JP7503682B2 - Glass fiber fabric products, printed circuit boards, integrated circuit boards and electronic products - Google Patents

Description

The present invention relates to fiber fabric products, and in particular to glass fiber fabric products.

Glass fibers with low dielectric properties (dielectric constant and dielectric tangent) have the advantages of excellent electrical insulation, low signal loss, and high stability. In recent years, glass fiber cloth made of glass fibers with low dielectric properties has been applied to electronic products that require high transmission speeds, such as equipment for the 5th generation mobile communication system (abbreviated as 5G), low earth orbit satellites whose orbits are at altitudes between 160 km and 2000 km above the earth's surface, high-performance servers that can support two or more processing devices, in-vehicle electronic devices, and high-performance graphics boards with video memory capacities of 6 GB or more.

Patent Document 1 discloses a low dielectric glass composition and a low dielectric glass fiber. The low dielectric glass composition includes _SiO2 in the range of more than 49 wt% and not more than 53 wt%, _Al2O3 in the range of 13 _wt % to 17 wt%, _B2O3 in the range of 18 wt% to 24 wt _% , MgO in the range of more than 2 wt% and not more than 4.5 wt%, CaO in the range of more than 2 wt% and not more than 5 wt%, _TiO2 in the range of more than 0.6 wt% and less than 3.5 wt%, _Na2O in the range of more than 0 wt% and not more than 0.6 wt%, _K2O in the range of 0 wt% to 0.5 wt%, _F2 in the range of 0 wt% to 1 wt%, ZnO in the range of more than 1 wt% and less than 4 wt%, _Fe2O3 in the range of more than 0 wt% and not more than ₁ wt%, and SO2 in the range of 0.1 wt% to 0.6 wt%. ₃ , and the total content of MgO+CaO+ZnO is in the range of more than 8 wt% and less than 11 wt%. The low dielectric glass fiber is made of the low dielectric glass composition. By this design, the low dielectric glass composition disclosed in Patent Document 1 has a low dielectric constant and a low dielectric loss tangent.

However, as electrical product designs become more complex, more and more heat is generated during operation, raising concerns that heat may have a detrimental effect on electrical products, or that residual stresses caused by thermal expansion or contraction during manufacturing may adversely affect electrical devices.

Therefore, there are increasing demands on the geometric properties of glass fibers (e.g., length and volume) that take into account the thermal expansion or contraction of the glass fibers.

Therefore, there is a great need to develop a glass fiber cloth that has low dielectric performance (dielectric constant and dielectric tangent) and also a low thermal expansion coefficient.

Taiwan Patent Application Publication No. 202118743

Therefore, an object of the present invention is to provide a glass fiber cloth product having a low coefficient of thermal expansion and a low dielectric constant, and a printed circuit board, an integrated circuit substrate, and an electronic product that include the glass fiber cloth product.

In order to achieve the above object, the present invention provides:
The present invention includes a glass fiber cloth and a silane coupling agent.
The glass fiber cloth is a woven or woven fabric of glass fiber yarn formed from glass fibers containing a glass composition,
The glass composition is, assuming the total amount of the glass composition to be 100 wt %,
Silicon oxide having a content in the range of 55 wt % to 64 wt %;
Aluminum oxide having a content in the range of 15 wt % to 22 wt %;
Calcium oxide having a content in the range of 0.1 wt % to 4 wt %;
Magnesium oxide having a content in the range of 2.1 wt % to 10 wt %;
Copper oxide having a content of more than 0 wt % and less than 7 wt %;
and a boron oxide content in the range of more than 13.1 wt % and less than 18 wt %.
The present invention provides a printed circuit board comprising the above-mentioned fiberglass cloth product.
The present invention provides an integrated circuit substrate comprising the above-described fiberglass cloth product.
The present invention provides an electronic product comprising at least one of the above-described printed circuit board and the above-described integrated circuit board.

Due to the above-mentioned configuration, the glass fiber cloth product of the present invention has multiple advantages, such as a low thermal expansion coefficient, a low dielectric constant, and a low dielectric tangent, due to the glass fibers. Therefore, printed circuit boards, integrated circuit boards, and electronic products that include the glass fiber cloth product have the advantages of excellent dimensional stability, signal transmission speed, and signal transmission integrity.

The fiberglass fabric product of the present invention comprises a fiberglass fabric and a silane coupling agent.
The glass fabric is a woven or woven fabric of glass fiber yarns formed from glass fibers containing a glass composition.

The glass composition contains, where the total amount of the glass composition is 100 wt%, silicon oxide having a content within the range of 55 wt% to 64 wt%, aluminum oxide having a content within the range of 15 wt% to 22 wt%, calcium oxide having a content within the range of 0.1 wt% to 4 wt%, magnesium oxide having a content within the range of 2.1 wt% to 10 wt%, copper oxide having a content within the range of more than 0 wt% and less than 7 wt%, and boron oxide having a content within the range of more than 13.1 wt% and less than 18 wt%.
The present invention will be described in detail below.

<Glass fiber cloth products>
Examples of fiberglass fabric products include, but are not limited to, fiberglass fabric or fiberglass prepreg that have been treated with a silane coupling agent.
In some embodiments of the present invention, the glass fiber cloth treated with the silane coupling agent is formed by braiding glass fiber yarns, and then surface treating the glass fiber cloth with the silane coupling agent, for example, by using an air jet loom.

In some embodiments of the present invention, the fiberglass cloth is, for example, a fiberglass cloth having a fabric type standard (IPC style) of 2116.

In some embodiments of the present invention, the glass fiber prepreg is formed by applying a resin to a glass fiber cloth treated with a silane coupling agent, followed by a drying process. The application process is, for example, an impregnation process.

<Glass fiber yarn>
The glass fiber yarn is formed from glass fibers, and the glass fibers are formed by subjecting the glass composition to a melting process and a spinning process.

In some embodiments of the present invention, the glass fiber yarn is, for example, a glass fiber yarn having a yarn type specification of E250, and the glass fiber yarn having a yarn type specification of E250 is formed from 200 glass fibers having a diameter of 7 μm and has a fineness of 250 and a twist number of 36 TPM (Twist Per Meter) with Z twist.

In some embodiments of the present invention, the thermal expansion coefficient of the glass fiber is less than or equal to 3 ppm/°C.

In some embodiments of the present invention, the dielectric constant of the glass fiber is less than or equal to 5 at a frequency of 10 GHz.

In some embodiments of the present invention, at a frequency of 10 GHz, the dielectric tangent of the glass fiber is 0.0045 or less.

<Glass Composition>
Silicon oxide (SiO ₂ ) is a main component of glass compositions. Silicon oxide has a three-dimensional network structure, and the basic structural unit of the three-dimensional network structure is a tetrahedral crystal structure of SiO ₄ .

In the three-dimensional network structure of aluminum oxide (Al ₂ O ₃ ) and silicon oxide, some oxygen atoms are bonded to form bridging oxygen, which improves the thermal stability and viscosity of the glass composition. However, if the content of aluminum oxide exceeds 22 wt %, the viscosity of the glass composition becomes too high, and a higher temperature is required to form the glass composition into glass fiber, which increases the manufacturing cost.

Calcium oxide (CaO) reduces the viscosity of the glass composition, which helps the glass composition melt sufficiently during thermal processing. However, if the calcium oxide content exceeds 4 wt%, the dielectric constant of the glass composition becomes high.

Magnesium oxide (MgO) reduces the viscosity of the glass composition, which helps to ensure sufficient melting during thermal processing of the glass composition, and also helps to improve the mechanical strength of the glass fiber formed from the glass composition. However, if the magnesium oxide content exceeds 10 wt%, the dielectric constant of the glass composition becomes high.

Copper oxide (CuO) can reduce the thermal expansion coefficient of the glass fiber formed by the glass composition and can enable the glass composition to have a dense structure during production, thereby alleviating the problem of the loose structure of the glass fiber caused by the presence of an oxide of an alkali metal [e.g., sodium oxide (Na ₂ O) or potassium oxide (K ₂ O)] and zinc oxide (ZnO). If copper oxide is not included, when the thermal expansion coefficient of the glass composition exceeds 3 ppm/° C. and the content of copper oxide is 7 wt % or more, crystals will be generated in the glass composition, which is disadvantageous for the spinning and molding operation.

When the content of boron oxide (B ₂ O ₃ ) is in the range of more than 13.1 wt % and less than 18 wt %, the glass composition and glass fiber have a low dielectric constant and a low dielectric loss tangent, and the glass composition has good spinnability. However, when the content of boron oxide is 13.1 wt % or less, the dielectric constant of the glass composition becomes 5 or more at a frequency of 10 GHz, and when the content of boron oxide is 18 wt % or more, crystals are generated in the glass composition, which is disadvantageous for spinning.

In some embodiments of the present invention, the glass composition further comprises zinc oxide (ZnO).

In some embodiments of the present invention, the zinc oxide content is in the range of more than 0 wt% and not more than 8 wt%, where the total amount of the glass composition is 100 wt%.

Zinc oxide can reduce the thermal expansion coefficient of the glass fiber formed from the glass composition. According to general knowledge in the technical field, when a glass composition contains an oxide of an alkali metal and zinc oxide, the glass fiber formed from the glass composition has a loose structure, which is disadvantageous for reducing the thermal expansion coefficient. Therefore, in some embodiments of the present invention, when the glass composition contains an oxide of an alkali metal, zinc oxide may not be added as necessary.

In some embodiments of the present invention, the glass composition further comprises other material components, which include at least one other material, such as, but not limited to, sodium oxide ( _Na2O ), potassium oxide ( _K2O ), iron oxide ( _Fe2O3 ), or _titanium dioxide ( _TiO2 ).

In some embodiments of the present invention, the other substance component includes at least one other substance selected from the group consisting of sodium oxide, potassium oxide, iron oxide, titanium dioxide, or a combination thereof. In some embodiments of the present invention, the content of the other substance component is in the range of more than 0 wt% and not more than 1.2 wt%, where the total amount of the glass composition is 100 wt%.

Sodium oxide and potassium oxide are fluxes that are beneficial for melting the glass composition and producing glass fibers at lower temperatures. However, if the content of sodium oxide or potassium oxide is too high, the chemical stability of the glass fibers is reduced, resulting in reduced electrical insulation and mechanical strength.

Iron oxide can improve the stability of the glass composition during melting, spinning, and other processes. However, if the iron oxide content is too high, there is a problem of uneven temperature when the glass composition is melted.

Titanium dioxide can improve the mechanical strength of glass fibers. However, if the titanium dioxide content is too high, crystals will form in the glass composition during the process of forming the glass fiber from the glass composition, which will be detrimental to the spinning and molding process.

<Silane coupling agent>
Examples of the silane coupling agent include, but are not limited to, silane coupling agents having an amino group and silane coupling agents not having an amino group.

Examples of silane coupling agents having an amino group include, but are not limited to, aminoalkoxysilane and aminosilanol.

Aminoalkoxysilanes include, for example,
(3-aminopropyl)trimethoxysilane [(3-aminopropyl)trimethoxysilane, CAS registration number: 13822-56-5],
Examples of the silane derivative include, but are not limited to, (N-aminoethyl-3-aminopropyl) methyldimethoxysilane (CAS Registry Number: 3069-29-2) and bis[3-(trimethoxysilyl)propyl]amine.

Examples of aminosilanols include hydrolysates of the above aminoalkoxysilanes, and examples of such hydrolysates include (3-aminopropyl)silanol or (N-aminoethyl-3-aminopropyl)methylsilanol.

Examples of silane coupling agents that do not have an amino group include, but are not limited to, vinylsilane coupling agents and acryloxysilane coupling agents.

In some embodiments of the present invention, the silane coupling agent is a silane coupling agent that does not have an amino group.

In some embodiments of the present invention, the silane coupling agent that does not have an amino group is selected from a vinyl silane coupling agent, an acryloxy silane coupling agent, or a combination thereof.

Examples of vinyl silane coupling agents include, but are not limited to, vinyl alkoxysilane and vinyl silanol.

Vinylalkoxysilanes are, for example,
Vinyltrimethoxysilane (CAS registration number: 2768-02-7),
Examples of the silane include, but are not limited to, vinyltriethoxysilane (CAS Registry Number: 78-08-0) and vinylmethyldimethoxysilane (CAS Registry Number: 16753-62-1).

Examples of vinyl silanols include hydrolyzates of the vinyl alkoxysilanes mentioned above.

Examples of acryloxysilane coupling agents include, but are not limited to, acryloxyalkoxysilane and acryloxysilanol.

Examples of the acryloxyalkoxysilane include
3-methacryloxypropyltrimethoxysilane (CAS registration number: 2530-85-0),
Examples of the silane include, but are not limited to, 3-methacryloxypropylmethyldimethoxysilane and 3-acryloxypropyltrimethoxysilane.

Examples of acryloxysilanols include hydrolysates of the above-mentioned acryloxyalkoxysilanes.

In some embodiments of the present invention, the glass fiber cloth product is a glass fiber cloth treated with a silane coupling agent, and the content of the silane coupling agent is in the range of 0.05 wt% to 1.5 wt%, with the total amount of the glass fiber cloth treated with the silane coupling agent being 100 wt%.

In some embodiments of the present invention, the content of the silane coupling agent is in the range of 0.05 wt% to 1.0 wt%, with the total amount of the glass fiber cloth treated with the silane coupling agent being 100 wt%.

In some embodiments of the present invention, the content of the silane coupling agent is in the range of 0.05 wt% to 0.5 wt%, with the total amount of the glass fiber cloth treated with the silane coupling agent being 100 wt%.

In some embodiments of the present invention in which the silane coupling agent is a silane coupling agent that does not have an amino group, the content of the silane coupling agent is in the range of 0.1 wt% to 1.0 wt%, where the total amount of the glass fiber cloth treated with the silane coupling agent is 100 wt%.

<Resin>
The fiberglass fabric product of the present invention further comprises a resin.
Examples of the resin include, but are not limited to, a thermosetting resin or a photocurable resin.

In some embodiments of the present invention, the resin is a thermosetting resin.
Examples of the thermosetting resin include, but are not limited to, polyphenylene ether resin, phenolic resin, epoxy resin, urea-formaldehyde resin, unsaturated polyester, melamine resin, and fluororesin.

Examples of photocurable resins include, but are not limited to, photocurable polyurethane resins and photocurable acrylic resins.

In some embodiments of the present invention, the glass fiber fabric product is a glass fiber prepreg, and the resin content (RC) is in the range of 40 wt% to 70 wt%, with the total amount of glass fiber prepreg being 100 wt%.

In some embodiments of the present invention, the resin content is in the range of 50 wt% to 55 wt%, with the total amount of glass fiber prepreg being 100 wt%.

In some embodiments of the present invention, the resin content is in the range of 51 wt% to 53 wt%, with the total amount of glass fiber prepreg being 100 wt%.

<Printed Circuit Board>
The printed circuit board of the present invention comprises the fiberglass fabric article described above.
Examples of the printed circuit board include single-sided printed circuit boards, double-sided printed circuit boards, multi-layer printed circuit boards, high-density printed circuit boards, and substrate-like printed circuit boards (abbreviated as SLP).

The glass fiber cloth products are used in the above printed circuit boards and as insulating layers, mounting substrates or reinforcement layers.

Glass fiber cloth products for printed circuit boards have multiple advantages, including a low coefficient of thermal expansion, a low dielectric constant, and a low dielectric tangent, and therefore can avoid the problem of unstable dimensions caused by thermal expansion. In addition, when the printed circuit board is used at a high frequency (e.g., 10 GHz), there is no problem of signal transmission delay, and the transmission speed is fast, and there is no signal transmission loss (attenuation), so the signal transmission is highly complete. Therefore, it can be used in electronic products that adopt communication technology of 5G or higher.

<Integrated Circuit Board>
The integrated circuit substrate of the present invention comprises the fiberglass fabric article described above.
Examples of integrated circuit substrates include, but are not limited to, flip chip substrates or wire bond substrates.

The glass fiber cloth product is an insulating layer, a mounting substrate or a reinforcing layer of the above integrated circuit board.
The glass fiber cloth product of the integrated circuit board has several advantages, such as a low thermal expansion coefficient, a low dielectric constant and a low dielectric loss tangent, so that the problem of the connection interface between the chip and the integrated circuit board being displaced due to thermal expansion, resulting in the loss of function of the connection conduction point, can be avoided. In addition, when the integrated circuit board is used at a high frequency (e.g., 10 GHz), it has the advantages of having a high transmission speed without the problem of signal transmission delay, and having high signal transmission integrity without signal transmission loss (attenuation), and therefore can be used in electronic products adopting communication technology of 5G or higher.

<Electronic products>
The electronic product of the present invention includes at least one of the above-described printed circuit board and the above-described integrated circuit board.
Examples of electronic products include, but are not limited to, mobile phones, tablets, autonomous vehicle electronic devices such as millimeter wave radar or image recognition systems, graphic boards, wireless communication devices or servers.

The present invention will be described below with reference to the following Preparations and Examples. It should be understood that these Preparations and Examples are illustrative and descriptive and should not be construed as limiting the present invention.

Production Example 1
A glass composition was obtained by mixing 55.21 wt% _SiO2 , 19.17 wt% _Al2O3 , 0.16 wt% CaO, 4.2 wt% MgO, 6.5 _wt % ZnO, 0.5 wt% CuO, 13.2 _wt % _B2O3 , and 1.06 wt% other material components (including 0.03% _Na2O , 0.03% _K2O , 0.32% _Fe2O3 , and _0.68 % _TiO2 ).

The glass composition was placed in a high-temperature furnace and heated at a temperature of 1500°C to 1600°C for 1 to 4 hours to obtain a completely molten liquid glass. The liquid glass was then poured into a graphite crucible with a diameter of 40 mm, which was then placed in an annealing furnace preheated to 800°C, and the liquid glass was cooled to room temperature to form a glass block.

Production Examples 2 to 5 and Comparative Production Examples 1 to 4
The manufacturing methods of Manufacturing Examples 2 to 5 and Comparative Manufacturing Examples 1 to 4 were the same as Manufacturing Example 1, except that the glass compositions were different as shown in Tables 1 and 2.

[Evaluation item]
<Measurement of thermal expansion coefficient>
A sample having a size of 0.5 cm x 0.5 cm x 2 cm was obtained by cutting and polishing from the glass block of each manufacturing example and each comparative manufacturing example. Then, using a thermomechanical analyzer (Hitachi, model number: TMA71000), the samples of each manufacturing example and each comparative manufacturing example were heated at a heating rate of 10 ° C / min, and the length of each sample was measured at 50 ° C and 200 ° C., and the thermal expansion coefficient was calculated by calculating the change in length and the change in temperature from the measured length and temperature. The results are shown in Tables 1 and 2.

<Measurement of dielectric constant and dielectric tangent>
The glass blocks of each manufacturing example and each comparative manufacturing example were polished to prepare glass sheets having a thickness of 0.695 mm ± 0.095 mm, and then a vector network analyzer (ZNB20, R&S, Germany) was used in combination with a split post dielectric resonator (WAVERAY TECHNOLOGY CO., LTD., Taiwan) to measure the dielectric constant and dielectric loss tangent of the glass sheets of each manufacturing example and each comparative manufacturing example at a frequency of 10 GHz. The results are shown in Tables 1 and 2.

As shown in Tables 1 and 2, the glass compositions of Comparative Manufacturing Examples 1 to 4 do not simultaneously control the copper oxide content to a range exceeding 0 wt % and less than 7 wt %, and the boron oxide content to a range exceeding 13.1 wt %, so that at least one of the thermal expansion coefficient, dielectric constant, and dielectric loss tangent of the glass (glass block or glass sheet) made from the glass composition is too high.

In contrast, the glass composition of each manufacturing example in the present invention simultaneously controls the copper oxide content to a range of more than 0 wt% and less than 7 wt%, and the boron oxide content to a range of more than 13.1 wt% and less than 18 wt%, so that the glass (glass block or glass sheet) made from the glass composition has a thermal expansion coefficient of 2.8 ppm/°C or less, a dielectric constant of 4.98 or less, and a dielectric tangent of 0.0043 or less. Therefore, compared to the glasses of Comparative Manufacturing Examples 1 to 4, the glass made from the glass composition of the present invention has multiple advantages, such as a low thermal expansion coefficient, a low dielectric constant, and a low dielectric tangent, and the glass fiber made from the glass composition of the present invention also has multiple advantages, such as a low thermal expansion coefficient, a low dielectric constant, and a low dielectric tangent. Therefore, the glass fiber cloth product formed from the glass fiber of the present invention also has multiple advantages, such as a low thermal expansion coefficient, a low dielectric constant, and a low dielectric tangent. Therefore, when the glass fiber cloth product of the present invention is applied to a printed circuit board or integrated circuit board, it can provide the printed circuit board or integrated circuit board with the advantages of excellent dimensional stability, high signal transmission speed, and high signal transmission integrity.

Example 1 Glass fiber cloth product and double-sided printed circuit board The glass composition of Preparation Example 2 was placed in a furnace and melted to form a molten glass liquid, which was then subjected to spinning, sizing, winding and twisting processes in order to obtain a glass fiber yarn having a yarn type specification of E250.

The glass fiber yarns were used as the warp and weft threads, which were then subjected to warping-sizing and beaming processes to obtain a weaver's beam.

The weave beam was installed on an air jet loom (manufacturer: Toyota, model number: JAT710) and used to weave glass fiber cloth with a fabric type standard of 2116 together with the weft yarn.

The glass fiber cloth was then subjected to a desizing process and a fiber opening process, after which it was immersed in a silane coupling agent treatment liquid to perform a surface treatment on the glass fiber cloth, and then dried to form a glass fiber cloth treated with a silane coupling agent.

The silane coupling agent treatment liquid is formed by stirring and mixing vinyltrimethoxysilane into an aqueous solution of acetic acid to obtain a mixed liquid with a pH value of 3.5 to 5.5, and then carrying out a hydrolysis reaction for 30 minutes. The total amount of the silane coupling agent treatment liquid is 100 wt%, and the vinyltrimethoxysilane content is 0.08 wt%.

The total amount of glass fiber cloth treated with the silane coupling agent is 100 wt%, and the vinyltrimethoxysilane content is 0.14 wt%.

Glass fiber cloth treated with a silane coupling agent was impregnated with a polyphenylene ether solution. The polyphenylene ether solution contained polyphenylene ether (manufacturer: SABIC, Saudi Arabia, model number: NORYL SA9000, molecular weight: 2300) and butanone, and the polyphenylene ether content was 65 wt% with the total amount of the polyphenylene ether solution being 100 wt%. Then, it was heated and dried at 160°C to obtain a glass fiber prepreg with a thickness of 100 μm. Note that the resin (polyphenylene ether) content was 52 wt% with the total amount of the glass fiber prepreg being 100 wt%.

Seven glass fiber prepregs were stacked one on top of the other to form a first laminate, and a sheet of 1 HOZ (approximately 18 μm thick) copper foil was placed on the upper surface of the first laminate and a sheet of 1 HOZ copper foil was placed on the lower surface of the first laminate to form a second laminate. The second laminate was then subjected to a hot press treatment for 1.5 hours using a vacuum lamination machine (manufacturer: Taiwan VIGOR, model number: V8117A) with a temperature setting of 210°C to produce a copper foil substrate with a thickness of approximately 0.7 mm.

The copper foil substrate was then subjected to line etching, drilling, and plated-through hole processing to obtain a double-sided printed circuit board with multiple through holes, each with a hole diameter of 0.35 mm and spaced 0.7 mm apart.

Examples 2 to 9
The manufacturing method of Examples 2 to 9 was the same as that of Example 1, except that the type of silane coupling agent and the amount of each component used were different as shown in Table 3.

In the silane coupling agent treatment liquid in each example, the vinyl silane coupling agent is vinyltrimethoxysilane, the acryloxysilane coupling agent is 3-methacryloxypropyltrimethoxysilane, and the silane coupling agent having an amino group is (3-aminopropyl)trimethoxysilane.

[Evaluation item]
<Measurement of Silane Coupling Agent Content>
The measurement was performed with reference to the measurement method in Section 4.4.8 of IPC-4412 (2006 edition), standard for woven fabrics made of E-glass fiber for printed circuit boards.

The glass fiber cloth treated with the silane coupling agent of Examples 1 to 9 was cut to form multiple samples with a size of 30 cm x 30 cm, and each sample was placed on a stainless steel tray and placed in an oven (manufacturer: Taiwan Dengyng Co., Ltd., model number: DOS30) with a temperature setting of 105 ± 5 ° C for 30 minutes for heat drying treatment, and then removed and cooled to obtain multiple dried glass fiber cloths. The weight of each dried glass fiber cloth was measured and recorded as W1.

Then, each dried glass fiber cloth was placed in a high-temperature furnace (manufacturer: Great Tide Co., Ltd., Taiwan, model number: JH-01) with a temperature setting of 625±5°C for 30 minutes for heat treatment, and then removed and cooled to obtain multiple heat-treated glass fiber cloths. The weight of each heat-treated glass fiber cloth was measured and recorded as W2.

The content of the silane coupling agent in the glass fiber cloth treated with the silane coupling agent was calculated according to the following formula.
Formula: [(W1-W2)/W1] x 100%

<Measurement of Resin Content>
The measurement was carried out with reference to the method for measuring the resin content of prepregs in IPC-TM-650 2.3.16.1 (1994 edition).

The weight of the fiberglass cloth treated with the silane coupling agents of Examples 1-9 was weighed and recorded as W3.
The fiberglass prepregs of Examples 1-9 were weighed and recorded as W4.

The resin content in the glass fiber prepreg was calculated using the following formula.
Formula: [(W4-W3)/W4] x 100%

<Measurement of Conductive Anodic Filament (CAF, unit: %)>
The double-sided printed circuit boards of Examples 1 to 9 were placed in a temperature and humidity test chamber (Temperature & Humidity Test Chamber, manufacturer: TERCHY Co., Ltd., Taiwan, model number: HB-225L) and subjected to high temperature and humidity treatment to form a number of samples. The conditions for the high temperature and humidity treatment were a temperature of 130±2°C, a humidity of 85±5%, a vapor pressure of 3 standard atmospheres (1 standard atmosphere=101325 Pa), and a time of 96 hours.
During the high temperature and high humidity treatment, six channels of each sample were measured at a DC voltage of 50 V using a High Resistance Meter (manufacturer: Agilent, USA, model number: HP-4339B) to obtain six resistance values.

According to the standard of IPC-TM-650 2.6.25 (2016 edition), if the resistance value exceeded 10 ⁶ Ω, it was determined as passing, and the resistance value passing rate was calculated by the following formula.
Formula: (number of channels with resistance greater than 10 ⁶ Ω/6)×100%

The higher the resistance pass rate, the less likely it is that micro-short circuits will occur inside the circuit board on a double-sided printed circuit board.

<Measurement of the length of crazing (unit: mil)>
The double-sided printed circuit boards of Examples 1 to 9 were cross-sectioned along the Z-axis direction at the through-holes, and the XZ cut surface was observed using a microscope (manufacturer: Taiwan OME-TOP Co., Ltd., model number: PM-203). The lengths of the 10 longest microcracks were measured, the average length was calculated, and the maximum length was recorded.

As shown in Table 3, the double-sided printed circuit boards of Examples 1 to 9 have a resistance pass rate of 66% to 100%, and the maximum length of the microcracks is 8 mils or less, which makes it less likely for micro-short circuits to occur in the inner layers of the circuit board, and prevents the double-sided printed circuit board from losing its function due to a short circuit, resulting in poor yield.

In addition, when comparing Examples 1 to 5 with Examples 6 to 9, the maximum length of microcracks in double-sided printed circuit boards formed with a glass fiber cloth product using a silane coupling agent without an amino group is 1.4 mil to 2.5 mil, which is smaller than the maximum length of microcracks in double-sided printed circuit boards formed with a glass fiber cloth product using a silane coupling agent with an amino group. This shows that, compared to double-sided printed circuit boards formed with a glass fiber cloth product using a silane coupling agent with an amino group, double-sided printed circuit boards formed with a glass fiber cloth product using a silane coupling agent without an amino group are less likely to suffer from micro-short circuits in the inner layers of the circuit board, resulting in better yields.

According to the above, the glass fiber cloth product of the present invention has multiple advantages such as low thermal expansion coefficient, low dielectric constant and low dielectric loss tangent due to the design of glass fiber. Due to the glass fiber cloth product, the printed circuit board, integrated circuit board and electronic product of the present invention containing the glass fiber cloth product have the advantages of excellent dimensional stability, signal transmission speed and signal transmission integrity.
Therefore, the object of the present invention can be achieved reliably.

The above embodiment is illustrative and describes the principles and effects of the present invention, and is not intended to limit the present invention. A person skilled in the art who is familiar with this technology may make some changes or modifications to the above embodiment, provided that such changes and modifications do not depart from the spirit and scope of the present invention. Therefore, all changes and modifications made by a person skilled in the art, provided that such changes and modifications do not depart from the gist of the present invention, should be considered to be included in the scope of protection of the present invention.

The fiberglass fabric of the present invention is suitable for use in printed circuit boards, integrated circuit boards and electronic products.

Claims (13)

Contains glass fiber cloth and a silane coupling agent;
The glass fiber cloth is a woven or woven fabric of glass fiber yarn formed from glass fibers containing a glass composition,
The glass composition is, assuming the total amount of the glass composition to be 100 wt %,
Silicon oxide having a content in the range of 55 wt % to 64 wt %;
Aluminum oxide having a content in the range of 15 wt % to 22 wt %;
Calcium oxide having a content in the range of 0.1 wt % to 4 wt %;
Magnesium oxide having a content in the range of 2.1 wt % to 10 wt %;
Copper oxide having a content of more than 0 wt % and less than 7 wt %;
and boron oxide in a content range of more than 13.1 wt % and less than 18 wt %. The glass composition further comprises zinc oxide,
2. The glass fiber cloth product according to claim 1, wherein the content of said zinc oxide is in the range of more than 0 wt % and not more than 8 wt %, with the total amount of said glass composition being 100 wt %. The glass composition further comprises other material components,
10. The fiberglass fabric product of claim 1, wherein the other material component comprises at least one other material selected from the group consisting of sodium oxide, potassium oxide, iron oxide, titanium dioxide, or combinations thereof. The glass fiber cloth product according to claim 3, characterized in that the content of the other substance components is in the range of more than 0 wt% and not more than 1.2 wt%, with the total amount of the glass composition being 100 wt%. The glass fiber cloth product according to claim 1, characterized in that the silane coupling agent is a silane coupling agent that does not have an amino group. The glass fiber cloth product according to claim 5, characterized in that the silane coupling agent not having an amino group is selected from a vinyl silane coupling agent, an acryloxy silane coupling agent, or a combination thereof. The glass fiber cloth product according to claim 1, further comprising a resin. The glass fiber cloth product according to claim 7, characterized in that the resin is selected from a thermosetting resin or a photocurable resin. The glass fiber cloth product according to claim 8, characterized in that the thermosetting resin is polyphenylene ether. A printed circuit board comprising the glass fiber cloth product according to any one of claims 7 to 9. An integrated circuit substrate comprising the glass fiber cloth product according to any one of claims 7 to 9. 11. An electronic product comprising the printed circuit board of claim 10. 12. An electronic product comprising the integrated circuit substrate of claim 11.