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JP7522012B2 - Film manufacturing system and film manufacturing method - Google Patents
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JP7522012B2 - Film manufacturing system and film manufacturing method - Google Patents

Film manufacturing system and film manufacturing method Download PDF

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JP7522012B2
JP7522012B2 JP2020192086A JP2020192086A JP7522012B2 JP 7522012 B2 JP7522012 B2 JP 7522012B2 JP 2020192086 A JP2020192086 A JP 2020192086A JP 2020192086 A JP2020192086 A JP 2020192086A JP 7522012 B2 JP7522012 B2 JP 7522012B2
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substrate
coating liquid
temperature
coating
film
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JP2022080790A (en
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俊明 植野
智之 太田
雅 品川
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Nitto Denko Corp
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Priority to CN202111340777.9A priority patent/CN114535012A/en
Priority to TW110142383A priority patent/TWI872294B/en
Priority to KR1020210156468A priority patent/KR102926132B1/en
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Priority to JP2023066634A priority patent/JP2023080314A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • B29C48/0018Combinations of extrusion moulding with other shaping operations combined with shaping by orienting, stretching or shrinking, e.g. film blowing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/92Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92009Measured parameter
    • B29C2948/92209Temperature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Description

本発明は、フィルムの製造システム、および、フィルムの製造方法に関する。 The present invention relates to a film manufacturing system and a film manufacturing method.

従来、アクリル系樹脂を溶融押出して製膜する溶融押出製膜装置と、得られたアクリルフィルムの一方面に易接着組成物を塗布するコーターと、延伸装置(逐次二軸延伸装置または同時二軸延伸装置)と、巻取り装置とを備えるフィルム製造装置が知られている(例えば、特許文献1参照。)。 Conventionally, a film manufacturing apparatus is known that includes a melt extrusion film-forming apparatus that melt-extrudes an acrylic resin to form a film, a coater that applies an easy-adhesion composition to one side of the obtained acrylic film, a stretching device (sequential biaxial stretching device or simultaneous biaxial stretching device), and a winding device (see, for example, Patent Document 1).

特開2020-023170号公報JP 2020-023170 A

上記した特許文献1に記載されるようなフィルム製造装置において、易接着組成物が塗布されていない未塗工部分が発生した場合に、未塗工部分を検出したいという要望がある。 In a film manufacturing apparatus such as that described in Patent Document 1, if an uncoated portion where the adhesive composition is not applied occurs, there is a demand to detect the uncoated portion.

本発明は、未塗工部分を検出できるフィルムの製造システム、および、フィルムの製造方法を提供する。 The present invention provides a film manufacturing system and a film manufacturing method that can detect uncoated areas.

本発明[1]は、溶融樹脂をシート状の基材に成形する成形装置と、成形された前記基材の表面に塗工液を塗布する塗工装置と、前記塗工液が塗布された前記基材を延伸する延伸装置と、前記塗工装置から前記延伸装置へ向かう前記基材の前記表面の温度を、前記基材の幅方向全部にわたって測定する温度測定装置とを備える、フィルムの製造システムを含む。 The present invention [1] includes a film manufacturing system that includes a molding device that molds molten resin into a sheet-shaped substrate, a coating device that applies a coating liquid to the surface of the molded substrate, a stretching device that stretches the substrate to which the coating liquid has been applied, and a temperature measuring device that measures the temperature of the surface of the substrate moving from the coating device to the stretching device across the entire width of the substrate.

このような構成によれば、成形された基材の表面のうち、塗工液が塗布された塗工部分は、塗工液によって冷却される。一方、成形された基材の表面に、塗工液が塗布されていない未塗工部分が発生した場合、未塗工部分は、冷却されない。そのため、未塗工部分の温度は、塗工部分の温度よりも高くなる。 With this configuration, the coated portion of the surface of the molded substrate, to which the coating liquid has been applied, is cooled by the coating liquid. On the other hand, if an uncoated portion, to which no coating liquid has been applied, occurs on the surface of the molded substrate, the uncoated portion is not cooled. Therefore, the temperature of the uncoated portion becomes higher than the temperature of the coated portion.

そのため、温度測定装置によって、塗工装置から延伸装置へ向かう基材の表面の温度を、基材の幅方向全部にわたって測定することにより、塗工部分の温度よりも高い未塗工部分を検出できる。 Therefore, by using a temperature measuring device to measure the surface temperature of the substrate going from the coating device to the stretching device across the entire width of the substrate, it is possible to detect uncoated areas where the temperature is higher than that of the coated areas.

本発明[2]は、前記温度測定装置が、赤外線サーモグラフィ装置である、上記[1]のフィルムの製造システムを含む。 The present invention [2] includes the film manufacturing system of [1] above, in which the temperature measuring device is an infrared thermography device.

このような構成によれば、赤外線サーモグラフィ装置により、未塗工部分を、視覚的に検出できる。 With this configuration, uncoated areas can be visually detected using an infrared thermography device.

本発明[3]は、前記温度測定装置が測定した温度のログを記憶する記憶装置を、さらに備える、上記[1]または[2]のフィルムの製造システムを含む。 The present invention [3] includes the film manufacturing system of [1] or [2] above, further comprising a storage device that stores a log of the temperatures measured by the temperature measuring device.

このような構成によれば、ログを確認することによって、未塗工部分を特定できる。 With this configuration, uncoated areas can be identified by checking the log.

本発明[4]は、溶融樹脂をシート状の基材に成形する成形工程と、成形された前記基材の表面に塗工液を塗布する塗布工程と、前記塗工液が塗布された前記基材を延伸する延伸工程と、前記塗布工程の後、前記延伸工程の前において、前記基材の前記表面の温度を前記基材の幅方向全部にわたって測定することにより、前記基材の前記表面に、前記塗工液が塗布された塗工部分と、前記塗工液が塗布されていない未塗工部分とが形成された場合に、前記塗工部分よりも高い温度を有する前記未塗工部分を検出する検出工程とを含む、フィルムの製造方法を含む。 The present invention [4] includes a method for producing a film, which includes a forming step of forming a molten resin into a sheet-shaped substrate, a coating step of applying a coating liquid to the surface of the formed substrate, a stretching step of stretching the substrate coated with the coating liquid, and a detection step of detecting the uncoated portion having a higher temperature than the coated portion when a coated portion coated with the coating liquid and an uncoated portion not coated with the coating liquid are formed on the surface of the substrate by measuring the temperature of the substrate surface over the entire width direction of the substrate after the coating step and before the stretching step.

このような方法によれば、未塗工部分を検出できる。 This method makes it possible to detect uncoated areas.

本発明[5]は、前記塗工液の温度が、前記塗工液が塗布される前の前記基材の温度よりも10℃以上低い、上記[4]のフィルムの製造方法を含む。 The present invention [5] includes the method for producing a film according to the above [4], in which the temperature of the coating liquid is at least 10°C lower than the temperature of the substrate before the coating liquid is applied.

このような方法によれば、塗工液が塗布される前の基材と、塗工液との温度差により、未塗工部分を確実に検出できる。 This method makes it possible to reliably detect uncoated areas based on the temperature difference between the substrate before the coating liquid is applied and the coating liquid.

本発明のフィルムの製造システム、および、フィルムの製造方法によれば、未塗工部分を検出できる。 The film manufacturing system and film manufacturing method of the present invention make it possible to detect uncoated areas.

図1は、フィルムの製造システムによって製造されるフィルムの断面図である。FIG. 1 is a cross-sectional view of a film produced by a film production system. 図2は、フィルムの製造システムの概略構成図である。FIG. 2 is a schematic diagram of a film production system. 図3Aは、赤外線サーモグラフィ装置のブロック図である。図3Bは、赤外線サーモグラフィ装置によって得られた温度の分布画像を説明するための説明図である。Fig. 3A is a block diagram of an infrared thermography device, and Fig. 3B is an explanatory diagram for explaining a temperature distribution image obtained by the infrared thermography device. 図4は、変形例を説明するための説明図である。FIG. 4 is an explanatory diagram for explaining the modified example.

1.フィルムの製造システムの概略
フィルムFの製造システム1の概略について説明する。
1. Overview of Film Production System An overview of a film F production system 1 will be described.

図1に示すように、フィルムFは、基材Sと、被膜Cとを備える。基材Sは、基材Sの厚み方向において、表面の一例としての第1面S1と、第2面S2とを有する。被膜Cは、基材Sの第1面S1の上に配置される。被膜Cは、基材Sの第1面S1を覆う。被膜Cは、易接着層であってもよい。被膜Cが易接着層である場合、フィルムFは、易接着フィルムである。易接着フィルムは、例えば、モバイル機器、カーナビゲーション装置、パソコン用モニタ、テレビなどの画像表示装置の偏光板に使用される。詳しくは、易接着フィルムは、偏光板の偏光子を保護する保護フィルムとして使用される。易接着フィルムは、接着剤層を介して、偏光子と貼り合わされる。易接着フィルムは、易接着層で、偏光子と貼り合わされる。 As shown in FIG. 1, the film F includes a substrate S and a coating C. The substrate S has a first surface S1 and a second surface S2 in the thickness direction of the substrate S. The coating C is disposed on the first surface S1 of the substrate S. The coating C covers the first surface S1 of the substrate S. The coating C may be an easy-adhesion layer. When the coating C is an easy-adhesion layer, the film F is an easy-adhesion film. The easy-adhesion film is used in the polarizing plate of an image display device such as a mobile device, a car navigation device, a computer monitor, or a television. More specifically, the easy-adhesion film is used as a protective film that protects the polarizer of the polarizing plate. The easy-adhesion film is bonded to the polarizer via an adhesive layer. The easy-adhesion film is bonded to the polarizer via the easy-adhesion layer.

図2に示すように、フィルムFの製造システム1は、成形装置2と、第1延伸装置4Aと、塗工装置3と、延伸装置の一例としての第2延伸装置4Bと、スリット加工装置5と、ナーリング加工装置6と、巻取装置7とを備える。 As shown in FIG. 2, the film F manufacturing system 1 includes a molding device 2, a first stretching device 4A, a coating device 3, a second stretching device 4B as an example of a stretching device, a slitting device 5, a knurling device 6, and a winding device 7.

(1)成形装置
成形装置2は、熱可塑性樹脂が溶融した溶融樹脂を、シート状の基材Sに成形する(成形工程)。本実施形態では、成形装置は、押出成形装置である。
(1) Molding Apparatus The molding apparatus 2 molds (molding step) a molten thermoplastic resin into a sheet-shaped substrate S. In this embodiment, the molding apparatus is an extrusion molding apparatus.

熱可塑性樹脂としては、例えば、アクリル樹脂、ポリオレフィン樹脂、環状ポリオレフィン樹脂、ポリエステル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ポリアミド樹脂、ポリイミド樹脂、アセテート樹脂(ジアセチルセルロース、トリアセチルセルロースなど)が挙げられる。 Examples of thermoplastic resins include acrylic resins, polyolefin resins, cyclic polyolefin resins, polyester resins, polycarbonate resins, polystyrene resins, polyamide resins, polyimide resins, and acetate resins (diacetyl cellulose, triacetyl cellulose, etc.).

偏光子の保護フィルムとして使用される易接着フィルムを製造する場合、基材Sの材料として、好ましくは、アクリル樹脂が挙げられる。 When manufacturing an easily adhesive film to be used as a protective film for a polarizer, the material of the substrate S is preferably an acrylic resin.

また、偏光子の保護フィルムとして使用される易接着フィルムを製造する場合、アクリル樹脂は、グルタル酸無水物構造を有するアクリル樹脂、ラクトン環構造を有するアクリル樹脂であってもよい。グルタル酸無水物構造を有するアクリル樹脂、および、ラクトン環構造を有するアクリル樹脂は、高い耐熱性、高い透明性、および高い機械的強度を有するため、偏光度が高くかつ耐久性に優れる偏光板の製造に適する。グルタル酸無水物構造を有するアクリル樹脂は、特開2006-283013号公報、特開2006-335902号公報、特開2006-274118号公報に記載されている。ラクトン環構造を有するアクリル樹脂は、特開2000-230016号公報、特開2001-151814号公報、特開2002-120326号公報、特開2002-254544号公報、特開2005-146084号公報に記載されている。 Furthermore, when manufacturing an easily adhesive film to be used as a protective film for a polarizer, the acrylic resin may be an acrylic resin having a glutaric anhydride structure or an acrylic resin having a lactone ring structure. Acrylic resins having a glutaric anhydride structure and acrylic resins having a lactone ring structure have high heat resistance, high transparency, and high mechanical strength, and are therefore suitable for manufacturing polarizing plates with a high degree of polarization and excellent durability. Acrylic resins having a glutaric anhydride structure are described in JP 2006-283013 A, JP 2006-335902 A, and JP 2006-274118 A. Acrylic resins having a lactone ring structure are described in JP-A-2000-230016, JP-A-2001-151814, JP-A-2002-120326, JP-A-2002-254544, and JP-A-2005-146084.

また、基材Sは、アクリル樹脂に加えて、アクリル樹脂以外の他の熱可塑性樹脂を含有してもよい。他の熱可塑性樹脂を含有することにより、アクリル樹脂の複屈折を打ち消して、光学等方性に優れる易接着フィルムを得ることができる。また、易接着フィルムの機械強度を向上させることもできる。 In addition to the acrylic resin, the substrate S may contain a thermoplastic resin other than the acrylic resin. By containing the other thermoplastic resin, the birefringence of the acrylic resin can be countered, and an easily adhesive film with excellent optical isotropy can be obtained. The mechanical strength of the easily adhesive film can also be improved.

なお、基材Sは、酸化防止剤、安定剤、補強材、紫外線吸収剤、難燃剤、帯電防止剤、着色剤、充填剤、可塑剤、滑剤、フィラーなどの添加剤を含有してもよい。 The substrate S may contain additives such as antioxidants, stabilizers, reinforcing materials, UV absorbers, flame retardants, antistatic agents, colorants, fillers, plasticizers, lubricants, and fillers.

(2)第1延伸装置
第1延伸装置4Aは、基材Sを、加熱した後、基材Sの流れ方向MDに延伸する。
(2) First Stretching Device The first stretching device 4A heats the substrate S and then stretches the substrate S in the machine direction MD.

(3)塗工装置
塗工装置3は、成形工程によって成形された基材Sの第1面S1に、塗工液を塗布する(塗布工程)。塗工装置としては、例えば、バーコーター、グラビアコーター、キスコーターなどが挙げられる。なお、基材Sの第1面S1には、成形工程の後、塗布工程の前に、コロナ処理、プラズマ処理などの表面処理が、施されてもよい。
(3) Coating Device The coating device 3 applies a coating liquid to the first surface S1 of the substrate S formed by the molding process (coating process). Examples of the coating device include a bar coater, a gravure coater, and a kiss coater. Note that the first surface S1 of the substrate S may be subjected to a surface treatment such as a corona treatment or a plasma treatment after the molding process and before the coating process.

易接着フィルムを製造する場合、塗工液は、易接着層を形成するための易接着組成物である。 When producing an easily adhesive film, the coating liquid is an easily adhesive composition for forming an easily adhesive layer.

易接着層は、バインダ樹脂と、微粒子とを含有する。 The easy-adhesion layer contains a binder resin and fine particles.

バインダ樹脂としては、例えば、ウレタン樹脂、エポキシ樹脂などの熱硬化性樹脂、例えば、アクリル樹脂、ポリエステル樹脂などの熱可塑性樹脂が挙げられる。易接着フィルムが偏光子の保護フィルムとして使用される場合、バインダ樹脂は、好ましくは、熱硬化性樹脂である。バインダ樹脂は、複数種類を併用できる。 Examples of binder resins include thermosetting resins such as urethane resins and epoxy resins, and thermoplastic resins such as acrylic resins and polyester resins. When the adhesive film is used as a protective film for a polarizer, the binder resin is preferably a thermosetting resin. Multiple types of binder resins can be used in combination.

微粒子としては、例えば、酸化ケイ素(シリカ)、酸化チタン(チタニア)、酸化アルミニウム(アルミナ)、酸化ジルコニウム(ジルコニア)などの酸化物、例えば、炭酸カルシウムなどの炭酸塩、例えば、ケイ酸カルシウム、ケイ酸アルミニウム、ケイ酸マグネシウムなどのケイ酸塩、例えば、タルク、カオリンなどのケイ酸塩鉱物、例えば、リン酸カルシウムなどのリン酸塩などが挙げられる。易接着フィルムが偏光子の保護フィルムとして使用される場合、微粒子は、好ましくは、酸化物、より好ましくは、酸化ケイ素である。微粒子は、複数種類を併用できる。 Examples of the fine particles include oxides such as silicon oxide (silica), titanium oxide (titania), aluminum oxide (alumina), and zirconium oxide (zirconia); carbonates such as calcium carbonate; silicates such as calcium silicate, aluminum silicate, and magnesium silicate; silicate minerals such as talc and kaolin; and phosphates such as calcium phosphate. When the easy-adhesion film is used as a protective film for a polarizer, the fine particles are preferably oxides, and more preferably silicon oxide. Multiple types of fine particles can be used in combination.

塗工液(易接着組成物)は、樹脂成分と、上記した微粒子と、分散媒とを含有する。 The coating liquid (easy-adhesion composition) contains a resin component, the above-mentioned fine particles, and a dispersion medium.

樹脂成分は、後述する延伸工程によって、上記したバインダ樹脂の被膜(易接着層)を形成する。バインダ樹脂がウレタン樹脂である場合、樹脂成分としては、例えば、水系ウレタン樹脂が挙げられる。水系ウレタン樹脂としては、例えば、ウレタン樹脂の乳化物である非反応型水系ウレタン樹脂、例えば、イソシアネート基をブロック剤で保護したウレタン樹脂の乳化物である反応型水系ウレタン樹脂などが挙げられる。バインダ樹脂がウレタン樹脂である場合、塗工液は、ウレタン硬化触媒(トリエチルアミンなど)、イソシアネートモノマーを含有してもよい。 The resin component forms a coating (easy-adhesion layer) of the binder resin described above by the stretching process described below. When the binder resin is a urethane resin, the resin component may be, for example, a water-based urethane resin. Examples of the water-based urethane resin include a non-reactive water-based urethane resin that is an emulsion of a urethane resin, and a reactive water-based urethane resin that is an emulsion of a urethane resin in which the isocyanate group is protected by a blocking agent. When the binder resin is a urethane resin, the coating liquid may contain a urethane curing catalyst (such as triethylamine) and an isocyanate monomer.

分散媒としては、例えば、水、例えば、メタノール、エタノールなどのアルコール、例えば、アセトン、メチルエチルケトンなどのケトンなどが挙げられる。 Examples of dispersion media include water, alcohols such as methanol and ethanol, and ketones such as acetone and methyl ethyl ketone.

(4)第2延伸装置
第2延伸装置4Bは、塗工液が塗布された前記基材を延伸する(延伸工程)。詳しくは、第2延伸装置4Bは、基材Sに塗布された塗工液を乾燥させる。これにより、塗工液が上記した被膜Cになる。また、第2延伸装置4Bは、被膜Cが形成された基材Sを、加熱した後、基材Sの幅方向TDに延伸する。幅方向TDは、流れ方向MDと直交する。延伸工程により、被膜Cが形成された基材Sが延伸され、上記したフィルムFが得られる。
(4) Second Stretching Device The second stretching device 4B stretches the substrate coated with the coating liquid (stretching process). More specifically, the second stretching device 4B dries the coating liquid applied to the substrate S. This causes the coating liquid to become the above-mentioned coating C. The second stretching device 4B also heats the substrate S on which the coating C has been formed, and then stretches the substrate S in the width direction TD. The width direction TD is perpendicular to the machine direction MD. In the stretching process, the substrate S on which the coating C has been formed is stretched, and the above-mentioned film F is obtained.

(5)スリット加工装置
スリット加工装置5は、フィルムFを、所定の幅に切断する。
(5) Slitting Device The slitting device 5 cuts the film F to a predetermined width.

(6)ナーリング加工装置
ナーリング加工装置6は、所定の幅に切断されたフィルムFの幅方向両端に、ナールを形成する。ナールは、レーザーによって形成される。ナールは、加熱されたエンボスロールによって形成されてもよい。
(6) Knurling Device The knurling device 6 forms knurls on both widthwise ends of the film F cut to a predetermined width. The knurls are formed by a laser. The knurls may also be formed by a heated embossing roll.

(7)巻取装置
巻取装置7は、ナールが形成されたフィルムFを巻き取る。
(7) Winding Device The winding device 7 winds up the film F on which the knurls have been formed.

2.フィルムの製造システムの詳細
フィルムの製造システム1は、温度測定装置の一例としての赤外線サーモグラフィ装置8を、さらに備える。
2. Details of the Film Manufacturing System The film manufacturing system 1 further includes an infrared thermography device 8 as an example of a temperature measuring device.

赤外線サーモグラフィ装置8は、塗工装置3から第2延伸装置4Bへ向かう基材Sの第1面S1の温度を、幅方向TDにおける基材Sの全部にわたって測定する。言い換えると、赤外線サーモグラフィ装置8は、塗布工程の後、延伸工程の前において、基材Sの第1面S1の温度を、幅方向TDにおける基材Sの全部にわたって測定する。詳しくは、図3Aに示すように、赤外線サーモグラフィ装置8は、赤外線カメラ81と、制御装置82と、モニタ83とを備える。 The infrared thermography device 8 measures the temperature of the first surface S1 of the substrate S traveling from the coating device 3 to the second stretching device 4B over the entire substrate S in the width direction TD. In other words, the infrared thermography device 8 measures the temperature of the first surface S1 of the substrate S over the entire substrate S in the width direction TD after the coating process and before the stretching process. In more detail, as shown in FIG. 3A, the infrared thermography device 8 includes an infrared camera 81, a control device 82, and a monitor 83.

赤外線カメラ81は、塗工装置3から第2延伸装置4Bへ向かう基材Sの第1面S1を撮影する。赤外線カメラ81は、幅方向TDにおける基材Sの全部を撮影する。 The infrared camera 81 captures an image of the first surface S1 of the substrate S traveling from the coating device 3 to the second stretching device 4B. The infrared camera 81 captures an image of the entire substrate S in the width direction TD.

制御装置82は、赤外線カメラ81に入射した赤外線の放射エネルギーを温度に変換し、温度の分布画像を作成する。これにより、赤外線サーモグラフィ装置8は、基材Sの第1面S1の温度を、幅方向TDにおける基材Sの全部にわたって測定する。制御装置82は、記憶装置の一例としてのメモリ84を有する。つまり、フィルムの製造システム1は、メモリ84を備える。メモリ84は、制御装置82によって変換された温度のログを記憶する。つまり、メモリ84は、赤外線サーモグラフィ装置8が測定した温度のログを記憶する。これにより、メモリ84に記憶されたログを確認することによって、未塗工部分P2(図3B参照)が発生したポイントを特定できる。 The control device 82 converts the infrared radiation energy incident on the infrared camera 81 into temperature and creates a temperature distribution image. As a result, the infrared thermography device 8 measures the temperature of the first surface S1 of the substrate S over the entire substrate S in the width direction TD. The control device 82 has a memory 84 as an example of a storage device. In other words, the film manufacturing system 1 is equipped with a memory 84. The memory 84 stores a log of the temperatures converted by the control device 82. In other words, the memory 84 stores a log of the temperatures measured by the infrared thermography device 8. As a result, the point where the uncoated portion P2 (see FIG. 3B) occurred can be identified by checking the log stored in the memory 84.

モニタ83は、制御装置82によって作成された温度の分布画像を表示する。図3Bに示すように、基材Sの第1面S1に、塗工液が塗布された塗工部分P1と、塗工液が塗布されていない未塗工部分P2とが形成された場合、温度の分布画像中において、未塗工部分P2は、塗工部分P1よりも高い温度で表示される。 The monitor 83 displays the temperature distribution image created by the control device 82. As shown in FIG. 3B, when a coated portion P1 to which the coating liquid is applied and an uncoated portion P2 to which the coating liquid is not applied are formed on the first surface S1 of the substrate S, the uncoated portion P2 is displayed in the temperature distribution image as having a higher temperature than the coated portion P1.

詳しくは、塗工液の温度は、塗工液が塗布される前の基材Sの温度よりも低い。そのため、塗工部分P1は、塗工液によって冷却される一方、未塗工部分P2は、冷却されない。そのため、未塗工部分P2の温度は、塗工部分P1の温度よりも高くなる。 More specifically, the temperature of the coating fluid is lower than the temperature of the substrate S before the coating fluid is applied. Therefore, the coated portion P1 is cooled by the coating fluid, while the uncoated portion P2 is not cooled. Therefore, the temperature of the uncoated portion P2 is higher than the temperature of the coated portion P1.

そして、この場合、作業者は、温度の分布画像を見て、塗工部分P1よりも高い温度を有する未塗工部分P2を検出する(検出工程)。これにより、未塗工部分P2を検出できる。 In this case, the worker looks at the temperature distribution image and detects the uncoated portion P2 that has a higher temperature than the coated portion P1 (detection process). This allows the uncoated portion P2 to be detected.

なお、塗工液の温度は、塗工液が塗布される前の基材Sの温度よりも、例えば、10℃以上、好ましくは、30℃以上、低い。塗工液と基材Sとの温度差が上記下限値以上であると、未塗工部分P2を、より確実に検出できる。なお、塗工液と基材Sとの温度差の上限値は、限定されない。 The temperature of the coating liquid is, for example, 10°C or more, preferably 30°C or more, lower than the temperature of the substrate S before the coating liquid is applied. When the temperature difference between the coating liquid and the substrate S is equal to or greater than the above-mentioned lower limit, the uncoated portion P2 can be detected more reliably. The upper limit of the temperature difference between the coating liquid and the substrate S is not limited.

3.変形例
(1)制御装置82は、未塗工部分P2の有無を、ソフトウェアによって判定してもよい。
3. Modifications (1) The control device 82 may determine the presence or absence of the uncoated portion P2 by using software.

(2)温度測定装置は、赤外線サーモグラフィ装置に限らない。例えば、複数の赤外線温度センサーにより、基材Sの幅方向全部の温度を測定してもよい。 (2) The temperature measuring device is not limited to an infrared thermography device. For example, the temperature of the substrate S in the entire width direction may be measured using multiple infrared temperature sensors.

(3)フィルムの製造システム1は、図4に示すように、流れ方向MDにおける塗工装置3の下流側に、スムージングローラ100を備えていてもよい。スムージングローラ100は、基材Sに塗布された塗工液を幅方向TDに塗り広げる。赤外線サーモグラフィ装置8の検出限界以下の幅を有する未塗工部分P2が発生した場合、スムージングローラ100は、基材Sに塗布された塗工液を幅方向TDに塗り広げることによって、未塗工部分P2に塗工液を塗布する。これにより、未塗工部分P2を無くすことができる。 (3) As shown in FIG. 4, the film manufacturing system 1 may include a smoothing roller 100 downstream of the coating device 3 in the machine direction MD. The smoothing roller 100 spreads the coating liquid applied to the substrate S in the width direction TD. When an uncoated portion P2 having a width below the detection limit of the infrared thermography device 8 occurs, the smoothing roller 100 applies the coating liquid to the uncoated portion P2 by spreading the coating liquid applied to the substrate S in the width direction TD. This makes it possible to eliminate the uncoated portion P2.

1 フィルムの製造システム
2 成形装置
3 塗工装置
4B 第2延伸装置
8 赤外線サーモグラフィ装置
84 メモリ
F フィルム
P1 塗工部分
P2 未塗工部分
S 基材
S1 第1面
REFERENCE SIGNS LIST 1 Film manufacturing system 2 Molding device 3 Coating device 4B Second stretching device 8 Infrared thermography device 84 Memory F Film P1 Coated portion P2 Uncoated portion S Substrate S1 First surface

Claims (5)

溶融樹脂をシート状の基材に成形する成形装置と、
成形された前記基材の表面に塗工液を塗布する塗工装置と、
前記塗工液が塗布された前記基材を延伸する延伸装置と、
前記塗工装置から前記延伸装置へ向かう前記基材の前記表面の温度を、前記基材の幅方向全部にわたって測定する温度測定装置と
を備える、フィルムの製造システム。
A molding device that molds a molten resin into a sheet-shaped substrate;
A coating device that applies a coating liquid to a surface of the molded substrate;
A stretching device that stretches the base material coated with the coating liquid;
a temperature measuring device that measures the temperature of the surface of the substrate from the coating device to the stretching device across the entire width direction of the substrate.
前記温度測定装置は、赤外線サーモグラフィ装置である、請求項1に記載のフィルムの製造システム。 The film manufacturing system of claim 1, wherein the temperature measuring device is an infrared thermography device. 前記温度測定装置が測定した温度のログを記憶する記憶装置を、さらに備える、請求項1または2に記載のフィルムの製造システム。 The film manufacturing system according to claim 1 or 2, further comprising a storage device that stores a log of the temperatures measured by the temperature measuring device. 溶融樹脂をシート状の基材に成形する成形工程と、
成形された前記基材の表面に塗工液を塗布する塗布工程と、
前記塗工液が塗布された前記基材を延伸する延伸工程と、
前記塗布工程の後、前記延伸工程の前において、前記基材の前記表面の温度を前記基材の幅方向全部にわたって測定することにより、前記基材の前記表面に、前記塗工液が塗布された塗工部分と、前記塗工液が塗布されていない未塗工部分とが形成された場合に、前記塗工部分よりも高い温度を有する前記未塗工部分を検出する検出工程と
を含む、フィルムの製造方法。
A molding step of molding the molten resin into a sheet-shaped substrate;
A coating step of applying a coating liquid to a surface of the molded substrate;
a stretching step of stretching the substrate to which the coating liquid has been applied;
a detection step of measuring the temperature of the surface of the substrate over the entire width direction of the substrate after the coating step and before the stretching step, thereby detecting the uncoated portion having a higher temperature than the coated portion when a coated portion to which the coating liquid is applied and an uncoated portion to which the coating liquid is not applied are formed on the surface of the substrate.
前記塗工液の温度は、前記塗工液が塗布される前の前記基材の温度よりも10℃以上低い、請求項4に記載のフィルムの製造方法。 The method for producing a film according to claim 4, wherein the temperature of the coating liquid is at least 10°C lower than the temperature of the substrate before the coating liquid is applied.
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