JP7513874B2 - Sensor Storage Device - Google Patents

Description

This disclosure relates to a sensor housing device.

Sensors such as infrared sensors and Lidar (Light Detection and Ranging) are widely used, which detect obstacles by emitting electromagnetic waves of a specific wavelength and receiving the reflected waves. Such sensors are housed in a sensor housing device, especially when used outdoors. Such a sensor housing device is provided with a window for emitting and receiving electromagnetic waves. Such a window is formed by closing an opening formed in the front of the sensor housing device with a plate-shaped screen made of glass, resin, or the like and having optical transparency for electromagnetic waves. When snow or frost adheres to the screen in a low-temperature environment, the emission and reception of electromagnetic waves are suppressed. Therefore, various heaters using a conductive film placed on the surface of the screen have been proposed. In the heater of Patent Document 1, the conductive film is used for both the purpose of a temperature sensor and a heater, and for example, temperature detection and heating of the screen are performed in a time-division manner.

JP 2017-103194 A

Snow and water that adhere to the screen tend to move downwards under their own weight and gather at the bottom of the screen. Therefore, there is a demand for locally generating more heat at the bottom of the screen compared to the top. However, in the past, sufficient consideration has not been given to locally generating more heat on the screen. For example, with the heater of Patent Document 1, when snow or water adheres to the screen, the entire screen generates more heat based on the detection results of the temperature sensor, and it is not possible to locally generate more heat. For this reason, in the heater of Patent Document 1, in order to melt the snow that covers the screen locally, a large amount of power sufficient to melt the snow is supplied to the entire conductive film, and there is a risk that the entire screen will be heated to a high temperature. In this case, the parts not covered by snow will be excessively heated, and in a screen made of resin such as acrylic, there is a risk that such parts will be deformed.

The above-mentioned problem is also common to sensors that only receive electromagnetic waves without emitting electromagnetic waves, such as sensor housing devices that house imaging cameras that receive visible light and capture images. In addition, this problem is not limited to cases where the sensor is used outdoors, but is also common when the sensor is used indoors, in configurations that use heaters for purposes such as preventing fogging on the screen. Therefore, technology that can generate more heat locally on the screen of the sensor housing device is desired.

The present disclosure can be realized in the following forms.
a first electrode electrically connected to a first side of the conductive film for applying a voltage to the conductive film; and a second electrode electrically connected to a second side of the conductive film facing the first side for applying a voltage to the conductive film, wherein a second connection portion of the conductive film electrically connected to the second electrode includes a high current density portion having an average current density higher than an average current density at a first connection portion of the conductive film electrically connected to the first electrode, the first electrode being electrically connected to the first side along the entirety of the first side, the second electrode being electrically connected to the second side along the entirety of the second side, a length of the second side being smaller than a length of the first side, and the second side being a side that is located lower than the first side when the sensor containing device is in use.
[Form 2] A sensor housing device for housing a sensor that receives electromagnetic waves, the sensor housing device comprising: an opening for receiving the electromagnetic waves; a screen covering the opening and transparent to the electromagnetic waves; a conductive film arranged in a planar shape along a surface of the screen and having electrical conductivity and transparency to the electromagnetic waves; a first electrode electrically connected to a first side of the conductive film for applying a voltage to the conductive film; and a second electrode electrically connected to a second side of the conductive film opposite to the first side for applying a voltage to the conductive film, wherein a connection length along which the second electrode is connected to the second side is shorter than a connection length along which the first electrode is connected to the first side, the first electrode is electrically connected to the first side along the entire first side, and the second electrode is electrically connected to the second side along the entire second side, the length of the second side is shorter than the length of the first side, and the second side is a side that is located below the first side when the sensor housing device is in use.

(1) According to one aspect of the present disclosure, there is provided a sensor housing device housing a sensor that receives electromagnetic waves, the sensor housing device including: an opening for receiving the electromagnetic waves, a screen that closes the opening and is transparent to the electromagnetic waves, a conductive film that is disposed in a planar shape along a surface of the screen and is conductive and transparent to the electromagnetic waves, a first electrode that is electrically connected to a first side of the conductive film and is for applying a voltage to the conductive film, and a second electrode that is electrically connected to a second side of the conductive film that faces the first side and is for applying a voltage to the conductive film, wherein a second connection portion of the conductive film that is electrically connected to the second electrode includes a high current density portion that has an average current density higher than an average current density at a first connection portion of the conductive film that is electrically connected to the first electrode.
According to this embodiment of the sensor accommodating device, the second connection portion of the conductive film includes a high current density portion having an average current density higher than the average current density of the first connection portion of the conductive film that is electrically connected to the first electrode, so that the high current density portion can generate more heat than other portions. Therefore, it is possible to locally generate more heat in the screen near the second side of the conductive film. For this reason, for example, by arranging the sensor accommodating device so that the second side is downward and the first side is upward, when snow or water locally covers the lower side of the screen, the snow or water can be removed by heat generation.
(2) In the sensor containing device of the above form, the first electrode may be electrically connected to the first side along the entirety of the first side, the second electrode may be electrically connected to the second side along the entirety of the second side, and the length of the second side may be smaller than the length of the first side.
According to this form of sensor containing device, the length over which the second electrode is electrically connected to the second side is shorter than the length over which the first electrode is electrically connected to the first side, so that the entire second connection portion can be configured as a high current density portion, allowing more heat to be generated at the second connection portion.
(3) In the sensor containing device of the above form, the sensor containing device may further include an insulating portion adjacent to the conductive film in a direction perpendicular to the direction from the first side to the second side, wherein the length of the second side is smaller than the length of the first side, the first electrode is connected only to the conductive portion of the conductive film and the insulating portion, and the second electrode is connected to both the conductive film and the insulating portion.
According to the sensor containing device of this embodiment, even if the length of the second electrode is configured to be longer than the length of the second side, the average current density in the high current density portion can be made approximately the same as when the length of the second electrode is the same as the length of the second side. Therefore, the average current density in the high current density portion can be increased while improving the connectivity with the conductive film by increasing the length of the second electrode.
(4) In the sensor containing device of the above form, the length of the second side may be equal to the length of the first side, and the length of the second electrode along the second side may be smaller than the length of the first electrode along the first side.
According to the sensor containing device of this aspect, the average current density in the second connection portion can be made higher than the average current density in the first connection portion, so that the entire second connection portion can be configured as a high current density portion.
(5) In the sensor containing device of the above form, the length of the second side may be equal to the length of the first side, the first electrode may be electrically connected to the first side along the entire first side, the second electrode may have a first portion and a second portion whose length along the second side is smaller than the second side, and the second electrode may be electrically connected to the second side at the first portion and the second portion, and the thickness of the second portion in a cross direction intersecting with the second side may be greater than the thickness of the first portion in the cross direction and greater than the thickness of the first electrode in the cross direction.
According to this embodiment of the sensor housing device, the thickness of the second portion in the cross direction intersecting with the second side is greater than the thickness of the first portion in the cross direction and is also greater than the thickness of the first electrode in the cross direction, so that the average current density in the portion of the second connection portion connected to the second portion can be made higher than the average current density in the portion connected to the first portion and the average current density in the first connection portion, thereby making it possible to configure the portion connected to the second portion as a high current density portion.
(6) In the sensor containing device of the above form, the length of the second side may be equal to the length of the first side, the first electrode may be electrically connected to the first side along the entire first side, the second electrode may have a first portion and a second portion whose length along the second side is smaller than the second side, and the second electrode may be electrically connected to the second side at the first portion and the second portion, and the second portion may be formed from a material having a higher conductivity than a material forming the first portion and a material having a higher conductivity than a material forming the first electrode.
In this embodiment of the sensor housing device, the second portion is formed of a material having a higher electrical conductivity than the material forming the first portion and having a higher electrical conductivity than the material forming the first electrode, so that the average current density at the portion of the second connection portion connected to the second portion can be made higher than the average current density at the portion connected to the first portion and the average current density at the first connection portion, thereby making it possible to configure the portion connected to the second portion as a high current density portion.
(7) In the sensor containing device of the above form, the conductive film includes a first portion and a second portion adjacent to the first portion in a direction perpendicular to the direction from the first side to the second side, the second portion having a smaller thickness than the first portion, and a connection length along which the second electrode is connected to the second portion may be smaller than a connection length along which the first electrode is connected to the second portion.
According to this form of sensor containing device, the conductive film includes a first portion and a second portion having a smaller thickness, and the connection length along which the second electrode is connected to the second portion is smaller than the connection length along which the first electrode is connected to the second portion, so that the average current density in the portion connected to the second electrode in the second portion can be made higher than the average current density in the first connection portion, thereby configuring it as a high current density portion.
(8) In the sensor containing device of the above form, the length of the second side may be equal to the length of the first side, the first electrode may be electrically connected to the first side along the entire first side, and the second electrode may be electrically connected to the second side along the entire second side, and an electrode thickness may be provided in part.
According to this embodiment of the sensor housing device, since the second electrode is partially provided with an electrode thickness, the average current density at the portion connected to the portion with the electrode thickness can be made higher than the average current density at the portion connected to the portion without the electrode thickness, so that the portion connected to the portion with the electrode thickness can be configured as a high current density portion.
(9) In the sensor containing device of the above-described form, a variable resistor may be provided, which is arranged between at least one of a pair of electrodes consisting of the first electrode and the second electrode and the conductive film, and is connected to one of the pair of electrodes and the conductive film, and the resistance value of the variable resistor may have a characteristic that is smaller when the temperature is low than when the temperature is high.
According to the sensor housing device of this embodiment, the resistance value of the variable resistor has a characteristic that it is smaller at low temperatures than at high temperatures, so that the current flowing through the variable resistor can be increased at low temperatures, and the temperature of the portion of the conductive film to which the variable resistor is connected can be raised compared to other portions. Also, since the variable resistor is disposed between at least one of the pair of electrodes and the conductive film, the transmission area of the electromagnetic wave in the conductive film can be prevented from narrowing. For these reasons, according to the sensor housing device of this embodiment, the portion requiring heating can be locally heated while preventing the transmission area of the electromagnetic wave in the screen from narrowing.
(10) In the sensor containing device of the above-described form, a plurality of the variable resistors may be provided, and the plurality of variable resistors may be arranged apart from each other in a direction parallel to the two sides between at least one of the pair of electrodes and the conductive film.
According to this form of sensor containing device, the multiple variable resistors are arranged at a distance from each other in a direction parallel to the two sides between at least one of the pair of electrodes and the conductive film. Therefore, even if the temperatures are different at the multiple locations to which the variable resistors are connected, a current according to each temperature, specifically, the lower the temperature, the more current can flow. Therefore, when there is a temperature distribution on the screen, such as when it is partially covered with snow and locally cold, each location can be appropriately heated.
(11) In the sensor containing device of the above aspect, the variable resistor may be configured with a substrate that is transparent to the electromagnetic waves, and a wiring pattern formed on the substrate using a conductive material.
According to this form of sensor containing device, the variable resistor is composed of a substrate that is transparent to electromagnetic waves and a wiring pattern formed on the substrate from a conductive material, so that the variable resistor can prevent the transmission area of the electromagnetic waves on the screen from becoming narrower.
(12) In the sensor housing device of the above aspect, the screen may be curved in an intersecting direction that intersects with the opposing direction in which the two sides face each other.
According to this form of sensor housing device, since the screen is curved in a cross direction that crosses the facing direction in which the two sides face each other, for example, when the sensor housing device is used outdoors, snow, frost, etc. are likely to adhere to various locations on the screen in various ways depending on environmental conditions such as wind direction. However, even in such a situation, by arranging a variable resistor in a location where snow, etc. locally adheres, it is possible to locally heat such a location and melt the snow, etc.
(13) In the sensor containing device of the above form, in a usage state, the sensor containing device is arranged so that the opposing direction is parallel to the vertical direction, and the screen has a contour shape having two sides parallel to the two sides, and of the two sides included in the contour shape, the length of the side on the vertically lower side in the usage state may be shorter than the length of the side on the vertically upper side.
With this type of sensor housing device, the vicinity of the vertically lower edge of the screen is prone to localized low temperatures because snow that has accumulated on the upper side of the screen slides down due to its own weight and collects there. However, even in such a situation, by locating the variable resistor in the vertically lower area that is prone to low temperatures, the variable resistor can be brought close to the low-temperature area, making it easier to transfer heat to the snow, etc., during heating, and efficiently achieving localized heating.
(14) In the sensor containing device of the above form, in a state of use, the sensor containing device may be arranged so that the pair of electrodes are arranged vertically facing each other with the conductive film in between, and the variable resistor is arranged between the vertically lower electrode of the pair of electrodes and the conductive film.
In this form of sensor housing device, the variable resistor is positioned between the vertically lower electrode of the pair of electrodes and the conductive film, so that the current flowing through the conductive film can be controlled in accordance with the temperature of the vertically lower part where snow that has adhered to the top of the screen slides down under its own weight and collects, tending to become cold, thereby making it possible to more reliably remove snow, water, etc.
(15) According to another aspect of the present disclosure, there is provided a sensor housing device for housing a sensor that receives electromagnetic waves, the sensor housing device including: an opening for receiving the electromagnetic waves, a screen that closes the opening and is transparent to the electromagnetic waves, a conductive film that is disposed in a planar shape along a surface of the screen and is conductive and transparent to the electromagnetic waves, a first electrode that is electrically connected to a first side of the conductive film and is for applying a voltage to the conductive film, and a second electrode that is electrically connected to a second side of the conductive film that faces the first side and is for applying a voltage to the conductive film, wherein a connection length of the second electrode connected to the second side is shorter than a connection length of the first electrode connected to the first side.
According to this embodiment of the sensor accommodating device, the connection length of the second electrode connected to the second side is shorter than the connection length of the first electrode connected to the first side, so that the portion of the conductive film connected to the second electrode can generate more heat than other portions, for example, the portion to which the first electrode is connected. Therefore, it is possible to locally generate more heat in the screen near the second side of the conductive film. For this reason, for example, by arranging the sensor accommodating device so that the second side is downward and the first side is upward, when snow or water locally covers the lower side of the screen, the snow or water can be removed by heat generation.

The present disclosure can be realized in various forms. For example, it can be realized in the form of a sensor including a sensor housing device and a sensor device, a screen device for a sensor housing device, etc.

1 is a side view showing an external shape of a sensor containing device according to an embodiment of the present disclosure. FIG. 2 is a front view showing the external shape of the sensor containing device of the first embodiment. FIG. 1 is a perspective view mainly showing an external configuration of a screen in a first embodiment. FIG. 2 is a developed plan view mainly showing the external configuration of the screen in the first embodiment. FIG. 11 is a developed plan view mainly showing the external configuration of a screen in a second embodiment. FIG. 13 is a developed plan view mainly showing the external configuration of a screen in a third embodiment. FIG. 13 is a developed plan view mainly showing the external configuration of a screen in a fourth embodiment. FIG. 13 is a developed plan view mainly showing the external configuration of a screen in a fifth embodiment. FIG. 23 is a developed plan view mainly showing the external configuration of a screen in a sixth embodiment. FIG. 23 is a perspective view mainly showing the external configuration of a screen in a seventh embodiment. 13 is an explanatory diagram illustrating an electrical connection between a conductive film, a pair of electrodes, and a variable resistor in a seventh embodiment. FIG. FIG. 23 is a plan view showing a detailed configuration of a variable resistor in the seventh embodiment. 13 is an explanatory diagram illustrating a schematic diagram of a current flowing through a conductive film in a state in which snow locally adheres to the screen in the seventh embodiment. FIG. FIG. 13 is an explanatory diagram showing an equivalent circuit of a variable resistor according to an eighth embodiment.

A. First embodiment:
FIG. 1 is a side view showing the external shape of a sensor containing device 10 according to an embodiment of the present disclosure. FIG. 2 is a front view showing the external shape of the sensor containing device 10 according to the first embodiment. FIG. 1 shows an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In this embodiment, the X-Y plane is a plane parallel to the horizontal direction. The +Z direction indicates a vertically upward direction. In this embodiment, the +X direction and the -X direction are collectively referred to as the "X-axis direction". Similarly, the +Y direction and the -Y direction are collectively referred to as the "Y-axis direction", and the +Z direction and the -Z direction are collectively referred to as the "Z-axis direction". The X-axis, the Y-axis, and the Z-axis shown in other drawings correspond to the X-axis, the Y-axis, and the Z-axis shown in FIG. 1.

1 and 2, the sensor housing device 10 houses the sensor device 200 and the drive unit 210. In this embodiment, the sensor device 200 emits electromagnetic waves as irradiated light R1 and receives reflected waves R2 to identify the position and size of an object. In this embodiment, the electromagnetic waves are infrared laser light. The drive unit 210 moves the orientation of the sensor device 200 up, down, left, and right. For example, a control device (not shown) included in the sensor device 200 controls the drive unit 210 according to a predetermined program to move the orientation of the sensor device 200 in a predetermined direction at a predetermined time interval. Also, for example, a control device (not shown) included in the sensor device 200 controls the drive unit 210 in response to the operation of a monitor on a remote control device capable of wireless communication with the sensor device 200 to move the orientation of the sensor device 200 in a predetermined direction at a predetermined time interval.

As shown in Figures 1 and 2, the sensor housing device 10 includes an upper case part 11, a lower case part 12, and a screen 100. The upper case part 11 is located at the top of the sensor housing device 10 and covers the sensor device 200 and the driving part 210 from above. The upper case part 11 has a semi-dome-shaped external shape. In this embodiment, the upper case part 11 is made of resin. Examples of resin that can be used include polyethylene, engineering plastic, and acrylic resin. Note that instead of resin, the upper case part 11 may be made of a metal such as aluminum or stainless steel.

1 and 2, the lower case part 12 is located at the center and the bottom of the sensor storage device 10, and covers the sensor device 200 and the driving part 210 from the side and below. The top of the lower case part 12 is connected to the bottom of the upper case part 11. In this embodiment, the lower case part 12 is made of the same material as the upper case part 11. An opening part 13 is formed in the upper part of the lower case part 12 in an angle range of approximately 180 degrees along the horizontal direction. The opening part 13 emits the irradiation light R1 to the outside through the screen 100, and transmits the reflected wave R2 arriving from the outside to the sensor device 200. The vertical height of the opening part 13, i.e., the size in the Z-axis direction, is larger than the height range of the electromagnetic wave emission range by the sensor device 200. In addition, the horizontal width of the opening part 13, i.e., the size in the X-axis direction, is larger than 80% of the width of the lower case part 12 and larger than the horizontal range of the electromagnetic wave emission range by the sensor device 200, as shown in FIG. 2.

3 is a perspective view mainly showing the external configuration of the screen 100 in the first embodiment. FIG. 4 is a developed plan view mainly showing the external configuration of the screen 100 in the first embodiment. The screen 100 covers the opening 13. The screen 100 is transparent to electromagnetic waves. Therefore, the sensor device 200 can irradiate the irradiation light R1 to the outside through the screen 100, and can receive the reflected wave R2 arriving from the outside through the screen 100. In this embodiment, the screen 100 is made of glass. Instead of glass, the screen 100 may be made of resin such as polyethylene, engineering plastic, or acrylic resin. As shown in FIG. 4, the screen 100 has a substantially fan-shaped developed planar shape. In the assembled state, in other words, in the used state, the vertical upper side and the vertical lower side of the screen 100 face each other. In other words, these two sides face each other in the Z-axis direction in the used state. The Z-axis direction is also called the facing direction. The screen 100 curves in a direction intersecting this opposing direction (hereinafter also referred to as the "intersecting direction"). Specifically, the screen 100 curves so as to protrude in a direction (-Y direction) away from the sensor device 200 as it moves toward the center in the X-axis direction. In a used state, the vertically lower side of the screen 100 is shorter than the vertically upper side. For this reason, snow and water that adhere to the screen 100 and slide down the surface of the screen 100 due to its own weight will gather and accumulate in a relatively narrow area. A thin film for anti-reflection and water repellency is formed on the outer surface S1 of the screen 100. A conductive film 110, which will be described later, is formed on the inner surface S2 of the screen 100.

3 and 4, the sensor containing device 10 further includes a number of components joined to the screen 100. Specifically, the sensor containing device 10 further includes a conductive film 110 and a pair of electrodes 121 and 122.

The conductive film 110 has a shape similar to that of the screen 100 (similar shape) and a size smaller than that of the screen 100. That is, in this embodiment, the conductive film 110 has a substantially fan-shaped developed planar shape as shown in FIG. 4. Therefore, the length La1 of the vertical upper side L1 (hereinafter referred to as the "first side L1") of the conductive film 110 is longer than the length Lb1 of the vertical lower side L2 (hereinafter referred to as the "second side L2") of the conductive film 110. The conductive film 110 is arranged in a planar shape along the inner surface S2 of the screen 100. The conductive film 110 has electrical conductivity and infrared laser transparency. In this embodiment, the conductive film 110 also has optical transparency. In this embodiment, the conductive film 110 is an ITO film (a film of a mixture of indium oxide and tin oxide). In addition to the ITO film, any conductive film having optical transparency, such as a silver nanowire film or a conductive polymer film, may be used. Alternatively, any conductive film that is transparent to electromagnetic waves (infrared laser) but not transparent to light may be used. The conductive film 110 is formed on the inner surface S2 of the screen 100 by, for example, sputtering, film deposition, or CVD (chemical vapor deposition). In this embodiment, the conductive film 110 is formed so that the vertical upper side of the conductive film 110 is parallel to the vertical upper side of the screen 100, and the vertical lower side of the conductive film 110 is parallel to the vertical lower side of the screen 100.

The pair of electrodes 121, 122 are used to apply a voltage to the conductive film 110. As shown in FIG. 3 and FIG. 4, the pair of electrodes 121, 122 each have a line-shaped external shape. The pair of electrodes 121, 122 are connected to a power source (not shown). As shown in FIG. 3 and FIG. 4, the upper electrode 121 is disposed above the conductive film 110 on the inner surface S2 of the screen 100, and is electrically connected to the first side L1 of the conductive film 110 over the entire first side L1. The lower electrode 122 is disposed below the conductive film 110 on the inner surface S2 of the screen 100, and is electrically connected to the second side L2 of the conductive film 110 over the entire second side L2.

As described above, the length La1 of the first side L1 is longer than the length Lb1 of the second side L2. Therefore, the connection length of the lower electrode 122 electrically connected to the second side L2 is smaller than the connection length of the upper electrode 121 electrically connected to the first side L1. Therefore, the part Ar2 electrically connected to the lower electrode 122 in the conductive film 110 (hereinafter referred to as the "second connection part Ar2") has a higher current density than the average current density in the part Ar1 electrically connected to the upper electrode 121 in the conductive film 110 (hereinafter referred to as the "first connection part Ar1"). This allows the second connection part Ar2 to generate more heat per unit area than the first connection part Ar1. Therefore, even if snow or water attached to the outer surface S1 of the screen 100 moves downward due to its own weight and gathers on the lower side of the screen 100 to locally cover the screen 100, heat sufficient to melt and evaporate the snow or water can be generated in such a part. The above-mentioned first connection site Ar1 is a region of the conductive film 110 that is a predetermined distance away from the upper electrode 121. Similarly, the second connection site Ar2 is a region of the conductive film 110 that is a predetermined distance away from the lower electrode 122. In this embodiment, the "predetermined distance" is 5 mm (millimeters). Note that this is not limited to 5 mm, and may be any value that is smaller than 1/2 the distance from the upper electrode 121 to the lower electrode 122.

In this embodiment, the entire second connection portion Ar2 corresponds to the "high current density portion" in this disclosure. Furthermore, the upper electrode 121 corresponds to the first electrode in this disclosure, and the lower electrode 122 corresponds to the second electrode in this disclosure.

According to the sensor accommodating device 10 of the first embodiment described above, the second connection site Ar2 in the conductive film 110 corresponds to a high current density portion having a higher average current density than the average current density in the first connection site Ar1 electrically connected to the upper electrode 121 in the conductive film 110, so that more heat can be generated in this high current density portion than in other portions. Therefore, more heat can be generated locally in the vicinity of the second edge L2 of the conductive film 110 in the screen 100. Therefore, in cases where snow or water locally covers the lower side of the screen 100, the snow or water can be removed by generating heat.

In addition, the length Lb1 over which the lower electrode 122 is electrically connected to the second side L2 is shorter than the length La1 over which the upper electrode 121 is electrically connected to the first side L1, so the entire second connection site Ar2 can be configured as a high current density area, allowing more heat to be generated at the second connection site Ar2.

B. Second embodiment:
5 is a developed plan view mainly showing the external configuration of the screen 100a in the second embodiment. The sensor containing device 10 of the second embodiment differs from the sensor containing device 10 of the first embodiment in that the sensor containing device 10 of the second embodiment includes a screen 100a instead of the screen 100, a pair of electrodes 121a, 122a instead of the pair of electrodes 121, 122, a conductive film 110a instead of the conductive film 110, and a pair of insulating parts 111a, 111b. The other configurations of the sensor containing device 10 of the second embodiment are the same as those of the sensor containing device 10 of the first embodiment, so the same reference numerals are used for the same configurations and detailed description thereof will be omitted.

As shown in FIG. 5, the screen 100a of the second embodiment has a rectangular shape in plan view. Therefore, the upper electrode 121a and the lower electrode 122a are parallel to each other and have the same length. The pair of electrodes 121a, 122a differs from the pair of electrodes 121, 122 of the first embodiment only in that they have a linear external shape.

The conductive film 110a of the second embodiment has a trapezoidal shape in plan view with the upper side larger than the lower side. The conductive film 110a differs from the conductive film 110 of the first embodiment only in the shape in plan view. The length Lb10 of the second side L20, which is the lower side of the conductive film 110a, is smaller than the length La10 of the first side L1, which is the upper side.

The first insulating portion 111a is disposed adjacent to the conductive film 110a in the -X direction. Similarly, the second insulating portion 111b is disposed adjacent to the conductive film 110a in the +X direction. In other words, the conductive film 110a is sandwiched in the X-axis direction by a pair of insulating portions 111a and 111b. As shown in FIG. 5, the pair of insulating portions 111a and 111b each have a right-angled triangular shape in plan view. The member formed by combining the pair of insulating portions 111a and 111b and the conductive film 110a has a rectangular shape in plan view as shown in FIG. 5. The pair of insulating portions 111a and 111b and the conductive film 110a are bonded to each other. The pair of insulating portions 111a and 111b are both formed of an insulating material. Such an insulating material may be, for example, a synthetic resin such as polyethylene or polyamide. The lower electrode 122a is connected to both the conductive film 110a and the pair of insulating parts 111a, 111b.

As shown in FIG. 5, the length Lb10 in the X-axis direction of the portion of the conductive film 110a that connects to the lower electrode 122a, i.e., the second connection portion Ar12, is shorter than the length La10 in the X-axis direction of the portion of the conductive film 110a that connects to the upper electrode 121a, i.e., the first connection portion Ar11. In addition, no current flows through the portion of the lower electrode 122a that contacts the pair of insulating portions 111a and 111b. Therefore, the average current density in the second connection portion Ar12 is greater than the average current density in the first connection portion Ar11. In the second embodiment, as in the first embodiment, the entire second connection portion Ar12 corresponds to the high current density portion of the present disclosure.

The sensor accommodating device 10 of the second embodiment described above has the same effect as the sensor accommodating device 10 of the first embodiment. In addition, the length Lb10 of the second side L20 is smaller than the length Lb10 of the first side L1, and the first electrode 121a is connected only to the conductive film 110a among the conductive film 110a and the pair of insulating parts 111a and 111b, and the second electrode 122a is connected to both of the conductive film 110a and the pair of insulating parts 111a and 111b. Therefore, even if the length of the second electrode 122a is configured to be longer than the length of the second side L20, the average current density in the high current density portion can be made to be approximately the same as when the length of the second electrode 122a is the same as the second side L20. Therefore, the average current density in the high current density portion can be increased while improving the connectivity between the conductive film 110a and the pair of 111a and 111b by increasing the length of the second electrode 122a.

C. Third embodiment:
6 is a developed plan view mainly showing the external configuration of the screen 100a in the third embodiment. The sensor containing device 10 of the third embodiment is different from the sensor containing device 10 of the first embodiment in that the sensor containing device 10 of the third embodiment includes a screen 100a instead of the screen 100, a pair of electrodes 121a, 122b instead of the pair of electrodes 121, 122, and a conductive film 110b instead of the conductive film 110. Since the other configurations of the sensor containing device 10 of the third embodiment are the same as those of the sensor containing device 10 of the first embodiment, the same components are given the same reference numerals and detailed description thereof is omitted. The screen 100a of the third embodiment is the same as the screen 100a of the second embodiment. Moreover, the upper electrode 121a is the same as the upper electrode 121a of the second embodiment. Therefore, the length La10 of the upper electrode 121a along the X-axis direction is the same as the length La10 of the upper electrode 121a of the second embodiment.

The conductive film 110b of the third embodiment has a rectangular planar shape similar to the screen 100a. The upper side L21 and the lower side L22 of the conductive film 110b are parallel to each other and have the same length.

The length Lb10 of the lower electrode 122b in the X-axis direction in the third embodiment is shorter than the length of the lower side L22 of the conductive film 110b. The lower electrode 122b is electrically connected to approximately the center of the lower side L22 of the conductive film 110b in the X-axis direction. The length Lb10 of the second connection part Ar22, which is the part of the conductive film 110b that connects to the lower electrode 122b, is the same as the length Lb10 of the second connection part Ar12 in the second embodiment. In addition, the length La10 of the first connection part Ar11, which is the part of the conductive film 110b that connects to the upper electrode 121a, is the same as the length La10 of the first connection part Ar11 in the X-axis direction in the second embodiment. Therefore, in the third embodiment, the length Lb10 of the second connection part Ar22 in the X-axis direction is shorter than the length La10 of the first connection part Ar11 in the X-axis direction. Therefore, the average current density at the second connection site Ar22 is greater than the average current density at the first connection site Ar11. In the third embodiment, as in the first embodiment, the entire second connection site Ar22 corresponds to the high current density portion of the present disclosure.

The sensor containing device 10 of the third embodiment described above has the same effect as the sensor containing device 10 of the first embodiment. In addition, since the length of the lower electrode 122b in the X-axis direction is smaller than the length of the upper electrode 121a in the X-axis direction, the average current density at the second connection site Ar22 can be made higher than the average current density at the first connection site Ar11. Therefore, the entire second connection site Ar22 can be configured as a high current density portion.

D. Fourth embodiment:
7 is a developed plan view mainly showing the external configuration of the screen 100a in the fourth embodiment. The sensor containing device 10 of the fourth embodiment is different from the sensor containing device 10 of the first embodiment in that the screen 100a is provided instead of the screen 100, that a pair of electrodes 121a, 122c is provided instead of the pair of electrodes 121, 122, and that a conductive film 110b is provided instead of the conductive film 110. Since the other configurations in the sensor containing device 10 of the fourth embodiment are the same as those in the sensor containing device 10 of the first embodiment, the same reference numerals are given to the same configurations, and detailed description thereof is omitted. The screen 100a of the fourth embodiment is the same as the screen 100a of the second embodiment. In addition, the upper electrode 121a is the same as the upper electrode 121a of the second embodiment. Therefore, the length La10 of the upper electrode 121a along the X-axis direction is the same as the length La10 of the upper electrode 121a of the second embodiment. The conductive film 110b is the same as the conductive film 110b in the third embodiment.

The lower electrode 122c of the fourth embodiment is composed of a pair of first portions 123 and a second portion 124. The lengths of the pair of first portions 123 and the pair of second portions 124 in the X-axis direction are both smaller than the length of the lower side L22 of the conductive film 110b. The second portion 124 is sandwiched between the pair of first portions 123 in the X-axis direction and connected to each of the first portions 123. The lengths (thickness) of the pair of first portions 123 in the Y-axis direction are equal to each other and are equal to the length (thickness) of the upper electrode 121a in the Y-axis direction. The length (thickness) of the second portion 124 in the Y-axis direction is larger than the length (thickness) of the pair of first portions 123 in the Y-axis direction. Therefore, the average current density in the portion Ar32 in the conductive film 110b that connects to the second portion 124 is larger than the average current density in the pair of portions Ar31 that connect to the pair of first portions 123. In the fourth embodiment, the combined portion of the pair of portions Ar31 and Ar32 corresponds to the second connection portion in this disclosure. Also, the portion Ar32 of the conductive film 110b that connects to the second portion 124 of the lower electrode 122c corresponds to the high current density portion in this disclosure.

The sensor containing device 10 of the fourth embodiment described above has the same effect as the sensor containing device 10 of the first embodiment. In addition, since the thickness in the Y-axis direction of the second portion 124 is greater than the thickness in the Y-axis direction of the first portion 123 and greater than the thickness in the Y-axis direction of the upper electrode 121a, the average current density in the portion Ar32 connected to the second portion 124 can be made higher than the average current density in the portion Ar31 connected to the first portion 123 and the average current density in the first connection portion Ar11. Therefore, the portion Ar32 connected to the second portion 124 can be configured as a high current density portion.

E. Fifth embodiment:
8 is a developed plan view mainly showing the external configuration of the screen 100a in the fifth embodiment. The sensor containing device 10 of the fifth embodiment is different from the sensor containing device 10 of the first embodiment in that the sensor containing device 10 of the fifth embodiment includes a screen 100a instead of the screen 100, a pair of electrodes 121a, 122d instead of the pair of electrodes 121, 122, and a conductive film 110b instead of the conductive film 110. Since the other configurations of the sensor containing device 10 of the fifth embodiment are the same as those of the sensor containing device 10 of the first embodiment, the same reference numerals are used for the same configurations, and detailed description thereof will be omitted. The screen 100a of the fifth embodiment is the same as the screen 100a of the second embodiment. Moreover, the upper electrode 121a is the same as the upper electrode 121a of the second embodiment. Therefore, the length La10 of the upper electrode 121a along the X-axis direction is the same as the length La10 of the upper electrode 121a of the second embodiment. The conductive film 110b is the same as the conductive film 110b in the third embodiment.

The lower electrode 122d of the fifth embodiment is composed of a pair of first portions 125 and a second portion 126. The lengths of the pair of first portions 125 and the pair of second portions 126 in the X-axis direction are both smaller than the length of the lower side L22 of the conductive film 110b. The second portion 126 is sandwiched between the pair of first portions 125 in the X-axis direction and is connected to each of the first portions 125. In this embodiment, the second portion 126 is formed of a material having a higher conductivity than the material forming the pair of first portions 125 and the material forming the upper electrode 121a. Specifically, in this embodiment, the second portion 126 is formed of silver (Ag), and the pair of first portions 125 and the upper electrode 121a are formed of copper (Cu). Therefore, the average current density in the portion Ar42 of the conductive film 110b that connects to the second portion 126 is larger than the average current density in the pair of portions Ar41 that connect to the pair of first portions 125. In the fifth embodiment, the combined portion of the pair of portions Ar41 and Ar42 corresponds to the second connection portion in this disclosure. Also, the portion Ar42 of the conductive film 110b that connects to the second portion 126 of the lower electrode 122d corresponds to the high current density portion in this disclosure.

The sensor containing device 10 of the fifth embodiment described above has the same effect as the sensor containing device 10 of the first embodiment. In addition, since the second portion 126 is formed of silver (Ag), which has a higher conductivity than the material (Cu) forming the first portion 125 and has a higher conductivity than the material (Cu) forming the upper electrode 121a, the average current density in the portion Ar42 connected to the second portion 126 can be made higher than the average current density in the portion Ar41 connected to the first portion 125 and the average current density in the first connection portion Ar11. Therefore, the portion connected to the second portion 126 can be configured as a high current density portion.

F. Sixth embodiment:
9 is a developed plan view mainly showing the external configuration of the screen 100a in the sixth embodiment. The sensor containing device 10 of the sixth embodiment is different from the sensor containing device 10 of the first embodiment in that the screen 100a is provided instead of the screen 100, that the pair of electrodes 121a, 122a are provided instead of the pair of electrodes 121, 122, and that the conductive film 110c is provided instead of the conductive film 110. Since the other configurations in the sensor containing device 10 of the sixth embodiment are the same as those in the sensor containing device 10 of the first embodiment, the same reference numerals are given to the same configurations, and detailed description thereof is omitted. The screen 100a of the sixth embodiment is the same as the screen 100a of the second embodiment. In addition, the pair of electrodes 121a, 122a are the same as the pair of electrodes 121a, 122a of the second embodiment.

The conductive film 110c of the sixth embodiment includes a pair of first portions 112a and a second portion 112b. The planar shape of the pair of first portions 112a is the same as the planar shape of the pair of insulating portions 111a, 111b of the second embodiment. The planar shape of the second portion 112b is the same as the planar shape of the conductive film 110a of the second embodiment. The thickness (length in the Y-axis direction) of the second portion 112b is constant and is larger than the thickness (length in the Y-axis direction) of the pair of first portions 112a. Therefore, the average current density in the second portion 112b is larger than the average current density in the pair of first portions 112a. Furthermore, as shown in FIG. 9, the connection length where the lower electrode 122a is connected to the second portion 112b is smaller than the connection length where the upper electrode 121a is connected to the second portion 112b. Therefore, the average current density in the portion Ar52 where the second portion 112b connects to the lower electrode 122a is greater than the average current density in the portion Ar51 where the pair of first portions 112a connect to the lower electrode 122a, and is also greater than the average current density in the first connection portion Ar11. In the sixth embodiment, the portion Ar52 corresponds to the high current density portion of the present disclosure.

The sensor storage device 10 of the sixth embodiment described above has the same effect as the sensor storage device 10 of the first embodiment. In addition, the connection length of the lower electrode 122a connected to the second portion 112b is configured to be shorter than the connection length of the upper electrode 121a connected to the second portion 112b, and the thickness of the second portion 112b is configured to be greater than the thickness of the pair of first portions 112a, so that the average current density of portion Ar52 can be made higher than the average current density of the pair of portions Ar51 and the average current density at the first connection portion Ar11, and such portions can be configured as high current density portions.

G. Seventh embodiment:
FIG. 10 is a perspective view mainly showing the external configuration of the screen 100 in the seventh embodiment. FIG. 11 is an explanatory diagram that shows the electrical connection of the conductive film, the pair of electrodes, and the variable resistor in the seventh embodiment. The sensor accommodating device 10 in the seventh embodiment is different from the sensor accommodating device 10 in the first embodiment in that it includes a conductive film 110d instead of the conductive film 110 and three variable resistors 131, 132, and 133. The other configurations in the sensor accommodating device 10 in the third embodiment are the same as those in the sensor accommodating device 10 in the first embodiment, so the same components are given the same reference numerals and detailed descriptions thereof are omitted. In FIG. 11, for convenience of explanation, the screen 100 and the conductive film 110d are shown as rectangular shapes, but both have a substantially sector-shaped planar shape similar to the conductive film 110 shown in FIG. 4. The three variable resistors 131, 132, and 133 may be collectively referred to as the variable resistor 130.

The conductive film 110d differs from the conductive film 110 of the first embodiment only in that the width (length in the direction from the first side L1 to the second side L2) is smaller than that of the conductive film 110 of the first embodiment.

As shown in Figures 10 and 11, the variable resistor 130 is disposed between the vertically lower side L2a of the conductive film 110d and the lower electrode 122, and is electrically connected to the conductive film 110d and the lower electrode 122. The three variable resistors 131, 132, and 133 are disposed apart from each other in a direction D parallel to the vertically lower side L2a of the conductive film 110d. The variable resistor 131 is disposed at a position corresponding to the center of the conductive film 110d along the direction D. The other two variable resistors 132 and 133 are disposed near both ends of the conductive film 110d along the direction D.

Figure 12 is a plan view showing the detailed configuration of the variable resistor 130. All variable resistors 130 have the same configuration. The variable resistor 130 has a film substrate 140 and an electrical resistance portion 141.

The film substrate 140 is formed from a resin film member. Examples of such resin include polyimide, PET, and PEN. Instead of resin, the film substrate 140 may be formed from glass or a Si (silicon) substrate.

The electrical resistance portion 141 has a zigzag wiring pattern that turns back in the direction D and faces the Z-axis direction. The electrical resistance portion 141 is formed of a conductive material. In this embodiment, the electrical resistance portion 141 is formed of copper. Specifically, the electrical resistance portion 141 is formed by depositing copper on the surface of the film substrate 140 so as to form the above-mentioned wiring pattern. Note that, instead of copper, any type of conductive material that has a lower electrical resistance at low temperatures than at high temperatures, such as silver or iron, may be used. The electrical resistance of the variable resistor 130 having such a configuration has a temperature characteristic. Specifically, the variable resistor 130 has a characteristic that the electrical resistance value of the variable resistor 130 is smaller at low temperatures than at high temperatures. Since the electrical resistance of the variable resistor 130 has the above-mentioned temperature characteristic, in a low-temperature environment, the electrical resistance of the variable resistor 130 is reduced and the current flowing through the conductive film 110 is increased. As a result, the amount of Joule heat generated in the conductive film 110 increases, and the screen 100 can be heated more. Therefore, snow adhering to the screen 100 can be melted, and liquid water adhering to the screen 100 can be evaporated. In a state in which snow, water, etc. are not locally attached to the screen 100, as described below, for example, in a state in which snow, etc. is not attached to the screen 100, or in a state in which snow is evenly and uniformly attached to the screen 100, the current flowing from the upper electrode 121 to the lower electrode 122 is dispersed in direction D, as shown by the dashed arrow in FIG. 11, flows through the conductive film 110d, passes through the three variable resistors 130, and heads toward the lower electrode 122.

Figure 13 is an explanatory diagram showing a schematic diagram of the current flowing through the conductive film 110d when snow is locally attached to the screen 100. In Figure 13, snow Sn attached to the screen 100 is represented by a two-dot chain line. As described above, the screen 100 is curved so that it protrudes in a direction (-Y direction) away from the sensor device 200 as it moves toward the center in the X-axis direction. Therefore, when snow adheres to the screen 100 by wind in the +Y direction, more snow adheres vertically downward to the center of the direction D. In such a situation, the temperature near the variable resistor 131 is lower than the temperature near the other two variable resistors 132 and 133. Therefore, the electrical resistance value of the variable resistor 131 is smaller than the electrical resistance values of the other two variable resistors 132 and 133. As a result, as shown by the dashed arrow in Figure 13, the current from the upper electrode 121 to the variable resistor 131 increases. Therefore, the area vertically below the center of the screen 100 in the direction D can be locally heated, and the snow Sn can be melted. In addition, at this time, a current large enough to flow through the variable resistor 131 does not flow through the variable resistors 132 and 133, so that it is possible to prevent the screen 100 from being deformed due to excessive heating at both ends of the screen 100 in the direction D.

The sensor accommodating device 10 of the seventh embodiment described above has the same effect as the sensor accommodating device 10 of the first embodiment. In addition, since the resistance value of the variable resistor 130 has a characteristic that it is smaller when the temperature is low than when the temperature is high, the current flowing through the variable resistor 130 can be increased at low temperatures, and the part of the conductive film 110d to which the variable resistor 130 is connected can be heated more than other parts. In addition, since the variable resistor 130 is disposed between the lower electrode 122 and the conductive film 110d, the electromagnetic wave transmission area of the conductive film 110d can be prevented from narrowing. For these reasons, according to the sensor accommodating device 10 of the seventh embodiment, the part that needs to be heated can be locally heated while preventing the electromagnetic wave transmission area of the screen 100 from narrowing.

The three variable resistors 131-133 are arranged at a distance from each other between the lower electrode 122 and the conductive film 110d in a direction parallel to the two sides. Therefore, even if the temperatures differ from one another at the multiple locations to which the variable resistors 130 are connected, a current according to each temperature can flow, specifically, the lower the temperature, the more current can flow. This allows each location to be appropriately heated when there is a temperature distribution on the screen 100, such as when it is partially covered with snow and locally cold.

In addition, the variable resistor 130 is composed of a film substrate 140 that is transparent to electromagnetic waves and a wiring pattern formed on the film substrate 140 with a conductive material, so that the variable resistor 130 can prevent the electromagnetic wave transmission area of the screen 100 from becoming narrower.

In addition, because the screen 100 is curved in the cross direction, for example, when the sensor housing device 10 is used outdoors, snow, frost, and the like are likely to adhere locally to the screen 100 depending on environmental conditions such as wind direction. However, even in such a situation, since the variable resistor 130 is disposed in the area where snow, etc., adheres locally, it is possible to locally heat such an area and melt the snow, etc.

In addition, in the sensor housing device 10, snow that has adhered to the upper part of the screen 100 tends to slide down and collect due to its own weight near the vertically lower edge of the screen 100, making the area prone to low temperatures. However, even in such a situation, the variable resistor 130 is located in an area that is prone to low temperatures, so that such an area can be locally heated to remove snow, water, etc.

In addition, since the variable resistor 130 is disposed between the lower electrode 122 and the conductive film 110, the current flowing through the conductive film 110 can be controlled according to the temperature of the vertically lower part where snow that has adhered to the upper part of the screen 100 slides down due to its own weight and accumulates, which tends to become cold, and snow, water, etc. can be removed more reliably.

H. Eighth embodiment:
14 is an explanatory diagram showing an equivalent circuit of the variable resistor 130a of the eighth embodiment. The sensor accommodating device 10 of the eighth embodiment differs from the sensor accommodating device 10 of the seventh embodiment in that it includes a variable resistor 130a instead of the variable resistor 130. The other configurations of the sensor accommodating device 10 of the eighth embodiment are the same as those of the sensor accommodating device 10 of the seventh embodiment, so the same components are given the same reference numerals and detailed descriptions thereof are omitted. In the eighth embodiment, the three variable resistors 130a are arranged in the same positions as the variable resistors 130 of the seventh embodiment.

The variable resistor 130a of the eighth embodiment includes the variable resistor 130 described above, a transistor 151, and a pull-down resistor 152. The variable resistor 130 of this embodiment is disposed between the gate electrode of the transistor 151 and a power supply VCC. The power supply VCC is the same as the power supply to which the upper electrode 121 is connected. The collector electrode of the transistor 151 is connected to the conductive film 110d. The emitter electrode of the transistor 151 is connected to the ground GND via the lower electrode 122. The pull-down resistor 152 is disposed between the variable resistor 130 and the lower electrode 122.

In the variable resistor 130a having the above configuration, when the temperature of the variable resistor 130a falls below a predetermined temperature, the resistance value of the variable resistor 130 falls below the predetermined resistance value, and a voltage capable of turning on the transistor 151 is applied to the gate electrode of the transistor 151. When the gate electrode of the transistor 151 is turned on, a current flows through the conductive film 110d, and the screen 100 is heated. Therefore, as in the seventh embodiment, in the variable resistor 130a located near an area of the screen 100 where the temperature has dropped due to snow adhering thereto, the transistor 151 is turned on and a current flows through the conductive film 110d, heating the corresponding area and removing the snow, etc.

On the other hand, in the case of the variable resistor 130a, when the temperature of the variable resistor 130a is higher than a predetermined temperature, almost no current flows through the variable resistor 130. This makes it possible to suppress Joule heat generated by the current flowing through the variable resistor 130, and to prevent the variable resistor 130 from becoming too hot. In addition, when snow or the like is not attached to the screen 100 and there is no need to heat the screen 100, the screen 100 does not need to be heated, which allows power saving to be achieved.

The sensor containing device 10 of the eighth embodiment described above has the same effect as the sensor containing device 10 of the seventh embodiment. In addition, since the variable resistor 130 is connected to the gate electrode of the transistor 151 arranged between the conductive film 110 and the lower electrode 122, when the temperature of the variable resistor 130a is equal to or lower than a predetermined temperature, a current can be passed through the conductive film 110 to heat the screen 100. When the temperature of the variable resistor 130a is higher than the predetermined temperature, heat generation in the variable resistor 130 can be suppressed by preventing current from passing through the variable resistor 130, and the screen 100 can be prevented from being unnecessarily heated, thereby realizing power saving.

I. Other embodiments:
(I1) In the second to sixth embodiments, the screen 100a and the conductive films 110a to 110c have a rectangular shape in plan view, but they may all be substantially sector-shaped as in the first embodiment. For example, in the second embodiment, the conductive film 110 may be provided with insulating parts similar to the pair of insulating parts 111a and 111b at both ends in FIG. 4. In the third embodiment, the length of the lower electrode 122 may be shortened in FIG. In the fourth embodiment, the lower electrode 122 may be configured to have a configuration in which multiple parts having different lengths (thicknesses) in the Y-axis direction are connected in FIG. In the fifth embodiment, the lower electrode 122 may be configured to have a configuration in which multiple parts having different conductivities are connected in FIG. In the sixth embodiment, the conductive film 110 may be configured to have a configuration in which multiple parts having different thicknesses are connected in FIG. 4.

(I2) In the second embodiment, the pair of insulating parts 111a, 111b are arranged to sandwich the conductive film 110a, but the present disclosure is not limited to this. A portion corresponding to one of the pair of insulating parts 111a, 111b may be configured as part of the conductive film 110a. Even in such a configuration, the length in the X-axis direction of the part of the conductive film 110a that connects to the lower electrode 122a can be configured to be shorter than the length in the X-axis direction of the first connection part Ar11, so that the same effect as in the second embodiment is achieved. In addition, the planar shape of at least one of the pair of insulating parts 111a, 111b is not limited to a right-angled triangle, and may be any polygonal shape.

(I3) In the third embodiment, the lower electrode 122b was electrically connected to approximately the center of the lower side L22 of the conductive film 110b in the X-axis direction, but it may be electrically connected to another part of the lower side L22.

(I4) In the fourth embodiment, the lower electrode 122c has a configuration in which the second portion 124 is sandwiched between a pair of first portions 123 in the X-axis direction, but the present disclosure is not limited to this. The lower electrode 122c may have a configuration in which one each of the first portion 123 and the second portion 124 are connected.

(I5) In the fifth embodiment, the second portion 126 is formed of silver (Ag), and the pair of first portions 125 and the upper electrode 121a are formed of copper (Cu), but the present disclosure is not limited to this. For example, the second portion 126 may be formed of copper, and the first portion 125 and the electrode 121a may be formed of stainless steel (SUS). Also, for example, the second portion 126 may be formed of gold (Au), and the first portion 125 and the electrode 121a may be formed of silver. That is, in general, the second portion 126 may be formed of any material having a higher conductivity than the material forming the pair of first portions 125 and the material forming the upper electrode 121a.

(I6) In the sixth embodiment, the pair of first portions 112a are arranged to sandwich the second portion 112b, but the present disclosure is not limited to this. A portion of the pair of first portions 112a corresponding to one of the pair of first portions 112a may be configured as part of the second portion 112b. Even in this configuration, the length in the X-axis direction of the portion of the second portion 112b that connects to the lower electrode 122a can be configured to be shorter than the length in the X-axis direction of the first connection portion Ar11, thereby achieving the same effect as in the sixth embodiment. Furthermore, the planar shape of at least one of the pair of first portions 112a is not limited to a right-angled triangle, and may be any polygonal shape.

(I7) In the seventh and eighth embodiments, the number of variable resistors 130, 130a was three, but any number may be used. Specifically, the number may be one or any number of two or more. Also, the variable resistors 130, 130a were arranged apart from each other in the direction D, but instead, they may be arranged in contact with each other.

(I8) A PTC (Positive Temperature Coefficient) thermistor may be used instead of the variable resistor 130 in the seventh and eighth embodiments. In other words, in general, any type of variable resistor having a characteristic that the electrical resistance value is smaller at low temperatures compared to at high temperatures may be used in the sensor housing device of the present disclosure.

(I9) In each embodiment, the screen 100 is curved in the cross direction, but instead of being curved, it may be bent. Alternatively, it may be flat. Also, in each embodiment, the vertically lower side of the screen 100 is the same length as or shorter than the vertically upper side, but the present disclosure is not limited to this. The vertically lower side of the screen 100 may be longer than the vertically upper side.

(I10) In the seventh and eighth embodiments, the variable resistors 130 and 130a were arranged between the conductive film 110 and the lower electrode 122, but instead of or in addition to this, they may be arranged between the conductive film 110 and the electrode 121.

(I11) In each embodiment, the electromagnetic waves emitted and received by the sensor device 200 are infrared lasers, but they are not limited to infrared lasers and may be electromagnetic waves of any wavelength. For example, they may be near-infrared light, far-infrared light, or microwaves. Furthermore, the sensor device 200 may be configured to only receive electromagnetic waves, instead of emitting and receiving them. For example, the sensor device 200 may be configured with an imaging device that receives visible light and forms an image. Even in such a configuration, it is possible to prevent visible light passing through the screens 100, 100a from being blocked by snow adhering to the screens 100, 100a.

(I12) In the screen 100a of the fourth embodiment, the first portion 123 may be configured as an electrode with almost no thickness, and the second portion 124 may be configured to have an electrode thickness. An "electrode with almost no thickness" means an electrode that is very thin for a heater electrode of such a screen, for example, an electrode with a thickness of 1 mm or less. In contrast, the electrode thickness means a thickness greater than 1 mm, for example. Also, for example, the electrode thickness has a broad concept that includes a state in which the portion where the electrode thickness is provided is more than twice as thick as the portion where the electrode thickness is not provided. Even with such a configuration, the same effect as the screen 100a of the fourth embodiment can be achieved.

The present disclosure is not limited to the above-described embodiments, and can be realized in various configurations without departing from the spirit of the present disclosure. For example, the technical features in each embodiment corresponding to the technical features in each form described in the Summary of the Invention column can be replaced or combined as appropriate to solve some or all of the above-described problems or to achieve some or all of the above-described effects. Furthermore, if a technical feature is not described in this specification as essential, it can be deleted as appropriate.

10...sensor housing device, 11...upper case part, 12...lower case part, 13...opening, 100, 100a...screen, 110, 110a to 110d...conductive film, 111a, 111b...insulating part, 112a...first part, 112b...second part, 121, 121a...upper electrode, 122, 122a to 122d...lower electrode, 130...variable resistor, 130a...variable resistor, 131...variable resistor, 132...variable resistor, 133...variable Resistor, 140...film substrate, 141...electrical resistance portion, 151...transistor, 152...pull-down resistor, 200...sensor device, 210...drive portion, Ar1, Ar11...first connection portion, Ar2, Ar12, Ar22, Ar32, Ar42, Ar52...second connection portion, D...direction, GND...ground, L1, L21...first edge, L2, L20, L22...second edge, R1...irradiated light, R2...reflected wave, Sn...snow, VCC...power supply

Claims (14)

A sensor housing device that houses a sensor that receives electromagnetic waves,
an opening for receiving the electromagnetic wave;
a screen that covers the opening and is transparent to the electromagnetic waves;
a conductive film disposed in a planar shape along a surface of the screen, the conductive film having electrical conductivity and electromagnetic wave permeability;
a first electrode electrically connected to a first side of the conductive film for applying a voltage to the conductive film;
a second electrode electrically connected to a second side of the conductive film opposite to the first side, for applying a voltage to the conductive film;
Equipped with
a second connection portion of the conductive film electrically connected to the second electrode includes a high current density portion having an average current density higher than an average current density of a first connection portion of the conductive film electrically connected to the first electrode ,
the first electrode is electrically connected to the first side over the entirety of the first side,
the second electrode is electrically connected to the second side over the entire second side,
The length of the second side is smaller than the length of the first side,
The second side is a side located below the first side when the sensor housing device is in a use state.
Sensor housing device. The sensor housing device according to claim 1 ,
an insulating portion adjacent to the conductive film in a direction perpendicular to a direction from the first side to the second side,
the first electrode is connected only to the conductive film among the conductive film and the insulating portion;
The second electrode is connected to both of the conductive film and the insulating portion. The sensor housing device according to claim 1 ,
A sensor containing device, wherein a length of the second electrode along the second side is smaller than a length of the first electrode along the first side. The sensor housing device according to claim 1 ,
the first electrode is electrically connected to the first side along the entirety of the first side;
the second electrode has a first portion and a second portion, each of which has a length along the second side smaller than the second side, and is electrically connected to the second side at the first portion and the second portion,
A sensor containing device, wherein a thickness in a cross direction, which is a direction that crosses the second side in the second part and is parallel to the thickness direction of the conductive film , is greater than a thickness in the cross direction in the first part and is also greater than a thickness in the cross direction in the first electrode. The sensor containing device according to claim 1 or 4 ,
the first electrode is electrically connected to the first side along the entirety of the first side;
the second electrode has a first portion and a second portion, each of which has a length along the second side smaller than the second side, and is electrically connected to the second side at the first portion and the second portion,
The second portion is formed of a material having a higher electrical conductivity than a material forming the first portion and a material having a higher electrical conductivity than a material forming the first electrode. The sensor housing device according to claim 1,
The conductive film is
A first portion;
a second portion adjacent to the first portion in a direction perpendicular to a direction from the first side to the second side, the second portion having a thickness greater than that of the first portion;
Including,
A connection length over which the second electrode is connected to the second portion is shorter than a connection length over which the first electrode is connected to the second portion. The sensor housing device according to claim 1 ,
the first electrode is electrically connected to the first side along the entirety of the first side;
the second electrode is electrically connected to the second side along the entirety of the second side and has an electrode thickness partially provided thereon;
The electrode thickness is at least twice as thick as a thickness of a portion of the second electrode excluding a portion where the electrode thickness is provided. The sensor housing device according to any one of claims 1 to 7 ,
a variable resistor disposed between at least one of a pair of electrodes consisting of the first electrode and the second electrode and the conductive film, and connected to the one of the pair of electrodes and the conductive film;
The variable resistor has a characteristic that its electrical resistance value is smaller when the temperature is low than when the temperature is high. The sensor containing device according to claim 8 ,
A plurality of the variable resistors are provided,
The plurality of variable resistors are disposed apart from one another in a direction parallel to the first side and the second side between at least one of the pair of electrodes and the conductive film. The sensor housing device according to claim 8 or 9 ,
The variable resistor is configured from a substrate that is transparent to the electromagnetic waves and a wiring pattern formed on the substrate using a conductive material. The sensor housing device according to any one of claims 8 to 10 ,
The screen is curved in a cross direction that crosses the opposing direction in which the first side and the second side face each other. The sensor containing device according to claim 11 ,
In a usage state, the sensor containing device is disposed so that the facing direction is parallel to a vertical direction,
The screen has a contour shape with two sides parallel to the first side and the second side, and of the two sides included in the contour shape, the length of the side on the vertically lower side in the usage state is shorter than the length of the side on the vertically upper side, in the sensor containing device. The sensor housing device according to any one of claims 8 to 12 ,
In a usage state, the sensor containing device has the pair of electrodes disposed vertically opposite to each other with the conductive film therebetween,
The variable resistor is disposed between the conductive film and a vertically lower electrode of the pair of electrodes. A sensor housing device that houses a sensor that receives electromagnetic waves,
an opening for receiving the electromagnetic wave;
a screen that covers the opening and is transparent to the electromagnetic waves;
a conductive film disposed in a planar shape along a surface of the screen, the conductive film having electrical conductivity and electromagnetic wave permeability;
a first electrode electrically connected to a first side of the conductive film for applying a voltage to the conductive film;
a second electrode electrically connected to a second side of the conductive film opposite to the first side, for applying a voltage to the conductive film;
Equipped with
a connection length of the second electrode connected to the second side is smaller than a connection length of the first electrode connected to the first side;
the first electrode is electrically connected to the first side over the entirety of the first side,
the second electrode is electrically connected to the second side over the entire second side,
The length of the second side is smaller than the length of the first side,
The second side is a side located below the first side when the sensor housing device is in a use state.
Sensor housing device.

Images