JP7514740B2 - Processing device and method for manufacturing processed products - Google Patents

Description

The present invention relates to a technique for a processing device and a method for manufacturing a processed product.

Patent Document 1 discloses a substrate holding device that includes a base that supports the substrate, a clamper that presses the substrate against the base, and an air cylinder that raises and lowers the clamper. In this substrate holding device, the clamper can be raised and lowered relative to the base by operating the air cylinder, and the substrate can be held between the clamper and the base.

Japanese Patent Application Laid-Open No. 7-33973

However, in a substrate holding device such as that described in Patent Document 1, if it is desired to raise and lower not only the clamper but also the base, it is necessary to provide a separate actuator (air cylinder) for raising and lowering the base. This increases the number of parts, which may complicate the structure of the device and increase costs.

The present invention has been made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a processing device and a method for manufacturing a processed product that are capable of moving two holding parts for holding a workpiece while preventing the structure from becoming too complicated.

The problem to be solved by the present invention is as described above, and in order to solve this problem, the processing device of the present invention comprises a first holding part arranged below a workpiece, a second holding part arranged above the workpiece, a common actuator that moves the first holding part and the second holding part so that the workpiece is sandwiched between the first holding part and the second holding part, a first regulating part that regulates downward movement of the first holding part, and a second regulating part that regulates downward movement of the second holding part, the actuator being fixed to the underside of the first holding part, and when the workpiece is sandwiched between the first holding part and the second holding part, the first regulating part does not regulate downward movement of the first holding part, and the second regulating part regulates downward movement of the second holding part. The actuator restricts downward movement of the workpiece, and when the actuator releases the hold of the workpiece, the actuator separates the second holding part from the first holding part, and when the workpiece is clamped between the first holding part and the second holding part, when the actuator separates the second holding part from the first holding part, the first holding part descends until the first restricting part restricts the downward movement of the first holding part, and then the second holding part rises and the restriction by the second restricting part is released.The actuator is provided with a work holding mechanism , a processing mechanism which processes the workpiece held by the work holding mechanism, and a transport mechanism which pulls out the workpiece wound in a roll and transports it to the work holding mechanism, and also winds up the workpiece processed by the processing mechanism into a roll .

The manufacturing method of the processed product according to the present invention processes the workpiece using the processing device.

The present invention makes it possible to prevent the structure from becoming complicated.

FIG. 2 is a schematic side view showing the overall configuration of the laser processing apparatus. A front cross-sectional view showing the holding mechanism (left side: when not holding a film, right side: when holding a film). FIG. 4 is a plan view showing the holding mechanism (particularly the lower holding portion). FIG. FIG. 4 is a side cross-sectional view showing the configuration of a stopper mechanism and an actuator. 1A is a side view showing the holding mechanism when the film is not being held, and FIG. FIG. 4 is a side view showing the holding mechanism in a state where the film is being held. 1A is a schematic plan view showing a film having a plurality of holes formed therein, (b) a schematic diagram showing the trajectory of a laser beam, and (c) a schematic diagram showing the shape of holes formed in the film. 1A is a schematic plan view showing a portion for sandwiching a film, FIG. 1B is a schematic plan view showing a modified example of the portion for sandwiching a film, and FIG. 1C is a schematic plan view showing a modified example of the portion for sandwiching a film.

The laser processing device 1 according to the present embodiment described below is for processing a film F, which is a workpiece (object to be processed). First, the film F to be processed will be described.

In this embodiment, the film F to be processed by the laser processing device 1 is assumed to be a release film used in a resin molding device. For example, a polystyrene film, a PET film, a polymethylpentene film, etc. can be used as this release film. The release film is adsorbed and held on the surface of the mold in the resin molding device so that the resin does not adhere to the mold.

Here, in order to adsorb and hold the wafer or the like that is to be resin molded onto the mold that adsorbs and holds the release film, it is necessary to form holes in the release film large enough to allow air to pass through. In order to obtain such a release film, the laser processing device 1 according to this embodiment forms multiple holes F1 (see FIG. 8) in the film F (performs hole drilling).

<Overall configuration of laser processing device 1>
Next, the configuration of the laser processing device 1 according to this embodiment will be described with reference to Fig. 1. In the following description, the directions indicated by the arrows U, D, L, R, F, and B shown in the figure are defined as the upward direction, downward direction, leftward direction, rightward direction, forward direction, and backward direction, respectively.

The laser processing device 1 mainly comprises an unwinding mechanism 10, a winding mechanism 20, a holding mechanism 100, an upper dust collection mechanism 30, a lower dust collection mechanism 40, and a laser mechanism 50.

<Unwinding mechanism 10>
The unwinding mechanism 10 supplies the film F wound in a roll to a holding mechanism 100 described below. The unwinding mechanism 10 mainly includes an unwinding roller 11, a guide roller 12, and an ionizer 13.

The unwinding roller 11 supports the film F wound into a roll. The unwinding roller 11 is formed in a cylindrical shape and is arranged with its axis oriented horizontally (in the depth direction of the paper in FIG. 1). The unprocessed film F is wound around the unwinding roller 11. A drive source (motor, etc.) (not shown) is provided on the unwinding roller 11. By applying an appropriate rotational force to the unwinding roller 11 by the drive source, an appropriate tension can be applied to the film F pulled out from the unwinding roller 11.

The guide rollers 12 guide the film F pulled out from the unwinding roller 11 to the holding mechanism 100. The guide rollers 12 are cylindrical and arranged with their axis oriented horizontally (into the depth direction of the paper in FIG. 1). There are three guide rollers 12. The film F pulled out from the unwinding roller 11 is wound around the three guide rollers 12 in sequence. The three guide rollers 12 provide the film F with an appropriate tension and guide it while changing its direction to an appropriate direction.

The ionizer 13 removes static electricity from the film F. The ionizer 13 can neutralize the static electricity from the film F with ions. The ionizer 13 is positioned midway along the path through which the film F passes, guided by the guide roller 12.

<Winding mechanism 20>
The winding mechanism 20 winds up the film F after the processing by the laser mechanism 50. The winding mechanism 20 mainly includes a winding roller 21, a guide roller 22, a feed roller 23, an adhesive roller 24, and an ionizer 25.

The winding roller 21 winds up the film F into a roll. The winding roller 21 is formed in a cylindrical shape and is positioned with its axis oriented horizontally (in the depth direction of the paper in FIG. 1). The film F that has been processed is wound around the winding roller 21. A drive source (motor, etc.) (not shown) is provided on the winding roller 21. By applying an appropriate rotational force to the winding roller 21 by the drive source, an appropriate tension can be applied to the film F being wound around the winding roller 21.

The guide rollers 22 guide the film F that has been processed by the laser mechanism 50 (that has passed through the holding mechanism 100) to the winding roller 21. The guide rollers 22 are cylindrical and are arranged with their axis oriented horizontally (into the depth direction of the paper in FIG. 1). There are three guide rollers 22. The film F that has been processed by the laser mechanism 50 is wound in sequence around the three guide rollers 22 and the feed roller 23, which will be described later. The film F is given an appropriate tension by the three guide rollers 22 and the feed roller 23, which will be described later, and is guided to the winding roller 21 while being turned in an appropriate direction.

The feed roller 23 feeds the film F from the unwind roller 11 toward the take-up roller 21. The feed roller 23 is formed in a cylindrical shape and is arranged with its axis oriented horizontally (in the direction of the depth of the paper in FIG. 1). The feed roller 23 is provided with an anti-slip roller 23a that sandwiches the film F between the feed roller 23 and the feed roller 23 to prevent the wound film F from slipping relative to the feed roller 23. The anti-slip roller 23a is formed of an elastic material such as rubber. The feed roller 23 is provided with a drive source (motor, etc.) not shown. By rotating the feed roller 23 with the drive source, the film F can be fed from the unwind roller 11 toward the take-up roller 21.

The adhesive roller 24 is used to remove dirt and processing debris (contamination) that has adhered to the film F after processing. The adhesive roller 24 is formed in a cylindrical shape and is positioned with its axis oriented horizontally (in the depth direction of the paper in Figure 1). Two adhesive rollers 24 are provided. Each adhesive roller 24 is positioned so as to sandwich the film F between the guide roller 22 and the feed roller 23.

The ionizer 25 removes static electricity from the film F. The ionizer 25 can neutralize the static electricity from the film F with ions. The ionizer 25 is positioned midway along the path of the film F, which is guided by the guide roller 22 and the feed roller 23.

The device for removing static electricity from the film F is not limited to the above-mentioned ionizer 13 and ionizer 25. For example, it is also possible to use a static elimination brush or the like that can remove static electricity by contacting the surface of the film F.

<Retention mechanism 100>
The holding mechanism 100 sandwiches and holds the film F when processing the film F. The holding mechanism 100 can hold the film F by sandwiching the film F from above and below using a lower holding part 120 and an upper holding part 130. The specific configuration of the holding mechanism 100 will be described later.

<Upper dust collecting mechanism 30>
The upper dust collection mechanism 30 collects fumes, particulate matter, and the like that are generated when the film F is processed. The upper dust collection mechanism 30 mainly includes an upper housing 31 and an upper duct 32.

The upper housing 31 covers the holding mechanism 100 (more specifically, the upper surface of the upper holding part 130 described later) from above. The upper housing 31 is formed in a hollow box shape. The upper housing 31 is disposed immediately above the holding mechanism 100. The lower surface of the upper housing 31 (the portion facing the upper holding part 130) is open.

The upper duct 32 connects the inside and outside of the upper housing 31. The upper duct 32 is formed in a cylindrical shape. The upper duct 32 is provided at the top of the upper housing 31. The upper duct 32 is connected to a fan (not shown). By driving the fan, the air inside the upper housing 31 can be exhausted through the upper duct 32.

<Lower dust collection mechanism 40>
The lower dust collection mechanism 40 collects fumes, particulate matter, and the like that are generated when the film F is processed. The lower dust collection mechanism 40 mainly includes a lower housing 41 and a lower duct 42.

The lower housing 41 covers the holding mechanism 100 (more specifically, the lower surface of the lower holding part 120 described below) from below. The lower housing 41 is formed in a hollow box shape. The lower housing 41 is disposed immediately below the holding mechanism 100. The upper surface of the lower housing 41 (the portion facing the lower holding part 120) is open. The lower housing 41 is fixed to the lower holding part 120.

The lower duct 42 connects the inside and outside of the lower housing 41. The lower duct 42 is formed in a cylindrical shape. The lower duct 42 is provided at the bottom of the lower housing 41. The lower duct 42 is connected to a fan (not shown). By driving the fan, air inside the lower housing 41 can be exhausted through the lower duct 42.

<Laser mechanism 50>
The laser mechanism 50 uses laser light to process the film F. The laser mechanism 50 mainly includes a processing head 51.

The processing head 51 irradiates laser light. The processing head 51 is provided on the top of the upper housing 31. The processing head 51 can irradiate laser light oscillated by an oscillator (not shown) downward. The processing head 51 can arbitrarily change the direction of laser light irradiation. The laser light irradiated from the processing head 51 is irradiated onto the film F held by the holding mechanism 100 through the inside of the upper housing 31. By irradiating the film F with laser light in this manner, the film F can be processed.

The laser used in the laser mechanism 50 can be various lasers such as a UV laser or a _CO2 laser.

The operation of each part of the laser processing device 1 described above is controlled by a control unit (not shown) that includes an arithmetic processing unit such as a CPU, a memory unit such as a RAM or a ROM, etc.

<Processing method using laser processing device 1>
Next, a method for processing the film F using the laser processing apparatus 1 configured as described above (a method for manufacturing the film F having the holes F1) will be described.

When the feed roller 23 rotates clockwise in a side view (see FIG. 1), the film F moves from the unwind roller 11 to the take-up roller 21 while being guided by the guide roller 12 etc. Specifically, the film F pulled out from the unwind roller 11 passes to the right between the lower holding part 120 and the upper holding part 130 of the holding mechanism 100 and is wound up by the take-up roller 21.

At this time, static electricity is removed from the film F pulled out from the unwinding roller 11 by the ionizer 13 before it reaches the holding mechanism 100. When the portion of the film F to be processed (a processing target range P (see FIG. 3) described below) reaches the holding mechanism 100, the feed roller 23 is stopped and the movement of the film F is halted. The film F is then sandwiched and held from above and below by the holding mechanism 100 (the lower holding portion 120 and the upper holding portion 130). Holding the film F in this manner makes it possible to prevent the film F from shaking or wrinkling due to the effects of vibration or air.

With the film F held by the holding mechanism 100, the upper dust collection mechanism 30 and the lower dust collection mechanism 40 are operated, and the laser mechanism 50 performs hole drilling on the film F. This allows multiple holes F1 to be formed in the film F while collecting fumes, etc.

When the processing of the area held by the holding mechanism 100 is completed, the lower holding part 120 and the upper holding part 130 move up and down so as to move away from the film F, and the film F is released from its hold. In this state, the feed roller 23 rotates again, and the film F moves toward the take-up roller 21.

Before the film F processed by the laser mechanism 50 reaches the winding roller 21, static electricity is removed by the ionizer 25 and contamination is removed by the adhesive roller 24. The film F is then wound onto the winding roller 21.

By repeatedly moving the film F a fixed distance and processing it with the laser mechanism 50, a roll of film F with multiple holes F1 formed therein can be manufactured.

<Specific Configuration of Retention Mechanism 100>
Next, the configuration of the holding mechanism 100 will be described with reference to FIGS.

As described above, the holding mechanism 100 clamps and holds the film F when the film F is processed. The holding mechanism 100 mainly comprises a base portion 110, a lower holding portion 120, an upper holding portion 130, an upper stopper mechanism 140, a lower stopper mechanism 150, and an actuator 160.

The base portion 110 shown in FIG. 2 supports each member (such as the upper holding portion 130 described below) that constitutes the holding mechanism 100. The base portion 110 is formed in a rectangular parallelepiped shape and is placed on the floor surface.

The lower holding portion 120 shown in Figures 2 to 4 is a member that can contact the lower surface of the film F. The lower holding portion 120 is formed in a rectangular frame shape when viewed from above. Specifically, the lower holding portion 120 is formed by providing a rectangular opening 121 in the center of a member that is a rectangular plate shape when viewed from above. The front-to-rear width of the opening 121 is formed to be slightly smaller than the front-to-rear width of the film F.

A sponge 122 is provided on the upper surface of the lower holding portion 120. The sponge 122 is an elastic member. The sponge 122 is arranged so as to surround the entire circumference of the opening 121. As a result, the sponge 122 is arranged in the shape of a rectangular frame in a plan view.

The upper holding portion 130 shown in Figures 2 and 4 is a member that can contact the upper surface of the film F. The upper holding portion 130 is formed in a shape (rectangular frame shape in plan view) that is generally the same as the lower holding portion 120. That is, the upper holding portion 130 is formed by providing a rectangular opening 131 in the center of a member that is rectangular plate-like in plan view. The opening 131 is formed to be slightly smaller than the opening 121 of the lower holding portion 120. Specifically, the front-to-back width and left-to-right width of the opening 131 are formed slightly smaller than the front-to-back width and left-to-right width of the opening 121, respectively (see the enlarged portion in Figure 2).

The upper holding part 130 is disposed above the lower holding part 120. The upper holding part 130 is disposed so that its outer shape matches the outer shape of the lower holding part 120 in a plan view. In this way, the upper holding part 130 is disposed so as to face the lower holding part 120 vertically.

The upper stopper mechanism 140 shown in Figures 2 to 5 guides the lower holding part 120 and the upper holding part 130 up and down, and regulates the downward movement of the upper holding part 130 at a predetermined position. As shown in Figure 5, the upper stopper mechanism 140 mainly comprises a lower bushing 141, an upper bushing 142, a movable shaft 143, and a stopper 144.

The lower bushing 141 is fixed to the base portion 110 and guides the movable shaft 143 described below. The lower bushing 141 is formed in a cylindrical shape and is arranged with its axis facing vertically. The lower part of the lower bushing 141 is fixed in a state where it is inserted into a hole 111 formed to penetrate the base portion 110 from top to bottom.

The upper bushing 142 is fixed to the lower holding part 120 and guides the movable shaft 143 described below. The upper bushing 142 is formed in a cylindrical shape and is arranged with its axis facing vertically. The upper bushing 142 is arranged coaxially with the lower bushing 141. The upper bushing 142 is fixed in a state where it is inserted into a hole 123 formed so as to penetrate the lower holding part 120 from top to bottom.

The movable shaft 143 guides the lower holding part 120 and the upper holding part 130 up and down. The movable shaft 143 is formed in a cylindrical shape and is arranged with its axis facing vertically. The movable shaft 143 is inserted into the lower bush 141 and the upper bush 142. The movable shaft 143 can move along the axial direction of the lower bush 141 and the upper bush 142. The upper end of the movable shaft 143 is fixed to the upper holding part 130.

The stopper 144 restricts the downward movement of the movable shaft 143 at a predetermined position. The stopper 144 is disposed between the lower bush 141 and the upper bush 142 in the up-down direction. The stopper 144 is fixed to the movable shaft 143 by being fitted into the movable shaft 143 from the outside. As a result, the stopper 144 is disposed so as to protrude radially outward from the outer circumferential surface of the movable shaft 143.

The upper stopper mechanism 140 configured in this manner is provided at each of the four corners of the lower holding part 120, which is rectangular in plan view, as shown in FIG. 3.

The lower stopper mechanism 150 shown in Figures 2 to 5 restricts the downward movement of the lower holding part 120 at a predetermined position. As shown in Figure 5, the lower stopper mechanism 150 mainly comprises a fixed shaft 151 and a stopper 152.

The fixed shaft 151 comes into contact with the stopper 152, which will be described later. The fixed shaft 151 is formed in a cylindrical shape and is arranged with its axis oriented vertically. The lower end of the fixed shaft 151 is fixed to the upper surface of the base part 110. The fixed shaft 151 is arranged so as to protrude upward from the base part 110.

The stopper 152 restricts the downward movement of the lower holding part 120 at a predetermined position. The stopper 152 is formed in a cylindrical shape and is arranged with its axis oriented vertically. The stopper 152 is arranged coaxially with the fixed shaft 151. The stopper 152 is fixed to the underside of the lower holding part 120. The stopper 152 is arranged so as to protrude downward from the lower holding part 120.

The lower stopper mechanism 150 configured in this manner is provided at each of the four corners of the lower holding portion 120, which is rectangular in plan view, as shown in FIG. 3.

The actuator 160 shown in Figures 2 to 5 moves the lower holding part 120 and the upper holding part 130 up and down. The actuator 160 is composed of an air cylinder. As shown in Figure 5, the actuator 160 mainly comprises a cylinder body 161 and a rod 162.

The cylinder body 161 supports the rod 162, which will be described later, in an extendable manner. The cylinder body 161 is fixed to the lower surface of the lower holding part 120.

The rod 162 is slidable (extendable) relative to the cylinder body 161. The rod 162 is formed in a cylindrical shape and is arranged with its axis facing vertically. The rod 162 is arranged so as to protrude upward from the cylinder body 161. The rod 162 is inserted into a hole 124 formed so as to penetrate the lower holding part 120 from top to bottom, and is arranged so as to protrude upward from the lower holding part 120. The upper end of the rod 162 is fixed to the upper holding part 130. By appropriately supplying air to the cylinder body 161, the rod 162 can be slid up and down relative to the cylinder body 161. Note that the rod 162 does not necessarily need to be fixed to the upper holding part 130. For example, it is also possible to have the upper end of the rod 162 in contact with the upper holding part 130 from below without fixing it to the upper holding part 130.

In this way, the actuator 160 having a rod 162 fixed to the lower holding part 120 and extending in one direction can be used to move the upper holding part 130 relatively toward or away from the lower holding part 120. Furthermore, the operation of this actuator 160 can move the lower holding part 120 and the upper holding part 130 up and down, respectively. Details of the operation using the actuator 160 will be described later.

The actuators 160 configured in this manner are provided at a pair of diagonal corners (front right and rear left corners) of the lower holding portion 120, which is rectangular in plan view, as shown in FIG. 3.

In this way, the upper stopper mechanism 140, the lower stopper mechanism 150, and the actuator 160 are disposed at one set of diagonal corners (front right and rear left corners) of the lower holding part 120. The upper stopper mechanism 140, the lower stopper mechanism 150, and the actuator 160 disposed at these diagonal corners are disposed in a line up in the front and rear so as to approach each other. The upper stopper mechanism 140 and the lower stopper mechanism 150 are disposed at the other set of diagonal corners (front left and rear right corners) of the lower holding part 120. The upper stopper mechanism 140 and the lower stopper mechanism 150 disposed at these diagonal corners are disposed in a line up in the front and rear so as to approach each other.

<Operation of holding mechanism 100>
As described above, the holding mechanism 100 configured in this manner can hold the film F by sandwiching it from above and below with the lower holding portion 120 and the upper holding portion 130. The operation of the holding mechanism 100 will be described below with reference to Figures 2, 3, 6 and 7.

First, the operation of the holding mechanism 100 when it clamps and holds the film F will be described. Note that in Figures 6 and 7, the two-dot chain lines show how each part moves when the film F is clamped.

Figure 6 (a) shows a state in which the holding mechanism 100 is not holding the film F. In this state, the rod 162 of the actuator 160 is extended, and the lower holding portion 120 and the upper holding portion 130 are separated from the film F above and below.

When the rod 162 of the actuator 160 is contracted from the state shown in FIG. 6(a), the upper holding part 130 moves downward together with the rod 162, as shown in FIG. 6(b). This causes the upper holding part 130 to approach the film F from above.

The movable shaft 143 also moves downward together with the upper holding part 130. When the movable shaft 143 moves downward to a predetermined position, the stopper 144 fixed to the movable shaft 143 comes into contact with the lower bushing 141. This restricts the downward movement of the upper holding part 130.

When the rod 162 of the actuator 160 is further contracted from the state shown in FIG. 6(b), the movement of the upper holding part 130 is restricted, so that, as shown in FIG. 7, it is not the upper holding part 130 but the lower holding part 120 to which the cylinder body 161 is fixed that moves upward. This causes the lower holding part 120 to approach the film F from below.

As the lower holding part 120 moves upward, the film F is sandwiched between the lower holding part 120 (more specifically, the sponge 122 provided on the lower holding part 120) and the upper holding part 130. At this time, the sponge 122 deforms appropriately, so that the film F can be held more securely.

In this way, by operating the common actuator 160 (contracting the rod 162), the upper holding part 130 and the lower holding part 120 can be moved sequentially to hold the film F. In this state, the rectangular part S (hatched part in FIG. 3) of the film F that is along the sponge 122 is sandwiched and held by the lower holding part 120 (sponge 122) and the upper holding part 130. In this way, the inner range (rectangular range) of the part where the film F is sandwiched becomes the processing target by the laser mechanism 50 (hereinafter, this range is referred to as the processing target range P). By sandwiching and holding the part S that extends around the processing target range P by the holding mechanism 100, it is possible to prevent the film F in the processing target range P from shaking or wrinkling due to the influence of vibration or air.

As shown in FIG. 2, the opening 131 of the upper holding part 130 is smaller than the opening 121 of the lower holding part 120, so that the sponge 122 provided on the lower holding part 120 is positioned so that it is covered from above by the upper holding part 130. This makes it possible to prevent the sponge 122 from being irradiated with laser light irradiated from above when the film F is processed, and thus prevents damage to the sponge 122.

Next, we will explain the operation when releasing the holding mechanism 100 from the film F.

When the rod 162 of the actuator 160 is extended from the state shown in FIG. 7, the cylinder body 161 moves downward. As a result, the lower holding part 120 to which the cylinder body 161 is fixed also moves downward away from the film F.

When the lower holding part 120 moves downward to a predetermined position, as shown in FIG. 6(b), the stopper 152 fixed to the lower holding part 120 comes into contact with the fixed shaft 151. This restricts the downward movement of the lower holding part 120.

When the rod 162 of the actuator 160 is further extended from the state shown in FIG. 6(b), the movement of the lower holding part 120 is restricted, so that as shown in FIG. 6(a), it is not the lower holding part 120 but the upper holding part 130 to which the rod 162 is fixed that moves upward. This causes the upper holding part 130 to move upward away from the film F.

In this way, by operating the common actuator 160 (extending the rod 162), the upper holding portion 130 and the lower holding portion 120 can be moved sequentially to release the holding of the film F. In this state, the film F can be moved toward the take-up roller 21 by rotating the feed roller 23 (see FIG. 1). In particular, by moving the upper holding portion 130 and the lower holding portion 120 up and down (away from the film F), it is possible to prevent the film F from rubbing against the upper holding portion 130 and the lower holding portion 120 as it moves.

<Shape of Hole F1>
Next, the shape of the hole F1 formed in the film F by the laser mechanism 50 will be described.

As shown in FIG. 8(a), in this embodiment, multiple holes F1 are formed in the processing target area P of the film F. FIG. 8(a) shows an example in which multiple holes F1 are formed within a circular area, assuming that the film F is used for a circular wafer.

When forming hole F1, the laser mechanism 50 irradiates the laser light along a linear trajectory T, as shown in FIG. 8(b). This allows a long hole-shaped hole F1 with a roughly constant width to be formed in the film F, as shown in FIG. 8(c). In this embodiment, hole F1 is formed so that width A is 0.2 to 1.0 mm and length B is 1.0 to 2.5 mm.

In this manner, in this embodiment, by irradiating the laser light in a straight line rather than in an annular (e.g., circular) shape to carve out the hole F1, it is possible to prevent residual residue of the processed film F from adhering to the film F.

The shape of the hole F1 is not limited to the above, and can be any shape. For example, the dimensions of the hole F1 are merely examples, and can be changed as desired. It is also possible to form the hole F1 by irradiating the laser light along a curved, linear trajectory T, such as a circle, rather than a straight line. As described above, from the viewpoint of suppressing adhesion of residual film F, it is desirable to irradiate the laser light along a linear trajectory T whose ends are not connected to each other.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical concept of the invention described in the claims.

For example, in this embodiment, as shown in FIG. 2, a sponge 122 is provided on the lower holding portion 120 to securely hold the film F, but the material provided on the lower holding portion 120 is not limited to the sponge 122 and may be any material having elasticity (e.g., rubber, etc.).

In addition, in this embodiment, an example in which the sponge 122 is provided on the lower holding portion 120 has been shown, but it is also possible to provide it on the upper holding portion 130 instead of the lower holding portion 120, or to provide it on both the lower holding portion 120 and the upper holding portion 130. Also, it is not necessarily necessary to provide the sponge 122, and it is also possible to configure the lower holding portion 120 and the upper holding portion 130 to directly sandwich the film F.

In the present embodiment, as shown in Fig. 3 and Fig. 9(a), an example is shown in which the holding mechanism 100 holds the portion S of the film F surrounding the processing range P, but the portion of the film F that is held is not limited to this. For example, as shown in Fig. 9(b), it is also possible to hold the portion S on the side of the processing range P of the film F by pinching it. In particular, Fig. 9(b) shows an example in which both sides of the processing range P of the film F (both ends in the width direction (front-rear direction) relative to the transport direction of the film F) are held by pinching it. Note that it is not limited to the example of Fig. 9(b), and it is also possible to configure it so that only one side (one side) of the processing range P of the film F is pinched and held.

As shown in FIG. 9(c), it is also possible to clamp and hold multiple portions S of the film F. In this way, by clamping and holding at least both ends of the film F in the width direction relative to the transport direction (the direction in which tension is applied by the transport mechanism), it is possible to prevent the film F in the processing area P from shaking or wrinkling due to the effects of vibration or air.

In addition, in this embodiment, as shown in FIG. 5, the actuator 160 (cylinder body 161) is fixed to the lower holding part 120, but the arrangement of the actuator 160 is not limited to this. For example, it is also possible to fix the cylinder body 161 to the upper holding part 130 and connect the rod 162 to the lower holding part 120.

In addition, in this embodiment, an example is shown in which an air cylinder is used as the actuator 160, but various other types of actuators (e.g., electric cylinders, hydraulic cylinders, etc.) can be used as the actuator 160.

In addition, in this embodiment, as shown in FIG. 3, the upper stopper mechanism 140 and the lower stopper mechanism 150 are provided at the corners of the lower holding portion 120, and the actuators 160 are provided at a pair of diagonal corners of the lower holding portion 120, but the arrangement of the upper stopper mechanism 140, etc. is not limited to this, and they can be arranged in any position depending on the size, shape, etc. of each part of the holding mechanism 100.

In addition, in this embodiment, an example is shown in which the film F held by the holding mechanism 100 is processed by the laser mechanism 50, but the processing method is not limited to this, and various processing methods can be adopted. For example, the film F held by the holding mechanism 100 can be processed using a cutting tool, water pressure (water jet), or plasma (i.e., applied to an atmospheric pressure/vacuum plasma processing device).

In this embodiment, a film F is used as an example of the workpiece (work) to be processed by the laser processing device 1, but it is possible to use various other workpieces in addition to the film F. For example, it is possible to process various workpieces such as metal, rubber, paper, and fabric.

It is also possible to provide the laser processing device 1 with mechanisms other than those illustrated in this embodiment. For example, if toxic gases are generated during processing (such as when processing fluorine-based film F), it is also possible to provide a separate exhaust gas treatment device.

As described above, the holding mechanism 100 (workpiece holding mechanism) according to this embodiment has the following features:
A lower holding portion 120 (first holding portion) arranged on one side of the film F (workpiece);
an upper holding portion 130 (second holding portion) arranged on the other side of the film F;
a common actuator 160 that moves the lower holding portion 120 and the upper holding portion 130 so that the film F is sandwiched between the lower holding portion 120 and the upper holding portion 130;
It is equipped with the following.
Such a configuration can prevent the structure from becoming complicated. That is, since the two holding parts can be moved by the common actuator 160, the structure can be prevented from becoming complicated, and furthermore, an increase in the number of parts and costs can be prevented.

The actuator 160 is fixed to either the lower holding portion 120 or the upper holding portion 130 .
With this configuration, it is possible to simplify the structure. That is, since the actuator 160 can be supported by the lower holding portion 120, it is possible to simplify the structure for supporting the actuator 160.

In addition, the actuator 160 can move the lower holding part 120 and the upper holding part 130 in a direction toward and away from each other,
a lower stopper mechanism (first restriction portion) that restricts the lower holding portion (120) from moving in a direction away from the upper holding portion (130) at a predetermined position;
an upper stopper mechanism 140 (second restricting portion) that restricts the upper holding portion 130 from moving toward the lower holding portion 120 at a predetermined position;
It further comprises:
Such a configuration can simplify the structure, i.e., by appropriately restricting the movement of the two holding parts by the two restricting parts, the two holding parts can be moved by a common actuator 160, and thus the structure can be simplified.

In addition, the lower holding portion 120 and the upper holding portion 130 are formed in a rectangular shape when viewed from the moving direction of the lower holding portion 120 and the upper holding portion 130,
The lower stopper mechanism 150 and the upper stopper mechanism 140 are disposed at least at the respective corners of the lower holding portion 120 and the upper holding portion 130 .
With this configuration, the movements of the lower holding part 120 and the upper holding part 130 can be stably restricted.

In addition, the lower holding portion 120 and the upper holding portion 130 are formed in a rectangular shape when viewed from the moving direction of the lower holding portion 120 and the upper holding portion 130,
The actuators 160 are disposed at least at one pair of diagonal corners of the lower holding portion 120 and the upper holding portion 130 .
With this configuration, the lower holding part 120 and the upper holding part 130 can be moved stably.

In addition, the laser processing apparatus 1 (processing apparatus) according to this embodiment is
The holding mechanism 100;
a laser mechanism 50 (processing mechanism) that processes the film F held by the holding mechanism 100;
It is equipped with the following.
By configuring in this way, it is possible to prevent the structure from becoming complicated.

In addition, the laser processing apparatus 1 according to this embodiment has
The film F wound in a roll is pulled out and transported to the holding mechanism 100, and the film F processed by the laser mechanism 50 is further provided with a transport mechanism (unwinding mechanism 10 and winding mechanism 20) that winds up the film F in a roll.
With this configuration, the roll-shaped film F can be processed stably.

In addition, the manufacturing method of the processed product according to this embodiment is as follows:
The film F is processed by using the laser processing device 1 .
By configuring in this way, it is possible to prevent the structure from becoming complicated.

REFERENCE SIGNS LIST 1 laser processing device 10 unwinding mechanism 20 winding mechanism 30 upper dust collection mechanism 40 lower dust collection mechanism 50 laser mechanism 100 holding mechanism 120 lower holding section 130 upper holding section 140 upper stopper mechanism 150 lower stopper mechanism 160 actuator

Claims (5)

A first holding portion disposed below the workpiece;
A second holding portion arranged above the workpiece;
A common actuator that moves the first holding portion and the second holding portion so that the workpiece is sandwiched between the first holding portion and the second holding portion;
A first restriction portion that restricts downward movement of the first holding portion;
A second restriction portion that restricts downward movement of the second holding portion;
Equipped with
The actuator is fixed to a lower side of the first holding portion,
When the workpiece is clamped by the first holding portion and the second holding portion, the first regulating portion does not regulate the downward movement of the first holding portion, and the second regulating portion regulates the downward movement of the second holding portion,
When releasing the holding of the workpiece, the actuator separates the second holding portion from the first holding portion,
When the workpiece is clamped by the first holding portion and the second holding portion, when the actuator separates the second holding portion from the first holding portion, the first holding portion descends until the first regulating portion regulates the downward movement of the first holding portion, and then the second holding portion rises and the regulation by the second regulating portion is released.
A work holding mechanism ;
a machining mechanism that machines the workpiece held by the workpiece holding mechanism;
a conveying mechanism that pulls out the work wound in a roll and conveys it to the work holding mechanism, and also winds up the work processed by the processing mechanism in a roll;
A processing device comprising: The actuator brings the second holding portion closer to the first holding portion.
The processing device according to claim 1 . The first holding portion and the second holding portion are formed in a rectangular shape when viewed from a moving direction of the first holding portion and the second holding portion,
The first restricting portion and the second restricting portion are disposed at least at each corner of the first holding portion and the second holding portion.
The processing apparatus according to claim 1 or 2. The first holding portion and the second holding portion are formed in a rectangular shape when viewed from a moving direction of the first holding portion and the second holding portion,
The actuator is disposed at least at one pair of diagonal corners of the first holding portion and the second holding portion.
The processing device according to any one of claims 1 to 3. The workpiece is machined using the machining apparatus according to any one of claims 1 to 4.
Manufacturing method for processed products .

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