JP7505207B2 - Mounting structure of solid-state imaging element, imaging device, mounting method of solid-state imaging element, and manufacturing method of imaging device - Google Patents

Description

The present invention relates to a mounting structure for a solid-state imaging element, an imaging device in which a solid-state imaging element is mounted using said mounting structure, a mounting method for a solid-state imaging element, and a manufacturing method for an imaging device in which a solid-state imaging element is mounted using said mounting method.

Conventionally, imaging devices equipped with solid-state imaging elements such as CCD (charge-coupled device) image sensors and CMOS (complementary metal oxide semiconductor) image sensors have been widely used in digital cameras, copiers, scanners, and the like.

The imaging device includes a lens and a solid-state imaging element (image sensor) that reads an image through the lens, and during assembly, the position of the solid-state imaging element is adjusted relative to the optical axis of the lens by reading a pattern image with the solid-state imaging element, etc.

Patent document 1 describes a technique in which, after adjusting the position of a solid-state imaging element in five axial directions, an imaging lens holding member to which an imaging lens is fixed and an intermediate holding member supporting the solid-state imaging element are fixed with an adhesive, and the solid-state imaging element and the intermediate holding member are fixed with an adhesive.

However, as described in Patent Document 1, when the solid-state imaging element is fixed with an adhesive, the adhesive strength may become uneven due to variations in the cleanliness of the adherend surfaces, and the thickness of the adhesive may become uneven due to the inclination between the adherend surfaces, which may cause the solid-state imaging element to become misaligned with respect to the optical axis of the lens.

JP 2001-313779 A

Therefore, an object of the present invention is to provide a mounting structure for a solid-state imaging element that does not cause misalignment of the solid-state imaging element with respect to the optical axis of a lens when fixing a solid-state imaging element holding member to which the solid-state imaging element is fixed and a lens holding member to which a lens is attached, and an imaging device in which a solid-state imaging element is attached by means of the mounting structure.
Another object of the present invention is to provide a method for mounting a solid-state imaging element that does not cause misalignment of the solid-state imaging element with respect to the optical axis of a lens when fixing a solid-state imaging element holding member to which the solid-state imaging element is fixed and a lens holding member to which a lens is attached, and a method for manufacturing an imaging device in which a solid-state imaging element is mounted by said mounting method.

In order to achieve the above object, the present invention provides
a solid-state imaging element holding member to which the solid-state imaging element is fixed;
a lens holding member to which a lens is attached;
A mounting structure for a solid-state imaging element, in which the solid-state imaging element holding member is fixed to the lens holding member in a state in which the solid-state imaging element is positioned with respect to an optical axis of the lens,
The lens holding member is provided with a plurality of support members whose heights can be changed,
the solid-state imaging element holding member is fixed to the lens holding member in a state in which the solid-state imaging element is adjusted in position with respect to the optical axis of the lens and abuts against the tip portions of the plurality of support members ;
the lens holding member is provided with two of the support members at respective lateral positions corresponding to both sides in a width direction of the solid-state imaging element,
the solid-state imaging element holding member is fixed to the lens holding member by a fixing screw member between two of the support members at each of the lateral positions while being in contact with the tip portions of the support members,
the support member is a support screw member that is provided on the lens holding member so as to be capable of advancing and retreating,
the solid-state imaging element holding member is fixed to the lens holding member in a state of contacting a tip end portion of the post screw member,
The present invention is characterized in that an adhesive is applied between the solid-state imaging element holding member and the lens holding member, and between the support screw member and the fixing screw member at each of the lateral positions, for fixing the solid-state imaging element holding member and the lens holding member and for preventing the support screw member and each of the fixing screw members from loosening .

Here, in the present invention, the height of the support member means the length of the support member protruding from the lens holding member, and is not necessarily limited to the vertical direction depending on the positional relationship between the solid-state imaging element holding member and the lens holding member, for example, when the solid-state imaging element is adjusted relative to the optical axis of the lens with the optical axis of the lens facing horizontally.

The mounting structure of the solid-state imaging device of the present invention comprises:
The solid-state imaging element holding member is preferably a rigid metal plate to which a sensor substrate having the solid-state imaging element fixed thereto is fixed.

The mounting structure of the solid-state imaging device of the present invention comprises:
It is preferable that the lens holding member is a camera case, and the rigid plate is fixed to the camera case.

The present invention relates to
a solid-state imaging element holding member to which the solid-state imaging element is fixed;
and a lens holding member to which a lens is attached,
According to any one of the above-mentioned solid-state imaging element mounting structures, the solid-state imaging element holding member is fixed to the lens holding member with the solid-state imaging element positioned relative to the optical axis of the lens.

In order to achieve the above object, the present invention provides a method for producing a liquid crystal display comprising:
a solid-state imaging element holding member to which the solid-state imaging element is fixed;
a lens holding member to which a lens is attached;
A method for mounting a solid-state imaging element, comprising the steps of: fixing the solid-state imaging element holding member to the lens holding member in a state in which the solid-state imaging element is positioned with respect to an optical axis of the lens;
a position adjustment step of adjusting the position of the solid-state imaging element with respect to an optical axis of the lens;
a contact step of contacting the solid-state imaging element holding member with tip portions of a plurality of support members provided on the lens holding member in a height-adjustable manner while the solid-state imaging element is positioned relative to the optical axis of the lens;
a fixing step of fixing the solid-state imaging element holding member to the lens holding member in a state in which the solid-state imaging element holding member and the tip ends of the plurality of support members are in contact with each other ,
the lens holding member is provided with two of the support members at respective lateral positions corresponding to both sides in a width direction of the solid-state imaging element,
the fixing step includes fixing the solid-state imaging element holding member to the lens holding member by a fixing screw member between two of the support members at each of the lateral positions in a state in which the solid-state imaging element holding member and a tip end of the support member are in contact with each other,
the support member is a support screw member that is provided on the lens holding member so as to be capable of advancing and retreating,
the abutting step is a step of changing a height of each of the support screw members and abutting a tip end of each of the support screw members against the solid-state imaging element holding member while adjusting the position of the solid-state imaging element with respect to the optical axis of the lens;
The fixing process is characterized in that after fixing the solid-state imaging element holding member to the lens holding member with the fixing screw member, an adhesive is applied between the solid-state imaging element holding member and the lens holding member, between the support screw member and the fixing screw member at each of the lateral positions, to fix the solid-state imaging element holding member and the lens holding member and to prevent each of the support screw members and each of the fixing screw members from loosening .

The method for mounting a solid-state imaging device of the present invention comprises the steps of:
the solid-state imaging element holding member is a rigid plate made of metal to which a sensor substrate having the solid-state imaging element fixed is fixed,
The plate is provided with a through hole for a drill bit,
It is preferable that the abutment process involves moving each of the post screw members back and forth using a drill bit inserted into the insertion hole from the plate side to change the height, and abutting the tip of each of the post screw members against the solid-state imaging element holding member.

The method for mounting a solid-state imaging device of the present invention comprises the steps of:
It is preferable that the abutment process detects that the tip of each of the support members (support screw members) has come into contact with the solid-state imaging element holding member and stops changing the height of each of the support members (support screw members).

The method for mounting a solid-state imaging device of the present invention comprises the steps of:
the solid-state imaging element holding member is a rigid plate made of metal to which a sensor substrate having the solid-state imaging element fixed is fixed,
The plate is provided with a through hole for a drill bit corresponding to each of the two post screw members at each of the side positions, while the entire surface of the plate is insulated;
a foil-shaped conductive member for electrically connecting the front and back surfaces of the plate is disposed around the opening of each of the insertion holes of the plate,
It is preferable that the abutment process involves inserting a drill bit, into each of the insertion holes from the plate side, into which a coil spring that abuts against the surface of the plate is loosely fitted, and using the drill bit to move each of the post screw members back and forth to change their height, and then detecting that the tip of each of the post screw members has come into contact with the back surface of the plate by passing electricity through the drill bit, the conductive member, and the coil spring, and then stopping the change in the height of each of the post screw members.

The present invention relates to
a solid-state imaging element holding member to which the solid-state imaging element is fixed;
A manufacturing method of an imaging device including a lens holding member to which a lens is attached, comprising:
According to any one of the above-described methods for mounting a solid-state imaging element, the solid-state imaging element holding member is fixed to the lens holding member in a state in which the solid-state imaging element is positioned relative to the optical axis of the lens.

The solid-state imaging element mounting structure of the present invention has a lens holding member provided with a plurality of support members whose heights can be adjusted, and the solid-state imaging element holding member is fixed to the lens holding member with the solid-state imaging element adjusted in position with respect to the optical axis of the lens and in contact with the tips of the plurality of support members, so that the solid-state imaging element holding member can be fixed to the lens holding member while maintaining the solid-state imaging element adjusted in position with respect to the optical axis of the lens.
Therefore, according to the solid-state imaging element mounting structure of the present invention, when the solid-state imaging element holding member to which the solid-state imaging element is fixed and the lens holding member to which the lens is attached are fixed, no positional deviation of the solid-state imaging element occurs relative to the optical axis of the lens.

In addition, in the solid-state imaging element mounting structure of the present invention, the lens holding member is provided with two support members at each lateral position corresponding to both widthwise sides of the solid-state imaging element, and the solid -state imaging element holding member is fixed to the lens holding member by fixing screw members between the two support members at each of the lateral positions with the solid-state imaging element holding member abutting the tip of the support member.Since the support members and the fixing screw members are in close proximity to each other, there is no risk of the solid-state imaging element holding member being deformed by the tightening load of the fixing screw members.

The mounting structure for a solid-state imaging element of the present invention is such that the support member is a support screw member that is movably attached to the lens holding member, and the lens holding member is provided with two support screw members at each lateral position corresponding to both widthwise sides of the solid -state imaging element, and the solid-state imaging element holding member is fixed to the lens holding member by a fixing screw member between the two support screw members at each of the lateral positions while abutting the tip of the support screw member, so that the solid-state imaging element holding member can be firmly fixed to the lens holding member by being sandwiched between the support screw member from the lens holding member side and the fixing screw member from the solid-state imaging element holding member side.

The solid-state imaging element mounting structure of the present invention is such that an adhesive is applied between the solid-state imaging element holding member and the lens holding member, and between the support screw member and the fixing screw member at each of the lateral positions, for fixing the solid-state imaging element holding member and the lens holding member and for preventing the support screw member and each of the fixing screw members from loosening.As a result of the hardening and shrinkage of the adhesive, the solid-state imaging element holding member and the lens holding member are firmly attracted to each other and fixed, and loosening of the support screw member and each of the fixing screw members can be prevented.

The mounting structure for the solid-state imaging element of the present invention can prevent deformation of the solid-state imaging element holding member due to heat generation from the solid-state imaging element and prevent misalignment of the solid-state imaging element relative to the optical axis of the lens if the solid-state imaging element holding member is a rigid metal plate to which a sensor board with the solid-state imaging element fixed is fixed.

The imaging device of the present invention comprises a solid-state imaging element holding member to which a solid-state imaging element is fixed, and a lens holding member to which a lens is attached, and the solid-state imaging element holding member is fixed to the lens holding member with the solid-state imaging element positioned relative to the optical axis of the lens by a solid-state imaging element mounting structure that does not cause the solid-state imaging element to shift in position relative to the optical axis of the lens.
Therefore, according to the imaging device of the present invention, there is no positional deviation of the solid-state imaging element with respect to the optical axis of the lens.

In addition, the method of installing a solid-state imaging element of the present invention includes a position adjustment step of adjusting the position of the solid-state imaging element relative to the optical axis of the lens, a contact step of abutting the solid-state imaging element holding member with the tips of a plurality of support members whose heights are adjustable on the lens holding member while the solid-state imaging element is in a position adjusted relative to the optical axis of the lens, and a fixing step of fixing the solid-state imaging element holding member to the lens holding member while the tips of the solid-state imaging element holding member and the plurality of support members are in abutment.Therefore, the solid-state imaging element holding member can be fixed to the lens holding member while maintaining the solid-state imaging element in a position adjusted relative to the optical axis of the lens.
Therefore, according to the method for mounting a solid-state imaging element of the present invention, when the solid-state imaging element holding member to which the solid-state imaging element is fixed and the lens holding member to which the lens is fixed are fixed, no positional deviation of the solid-state imaging element occurs relative to the optical axis of the lens.

In the method of mounting a solid-state imaging element of the present invention, the lens holding member has two support members at each lateral position corresponding to both widthwise sides of the solid-state imaging element, and the fixing step fixes the solid -state imaging element holding member to the lens holding member at each of the lateral positions between the two support members by a fixing screw member with the tip ends of the solid- state imaging element holding member and the support member in abutting contact with each other.Since the support members and the fixing screw member are in close proximity to each other, there is no risk of the solid-state imaging element holding member being deformed by the tightening load of the fixing screw member.

In the method of mounting a solid-state imaging element of the present invention, the support member is a support screw member that is movable forward and backward on the lens holding member, and the lens holding member is provided with two support screw members at each lateral position corresponding to both widthwise sides of the solid-state imaging element, and the fixing process fixes the solid- state imaging element holding member to the lens holding member at each of the lateral positions between the two support screw members by a fixing screw member with the tip portions of the solid-state imaging element holding member and the support screw member abutting each other , so that the solid-state imaging element holding member can be firmly fixed to the lens holding member by being sandwiched between the support screw member from the lens holding member side and the fixing screw member from the solid-state imaging element holding member side.

In the solid-state imaging element mounting method of the present invention, the fixing step involves fixing the solid-state imaging element holding member to the lens holding member with the fixing screw member, and then applying an adhesive between the solid -state imaging element holding member and the lens holding member, and between the support screw member and the fixing screw member at each of the lateral positions, for fixing the solid-state imaging element holding member and the lens holding member and for preventing loosening of each of the support screw members and each of the fixing screw members.As a result of the hardening and shrinkage of the adhesive, the solid-state imaging element holding member and the lens holding member are firmly attracted to and fixed together, and loosening of each of the support screw members and each of the fixing screw members can be prevented.

In the method for mounting a solid-state imaging element of the present invention, if the contact step detects that the tip of each of the support members (support screw members) has come into contact with the solid-state imaging element holding member and stops changing the height of each of the support members (support screw members), it is possible to prevent misalignment caused by the impact when the tip of each of the support screw members comes into contact with the solid-state imaging element holding member.

The manufacturing method for an imaging device of the present invention is a manufacturing method for an imaging device that includes a solid-state imaging element holding member to which a solid-state imaging element is fixed, and a lens holding member to which a lens is attached, and the solid-state imaging element holding member is fixed to the lens holding member with the solid-state imaging element positioned relative to the optical axis of the lens using a solid-state imaging element mounting method that does not cause the solid-state imaging element to be misaligned relative to the optical axis of the lens.
Therefore, according to the method for manufacturing an imaging device of the present invention, no positional deviation of the solid-state imaging element occurs with respect to the optical axis of the lens.

FIG. Exploded view of the sensor board. FIG. A diagram showing the relationship between the sensor board and the camera case. FIG. 4 is an explanatory diagram of a state in which the position of the solid-state imaging element is adjusted with respect to the lens optical axis. 13 is an explanatory diagram of a state in which the support bolt is brought into contact with the sensor board. FIG. FIG. 4 is an explanatory diagram of the sensor board fixed to the camera case. FIG. 4 is an explanatory diagram of the fixing portion of the sensor board and the camera case.

An embodiment of the present invention will be described with reference to the drawings.
Fig. 1 shows a perspective view of the sensor board, Fig. 2 shows an exploded view of the sensor board, Fig. 3 shows a perspective view of the camera case, and Fig. 4 shows the relationship between the sensor board and the camera case.
In the embodiment of the present invention, the imaging device comprises a sensor board 1 and a camera case 2 to which the sensor board 1 is fixed.

1 and 2, the sensor board 1 includes a sensor substrate 12 having a solid-state image pickup element such as a line sensor fixed to its underside, and a metallic rigid plate 13 to which the sensor substrate 12 is fixed.
An opening 131 is formed in the rigid plate 13 , and the sensor board 12 is fixed to the rigid plate 13 by a connecting bolt 3 in the vicinity of the solid-state imaging element so that the solid-state imaging element is positioned in the opening 131 .

The rigid plate 13 has two drill bit insertion holes 133 for inserting a drill bit 51, which will be described later, at lateral positions (on both sides of the opening 131) corresponding to both sides in the width direction of the solid-state imaging element. Each of the drill bit insertion holes 133 has a diameter larger than that of the drill bit 51.

The rigid plate 13 is insulated on its entire surface, and copper foil tape 135 is arranged around the openings where the drill bit insertion holes 133 are opened, as shown in Figures 1 and 2, to provide electrical conductivity between the upper and lower surfaces of the rigid plate 13.

Between the drill bit insertion holes 133 at both side positions of the rigid plate 13, a fixing bolt insertion hole 137 for inserting a fixing bolt 4 described later is provided. The fixing bolt insertion hole 137 has a diameter larger than that of the fixing bolt 4.

The camera case 2 has a lens mounting portion 21 at the upper part in FIG. 3, and a lens 22 is mounted in the lens mounting portion 21.
The camera case 2 is provided with two support bolts 24 each at lateral positions corresponding to both widthwise sides of the solid-state imaging element when fixing the sensor board 1, the support bolts 24 being vertically movable and adjustable in height.

A screw hole 26 for a fixing bolt is provided between each of the support bolts 24 at both sides of the camera case 2, for screwing the fixing bolt 4 when fixing the sensor board 1.

In an embodiment of the present invention, the sensor board 1 and the camera case 2 are fixed in a state in which the solid-state image sensor mounted on the sensor board 1 is adjusted in position relative to the optical axis 23 of the lens 22 mounted on the camera case 2, for example, in the five-axis direction shown in FIG. 4.

The five axis directions shown in FIG. 4 are the X-axis direction and the Y-axis direction parallel to a plane perpendicular to the optical axis 23 of the lens 22 (the X-axis direction is the main scanning direction of the solid-state imaging element, and the Y-axis direction is a direction perpendicular to the main scanning direction of the solid-state imaging element), the Z-axis direction parallel to the optical axis 23 of the lens 22, the β rotation direction around the Y axis, and the γ rotation direction around the Z axis.

FIG. 5 is an explanatory diagram showing a state in which the position of the solid-state image sensor is adjusted with respect to the optical axis of the lens.
In the example shown in FIG. 5, the sensor board 1 is positioned directly above the camera case 2 with the solid-state imaging element adjusted in position in the five axial directions shown in FIG.
After the sensor board 1 is positioned relative to the camera case 2, the support bolts 24 provided on the camera case 2 are raised to adjust their height, and the heads of the support bolts 24 are abutted against the underside of the sensor board 1 (rigid plate 13).

FIG. 6 is an explanatory diagram showing how the post bolt is brought into contact with the sensor board.
In the example shown in Figure 6, the drill bit 51 of the electric screwdriver 5 is inserted from above into the drill bit insertion hole 133 provided in the rigid plate 13, and the support bolt 24 is rotated and raised by the drill bit 51.
Here, a coil spring 52 is loosely fitted into the drill bit 51, and the lower end of the coil spring 52 is in contact with the copper foil tape 135 arranged on the upper surface of the rigid plate 13, and the drill bit 51 is used to raise the support bolt 24.

Then, the contact of the head of the support bolt 24 with the copper foil tape 135 arranged on the underside of the rigid plate 13 is detected by passing electricity through the drill bit 51, the support bolt 24, the copper foil tape 135, and the coil spring 52, and the lifting of the support bolt 24 by the drill bit 51 is stopped.

In the example shown in FIG. 6, the contact of the head of each support bolt 24 with the underside of the rigid plate 13 is detected and the adjustment of the height of each support bolt 24 is stopped, so that it is possible to prevent the position of the solid-state imaging element from shifting relative to the optical axis 23 of the lens 22 due to the impact when the head of each support bolt 24 abuts against the underside of the rigid plate 13.

Here, for example, a low head bolt with a hexagonal socket or a cross recess can be used as the support bolt 24. If the support bolt 24 is a low head bolt, the head of the support bolt 24 can be reliably brought into contact with the copper foil tape 135 disposed on the lower surface of the rigid plate 13.
Moreover, instead of the copper foil tape 135, other foil-like conductive members such as aluminum foil can be used.

In the example shown in FIG. 6, contact of the head of each support bolt 24 with the underside of the rigid plate 13 is detected by passing an electric current through it, but contact can also be detected by other means.

The support bolts 24 provided on the camera case 2 are raised to adjust the height, and all of the support bolts 24 are brought into contact with the underside of the sensor board 1. After that, the fixing bolts 4 are screwed from above the sensor board 1 through the fixing bolt insertion holes 137 into the fixing bolt screw holes 26 provided on the camera case 2 at both side positions of the sensor board 1, and the sensor board 1 is fixed to the camera case 2.

Fig. 7 is an explanatory diagram of the state in which the sensor board is fixed to the camera case, and Fig. 8 is an explanatory diagram of the fixing part of the sensor board and the camera case.
In the example shown in Figure 7, the sensor board 1 is positioned directly above the camera case 2 with the solid-state imaging element adjusted to the optical axis 23 of the lens 22, and the sensor board 1 is fixed to the camera case 2 by each of the fixing bolts 4 with the heads of each of the support bolts 24 abutting the underside of the sensor board 1.

Therefore, the sensor board 1 can be fixed to the camera case 2 while maintaining the state in which the solid-state imaging element is positioned relative to the optical axis 23 of the lens 22 .
Therefore, according to the embodiment of the present invention, when the sensor board 1 is fixed to the camera case 2 , no positional deviation of the solid-state imaging element with respect to the optical axis 23 of the lens 22 occurs.

Furthermore, according to the embodiment of the present invention, the sensor board 1 can be firmly fixed to the camera case 2 by sandwiching it between the support bolt 24 from the camera case 2 side and the fixing bolt 4 from the sensor board 1 side.

Furthermore, according to the embodiment of the present invention, the sensor board 1 is fixed to the camera case 2 by the fixing bolt 4 between the two support bolts 24 at each of the lateral positions while abutting against the heads of the support bolts 24. Since the support bolts 24 and the fixing bolts 4 are in close proximity to each other, there is no risk of the sensor board 1 being deformed by the tightening load of the fixing bolts 4.

8, an adhesive 6 can be applied between the rigid plate 13 and the camera case 2, and between each of the support bolts 24 and the fixing bolts 4. At that time, the adhesive 6 can be applied so as to be entangled with each of the support bolts 24 and the fixing bolts 4.
The adhesive 6 functions to secure the sensor board 1 and the camera case 2 together, and also to prevent the support bolts 24 and the fixing bolts 4 from loosening. As the adhesive 6 hardens and shrinks, the sensor board 1 and the camera case 2 are firmly attracted to and fixed together, and the support bolts 24 and the fixing bolts 4 can be prevented from loosening.

In the above embodiment of the present invention, the sensor board 1 is provided with a metallic rigid plate 13 to which a sensor board 12 having a solid-state imaging element such as a line sensor fixed thereto is fixed, and the rigid plate 13 is fixed to the camera case 2, but the sensor board 12 can also be fixed to the camera case 2 without using the rigid plate 13.
Further, although the sensor board 1 is fixed directly to the camera case 2 by the fixing bolts 4, it may be fixed via an L-shaped metal fitting or the like.
By providing the sensor board 1 with the rigid plate 13 to which the sensor substrate 12 is fixed and fixing the rigid plate 13 to the camera case 2, deformation of the sensor board 1 due to heat generation by the solid-state imaging element can be prevented, and misalignment of the solid-state imaging element relative to the optical axis 23 of the lens 22 can be prevented.

In the above embodiment of the present invention, the pillar bolts 24 are provided in two on each side of the camera case 2, but this is not limited to this. For example, the pillar bolts 24 can be provided in other positions in addition to the above positions, or in other positions other than the above positions.

In the above embodiment of the present invention, the support bolt 24 provided on the camera case 2 is rotated upward by a drill bit 51 from above the sensor board 1, but this is not limited to this and it can also be rotated upward, for example, from below the camera case 2.
Further, in a state where the solid-state imaging element is positioned relative to the optical axis 23 of the lens 22, other members may be used instead of the support bolts 24 as support members that abut against the lower surface of the sensor board 1.

The above describes an embodiment of the present invention, but the present invention is not limited to the above embodiment, and the configuration can be modified as appropriate without departing from the scope of the invention.

The mounting structure for a solid-state imaging element and the mounting method for a solid-state imaging element of the present invention are extremely useful because they prevent misalignment of the solid-state imaging element with respect to the optical axis of the lens when fixing the solid-state imaging element holding member to which the solid-state imaging element is fixed and the lens holding member to which the lens is attached.

1 Sensor board (solid-state image sensor holding member)
12 Sensor board 13 Rigid plate 131 Opening 133 Drill bit insertion hole 135 Copper foil tape 137 Fixing bolt insertion hole 2 Camera case (lens holding member)
21 Lens mounting portion 22 Lens 23 Optical axis 24 Post bolt 26 Screw hole for fixing bolt 3 Connecting bolt 4 Fixing bolt 5 Electric driver 51 Drill bit 52 Coil spring 6 Adhesive

Claims (6)

a solid-state imaging element holding member to which the solid-state imaging element is fixed;
a lens holding member to which a lens is attached;
A mounting structure for a solid-state imaging element, in which the solid-state imaging element holding member is fixed to the lens holding member in a state in which the solid-state imaging element is positioned with respect to an optical axis of the lens,
The lens holding member is provided with a plurality of support members whose heights can be changed,
the solid-state imaging element holding member is fixed to the lens holding member in a state in which the solid-state imaging element is adjusted in position with respect to the optical axis of the lens and abuts against the tip portions of the plurality of support members ,
the lens holding member is provided with two of the support members at respective lateral positions corresponding to both sides in a width direction of the solid-state imaging element,
the solid-state imaging element holding member is fixed to the lens holding member by a fixing screw member between two of the support members at each of the lateral positions while being in contact with the tip portions of the support members,
the support member is a support screw member that is provided on the lens holding member so as to be capable of advancing and retreating,
the solid-state imaging element holding member is fixed to the lens holding member in a state of contacting a tip end portion of the post screw member,
A solid-state imaging element mounting structure characterized in that an adhesive is applied between the solid-state imaging element holding member and the lens holding member, and between the support screw member and the fixing screw member at each of the lateral positions, to fix the solid-state imaging element holding member and the lens holding member and to prevent the support screw member and each of the fixing screw members from loosening. 2. The solid-state image sensor mounting structure according to claim 1, wherein the solid-state image sensor holding member is a rigid metal plate to which a sensor board having the solid-state image sensor fixed thereto is fixed. a solid-state imaging element holding member to which the solid-state imaging element is fixed;
and a lens holding member to which a lens is attached,
3. An imaging device characterized in that the solid-state imaging element holding member is fixed to the lens holding member with the solid-state imaging element positioned relative to the optical axis of the lens by the mounting structure for the solid-state imaging element according to claim 1 or 2. a solid-state imaging element holding member to which the solid-state imaging element is fixed;
a lens holding member to which a lens is attached;
A method for mounting a solid-state imaging element, comprising the steps of: fixing the solid-state imaging element holding member to the lens holding member in a state in which the solid-state imaging element is positioned with respect to an optical axis of the lens;
a position adjusting step of adjusting the position of the solid-state imaging element with respect to an optical axis of the lens;
a contact step of contacting the solid-state imaging element holding member with tip portions of a plurality of support members provided on the lens holding member in a height-adjustable manner while the solid-state imaging element is positioned with respect to the optical axis of the lens;
a fixing step of fixing the solid-state imaging element holding member to the lens holding member in a state in which the solid-state imaging element holding member and the tip ends of the plurality of support members are in contact with each other,
the lens holding member is provided with two of the support members at respective lateral positions corresponding to both sides in a width direction of the solid-state imaging element,
the fixing step includes fixing the solid-state imaging element holding member to the lens holding member by a fixing screw member between two of the support members at each of the lateral positions in a state in which the solid-state imaging element holding member and a tip end of the support member are in contact with each other,
the support member is a support screw member that is provided on the lens holding member so as to be capable of advancing and retreating,
the contacting step is a step of changing a height of each of the support screw members and contacting a tip end of each of the support screw members with the solid-state imaging element holding member in a state where the solid-state imaging element is positioned with respect to the optical axis of the lens;
A method for installing a solid-state imaging element, characterized in that the fixing process includes fixing the solid-state imaging element holding member to the lens holding member with the fixing screw member, and then applying an adhesive between the solid-state imaging element holding member and the lens holding member, between the support screw member and the fixing screw member at each of the lateral positions, to fix the solid-state imaging element holding member and the lens holding member and to prevent each of the support screw members and each of the fixing screw members from loosening. 5. The method for mounting a solid-state imaging device according to claim 4, wherein the abutting step detects that the tip of the support member has come into contact with the solid-state imaging device holding member and stops changing the height of the support member. a solid-state imaging element holding member to which the solid-state imaging element is fixed;
A manufacturing method of an imaging device including a lens holding member to which a lens is attached, comprising:
6. A method for manufacturing an imaging device, comprising the steps of: fixing the solid-state imaging element holding member to the lens holding member in a state in which the solid-state imaging element is positioned relative to the optical axis of the lens by the method for mounting the solid-state imaging element according to claim 4 or 5.

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