JP7498682B2 - Resin molding device and method for manufacturing resin molded product - Google Patents

Description

The present invention relates to a resin molding device and a manufacturing method for resin molded products.

Patent Document 1 discloses a resin molding device equipped with a degate unit that separates unnecessary resin from a molded product. This degate unit includes a pair of left and right degate pallets on which the molded product is placed, a cull receiving unit that receives the molded product cull (unnecessary resin) between the pair of degate pallets, and a cull pressing unit that presses the molded product cull against the cull receiving units.

In the degate section configured in this way, after the molded product cull is separated from the molded product, it is adsorbed by the suction pad built into the cull holder and lifted from the cull receiver. After the molded product is removed, the cull is released from the cull holder and placed in the scrap box. In this way, the molded product cull that has been separated from the molded product can be discharged.

JP 2012-43839 A

However, the technology described in Patent Document 1 requires a mechanism for absorbing the molded product cull (unwanted resin) that has been separated from the molded product in order to discharge it, leaving room for improvement in terms of the complexity of the device configuration.

The present invention was made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a resin molding device and a method for manufacturing resin molded products that can simplify the device configuration.

The problem that the present invention aims to solve is as described above, and in order to solve this problem, a resin molding apparatus according to the present invention comprises an upper mold and a lower mold opposite the upper mold, and is equipped with a molding mold for resin molding a substrate, a mold clamping mechanism for clamping the molding mold, and an unnecessary resin removal mechanism for removing unnecessary resin formed on the resin-molded substrate, wherein the unnecessary resin removal mechanism comprises a substrate mounting section on which a substrate portion of the resin-molded substrate is placed, an unnecessary resin mounting section arranged to the side of the substrate mounting section and on which the unnecessary resin of the resin-molded substrate is placed, and a removal section that removes the unnecessary resin from the resin-molded substrate by pressing the unnecessary resin of the placed resin-molded substrate, the removal section being movable in vertical and horizontal directions, the removal section removes the unnecessary resin from a plurality of the resin-molded substrates that are lined up, the number of the resin-molded substrates that are lined up is greater than the number of the removal sections, and the unnecessary resin removed by the removal section from the resin-molded substrate falls by its own weight.

The method for manufacturing a resin molded product according to the present invention is for manufacturing a resin molded product using the resin molding device.

The present invention makes it possible to simplify the device configuration.

1 is a schematic plan view showing an overall configuration of a resin molding apparatus according to an embodiment; 1 is a schematic front view showing an overall configuration of a resin molding apparatus according to an embodiment; FIG. 4 is a schematic plan view showing the arrangement of a resin-molded substrate molded in a molding die. FIG. 4 is a perspective view showing the configuration of an unnecessary resin removal mechanism. FIG. 4 is a side view showing the configuration of the unnecessary resin removal mechanism. FIG. 4 is an enlarged side cross-sectional view showing the configuration of an unnecessary resin removal mechanism. FIG. 11 is an enlarged cross-sectional side view showing how unwanted resin falls. FIG. 13 is a side view showing how the remover is driven. 1A is a schematic side view showing the positional relationship between the unnecessary resin, the unnecessary resin placing portion, and the resin pressing portion, and FIG. 1A is a schematic side view showing a first modified example of the unnecessary resin placing portion, (b) a schematic side view showing a second modified example of the unnecessary resin placing portion, and (c) a schematic side view showing a third modified example of the unnecessary resin placing portion.

In the following explanation, the directions indicated by the arrows U, D, L, R, F, and B in the figure are defined as the upward direction, downward direction, leftward direction, rightward direction, forward direction, and backward direction, respectively.

<Overall configuration of resin molding device 1>
First, the configuration of a resin molding apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 and 2. The resin molding apparatus 1 resin-encapsulates electronic elements such as semiconductor chips, resistor elements, and capacitor elements (hereinafter simply referred to as "chips") to manufacture resin molded products. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method.

The resin molding device 1 comprises, as its components, a resin molding module 10 and an unloading module 20. Each component is detachable and replaceable with respect to the other components.

<Resin Molded Module 10>
The resin molding module 10 resin-seals chips connected to the substrate 3 (see FIG. 3). The resin molding module 10 mainly comprises a molding die 100 (lower die 110 and upper die 120), a clamping mechanism 200, and a control unit 300. Note that as the substrate 3, various substrates can be used, including a lead frame, a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, etc.

The molding die 100 uses molten resin material to resin-seal the chips connected to the substrate 3. The molding die 100 has a pair of upper and lower dies that face each other, that is, a lower die 110 and an upper die 120. The molding die 100 is provided with a heating unit (not shown) such as a heater.

The mold clamping mechanism 200 clamps or opens the molding die 100 by moving the lower die 110 up and down.

The control unit 300 controls the operation of each module of the resin molding device 1. The control unit 300 controls the operation of the resin molding module 10 and the discharge module 20. The control unit 300 can also be used to arbitrarily change (adjust) the operation of each module.

In this embodiment, an example is shown in which the control unit 300 is provided in the resin molding module 10, but the control unit 300 can also be provided in other modules. It is also possible to provide multiple control units 300. For example, it is possible to provide a control unit 300 for each module or device, and to control the operations of each module individually while linking them together.

<Exit Module 20>
The unloading module 20 receives and unloads the resin-sealed substrate 3 (resin-molded substrate 2) from the resin molding module 10. The unloading module 20 is disposed adjacent to the right side of the resin molding module 10. The unloading module 20 mainly includes an unloader 400, an unnecessary resin removal mechanism 500, a transport mechanism 600, and a substrate accommodation section 700.

The unloader 400 holds the resin-molded substrate 2 that has been resin-sealed in the molding die 100 and transports it to the unnecessary resin removal mechanism 500. The unloader 400 is provided so that it can move left and right between the resin molding module 10 (molding die 100) and the discharge module 20 (unnecessary resin removal mechanism 500).

The unnecessary resin removal mechanism 500 removes unnecessary resin (unnecessary resin) from the resin-molded substrate 2. As will be described in detail later, the unnecessary resin removal mechanism 500 includes a mounting unit 520 on which the resin-molded substrate 2 is placed, a removal section 550 that removes unnecessary resin from the resin-molded substrate 2 placed on the mounting unit 520, and the like.

The transfer mechanism 600 transfers the resin-molded substrate 2 from which the unnecessary resin has been removed, from the unnecessary resin removal mechanism 500 to the substrate accommodation section 700. The transfer mechanism 600 is disposed to the right of the unnecessary resin removal mechanism 500 (removal section 550).

The substrate storage section 700 stores the resin-molded substrate 2. The substrate storage section 700 is positioned below the transfer mechanism 600.

<Outline of Operation of Resin Molding Apparatus 1>
Next, an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1) will be described.

The mold 100 is supplied in advance with the substrate 3 to be resin molded and the resin material (e.g., tablet-shaped resin) to be used in molding. The substrate 3 and the resin material can be supplied to the mold 100 using a supply mechanism (not shown).

In the resin molding module 10, the mold clamping mechanism 200 clamps the molding die 100. Then, the tablet-shaped resin is heated and melted by a heating section (not shown) of the molding die 100, and the resulting fluid resin is used to resin-seal the substrate 3. This forms the resin-sealed resin-molded substrate 2.

After the resin sealing is completed, the mold clamping mechanism 200 opens the molding die 100 and releases the resin-molded substrate 2. The resin-molded substrate 2 is then removed from the molding die 100 by the unloader 400 and placed on the placement unit 520 of the unnecessary resin removal mechanism 500.

The placement unit 520 on which the resin-molded substrate 2 is placed moves below the removal section 550. The removal section 550 removes unnecessary resin from the resin-molded substrate 2 placed on the placement unit 520.

After the unnecessary resin is removed, the placement unit 520 moves below the transfer mechanism 600. The transfer mechanism 600 transfers the resin-molded substrate 2 from which the unnecessary resin has been removed, from the placement unit 520 to the substrate storage section 700. In this manner, the resin-molded substrate 2 is manufactured and stored in the substrate storage section 700.

<Regarding Resin-Molded Substrate 2>
The configuration of the unnecessary resin removal mechanism 500 will be described in more detail below, but as a prerequisite, the resin-molded substrate 2 according to this embodiment will be described.

As shown in FIG. 3, the molding die 100 of this embodiment molds resin-molded substrates 2 arranged in three rows (rows L1 to L3) from front to back. Specifically, six rectangular substrates 3 that are long in the left-right direction are arranged in three rows from front to back and two rows from left to right on the lower die 110, and are then resin-molded to form the resin-molded substrates 2. Resin (molded resin portion 4) that encapsulates the chip is formed on the upper surface of the resin-molded substrates 3.

In addition, resin that is not required for the product (unnecessary resin) is formed on the sides of the substrate 3. Specifically, a cull 5 is formed on the front side of the substrate 3 in the resin-molded substrate 2 in the frontmost (front side) row L1. A runner 6 is also formed so as to extend from the cull 5 to the rear surface (lower surface) of the substrate 3. A plurality of through holes 3a for removing the runner 6 from the substrate 3 are formed along the runner 6 in the substrate 3.

The resin-molded boards 2 in the front-to-back center row L2 and the backmost (rear) row L3 are formed in a shape that is like the resin-molded boards 2 in row L1 flipped front-to-back. That is, in the resin-molded boards 2 in rows L2 and L3, a cull 5 is formed on the rear side of the board 3.

In this way, the molding die 100 of this embodiment produces resin-molded substrates 2 with different arrangements (positional relationship between substrate 3 and unnecessary resin).

<Detailed Configuration of Unwanted Resin Removal Mechanism 500>
Next, a more detailed description will be given of the configuration of the unnecessary resin removal mechanism 500. Note that Figures 6 and 7 used in the following description are schematic diagrams for the purpose of explanation, and the positions of the cross sections may be partially inaccurate.

As shown in Figures 4 and 5, the unnecessary resin removal mechanism 500 mainly comprises a lower movable body 510, a mounting unit 520, an upper base section 530, an upper movable body 540, a removal section 550, and a cooling section 560.

<Lower Movable Body 510>
The lower movable body 510 supports a mounting unit 520, which will be described later. The lower movable body 510 can move in the left-right direction by an appropriate movement mechanism (for example, a rail that guides the lower movable body 510 so that the lower movable body 510 can move in the left-right direction, a servo motor that moves the lower movable body 510 along the rail to an arbitrary position, etc.).

<Placement Unit 520>
4 to 6, the resin-molded substrate 2 is placed on the mounting unit 520. The mounting unit 520 is provided on the lower movable body 510. Three mounting units 520 are provided in a row, one behind the other, to correspond to the three rows of resin-molded substrates 2. For ease of explanation, the mounting unit 520 located at the forefront (front side) will be specifically explained below, and detailed explanations of the other mounting units 520 will be omitted as appropriate.

The placement unit 520 mainly comprises a substrate placement section 521, an unnecessary resin placement section 522, and a guide plate 523.

The substrate placement portion 521 is where the substrate 3 portion of the resin-molded substrate 2 is placed. The substrate placement portion 521 is formed in a rectangular parallelepiped shape with a generally flat upper surface. The substrate placement portion 521 is fixed to the lower movable body 510. Although not shown, the substrate placement portion 521 is appropriately provided with grooves corresponding to the shape of the unnecessary resin (runner 6, etc.) of the resin-molded substrate 2 to be placed. This makes it possible to prevent the unnecessary resin from interfering with the substrate placement portion 521 when the resin-molded substrate 2 is placed on the substrate placement portion 521.

The unnecessary resin placing section 522 supports the unnecessary resin portion of the resin-molded substrate 2 (particularly the cull 5 formed on the side of the substrate 3) from below. The unnecessary resin placing section 522 is disposed in front of the substrate placing section 521. The unnecessary resin placing section 522 mainly comprises a support section 522a and a placing section 522b.

The support portion 522a is a portion that supports the mounting portion 522b, which will be described later. The support portion 522a is disposed in front of the substrate mounting portion 521. The support portion 522a is disposed with an appropriate distance between it and the substrate mounting portion 521. The support portion 522a is disposed so as to rise upward from the lower movable body 510. The support portion 522a is disposed with its longitudinal direction facing the left-right direction.

The placement portion 522b is a portion on which the unnecessary resin of the resin-molded substrate 2 is placed. The placement portion 522b is formed in a cylindrical shape with its longitudinal direction (axial direction) facing the left-right direction. The placement portion 522b is fixed to the upper surface of the support portion 522a. The placement portion 522b is positioned so that the height of the upper end of the placement portion 522b is approximately the same as the height of the upper surface of the substrate placement portion 521. The placement portion 522b is positioned with an appropriate gap between it and the substrate placement portion 521.

The guide plate 523 shown in Figures 5 and 6 guides the unnecessary resin removed from the resin-molded substrate 2 in an appropriate direction. The guide plate 523 is disposed between the substrate placement section 521 and the unnecessary resin placement section 522. The guide plate 523 is disposed so as to incline downward from the front (unnecessary resin placement section 522 side) to the rear (substrate placement section 521 side). This enables the guide plate 523 to guide the fallen unnecessary resin to an unnecessary resin storage section (not shown) formed below the substrate placement section 521.

In this embodiment, three mounting units 520 as described above are arranged in a front-to-back arrangement on top of the lower movable body 510. The three mounting units 520 correspond to three rows of resin-molded substrates 2 (see FIG. 3). That is, the frontmost mounting unit 520 mounts the resin-molded substrates 2 in the frontmost row L1. Similarly, the mounting units 520 in the front-to-rear center and the rearmost mounting unit 520 mount the resin-molded substrates 2 in rows L2 and L3, respectively. The three mounting units 520 can be moved together left and right by the lower movable body 510.

In the following, in order to distinguish between the three mounting units 520, the mounting unit 520 closest to you (front side) may be referred to as mounting unit 520F, the mounting unit 520 in the middle between the front and rear may be referred to as mounting unit 520M, and the mounting unit 520 furthest back (rear side) may be referred to as mounting unit 520B.

The orientation of each placement unit 520 is set to correspond to the orientation of the resin-molded substrate 2. Specifically, placement units 520M and 520B are formed in a shape that is similar to the foremost placement unit 520F, which is inverted front to back. That is, in placement units 520M and 520B, the unnecessary resin placement section 522 is disposed behind the substrate placement section 521.

<Upper base portion 530>
5 supports an upper movable body 540, which will be described later. The upper base portion 530 is disposed at a predetermined height via an appropriate support member.

<Upper movable body 540>
The upper movable body 540 supports the removal unit 550, which will be described later. The upper movable body 540 is provided below the upper base unit 530. The upper movable body 540 can be moved in the front-rear direction relative to the upper base unit 530 by an appropriate movement mechanism (e.g., rails 541 that guide the upper movable body 540 so that it can move in the front-rear direction, a servo motor that moves the upper movable body 540 to an arbitrary position along the rails 541, etc.).

For convenience, the upper base portion 530 and the upper movable body 540 are omitted from illustration in Figure 4 etc.

<Removal Unit 550>
4 to 6 presses down the unnecessary resin on the resin-molded substrate 2 to remove the unnecessary resin from the resin-molded substrate 2. Two removal units 550 are provided, one at the front and one at the back. For ease of explanation, the removal unit 550 provided on the near side (front side) will be specifically explained below, and detailed explanation of the other removal unit 550 will be omitted as appropriate.

The removal section 550 mainly comprises a substrate holding section 551 and a resin holding section 552.

The board pressing portion 551 shown in FIG. 6 mainly presses down from above the board 3 portion of the resin-molded board 2 placed on the board placement portion 521. The board pressing portion 551 mainly includes a lifting portion 551a, a board contact portion 551b, an elastic member 551c, and a pin 551d.

The lifting/lowering unit 551a shown in Figures 5 and 6 is capable of moving (raising and lowering) up and down. The lifting/lowering unit 551a is provided at the bottom of the upper movable body 540. The lifting/lowering unit 551a can move up and down relative to the upper movable body 540 by an appropriate movement mechanism (e.g., a rail that guides the lifting/lowering unit 551a so that it can move up and down, a servo motor that moves the lifting/lowering unit 551a along the rail to any position, etc.).

The board contact portion 551b is a portion that comes into contact with the board 3 of the resin-molded board 2. The board contact portion 551b is formed in a generally plate-like shape. The board contact portion 551b is disposed below the lifting portion 551a with its thickness direction facing the up-down direction. The board contact portion 551b is supported via an appropriate member so that it can move up and down (lift) relative to the lifting portion 551a. A recess is appropriately formed on the underside of the board contact portion 551b to avoid interference with the molded resin portion 4 of the resin-molded board 2. The board contact portion 551b has a through hole 551e formed therein into which the pin 551d described later is inserted.

The elastic member 551c shown in FIG. 6 applies a downward force to the board contact portion 551b. The elastic member 551c is formed, for example, from a compression coil spring. The elastic member 551c is disposed between the lifting portion 551a and the board contact portion 551b. The biasing force of the elastic member 551c constantly applies a downward force to the board contact portion 551b.

The pin 551d presses down unnecessary resin (particularly the runner 6) of the resin-molded substrate 2 from above. The pin 551d is formed in a generally cylindrical shape with its longitudinal direction facing the up-down direction. The pin 551d is fixed to the lower part of the lifting/lowering part 551a. The pin 551d is positioned so as to extend downward from the lifting/lowering part 551a. A plurality of pins 551d are provided at positions corresponding to the through holes 3a of the resin-molded substrate 2. The lower part of the pin 551d is inserted into the through hole 551e of the substrate contact part 551b.

The resin pressing part 552 mainly presses down the unnecessary resin (culls 5, runners 6) of the resin-molded board 2 from above. The resin pressing part 552 is disposed in front of the board pressing part 551. The resin pressing part 552 mainly comprises a support part 552a, a connecting part 552b, and a resin contact part 552c.

The support part 552a is a part that supports the resin contact part 552c described below. The support part 552a is fixed to the front part of the lift part 551a.

The connecting portion 552b is a portion that connects the support portion 552a and the resin contact portion 552c described below. The connecting portion 552b is formed in a generally cylindrical shape with its longitudinal direction facing the up-down direction. The connecting portion 552b is arranged so as to extend downward from the support portion 552a. Multiple connecting portions 552b are provided lined up on the left and right (see FIG. 4).

The resin contact portion 552c is a portion that comes into contact with the unnecessary resin of the resin-molded substrate 2. The resin contact portion 552c is formed in a substantially rectangular parallelepiped shape with its longitudinal direction facing left and right. The resin contact portion 552c is formed with chamfered vertices at the front lower and rear lower portions. This forms inclined surfaces at the front lower and rear lower portions of the resin contact portion 552c. The resin contact portion 552c is fixed to the lower portion of the connecting portion 552b. The height of the lower end of the resin contact portion 552c is positioned so that it is approximately the same as the height of the lower end of the substrate contact portion 551b (specifically, the substrate contact portion 551b when it has moved to the lowest position relative to the lifting portion 551a). A cooling hole 552d is formed in the resin contact portion 552c.

The cooling hole 552d is a hole for ejecting gas (e.g., cooling air) toward the resin-molded substrate 2. The cooling hole 552d is formed so as to open to the inclined surface (chamfered portion) facing downward toward the rear of the resin contact portion 552c. The cooling hole 552d is formed so as to connect to a cooling air flow path formed inside the resin contact portion 552c. By operating a blower (not shown), the cooling air is sent to the flow path of the resin contact portion 552c. This cooling air is ejected downward toward the rear from the resin contact portion 552c through the cooling hole 552d.

In this embodiment, two removal units 550 as described above are provided lined up in front and behind the lower part of the upper movable body 540. In the following, in order to distinguish between the two removal units 550, the front removal unit 550 may be referred to as removal unit 550F, and the rear removal unit 550 may be referred to as removal unit 550B.

Removal section 550B is formed in a shape that is the reverse of removal section 550F. That is, in removal section 550B, resin pressing section 552 is positioned behind board pressing section 551.

The two removal units 550 (lifting units 551a) can be driven (lifted) independently of each other. The configuration for driving the two removal units 550 independently of each other is not limited. For example, a configuration in which a drive source (servo motor, etc.) is provided for each of the two removal units 550 and the two drive sources are controlled independently, or a configuration in which a mechanism is provided for independently switching whether or not to transmit a drive force from one (common) drive source to each of the two removal units 550, etc. can be adopted.

<Cooling section 560>
The cooling section 560 shown in Fig. 5 ejects cooling air toward the resin-molded substrate 2 placed on the placement unit 520B. The cooling section 560 is disposed above the placement unit 520B. The cooling section 560 has a configuration generally similar to that of the resin contact section 552c (see Fig. 6, etc.) of the removal section 550. That is, the cooling section 560 is a member whose longitudinal direction faces the left-right direction, and has cooling holes for ejecting cooling air.

<Operation of Unnecessary Resin Removal Mechanism 500>
The following describes how the unnecessary resin is removed from the resin-molded substrate 2 using the unnecessary resin removing mechanism 500 configured as described above.

As shown in FIG. 2, the resin-molded substrates 2 that have been resin-sealed in the molding die 100 are placed on the placement units 520 by the unloader 400. At this time, three rows (rows L1 to L3) of resin-molded substrates 2 (see FIG. 3) are placed on the corresponding placement units 520.

Figure 6 shows the state in which the resin-molded substrate 2 in the frontmost row L1 is placed on the placement unit 520F. The substrate 3 portion of the resin-molded substrate 2 is placed on the substrate placement section 521. The cull 5 portion of the resin-molded substrate 2 is placed on the unnecessary resin placement section 522. In this way, by supporting not only the substrate 3 portion but also the unnecessary resin (cull 5) formed on the side of the substrate 3, the resin-molded substrate 2 can be stably supported.

Although not shown in the figures, the resin-molded substrates 2 in the other rows (row L2, row L3) are similarly placed on the placement units 520M and 520B, respectively. Below, the removal of unnecessary resin from the resin-molded substrates 2 placed mainly on the placement unit 520F will be described, and descriptions of the other resin-molded substrates 2 will be omitted as appropriate.

When the resin-molded substrate 2 is placed on the placement unit 520, the lower movable body 510 (see FIG. 4) moves to the right and stops below the removal unit 550. At this time, as shown in FIG. 4 and FIG. 5, the removal unit 550F and the removal unit 550B are located above the placement unit 520F and the placement unit 520M, respectively.

Next, as shown in FIG. 5, cooling air is sprayed for a predetermined time from the resin contact portion 552c and the cooling portion 560 of the removal portion 550. The resin-molded substrate 2 placed on the placement unit 520F and the placement unit 520M is cooled by the cooling air sprayed from the resin contact portion 552c. The resin-molded substrate 2 placed on the placement unit 520B is also cooled by the cooling air sprayed from the cooling portion 560. In this way, by cooling the resin-molded substrate 2 to a certain extent, it is possible to make it easier to remove unnecessary resin.

Next, removal unit 550F and removal unit 550B each move down. More specifically, the lifting unit 551a of each removal unit 550 moves downward (lowers) relative to the upper movable body 540. As the lifting unit 551a moves down, the substrate contact unit 551b and the resin pressing unit 552 also move down.

As shown in FIG. 7, when the removal unit 550 descends to a certain extent, the substrate 3 portion of the resin-molded substrate 2 placed on the substrate placement unit 521 comes into contact with the substrate contact unit 551b. In this way, the substrate 3 is sandwiched and held between the substrate contact unit 551b and the substrate placement unit 521.

When the lifting/lowering part 551a is further lowered in this state, the lifting/lowering part 551a is lowered relative to the board contact part 551b. This causes the pin 551d on the lifting/lowering part 551a to protrude downward from the board contact part 551b and press down the runner 6 part through the through hole 3a formed in the board 3. Almost simultaneously, the resin pressing part 552 presses down the cull 5 part formed on the side of the board 3 (the front in FIG. 7). In this way, the unnecessary resin of the resin-molded board 2 is pressed down, and the unnecessary resin is peeled off from the resin-molded board 2.

Although the unnecessary resin placing section 522 (placing section 522b) is arranged below the unnecessary resin (cull 5), the cylindrically shaped placing section 522b cannot stably support the unnecessary resin. For this reason, the unnecessary resin peeled off from the resin-molded substrate 2 falls downward due to its own weight. At this time, the resin pressing section 552 arranged behind the unnecessary resin placing section 522 presses down the unnecessary resin, causing the unnecessary resin to fall to the rear side of the unnecessary resin placing section 522. The fallen unnecessary resin is guided by the guide plate 523 and collected in the unnecessary resin storage section (not shown) and discharged.

Although not shown in the figure, the unnecessary resin is removed by the removal section 550B not only from the resin-molded substrate 2 placed on the placement unit 520F, but also from the resin-molded substrate 2 placed on the placement unit 520M.

When the unnecessary resin is removed from the resin-molded substrate 2 placed on the placement unit 520F and the placement unit 520M, the removal section 550F and the removal section 550B each rise. Then, as shown in FIG. 8, the upper movable body 540 moves rearward. Accordingly, the two removal sections 550 move rearward together. When the removal section 550B reaches above the placement unit 520, the upper movable body 540 stops.

Next, of the two removal units 550, only removal unit 550B is lowered. This removes the unnecessary resin from the resin-molded substrate 2 placed on placement unit 520B, as in the case of placement units 520F and 520M. Once the unnecessary resin has been removed from the resin-molded substrate 2, removal unit 550B is raised.

Then, as described above, the mounting unit 520 (lower movable body 510) moves to the right, and the resin-molded substrate 2 from which the unnecessary resin has been removed is transferred to the substrate storage section 700 (see Figure 2).

As described above, the unnecessary resin removal mechanism 500 of this embodiment can remove unnecessary resin from three rows of resin-molded substrates 2 by using two removal units 550 that can be driven independently of each other. In other words, by making the removal units 550 independently drivable, unnecessary resin can be removed regardless of the number (number of rows) of resin-molded substrates 2. This can improve the versatility of the resin molding device 1.

In particular, in this embodiment, the two removal sections 550 are arranged in a front-to-back inverted manner. By providing a plurality of removal sections 550 with different arrangements in this manner, it is possible to appropriately remove the unnecessary resin from each of the resin-molded substrates 2 (row L1, row L2, and row L3 (see FIG. 3)) that are arranged in a front-to-back inverted manner, as in this embodiment.

In addition, in the unnecessary resin removal mechanism 500 of this embodiment, the unnecessary resin removed from the resin-molded substrate 2 is not stably supported by the unnecessary resin placement section 522, so it falls downward by its own weight and is collected. In other words, in this embodiment, there is no need to provide a mechanism for discharging the removed unnecessary resin (for example, an adsorption mechanism for holding the unnecessary resin, or a transport mechanism for discharging it, etc.), so the configuration of the device can be simplified. Below, the configuration of the unnecessary resin placement section 522, etc. for causing the unnecessary resin to fall by its own weight will be specifically described.

<Details of Unwanted Resin Placement Section 522, etc.>
FIG. 9 diagrammatically shows the unnecessary resin (culls 5 and runners 6 ), the unnecessary resin placing portion 522 , and the resin pressing portion 552 of the resin-molded substrate 2 .

In this embodiment, the mounting portion 522b is formed in a cylindrical shape. Therefore, when viewed from the side, the mounting portion 522b comes into contact with the unwanted resin at one point on the side of the cylinder, which is formed in a curved shape. Hereinafter, the portion where the mounting portion 522b comes into contact with the unwanted resin is referred to as the contact portion P1.

If this contact portion P1 is positioned so as not to overlap with the center of gravity G of the unwanted resin in a planar view, the unwanted resin placement portion 522 cannot stably support the unwanted resin, and the unwanted resin can fall under its own weight. Therefore, it is preferable to position the unwanted resin placement portion 522 so that the contact portion P1 does not overlap with the center of gravity G of the unwanted resin in a planar view.

In addition, to make it easier to drop the unwanted resin, it is preferable to make the contact portion P1 (the portion where the placement portion 522b comes into contact with the unwanted resin) as small as possible. For example, in this embodiment, the placement portion 522b is formed into a cylindrical shape, so that it is configured to contact the unwanted resin at one point (contact portion P1) on the upper end portion of the placement portion 522b in a side view. By minimizing the contact area with the unwanted resin in this way, the unwanted resin placed on the unwanted resin placement portion 522 can be made unstable, and therefore can be made to drop more easily under its own weight.

In addition, to make it easier to drop the unwanted resin, it is preferable to place the resin pressing portion 552 that presses down the unwanted resin on the side of the unwanted resin placing portion 522. More specifically, it is preferable that the portion of the resin pressing portion 552 (resin contact portion 552c) that comes into contact with the unwanted resin (hereinafter referred to as contact portion P2) is placed in a position that does not overlap with the contact portion P1 of the unwanted resin placing portion 522 in a plan view. In this embodiment, the lower end surface of the resin contact portion 552c becomes the contact portion P2.

To explain more specifically in accordance with this embodiment, it is preferable that position A of the front end of contact portion P2 of resin contact portion 552c is located rearward of contact portion P1 of mounting portion 522b (i.e., at a position that overlaps with the curved surface of mounting portion 522b (excluding contact portion P1), or at a position that does not overlap mounting portion 522b). By arranging it in this manner, it is possible to prevent unwanted resin from being pinched between contact portion P1 and contact portion P2, making it difficult to drop.

The resin molding device 1 does not necessarily have to have all of the configurations regarding the positional relationship between the unnecessary resin placement section 522 and the center of gravity G, the size of the contact section P1, and the arrangement of the resin pressing section 552 described above. In other words, the resin molding device 1 can drop the unnecessary resin by its own weight as long as it has at least one of the configurations described above.

Below, a modified example of the unnecessary resin placement section 522 is described using Figure 10.

In a first modified example of the unwanted resin placing section 522 shown in FIG. 10(a), the placing section 522b is formed in a triangular shape when viewed from the side. Specifically, the placing section 522b is formed so that a corner (one apex) formed by two slopes faces upward. This corner becomes the contact section P1 that comes into contact with the unwanted resin. The unwanted resin placing section 522 of the first modified example comes into contact with the unwanted resin at one point at the apex of the triangle when viewed from the side, making it easier to drop the unwanted resin.

In a second modified example of the unwanted resin placing section 522 shown in FIG. 10(b), the placing section 522b is formed into a trapezoidal shape in a side view. Specifically, the placing section 522b is formed so that the front-to-back width of the upper surface (upper base in a side view) is smaller than the front-to-back width of the lower surface (lower base). This upper surface becomes the contact portion P1 that comes into contact with the unwanted resin. As the upper surface of the unwanted resin placing section 522 of the second modified example is formed relatively small, it is possible to make it easier to drop the unwanted resin.

In a third modified example of the unnecessary resin placing portion 522 shown in FIG. 10(c), the placing portion 522b is formed in a rectangular shape when viewed from the side. In this case, the upper surface of the placing portion 522b becomes the contact portion P1 that comes into contact with the unnecessary resin. Although the unnecessary resin placing portion 522 of the third modified example has a relatively large upper surface, the unnecessary resin can be dropped by positioning the unnecessary resin placing portion 522 so that the center of gravity G of the unnecessary resin does not overlap with the contact portion P1 when viewed from above.

As described above, the resin molding device 1 according to this embodiment includes an upper mold 120 and a lower mold 110 facing the upper mold 120, a molding mold 100 for resin molding the substrate 3, a mold clamping mechanism 200 for clamping the molding mold 100, and an unnecessary resin removal mechanism 500 for removing unnecessary resin formed on the resin-molded substrate 2. The unnecessary resin removal mechanism 500 includes a plurality of removal units 550 for pressing the unnecessary resin on the resin-molded substrate to remove the unnecessary resin from the resin-molded substrate 2, and the plurality of removal units 550 can be driven independently of each other.

This configuration improves the versatility of the resin molding device 1. In other words, any of the removal units 550 can be driven individually depending on the number, arrangement, etc. of the resin-molded substrates 2, so that unnecessary resin can be appropriately removed regardless of the number, arrangement, etc. of the resin-molded substrates 2.

In addition, the multiple removal units 550 can move vertically independently of each other.

This configuration can improve the versatility of the resin molding device 1. In other words, since the multiple removal units 550 can be moved individually in the vertical direction, it is possible to operate only the necessary removal units 550 depending on the number of resin-molded substrates 2, etc.

The multiple removal units 550 can be moved together in the horizontal direction.

By configuring in this way, it is possible to simplify the structure of the resin molding device 1. In other words, by configuring multiple removal units 550 to move horizontally together, it is possible to simplify the configuration for moving the removal units 550 in the horizontal direction.

The removal section 550 also includes a substrate pressing section 551 that presses and holds the substrate 3 portion of the resin-molded substrate 2, and a resin pressing section 552 that is formed to the side of the substrate pressing section 551 and presses and removes the unnecessary resin from the resin-molded substrate 2.

By configuring it in this way, unnecessary resin formed on the sides of the resin-molded substrate 2 can be easily removed.

The plurality of removal sections 550 include a removal section 550F (first removal section) in which the resin pressing section 552 is disposed on one side (front) of the substrate pressing section 551, and a removal section 550B (second removal section) in which the resin pressing section 552 is disposed on the other side (rear) of the substrate pressing section 551.

This configuration can improve the versatility of the resin molding device 1. In other words, by using the removal unit 550F and the removal unit 550B depending on the shape of the resin-molded substrate 2 (particularly the position of the unnecessary resin relative to the substrate 3), it is possible to handle multiple types of resin-molded substrates 2.

The resin-molded substrate 2 includes a resin-molded substrate 2 (first resin-molded substrate) in row L1 in which the unnecessary resin is formed on one side (front) of the substrate 3 portion, and a resin-molded substrate 2 (second resin-molded substrate) in rows L2 and L3 in which the unnecessary resin is formed on the other side (rear) of the substrate 3 portion.

This configuration improves the versatility of the resin molding device 1. In other words, it is possible to remove unnecessary resin from resin-molded substrates 2 that have different shapes (particularly, the position of the unnecessary resin relative to the substrate 3).

The resin pressing portion 552 is capable of cooling the resin-molded substrate 2 by injecting gas onto the resin-molded substrate 2.

By configuring it in this way, it is possible to cool the resin-molded substrate 2 to a certain extent, making it easier to remove the unnecessary resin. In addition, by using the structure for cooling the unnecessary resin, etc. as the resin pressing section 552, the structure of the resin molding device 1 can be simplified.

The method for manufacturing a resin molded product according to this embodiment uses the resin molding device 1 to manufacture a resin molded product.

By configuring it in this way, the versatility of the resin molding device 1 can be improved.

The resin molding device 1 according to this embodiment includes an upper mold 120 and a lower mold 110 facing the upper mold 120, and is equipped with a molding mold 100 for resin molding the substrate 3, a mold clamping mechanism 200 for clamping the molding mold 100, and an unnecessary resin removal mechanism 500 for removing unnecessary resin formed on the resin-molded substrate 2. The unnecessary resin removal mechanism 500 is equipped with a substrate placement section 521 on which the substrate 3 portion of the resin-molded substrate 2 is placed, and an unnecessary resin placement section 522 that is disposed to the side of the substrate placement section 521, on which the unnecessary resin of the resin-molded substrate 2 is placed, and on which the unnecessary resin removed from the resin-molded substrate 2 falls by its own weight.

By configuring in this way, the configuration of the resin molding device 1 can be simplified. In other words, since a mechanism for discharging the unnecessary resin removed from the resin-molded substrate 2 (such as an adsorption mechanism for adsorbing the unnecessary resin) is not required, the configuration of the resin molding device 1 can be simplified and costs can be reduced.

The unnecessary resin placement section 522 supports the unnecessary resin from below at a position that does not overlap with the center of gravity G of the unnecessary resin removed from the resin-molded substrate 2 in a plan view.

This configuration makes it easier for the unwanted resin to fall under its own weight. In other words, because the unwanted resin placement section 522 does not support the center of gravity G of the unwanted resin, the unwanted resin becomes unstable and is more likely to fall.

The unnecessary resin placement section 522 is formed so that the portion that comes into contact with the placed unnecessary resin (contact portion P1) is a curved surface (see FIG. 9) or a corner where multiple surfaces intersect (see FIG. 10(a)).

This configuration makes it easier for the unwanted resin to fall under its own weight. In other words, by making the contact portion P1 of the unwanted resin placement portion 522 smaller, the unwanted resin becomes unstable and easier to fall.

The unnecessary resin placement portion 522 (placement portion 522b) is formed in a cylindrical shape and is positioned so that the curved side surface comes into contact with the unnecessary resin.

This configuration makes it easier for the unwanted resin to fall under its own weight. In other words, by making the contact portion P1 of the unwanted resin placement portion 522 smaller, the unwanted resin becomes unstable and easier to fall.

The unnecessary resin removal mechanism 500 is also provided with a resin pressing part 552 that is disposed to the side of the unnecessary resin placement part 522 and presses the unnecessary resin from above to remove it from the substrate 3 part.

This configuration makes it easier for the unwanted resin to fall under its own weight. In other words, by pressing the unwanted resin on the sides of the unwanted resin placement section 522, the unwanted resin can be easily dropped from the unwanted resin placement section 522.

The resin pressing portion 552 is positioned so that when pressing the unwanted resin, the portion that comes into contact with the unwanted resin (contact portion P2) does not overlap in a plan view with the portion that comes into contact with the unwanted resin placing portion 522 and the unwanted resin (contact portion P1).

This configuration makes it easier for the unwanted resin to fall under its own weight. In other words, it is possible to prevent the unwanted resin from being pinched and held between the unwanted resin placement section 522 and the resin pressing section 552, allowing the unwanted resin to fall easily.

The unnecessary resin is formed on one side of the substrate 3 portion.

By configuring it in this way, the configuration of the resin molding device 1 that removes unnecessary resin formed on one side of the substrate 3 can be simplified.

The method for manufacturing a resin molded product according to this embodiment uses the resin molding device 1 to manufacture a resin molded product.

By configuring it in this way, the configuration of the resin molding device 1 can be simplified.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical concept of the invention described in the claims.

For example, the components (such as the resin molding module 10) used in the resin molding device 1 of the above embodiment are examples, and can be attached, detached, or replaced as appropriate. For example, it is possible to further provide a supply module for supplying the substrate 3 or tablet-shaped resin to the resin molding module 10, or to change the number of resin molding modules 10. In addition, the configurations and operations of the components used in the resin molding device 1 of this embodiment are examples, and can be changed as appropriate.

In addition, in this embodiment, a configuration in which the two removal units 550 are moved together in the horizontal direction has been exemplified, but the present invention is not limited to this, and it is also possible to configure, for example, the two removal units 550 to move independently in the horizontal direction. This can further improve the versatility of the resin molding device 1.

In addition, in this embodiment, a resin molding device 1 having two removal units 550 is exemplified, but the present invention is not limited to this, and it is also possible to provide, for example, three or more removal units 550 and configure them to be driven independently.

In addition, in this embodiment, removal unit 550F in which resin holding unit 552 is arranged "in front" of substrate holding unit 551 and removal unit 550B in which resin holding unit 552 is arranged "behind" substrate holding unit 551 are exemplified, but the present invention is not limited to this, and the relative positional relationship between resin holding unit 552 and substrate holding unit 551 can be changed as desired. For example, it is also possible to use a removal unit 550 in which resin holding unit 552 is arranged "to the left" of substrate holding unit 551, a removal unit 550 in which resin holding unit 552 is arranged "to the right" of substrate holding unit 551, etc.

In addition, in this embodiment, the resin-molded board 2 in row L1 in which the unnecessary resin is formed in the "front" of the board 3 and the resin-molded board 2 in rows L2 and L3 in which the unnecessary resin is formed in the "rear" of the board 3 are exemplified, but the present invention is not limited to this, and the relative positional relationship between the board 3 and the unnecessary resin can be changed as desired. For example, it is also possible to use a resin-molded board 2 in which the unnecessary resin is formed in the "left" of the board 3, a resin-molded board 2 in which the unnecessary resin is formed in the "right" of the board 3, etc.

In this way, the orientation of the removal section 550 and the resin-molded substrate 2 can be set arbitrarily, improving the versatility of the resin molding device 1.

In addition, the number and arrangement of the resin-molded substrates 2 and the corresponding number and arrangement of the mounting units 520 shown in this embodiment are merely examples and can be changed as desired.

In addition, in this embodiment, several shapes of the unnecessary resin placing section 522 (placement section 522b) are exemplified (see Figures 9 and 10), but the present invention is not limited to these, and the shape of the placement section 522b can be changed as desired. In other words, the shape of the unnecessary resin placing section 522 (placement section 522b) is not particularly limited as long as the unnecessary resin removed from the resin-molded substrate 2 can fall by its own weight. For example, it is also possible to form the placement section 522b in a semi-cylindrical shape (semi-circular shape in side view) with a curved surface facing upward, rather than a cylindrical shape (circular shape in side view, see Figure 9).

REFERENCE SIGNS LIST 1 Resin molding device 2 Resin-molded substrate 3 Substrate 5 Cull 6 Runner 10 Resin molding module 20 Discharge module 100 Molding mold 110 Lower mold 120 Upper mold 200 Mold clamping mechanism 500 Unnecessary resin removal mechanism 520 Placement unit 521 Substrate placement section 522 Unnecessary resin placement section 550 Removal section 551 Substrate pressing section 552 Resin pressing section

Claims (8)

a molding die including an upper die and a lower die opposed to the upper die, for resin-molding a substrate;
a mold clamping mechanism that clamps the molding die;
an unnecessary resin removing mechanism for removing unnecessary resin formed on the resin-molded substrate,
The unnecessary resin removing mechanism includes:
a substrate placement section on which a substrate portion of the resin-molded substrate is placed;
a waste resin placement part disposed to a side of the substrate placement part, on which waste resin of the resin-molded substrate is placed;
a removal unit that removes the unnecessary resin from the resin-molded substrate by pressing the unnecessary resin of the resin-molded substrate that is placed on the substrate,
The removal unit is movable in vertical and horizontal directions,
the removing unit removes the unnecessary resin from the plurality of resin-molded substrates arranged side by side,
the number of the resin-molded substrates arranged side by side is greater than the number of the removed portions;
The unnecessary resin removed from the resin-molded substrate by the removal unit falls due to its own weight.
Resin molding equipment. the unnecessary resin placing portion supports, from below, a position of the unnecessary resin that does not overlap, in a plan view, with a center of gravity of the unnecessary resin removed from the resin-molded substrate;
The resin molding apparatus according to claim 1 . the waste resin placing portion is formed so that a portion in contact with the placed waste resin is a curved surface or a corner portion where a plurality of surfaces intersect.
The resin molding apparatus according to claim 1 or 2. the waste resin placement portion is formed in a cylindrical shape and is disposed so that a curved side surface of the waste resin comes into contact with the waste resin;
The resin molding apparatus according to claim 3. the removal unit includes a resin pressing unit disposed to the side of the unnecessary resin placing unit and configured to press the unnecessary resin from above to remove it from the substrate portion;
The resin molding apparatus according to any one of claims 1 to 4. the resin pressing portion is disposed so that a portion that contacts the unnecessary resin when pressing the unnecessary resin does not overlap a portion that contacts the unnecessary resin placing portion and the unnecessary resin in a plan view.
The resin molding apparatus according to claim 5. The unnecessary resin is formed on one side of the substrate portion.
The resin molding apparatus according to any one of claims 1 to 6. A method for manufacturing a resin molded product, which uses the resin molding device according to any one of claims 1 to 7.

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