JP7531102B2 - Component mounting device and method for manufacturing component-mounted board - Google Patents

Description

The present invention relates to a component mounting device and a method for manufacturing a component mounting board.

One method for mounting electronic components with bumps, such as flip chips, on a substrate is to use a component mounting device that bonds the bumps by pressing them against electrodes formed on the substrate while holding the substrate with a substrate stage (see, for example, Patent Document 1).

The component mounting device in Patent Document 1 has a function to correct the tilt of the substrate stage so that the substrate stage remains horizontal, and a function to display the results of that correction on a display unit.

JP 2015-177158 A

However, when mounting components on a board, there is a need to mount the components in more precise positions.

The object of the present invention is therefore to solve the above problems and to provide a component mounting device and a method for manufacturing a component mounting board that can mount components in more accurate positions.

To achieve the above object, the component mounting device of the present invention is a component mounting device that mounts components on a substrate, and includes a component holding unit having a component holding surface that holds the components, a substrate stage having a substrate holding surface that holds the substrate, a first drive unit that drives the component holding unit, a second drive unit that drives the substrate stage, and a control unit, and the control unit controls the first drive unit or the second drive unit based on first information regarding the inclination of the component holding surface and second information regarding the inclination of the substrate holding surface to bring the component holding surface and the substrate holding surface closer to parallel, and mounts the components held on the component holding surface onto the substrate held on the substrate holding surface.

The method for manufacturing a component-mounted board of the present invention is a method for manufacturing a component-mounted board by mounting components on a board, and drives the component holding part or the board stage so as to bring the component holding surface and the board holding surface closer to parallel based on first information regarding the inclination of the component holding surface of the component holding part that holds the component and second information regarding the inclination of the board holding surface of the board stage that holds the board, and mounts the components held on the component holding surface onto the board held on the board holding surface.

The present invention allows components to be mounted in more accurate positions.

Schematic diagram of a component mounting device according to an embodiment. FIG. 2 is a perspective view of the component mounting apparatus shown in FIG. 1 . FIG. 2 is a block diagram of a control unit included in the component mounting apparatus shown in FIG. 2 is a flowchart showing a method for acquiring first calibration information using the component mounting apparatus shown in FIG. 1. FIG. 5 is an explanatory diagram for executing each step according to the flowchart of FIG. 4. FIG. 5 is an explanatory diagram for executing each step according to the flowchart of FIG. 4. FIG. 5 is an explanatory diagram for executing each step according to the flowchart of FIG. 4. 1 is a flowchart showing a method for acquiring second calibration information using the component mounting apparatus shown in FIG. FIG. 8 is an explanatory diagram for executing each step according to the flowchart of FIG. 7. FIG. 8 is an explanatory diagram for executing each step according to the flowchart of FIG. 7. FIG. 8 is an explanatory diagram for executing each step according to the flowchart of FIG. 7. 1 is a flowchart showing a method for mounting components on a substrate by correcting the inclination of a substrate stage using the component mounting apparatus shown in FIG. FIG. 11 is an explanatory diagram for executing each step according to the flowchart of FIG. 10. FIG. 11 is an explanatory diagram for executing each step according to the flowchart of FIG. 10. FIG. 11 is an explanatory diagram for executing each step according to the flowchart of FIG. 10. FIG. 11 is an explanatory diagram for executing each step according to the flowchart of FIG. 10. FIG. 11 is an explanatory diagram for executing each step according to the flowchart of FIG. 10. 1 is a flowchart showing a method for correcting the inclination of a substrate stage and polishing a component holding surface in a polishing unit using the component mounting apparatus shown in FIG. FIG. 17 is an explanatory diagram for executing each step according to the flowchart of FIG. 16. FIG. 17 is an explanatory diagram for executing each step according to the flowchart of FIG. 16.

According to a first aspect of the present invention, there is provided a component mounting device for mounting a component on a substrate, the component mounting device comprising: a component holding unit having a component holding surface for holding the component; a substrate stage having a substrate holding surface for holding the substrate; a first drive unit for driving the component holding unit; a second drive unit for driving the substrate stage; and a control unit, the control unit controlling the first drive unit or the second drive unit based on first information regarding the inclination of the component holding surface and second information regarding the inclination of the substrate holding surface to bring the component holding surface and the substrate holding surface closer to parallel, and mounting the component held on the component holding surface onto the substrate held on the substrate holding surface.

With this configuration, even if the inclinations of the component holding surface and the board holding surface are different, the components can be mounted on the board by bringing them closer to being parallel to each other, allowing the components to be mounted in a more accurate position.

According to a second aspect of the present invention, there is provided a component mounting device according to the first aspect, in which the first information is based on height information at least at three locations on the component holding surface. With this configuration, the inclination of the component holding surface can be easily calculated by determining the inclination of the component holding surface based on the height information of the component holding surface.

According to a third aspect of the present invention, there is provided the component mounting device according to the second aspect, in which the substrate stage has a protrusion, and the control unit acquires the height information of the first information by controlling the first drive unit to bring the at least three points of the component holding surface into contact with the protrusions of the substrate stage. With this configuration, the height information of the component holding surface can be easily acquired by acquiring the height information through contact with the protrusions.

According to a fourth aspect of the present invention, there is provided a component mounting device according to any one of the first to third aspects, in which the second information is based on height information at at least three locations on the board holding surface. With this configuration, the inclination of the board holding surface can be easily calculated by determining the inclination of the board holding surface based on the height information of the board holding surface.

According to a fifth aspect of the present invention, there is provided the component mounting device according to the fourth aspect, in which the control unit acquires the height information of the second information by controlling the first drive unit to bring the tip of the component holding unit into contact with each of the at least three locations on the board holding surface. With this configuration, the height information of the board holding surface is acquired by contact with the component holding unit, so that the height information can be easily acquired.

According to a sixth aspect of the present invention, there is provided a component mounting device according to the fourth or fifth aspect, in which the height information of the second information includes height information at each lattice point when the board holding surface is divided into a lattice, and the control unit identifies a divided area that includes a mounting position where the component is to be mounted on the board from among the multiple divided areas divided into the lattice, and uses height information at four lattice points constituting the identified divided area as the second information to control the first drive unit or the second drive unit so as to bring the component holding surface and the board holding surface closer to parallel. With this configuration, by performing tilt correction based on the tilt of the area on the board holding surface that includes the mounting position, components can be mounted in more accurate positions for each mounting position.

According to a seventh aspect of the present invention, there is provided a component mounting device according to the third or fifth aspect, in which the control unit acquires the height information based on a deceleration rate of the speed of the component holder when the control unit controls the first drive unit to lower the component holder at a predetermined speed. With this configuration, it is possible to acquire height information while simplifying the device configuration of the component mounting device.

According to an eighth aspect of the present invention, there is provided a component mounting device according to any one of the first to seventh aspects, in which the second drive unit has a tilt mechanism that changes the tilt of the substrate stage, and the control unit drives the tilt mechanism of the second drive unit to bring the component holding surface and the substrate holding surface closer to parallelism. With this configuration, tilt correction can be easily performed.

According to a ninth aspect of the present invention, there is provided a component mounting device according to any one of the first to eighth aspects, in which the substrate stage has a polishing unit for polishing the component holding surface, and the control unit controls the first drive unit or the second drive unit to bring the component holding surface and the substrate holding surface closer to parallelism based on the first information and the second information before the component holding surface is brought into contact with the polishing unit for polishing. With this configuration, the component holding surface can be polished with greater precision by performing tilt correction even when polishing the component holding surface.

According to a tenth aspect of the present invention, there is provided a method for manufacturing a component-mounted board by mounting components on a board, the method comprising driving the component holding part or the board stage so as to bring the component holding surface and the board holding surface closer to parallel based on first information relating to the inclination of the component holding surface of the component holding part that holds the components and second information relating to the inclination of the board holding surface of the board stage that holds the board, and mounting the components held on the component holding surface onto the board held on the board holding surface.

This method can achieve the same effects as the component mounting device of the first aspect.

According to an eleventh aspect of the present invention, there is provided a method for manufacturing a component mounting board according to the tenth aspect, in which the first information is based on height information at least in three locations on the component holding surface. With such a method, it is possible to achieve the same effect as the component mounting device of the second aspect.

According to a twelfth aspect of the present invention, there is provided a method for manufacturing a component mounting board according to the eleventh aspect, in which the height information of the first information is obtained by contacting each of the at least three points of the component holding surface with a protrusion provided on the substrate stage. With such a method, it is possible to achieve the same effect as the component mounting device of the third aspect.

According to a thirteenth aspect of the present invention, there is provided a method for manufacturing a component mounting board according to any one of the tenth to twelfth aspects, in which the second information is based on height information at at least three points on the board holding surface. With such a method, it is possible to achieve the same effect as the component mounting device of the fourth aspect.

According to a 14th aspect of the present invention, there is provided a method for manufacturing a component mounting board according to the 13th aspect, in which the height information of the second information is obtained by contacting the tip of the component holding part with each of the at least three points on the board holding surface. With such a method, it is possible to achieve the same effect as the component mounting device of the 5th aspect.

According to a fifteenth aspect of the present invention, there is provided a method for manufacturing a component mounting board according to the thirteenth or fourteenth aspect, in which the height information of the second information includes height information at each lattice point when the board holding surface is divided into a lattice, and a divided area including a mounting position where the component is to be mounted on the board is identified from among the multiple divided areas divided into the lattice, and height information at four lattice points constituting the identified divided area is used as the second information to drive the component holding unit or the board stage so as to bring the component holding surface and the board holding surface closer to parallel. With such a method, it is possible to achieve the same effect as the component mounting device of the sixth aspect.

According to a 16th aspect of the present invention, there is provided a method for manufacturing a component mounting board according to the 12th or 14th aspect, in which the height information is obtained based on a deceleration rate of the speed of the component holder when the component holder is lowered at a predetermined speed. This method can achieve the same effects as the component mounting device of the 7th aspect.

According to a 17th aspect of the present invention, there is provided a method for manufacturing a component mounting board according to any one of the 10th to 16th aspects, in which the component holding surface and the board holding surface are brought closer to parallelism by changing the inclination of the board stage. This method can achieve the same effect as the component mounting device of the 8th aspect.

According to an 18th aspect of the present invention, there is provided a method for manufacturing a component mounting board according to any one of the 10th to 17th aspects, in which, before the component holding surface is brought into contact with a polishing unit provided on the substrate stage and polished, the component holding unit or the substrate stage is driven so as to bring the component holding surface and the substrate holding surface closer to parallelism based on the first information and the second information. With such a method, it is possible to achieve the same effect as the component mounting device of the 9th aspect.

Below, exemplary embodiments of a component mounting device and a method for manufacturing a component mounting board using the same according to the present invention will be described with reference to the accompanying drawings. The present invention is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present invention.

(Embodiment)
First, the configuration of a component mounting apparatus according to an embodiment of the present invention will be described with reference to Figures 1 and 2. The component mounting apparatus (bonding apparatus) 1 shown in Figure 1 has a function of bonding a component (electronic component) 3 to a substrate 2, and includes a substrate positioning unit 4, a bonding unit 5, and a component supply mechanism 40. Figure 1 shows a state in which the substrate 2 is held by a substrate stage 9 of the substrate positioning unit 4, and a component 3 is held by a component transfer head 40a of the component supply mechanism 40. An example of the component 3 is a flip chip having a plurality of bumps.

The substrate positioning unit 4 is constructed by stacking, from bottom to top, a substrate stage movement mechanism 7, a tilt mechanism 8, and a substrate stage 9 on the upper surface of a base 6.

The substrate stage movement mechanism 7 moves the tilt mechanism 8 and the substrate stage 9 in the X and Y directions. The tilt mechanism 8 adjusts the inclination (tilt) of the substrate stage 9. The substrate stage 9 holds the substrate 2 on its upper surface, the substrate holding surface 9a. By driving the substrate stage movement mechanism 7 and the tilt mechanism 8, the substrate 2 held by the substrate stage 9 can be positioned at a predetermined bonding work position.

The substrate positioning portion 4 further has a protrusion portion 28 and a polishing portion 29.

The protrusion 28 is a member for contacting the component holding surface 13b of the bonding tool 13 described below to acquire height information of the component holding surface 13b. The protrusion 28 protrudes upward so as to be able to contact the component holding surface 13b. In the embodiment, the protrusion 28 is provided on the same plane as the substrate holding surface 9a of the substrate stage 9, but may be provided at any position on the substrate stage 9. The height information of the component holding surface 13b is used as information regarding the inclination of the component holding surface 13b.

The polishing part 29 is a member for polishing the component holding surface 13b of the bonding tool 13. The polishing part 29 has a polishing surface 30 that faces upward and can come into contact with the component holding surface 13b.

The bonding section 5 includes a moving table 11 and a bonding head 12. The moving table 11 is a member that holds the bonding head 12 so that it can move in the X direction. The bonding head 12 includes a shaft member 27 that protrudes downward, and a bonding tool 13 is attached to the lower end of the shaft member 27. The bonding tool 13 is a component holding tool that holds the components 3 supplied from the component supply mechanism 40.

As shown in FIG. 2, the bonding tool 13 has a horizontally elongated horn 13a. A component holding surface 13b protrudes from the bottom surface of the horn 13a. The component holding surface 13b abuts against the top surface of the component 3 to hold it by suction, and presses the component 3 against the board 2.

A vibrator 14 is attached to one end of the horn 13a. By driving the vibrator 14, ultrasonic vibrations are transmitted to the component holding surface 13b via the horn 13a for transmitting ultrasonic vibrations. When the bonding tool 13 presses the component 3 onto the board 2, ultrasonic vibrations are applied to the component 3 via the component holding surface 13b while the component holding surface 13b is heated by the bonding tool heating section (Figure 3), thereby performing a component bonding operation to bond the component 3 to the board 2. This produces a component-mounted board in which the component 3 is mounted on the board 2.

The bonding section 5 has a built-in lift motor 25 (Figure 3). The lift motor 25 is a drive section that drives the bonding head 12 having the bonding tool 13, which is a component holding section. By driving the lift motor 25 to lower the bonding tool 13, the component 3 held on the component holding surface 13b can be bonded to the substrate 2 held on the substrate stage 9. Similarly, by driving the lift motor 25 to lower the bonding tool 13, the component holding surface 13b can be brought into contact with the protrusion 28, or the component holding surface 13b can be brought into contact with the polishing surface 30 of the polishing section 29.

The bonding unit 5 further includes a built-in linear encoder 26 (Figure 3). The linear encoder 26 has a scale unit (not shown) and a scanning unit (not shown), and outputs position information indicating the position of the scanning unit relative to the scale unit. The scanning unit of the linear encoder 26 is linked to the bonding head 12, and the position information output by the linear encoder 26 is used as height information for the bonding head 12 and bonding tool 13, and is also used as height information for the substrate holding surface 9a where the bonding tool 13 comes into contact.

The component supply mechanism 40 has a component transfer head 40a that can move horizontally below the bonding tool 13. The component transfer head 40a holds the component 3 and moves it below the bonding tool 13, allowing the component 3 to be delivered to the component holding surface 13b. The components of the component supply mechanism 40 other than the component transfer head 40a are not shown or described.

The component mounting device 1 further includes a board camera that captures an image of the board 2 held by the board stage 9 from above, and a component camera that captures an image of the component 3 held by the bonding tool 13 from below. Illustrations and descriptions of these configurations are omitted in this specification.

The component joining operation by the bonding tool 13 described above is controlled by the control unit 60.

The control unit 60 is a component that controls the operation of each component of the component mounting device 1. The control unit 60 is electrically connected to each component of the component mounting device 1 via wiring or the like. The control unit 60 is composed of, for example, a microcomputer.

Figure 3 shows a block diagram of the control unit 60. As shown in Figure 3, the control unit 60 is electrically connected to the substrate stage moving mechanism 7, tilt mechanism 8, bonding head 12, lift motor 25, linear encoder 26, component supply mechanism 40, etc.

The control unit 60 includes a bonding operation execution unit 62, a component holding surface height measurement unit 64, a board holding surface height measurement unit 66, a mounting calibration execution unit 68, a polishing calibration execution unit 69, and a memory unit 70.

The bonding operation execution unit 62, the component holding surface height measurement unit 64, the board holding surface height measurement unit 66, the mounting calibration execution unit 68, and the polishing calibration execution unit 69 are, for example, processing circuits, and each executes a computer program stored in the storage unit 70. The storage unit 70 is, for example, a memory that stores a computer program. The bonding operation execution unit 62, the component holding surface height measurement unit 64, the board holding surface height measurement unit 66, the mounting calibration execution unit 68, and the polishing calibration execution unit 69 are realized by the processing circuit executing the computer program, or by the processing circuit alone, or by the memory alone.

The bonding operation execution unit 62 performs the function of mounting the component 3 held by the bonding tool 13 onto the substrate 2 placed on the substrate stage 9.

The component holding surface height measuring unit 64 performs the function of measuring the height of the component holding surface 13b in the bonding tool 13. When measuring the height of the component holding surface 13b, the component holding surface 13b is brought into contact with the protrusion 28. Height information of the component holding surface 13b, which is the measurement result of the component holding surface height measuring unit 64, is stored in the memory unit 70 as first calibration information S1 used for tilt correction (calibration operation) of the substrate stage 9 described later.

The substrate holding surface height measuring unit 66 performs the function of measuring the height of the substrate holding surface 9a on the substrate stage 9. When measuring the height of the substrate holding surface 9a, the component holding surface 13b is brought into contact with the portion of the substrate holding surface 9a to be measured. Height information of the substrate holding surface 9a, which is the measurement result of the substrate holding surface height measuring unit 66, is stored in the memory unit 70 as second calibration information S2 used for tilt correction (calibration operation) of the substrate stage 9, which will be described later.

Before mounting the component 3 on the substrate 2, the mounting calibration execution unit 68 performs a calibration operation to adjust the inclination of the substrate stage 9 so that the component holding surface 13b of the bonding tool 13 and the substrate holding surface 9a of the substrate stage 9 are closer to being parallel.

Before polishing the component holding surface 13b of the bonding tool 13 using the polishing unit 29, the polishing calibration execution unit 69 performs a calibration operation to adjust the inclination of the substrate stage 9 so that the component holding surface 13b and the substrate holding surface 9a are closer to being parallel.

The memory unit 70 stores various computer programs as well as various data such as the first calibration information S1 and the second calibration information S2.

Next, a method for measuring the height of the component-holding surface 13b using the above-mentioned component-holding surface height measuring unit 64 will be described with reference to Figs. 4 to 6. Fig. 4 is a flowchart for explaining the method, and Figs. 5A, 5B, and 6 are various explanatory diagrams for executing each step according to the flowchart of Fig. 4. Each step shown in the flowchart of Fig. 4 is executed, for example, by the component-holding surface height measuring unit 64 of the control unit 60.

As shown in FIG. 4, the control unit 60 first lowers the bonding head 12 to the measurement start height (S1). Specifically, as shown in FIG. 5A, the substrate stage 9 is moved horizontally by the substrate stage movement mechanism 7 to align the protrusion 28 below the bonding tool 13. Then, the lift motor 25 is driven to lower the bonding tool 13, which is not holding the component 3, to the predetermined measurement start height (see arrow).

The control unit 60 monitors the speed of the bonding tool 13 (S2). Specifically, the control unit 60 continuously monitors the output value of the linear encoder 26, which indicates the height information of the bonding tool 13, taking the value per unit time as the speed of the bonding tool 13.

The control unit 60 slightly lowers the bonding tool 13 toward the protrusion 28 (S3). Specifically, the lift motor 25 is driven to lower the bonding tool 13 by a small distance toward the protrusion 28. The drive amount of the lift motor 25 is set in advance so that the bonding tool 13 is lowered by a small distance.

The control unit 60 determines whether the speed of the bonding tool 13 has reached a predetermined speed or less (S4). Specifically, it determines whether the speed of the bonding tool 13, which started to be monitored in step S2, has reached a predetermined speed (i.e., a threshold value) or less that is pre-stored in the storage unit 70.

As shown in FIG. 5A, when the component holding surface 13b is not in contact with the protrusion 28, the speed of the bonding tool 13 is constant and does not reach or fall below the predetermined speed (NO in S4). The control unit 60 again slightly lowers the bonding tool 13 toward the protrusion 28 (S3) and determines whether the speed of the bonding tool 13 has reached or fallen below the predetermined speed (S4). According to this flow, steps S3 and S4 are repeated until the component holding surface 13b comes into contact with the protrusion 28, and the bonding tool 13 continues to descend.

As shown in FIG. 5B, when the component holding surface 13b comes into contact with the protrusion 28, the descent of the bonding tool 13 stops and the speed of the bonding tool 13 reaches a predetermined speed or less (YES in S4). The control unit 60 reads the output of the linear encoder 26 and stores it as the first calibration information S1 (S5). By reading the output of the linear encoder 26 when the component holding surface 13b comes into contact with the protrusion 28, height information of the component holding surface 13b can be obtained.

The control unit 60 executes the above-mentioned steps S1 to S5 for each of the multiple locations on the component holding surface 13b. In this embodiment, as shown in FIG. 6, four measurement points 50(n) are set in advance near the four corners of the component holding surface 13b (n=1, 2, 3, 4 in this embodiment), and steps S1 to S5 are executed a total of four times so that each of the four measurement points 50(n) is brought into contact with the protrusion 28. This allows height information h(n) indicating the height of each measurement point 50(n) to be acquired. The control unit 60 stores calibration data that associates the acquired height information h(n) with the XY coordinates of the measurement point 50(n) in the memory unit 70 as first calibration information S1.

Next, a method for measuring the height of the substrate holding surface 9a using the substrate holding surface height measuring unit 66 described above will be described with reference to Figs. 7 to 9. Fig. 7 is a flowchart for explaining the method, and Figs. 8A, 8B, and 9 are various explanatory diagrams for executing each step according to the flowchart of Fig. 7. Each step shown in the flowchart of Fig. 7 is executed, for example, by the substrate holding surface height measuring unit 66 of the control unit 60.

As shown in FIG. 7, the control unit 60 first lowers the bonding head 12 to the measurement start height (S6). Specifically, as shown in FIG. 8A, the substrate stage 9 is moved horizontally by the substrate stage movement mechanism 7 to align a predetermined portion of the substrate holding surface 9a below the bonding tool 13. Then, the lift motor 25 is driven to lower the bonding tool 13, which is not holding the component 3, to the predetermined measurement start height (see arrow).

The control unit 60 monitors the speed of the bonding tool 13 (S7), slightly lowers the bonding tool 13 toward the substrate holding surface 9a (S8), and determines whether the speed of the bonding tool 13 has reached a predetermined speed or lower (S9). The processing contents of steps S7 to S9 are the same as steps S2 to S4 shown in FIG. 4.

As shown in FIG. 8A, when the component holding surface 13b is not in contact with the board holding surface 9a, it is determined that the speed of the bonding tool 13 does not reach or exceed the predetermined speed (NO in S9). Steps S8 and S9 are repeated until the component holding surface 13b comes into contact with the board holding surface 9a.

As shown in FIG. 8B, when the component holding surface 13b comes into contact with the board holding surface 9a, it is determined that the speed of the bonding tool 13 has reached or exceeded a predetermined speed (YES in S9). The control unit 60 reads the output of the linear encoder 26 and stores it as second calibration information S2 (S10). By reading the output of the linear encoder 26 when the component holding surface 13b comes into contact with the board holding surface 9a, height information of the board holding surface 9a at the point of contact with the component holding surface 13b can be obtained.

The control unit 60 executes the above-mentioned steps S6 to S10 for each of the multiple locations on the board holding surface 9a. In this embodiment, as shown in FIG. 9, the board holding surface 9a is divided into a grid to set multiple grid points 52(i,j) (in this embodiment, i=1 to 9, j=1 to 7), and the processing of steps S6 to S10 is repeatedly executed so that the component holding surface 13b contacts each of the grid points 52(i,j). As a result, height information H(i,j) indicating the height of each grid point 52(i,j) is acquired. The control unit 60 stores the calibration data that associates the acquired height information H(i,j) with the XY coordinates of the grid points 52(i,j) in the storage unit 70 as second calibration information S2.

Next, a method for correcting the tilt of the substrate stage 9 based on the first calibration information S1 and the second calibration information S2 and mounting the component 3 on the substrate 2 using the above-mentioned mounting calibration execution unit 68 will be described with reference to Figs. 10 to 15. Fig. 10 is a flowchart for explaining this method, and Figs. 11 to 15 are various explanatory diagrams for executing each step according to the flowchart of Fig. 10. Each step shown in the flowchart of Fig. 10 is executed, for example, by the mounting calibration execution unit 68 of the control unit 60.

As shown in FIG. 10, the control unit 60 first holds the substrate 2 using the substrate stage 9 (S11). Specifically, as shown in FIG. 11, the substrate 2 that has been brought into the substrate positioning unit 4 is placed on the substrate holding surface 9a of the substrate stage 9, which holds the substrate 2. The substrate stage 9, which is holding the substrate 2, is moved horizontally using the substrate stage movement mechanism 7, thereby being positioned at a predetermined horizontal position.

The control unit 60 uses the bonding tool 13 to hold the component 3 (S12). Specifically, as shown in FIG. 11, the component 3 supplied from the component transfer head 40a of the component supply mechanism 40 is adsorbed and held on the component holding surface 13b of the bonding tool 13. The bonding tool 13 holding the component 3 is moved horizontally using the moving table 11 to be positioned at a predetermined horizontal position.

The control unit 60 calculates the inclination of the component holding surface 13b based on the first calibration information S1 (S13). A specific method for calculating the inclination is described with reference to FIG. 12.

Figure 12 shows an example of a method for calculating the inclination of component holding surface 13b in the X direction. As shown in Figure 12, to calculate the inclination of component holding surface 13b in the X direction, the average value hm1 of the heights h(1) and h(3) of measurement points 50(1) and 50(3) that are approximately at the same position in the X direction is calculated (hm1 = (h(1) + h(3))/2). Similarly, the average value hm2 of the heights of measurement points 50(2) and 50(4) that are approximately at the same position in the X direction is calculated (hm2 = (h(2) + h(4))/2).

Furthermore, the difference Δhx is calculated as the difference between hm1 and hm2 (Δhx = hm2 - hm1), and the difference Δhx is divided by a constant A pre-stored in the memory unit 70 to calculate the slope xp (xp = Δhx/A). The constant A is a value that is preset as the dimension of the component holding surface 13b in the X direction. In this way, the slope xp of the component holding surface 13b in the X direction can be calculated.

The Y-axis tilt yp can also be calculated using a similar method.

The inclinations xp and yp may be calculated at any time, not limited to when they are calculated based on the first calibration information S1 when the component 3 is mounted on the board 2 as in step S13. For example, as shown in Figures 4 to 6, the inclinations xp and yp may be calculated in advance when the height of the component holding surface 13b is measured using the component holding surface height measurement unit 64, and stored in the storage unit 70 as part of the first calibration information S1.

The control unit 60 identifies a divided area including the mounting position P (S14). Specifically, of the multiple divided areas obtained by dividing the board holding surface 9a shown in FIG. 9 into a lattice shape, one divided area including the mounting position P of the component 2 held by the bonding tool 13 shown in FIG. 11 is identified. More specifically, the XY coordinates of the mounting position P are pre-stored in the storage unit 70, and the divided area including the mounting position P is identified based on the XY coordinates of the mounting position P and the XY coordinates of the lattice point 52(i,j).

The control unit 60 acquires height information of the four lattice points 52 that make up the identified divided area based on the second calibration information S2 (S15). Specifically, as shown in FIG. 13, the control unit 60 acquires height information H(i,j), H(i+1,j), H(i,j+1), and H(i+1,j+1) of the four lattice points 52(i,j), 52(i+1,j), 52(i,j+1), and 52(i+1,j+1) that make up the divided area identified in step S14 based on the second calibration information S2.

The control unit 60 calculates the inclination of the substrate holding surface 9a based on the height information (i, j), H(i+1, j), H(i, j+1), and H(i+1, j+1) of the four lattice points 52(i, j), 52(i+1, j), 52(i, j+1), and 52(i+1, j+1) (S16). Specifically, the control unit 60 calculates the average height Hm1 of the lattice points 52(i, j) and 52(i, j+1) (Hm1={H(i, j)+H(i, j+1)}/2) and calculates the average height Hm2 of the lattice points 52(i+1, j) and 52(i+1, j+1) (Hm2={H(i+1, j)+H(i+1, j+1)}/2) as shown in FIG. 14, using a method similar to that shown in FIG. 12.

Furthermore, the difference between Hm1 and Hm2 is calculated as ΔHx (= Hm2 - Hm1), and the difference ΔHx is divided by a constant C that is pre-stored in the memory unit 70 as the dimension of the substrate holding surface 9a in the X direction to calculate the slope xP (xP = ΔHx/C). In this way, the slope xP of the substrate holding surface 9a in the X direction can be calculated. The slope yP in the Y direction can also be calculated in a similar manner.

The control unit 60 performs tilt correction so that the component holding surface 13b and the board holding surface 9a approach parallelism (S17). Specifically, the tilt mechanism 8 is used to change the tilts xP and yP of the board holding surface 9a based on the tilts xp and yp of the component holding surface 13b calculated in step S13 and the tilts xP and yP of the board holding surface 9a calculated in step S16. More specifically, the tilt mechanism 8 is used to change the attitude of the board stage 9 so that the tilts xP and yP of the board holding surface 9a approach the same values as the tilts xp and yp of the component holding surface 13b, respectively.

The control unit 60 mounts the component 3 on the substrate 2 (S18). Specifically, as shown in FIG. 15, the lift motor 25 is driven to lower the bonding tool 13 toward the substrate 2 held by the substrate stage 9 whose attitude was changed in step S17, and the component 3 is mounted on the substrate 2.

As described above, the inclination is corrected so that the component holding surface 13b that holds the component 3 and the board holding surface 9a at the location including the mounting position P where the component 3 is mounted are as close to parallel as possible, so that the component 3 can be mounted in the correct position and orientation relative to the board 2.

If there are multiple components 3 to be mounted on the board 2, the above-mentioned steps S11 to S18 are performed on each of the multiple components 3 to manufacture a component-mounted board in which the components 3 are mounted on the board 2.

According to the flow of steps S11 to S18, even if the mounting position P changes for each of the multiple components 3, tilt correction is performed each time so that the board holding surface 9a and the component holding surface 13b at the location including the mounting position P become closer to parallel. This allows each of the multiple components 3 to be mounted in a more accurate position and orientation.

The component mounting device 1 of this embodiment further has a function of performing tilt correction of the substrate stage 9 not only when mounting the components 3 on the substrate 2, but also when polishing the component holding surface 13b of the bonding tool 13 using the polishing unit 29. A specific method will be described with reference to Figures 16 to 18. Figure 16 is a flowchart for explaining the method, and Figures 17 and 18 are various explanatory diagrams for executing each step according to the flowchart of Figure 16. Each step shown in the flowchart of Figure 16 is executed, for example, by the polishing calibration execution unit 69 of the control unit 60.

As shown in Fig. 16, the control unit 60 first moves the bonding tool 13 to the polishing position (S19). Specifically, as shown in Fig. 17, the bonding tool 13 not holding the component 3 is moved horizontally using the moving table 11 to position it at a predetermined horizontal position above the polishing unit 29.

The control unit 60 calculates the inclinations xp and yp of the component holding surface 13b based on the first calibration information S1 (S20). Specifically, the control unit 60 calculates the inclinations xp and yp of the component holding surface 13b using a method similar to that used in step S13 shown in FIG. 10.

The control unit 60 calculates the inclination of the substrate holding surface 9a based on the second calibration information S2 (S21). Specifically, among the multiple divided regions obtained by dividing the substrate holding surface 9a shown in FIG. 9 into a lattice shape, a divided region having an inclination similar to the inclination of the polishing section 29 is identified, and the height information of the four lattice points 52 constituting the identified divided region is used as the second calibration information S2 to calculate the inclinations xP, yP of the substrate holding surface 9a in a manner similar to that of step S16 shown in FIG. 10.

The control unit 60 performs tilt correction so that the component holding surface 13b and the board holding surface 9a approach parallelism (S22). Specifically, the tilt mechanism 8 is used to change the tilts xP and yP of the board holding surface 9a based on the tilts xp and yp of the component holding surface 13b calculated in step S20 and the tilts xP and yP of the board holding surface 9a calculated in step S21. The specific method is the same as step S17 shown in FIG. 10, and the tilt of the board stage 9 is adjusted using the tilt mechanism 8 so that the tilts xP and yP of the board holding surface 9a approach the same values as the tilts xp and yp of the component holding surface 13b, respectively.

The control unit 60 polishes the component holding surface 13b with the polishing unit 29 (S23). Specifically, as shown in FIG. 18, the lifting motor 25 is driven to lower the bonding tool 13, and the component holding surface 13b is brought into contact with the polishing surface 30 of the polishing unit 29. This allows the component holding surface 13b to be polished with the polishing unit 29.

According to the above method, by correcting the inclination of the substrate stage 9 before polishing the component holding surface 13b with the polishing unit 29, the component holding surface 13b can be brought into contact with the polishing surface 30 of the polishing unit 29 with high precision and polished.

As described above, in the embodiment of the component mounting device 1 and the method of manufacturing a component mounting board using the same, the control unit 60 controls the tilt mechanism 8 (drive unit) to bring the component holding surface 13b and the board holding surface 9a closer to parallelism based on the first calibration information S1 (first information) regarding the inclinations xp, yp of the component holding surface 13b and the second calibration information S2 (second information) regarding the inclinations xP, yP of the board holding surface 9a (S17), and mounts the component 3 held on the component holding surface 13b on the board 2 held on the board holding surface 9a (S18).

With this configuration and method, even if the inclinations xp, yp of the component holding surface 13b and the inclinations xP, yP of the board holding surface 9a are different, the components 3 can be mounted in a more accurate position by bringing them closer to parallel before mounting the component 3 on the board 2.

In addition, in the embodiment of the component mounting device 1 and the manufacturing method of a component mounting board using the same, the first calibration information S1 is based on height information h(n) at four measurement points 50(n) on the component holding surface 13b.

With this configuration and method, the inclinations xp, yp of the component holding surface 13b can be obtained based on the height information h(n) of the component holding surface 13b, and the inclinations xp, yp can be easily calculated.

In addition, in the embodiment of the component mounting device 1 and the method for manufacturing a component mounting board using the same, the control unit 60 acquires height information h(n) of the first calibration information S1 by controlling the lift motor 25 so that each of the four measurement points 50(n) on the component holding surface 13b contacts the protrusions 28 of the substrate stage 9 (S1 to S5).

With this configuration and method, the height information h(n) of the component holding surface 13b can be easily obtained by acquiring the height information h(n) through contact with the protrusion 28.

In addition, in the component mounting device 1 of the embodiment and the method for manufacturing a component mounting board using the same, the second calibration information S2 is based on the height information H(i, j) at each lattice point 52(i, j) on the board holding surface 9a.

With this configuration and method, the inclinations xP and yP of the substrate holding surface 9a can be obtained based on the height information H(i, j) of the substrate holding surface 9a, and the inclinations xP and yP can be easily calculated.

In addition, in the embodiment of the component mounting device 1 and the method for manufacturing a component mounting board using the same, the control unit 60 acquires height information H(i,j) of the second calibration information S2 by controlling the lift motor 25 to bring the component holding surface 13b, which is the tip of the bonding tool 13, into contact with each lattice point 52(i,j) on the board holding surface 9a (S6 to S10).

With this configuration and method, the height information H(i, j) of the substrate holding surface 9a can be easily obtained by acquiring the height information H(i, j) through contact with the bonding tool 13.

In the component mounting device 1 of the embodiment and the manufacturing method of a component mounting board using the same, the height information H(i, j) of the second calibration information S2 is height information of the board holding surface 9a at each lattice point 52 when the board holding surface 9a is divided into a lattice. The control unit 60 identifies a divided area that includes the mounting position P where the component 3 is mounted on the board 2 from among the multiple divided areas divided into a lattice (S14), and controls the tilt mechanism 8 to move the component holding surface 13b and the board holding surface 9a closer to parallel using the height information H(i, j), H(i+1, j), H(i, j+1), and H(i+1, j+1) at the four lattice points 52(i, j), 52(i+1, j), 52(i, j+1), and 52(i+1, j+1) that constitute the identified divided area as the second calibration information S2 (S15 to S17).

With this configuration and method, by performing tilt correction based on the tilt of the divided area on the board holding surface 9a that includes the mounting position P, the component 3 can be mounted in a more accurate position for each mounting position P.

In addition, in the embodiment of the component mounting device 1 and the manufacturing method of a component mounting board using the same, the control unit 60 acquires height information h(n), H(i, j) based on the deceleration rate of the bonding tool 13 when controlling the lift motor 25 to lower the bonding tool 13 at a predetermined speed (S4 to S5, S9 to S10).

With this configuration and method, compared to when height information is obtained based on the rate of change of load using a load cell or the like, it is possible to obtain height information h(n), H(i, j) without providing any new configuration, simplifying the device configuration of the component mounting device 1.

In addition, in the embodiment of the component mounting device 1 and the method for manufacturing a component mounted board using the same, the tilt mechanism 8 is used to change the inclination of the board stage 9, thereby bringing the component holding surface 13b and the board holding surface 9a closer to being parallel (S17).

This configuration and method makes it easy to perform tilt correction.

In addition, in the embodiment of the component mounting device 1 and the method for manufacturing a component mounting board using the same, the control unit 60 controls the tilt mechanism 8 to bring the component holding surface 13b and the board holding surface 9a closer to parallelism based on the first calibration information S1 and the second calibration information S2 before bringing the component holding surface 13b into contact with the polishing unit 29 for polishing (S22, S23).

With this configuration and method, the inclination of the substrate stage 9 can be corrected when polishing the component holding surface 13b, allowing the component holding surface 13b to be polished with greater precision.

Although the present invention has been described above with reference to the above-mentioned embodiment, the present invention is not limited to the above-mentioned embodiment. For example, the tilt mechanism 8 is used to drive the substrate stage 9 to perform tilt correction in step S17, but the present invention is not limited to this case. If a mechanism for adjusting the tilt of the bonding tool 13 is provided, the component holding surface 13b and the substrate holding surface 9a may be brought closer to parallelism by adjusting the tilt of the bonding tool 13 instead of the substrate stage 9. In other words, in order to bring the component holding surface 13b and the substrate holding surface 9a closer to parallelism, it is sufficient to control either the first driving unit that drives the bonding tool 13, which is the component holding unit, or the second driving unit (tilt mechanism 8) that drives the substrate stage 9.

In addition, in this embodiment, the component holding surface 13b is brought into contact with the protrusion 28 or the board holding surface 9b to obtain the height information h(n) of the component holding surface 13b and the height information H(i, j) of the board holding surface 9a, but this is not the only case. The height information may be obtained by a non-contact method such as a laser, without being limited to such a contact method. In other words, a contact sensor or a non-contact sensor may be used to obtain the height information.

In the present embodiment, the height information h(n) at four measurement points 50(n) on the component holding surface 13b is obtained as the first calibration information S1, but this is not limited to the above case. If height information is obtained at at least three points on the component holding surface 13b, the inclinations xp, yp of the component holding surface 13b can be calculated.

In the present embodiment, the height information H(i, j) at each lattice point 52(i, j) on the board holding surface 9a is obtained as the second calibration information S2, but this is not limited to the above case. As with the component holding surface 13b, if height information is obtained at least three points on the board holding surface 9a, the inclinations xP, yP of the board holding surface 9a can be calculated.

In the present embodiment, as shown in Figures 12 and 14, the values of the height information h(n) of the component holding surface 13b and the height information H(i, j) of the board holding surface 9a are used as is to calculate the slopes xp, yp, xP, and yP, but this is not the only case. A predetermined reference height may be determined for the component holding surface 13b and the board holding surface 9a, and the height information h(n), H(i, j) may be converted to heights relative to the reference height before calculating the slopes xp, yp, xP, and yP.

Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications and variations will be apparent to those skilled in the art. Such modifications and variations are to be understood as being included within the scope of the present disclosure as defined by the appended claims, unless they deviate therefrom. In addition, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

In addition, by appropriately combining any of the various modifications of the above embodiment, the effects of each can be achieved.

The present invention can be applied to any component mounting device and a method for manufacturing a component mounting board using the same.

REFERENCE SIGNS LIST 1 Component mounting device 2 Substrate 3 Component 4 Substrate positioning section 5 Bonding section 6 Base 7 Substrate stage moving mechanism 8 Tilt mechanism (second driving section)
DESCRIPTION OF SYMBOLS 9 Substrate stage 9a Substrate holding surface 11 Moving table 12 Bonding head 13 Bonding tool 13a Horn 13b Component holding surface 14 Vibrator 25 Lifting motor 26 Linear encoder 27 Shaft member 28 Protrusion 29 Polishing section 30 Polishing surface 40 Component supply mechanism 40a Component transfer head 50(n) Measurement point 52(i,j) Lattice point 60 Control section 62 Bonding operation execution section 64 Component holding surface height measurement section 66 Substrate holding surface height measurement section 68 Mounting calibration execution section 69 Polishing calibration execution section 70 Memory section h(n) Height information (of component holding surface) hm1, hm2 Average value Δhx Difference H(i,j) Height information (of substrate holding surface) Hm1, Hm2 Average value ΔHx Difference A, C: constant P: mounting position S1: first calibration information S2: second calibration information

Claims (14)

A component mounting apparatus for mounting components on a substrate, comprising:
a component holder having a component holder surface for holding the component;
a substrate stage having a substrate holding surface for holding the substrate;
A first driving unit that drives the component holding unit;
A second drive unit that drives the substrate stage;
A control unit,
The control unit is
controlling the first driving unit or the second driving unit based on first information regarding an inclination of the component holding surface and second information regarding an inclination of the board holding surface so as to bring the component holding surface and the board holding surface closer to being parallel;
mounting the component held on the component holding surface onto the board held on the board holding surface;
the first information is based on height information at at least three points on the component holding surface,
the substrate stage has a protrusion,
The control unit is
A component mounting apparatus that acquires the height information of the first information by controlling the first drive unit so as to bring the at least three points of the component holding surface into contact with the protrusions of the substrate stage, respectively. The component mounting device according to claim 1 , wherein the second information is based on height information at least at three points on the board holding surface. A component mounting apparatus for mounting components on a substrate, comprising:
a component holder having a component holder surface for holding the component;
a substrate stage having a substrate holding surface for holding the substrate;
A first driving unit that drives the component holding unit;
A second drive unit that drives the substrate stage;
A control unit,
The control unit is
controlling the first driving unit or the second driving unit based on first information regarding an inclination of the component holding surface and second information regarding an inclination of the board holding surface so as to bring the component holding surface and the board holding surface closer to being parallel;
mounting the component held on the component holding surface onto the board held on the board holding surface;
The second information is based on height information at at least three points on the substrate holding surface,
The control unit is
A component mounting device that acquires the height information of the second information by controlling the first drive unit so as to bring the tips of the component holding parts into contact with the at least three locations on the board holding surface. A component mounting apparatus for mounting components on a substrate, comprising:
a component holder having a component holder surface for holding the component;
a substrate stage having a substrate holding surface for holding the substrate;
A first driving unit that drives the component holding unit;
A second drive unit that drives the substrate stage;
A control unit,
The control unit is
controlling the first driving unit or the second driving unit based on first information regarding an inclination of the component holding surface and second information regarding an inclination of the board holding surface so as to bring the component holding surface and the board holding surface closer to being parallel;
mounting the component held on the component holding surface onto the board held on the board holding surface;
The second information is based on height information at at least three points on the substrate holding surface,
the height information of the second information includes height information at each lattice point when the substrate holding surface is divided into a lattice shape,
The control unit is
a component mounting device that identifies a divided area among the plurality of divided areas divided in a lattice pattern, the divided area including a mounting position where the component is to be mounted on the board, and uses height information at four lattice points constituting the identified divided area as the second information to control the first drive unit or the second drive unit so as to bring the component holding surface and the board holding surface closer to parallelism. The control unit is
4. The component mounting device according to claim 1 , wherein the height information is obtained based on a deceleration rate of a speed of the component holder when the first drive unit is controlled to lower the component holder at a predetermined speed. the second driving unit has a tilt mechanism that changes the tilt of the substrate stage,
The control unit is
6. The component mounting apparatus according to claim 1, wherein the tilt mechanism of the second drive unit is driven to bring the component holding surface and the board holding surface closer to each other in parallel. the substrate stage has a polishing unit for polishing the component holding surface,
The control unit is
7. A component mounting device as described in any one of claims 1 to 6, wherein before the component holding surface is brought into contact with the polishing unit for polishing, the first driving unit or the second driving unit is controlled so as to bring the component holding surface and the board holding surface closer to parallel based on the first information and the second information. A method for manufacturing a component-mounted board by mounting components on a board, comprising the steps of:
driving the component holding part or the substrate stage so as to bring the component holding surface and the substrate holding surface closer to parallel based on first information relating to an inclination of a component holding surface of the component holding part which holds the component and second information relating to an inclination of a substrate holding surface of the substrate stage which holds the substrate;
mounting the component held on the component holding surface onto the board held on the board holding surface;
the first information is based on height information at at least three points on the component holding surface,
A method for manufacturing a component mounting board, comprising the steps of: contacting the at least three locations of the component holding surface with protrusions provided on the substrate stage, thereby acquiring the height information of the first information. The method for manufacturing a component-mounted board according to claim 8 , wherein the second information is based on height information at least at three points on the board holding surface. A method for manufacturing a component-mounted board by mounting components on a board, comprising the steps of:
driving the component holding part or the substrate stage so as to bring the component holding surface and the substrate holding surface closer to parallel based on first information relating to an inclination of a component holding surface of the component holding part which holds the component and second information relating to an inclination of a substrate holding surface of the substrate stage which holds the substrate;
mounting the component held on the component holding surface onto the board held on the board holding surface;
The second information is based on height information at at least three points on the substrate holding surface,
The method of manufacturing a component mounting board includes acquiring the height information of the second information by contacting tips of the component holding parts with the at least three locations on the board holding surface. A method for manufacturing a component-mounted board by mounting components on a board, comprising the steps of:
driving the component holding part or the substrate stage so as to bring the component holding surface and the substrate holding surface closer to parallel based on first information relating to an inclination of a component holding surface of the component holding part which holds the component and second information relating to an inclination of a substrate holding surface of the substrate stage which holds the substrate;
mounting the component held on the component holding surface onto the board held on the board holding surface;
The second information is based on height information at at least three points on the substrate holding surface,
the height information of the second information includes height information at each lattice point when the substrate holding surface is divided into a lattice shape,
a second information setting unit that sets the height of the component holding surface and the substrate holding surface so as to be closer to parallel to each other, the second information setting unit being located at a position where the component is to be mounted on the substrate, and the second information setting unit being located at a position where the component is to be mounted on the substrate, ... 11. The method for manufacturing a component mounting board according to claim 8 , further comprising the step of acquiring the height information based on a deceleration rate of a speed of the component holder when the component holder is lowered at a predetermined speed. 13. The method for manufacturing a component mounted board according to claim 8 , further comprising changing an inclination of the board stage to bring the component holding surface and the board holding surface closer to being parallel to each other. 14. The method for manufacturing a component mounting board according to claim 8, wherein before the component holding surface is brought into contact with a polishing section provided on the substrate stage for polishing, the component holding section or the substrate stage is driven so as to bring the component holding surface and the substrate holding surface closer to parallelity based on the first information and the second information.

Images