JP7524582B2 - Molded body, transfer sheet, and method for producing molded body - Google Patents

Description

The present invention relates to a molded body, a transfer sheet, and a method for manufacturing a molded body.

There are cases where it is required to impart antiglare properties to the surface of an arbitrary adherend. In such cases, for example, insert molding is carried out.
Insert molding is a method of obtaining a molded body by placing an anti-glare film having an anti-glare layer on a substrate inside an injection molding die, pouring injected resin into the substrate side, and integrating the substrate side of the anti-glare film with the injected resin as the adherend.

However, with insert molding, there is a problem that a relatively thick substrate is present between the adherend and the anti-glare layer, which increases the overall thickness of the molded product and impairs the texture of the adherend.

On the other hand, as a means other than insert molding, a means has been proposed in which an anti-glare layer is formed on an adherend by in-mold molding using a transfer sheet (Patent Document 1).

JP 2010-234610 A

However, there were many cases where the molded products obtained by in-mold molding using transfer sheets did not have the desired anti-glare properties.

The present invention aims to provide a molded article with the desired anti-glare properties. It also aims to provide a transfer sheet that can easily produce the molded article, and a method for producing the molded article.

The present invention, which solves the above problems, provides the following [1] to [3].
[1] A molded article having a transfer layer on an adherend, the transfer layer having at least a heat seal layer in contact with the adherend and an antiglare layer located on the opposite side of the heat seal layer from the adherend, and the indentation hardness of the heat seal layer is 290 MPa or more.
[2] A transfer sheet having a transfer layer and a second release substrate on a first release substrate, the transfer layer having at least a heat seal layer having an indentation hardness of 290 MPa or more in contact with the first release substrate, and an antiglare layer located on the opposite side of the heat seal layer from the first release substrate.
[3] A method for producing a molded body, comprising carrying out the following steps (1) and (2) in order:
(1) A process for obtaining a laminate by peeling off the first release substrate of the transfer sheet described in [2] above and heat-pressing the exposed surface of the transfer layer on the heat seal layer side to an adherend.
(2) A step of peeling off the second release substrate from the laminate to obtain a molded article having a transfer layer on an adherend.

The molded article of the present invention can have the desired anti-glare properties on the surface of the molded article. Furthermore, the transfer sheet and molded article manufacturing method of the present invention can easily manufacture molded articles with good anti-glare properties.

1 is a cross-sectional view showing one embodiment of a molded article of the present invention. 1 is a cross-sectional view showing one embodiment of a transfer sheet of the present invention.

[Molded body]
The molded article of the present invention is a molded article having a transfer layer on an adherend, the transfer layer having at least a heat seal layer in contact with the adherend and an antiglare layer located on the opposite side of the heat seal layer from the adherend, and the indentation hardness of the heat seal layer is 290 MPa or more.

FIG. 1 is a cross-sectional view showing one embodiment of the molded article of the present invention.
The molded body 100 in Fig. 1 has a transfer layer 20 on an adherend 10. The transfer layer 20 of the molded body in Fig. 1 also has a heat seal layer 21 in contact with the adherend, and an antiglare layer 23 located on the opposite side of the heat seal layer 21 from the adherend 10. The transfer layer 20 of the molded body in Fig. 1 also has a migration-inhibiting layer 22 between the heat seal layer 21 and the antiglare layer 23, and a low refractive index layer 24 located on the opposite side of the antiglare layer 23 from the heat seal layer 21.

<Adherend>
The material of the adherend is not particularly limited, and examples thereof include inorganic materials such as glass and ceramics, resins, or mixtures thereof.

In the molded article of the present invention, the adherend preferably contains a resin. Moreover, the resin is preferably an injected resin.
The molded article of the present invention can be obtained, for example, by thermocompression bonding the surface of the transfer layer on the heat seal layer side to the adherend. In a general thermocompression process, the force generated on the adherend side may be transmitted to the antiglare layer through the heat seal layer. In particular, in the case of thermocompression bonding by in-mold molding, the pressure when the molten resin injected into the mold hits the heat seal layer side of the transfer layer is large, and the large pressure is transmitted to the antiglare layer through the heat seal layer. In this case, if the heat seal layer is deformed by the pressure, the strain due to the deformation is transmitted to the antiglare layer, and it is considered that the antiglare layer is easily deformed.
By setting the indentation hardness of the heat seal layer to 290 MPa or more, the molded article of the present invention has the effect of suppressing deformation of the heat seal layer, and thus suppressing deformation of the antiglare layer, thereby providing the surface of the molded article with the desired antiglare properties.
In addition, the pressure from the adherend side toward the transfer layer side is likely to occur when the adherend contains a resin. Therefore, when the adherend contains a resin, it is preferable in that the effect of making the indentation hardness of the heat seal layer 290 MPa or more can be more prominent.
Whether or not a desired antiglare property is provided can be evaluated, for example, by the rate of change between the transmitted image clarity of the transfer layer before transfer and the transmitted image clarity of the molded article.

When in-mold molding is performed, it is preferable to use an injection-moldable thermoplastic resin or thermosetting resin as the adherend, and among these, a thermoplastic resin is more preferable.
Examples of thermoplastic resins include polystyrene-based resins, polyolefin-based resins, ABS resins (including heat-resistant ABS resins), AS resins, AN resins, polyphenylene oxide-based resins, polycarbonate-based resins, polyacetal-based resins, acrylic-based resins, polyethylene terephthalate-based resins, polybutylene terephthalate-based resins, polysulfone-based resins, and polyphenylene sulfide-based resins.
Among these, acrylic resins are preferred from the viewpoints of transparency and weather resistance, and polycarbonate resins are preferred from the viewpoint of impact resistance.

When performing in-mold molding, the injection material may contain additives (e.g., ultraviolet absorbers, antioxidants, etc.) in addition to the injection moldable resin.

The shape of the adherend is not particularly limited, and may be a flat plate or may have a three-dimensional shape. The thickness of the adherend is also not particularly limited.
The adherend may be one that has been molded in advance, or one that is molded during the process, such as in-mold molding.

<Transfer Layer>
The transfer layer has at least a heat seal layer in contact with the adherend, and an antiglare layer located on the opposite side of the heat seal layer from the adherend.
The transfer layer may have layers (other layers) other than the heat seal layer and the antiglare layer, such as a migration-suppressing layer located between the heat seal layer and the antiglare layer, and an antireflection layer located on the opposite side of the antiglare layer to the heat seal layer.

<Heat seal layer>
The heat seal layer is the layer that is located closest to the adherend among the layers constituting the transfer layer, and is the layer that comes into contact with the adherend.

The indentation hardness of the heat seal layer must be 290 MPa or more. If the indentation hardness of the heat seal layer is less than 290 MPa, when pressure is generated from the adherend side toward the transfer layer side, the pressure cannot be prevented from being transmitted to the antiglare layer through the heat seal layer, and the desired antiglare properties cannot be obtained. Usually, the heat seal layer is designed to be soft in order to improve the adhesion with the adherend. In the present invention, the indentation hardness of the heat seal layer is intentionally made hard, thereby making it possible to obtain the desired antiglare properties.
If the indentation hardness of the heat seal layer is too high, the adhesion to the adherend tends to decrease. Therefore, the indentation hardness of the heat seal layer is preferably 290 to 480 MPa, more preferably 300 to 460 MPa, even more preferably 330 to 430 MPa, and even more preferably 350 to 400 MPa.

The heat seal layer preferably contains at least a thermoplastic resin.
Examples of the thermoplastic resin for the heat seal layer include acrylic resins, polyester resins, urethane resins, styrene resins, and amide resins.

In addition, the heat seal layer preferably contains a cured product of a curable resin composition in addition to the thermoplastic resin. By containing the cured product of the curable resin composition in the heat seal layer, the indentation hardness of the heat seal layer can be easily set to 290 MPa or more.
In addition, the heat seal layer is usually designed to be soft in order to improve adhesion to the adherend. In other words, a configuration in which the heat seal layer is intentionally made to contain a cured product of a curable resin composition is usually not adopted.

When the heat seal layer contains a thermoplastic resin and a cured product of a curable resin composition, the blending ratio of the thermoplastic resin to the cured product of the curable resin composition is preferably 40:60 to 95:5, more preferably 50:50 to 90:10, and even more preferably 60:40 to 85:15, on a mass basis.
The indentation hardness of the heat seal layer can be easily set to 290 MPa or more by making the blending amount of the cured product of the curable resin composition 5 or more relative to the thermoplastic resin 95. Also, by making the blending amount of the cured product of the curable resin composition 60 or less relative to the thermoplastic resin 40, the indentation hardness of the heat seal layer can be prevented from becoming too hard, and the adhesiveness of the heat seal layer based on the thermoplastic resin can be easily maintained.

Curable resin compositions include thermosetting resin compositions and ionizing radiation curable resin compositions.

The thermosetting resin composition is a composition that contains at least a thermosetting resin, and is a resin composition that is cured by heating.
Examples of the thermosetting resin include acrylic resin, urethane resin, phenol resin, urea melamine resin, epoxy resin, unsaturated polyester resin, silicone resin, etc. A curing agent is added to the thermosetting resin composition as necessary.

The ionizing radiation curable resin composition is a composition containing a compound having an ionizing radiation curable functional group (hereinafter also referred to as "ionizing radiation curable compound"). Examples of the ionizing radiation curable functional group include ethylenically unsaturated bond groups such as (meth)acryloyl group, vinyl group, and allyl group, as well as epoxy group, oxetanyl group, and the like. As the ionizing radiation curable compound, a compound having an ethylenically unsaturated bond group is preferred, a compound having two or more ethylenically unsaturated bond groups is more preferred, and among them, a polyfunctional (meth)acrylate-based compound having two or more ethylenically unsaturated bond groups is even more preferred. As the polyfunctional (meth)acrylate-based compound, either a monomer or an oligomer can be used.
The ionizing radiation refers to electromagnetic waves or charged particle beams that have an energy quantum capable of polymerizing or crosslinking molecules. Usually, ultraviolet rays (UV) or electron beams (EB) are used, but other types of radiation such as electromagnetic waves, such as X-rays and gamma rays, and charged particle beams, such as alpha rays and ion beams, can also be used.
In this specification, (meth)acrylate means acrylate or methacrylate, (meth)acrylic acid means acrylic acid or methacrylic acid, and (meth)acryloyl group means acryloyl group or methacryloyl group.

Among the polyfunctional (meth)acrylate compounds, examples of bifunctional (meth)acrylate monomers include ethylene glycol di(meth)acrylate, bisphenol A tetraethoxydiacrylate, bisphenol A tetrapropoxydiacrylate, and 1,6-hexanediol diacrylate.
Examples of trifunctional or higher (meth)acrylate monomers include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol tetra(meth)acrylate, and isocyanuric acid-modified tri(meth)acrylate.
The (meth)acrylate monomer may have a part of its molecular skeleton modified, and may be modified with ethylene oxide, propylene oxide, caprolactone, isocyanuric acid, an alkyl, a cyclic alkyl, an aromatic, a bisphenol, or the like.

Examples of the polyfunctional (meth)acrylate oligomer include acrylate polymers such as urethane (meth)acrylate, epoxy (meth)acrylate, polyester (meth)acrylate, and polyether (meth)acrylate.
The urethane (meth)acrylate can be obtained, for example, by reacting a polyhydric alcohol and an organic diisocyanate with a hydroxy (meth)acrylate.
In addition, preferred epoxy (meth)acrylates are (meth)acrylates obtained by reacting a tri- or higher functional aromatic epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin, or the like with (meth)acrylic acid, (meth)acrylates obtained by reacting a di- or higher functional aromatic epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin, or the like with a polybasic acid and (meth)acrylic acid, and (meth)acrylates obtained by reacting a di- or higher functional aromatic epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin, or the like with a phenol and (meth)acrylic acid.
The ionizing radiation curable compounds may be used alone or in combination of two or more. Among the ionizing radiation curable compounds, polyfunctional (meth)acrylate oligomers are preferred, and polyfunctional urethane (meth)acrylate oligomers are more preferred.

When the ionizing radiation curable compound is an ultraviolet ray curable compound, the ionizing radiation curable composition preferably contains additives such as a photopolymerization initiator and a photopolymerization accelerator.
The photopolymerization initiator may be one or more selected from acetophenone, benzophenone, α-hydroxyalkylphenone, Michler's ketone, benzoin, benzyl dimethyl ketal, benzoyl benzoate, α-acyloxime ester, thioxanthones, and the like.
The photopolymerization accelerator can reduce polymerization inhibition caused by air during curing and increase the curing speed, and examples of the accelerator include one or more types selected from p-dimethylaminobenzoic acid isoamyl ester, p-dimethylaminobenzoic acid ethyl ester, and the like.

The heat seal layer may contain additives such as leveling agents, UV absorbers, antioxidants, and antistatic agents, as long as they do not impair the effects of the present invention.

The thickness of the heat seal layer is preferably 0.5 to 5.0 μm, more preferably 0.6 to 4.0 μm, even more preferably 0.7 to 2.0 μm, and even more preferably 0.8 to 1.6 μm.
By making the thickness of the heat seal layer 0.5 μm or more, it is possible to easily improve the adhesive strength between the heat seal layer and the adherend.
In addition, by setting the thickness of the heat seal layer to 5.0 μm or less, the deformation of the antiglare layer can be suppressed, and the surface of the molded article can be easily provided with the desired antiglare properties. This is because the thinner the heat seal layer, the smaller the absolute amount of deformation of the heat seal layer and the smaller the strain transmitted to the antiglare layer.

Each layer, such as the heat seal layer and the antiglare layer, can be formed, for example, by applying a coating liquid containing the components constituting each layer, drying it, and irradiating it with ionizing radiation as necessary. These coating liquids preferably contain a solvent for the purposes of dissolving the components constituting each layer and adjusting the viscosity of the coating liquid. In addition, it is preferable to adjust the type and amount of the solvent according to the components constituting each layer and the desired viscosity.

- Indentation hardness measurement method -
In order to measure the indentation hardness of the heat seal layer, it is necessary to prepare a measurement sample in which the cross section of the heat seal layer is exposed. The sample can be prepared, for example, by the following steps (A1) to (A2).

(A1) The molded product is cut into a desired size (for example, a rectangular shape of 10 mm length × 3 mm width) to prepare a cut sample, and then the cut sample is embedded in a resin to prepare an embedded sample. The embedding resin is preferably an epoxy resin.
The embedded sample can be obtained, for example, by placing the cut sample in a silicon embedding plate (silicon capsule), pouring in embedding resin, hardening the embedding resin (in the case of the epoxy resin manufactured by Struers, which is exemplified below, it is preferable to leave it at room temperature for 12 hours to harden), and then removing the cut sample and the embedding resin that encases it from the silicon embedding plate (silicon capsule). Examples of the silicon embedding plate (silicon capsule) include those manufactured by Dosaka EM. The epoxy resin for embedding can be, for example, a mixture of Struers' product name "Epofix" and the same company's product name "Epofix Hardener" in a ratio of 10:1.2.

(A2) The embedded sample is cut vertically with a diamond knife to expose the cross section of the molded body, thereby preparing a sample for indentation hardness measurement. The embedded sample is preferably cut so as to pass through the center of the cut sample.
An example of an apparatus for cutting an embedded sample is the product name "Ultramicrotome EM UC7" manufactured by Leica Microsystems.

The indentation hardness of the cross section of the heat seal layer is measured by pressing a Berkovich indenter (material: diamond triangular pyramid) vertically into the cut surface of the above-mentioned sample. Here, it is preferable that the position where the Berkovich indenter is pressed is approximately the center in the thickness direction of the heat seal layer. Approximately the center means that when the thickness of the heat seal layer is defined as T [μm], the deviation from the center in the thickness direction of the heat seal layer is within ±0.1 T.

The indentation hardness is preferably measured under the following conditions.
<Measurement conditions>
Indenter used: Berkovich indenter (model number: TI-0039, manufactured by BRUKER)
Pressing conditions: Load control method Maximum load: 50 μN
Load application time: 10 seconds (load change rate: 5 μN/sec)
Holding time: 5 seconds Holding load: 50 μN
Load removal time: 10 seconds (load change rate: -5 μN/sec)

The indentation hardness can be calculated as follows.
First, the indentation depth h (nm) corresponding to the indentation load F (N) is continuously measured to create a load-displacement curve. The created load-displacement curve is analyzed, and the indentation hardness _HIT can be calculated as the maximum indentation load F _max (N) divided by the projected area A _p (mm ² ) where the indenter is in contact with the plastic film (the following formula (1)).
_HIT = _Fmax / _Ap ...(1)
Here, A _p is the contact projected area corrected for the indenter tip curvature by the Oliver-Pharr method using a standard sample of fused quartz (5-0098 manufactured by BRUKER).

In this specification, the indentation hardness of the heat seal layer means the average value of the measurements of 10 samples.

In this specification, the atmosphere for the measurements of indentation hardness and surface shape, which will be described later, is a temperature of 23°C ± 5°C and a humidity of 40 to 65%, unless otherwise specified. Furthermore, the sample is exposed to the above atmosphere for at least 30 minutes before the measurements.

<Anti-glare layer>
The antiglare layer is a layer located on the opposite side of the heat seal layer to the adherend. The antiglare layer makes the surface of the transfer layer (≒ surface of the molded article) uneven, and serves to impart antiglare properties to the molded article.
The antiglare layer preferably contains a binder resin and particles.

Examples of the binder resin for the antiglare layer include a cured product of a curable resin composition and a thermoplastic resin.
The binder resin of the antiglare layer preferably contains a cured product of a curable resin composition as a main component. In addition, an embodiment of the binder resin of the antiglare layer may contain a cured product of a curable resin composition and a thermoplastic resin.
When the binder resin contains a cured product of a curable resin composition as a main component, the hardness of the antiglare layer can be increased, and deformation of the antiglare layer can be easily suppressed. On the other hand, when the binder resin contains a cured product of a curable resin composition and a thermoplastic resin, the cured product of the curable resin composition can impart a predetermined hardness, while the thermoplastic resin can alleviate distortion generated in the heat seal layer, and deformation of the antiglare layer can be easily suppressed.

When the main component of the binder resin in the antiglare layer is a cured product of a curable resin composition, the content of the cured product of the curable resin composition is preferably 50% by mass or more of the total binder resin, more preferably 70% by mass or more, more preferably 90% by mass or more, more preferably 95% by mass or more, and more preferably 99% by mass or more.

When the binder resin of the antiglare layer contains a cured product of a curable resin composition and a thermoplastic resin, the blending ratio of the cured product of the curable resin composition to the thermoplastic resin is preferably 99:1 to 70:30, and more preferably 95:5 to 85:15.

Examples of the curable resin composition include a heat curable resin composition and an ionizing radiation curable resin composition. From the viewpoint of suppressing deformation, the ionizing radiation curable resin composition is preferred.
The thermoplastic resin, the thermosetting resin composition, and the ionizing radiation curable resin composition as the binder resin of the antiglare layer may be a general-purpose material, and examples thereof include those exemplified for the heat seal layer.

The particles may be one or more types selected from organic particles and inorganic particles.
Examples of organic particles include particles made of polymethyl methacrylate, polyacrylic-styrene copolymer, melamine resin, polycarbonate, polystyrene, polyvinyl chloride, benzoguanamine-melamine-formaldehyde condensate, silicone, fluorine-based resin, polyester resin, etc. Examples of inorganic particles include particles made of silica, alumina, antimony, zirconia, titania, etc.
Examples of the particles include spherical, disc-like, rugby ball-like, amorphous, and other shapes, and also include hollow particles, porous particles, and solid particles of these shapes. Among these, spherical solid particles are preferred from the viewpoint of ease of controlling the uneven shape.

The average particle size of the particles in the antiglare layer cannot be generalized because it varies depending on the thickness of the antiglare layer, but is preferably 0.1 to 10.0 μm, and more preferably 0.2 to 5.0 μm. Two or more types of particles with different average particle sizes can also be used.

The average particle size of the particles can be calculated by the following steps (i) to (iii).
(i) A transmitted observation image of the antiglare film is taken using an optical microscope, preferably at a magnification of 500 to 2000 times.
(ii) Randomly extract 10 large particles from the observed image, and calculate the particle diameter of each particle. The particle diameter is measured as the distance between two parallel lines that is the maximum distance between the two lines when the cross section of the particle is sandwiched between the two lines.
(iii) The same procedure is repeated five times on a separate observation image of the same sample, and the value obtained from the number average of the particle diameters of a total of 50 particles is regarded as the average particle diameter of the particles.

However, when the particles cannot be observed optically, the following (iv) to (vi) shall apply.
(iv) A slice is prepared from the antiglare film using a microtome, the slice being a cross section passing through the center of the particle. The thickness of the slice is preferably 70 nm to 100 nm. In order to obtain a slice that is a cross section passing through the center, multiple slices are prepared continuously for one particle, and the slice that has the maximum particle diameter calculated by the operation (v) from each slice can be used as the slice that is a cross section passing through the center.
(v) The obtained slice is observed under a scanning electron microscope (STEM) to calculate the particle size. The method for calculating the particle size is the same as in (ii). The magnification is preferably 5,000 to 20,000 times.
(vi) This procedure is carried out for 20 particles, and the value obtained by averaging the particle diameters of the 20 particles is regarded as the average particle diameter of the particles.

The amount of particles contained in the antiglare layer cannot be generalized because it varies depending on the desired level of antiglare properties, but it is preferably 0.5 to 50 parts by mass, more preferably 1.0 to 25 parts by mass, and even more preferably 1.5 to 20 parts by mass, per 100 parts by mass of binder resin.

The antiglare layer may contain additives such as leveling agents, ultraviolet absorbers, antioxidants, and antistatic agents, as long as they do not impair the effects of the present invention.

The thickness of the antiglare layer is preferably 1 to 30 μm, more preferably 2 to 15 μm, and even more preferably 3 to 7 μm.

Migration Suppression Layer
The transfer layer may have a migration-inhibiting layer located between the heat seal layer and the antiglare layer.
The migration-inhibiting layer has the role of inhibiting the components of the heat-sealing layer from migrating to the anti-glare layer. If the components of the heat-sealing layer migrate into the anti-glare layer, the anti-glare properties of the anti-glare layer may change. For this reason, by disposing the migration-inhibiting layer between the heat-sealing layer and the anti-glare layer, it is possible to easily impart the desired anti-glare properties to the surface of the molded article. It is considered that the components of the heat-sealing layer are more likely to migrate to the anti-glare layer side due to "heat" and "pressure from the adherend side toward the transfer layer side."

The migration-suppressing layer preferably contains a cured product of a curable resin composition as a main component. The main component means 50% by mass or more of the total solid content of the migration-suppressing layer, preferably 60% by mass or more, and more preferably 70% by mass or more.

The curable resin composition of the migration-preventing layer may be a heat-curable resin composition or an ionizing radiation-curable resin composition, with the ionizing radiation-curable resin composition being preferred.
The thermosetting resin composition and ionizing radiation curable resin composition of the migration-inhibiting layer may be general-purpose materials, and examples thereof include those exemplified for the heat seal layer.

The migration-inhibiting layer may contain a thermoplastic resin in addition to the cured product of the curable resin composition.

The migration-inhibiting layer may contain additives such as a leveling agent, an ultraviolet absorbing agent, an antioxidant, and an antistatic agent, as long as the effects of the present invention are not impaired.
From the viewpoint of suppressing migration, it is preferable that the migration-suppressing layer does not substantially contain particles. "Substantially not containing" means that the amount of particles is 0.1% by mass or less of the total solid content of the migration-suppressing layer, preferably 0.01% by mass or less, and more preferably 0% by mass.

The thickness of the migration-suppressing layer is preferably 0.5 to 5.0 μm, more preferably 0.7 to 4.0 μm, and even more preferably 1.0 to 3.0 μm.
By making the thickness of the migration-suppressing layer 0.5 μm or more, it is possible to easily suppress migration, and by making the thickness of the migration-suppressing layer 5.0 μm or less, it is possible to easily improve moldability.

<Anti-reflection layer>
From the viewpoint of imparting anti-reflection properties to the molded article, the transfer layer may have an anti-reflection layer located on the opposite side of the anti-glare layer to the heat seal layer.
The antireflection layer may have, for example, a single-layer structure of a low refractive index layer, or a laminate structure of a high refractive index layer and a low refractive index layer.

-Low refractive index layer-
The low refractive index layer is preferably disposed at a position farthest from the adherend among the layers constituting the transfer layer, that is, the low refractive index layer is preferably disposed on the outermost surface of the molded article.
In addition, by forming a high refractive index layer (described later) adjacent to the low refractive index layer on the antiglare layer side of the low refractive index layer, the antireflection properties can be further improved.

The refractive index of the low refractive index layer is preferably from 1.10 to 1.48, more preferably from 1.20 to 1.45, more preferably from 1.26 to 1.40, more preferably from 1.28 to 1.38, and even more preferably from 1.30 to 1.35.
The thickness of the low refractive index layer is preferably 80 to 120 nm, more preferably 85 to 110 nm, and even more preferably 90 to 105 nm. The thickness of the low refractive index layer is preferably larger than the average particle size of the low refractive index particles such as hollow particles.

The low refractive index particles include hollow particles and non-hollow particles.
The material of the hollow particles and non-hollow particles may be either an inorganic compound such as silica or magnesium fluoride, or an organic compound, but silica is preferred from the viewpoint of low refractive index and strength. Hereinafter, the hollow silica particles and non-hollow silica particles will be mainly described.

Hollow silica particles refer to particles that have a shell layer made of silica, the inside of the particle surrounded by the shell layer is hollow, and the inside of the cavity contains air.Hollow silica particles are particles that contain air, and the refractive index is reduced in proportion to the occupancy rate of gas compared to the refractive index of silica itself.Non-hollow silica particles are particles that are not hollow like hollow silica particles.Non-hollow silica particles are, for example, solid silica particles.
The shape of the hollow silica particles and non-hollow silica particles is not particularly limited, and may be a perfect sphere, a spheroid, or a nearly spherical shape such as a polyhedron that can approximate a sphere, etc. Among these, in consideration of scratch resistance, a perfect sphere, a spheroid, or a nearly spherical shape is preferable.

Since hollow silica particles contain air inside, they play a role in lowering the refractive index of the entire low refractive index layer. By using hollow silica particles with a large particle size and a high ratio of air, the refractive index of the low refractive index layer can be further lowered. On the other hand, hollow silica particles tend to have poor mechanical strength. In particular, when hollow silica particles with a large particle size and a high ratio of air are used, the scratch resistance of the low refractive index layer tends to be easily reduced.
The non-hollow silica particles, when dispersed in the binder resin, play a role in improving the scratch resistance of the low refractive index layer.

The average particle size of the hollow silica particles is preferably 50 nm or more and 100 nm or less, and more preferably 60 nm or more and 80 nm or less.
The average particle size of the non-hollow silica particles is preferably 5 nm or more and 20 nm or less, and more preferably 10 nm or more and 15 nm or less.

The surfaces of the hollow silica particles and non-hollow silica particles are preferably coated with a silane coupling agent, and it is more preferable to use a silane coupling agent having a (meth)acryloyl group or an epoxy group.
By subjecting the silica particles to a surface treatment with a silane coupling agent, the affinity between the silica particles and the binder resin is improved, and the silica particles are less likely to aggregate. A general-purpose silane coupling agent can be used.

The higher the content of the hollow silica particles, the higher the filling rate of the hollow silica particles in the binder resin, and the lower the refractive index of the low refractive index layer. Therefore, the content of the hollow silica particles is preferably 100 parts by mass or more, more preferably 150 parts by mass or more, relative to 100 parts by mass of the binder resin.
On the other hand, if the content of hollow silica particles relative to binder resin is too high, the hollow silica particles exposed from the binder resin increase, and the binder resin that bonds between particles decreases.As a result, the hollow silica particles tend to be easily damaged or fall off, and the mechanical strength of the low refractive index layer, such as scratch resistance, tends to decrease.For this reason, the content of hollow silica particles is preferably 400 parts by mass or less, more preferably 300 parts by mass or less, relative to 100 parts by mass of binder resin.

When the content of non-hollow silica particles is small, even if non-hollow silica particles are present on the surface of low refractive index layer, it may not affect hardness increase.In addition, when non-hollow silica particles are contained in a large amount, shrinkage unevenness caused by polymerization of binder resin can be suppressed.Therefore, the content of non-hollow silica particles is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, relative to 100 parts by mass of binder resin.
On the other hand, if the content of the non-hollow silica particles is too high, the non-hollow silica particles tend to aggregate, which may cause uneven shrinkage of the binder resin. Therefore, the content of the non-hollow silica particles is preferably 150 parts by mass or less, more preferably 100 parts by mass or less, and even more preferably 70 parts by mass or less, relative to 100 parts by mass of the binder resin.

The binder resin of the low refractive index layer preferably contains a cured product of an ionizing radiation curable resin composition. The ionizing radiation curable resin composition of the low refractive index layer may be a general-purpose material, such as those exemplified for the heat seal layer.

-High refractive index layer-
The high refractive index layer is formed on the antiglare layer side of the low refractive index layer as necessary. When a hard coat layer described later is provided, the high refractive index layer is preferably formed between the hard coat layer and the low refractive index layer.

The high refractive index layer has a refractive index of preferably 1.53 to 1.85, more preferably 1.54 to 1.80, more preferably 1.55 to 1.75, and even more preferably 1.56 to 1.70.
The thickness of the high refractive index layer is preferably 200 nm or less, more preferably 50 to 180 nm, and even more preferably 70 to 150 nm. When a high refractive index hard coat layer is used, the thickness is preferably similar to that of the hard coat layer.

The high refractive index layer can be formed, for example, from a coating liquid for forming a high refractive index layer that contains a binder resin composition and high refractive index particles. Examples of the binder resin composition include the curable resin composition exemplified in the hard coat layer described below.

High refractive index particles include antimony pentoxide (1.79), zinc oxide (1.90), titanium oxide (2.3-2.7), cerium oxide (1.95), tin-doped indium oxide (1.95-2.00), antimony-doped tin oxide (1.75-1.85), yttrium oxide (1.87) and zirconium oxide (2.10).

The average particle size of the high refractive index particles is preferably 2 nm or more, more preferably 5 nm or more, and even more preferably 10 nm or more. From the viewpoint of suppressing whitening and transparency, the average particle size of the high refractive index particles is preferably 200 nm or less, more preferably 100 nm or less, more preferably 80 nm or less, more preferably 60 nm or less, and even more preferably 30 nm or less. The smaller the average particle size of the high refractive index particles, the better the transparency, and by making it 60 nm or less, the transparency can be made extremely good.

The average particle size of the high refractive index particles or the low refractive index particles can be calculated by the following steps (y1) to (y3).
(y1) A cross section of the high refractive index layer or the low refractive index layer is imaged by a TEM or STEM. The acceleration voltage of the TEM or STEM is preferably 10 kV to 30 kV, and the magnification is preferably 50,000 to 300,000.
(y2) Randomly extract 10 particles from the observed image, and calculate the particle diameter of each particle. The particle diameter is measured as the distance between two parallel lines that is the maximum distance between the two lines when the cross section of the particle is sandwiched between the two lines. When the particles are aggregated, the aggregated particles are regarded as one particle and measured.
(y3) The same procedure is repeated five times on a separate observation image of the same sample, and the value obtained from the number average of the particle diameters of a total of 50 particles is regarded as the average particle diameter of the high refractive index particles or low refractive index particles.

The high refractive index layer and the low refractive index layer may contain additives such as leveling agents, UV absorbers, antioxidants, and antistatic agents, as long as they do not impair the effects of the present invention.

<Surface properties>
The molded article of the present invention preferably has an arithmetic average roughness Ra (Ra0.25) of 0.02 to 0.30 μm at a cutoff value of 0.25 mm according to JIS B0601:1994 on the surface of the molded article on the transfer layer side, more preferably 0.04 to 0.20 μm, and even more preferably 0.06 to 0.10 μm.
By making Ra0.25 0.02 μm or more, it is possible to easily impart antiglare properties, and by making Ra0.25 0.30 μm or less, it is possible to easily prevent the molded article from appearing whitish.

The Ra0.25 and reflectance of the molded body are preferably calculated as the average of the measured values at 8 locations excluding the minimum and maximum values of the measured values at any 10 locations. The measurement conditions for the Ra0.25 of the molded body are preferably the same as the measurement conditions for the Ra0.25 of the first release substrate described below.

The molded article of the present invention preferably has a reflectance of the surface on the transfer layer side of the molded article of 2.0% or less, more preferably 1.5% or less, and even more preferably 1.0% or less.

In this specification, the reflectance refers to the luminous reflectance Y value of the CIE 1931 standard color system.
In addition, when measuring the reflectance, a sample is prepared by attaching a black plate to the adherend side of the molded article via a transparent adhesive layer, and light is made incident from the release layer side of the sample at an incident angle of 5° to measure the reflectance. It is preferable to use D65 as a light source when measuring the reflectance.
The refractive index difference between the transparent adhesive layer and a member (e.g., a transparent plastic film) in contact with the sample's transparent adhesive layer is preferably within 0.15, more preferably within 0.10. The black plate preferably has a total light transmittance of 1% or less, more preferably 0%, according to JIS K7361-1:1997. The refractive index difference between the resin constituting the black plate and the transparent adhesive layer is preferably within 0.15, more preferably within 0.10.

[Transfer sheet]
The transfer sheet of the present invention has a transfer layer and a second release substrate on a first release substrate, and the transfer layer has at least a heat seal layer having an indentation hardness of 290 MPa or more in contact with the first release substrate, and an antiglare layer located on the opposite side of the heat seal layer from the first release substrate.

The transfer sheet of the present invention is preferably manufactured by forming a transfer layer on a first release substrate, and then laminating a second release substrate on the transfer layer. Furthermore, the transfer sheet of the present invention is preferably such that the peel strength between the second release substrate and the transfer layer (hereinafter referred to as "peel strength 2") is greater than the peel strength between the first release substrate and the transfer layer (hereinafter referred to as "peel strength 1").
By configuring the transfer sheet as described above, the transfer layer can easily exhibit its function when transferred to an adherend, for the following reasons.

When a functional layer is formed on an arbitrary substrate, the function may be substantially uniform in the thickness direction of the functional layer, but in many cases, the function is unevenly distributed in the thickness direction of the functional layer. In other words, the function is often different between the surface side of the functional layer and the substrate side of the functional layer. And, a typical functional coating material is designed to fully exert its function on the surface side of the functional layer.
By using the transfer sheet configured as described above to manufacture a molded body in accordance with steps (1) to (2) of the method for manufacturing a molded body of the present invention described below, the top and bottom in the thickness direction of the functional layer when manufactured can be made the same as the top and bottom in the thickness direction of the functional layer when transferred to the molded body, making it easier for the functional layer (anti-glare layer, etc.) contained in the transfer layer to exhibit its function.

<First release substrate>
The first release substrate can be any substrate that can be peeled off from the transfer layer without any particular limitation, and a plastic film is preferably used. The first release substrate is peeled off before the transfer and does not remain at the time of the transfer.

Examples of plastic films used as the first release substrate include plastic films formed from one or more of the following: polyolefin resins such as polyethylene and polypropylene; vinyl resins such as polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl acetate copolymer, and ethylene-vinyl alcohol copolymer; polyester resins such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene; polyamide resins such as nylon 6 or nylon 66; cellulose resins such as triacetyl cellulose; polycarbonate resins; and polyimide resins.

From the viewpoint of improving the releasability from the transfer layer and from the viewpoint of making peel strength 2 greater than peel strength 1, it is preferable that the surface of the first release substrate is release-treated with a release agent such as a fluorine-based release agent or a silicone-based release agent.
In addition, from the above-mentioned two viewpoints, it is preferable that the surface shape of the first release substrate is substantially smooth. Specifically, the surface of the first release substrate on which the transfer layer is formed preferably has an arithmetic average roughness Ra (Ra0.25) of JIS B0601:1994 at a cutoff value of 0.25 mm of less than 0.02 μm. The Ra0.25 of the first release substrate can be measured, for example, by preparing an evaluation sample by bonding a black acrylic plate (manufactured by Kuraray, product name "COMOGLAS 502K") via a transparent adhesive (manufactured by Hitachi Chemical Co., Ltd., product name "DA-1000") to the side of the first release substrate cut to 100 mm x 100 mm on which the transfer layer is not laminated, placing the sample on a horizontal surface, and measuring under the following measurement conditions. It is preferable that the Ra0.25 of the first release substrate is calculated as the average value of the measured values at 8 points excluding the minimum and maximum values of the measured values at any 10 points.

<Measurement conditions for Ra 0.25>
Reference length (cutoff value λc of roughness curve): 0.25 mm
Evaluation length (reference length (cutoff value λc) × 5): 1.25 mm
Stylus feed speed: 0.1 mm/s
Vertical magnification: 10,000 times Horizontal magnification: 50 times Skid: Not used (no contact with the measurement surface)
Cutoff filter type: Gaussian JIS mode: JIS 1994

The first release substrate may have an antistatic layer to suppress peeling static electricity.

The thickness of the first release substrate is not particularly limited, but from the viewpoint of ease of handling, it is preferably from 10 to 500 μm, more preferably from 20 to 400 μm, and even more preferably from 30 to 300 μm.
In addition, when the thickness of the first release substrate is T1 and the thickness of the second release substrate is T2, from the viewpoint of handling after peeling off the first release substrate, T2/T1 is preferably more than 1.00, more preferably 1.10 or more, and even more preferably 1.20 or more. In addition, from the viewpoint of suppressing curling of the transfer sheet, T2/T1 is preferably 2.00 or less, more preferably 1.80 or less, and even more preferably 1.60 or less.

<Transfer Layer>
The embodiments of the layers constituting the transfer layer of the transfer sheet (the heat seal layer and the antiglare layer, and the migration suppression layer and the antireflection layer, if necessary) are as described above for the molded article.
As described above, the transfer layer is preferably formed on the first release substrate.

<Second release substrate>
The second release substrate is what remains upon transfer.
The second release substrate can be any substrate that can be peeled off from the transfer layer without any particular limitation, and a plastic film is preferably used.
As the plastic film used as the second release substrate, the same materials as those exemplified as the plastic film of the first release substrate can be used.

It is preferable that the surface of the second release substrate on the transfer layer side is substantially smooth. Specifically, it is preferable that the surface of the second release substrate on the transfer layer side has an arithmetic mean roughness Ra (Ra0.25) of less than 0.02 μm according to JIS B0601:1994 at a cutoff value of 0.25 mm. The Ra0.25 of the second release substrate can be measured by the same method as the Ra0.25 of the first release substrate.

Since the second release substrate remains during transfer, it is preferable that it has good conformability to the shape of the substrate. Specifically, the second release substrate preferably has an elongation at break of 70% or more, more preferably 80% or more, in a tensile property test conforming to JIS K7127:1999. If the second release substrate is stretchable, a shrinking force is generated in the second release substrate after laminating the second release substrate on the transfer layer, and the first release substrate is easily peeled off from the transfer layer. For this reason, when a second release substrate that is stretchable is used, it is preferable to increase the peel strength 1 (peel strength 1 is preferably 40 mN/25 mm or more, more preferably 50 mN/25 mm or more).

From the viewpoint of making the peel strength 2 larger than the peel strength 1 while enabling peeling from the transfer layer, the second release substrate preferably has an adhesive layer with weak adhesive strength on its surface.
The adhesive contained in the adhesive layer on the surface of the second release substrate is preferably an adhesive having a weak adhesive strength such that the peel strength 2 falls within the range described below.

The second release substrate may have an antistatic layer from the viewpoint of suppressing peeling static electricity.
The thickness of the second release substrate is not particularly limited, but from the viewpoints of handleability after peeling off the first release substrate and conformability to the shape of the adherend, it is preferably 5 to 100 μm, more preferably 10 to 80 μm, and even more preferably 20 to 70 μm.

<Peel strength>
Of the two release substrates included in the transfer sheet, the first release substrate is peeled off before transfer and does not remain at the time of transfer, while the second release substrate remains at the time of transfer. In order to enable only the first release substrate to be peeled off before transfer, it is preferable that the transfer sheet has a peel strength (peel strength 2) between the second release substrate and the transfer layer greater than the peel strength (peel strength 1) between the first release substrate and the transfer layer.

From the viewpoint of facilitating peeling of only the first release substrate before transfer, the difference between the peel strength 2 and the peel strength 1 (peel strength 2 - peel strength 1) is preferably 15 mN/25 mm or more, more preferably 40 mN/25 mm or more, and even more preferably 100 mN/25 mm or more. If the difference is too large, it may be difficult to peel the second release substrate after transfer, so the difference is preferably 450 mN/25 mm or less, and more preferably 350 mN/25 mm or less.
From the viewpoint of suppressing the detachment of the first release substrate, the peel strength 1 is preferably 10 mN/25 mm or more, more preferably 20 mN/25 mm or more, and even more preferably 30 mN/25 mm or more. From the viewpoint of easily achieving a difference from the peel strength 2, the peel strength 1 is preferably 90 mN/25 mm or less, and more preferably 70 mN/25 mm or less.
From the viewpoint of easily achieving a difference from the peel strength 1, the peel strength 2 is preferably 100 mN/25 mm or more, more preferably 120 mN/25 mm or more, and even more preferably 140 mN/25 mm or more. Moreover, from the viewpoint of suppressing cohesive failure of the adhesive layer and the transfer layer of the second release substrate when the second release substrate is peeled off, the peel strength 2 is preferably 600 mN/25 mm or less, more preferably 500 mN/25 mm or less, and even more preferably 400 mN/25 mm or less.
In this specification, the peel strength can be measured in accordance with the 180-degree peel test of JIS Z0237:2009. The atmosphere in which the peel strength is measured is preferably 23°C and humidity 40 to 65%. In addition, it is preferable to allow the sample to acclimate to the above atmosphere for 30 minutes before measuring the peel strength. The measurement is performed three times for each sample, and the average value is taken as the peel strength.

[Method of manufacturing molded body]
The method for producing a molded article of the present invention involves sequentially carrying out the following steps (1) and (2).
(1) A step of peeling off the first release substrate from the transfer sheet of the present invention described above, and heat-pressing the exposed surface of the transfer layer on the heat seal layer side to an adherend to obtain a laminate.
(2) A step of peeling off the second release substrate from the laminate to obtain a molded article having a transfer layer on an adherend.

<Step (1)>
Step (1) is a step of peeling off the first release substrate of the transfer sheet of the present invention described above, and heat-pressing the exposed surface of the transfer layer on the heat seal layer side to an adherend to obtain a laminate.

《Substrate》
The material of the adherend is not particularly limited, and examples thereof include one selected from inorganic materials such as glass and ceramics, and resins, or a mixture thereof.

When in-mold molding is performed, it is preferable to use an injection-moldable thermoplastic resin or thermosetting resin as the adherend, and among these, a thermoplastic resin is more preferable.
Examples of thermoplastic resins include polystyrene-based resins, polyolefin-based resins, ABS resins (including heat-resistant ABS resins), AS resins, AN resins, polyphenylene oxide-based resins, polycarbonate-based resins, polyacetal-based resins, acrylic-based resins, polyethylene terephthalate-based resins, polybutylene terephthalate-based resins, polysulfone-based resins, and polyphenylene sulfide-based resins.
Among these, acrylic resins are preferred from the viewpoints of transparency and weather resistance, and polycarbonate resins are preferred from the viewpoint of impact resistance.

The shape of the adherend is not particularly limited, and may be a flat plate or may have a three-dimensional shape. The thickness of the adherend is also not particularly limited.
The adherend may be one that has been molded in advance, or one that is molded during step (1) such as in-mold molding.

<Heat compression bonding>
The heat-pressure bonding in the step (1) may be performed by heat-pressure bonding using a roll transfer machine or by heat-pressure bonding using an injected resin during in-mold molding.

The method for producing a molded article of the present invention preferably includes, as step (1), the following steps (a) to (c):
Carrying out the following steps (a) to (c) as step (1) and then carrying out step (2) means so-called "in-mold molding." In the case of in-mold molding, since a large pressure is likely to be applied from the adherend side toward the transfer layer side, the effect of making the indentation hardness of the heat seal layer 290 MPa or more can be more prominent.

(a) A step of peeling off the first release substrate of the transfer sheet of the present invention described above, and placing the exposed surface of the transfer layer facing the heat seal layer side toward the inside of an in-mold molding die.
(b) A step of injecting a resin into the in-mold molding die.
(c) A step of obtaining a laminate by integrating the surface of the transfer layer facing the heat seal layer with the resin.

<Step (2)>
Step (2) is a step of peeling the second release substrate from the laminate to obtain a molded article having a transfer layer on an adherend.

The present invention will be specifically described below with reference to examples and comparative examples. Note that the present invention is not limited to the embodiments described in the examples.

1. Measurement and Evaluation 1-1. Indentation Hardness of Heat Seal Layer of Molded Article According to the preferred methods exemplified in (A1) and (A2) of the present specification, a measurement sample in which the cross section of the heat seal layer was exposed was prepared.
The embedded sample was cut using a Leica Microsystems Ultramicrotome EM UC7. The embedded sample was cut so as to pass through the center of the cut sample. The cutting was performed roughly at first (rough trimming), and then precisely under the conditions of "SPEED: 1.00 mm/s" and "FEED: 70 nm" so that the cut surface passing through the center of the sample was approximately flat. After precise trimming, the cut surface was checked with a microscope to ensure that there were no foreign objects or irregularities that would hinder the measurement.
Next, a Berkovich indenter (material: diamond triangular pyramid) was pressed vertically into the cross section of the exposed heat seal layer using the measurement sample, and the indentation hardness was measured under the following measurement conditions. The position where the Berkovich indenter was pressed was approximately the center in the thickness direction of the heat seal layer. The average value of the measured values of 10 samples was taken as the indentation hardness of each Example and Comparative Example. The results are shown in Table 1.
<Measurement conditions>
Indenter used: Berkovich indenter (model number: TI-0039, manufactured by BRUKER)
Pressing conditions: Load control method Maximum load: 50 μN
Load application time: 10 seconds (load change rate: 5 μN/sec)
Holding time: 5 seconds Holding load: 50 μN
Load removal time: 10 seconds (load change rate: -5 μN/sec)

1-2. Transmitted image clarity (JIS K7374:2007 Transmitted image clarity)
For the transfer sheets of the Examples and Comparative Examples, the transmitted image clarity was measured at the stage where a transfer layer was formed on the first release substrate (at the stage where a second release substrate was not laminated on the transfer layer). The light incident surface was the low refractive index layer side (opposite side to the first release substrate). The measurement device used was an image clarity measuring device (product name: ICM-1T) manufactured by Suga Test Instruments Co., Ltd. The total transmitted image clarity for the four optical comb widths (0.25 mm, 0.5 mm, 1.0 mm, and 2.0 mm) is shown in Table 1.
The transmitted image clarity of the molded bodies of the examples and comparative examples was measured. The light incident surface was the low refractive index layer side (opposite to the adherend). The measuring device used was the same as that used to measure the transfer sheet. The total transmitted image clarity of the four optical comb widths (0.25 mm, 0.5 mm, 1.0 mm, and 2.0 mm) is shown in Table 1.
The ratio of the total transmitted image clarity of the transfer sheet to the total transmitted image clarity of the molded body is shown in Table 1. If the "transmitted image clarity of the molded body/transfer image clarity" is 1.50 or less, it is at the pass level. In Table 1, the ratio of 1.50 or less is marked as "good", and the ratio exceeding 1.50 is marked as "poor".

1-3. Adhesion A grid of 1 mm squares was cut into 100 squares on the transfer layer side of the molded articles of the Examples and Comparative Examples, and Nichiban Cellotape (registered trademark) No. 405 (industrial use 24 mm) was attached, rubbed with a spatula to adhere, and then rapidly peeled off three times in a 90 degree direction. The remaining squares were visually confirmed and shown in Table 1 as a percentage.

2. Preparation of transfer sheet and molded product [Example 1]
A coating solution 1 for forming a heat seal layer having the following formulation was applied onto a polyethylene terephthalate film (first release substrate) having a thickness of 38 μm and a size of 200 mm × 600 mm, the film having a release-treated surface, dried (100°C, 60 seconds), and irradiated with ultraviolet light to form a heat seal layer having a thickness of 0.8 μm.
Next, migration-inhibiting layer forming coating solution 1 having the following formulation was applied onto the heat seal layer, dried (70° C., 30 seconds), and irradiated with ultraviolet light to form a migration-inhibiting layer having a thickness of 2.0 μm.
Next, coating solution 1 for forming an antiglare layer having the following formulation was applied onto the migration-inhibiting layer, dried (70° C., 30 seconds), and irradiated with ultraviolet light to form an antiglare layer having a thickness of 5.0 μm.
Next, low refractive index layer forming coating solution 1 having the following formulation was applied onto the antiglare layer, dried (50° C., 60 seconds), and irradiated with ultraviolet light to form a low refractive index layer having a thickness of 100 nm and a refractive index of 1.30.
Next, a second release substrate (manufactured by San-A Chemical Industries, Ltd., product name "SAT TS1050TRL") having a pressure-sensitive adhesive layer on a 50 μm thick polyethylene terephthalate film was prepared, and the adhesive layer side of the second release substrate was bonded to the low refractive index layer to obtain a transfer sheet of Example 1. The transfer sheet of Example 1 has a first release substrate, a heat seal layer, a migration suppression layer, an antiglare layer, a low refractive index layer, and a second release substrate in this order.

Next, the first release substrate of the transfer sheet was peeled off to expose the heat seal layer. Since the first release substrate can be peeled off from the transfer sheet while leaving the second release substrate, the transfer sheet of Example 1 shows that the peel strength 2 is greater than the peel strength 1.
Next, the transfer sheet with the heat seal layer exposed was placed in an in-mold molding die such that the surface on the heat seal layer side faced the inside of the die (the side in contact with the injected resin).
Next, the mold was clamped, and an injection resin (polycarbonate resin) was injected into the mold, and the heat seal layer side of the transfer sheet and an adherend (thickness 1.3 mm) made of the injection resin were heated and pressed together to obtain a laminate.
Next, the second release substrate was peeled off from the laminate to obtain a molded article having a transfer layer on the adherend of Example 1. The molded article of Example 1 has an adherend, a heat seal layer, a migration suppression layer, an antiglare layer, and a low refractive index layer in this order.

<Coating solution 1 for forming heat seal layer>
Thermoplastic resin: 18.6 parts by mass (polyester-based urethane resin, manufactured by Toyobo Co., Ltd., product name: Vylon UR8210)
UV-curable compound: 1.48 parts by mass (polyfunctional urethane acrylate oligomer, manufactured by Taisei Fine Chemical Co., Ltd., product name: 8UX-015A)
Fluorine-based leveling agent: 0.07 parts by mass (manufactured by DIC Corporation, product name: MEGAFACE F-568)
・Photopolymerization initiator 0.15 parts by mass (IGM Resins BV, trade name: Omnirad 184)
Dilution solvent: 79.7 parts by weight (MEK alone)

<Migration-Suppressing Layer-Forming Coating Solution 1>
UV-curable compound: 40.8 parts by mass (acrylic polymer, manufactured by Taisei Fine Chemical Co., Ltd., product name: 8KX-077)
UV-curable compound: 4.1 parts by mass (polyfunctional urethane acrylate, manufactured by Daiichi Kogyo Seiyaku Co., Ltd., product name: GX-8871A (70))
Fluorine-based leveling agent: 0.15 parts by mass (manufactured by DIC Corporation, product name: MEGAFACE F-560)
・Photopolymerization initiator 0.77 parts by mass (IGM Resins BV, product name: Omnirad 184)
Dilution solvent: 54.2 parts by weight (MEK/IPA = 70/30 mixture)

<Coating liquid 1 for forming anti-glare layer>
UV-curable compound: 25.1 parts by mass (acrylic polymer, manufactured by Taisei Fine Chemical Co., Ltd., product name: 8KX-077)
UV-curable compound: 25.4 parts by mass (polyfunctional acrylate, manufactured by Nippon Kayaku Co., Ltd., product name: PET-30)
・Photopolymerization initiator 1.0 parts by mass (IGM Resins BV, trade name: Omnirad 184)
Organic particles: 1.4 parts by mass (styrene acrylic particles, average particle size 3.9 μm)
Organic particles: 6.6 parts by mass (styrene acrylic particles, average particle size 3.5 μm)
Inorganic particles: 2.8 parts by mass (fumed silica, average particle size 250 μm)
Silicone leveling agent: 0.30 parts by mass (manufactured by Momentive Performance Materials, product name: TSF4460)
Dilution solvent: 37.4 parts by weight (toluene/IPA/PMA = 47/33/20 mixed solution)

<Coating solution 1 for forming low refractive index layer>
UV-curable compound: 0.6 parts by mass (tri- to tetrafunctional alkoxylated pentaerythritol acrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., product name: NK Ester ATM-4PL)
・Photopolymerization initiator 0.1 part by mass (IGM Resins BV, product name: Omnirad 127)
Hollow silica 1.88 parts by mass (average particle size 60 nm)
Solid silica 0.3 parts by mass (average particle size 12 nm)
Fluorine-based antifouling agent: 1.16 parts by mass (manufactured by DIC Corporation, product name: MEGAFACE F-568)
Dilution solvent: 92.7 parts by mass (a 90/10 mixture of methyl isobutyl ketone and propylene glycol monomethyl ether acetate)

[Example 2]
A transfer sheet and a molded product of Example 2 were obtained in the same manner as in Example 1, except that the thickness of the heat seal layer was changed to 2.4 μm.

[Example 3]
A transfer sheet and a molded product of Example 3 were obtained in the same manner as in Example 1, except that the coating liquid 1 for forming an antiglare layer was changed to the coating liquid 2 for forming an antiglare layer described below.

<Coating liquid 2 for forming anti-glare layer>
UV-curable compound: 23.7 parts by mass (multifunctional urethane acrylate, manufactured by DIC Corporation, product name: Luxidia ERS-543)
UV-curable compound: 18.5 parts by mass (acrylic polymer, manufactured by DIC Corporation, product name: Luxidia EKS-796)
Ultraviolet absorber: 0.74 parts by mass (hydroxyphenyltriazine type, manufactured by BASF Japan Ltd., product name: Tinuvin 477)
UV-curable compound: 1.85 parts by mass (acrylic resin, manufactured by Arakawa Chemical Industries, Ltd., product name: DSR-1)
・Photopolymerization initiator 0.84 parts by mass (IGM Resins BV, product name: Omnirad 184)
Organic particles: 5.17 parts by mass (styrene particles, average particle size 2.0 μm)
Organic particles: 0.72 parts by mass (fumed silica, average particle size 200 nm)
Silicone leveling agent: 0.27 parts by mass (manufactured by Momentive Performance Materials, product name: TSF4460)
Dilution solvent: 48.3 parts by mass (mixture of toluene/IPA = 60/40)

[Example 4]
A transfer sheet and a molded product of Example 4 were obtained in the same manner as in Example 1, except that the heat-sealing layer forming coating liquid 1 was changed to the heat-sealing layer forming coating liquid 2 described below.

<Coating solution 2 for forming heat seal layer>
Thermoplastic resin: 10 parts by mass (polyester resin, manufactured by Toyobo Co., Ltd., product name: Vylon-UR4800)
Fluorine-based leveling agent: 0.15 parts by mass (manufactured by DIC Corporation, product name: MEGAFACE F-560)
Dilution solvent: 90 parts by weight (MEK alone)

[Comparative Example 1]
A transfer sheet and a molded product of Comparative Example 1 were obtained in the same manner as in Example 1, except that the heat seal layer forming coating liquid 1 was changed to the heat seal layer forming coating liquid 3 described below.

<Coating solution 3 for forming heat seal layer>
Thermoplastic resin: 10 parts by mass (polyester-based urethane resin, manufactured by Toyobo Co., Ltd., product name: Vylon UR8210)
Fluorine-based leveling agent: 0.15 parts by mass (manufactured by DIC Corporation, product name: MEGAFACE F-560)
Dilution solvent: 90 parts by weight (MEK alone)

From the results in Table 1, it can be seen that by setting the indentation hardness of the heat seal layer to 290 MPa or more, as in Examples 1 to 4, the change in transmitted image clarity is small. This means that by setting the indentation hardness of the heat seal layer to 290 MPa or more, it is possible to impart the desired antiglare properties to the surface of the molded article.

10: Adherend 20: Transfer layer 21: Heat seal layer 22: Migration inhibitor layer 23: Antiglare layer 24: Low refractive index layer 30: First release substrate 40: Second release substrate 41: Substrate 42: Peelable adhesive layer 100: Molded body 200: Transfer sheet

Claims (9)

A molded article having a transfer layer on an adherend, the transfer layer having at least a heat seal layer in contact with the adherend and an antiglare layer located on the opposite side of the heat seal layer from the adherend,
The heat seal layer contains a thermoplastic resin and a cured product of a curable resin composition,
The antiglare layer contains a binder resin and particles,
The molded article, wherein the indentation hardness of the heat seal layer is 290 MPa or more and 480 MPa or less . The molded article according to claim 1, wherein the heat seal layer has a thickness of 0.5 to 5.0 μm. the transfer layer has a migration-inhibiting layer between the heat seal layer and the antiglare layer,
The molded article according to claim 1 , wherein the migration-inhibiting layer contains a cured product of a curable resin composition in an amount of 50 mass % or more based on a total solid content of the migration-inhibiting layer. The molded article according to any one of claims 1 to 3, wherein the transfer layer has an anti-reflection layer located on the opposite side of the anti-glare layer from the heat seal layer. The molded body according to any one of claims 1 to 4, wherein the surface of the molded body on the transfer layer side has an arithmetic mean roughness Ra of 0.02 to 0.30 μm according to JIS B0601:1994 at a cutoff value of 0.25 mm. A transfer layer and a second release substrate are provided in this order on a first release substrate, the transfer layer having at least a heat seal layer contacting the first release substrate and having an indentation hardness of 290 MPa or more and 480 MPa or less , and an antiglare layer located on the opposite side of the heat seal layer to the first release substrate ,
The heat seal layer contains a thermoplastic resin and a cured product of a curable resin composition,
The transfer sheet , wherein the antiglare layer contains a binder resin and particles . The transfer sheet according to claim 6 , wherein the surface of the second release substrate facing the transfer layer has an arithmetic average roughness Ra of less than 0.02 μm at a cutoff value of 0.25 mm according to JIS B0601:1994. A method for producing a molded body, comprising the steps of (1) to (2) below in sequence:
(1) A process for obtaining a laminate by peeling off the first release substrate of the transfer sheet according to claim 6 or 7 and heat-pressing the exposed surface of the transfer layer on the heat seal layer side to an adherend.
(2) A step of peeling off the second release substrate from the laminate to obtain a molded article having a transfer layer on an adherend. The method for producing a molded body according to claim 8, wherein the step (1) comprises the following steps (a) to (c):
(a) A step of peeling off the first release substrate of the transfer sheet according to claim 6 or 7, and arranging the exposed surface of the transfer layer on the heat seal layer side facing the inside of an in-mold molding die.
(b) A step of injecting a resin into the in-mold molding die.
(c) A step of obtaining a laminate by integrating the surface of the transfer layer facing the heat seal layer with the resin.