JP7513403B2 - Thermoelectric Module - Google Patents

Description

The present invention relates to a thermoelectric module, and more specifically to a fastening structure for a thermoelectric module.

Thermoelectric phenomenon occurs due to the movement of electrons and holes inside a material, and refers to the direct energy conversion between heat and electricity.

A thermoelectric element is a general term for elements that utilize the thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are joined between metal electrodes to form a PN junction pair.

Thermoelectric elements can be classified into elements that utilize the temperature change of electrical resistance, elements that utilize the Seebeck effect, which is a phenomenon in which an electromotive force is generated due to a temperature difference, and elements that utilize the Peltier effect, which is a phenomenon in which heat is absorbed or generated due to electric current.

Thermoelectric elements are used in a variety of applications, including home appliances, electronic components, and communication components. For example, thermoelectric elements can be used in cooling devices, heating devices, and power generation devices. As a result, the demands for thermoelectric performance of thermoelectric elements are becoming higher and higher.

The thermoelectric element includes a substrate, electrodes, and thermoelectric legs, with a plurality of thermoelectric legs arranged in an array between an upper substrate and a lower substrate, a plurality of upper electrodes arranged between the plurality of thermoelectric legs and the upper substrate, and a plurality of lower electrodes arranged between the plurality of thermoelectric legs and the lower substrate.

One of the upper and lower substrates of the thermoelectric element becomes the high temperature part, and the other becomes the low temperature part. At this time, a temperature difference occurs between the high temperature part and the low temperature part, which can cause thermal deformation of the high temperature part of the substrate, resulting in stress concentration at the bonding interface of the substrates. This can cause peeling and cracks at the bonding interface, reducing the quality of the product.

In particular, the edge of the substrate in the high temperature area is subject to greater thermal deformation than the center, and when the edge of the substrate in the high temperature area is joined to the edge of the substrate in the low temperature area, thermal deformation can cause stress to concentrate at the joining interface.

The technical objective of this invention is to provide a fastening structure for a thermoelectric module.

The thermoelectric module according to one embodiment of the present invention includes a first metal substrate including a first through hole; a first insulating layer disposed on the first metal substrate; a first electrode portion disposed on the first insulating layer and including a plurality of first electrodes; a plurality of P-type and N-type thermoelectric legs disposed on the first electrode portion; a second electrode portion disposed on the plurality of P-type and N-type thermoelectric legs and including a plurality of second electrodes; a second insulating layer disposed on the second electrode portion; and a second metal substrate disposed on the second insulating layer and including a second through hole; the first metal substrate includes an effective region in which the first electrode portion is disposed and an outer region formed on the outer periphery of the effective region, the second metal substrate includes an effective region in which the second electrode portion is disposed and an outer region formed on the outer periphery of the effective region, the first through hole is formed within the effective region of the first metal substrate, the second through hole is formed within the effective region of the second metal substrate, and the first through hole and the second through hole are formed at positions corresponding to each other.

The device may further include a fastening member that passes through the first through hole and the second through hole to fasten the first metal substrate and the second metal substrate.

The second metal substrate may include a plurality of second metal substrates spaced apart from one another, and each second metal substrate may include at least one second through hole.

An insulating member may be disposed between multiple second metal substrates spaced apart from one another.

The thickness of the insulating member may be less than the thickness of the second metal substrates.

The length direction of a portion of the multiple first electrodes arranged on the first metal substrate is different from the length direction of the remaining portion, and the length direction of a portion of the multiple second electrodes arranged on the second metal substrate is different from the length direction of the remaining portion, and the length direction may be the long width direction of each electrode.

At least two of the first electrodes of the first electrode portion excluding the edge region are arranged in a second direction perpendicular to the first direction, and the remaining electrodes are arranged in the first direction, and at least two of the second electrodes of the second electrode portion excluding the edge region are arranged in a second direction perpendicular to the first direction, and the remaining electrodes are arranged in the first direction.

Of the plurality of first electrodes excluding the edge region, the number of first electrodes whose length direction is arranged in the second direction may be a multiple of 2, and of the plurality of second electrodes excluding the edge region, the number of second electrodes whose length direction is arranged in the second direction may be a multiple of 2.

At least some of the second electrodes arranged in two columns or two rows facing each other in the edge region may be arranged such that their length direction is in the second direction.

The first metal substrate includes a first hole arrangement region which is a space formed by a virtual line connecting the surfaces of the first electrodes which are closest to the first through hole and arranged adjacent to each other, and the second metal substrate includes a second hole arrangement region which is a space formed by a virtual line connecting the surfaces of the second electrodes which are closest to the second through hole and arranged adjacent to each other, and at least one first electrode adjacent to the first hole arrangement region may be arranged with its length direction in the second direction, and at least one second electrode adjacent to the second hole arrangement region may be arranged with its length direction in the second direction.

The at least one first electrode may be arranged so as to overlap at least a portion of a virtual space formed by an extension line extending from a virtual line defining the first hole arrangement area, and the at least one second electrode may be arranged so as to overlap at least a portion of a virtual space formed by an extension line extending from a virtual line defining the second hole arrangement area.

The first through holes may include a plurality of holes, and the first hole arrangement regions may be formed around the plurality of first through holes, respectively, and the second through holes may include a plurality of holes, and the second hole arrangement regions may be formed around the plurality of second through holes, respectively.

The plurality of first through holes and the plurality of second through holes may be formed at positions corresponding to each other.

The first metal substrate may further include a third through hole disposed in an outer region of the first metal substrate.

The ratio of the area of the second metal substrate to the area of the first metal substrate may be 0.5 to 0.95.

It may further include an insulating insert member disposed adjacent to the fastening member.

The diameter of the first through hole and the diameter of the second through hole may be different from each other.

The diameter of the second through hole may be 1.1 to 2.0 times the diameter of the first through hole.

A portion of the insulating insert member may be disposed within the second through hole.

It may further include a third insulating layer disposed between the first metal substrate and the first insulating layer.

According to an embodiment of the present invention, by fastening the high-temperature substrate and the low-temperature substrate to each other so that they occupy a portion of the effective area of each, it is possible to reduce thermal deformation of the high-temperature substrate, prevent stress concentration at the joint area, and improve the reliability and durability of the thermoelectric module at high temperatures.

According to an embodiment of the present invention, it is possible to optimally arrange multiple P-type and N-type thermoelectric legs within the limited space in which each hole arrangement area is formed, without wasting space, thereby maintaining the power generation performance of the thermoelectric module.

1 is a side view of a thermoelectric module according to a first embodiment of the present invention; 1 is a perspective view of a thermoelectric module according to a first embodiment of the present invention; 1 is an exploded perspective view of a thermoelectric module according to a first embodiment of the present invention; FIG. 2 is a side view illustrating a state in which the thermoelectric module according to the first embodiment of the present invention is installed in a cooling part. FIG. 5 is a perspective view of a thermoelectric module according to a second embodiment of the present invention. FIG. 11 is a side view illustrating a state in which a thermoelectric module according to a second embodiment of the present invention is installed in a cooling part. 4 is a diagram illustrating a first example of a method for arranging first electrodes and second electrodes on a plurality of first metal substrates and a second metal substrate; 8 is a diagram illustrating a state in which a plurality of first electrodes and a plurality of second electrodes shown in FIG. 7 are overlapped. 4 is a diagram illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate; 4 is a diagram illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate; 4 is a diagram illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate; 4 is a diagram illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate; 1 is a diagram illustrating a fastening structure of a power generation module according to an embodiment of the present invention.

Below, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

However, the technical concept of the present invention is not limited to the embodiments described, but may be embodied in a variety of different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted in a manner that would be commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless otherwise clearly defined, and commonly used terms, such as those defined in a dictionary, may be interpreted in light of the contextual meaning of the relevant art.

Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the invention.

In this specification, the singular can include the plural unless otherwise specified in the context, and when it is stated that "A and (and) at least one (or more) of B and C" is used, it can include one or more of all combinations of A, B, and C.

In addition, terms such as first, second, A, B, (a), (b), etc. may be used in describing components of embodiments of the present invention.

Such terms are merely used to distinguish a component from other components, and do not limit the nature, order, or sequence of the components.

When a component is described as being "coupled," "bonded," or "connected" to another component, this includes not only the case where the component is directly coupled, bonded, or connected to the other component, but also the case where the component is "coupled," "bonded," or "connected" by yet another component between the component and the other component.

In addition, when it is described as being formed or located "above or below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or located between the two components. In addition, when it is expressed as "above or below," it can include not only the meaning of the upper direction but also the meaning of the lower direction based on one component.

Figure 1 is a side view of a thermoelectric module according to a first embodiment of the present invention, Figure 2 is a perspective view of a thermoelectric module according to a first embodiment of the present invention, Figure 3 is an exploded perspective view of a thermoelectric module according to a first embodiment of the present invention, and Figure 4 is a side view illustrating the state in which a thermoelectric module according to a first embodiment of the present invention is installed in a cooling section.

Referring to Figures 1 to 4, the thermoelectric module includes a first metal substrate 110, a first resin layer 120, a plurality of first electrodes 130, a plurality of P-type thermoelectric legs 140, a plurality of N-type thermoelectric legs 150, a plurality of second electrodes 160, a second resin layer 170, a second metal substrate 180, a fastening member 190 and a thermal insulating material 200, and the first metal substrate 110 and the second metal substrate 180 may include at least one through hole for passing the fastening member 190 through.

According to another embodiment of the present invention, a thermoelectric module includes a first metal substrate 110, a plurality of second metal substrates 180, a first resin layer 120 arranged between the first metal substrate 110 and the plurality of second metal substrates 180, a plurality of first electrodes 130, a plurality of P-type thermoelectric legs 140, a plurality of N-type thermoelectric legs 150, a plurality of second electrodes 160, and a second resin layer 170, and the first metal substrate 110 and the second metal substrate 180 may include at least one through hole for passing a fastening member 190 therethrough.

The first metal substrate 110 is formed in a plate shape. The first metal substrate 110 may be fixed on the cooling unit C or the heat generating unit (not shown). In the embodiment of the present invention described below, an example in which the first metal substrate 110 is fixed to the cooling unit C is described. At this time, a hole 20h is formed in the cooling unit C at a position corresponding to the first through hole 111 formed in the first metal substrate 110, and a fastening member 190 described below may be inserted into the hole 20h through the first through hole 111. As in the embodiment of FIG. 9 to FIG. 11, the first metal substrate 110 may further have a third through hole 113 formed in an outer region, i.e., an area where the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 are not arranged, and at this time, the fastening member 190 may be inserted into the third through hole 113 and the hole 20h of the cooling unit C formed at a position corresponding to the third through hole 113. A heat dissipation pad H may be further arranged between the first metal substrate 110 and the cooling unit C.

The first metal substrate 110 may include at least one of aluminum, an aluminum alloy, copper, and a copper alloy. When a voltage is applied to the thermoelectric module, the first metal substrate 110 absorbs heat due to the Peltier effect and acts as a low-temperature part, and the second metal substrate 180 releases heat and acts as a high-temperature part. Meanwhile, when different temperatures are applied to the first metal substrate 110 and the second metal substrate 180, the electrons in the high-temperature region move to the low-temperature region due to the temperature difference, generating a thermoelectromotive force. This is called the Seebeck effect, and the resulting thermoelectromotive force generates electricity in the circuit of the thermoelectric element.

The first metal substrate 110 includes at least one first through hole 111. The first through hole 111 is formed at a position corresponding to a second through hole 181 formed in the second metal substrate 180 described below. The first through hole 111 may be formed at a predetermined distance from the outer periphery of the first metal substrate 110. At this time, the fastening member 190 may pass through the first through hole 111 and the second through hole 181, and the first metal substrate 110 and the second metal substrate 180 may be fixed by the fastening member 190. At this time, the diameter of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the diameter of the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 may be the same, but the diameter of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the diameter of the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 may be different depending on the arrangement form and position of the insulating insert member described below.

A first resin layer 120 is applied onto the first metal substrate 110, and multiple first electrodes 130 are arranged on it.

Here, the first metal substrate 110 may be in direct contact with the first resin layer 120. For this purpose, the first metal substrate 110 may have surface roughness formed on the entirety or part of the surface on which the first resin layer 120 is disposed, i.e., the surface of the first metal substrate 110 facing the first resin layer 120. This can prevent the first resin layer 120 from floating during thermal compression bonding between the first metal substrate 110 and the first resin layer 120. In this specification, surface roughness refers to unevenness and may be used interchangeably with surface roughness.

The first resin layer 120 and the second resin layer 170 may be made of a resin composition including a resin and an inorganic filler, and the resin may be an epoxy resin or a silicone resin. Here, the inorganic filler may be included in the resin composition at 68 to 88 vol%. If the inorganic filler is included in less than 68 vol%, the thermal conduction effect may be reduced, and if the inorganic filler is included in more than 88 vol%, the adhesive strength between the resin layer and the metal substrate may be reduced, and the resin layer may be easily broken.

The epoxy resin may include an epoxy compound and a curing agent. At this time, the epoxy compound may be included in a volume ratio of 10 to 10 of the curing agent. Here, the epoxy compound may include at least one of a crystalline epoxy compound, a non-crystalline epoxy compound, and a silicone epoxy compound. The crystalline epoxy compound may include a mesogen structure. A mesogen is a basic unit of a liquid crystal and includes a rigid structure. And, the non-crystalline epoxy compound may be a general non-crystalline epoxy compound having two or more epoxy groups in the molecule, for example, a glycidyl ether derived from bisphenol A or bisphenol F. Here, the curing agent may include at least one of an amine-based curing agent, a phenol-based curing agent, an acid anhydride-based curing agent, a polymercaptan-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent, and a blocked isocyanate-based curing agent, and two or more types of curing agents may be mixed and used.

The inorganic filler may include aluminum oxide and nitride, and the nitride may be included in an amount of 55 to 95 wt % of the inorganic filler, and more preferably 60 to 80 wt %. When the nitride is included in such a numerical range, the thermal conductivity and bonding strength can be increased. Here, the nitride may include at least one of boron nitride and aluminum nitride. Here, the boron nitride may be boron nitride aggregates in which plate-shaped boron nitride is aggregated.

In this case, the particle size D50 of the boron nitride aggregates may be 250 to 350 μm, and the particle size D50 of the aluminum oxide may be 10 to 30 μm. When the particle size D50 of the boron nitride aggregates and the particle size D50 of the aluminum oxide satisfy these numerical ranges, the boron nitride aggregates and the aluminum oxide may be uniformly dispersed in the epoxy resin composition, and therefore the resin layer may have uniform heat conduction effect and adhesive performance as a whole.

According to an embodiment of the present invention, at least one of the first metal substrate 110 side and the second metal substrate 180 side may include a plurality of resin layers. For example, a third resin layer (not shown) may be further disposed between the first resin layer 120 and the plurality of first electrodes 130. Or, a fourth resin layer (not shown) may be further disposed between the plurality of second electrodes 160 and the second resin layer 170. In this case, at least one of the composition, Young's modulus, thermal expansion coefficient, and thickness of the first resin layer 120 and the third resin layer (not shown) may be different from each other. At least one of the composition, Young's modulus, thermal expansion coefficient, and thickness of the second resin layer 170 and the fourth resin layer (not shown) may be different from each other. For example, when one of the first resin layer 120 and the third resin layer (not shown) is a resin composition, the other may be a resin composition having at least one of a different composition, Young's modulus, thermal expansion coefficient, and thickness, an aluminum oxide layer, or a composite containing silicon and aluminum. Here, the composite may be at least one of oxide, carbide, and nitride containing silicon and aluminum. For example, the composite may include at least one of Al-Si bond, Al-O-Si bond, Si-O bond, Al-Si-O bond, and Al-O bond. Thus, a composite containing at least one of Al-Si bond, Al-O-Si bond, Si-O bond, Al-Si-O bond, and Al-O bond has excellent insulation performance, and can obtain high voltage resistance performance. Alternatively, the composite may be an oxide, carbide, or nitride further containing titanium, zirconium, boron, zinc, etc. in addition to silicon and aluminum. For this purpose, the composite may be obtained by mixing at least one of an inorganic binder and an organic/inorganic mixed binder with aluminum and then heat treating the mixture. The inorganic binder may include at least one of silica (SiO ₂ ), metal alkoxide, boron oxide (B ₂ O ₃ ), and zinc oxide (ZnO ₂ ). The inorganic binder is an inorganic particle, but when it comes into contact with water, it can be converted into a sol or gel and act as a binding agent. At this time, at least one of silica (SiO ₂ ), metal alkoxide, and boron oxide (B ₂ O ₃ ) can increase the adhesion to metal, and zinc oxide (ZnO ₂ ) can increase the strength of the resin layer and increase the thermal conductivity. In this specification, the withstand voltage performance may mean a property that is maintained without dielectric breakdown for a predetermined period of time under a predetermined voltage and a predetermined current. For example, if it is maintained without dielectric breakdown for 10 seconds under a voltage of AC 2.5 kV and a current of 1 mA, the withstand voltage can be said to be 2.5 kV. Alternatively, when one of the second resin layer 170 and the fourth resin layer (not shown) is a resin composition, the other may be a resin composition having at least one different composition, Young's modulus, thermal expansion coefficient, and thickness, an aluminum oxide layer, or a composite containing silicon and aluminum. Here, each resin layer may be mixed with an insulating layer.

A plurality of first electrodes 130 are disposed on the first resin layer 120. A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are disposed on the first electrodes 130. At this time, the first electrodes 130 are electrically connected to the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150. Here, the first electrodes 130 may include at least one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni).

A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are disposed on the first electrode 130. At this time, the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150 may be joined to the first electrode 130 by soldering.

At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be bismuth telluride (Bi-Te)-based thermoelectric legs containing bismuth (Bi) and tellurium (Te) as main raw materials. The P-type thermoelectric leg 140 may be a thermoelectric leg containing 99 to 99.999 wt% of a bismuth telluride (Bi-Te)-based main raw material containing at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In) and 0.001 to 1 wt% of a mixture containing Bi or Te, based on a total weight of 100 wt%. For example, the main raw material may be Bi-Se-Te, and Bi or Te may be further included at 0.001 to 1 wt% of the total weight. The N-type thermoelectric leg 150 may be a thermoelectric leg containing 99 to 99.999 wt% of a bismuth telluride (Bi-Te)-based main raw material containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In) and 0.001 to 1 wt% of a mixture containing Bi or Te, based on a total weight of 100 wt%. For example, the main raw material may be Bi-Sb-Te, and Bi or Te may be further included at 0.001 to 1 wt% of the total weight.

The P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be formed in a bulk type or a stacked type. In general, the bulk type P-type thermoelectric leg 140 or the bulk type N-type thermoelectric leg 150 may be obtained by heat treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for the thermoelectric leg, sintering the powder, and cutting the sintered body. The stacked type P-type thermoelectric leg 140 or the stacked type N-type thermoelectric leg 150 may be obtained by applying a paste containing a thermoelectric material onto a sheet-shaped substrate to form unit members, and then stacking and cutting the unit members.

In this case, the pair of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 may have the same shape and volume, or may have different shapes and volumes. For example, since the electrical conduction characteristics of the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150 are different, the height or cross-sectional area of the N-type thermoelectric legs 150 may be formed to be different from the height or cross-sectional area of the P-type thermoelectric legs 140.

The performance of a thermoelectric element according to an embodiment of the present invention can be expressed by a thermoelectric figure of merit. The thermoelectric figure of merit (ZT) can be expressed as follows:

Here, α is the Seebeck coefficient [V/K], σ is the electrical conductivity [S/m], and α ² σ is the power factor ([W/mK ² ]). T is the temperature, and k is the thermal conductivity [W/mK]. k can be expressed as a·cp·ρ, where a is the thermal diffusivity [cm ² /S], cp is the specific heat [J/gK], and ρ is the density [g/cm ³ ].

To obtain the thermoelectric figure of merit of a thermoelectric element, a Z meter is used to measure the Z value (V/K), and the measured Z value can be used to calculate the Seebeck index (ZT).

The P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may have a cylindrical shape, a polygonal column shape, an elliptical column shape, or the like. Alternatively, the P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may have a stacked structure. For example, the P-type thermoelectric leg or the N-type thermoelectric leg may be formed by stacking a plurality of structures in which a semiconductor material is applied to a sheet-like substrate, and then cutting the stacked structures. As a result, loss of material can be prevented and electrical conductivity characteristics can be improved.

The plurality of second electrodes 160 are disposed on the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150. At this time, the P-type thermoelectric legs 140 and the N-type thermoelectric legs 150 may be joined to the second electrodes 160 by soldering. Here, the second electrodes 160 may include at least one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni).

The second resin layer 170 is disposed on the multiple second electrodes 160. Then, multiple second metal substrates 180 are disposed on the second resin layer 170.

The second metal substrate 180 is disposed on the second resin layer 170 facing one of the first metal substrates 110. The second metal substrate 180 may be made of aluminum, an aluminum alloy, copper, or a copper alloy.

The area of the first metal substrate 110 and the area of the second metal substrate 180 may be the same, and as described above, when the third through-hole 113 is formed in the first metal substrate 110, the area of the first metal substrate 110 may be larger than the area of the second metal substrate 180. In this case, the area ratio of the second metal substrate 180 to the area of the first metal substrate 110 may be 0.50 to 0.95, preferably 0.60 to 0.90, and more preferably 0.70 to 0.85.

In another embodiment, in the case of an application field requiring a relatively larger area or where the influence of thermal deformation needs to be further minimized, the second metal substrate 180 may be divided into a plurality of portions for one first metal substrate 110. In this case, the area ratio of each second metal substrate 180 to the area of the first metal substrate 110 may be 0.10 to 0.50, preferably 0.15 to 0.45, and more preferably 0.2 to 0.40. For example, two second metal substrates 180 may be disposed on one first metal substrate 110. In this case, the second metal substrates 180 may be disposed so as to be spaced apart from each other. For example, the first metal substrate 110 may have an area of 100 mm×100 mm, and each of the second metal substrates 180 may have an area of 45 mm×100 mm, and the distance between the spaced apart second metal substrates 180 may be about 10 mm.

As another example, four second metal substrates 180 may be arranged on one first metal substrate 110. In this case, the second metal substrates 180 may be arranged to be spaced apart from each other. For example, the first metal substrate 110 may have an area of 100 mm x 100 mm, each of the second metal substrates 180 may have an area of 45 mm x 45 mm, and the distance between the spaced apart second metal substrates 180 may be about 10 mm.

As another example, the spacing between the multiple second metal substrates 180 may be less than 5 mm. For example, the first metal substrate 110 may have an area of 100 mm x 100 mm, the second metal substrate 180 may have an area of 49.5 mm x 49.5 mm, the spacing between the multiple second metal substrates 180 may be 2 mm, and the connecting member 230 connecting the multiple second metal substrates 180 may be formed to have a width of 2 mm.

In this case, the thickness of the first metal substrate 110 may be 0.1 mm to 2 mm. Also, the thickness of the second metal substrate 180 may be the same as or greater than the thickness of the first metal substrate 110. If the thickness of the second metal substrate 180 is greater than the thickness of the first metal substrate 110, the thickness of the second metal substrate 180 may be 1.1 to 2.0 times the thickness of the first metal substrate 110. Here, the second metal substrate 180 may be formed thicker than the first metal substrate 110 since it may be bent by the fastening member 190.

At least one second through hole 181 is formed in the second metal substrate 180. At this time, the second through hole 181 may be formed to occupy a part of the effective area B1, which is an area inside the outer area B2 of each second metal substrate 180. Here, the effective area may be defined as an area in which a plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 that can substantially realize the Peltier effect or the Seebeck effect are arranged, and a terminal electrode may be arranged within this effective area. The terminal electrode may be extended from the effective area to be connected to an external terminal or wire, and may be electrically connected to at least one of the plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 and at least one of the plurality of first electrodes 130 and the plurality of second electrodes 160. In this area, the plurality of first electrodes 130 and the plurality of second electrodes 160 may vertically overlap each other. The second through holes 181 formed in the second metal substrate 180 may be formed at a predetermined interval from the outer periphery of the second metal substrate 180, and when there are a plurality of second through holes 181, they may be disposed at equal intervals from the outer periphery of the second metal substrate 180. The second through holes 181 are disposed to overlap the first through holes 111, and the fastening member 190 may pass through the corresponding first through holes 111 and second through holes 181. In this manner, the fastening member 190 fixes the first metal substrate 110 and the second metal substrate 180 to each other so as to occupy a part of the effective areas A1 and B1 of the first metal substrate 110 and the second metal substrate 180, thereby reducing thermal deformation and preventing stress concentration at the joint portion.

Although not shown, when the A2 and B2 portions of the outer regions of the first metal substrate 110 and the second metal substrate 180, i.e., the edge regions of the substrates, are fastened together so as not to affect the effective regions A1 and B1 of the first metal substrate 110 and the second metal substrate 180, the fastening force between the substrates may be relatively high. However, in applications where the thermoelectric module is exposed to a high-temperature environment of 100°C or higher to utilize the Seebeck effect or where the Peltier effect is used to generate heat of 100°C or higher, the thermoelectric module may be damaged due to the relative difference in the amount of heat received by the low-temperature region and the high-temperature region. For example, in the case of a thermoelectric module using the Seebeck effect, the high-temperature metal substrate expands due to heat and the low-temperature metal substrate contracts due to a separate cooling member, and thermal stress is concentrated at the edge regions of the substrates. The thermal stress generated at this time is also transmitted to the electrodes, thermoelectric legs, and resin layers arranged between the substrates, and may cause peeling and cracks at the fragile interfaces, resulting in a sharp decrease in thermoelectric efficiency due to damage to the thermoelectric module. Although not shown, a sealing member may be further disposed between the first metal substrate 110 and the second metal substrate 180. The sealing member may be disposed on the sides of the first electrode 130, the P-type thermoelectric legs 140, the N-type thermoelectric legs 150, and the second electrode 160 between the first metal substrate 110 and the plurality of second metal substrates 180. Accordingly, the first electrode 130, the P-type thermoelectric legs 140, the N-type thermoelectric legs 150, and the second electrode 160 may be sealed from external moisture, heat, contamination, and the like. Here, the sealing member may include a sealing case disposed at a predetermined distance from the outermost peripheries of the plurality of first electrodes 130, the outermost peripheries of the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150, and the outermost peripheries of the plurality of upper electrodes 160, a sealing material disposed between the sealing case and the first metal substrate 110, and a sealing material disposed between the sealing case and the second metal substrate 180. In this way, the sealing case can be in contact with the first metal substrate 110 and the second metal substrate 180 through the sealing material. Accordingly, when the sealing case is in direct contact with the first metal substrate 110 and the second metal substrate 180, heat conduction occurs through the sealing case, and as a result, the problem of a decrease in temperature difference between the first metal substrate 110 and the second metal substrate 180 can be prevented. Here, the sealant can include at least one of an epoxy resin and a silicone resin, or a tape having at least one of an epoxy resin and a silicone resin applied on both sides. The sealant serves to make the gap between the sealing case and the first metal substrate 110 and between the sealing case and the second metal substrate 180 airtight, and can enhance the sealing effect of the first electrode 130, the P-type thermoelectric leg 140, the N-type thermoelectric leg 150, and the second electrode 160, and can be mixed with a finishing material, a finishing layer, a waterproof material, a waterproof layer, etc. Here, the sealant that seals between the sealing case and the first metal substrate 110 may be disposed on the top surface of the first metal substrate 110, and the sealant that seals between the sealing case and the second metal substrate 180 may be disposed on the side surface of the second metal substrate 180. For this, the area of the first metal substrate 110 may be larger than the entire area of the second metal substrate 180. Meanwhile, the sealing case may be formed with a guide groove for drawing out the lead wire connected to the electrode. For this, the sealing case may be an injection molding made of plastic or the like, and may be mixed with the sealing cover. However, the above description of the sealing member is merely an example, and the sealing member may be modified into various forms. Although not shown, a heat insulating material may be further included to surround the sealing member. Or, the sealing member may include a heat insulating component.

7, the first metal substrate 110 has a first hole arrangement region 112 formed adjacent to the first through hole 111. The first hole arrangement region 112 is closest to the first through hole 111, but may be defined as a space formed by virtual lines 201, 202, 203, and 204 connecting the surfaces of the adjacent electrodes. The first hole arrangement region 112 may be formed in a polygonal shape, preferably a rectangular shape. In this case, the first electrodes 130 may not be arranged in the first hole arrangement region 112. In addition, the second metal substrate 180 has a second hole arrangement region 182 formed adjacent to the second through hole 181 on a surface facing the first metal substrate 110. The second hole arrangement region 182 is closest to the second through hole 181, but may be defined as a space formed by virtual lines 211, 212, 213, and 214 connecting the surfaces of the adjacent electrodes. The second hole arrangement region 182 may be formed in a polygonal shape, preferably in a rectangular shape. In this case, the second electrodes 160 may not be arranged in the second hole arrangement region 182.

The fastening member 190 fixes the first metal substrate 110 and at least one second metal substrate 180. At this time, a part of the fastening member 190 passes through the second through hole 181 and the first through hole 111, and an end is inserted and coupled into the hole 20h of the cooling section C.

Referring to FIG. 4, the fastening member 190 may include a first member 191 and a second member 192. The first member 191 passes through the second through hole 181 and the first through hole 111 and is embedded in the one end cooling part C and fixed. At this time, a screw thread may be formed on the outer periphery of the first member 191. The diameter of the first member 191 may be the same as the diameters of the second through hole 181 and the first through hole 111 or may be smaller than the diameters of the second through hole 181 and the first through hole 111.

The second member 192 extends from the other end of the first member 191 and is formed with a diameter larger than the diameter of the second through hole 181. The second member 192 prevents the second metal substrate 180 from expanding from the first metal substrate 110.

When there are multiple second metal substrates 180, the insulating material 200 may be disposed in the space between the multiple second metal substrates 180. Here, the insulating material 200 may include at least one of epoxy resin, silicone resin, and ceramic wool, and the insulating material 200 may be mixed with the sealing member described above and the connecting member 230 described below.

The heat sink 220 may be disposed on the second metal substrate 180. For example, the heat sink 220 may be disposed on one of the two surfaces of the second metal substrate 180 opposite to the surface on which the second resin layer 170 is disposed. In this case, the second metal substrate 180 and the heat sink 220 may be integrally formed. Although not shown, a heat sink may also be formed on the first metal substrate 110. The heat sink 220 may have a structure in which a plurality of flat plate-shaped planar substrates 221 are arranged in parallel, and the spaces between the planar substrates 221 form air flow paths. In this case, the interval between the planar substrates 221 may be less than 10 mm.

Below, another embodiment of the thermoelectric module 20 will be described with reference to Figures 5 and 6.

Figure 5 is a perspective view of a thermoelectric module according to a second embodiment of the present invention, and Figure 6 is a side view illustrating the state in which the thermoelectric module according to the second embodiment of the present invention is installed in a cooling section.

Referring to FIG. 5 and FIG. 6, the thermoelectric module 20 may further include a connecting member 230 that connects between the multiple second metal substrates 180.

The connecting member 230 may be a glue that joins the plurality of second metal substrates 180 together. In this case, the thermoelectric module 20 may omit heat insulation treatment in the space between the plurality of second metal substrates 180, but as described above, a heat insulating material 200 may be disposed between the first metal substrate 110 and the second metal substrate 180.

Although not shown, the thermoelectric module may be formed without the connecting member 230 and connected to each other by extension members each extending from a portion of the second metal substrates 180.

In this case, the extension member may be formed to be thinner than the second metal substrate 180. For example, the thickness of the second metal substrate 180 may be 0.2 mm to 4 mm, and the thickness of the extension member may be 0.1 mm to 2 mm. Here, the ratio of the thickness of the second metal substrates to the thickness of the extension member may be 1 to 2 or less.

One side of the connecting member 230 may be recessed compared to one side of the second metal substrate 180 to form a groove 241. In this case, the connecting member 230 may be formed in a cross shape. For example, when the area of the first metal substrate 110 is 100 mm×100 mm and the area of the second metal substrate 180 is 45 mm×45 mm and the thickness is 0.2 mm to 4 mm, the connecting member 230 may have a width of 10 mm and a thickness of 0.1 mm to 2 mm, and the groove formed by the connecting member 230 may have a depth of 0.1 mm to 2 mm or less. In this way, the groove is formed due to the difference in thickness between the connecting member 230 and the second metal substrate 180, and the thickness of the center part of the second metal substrate 180 becomes thinner, which has the effect of mitigating thermal deformation of the second metal substrate 180.

In this specification, the heat insulating material 200, the connecting member 230 and the extension member that are disposed between the plurality of second metal substrates 180 spaced apart from one another and connect the plurality of second metal substrates 180 are collectively referred to as connecting members, and the connecting members may be insulating members that contain insulating material.

Hereinafter, various embodiments of the arrangement method of the plurality of first electrodes 130 and the plurality of second electrodes 160 will be described with reference to Figures 7 to 11.

Figure 7 is a diagram illustrating a first embodiment of a method for arranging first and second electrodes on a first metal substrate 110 and a second metal substrate 180, Figure 8 is a diagram illustrating a state in which a plurality of first electrodes and a plurality of second electrodes shown in Figure 7 are stacked, and Figures 9 to 11 are diagrams illustrating various embodiments of a method for arranging first and second electrodes on a first metal substrate 110 and a second metal substrate 180.

Referring to Figures 7 to 11, the first electrodes 130 are arranged on one side of the first metal substrate 110 facing the second metal substrate 180, and the second electrodes 160 are arranged on one side of the second metal substrate 180 facing the first metal substrate 110. At this time, the first electrodes 130 may be arranged with the first hole arrangement region 112 spaced apart, and the second electrodes may be arranged with the second hole arrangement region 182 spaced apart, and the positions of the first hole arrangement region 112 and the second hole arrangement region 182 correspond to each other.

Here, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 is formed in a rectangular shape, and is divided into a long width W1 and a short width W2. At this time, the ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 may be variable depending on the shape of the legs to be arranged, and preferably, the ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 may be 2.05 to 4.50. In this specification, the direction of the long width may be referred to as the length direction.

Although not shown, if no through holes 111, 181 are formed in the effective areas of the first metal substrate 110 and the second metal substrate 180, the length directions of the first electrodes 130 may all be arranged in the first direction Y. At this time, at least some of the second electrodes 160 arranged in two columns or two rows facing each other at the edge areas of the effective areas may be arranged in a second direction X perpendicular to the first direction Y, and the remaining electrodes may be shifted from the first electrodes 130 by the short width W2 of the electrodes and at least some of them may overlap. Through this, the P-type and N-type thermoelectric legs between the first metal substrate 110 and the second metal substrate 180 may all be connected in series.

When at least one through hole 111, 181 is formed in the effective area of the first metal substrate 110 and the second metal substrate 180 according to an embodiment of the present invention, the length directions of the first electrode 130 and the plurality of second electrodes 160, excluding the electrodes in the edge areas, can be arranged in a mixture of the first direction Y and the second direction X perpendicular to the first direction Y.

At this time, at least two of the plurality of first electrodes 130 or the plurality of second electrodes 160, excluding the edge regions, may be arranged in a second direction X perpendicular to the first direction Y, and the remaining electrodes may be arranged in the first direction Y perpendicular to the second direction X.

At least one electrode adjacent to the first hole arrangement region 112 or the second hole arrangement region 182 may be arranged so that its length direction faces the second direction X, and another electrode adjacent to the at least one may also be arranged so that its length direction faces the second direction X. In this case, the at least two first electrodes 130 and the at least two second electrodes 160 may not overlap each other or may partially overlap each other.

In more detail, at least two of the first electrodes 130 adjacent to the first hole arrangement region 112, the first electrodes 130a and 130b, may be arranged so that their length direction faces the second direction X. And the remaining first electrodes 130 may be arranged so that their length direction faces the first direction Y.

At this time, at least two of the second electrodes 160 adjacent to the second hole arrangement region 182, 160a and 160b, may be arranged in the second direction X. In addition, two rows of the second electrodes 160c arranged at the edge of the effective region facing each other may also be arranged with their length directions in the second direction X. The remaining second electrodes 160 may be arranged with their length directions facing the first direction Y. At this time, the first electrodes 130a and 130b arranged in the second direction X and the second electrodes 160a and 160b arranged in the second direction may be arranged so that they do not overlap each other or partially overlap each other. Here, the arrangement forms of the first electrodes 130 and the second electrodes 160 may be changed and applied.

8, at least two of the first electrodes 130, excluding the edge regions, may be arranged in the second direction X by at least partially overlapping with the virtual space (H1 or H2) formed by the extension lines extending from the virtual lines 201, 202, 203, and 204 that define the first hole arrangement region 112, and at least two of the second electrodes 160, excluding the edge regions, may be arranged in the second direction X by at least partially overlapping with the virtual space (H3 or H4) formed by the extension lines extending from the virtual lines 211, 212, 213, and 214 that define the second hole arrangement region 182. Through this, it is possible to optimally arrange the multiple P-type and N-type thermoelectric legs within the limited space in which each hole arrangement region is formed. Here, the number of electrodes arranged in the second direction X may increase depending on the number, positions, and shapes of the first hole arrangement region 112 and the second hole arrangement region 182. In this case, the number of electrodes arranged in the second direction X may be a multiple of 2, and at least two of the electrodes arranged in the second direction X may be arranged to overlap at least partially with H1 to H4.

In this specification, the electrode arrangement forms of the plurality of first electrodes 130 and the plurality of second electrodes 160 may be changed and applied, and the first direction Y and the second direction X are not limited thereto.

Referring to FIG. 9, among the plurality of first electrodes 130, two first electrodes 130d, 130f adjacent to the first hole arrangement region 112 may be arranged so that their length direction faces the second direction X, and two first electrodes 130c, 130e adjacent to the two first electrodes 130d, 130f may also be arranged so that their length direction faces the second direction X. And the remaining first electrodes 130 may be arranged so that their length direction faces the first direction Y.

In this case, among the plurality of second electrodes 160, two second electrodes 160d, 160e adjacent to the second hole arrangement region 182 may be arranged so that their length direction faces the second direction X, and the other two second electrodes 160f, 160g adjacent to the second hole arrangement region 182 may also be arranged so that their length direction faces the second direction X. In addition, the second electrodes 160h arranged in two rows facing each other in the edge region may also be arranged so that their length direction faces the second direction. And the remaining second electrodes 160 may be arranged so that their length direction faces the first direction Y.

10, the first metal substrate 110 and the second metal substrate 180 may have a plurality of first through holes 111 and a plurality of second through holes 181, and accordingly, the first hole arrangement region 112 and the second hole arrangement region 182 may also be formed in a plurality of numbers. At this time, two first electrodes 130g, 130h adjacent to each first hole arrangement region 112 among the plurality of first electrodes 130 may be arranged so that their length direction faces the second direction X, and two first electrodes 130i, 130j adjacent to the two first electrodes 130g, 130h may also be arranged so that their length direction faces the second direction X. At this time, the first hole arrangement region 112 is formed in a plurality of numbers, and a multiple of two of the plurality of first electrodes 130 may be arranged so that they face the second direction X. More specifically, at least eight first electrodes 130g, ..., 130n among the plurality of first electrodes 130 may be arranged so that they face the second direction X. Additionally, the remaining first electrodes 130 may be arranged such that their length directions face the first direction Y.

In this case, among the second electrodes 160, two second electrodes 160i and 160j adjacent to each second hole arrangement region 182 in the first direction Y may be arranged so that their length direction faces the second direction X, and the other two second electrodes 160k and 160l adjacent to the second hole arrangement region 182 may also be arranged so that their length direction faces the second direction X.

In this case, the second hole arrangement region 182 may be formed in a plurality of regions, and a multiple of two of the plurality of second electrodes 160 may be arranged so that their length direction faces the second direction X. More specifically, at least eight of the plurality of second electrodes 160, 160i, ..., 160p, may be arranged so that their length direction faces the second direction X. In addition, the second electrodes 160q arranged in two rows facing each other in the edge region may also be arranged so that their length direction faces the second direction X. In addition, the remaining second electrodes 160 may be arranged so that their length direction faces the first direction Y.

Referring to FIG. 11, the first hole arrangement region 112 is formed in a plurality of regions, and the four first electrodes 130o, ..., 130r spaced apart from one of the plurality of first electrodes 130 may be arranged so that their length direction faces the second direction X. Here, a plurality of electrodes may be arranged between the first hole arrangement region 112 and the first electrodes 130o, ..., 130r. However, the first electrodes 130o, ..., 130r may be arranged in the second direction X with at least a portion overlapping with a virtual space formed by an extension line extending from each virtual line defining the first hole arrangement region 112. In addition, the four first electrodes 130s, ..., 130v adjacent in the first direction to another of the plurality of first electrodes 130 may be arranged in the second direction X.

In this case, among the second electrodes 160, the four second electrodes 160r, ..., 160u and the four second electrodes 160v, ..., 160y adjacent to each second hole arrangement region 182 in the first direction Y may be arranged so that their length directions face the second direction X.

Referring to FIG. 12, the first metal substrate 110 and the second metal substrate 180 may have a plurality of first through holes 111 and a plurality of second through holes 181, and accordingly, the first hole arrangement regions 112 and the second hole arrangement regions 182 may also be formed in a plurality of numbers. For example, the first metal substrate 110 may include four first through holes 111 and four first hole arrangement regions 112, and the second metal substrate 180 may include four second through holes 181 and four second hole arrangement regions 182.

In this case, among the plurality of first electrodes 130, two first electrodes 130-1, 130-2 adjacent to each first hole arrangement region 112 may be arranged so that their length direction faces the second direction X, and the other two first electrodes 130-3, 130-4 adjacent to each first hole arrangement region 112 may also be arranged so that their length direction faces the second direction X. Accordingly, among the plurality of first electrodes 130, a multiple of two may be arranged so that their length direction faces the second direction X. More specifically, among the plurality of first electrodes 130, at least 16 first electrodes 130-1, ..., 130-4 may be arranged so that their length direction faces the second direction X. Also, the remaining first electrodes 130 may be arranged so that their length direction faces the first direction Y.

In addition, 2n (n is an integer of 1 or more) first electrodes 130-2n adjacent to at least one of the four first electrodes 130-1, ..., 130-4 arranged adjacent to one of the first hole arrangement regions 112 and facing the second direction X may also be arranged with their length direction facing the second direction X. Here, the positions at which the 2n first electrodes 130-2n are arranged may be variously changed depending on the arrangement structure of the plurality of second electrodes 180.

In addition, here, a plurality of electrodes may be arranged between the first hole arrangement region 112 and the 2n first electrodes 130-2n. However, the 2n first electrodes 130-2n may be arranged in the second direction X so as to overlap at least a portion with a virtual space formed by extensions of each virtual line defining the first hole arrangement region 112.

In FIG. 12, 2n first electrodes 130-2n are illustrated as being arranged in the second direction X, but this is not limited thereto, and 2n second electrodes may be arranged in the first direction Y.

The first resin layer 120 arranged between the first metal substrate 110 and the plurality of first electrodes 130 and the second resin layer 170 arranged between the second metal substrate 180 and the plurality of second electrodes 160 are shown only in FIG. 12, but are not limited thereto, and are omitted in the embodiments of FIGS. 7 to 11 for convenience of explanation, and the first resin layer 120 and the second resin layer 180 of the same or similar structure may be applied in the embodiments of FIGS. 7 to 11.

Similarly, although the terminal electrode 500 is only illustrated in FIG. 12, this is not limiting, and terminal electrodes 500 of the same or similar structure may be applied to the embodiments of FIGS. 7 to 11.

As shown in FIGS. 7 to 12, the two rows arranged in the second direction X to face each other in the edge region may be included in the first electrode 130 arranged on the first metal substrate 110 or the second electrode 160 arranged on the second metal substrate 180.

At this time, the diameter d1 of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the diameter d2 of the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 may be the same, but the diameter d1 of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the diameter d2 of the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 may be different depending on the arrangement form and position of the insulating insert member described later.

Meanwhile, as shown in FIG. 7 to FIG. 12, the area of the first hole arrangement region 112 may be 4 times or more, preferably 6 times or more, and more preferably 8 times or more, the area of one first electrode 130. If the area of the first hole arrangement region 112 is less than 4 times the area of one first electrode 130, a current may move through the first through hole 111 to the first metal substrate 110 under a high voltage of AC 1 kV or more, causing electrical breakdown of the thermoelectric module. Therefore, in applications under high voltage, it is important to ensure a sufficient insulation distance to prevent electrical breakdown of the thermoelectric module. If the area of the first hole arrangement region 112 is 8 times or more the area of one first electrode 130, electrical breakdown does not occur even under a high voltage of AC 2.5 kV or more. Similarly, the area of the second hole arrangement region 182 formed on the second metal substrate 180 may be 4 times or more, preferably 6 times or more, and more preferably 8 times or more, the area of one second electrode 160.

7 to 12, the electrodes of the first electrodes 130 that are disposed most adjacent to the first edge (not shown) of the first metal substrate 110 may be disposed periodically, and the path between the start point and the end point of the virtual line connecting the electrode surface disposed most adjacent to the first edge of the first metal substrate 110 may be disposed as a straight line without a bent region. That is, in all the first electrodes 130 that are most adjacent to the first edge of the first metal substrate 110, the electrode surface most adjacent to the first edge of the first metal substrate 110 among the four electrode surfaces of each first electrode 130 may be disposed at the same interval as the first edge of the first metal substrate 110 along one direction without a removed region. For example, if the path between the start point and the end point of the virtual line connecting the electrode surface disposed most adjacent to the first edge of the first metal substrate 110 is a straight line, it may mean that all the electrodes of the first row (not shown) of the first electrodes 130 are disposed periodically. This can reduce the complexity of the process when arranging a plurality of first electrodes 130 on the first metal substrate 110, and can simplify the arrangement structure of the second electrode 160 arranged on the second metal substrate 180 and the thermoelectric legs arranged between the first electrode 130 and the second electrode 160. In addition, since the shortest distance between the edge of the first metal substrate 110 and the first electrode 130 arranged closest to the edge of the first metal substrate 110 is maintained constant, the first electrode 130 arranged closest to the edge of the first metal substrate 110 can have uniform electrical characteristics.

If the path between the start point and the end point of the virtual line connecting the electrode surface disposed most adjacent to the first edge of the first metal substrate 110 includes a bent region, it may mean that a part of the electrodes in the first row of the plurality of first electrodes 130 is removed or includes a sunken region, resulting in a loss of periodicity in the arrangement. The electrode surface disposed most adjacent to the first edge of the first metal substrate 110 in the bent region may be an electrode surface disposed in a second row (not shown), which is the next row to the first row. Here, the second row is a row disposed farther from the first edge of the first metal substrate 110 than the first row, and may not be the outermost row. Although the first electrodes 130 may be disposed to include a bent region in order to additionally dispose through holes, as described above, in high-voltage applications, electrical breakdown of the thermoelectric module may occur due to insufficient insulation distance being secured, or the effective area of the first electrode portion may be reduced, resulting in a decrease in the efficiency of the thermoelectric module.

Similarly, the electrode (Nth column) among the plurality of first electrodes 130 that is closest to the second edge (not shown) facing the first edge of the first metal substrate 110, the electrode (first row) among the plurality of first electrodes 130 that is closest to the third edge (not shown) between the first and second edges of the first metal substrate 110, and the electrode (Mth row) among the plurality of first electrodes 130 that is closest to the fourth edge (not shown) facing the third edge of the first metal substrate 110 may all be arranged so that the path between the start point and the end point of the virtual line connecting each edge of the first metal substrate 110 and the electrode surface that is closest to the first metal substrate 110 is a straight line without a bent region, but depending on the design of the arrangement of the terminal electrodes, etc., only one of the outermost columns or outermost rows, for example, one of the first column, Nth column, first row, and Mth row, may have an exceptional path. For example, the terminal electrode may be connected to the first electrode 130 arranged in any one of the first column, the Nth column, the first row, and the Mth row, which is the outermost column or row, or may be extended from the first electrode 130 arranged in any one of the first column, the Nth column, the first row, and the Mth row. Accordingly, the remaining columns or rows, except for one column or row in which the terminal electrode is arranged, among the outermost columns and rows, may be arranged to have a certain distance from each corresponding edge of the first metal substrate 110.

Figure 13 shows the junction structure of a thermoelectric element according to one embodiment of the present invention.

Referring to FIG. 13, the thermoelectric element 100 may be fastened by a plurality of fastening members 400. The plurality of fastening members 400 may fasten the heat sink 220 and the second metal substrate 180, fasten the heat sink 220, the second metal substrate 180 and the first metal substrate (not shown), fasten the heat sink 220, the second metal substrate 180 and the first metal substrate (not shown) and the cooling portion (not shown), fasten the second metal substrate 180, the first metal substrate (not shown) and the cooling portion (not shown), or fasten the second metal substrate 180 and the first metal substrate (not shown).

For this purpose, a through hole S through which the fastening member 400 passes may be formed in the heat sink 220, the second metal substrate 180, the first metal substrate (not shown), and the cooling unit (not shown). Here, the through hole S may include the second through hole 181 and the first through hole 111 described above. Here, a separate insulating insert member 410 may be further disposed between the second through hole 181 and the fastening member 400. The separate insulating insert member 410 may be an insulating insert member surrounding the outer periphery of the fastening member 400 or an insulating insert member surrounding the wall surface of the through hole S. This makes it possible to increase the insulation distance of the thermoelectric element.

Meanwhile, the shape of the insulating insert member 410 may be as illustrated in FIG. 13(a) and FIG. 13(b). For example, as illustrated in FIG. 13(a), the insulating insert member 410 may be arranged to form a step in the through hole S region formed in the second metal substrate 180 and surround a part of the wall surface of the through hole S. Alternatively, the insulating insert member 410 may be arranged to form a step in the through hole S region formed in the second metal substrate 180 and extend along the wall surface of the through hole S to the first surface on which the second electrode (not shown) is disposed.

13(a), the diameter d2' of the through hole S on the first surface in contact with the second electrode of the second metal substrate 180 may be the same as the diameter of the through hole S on the first surface in contact with the first electrode of the first metal substrate. At this time, depending on the shape of the insulating insert member 410, the diameter d2' of the through hole S formed on the first surface of the second metal substrate 180 may be different from the diameter d2 of the through hole S formed on the second surface, which is the opposite surface of the first surface. Although not shown, if the insulating insert member 410 is disposed only on a part of the upper surface of the second metal substrate 180 without forming a step in the through hole S area, or if the insulating insert member 410 is disposed so as to extend from the upper surface of the second metal substrate 180 to a part or all of the wall surface of the through hole S, the diameter d2' of the through hole S formed on the first surface of the second metal substrate 180 may be the same as the diameter d2 of the through hole S formed on the second surface, which is the opposite surface of the first surface.

13(b), depending on the shape of the insulating insert member 410, the diameter d2' of the through hole S on the first surface in contact with the second electrode of the second metal substrate 180 may be larger than the diameter of the through hole on the first surface in contact with the first electrode of the first metal substrate. In this case, the diameter d2' of the through hole S on the first surface of the second metal substrate 180 may be 1.1 to 2.0 times the diameter of the through hole on the first surface of the first metal substrate. If the diameter d2' of the through hole S on the first surface of the second metal substrate 180 is less than 1.1 times the diameter of the through hole on the first surface of the first metal substrate, the insulating effect of the insulating insert member 410 is small, which may cause insulation breakdown of the thermoelectric element. If the diameter d2' of the through hole S on the first surface of the second metal substrate 180 is more than 2.0 times the diameter of the through hole on the first surface of the first metal substrate, the area occupied by the through hole S increases relatively, which reduces the effective area of the second metal substrate 180, and may reduce the efficiency of the thermoelectric element.

Depending on the shape of the insulating insert member 410, the diameter d2' of the through hole S formed on the first surface of the second metal substrate 180 may be different from the diameter d2 of the through hole S formed on the second surface, which is the opposite surface of the first surface. As described above, if no step is formed in the through hole S area of the second metal substrate 180, the diameter d2' of the through hole S formed on the first surface of the second metal substrate 180 may be the same as the diameter d2 of the through hole S formed on the second surface, which is the opposite surface of the first surface.

In the embodiment of the present invention, even if the first electrode 130 or the second electrode 160 is separated from the first hole arrangement region 112 or the second hole arrangement region 182, at least a portion of at least two electrodes are overlapped and arranged in the second direction X within the virtual space formed by the extension lines extending from each virtual line defining each hole arrangement region, so that it is possible to optimally arrange multiple P-type and N-type thermoelectric legs without wasting space within the limited space formed by each hole arrangement region.

The thermoelectric element according to the embodiment of the present invention can be used in power generation devices, cooling devices, heating devices, etc. Specifically, the thermoelectric element according to the embodiment of the present invention can be mainly applied to optical communication modules, sensors, medical devices, measuring devices, the aerospace industry, refrigerators, chillers, automobile ventilation seats, cup holders, washing machines, dryers, wine cellars, water purifiers, power supply devices for sensors, thermopiles, etc.

Here, an example of a medical device to which the thermoelectric element according to the embodiment of the present invention is applied is a PCR (Polymerase Chain Reaction) device. A PCR device is a device for amplifying DNA to determine the base sequence of the DNA, and is an instrument that requires precise temperature control and thermal cycling. For this purpose, a Peltier-based thermoelectric element can be applied.

Another example of a medical device to which the thermoelectric element according to an embodiment of the present invention is applied is a photodetector. Here, photodetectors include infrared/ultraviolet detectors, CCD (Charge Coupled Device) sensors, X-ray detectors, TTRS (Thermoelectric Thermal Reference Sources), etc. A Peltier-based thermoelectric element may be applied to cool the photodetector. As a result, it is possible to prevent wavelength changes, output reduction, and resolution reduction caused by an internal temperature rise in the photodetector.

Further examples of applications of the thermoelectric element according to the embodiment of the present invention to medical devices include the immunoassay field, in vitro diagnostics field, general temperature control and cooling systems, physical therapy field, liquid chiller systems, blood/plasma temperature control field, etc. As a result, precise temperature control is possible.

Another example of a medical device in which the thermoelectric element according to the embodiment of the present invention is applied is an artificial heart. Accordingly, it is possible to supply power to the artificial heart.

Examples of applications of the thermoelectric element according to the embodiment of the present invention in the aerospace industry include star tracking systems, thermal imaging cameras, infrared/ultraviolet detectors, CCD sensors, the Hubble Space Telescope, and TTRS. As a result, the temperature of the image sensor can be maintained.

Other examples of applications of thermoelectric elements according to embodiments of the present invention in the aerospace industry include cooling devices, heaters, and power generation devices.

In addition, the thermoelectric elements according to the embodiments of the present invention can be applied to other industrial fields for power generation, cooling, and heating.

Although the present invention has been described above with reference to preferred embodiments, it will be understood by those skilled in the art that various modifications and variations of the present invention may be made without departing from the spirit and scope of the present invention as set forth in the following claims.

C: Cooling section 10: Thermoelectric module 110: First metal substrate 111: First through hole 112: First hole arrangement area 120: First resin layer 130: Multiple first electrodes 140: Multiple P-type thermoelectric legs 150: Multiple N-type thermoelectric legs 160: Multiple second electrodes 170: Second resin layer 180: Second metal substrate 181: Second through hole 182: Second hole arrangement area 190: Fastening member 200: Thermal insulation material 220: Heat sink 230: Connection member

Claims (20)

a first metal substrate including a first through hole;
a first insulating layer disposed on the first metallic substrate;
a first electrode portion disposed on the first insulating layer and including a plurality of first electrodes;
a plurality of P-type and N-type thermoelectric legs disposed on the first electrode portion;
a second electrode portion disposed on the plurality of P-type and N-type thermoelectric legs and including a plurality of second electrodes;
a second insulating layer disposed on the second electrode portion; and a second metal substrate disposed on the second insulating layer and including a second through hole;
the first metal substrate includes an effective area in which a first electrode portion is disposed and an outer area formed on an outer periphery of the effective area,
the second metal substrate includes an effective area in which a second electrode portion is disposed and an outer area formed on the outer periphery of the effective area,
the first through hole is formed within the effective area of the first metal substrate,
the second through hole is formed within the effective area of the second metal substrate;
the first through hole and the second through hole are formed at positions corresponding to each other ,
A thermoelectric module, wherein the diameter of the second through hole is larger on one of both surfaces of the second metal substrate that is arranged toward the second insulating layer than the diameter of the first through hole on one of both surfaces of the first metal substrate that is arranged toward the first insulating layer . The thermoelectric module of claim 1, further comprising a fastening member that passes through the first through hole and the second through hole to fasten the first metal substrate and the second metal substrate. a length direction of a portion of the plurality of first electrodes disposed on the first metal substrate is different from a length direction of a portion of the remaining first electrodes;
a length direction of a portion of the plurality of second electrodes disposed on the second metal substrate is different from a length direction of a portion of the remaining second electrodes;
3. The thermoelectric module according to claim 2 , wherein the length direction is the long width direction of each electrode. At least two of the first electrodes of the first electrode portion excluding the edge region are arranged such that a length direction of the first electrodes is aligned in a second direction perpendicular to the first direction, and the remaining electrodes are arranged such that a length direction of the first electrodes is aligned in the first direction;
4. The thermoelectric module of claim 3, wherein at least two of the second electrodes of the second electrode portion excluding the edge regions are arranged such that a length direction of the at least two electrodes is perpendicular to the first direction, and a length direction of the remaining electrodes is aligned in the first direction. the number of first electrodes whose length directions are arranged in the second direction among the plurality of first electrodes excluding the edge region is a multiple of 2;
The thermoelectric module of claim 4 , wherein the number of second electrodes whose length directions are arranged in the second direction among the plurality of second electrodes excluding the edge regions is a multiple of two. The thermoelectric module according to claim 5, wherein at least some of the second electrodes arranged in two columns or two rows facing each other in the edge region are arranged with their length direction in the second direction. the first metal substrate includes a first hole arrangement region, which is a space defined by an imaginary line connecting surfaces of the first electrodes that are disposed adjacent to the first through hole and are closest to the first through hole;
the second metal substrate includes a second hole arrangement region, which is a space defined by a virtual line connecting surfaces of the second electrodes that are disposed adjacent to the second through hole and are closest to the second through hole,
At least one first electrode adjacent to the first hole arrangement region has a length direction aligned in the second direction,
The thermoelectric module according to claim 6 , wherein at least one second electrode adjacent to the second hole arrangement region has a length aligned in the second direction. the at least one first electrode is disposed so as to at least partially overlap with a virtual space formed by an extension line extending from a virtual line defining the first hole arrangement region;
The thermoelectric module according to claim 7 , wherein the at least one second electrode is disposed so as to at least partially overlap with an imaginary space formed by an extension line extending from an imaginary line defining the second hole arrangement region. The first through hole includes a plurality of first through holes,
the first hole arrangement regions are formed around the first through holes,
The second through hole includes a plurality of second through holes,
The thermoelectric module of claim 8 , wherein the second hole arrangement regions are formed around the second through holes, respectively. The thermoelectric module according to claim 9, wherein the first through holes and the second through holes are formed at positions corresponding to each other. The thermoelectric module of claim 10, further comprising a third through hole disposed in an outer region of the first metal substrate. The thermoelectric module according to claim 11, wherein the ratio of the area of the second metal substrate to the area of the first metal substrate is 0.5 to 0.95. The thermoelectric module of claim 12 further comprising an insulating insert positioned adjacent the fastener . The thermoelectric module of claim 13 , wherein a portion of the insulating insert is disposed within the second through hole. the first metal substrate includes a first hole arrangement region, which is a space defined by a virtual line connecting surfaces of the first electrodes that are closest to the first through hole and that are arranged adjacent to each other;
the second metal substrate includes a second hole arrangement region, which is a space defined by a virtual line connecting surfaces of the second electrodes that are closest to the second through hole and are arranged adjacent to each other;
The thermoelectric module of claim 1 , wherein a minimum distance between the first through hole and the first electrode in the first hole arrangement region is greater than a minimum distance between the second through hole and the second electrode in the second hole arrangement region. the first metal substrate includes a first hole arrangement region, which is a space defined by an imaginary line connecting surfaces of the first electrodes that are most adjacent to the first through hole and are disposed adjacent to each other among the plurality of first electrodes, the surfaces being most adjacent to the first through hole;
a size of the first hole arrangement region is four or more times a size of any one of the first electrodes;
The thermoelectric module according to claim 1 , having a withstand voltage characteristic of 1 kV or more. The thermoelectric module of claim 16, further comprising a third insulating layer disposed between the first metal substrate and the first insulating layer. The thermoelectric module of claim 17, wherein the second metal substrate includes a plurality of second metal substrates spaced apart from one another, and each second metal substrate includes at least one second through hole. The thermoelectric module according to claim 18, in which an insulating member is disposed between a plurality of second metal substrates spaced apart from one another. The thermoelectric module according to any one of claims 2 to 14 ; and a cooling part coupled to the first metal substrate,
A power generation device, wherein a portion of the fastening member is disposed within the cooling portion.

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