The side heat equalizing plates 34c are provided on both sides (X direction in FIG. 1) of the processing regions 30a, 30b in the direction in which the multiple temperature control sections 32 are arranged. The side heat equalizing plates 34c can be provided inside the cover 36. In addition, at least one temperature control section 32 can be provided between the side heat equalizing plates 34c and the cover 36, spaced apart from the side heat equalizing plates 34c and the cover 36.
By providing the temperature control section 32 between the side heat equalizing plate 34c and the cover in this manner, it is possible to prevent sublimates produced by baking the workpiece 100 from adhering to the side heat equalizing plate 34c.

The side heat equalizing plates 34d are provided on both sides of the processing regions 30a, 30b in a direction (Y direction in FIG. 1) perpendicular to the direction in which the temperature control sections 32 are arranged.
The processing regions 30a and 30b are surrounded by a plurality of upper heat equalizing plates 34a, a plurality of lower heat equalizing plates 34b, a plurality of side heat equalizing plates 34c, and a plurality of side heat equalizing plates 34d.
In addition, the side heat equalizing plate 34d on the opening/closing door 13 side may be provided on the opening/closing door 13 together with the cover 36, so that the workpiece 100 can be smoothly loaded and unloaded when the opening/closing door 13 is opened and closed.

The upper and lower heat equalizing plates 34a and 34b are preferably made of a material having high thermal conductivity, such as a metal such as aluminum, copper, or stainless steel.
Moreover, the material of the side heat equalizing plates 34c, 34d can be the same as the material of the upper heat equalizing plate 34a and the lower heat equalizing plate 34b.

Here, since the heater 32a has a shape that extends in one direction, heat is emitted radially from the central axis of the heater 32a. In this case, the shorter the distance between the central axis of the temperature control unit 32 and the area to be heated, the higher the temperature. Therefore, when multiple heaters 32a are provided facing the workpiece 100, temperature variations are likely to occur within the surface of the workpiece 100.

In this case, if an upper heat equalizing plate 34a and a lower heat equalizing plate 34b are provided, heating by the multiple heaters 32a is performed via the upper heat equalizing plate 34a and the lower heat equalizing plate 34b. That is, the heat radiated from the multiple heaters 32a is incident on the upper heat equalizing plate 34a and the lower heat equalizing plate 34b, and is radiated toward the workpiece 100 while propagating inside them in the planar direction. Therefore, it is possible to suppress the occurrence of temperature variations within the surface of the workpiece 100, and ultimately to improve the quality of the formed organic film.

Although the above example illustrates a case in which multiple upper heat equalizing plates 34a and multiple lower heat equalizing plates 34b are provided, at least one of the upper heat equalizing plates 34a and the lower heat equalizing plates 34b may be a single plate-shaped member.

The multiple heat equalizer plate support parts 35 (upper heat equalizer plate support parts) are arranged in a line in the direction in which the multiple upper heat equalizer plates 34a are arranged. The heat equalizer plate support parts 35 can be arranged directly below between the upper heat equalizer plates 34a in the direction in which the multiple upper heat equalizer plates 34a are arranged. The multiple heat equalizer plate support parts (lower heat equalizer plate support parts) that support the multiple lower heat equalizer plates 34b can also have a similar configuration.

The cover 36 is plate-shaped and covers the top, bottom, and sides of the frame 31. In this case, the cover 36 on the opening/closing door 13 side can be provided on the opening/closing door 13, as described above. The cover 36 surrounds the processing areas 30a and 30b, but for example, gaps can be provided between the covers 36, or holes or slits can be provided. In this way, the space between the inner wall of the chamber 10 and the cover 36 is connected to the processing areas 30a and 30b, so that the pressure in the internal space of the processing areas 30a and 30b becomes the same as the pressure in the space between the inner wall of the chamber 10 and the cover 36. In addition, the cover 36 covering the side of the frame 31 has holes 36a for supplying the fluid 101 to the space in which the temperature control group 3 is provided, or for discharging the fluid 101 from the space in which the temperature control group 3 is provided. The cover 36 can be made of, for example, stainless steel.

The cooling unit 40 supplies the fluid 101 through the first flow path 40a to the space in which the temperature control group 3 is provided. As described above, the space in which the temperature control group 3 is provided is surrounded by the beam 31a, the upper heat equalizing plate 34a, the lower heat equalizing plate 34b, and the cover 36.
The cooling unit 40 cools the temperature control group 3 , thereby indirectly cooling the workpiece 100 facing the temperature control group 3 .

The cooling unit 40 includes, for example, a supply source 41 and a flow rate control unit 42 .
The supply source 41 supplies the fluid 101. The supply source 41 may be, for example, a high-pressure gas cylinder or factory piping.
The fluid 101 may be, for example, dry air or an inert gas such as nitrogen gas, argon, helium, etc. However, the type of the fluid 101 is not limited to the examples given.

Here, if the fluid 101 is a gas containing oxygen, there is a risk that the guide portion 32b, which is in a high temperature state, will oxidize. Therefore, it is preferable that the fluid 101 is a gas that does not contain oxygen, for example, an inert gas such as nitrogen gas.

The temperature of the fluid 101 may be, for example, room temperature (25° C.) or lower. In this case, a cooler for cooling the fluid 101 may be provided, or the temperature of the gaseous fluid 101 may be reduced by using the heat of vaporization generated when the liquid fluid 101 is vaporized.
If the temperature of the fluid 101 is low, the temperature of the temperature control group 3 can be quickly lowered, and therefore the temperature of the workpiece 100 can be quickly lowered.

The flow rate control unit 42 , for example, starts and stops the supply of the fluid 101, and controls the flow rate and pressure of the fluid 101. The fluid control unit 42 can be, for example, a mass flow controller or a needle valve.

The controller 50 includes a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 50 is, for example, a computer.
The controller 50 controls the operation of each element provided in the organic film forming apparatus 1 based on a control program stored in the storage unit.
For example, the controller 50 controls the power applied to the heater 32a and the flow rate of the fluid 101 supplied to the temperature control group 3 via the first flow path 40a based on the detection value of a thermometer (not shown) installed in the processing regions 30a and 30b.
As will be described later, the controller 50 controls the flow rate of the fluid 101 supplied to the fluid supply units 32e and 232e via the second flow paths 40b and the supply position of the fluid 101, for example, based on the detection value of a thermometer (not shown) provided in the processing regions 30a and 30b (see FIGS. 5, 9 to 11).

Next, the operation of the organic film forming apparatus 1 will be illustrated.
First, the controller 50 moves the opening and closing door 13 away from the flange 11. Then, the workpiece 100 is carried into the chamber 10 by a transfer device (not shown).
Next, the controller 50 controls the operation of each element provided in the organic film forming apparatus 1 to carry out the organic film forming process.

FIG. 4 is a graph illustrating a process of forming an organic film.
As shown in FIG. 4, in the process of forming an organic film, a temperature increasing step (1), a heat treatment step (1), a temperature increasing step (2), a heat treatment step (2), and a cooling step are carried out in this order.

First, the temperature increasing step (1) is carried out. In the temperature increasing step (1), the internal space of the chamber 10 is depressurized to a predetermined pressure by the exhaust unit 20. The pressure at which the pressure is reduced may be any pressure at which the polyamic acid in the solution does not react with oxygen remaining in the internal space of the chamber 10 and is not oxidized. For example, the pressure at which the pressure is reduced may be 100 Pa to 1×10 ⁻² Pa. In other words, the reduction in pressure by the second exhaust unit 22 is not necessarily required, and once the pressure in the internal space of the chamber 10 reaches 10 Pa to 100 Pa by the first exhaust unit 21, heating of the workpiece 100 by the heater 32a may be started.
Furthermore, the reduced pressure is maintained in the temperature increasing step (1), the heat treatment step (1), the temperature increasing step (2), and the heat treatment step (2).

When the internal space of the chamber 10 is depressurized to a predetermined pressure, power is applied to the heater 32a. Then, as shown in FIG. 4, the temperature of the workpiece 100 increases. The process of increasing the temperature of the workpiece 100 is called the temperature increase process. In the organic film formation process according to this embodiment, the temperature increase process is performed twice (temperature increase processes (1) and (2)).

For example, in the temperature increasing step (1), the controller 50 controls the power applied to the heater 32a based on the detection value of a thermometer (not shown).
In this case, the memory unit of the controller 50 prestores the first temperature in the heat treatment step (1) and the time of the temperature increase step (1). The calculation unit of the controller 50 controls the heater 32a to reach the first temperature in the heat treatment step (1) before the time of the temperature increase step (1) has elapsed.

After the temperature increasing step (1), the heat treatment step (1) is carried out. In the heat treatment step (1), the first temperature is maintained for a predetermined time. In the organic film forming process according to this embodiment, the heat treatment step is carried out twice (heat treatment steps (1) and (2)).

In the heat treatment step (1), the workpiece 100 is heated at a first temperature for a predetermined time to remove moisture, gas, etc. contained in the solution. The first temperature may be, for example, 100° C. to 200° C.
For example, the controller 50 detects the temperature of the workpiece 100 using a thermometer (not shown), and controls the power applied to the heater 32a so that the workpiece 100 has a first temperature.

By carrying out the heat treatment step (1), it is possible to prevent moisture and gas contained in the solution from being contained in the formed organic film. Depending on the components of the solution, the heat treatment step (1) can be carried out multiple times at different temperatures, or the heat treatment step (1) can be omitted.

After the heat treatment step (1), a temperature increasing step (2) is performed. For example, the controller 50 controls the power applied to the heater 32a based on a detection value of a thermometer (not shown).
In this case, the memory unit of the controller 50 prestores the second temperature in the heat treatment step (2) and the time for the temperature increase step (2). The calculation unit of the controller 50 controls the heater 32a to reach the second temperature in the heat treatment step (2) before the time for the temperature increase step (2) has elapsed.

After the temperature increasing step (2), the heat treatment step (2) is carried out. In the heat treatment step (2), the second temperature is maintained for a predetermined time, and an organic film is formed from the solution. The second temperature may be a temperature at which imidization occurs, for example, 300°C or higher. For example, when forming an organic film with a high degree of molecular chain packing, the second temperature may be set to 400°C to 600°C. For example, the controller 50 detects the temperature of the workpiece 100 using a thermometer (not shown), and controls the power applied to the heater 32a so that the workpiece 100 reaches the second temperature.

After the heat treatment step (2), a cooling step is performed in which the temperature of the workpiece 100 on which the organic film is formed is lowered by the cooling unit 40. In the cooling step, the workpiece 100 is cooled to a temperature at which the workpiece 100 can be carried out.
The temperature at which the workpiece 100 can be unloaded is at least a temperature (for example, 100° C. or lower) at which the quality of the film formed on the workpiece 100 does not change even when exposed to air containing oxygen.

For example, if the temperature of the workpiece 100 to be removed is room temperature, it will be easier to remove the workpiece 100. However, if cooling is performed so that the temperature of the workpiece 100 is room temperature, the temperature of the internal space of the chamber 10 and the heater 32a will be close to room temperature, and therefore the time required for the heating process (1) when processing the next workpiece 100 will be longer. In other words, there is a risk of a decrease in productivity.

Therefore, in the cooling process according to this embodiment, the temperature of the workpiece 100 is set to about 50°C to 90°C (third temperature). In this way, the temperature of the internal space of the chamber 10 and the temperature of the heater 32a do not become excessively low, so that the time required for the heating process (1) when the next workpiece 100 is heat-treated can be prevented from becoming too long.

In addition, in the cooling process, the workpiece 100 can be directly cooled by supplying the fluid 101 to the internal space of the chamber 10. However, since the volume of the internal space of the chamber 10 is large, it is difficult to cool high-temperature members, such as the heater 32a and the soaking section 34. Even if the workpiece 100 is cooled by supplying the fluid 101 to it, if the temperature of the members around the workpiece 100 is high, heat is transferred from the members to the workpiece 100. As a result, even if the workpiece 100 is directly cooled, it takes time to cool the workpiece 100. In addition, a large amount of fluid 101 is required, so the running cost increases. Furthermore, if the fluid 101 is supplied to the internal space of the chamber 10, there is a risk that the sublimate that is generated when the solution is heated and adheres to the inner wall of the chamber 10, etc., will peel off and adhere to the organic film. If the sublimate adheres to the organic film, the quality of the organic film will deteriorate.

Therefore, in the cooling process according to this embodiment, the fluid 101 is supplied to the space in which the temperature control group 3 is provided (the space surrounded by the beam 31a, the upper heat equalizing plate 34a, the lower heat equalizing plate 34b, and the cover 36) to indirectly cool the workpiece 100. In this way, the components around the workpiece 100 (the heater 32a and the heat equalizing section 34) can be directly cooled. If the temperature of the components around the workpiece 100 is reduced, the time required to cool the workpiece 100 can be shortened. In addition, since the volume of the space in which the temperature control group 3 is provided is small, the amount of fluid 101 can be reduced. This allows the running costs to be reduced.

In the cooling process, the controller 50 closes the valves 25 of the first exhaust section 21 and the second exhaust section 22. The controller 50 also controls the cooling section 40 to supply the fluid 101 to the space in which the temperature control group 3 is provided. The supply of the fluid 101 to the space in which the temperature control group 3 is provided indirectly cools the workpiece 100. The controller 50 maintains the supply of the fluid 101 until the detection value of a thermometer (not shown) reaches the third temperature. When the detection value of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10 reaches the same pressure as atmospheric pressure, the controller 50 opens the valve 25 of the third exhaust section 23 and discharges the fluid 101 to the outside of the chamber 10.

As described below, in the cooling process, the fluid 101 may be supplied to the inside of the guide portion 32b provided in the temperature control portion 132, 232. In this manner, the workpiece 100 can be indirectly cooled. Furthermore, if the fluid 101 is supplied to the space in which the temperature control group 3 is provided and to the inside of the guide portion 32b provided in the temperature control portion 132, 232, the time required for the cooling process can be shortened.

Next, the controller 50 moves the opening/closing door 13 away from the flange 11. Then, the workpiece 100 is carried out of the chamber 10 by a transfer device (not shown).
Thereafter, the above-mentioned procedure can be repeated to form a plurality of organic films.

FIG. 5 is a schematic cross-sectional view illustrating a temperature control unit 132 according to another embodiment.
As shown in FIG. 5, the temperature control unit 132 includes, for example, a heater 32a, a guide unit 32b, a support unit 32c, a holder 32d, and a fluid supply unit 32e.
As described above, the heat of the peripheral region of the workpiece 100 is more easily transferred to the inner wall of the chamber 10 than the heat of the central region of the workpiece 100. Therefore, the temperature of the peripheral region of the workpiece 100 is likely to be lower than the temperature of the central region of the workpiece 100. In this case, if the support portion 32c is provided near the peripheral region of the workpiece 100, the temperature of the peripheral region of the workpiece 100 can be increased. However, even in this case, the difference between the temperature of the central region of the workpiece 100 and the temperature of the peripheral region of the workpiece 100 may still be large. In addition, for example, when the output value of the heater 32a is increased in order to increase the temperature of the peripheral region of the workpiece 100, the temperature of the central region of the workpiece 100 may also become too high.

Therefore, the temperature control section 132 is provided with a fluid supply section 32 e that controls the temperature of the area of the guide section 32 b that faces the central area of the workpiece 100 .
5, the fluid supply unit 32e supplies, for example, a fluid 101 to the inside of the guide unit 32b. For example, the fluid 101 is supplied to a position inside the guide unit 32b facing the central region of the workpiece 100. The fluid 101 supplied to the inside of the guide unit 32b is discharged to the outside of the guide unit 32b through a gap between the inner wall of the hole 32c1 and the heat generating unit 32a1, or a gap between the inner wall of the guide unit 32b and the support unit 32c.

The fluid supply unit 32e can be connected to, for example, the second flow path 40b shown in FIG. 1. In addition, a fluid control unit 32e1 can be provided that controls the supply and stop of the fluid 101, the flow rate and pressure of the fluid 101, and the like. The fluid control unit 32e1 can be, for example, a mass flow controller or a needle valve.

By supplying the fluid 101, the temperature of the area of the guide portion 32b facing the central area of the workpiece 100 decreases. Therefore, it is possible to prevent the temperature of the central area of the workpiece 100 from becoming too high compared to the temperature of the peripheral area of the workpiece 100. In other words, it is possible to reduce the temperature difference between the central area and the peripheral area of the workpiece 100.

In addition, by controlling the flow rate and pressure of the fluid 101 using the fluid control unit 32e1, the temperature of the area of the guide unit 32b facing the central area of the workpiece 100, and ultimately the temperature of the central area of the workpiece 100, can be controlled.
Moreover, by changing the position where the fluid 101 is supplied, the position of the region of the workpiece 100 where the temperature is to be controlled can be changed.
Furthermore, the control of the fluid 101 may be performed together with the control of the power applied to the heater 32a, or may be performed after the application of power to the heater 32a is stopped.

This type of control applies to the above-mentioned temperature increasing step (1), heat treatment step (1), temperature increasing step (2), and heat treatment step (2). In the above-mentioned cooling step, since cooling is simply required, the application of power to the heater 32a is stopped and a predetermined flow rate of the fluid 101 is allowed to flow.
As described above, the temperature increase process (1), the heat treatment process (1), the temperature increase process (2), and the heat treatment process (2) each require processing under a predetermined pressure. Therefore, when supplying the fluid 101, it is preferable to perform exhaust using the exhaust section 60 described later so that the pressure in the processing region 30a and the processing region 30b can be maintained at a predetermined pressure.

FIG. 6 is a schematic cross-sectional view illustrating a support portion 132c according to another embodiment.
FIG. 7 is a schematic cross-sectional view of the support portion 132c taken along line AA in FIG.
As shown in FIG. 6 and FIG. 7, the support portion 132c is provided with a hole 132c1 (corresponding to an example of a second hole) penetrating in the axial direction. The internal space of the guide portion 32b and the internal space of the chamber 10 are connected via the hole 132c1. The hole 132c1 serves as an outlet for the fluid 101 supplied to the inside of the guide portion 32b. If the hole 132c1 is provided, the fluid 101 can be easily discharged, so that the flow rate of the fluid 101 supplied to the inside of the guide portion 32b can be increased. Therefore, the temperature control of the guide portion 32b and therefore the temperature control of the workpiece 100 can be easily performed. In this embodiment, the fluid 101 is also supplied in the temperature increase process (1), the heat treatment process (1), the temperature increase process (2), and the heat treatment process (2).
The fluid 101 is supplied by a mechanism similar to the fluid supply unit 32e shown in FIG.

At least one hole 132c1 can be provided. The support portion 132c illustrated in Figures 6 and 7 has multiple holes 132c1. The number and arrangement of the holes 132c1 are not limited to those illustrated. The number and arrangement of the holes 132c1 can be changed as appropriate depending on, for example, the diameter dimension of the support portion 132c, the flow rate of the fluid 101, etc.

As shown in FIG. 6, the fluid 101 is heated by contact with the heat generating portion 32a1 and becomes a high-temperature fluid at approximately the same temperature as the heat generating portion 32a1, and the high-temperature fluid 101a discharged from the hole 132c1 reaches the inner wall (opening door 13) of the chamber 10. As a result, heat is constantly supplied to the inner wall (opening door 13) of the chamber 10, making it difficult to lower the temperature of the opening door 13. If the temperature of the opening door 13 is kept high, the cooling efficiency may deteriorate when moving from the heating process to the cooling process, and the cooling time may be long. Therefore, hereinafter, a configuration for maintaining the temperature of the opening door 13 at an appropriate level (maintaining a temperature that does not hinder cooling in the cooling process) will be described.

FIG. 8 is a schematic cross-sectional view of the opening and closing door 13 taken along line BB in FIG.
As shown in FIG. 8, the area of the opening/closing door 13 where the fluid 101a discharged from the hole 132c1 reaches can be an uneven surface 13a. The uneven surface 13a can have at least one of a plurality of recesses and a plurality of protrusions. That is, at least one of a plurality of recesses and a plurality of protrusions is provided in the area of the inner wall surface of the chamber 10 facing the hole 132c1. The recesses may be grooves or holes. The protrusions may be protrusions or linear bodies. That is, the surface area of the area where the fluid 101a reaches can be made larger than that in the case of a flat surface. The number, size, arrangement, shape, etc. of the plurality of recesses and the plurality of protrusions can be appropriately changed depending on the flow rate, temperature, etc. of the fluid 101a.

If the area where the fluid 101a reaches is an uneven surface 13a, it becomes easier to transfer the heat of the fluid 101a to the opening and closing door 13. Therefore, the heat of the fluid 101a can be efficiently discharged to the outside of the opening and closing door 13. With such a configuration, it is possible to prevent the temperature of the opening and closing door 13 from becoming too high during the heating process, and it becomes easier to cool the internal space of the chamber 10 in the subsequent cooling process.

As described above, a cooling section 16 (e.g., a water jacket) can be provided on the outer surface of the opening/closing door 13. Therefore, as shown in FIG. 8, the cooling capacity of the cooling section 16 provided at the position facing the uneven surface 13a can be made higher than the cooling capacity of the cooling section 16 provided in other areas of the opening/closing door 13. In other words, the cooling capacity of the cooling section 16 in the area of the outer wall surface of the chamber 10 facing the hole 132c1 can be made higher than the cooling capacity of the cooling section 16 in areas of the outer wall surface of the chamber 10 other than the area facing the hole 132c1.

For example, as shown in FIG. 8, the piping pitch of the cooling section 16 provided at a position facing the uneven surface 13a can be narrowed. Also, the cooling section 16 provided at a position facing the uneven surface 13a and the cooling section 16 provided in another area can be provided separately. Then, for example, the amount of refrigerant flowing through the cooling section 16 provided at a position facing the uneven surface 13a can be increased, or the temperature of the refrigerant can be lowered.

In this way, the heat of the fluid 101a can be more efficiently discharged to the outside of the opening and closing door 13. In addition, it becomes easier to cool the internal space of the chamber 10.

Next, another embodiment will be described with reference to FIG. 9 and FIG.
FIG. 9 is a schematic cross-sectional view illustrating a temperature control unit 232 according to another embodiment.
As shown in FIG. 9, the temperature control unit 232 includes, for example, a heater 32a, a guide unit 32b, a support unit 32c, a holder 32d, and a plurality of fluid supply units 232e.
The fluid supply unit 232e supplies, for example, the fluid 101 to the inside of the guide unit 32b. The fluid supply unit 232e can also discharge the fluid 101 supplied to the inside of the guide unit 32b.

The fluid supply unit 232e may be provided with a fluid control unit 232e1. The fluid control unit 232e1 may be connected to, for example, the second flow path 40b shown in FIG. 1. The fluid control unit 232e1 supplies and stops the supply of the fluid 101 to the inside of the guide unit 32b, controls the flow rate and pressure of the fluid 101, and discharges the fluid 101 supplied to the inside of the guide unit 32b. The fluid control unit 232e1 may have, for example, two on-off valves or may be a three-way valve. The fluid control unit 232e1 may also have the function of controlling the flow rate and pressure of the fluid 101.

FIG. 10 is a schematic diagram illustrating the operation of the fluid control unit 232e1.
The fluid control unit 232e1 illustrated in Fig. 10 has two on-off valves. One on-off valve can be connected to the second flow path 40b. The other on-off valve can be connected to an exhaust unit 60 (corresponding to an example of a second exhaust unit) or to piping in a factory. The exhaust unit 60 will be described later.

For example, as shown in FIG. 10, one of the on-off valves of the fluid control unit 232e1 located in the center is opened to supply fluid 101 into the inside of the guide unit 32b. The other on-off valve of the fluid control unit 232e1 located in the center is closed. For example, one of the on-off valves of the fluid control unit 232e1 located on the left side is closed to prevent fluid 101 from being supplied into the inside of the guide unit 32b. The other on-off valve of the fluid control unit 232e1 located on the left side is opened to discharge the fluid 101 supplied into the inside of the guide unit 32b. For example, the two on-off valves of the fluid control unit 232e1 located on the right side are closed.

In this way, as shown in FIG. 10, the fluid 101 can be caused to flow from the center to the left side inside the guide portion 32b. Therefore, the temperature of the left region of the guide portion 32b can be controlled.

For example, one of the on-off valves of the fluid control unit 232e1 on the right side is closed to prevent the fluid 101 from being supplied to the inside of the guide unit 32b. The other on-off valve of the fluid control unit 232e1 on the right side is opened to discharge the fluid 101 supplied to the inside of the guide unit 32b. For example, the two on-off valves of the fluid control unit 232e1 on the left side are kept closed.

In this way, as shown in FIG. 10, the fluid 101 can be caused to flow from the center to the right side inside the guide portion 32b. Therefore, the temperature of the right region of the guide portion 32b can be controlled.

As described above, if multiple fluid supply units 232e each having a fluid control unit 232e1 are provided, the area of the guide unit 32b where temperature control is performed can be changed. Therefore, the temperature of the workpiece 100 can be more appropriately controlled.

This type of control applies to the above-mentioned heating process (1), heat treatment process (1), heating process (2), and heat treatment process (2). In the above-mentioned cooling process, since cooling is simply required, the application of power to the heater 32a is stopped and a predetermined flow rate of the fluid 101 is allowed to flow.

FIG. 11 is a piping diagram of the fluid 101.
As shown in FIG. 11, the first flow path 40a is connected to the space in which the temperature control groups 3a, 3ab, and 3b are provided.
The first flow path 40a has, for example, a supply source 41, a pipe 43, a flow rate control unit 42 , and a pipe 44. One flow rate control unit 42 is provided between the pipe 44 and the supply source 41. Specifically, the flow rate control unit 42 is connected to the pipe 43.

The pipe 43 has a three-way structure with three ends 43a, 43b, and 43c. The pipe 43 is made of a metal such as stainless steel. For example, the end 43a of the pipe 43 is connected to the supply source 41. The end 43b of the pipe 43 is connected to the flow rate control unit 42. The pipe 43 may have a structure in which three straight pipes are connected to a three-way joint.
The pipe 43 is connected to the pipe 44 via a flow rate control unit 42 .

The pipe 44 has a structure in which the end that is not connected to the flow control unit 42 branches into three. For example, the three branched ends are called branch 44a, branch 44ab, and branch 44b. Each of branch 44a, 44ab, and 44b is connected to a space in which multiple temperature control units 32 are provided.

The branches 44a, 44ab, and 44b are connected to a hole 36a provided in one cover 36 that covers the side of the frame 31. Most of the fluid 101 supplied to the space in which the temperature control groups 3a, 3ab, and 3b are provided is discharged from the hole 36a in the other cover 36 into the internal space of the chamber 10.

There is a small gap between the upper heat equalizer plate 34a and the lower heat equalizer plate 34b, which form the space in which the temperature control group 3 is provided, and the beam 31a or the cover 36. Therefore, a part of the fluid 101 supplied to the space in which the temperature control groups 3a, 3ab, and 3b are provided is discharged to the processing areas 30a and 30b through the gaps in the upper heat equalizer plate 34a and the gaps in the lower heat equalizer plate 34b. Note that it is preferable that the conductance of the gaps in the upper heat equalizer plate 34a and the gaps in the lower heat equalizer plate 34b be greater than the conductance of the holes 36a in the other cover 36 so that most of the fluid 101 supplied to the space in which the temperature control groups 3a, 3ab, and 3b are provided is discharged through the holes 36a in the other cover 36.

The second flow path 40b is connected to the temperature control units 32, 232 (32e1, 232e1) provided in the temperature control groups 3a, 3ab, 3b.
The second flow path 40b has, for example, a supply source 41, a pipe 43, a pipe 45, a flow rate control unit 42 , and a pipe 46. The supply source 41 can be shared with the first flow path 40a. The flow rate control unit 42 can be omitted.

One end of the pipe 45 is connected to the end 43c of the pipe 43 by a joint (not shown). The other end of the pipe 45 branches into three parts. The branched parts are referred to as branch portion 45a, branch portion 45ab, and branch portion 45b. In this embodiment, branch portion 45a, branch portion 45ab, and branch portion 45b have the same structure, so to simplify the explanation, only branch portion 45a will be explained.

The branching portion 45a can further have multiple branches. In this embodiment, the branching portion 45a has three branches because the processing area 30a (30b) is divided into a central portion and portions on both sides thereof for temperature control.

The three branches of the branch portion 45a are referred to as a branch portion 45a1, a branch portion 45a2, and a branch portion 45a3.
The branch portion 45a1, the branch portion 45a2, and the branch portion 45a3 are connected to the flow control portion 42. The branch portion 45a1, the branch portion 45a2, and the branch portion 45a3 are each connected to the pipe 46 via the flow control portion 42.

The end of the pipe 46 opposite to the end connected to the flow rate control unit 42 is branched into the same number of temperature control units 32 provided in the central part of the processing region 30a (30b) and on both sides of the central part. In this embodiment, the pipe 46 has a six-pronged structure having six ends. The pipe 46 may have a structure in which multiple joints and multiple straight pipes are combined, or a structure in which multiple joints and multiple tubes are combined.
The pipe 46 can be connected to, for example, the fluid control units 32e1, 232e1 (see Figures 5 and 9).

The exhaust air from the fluid control unit 232e1 may be connected to piping in a factory, for example.
In this case, as shown in Fig. 10 and Fig. 11, the exhaust side of the fluid control unit 232e1 can be connected to the exhaust unit 60. The exhaust unit 60 sucks the fluid 101 discharged from the fluid control unit 232e1 at a pressure lower than the internal pressure of the chamber 10. The exhaust unit 60 can be equipped with, for example, a tank and an exhaust pump. In this way, it becomes easy to discharge the fluid 101 supplied inside the guide unit 32b to the outside of the guide unit 32b. Therefore, the flow of the fluid 101 inside the guide unit 32b described above becomes smooth. As a result, it becomes easy to partially control the guide unit 32b.

The temperature of the central region in the processing region 30a (30b) is likely to be higher than the temperature of the regions located on either side of the central region. If temperature variations occur within the processing region 30a (30b), there is a risk of temperature variations occurring within the surface of the workpiece 100. If there is temperature variation within the surface of the workpiece 100, the composition of the organic film may become non-uniform, resulting in a risk of reduced quality. In this case, if the fluid 101 is controlled separately in the central region in the processing region 30a (30b) and in the regions located on either side of the central region, it is possible to suppress temperature variations occurring in the workpiece 100.

For example, the flow rate control units 42 provided in the branch portion 45a may be controlled so that the flow rate of the fluid 101 in the branch portion 45a2 is greater than the flow rates of the fluid 101 in the branch portions 45a1 and 45a3 (see FIG. 11). The branch portions 45ab and 45b may be controlled in a similar manner.

Although the embodiments have been described above, the present invention is not limited to these descriptions.
Furthermore, any modifications to the above-described embodiments made by those skilled in the art are also encompassed within the scope of the present invention as long as they incorporate the features of the present invention.
Furthermore, the elements of each of the above-described embodiments can be combined to the greatest extent possible, and combinations of these are also included within the scope of the present invention as long as they include the features of the present invention.

1 organic film forming apparatus, 3 temperature control group, 10 chamber, 20 exhaust section, 30 processing section, 30a processing area, 30b processing area, 32 temperature control section, 32a heater, 32a1 heat generating section, 32b guide section, 32c support section, 32c1 hole, 32c2 tapered surface, 32e fluid supply section, 32e1 fluid control section, 40 cooling section, 50 controller, 60 exhaust section, 100 work, 101 fluid, 132 temperature control section, 132c1 hole, 232 temperature control section, 232e fluid supply section, 232e1 fluid control section

Claims (10)

1. An organic film forming apparatus capable of heating a workpiece having a substrate and a solution containing an organic material and a solvent applied to an upper surface of the substrate in an atmosphere reduced in pressure below atmospheric pressure,
a chamber capable of maintaining an atmosphere reduced in pressure below atmospheric pressure;
a first exhaust unit capable of exhausting the inside of the chamber;
a guide portion facing the work supported in the chamber , having a cylindrical shape and extending in one direction, with both open ends provided inside the chamber;
a support portion provided inside the guide portion and having a first hole passing therethrough in an axial direction;
a heater that is detachably provided in the first hole and has a heat generating portion that extends along the guide portion;
An organic film forming apparatus comprising: 2. The organic film forming apparatus according to claim 1 , wherein the support portion is provided at a position overlapping a periphery of the workpiece when viewed from a direction perpendicular to a surface of the workpiece . a hole for inserting the heater into the guide portion is provided in an outer wall of the chamber;
3. The organic film forming apparatus according to claim 1, wherein the outer wall is provided with a holder for airtightly connecting the heater to the outer wall. 4. The organic film forming apparatus according to claim 1 , wherein the opening of the first hole is provided with a tapered surface. The organic film forming apparatus according to any one of claims 1 to 4, further comprising at least one fluid supply unit capable of supplying a fluid inside the guide unit. A plurality of the fluid supply units are provided,
6. The organic film forming apparatus according to claim 5, wherein each of the plurality of fluid supplying parts has a fluid control part capable of controlling the fluid supplied to the inside of the guide part. The fluid control unit is further capable of controlling the discharge of the fluid supplied to the inside of the guide unit,
The fluid discharge side of the fluid control unit is connected to a second exhaust unit,
7. The organic film forming apparatus according to claim 6, wherein the second exhaust section is capable of sucking the fluid discharged from the fluid control section at a pressure lower than the internal pressure of the chamber. The support portion has a second hole passing therethrough in the axial direction,
8. The organic film forming apparatus according to claim 1, wherein an internal space of the guide portion is connected to an internal space of the chamber through the second hole. The organic film forming apparatus according to claim 8, wherein at least one of a plurality of recesses and a plurality of protrusions is provided in the region of the inner wall surface of the chamber facing the second hole. A cooling unit is further provided on an outer wall surface of the chamber,
10. The organic film forming apparatus according to claim 8, wherein the cooling capacity of the cooling section in a region of the outer wall surface of the chamber facing the second hole is higher than the cooling capacity of the cooling section in a region of the outer wall surface of the chamber other than the region facing the second hole.

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