JP7491566B2 - Sensor system, child tag, parent tag and information processing program - Google Patents

Description

Patent Law Article 30, Paragraph 2 Applicable Monthly Machinery and Tools Vol. 10, No. 3 (Serial No. 108) Japan Industrial Publishing

The present invention relates to a sensor system capable of detecting the surface temperature of a fixed mold and a movable mold, such as a die-casting mold or an injection molding mold, and a child tag, a parent tag, and an information processing program included in the sensor system.

In die casting of zinc, aluminum, etc., casting defects caused by abnormal increases in mold surface temperature are a major issue. The rise in surface temperature can lead to insufficient solidification within the set cycle time or gas accumulation inside the casting, resulting in deformation and dimensional defects. The cause of the rise in mold surface temperature is a deterioration in the cooling efficiency inside the mold, such as deterioration of the cooling water or clogging of the cooling pipes due to rust or foreign matter. In addition, mold surface temperature can rise due to mold deterioration, temperature changes in the casting environment, and fluctuations in casting conditions, and changes can occur even during mass production in a day, causing casting defects and becoming a major problem. To address this issue, it is necessary to directly monitor the mold surface temperature in addition to monitoring the mold temperature, cooling water temperature, and temperature controller.

The need to monitor mold surface temperatures is not limited to die casting molds, but is also applicable to injection molding, where monitoring for abnormal increases in mold surface temperatures during mass production that directly lead to defective molded products is essential to prevent molding defects such as deformation and dimensional defects. It has also been discovered that changes in mold surface temperatures are related to defective parts in rubber molds, vacuum molding, and more recently in press molds, and there is an increasing need to measure these mold surface temperatures.

Futaba Corporation, "Mold Marshalling System Resin Temperature Measurement System Catalog", [online], [searched on September 11, 2020], Internet <URL: https://premium.ipros.jp/futaba/catalog/detail/439484/> Chino Corporation, "Small Thermal Image Sensor TP Series", [online], [searched on September 11, 2020], Internet <URL: https://www.chino.co.jp/wp/wp-content/themes/chino/pdf/tp-l.pdf> Rika Kogyo Co., Ltd., "Mold surface temperature monitoring (magnetic temperature sensor)", [online], [searched on September 11, 2020], Internet <URL: https://www.rkcinst.co.jp/applications/7897/>

One method for measuring the mold surface temperature is to directly measure the mold surface using a thermocouple sensor (Non-Patent Documents 1 and 3). However, with the direct measurement method, the sensor must be installed inside the mold, which can complicate or modify the mold structure, and requires installation for each mold, which can be costly.

Another method for measuring the mold surface temperature is a remote measurement method (Non-Patent Document 2) that uses a non-contact thermosensor such as a camera or an infrared sensor. However, in the remote measurement method, the sensor must be installed outside, and in the case of die-casting molds in particular, measurements must be taken in a harsh environment where the temperature near the mold is close to 400 degrees, and there is gas generated during solidification, spray, air blow, dust, and splattering of molten material, and an effective sensor system has not been put to practical use. On the other hand, injection molding molds are relatively unaffected by environmental temperatures, dust, gas, etc., but many injection molding products are small, and there is an issue that measuring the macroscopic temperature distribution is not suitable for measuring temperature changes in detail, and an effective mold surface temperature sensor system has not been put to practical use.

On the other hand, there are also issues with sensor systems. In recent years, various sensors such as MEMS temperature sensors have been developed and miniaturized. However, in addition to sensors, users need data settings and processing systems according to usability, such as pass/fail judgment of temperature limits for sensing data that differs for each part, measurement timing, time, and temperature measurement conditions that correspond to manufacturing conditions, and even simultaneous measurement of fixed and movable molds. There is a demand for a mold surface temperature sensing system that combines sensors and information processing programs.

In view of the above circumstances, the object of the present invention is to provide a sensor system that can better detect the surface temperatures of the fixed mold and the movable mold and can appropriately process the detected surface temperatures.

A sensor system according to one aspect of the present invention includes:
a first wireless communication interface;
A first temperature sensor capable of detecting a mold surface temperature, which is the temperature of the surface of the mold;
a temperature detection unit that controls the first temperature sensor to detect the mold surface temperature and outputs the mold surface temperature via the first wireless communication interface;
A first child tag having
an information processing device having a processing unit for processing the mold surface temperature output by the first child tag;
Equipped with:

The sensor system is
a second wireless communication interface;
A second temperature sensor capable of detecting a movable-side mold surface temperature, which is the temperature of the surface of the movable-side mold;
a movable-side temperature detection unit that controls the second temperature sensor to detect the movable-side mold surface temperature and outputs the movable-side mold surface temperature via the second wireless communication interface;
and a second child tag having
the first temperature sensor of the first child tag is capable of detecting a fixed-side mold surface temperature, which is a temperature of a surface of a fixed-side mold that is paired with the movable-side mold,
the temperature detection unit of the first child tag is a fixed-side temperature detection unit that controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface,
The processing unit synchronously processes the fixed-side mold surface temperature outputted by the first child tag and the movable-side mold surface temperature outputted by the second child tag.

According to this embodiment, the surface temperature of the fixed side mold and the surface temperature of the movable side mold that is paired with the fixed side mold can be processed in a synchronized manner, resulting in high usability.

The first child tag is
a vibration/acceleration sensor capable of detecting vibration or acceleration of the movable die;
a mold state detection unit that detects a mold open limit state in which the movable mold is completely open and a closing start state in which the movable mold starts closing, based on the vibration or acceleration;
a blockage start signal output unit that outputs, when the blockage start state is detected, a blockage start signal indicating that the blockage start state has been detected via the first wireless communication interface;
and
When the mold open limit state is detected, the fixed-side temperature detection unit controls the first temperature sensor to detect the fixed-side mold surface temperature,
When the movable side temperature detection unit of the second child tag receives a temperature detection request signal that is output as a trigger when the first child tag outputs the blockage start signal, it controls the second temperature sensor to detect the movable side mold surface temperature.

According to this embodiment, the timing for detecting the fixed side mold surface temperature and the movable side mold surface temperature is determined based on the periodic vibration or acceleration of the movable side mold. This makes it possible to detect the fixed side mold surface temperature and the movable side mold surface temperature for each cycle of the movable side mold operation, and as a result, the fixed side mold surface temperature and the movable side mold surface temperature can always be processed synchronously.

the first child tag further includes a first shutter that opens and closes to expose and shield the first temperature sensor;
the fixed-side temperature detection unit of the first child tag opens the first shutter to expose the first temperature sensor only when controlling the first temperature sensor to detect the fixed-side mold surface temperature;
the second child tag further includes a second shutter that opens and closes to expose and shield the second temperature sensor;
The movable side temperature detection unit of the second child tag opens the second shutter to expose the second temperature sensor only when it controls the second temperature sensor to detect the movable side mold surface temperature.

This minimizes the time that the first and second temperature sensors are exposed, thereby preventing deterioration or failure of the first and second temperature sensors.

when the mold open limit state is detected, the fixed-side temperature detection unit of the first child tag opens the first shutter to expose the first temperature sensor, controls the first temperature sensor to detect the fixed-side mold surface temperature, and after detection, closes the first shutter to shield the first temperature sensor;
When the movable side temperature detection unit of the second child tag receives the temperature detection request signal, it opens the second shutter to expose the second temperature sensor, controls the second temperature sensor to detect the movable side mold surface temperature, and after detection closes the second shutter to shield the second temperature sensor.

When the mold open limit state is detected, the first shutter is opened, so that the timing for exposing the first temperature sensor can be reliably set to immediately before temperature detection. When a temperature detection request signal is received, the second shutter is opened, so that the timing for exposing the second temperature sensor can be reliably set to immediately before temperature detection. As a result, by minimizing the time for which the first and second temperature sensors are exposed, it is possible to more reliably prevent deterioration or failure of the first and second temperature sensors.

the fixed-side mold surface temperature includes a plurality of fixed-side mold surface area temperatures, each of a plurality of areas obtained by two-dimensionally dividing the surface of the fixed-side mold,
the movable-side mold surface temperature includes a plurality of movable-side mold surface area temperatures in each of a plurality of areas obtained by two-dimensionally dividing the surface of the movable mold,
The processing unit includes:
Compare the absolute values of the multiple fixed side mold surface area temperatures with a first threshold value, compare the absolute values of the multiple movable side mold surface area temperatures with a second threshold value, and output the comparison result, and/or compare the gradient of the multiple fixed side mold surface area temperatures with a third threshold value, output the comparison result, and compare the gradient of the multiple movable side mold surface area temperatures with a fourth threshold value, and output the comparison result.

This makes it possible to output the temperature of multiple mold surface areas in each of multiple areas obtained by dividing the surface of the mold into two dimensions, even for small injection molding molds. This allows the user to know the temperature (absolute value, gradient) of the fine details of a small mold.

The sensor system further includes a parent tag having a mold surface temperature transfer unit that receives the fixed side mold surface temperature output by the first child tag and the movable side mold surface temperature output by the second child tag, and transfers them in synchronization to the information processing device.

According to this embodiment, not only are the fixed side mold surface temperature and the movable side mold surface temperature detected for each cycle of the movable side mold operation, but the timing of transfer to the information processing device is synchronized, so that the fixed side mold surface temperature and the movable side mold surface temperature can be always processed in a synchronized manner with even greater reliability.

The parent tag further has a temperature detection request unit that receives the blockage start signal output by the first child tag and outputs the temperature detection request signal to the second child tag using the reception as a trigger.

According to this embodiment, the parent tag outputs a temperature detection request signal directly to the second child tag without communicating with an information processing device, so there is a short gap between the detection timing of the fixed side mold surface temperature of the first child tag and the detection timing of the movable side mold surface temperature of the second child tag. In other words, the fixed side mold surface temperature and the movable side mold surface temperature can be detected almost simultaneously.

A plurality of pairs of the first child tag and the second child tag are connectable to the parent tag;
the parent tag synchronously transfers the fixed-side mold surface temperature and the movable-side mold surface temperature for each pair;
The processing unit processes the fixed-side mold surface temperature and the movable-side mold surface temperature in synchronization with each other for each pair.

Multiple pairs of the first and second child tags are typically installed on multiple target machines installed at the same site (such as a manufacturing plant). One parent tag transfers communications from the multiple pairs of the first and second child tags to an information processing device. Therefore, if it is desired to obtain the surface temperatures of multiple target machines, by attaching the first and second child tags to multiple target machines, one parent tag will send communications from multiple pairs of the first and second child tags to an information processing device, eliminating the need to install expensive equipment on each of the multiple target machines, and allowing the sensor system to be installed easily and inexpensively.

The first child tag is attachable to the movable mold;
The second daughter tag is attachable to the stationary mold.

As a result, the first and second child tags are small and lightweight enough to be attached to the movable and fixed molds, making it easier to introduce them to a large number of target machines. Also, for example, if you want to obtain the mold surface temperature of an old target machine, you can simply attach the first and second child tags to the old target machine, making it possible to introduce the sensor system easily and inexpensively.

the first temperature sensor is a MEMS temperature sensor capable of detecting, as the fixed-side mold surface temperature, a plurality of fixed-side mold surface area temperatures in each of a plurality of areas obtained by two-dimensionally dividing the surface of the fixed-side mold,
The second temperature sensor is a MEMS temperature sensor capable of detecting, as the movable side mold surface temperature, the temperatures of a plurality of movable side mold surface areas in each of a plurality of areas obtained by two-dimensionally dividing the surface of the movable side mold.

This makes it possible to output the temperature of multiple mold surface areas in each of multiple areas obtained by dividing the surface of the mold into two dimensions, even for small injection molding molds. This allows the user to know the temperature (absolute value, gradient) of the fine details of a small mold.

The fixed mold and the movable mold are a pair of die-casting molds, injection molding molds, rubber molding molds, vacuum molding molds, or press molds.

It is expected that die casting dies, injection molding dies, rubber molding dies, vacuum molding dies or press dies will repeat periodic displacements, with one cycle being from a maximum mold open state to a maximum mold closed state and then back to a maximum mold open state. For this reason, the fixed side mold surface temperature and the movable side mold surface temperature can be detected for each cycle of the operation of the movable side mold, which is expected to operate cyclically, and as a result, the fixed side mold surface temperature and the movable side mold surface temperature can always be processed synchronously.

The sensor system is
a plurality of said first child tags;
a plurality of said second child tags;
Equipped with
Each of the first child tags is capable of detecting a surface temperature of the stationary mold at a plurality of different portions of the surface of the stationary mold,
Each of the second child tags is capable of detecting the movable mold surface temperature at a plurality of different portions of the surface of the movable mold,
The processing unit includes:
The stationary-side mold surface temperature of the plurality of different portions output by the plurality of first child tags is synthesized to obtain the stationary-side mold surface temperature of the entire surface of the stationary-side mold;
The movable side mold surface temperatures of the multiple different parts output by the multiple second child tags may be combined to obtain the movable side mold surface temperature of the entire surface of the movable side mold.

If the target machine is large, multiple first child tags may be attached to the movable mold and multiple second child tags may be attached to the fixed mold. In this case, the information processing device can synchronously process the multiple fixed mold surface temperatures output by the multiple first child tags and the multiple movable mold surface temperatures output by the multiple second child tags, and simultaneously display them on the screen.

A child tag according to one embodiment of the present invention is
a first wireless communication interface;
A first temperature sensor capable of detecting a fixed-side mold surface temperature, which is the temperature of the surface of the fixed-side mold;
a vibration/acceleration sensor capable of detecting vibration or acceleration of a movable die paired with the fixed die;
a mold state detection unit that detects a mold open limit state in which the movable mold is completely open and a closing start state in which the movable mold starts closing, based on the vibration or acceleration;
a fixed-side temperature detection unit that, when the mold open limit state is detected, controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface;
a blockage start signal output unit that outputs, when the blockage start state is detected, a blockage start signal indicating that the blockage start state has been detected via the first wireless communication interface;
Equipped with:

A parent tag according to one aspect of the present invention is
a first wireless communication interface;
A first temperature sensor capable of detecting a fixed-side mold surface temperature, which is the temperature of the surface of the fixed-side mold;
a fixed-side temperature detection unit that controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface;
A first child tag having
a second wireless communication interface;
a second temperature sensor capable of detecting a movable-side mold surface temperature, which is the temperature of a surface of a movable-side mold paired with the fixed-side mold;
a movable-side temperature detection unit that controls the second temperature sensor to detect the movable-side mold surface temperature and outputs the movable-side mold surface temperature via the second wireless communication interface;
and a second child tag having
a third wireless communication interface capable of wireless communication;
a mold surface temperature transfer unit that receives the fixed-side mold surface temperature output from the first child tag and the movable-side mold surface temperature output from the second child tag, and transfers them to the information processing device in synchronization with each other;
Equipped with:

An information processing program according to an embodiment of the present invention includes:
A control circuit for the sensor system,
a first wireless communication interface;
A first temperature sensor capable of detecting a fixed-side mold surface temperature, which is the temperature of the surface of the fixed-side mold;
a fixed-side temperature detection unit that controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface;
The fixed side mold surface temperature output by a first child tag having the
a second wireless communication interface;
a second temperature sensor capable of detecting a movable-side mold surface temperature, which is the temperature of a surface of a movable-side mold paired with the fixed-side mold;
a movable-side temperature detection unit that controls the second temperature sensor to detect the movable-side mold surface temperature and outputs the movable-side mold surface temperature via the second wireless communication interface;
The movable-side mold surface temperature output from the second child tag having the same temperature as the ...

The present invention aims to provide a sensor system that can better detect the surface temperatures of the fixed mold and the movable mold and can appropriately process the detected surface temperatures.

The effects described here are not necessarily limited to those described herein, and may be any of the effects described in this disclosure.

1 shows an overview of a sensor system according to an embodiment of the present invention. 2 shows the functional configuration of the sensor system. 4 shows the operation flow of the sensor system. 1 shows an example of a screen displayed on an information processing device.

The following describes an embodiment of the present invention with reference to the drawings.

1. Overview of the sensor system

Figure 1 shows an overview of a sensor system according to one embodiment of the present invention.

The sensor system 1 has a pair of a first child tag 10 and a second child tag 20, a parent tag 30, and an information processing device 40.

The first child tag 10 is attached to the movable side mold C1 (core). The second child tag 20 is attached to the fixed side mold C2 (cavity). The pair of the movable side mold C1 and the fixed side mold C2 is typically a pair of die casting molds, injection molding molds, rubber molding molds, vacuum molding molds, or press molds.

The first child tag 10 incorporates a first temperature sensor 11 (FIG. 2). The first temperature sensor 11 is a MEMS temperature sensor. The first temperature sensor 11 can detect the temperature (fixed side mold surface temperature T2) of the surface of the fixed side mold C2. Specifically, the first temperature sensor 11 can detect a plurality of temperatures (fixed side mold surface area temperatures) of a plurality of areas obtained by dividing the surface of the fixed side mold C2 (the surface on which the molded product is produced) into two dimensions (matrix shape) as the fixed side mold surface temperature T2. As shown in the figure, the first child tag 10 is attached to an arbitrary position of the movable side mold C1 so that the first temperature sensor 11 can photograph almost the entire surface of the fixed side mold C2 (dashed line in the figure). The first child tag 10 may be small in size and light enough to be attached to the movable side mold C1 (for example, fitted into an attachment jig adhered to the movable side mold C1). The first child tag 10 incorporates a battery (not shown). The first child tag 10 is connected to the parent tag 30 so that it can communicate wirelessly. The wireless communication may be, for example, network communication via a network N (wireless LAN).

The second child tag 20 incorporates a second temperature sensor 21 (FIG. 2). The second temperature sensor 21 can detect the temperature of the surface of the movable side mold C1 (movable side mold surface temperature T1). Specifically, the second temperature sensor 21 is a MEMS temperature sensor. The second temperature sensor 21 can detect, as the movable side mold surface temperature T1, a plurality of temperatures (movable side mold surface area temperatures) of a plurality of areas obtained by dividing the surface of the movable side mold C1 (the surface on which the molded product is produced) into two dimensions (matrix shape). As shown in the figure, the second child tag 20 is attached to an arbitrary position of the fixed side mold C2 so that the second temperature sensor 21 can photograph almost the entire surface of the movable side mold C1 (dotted line in the figure). The second child tag 20 may be small in size and light enough to be attached to the movable side mold C1 (for example, fitted into an attachment jig adhered to the fixed side mold C2). The second child tag 20 incorporates a battery (not shown). The second child tag 20 is connected to the parent tag 30 so that it can communicate wirelessly. The wireless communication may be, for example, network communication via a network N (wireless LAN).

Multiple pairs of a first child tag 10 and a second child tag 20 can be connected to the parent tag 30. The multiple pairs of the first child tag 10 and the second child tag 20 are typically installed on the fixed side mold C2 and the movable side mold C1 of multiple (e.g., several tens) target machines 50 installed at the same site (such as a manufacturing plant). In the following, unless otherwise specified, a single first child tag 10 and a single second child tag 20 will be described and illustrated.

The parent tag 30 is connected to multiple pairs of the first child tag 10 and the second child tag 20 for wireless communication via, for example, a network N (wireless LAN), and is further connected to an information processing device 40 for communication via, for example, a USB. The parent tag 30 transfers the fixed side mold surface temperature T2 received from the first child tag 10 and the movable side mold surface temperature T1 received from the second child tag 20 to the information processing device 40 in synchronization with each pair. The parent tag 30 may be the shape and size of a USB flash drive.

The information processing device 40 receives the fixed side mold surface temperature T2 received from the first child tag 10 and the movable side mold surface temperature T1 received from the second child tag 20 from the parent tag 30. The information processing device 40 processes the fixed side mold surface temperature T2 received from the first child tag 10 and the movable side mold surface temperature T1 received from the second child tag 20 in synchronization with each other for each pair. The information processing device 40 is a general-purpose personal computer or a dedicated computer. When the information processing device 40 is a general-purpose personal computer, the information processing program for realizing the sensor system of this embodiment may be recorded on a portable, non-transient computer-readable recording medium or downloaded via the Internet or the like and then installed on the general-purpose personal computer. When the information processing device 40 is a dedicated computer, a dedicated computer (stationary, mobile, etc.) on which the information processing program for realizing the sensor system of this embodiment is installed may be shipped.

2. Functional configuration of the sensor system

Figure 2 shows the functional configuration of the sensor system.

The first child tag 10 has a first temperature sensor 11, a first shutter 12, a control circuit 13, a wireless communication interface 14, and a vibration/acceleration sensor 15. The first temperature sensor 11 is a MEMS sensor and has a condenser lens, a thermopile, an amplifier, a temperature conversion circuit, etc. The first shutter 12 exposes and shields the first temperature sensor 11 (particularly the condenser lens) by opening and closing. The vibration/acceleration sensor 15 can detect the vibration or acceleration of the movable side mold C1 to which the first child tag 10 is attached. In detail, the vibration/acceleration sensor 15 constantly detects the vibration or acceleration of the movable side mold C1 to which the first child tag 10 is attached, and outputs a detection signal. The detection signal from the vibration/acceleration sensor 15 is input to the control circuit 13 via an amplifier and an A/D converter (not shown), etc. In the control circuit 13, the CPU loads an information processing program recorded in the ROM into the RAM and executes it, thereby operating as the fixed side temperature detection unit 101, the mold state detection unit 102, and the closure start signal output unit 103.

The second child tag 20 has a second temperature sensor 21, a second shutter 22, a control circuit 23, and a wireless communication interface 24. The second temperature sensor 21 is a MEMS sensor and has a focusing lens, a thermopile, an amplifier, a temperature conversion circuit, etc. The second shutter 22 exposes and shields the second temperature sensor 21 (particularly the focusing lens) by opening and closing. In the control circuit 23, the CPU operates as the movable side temperature detection unit 201 by loading an information processing program recorded in the ROM into the RAM and executing it.

The parent tag 30 has a wireless communication interface 31, a USB interface 32, a control circuit 33, and a non-volatile storage device 34 such as an SSD. In the control circuit 33, the CPU loads an information processing program recorded in the ROM into the RAM and executes it to operate as a temperature detection request unit 301 and a mold surface temperature transfer unit 302. The storage device 34 stores a child tag table 310. Furthermore, the parent tag 30 has software (not shown) for non-volatilely storing the fixed side mold surface temperature T2 received from the first child tag 10 and the movable side mold surface temperature T1 received from the second child tag 20 as necessary (such as when the power supply of the information processing device 40 is off) and transferring them to the information processing device 40 via USB communication.

The child tag table 310 stores a first child tag ID 311 and a second child tag ID 312 in association with each other. The first child tag ID 311 and the second child tag ID 312 associated with each other are communicatively connected to the parent tag 30 and identify the first child tag 10 and the second child tag 20 that form a pair.

The information processing device 40 has a USB interface 41, a control circuit 42, an output device 43 (display, speaker, etc.), and a large-capacity non-volatile storage device 44 such as an HDD or SSD. In the control circuit 42, the CPU operates as a processing unit 401 by loading an information processing program recorded in the ROM into the RAM and executing it. The storage device 44 stores a target machine table 410.

The target machine table 410 stores a first child tag ID 411, a second child tag ID 412, and a target machine ID 413 in association with each other. The first child tag ID 411 and the second child tag ID 412 associated with each other are communicatively connected to the parent tag 30 and identify the first child tag 10 and the second child tag 20 that form a pair. The target machine ID 413 associated with the pair of the first child tag ID 411 and the second child tag ID 412 identifies the target machine 50 to which the pair of the first child tag 10 and the second child tag 20 is attached.

3. Sensor system operation flow

Figure 3 shows the operational flow of the sensor system.

As a premise, a target machine 50 having a movable side mold C1 and a fixed side mold C2 is in operation. The target machine 50 periodically repeats a state in which the movable side mold C1 is completely closed relative to the fixed side mold C2 (mold closed limit state) and a state in which the movable side mold C1 is completely open relative to the fixed side mold C2 (mold open limit state). The movable side mold C1 repeats periodic displacement, with one cycle consisting of a movement from the mold open limit state through the mold closed limit state and back to the mold open limit state.

The vibration/acceleration sensor 15 of the first child tag 10 attached to the movable mold C1 detects the vibration or acceleration of the movable mold C1, which repeats periodic displacement. In other words, the vibration or acceleration detected by the vibration/acceleration sensor 15 of the first child tag 10 is a periodic waveform. Specifically, the waveform includes characteristic points indicating that the movable mold C1 has reached the mold open limit state, characteristic points indicating a closing start state in which the movable mold C1 in the mold open limit state has started to close, and the like. The vibration/acceleration sensor 15 constantly detects the vibration or acceleration of the movable mold C1 and outputs a detection signal to the control circuit 13.

When the movable side mold C1 is completely closed relative to the fixed side mold C2 (mold closed limit state), a molded product (not shown) is produced between the movable side mold C1 and the fixed side mold C2. Meanwhile, when the movable side mold C1 is completely open relative to the fixed side mold C2 (mold open limit state), the molded product is removed from the movable side mold C1. When the movable side mold C1 is open relative to the fixed side mold C2 and the molded product is removed, the first child tag 10 detects the fixed side mold surface temperature T2, and the second child tag 20 detects the movable side mold surface temperature T1.

(1) Operational flow of the first child tag

The mold state detection unit 102 of the first child tag 10 constantly inputs the vibration or acceleration output by the vibration/acceleration sensor 15, and detects that the movable side mold C1 has reached a completely open state (mold open limit state) based on the vibration or acceleration (step S101). When the movable side mold C1 reaches the mold open limit state, a molded product is attached to the movable side mold C1 (it has not yet been removed).

After a predetermined time (several seconds) has elapsed since the detection of the mold open limit state (step S101) (i.e., after the molded product is removed from the movable mold C1), the fixed side temperature detection unit 101 of the first child tag 10 opens the first shutter 12 to expose the first temperature sensor 11. The fixed side temperature detection unit 101 controls the first temperature sensor 11 to detect the fixed side mold surface temperature T2, and after detection, closes the first shutter 12 to shield the first temperature sensor 11 (step S102). In other words, the fixed side temperature detection unit 101 opens the first shutter 12 to expose the first temperature sensor 11 only when it controls the first temperature sensor 11 to detect the fixed side mold surface temperature T2.

The fixed side temperature detection unit 101 creates a message including the fixed side mold surface temperature T2 and a child tag ID that identifies the first child tag 10 (step S103), and transmits it to the parent tag 30 via the wireless communication interface 14 (step S104). The fixed side mold surface temperature T2 includes multiple temperatures (fixed side mold surface area temperatures) for each of multiple areas obtained by dividing the surface of the fixed side mold C2 into two dimensions.

Then, the mold state detection unit 102 of the first child tag 10 detects, based on the vibration or acceleration output by the vibration/acceleration sensor 15, that the movable side mold C1, which is in the fully open state, has entered a blockage start state, in which blocking has begun. When the blockage start state is detected, the blockage start signal output unit 103 outputs a blockage start signal indicating that the blockage start state has been detected to the parent tag 30 via the wireless communication interface 14 (step S105). The blockage start signal includes a child tag ID that identifies the first child tag 10.

(2) First operation flow of the parent tag

The mold surface temperature transfer unit 302 of the parent tag 30 receives a message (step S104) including the fixed side mold surface temperature T2 and the child tag ID that identifies the first child tag 10 from the first child tag 10 via the wireless communication interface 31 (step S301). The mold surface temperature transfer unit 302 waits until it receives a message from the second child tag 20 that is paired with the first child tag 10. Specifically, the mold surface temperature transfer unit 302 waits until it receives a message including the second child tag ID 312 registered in the child tag table 310 in association with the first child tag ID 311 included in the message received from the first child tag 10 (it buffers the fixed side mold surface temperature T2 and the first child tag ID 311 received from the first child tag 10).

Meanwhile, the temperature detection request unit 301 of the parent tag 30 receives a blockage start signal (step S105) from the first child tag 10 via the wireless communication interface 31 (step S302). The temperature detection request unit 301 is triggered by the reception of the blockage start signal output by the first child tag 10, and outputs a temperature detection request signal to the second child tag 20 via the wireless communication interface 31 (step S303). Specifically, the temperature detection request unit 301 outputs the temperature detection request signal to the second child tag 20 identified by the second child tag ID 312 registered in the child tag table 310 in association with the first child tag ID 311 included in the blockage start signal output by the first child tag 10.

(3) Operational flow of the second child tag

The movable side temperature detection unit 201 of the second child tag 20 receives a temperature detection request signal from the parent tag 30 via the wireless communication interface 24. The movable side temperature detection unit 201 then opens the second shutter 22 to expose the second temperature sensor 21. The movable side temperature detection unit 201 controls the second temperature sensor 21 to detect the movable side mold surface temperature T1, and after detection, closes the second shutter 22 to shield the second temperature sensor 21 (step S201). In other words, the movable side temperature detection unit 201 opens the second shutter 22 to expose the second temperature sensor 21 only when it controls the second temperature sensor 21 to detect the movable side mold surface temperature T1.

The movable side temperature detection unit 201 creates a message including the movable side mold surface temperature T1 and a child tag ID that identifies the second child tag 20 (step S202), and transmits it to the parent tag 30 via the wireless communication interface 24 (step S203). The movable side mold surface temperature T1 includes multiple temperatures (movable side mold surface area temperatures) for each of multiple areas obtained by dividing the surface of the movable side mold C1 into two dimensions.

The first child tag 10 detects and outputs the fixed side mold surface temperature T2 and outputs a closing start signal each time it detects the fully open state of the movable side mold C1. The second child tag 20 detects and outputs the movable side mold surface temperature T1 each time it receives a temperature detection request signal that is output using the closing start signal as a trigger. In other words, for each cycle of operation of the movable side mold C1, the first child tag 10 detects and outputs the fixed side mold surface temperature T2, and the second child tag 20 detects and outputs the movable side mold surface temperature T1.

(4) Second operation flow of parent tag

The mold surface temperature transfer unit 302 of the parent tag 30 receives a message (step S203) including the movable side mold surface temperature T1 and the second child tag ID that identifies the second child tag 20 from the second child tag 20 via the wireless communication interface 31 (step S304). The mold surface temperature transfer unit 302 synchronously transfers the fixed side mold surface temperature T2 (step S301) received from the first child tag 10 and the movable side mold surface temperature T1 received from the second child tag 20 that is paired with the first child tag 10 to the information processing device 40 via the USB interface 32 (step S305). Specifically, the mold surface temperature transfer unit 302 reads from the buffer the fixed side mold surface temperature T2 and the first child tag ID 311 received from the first child tag 10 identified by the first child tag ID 311 registered in the child tag table 310 in association with the second child tag ID 312 included in the message received from the second child tag 20. The mold surface temperature transfer unit 302 transfers the fixed side mold surface temperature T2 and the first child tag ID 311 read from the buffer, and the movable side mold surface temperature T1 and the second child tag ID 312 received from the second child tag 20, to the information processing device 40 via the USB interface 32.

(5) Operation flow of information processing device

The processing unit 401 of the information processing device 40 receives the fixed side mold surface temperature T2 and the first child tag ID, and the movable side mold surface temperature T1 and the second child tag ID from the parent tag 30 via the USB interface 41. The processing unit 401 synchronously processes and displays the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 of the target machine 50 identified by the target machine ID 413 associated with the first child tag ID 411 and the second child tag ID 412 received by the processing unit 401 and registered in the target machine table 410.

The fixed side mold surface temperature T2 includes multiple temperatures (fixed side mold surface area temperatures) of multiple areas obtained by dividing the surface of the fixed side mold C2 into two dimensions. The movable side mold surface temperature T1 includes multiple temperatures (movable side mold surface area temperatures) of multiple areas obtained by dividing the surface of the movable side mold C1 into two dimensions.

For example, the processing unit 401 compares the absolute values of the multiple fixed side mold surface area temperatures with a first threshold value, and compares the absolute values of the multiple movable side mold surface area temperatures with a second threshold value (step S401). The first threshold value and the second threshold value may be, for example, an upper limit value and/or a lower limit value that can guarantee the quality of the molded product. The first threshold value and the second threshold value may be the same or different. For example, the first threshold value to be compared with the movable side mold surface area temperature of the movable side mold C1 (core) may be an upper limit value of 30°C and/or a lower limit value of 10°C. The second threshold value to be compared with the fixed side mold surface area temperature of the fixed side mold C2 (cavity) may be an upper limit value of 40°C and/or a lower limit value of 20°C.

For example, the processing unit 401 compares the gradient (temperature difference) of the temperatures of the multiple fixed mold surface areas with a third threshold value, outputs the comparison result, and compares the gradient of the temperatures of the multiple movable mold surface areas with a fourth threshold value (step S402). The third threshold value and the fourth threshold value may be, for example, upper limit values that can ensure the quality of the molded product. The third threshold value and the fourth threshold value may be the same or different.

Figure 4 shows an example of a screen displayed on an information processing device.

The processing unit 401 of the information processing device 40 displays on the screen 520 a matrix-shaped thermograph 521 showing a plurality of temperatures (movable side mold surface area temperatures) for each of a plurality of areas obtained by dividing the surface of the movable side mold C1 into two dimensions. The processing unit 401 displays on the screen 520 a matrix-shaped thermograph 522 showing a plurality of temperatures (fixed side mold surface area temperatures) for each of a plurality of areas obtained by dividing the surface of the fixed side mold C2 into two dimensions. In short, the processing unit 401 displays on a single screen 520 the movable side mold surface temperature T1 and the fixed side mold surface temperature T2, which are detected and synchronized in the same cycle.

The processing unit 401 of the information processing device 40 outputs (displays on a display) the comparison results (steps S401 and S402) to the output device 43 (step S403). For example, when each value exceeds a threshold value, the processing unit 401 displays the comparison result so that the position on the mold surface where the value (temperature) exceeds the threshold value can be visually identified (an alarm is issued by highlighting the value by changing the color, etc.).

The processing unit 401 displays the average, maximum, and minimum values 523 of the movable side mold surface area temperature and the average, maximum, and minimum values 524 of the fixed side mold surface area temperature on the screen 520 (step S404). As described above, for each cycle of the operation of the movable side mold C1, the first child tag 10 detects and outputs the fixed side mold surface temperature T2, and the second child tag 20 detects and outputs the movable side mold surface temperature T1. The processing unit 401 may display the time-series changes in the average values of the movable side mold surface area temperature and the fixed side mold surface area temperature received for each cycle as graphs 525 and 526.

4. Modifications

In this embodiment, the parent tag 30 is triggered by receiving a blockage start signal from the first child tag 10 (step S302) and outputs a temperature detection request signal to the second child tag 20 (step S303). Alternatively, the parent tag 30 may simply transfer the blockage start signal to the information processing device 40 upon receiving the blockage start signal. In this case, the information processing device 40 may output a temperature detection request signal to the second child tag 20 via the parent tag 30, triggered by receiving the blockage start signal.

In this embodiment, the parent tag 30 waits when it receives the fixed side mold surface temperature T2 (step S301), and when it receives the movable side mold surface temperature T1 (step S304), it synchronously transfers the movable side mold surface temperature T1 and the fixed side mold surface temperature T2 to the information processing device 40 (step S305). Alternatively, the parent tag 30 may simply transfer the fixed side mold surface temperature T2 when it receives it, and simply transfer the movable side mold surface temperature T1 when it receives it. In this case, the information processing device 40 waits when it receives the fixed side mold surface temperature T2, and when it receives the movable side mold surface temperature T1, it processes the movable side mold surface temperature T1 and the fixed side mold surface temperature T2 in a synchronous manner.

When the target machine 50 is large, multiple first child tags 10 may be attached to the movable side mold C1, and multiple second child tags 20 may be attached to the fixed side mold C2. Each first child tag 10 can detect the fixed side mold surface temperature T2 of multiple different parts of the surface of the fixed side mold C2. Each second child tag 20 can detect the movable side mold surface temperature T1 of multiple different parts of the surface of the movable side mold C1. In this case, the information processing device 40 may synchronously process the multiple fixed side mold surface temperatures T2 output by the multiple first child tags 10 and the multiple movable side mold surface temperatures T1 output by the multiple second child tags 20, and display them on the screen at the same time. Specifically, the information processing device 40 synthesizes the fixed side mold surface temperatures T2 of the multiple different parts output by the multiple first child tags 10 to obtain the fixed side mold surface temperature T2 of the entire surface of the fixed side mold C2. The information processing device 40 combines the movable side mold surface temperatures T1 of the multiple different parts output by the multiple second child tags 20 to obtain the movable side mold surface temperature T1 of the entire surface of the movable side mold C1.

In this embodiment, the fixed side mold surface temperature T2 output by the first child tag 10 and the movable side mold surface temperature T1 output by the second child tag 20 are not thinned out or compressed. This is because the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 are output for each cycle of the operation of the movable side mold C1, and are not output frequently (less than every few seconds). For this reason, there is little need to reduce the amount of data communication in order to increase the transmission speed. However, the first child tag 10 may output the fixed side mold surface temperature T2 after thinning out or compressing it, and the second child tag 20 may output the movable side mold surface temperature T1 after thinning out or compressing it.

When each value exceeds each threshold value, the information processing device 40 may not only display an alarm (step S403), but may also feedback control the movable side mold C1 and/or the fixed side mold C2. For example, when the absolute value of the movable side mold surface temperature T1 and/or the fixed side mold surface temperature T2 is high, the information processing device 40 may control the cooling of the movable side mold C1 and/or the fixed side mold C2 (such as lowering the temperature of the internal cooling water).

5. Conclusion

According to this embodiment, the first child tag 10 has a wireless communication interface 14, a first temperature sensor 11 capable of detecting the fixed side mold surface temperature T2, which is the temperature of the surface of the fixed side mold C2, and a fixed side temperature detection unit 101 that controls the first temperature sensor 11 to detect the fixed side mold surface temperature T2 and outputs the fixed side mold surface temperature T2 via the wireless communication interface 14. The second child tag 20 has a wireless communication interface 24, a second temperature sensor 21 capable of detecting the movable side mold surface temperature T1, which is the temperature of the surface of the movable side mold C1 that is paired with the fixed side mold C2, and a movable side temperature detection unit 201 that controls the second temperature sensor 21 to detect the movable side mold surface temperature T1 and outputs the movable side mold surface temperature T1 via the wireless communication interface 24. The second child tag 20 has an information processing device 40 and a processing unit 401 that synchronously processes the fixed side mold surface temperature T2 output by the first child tag 10 and the movable side mold surface temperature T1 output by the second child tag 20.

According to this embodiment, the fixed side mold surface temperature T2 of the fixed side mold C2 and the movable side mold surface temperature T1 of the movable side mold C1 that pairs with the fixed side mold C2 can be processed in synchronization, resulting in high usability.

The first child tag 10 further includes a vibration/acceleration sensor 15 capable of detecting vibration or acceleration of the movable side mold C1, a mold state detection unit 102 that detects a mold open limit state in which the movable side mold C1 is completely open and a closing start state in which the movable side mold C1 starts to close based on the vibration or acceleration, and a closing start signal output unit 103 that outputs a closing start signal indicating that the closing start state has been detected via the wireless communication interface 14 when the closing start state is detected. When the mold open limit state is detected, the fixed side temperature detection unit 101 controls the first temperature sensor 11 to detect the fixed side mold surface temperature T2. When the movable side temperature detection unit 201 of the second child tag 20 receives a temperature detection request signal that is output as a trigger when the first child tag 10 outputs the closing start signal, it controls the second temperature sensor 21 to detect the movable side mold surface temperature T1.

According to this embodiment, the detection timing of the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 is determined based on the periodic vibration or acceleration of the movable side mold C1. This makes it possible to detect the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 for each operation cycle of the movable side mold C1, and as a result, the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 can always be processed synchronously.

The first child tag 10 further has a first shutter 12 that exposes and shields the first temperature sensor 11 by opening and closing, and the fixed side temperature detection unit 101 of the first child tag 10 opens the first shutter 12 to expose the first temperature sensor 11 only when controlling the first temperature sensor 11 to detect the fixed side mold surface temperature T2, and the second child tag 20 further has a second shutter 22 that exposes and shields the second temperature sensor 21 by opening and closing, and the movable side temperature detection unit 201 of the second child tag 20 opens the second shutter to expose the second temperature sensor 21 only when controlling the second temperature sensor 21 to detect the movable side mold surface temperature T1.

As a result, particularly in the case of die-casting molds, in adverse environments where the temperature near the mold is close to 400 degrees and there is gas generated during solidification, spray, air blow, dust, and molten material splashing, etc., the time that the first temperature sensor 11 and the second temperature sensor 21 are exposed is minimized, thereby preventing deterioration and failure of the first temperature sensor 11 and the second temperature sensor 21.

When the fixed-side temperature detection unit 101 of the first child tag 10 detects the fully open mold state, it opens the first shutter 12 to expose the first temperature sensor 11, controls the first temperature sensor 11 to detect the fixed-side mold surface temperature T2, and after detection, closes the first shutter 12 to shield the first temperature sensor 11. When the movable-side temperature detection unit 201 of the second child tag 20 receives a temperature detection request signal, it opens the second shutter to expose the second temperature sensor 21, controls the second temperature sensor 21 to detect the movable-side mold surface temperature T1, and after detection, closes the second shutter to shield the second temperature sensor 21.

When the mold open limit state is detected, the first shutter 12 is opened, so that the timing of exposing the first temperature sensor 11 can be reliably set to immediately before temperature detection. When a temperature detection request signal is received, the second shutter 22 is opened, so that the timing of exposing the second temperature sensor 21 can be reliably set to immediately before temperature detection. As a result, by minimizing the time that the first temperature sensor 11 and the second temperature sensor 21 are exposed, deterioration or failure of the first temperature sensor 11 and the second temperature sensor 21 can be prevented more reliably.

The fixed side mold surface temperature T2 includes a plurality of fixed side mold surface area temperatures for each of a plurality of areas obtained by dividing the surface of the fixed side mold C2 into two dimensions. The movable side mold surface temperature T1 includes a plurality of movable side mold surface area temperatures for each of a plurality of areas obtained by dividing the surface of the movable side mold C1 into two dimensions. The processing unit 401 compares the absolute values of the plurality of fixed side mold surface area temperatures with a first threshold value, compares the absolute values of the plurality of movable side mold surface area temperatures with a second threshold value, and outputs the comparison result, and/or compares the gradients of the plurality of fixed side mold surface area temperatures with a third threshold value, and outputs the comparison result, and compares the gradients of the plurality of movable side mold surface area temperatures with a fourth threshold value, and outputs the comparison result.

This makes it possible to output the temperature of multiple mold surface areas in each of multiple areas obtained by dividing the surface of the mold into two dimensions, even for small injection molding molds. This allows the user to know the temperature (absolute value, gradient) of the fine details of a small mold.

The parent tag 30 has a mold surface temperature transfer unit 302 that receives the fixed side mold surface temperature T2 output by the first child tag 10 and the movable side mold surface temperature T1 output by the second child tag 20, and transfers them in synchronization to the information processing device 40.

According to this embodiment, not only are the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 detected for each cycle of the operation of the movable side mold C1, but the timing of transfer to the information processing device 40 is synchronized, so that the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 can be always processed in a synchronized manner with even greater reliability.

The parent tag 30 further has a temperature detection request unit 301 that receives the blockage start signal output by the first child tag 10 and outputs a temperature detection request signal to the second child tag 20 using the reception as a trigger.

According to this embodiment, the parent tag 30 outputs a temperature detection request signal directly to the second child tag 20 without communicating with the information processing device 40, so there is a short gap between the detection timing of the fixed side mold surface temperature T2 of the first child tag 10 and the detection timing of the movable side mold surface temperature T1 of the second child tag 20. In other words, the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 can be detected almost simultaneously.

Multiple pairs of a first child tag 10 and a second child tag 20 can be connected to the parent tag 30, and the parent tag 30 transfers the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 synchronously for each pair, and the processing unit 401 processes the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 synchronously for each pair.

Multiple pairs of the first child tag 10 and the second child tag 20 are typically installed on multiple target machines 50 installed at the same site (such as a manufacturing plant). One parent tag 30 transfers communication from multiple pairs of the first child tag 10 and the second child tag 20 to the information processing device 40. Therefore, if it is desired to obtain the surface temperatures of multiple target machines 50, by attaching the first child tag 10 and the second child tag 20 to multiple target machines 50, one parent tag 30 sends communication from multiple pairs of the first child tag 10 and the second child tag 20 to the information processing device 40, eliminating the need to install expensive equipment in each of the multiple target machines 50, and allowing the sensor system 1 to be installed easily and inexpensively.

The first child tag 10 can be attached to the movable mold C1, and the second child tag 20 can be attached to the fixed mold C2.

As a result, the first child tag 10 and the second child tag 20 are small and lightweight enough to be attached to the movable side mold C1 and the fixed side mold C2, making it even easier to introduce them to a large number of target machines 50. Also, for example, if it is desired to obtain the mold surface temperature of an old target machine 50, the first child tag 10 and the second child tag 20 can be attached to the old target machine 50, so the sensor system 1 can be introduced easily and inexpensively.

The first temperature sensor 11 is a MEMS temperature sensor capable of detecting, as the fixed side mold surface temperature T2, the temperatures of multiple fixed side mold surface areas in each of multiple areas obtained by dividing the surface of the fixed side mold C2 into two dimensions. The second temperature sensor 21 is a MEMS temperature sensor capable of detecting, as the movable side mold surface temperature T1, the temperatures of multiple movable side mold surface areas in each of multiple areas obtained by dividing the surface of the movable side mold C1 into two dimensions.

This makes it possible to output the temperature of multiple mold surface areas in each of multiple areas obtained by dividing the surface of the mold into two dimensions, even for small injection molding molds. This allows the user to know the temperature (absolute value, gradient) of the fine details of a small mold.

The fixed mold C2 and the movable mold C1 are a pair of die-casting molds, injection molding molds, rubber molding molds, vacuum molding molds, or press molds.

It is assumed that die casting dies, injection molding dies, rubber molding dies, vacuum molding dies or press dies repeat periodic displacements, with one cycle being from a maximum mold open state to a maximum mold closed state and then back to a maximum mold open state. For this reason, the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 can be detected for each cycle of operation of the movable side mold C1, which is assumed to operate cyclically, and as a result, the fixed side mold surface temperature T2 and the movable side mold surface temperature T1 can always be processed synchronously.

Although the embodiments and variations of the present technology have been described above, the present technology is not limited to the above-described embodiments, and various modifications can of course be made without departing from the spirit of the present technology.

1 Sensor system 10 First child tag 101 Fixed side temperature detection unit 102 Mold state detection unit 103 Closure start signal output unit 11 First temperature sensor 12 First shutter 13 Control circuit 14 Wireless communication interface 15 Acceleration sensor 20 Second child tag 201 Movable side temperature detection unit 21 Second temperature sensor 22 Second shutter 23 Control circuit 24 Wireless communication interface 30 Parent tag 301 Temperature detection request unit 302 Mold surface temperature transfer unit 31 Wireless communication interface 310 Child tag table 32 USB interface 33 Control circuit 34 Memory device 40 Information processing device 401 Processing unit 41 USB interface 410 Target machine table 42 Control circuit 43 Output device 44 Memory device 50 Target machine C1 Movable side mold C2 Fixed side mold T1 Movable side mold surface temperature T2 Fixed side mold surface temperature

Claims (15)

a first wireless communication interface;
A first temperature sensor capable of detecting a mold surface temperature, which is the temperature of the surface of the mold;
a temperature detection unit that controls the first temperature sensor to detect the mold surface temperature and outputs the mold surface temperature via the first wireless communication interface;
A first child tag having
an information processing device having a processing unit for processing the mold surface temperature output by the first child tag;
a second wireless communication interface;
A second temperature sensor capable of detecting a movable-side mold surface temperature, which is the temperature of the surface of the movable-side mold;
a movable-side temperature detection unit that controls the second temperature sensor to detect the movable-side mold surface temperature and outputs the movable-side mold surface temperature via the second wireless communication interface;
and a second child tag having
Equipped with
the first temperature sensor of the first child tag is capable of detecting a fixed-side mold surface temperature, which is a temperature of a surface of a fixed-side mold that is paired with the movable-side mold,
the temperature detection unit of the first child tag is a fixed-side temperature detection unit that controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface,
The processing unit processes the fixed-side mold surface temperature outputted from the first child tag and the movable-side mold surface temperature outputted from the second child tag in synchronization with each other.
Sensor system. 2. The sensor system of claim 1 ,
The first child tag is
a vibration/acceleration sensor capable of detecting vibration or acceleration of the movable die;
a mold state detection unit that detects a mold open limit state in which the movable mold is completely open and a closing start state in which the movable mold starts closing, based on the vibration or acceleration;
a blockage start signal output unit that outputs, when the blockage start state is detected, a blockage start signal indicating that the blockage start state has been detected via the first wireless communication interface;
and
When the mold open limit state is detected, the fixed-side temperature detection unit controls the first temperature sensor to detect the fixed-side mold surface temperature,
When the movable side temperature detection unit of the second child tag receives a temperature detection request signal that is output in response to the first child tag outputting the closing start signal, the movable side temperature detection unit controls the second temperature sensor to detect the movable side mold surface temperature. 3. The sensor system of claim 2 ,
the first child tag further includes a first shutter that opens and closes to expose and shield the first temperature sensor;
the fixed-side temperature detection unit of the first child tag opens the first shutter to expose the first temperature sensor only when controlling the first temperature sensor to detect the fixed-side mold surface temperature;
the second child tag further includes a second shutter that opens and closes to expose and shield the second temperature sensor;
The movable-side temperature detection unit of the second child tag opens the second shutter to expose the second temperature sensor only when controlling the second temperature sensor to detect the movable-side mold surface temperature. The sensor system according to claim 3 ,
when the mold open limit state is detected, the fixed-side temperature detection unit of the first child tag opens the first shutter to expose the first temperature sensor, controls the first temperature sensor to detect the fixed-side mold surface temperature, and after detection, closes the first shutter to shield the first temperature sensor;
When the movable-side temperature detection unit of the second child tag receives the temperature detection request signal, it opens the second shutter to expose the second temperature sensor, controls the second temperature sensor to detect the movable-side mold surface temperature, and after detection, closes the second shutter to shield the second temperature sensor. A sensor system according to any one of claims 2 to 4 ,
the fixed-side mold surface temperature includes a plurality of fixed-side mold surface area temperatures, each of a plurality of areas obtained by two-dimensionally dividing the surface of the fixed-side mold,
the movable-side mold surface temperature includes a plurality of movable-side mold surface area temperatures in each of a plurality of areas obtained by two-dimensionally dividing the surface of the movable mold,
The processing unit includes:
A sensor system which compares absolute values of the multiple fixed side mold surface area temperatures with a first threshold, compares absolute values of the multiple movable side mold surface area temperatures with a second threshold, and outputs a comparison result, and/or compares a gradient of the multiple fixed side mold surface area temperatures with a third threshold, and outputs a comparison result, and compares a gradient of the multiple movable side mold surface area temperatures with a fourth threshold, and outputs a comparison result. A sensor system according to any one of claims 2 to 5 ,
The sensor system further comprises a parent tag having a mold surface temperature transfer unit that receives the fixed side mold surface temperature output by the first child tag and the movable side mold surface temperature output by the second child tag, and transfers them in synchronization to the information processing device. 7. The sensor system of claim 6 ,
The parent tag further comprises a temperature detection request unit that receives the blockage start signal output by the first child tag and outputs the temperature detection request signal to the second child tag using the reception as a trigger. The sensor system according to claim 6 or 7 ,
A plurality of pairs of the first child tag and the second child tag are connectable to the parent tag;
the parent tag synchronously transfers the fixed-side mold surface temperature and the movable-side mold surface temperature for each pair;
The processing unit processes the fixed-side mold surface temperature and the movable-side mold surface temperature in a synchronous manner for each pair. A sensor system according to any one of claims 1 to 8 ,
The first child tag is attachable to the movable mold;
The second daughter tag is attachable to the fixed mold. A sensor system according to any one of claims 1 to 9 ,
the first temperature sensor is a MEMS temperature sensor capable of detecting, as the fixed-side mold surface temperature, a plurality of fixed-side mold surface area temperatures in each of a plurality of areas obtained by two-dimensionally dividing the surface of the fixed-side mold,
The second temperature sensor is a MEMS temperature sensor capable of detecting, as the movable-side mold surface temperature, temperatures of a plurality of movable-side mold surface areas in each of a plurality of areas obtained by two-dimensionally dividing the surface of the movable-side mold. A sensor system according to any one of claims 1 to 10 ,
The fixed mold and the movable mold are a pair of a die casting mold, an injection molding mold, a rubber molding mold, a vacuum molding mold, or a press mold. A sensor system according to any one of claims 1 to 11 ,
a plurality of said first child tags;
a plurality of said second child tags;
Equipped with
Each of the first child tags is capable of detecting a surface temperature of the stationary mold at a plurality of different portions of the surface of the stationary mold,
Each of the second child tags is capable of detecting the movable mold surface temperature at a plurality of different portions of the surface of the movable mold,
The processing unit includes:
The stationary-side mold surface temperature of the plurality of different portions output by the plurality of first child tags is synthesized to obtain the stationary-side mold surface temperature of the entire surface of the stationary-side mold;
a sensor system for acquiring the movable-side mold surface temperature of the entire surface of the movable-side mold by combining the movable-side mold surface temperatures of the multiple different portions output by the multiple second child tags. a first wireless communication interface;
A first temperature sensor capable of detecting a fixed-side mold surface temperature, which is the temperature of the surface of the fixed-side mold;
a vibration/acceleration sensor capable of detecting vibration or acceleration of a movable die paired with the fixed die;
a mold state detection unit that detects a mold open limit state in which the movable mold is completely open and a closing start state in which the movable mold starts closing, based on the vibration or acceleration;
a fixed-side temperature detection unit that, when the mold open limit state is detected, controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface;
a blockage start signal output unit that outputs, when the blockage start state is detected, a blockage start signal indicating that the blockage start state has been detected via the first wireless communication interface;
A child tag that includes: a first wireless communication interface;
A first temperature sensor capable of detecting a fixed-side mold surface temperature, which is the temperature of the surface of the fixed-side mold;
a fixed-side temperature detection unit that controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface;
A first child tag having
a second wireless communication interface;
a second temperature sensor capable of detecting a movable-side mold surface temperature, which is the temperature of a surface of a movable-side mold paired with the fixed-side mold;
a movable-side temperature detection unit that controls the second temperature sensor to detect the movable-side mold surface temperature and outputs the movable-side mold surface temperature via the second wireless communication interface;
and a second child tag having
a third wireless communication interface capable of wireless communication;
a mold surface temperature transfer unit that receives the fixed-side mold surface temperature output from the first child tag and the movable-side mold surface temperature output from the second child tag, and transfers them in synchronization with each other to an information processing device;
A parent tag that has A control circuit for the sensor system,
a first wireless communication interface;
A first temperature sensor capable of detecting a fixed-side mold surface temperature, which is the temperature of the surface of the fixed-side mold;
a fixed-side temperature detection unit that controls the first temperature sensor to detect the fixed-side mold surface temperature and outputs the fixed-side mold surface temperature via the first wireless communication interface;
The fixed side mold surface temperature output by a first child tag having the
a second wireless communication interface;
a second temperature sensor capable of detecting a movable-side mold surface temperature, which is the temperature of a surface of a movable-side mold paired with the fixed-side mold;
a movable-side temperature detection unit that controls the second temperature sensor to detect the movable-side mold surface temperature and outputs the movable-side mold surface temperature via the second wireless communication interface;
and a processing unit that synchronously processes the movable-side mold surface temperature outputted from the second child tag having the information processing program.

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