JP7528604B2 - Display panel substrate and method for manufacturing the display panel - Google Patents

Description

This embodiment relates to a display panel substrate on which a display panel is mounted and a method for manufacturing the display panel.

Liquid crystal panels are manufactured by sealing liquid crystal between a pair of transparent substrates. A known method of manufacturing liquid crystal panels is to bond two glass substrates called mother substrates, which have electrodes for multiple liquid crystal panels built in, together with a seal, divide the mother substrate into multiple liquid crystal panel units, and seal liquid crystal into each liquid crystal panel to simultaneously produce multiple liquid crystal panels. One method of manufacturing such liquid crystal panels is to place a seal pattern on the cut line of two adjacent liquid crystal panels, and then separate these two adjacent liquid crystal panels in the center of the seal pattern. Hereinafter, this method will be referred to as seal separation. Using seal separation makes it possible to narrow the frame of each liquid crystal panel.

Chinese Patent No. 101118334

When cutting the motherboard using seal cutting, diagonal cracks in the board, chipping of the glass, and tiny pieces of glass flying off can occur at points where the seal is not cut, such as the start and end points of the seal cutting.

The embodiment provides a manufacturing method for a display panel substrate and a display panel that suppresses cracks and other defects that occur when the seal is severed.

The display panel substrate of the first aspect includes a first substrate, a second substrate disposed opposite the first substrate, a first seal formed between the first substrate and the second substrate so that the first substrate and the second substrate form a first display panel, a second seal formed between the first substrate and the second substrate so that the first substrate and the second substrate form a second display panel, and a transfer that conductively connects the first substrate and the second substrate that form the first display panel. The first seal and the second seal are common to the cut line between the first display panel and the second display panel. The transfer is formed outside the first seal on the first substrate and on the first display panel side of the cut line. A structure that does not conductively connect the first substrate and the second substrate is formed at a position symmetrical to the transfer with respect to the cut line.

The display panel substrate of the second aspect includes a first substrate, a second substrate disposed opposite to the first substrate, a first seal formed between the first substrate and the second substrate so as to form a first display panel together with the first substrate, a second seal formed between the first substrate and the second substrate so as to form a second display panel together with the first substrate, and a transfer conductively connecting the first substrate and the second substrate forming the first display panel. The transfer is formed at a position on the first substrate that is more inward than the first seal. The first seal and the second seal are common to the cut line between the first display panel and the second display panel, and are formed symmetrically with respect to the cut line.

The manufacturing method of the display panel of the third aspect includes forming a first substrate, forming a second substrate, forming a seal pattern on the first substrate, the seal pattern including a first seal and a second seal that are common to the cut line of the first display panel and the second display panel, forming a transfer conductively connecting the first substrate and the second substrate that form the first display panel at a position on the first substrate outside the first seal and on the first display panel side of the cut line, forming a structure that does not conductively connect the first substrate and the second substrate at a position symmetrical to the transfer with respect to the cut line, forming the first substrate and the second substrate by bonding the first substrate and the second substrate together, and dividing the first substrate and the second display panel at the cut line.

The fourth aspect of the manufacturing method of the display panel includes forming a first substrate, forming a second substrate, forming a seal pattern on the first substrate for forming the first display panel and the second display panel, the seal pattern including a first seal and a second seal that are common to the cut line of the first display panel and the second display panel and are symmetrical with respect to the cut line, forming a transfer conductively connecting the first substrate and the second substrate that form the first display panel at a position inside the first seal on the first substrate, forming the first display panel and the second substrate by bonding the first substrate and the second substrate together, and dividing the first display panel and the second display panel at the cut line.

According to the embodiment, it is possible to provide a display panel substrate and a manufacturing method for a display panel that suppresses cracks and other defects when the seal is severed.

FIG. 1A is a plan view showing the configuration of a display panel according to each embodiment. FIG. 1B is a cross-sectional view taken along line 1B-1B of FIG. 1A. FIG. 2 is a diagram showing a display panel substrate according to each embodiment for manufacturing a display panel. FIG. 3 is an enlarged view of a region near the end of the cut line shown in FIG. 2 in the first embodiment. FIG. 4 is a flowchart showing an example of a manufacturing method of the display panel according to the first embodiment. FIG. 5A is a diagram showing seal separation in a state where a dummy transfer is not formed on a display panel. FIG. 5B is a diagram showing how the seal breaks when a dummy transfer is formed on the display panel. FIG. 6 is a diagram showing a structure of the first modified example. FIG. 7 is a diagram showing a structure of the second modified example. FIG. 8 is an enlarged view of a region near the end of the cut line shown in FIG. 2 in the second embodiment.

Hereinafter, an embodiment will be described with reference to the drawings.
[First embodiment]
FIG. 1A is a plan view showing the configuration of a display panel according to each embodiment. FIG. 1B is a cross-sectional view taken along line 1B-1B of FIG. 1A. As shown in FIG. 1A, the display panel 1 is a liquid crystal panel, and has a first substrate 10 and a second substrate 20. The first substrate 10 and the second substrate 20 are, for example, glass substrates. As shown in FIG. 1B, a liquid crystal layer 30 is interposed between the first substrate 10 and the second substrate 20. The seal 40 is made of, for example, a resin, and bonds the first substrate 10 and the second substrate 20 while sealing the liquid crystal of the liquid crystal layer 30 so that it does not leak out. The cell gap, which is the distance between the first substrate 10 and the second substrate 20, is kept constant by a spacer (not shown). Here, a display area a is set in the display panel 1. The display area a is an area actually used to display an image in the display panel 1.

In the display area a of the first substrate 10, scanning lines 11, signal lines 12, and pixels 13 are formed. The scanning lines 11 are formed along the horizontal direction of the display area a, and are connected to a scanning line driving circuit (not shown). The signal lines 12 are formed so as to intersect with the scanning lines 11 in the vertical direction of the display area a, and are connected to a signal line driving circuit (not shown). The pixels 13 are formed near the intersections of the scanning lines 11 and the signal lines 12. The pixels 13 include pixel electrodes and switching elements. The pixel electrodes and the switching elements are covered with an alignment film. The pixel electrodes are transparent electrodes such as ITO. The switching elements are, for example, thin film transistors (TFTs), and are connected to the scanning lines 11, the signal lines 12, and the pixel electrodes. The switching elements are turned on or off in response to a scanning signal sent from the scanning line driving circuit via the scanning line 11. When the switching elements are turned on, a gradation voltage sent from the signal line driving circuit via the signal line 12 is applied to the pixel electrodes.

A common electrode 21 is formed in the display area a of the second substrate 20. The common electrode 21 is formed to face each pixel 13 of the first substrate 10, and is connected to a common electrode driving circuit (not shown). The common electrode 21 is covered with an alignment film. A common voltage is applied to the common electrode 21 by the common electrode driving circuit.

When the switching element is turned on, a gradation voltage is applied to the pixel electrode of pixel 13. Meanwhile, a common voltage is applied to the common electrode 21. Therefore, a voltage corresponding to the difference between the gradation voltage and the common voltage is applied to the liquid crystal layer 30 interposed between the pixel electrode of pixel 13 and the common electrode 21. Liquid crystal has the property of changing the light transmittance by applying a voltage. For example, a light source is arranged on the back surface of the display panel 1, and the transmittance of light from the light source when it passes through the liquid crystal layer 30 is changed, thereby enabling gradation display for each pixel 13.

Figure 2 is a diagram showing a display panel substrate according to each embodiment for manufacturing a display panel. In the embodiment, the display panel substrate 100 is a substrate on which multiple display panels having the configuration shown in Figure 1 are simultaneously formed. Figure 2 shows an example in which two display panels 1a and 1b are formed in the display panel substrate 100. For example, when the direction along the horizontal direction of the display panel is the row direction and the direction along the vertical direction is the column direction, the display panels 1a and 1b are formed adjacent to each other in the row direction. A cut line CL is set at the boundary between the display panels 1a and 1b in the row direction. After the formation of the display panels 1a and 1b is completed, the display panels 1a and 1b are separated at the cut line CL.

As shown in FIG. 2, the sticker 40a of the display panel 1a and the sticker 40b of the display panel 1b are formed so as to be common to each other at the cut line CL. In this case, the display panels 1a and 1b are separated from each other along the cut line CL. When the stickers are separated in this manner, the positions at which the stickers of each display panel are formed can be moved to the position of the cut line. This allows the display panels to have a narrower frame.

3 is an enlarged view of the region R near the end of the cut line CL shown in FIG. 2 in the first embodiment. In the liquid crystal panel, a transfer is formed to electrically connect the first substrate 10 and the second substrate 20. In FIG. 3, the transfer 50a of the display panel 1a is formed in an empty area in the upper right corner of the display panel 1a, which is composed of the seal 40a and the cut line CL. The transfer 50a is made of a conductive paste such as silver paste or carbon paste. The transfer 50a can be connected to a lead-out wiring for connecting the first substrate 10 and the second substrate 20 to a circuit such as a scanning line driving circuit, a signal line driving circuit, or a common electrode driving circuit outside the display panel 1a. Although not shown in FIG. 3, the transfer can also be formed in the empty area in the upper right corner of the display panel 1b.

Here, in the embodiment, a dummy transfer 50b is formed as a structure at a position symmetrical to the transfer 50a with respect to the cut line CL. That is, in FIG. 3, the dummy transfer 50b of the display panel 1b is formed in the empty area in the upper left corner of the display panel 1b, which is composed of the seal 40b and the cut line CL. The dummy transfer 50b may be formed of the same material and with the same structure as the transfer 50a. However, unlike the transfer 50a, the dummy transfer 50b is not connected to circuits such as the scanning line driving circuit, the signal line driving circuit, or the common electrode driving circuit.

Figure 4 is a flowchart showing an example of a method for manufacturing a display panel according to the first embodiment. Below, for the sake of simplicity, a method for manufacturing the display panel 1a and the display panel 1b shown in Figure 2 will be described.

In step S1, the scanning lines 11, signal lines 12, and pixels 13 constituting the display panel 1a, and the scanning lines 11, signal lines 12, and pixels 13 constituting the display panel 1b are formed on a first mother substrate for forming the first substrate 10. The formation of the scanning lines 11, signal lines 12, and pixels 13 can be performed by any method.

In step S2, a common electrode 21 constituting the display panel 1a and a common electrode 21 constituting the display panel 1b are formed on a second mother substrate for forming the second substrate 20. The common electrode 21 can be formed by any method.

In step S3, a seal pattern is formed on the first mother substrate. As described above, the seal pattern is formed so that the seal of display panel 1a and the seal of display panel 1b are common to each other at the cut line between display panel 1a and display panel 1b. The seal pattern is also formed so that each display panel has an injection port for injecting liquid crystal in a later process. The seal pattern may be formed on the second mother substrate.

In step S4, a transfer is formed on the first mother substrate. The transfer may also be formed on the second mother substrate.

In step S5, a dummy transfer is formed on the first mother substrate. As described above, the dummy transfer is formed in a position symmetrical to the transfer with respect to the cut line between display panel 1a and display panel 1b. The dummy transfer may be formed on the second mother substrate. Also, the formation of the transfer in step S4 and the formation of the dummy transfer in step S5 may be performed in the same process.

In step S6, the first mother substrate and the second mother substrate are bonded together.

In step S7, the first mother substrate and the second mother substrate are cut together with the seal by a scriber such as a diamond cutter or a glass cutter. This forms the first substrate 10 and the second substrate 20 that make up the display panel 1a, and the first substrate 10 and the second substrate 20 that make up the display panel 1b.

In step S8, liquid crystal is injected into display panel 1a and display panel 1b through injection ports formed in the seals of each of display panels 1a and 1b. After the liquid crystal is injected, each injection port is sealed. This completes the manufacture of display panels 1a and 1b.

As described above, according to the first embodiment, the transfer 50a and the dummy transfer 50b are formed so as to be symmetrical with respect to the cut line CL set at the boundary between the display panels 1a and 1b. This causes the vertical structures of the display panels 1a and 1b to match at positions symmetrical with respect to the cut line CL. This prevents the substrate from cracking diagonally, the glass from chipping, tiny pieces of glass from scattering, and the like when the display panels 1a and 1b are separated at the cut line CL.

The effects of the first embodiment are further described below. Figure 5A is a diagram showing seal rupture when no dummy transfer is formed on the display panel 1b.

When the dummy transfer 50b is not formed on the display panel 1b, the vertical structures of the display panels 1a and 1b at positions symmetrical to the cut line CL do not match due to the difference in the presence or absence of the transfer 50a.

Here, in the seal cutting by a scriber using a diamond cutter, a glass cutter, or the like, the mother substrate is cut together with the seal while the scribe blade 200 is pressed along the cut line CL. At this time, a pressing force in the direction of gravity acts on the second mother substrate and the first mother substrate by pressing the scribe blade 200. Here, in the example of FIG. 5A, the vertical structures of the display panel 1a and the display panel 1b at positions symmetrical to the cut line CL do not match. Therefore, the way in which the pressing force from the scribe blade 200 is applied differs on either side of the cut line CL. In other words, the second substrate 20a, which is the second mother substrate on the display panel 1a side, is supported by the transfer 50a, so the pressing force from the scribe blade 200 is received by the transfer 50a. In contrast, the second substrate 20b, which is the second mother substrate on the display panel 1b side, is not supported, so only the second substrate 20b can be deformed in the direction of gravity by the pressing force from the scribe blade 200. If such deformation occurs, even if the scribe blade 200 descends vertically along the cut line CL, the scribe blade 200 will enter the second substrate 20b at an angle. Therefore, the second substrate 20b is cut at an angle as shown by the dashed line C. In this way, the substrate may crack diagonally when the seal is severed, the glass may chip, and tiny pieces of glass may fly off.

Figure 5B shows the seal breaking when a dummy transfer is formed on the display panel 1b.

When the dummy transfer 50b is formed on the display panel 1b, the vertical structures of the display panels 1a and 1b match at positions symmetrical to the cut line CL. Therefore, the way in which the pressing force from the scribe blade 200 is applied does not differ across the cut line CL. Therefore, when the scribe blade 200 descends vertically along the cut line CL, the scribe blade 200 penetrates vertically into both the second substrate 20a and the second substrate 20b as shown by the dashed line C. In this way, diagonal cracking of the substrate, glass chipping, scattering of tiny glass fragments, etc., when the seal is cut are suppressed.

Here, in the first embodiment, only two display panels 1a, 1b are shown formed on the display panel substrate 100. However, three or more display panels adjacent to each other may be formed simultaneously on the display panel substrate 100. For example, three or more display panels may be formed adjacent to each other in the row direction. Even in this case, the stickers of the adjacent display panels may be formed so as to be common at the cut line. Display panels may further be formed on the display panel substrate 100 so as to be adjacent in the column direction. The stickers of the display panels adjacent to each other in the column direction may or may not be common at the cut line.

[Modification]
A modified example of the first embodiment will be described. In the first embodiment, a dummy transfer 50b is formed as a structure at a position symmetrical to the transfer 50a with respect to the cut line CL. However, the structure formed at a position symmetrical to the transfer 50a does not necessarily have to be a dummy transfer.

Figure 6 is a diagram showing a structure of a first modified example. The structure in Figure 6 is a seal structure 60b. The seal structure 60b is formed in a position symmetrical to the transfer 50a with respect to the cut line CL, similar to the dummy transfer 50b. This seal structure 60b has a vertical structure similar to that of the transfer 50a, and is formed integrally with the seal 40b when forming the seal pattern for forming the seal 40b.

Even when the seal structure 60b shown in FIG. 6 is formed, the vertical structures of the display panels 1a and 1b at positions symmetrical to the cut line CL are almost identical. This prevents the substrate from cracking diagonally, the glass from chipping, and tiny pieces of glass from scattering when the seal is severed.

In addition, the seal structure 60b can be formed at the same time as the seal pattern is formed. Therefore, the seal structure 60b can be formed more inexpensively and easily than the dummy transfer 50b.

Figure 7 is a diagram showing a structure of a second modified example. The structure in Figure 7 is a spacer 70b. Like the dummy transfer 50b, the spacer 70b is formed at a position symmetrical to the transfer 50a with respect to the cut line CL. This spacer 70b is a spacer for forming a cell gap in the display panel 1b, and is a columnar spacer having a vertical structure similar to that of the transfer 50a. The spacer 70b may be formed of an organic material or an inorganic material.

Even with the formation of the spacer 70b as shown in FIG. 7, the vertical structures of the display panels 1a and 1b at positions symmetrical to the cut line CL are almost identical. This prevents the substrate from cracking diagonally, the glass from chipping, and tiny pieces of glass from scattering when the seal is severed.

The spacer 70b can be formed at the same time as the spacer for forming the cell gap. Therefore, the spacer 70b can be formed more cheaply and easily than the dummy transfer 50b.

Second Embodiment
Next, a second embodiment will be described. Here, the description of the same parts of the second embodiment as those of the first embodiment will be omitted. In the first embodiment, a structure is formed at a position symmetrical to the transfer 50a with respect to the cut line CL, so that the vertical structures of the display panels 1a and 1b at the positions symmetrical to the cut line CL match. In contrast, the second embodiment is an example in which the vertical structures of the display panels 1a and 1b at the positions symmetrical to the cut line CL match without a structure being formed at a position symmetrical to the transfer 50a with respect to the cut line CL.

Figure 8 is an enlarged view of region R near the end of cut line CL shown in Figure 2 in the second embodiment. In Figure 8, transfer 50a of display panel 1a is formed inside seal 40a. Because transfer 50a is formed inside seal 40a, the vertical structures of display panel 1a and display panel 1b match at positions symmetrical to cut line CL. This prevents diagonal cracking of the substrate, glass chipping, and scattering of tiny glass fragments when display panel 1a and display panel 1b are separated at cut line CL.

The manufacturing method of the display panel according to the second embodiment basically follows the flow shown in FIG. 4. The second embodiment differs from the first embodiment in the position where the transfer is formed in step S4, and in that the formation of the dummy transfer in step S5 is omitted.

In the second embodiment, it is more preferable that the common portion of the seal 40a of the display panel 1a and the seal 40b of the display panel 1b be as close to the edge of the cut line CL as possible. For example, in FIG. 8, when the distance between the common portion of the seal and the edge of the cut line CL is d, it is preferable that d is, for example, within 0.7 mm. By making d short, the pressing force from the scribe blade 200 is more likely to be applied to the display panels 1a and 1b in the same way. This further reduces the occurrence of diagonal cracks in the substrate, glass chipping, and scattering of tiny glass fragments when the display panels 1a and 1b are separated.

The present invention is not limited to the above-described embodiments, and can be modified in various ways in the implementation stage without departing from the gist of the invention. The embodiments may also be implemented in appropriate combination, in which case the combined effects can be obtained. Furthermore, the above-described embodiments include various inventions, and various inventions can be extracted by combinations selected from the multiple constituent elements disclosed. For example, if the problem can be solved and an effect can be obtained even if some constituent elements are deleted from all the constituent elements shown in the embodiments, the configuration from which these constituent elements are deleted can be extracted as an invention.

1, 1a, 1b...display panel, 10...first substrate, 11...scanning line, 12...signal line, 13...pixel, 20, 20a, 20b...second substrate, 21...common electrode, 30...liquid crystal layer, 40, 40a, 40b...seal, 50a...transfer, 50b...dummy transfer, 60b...seal structure, 70b...spacer, 100...display panel substrate, 200...scriber blade.

Claims (7)

A first substrate;
a second substrate disposed opposite to the first substrate;
a first seal formed between the first substrate and the second substrate such that the first substrate and the second substrate form a first display panel;
a second seal formed between the first substrate and the second substrate such that the first substrate and the second substrate form a second display panel;
a transfer conductively connecting the first substrate and the second substrate forming the first display panel;
Equipped with
the first seal and the second seal are made common to a cut line between the first display panel and the second display panel,
the transfer is formed at a position outside the first seal on the first substrate and on a side of the first display panel relative to the cut line;
a structure that does not electrically connect the first substrate and the second substrate is formed at a position symmetrical to the transfer with respect to the cut line;
Display panel board. 2. The display panel substrate according to claim 1 , wherein the structure is a dummy transfer that does not electrically connect the first substrate and the second substrate. The display panel substrate according to claim 1 , wherein the structure is a structure formed by the second seal. The display panel substrate according to claim 1 , wherein the structure is a columnar spacer. A first substrate;
a second substrate disposed opposite to the first substrate;
a first seal formed between the first substrate and the second substrate such that the first substrate and the second substrate form a first display panel;
a second seal formed between the first substrate and the second substrate such that the first substrate and the second substrate form a second display panel;
a transfer conductively connecting the first substrate and the second substrate forming the first display panel;
Equipped with
the transfer is formed at a position on the first substrate that is inward of the first seal;
the first seal and the second seal are formed in common at a cut line between the first display panel and the second display panel, and are formed symmetrically with respect to the cut line;
Display panel board. Providing a first substrate;
Providing a second substrate;
forming a seal pattern on the first substrate, the seal pattern including a first seal and a second seal for forming a first display panel and a second display panel, the first seal and the second seal being common to each other at a cut line of the first display panel and the second display panel;
forming a transfer conductively connecting the first substrate and the second substrate that form the first display panel at a position on the first substrate that is outside the first seal and is closer to the first display panel than the cut line;
forming a structure that does not electrically connect the first substrate and the second substrate at a position symmetrical to the transfer with respect to the cut line;
forming the first display panel and the second display panel by bonding the first substrate and the second substrate together;
dividing the first display panel and the second display panel at the cut line;
A method for manufacturing a display panel comprising the steps of: Providing a first substrate;
Providing a second substrate;
forming a seal pattern on the first substrate, the seal pattern being for forming a first display panel and a second display panel, the seal pattern including a first seal and a second seal that are common to a cut line of the first display panel and the second display panel and are symmetrical with respect to the cut line;
forming a transfer conductively connecting the first substrate and the second substrate, the first substrate forming the first display panel, at a position inside the first seal on the first substrate;
forming the first display panel and the second display panel by bonding the first substrate and the second substrate together;
dividing the first display panel and the second display panel at the cut line;
A method for manufacturing a display panel comprising the steps of: