JP7499161B2 - Detection Data Storage Device - Google Patents

Description

This disclosure relates to the storage process of detection data during modeling operations of a three-dimensional modeling device.

Conventionally, technology has been proposed for determining defects in 3D printing devices that use additive manufacturing methods to perform printing. In the system of Patent Document 1 below, a camera is provided in a position where it can capture an image of the object printed by the 3D printing device. If the system determines that the object is defective based on the image of the object captured by the camera, it stops the manufacturing process.

JP 2019-010890 A (paragraph 0033)

In the above-mentioned system, if the shape of the printed object differs from the desired rendered shape based on the image, the object is judged to be defective. However, even if a defective object is discovered through image processing, if the cause of the defective object cannot be identified, the defective object may occur again. For this reason, there is a demand for technology that can identify the cause of a defect when a defect such as a defective object occurs.

This disclosure has been made in light of these circumstances, and aims to provide a detection data storage device that can assist in identifying the cause of defects that occur in three-dimensional modeling devices.

This specification discloses a detection data storage device comprising: a plurality of state detection devices that output detection data corresponding to the state of a modeling operation in a three-dimensional modeling device; a storage processing unit that associates the plurality of detection data output from each of the plurality of state detection devices with each other and stores them in a storage device; and an extraction processing unit that extracts the detection data corresponding to the content of the inquiry from the plurality of detection data stored in the storage device based on receiving an inquiry about the modeling operation of the three-dimensional modeling device, wherein the storage processing unit associates layer number information indicating the number of layers being modeled by the three-dimensional modeling device and indicating the number of layers at the time the detection data was detected with the detection data and stores it in the storage device, and the extraction processing unit accepts a designation of the number of layers in a process of accepting an inquiry about the modeling operation, and extracts the detection data associated with the layer number information indicating the specified number of layers .
This specification also discloses a detection data storage device comprising: a plurality of state detection devices that output detection data corresponding to the state of a modeling operation in a three-dimensional modeling apparatus; a storage processing unit that associates the detection data output from each of the plurality of state detection devices with each other and stores the detection data in a storage device; and an extraction processing unit that extracts the detection data corresponding to the inquiry content from the plurality of detection data stored in the storage device based on receiving an inquiry about the modeling operation of the three-dimensional modeling apparatus, wherein the storage processing unit associates the command information, which indicates an execution command that determines the operation content of the modeling operation for the three-dimensional modeling apparatus, with the detection data and stores the command information, which indicates the execution command when the detection data is detected, in the storage device; and the extraction processing unit accepts designation of the execution command in a process of accepting an inquiry about the modeling operation, and extracts the detection data associated with the command information indicating the specified execution command.
The present specification also relates to a method for manufacturing a three-dimensional modeling apparatus comprising: a plurality of state detection devices that output detection data corresponding to a state of a modeling operation in a three-dimensional modeling apparatus; a storage processing unit that stores the plurality of detection data output from each of the plurality of state detection devices in a storage device in association with one another; an extraction processing unit that extracts the detection data corresponding to the inquiry content from the plurality of detection data stored in the storage device based on receipt of an inquiry about the modeling operation of the three-dimensional modeling apparatus; malfunction content information indicating the content of a malfunction occurring in the modeling operation of the three-dimensional modeling apparatus; presumed cause information indicating a presumed cause of the malfunction indicated by the malfunction content information; and and classification data having investigation location information for identifying the detection data required to investigate the cause indicated by the detection data, wherein the memory processing unit stores the detection data in the storage device in association with the corresponding investigation location information, and the extraction processing unit accepts a type of the defect content information in a process of accepting an inquiry about a modeling operation, identifies the probable cause information corresponding to the accepted type of defect content information based on the classification data, identifies the investigation location information corresponding to the identified probable cause information based on the classification data, and extracts the detection data associated with the identified investigation location information.

According to the detection data storage device of the present disclosure, the modeling operation of the three-dimensional modeling device is detected by a plurality of state detection devices, and the detected plurality of detection data are stored in a storage device in association with each other. The detection data storage device accumulates the detection data regardless of the occurrence of a malfunction. When a malfunction such as an error occurs during the modeling operation of the three-dimensional modeling device, the user inquires of the detection data storage device. When the detection data storage device receives an inquiry about a malfunction from the user, it extracts detection data according to the content of the inquiry. This allows the user to make an inquiry when a malfunction occurs and check detection data before and after the malfunction occurs. In addition, the user can easily create a report of the malfunction to be sent to the vendor based on the extracted detection data. In addition, the vendor can also appropriately and quickly obtain detection data related to the malfunction, i.e., the data necessary to deal with the malfunction, and can quickly deal with the malfunction.

FIG. 2 is a plan view illustrating the manufacturing apparatus according to the first embodiment; FIG. 2 is a block diagram of a manufacturing apparatus. FIG. 2 is a block diagram of a manufacturing apparatus. 1A to 1C are schematic diagrams showing an electronic device to be manufactured. FIG. 4 is a block diagram showing a flow of processing of detected data. FIG. 13 is a diagram showing the contents of a detection log. FIG. 2 is a diagram showing the contents of classification data. FIG. 13 is a diagram showing a reception screen. FIG. 13 is a diagram showing a screen displaying detection data. FIG. 13 is a diagram illustrating a configuration of a second embodiment.

(1. Configuration of Electronic Device Manufacturing Apparatus)
Hereinafter, a first embodiment in which the detection data storage device of the present disclosure is embodied in an electronic device manufacturing apparatus will be described in detail with reference to the drawings. FIG. 1 is a plan view that typically illustrates an electronic device manufacturing apparatus (hereinafter, sometimes referred to as a manufacturing apparatus) 10 of this embodiment in a plan view. As illustrated in FIG. 1, the manufacturing apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 23, a mounting unit 24, an inspection unit 25, and a control device 27 (see FIGS. 2 and 3). The conveying device 20, the first modeling unit 22, the second modeling unit 23, the mounting unit 24, and the inspection unit 25 are disposed on a base 28 of the manufacturing apparatus 10. The base 28 is generally rectangular in plan view. In the following description, the longitudinal direction of the base 28 is referred to as the X-axis direction, the lateral direction of the base 28 is referred to as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction is referred to as the Z-axis direction.

The manufacturing apparatus 10 is an apparatus that controls the first modeling unit 22, the second modeling unit 23, and the mounting unit 24 to manufacture an electronic device on a base member 55 held by a stage 43 described later. The manufacturing apparatus 10 manufactures an electronic device 100 in which an electronic component 101 is mounted on a circuit board 102, as shown in FIG. 4, for example. The circuit board 102 includes an insulating layer 103, wiring 105 arranged on each layer of the insulating layer 103, through holes 106 connecting the wiring 105 of each layer, and a connection terminal 109 connected to a terminal 107 of the electronic component 101. In the following description, as an example, a case in which the electronic device 100 shown in FIG. 4 is manufactured as a molded object will be described.

As shown in FIG. 4, the manufacturing apparatus 10 manufactures the electronic device 100 on the release film 57, which is attached to the upper surface of the base member 55 and can be peeled off by heat, for example. The release film 57 is a member that is peeled off from the base member 55 by being heated to a predetermined temperature or higher. By peeling the release film 57 from the base member 55, the electronic device 100 can be separated from the base member 55. The method of separating the base member 55 and the electronic device 100 is not limited to the method using the release film 57. For example, a support material that dissolves with heat or water may be placed between the base member 55 and the electronic device 100, and the support material may be melted to separate them. The electronic device 100 may also be manufactured directly on the base member 55 without using a separating member such as the release film 57.

First, the transport device 20 shown in FIG. 1 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 includes an electromagnetic motor 38 (see FIG. 2), and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38.

The Y-axis slide mechanism 32 also has a Y-axis slide rail 41 and a stage 43. The Y-axis slide rail 41 is disposed on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 41 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 41 is movable in the X-axis direction. The stage 43 is held by the Y-axis slide rail 41 so as to be slidable in the Y-axis direction. The Y-axis slide mechanism 32 has an electromagnetic motor 39 (see FIG. 2), and the stage 43 is moved to any position in the Y-axis direction by driving the electromagnetic motor 39. As a result, the stage 43 is moved to any position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 43 has a base 51, a holding device 52, a lifting device 53, and a heating/cooling device 54. The base 51 is formed in a flat plate shape, and a base member 55 is placed on the upper surface. The holding devices 52 are provided on both sides of the base 51 in the X-axis direction. The holding devices 52 hold the base member 55 fixedly relative to the base 51 by clamping both edges in the X-axis direction of the base member 55 placed on the base 51. The lifting device 53 is disposed below the base 51, and raises and lowers the base 51 in the Z-axis direction.

The heating and cooling device 54 is a device that heats and cools the base member 55. The heating and cooling device 54, for example, heats the base member 55 to heat the release film 57 (see FIG. 4), and peels the release film 57 from the base member 55. The heating and cooling device 54 has, for example, a heater (electric heating wire) provided within the base member 55 as a device for heating the base member 55. The heating and cooling device 54 adjusts the heating temperature of the base member 55 by controlling the current flowing through the heater.

The heating and cooling device 54 cools the base member 55 so that the insulating layer 103 (see FIG. 4) does not expand due to heat generated when forming the wiring 105, etc. The heating and cooling device 54 includes, as a device for cooling the base member 55, a water-cooling pipe provided on the base member 55, a pump device for supplying water into the water-cooling pipe, and a constant temperature circulation layer for storing the water to be supplied. The heating and cooling device 54 changes the cooling temperature for cooling the base member 55 by changing the circulation speed of the cold water or the temperature of the cold water. The heating and cooling configuration of the heating and cooling device 54 is not particularly limited. For example, the heating and cooling device 54 may heat the base member 55 by electromagnetic induction, or may cool the base member 55 using gas as a refrigerant.

The transport device 20 also includes a stage camera 56 (see FIG. 2) that images the stage 43. The stage camera 56 is, for example, a camera that images the stage 43 from the side (X-axis direction or Y-axis direction). The stage camera 56 is positioned in a position that allows it to image the stage 43, the base member 55, the model on the base member 55, and the device working on the base member 55 (such as the inkjet head 63 of the first modeling unit 22 described later) from the side. The stage camera 56 moves together with the stage 43.

The number of stage cameras 56 may be one or more. When multiple stage cameras 56 are arranged, the stage cameras 56 may be arranged in different positions so that the stage 43 can be imaged from various directions. The imaging device of the present application may be a camera equipped with a lens, or may be configured to include only an imaging element such as a CCD. The same applies to the other cameras (such as the first head camera 64) described below.

The first modeling unit 22 is a unit that models an insulating layer 103 (see FIG. 4) on a base member 55 placed on a base 51, and has a first printing unit 61 and a curing unit 62. The first printing unit 61 has, for example, an inkjet head 63 (see FIG. 2), and ejects a thin film of ultraviolet curable resin onto the base member 55. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The method by which the first printing unit 61 ejects the ultraviolet curable resin may be, for example, a piezo method using a piezoelectric element, or a thermal method in which the resin is heated to generate bubbles and ejected from multiple nozzles.

The first printing unit 61 also includes a first head camera 64 (see FIG. 2). The first head camera 64 is positioned so that it can capture an image of the state in which the UV-curable resin is being ejected from the nozzles of the inkjet head 63, and the droplets of the UV-curable resin ejected onto the base member 55. The first head camera 64 that captures the nozzles and the first head camera 64 that captures the droplets of the ejected UV-curable resin may be separate cameras.

The curing unit 62 has a flattening device 65 (see FIG. 2) and an irradiation device 66 (see FIG. 2). The flattening device 65 flattens the top surface of the UV-curable resin ejected onto the base member 55 by the first printing unit 61. The flattening device 65 includes, for example, a roller (not shown) that scrapes off excess resin while leveling the surface of the UV-curable resin, and a cleaning unit (blade and collection box) that collects droplets of UV-curable resin that adhere to the roller, thereby making the thickness of the UV-curable resin uniform.

The flattening device 65 also includes a unit camera 67 (see FIG. 2). The unit camera 67 is an imaging device that captures images of the flattening process performed by the flattening device 65. The unit camera 67 captures images of the UV-curable resin attached to the roller, the UV-curable resin flattened by the roller, and the state of the UV-curable resin collected by the cleaning unit.

The irradiation device 66 is equipped with a mercury lamp or LED as a light source, and irradiates ultraviolet light onto the ultraviolet curable resin discharged onto the base member 55. The first modeling unit 22 repeats the steps of discharge by the first printing unit 61, flattening by the flattening device 65, and curing by the irradiation device 66, thereby forming an insulating layer 103 (see FIG. 4) on the base member 55.

The irradiation device 66 also has a blower 68 (see FIG. 2). When the insulating layer 103 is irradiated with ultraviolet light from the irradiation device 66 to harden the resin, the temperature of the insulating layer 103 increases, which may cause distortion or warping. The blower 68 blows air toward the model (the insulating layer 103 being modeled) during and after irradiation with ultraviolet light by the irradiation device 66 to cool the model.

As shown in FIG. 4, the electronic device 100 has wiring 105, through holes 106, connection terminals 109, etc. (hereinafter, these may be collectively referred to as conductors). The second modeling unit 23 shown in FIG. 1 is a unit that models the conductors, and has a second printing unit 71 and a baking unit 72. In the following explanation, the same content as the first modeling unit 22 will be omitted as appropriate.

The second printing unit 71 has, for example, an inkjet head 74 (see FIG. 2), and is a device that ejects metal ink onto the base member 55, onto each layer of the insulating layer 103, through holes formed in each layer of the insulating layer 103, the surface of the insulating layer 103, and the like. The metal ink referred to here is, for example, a material that contains nanometer-sized metal (such as silver) particles dispersed in a solvent as the main component, and hardens when baked with heat. The metal ink contains, for example, metal nanoparticles with a size of several hundred nanometers or less. The surfaces of the metal nanoparticles are, for example, coated with a dispersant to suppress aggregation in the solvent.

The second printing unit 71 also has, for example, a dispenser 75 (see FIG. 2), which is a device that dispenses conductive resin paste onto the surface of the insulating layer 103, the wiring 105, and the like. The conductive resin paste is, for example, a resin adhesive that hardens when heated, in which micrometer-sized metal particles (such as silver) are dispersed. The metal particles are, for example, in the form of flakes. The adhesive contains, for example, an epoxy resin as its main component. When the conductive resin paste is hardened by the application of heat, the resin shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. This allows the conductive resin paste to exhibit conductivity.

When the conductive paste is heated, the adhesive (such as resin) hardens and the flake-shaped metal is hardened in a state of contact with each other. On the other hand, when the metal ink is heated, the metal nanoparticles are fused together to form an integrated metal, and the conductivity is higher than when the metal nanoparticles are simply in contact with each other. Also, a conductor formed from a conductive resin paste has a lower conductivity than a conductor formed from a metal ink, but has a strong adhesive force and excellent adhesion due to the hardening of the resin. Therefore, the manufacturing device 10 forms a conductor suited to the application by, for example, using a metal ink with high conductivity and a conductive resin paste with high adhesion. For example, the manufacturing device 10 uses a conductive resin paste for the connection terminal 109 that requires adhesive strength, and a metal ink for the wiring 105 and through-hole 106 that require conductivity.

The second printing unit 71 may eject or apply the metal ink or conductive resin paste by a method other than the inkjet head 74 or the dispenser 75. The type of metal contained in the metal ink or conductive resin paste is not limited to silver, but may be copper, gold, or multiple types. The second printing unit 71 may be configured to use only either the metal ink or the conductive resin paste.

The second printing unit 71 also includes a second head camera 77 and a third head camera 78 (see FIG. 2). The second head camera 77, like the first head camera 64, is positioned so that it can capture images of the state in which metal ink is being ejected from the nozzles of the inkjet head 74. The third head camera 78 is positioned so that it can capture images of the state in which conductive resin paste is being ejected from the dispenser 75.

The baking unit 72 is a device that heats the metal ink or conductive resin paste discharged from the second printing unit 71, for example, by an infrared heater. The metal ink or conductive resin paste is baked by applying heat from the infrared heater to form wiring 105 and the like. The baking here refers to, for example, a phenomenon in which heat is applied to the metal ink to evaporate the solvent and form a protective film for the metal nanoparticles, i.e., decompose the dispersant, and the metal nanoparticles come into contact or fuse together, thereby increasing the conductivity. Alternatively, baking refers to a phenomenon in which heat is applied to the conductive resin paste to shrink the resin and fix the flake-shaped metal particles dispersed in the resin by contacting each other. The device that heats the metal ink or conductive resin paste is not limited to an infrared heater. For example, the manufacturing device 10 may be equipped with an infrared lamp, a laser irradiation device, or an electric furnace that heats the metal ink or conductive resin paste by placing it in the furnace.

The baking unit 72 also has a blower 79 (see FIG. 2). The temperature of conductors such as the wiring 105 increases during baking, which may cause cracks or breakage. The blower 79 blows air toward the molded object (the conductor being molded) during baking by the baking unit 72, thereby cooling the molded object.

The mounting unit 24 is a unit that places the electronic components 101 on the base member 55 placed on the base 51, and has a supply section 81 and a mounting section 82. The supply section 81 has a plurality of tape feeders 83 (see FIG. 3) that feed the taped electronic components one by one, and supplies the electronic components 101 at each supply position. The electronic components 101 are, for example, sensor elements such as temperature sensors. The supply section 81 is not limited to a device that supplies the electronic components 101 from the tape feeders 83, but may be a tray-type supply device that picks up and supplies the electronic components 101 from a tray.

The mounting unit 82 has a mounting head 85, a moving device 86, and a mounting camera 87 (see FIG. 3). The mounting head 85 has a suction nozzle for suctioning and holding the electronic component 101. The moving device 86 moves the mounting head 85 between the supply position of the tape feeder 83 and the base member 55 placed on the base 51. As a result, the mounting unit 82 holds the electronic component 101 with the mounting head 85 and places the electronic component 101 held by the mounting head 85 on the base member 55. The mounting camera 87 is placed in a position where it can capture images of the state of the electronic component 101 sucked by the suction nozzle of the mounting head 85, the state of the electronic component 101 on the circuit board 102 placed by the mounting head 85, etc.

The inspection unit 25 is a unit that inspects the electronic device 100. For example, as shown in FIG. 4, the electronic device 100 electrically connects the electronic component 101 to the wiring 105 via the connection terminal 109, and the electronic component 101 is mounted on the circuit board 102. The inspection unit 25 includes an inspection camera 89 (see FIG. 3), which captures an image of the circuit board 102 on which the electronic component 101 is mounted. The control device 27 (see FIG. 3) of the manufacturing device 10 judges whether the mounting state of the electronic component 101 is good or bad based on the image captured by the inspection camera 89. The control device 27 may also judge whether the wiring 105 is good or bad (whether there is a crack or a cut) and whether the through hole 106 is good or bad (such as the size of the formed through hole 106) based on the image captured by the inspection camera 89.

Next, the configuration of the control device 27 of the manufacturing apparatus 10 will be described. As shown in Figures 2 and 3, the control device 27 includes a controller 91, multiple drive circuits 92, and a memory device 93. The multiple drive circuits 92 are connected to the electromagnetic motors 38, 39, the holding device 52, the lifting device 53, the first modeling unit 22, the second modeling unit 23, the mounting unit 24, and the inspection unit 25.

The controller 91 is a computer-based device including a CPU, a ROM, a RAM, etc., and is connected to a number of drive circuits 92. The storage device 93 is an internal memory including a RAM, a ROM, a hard disk, etc., and stores a control program 111, design data 112, a detection log 113, and classification data 114. The control program 111 is a program that controls the manufacturing device 10. The controller 91 can control the operation of the conveying device 20, the first modeling unit 22, etc., by executing the control program 111 with the CPU. In the following description, the controller 91 executing the control program 111 to control each device may be simply described as "the device". For example, "the controller 91 moves the stage 43" means that "the controller 91 executes the control program 111 with the CPU, controls the operation of the conveying device 20 via the drive circuit 92, and moves the stage 43 by the operation of the conveying device 20."

The design data 112 is 3D data for each layer obtained by slicing the finished electronic device 100. The controller 91 determines the position for dispensing the ultraviolet curable resin based on the design data 112 in the storage device 93, and forms the circuit board 102. The controller 91 also determines the layer and position for placing the electronic component 101 based on the design data 112, and mounts the electronic component 101 on the circuit board 102.

The detection log 113 is a database that accumulates detection data from various sensors, which will be described later. The classification data 114 is information that determines the classification of the detection data accumulated in the detection log 113. Details of the detection log 113 and the classification data 114 will be described later.

As shown in FIG. 3, the manufacturing apparatus 10 is equipped with various sensors. The types and number of sensors shown in FIG. 3 are merely examples. To avoid cluttering the drawing, FIG. 3 shows the various sensors together, for example, by combining multiple level gauges 116 into one. The manufacturing apparatus 10 is equipped with various sensors, for example, a light quantity sensor 115, a level gauge 116, a negative pressure sensor 117, a temperature sensor 118, a voltage sensor 119, a flow rate sensor 120, and an air flow sensor 121.

The light quantity sensor 115 detects the amount of ultraviolet light emitted from the irradiation device 66. The liquid level gauge 116 is provided on each of the inkjet head 63 of the first printing unit 61, the inkjet head 74 of the second printing unit 71, and the dispenser 75. The liquid level gauge 116 detects the liquid level of an ink tank that stores, for example, an ultraviolet curing resin, a metal ink, or a conductive resin paste. The negative pressure sensor 117 is provided on each of the inkjet head 63 of the first printing unit 61, the inkjet head 74 and the dispenser 75 of the second printing unit 71, and the mounting head 85. For example, the inkjet head 63 controls the negative pressure in the nozzle to control the presence or absence of ejection of the ultraviolet curing resin, the ejection speed, etc. Also, the mounting head 85 controls the suction state of the electronic device 100 by controlling the negative pressure in the suction nozzle. The negative pressure sensor 117 detects the magnitude of the negative pressure in these nozzles.

The temperature sensor 118 detects the temperature of the shaped object (insulating layer 103 and conductor) during hardening by the irradiation device 66 and during baking by the baking unit 72. The temperature sensor 118 also detects the temperature of the base member 55 when the base member 55 is heated or cooled by the heating/cooling device 54. The voltage sensor 119 detects, for example, the voltage value applied to the infrared heater of the baking unit 72 during baking. The voltage sensor 119 also detects, for example, the voltage value applied to the heater when heating by the heating/cooling device 54. The flow rate sensor 120 detects the flow rate of water flowing through the piping of the heating/cooling device 54. The air flow sensor 121 also detects the volume of air blown from the blower 68 of the irradiation device 66 and the blower 79 of the baking unit 72.

The above-mentioned types, arrangements, and detection targets of the sensors are merely examples. For example, if the heating/cooling device 54 is configured to perform cooling by gas, the manufacturing apparatus 10 may be equipped with a flow sensor that measures the flow rate of the refrigerant gas and a pressure sensor that measures the pressure of the gas. The manufacturing apparatus 10 may also be equipped with, for example, an ammeter that detects the current value of the current flowing through the infrared heater of the baking section 72.

As shown in FIG. 3, the manufacturing apparatus 10 is also equipped with a touch panel 123. The touch panel 123 outputs a signal corresponding to an operation input from a user to the controller 91. This allows the controller 91 to receive defect content information, etc., which will be described later, through the touch panel 123. The touch panel 123 also changes the display content displayed on the liquid crystal panel based on the control of the controller 91. The touch panel 123 can display detection data extracted from the detection log 113 on the liquid crystal panel.

(2. Molding operation of manufacturing equipment, monitoring of molding operation)
The manufacturing apparatus 10 of this embodiment, with the above-mentioned configuration, executes the manufacture of the electronic device 100. The controller 91 executes the control program 111 with the CPU, and controls the first modeling unit 22 and the like based on the design data 112, thereby manufacturing the electronic device 100.

Specifically, when the base member 55 is set on the base 51 of the stage 43, the controller 91 moves the stage 43 to manufacture the electronic device 100 on the base member 55. The controller 91 controls the transport device 20 to move the stage 43 to the first modeling unit 22, the second modeling unit 23, and the mounting unit 24. The first modeling unit 22 ejects ultraviolet curable resin from the first printing unit 61 based on the control of the controller 91, and hardens it in the hardening unit 62 to form the insulating layer 103. In addition, in the process of forming the insulating layer 103, the second modeling unit 23 ejects metal ink or conductive resin paste from the second printing unit 71, and bakes it in the baking unit 72 to form conductors such as wiring 105 (see FIG. 4).

The mounting unit 24 also mounts the electronic component 101 in the formation of the electronic device 100 described above. The controller 91 ejects conductive resin paste from the second printing unit 71, for example, in accordance with the position of the connection terminal 109 based on the design data 112, and then mounts the electronic component 101 using the mounting unit 24. As shown in FIG. 4, the controller 91 controls the mounting unit 82 to mount the electronic component 101 so that the terminal 107 of the electronic component 101 is connected to the wiring 105 via the connection terminal 109. After mounting the electronic component 101, the controller 91 hardens the connection terminal 109 by firing the conductive resin paste using the firing unit 72, and mounts the electronic component 101 on the circuit board 102. The controller 91 manufactures the electronic device 100 while appropriately executing each of the above-mentioned processes.

The controller 91 also executes inspections using the inspection unit 25 during and after the manufacture of the electronic device 100. Based on image data captured by the inspection camera 89 of the inspection unit 25, the controller 91 inspects for cracks in the wiring 105 after firing, tilt of the mounted electronic component 101, and the like.

Here, if some kind of malfunction, such as a defective modeling, occurs in the above-mentioned manufacturing process, it may be difficult to identify the cause. For example, in additive manufacturing, printing is performed layer by layer, and if it takes several to several tens of hours to manufacture one electronic device 100, it may take a long time to reproduce and confirm the malfunction phenomenon. In addition, since ultraviolet light is used to harden the ultraviolet-curable resin, if a UV-cut film is attached to the observation window of the manufacturing device 10, it becomes difficult for the user to see the internal modeling operation, making it difficult to check the modeling operation.

Therefore, the manufacturing apparatus 10 of this embodiment stores detection data obtained by detecting the state of the molding operation using various cameras, various sensors, a driving circuit 92 (hereinafter sometimes referred to as a state detection device) and the like in the storage device 93 as a detection log 113. The various cameras referred to here are, for example, as shown in FIG. 5, the stage camera 56, the first head camera 64, the second head camera 77, the third head camera 78, the unit camera 67, and the attached camera 87, excluding the inspection camera 89, among the cameras attached to the manufacturing apparatus 10. In more detail, as shown in FIG. 2, the controller 91 has a storage processing unit 125, an additional information acquisition unit 126, and an extraction processing unit 127. The storage processing unit 125 and the like are processing modules that are realized, for example, by executing the control program 111 in the CPU of the controller 91. The storage processing unit 125 and the like may be realized by hardware processing rather than software processing, or may be realized by a combination of software processing and hardware processing.

The storage processing unit 125 is a functional unit that associates multiple pieces of detection data output from each of the multiple state detection devices with each other and stores them in the storage device 93. The additional information acquisition unit 126 is a functional unit that acquires command information and layer number information, which will be described later. The extraction processing unit 127 is a functional unit that extracts detection data corresponding to the content of an inquiry from the multiple pieces of detection data stored in the storage device 93, based on receiving an inquiry about the molding operation of the manufacturing device 10.

Figure 5 is a block diagram showing the flow of processing of detection data. As shown in Figure 5, the storage processing unit 125 has an image acquisition unit 131, a video capture acquisition unit 132, a sensor information acquisition unit 133, a status information acquisition unit 134, and a file creation unit 135. The storage processing unit 125 inputs detection data from various cameras and the like. Specifically, the image acquisition unit 131 acquires image data 141 from the inspection camera 89. For example, while inspecting a molded object in the inspection unit 25, the image acquisition unit 131 acquires image data 141 from the inspection camera 89 at predetermined timing or when an instruction is received from the controller 91, and stores the acquired image data 141 as a detection log 113.

The video capture acquisition unit 132 also acquires video data 142 captured by each of the various cameras. The video capture acquisition unit 132 acquires the video data 142 captured by each camera from the various cameras when work is being performed in each unit, etc. For example, the video capture acquisition unit 132 acquires video data 142 captured by the first head camera 64 when the first printing unit 61 ejects ultraviolet curable resin. The video capture acquisition unit 132 generates (captures) image data cut from the acquired video data 142 at predetermined time intervals and stores the generated image data as the detection log 113. Note that the video capture acquisition unit 132 may store the image in the detection log 113 as video data without cutting out the image from the video data 142. The storage processing unit 125 may also acquire video data from the inspection camera 89, or may acquire still images from the various cameras.

The sensor information acquisition unit 133 acquires sensor information 143 detected by various sensors such as the light amount sensor 115. The sensor information acquisition unit 133 acquires sensor information 143 detected by various sensors when work is being performed in each unit, etc. The sensor information 143 is, for example, the value of the amount of ultraviolet light detected by the light amount sensor 115, the value of the liquid level detected by the liquid level gauge 116, the value of the negative pressure detected by the negative pressure sensor 117, etc. For example, the sensor information acquisition unit 133 acquires the value of the amount of ultraviolet light detected by the light amount sensor 115 when the ultraviolet curing resin is cured in the curing unit 62.

The status information acquisition unit 134 acquires status information 144 from each of the multiple drive circuits 92. The status information 144 is, for example, command information issued from the controller 91 to the drive circuit 92 (position information of the destination, torque control value, etc.) and information related to the control of the drive circuit 92 such as values detected by the drive circuit 92 (current position information, feedback value, etc.). For example, when a servo controller is used as the drive circuit 92 that controls the electromagnetic motor 38 of the X-axis slide mechanism 30, the status information acquisition unit 134 is information such as the rotation position (target position, current position) of the electromagnetic motor 38 and the rotation torque (target value, actual value) of the electromagnetic motor 38. The status information acquisition unit 134 can acquire position information (X, Y, Z coordinates, etc.) of the stage 43 based on the status information 144 acquired from the drive circuits 92 connected to each of the electromagnetic motors 38 and 39. The status information acquisition unit 134 may also acquire position information of the nozzles of the inkjet head 63, the rollers of the flattening device 65, and the like, based on the status information 144. The status information acquisition unit 134 may detect position information of the stage 43 from a linear encoder attached to the Y-axis slide mechanism 32 or the X-axis slide rail 34. The status information acquisition unit 134 may also detect position information of the inkjet head 63, etc., using other position detection devices such as a rotary encoder.

Image data 141, video data 142, sensor information 143, and status information 144 are examples of detection data of the present disclosure. In the following description, these data and information may be collectively referred to as detection data. The storage processing unit 125 associates the detection data acquired by each of the image acquisition unit 131, video capture acquisition unit 132, sensor information acquisition unit 133, and status information acquisition unit 134 and stores them in the detection log 113.

The file creation unit 135 is a processing unit that converts the sensor information 143 detected by the sensor information acquisition unit 133 and the status information 144 detected by the status information acquisition unit 134 into a file format. The file creation unit 135 outputs the values of the sensor information 143 and the status information 144 as a file in, for example, a comma separated value (CSV) format.

Figure 6 shows the contents of the detection log 113. As shown in Figure 6, the detection log 113 stores, for example, time information, number of layers information, command information, detection data, and investigation location information in association with each other. The detection log 113 may be file data in CSV format, or may be a database that stores time information, command information, etc. as a single record.

The additional information acquisition unit 126 outputs the command information and the number of layers information to the storage processing unit 125. The controller 91 sets an execution command that determines the operation content of the next modeling operation to be performed at each stage of manufacturing the electronic device 100, for example. Specifically, the execution command is an ejection command that executes an ejection process to eject ultraviolet curable resin, metal ink, and conductive resin paste from each head such as the inkjet head 63. The execution command is, for example, a flattening command that executes a flattening process using the rollers of the flattening device 65, or a curing command that executes a curing process in which ultraviolet rays are irradiated by the irradiation device 66. The execution command may also be, for example, a movement command that executes a movement process to move the stage 43 to a predetermined position, or a mounting command that executes a mounting process of the electronic component 101 using the mounting head 85. The controller 91 changes the instruction content to be sent to each device of the manufacturing device 10 according to the set execution command, and changes the modeling operation. The command information is information that identifies the type of this execution command, and is information that indicates the above-mentioned ejection command, flattening command, etc. That is, the command information is information that indicates the modeling operation being executed.

The execution command is not limited to commands during the manufacture of the electronic device 100, but may be commands to execute processes before and after modeling, such as maintenance operations. Maintenance operations include, for example, a nozzle check operation to check the nozzle discharge amount of the inkjet head 63, and a camping operation to prevent the ink from drying by attaching a cover to the nozzle. Alternatively, the maintenance operation may be an initialization operation to move the electromagnetic motor 38 and the lifting device 53 to their initial positions, a preheating operation of the heating and cooling device 54, and the like. The controller 91 extracts the detection data based on the type of command information, as described below. Therefore, the command information is not limited to the execution commands described above, and various information that can classify the detection data according to the instructions given to the manufacturing device 10 to perform the operation can be used.

The layer number information is information that identifies the number of layers being built. Specifically, the layer number information is information that indicates which layer is being built when the electronic device 100 is built one layer at a time by, for example, an inkjet-type additive manufacturing method. The additional information acquisition unit 126 can acquire command information and layer number information based on, for example, the processing content being executed by the controller 91 (determined execution command, number of layers) and the instructions issued from the controller 91 to each device.

For example, when a new execution command is set by the controller 91 and instructions based on the set execution command are issued to each device, the memory processing unit 125 sets the device to which the instruction was issued (such as the device to be used for the next modeling operation) as the target device. The memory processing unit 125 acquires detection data from cameras and sensors attached to the target device, drive circuits 92 that control the device, and the like, and sends the data to each acquisition unit such as the image acquisition unit 131. This makes it possible to acquire detection data from the target device during modeling operation. The memory processing unit 125 periodically acquires detection data from cameras, etc. while the target device is operating.

For example, when the sensor information acquisition unit 133 acquires new sensor information 143, the file creation unit 135 acquires the system time of the manufacturing apparatus 10. The file creation unit 135 also acquires command information and layer number information at the time of detection of the detection data from the additional information acquisition unit 126. The file creation unit 135 creates data that expresses this information in CSV format. Similarly, for example, when the status information acquisition unit 134 acquires new status information 144, the file creation unit 135 creates data associated with the system time, command information, etc. of the manufacturing apparatus 10. Similarly, when the image acquisition unit 131 or the video capture acquisition unit 132 acquires new image data 141, for example, they create data associated with the system time, command information, etc. of the manufacturing apparatus 10.

As shown in FIG. 6, the image acquisition unit 131, video capture acquisition unit 132, and file creation unit 135 add investigation location information to time information, layer number information, command information, and detection data. Investigation location information is information set in classification data 114, and is information for classifying detection data. FIG. 7 shows the contents of classification data 114. As shown in FIG. 7, fault content information, probable cause information, investigation location information, and detection data are set in classification data 114. The extraction processing unit 127 shown in FIG. 6 accepts the selection of fault content information via the touch panel 123, as described below. The extraction processing unit 127 extracts detection data corresponding to the selected fault content information. The probable cause information and investigation location information are information for identifying (extracting) detection data corresponding to the fault content information.

The defect content information is information that indicates the content of a defect that occurs during the modeling operation of the manufacturing device 10. Specifically, as illustrated in FIG. 7, the defect content information is information that indicates defects such as defective modeling of the insulating layer 103, defective modeling of conductors such as the wiring 105, defects caused by objects falling onto the modeled object, and defects in which the modeled object interferes with the inkjet head 63, etc. Thus, the defect content information is information that indicates the type of defect that may occur in the manufacturing device 10 and hinder modeling.

The estimated cause information is information indicating the estimated cause of the defect indicated by the defect content information. For example, as shown in FIG. 7, possible molding defects of the insulating layer 103 include defective discharge of the ultraviolet curing resin, defective flattening processing, defective curing processing, and defective position error of the stage 43. The estimated cause information is information that classifies factors that are considered to cause the occurrence of such defects indicated by the defect content information. Note that an explanation of all the estimated cause information shown in FIG. 7 is omitted, but for example, the estimated cause information of interference of the molded object may be peeling of the substrate or adhesion of the printed part. More specifically, if the heat during molding increases or the cooling effect of the heating and cooling device 54 decreases, the release film 57 may peel off, causing the molded object to float. As a result, there is a risk of interference between the inkjet head 63, etc. and the molded object. In addition, if some adhesion adheres to the printing part of the inkjet heads 63, 74, etc., there is a risk of interference between the adhesion and the molded object. For this reason, the estimated cause of interference of the molded object may be peeling of the substrate or adhesion of the printed part.

The investigation location information is information for identifying detection data necessary to investigate the cause indicated by the estimated cause information. For example, when it is considered that the molding defect (defect information) of the insulating layer 103 occurs due to the discharge defect (estimated cause information) of the ultraviolet curing resin, it is preferable to investigate the discharge state of the inkjet head 63 of the first printing unit 61 as the investigation location information. Therefore, as the investigation location information and detection data of the discharge defect, each information of the resin discharge state and the image of the first head camera 64 is associated. Similarly, for example, when it is considered that the molding defect (defect information) of the insulating layer 103 occurs due to the flattening defect (estimated cause information) of the ultraviolet curing resin, it is preferable to investigate the state of the adhesion of the roller of the flattening device 65 as the investigation location information. Therefore, as the investigation location information and detection data of the flattening defect, each information of the adhesion of the roller and the image of the stage camera 56 is associated. As shown in FIG. 7, the classification data 114 is hierarchically associated with the defect content information, estimated cause information, investigation location information, and detection data. When the extraction processing unit 127 receives a selection of defect content information from the user, it extracts the corresponding detection data based on the classification data 114. Then, the file creation unit 135 of the storage processing unit 125 adds the investigation location information to the command information and the detection data as shown in FIG. 6. For example, the file creation unit 135 identifies the investigation location information corresponding to the detection data based on the classification data 114, and associates the identified investigation location information and stores it in the detection log 113. Note that multiple types of investigation location information may be associated with one type of detection data, and multiple types of detection data may be associated with one type of investigation location information. Also, the classification data 114 shown in FIG. 7 is an example, and for example, classification data 114 may be created in which defect content information selected by the user is directly associated with multiple detection data.

The storage processing unit 125 also acquires image data 141 and video data 142 from a camera attached to the target device of the execution command, similar to the sensor information 143 and status information 144. Specifically, the image acquisition unit 131 acquires image data 141 from the inspection camera 89 if the molded object is being inspected. The video capture acquisition unit 132 acquires video data 142 from the first head camera 64 if the insulating layer 103 is being molded. The storage processing unit 125 associates the image data acquired or generated by the image acquisition unit 131 or the video capture acquisition unit 132 with time information of the system time, layer number information, command information, and investigation location information and stores them in the detection log 113. The storage processing unit 125 identifies the investigation location information corresponding to the image data based on the classification data 114 and performs the association. The storage processing unit 125 may directly store the image data in the detection data item of the detection log 113, or may store the identification information of the image data (such as a file path) in the detection data item. This allows detection data detected by various sensors during modeling operations to be accumulated in the detection log 113.

The above-mentioned processing contents of the storage processing unit 125 and the data format of the detection log 113 shown in FIG. 6 are merely examples. For example, the storage processing unit 125 may collect multiple detection data (video data 142, sensor information 143, status information 144) acquired within a certain period of time and store them in the detection log 113 as one piece of data (one line of data in FIG. 6). That is, one piece of data registered in the detection log 113 may include one detection data or multiple detection data. The storage processing unit 125 may also set the same time as the time information of the detection data detected within a certain period of time. This allows the detection data detected within a certain period of time to be extracted as detection data of the same time in the extraction processing of the extraction processing unit 127 described later.

(3. Extraction of Detection Data)
Next, the extraction process executed by the extraction processing unit 127 will be described. For example, when a user has encountered or is suspected of encountering a malfunction during the modeling operation of the manufacturing apparatus 10, the user operates the touch panel 123 to check the detection data. When the extraction processing unit 127 receives a predetermined operation input to the touch panel 123, for example, the extraction processing unit 127 displays a reception screen 151 shown in FIG. 8 on the touch panel 123. As shown in FIG. 8, the extraction processing unit 127 displays a designated time field 152, a modeling operation field 153, a designated number of layers field 154, a malfunction content field 156, an inquiry button 157, and a cancel button 158 on the reception screen 151.

The specified time field 152 is an operation section for specifying the time for extracting detection data. When the inquiry button 157 is touched, the extraction processing section 127 extracts and displays detection data that was detected at the time specified in the specified time field 152, or detected a predetermined time before or after the specified time. This predetermined time may be a fixed time, or may be changed depending on the type of defect. For example, the extraction processing section 127 extracts detection data (see FIG. 6) with time information that matches the time specified in the specified time field 152 from the detection log 113, and displays it on the touch panel 123.

The modeling operation column 153 is an operation section for specifying an execution command, and for example, the execution command can be selected from a pull-down menu. FIG. 8 shows a state in which flattening processing corresponding to a flattening command is displayed. When the inquiry button 157 is touched, the extraction processing section 127 extracts detection data corresponding to the execution command specified in the modeling operation column 153 from the detection log 113 and displays it on the touch panel 123. When no time is specified in the specified time column 152, the extraction processing section 127 extracts all detection data corresponding to the execution command and displays them in chronological order of time information (for example, descending order). All detection data here refers to, for example, detection data of the latest modeling operation performed before receiving an inquiry about defect content information. The extraction processing section 127 may extract detection data of past modeling operations as well as the latest modeling operation.

The specified number of layers field 154 is an operation section for specifying the number of layers. When the inquiry button 157 is touched, the extraction processing section 127 extracts and displays detection data from the detection log 113 that matches the number of layers specified in the specified number of layers field 154, or that matches a predetermined number of layers above and below the specified number of layers. When the specified time field 152 or the modeling operation field 153 is not specified, the extraction processing section 127 extracts all detection data corresponding to the specified number of layers and displays them in chronological order of the time information.

Fault content field 156 is an operation section for specifying fault content, and for example, the type of fault content (each item of fault content information in FIG. 7) can be selected from a pull-down menu. When inquiry button 157 is touched, extraction processing section 127 identifies probable cause information corresponding to the type of fault content specified in fault content field 156 from classification data 114 (see FIG. 7). Extraction processing section 127 identifies investigation location information corresponding to the identified probable cause information from classification data 114. Then, extraction processing section 127 extracts detection data associated with the identified investigation location information from detection log 113.

The extraction processing unit 127 extracts detection data that satisfies all the conditions of the specified items among the specified time column 152, the modeling operation column 153, the specified number of layers column 154, and the defect content column 156. For example, when only the specified time column 152 and the specified number of layers column 154 are specified, the extraction processing unit 127 extracts detection data that matches the time specified in the specified time column 152 and the number of layers specified in the specified number of layers column 154. Also, when only the modeling operation column 153 and the specified number of layers column 154 are specified, the extraction processing unit 127 extracts detection data that matches the execution command specified in the modeling operation column 153 and the number of layers specified in the specified number of layers column 154. Also, when the cancel button 158 is touched, the extraction processing unit 127 erases the display of the reception screen 151 from the touch panel 123.

Figure 9 shows an example of a display screen 161 that displays detection data on the touch panel 123. The extraction processing unit 127 displays an image display field 163 and a detailed information field 164 on the display screen 161. The image display field 163 is a field that displays image data (captures of image data 141 and video data 142) extracted by the reception process of the reception screen 151. The extraction processing unit 127 displays the image data in the image display field 163 in order of earliest detection time based on the time information in the detection log 113. The extraction processing unit 127 displays the image data in order from left to right on the first line, then from left to right on the second line, and so on in chronological order from top left to bottom right.

9, the user can select any image data from the image data displayed in the image display field 163. The extraction processing unit 127 displays the time information, layer number information, and command information of the image data (detection data) selected in the image display field 163 in the detailed information field 164. The extraction processing unit 127 also displays the detection data (sensor information 143 and status information 144) detected at the same time as the image data selected in the image display field 163 in the detailed information field 164. In the state shown in FIG. 9, the image data in the upper left of the image display field 163 is selected, and in addition to the time information, layer number information, and command information of this image data, the light amount at the same time, the value of the liquid level gauge, the stage position, etc. are displayed in the detailed information field 164. This allows the user to check the image data when a malfunction occurs while also checking the values of various sensors. The extraction processing unit 127 may display not only the detection data (sensor information 143, status information 144) whose time exactly matches the selected image data, but also the detection data detected at the time closest to the detection time indicated by the time information of the image data in the detailed information field 164.

In addition, check buttons 163A for selecting each image data are displayed in the image display field 163. When the report creation button 165 displayed in the detailed information field 164 is touched, the extraction processing unit 127 creates a data file that lists in order the image data selected by the check buttons 163A in the image display field 163 and the detailed information field 164 related to that image data. This allows the user to easily report a defect to the vendor of the manufacturing device 10 by submitting the created data file.

When the cancel button 166 in the detailed information field 164 is touched, the extraction processing unit 127 erases the display on the display screen 161 from the touch panel 123. The display format shown in FIG. 9 is an example. For example, the extraction processing unit 127 may extract only items that match the time or number of layers specified on the reception screen 151, as in the format of the detection log 113 shown in FIG. 6, and display them in order of detection time, or may output them as a CSV file. The extraction processing unit 127 may also create only a CSV file that summarizes the extracted detection data, without executing the display process. In this case as well, the detection data at the time of the occurrence of a malfunction can be efficiently sent to a vendor, etc.

As described above, the manufacturing apparatus 10 of the first embodiment is equipped with, as the state detection device of the present disclosure, an inspection camera 89 that captures an image of the electronic device 100 produced by the manufacturing apparatus 10, various cameras such as a stage camera 56 that captures images of the devices (stage 43 and inkjet head 63) operating in the manufacturing apparatus 10, various sensors, and a drive circuit 92 that controls a drive source (such as an electromagnetic motor 38) that moves a movable part (such as the X-axis slide mechanism 30) of the manufacturing apparatus 10.

This makes it possible to extract detection data such as image data 141 and video data 142 from the inspection camera 89 and stage camera 56, sensor information 143 from the sensors, and status information 144 from the drive circuit 92 when a malfunction occurs. If a malfunction such as a molding defect occurs, the cause of the malfunction can be identified later based on the image data 141, etc.

The storage processing unit 125 also stores each of the multiple detection data in the storage device 93 in association with time information (see FIG. 6). The extraction processing unit 127 extracts detection data corresponding to the inquiry content from the storage device 93, arranges the data in the time order indicated by the time information, and displays the data on the touch panel 123 (see FIG. 9).

This allows the detection data before and after the occurrence of a malfunction to be displayed in chronological order with each piece of detection data associated with the other pieces of detection data. By displaying the detection data corresponding to the content of the inquiry in chronological order, the burden on the user of checking the detection data can be reduced.

As shown in FIG. 6, the storage processing unit 125 stores the layer number information indicating the number of layers during modeling and indicating the number of layers when the detection data was detected in the detection log 113 in association with the detection data. The extraction processing unit 127 can accept the designation of the number of layers in the designated layer number field 154 in the process of accepting an inquiry about the modeling operation (see FIG. 8). When the extraction processing unit 127 accepts the designation of the number of layers, it extracts the detection data associated with the layer number information indicating the designated number of layers.

According to this, the storage processing unit 125 stores layer number information indicating the number of layers being modeled in the storage device 93 in association with the detection data. Then, the extraction processing unit 127 extracts detection data during modeling that corresponds to the number of layers specified in the reception process, i.e., the number of layers indicated by the layer number information. This makes it possible to check at which layer number the defect occurred while specifying the number of layers. Alternatively, if the number of layers at which the defect occurred is known, it is possible to check what was happening during the modeling operation when the defect occurred by specifying that number of layers.

The storage processing unit 125 also stores command information indicating an execution command for determining the operation content of the modeling operation for the manufacturing device 10 and indicating the execution command when the detection data is detected in the detection log 113 in association with the detection data (see FIG. 6). The extraction processing unit 127 extracts the detection data associated with the command information indicating the execution command specified in the modeling operation column 153 in FIG. 8 from the detection log 113.

According to this, the extraction processing unit 127 extracts detection data corresponding to the execution command specified in the reception process, i.e., during the execution command indicated by the command information. This makes it possible to confirm which modeling operation occurred during which malfunction while specifying the execution command. Alternatively, if the modeling operation when the malfunction occurred is known, it is possible to confirm what was happening when the malfunction occurred by specifying the execution command corresponding to the modeling operation.

As shown in FIG. 7, the classification data 114 includes defect content information indicating the content of a defect occurring during a modeling operation, presumed cause information indicating the presumed cause of the defect indicated by the defect content information, and investigation location information for identifying detection data required to investigate the cause indicated by the presumed cause information. The storage processing unit 125 associates the detection data with the corresponding investigation location information and stores it in the detection log 113 of the storage device 93. The extraction processing unit accepts the type of defect content information in the defect content column 156 of FIG. 8, and identifies presumed cause information corresponding to the type of accepted defect content information based on the classification data 114. The extraction processing unit 127 identifies investigation location information corresponding to the identified presumed cause information based on the classification data 114, and extracts detection data associated with the identified investigation location information from the detection log 113.

This allows the malfunction content information, probable cause information, and investigation location information to be associated with the detection data, and the detection data to be classified hierarchically. Then, by accepting the type of malfunction content information, the detection data corresponding to that type of malfunction content information can be extracted from the storage device 93 based on the probable cause information and investigation location information in the classification data 114.

(4. Second embodiment)
Next, a second embodiment that embodies the contents of the present disclosure will be described. In the above-mentioned first embodiment, the manufacturing apparatus 10 is configured to include the detection data storage device of the present disclosure. In contrast, in the second embodiment, the detection data storage device is configured as a device separate from the manufacturing apparatus 10. FIG. 10 shows the configuration of the second embodiment. As shown in FIG. 10, a PC 171 connected to the manufacturing apparatus 10 may function as a detection data storage device to accumulate the detection log 113 and extract the detection data. In the following description, the same reference numerals are used for the same configuration as the above-mentioned first embodiment, and the description thereof will be omitted as appropriate.

For example, the controller 172 of the PC 171 includes a storage processing unit 125 and the like. The controller 172 controls the manufacturing apparatus 10 based on a control program 111 stored in the storage device 173 of the PC 171. The PC 171 transmits execution commands and control signals corresponding to the execution commands to the manufacturing apparatus 10 via a communication cable 175, and controls the manufacturing apparatus 10. The storage processing unit 125 of the controller 172 also acquires detection data such as image data 141 from the manufacturing apparatus 10 via the communication cable 175. The storage processing unit 125 accumulates the acquired detection data in the detection log 113 of the storage device 173.

The PC 171 also displays the reception screen 151 (see FIG. 8) on the LCD 179 based on operation input to the operation unit 177, such as a keyboard or mouse. The PC 171 extracts detection data that matches the items selected based on the operation input to the operation unit 177 from the detection log 113, and displays the data on the LCD 179. Even in this second embodiment, the user can operate the PC 171 to check the detection data extracted in chronological order and take action to resolve any problems.

Incidentally, in the above embodiment, the manufacturing device 10 is an example of a three-dimensional modeling device and a detection data storage device. The stage camera 56, the unit camera 67, the first head camera 64, the second head camera 77, the third head camera 78, the attached camera 87, the inspection camera 89, the light quantity sensor 115, the liquid level gauge 116, the negative pressure sensor 117, the temperature sensor 118, the voltage sensor 119, the flow rate sensor 120, and the air flow sensor 121 are examples of a state detection device. The electronic device 100 is an example of a modeled object. The touch panel 123 and the LCD 179 are examples of a display device. The image data 141, the video data 142, the sensor information 143, and the status information 144 are examples of detection data. The inspection camera 89 is an example of a modeled object imaging device. The stage camera 56, the unit camera 67, the first head camera 64, the second head camera 77, the third head camera 78, and the attached camera 87 are examples of an apparatus imaging device. The X-axis slide mechanism 30, the Y-axis slide mechanism 32, the holding device 52, the lifting device 53, the heating/cooling device 54, the stage camera 56, the first printing unit 61, the curing unit 62, the second printing unit 71, the baking unit 72, the supply unit 81, the mounting unit 82, and the inspection unit 25 are examples of movable units. The electromagnetic motors 38 and 39 are examples of drive sources. The PC 171 is an example of a detection data storage device.

According to each of the above-described embodiments, the following effects are achieved.
The manufacturing apparatus 10 includes a camera that outputs detection data corresponding to the state of the modeling operation, various sensors, and a drive circuit 92. The storage processing unit 125 stores a plurality of detection data (image data 141, etc.) output from the various cameras, etc., in a detection log 113 of the storage device 93 in association with each other. The extraction processing unit 127 extracts detection data corresponding to the inquiry from the detection log 113 based on receiving an inquiry about the modeling operation via the touch panel 123, and displays the extracted detection data on the touch panel 123 ( FIG. 9 ).

According to this, the controller 91 detects the modeling operation of the manufacturing device 10 using multiple sensors, etc., and stores the multiple detected detection data in the storage device 93 in association with each other. When a malfunction such as an error occurs in the modeling operation of the manufacturing device 10, the user operates the touch panel 123 to inquire about the detection data. The extraction processing unit 127 extracts and displays the detection data corresponding to the inquiry content based on the operation input of the touch panel 123. This allows the user to make an inquiry when a malfunction occurs and check the detection data before and after the malfunction. In addition, the user can easily create a report of the malfunction to be sent to the vendor by operating the report creation button 165. In addition, even if an unexpected malfunction that cannot be mechanically detected by the manufacturing device 10 occurs, the cause of the malfunction can be identified and appropriately dealt with by examining the detection data later.

(5. Other)
The present disclosure is not limited to the above-described embodiments, but can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art.
For example, in the second embodiment shown in Fig. 10, various cameras and sensors may be provided in the PC 171. That is, the state detection device of the present disclosure may be provided on the PC 171. In this case, the PC 171 is an example of the detection data storage device of the present disclosure.
10, the manufacturing apparatus 10 does not need to include the storage processing unit 125, the additional information acquisition unit 126, the extraction processing unit 127, the control program 111, the design data 112, the detection log 113, the classification data 114, and the touch panel 123. That is, the manufacturing apparatus 10 does not need to include the components necessary for the detection data storage device of the present disclosure and included in the PC 171.
Furthermore, the manufacturing apparatus 10 of each embodiment may be configured to include at least one of a camera, a sensor, and a drive circuit 92 as a state detection device.
Furthermore, the extraction processing unit 127 may execute a process of outputting the extracted detection data as one file data, without executing a display process.
Furthermore, the extraction processing unit 127 does not need to display the extracted detection data in chronological order.
The extraction processing unit 127 may be configured to accept at least one of the items of the number of layers, the execution command, and the type of defect content information, or may be configured not to accept all of the items. For example, the extraction processing unit 127 may be configured to accept and extract only the specified time.

In the process of accepting the number of layers, the extraction processing unit 127 may accept a range of the number of layers, such as from which layer to which layer.
The types of execution commands shown in FIG. 6 are merely examples, and may be changed as appropriate depending on the content of the modeling operation executed by the manufacturing apparatus 10.
The types and contents of items of the classification data 114 shown in FIG. 7 are merely examples, and may be changed or added as appropriate.

In the above embodiment, the manufacturing apparatus 10 for manufacturing the electronic device 100 is used as the three-dimensional printing apparatus of the present disclosure, but the present disclosure is not limited to this. As the three-dimensional printing apparatus of the present disclosure, various three-dimensional printing apparatuses that perform modeling using a three-dimensional additive manufacturing method can be used.
In addition, the three-dimensional additive manufacturing method is not limited to the inkjet method, and other methods such as stereo lithography (SL), selective laser sintering (SLS), and fused deposition molding (FDM) can be used.

10 Manufacturing device (three-dimensional modeling device, detection data storage device), 25 Inspection unit (movable part), 30 X-axis slide mechanism (movable part), 32 Y-axis slide mechanism (movable part), 38, 39 Electromagnetic motor (driving source), 52 Holding device (movable part), 53 Lifting device (movable part), 54 Heating and cooling device (movable part), stage camera 56 (state detection device, device imaging device, movable part), 61 First printing unit (movable part), 62 Hardening unit (movable part), 64 First head camera (state detection device, device imaging device), 67 Unit camera (state detection device, device imaging device), 71 Second printing unit (movable part), 72 Baking unit (movable part), 77 Second head camera (state detection device, device imaging device), 78 Third head camera (state detection device, device imaging device), 81 Supply unit (movable part), 82 Mounting unit (movable part), 87 Mounting camera (state detection device, device imaging device), 89 Inspection camera (state detection device, object imaging device), 93 storage device, 100 electronic device (object), 114 classification data, 115 light quantity sensor (state detection device), 116 liquid level gauge (state detection device), 117 negative pressure sensor (state detection device), 118 temperature sensor (state detection device), 119 voltage sensor (state detection device), 120 flow rate sensor (state detection device), 121 air flow sensor (state detection device), 123 touch panel (display device), 125 storage processing unit, 127 extraction processing unit, 141 image data (detection data), 142 video data (detection data), 143 sensor information (detection data), 144 status information (detection data), 171 PC (detection data storage device), 173 storage device, 179 LCD (display device).

Claims (7)

A plurality of state detection devices that output detection data corresponding to a state of a modeling operation in the three-dimensional modeling apparatus;
a storage processing unit that stores the plurality of detection data output from each of the plurality of state detection devices in a storage device in association with each other;
an extraction processing unit that extracts the detection data corresponding to the content of the inquiry based on the receipt of an inquiry about a modeling operation of the three-dimensional modeling device from the plurality of detection data stored in the storage device;
Equipped with
The storage processing unit is
storing, in the storage device, layer number information indicating the number of layers being modeled by the three-dimensional modeling device and indicating the number of layers at the time when the detection data is detected, in association with the detection data;
The extraction processing unit:
a detection data storage device that receives a designation of the number of layers in a process of receiving an inquiry about a modeling operation, and extracts the detection data associated with the layer number information indicating the designated number of layers . The storage processing unit is
storing, in the storage device, command information indicating an execution command for determining an operation content of a modeling operation for the three-dimensional modeling device and indicating the execution command when the detection data is detected, in association with the detection data;
The extraction processing unit:
The detection data storage device according to claim 1 , further comprising: a step of accepting a designation of the execution command in a process of accepting an inquiry about a modeling operation; and extracting the detection data associated with the command information indicating the designated execution command. A plurality of state detection devices that output detection data corresponding to a state of a modeling operation in the three-dimensional modeling apparatus;
a storage processing unit that stores the plurality of detection data output from each of the plurality of state detection devices in a storage device in association with each other;
an extraction processing unit that extracts the detection data corresponding to the content of the inquiry based on the receipt of an inquiry about a modeling operation of the three-dimensional modeling device from the plurality of detection data stored in the storage device;
Equipped with
The storage processing unit is
storing, in the storage device, command information indicating an execution command for determining an operation content of a modeling operation for the three-dimensional modeling device and indicating the execution command when the detection data is detected, in association with the detection data;
The extraction processing unit:
a detection data storage device that receives a designation of the execution command in a process of receiving an inquiry about a modeling operation, and extracts the detection data associated with the command information indicating the designated execution command. classification data including: defect content information indicating a content of a defect occurring in a modeling operation of the three-dimensional modeling device; presumed cause information indicating a presumed cause of the defect indicated by the defect content information; and investigation point information for identifying the detection data required to investigate the cause indicated by the presumed cause information;
The storage processing unit is
The detection data is stored in the storage device in association with the corresponding inspection location information;
The extraction processing unit:
A detection data storage device as described in any one of claims 1 to 3, which receives a type of defect content information in a process of receiving an inquiry regarding a molding operation, identifies the probable cause information corresponding to the type of defect content information received based on the classification data, identifies the investigation location information corresponding to the identified probable cause information based on the classification data, and extracts the detection data associated with the identified investigation location information. A plurality of state detection devices that output detection data corresponding to a state of a modeling operation in the three-dimensional modeling apparatus;
a storage processing unit that stores the plurality of detection data output from each of the plurality of state detection devices in a storage device in association with each other;
an extraction processing unit that extracts the detection data corresponding to the content of the inquiry based on the receipt of an inquiry about a modeling operation of the three-dimensional modeling device from the plurality of detection data stored in the storage device;
Classification data including: defect content information indicating the content of a defect occurring in a modeling operation of the three-dimensional modeling device; presumed cause information indicating a presumed cause of the defect indicated by the defect content information; and investigation location information for identifying the detection data required to investigate the cause indicated by the presumed cause information;
Equipped with
The storage processing unit is
The detection data is stored in the storage device in association with the corresponding inspection location information;
The extraction processing unit:
A detection data storage device that receives a type of defect content information in a process of receiving an inquiry regarding a molding operation, identifies the probable cause information corresponding to the received type of defect content information based on the classification data, identifies the investigation location information corresponding to the identified probable cause information based on the classification data, and extracts the detection data associated with the identified investigation location information. The state detection device includes:
The detection data storage device according to any one of claims 1 to 5, comprising at least one of a model imaging device that images a model formed by the three-dimensional printing device, a device imaging device that images a device operating in the three-dimensional printing device, a sensor attached to the three-dimensional printing device, and a drive circuit that controls a drive source that moves a movable part of the three-dimensional printing device. The storage processing unit is
storing each of the plurality of detection data in the storage device in association with time information;
The extraction processing unit:
7. The detection data storage device according to claim 1, further comprising: extracting the detection data corresponding to the inquiry from the storage device, arranging the data in the time order indicated by the time information, and displaying the data on a display device.

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