JP7528972B2 - Manufacturing method and device for manufacturing electronic components - Google Patents

Description

The present invention relates to a manufacturing method and manufacturing apparatus for electronic components having external electrodes on the main body.

Electronic components such as multilayer ceramic capacitors are known in which external electrodes are provided on the surface of the main body. In order to manufacture such electronic components, Patent Document 1 discloses a method for forming external electrodes by applying a conductive paste to a predetermined surface of the main body and pressing the surface to which the conductive paste has been applied (hereinafter referred to as the "applied surface") against the surface of a hot plate to flatten it. This method for forming external electrodes is said to enable the surface of the external electrodes to be flattened and formed thin.

JP 2011-166030 A

However, in the method of forming external electrodes described in Patent Document 1, when the coated surface of the conductive paste is pressed against the surface of the hot plate, some of the conductive paste adheres to the surface of the hot plate and the conductive paste spreads and hardens outside the coated surface, which may result in an external electrode not being formed in the desired shape.

The present invention aims to solve the above problems and provide a manufacturing method and manufacturing apparatus for electronic components that can form external electrodes with flat surfaces and desired shapes.

The method for manufacturing an electronic component of the present invention is a method for manufacturing an electronic component having an external electrode provided on a main body portion, comprising the steps of:
applying a conductive paste to an external electrode formation region;
bringing the conductive paste applied to the external electrode formation region into contact with a liquid-repellent layer including at least one of a liquid that is liquid-repellent to a solvent contained in the conductive paste and a solid formed by solidifying the liquid;
stopping the conductive paste in a state of contact with the liquid repellent layer;
a step of separating the main body portion from the liquid repellent layer;
The present invention is characterized by comprising:

The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus having an external electrode provided on a main body portion,
a holder for holding the main body having an external electrode forming region coated with a conductive paste;
a surface plate for forming a liquid-repellent layer thereon, the liquid-repellent layer including at least one of a liquid having liquid-repellency to a solvent contained in the conductive paste and a solid formed by solidifying the liquid;
a moving mechanism capable of moving the holder holding the main body portion so that the conductive paste applied to the external electrode formation region comes into contact with the liquid repellent layer formed on the base plate; and
The present invention is characterized by comprising:

According to the method for manufacturing electronic components of the present invention, the conductive paste applied to the external electrode formation region is brought into contact with a liquid-repellent layer containing at least one of a liquid that is liquid-repellent to the solvent contained in the conductive paste and a solidified liquid, and then the main body is separated from the liquid-repellent layer, so that an external electrode with a flat surface and a desired shape can be formed. In other words, by bringing the conductive paste into contact with the liquid-repellent layer and stopping it, the surface can be flattened, and when the main body is separated from the liquid-repellent layer, the occurrence of stringiness of the conductive paste can be suppressed, so that the flattened state can be maintained.

The electronic component manufacturing device of the present invention can form external electrodes with a flat surface and a desired shape. That is, the body part with the conductive paste applied to the external electrode formation area is held by a holder, and the conductive paste is brought into contact with a liquid-repellent layer formed on a base plate, thereby flattening the surface of the conductive paste. In addition, when the holder is moved by the moving mechanism so as to pull the body part away from the liquid-repellent layer, the occurrence of stringing of the conductive paste can be suppressed, and the flattened state of the conductive paste can be maintained.

1 is a perspective view illustrating a schematic configuration of a multilayer ceramic capacitor, which is an example of an electronic component. 2 is a cross-sectional view showing a schematic configuration of the multilayer ceramic capacitor shown in FIG. 1 cut along line II-II. 3 is a cross-sectional view showing a schematic configuration of the multilayer ceramic capacitor shown in FIG. 1 taken along line III-III. 4 is a flowchart for explaining a method for manufacturing an electronic component according to the first embodiment. 1 is a diagram illustrating a schematic configuration of an electronic component manufacturing apparatus according to a first embodiment; FIG. 11 is a diagram for explaining a method of forming an external electrode by applying a conductive paste to the external electrode formation region, in which (a) shows a state in which the main body is held by a holder and a liquid-repellent layer is formed on a base plate, (b) shows a state in which the conductive paste applied to the external electrode formation region is in contact with the liquid-repellent layer, and (c) shows a state in which the main body has been pulled away from the liquid-repellent layer. FIG. 1A is a cross-sectional view showing a schematic shape of an external electrode of a multilayer ceramic capacitor manufactured by the manufacturing method of the first embodiment, and FIG. 1B is a cross-sectional view showing a schematic shape of an external electrode of a conventional multilayer ceramic capacitor manufactured through a process of immersing a body portion in a conductive paste, pulling it up, and then drying it. 10 is a flowchart for explaining a method for manufacturing an electronic component according to a second embodiment. FIG. 13 is a diagram illustrating a schematic configuration of an electronic component manufacturing apparatus according to a second embodiment. 13 is a diagram showing a state in which the conductive paste applied to the external electrode formation region is brought into contact with a solid layer included in the liquid-repellent layer. FIG. 13 is a diagram showing a state in which the conductive paste applied to the external electrode formation region is brought into contact with a liquid-repellent layer, which is a solid layer. FIG.

The following describes an embodiment of the present invention and explains its features in detail.

First, the structure of a multilayer ceramic capacitor, which is a multilayer ceramic electronic component, will be described as an example of an electronic component manufactured by the electronic component manufacturing method of the present invention, and then a manufacturing method and an apparatus for manufacturing electronic components will be described. A multilayer ceramic electronic component is an electronic component whose main body has multiple stacked internal electrodes. However, electronic components manufactured by the electronic component manufacturing method of the present invention are not limited to multilayer ceramic capacitors, and there are no particular restrictions on the type of electronic component, such as thermistors and inductors, as long as the main body has external electrodes.

(Electronic Components)
Fig. 1 is a perspective view showing a schematic configuration of a multilayer ceramic capacitor 10, which is an example of an electronic component. Fig. 2 is a cross-sectional view showing a schematic configuration of the multilayer ceramic capacitor 10 shown in Fig. 1 when cut along line II-II. Fig. 3 is a cross-sectional view showing a schematic configuration of the multilayer ceramic capacitor 10 shown in Fig. 1 when cut along line III-III.

The multilayer ceramic capacitor 10 has an overall rectangular parallelepiped shape and includes a body 11 and external electrodes provided on the surface of the body 11. The external electrodes include a first external electrode 14a and a second external electrode 14b.

Here, the direction in which the dielectric layers 12 and the internal electrodes 13a, 13b described below are stacked is defined as the stacking direction T of the multilayer ceramic capacitor 10, the direction in which the pair of external electrodes 14a, 14b face each other is defined as the length direction L, and the direction perpendicular to both the length direction L and the stacking direction T is defined as the width direction W. Any two directions among the length direction L, stacking direction T, and width direction W are mutually perpendicular. The stacking direction T is sometimes referred to as the thickness direction.

The size of the multilayer ceramic capacitor 10 is, for example, 3.2 mm, 1.6 mm, and 1.6 mm in the length direction L, width direction W, and stacking direction T, respectively. However, the size of the multilayer ceramic capacitor 10 is not limited to the above-mentioned numerical values, and may be, for example, small sizes such as 0.25 mm, 0.125 mm, and 0.125 mm, or large sizes such as 5.7 mm, 5.0 mm, and 5.0 mm.

The main body 11 has a first end face 15a and a second end face 15b that face each other in the length direction L, a first main surface 16a and a second main surface 16b that face each other in the stacking direction T, and a first side surface 17a and a second side surface 17b that face each other in the width direction W.

As shown in Figures 2 and 3, the main body 11 includes a plurality of laminated dielectric layers 12 and a plurality of internal electrodes 13a, 13b. The internal electrodes 13a, 13b include a first internal electrode 13a and a second internal electrode 13b. More specifically, the main body 11 has a structure in which the first internal electrodes 13a and the second internal electrodes 13b are alternately laminated in the lamination direction T with the dielectric layers 12 interposed therebetween.

The first internal electrode 13a and the second internal electrode 13b contain, for example, a metal such as Ni, Ag, Pd, Au, Cu, Ti, or Cr, or an alloy mainly composed of the above-mentioned metal. It is preferable that the first internal electrode 13a and the second internal electrode 13b contain, as a common material, the same ceramic material as the dielectric ceramic contained in the dielectric layer 12.

The first internal electrode 13a is extended to the first end surface 15a of the main body 11. The second internal electrode 13b is extended to the second end surface 15b of the main body 11.

In this embodiment, the first external electrode 14a is provided over the entire first end face 15a of the main body 11, and is provided so as to extend from the first end face 15a to the first main face 16a, the second main face 16b, the first side face 17a, and the second side face 17b. The first external electrode 14a is electrically connected to the first internal electrode 13a exposed on the first end face 15a.

In this embodiment, the second external electrode 14b is provided over the entire second end face 15b of the main body 11, and is provided so as to extend from the second end face 15b around the first main face 16a, the second main face 16b, the first side face 17a, and the second side face 17b. The second external electrode 14b is electrically connected to the second internal electrode 13b exposed on the second end face 15b.

The first external electrode 14a and the second external electrode 14b are each formed through a process of applying a conductive paste to the external electrode formation area, as described below. For example, the first external electrode 14a and the second external electrode 14b are formed through a process of applying a conductive paste to the external electrode formation area of the main body 11. However, if the first external electrode 14a and the second external electrode 14b are made up of multiple layers, the process of applying the conductive paste can be performed to form any of the multiple layers. Here, the area where the conductive paste is applied is referred to as the external electrode formation area.

In this embodiment, the first external electrode 14a and the second external electrode 14b each include a base electrode layer and a plating layer.

The base electrode layer contains, for example, metals such as Ni, Cu, Ag, Pd, Au, Ti, and Cr, or alloys containing these metals. The base electrode layer may contain a common material made of a material that is the same as or similar to the material contained in the dielectric layer 12, or glass. When the base electrode layer contains a common material or glass, the content is preferably 30 volume % or more and 70 volume % or less of the entire external electrode.

The base electrode layer can be formed by applying and baking a conductive paste. In the multilayer ceramic capacitor 10 shown in Figures 1 to 3, the entire first end face 15a and the entire second end face 15b, as well as partial areas of the first main face 16a, the second main face 16b, the first side face 17a, and the second side face 17b, constitute the external electrode formation area.

The plating layer contains, for example, a metal such as Cu, Ni, Ag, Pd, Ti, Cr, or Au, or an alloy mainly composed of such a metal. The plating layer may be a single layer or multiple layers. However, it is preferable that the plating layer has a two-layer structure of a Ni plating layer and a Sn plating layer. The Ni plating layer prevents the base electrode layer from being eroded by solder when mounting the multilayer ceramic capacitor 10. The Sn plating layer improves the wettability of the solder when mounting the multilayer ceramic capacitor 10.

(Electronic component manufacturing method)
First Embodiment
4 is a flow chart for explaining a method for manufacturing an electronic component according to the first embodiment. Here, a method is explained in which a main body of an electronic component is prepared, and a conductive paste is applied to an external electrode formation region to form external electrodes. The main body can be produced by a known method.

In step S1, a conductive paste is applied to the external electrode formation region. When the electronic component is the multilayer ceramic capacitor 10 shown in Figures 1 to 3, the conductive paste is applied to the entire first end face 15a of the body portion 11 constituting the external electrode formation region, and to parts of the first main surface 16a, the second main surface 16b, the first side surface 17a, and the second side surface 17b. The body portion 11 is fired, but may be unfired. When the body portion 11 is unfired, the unfired body portion 11 may be fired at the same time that the conductive paste is applied to the external electrode formation region and fired as described below.

The conductive paste contains particles of a metal such as Cu, Ni, Ag, Pd, Ti, Cr, or Au, or an alloy mainly composed of such a metal, and a solvent. The solvent is, for example, a water-insoluble organic solvent such as terpineol. Note that the conductive paste may be any commonly used paste for forming external electrodes.

The conductive paste is applied, for example, by immersing the main body 11 in the conductive paste. However, the method of applying the conductive paste is not limited to immersion, and any method can be used.

In step S2 following step S1, the conductive paste applied to the external electrode formation region is brought into contact with a liquid-repellent layer that contains at least one of a liquid that is liquid-repellent to the solvent contained in the conductive paste and a solid formed from such a liquid. In this embodiment, the liquid-repellent layer is a liquid layer made of the liquid described above. The liquid is, for example, water or an aqueous solution. An example of a method for bringing the conductive paste into contact with the liquid-repellent layer is described below.

Figure 5 is a diagram showing a schematic configuration of an electronic component manufacturing apparatus 100 according to a first embodiment of the present invention. The electronic component manufacturing apparatus 100 according to the first embodiment includes a holder 20, a platen 30, and a moving mechanism 40.

The holder 20 is for holding the main body 11 in which the conductive paste is applied to the external electrode formation region. The holder 20 holds the main body 11 in a state in which the conductive paste applied to the external electrode formation region is exposed. For example, in the above-mentioned laminated ceramic capacitor 10, when the conductive paste is applied to the first end face 15a side of the main body 11, the holder 20 holds the second end face 15b of the main body 11 as shown in FIG. 5. The holder 20 can hold the main body 11 in any manner. In order to form external electrodes for multiple main body parts 11 at once, it is preferable that the holder 20 holds multiple main body parts 11 as shown in FIG. 5. In FIG. 5, the external electrode formation region of the main body 11 in which the conductive paste is applied is shown in black.

The surface plate 30 is used to form a liquid-repellent layer 31 thereon, the liquid containing at least one of a liquid that is liquid-repellent to the solvent contained in the conductive paste and a solid formed from such a liquid. The surface plate 30 is made of, for example, ceramic, granite, metal, etc. The surface plate surface 30a of the surface plate 30 that contacts the liquid-repellent layer 31 is preferably a horizontal plane.

The moving mechanism 40 is configured to be able to move the holder 20 holding the main body 11 so that the conductive paste applied to the external electrode formation region comes into contact with the liquid-repellent layer 31 formed on the base plate 30. For example, the moving mechanism 40 has a moving shaft connected to the holder 20, and can move the holder 20 closer to or farther away from the base plate 30 by lowering or raising the holder 20 by rotating the moving shaft. However, the method by which the moving mechanism 40 moves the holder 20 is not limited to the above-mentioned method, and it can be moved by any method.

The method for bringing the conductive paste applied to the external electrode formation area into contact with the liquid-repellent layer 31 using the electronic component manufacturing device 100 is described below.

First, as shown in FIG. 6(a), a liquid-repellent layer 31 is formed on a base plate 30, and the main body 11, on which a conductive paste is applied in the external electrode formation area, is held by a holder 20.

Then, the moving mechanism 40 moves the holder 20, so that the conductive paste applied to the external electrode formation region comes into contact with the liquid-repellent layer 31, as shown in FIG. 6(b). Specifically, the moving mechanism 40 lowers the holder 20 holding the main body 11, so that the conductive paste applied to the external electrode formation region comes into contact with the liquid-repellent layer 31. However, if the holder 20 is not located above the liquid-repellent layer 31, it is moved to a position above the liquid-repellent layer 31 and then lowered. The speed at which the main body 11 enters the liquid-repellent layer 31 is, for example, 1 μm/s or more and 1000 μm/s or less. Even if the conductive paste applied to the external electrode formation region comes into contact with the liquid-repellent layer 31, the solvent contained in the conductive paste does not mix with the liquid that constitutes the liquid-repellent layer 31.

The conductive paste applied to the external electrode formation area is not allowed to come into contact with the surface 30a of the surface plate 30. If the conductive paste comes into contact with the surface 30a of the surface plate 30, the conductive paste will adhere to the surface 30a, making it difficult to flatten the external electrodes to be formed.

In step S3 following step S2, the conductive paste is stopped in contact with the liquid-repellent layer 31. That is, as shown in FIG. 6(b), the conductive paste applied to the external electrode formation area is maintained in contact with the liquid-repellent layer 31 for a predetermined time. The predetermined time is, for example, 1 second or more and 5 seconds or less. By stopping the conductive paste in contact with the liquid-repellent layer 31, a uniform pressure is applied to the conductive paste from the liquid that constitutes the liquid-repellent layer 31, so that the surface can be flattened. Here, the surface of the conductive paste can be flattened while the conductive paste is in a wet state containing a solvent.

In step S4 following step S3, as shown in FIG. 6(c), the main body 11 is pulled away from the liquid-repellent layer 31. Specifically, the main body 11 is moved to the outside of the liquid-repellent layer 31 by lifting the holder 20 with the moving mechanism 40. The speed at which the main body 11 is lifted to the outside of the liquid-repellent layer 31 is, for example, 1 μm/s or more and 1000 μm/s or less.

As described above, the liquid-repellent layer 31 is liquid-repellent to the solvent contained in the conductive paste. Therefore, when the main body 11 is pulled up to the outside of the liquid-repellent layer 31, the occurrence of stringiness of the conductive paste can be suppressed, and the surface of the conductive paste can be kept flat.

The above-mentioned steps S1 to S4 are also performed on the second end face 15b opposite the first end face 15a of the main body 11. However, if the viscosity of the liquid-repellent layer 31 is high, it is preferable to flatten the surface of the liquid-repellent layer 31 with a squeegee or the like before performing the process on the second end face 15b.

After this, the conductive paste is dried and baked. The shape of the conductive paste is maintained even during the drying process. By baking the conductive paste, the base electrode layer of the external electrode is formed. If a plating layer is provided on the surface of the external electrode, a plating process is performed after the formation of the base electrode layer. Through the above-mentioned process, an electronic component is manufactured in which an external electrode is provided in the external electrode formation area.

As mentioned above, when the external electrode is made up of multiple layers, the process of applying the conductive paste described above can be performed to form any of the multiple layers.

According to the manufacturing method of electronic components in this embodiment, the conductive paste applied to the external electrode formation region is brought into contact with the liquid-repellent layer 31 and stopped, and then the main body 11 is pulled away from the liquid-repellent layer 31, so that an external electrode with a flat surface and a desired shape can be formed. That is, when the conductive paste is brought into contact with the liquid-repellent layer 31 and stopped, a uniform pressure is applied to the conductive paste from the liquid constituting the liquid-repellent layer 31, so that the surface can be flattened. In addition, when the main body 11 is pulled away from the liquid-repellent layer 31, the occurrence of stringing of the conductive paste can be suppressed, so that the thickness of the central part of the end face constituting the external electrode formation region becomes thick and the thickness of the corners can be suppressed from becoming thin due to stringing. This makes it possible to form an external electrode with a flat surface and a thin surface.

Figure 7(a) is a cross-sectional view showing a schematic shape of the external electrode 14 of a multilayer ceramic capacitor 10 manufactured by the manufacturing method of this embodiment. Figure 7(b) is a cross-sectional view showing a schematic shape of an external electrode 14X of a conventional multilayer ceramic capacitor 10X manufactured by immersing a main body 11X in a conductive paste, lifting it up, and then drying it. Note that the internal electrodes are omitted in Figures 7(a) and (b).

As shown in FIG. 7(b), in the conventional multilayer ceramic capacitor 10X, stringiness occurs when the main body 11X is immersed in the conductive paste and then pulled up, resulting in a thicker film thickness at the center of the external electrode 14X and a thinner film thickness at the corners, ridges, and other end portions.

In contrast, as described above, the multilayer ceramic capacitor 10 manufactured by the electronic component manufacturing method of this embodiment can flatten the surface of the conductive paste applied to the external electrode formation area and maintain that state, thereby achieving a flat surface and a uniform film thickness for the external electrode 14. In addition, since the expansion of the film thickness in the center can be suppressed, a thin external electrode 14 can be formed while maintaining a constant film thickness at the ends such as corners and ridges.

In addition, when the temperature of the liquid that constitutes the liquid-repellent layer 31 was changed and the shape of the external electrodes of the manufactured electronic components was checked, it was found that the film thickness of the external electrodes was more flat when the temperature of the liquid was 10°C or less. Therefore, it is preferable that the temperature of the liquid that constitutes the liquid-repellent layer 31 be 10°C or less.

Second Embodiment
Fig. 8 is a flowchart for explaining a method for manufacturing an electronic component according to the second embodiment. The same steps as those in the flowchart shown in Fig. 4 are given the same step numbers and detailed explanations are omitted. In the flowchart shown in Fig. 8, a step (step S11) of forming a solid layer by solidifying a liquid that is liquid repellent with respect to a solvent contained in the conductive paste is added to the flowchart shown in Fig. 4 before the step (step S2) of bringing the conductive paste into contact with the liquid repellent layer.

Figure 9 is a diagram showing a schematic configuration of an electronic component manufacturing apparatus 100A in a second embodiment of the present invention. The electronic component manufacturing apparatus 100A in the second embodiment is further equipped with a cooling mechanism 50 for cooling and solidifying the liquid placed on the base plate 30 compared to the electronic component manufacturing apparatus 100 in the first embodiment. The liquid placed on the base plate 30 is a liquid that is liquid repellent with respect to the solvent contained in the conductive paste.

The cooling mechanism 50 may be any mechanism capable of cooling the temperature of the liquid placed on the base plate 30 to a temperature below the freezing point. The cooling mechanism 50 may be, for example, a mechanism equipped with a Peltier element or a chiller (cooling water circulation device).

As shown in FIG. 9, in this embodiment, the liquid-repellent layer 31 includes a liquid layer 31a made of a liquid that is liquid-repellent to the solvent contained in the conductive paste, and a solid layer 31b located deeper than the liquid layer 31a and made of a solid that is a solidified version of the liquid that constitutes the liquid layer 31a. The liquid is, for example, water or an aqueous solution.

In the flow chart shown in FIG. 8, in step S11 following step S1, a solid layer is formed by solidifying the liquid placed on the base plate 30. That is, similar to the first embodiment, a liquid layer made of a liquid that is liquid repellent with respect to the solvent contained in the conductive paste is formed on the base plate 30, and then the liquid layer is cooled by the cooling mechanism 50, thereby solidifying a portion of the liquid layer to form a solid layer 31b. As a result, a solid layer 31b is formed on the base plate 30 side, and a liquid layer 31a is formed on the solid layer 31b.

Note that step S11 may be performed before step S1.

In step S2 following step S11, the conductive paste applied to the external electrode formation region is brought into contact with the liquid-repellent layer 31. In this embodiment, as shown in FIG. 10, the conductive paste applied to the external electrode formation region is brought into contact with the solid layer 31b included in the liquid-repellent layer 31. By bringing the conductive paste into contact with the solid layer 31b, the surface of the conductive paste can be made flatter.

The portion of solid layer 31b that comes into contact with the conductive paste may become liquid due to the heat transferred from the conductive paste.

The steps S3 and S4 are the same as the steps S3 and S4 in the flowchart shown in FIG. 4. When the main body 11 is separated from the liquid-repellent layer 31 in step S4, the conductive paste does not adhere to the solid layer 31b of the liquid-repellent layer 31, so the shape of the surface of the conductive paste applied to the external electrode formation area can be maintained. Also, in this embodiment, the occurrence of stringing of the conductive paste can be suppressed when the main body 11 is separated from the liquid-repellent layer 31, so the surface of the conductive paste can be maintained in a flattened state.

When the conductive paste applied to the first end face 15a, which is the external electrode formation region, is brought into contact with the solid layer 31b, some of the conductive paste applied to the first end face 15a may overflow outside the first end face 15a. However, since the conductive paste is in a wet state containing a solvent, it returns to the first end face 15a side during the drying process and does not harden in the overflowing state.

Third Embodiment
In the second embodiment, the liquid-repellent layer 31 includes a liquid layer 31a made of a liquid that is liquid-repellent to the solvent contained in the conductive paste, and a solid layer 31b located deeper than the liquid layer 31a and made of a solid that is a solidified version of the liquid that constitutes the liquid layer 31a.

In contrast, in the third embodiment, the liquid-repellent layer 31 is a solid layer made of a solidified liquid that is liquid-repellent to the solvent contained in the conductive paste.

The configuration of the electronic component manufacturing apparatus in the third embodiment is the same as the configuration of the electronic component manufacturing apparatus 100A shown in FIG. 9. However, the cooling mechanism 50 forms a solid layer by solidifying the entire liquid layer formed on the base plate 30, rather than solidifying only a portion of it.

The method for manufacturing electronic components in the third embodiment is the same as the method for manufacturing electronic components in the second embodiment described using the flowchart shown in FIG. 8. However, in step S11 of the flowchart shown in FIG. 8, as described above, a solid layer is formed by solidifying the entire liquid layer formed on the base plate 30, rather than solidifying only a portion of it.

In addition, in step S2, the conductive paste applied to the external electrode formation area is brought into contact with the liquid-repellent layer 31. In this embodiment, since the liquid-repellent layer 31 is a solid layer, the conductive paste is brought into contact with the surface of the liquid-repellent layer 31, as shown in FIG. 11.

In this embodiment, as in the second embodiment, the conductive paste is brought into contact with the liquid-repellent layer 31, which is a solid layer, so that the surface of the conductive paste can be made flatter. In addition, since the occurrence of stringiness of the conductive paste can be suppressed when the main body 11 is separated from the liquid-repellent layer 31, the surface of the conductive paste can be maintained in a flattened state.

The present invention is not limited to the above embodiment, and various applications and modifications are possible within the scope of the present invention.

REFERENCE SIGNS LIST 10 Electronic component 11 Main body 12 Dielectric layer 13a First internal electrode 13b Second internal electrode 14a First external electrode 14b Second external electrode 20 Holder 30 Surface plate 31 Liquid-repellent layer 31a Liquid layer 31b Solid layer 40 Movement mechanism 50 Cooling mechanism 100, 100A Manufacturing apparatus for electronic components

Claims (11)

A method for manufacturing an electronic component having an external electrode provided on a main body, comprising the steps of:
applying a conductive paste to an external electrode formation region;
bringing the conductive paste applied to the external electrode formation region into contact with a liquid-repellent layer including at least one of a liquid that is liquid-repellent to a solvent contained in the conductive paste and a solid formed by solidifying the liquid;
stopping the conductive paste in a state of contact with the liquid repellent layer;
a step of separating the main body portion from the liquid repellent layer;
A method for manufacturing an electronic component, comprising: The method for manufacturing electronic components according to claim 1, characterized in that the liquid-repellent layer is a liquid layer made of the liquid. The method for manufacturing electronic components according to claim 2, characterized in that the temperature of the liquid is 10°C or less. the liquid-repellent layer includes a liquid layer made of the liquid, and a solid layer made of the solid and located deeper than the liquid layer,
2. The method for manufacturing an electronic component according to claim 1, wherein in the step of bringing the conductive paste into contact with the liquid repellent layer, the conductive paste is brought into contact with the solid layer. The method for manufacturing electronic components according to claim 1, characterized in that the liquid-repellent layer is a solid layer made of the solid. The method for manufacturing electronic components according to claim 4 or 5, further comprising a step of forming the solid layer by solidifying the liquid before the step of contacting the conductive paste with the liquid-repellent layer. The method for manufacturing electronic components according to any one of claims 2 to 6, characterized in that the liquid is water or an aqueous solution. The method for manufacturing an electronic component according to any one of claims 1 to 7, characterized in that the electronic component is a multilayer ceramic electronic component in which the main body has multiple stacked internal electrodes. An apparatus for manufacturing electronic components having external electrodes provided on a main body, comprising:
a holder for holding the main body having an external electrode forming region coated with a conductive paste;
a surface plate for forming a liquid-repellent layer thereon, the liquid-repellent layer including at least one of a liquid having liquid-repellency to a solvent contained in the conductive paste and a solid formed by solidifying the liquid;
a moving mechanism capable of moving the holder holding the main body portion so that the conductive paste applied to the external electrode formation region comes into contact with the liquid repellent layer formed on the base plate; and
An apparatus for manufacturing electronic components comprising: the liquid-repellent layer includes a solid layer made of the solid,
The electronic component manufacturing apparatus according to claim 9, further comprising a cooling mechanism for cooling and solidifying the liquid placed on the platen. The electronic component manufacturing apparatus according to claim 9 or 10, characterized in that the electronic component is a multilayer ceramic electronic component in which the main body has multiple stacked internal electrodes.

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