JP7511466B2 - Cleaning device for cleaning member, substrate cleaning device and cleaning member assembly - Google Patents

Description

The present invention relates to a cleaning member cleaning device, a substrate cleaning device, and a cleaning member assembly for cleaning a cleaning member.

Conventionally, new cleaning members have had to have contaminants attached to them, and these have had to be removed and initialized before use. In addition, if a substrate is continuously cleaned with a cleaned cleaning member, particles on the substrate, such as polishing slurry that was present on the substrate to be processed, accumulate on the cleaning member, causing a problem of reduced cleaning performance. To solve such problems, Patent Document 1 proposes a substrate cleaning device that rotates the substrate and cleans the substrate while bringing the cleaning member into contact with the rotating substrate. This substrate cleaning device is provided with a self-cleaning member that is provided on an arm supporting the cleaning member and that contacts the cleaning member to self-clean the cleaning member, and a movement mechanism that is provided on the arm supporting the cleaning member and that moves the self-cleaning member between a position where it contacts the cleaning member and a position where it is separated from the cleaning member.

JP 2016-152345 A

Patent Document 1 also discloses a configuration in which a cleaning liquid is supplied to the contact area between the cleaning member and the self-cleaning member. However, this conventional configuration in which a cleaning liquid is supplied from the outside to the contact area between the cleaning member and the self-cleaning member has problems, such as the possibility that the particle removal performance may not meet the expected performance in a cleaning process after substrate polishing using a specific slurry that has been recently investigated.

The present invention provides a cleaning member cleaning device, a substrate cleaning device, and a cleaning member assembly that can efficiently clean cleaning members.

The cleaning device for the cleaning member according to the present invention comprises:
a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
The present invention may also include:

In the cleaning device for a cleaning member according to the present invention,
During the second process, the supply of the cleaning liquid from the outer cleaning liquid supply unit to the substrate may be stopped.

In the cleaning device for a cleaning member according to the present invention,
During the second process, the cleaning liquid may be supplied from the outer cleaning liquid supply unit to the substrate.

In the cleaning device for a cleaning member according to the present invention,
A second rotation speed of the cleaning member in the second process may be faster than a first rotation speed of the cleaning member in the first process.

In the cleaning device for a cleaning member according to the present invention,
The inner cleaning liquid supply unit may supply a rinsing liquid and the outer cleaning liquid supply unit may supply a chemical liquid, the inner cleaning liquid supply unit may supply a chemical liquid and the outer cleaning liquid supply unit may supply a rinsing liquid, or both the inner cleaning liquid supply unit and the outer cleaning liquid supply unit may supply chemical liquids.

In the cleaning device for a cleaning member according to the present invention,
The inner cleaning liquid supplying unit may supply a first chemical liquid, and the outer cleaning liquid supplying unit may supply a second chemical liquid different from the first chemical liquid.

In the cleaning device for a cleaning member according to the present invention,
the control unit supplies a cleaning liquid from an inner cleaning liquid supply unit while the cleaning member is pressed against the substrate with a second pressure;
The second pressure may be less than or equal to half the first pressure.

In the cleaning device for a cleaning member according to the present invention,
The control unit may control the transport unit to replace the substrate, and control the first process, the second process, and the substrate replacement process to be performed a set of a plurality of times.

In the cleaning device for a cleaning member according to the present invention,
The first pressure in the latter set may be less than the first pressure in the former set.

In the cleaning device for a cleaning member according to the present invention,
The control unit may control the rotation directions of the substrate and the cleaning member to be opposite when the first pressure is equal to or greater than a threshold value, and to be the same when the first pressure is less than the threshold value.

In the cleaning device for a cleaning member according to the present invention,
the outer cleaning liquid supply unit continues to supply cleaning liquid during the first process and the second process;
The inner cleaning liquid supply unit may supply a rinsing liquid, and the supply of the rinsing liquid may be stopped during the first process.

In the cleaning device for a cleaning member according to the present invention,
The inner cleaning liquid supply unit supplies a rinse liquid,
The control unit may perform control such that a first time period during which the first processing is performed is longer than a second time period during which the second processing is performed.

In the cleaning device for a cleaning member according to the present invention,
The control unit may control the outer cleaning liquid supply unit to perform a flushing process before cleaning the substrate to be subjected to the cleaning process.

The cleaning member assembly according to the present invention comprises:
The cleaning member may be one that has been cleaned by the cleaning device for the cleaning member described above.

The substrate cleaning apparatus according to the present invention comprises:
A substrate cleaning apparatus for cleaning a substrate, comprising:
A substrate support for holding a substrate;
a substrate cleaning liquid supply unit for supplying a cleaning liquid to the substrate;
a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
The present invention may also include:

The cleaning member assembly according to the present invention comprises:
The substrate may include a cleaning member that has been cleaned by the substrate cleaning apparatus described above.

Effect of the Invention

The present invention provides a cleaning device for cleaning members that can efficiently clean cleaning members.

FIG. 1 is a schematic plan view showing an overall configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing a substrate cleaning apparatus that can be used in an embodiment of the present invention. FIG. 3 is a diagram showing a cleaning device for a cleaning member used as an example of an embodiment of the present invention. FIG. 4 is a diagram showing a cleaning device for a cleaning member used as another example of an embodiment of the present invention. FIG. 5 is a diagram for explaining a cleaning method for the roll cleaning member used in the embodiment of the present invention. FIG. 6 is a diagram for explaining how foreign matter is removed from within the cleaning member according to an embodiment of the present invention. FIG. 7 is a diagram for explaining an example of a method for manufacturing an integrally molded cleaning member that can be used in an embodiment of the present invention. FIG. 8 is a block diagram of a cleaning device for a cleaning member that can be used in an embodiment of the present invention. FIG. 9 is a photograph (defect map) showing particles of 19 nm or more remaining on a substrate when the cleaning device for the cleaning member according to Example 1 of an embodiment of the present invention is used, and particles of 19 nm or more remaining on a substrate when the cleaning device for the cleaning member according to Comparative Example 1 is used. FIG. 10 is a graph showing the ratio of the number of particles having a size of 19 nm or more remaining on a substrate when the cleaning device for the cleaning member according to Example 1 of an embodiment of the present invention is used to the number of particles having a size of 19 nm or more remaining on a substrate when the cleaning device for the cleaning member according to Comparative Example 1 is used. FIG. 11( a ) shows a state in which the dummy substrate and the roll-type cleaning member rotate in opposite directions at the point where the dummy substrate and the roll-type cleaning member come into contact with each other, and FIG. 11 ( b ) shows a state in which the dummy substrate and the roll-type cleaning member rotate in the same direction at the point where the dummy substrate and the roll-type cleaning member come into contact with each other. FIG. 12 is a diagram for explaining a cleaning method for the pencil cleaning member used in the embodiment of the present invention. FIG. 13 is a schematic diagram showing the configuration of a roll cleaning device used in an embodiment of the present invention. FIG. 14 is a diagram for explaining a cleaning method for the roll cleaning member used in the second embodiment of the present invention. FIG. 15 is a diagram for explaining a cleaning method for the roll cleaning member used in the third embodiment of the present invention. FIG. 16 is a graph showing the ratio of the number of particles having a size of 19 nm or more remaining on a substrate according to Examples 1 to 3 of the present invention.

Embodiment <Configuration>
An embodiment of a substrate processing apparatus including a substrate cleaning apparatus will be described. Note that, although the following embodiment shows an example of application to a cleaning process of a semiconductor wafer (object to be processed), particularly a process using a chemical solution, the present invention is not limited to application to a wafer cleaning process.

As shown in FIG. 1, the substrate processing apparatus of this embodiment has a substantially rectangular housing 310 and a load port 312 on which a substrate cassette that stocks a large number of substrates W is placed. The load port 312 is disposed adjacent to the housing 310. An open cassette, a SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the load port 312. The SMIF pod and FOUP are sealed containers that store substrate cassettes inside and are covered with a partition wall to maintain an environment independent of the external space. Examples of substrates W include semiconductor wafers.

The housing 310 contains a plurality of polishing units 314a-314d (four in the embodiment shown in FIG. 1), a first cleaning unit 316 and a second cleaning unit 318 for cleaning the polished substrate W, and a drying unit 320 for drying the cleaned substrate W. The polishing units 314a-314d are arranged along the longitudinal direction of the substrate processing apparatus, and the cleaning units 316, 318 and the drying unit 320 are also arranged along the longitudinal direction of the substrate processing apparatus. According to the substrate processing apparatus of this embodiment, various substrates W can be polished in the manufacturing process of semiconductor wafers with diameters of 300 mm or 450 mm, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory). Note that, as another embodiment of the substrate processing apparatus, the housing 310 may not be provided with a polishing unit for polishing the substrate W, and the substrate W may be cleaned and dried.

A first transport robot 322 is disposed in an area surrounded by the load port 312, the polishing unit 314a located on the load port 312 side, and the drying unit 320. A transport unit 324 is disposed in parallel to the polishing units 314a-314d, the cleaning units 316, 318, and the drying unit 320. The first transport robot 322 receives the unpolished substrate W from the load port 312 and passes it to the transport unit 324, and receives the dried substrate W removed from the drying unit 320 from the transport unit 324.

Between the first cleaning unit 316 and the second cleaning unit 318, a second transport robot 326 is disposed to transfer the substrate W between the first cleaning unit 316 and the second cleaning unit 318, and between the second cleaning unit 318 and the drying unit 320, a third transport robot 328 is disposed to transfer the substrate W between the second cleaning unit 318 and the drying unit 320. Furthermore, inside the housing 310, a control unit 350 is disposed to control the movement of each device of the substrate processing apparatus. In this embodiment, a mode in which the control unit 350 is disposed inside the housing 310 is described, but this is not limited thereto, and the control unit 350 may be disposed outside the housing 310, or the control unit 350 may be provided in a remote location.

The first cleaning unit 316 may be a roll cleaning device that contacts the substrate W with a roll cleaning member 90 that extends linearly over almost the entire diameter of the substrate W in the presence of a cleaning liquid, and scrubs the surface of the substrate W while rotating the roll cleaning member around a central axis parallel to the substrate W. The second cleaning unit 318 may be a pencil cleaning device that contacts the substrate W with a contact surface of a cylindrical pencil cleaning member that extends vertically in the presence of a cleaning liquid, and moves the pencil cleaning member in one direction while rotating on its axis, to scrub the surface of the substrate W. The drying unit 320 may be a spin drying unit that sprays IPA vapor from a moving spray nozzle toward the substrate W that is rotating while being held horizontally to dry the substrate W, and further rotates the substrate W at high speed to dry the substrate W by centrifugal force.

In addition, instead of a roll cleaning device, the first cleaning unit 316 may be a pencil cleaning device similar to the second cleaning unit 318, or a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet. Also, instead of a pencil cleaning device, the second cleaning unit 318 may be a roll cleaning device similar to the first cleaning unit 316, or a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet.

The cleaning liquid in this embodiment includes a rinse liquid such as deionized water (DIW) and a chemical liquid such as ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid water, and hydrofluoric acid. It may also be a mixed liquid or a diluted liquid that mainly contains these. Unless otherwise specified in this embodiment, the cleaning liquid means a rinse liquid, a chemical liquid, or both a rinse liquid and a chemical liquid. Note that the cleaning in this embodiment includes a mode in which a cleaning member such as a roll cleaning member 90 or a pen cleaning member 90a is rotated and brought into contact with the substrate while supplying the cleaning liquid to the substrate to scrub the substrate, and a mode in which the cleaning liquid is simply supplied without contacting the member with the substrate.

As shown in Fig. 3, the cleaning member assembly 1 may have a cleaning member attachment portion 10 and a cleaning member attached to the surface of the cleaning member attachment portion 10. In the following, a roll cleaning member 90 is used as a cleaning member as an example, but the present invention is not limited to this, and the embodiment may also be used as a cleaning member such as a pencil cleaning member, a brush, or a mandrel. As shown in Fig. 2, the roll cleaning member 90 may be made of a sponge having a plurality of nodules (projecting members) 95. The area of the top of the nodules 95 may be 5 ^cm2 or less. PVDF or PTFE may be used as the material of the cleaning member attachment portion 10.

As shown in FIG. 2, the substrate cleaning apparatus may have a substrate support part 200 for holding the substrate W. The substrate support part 200 may hold the substrate W by extending horizontally, by extending vertically, or by tilting from the horizontal. The substrate support part 200 may rotate while holding the substrate W by chuck or suction, or may support the substrate W while rotating like a spindle shown in FIG. 2. A chemical liquid supply part 210 for supplying a chemical liquid to the substrate W and a rinsing liquid supply part 220 for supplying a rinsing liquid to the substrate W may be provided. In this embodiment, the substrate cleaning liquid supply part for supplying a cleaning liquid to the substrate W is composed of the chemical liquid supply part 210 and the rinsing liquid supply part 220.

In this embodiment, the cleaning device for the cleaning member is a substrate cleaning device. In other words, in this embodiment, in a substrate cleaning device used to clean substrates W used in a series of processing steps in mass production of semiconductor substrate wafers, etc., a cleaning device for the cleaning member (self-cleaning device or break-in device) that cleans the cleaning member is also used as a substrate cleaning device that cleans the substrate. However, this is not limited to this embodiment, and a dedicated cleaning device for the cleaning member may be provided separately from the substrate cleaning device. When such a dedicated cleaning device for the cleaning member is used, it is not necessary to use the substrate cleaning device used for cleaning the substrate W as the cleaning device for the cleaning member. This is advantageous in that the operating time of the substrate cleaning device can be extended and the number of substrates processed can be increased (the operating rate of the device can be increased).

When cleaning a cleaning member such as the roll cleaning member 90, a dummy substrate Wd may be used as the substrate. In the present embodiment, the following description will be given of an embodiment in which a dummy substrate Wd is used as the substrate, but the present invention is not limited to this embodiment. The cleaning process of the cleaning member may be performed using a substrate W such as a wafer used in mass production. In addition, when a chemical solution is used as the cleaning solution for a dummy substrate Wd having a metal film, the metal film may be dissolved. Therefore, when a chemical solution is used as the cleaning solution, it is preferable to use a dummy substrate Wd having an insulating film such as an oxide film. This insulating film may be TEOS (tetraethoxysilane).

As shown in FIG. 3, the cleaning device for the cleaning member may have a holding unit 100 that holds a cleaning member assembly 1 having a roll cleaning member 90, a member rotation unit 80 that rotates the roll cleaning member 90, an inner cleaning liquid supply unit 110 that supplies cleaning liquid into the roll cleaning member 90, and an outer cleaning liquid supply unit 120 that supplies cleaning liquid from the outside of the roll cleaning member 90.

In one embodiment, the member rotating unit 80 is composed of, for example, a motor and a transmission unit such as a belt that transmits the driving force of the motor, and the member rotating unit 80 and the cleaning member assembly 1 are connected via the holding unit 100. The rotational driving force generated by the member rotating unit 80 is transmitted to the roll cleaning member 90 of the cleaning member assembly 1. The member rotating unit 80 can also have a stopper that can move the cleaning member assembly 1 up and down freely in the vertical direction (relative to the substrate W) and stop it at a predetermined position. In one embodiment, a cylinder mechanism can be provided for moving the roll cleaning member up and down. When rotating the roll cleaning member, the motor generates a driving force and transmits the driving force to a transmission unit such as a belt, so that the roll cleaning member 90 rotates around an axis center along the longitudinal direction. A sensor is provided to measure the position of the roll cleaning member so that motion control in each of the x, y and z axes of the roll cleaning member is possible, and the control unit receives the signal obtained by the sensor, generates a displacement signal for displacing the position of the roll cleaning member, and transmits the displacement signal to the member rotation unit or cylinder, thereby controlling the position of the roll cleaning member to an optimal position.

A more specific example is explained using Figure 13.

As shown in FIG. 13, a roll pressing drive unit 519 may be provided for pressing the roll cleaning member 90 against the substrate W or for moving the roll cleaning member 90 away from the substrate W. A transmission unit 517 made of a belt or the like for transmitting the rotational force generated by a drive unit 515 such as a motor may also be provided. The roll cleaning member 90 may be driven directly by the drive unit 515 or indirectly via a belt or the like.

The member rotation unit 80 may have a torque detection unit 516 that detects the torque applied to the drive unit 515, and a pressing force detection unit 518 that detects the pressing force of the roll cleaning member 90 against the substrate W by the pressing drive unit 519. A load cell, for example, may be used as the pressing force detection unit 518.

The control unit 350 may control the pressing force of the pressing drive unit 519 against the substrate W of the roll cleaning member 90 based on the detection result from the torque detection unit 516. For example, the control unit 350 controls the pressing force of the roll cleaning member 90 against the substrate W so that the torque applied to the drive unit 515 falls within a certain range (within a second range described below) or becomes a constant value.

The control unit 350 may control the pressing force of the roll cleaning member 90 against the substrate W by the pressing drive unit 519 based on the detection result from the pressing force detection unit 518.

The control unit 350 may control the pressing force of the roll cleaning member 90 against the substrate W by the pressing drive unit 519 based on the detection result from the pressing force detection unit 518 until a first time (e.g., 1 to 3 seconds) has elapsed since the roll cleaning member 90 came into contact with the substrate W, and may control the pressing force based on the detection result from the torque detection unit 516 after the first time has elapsed. Note that instead of this mode, control (threshold control) may be performed based on the detection result from the pressing force detection unit 518 only so that the pressing force of the roll cleaning member 90 against the substrate W does not become excessively large or excessively small.

Furthermore, when the first time arrives, the control unit 350 may determine whether the pressing force of the roll cleaning member 90 against the substrate W is within a first range based on the detection result from the pressing force detection unit 518, and if the pressing force is outside the first range, control the pressing drive unit 519 so that the pressing force is within the first range.

The torque detection unit 516 may detect the torque multiple times within a predetermined time, and the control unit 350 may control the pressing force based on the multiple torque values detected by the torque detection unit 516 (e.g., using the average value of the multiple torque values). The torque detection unit 516 may also detect the torque every predetermined time (e.g., every 0.1 to 0.3 seconds). As an example, the control unit 350 may control the pressing force based on 2 to 5 consecutive detection results. For example, three points may be taken every 0.1 seconds, and the pressing force applied to the substrate W from the roll cleaning member 90 may be controlled using the average value of these.

When the member rotating unit 80 rotates at a predetermined rotation speed, the torque applied repeatedly changes between large and small values because the member rotating unit 80 tries to achieve a constant rotation speed. In other words, when the torque becomes high at a certain point, the pressing force applied from the roll cleaning member 90 to the substrate W is controlled to be small, resulting in a small torque. When the torque becomes small in this way, the pressing force applied from the roll cleaning member 90 to the substrate W is controlled to be large, resulting in a large torque. The member rotating unit 80 is controlled by repeating this process, so that by taking the average value, it becomes possible to control using a highly accurate torque value. Note that the torque increases and decreases repeatedly during one rotation of the rotating shaft, so the period of this increase and decrease may be stored in advance as a set value. Then, the effect of the increase and decrease during one rotation of the rotating shaft may be calculated and the above torque monitoring may be performed. In addition, the smaller the torque fluctuation within one rotation of the roll cleaning member 90, the less variation in cleaning effect caused by differences in the rotational position of the roll cleaning member 90 (the circumferential location of the nodules 95 that come into contact with the object to be cleaned, such as the substrate W) can be suppressed.

The torque detection unit 516 may detect the torque multiple times within the time it takes for the roll cleaning member 90 to rotate n times (where "n" is an integer), and the pressing force applied from the roll cleaning member 90 to the substrate W may be controlled using the average value.

The control unit 350 may control the torque to be different values for at least two different types of cleaning liquid. In addition, the control unit 350 may control the pressing force applied to the substrate W from the roll cleaning member 90 to be different torque values when the types of substrate W are different.

The control unit 350 may control the pressing drive unit 519 so that the torque is within the second range based on the detection result from the torque detection unit 516. The control unit 350 may also intermittently detect whether the torque is within the second range at predetermined time intervals based on the detection result from the torque detection unit 516, and when the torque is outside the second range, control the pressing drive unit 519 so that the torque is within the second range. The control unit 350 may also continuously detect whether the torque is within the second range based on the detection result from the torque detection unit 516, and adjust the torque as appropriate so that the torque does not deviate from the second range.

When a spindle is used as the substrate support 200, the control unit 350 may prevent the rotation of the substrate W from being stopped in advance by controlling the pressing drive unit 519 so that the torque does not exceed a first threshold based on the detection result from the torque detection unit 516. The first threshold may be determined based on an empirical value when the substrate W does not rotate or stops rotating, or may be determined based on a theoretical value when the substrate W does not rotate. For example, the first threshold may be a value that is 10% to 30% or less of the torque value when the substrate W does not rotate or stops rotating empirically, or a value that is 10% to 30% or less of the torque value when the substrate W does not rotate theoretically.

When performing the first process, for example, by receiving feedback of the detection results from the torque detection unit 516 and/or the pressing force detection unit 518, the control unit 350 may control the pressing drive unit 519 to press the roll cleaning member 90 against the substrate W with a first pressure, while controlling the outer cleaning liquid supply unit 120 to supply cleaning liquid from the outer cleaning liquid supply unit 120 to the substrate W.

When performing the second process, for example, the control unit 350 may control the pressing drive unit 519 to move the roll cleaning member 90 away from the substrate W by receiving feedback of the detection results from the torque detection unit 516 and/or the pressing force detection unit 518, or may control the pressing drive unit 519 to press the roll cleaning member 90 against the substrate W with a second pressure. In addition, at this time, the control unit 350 may control the inner cleaning liquid supply unit 110 to supply cleaning liquid into the roll cleaning member 90.

When a signal is sent from the torque detection unit 516 and/or the pressing force detection unit 518 to the control unit 350, the detection results from the torque detection unit 516 and/or the pressing force detection unit 518 are received by the control unit 350. In addition, when the control unit 350 sends a signal to the pressing drive unit 519, the pressing drive unit 519 receives the signal, and the pressing drive unit 519 moves the roll cleaning member 90 along the normal direction of the substrate W.

Next, an example of a method for cleaning the roll cleaning member 90 will be described.

First, the dummy substrate Wd is supported by a substrate support part 200 such as a spindle.

Next, the substrate W is rotated and cleaning liquid is supplied to the substrate W from the outer cleaning liquid supply unit 120.

Next, the control unit 350 controls the pressing drive unit 519 to press the roll cleaning member 90 against the substrate W with a first pressure (first process). During this process, cleaning liquid continues to be supplied to the substrate W from the outer cleaning liquid supply unit 120.

Next, the control unit 350 controls the pressing drive unit 519 to move the roll cleaning member 90 away from the substrate W, or controls the pressing drive unit 519 to press the roll cleaning member 90 against the substrate W with a second pressure. During or after this control, the control unit 350 controls the inner cleaning liquid supply unit 110 to supply cleaning liquid into the roll cleaning member 90 (second process). During this time, cleaning liquid continues to be supplied to the substrate W from the outer cleaning liquid supply unit 120.

Next, the transport unit 300 is controlled by receiving a signal from the control unit 350, the dummy substrate Wd used by the transport unit 300 is removed, and another dummy substrate Wd is loaded.

The above steps are then repeated. Note that the dummy substrate Wd may not be replaced by performing the first process and the second process only once, but may be replaced after performing the first process and the second process multiple times in a set.

The control unit 350 may control the roll cleaning member 90 to contact the dummy substrate Wd. The control unit 350 may control the holding unit 100 to bring the roll cleaning member 90 into contact with the dummy substrate Wd, and may control the roll cleaning member 90 to approach the dummy substrate Wd or to move away from the dummy substrate Wd. This is not limited to the above, and the control unit 350 may control the substrate support unit 200 to bring the dummy substrate Wd closer to the roll cleaning member 90 or to move away from the roll cleaning member 90. The rotation speed of the roll cleaning member 90 is, for example, 50 rpm (revolutions per minute) to 400 rpm. The rotation speed of the dummy substrate Wd is, for example, 50 rpm to 400 rpm. When a substrate cleaning device is used as a cleaning device for the cleaning member, the chemical liquid supply unit 210 or the rinse liquid supply unit 220 shown in FIG. 2 may be used as the outer cleaning liquid supply unit 120.

The control unit 350 may perform control to perform a first process of supplying cleaning liquid from the outer cleaning liquid supply unit 120 to the dummy substrate Wd while pressing the roll cleaning member 90 against the dummy substrate Wd with a first pressure, and a second process of separating the roll cleaning member 90 from the dummy substrate Wd or supplying cleaning liquid from the inner cleaning liquid supply unit 110 while pressing the roll cleaning member 90 against the dummy substrate Wd with a second pressure that is equal to or less than the first pressure.

In the second process, the roll cleaning member 90 may be rotated at 200 to 600 revolutions per minute (rpm) while being separated from the dummy substrate Wd, while supplying an inner cleaning liquid such as a rinse liquid. In particular, the rotation may be at about 400 revolutions per minute.

The temperature of the cleaning liquid is, for example, less than 60 degrees. If the temperature is higher than 60 degrees, the cleaning members such as the roll cleaning member 90 may be altered. It is advantageous to have a higher temperature of the cleaning liquid (less than 60 degrees) in terms of being more effective at removing foreign matter. In this application, the dust present on the substrate W is referred to as particles, and the particles and residue contained in cleaning members such as the roll cleaning member 90 are referred to as foreign matter.

When moving the roll cleaning member 90 away from the dummy substrate Wd (when moving it to the retracted position), the roll cleaning member 90 may be moved along the normal direction of the dummy substrate Wd, or the roll cleaning member 90 may be moved slightly along the normal direction of the dummy substrate Wd and then moved along the in-plane direction of the dummy substrate Wd.

The second rotation speed of the roll cleaning member 90 in the second process may be faster than the first rotation speed of the roll cleaning member 90 in the first process. The second rotation speed of the roll cleaning member 90 may be 1.5 to 6 times faster than the first rotation speed, and it is particularly preferable that the second rotation speed is 1.5 to 3 times faster.

For example, the cleaning device for the cleaning member of this embodiment may be used when breaking in a new roll cleaning member 90. Since a new roll cleaning member 90 is likely to have dirt attached thereto, it is beneficial to use a cleaning device for the cleaning member as in this embodiment. Also, even if the roll cleaning member 90 has been used to a certain extent, dirt may adhere to the roll cleaning member 90. For this reason, the cleaning device for the cleaning member of this embodiment can also be used when cleaning a roll cleaning member 90 that has been used to a certain extent.

The control unit 350 may control the first and second processes and the replacement process of the dummy substrate Wd to be performed as a set of multiple times. The control unit 350 may repeat the first and second processes and the replacement process of the dummy substrate Wd, for example, 3 to 150 times. As an example, the set in the table below (the first and second processes and the replacement process of the dummy substrate Wd) may be repeated. That is, in the first process, the outer cleaning liquid may be supplied while pressing the roll cleaning member 90 against the dummy substrate Wd, and in the second process, the inner cleaning liquid and the outer cleaning liquid may be supplied while separating the roll cleaning member 90 from the dummy substrate Wd (see FIG. 5). Thereafter, the supply of the inner cleaning liquid and the outer cleaning liquid may be stopped, the dummy substrate Wd may be replaced, and the first process may be started again.

However, this is not limited to the above embodiment, and the dummy substrate Wd may be replaced after the first and second processes in Table 1 above are repeated a predetermined number of times (e.g., 3 to 50 times). Furthermore, when replacing the dummy substrate Wd, the supply of the outer cleaning liquid may be continued without stopping. According to this embodiment, the dummy substrate Wd to be replaced can be more reliably wetted from the beginning.

The control unit 350 may control the first pressure in the latter set to be smaller than the first pressure in the former set. For example, the first pressure in the first set may be larger than the first pressure in the last set. In addition, when the first and second processes and the replacement process of the dummy substrate Wd are repeated n times, the average value of the first pressure in a number of times exceeding half n may be smaller than the average value of the first pressure in a number of times equal to or less than half n. More specifically, when n is an even number, the average value of the first pressure in a number of times equal to or less than n/2 may be larger than the average value of the first pressure in a number of times equal to or less than (n/2+1), and when n is an odd number, the average value of the first pressure in a number of times equal to or less than (n-1)/2 may be larger than the average value of the first pressure in a number of times equal to or more than (n+1)/2.

The recipe (processing contents) may be the same or different for the cleaning process (break-in process) of a new roll cleaning member 90 and the cleaning process (hereinafter also referred to as "maintenance process") after the roll cleaning member 90 has been used to a certain extent. Generally, the roll cleaning member 90 is manufactured with a sponge-like structure and is further processed to provide an internal space for inner rinsing, so that pieces of the roll material during manufacturing remain in the internal space. For this reason, the new roll cleaning member 90 is generally dirtier than the roll cleaning member 90 that has already been used to clean the substrate W, and the recipe for the maintenance process may be shorter than that for the break-in process. When the first and second processes and the process of replacing the dummy substrate Wd are performed in multiple sets, the maintenance process may be performed with 1/2 to 1/3 of the number of sets for the break-in process.

A detection device 250 may be provided for detecting contamination of the substrate W (see FIG. 8). When the detection result of the detection device 250 indicates that the contamination of the substrate W is greater than a predetermined level (for example, when the number of particles is greater than a predetermined number), the control unit 350 may control the cleaning member, such as the roll cleaning member 90, to perform a cleaning process. The cleaning member may also be cleaned when a predetermined number of substrates W have been cleaned. For example, the control unit 350 may control the cleaning member to perform a cleaning process using a dummy substrate Wd every time 20 substrates W have been cleaned.

After using the dummy substrate Wd to clean the cleaning member, a substrate such as a monitor wafer may be cleaned using the cleaning member, and contamination of the substrate may be checked by the detection device 250. A cleaning member such as a wet roll cleaning member 90 may also be squeezed, and particles and the like in the resulting liquid may be detected by the detection device 250. As the detection device 250, an ICP-MS (ICP mass spectrometry), LC (liquid chromatograph), a wafer foreign matter inspection device SP5 (manufactured by KLA Tencor), or the like may be used.

The inner cleaning liquid supply unit 110 and the outer cleaning liquid supply unit 120 may supply the same cleaning liquid, but this is not limited to the above embodiment, and the inner cleaning liquid supply unit 110 and the outer cleaning liquid supply unit 120 may supply different cleaning liquids. For example, the inner cleaning liquid supply unit 110 may supply a rinse liquid, and the outer cleaning liquid supply unit 120 may supply a chemical liquid. Also, different from this embodiment, the inner cleaning liquid supply unit 110 may supply a chemical liquid, and the outer cleaning liquid supply unit 120 may supply a rinse liquid. Also, the inner cleaning liquid supply unit 110 may supply a first chemical liquid, and the outer cleaning liquid supply unit 120 may supply a second chemical liquid different from the first chemical liquid.

The control unit 350 may control the inner cleaning liquid supply unit 110 to supply cleaning liquid while the roll cleaning member 90 is pressed against the dummy substrate Wd with the second pressure. The second pressure may be smaller than the first pressure, or may be 1/2 or less, or may be 1/3 or less. The pressing force against the dummy substrate Wd is, for example, 1N to 20N, for example, about 6N. When 6N is used as the first pressure in this manner, the second pressure may be about 3N. However, this is not limited to this embodiment, and the second pressure may be the same value as the first pressure, or the second pressure may be greater than the first pressure.

The control unit 350 may control the transport unit 300 to replace the dummy substrate Wd (see FIG. 8). The transport unit 300 may include a load port 312, a first transport robot 322, a transport unit 324, and a second transport robot 326 (see FIG. 1). When a cleaning device with a dedicated cleaning member is used separately from the substrate cleaning device, a dedicated transport unit 300 may be provided.

The control unit 350 may control the rotation directions of the dummy substrate Wd and the roll cleaning member 90 to be opposite when the first pressure is equal to or greater than the threshold value, and to be the same when the first pressure is less than the threshold value. The threshold value may be set in advance, or may be set by a user inputting the threshold value from an input unit 400 (see FIG. 8) such as a keyboard and mouse of a personal computer. In this embodiment, "opposite rotation directions of the dummy substrate Wd and the roll cleaning member 90" means that the dummy substrate Wd and the roll cleaning member 90 rotate in opposite directions at the point where the dummy substrate Wd and the roll cleaning member 90 contact each other (see FIG. 11(a)). In addition, "the same rotation direction of the dummy substrate Wd and the roll cleaning member 90" means that the dummy substrate Wd and the roll cleaning member 90 rotate in the same direction at the point where the dummy substrate Wd and the roll cleaning member 90 contact each other (see FIG. 11(b)). When changing the rotation direction, the rotation direction of the dummy substrate Wd may be changed, or the rotation direction of the roll cleaning member 90 may be changed.

The cleaning liquid supplied from the inner cleaning liquid supply unit 110 and the outer cleaning liquid supply unit 120 may be an alkaline liquid such as NH ₄ OH.

The outer cleaning liquid supply unit 120 may continue to supply cleaning liquid during the first process and the second process. The inner cleaning liquid supply unit 110 may supply rinsing liquid and stop supplying rinsing liquid during the first process. Such control of the cleaning liquid and rinsing liquid may be performed by the control unit 350.

The inner cleaning liquid supply unit 110 supplies the cleaning liquid at, for example, 50 ml/min to 2500 ml/min, typically 400 ml/min to 900 ml/min. The outer cleaning liquid supply unit 120 may supply the cleaning liquid in a spray form or in a linear form. If the amount of cleaning liquid supplied from the inner cleaning liquid supply unit 110 is less than 50 ml/min, the inner cleaning liquid may not be discharged with a uniform discharge pressure from the holes provided throughout the entire cleaning member, and it is not possible to physically remove dirt by the discharge pressure. In addition, in order to reliably supply the inner cleaning liquid into the cleaning member while reducing concerns about backflow, for example, it is desirable to set the amount to less than 1500 ml/min.

The chemical liquid supplied from the inner cleaning liquid supply unit 110 may be supplied while changing its concentration. In addition, when chemical liquids are supplied from the inner cleaning liquid supply unit 110 and the outer cleaning liquid supply unit 120, the chemical liquids supplied from the inner cleaning liquid supply unit 110 and the outer cleaning liquid supply unit 120 may be different types of chemical liquids, or may be the same chemical liquid but with different concentrations.

The control unit 350 may perform control so that the first time for performing the first processing is longer than the second time for performing the second processing.

The control unit 350 may control related devices including the outer cleaning liquid supply unit 120 to perform a flushing process before cleaning substrates W such as mass-produced wafers. Flushing is a process of cleaning the inside of a substrate cleaning device that does not have a substrate W or a cleaning device with dedicated cleaning members by spraying a rinse liquid inside the device.

One end of the cleaning member assembly 1 may be passively held by the cleaning member holder 100, and the other end may be driven by a member rotation unit 80 having a motor (see FIG. 3). In other words, the cleaning member holder 100 may have a second cleaning member holder 100b that is driven by the member rotation unit 80, and a first cleaning member holder 100a that is passively driven.

The roll cleaning member 90 may have a cantilever structure or a double-supported structure. In the case of a cantilever structure, there was a structural concern about rotating the cleaning member away from the dummy substrate Wd, but the inventors confirmed that there is no particular problem if the rotation speed is 400 rpm or less. In the case of a cantilever structure, a member rotation unit 80 may be provided on the end side where the roll cleaning member 90 is held, and the inner cleaning liquid may be supplied from that end (see FIG. 4). In the case of a double-supported structure, the rotation speed may be 400 rpm or more if necessary. Furthermore, even if it has a cantilever structure, it can be used at a rotation speed of 400 rpm or more depending on the design specifications.

When supplying the inner cleaning liquid and the outer cleaning liquid, filters 112, 122 with a mesh size of about 1 nm or more may be used (see FIG. 3), depending on the substrate to be treated. However, in the future, filters with finer mesh may be used in response to requirements for further miniaturization of substrates. By using such filters 112, 122, foreign matter contained in the cleaning liquid can be removed. The outer cleaning liquid supply unit 120 may have an outer cleaning liquid storage unit 124 and an outer cleaning liquid supply member 121 consisting of a nozzle or the like connected to the outer cleaning liquid storage unit 124. In this case, a filter 122 may be provided between the outer cleaning liquid storage unit 124 and the outer cleaning liquid supply member 121. Also, a filter 112 may be provided between the inner cleaning liquid supply unit 110 and the cleaning member holding unit 100.

As shown in FIG. 3, the cleaning member mounting part 10 may have a main body 20, a cleaning liquid introduction part (void) 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 connected to the cleaning liquid introduction part 30. The cleaning member mounting part 10 may be configured in a cylindrical shape having a hollow area. This hollow area serves as the cleaning liquid introduction part 30, and the cleaning liquid supply holes 40 may be connected to the cleaning liquid introduction part 30, so that the cleaning liquid supplied to the cleaning liquid introduction part 30 may permeate the roll cleaning member 90 and be used to clean the substrate W. FIG. 3 shows a cross section of the roll cleaning member 90 etc. cut at a location where no nodules 95 are provided.

The cleaning liquid may be introduced into the cleaning liquid introduction section 30 via a supply pipe 115 provided inside the first cleaning member holding section 100a.

The dummy substrate Wd may be arranged at an angle to the horizontal direction, or may be arranged to extend in the vertical direction. In addition, the cleaning process of the roll cleaning member 90 may be performed using both the front and back surfaces of the dummy substrate Wd. The process using both the front and back surfaces of the dummy substrate Wd may be performed simultaneously, or one side at a time.

The cleaning member assembly 1 may be constructed such that the cleaning member attachment portion 10 and the roll cleaning member 90 are integrally formed, or the roll cleaning member 90 may be molded on the cleaning member attachment portion 10. The cleaning member attachment portion 10 and the roll cleaning member 90 may be constructed as separate members and may be removable. The roll cleaning member 90 may be made of a resin material such as a PVA (polyvinyl alcohol) sponge material or a PVFM (polyvinyl formal) made by reacting PVA. This PVA sponge material can be prepared from a homopolymer of polyvinyl acetate, etc. As the material for the roll cleaning member 90, other moldable materials such as nylon, polyurethane, or a combination of polyurethane and PVA, or other copolymers that do not scratch the substrate surface and provide suitable material removal for the process can be used.

In one embodiment, a mold is formed by the cap member constituting the first end 11, the inner frame 951 having the hole 951a, and the outer frame 952 (see FIG. 7). The cleaning member mounting part 10 is inserted into the inner frame 951 forming the mold. Note that the inside of the cleaning member mounting part 10 can be filled with a filler (e.g., wax) and then a cap member that caps each opening of the cleaning liquid supply hole 40 can be attached. Next, a mixed liquid (or foaming solution) containing an aqueous solution of at least polyvinyl alcohol having a polymerization degree of 500 to 4000 and a saponification degree of 80% or more, an aldehyde-based crosslinking agent, a catalyst, and starch as a pore-forming agent, which is a PVA material constituting the roll cleaning member 90, is poured between the inner frame 951 and the cleaning member mounting part 10 using a nozzle (not shown). Then, the cap member constituting the second end 12 is attached to the cleaning member mounting part 10, the inner frame 951, and the outer frame 952, and heated to 40 to 80 degrees to react the liquid. In this way, the cleaning member attachment part 10 is formed as an elongated part with internal voids, and the porous cleaning layer (PVA porous layer) covering the outer surface of the cleaning member attachment part 10 is formed integrally with the cleaning member attachment part 10, and multiple nodules made of the same porous PVA as the cleaning layer are formed to protrude outward.

Each of the inner frame 951 and the outer frame 952 can be opened and closed. Next, the inner frame 951 and the outer frame 952 are opened to remove the cleaning member attachment part 10 from the mold. Then, the filler (e.g., wax) filled inside the cleaning member attachment part 10 is removed by a specified method, and the cap members that cap the openings of each of the cleaning liquid supply holes 40 are removed.

Next, the inside of the cleaning member attachment part 10, the openings of the cleaning liquid supply holes 40, and the roll cleaning member 90 are each washed with water. Through this series of steps, the roll cleaning member 90 made of PVA material can be integrally manufactured (molded) onto the cleaning member attachment part 10 while minimizing the occurrence of problems with back-contamination during use.

When the roll-type cleaning member 90 made of PVA material is manufactured by integral molding on the cleaning member mounting part 10, the roll-type cleaning member 90 made of PVA material can be molded so that depressions are formed at locations corresponding to the openings of the cleaning liquid supply holes 40 of the roll-type cleaning member 90. By forming such a cleaning member assembly 1, it is possible to more effectively prevent the cleaning liquid discharged from the cleaning member mounting part 10 to the cleaning part 90 from flowing back inside.

The cleaning member assembly 1 can be attached to the cleaning member attachment portion 10 and the roll cleaning member 90 with adhesive.

In one embodiment, the cleaning member assembly 1 is formed so that the inner diameter of the roll cleaning member 90 is smaller than the outer diameter of the cleaning member mounting part 10, and the roll cleaning member 90 is pushed into the cleaning member mounting part 10, whereby the cleaning member mounting part 10 and the roll cleaning member 90 are fixedly supported by the elastic force of the roll cleaning member 90. Furthermore, in one embodiment, a surfactant can be applied to the surface of the cleaning member mounting part 10, and after the roll cleaning member 90 is inserted into the cleaning member mounting part 10, the cleaning member mounting part 10 and the roll cleaning member 90 can be rinsed with water to remove the surfactant.

In one embodiment, the average pore diameter of the roll cleaning member 90 can be set to 50 μm to 250 μm (the average pore diameter here refers to the average value of the major axis of a predetermined number of pores randomly extracted from a plurality of pores in a target area). In one embodiment, the apparent density of the roll cleaning member 90 can be set to 0.05 g/cm ³ or more, and the water retention rate can be set to 500% to 1200%. In one embodiment, the 30% compressive stress in the appropriate water content state of the roll cleaning member 90 can be set to 3 kPa or more and 200 kPa or less. The appropriate water content state is a weight percentage of the water content state relative to the dry state, and refers to a water content state in which the roll cleaning member 90 has an appropriate elastic force during cleaning processing of the substrate W, etc. The 30% compressive stress refers to the load per unit area obtained by dividing the measured value by the area of the end faces when the roll cleaning member 90 is brought into an appropriate hydrated state, a load is applied to both end faces to crush the roll cleaning member 90 by 30% in the longitudinal direction, and the measured value is measured with a digital load measuring device.

As described above, the pen cleaning member 90a may be used as the cleaning member. When the pen cleaning member 90a is used as the cleaning member in this manner, during the second process, the cleaning liquid in the pen cleaning member 90a may be sucked by a suction unit 260 (see FIG. 12) connected to the cleaning member assembly 1a (the cleaning member assembly having the pencil cleaning member 90a is indicated by the symbol "1a") in addition to or instead of rotating the pen cleaning member 90a.

One aspect of this embodiment is shown as an example.

Example 1
In the embodiment 1, the inner cleaning liquid supply unit 110 does not supply a rinse liquid while the roll cleaning member 90 made of a resin material is pressed against the dummy substrate Wd, and the inner cleaning liquid supply unit 110 supplies a rinse liquid while the roll cleaning member 90 is separated from the dummy substrate Wd (see FIG. 5). The rotation speed of the roll cleaning member 90 is 400 rpm (revolutions per minute). The outer cleaning liquid supply unit 120 continues to supply a chemical liquid. NH ₄ OH is used as the chemical liquid, and deionized water (DIW) is used as the rinse liquid. In the embodiment 1, the first process, the second process, and the replacement process of the dummy substrate Wd were repeatedly performed.

<Comparative Example 1>
In Comparative Example 1, the chemical liquid continues to be supplied from the outer cleaning liquid supply unit 120 while the roll cleaning member 90 is pressed against the dummy substrate Wd. At this time, the inner cleaning liquid supply unit 110 does not supply a rinsing liquid.

According to Example 1, after 60 minutes, the number of particles was reduced to about 42% of that of Comparative Example 1, and after 180 minutes, the number of particles was reduced to about 12% of that of Comparative Example 1 after 60 minutes (see Figures 10(a) and (b)). According to Comparative Example 1, the number of particles could be reduced to a certain number, but it was difficult to reduce it further. The defect map shown in Figure 9 is a photograph of this result. Note that the particles referred to in Example 1 (shown in Figure 10) are particles with a maximum diameter of 19 nm or more that can be observed by an inspection device. However, in the future, the accuracy of inspection devices may be improved to meet demands such as further miniaturization of substrates, and even finer particles may be observed.

Example 2
In Example 2, while the chemical liquid was being supplied from the outer cleaning liquid supply unit 120, the rinsing liquid was not supplied from the inner cleaning liquid supply unit 110, and after the supply of the chemical liquid from the outer cleaning liquid supply unit 120 was stopped, the rinsing liquid was supplied from the inner cleaning liquid supply unit 110 at 900 ml/min (see FIG. 14 ). During this time, the roll-type cleaning member 90 made of a resin material was pressed against the dummy substrate Wd with a force of 9 N, and the pressing force of the roll-type cleaning member 90 against the dummy substrate Wd was always kept at the same value of 9 N (i.e., the first pressure=the second pressure).

Example 3
In Example 3, the chemical liquid was continuously supplied from the outer cleaning liquid supply unit 120, and the rinsing liquid was supplied from the inner cleaning liquid supply unit 110 at a constant timing at 900 ml/min (see FIG. 15 ). During this time, as in Example 2, the roll-type cleaning member 90 made of a resin material was pressed against the dummy substrate Wd with a force of 9 N, and the pressing force of the roll-type cleaning member 90 against the dummy substrate Wd was always kept at the same value of 9 N (i.e., the first pressure=the second pressure).

The experiments in Examples 2 and 3 differ from the experiments in Example 1 and Comparative Example 1 in the method (recipe) for checking particles. Therefore, as in Example 1, while the roll cleaning member 90 made of a resin material is pressed against the dummy substrate Wd, no rinsing liquid is supplied from the inner cleaning liquid supply unit 110, and while the roll cleaning member 90 is separated from the dummy substrate Wd, rinsing liquid is supplied from the inner cleaning liquid supply unit 110 (see FIG. 5). The results of measurements made using the same recipe as in Examples 2 and 3 are shown in Example 4 (see FIG. 16).

In Examples 2 and 3 of this case, as in Example 1, particles with a maximum particle diameter of 19 nm or more that could be observed by the inspection device were treated as particles, and the number of particles was counted and compared with the result of Comparative Example 1 after 60 minutes (this result was set to 100%), resulting in the results shown in FIG. 16. In Examples 2 and 3, as in Example 1, the first and second processes and the replacement process of the dummy substrate Wd were repeated. When the dummy substrate Wd was replaced, the roll cleaning member 90 was separated from the dummy substrate Wd. As described above, the first and second processes and the replacement process of the dummy substrate Wd may be performed in multiple sets, for example, 2 to 10 sets. This is also the case in Example 1.

As shown in Figure 16, in Example 3, the difference was about 3% compared to the result of Comparative Example 1 after 60 minutes, and in Example 2, the difference was about 5% compared to the result of Comparative Example 1 after 60 minutes. Since Example 4, which corresponds to Example 1, was about 8% compared to the result of Comparative Example 1 after 60 minutes, Examples 2 and 3 were able to obtain beneficial effects even when compared to Example 4.

It is beneficial that the number of particles could be significantly reduced in a short time of 60 minutes in each of Examples 2 and 3. In particular, the embodiment of Example 2 showed better results than the embodiment of Example 3, and it was confirmed that using this embodiment is beneficial. In other words, the embodiment in which the supply of cleaning liquid from the outer cleaning liquid supply unit 120 to the dummy substrate Wd is stopped while the roll cleaning member 90 is pressed against the dummy substrate Wd during the second process is particularly beneficial, but it was also confirmed that the embodiment in which the supply of cleaning liquid from the outer cleaning liquid supply unit 120 to the dummy substrate Wd is performed while the roll cleaning member 90 is pressed against the dummy substrate Wd during the second process is beneficial. In addition, in Examples 2 to 4, the roll-type cleaning member 90 is pressed against the dummy substrate Wd with a force of 9 N, but it is more beneficial to press the roll-type cleaning member 90 against the dummy substrate Wd with a force of 5 N or more, more beneficial to press the roll-type cleaning member 90 against the dummy substrate Wd with a force of 9 N or more, and even more beneficial to press the roll-type cleaning member 90 against the dummy substrate Wd with a force of 15 N or more.

"effect"
Next, effects of the present embodiment having the above-mentioned configuration, which have not been described yet, will be described. Any configuration described in "Effects" can be adopted in the present invention even if it is not described in "Configuration". Note that in the "Effects", the term "cleaning member" will be used instead of the term "roll cleaning member", which is an example of a cleaning member.

When the control unit 350 controls the first process of supplying cleaning liquid from the outer cleaning liquid supply unit 120 to the dummy substrate Wd while pressing the cleaning member to be cleaned against the dummy substrate Wd with a first pressure, and the second process of supplying cleaning liquid from the inner cleaning liquid supply unit 110 while separating the cleaning member from the dummy substrate Wd or pressing the cleaning member against the dummy substrate Wd with a second pressure that is equal to or less than the first pressure, the cleaning time of the cleaning member can be significantly shortened (see FIG. 10 (a) (b)). By pressing the cleaning member against the dummy substrate Wd while supplying cleaning liquid from the outer cleaning liquid supply unit 120, dirt on the outer surface of the cleaning member can be removed. In addition, by separating the cleaning member from the dummy substrate Wd or supplying cleaning liquid from the inner cleaning liquid supply unit 110 while pressing the cleaning member against the dummy substrate Wd with a second pressure that is equal to or less than the first pressure, foreign matter in the cleaning member can be efficiently pushed out to the outside (see FIG. 6).

In recent years, there has been a demand for removing small-sized foreign matter, and this embodiment is advantageous in that it can efficiently remove small-sized foreign matter. In addition, it is possible to maintain a high level of cleanliness in the cleaning components, which leads to a longer life for the cleaning components and more stable production.

The inventors of the present application have confirmed that the cleaning effect of the cleaning member can be improved by making the second rotation speed of the cleaning member in the second process faster than the first rotation speed of the cleaning member in the first process.

When different cleaning liquids are supplied from the inner cleaning liquid supply unit 110 and the outer cleaning liquid supply unit 120, cleaning can be performed more effectively depending on the material of the cleaning member.

When the inner cleaning liquid supply unit 110 supplies the rinsing liquid and the outer cleaning liquid supply unit 120 supplies the chemical liquid, if a configuration is adopted in which the first time for performing the first process is longer than the second time for performing the second process, the cleaning member can be enriched with the chemical liquid, which is beneficial in terms of improving the cleaning effect.

When a cleaning liquid is supplied from the inner cleaning liquid supply unit 110 while the cleaning member is pressed against the dummy substrate Wd with the second pressure, it is possible to prevent dirt adhering to the dummy substrate Wd from returning to the cleaning member. This makes it possible to clean the cleaning member more effectively.

When the control unit 350 controls the transport unit 300 to replace the dummy substrate Wd, the replacement of the dummy substrate Wd during the cleaning process of the cleaning member can also be performed automatically.

When the control unit 350 controls the first process, the second process, and the replacement process of the dummy substrate Wd to be performed multiple times as a set, an effective cleaning process of the cleaning member can be performed automatically.

When the control unit 350 controls the first pressure in the latter set to be smaller than the first pressure in the former set, it is possible to prevent reverse contamination from occurring. After the cleaning process is completed, the cleaning process of the substrate W such as a wafer is performed, but it cannot be denied that there is a possibility that contamination of the dummy substrate Wd may adhere to the cleaning member during the cleaning process. Since such contamination may occur when the cleaning member is strongly pressed against the dummy substrate Wd, making the first pressure in the latter set smaller than the first pressure in the former set is beneficial in that it can reduce the risk of reverse contamination.

By adopting an embodiment in which the rotation directions of the dummy substrate Wd and the cleaning member are reversed when the first pressure is equal to or greater than the threshold value, the cleaning process of the cleaning member can be performed with more cleaning liquid stored at the contact point between the dummy substrate Wd and the cleaning member. Generally, cleaning can be performed more effectively when the cleaning member is pressed more strongly against the dummy substrate Wd, but according to this embodiment, in such a case, more cleaning liquid can be stored at the contact point between the dummy substrate Wd and the cleaning member.

When the first pressure is smaller than the threshold value, the rotation directions of the dummy substrate Wd and the cleaning member are controlled to be the same, so that the cleaning member is prevented from being soaked in a large amount of cleaning liquid when cleaning is relatively less effective. In this way, by preventing the cleaning member from being soaked in a large amount of cleaning liquid, reverse contamination of the cleaning member from the dummy substrate Wd can be prevented.

As an example, in the first set where the first pressure is large, the control unit 350 may control the rotation directions of the dummy substrate Wd and the cleaning member to be opposite (see FIG. 11(b)), and in the second set where the first pressure is small, the control unit 350 may control the rotation directions of the dummy substrate Wd and the cleaning member to be the same (see FIG. 11(a)).

By using a chemical solution as the cleaning solution, a negative potential can be generated, and as a result, a high zeta potential can be generated. Therefore, a repulsive force can be generated between the cleaning member and the foreign matter, or between the foreign matters themselves, making it easier to remove the foreign matter. From this point of view, it is beneficial to use an alkaline chemical solution. This is because an alkaline chemical solution such as NH ₄ OH has a larger negative potential than an acidic chemical solution. Even if the cleaning solution used in the cleaning process of the substrate W is an acidic chemical solution, an alkaline chemical solution may be used in the cleaning process of the cleaning member. On the other hand, the same chemical solution as that used in the cleaning process of the substrate W may be used to perform the cleaning process of the cleaning member. In this case, it is beneficial in that there is no need to change the configuration of the device.

When the outer cleaning liquid supply unit 120 continues to supply cleaning liquid between the first process and the second process, the dummy substrate Wd can be kept constantly wet. If the dummy substrate Wd becomes dry, the possibility of foreign matter adhering to the cleaning member increases, so it is beneficial to keep the dummy substrate Wd constantly wet by the outer cleaning liquid supply unit 120. From this perspective, it is beneficial to start the cleaning process of the cleaning member, including the break-in process, after wetting the dummy substrate Wd with cleaning liquid.

When a new cleaning member is subjected to the cleaning process (break-in process), the cleaning member may be wetted with cleaning liquid in advance. It is advantageous to adopt such an embodiment, since performing the cleaning process when the cleaning member is dry may cause reverse contamination of the cleaning member. The control unit 350 may control the cleaning member to be immersed in the cleaning liquid to wet the cleaning member, or the control unit 350 may control the cleaning member to start cleaning after a certain amount of cleaning liquid has been supplied from the inner cleaning liquid supply unit 110. According to the inventors, it has been confirmed that the cleaning effect is higher when a chemical liquid, rather than a rinse liquid, is used as the cleaning liquid to wet the cleaning member.

When a rinse liquid is supplied from the inner cleaning liquid supply unit 110 and a chemical liquid is supplied from the outer cleaning liquid supply unit 120, the supply of rinse liquid from the inner cleaning liquid supply unit 110 may be stopped while the cleaning member is in contact with the dummy substrate Wd. If rinse liquid continues to be supplied from the inner cleaning liquid supply unit 110, the chemical liquid supplied from the outer cleaning liquid supply unit 120 will become diluted, reducing the cleaning effect. Note that when a chemical liquid is supplied from the inner cleaning liquid supply unit 110, the chemical liquid may be supplied from the inner cleaning liquid supply unit 110 even while the cleaning member is in contact with the dummy substrate Wd.

Rotating the cleaning member may cause the cleaning liquid to splash inside the device, which may adversely affect the cleaning of mass-produced substrates W. From this perspective, when using a substrate cleaning device as a cleaning device for the cleaning member, flushing the inside of the device before starting cleaning of mass-produced substrates W is beneficial as it can prevent adverse effects from splashed cleaning liquid. Also, from the perspective of preventing cleaning liquid from splashing inside the device, when using a substrate cleaning device as a cleaning device for the cleaning member, the downflow inside the device may be increased during the cleaning process of the cleaning member compared to when cleaning substrates W.

In one embodiment, the object to be cleaned by the cleaning member is not limited to a semiconductor wafer, but may be a silicon wafer, a glass substrate, a printed wiring board, a liquid crystal panel, or a solar panel. The shape of the plane of the object to be cleaned may be circular or rectangular, and the thickness of the plane may be a thickness that allows for in-plane deflection. The substrate to be treated includes rectangular substrates and circular substrates. The rectangular substrate includes polygonal glass substrates such as rectangular, liquid crystal substrates, printed circuit boards, and other polygonal objects to be plated. The circular substrate includes semiconductor wafers, glass substrates, and other circular objects to be plated.

Examples of cleaning fluids that can be used include high-temperature pure water, APM (Ammonium Hydrogen-peroxide Mixture, a mixture of ammonia and hydrogen peroxide), SPM (Sulfuric-Acid Hydrogen Peroxide Mixture, a mixture of sulfuric acid and hydrogen peroxide), carbonated water, ultrasonic water, and ozone water.

The above-mentioned description of each embodiment and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and the above-mentioned description of each embodiment or the disclosure of the drawings do not limit the invention described in the claims. Furthermore, the description of the claims at the time of filing is merely an example, and the description of the claims may be changed as appropriate based on the description in the specification, drawings, etc.

80: member rotating section 90: cleaning member 100: holding section 110: inner cleaning liquid supply section 120: outer cleaning liquid supply section 350: control section Wd: dummy substrate

Claims (20)

a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
Equipped with
The cleaning device for the cleaning member stops supplying the cleaning liquid from the outer cleaning liquid supply unit to the substrate during the second process . a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
Equipped with
A cleaning device for a cleaning member , wherein an inner cleaning liquid supplying section supplies a first chemical liquid, and an outer cleaning liquid supplying section supplies a second chemical liquid different from the first chemical liquid . a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
Equipped with
the control unit supplies a cleaning liquid from an inner cleaning liquid supply unit while the cleaning member is pressed against the substrate with a second pressure;
A cleaning device for a cleaning member , wherein the second pressure is equal to or less than half of the first pressure . a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
Equipped with
The control unit controls a transport unit to replace the substrate, and controls the first process, the second process, and the substrate replacement process to be performed multiple times as a set . a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
Equipped with
the cleaning member is a roll cleaning member that rotates about a rotation axis extending along the in-plane direction of the substrate,
the substrate has a rotation axis extending along a normal direction of the substrate,
the roll cleaning member contacts the substrate in one direction outwardly of a periphery of a rotation axis of the substrate,
The control unit controls the rotation directions of the substrate and the cleaning member to be opposite when the first pressure is equal to or greater than a threshold value, and controls the rotation directions of the substrate and the cleaning member to be the same when the first pressure is less than the threshold value . a holder for holding a cleaning member assembly having a cleaning member;
A member rotating unit that rotates the cleaning member;
an inner cleaning liquid supply unit that supplies a cleaning liquid into the cleaning member;
an outer cleaning liquid supply unit that supplies cleaning liquid from outside the cleaning member;
a control unit that controls to perform a first process of supplying a cleaning liquid from the outer cleaning liquid supply unit to the substrate while pressing the cleaning member against the substrate with a first pressure, and a second process of separating the cleaning member from the substrate or supplying a cleaning liquid from the inner cleaning liquid supply unit while pressing the cleaning member against the substrate with a second pressure that is equal to or lower than the first pressure;
Equipped with
the outer cleaning liquid supply unit continues to supply cleaning liquid during the first process and the second process;
The inner cleaning liquid supply unit supplies a rinsing liquid, and the supply of the rinsing liquid is stopped during the first process . 7. The cleaning device for a cleaning member according to claim 2, wherein the supply of the cleaning liquid from the outer cleaning liquid supply unit to the substrate is stopped during the second process. 7. The cleaning device for a cleaning member according to claim 2, wherein the cleaning liquid is supplied from the outer cleaning liquid supply unit to the substrate during the second treatment. The cleaning device for a cleaning member according to claim 1 , wherein a second rotation speed of the cleaning member in the second treatment is faster than a first rotation speed of the cleaning member in the first treatment. A cleaning device for a cleaning member as described in any one of claims 1 to 9, wherein the inner cleaning liquid supply unit supplies a rinsing liquid and the outer cleaning liquid supply unit supplies a chemical liquid, the inner cleaning liquid supply unit supplies a chemical liquid and the outer cleaning liquid supply unit supplies a rinsing liquid, or the inner cleaning liquid supply unit and the outer cleaning liquid supply unit supply chemical liquids. 7. The cleaning device for a cleaning member according to claim 1, wherein the inner cleaning liquid supplying section supplies a first chemical liquid, and the outer cleaning liquid supplying section supplies a second chemical liquid different from the first chemical liquid. the control unit supplies a cleaning liquid from an inner cleaning liquid supply unit while the cleaning member is pressed against the substrate with a second pressure;
7. The cleaning device for a cleaning member according to claim 1 , 2, or 4 to 6, wherein the second pressure is equal to or less than half of the first pressure. The cleaning device for a cleaning member according to any one of claims 1 to 3, 5 and 6, wherein the control unit controls the transport unit to replace the substrate, and controls the first process, the second process and the substrate replacement process to be performed as a set of multiple times. The cleaning device for a cleaning member according to claim 13 , wherein the first pressure in the latter set is lower than the first pressure in the former set. the cleaning member is a roll cleaning member that rotates about a rotation axis extending along the in-plane direction of the substrate,
the substrate has a rotation axis extending along a normal direction of the substrate,
the roll cleaning member contacts the substrate in one direction outwardly of a periphery of a rotation axis of the substrate,
7. The cleaning device for a cleaning member according to claim 1, wherein the control unit controls the rotation directions of the substrate and the cleaning member to be opposite to each other when the first pressure is equal to or greater than a threshold value, and controls the rotation directions of the substrate and the cleaning member to be the same when the first pressure is less than the threshold value. the outer cleaning liquid supply unit continues to supply cleaning liquid during the first process and the second process;
The cleaning device for a cleaning member according to claim 1 , wherein the inner cleaning liquid supply unit supplies a rinsing liquid, and the supply of the rinsing liquid is stopped during the first process. 17. The cleaning device for a cleaning member according to claim 1, wherein the control unit controls the outer cleaning liquid supply unit so as to perform a flushing process before cleaning a substrate to be subjected to a cleaning process. A cleaning member assembly comprising a cleaning member that has been cleaned by a cleaning device according to any one of claims 1 to 17 . In a substrate cleaning apparatus for cleaning a substrate,
A substrate support for holding a substrate;
a substrate cleaning liquid supply unit for supplying a cleaning liquid to the substrate;
A cleaning device for a cleaning member according to any one of claims 1 to 17,
A substrate cleaning apparatus comprising: A cleaning member assembly comprising a cleaning member cleaned by the substrate cleaning apparatus of claim 19 .