JP7531328B2 - Adhesive composition, laminate, method for producing laminate, and method for producing electronic component - Google Patents

Description

The present invention relates to an adhesive composition, a laminate, a method for manufacturing a laminate, and a method for manufacturing an electronic component.

2. Description of the Related Art Semiconductor packages (electronic components) that include semiconductor elements are available in various forms according to the corresponding sizes, such as wafer level packages (WLPs) and panel level packages (PLPs).
Semiconductor package technologies include fan-in technology and fan-out technology. A known semiconductor package using fan-in technology is a fan-in WLP (Fan-in Wafer Level Package), which rearranges terminals at the end of a bare chip within the chip area. A known semiconductor package using fan-out technology is a fan-out WLP (Fan-out Wafer Level Package), which rearranges the terminals outside the chip area.

In recent years, fan-out technology in particular has been attracting attention as a method for achieving higher integration, thinner size, and smaller size in semiconductor packages, such as through its application to fan-out PLPs (Fan-out Panel Level Packages), in which semiconductor elements are arranged on a panel and packaged.

In order to miniaturize semiconductor packages, it is important to reduce the thickness of the substrate in which the elements are incorporated. However, reducing the thickness of the substrate reduces its strength, making it more susceptible to damage during semiconductor package manufacturing. In response to this, a technique is known in which the substrate is temporarily attached to a support using an adhesive, and the substrate is processed before being separated from the support.

Thermoplastic adhesives are often used as adhesives for temporary bonding between a substrate and a support, because the adhesive layer can be easily removed using a solvent or the like. For example, Patent Document 1 discloses an adhesive composition that contains a thermoplastic elastomer, a high-boiling point solvent, and a low-boiling point solvent.

International Publication No. 2016/052315

Incidentally, in the manufacture of semiconductor packages, high-temperature processes such as thin film formation, baking, die bonding, etc. may be performed. If the heat resistance of the adhesive is low, the elastic modulus of the adhesive layer may decrease during high-temperature processing, and there is a concern that the position of the substrate may be shifted or the substrate may sink. On the other hand, if the heat resistance of the adhesive is increased, the applicability to the substrate or support tends to decrease.
When a thermosetting adhesive is used to bond the support and the substrate, problems such as misalignment and sinking during high-temperature treatment do not occur. However, it is difficult to remove the adhesive layer using a solvent or the like, and even if a separation layer is provided, it is difficult to remove the adhesive layer that adheres to the substrate after the support and the substrate are separated due to deterioration of the separation layer.
Furthermore, conventional adhesives usually require a separation layer to separate the support and the substrate after processing the substrate, which makes the process complicated since the separation layer and the adhesive layer must be formed separately.

The present invention has been made in view of the above circumstances, and aims to provide an adhesive composition that does not require a separation layer, has high heat resistance, and allows easy removal of the adhesive layer, a laminate produced using the adhesive composition, a method for producing the laminate, and a method for producing electronic components using the adhesive composition.

In order to solve the above problems, the present invention employs the following configuration.
That is, a first aspect of the present invention is an adhesive composition used for forming an adhesive layer that temporarily bonds a semiconductor substrate or an electronic device to a light-transmitting support, the adhesive composition comprising a urethane resin (P1) containing a polymerizable carbon-carbon unsaturated bond, a compound (B) that absorbs at least a portion of light in a wavelength range of 300 to 800 nm and contains a polymerizable carbon-carbon unsaturated bond (excluding those corresponding to the urethane resin (P1)), and a polymerization initiator (A).

The second aspect of the present invention is a laminate in which a light-transmitting support, an adhesive layer, and a semiconductor substrate or an electronic device are laminated in this order, and the adhesive layer is a cured product of the adhesive composition according to the first aspect.

The third aspect of the present invention is a method for producing a laminate in which a light-transmitting support, an adhesive layer, and a semiconductor substrate are laminated in this order, the method comprising the steps of applying the adhesive composition according to the first aspect to the support or the semiconductor substrate to form an adhesive composition layer, placing the semiconductor substrate on the support via the adhesive composition layer, and curing the adhesive composition layer to form the adhesive layer.

The fourth aspect of the present invention is a method for producing a laminate in which a light-transmitting support, an adhesive layer, and an electronic device are laminated in this order, the method further comprising an electronic device formation step of forming an electronic device, which is a composite of a member made of a metal or semiconductor and a resin that seals or insulates the member, after a laminate is obtained by the method for producing a laminate according to the third aspect.

The fifth aspect of the present invention is a method for producing an electronic component, comprising the steps of: obtaining a laminate by the method for producing a laminate according to the fourth aspect; irradiating the adhesive layer with light through the support to alter the adhesive layer, thereby separating the electronic device from the support; and removing the adhesive layer attached to the electronic device by decomposing the urethane bonds in the adhesive layer with an acid or alkali.

The present invention provides an adhesive composition that does not require a separation layer, has high heat resistance, and allows easy removal of the adhesive layer, a laminate produced using the adhesive composition, a method for producing the laminate, and a method for producing electronic components using the adhesive composition.

1 is a schematic diagram showing one embodiment of a laminate to which the present invention is applied. 1 is a schematic diagram showing one embodiment of a laminate to which the present invention is applied. 1 is a schematic diagram showing one embodiment of a laminate to which the present invention is applied. 1 is a schematic diagram showing one embodiment of a laminate to which the present invention is applied. 5A and 5B are schematic process diagrams illustrating one embodiment of a method for producing a laminate 100' in which a support, an adhesive composition layer, and a semiconductor substrate are laminated in this order. Fig. 5A is a diagram illustrating an adhesive composition layer forming step, and Fig. 5B is a diagram illustrating a semiconductor substrate placing step. FIG. 13 is a diagram illustrating an adhesive layer forming step. 7A to 7C are schematic process diagrams illustrating one embodiment of a method for manufacturing a laminate 120. Fig. 7A is a diagram illustrating a sealing process, Fig. 7B is a diagram illustrating a grinding process, and Fig. 7C is a diagram illustrating a wiring layer formation process. 8A and 8B are schematic process diagrams illustrating one embodiment of a method for manufacturing a semiconductor package (electronic component) from a laminate 120. Fig. 8A is a diagram showing a laminate 200, Fig. 8B is a diagram illustrating a separation step, and Fig. 8C is a diagram illustrating an adhesive layer removal step.

In this specification and claims, the term "aliphatic" is a relative concept to aromaticity and is defined as meaning a group, compound, etc. that does not have aromaticity.
Unless otherwise specified, the term "alkyl group" includes linear, branched and cyclic monovalent saturated hydrocarbon groups. The same applies to the alkyl group in an alkoxy group.
Unless otherwise specified, the term "alkylene group" includes linear, branched and cyclic divalent saturated hydrocarbon groups.
The term "halogenated alkyl group" refers to an alkyl group in which some or all of the hydrogen atoms have been substituted with halogen atoms, and examples of the halogen atoms include fluorine, chlorine, bromine and iodine atoms.
The term "fluorinated alkyl group" or "fluorinated alkylene group" refers to an alkyl group or alkylene group in which some or all of the hydrogen atoms have been substituted with fluorine atoms.
The term "structural unit" refers to a monomer unit that constitutes a polymeric compound (resin, polymer, copolymer).
The phrases "may have a substituent" or "may have a substituent" include both cases where a hydrogen atom (-H) is replaced with a monovalent group and cases where a methylene group (-CH ₂ -) is replaced with a divalent group.
The term "exposure" is intended to include the general concept of irradiation with radiation.

The term "structural unit derived from hydroxystyrene" refers to a structural unit formed by cleavage of the ethylenic double bond of hydroxystyrene. The term "structural unit derived from a hydroxystyrene derivative" refers to a structural unit formed by cleavage of the ethylenic double bond of a hydroxystyrene derivative.
The term "hydroxystyrene derivative" refers to a hydroxystyrene derivative in which the hydrogen atom at the α-position of the hydroxystyrene is replaced by another substituent such as an alkyl group or a halogenated alkyl group, and includes derivatives thereof. Examples of such derivatives include hydroxystyrene in which the hydrogen atom at the α-position may be replaced by a substituent, in which the hydrogen atom of the hydroxyl group is replaced by an organic group; and hydroxystyrene in which the hydrogen atom at the α-position may be replaced by a substituent, in which a substituent other than a hydroxyl group is bonded to the benzene ring. The α-position (carbon atom at the α-position) refers to the carbon atom to which the benzene ring is bonded, unless otherwise specified.
Examples of the substituent that substitutes the hydrogen atom at the α-position of the hydroxystyrene include the same as those exemplified as the substituent at the α-position in the above-mentioned α-substituted acrylic ester.

The alkyl group as the substituent at the α-position is preferably a linear or branched alkyl group, and specific examples thereof include alkyl groups having 1 to 5 carbon atoms (such as a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, a pentyl group, an isopentyl group, and a neopentyl group).
Specific examples of the halogenated alkyl group as the substituent at the α-position include groups in which some or all of the hydrogen atoms of the above-mentioned "alkyl group as the substituent at the α-position" are substituted with halogen atoms. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is particularly preferred.
Specific examples of the hydroxyalkyl group as the substituent at the α-position include the above-mentioned "alkyl group as the substituent at the α-position" in which some or all of the hydrogen atoms have been substituted with hydroxyl groups. The number of hydroxyl groups in the hydroxyalkyl group is preferably 1 to 5, and most preferably 1.

In this specification and claims, some structures represented by chemical formulas may have asymmetric carbons, and enantiomers or diastereoisomers may exist. In such cases, a single formula represents all of the isomers. These isomers may be used alone or as a mixture.

(Adhesive Composition)
The adhesive composition according to a first aspect of the present invention is an adhesive composition used for forming an adhesive layer that temporarily bonds a semiconductor substrate or an electronic device to a light-transmitting support,
The composition is characterized by comprising a compound (B) that absorbs at least a portion of light in a wavelength range of 300 to 800 nm and that contains a polymerizable carbon-carbon unsaturated bond, a urethane resin (P1) that contains a polymerizable carbon-carbon unsaturated bond, and a polymerization initiator (A).

<Target for temporary adhesion>
The adhesive composition according to the present embodiment is used to form an adhesive layer that temporarily bonds a semiconductor substrate or an electronic device to a support. In this specification, "temporary adhesion" refers to the fact that the objects to be bonded are temporarily bonded (for example, during any work process). More specifically, the semiconductor substrate or electronic device is temporarily bonded to a support and fixed on the support (temporary adhesion) for the purposes of thinning the device, transporting the semiconductor substrate, mounting on the semiconductor substrate, etc., and is separated from the support after the process is completed.

<Semiconductor substrate>
The semiconductor substrate to which the adhesive composition according to the present embodiment is applied is not particularly limited, and may be a substrate generally used as a semiconductor substrate. The semiconductor substrate (bare chip) is subjected to processes such as thinning and mounting while being supported on a support. The semiconductor substrate may have structures such as integrated circuits and metal bumps mounted thereon.
A typical example of the semiconductor substrate is a silicon wafer substrate, but is not limited thereto, and may be a ceramic substrate, a thin film substrate, a flexible substrate, or the like.

<Electronic Devices>
In this specification, the term "electronic device" refers to a member constituting at least a part of an electronic component. The electronic device is not particularly limited, and may be one in which various mechanical structures or circuits are formed on the surface of a semiconductor substrate. The electronic device may preferably be a composite of a member made of a metal or semiconductor and a resin that seals or insulates the member. The electronic device may be one in which a rewiring layer, which will be described later, and/or a semiconductor element or other element is sealed or insulated with a sealing material or an insulating material, and may have a single-layer or multi-layer structure.

<Support>
The support is a member that supports a semiconductor substrate or an electronic device. As described below, the support is made of a member that has light transmitting properties and supports a semiconductor substrate.

<Compound that absorbs at least a portion of light in the wavelength range of 300 to 800 nm and contains a polymerizable carbon-carbon unsaturated bond: Component (B)>
The adhesive composition according to this embodiment contains a compound (B) (hereinafter also referred to as "component (B)") that absorbs at least a portion of light in the wavelength range of 300 to 800 nm and contains a polymerizable carbon-carbon unsaturated bond. Note that component (B) is a compound that does not fall under component (P1) described below.
Since the component (B) contains a polymerizable carbon-carbon unsaturated bond, it reacts with a urethane resin (P1) (hereinafter also referred to as "component (P1)") containing a polymerizable carbon-carbon unsaturated bond described below and hardens, and can form an adhesive layer together with the component (P1). This allows a semiconductor substrate or an electronic device to be temporarily bonded to a support. In addition, since the component (B) absorbs at least a portion of light having a wavelength in the range of 300 to 800 nm, the component (B) absorbs the light and generates heat by irradiating the adhesive layer with light having a wavelength in the range of 300 to 800 nm. This allows the adhesive layer to be altered.

The (B) component acts as a light absorber that absorbs light with a wavelength of 300 to 800 nm. The (B) component can absorb light with a wavelength in the range of 300 to 800 nm and convert it into heat energy to an extent that can alter the adhesive layer. The (B) component is preferably capable of absorbing light in the wavelength range of 300 to 700 nm, more preferably capable of absorbing light in the wavelength range of 300 to 600 nm, even more preferably capable of absorbing light in the wavelength range of 300 to 550 nm, and particularly preferably capable of absorbing light in the wavelength range of 300 to 400 nm. The (B) component preferably has an absorption peak in the above wavelength range. The (B) component can be one that can absorb light of the wavelength depending on the wavelength of the light used when separating the support from the semiconductor substrate or the like. An example of the (B) component is one that can absorb light with a wavelength of 355 nm and convert it into heat energy to alter the adhesive layer.

The polymerizable carbon-carbon unsaturated bond contained in compound (B) is not particularly limited, but is preferably radically polymerizable. Examples of the polymerizable carbon-carbon unsaturated bond include a polymerizable carbon-carbon double bond and a polymerizable carbon-carbon triple bond. Examples of the polymerizable carbon-carbon double bond include, but are not limited to, a vinyl group, a methacryloyl group, and an acryloyl group. Examples of the polymerizable carbon-carbon triple bond include, but are not limited to, an ethynyl group, and a propargyl group.

Examples of compound (B) include those represented by the following general formula (b):

［式中、Ｗは重合性炭素－炭素不飽和結合を含む１価の基であり、Ｙは単結合又は－Ｏ－、－ＣＯ－、－ＣＯＯ－、及び－ＣＯＮＨ－からなる群から選択される２価の基である。ｎは１～６の整数であり、Ｘはその構造中に芳香族性を有する縮合環骨格、ベンゾフェノン骨格、ジベンゾイルメタン骨格、ジベンゾイルベンゼン骨格、又はベンゾトリアゾール骨格、を有するｎ価の原子団であり、ｎが２以上の場合、複数存在するＷ及びＹは互いに同一であってもよく、異なっていてもよい。］

[In the formula, W is a monovalent group containing a polymerizable carbon-carbon unsaturated bond, Y is a single bond or a divalent group selected from the group consisting of -O-, -CO-, -COO-, and -CONH-, n is an integer of 1 to 6, X is an n-valent atomic group having a fused ring skeleton, a benzophenone skeleton, a dibenzoylmethane skeleton, a dibenzoylbenzene skeleton, or a benzotriazole skeleton having aromaticity in its structure, and when n is 2 or more, a plurality of Ws and Ys may be the same or different.]

In the general formula (b), W is a polymerizable group-containing group containing a polymerizable carbon-carbon unsaturated bond. Examples of the polymerizable carbon-carbon unsaturated bond contained in W include a polymerizable carbon-carbon double bond and a polymerizable carbon-carbon triple bond. Examples of W include an alkenyl group and an alkynyl group. The alkenyl group preferably has 2 to 10 carbon atoms, more preferably has 2 to 6 carbon atoms, and even more preferably has 2 or 3 carbon atoms. Specific examples of the alkenyl group include a vinyl group and an isopropenyl group. The alkynyl group preferably has 2 to 6 carbon atoms, more preferably has 2 or 3 carbon atoms, and even more preferably has 2 carbon atoms. Specific examples of the alkynyl group include an ethynyl group and a 1-propynyl group.

In general formula (b), Y is a single bond or a divalent group selected from the group consisting of -O-, -CO-, -COO-, and -CONH-. Of these, Y is preferably a single bond, -COO-, or -CONH-, and more preferably a single bond or -CONH-.

In general formula (b), X is an n-valent atomic group having an aromatic fused ring skeleton, a benzophenone skeleton, a dibenzoylmethane skeleton, a dibenzoylbenzene skeleton, or a benzotriazole skeleton in its structure.
The aromatic fused ring skeleton includes a fused ring having at least one aromatic ring. The aromatic ring is not particularly limited as long as it is a cyclic conjugated system having 4n+2 π electrons, and may be an aromatic hydrocarbon ring or an aromatic heterocycle. The number of aromatic rings in the fused ring is preferably 2 to 10, more preferably 2 to 6, even more preferably 2 to 4, and particularly preferably 2 or 3. The fused ring may be composed of only aromatic rings or may be a fused ring of an aromatic ring and an aliphatic hydrocarbon ring, but a fused ring composed of only aromatic rings is preferable. Specific examples of the fused ring include naphthalene, anthracene, phenanthrene, pyrene, and the like. Among these, anthracene or phenanthrene is preferable.

In general formula (b), n is an integer of 1 to 6. n is preferably 1 to 5, more preferably 1 to 3, further preferably 1 or 2, and particularly preferably 1. When n is 2 or more, multiple Ws may be the same or different, but are preferably the same. When n is 2 or more, multiple Ys may be the same or different, but are preferably the same.

Examples of X having a fused ring skeleton with aromaticity include those represented by the following general formula (Xa-1) or (Xa-2). X represented by general formula (Xa-1) is an atomic group having an anthracene skeleton, and X represented by general formula (Xa-2) is an atomic group having a phenanthrene skeleton.

［式中、Ｌ^ａ１及びＬ^ａ２は、それぞれ独立に、単結合又は２価の連結基を表し、Ｒ^ａ１及びＲ^ａ２は、それぞれ独立に、置換基を表す。ｎは、前記式（ｂ）中のｎと同じものである。ｍは、０～９の整数を表し、ｍ＋ｎ≦１０である。ｎが２以上の場合、複数存在するＬ^ａ１及びＬ^ａ２は互いに同一であっても異なっていてもよい。ｍが２以上の場合、複数存在するＲ^ａ１及びＲ^ａ２は互いに同一であっても異なっていてもよい。＊は一般式（ｂ）中のＹに結合する結合手である。］

[In the formula, L ^a1 and L ^a2 each independently represent a single bond or a divalent linking group, and R ^a1 and R ^a2 each independently represent a substituent. n is the same as n in the formula (b). m represents an integer of 0 to 9, and m+n≦10. When n is 2 or more, a plurality of L ^a1s and L ^a2s may be the same or different. When m is 2 or more, a plurality of R ^a1s and R ^a2s may be the same or different. * represents a bond bonded to Y in the general formula (b).]

In general formulae (Xa-1) and (Xa-2), L ^a1 and L ^a2 each independently represent a single bond or a divalent linking group. Examples of the divalent linking group include a hydrocarbon group which may have a substituent. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group.
The aliphatic hydrocarbon group may be saturated or unsaturated, but is preferably saturated. The aliphatic hydrocarbon group may be linear or branched, or may contain a ring in its structure. The linear aliphatic hydrocarbon group preferably has 1 to 10 carbon atoms, more preferably has 1 to 6 carbon atoms, and even more preferably has 1 to 3 carbon atoms. The branched aliphatic hydrocarbon group preferably has 2 to 10 carbon atoms, more preferably has 2 to 6 carbon atoms, and even more preferably has 2 or 3 carbon atoms. The aliphatic hydrocarbon group containing a ring structure preferably has 3 to 10 carbon atoms, and preferably has 3 to 6 carbon atoms.
The aliphatic hydrocarbon group may have a substituent. The substituent may be one that replaces a hydrogen atom, or one that replaces a methylene group (-CH ₂ -) in the carbon chain. Examples of the substituent that replaces a hydrogen atom include a hydroxy group, an amino group, an alkoxy group, a halogen atom, a carboxy group, a cyano group, etc., and a hydroxy group or an amino group is preferable. Examples of the substituent that replaces a methylene group (-CH ₂ -) in the carbon chain include -O-, -CO-, -NH-, -COO-, -CONH-, etc.

The aromatic hydrocarbon group is a hydrocarbon group containing at least one aromatic ring. The aromatic ring contained in the aromatic hydrocarbon group may be a monocyclic ring or a polycyclic ring. The aromatic ring may be an aromatic hydrocarbon ring or an aromatic heterocyclic ring. The number of aromatic rings contained in the aromatic hydrocarbon group is not particularly limited, but is preferably 1 to 3, and more preferably 1 or 2. The aromatic hydrocarbon group may be a group in which an aromatic ring and an aliphatic hydrocarbon group are linked.
The aromatic hydrocarbon group may have a substituent. The substituent may be a group that replaces a hydrogen atom of an aromatic ring, or a group that replaces a carbon atom that constitutes a ring of an aromatic ring with a hetero atom. Examples of the substituent that replaces a hydrogen atom include a hydroxy group, an amino group, an alkoxy group, a halogen atom, a carboxy group, and a cyano group, and a hydroxy group or an amino group is preferred. Examples of the hetero atom that replaces a ring of an aromatic ring include a nitrogen atom, an oxygen atom, and a sulfur atom, and a nitrogen atom is preferred.

In the general formulae (Xa-1) and (Xa-2), R ^a1 and R ^a2 each independently represent a substituent. Examples of R ^a1 and R ^a2 include an alkyl group, a hydroxy group, an amino group, an alkoxy group, a halogen atom, a carboxy group, a cyano group, a nitrile group, a nitrile alkyl group, and an alicyclic group. The alkyl group, alkoxy group, and nitrile alkyl group preferably have 1 to 5 carbon atoms, and more preferably have 1 to 3 carbon atoms. The alicyclic group preferably has 1 to 6 carbon atoms. Examples of the nitrile alkyl group include a malonylnitrile group. The alicyclic group may be an alicyclic hydrocarbon ring or an alicyclic heterocycle. Examples of the alicyclic heterocycle include those containing a sulfur atom, a nitrogen atom, or an oxygen atom. A specific example of the alicyclic heterocycle includes dithiolane.

In formulae (Xa-1) and (Xa-2), m represents an integer of 0 to 9. m is preferably an integer of 0 to 6, more preferably an integer of 0 to 5, still more preferably an integer of 0 to 3, and particularly preferably an integer of 0 to 2.
In the general formulae (Xa-1) and (Xa-2), n is the same as n in the above formula (b).
The relationship between m and n is m+n≦10.

Examples of X having a benzophenone skeleton include those represented by the following general formula (Xb).

［式中、Ｌ^ｂ１及びＬ^ｂ２は、それぞれ独立に、単結合又は２価の連結基を表し、Ｒ^ｂ１及びＲ^ｂ２は、それぞれ独立に、置換基を表す。ｐ及びｑは、それぞれ独立に、０～５の整数を表し、ｐ＋ｑ＝ｎである。ｍ１及びｍ２は、それぞれ独立に、０～５の整数を表し、ｍ１＋ｐ≦５、ｍ２＋ｑ≦５である。ｐが２以上の場合、複数存在するＬ^ｂ１は互いに同一であっても異なっていてもよい。ｑが２以上の場合、複数存在するＬ^ｂ２は互いに同一であっても異なっていてもよい。ｍ１が２以上の場合、複数存在するＲ^ｂ１は互いに同一であっても異なっていてもよい。ｍ２が２以上の場合、複数存在するＲ^ｂ２は互いに同一であっても異なっていてもよい。＊は一般式（ｂ）中のＹに結合する結合手である。］

[In the formula, L ^b1 and L ^b2 each independently represent a single bond or a divalent linking group, and R ^b1 and R ^b2 each independently represent a substituent. p and q each independently represent an integer of 0 to 5, and p+q=n. m1 and m2 each independently represent an integer of 0 to 5, and m1+p≦5, m2+q≦5. When p is 2 or more, the multiple L ^b1s may be the same or different from each other. When q is 2 or more, the multiple L ^b2s may be the same or different from each other. When m1 is 2 or more, the multiple R ^b1s may be the same or different from each other. When m2 is 2 or more, the multiple R ^b2s may be the same or different from each other. * is a bond bonded to Y in general formula (b).]

In the general formula (Xb), L ^b1 and L ^b2 each independently represent a single bond or a divalent linking group. Examples of the divalent linking group include the same as those exemplified for L ^a1 and L ^a2 in the formulae (Xa-1) and (Xa-2). L ^b1 and L ^b2 are preferably a single bond or an aliphatic hydrocarbon group which may have a substituent, and preferably a single bond or an alkyl group which may have a substituent. The alkyl group which may have a substituent preferably has 1 to 5 carbon atoms, and more preferably has 1 to 3 carbon atoms. The alkyl group which may have a substituent is preferably an alkyl group, or an alkyl group in which a part of a methylene group (-CH ₂ -) constituting a carbon chain is substituted with -O-, -CO-, -NH-, -COO-, or -CONH-.

In formula (Xb), R ^b1 and R ^b2 each independently represent a substituent. Examples of R ^b1 and R ^b2 include the same groups as those exemplified for R ^a1 and R ^a2 in formulas (Xa-1) and (Xa-2).

In formula (Xb), p and q each independently represent an integer of 0 to 5, and p+q=n, where n is the same as n in formula (b).
In formula (Xb), m1 and m2 each independently represent an integer of 0 to 5, and m1+p≦5 and m2+q≦5. m1 and m2 each preferably represent an integer of 0 to 3, more preferably 0 to 2, and even more preferably 0 or 1.

Examples of X having a dibenzoylmethane skeleton include those represented by the following general formula (Xc).

［式中、Ｌ^ｃ１及びＬ^ｃ２は、それぞれ独立に、単結合又は２価の連結基を表し、Ｒ^ｃ１及びＲ^ｃ２は、それぞれ独立に、置換基を表す。ｐ及びｑは、それぞれ独立に、０～５の整数を表し、ｐ＋ｑ＝ｎである。ｍ１及びｍ２は、それぞれ独立に、０～５の整数を表し、ｍ１＋ｐ≦５、ｍ２＋ｑ≦５である。ｐが２以上の場合、複数存在するＬ^ｃ１は互いに同一であっても異なっていてもよい。ｑが２以上の場合、複数存在するＬ^ｃ２は互いに同一であっても異なっていてもよい。ｍ１が２以上の場合、複数存在するＲ^ｃ１は互いに同一であっても異なっていてもよい。ｍ２が２以上の場合、複数存在するＲ^ｃ２は互いに同一であっても異なっていてもよい。＊は一般式（ｂ）中のＹに結合する結合手である。］

[In the formula, L ^c1 and L ^c2 each independently represent a single bond or a divalent linking group, and R ^c1 and R ^c2 each independently represent a substituent. p and q each independently represent an integer of 0 to 5, and p + q = n. m1 and m2 each independently represent an integer of 0 to 5, and m1 + p ≦ 5, m2 + q ≦ 5. When p is 2 or more, the multiple L ^c1s may be the same or different from each other. When q is 2 or more, the multiple L ^c2s may be the same or different from each other. When m1 is 2 or more, the multiple R ^c1s may be the same or different from each other. When m2 is 2 or more, the multiple R ^c2s may be the same or different from each other. * is a bond bonded to Y in general formula (b).]

In the general formula (Xc), L ^c1 and L ^c2 each independently represent a single bond or a divalent linking group. Examples of the divalent linking group include the same as those exemplified for L ^a1 and L ^a2 in the formulae (Xa-1) and (Xa-2). L ^c1 and L ^c2 are preferably a single bond or an aliphatic hydrocarbon group which may have a substituent, and preferably a single bond or an alkyl group which may have a substituent. The alkyl group which may have a substituent preferably has 1 to 5 carbon atoms, and more preferably has 1 to 3 carbon atoms. The alkyl group which may have a substituent is preferably an alkyl group, or an alkyl group in which a part of a methylene group (-CH ₂ -) constituting a carbon chain is substituted with -O-, -CO-, -NH-, -COO-, or -CONH-.

In formula (Xc), R ^c1 and R ^c2 each independently represent a substituent. Examples of R ^c1 and R ^c2 include the same groups as those exemplified for R ^a1 and R ^a2 in formulas (Xa-1) and (Xa-2).

In formula (Xc), p and q each independently represent an integer of 0 to 5, and p+q=n, where n is the same as n in formula (b).
In formula (Xc), m1 and m2 each independently represent an integer of 0 to 5, and m1+p≦5 and m2+q≦5. m1 and m2 each preferably represent an integer of 0 to 3, more preferably 0 to 2, and even more preferably 0 or 1.

Examples of X having a dibenzoylbenzene skeleton include those represented by the following general formula (Xd).

［式中、Ｌ^ｄ１、Ｌ^ｄ２及びＬ^ｄ３は、それぞれ独立に、単結合又は２価の連結基を表し、Ｒ^ｄ１、Ｒ^ｄ２及びＲ^ｄ３は、それぞれ独立に、置換基を表す。ｐ及びｑは、それぞれ独立に、０～５の整数を表し、ｒは、０～４の整数を表し、ｐ＋ｑ＋ｒ＝ｎである。ｍ１及びｍ２は、それぞれ独立に、０～５の整数を表し、ｍ３は、１～４の整数を表し、ｍ１＋ｐ≦５、ｍ２＋ｑ≦５、ｍ３＋ｒ＝４である。ｐが２以上の場合、複数存在するＬ^ｄ１は互いに同一であっても異なっていてもよい。ｑが２以上の場合、複数存在するＬ^ｄ２は互いに同一であっても異なっていてもよい。ｒが２以上の場合、複数存在するＬ^ｄ３は互いに同一であっても異なっていてもよい。ｍ１が２以上の場合、複数存在するＲ^ｄ１は互いに同一であっても異なっていてもよい。ｍ２が２以上の場合、複数存在するＲ^ｄ２は互いに同一であっても異なっていてもよい。ｍ３が２以上の場合、複数存在するＲ^ｄ３は互いに同一であっても異なっていてもよい。＊は一般式（ｂ）中のＹに結合する結合手である。］

[In the formula, L ^d1 , L ^d2 and L ^d3 each independently represent a single bond or a divalent linking group, and R ^d1 , R ^d2 and R ^d3 each independently represent a substituent. p and q each independently represent an integer of 0 to 5, r represents an integer of 0 to 4, and p + q + r = n. m1 and m2 each independently represent an integer of 0 to 5, m3 represents an integer of 1 to 4, and m1 + p ≦ 5, m2 + q ≦ 5, and m3 + r = 4. When p is 2 or more, the multiple L ^d1s may be the same or different from each other. When q is 2 or more, the multiple L ^d2s may be the same or different from each other. When r is 2 or more, the multiple L ^d3s may be the same or different from each other. When m1 is 2 or more, the multiple R ^d1s may be the same or different from each other. When m2 is 2 or more, the multiple R ^d2 may be the same or different. When m3 is 2 or more, the multiple R ^d3 may be the same or different. * is a bond bonded to Y in general formula (b).

In the general formula (Xd), L ^d1 , L ^d2 and L ^d3 each independently represent a single bond or a divalent linking group. Examples of the divalent linking group include the same as those exemplified for L ^a1 and L ^a2 in the formulas (Xa-1) and (Xa-2). L ^d1 , L ^d2 and L ^d3 are preferably a single bond or an aliphatic hydrocarbon group which may have a substituent, and are preferably a single bond or an alkyl group which may have a substituent. The alkyl group which may have a substituent preferably has 1 to 5 carbon atoms, and more preferably has 1 to 3 carbon atoms. The alkyl group which may have a substituent is preferably an alkyl group, or an alkyl group in which a part of the methylene group (-CH ₂ -) constituting the carbon chain is substituted with -O-, -CO-, -NH-, -COO- or -CONH-.

In formula (Xd), R ^d1 , R ^d2 and R ^d3 each independently represent a substituent. Examples of R ^d1 , R ^d2 and R ^d3 include the same groups as those exemplified for R ^a1 and R ^a2 in formulas (Xa-1) and (Xa-2).

In formula (Xd), p and q each independently represent an integer of 0 to 5, r represents an integer of 0 to 4, and p+q+r=n, where n is the same as n in formula (b).
In formula (Xd), m1 and m2 each independently represent an integer of 0 to 5, m3 represents an integer of 1 to 4, m1+p≦5, m2+q≦5, and m3+r=4. m1, m2, and m3 each preferably represent an integer of 0 to 3, more preferably an integer of 0 to 2, and even more preferably 0 or 1.

Examples of X having a benzotriazole skeleton include those represented by the following general formula (Xe):

［式中、Ｌ^ｅは、単結合又は２価の連結基を表し、Ｒ^ｅは、置換基を表す。ｎは、前記式（ｂ）中のｎと同じものである。ｍは、０～４の整数を表し、ｍ＋ｎ≦５である。ｎが２以上の場合、複数存在するＬ^ｅは互いに同一であっても異なっていてもよい。ｍが２以上の場合、複数存在するＲ^ｅは互いに同一であっても異なっていてもよい。＊は一般式（ｂ）中のＹに結合する結合手である。］

[In the formula, L ^e represents a single bond or a divalent linking group, and R ^e represents a substituent. n is the same as n in the formula (b). m represents an integer of 0 to 4, and m+n≦5. When n is 2 or more, multiple L ^e may be the same or different. When m is 2 or more, multiple R ^e may be the same or different. * represents a bond bonded to Y in the general formula (b).]

In the general formula (Xe), L ^e represents a single bond or a divalent linking group. Examples of the divalent linking group include the same as those exemplified for L ^a1 and L ^a2 in the formulae (Xa-1) and (Xa-2). ^{L e} is preferably a single bond or a hydrocarbon group which may have a substituent, and is preferably a single bond, an alkyl group which may have a substituent, or a group in which one hydrogen atom of a benzene ring is substituted with an alkyl group. The alkyl group which may have a substituent and the alkyl group bonded to a benzene ring preferably have 1 to 5 carbon atoms, and more preferably have 1 to 3 carbon atoms.

In formula (Xe), R ^e represents a substituent. Examples of R ^e include the same groups as those exemplified for R ^a1 and R ^a2 in formulae (Xa-1) and (Xa-2).

In formula (Xe), m represents an integer of 0 to 4. m is preferably an integer of 0 to 3, more preferably an integer of 0 to 2, and further preferably 0 or 1.
In the general formula (Xe), n is the same as n in the above formula (b), in which case n is an integer of 1 to 5.
The relationship between m and n is m+n≦5.

Compound (B) is preferably a compound represented by the following general formula (b-1) or (b-2).

［式中、Ｒ^１１、Ｒ^１２、及びＲ^１３は、それぞれ独立に、水素原子又は炭素原子数１～３のアルキル基であり、Ｙ^１は単結合又は－Ｏ－、－ＣＯ－、－ＣＯＯ－、及び－ＣＯＮＨ－からなる群から選択される２価の基である。ｎは１～６の整数であり、Ｘ^１はその構造中に芳香族性を有する縮合環骨格、ベンゾフェノン骨格、ジベンゾイルメタン骨格、ジベンゾイルベンゼン骨格、又はベンゾトリアゾール骨格、を有するｎ^１価の原子団であり、ｎ^１が２以上の場合、複数存在するＲ^１１、Ｒ^１２、及びＲ^１３及びＹ^１は互いに同一であってもよく、異なっていてもよい。］

[In the formula, R ¹¹ , R ¹² , and R ¹³ are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and Y ¹ is a single bond or a divalent group selected from the group consisting of -O-, -CO-, -COO-, and -CONH-. n is an integer of 1 to 6, and X ¹ is an n ¹ -valent atomic group having a fused ring skeleton, a benzophenone skeleton, a dibenzoylmethane skeleton, a dibenzoylbenzene skeleton, or a benzotriazole skeleton having aromaticity in its structure, and when n ¹ is 2 or more, the multiple R ¹¹ , R ¹² , R ¹³ , and Y ¹ may be the same as or different from each other.]

［式中、Ｒ^２１は水素原子又は炭素原子数１～３のアルキル基であり、Ｙ^２は単結合又は－Ｏ－、－ＣＯ－、－ＣＯＯ－、及び－ＣＯＮＨ－からなる群から選択される２価の基である。ｎ^２は１～６の整数であり、Ｘ^２はその構造中に芳香族性を有する縮合環骨格、ベンゾフェノン骨格、ジベンゾイルメタン骨格、ジベンゾイルベンゼン骨格、又はベンゾトリアゾール骨格、を有するｎ^２価の原子団であり、ｎ^２が２以上の場合、複数存在するＲ^２１及びＹ^２は互いに同一であってもよく、異なっていてもよい。］

[In the formula, R ²¹ is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, Y ² is a single bond or a divalent group selected from the group consisting of -O-, -CO-, -COO-, and -CONH-, n ² is an integer of 1 to 6, X ² is a divalent atomic group having an aromatic fused ring skeleton, a benzophenone skeleton, a dibenzoylmethane skeleton, a ^{dibenzoylbenzene} skeleton, or a benzotriazole skeleton in its structure, and when n ² is 2 or more, a plurality of R ²¹ and Y ² may be the same or different.]

In general formula (b-1), R ¹¹ , R ¹² , and R ¹³ are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. R ¹¹ and R ¹² are each independently preferably a hydrogen atom, a methyl group, or an ethyl group, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom. ^{R 13} is preferably a hydrogen atom, a methyl group, or an ethyl group, and more preferably a hydrogen atom or a methyl group.

In the general formula (b-1), ^Y1 is the same as Y in the general formula (b).
In the general formula (b-1), ^X1 is the same as X in the general formula (b).
In general formula (b-1), ⁿ¹ is the same as n in general formula (b). When ⁿ¹ is 2 or more, the multiple ^R11 , ^R12 , and ^R13 may be the same as or different from each other. When ⁿ¹ is 2 or more, the multiple ^Y1s may be the same as or different from each other. When ⁿ¹ is 2 or more, the multiple ^X1s may be the same as or different from each other.

In general formula (b-2), R ²¹ is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. R ²¹ is preferably a hydrogen atom, a methyl group, or an ethyl group, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.

In the general formula (b-2), ^Y2 is the same as Y in the general formula (b).
In the general formula (b-2), ^X2 is the same as X in the general formula (b).
In general formula (b-2), ⁿ² is the same as n in general formula (b). When ⁿ² is 2 or more, the multiple ^R21s may be the same as or different from each other. When ⁿ² is 2 or more, the multiple ^Y2s may be the same as or different from each other. When ⁿ² is 2 or more, the multiple ^X2s may be the same as or different from each other.

Specific examples of compounds (B) containing a fused ring skeleton with aromaticity are shown below, but are not limited to these.

Specific examples of compounds (B) containing a benzophenone skeleton are shown below, but are not limited to these.

Specific examples of compounds (B) containing a dibenzoylmethane skeleton are shown below, but are not limited to these.

Specific examples of compounds (B) containing a dibenzoylbenzene skeleton are shown below, but are not limited to these.

Specific examples of compounds (B) containing a benzotriazole skeleton are shown below, but are not limited to these.

The component (B) may be used alone or in combination of two or more types.
The content of the (B) component in the adhesive composition is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, and may be 10 parts by mass or more, or 15 parts by mass or more, relative to 100 parts by mass of the polyurethane resin (P1) described later. The upper limit of the content of the (B) component is not particularly limited, but may be, for example, 30 parts by mass or less, or 20 parts by mass or less, relative to 100 parts by mass of the polyurethane resin (P1) described later. The range of the content of the (B) component is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, and even more preferably 5 to 15 parts by mass, relative to 100 parts by mass of the polyurethane resin (P1) described later. When the content of the (B) component is equal to or more than the lower limit, the light absorption efficiency in the adhesive layer is improved, and the alteration of the adhesive layer is improved. When the content of the (B) component is equal to or less than the upper limit, it is easy to balance with other components.

<Urethane resin containing polymerizable carbon-carbon unsaturated bonds: component (P1)>
The adhesive composition according to this embodiment contains a urethane resin containing a polymerizable carbon-carbon unsaturated bond (hereinafter also referred to as "component (P1)"). The component (P1) is polymerized and cured by the polymerizable carbon-carbon unsaturated bond to form an adhesive layer. This allows a semiconductor substrate or an electronic device to be temporarily bonded to a support. Furthermore, the urethane bond in the component (P1) has the property of being decomposed by an acid or an alkali. Therefore, the adhesive layer can be easily removed by a treatment liquid containing an acid or an alkali.

The polymerizable carbon-carbon unsaturated bond contained in the component (P1) is not particularly limited, but is preferably radically polymerizable. The polymerizable carbon-carbon unsaturated bond may be a polymerizable carbon-carbon double bond or a polymerizable carbon-carbon triple bond, with a polymerizable carbon-carbon double bond being preferred. Examples of the polymerizable carbon-carbon unsaturated bond include a methacryloyl group and an acryloyl group. The polymerizable carbon-carbon unsaturated bond contained in the component (P1) may be one type or two or more types.
The equivalent of the polymerizable carbon-carbon unsaturated bond contained in the (P1) component is preferably 200 to 2000 g/eq. or more, more preferably 300 to 1500 g/eq. or more, even more preferably 400 to 1200 g/eq. or more, and particularly preferably 500 to 1000 g/eq. When the polymerizable carbon-carbon unsaturated bond equivalent is equal to or more than the lower limit of the above-mentioned preferred range, the elastic modulus, heat resistance, etc. of the adhesive layer are further improved. When the polymerizable carbon-carbon unsaturated bond equivalent is equal to or less than the upper limit of the above-mentioned preferred range, the adhesive layer does not become too hard and has good washability. The above-mentioned equivalent number is the molecular weight of the urethane resin per equivalent of the polymerizable carbon-carbon unsaturated bond.

The weight average molecular weight (Mw) of the (P1) component is preferably 5,000 to 100,000, more preferably 1,000 to 50,000, even more preferably 12,000 to 30,000, and particularly preferably 13,000 to 25,000.

The (P1) component can be synthesized by a polymerization addition reaction between a polyisocyanate compound (hereinafter also referred to as "component (I)") and a polyol (hereinafter also referred to as "component (O)"). At least one of the (I) component and the (O) component preferably contains a polymerizable carbon-carbon unsaturated bond.

<Polyisocyanate compound: component (I)>
In this specification, the term "polyisocyanate compound" refers to a compound having two or more isocyanate groups (-N=C=O) (polyisocyanate) or a compound having two or more blocked isocyanate groups (blocked polyisocyanate). The polyisocyanate is not particularly limited, and any polyisocyanate that is generally used in the production of urethane resins can be used without particular limitation.
Blocked polyisocyanates are compounds in which the isocyanate groups of polyisocyanates are blocked and inactivated by reaction with a blocking agent. The blocked polyisocyanates used as component (I) are preferably those in which the isocyanate groups are blocked with a thermally dissociable blocking agent. Examples of the thermally dissociable blocking agent include blocking agents such as oximes, diketones, phenols, and caprolactams. In blocked polyisocyanates using a thermally dissociable blocking agent, the isocyanate groups are inactive at room temperature, and when heated, the thermally dissociable blocking agent dissociates to regenerate the isocyanate groups.

Specific examples of polyisocyanates include aliphatic diisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, and lysine diisocyanate; alicyclic diisocyanates such as dicyclohexylmethane diisocyanate, isophorone diisocyanate, 1,4-cyclohexane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated tolylene diisocyanate, and dicyclohexylmethane-4,4'-diisocyanate. isocyanate; and aromatic diisocyanates such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, tolidine diisocyanate, p-phenylene diisocyanate, and naphthylene diisocyanate; as well as their biuret forms, isocyanurate forms, and adducts with trimethylolpropane. The polyisocyanate may be used alone or in combination of two or more types.

Commercially available polyisocyanates may be used. Examples of commercially available polyisocyanates include Duranate (registered trademark) 24A-100, Duranate 22A-75P, Duranate TPA-100, Duranate TKA-100, Duranate P301-75E, Duranate 21S-75E, Duranate MFA-75B, Duranate MHG-80B, Duranate TUL-100, and Duranate 100. Examples of such products include Duranate TLA-100, Duranate TSA-100, Duranate TSS-100, Duranate TSE100, Duranate E402-80B, Duranate E405-70B, Duranate AS700-100, Duranate D101, Duranate D201, and Duranate A201H (all trade names, manufactured by Asahi Kasei Chemicals Corporation). These products may be used alone or in combination of two or more types.

Examples of blocked isocyanates include compounds in which the isocyanate groups of the polyisocyanates described above are protected by reaction with a blocking agent. The blocking agent is not particularly limited as long as it is a thermally dissociable blocking agent, that is, a compound that is added to an isocyanate group, is stable at room temperature, but is liberated when heated to a dissociation temperature or higher to generate an isocyanate group, and any known blocking agent can be used without particular limitation.
Specific examples of blocking agents include lactam compounds such as γ-butyrolactam, ε-caprolactam, γ-valerolactam, and propiolactam; oxime compounds such as methyl ethyl ketoxime, methyl isoamyl ketoxime, methyl isobutyl ketoxime, formamide oxime, acetamide oxime, acetoxime, diacetyl monooxime, benzophenone oxime, and cyclohexanone oxime; monocyclic phenol compounds such as phenol, cresol, catechol, and nitrophenol; polycyclic phenol compounds such as 1-naphthol; alcohol compounds such as methyl alcohol, ethyl alcohol, isopropyl alcohol, tert-butyl alcohol, trimethylolpropane, and 2-ethylhexyl alcohol; ether compounds such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol monobutyl ether; active methylene compounds such as malonic acid alkyl esters, malonic acid dialkyl esters, acetoacetate alkyl esters, and acetylacetone; and the like. The blocking agents may be used alone or in combination of two or more.

Blocked polyisocyanates can be produced by reacting polyisocyanates with blocking agents. The reaction between polyisocyanates and blocking agents is carried out, for example, in a solvent that does not have active hydrogen (1.4 dioxane, cellosolve acetate, etc.) under heating at about 50 to 100°C, and in the presence of a blocking catalyst as necessary. There are no particular restrictions on the ratio of polyisocyanates to blocking agents used, but the equivalent ratio of isocyanate groups in the polyisocyanate to blocking agent is preferably 0.95:1.0 to 1.1:1.0, and more preferably 1:1.05 to 1.15. Known blocking catalysts can be used, and examples of such blocking catalysts include metal alcoholates such as sodium methylate, sodium ethylate, sodium phenolate, and potassium methylate; hydroxides of tetraalkylammonium such as tetramethylammonium, tetraethylammonium, and tetrabutylammonium; organic weak acid salts such as acetates, octylates, myristates, and benzoates of these; and alkali metal salts of alkylcarboxylic acids such as acetate, caproic acid, octylate, and myristic acid. The blocking catalysts may be used alone or in combination of two or more.

Commercially available blocked polyisocyanates may be used. Examples of commercially available blocked polyisocyanates include Duranate MF-K60B, Duranate SBB-70P, Duranate SBN-70D, Duranate MF-B60B, Duranate 17B-60P, Duranate TPA-B80E, and Duranate E402-B80B (all trade names, manufactured by Asahi Kasei Corporation).

The component (I) is preferably a blocked polyisocyanate in which the isocyanate groups are blocked with a thermally dissociable blocking agent.
The component (I) may be used alone or in combination of two or more. For example, the component (I) may be a mixture of an aliphatic diisocyanate and an aromatic diisocyanate. The aliphatic diisocyanate is preferably hydrogenated xylene diisocyanate. The aromatic diisocyanate is preferably 4,4-diphenylmethane diisocyanate.

<Polyol: component (O)>
Polyol (component (O)) is a compound having two or more hydroxy groups (-OH). There are no particular limitations on the polyol, and any polyol that is generally used in the production of urethane resins can be used without particular limitations. Examples of component (O) include polyols containing a polymerizable carbon-carbon unsaturated bond (hereinafter also referred to as "component (O1)") and other polyols (hereinafter also referred to as "component (O2)").

Polyol containing a polymerizable carbon-carbon unsaturated bond (component (O1))
The component (O1) may be a polyol containing at least one selected from the group consisting of a methacryloyl group and an acryloyl group. The component (O1) may have one polymerizable carbon-carbon unsaturated bond or two or more polymerizable carbon-carbon unsaturated bonds.

Examples of the (O1) component include esters of trivalent or higher polyols and methacrylic acid, acrylic acid, or derivatives thereof. The trivalent or higher polyol is preferably a trivalent or higher low molecular weight polyol. Examples of the trivalent or higher low molecular weight polyols include trivalent alcohols such as glycerin and trimethylolpropane; tetravalent alcohols such as tetramethylolmethane (pentaerythritol) and diglycerin; pentavalent alcohols such as xylitol; hexavalent alcohols such as sorbitol, mannitol, allitol, iditol, dulcitol, altritol, inositol, and dipentaerythritol; heptavalent alcohols such as perseitol; and octavalent alcohols such as sucrose.

Specific examples of the component (O1) include glycerin mono(meth)acrylate, diglycerin tri(meth)acrylate, pentaerythritol mono(meth)acrylate, pentaerythritol di(meth)acrylate, diglycerin di(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, sorbitol mono(meth)acrylate, sorbitol di(meth)acrylate, sorbitol tri(meth)acrylate, and sorbitol tetra(meth)acrylate.
The term "(meth)acrylate" is a concept encompassing methacrylate and acrylate, and means either methacrylate or acrylate.

The component (O1) may be used alone or in combination of two or more types.
Of these, the component (O1) is preferably a diol containing a methacryloyl group or an acryloyl group, and more preferably glycerin mono(meth)acrylate or pentaerythritol di(meth)acrylate.

Other polyols (component (O2))
The (O2) component is a polyol other than the above (O1) component. The (O2) component is not particularly limited, and may be an aliphatic polyol or an aromatic polyol. The (O2) component may be a low molecular weight polyol (e.g., molecular weight less than 500) or a high molecular weight polyol (e.g., molecular weight 500 or more).

Examples of low molecular weight polyols include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butylene glycol, 1,3-butylene glycol, 1,2-butylene glycol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, alkanediols having 7 to 22 carbon atoms, diethylene glycol, triethylene glycol, dipropylene glycol, 3-methyl-1,5-pentanediol, 2-ethyl-2-butyl-1,3-propanediol, alkane-1,2-diols having 17 to 20 carbon atoms, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 1 dihydric alcohols such as 1,4-cyclohexanediol, hydrogenated bisphenol A, 1,4-dihydroxy-2-butene, 2,6-dimethyl-1-octene-3,8-diol, and bisphenol A; trihydric alcohols such as glycerin and trimethylolpropane; tetrahydric alcohols such as tetramethylolmethane (pentaerythritol) and diglycerin; pentahydric alcohols such as xylitol; hexahydric alcohols such as sorbitol, mannitol, allitol, iditol, dulcitol, altritol, inositol, and dipentaerythritol; heptahydric alcohols such as perseitol; and octahydric alcohols such as sucrose.
Among these, the low molecular weight polyol is preferably a dihydric alcohol (diol).

Examples of polymer polyols include phenol resins, resins containing a hydroxystyrene skeleton, polyester polyols, polyether polyols, polyether ester polyols, polyester amide polyols, acrylic polyols, polycarbonate polyols, polyhydroxyl alkanes, polyurethane polyols, and vegetable oil-based polyols. The number average molecular weight of the polymer polyol is preferably 500 to 100,000.

When a low molecular weight polyol is used as the (O2) component, the ratio of the low molecular weight polyol to the (O1) component (low molecular weight polyol/(O1) component (mass ratio)) is preferably 0.01 to 0.1, and more preferably 0.03 to 0.08.

[Phenol resin]
The phenolic resin may be a novolac type phenolic resin or a resol type phenolic resin. The novolac type phenolic resin can be obtained by addition condensation of an aromatic compound having a phenolic hydroxyl group (hereinafter referred to as "phenols") and an aldehyde under an acid catalyst. The resol type phenolic resin can be obtained by addition condensation of a phenol and an aldehyde under an alkali catalyst.

Examples of the phenols include phenol; cresols such as m-cresol, p-cresol, and o-cresol; xylenols such as 2,3-xylenol, 2,5-xylenol, 3,5-xylenol, and 3,4-xylenol; alkylphenols such as m-ethylphenol, p-ethylphenol, o-ethylphenol, 2,3,5-trimethylphenol, 2,3,5-triethylphenol, 4-tert-butylphenol, 3-tert-butylphenol, 2-tert-butylphenol, 2-tert-butyl-4-methylphenol, and 2-tert-butyl-5-methylphenol; p-methoxyphenol, m-methoxyphenol, p-ethoxyphenol, and m-ethoxyphenol. alkoxyphenols such as phenol, p-propoxyphenol, and m-propoxyphenol; isopropenylphenols such as o-isopropenylphenol, p-isopropenylphenol, 2-methyl-4-isopropenylphenol, and 2-ethyl-4-isopropenylphenol; arylphenols such as phenylphenol; and polyhydroxyphenols such as 4,4'-dihydroxybiphenyl, bisphenol A, resorcinol, hydroquinone, pyrogallol, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, and 1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane.

Examples of the aldehydes include formaldehyde, paraformaldehyde, trioxane, furfural, benzaldehyde, terephthalaldehyde, phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, cinnamaldehyde, 4-isopropylbenzaldehyde, 4-isobutylbenzaldehyde, and 4-phenylbenzaldehyde.

The acid catalyst used in the addition condensation reaction is not particularly limited, and examples of the catalyst that can be used include hydrochloric acid, nitric acid, sulfuric acid, formic acid, oxalic acid, and acetic acid. The alkali catalyst used in the addition condensation reaction is not particularly limited, and examples of the catalyst that can be used include sodium hydroxide, lithium hydroxide, potassium hydroxide, aqueous ammonia, triethylamine, sodium carbonate, and hexamethylenetetramine.

[Resin containing a hydroxystyrene skeleton]
The resin containing a hydroxystyrene skeleton is not particularly limited as long as it has a structural unit derived from hydroxystyrene or a hydroxystyrene derivative. Specific examples of the structural unit derived from hydroxystyrene or a hydroxystyrene derivative include a structural unit represented by the following general formula (a10-1).

［式中、Ｒは、水素原子、炭素数１～５のアルキル基又は炭素数１～５のハロゲン化アルキル基である。Ｙａ^ｘ１は、単結合又は２価の連結基である。Ｗａ^ｘ１は、（ｎ_ａｘ１＋１）価の芳香族炭化水素基である。ｎ_ａｘ１は、１～３の整数である。］

[In the formula, R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Ya ^x1 is a single bond or a divalent linking group. Wa ^x1 is an aromatic hydrocarbon group having a valence of (n _ax1 +1). n _ax1 is an integer of 1 to 3.]

In the above formula (a10-1), R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms.
The alkyl group having 1 to 5 carbon atoms for R is preferably a linear or branched alkyl group having 1 to 5 carbon atoms, and specific examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, a pentyl group, an isopentyl group, and a neopentyl group. The halogenated alkyl group having 1 to 5 carbon atoms for R is a group in which some or all of the hydrogen atoms of the alkyl group having 1 to 5 carbon atoms are substituted with halogen atoms. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is particularly preferred.
R is preferably a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a fluorinated alkyl group having 1 to 5 carbon atoms, and from the viewpoint of industrial availability, a hydrogen atom or a methyl group is most preferred.

In the above formula (a10-1), Ya ^x1 represents a single bond or a divalent linking group.
Preferred examples of the divalent linking group for Ya ^x1 include a divalent hydrocarbon group which may have a substituent, and a divalent linking group containing a hetero atom.

Optionally substituted divalent hydrocarbon groups:
When Ya ^x1 is a divalent hydrocarbon group which may have a substituent, the hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group.

Aliphatic Hydrocarbon Group in Ya ^x1 The aliphatic hydrocarbon group means a hydrocarbon group having no aromaticity. The aliphatic hydrocarbon group may be saturated or unsaturated, and is usually preferably saturated.
Examples of the aliphatic hydrocarbon group include linear or branched aliphatic hydrocarbon groups, and aliphatic hydrocarbon groups containing a ring in the structure.

...Straight-chain or branched-chain aliphatic hydrocarbon group The straight-chain aliphatic hydrocarbon group preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, even more preferably 1 to 4 carbon atoms, and most preferably 1 to 3 carbon atoms.
As the straight-chain aliphatic hydrocarbon group, a straight-chain alkylene group is preferable, and specific examples thereof include a methylene group [-CH ₂ -], an ethylene group [-(CH ₂ ) ₂ -], a trimethylene group [-(CH ₂ ) ₃ -], a tetramethylene group [-(CH ₂ ) ₄ -], a pentamethylene group [-(CH ₂ ) ₅ -], etc.
The branched aliphatic hydrocarbon group preferably has 2 to 10 carbon atoms, more preferably has 3 to 6 carbon atoms, even more preferably has 3 or 4 carbon atoms, and most preferably has 3 carbon atoms.
As the branched aliphatic hydrocarbon group, a branched alkylene group is preferable, and specific examples thereof _include alkylmethylene groups such as -CH( _CH3 )-, -CH( _CH2CH3 )-, -C( _{CH3 ) 2- , -C(CH3)(CH2CH3)-, -C(CH3)(CH2CH2CH3)-, and -C(CH2CH3 ) 2- ; alkylethylene groups such as -CH} ( _{CH3 ) CH2- ,} -CH( _CH3 )CH _{( CH3} ) _- , -C( _CH3 ) _2CH2- , -CH _{( CH2CH3} ) _{CH2- ,} and -C( _CH2CH3 ) _{2 - CH2-} ; alkyltrimethylene groups such as _-CH ( _CH3 ) _{CH2CH2CH2- , -CH2CH(CH3 )} CH2CH2- _, etc.; and alkylalkylene groups such as alkyltetramethylene groups such as -CH( _CH3 )CH2CH2CH2-, _-CH2CH( CH3) _CH2CH2- , etc. The alkyl group in the alkylalkylene group is preferably a linear alkyl group having 1 to 5 carbon atoms.

The linear or branched aliphatic hydrocarbon group may or may not have a substituent. Examples of the substituent include a fluorine atom, a fluorinated alkyl group having 1 to 5 carbon atoms and substituted with a fluorine atom, and a carbonyl group.

... Aliphatic hydrocarbon groups containing a ring in the structure Examples of the aliphatic hydrocarbon groups containing a ring in the structure include cyclic aliphatic hydrocarbon groups (groups obtained by removing two hydrogen atoms from an aliphatic hydrocarbon ring) which may contain a substituent containing a heteroatom in the ring structure, groups in which the cyclic aliphatic hydrocarbon group is bonded to the end of a linear or branched aliphatic hydrocarbon group, groups in which the cyclic aliphatic hydrocarbon group is interposed in the middle of a linear or branched aliphatic hydrocarbon group, etc. Examples of the linear or branched aliphatic hydrocarbon group include the same as those described above.
The cyclic aliphatic hydrocarbon group preferably has 3 to 20 carbon atoms, and more preferably has 3 to 12 carbon atoms.
The cyclic aliphatic hydrocarbon group may be a polycyclic group or a monocyclic group. The monocyclic alicyclic hydrocarbon group is preferably a group in which two hydrogen atoms have been removed from a monocycloalkane. The monocycloalkane preferably has 3 to 6 carbon atoms, and specific examples thereof include cyclopentane and cyclohexane. The polycyclic alicyclic hydrocarbon group is preferably a group in which two hydrogen atoms have been removed from a polycycloalkane, and the polycycloalkane preferably has 7 to 12 carbon atoms, and specific examples thereof include adamantane, norbornane, isobornane, tricyclodecane, and tetracyclododecane.

The cyclic aliphatic hydrocarbon group may or may not have a substituent, such as an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a hydroxyl group, or a carbonyl group.
The alkyl group as the substituent is preferably an alkyl group having 1 to 5 carbon atoms, and most preferably a methyl group, an ethyl group, a propyl group, an n-butyl group, or a tert-butyl group.
The alkoxy group as the substituent is preferably an alkoxy group having 1 to 5 carbon atoms, more preferably a methoxy group, an ethoxy group, an n-propoxy group, an iso-propoxy group, an n-butoxy group, or a tert-butoxy group, and most preferably a methoxy group or an ethoxy group.
Examples of the halogen atom as the substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, with a fluorine atom being preferred.
Examples of the halogenated alkyl group as the substituent include groups in which some or all of the hydrogen atoms of the alkyl group are substituted with the halogen atoms.
In the cyclic aliphatic hydrocarbon group, some of the carbon atoms constituting the ring structure may be substituted with a substituent containing a hetero atom. Preferred examples of the substituent containing a hetero atom include -O-, -C(=O)-O-, -S-, -S(=O) ₂ - and -S(=O) ₂ -O-.

Aromatic Hydrocarbon Group in Ya ^x1 The aromatic hydrocarbon group is a hydrocarbon group having at least one aromatic ring.
The aromatic ring is not particularly limited as long as it is a cyclic conjugated system having 4n+2 π electrons, and may be monocyclic or polycyclic. The number of carbon atoms in the aromatic ring is preferably 5 to 30, more preferably 5 to 20, even more preferably 6 to 15, and particularly preferably 6 to 12. However, the number of carbon atoms does not include the number of carbon atoms in the substituent. Specific examples of the aromatic ring include aromatic hydrocarbon rings such as benzene, naphthalene, anthracene, and phenanthrene; and aromatic heterocycles in which a part of the carbon atoms constituting the aromatic hydrocarbon ring is substituted with a heteroatom. Examples of the heteroatom in the aromatic heterocycle include an oxygen atom, a sulfur atom, and a nitrogen atom. Specific examples of the aromatic heterocycle include a pyridine ring and a thiophene ring.
Specific examples of the aromatic hydrocarbon group include a group in which two hydrogen atoms have been removed from the aromatic hydrocarbon ring or aromatic heterocycle (arylene group or heteroarylene group); a group in which two hydrogen atoms have been removed from an aromatic compound containing two or more aromatic rings (e.g., biphenyl, fluorene, etc.); a group in which one hydrogen atom of a group in which one hydrogen atom has been removed from the aromatic hydrocarbon ring or aromatic heterocycle (aryl group or heteroaryl group) has been substituted with an alkylene group (e.g., a group in which one hydrogen atom has been further removed from the aryl group in an arylalkyl group such as a benzyl group, a phenethyl group, a 1-naphthylmethyl group, a 2-naphthylmethyl group, a 1-naphthylethyl group, or a 2-naphthylethyl group). The number of carbon atoms in the alkylene group bonded to the aryl group or heteroaryl group is preferably 1 to 4, more preferably 1 to 2, and particularly preferably 1.

The aromatic hydrocarbon group may have a hydrogen atom substituted with a substituent. For example, a hydrogen atom bonded to an aromatic ring in the aromatic hydrocarbon group may be substituted with a substituent. Examples of the substituent include an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, and a hydroxyl group.
The alkyl group as the substituent is preferably an alkyl group having 1 to 5 carbon atoms, and most preferably a methyl group, an ethyl group, a propyl group, an n-butyl group, or a tert-butyl group.
Examples of the alkoxy group, halogen atom and halogenated alkyl group as the substituent include those exemplified as the substituent substituting a hydrogen atom of the cyclic aliphatic hydrocarbon group.

Divalent linking groups containing heteroatoms:
When Ya ^x1 is a divalent linking group containing a hetero atom, preferred examples of the linking group include -O-, -C(=O)-O-, -C(=O)-, -O-C(=O)-O-, -C(=O)-NH-, -NH-, -NH-C(=NH)- (H may be substituted by a substituent such as an alkyl group or an acyl group), -S-, -S(=O) ₂ -, -S(=O) ₂ -O-, the general formula -Y ²¹ -O-Y ²² -, -Y ²¹ -O-, -Y ²¹ -C(=O)-O-Y ²¹ -, -[Y ²¹ -C(=O)-O] _{m "} -Y ²² -, -Y ²¹ -O-C(=O)-Y ²² -, or -Y ²¹ Examples of the alkyl group include a group represented by -S(=O) ₂ -O-Y ²² - (wherein Y ²¹ and Y ²² each independently represent a divalent hydrocarbon group which may have a substituent, O represents an oxygen atom, and m" represents an integer of 0 to 3).
When the divalent linking group containing a hetero atom is -C(=O)-NH-, -C(=O)-NH-C(=O)-, -NH-, or -NH-C(=NH)-, the H may be substituted with a substituent such as an alkyl group, acyl, etc. The substituent (alkyl group, acyl group, etc.) preferably has 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms, and particularly preferably 1 to 5 carbon atoms.
In the general formula -Y ²¹ -O-Y ²² -, -Y ²¹ -O-, -Y ²¹ -C(═O)-O-, -C(═O)-O-Y ²¹ -, -[Y ²¹ -C(═O)-O] _m" -Y ²² -, -Y ²¹ -O-C(═O)-Y ²² - or -Y ²¹ -S(═O) ₂ -O-Y ²² -, Y ²¹ and Y ²² each independently represent a divalent hydrocarbon group which may have a substituent. Examples of the divalent hydrocarbon group include the same as those (divalent hydrocarbon group which may have a substituent) listed above in the description of the divalent linking group.
Y ²¹ is preferably a linear aliphatic hydrocarbon group, more preferably a linear alkylene group, still more preferably a linear alkylene group having 1 to 5 carbon atoms, and particularly preferably a methylene group or ethylene group.
Y ²² is preferably a linear or branched aliphatic hydrocarbon group, more preferably a methylene group, an ethylene group or an alkylmethylene group. The alkyl group in the alkylmethylene group is preferably a linear alkyl group having 1 to 5 carbon atoms, more preferably a linear alkyl group having 1 to 3 carbon atoms, and most preferably a methyl group.
In the group represented by the formula -[Y ²¹ -C(═O)-O] _m" -Y ²² -, m" is an integer of 0 to 3, preferably an integer of 0 to 2, more preferably 0 or 1, and particularly preferably 1. That is, as the group represented by the formula -[Y ²¹ -C(═O)-O] _m" -Y ²² -, a group represented by the formula -Y ²¹ -C(═O)-O-Y ²² - is particularly preferred. Of these, a group represented by the formula -(CH ₂ ) _a' -C(═O)-O-(CH ₂ ) _b' - is preferred. In the formula, a' is an integer of 1 to 10, preferably an integer of 1 to 8, more preferably an integer of 1 to 5, even more preferably 1 or 2, and most preferably 1. b' is an integer of 1 to 10, preferably an integer of 1 to 8, more preferably an integer of 1 to 5, even more preferably 1 or 2, and most preferably 1.

Ya ^x1 is preferably a single bond, an ester bond [—C(═O)—O—], an ether bond (—O—), —C(═O)—NH—, a linear or branched alkylene group, or a combination thereof, and among these, a single bond is particularly more preferable.

In the above formula (a10-1), Wa ^x1 is an aromatic hydrocarbon group having a valence of (n _ax1 +1).
The aromatic hydrocarbon group in Wa ^x1 may be a group in which (n _ax1 +1) hydrogen atoms have been removed from an aromatic ring. The aromatic ring here is not particularly limited as long as it is a cyclic conjugated system having 4n+2 π electrons, and may be monocyclic or polycyclic. The aromatic ring preferably has 5 to 30 carbon atoms, more preferably 5 to 20 carbon atoms, even more preferably 6 to 15 carbon atoms, and particularly preferably 6 to 12 carbon atoms. Specific examples of the aromatic ring include aromatic hydrocarbon rings such as benzene, naphthalene, anthracene, and phenanthrene; and aromatic heterocycles in which a part of the carbon atoms constituting the aromatic hydrocarbon ring is substituted with a heteroatom. Examples of the heteroatom in the aromatic heterocycle include an oxygen atom, a sulfur atom, and a nitrogen atom. Specific examples of the aromatic heterocycle include a pyridine ring and a thiophene ring.

In the above formula (a10-1), n _ax1 represents an integer of 1 to 3, preferably 1 or 2, and more preferably 1.

Specific examples of the structural unit represented by general formula (a10-1) are shown below.
In the following formula, R ^α represents a hydrogen atom, a methyl group, or a trifluoromethyl group.

The resin containing a hydroxystyrene skeleton is preferably a polymer of hydroxystyrene or a hydroxystyrene derivative, and more preferably a polymer of hydroxystyrene (polyhydroxystyrene).

[Polycarbonate polyol]
Examples of polycarbonate polyols include polycarbonate polyols obtained by reacting one or more glycols such as ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,9-nonanediol, 1,8-nonanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, bisphenol A, or hydrogenated bisphenol A with dimethyl carbonate, diphenyl carbonate, ethylene carbonate, phosgene, or the like.

Among them, the polycarbonate polyol is preferably a polycarbonate diol represented by the following general formula (PC-1).

［式中、Ｒｐ^１及びＲｐ^２は、それぞれ独立に、２価の炭化水素基である。ｎｐは、２以上の整数である。］

[In the formula, ^Rp1 and ^Rp2 are each independently a divalent hydrocarbon group. np is an integer of 2 or more.]

In the general formula (PC-1), Rp ¹ and Rp ² are each independently a divalent hydrocarbon group. The divalent hydrocarbon group may be an aromatic hydrocarbon group or an aliphatic hydrocarbon group. Examples of the divalent hydrocarbon group include the same as those exemplified for Ya ^x1 in the general formula (a10-1). The divalent hydrocarbon group in Rp ¹ and Rp ² is preferably an aliphatic hydrocarbon group, more preferably a linear or branched alkylene group. The divalent hydrocarbon group preferably has 1 to 10 carbon atoms, more preferably 3 to 8 carbon atoms, and even more preferably 4 to 6 carbon atoms. Specific examples of Rp ¹ and Rp ² include -(CH ₂ ) ₆ - or -(CH ₂ ) ₅ -.

The weight average molecular weight (Mw) of the polycarbonate polyol is preferably 500 to 5,000, more preferably 500 to 3,000, even more preferably 500 to 2,000, and particularly preferably 500 to 1,000.

When a polycarbonate polyol is used as the (O2) component, the ratio of the polycarbonate polyol to the (O1) component (polycarbonate polyol/(O1) component (mass ratio)) is preferably 0.1 to 5, more preferably 0.3 to 3, and even more preferably 0.4 to 3.

[Other polyols]
Examples of the polyester polyol include polyester polyols obtained by reacting a dibasic acid such as terephthalic acid, isophthalic acid, adipic acid, azelaic acid, or sebacic acid, or a dialkyl ester thereof, or a mixture thereof, with a glycol such as ethylene glycol, propylene glycol, diethylene glycol, butylene glycol, neopentyl glycol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 3,3'-dimethylolheptane, polyoxyethylene glycol, polyoxypropylene glycol, or polytetramethylene ether glycol, or a mixture thereof; and polyester polyols obtained by ring-opening polymerization of lactones such as polycaprolactone, polyvalerolactone, or poly(β-methyl-γ-valerolactone).

Examples of polyether polyols include polyether polyols obtained by polymerizing oxirane compounds such as ethylene oxide, propylene oxide, butylene oxide, and tetrahydrofuran with low molecular weight polyols such as water, ethylene glycol, propylene glycol, trimethylolpropane, and glycerin as an initiator.

Examples of polyether ester polyols include polyether ester polyols obtained by reacting dibasic acids such as terephthalic acid, isophthalic acid, adipic acid, azelaic acid, and sebacic acid, or their dialkyl esters, or mixtures thereof, with the above-mentioned polyether polyols.

Examples of polyesteramide polyols include polyesteramide polyols obtained by using an aliphatic diamine having an amino group, such as ethylenediamine, propylenediamine, or hexamethylenediamine, as a raw material in the above-mentioned esterification reaction.

Examples of acrylic polyols include polyesteramide polyols obtained by copolymerizing hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, etc., which contain one or more hydroxyl groups in one molecule, or the corresponding methacrylic acid derivatives, etc., with, for example, acrylic acid, methacrylic acid, or an ester thereof.

Examples of polyhydroxyalkanes include liquid rubbers obtained by copolymerizing butadiene or butadiene with acrylamide, etc.

Polyurethane polyols are polyols that have one or more urethane bonds in one molecule, and examples of such polyols include polyurethane polyols obtained by reacting polyether polyols, polyester polyols, polyether ester polyols, etc., having a number average molecular weight of 200 to 20,000 with polyisocyanate, preferably at an NCO/OH ratio of less than 1, more preferably 0.9 or less.

Examples of the vegetable oil-based polyol include castor oil, castor oil-modified polyol, dimer acid-modified polyol, soybean oil-modified polyol, etc. Among them, as the vegetable oil-based polyol, castor oil-modified polyol is preferable, and castor oil-modified diol is more preferable.
When a vegetable oil-based polyol is used as the (O2) component, the ratio of the vegetable oil-based polyol to the (O1) component (vegetable oil-based polyol/(O1) component (mass ratio)) is preferably 0.1 to 5, more preferably 0.3 to 3, and even more preferably 0.4 to 2.5.

The component (O2) may be used alone or in combination of two or more types.
Among the above, polycarbonate polyols and low molecular weight polyols are preferred as the (O2) component from the viewpoint of adjusting the viscosity of the adhesive composition and the hardness of the adhesive layer. Also, from the viewpoint of improving the heat resistance of the adhesive layer, castor oil-modified polyols may be used as the (O2) component.

From the viewpoint of adjusting the viscosity of the adhesive composition and the heat resistance of the adhesive layer, the (O) component is preferably a combination of the (O1) component and the (O2) component. The (O2) component is preferably a low molecular weight polyol, a polycarbonate polyol, a castor oil-modified polyol, or a combination thereof. Specific examples of the (O2) component to be combined with the (O1) component include a combination of a polycarbonate polyol, a castor oil-modified polyol, and a low molecular weight polyol; a combination of a polycarbonate polyol and a castor oil-modified polyol; and a polycarbonate polyol.
The mass ratio of the (O1) component to the (O2) component is preferably (O1):(O2)=1:5 to 5:1, more preferably 1:4 to 2:1, even more preferably 1:4 to 1:1, and particularly preferably 1:4 to 1:2. By setting the mass ratio of the (O1) component to the (O2) component within the above range, the elastic modulus, heat resistance, etc. of the adhesive layer can be improved.

The (P1) component can be synthesized by mixing the (I) and (O) components and copolymerizing them according to a known method for synthesizing urethane resins. The copolymerization of the (I) and (O) components is preferably carried out in the presence of a known urethane catalyst such as a bismuth catalyst. In addition, a polymerization inhibitor may be added to the reaction system to prevent polymerization of the polymerizable carbon-carbon unsaturated bonds in the (O1) component.

The ratio (mass ratio) of the (I) component and the (O) component used in the synthesis of the (P1) component is, for example, preferably (I):(O) = 10:90 to 60:40, more preferably 20:80 to 50:50, and even more preferably 25:75 to 45:55. The molar ratio (NCO/OH) of the hydroxyl groups (-OH) in the (O) component to the isocyanate groups (-NCO) in the (I) component is preferably 60:40 to 40:60, and more preferably 55:45 to 45:55.

The component (P1) may be used alone or in combination of two or more types.
The content of the (P1) component in the adhesive composition of this embodiment is not particularly limited as long as it is a concentration that allows application to a support, etc. The content of the (P1) component in the adhesive composition is preferably 10 to 60 mass%, more preferably 20 to 60 mass%, and even more preferably 30 to 60 mass%, relative to the total amount (100 mass%) of the adhesive composition.

<Polymerization initiator: component (A)>
The adhesive composition of the present embodiment contains a polymerization initiator (hereinafter also referred to as component (A)). The polymerization initiator refers to a component that has a function of promoting a polymerization reaction. Examples of component (A) include a thermal polymerization initiator and a photopolymerization initiator.

Examples of thermal polymerization initiators include peroxides and azo-based polymerization initiators.

Examples of peroxides in thermal polymerization initiators include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, and peroxy esters. Specific examples of such peroxides include acetyl peroxide, dicumyl peroxide, tert-butyl peroxide, t-butylcumyl peroxide, propionyl peroxide, benzoyl peroxide (BPO), 2-chlorobenzoyl peroxide, 3-chlorobenzoyl peroxide, 4-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, 4-bromomethylbenzoyl peroxide, lauroyl peroxide, potassium persulfate, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2-methylpropyl-1-hydroperoxide, tert-butyl pertriphenylacetate, tert-butyl hydroperoxide, tert-butyl performate, tert-butyl peracetate, tert-butyl perbenzoate, tert-butyl perphenylacetate, tert-butyl per-4-methoxyacetate, and tert-butyl per-N-(3-toluyl)carbamate.

The peroxide may be, for example, commercially available products manufactured by NOF Corporation under the trade names "Percumyl (registered trademark)", "Perbutyl (registered trademark)", "Peroyl (registered trademark)" and "Perocta (registered trademark)".

Examples of azo-based polymerization initiators in thermal polymerization initiators include 2,2'-azobispropane, 2,2'-dichloro-2,2'-azobispropane, 1,1'-azo(methylethyl)diacetate, 2,2'-azobis(2-amidinopropane) hydrochloride, 2,2'-azobis(2-aminopropane) nitrate, 2,2'-azobisisobutane, 2,2'-azobisisobutylamide, 2,2'-azobisisobutyronitrile, and 2,2'-azobis-2-methylpropionic acid methyl ester. ethyl, 2,2'-dichloro-2,2'-azobisbutane, 2,2'-azobis-2-methylbutyronitrile, 2,2'-azobisisobutyric acid dimethyl, 1,1'-azobis(1-methylbutyronitrile-3-sodium sulfonate), 2-(4-methylphenylazo)-2-methylmalonodinitrile, 4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethylphenylazo-2-allylmalonodinitrile, 2,2'-azobis-2-methylvaleronitrile, 4, 4'-Azobis-4-cyano dimethyl valerate, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobiscyclohexanenitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobiscyclohexanenitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobis-1-chlorophenylethane, 1,1'-azobis-1-cyclohexanecarbonitrile, 1,1'-azobis-1-cycloheptanenitrile , 1,1'-azobis-1-phenylethane, 1,1'-azobiscumene, 4-nitrophenylazobenzyl cyanoethyl acetate, phenylazodiphenylmethane, phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis-1,2-diphenylethane, poly(bisphenol A-4,4'-azobis-4-cyanopentanoate), poly(tetraethylene glycol-2,2'-azobisisobutyrate), etc.

Examples of photopolymerization initiators include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, bis(4-dimethylaminophenyl)ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyloxime), 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 4-benzoyl-4'-methyldimethylsulfide, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 4-dimethylamino-2-ethylhexylbenzoic acid, 4-dimethylamino-2-isoamylbenzoic acid, benzyl-β-methoxyethane Chil acetal, benzyl dimethyl ketal, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, o-benzoyl methyl benzoate, 2,4-diethyl thioxanthone, 2-chloro thioxanthone, 2,4-dimethyl thioxanthone, 1-chloro-4-propoxy thioxanthone, thioxanthene, 2-chloro thioxanthene, 2,4-diethyl thioxanthene, 2-methyl thioxanthene, 2-isopropyl thioxanthene, 2-ethyl anthraquinone, octamethyl anthraquinone, 1,2-benzanthraquinone, 2,3-diphenyl anthraquinone, azobisisobutyronitrile, benzo peroxide, cumene peroxide, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4,5-triarylimidazole dimer, benzophenone, 2-chlorobenzophenone , 4,4'-bisdimethylaminobenzophenone (i.e. Michler's ketone), 4,4'-bisdiethylaminobenzophenone (i.e. ethyl Michler's ketone), 4,4'-dichlorobenzophenone, 3,3-dimethyl-4-methoxybenzophenone, benzil, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzoin t-butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, acetophenone, trichloroacetophenone, p-t-butylacetophenone, p-dimethylaminoacetophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, α,α-dichloro-4-phenoxyacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzosuberone, pentyl-4-dimethylaminobenzoate, 9-phenylacridine, 1,7-bis-(9-acridinyl)heptane, 1,5-bis-(9-acridinyl)pentane, 1,3-bis-(9-acridinyl)propane, p-methoxytriazine, 2,4,6-tris(trichloro methyl)-s-triazine, 2-methyl-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(5-methylfuran-2-yl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(furan-2-yl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(4-diethylamino-2-methylphenyl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(3,4-dimethoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine triazine, 2-(4-ethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-n-butoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis-trichloromethyl-6-(3-bromo-4-methoxy)phenyl-s-triazine, 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)phenyl-s-triazine, 2,4-bis-trichloromethyl-6-(3-bromo-4-methoxy)styrylphenyl-s-triazine, 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)styrylphenyl-s-triazine, and the like.

The photopolymerization initiator may be, for example, commercially available products such as "IRGACURE OXE02", "IRGACURE OXE01", "IRGACURE 369", "IRGACURE 651", and "IRGACURE 907" (all product names, manufactured by BASF Corporation) and "NCI-831" (product name, manufactured by ADEKA Corporation).

One type of (A) component may be used alone, or two or more types may be used in combination. As the (A) component, a thermal polymerization initiator is preferred, and a peroxide is more preferred. The amount of the (A) component used can be adjusted according to the amount of the (P1) component used. The content of the polymerization initiator in the adhesive composition is preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the (P1) component.

<Optional ingredients>
In addition to the above components, the adhesive composition of the present embodiment may contain optional components within a range that does not impair the effects of the present invention. The optional components are not particularly limited, but examples thereof include a polymerization inhibitor, a solvent component, a plasticizer, an adhesive auxiliary, a stabilizer, a colorant, a surfactant, etc.

Polymerization inhibitor
A polymerization inhibitor is a component that has the function of preventing radical polymerization reactions caused by heat or light. Polymerization inhibitors are highly reactive to radicals.

As the polymerization inhibitor, one having a phenol skeleton is preferable. For example, a hindered phenol-based antioxidant can be used as the polymerization inhibitor, and examples of such an antioxidant include pyrogallol, benzoquinone, hydroquinone, methylene blue, tert-butylcatechol, monobenzyl ether, methylhydroquinone, amylquinone, amyloxyhydroquinone, n-butylphenol, phenol, hydroquinone monopropyl ether, 4,4'-(1-methylethylidene)bis(2-methylphenol), 4,4'-(1-methylethylidene)bis(2,6- dimethylphenol), 4,4'-[1-[4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl]ethylidene]bisphenol, 4,4',4"-ethylidene tris(2-methylphenol), 4,4',4"-ethylidene trisphenol, 1,1,3-tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane, 2,6-di-tert-butyl-4-methylphenol, 2,2'-methylenebis(4-methyl-6-tert-butylphenol) 4,4'-butylidenebis(3-methyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), 3,9-bis[2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)-propionyloxy)-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro(5,5)undecane, triethylene glycol-bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy nate, n-octyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythryl tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (product name IRGANOX1010, manufactured by BASF), tris(3,5-di-tert-butylhydroxybenzyl)isocyanurate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], etc.

The polymerization inhibitor may be used alone or in combination of two or more kinds.
The content of the polymerization inhibitor may be appropriately determined depending on the type of resin component, the application of the adhesive composition, and the environment in which it is used.

<Surfactants>
The adhesive composition of the present embodiment can be prepared by dissolving the (B), (P1) and (A) components, and, if necessary, any optional components, in a solvent component and mixing them together. As the solvent component, a solvent capable of dissolving each of the above components can be used.

Examples of solvent components include hydrocarbon solvents, petroleum-based solvents, and other solvents other than the above-mentioned solvents. Hereinafter, hydrocarbon solvents and petroleum-based solvents are collectively referred to as "(S1) component." Solvent components other than (S1) component are also referred to as "(S2) component."

Hydrocarbon solvents include linear, branched or cyclic hydrocarbons. Examples of the hydrocarbon solvent include linear hydrocarbons such as hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, and tridecane; branched hydrocarbons such as isooctane, isononane, and isododecane; alicyclic hydrocarbons such as p-menthane, o-menthane, m-menthane, diphenylmenthane, 1,4-terpine, 1,8-terpine, bornane, norbornane, pinane, thujane, carane, longifolene, α-terpinene, β-terpinene, γ-terpinene, α-pinene, β-pinene, α-thujone, β-thujone, cyclohexane, cycloheptane, and cyclooctane; and aromatic hydrocarbons such as toluene, xylene, indene, pentalene, indane, tetrahydroindene, naphthalene, tetrahydronaphthalene (tetralin), and decahydronaphthalene (decalin).

Petroleum-based solvents are solvents that are refined from heavy oil, such as kerosene, paraffin-based solvents, and isoparaffin-based solvents.

Component (S2) includes terpene solvents having an oxygen atom, a carbonyl group, or an acetoxy group as a polar group, such as geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1,4-cineole, 1,8-cineole, borneol, carvone, ionone, thujone, camphor, etc.

Examples of the (S2) component include lactones such as γ-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, and 2-heptanone; polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; compounds having an ester bond such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, and dipropylene glycol monoacetate; and monomethyl ethers, monoethyl ethers, monopropyl ethers, and monobutyl ethers of the above polyhydric alcohols or compounds having an ester bond. Derivatives of polyhydric alcohols such as compounds having an ether bond, such as monoalkyl ethers or monophenyl ethers (among these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferred); cyclic ethers such as dioxane; esters such as methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, and ethyl ethoxypropionate; and aromatic organic solvents such as anisole, ethyl benzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, phenetole, and butyl phenyl ether.

The solvent components may be used alone or in combination of two or more. The solvent components are preferably inactive to the (P1) component. Preferred solvent components include, for example, ester-based solvents, ketone-based solvents, aromatic hydrocarbon-based solvents, PGMEA, PGME, and mixed solvents thereof.

The content of the solvent component in the adhesive composition of this embodiment may be adjusted appropriately depending on the thickness of the adhesive composition layer. The content of the solvent component is preferably, for example, within the range of 40 to 90 mass% relative to the total amount (100 mass%) of the adhesive composition. In other words, the adhesive composition of this embodiment preferably has a solids concentration (total amount of blended components excluding the solvent component) within the range of 10 to 80 mass%. When the content of the solvent component is within the above-mentioned preferred range, viscosity adjustment becomes easy.

When a polymerization initiator is used, the polymerization initiator can be blended by a known method immediately before using the adhesive composition. The polymerization initiator or polymerization inhibitor may be blended in the form of a solution in which it is dissolved in advance in the above-mentioned (S2) component. The amount of the (S2) component used can be adjusted appropriately depending on the type of polymerization initiator or polymerization inhibitor, and is preferably 1 to 50 parts by mass, and more preferably 5 to 30 parts by mass, per 100 parts by mass of the (S1) component. If the amount of the (S2) component used is within the above-mentioned preferred range, the polymerization initiator or polymerization inhibitor can be sufficiently dissolved.

According to the adhesive composition of the present embodiment, when a semiconductor substrate or the like is temporarily bonded to a support, an adhesive composition layer is formed between the semiconductor substrate or the like and the support, and then cured. This forms an adhesive layer that temporarily bonds the semiconductor substrate or the like to the support. Since the adhesive layer is cured by a crosslinked structure, it has high heat resistance and does not decrease in elasticity even at high temperatures (e.g., 200°C or higher). Therefore, even if a high-temperature process is performed during processing of a semiconductor substrate or an electronic device, defects such as misalignment and sinking are unlikely to occur.
On the other hand, when the adhesive layer is irradiated with light such as laser light, the component (B) in the adhesive layer absorbs the light and the adhesive layer is altered. This reduces the adhesive strength of the adhesive layer, allowing the semiconductor substrate or the like to be separated from the support. Therefore, there is no need to provide a separation layer.
Furthermore, since the adhesive layer contains a urethane resin, the adhesive layer can be decomposed by decomposing the urethane bond with an acid or alkali, and therefore, even if residues of the adhesive layer adhere to the semiconductor substrate or the like separated from the support, the residues of the adhesive layer can be easily removed by washing with an acid or alkali.

(Laminate)
The laminate according to the second aspect of the present invention is a laminate in which a light-transmitting support, an adhesive layer, and a semiconductor substrate or an electronic device are laminated in this order, and is characterized in that the adhesive layer is a cured product of the adhesive composition according to the first aspect.

FIG. 1 shows one embodiment of a laminate according to the second aspect.
1 includes a light-transmitting support 1, an adhesive layer 3, and a semiconductor substrate 4. In the stack 100, the support 1, the adhesive layer 3, and the semiconductor substrate 4 are stacked in this order.

FIG. 2 shows another embodiment of the laminate according to the second aspect.
The laminate 200 shown in FIG. 2 has the same configuration as the laminate 100 , except that an electronic device 456 consisting of a semiconductor substrate 4 , a sealing material layer 5 and a wiring layer 6 is laminated on an adhesive layer 3 .

FIG. 3 shows yet another embodiment of the laminate according to the second aspect.
The laminate 300 shown in FIG. 3 has the same configuration as the laminate 100 , except that the electronic device is made of a wiring layer 6 .

FIG. 4 shows yet another embodiment of the laminate according to the second aspect.
The laminate 400 shown in FIG. 4 has the same configuration as the laminate 100 , except that an electronic device 645 consisting of a wiring layer 6 , a semiconductor substrate 4 and a sealing material layer 5 is laminated on an adhesive layer 3 .

<Support>
The support is a member that supports a semiconductor substrate or an electronic device. The support has a property of transmitting light. The support is attached to the semiconductor substrate or the electronic device via an adhesive layer. Therefore, the support preferably has a strength required to prevent damage or deformation of the semiconductor substrate during thinning of the device, transportation of the semiconductor substrate, mounting on the semiconductor substrate, etc.
Examples of the material of the support include glass, silicon, acrylic resin, etc. Examples of the shape of the support include, but are not limited to, a rectangle, a circle, etc. As the support, a circular support with a larger size or a large panel with a square shape in a plan view can be used in order to achieve higher density integration and improve production efficiency.

<Adhesive Layer>
The adhesive layer is provided to temporarily adhere a semiconductor substrate or an electronic device to a support. The adhesive layer is a cured product of the adhesive composition according to the first embodiment. The adhesive composition according to the first embodiment can be cured by heating the adhesive composition. The thickness of the adhesive layer is preferably, for example, in the range of 1 μm or more and 200 μm or less, and more preferably in the range of 5 μm or more and 150 μm or less.

As described above, the adhesive layer is a cured product of the adhesive composition, and the material (cured product) constituting this adhesive layer preferably satisfies the following properties.
That is, when the complex modulus of the cured body is measured under the following conditions, the complex modulus at 200° C. is preferably 1.0×10 ⁴ Pa or more, more preferably 5.0×10 ⁴ Pa or more, and even more preferably 1.0×10 ⁵ Pa or more. Furthermore, the complex modulus at 200° C. is more preferably 1.0×10 ⁶ Pa or more, even more preferably 5.0×10 ⁶ Pa or more, and particularly preferably 1.0×10 ⁷ Pa or more. The upper limit of the complex modulus at 200° C. is, for example, 1.0×10 ¹⁰ Pa or less.
Furthermore, when the complex modulus of elasticity of the cured body is measured under the following conditions, the complex modulus at 250° C. is preferably 5.0×10 ⁶ Pa or more, and more preferably 1.0×10 ⁷ Pa or more. The upper limit of the complex modulus at 250° C. is, for example, 1.0×10 ¹⁰ Pa or less.

The complex modulus of elasticity of the cured body can be measured using a dynamic viscoelasticity measuring device Rheogel-E4000 (manufactured by UBM Co., Ltd.). Specifically, the adhesive composition is applied to a PET film with a release agent, and heated in an oven in a nitrogen atmosphere at 180°C for 1 hour to form a test piece with a thickness of 50 μm. The test piece (size 5 mm x 40 mm, thickness 50 μm) is then peeled off from the PET film and measured using the measuring device described above. The measurement conditions are a tensile condition with a frequency of 1 Hz, and a temperature rise rate of 5°C/min from the starting temperature of 50°C to 300°C.

<Semiconductor Substrate or Electronic Device>
The semiconductor substrate or electronic device is temporarily attached to the support via an adhesive layer.

<Semiconductor substrate>
The semiconductor substrate is not particularly limited, and examples thereof include those exemplified in the above "(adhesive composition)". The semiconductor substrate may be a semiconductor element or other element, and may have a single-layer or multi-layer structure.

<Electronic Devices>
The electronic device is not particularly limited, and examples thereof include those exemplified in the above "(adhesive composition)". The electronic device is preferably a composite of a member made of a metal or semiconductor and a resin that seals or insulates the member. Specifically, the electronic device may include at least one of an encapsulant layer and a wiring layer, and may further include a semiconductor substrate.
In the laminate 200 shown in Fig. 2, the electronic device 456 is composed of the semiconductor substrate 4, the encapsulant layer 5, and the wiring layer 6. In the laminate 300 shown in Fig. 3, the electronic device 6 is composed of the wiring layer 6. In the laminate 400 shown in Fig. 4, the electronic device 645 is composed of the wiring layer 6, the semiconductor substrate 4, and the encapsulant layer 5.

[Sealing material layer]
The encapsulant layer is provided to encapsulate the semiconductor substrate, and is formed using an encapsulant that can insulate or encapsulate a member made of a metal or a semiconductor.
As the sealing material, for example, a resin composition can be used. The sealing material layer 5 is preferably provided so as to cover the entire semiconductor substrate 4 on the adhesive layer 3, rather than being provided for each individual semiconductor substrate 4. The resin used for the sealing material is not particularly limited as long as it can seal and/or insulate metal or semiconductor, and examples thereof include epoxy resins and silicone resins.
The sealing material may contain other components such as a filler in addition to the resin. Examples of the filler include spherical silica particles.

<Wiring layer>
The wiring layer, also called an RDL (Redistribution Layer), is a thin-film wiring body constituting wiring connected to a substrate, and may have a single-layer or multi-layer structure. The wiring layer may be, but is not limited to, wiring formed by a conductor (e.g., metals such as aluminum, copper, titanium, nickel, gold, and silver, and alloys such as silver-tin alloy) between dielectrics (e.g., silicon oxide ( _SiO x ), photosensitive resins such as photosensitive epoxy, etc.).

In the laminates of Figs. 1 to 4, the support 1 and the adhesive layer 3 are adjacent to each other, but this is not limited thereto, and other layers may be formed between the support 1 and the adhesive layer 3. In this case, the other layers need only be made of a material that transmits light. This allows layers that impart desirable properties to the laminates 100 to 400 to be added as appropriate without preventing the incidence of light into the adhesive layer 3. The wavelengths of light that can be used vary depending on the type of material that constitutes the adhesive layer 3. Therefore, the material that constitutes the other layers does not need to transmit all wavelengths of light, and can be appropriately selected from materials that transmit light of wavelengths that can alter the material that constitutes the adhesive layer 3.

(Laminate manufacturing method (1))
The method for producing a laminate according to the third aspect of the present invention is a method for producing a laminate in which a light-transmitting support, an adhesive layer, and a semiconductor substrate are laminated in this order, and is characterized by comprising a step of applying the adhesive composition according to the first aspect to the support or the semiconductor substrate to form an adhesive composition layer (hereinafter also referred to as an "adhesive composition layer forming step"), a step of placing the semiconductor substrate on the support via the adhesive composition layer (hereinafter also referred to as a "semiconductor substrate placing step"), and a step of curing the adhesive composition layer by a polymerization reaction of the urethane resin to form the adhesive layer (hereinafter also referred to as an "adhesive layer forming step").

5 and 6 are schematic process diagrams illustrating one embodiment of the method for producing a laminate according to the present embodiment.
5(a) and 5(b) are diagrams illustrating the steps of manufacturing a laminate 100' in which a support 1, an adhesive composition layer 3', and a semiconductor substrate 4 are laminated in this order. Fig. 5(a) is a diagram illustrating the adhesive composition layer forming step. Fig. 5(b) is a diagram illustrating the semiconductor substrate placing step.
6 is a diagram illustrating the adhesive layer forming step. The adhesive composition layer 3' in the laminate 100' is thermally cured to form the adhesive layer 3, thereby obtaining the laminate 100.

[Adhesive composition layer forming step]
The method for producing a laminate according to this embodiment includes an adhesive composition layer forming step, which is a step of applying an adhesive composition to a support or a semiconductor substrate to form an adhesive composition layer.
In FIG. 5( a ), an adhesive composition layer 3 ′ is formed on a support 1 using an adhesive composition.

The method for forming the adhesive composition layer 3' on the support 1 is not particularly limited, but examples thereof include spin coating, dipping, roller blade coating, spray coating, slit coating, and the like.
An adhesive composition layer may be formed on the semiconductor substrate 4 in a similar manner.

After the adhesive composition layer is formed, a baking treatment may be performed. The baking temperature conditions are lower than the heating temperature in the adhesive layer formation process described below. The baking conditions may vary depending on the type of curable component contained in the adhesive composition, but examples include a temperature condition of 70 to 100°C for 1 to 10 minutes.

[Semiconductor substrate mounting process]
The method for producing a laminate according to this embodiment includes a semiconductor substrate mounting step. The semiconductor substrate mounting step is a step of mounting a semiconductor substrate on a support via an adhesive composition layer. This allows a laminate 100' to be obtained.
In FIG. 5( c ), a semiconductor substrate 4 is placed on a support 1 via an adhesive composition layer 3 ′ formed on the support 1 .

The method for placing the semiconductor substrate 4 on the support 1 via the adhesive composition layer 3' is not particularly limited, and any method commonly used for placing a semiconductor substrate in a predetermined position can be used.

[Adhesive layer forming process]
The method for producing the laminate according to the present embodiment includes an adhesive layer forming step. The adhesive layer forming step is a step of forming an adhesive layer by curing the adhesive composition layer through a polymerization reaction of the urethane resin (component (P1)) in the adhesive composition layer. This allows the laminate 100 to be obtained.
In FIG. 6, adhesive layer 3 is formed by curing adhesive composition layer 3'.

The polymerization reaction of the (P1) component in the adhesive composition layer can be carried out by selecting an appropriate method depending on the type of polymerizable carbon-carbon double bond contained in the (P1) component. For example, when the (P1) component contains a methacryloyl group or an acryloyl group, the polymerization reaction of the (P1) component can be carried out by heating.

The heating temperature may be, for example, 80 to 350°C, 100 to 300°C, 130 to 300°C, or 150 to 300°C.
The heating time is not particularly limited as long as it is sufficient for the component (P1) to polymerize and harden. The heating time is, for example, preferably 30 to 180 minutes, more preferably 45 to 120 minutes, or even more preferably 60 to 120 minutes. The hardening reaction can be carried out, for example, under a nitrogen atmosphere.

In this process, the (P1) component and the (B) component in the adhesive composition layer 3' are crosslinked and cured, and an adhesive layer 3, which is a cured product of the adhesive composition layer 3', is formed. This temporarily bonds the support 12 and the semiconductor substrate 4. As a result, the laminate 100 can be obtained.

[Optional steps]
The method for producing a laminate according to the present embodiment may include other steps in addition to the steps described above, such as various mechanical or chemical treatments (thinning treatments such as grinding and chemical mechanical polishing (CMP), high-temperature and vacuum treatments such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), treatments using chemicals such as organic solvents, acidic treatment solutions, and basic treatment solutions, plating treatments, irradiation with active light, heating and cooling treatments, etc.).

(Laminate manufacturing method (2))
The method for producing a laminate according to the fourth aspect of the present invention is characterized in that it further comprises an electronic device formation step of forming an electronic device, which is a composite of a member made of a metal or a semiconductor and a resin that seals or insulates the member, after obtaining a laminate by the method for producing a laminate according to the third aspect.

The laminate obtained by the laminate manufacturing method of this embodiment is a laminate in which a support, an adhesive layer, and an electronic device are laminated in this order. The laminate can be obtained by carrying out an electronic device formation process on the laminate obtained by the laminate manufacturing method according to the third aspect.

[Electronic device formation process]
The method for producing a laminate according to the present embodiment includes an electronic device forming step, which is a step for forming an electronic device that is a composite of a member made of a metal or a semiconductor and a resin that seals or insulates the member.
The electronic device forming process may include any one of a sealing process, a grinding process, and a wiring layer forming process. In one embodiment, the electronic device forming process includes a substrate fixing process and a sealing process. In this case, the electronic device forming process may further include a grinding process and a wiring layer forming process.

Regarding the Encapsulating Step The encapsulating step is a step of encapsulating the substrate fixed on the support with a sealing material.
In FIG. 7A, a laminate 110 is obtained in which a semiconductor substrate 4 temporarily adhered to a support 1 via an adhesive layer 3 is entirely sealed with a sealing material layer 5 .

In the sealing process, the sealing material heated to, for example, 130 to 170° C. is supplied onto the adhesive layer 3 while maintaining a high viscosity so as to cover the semiconductor substrate 4, and is compression molded to produce a laminate 110 in which a sealing material layer 5 is provided on the adhesive layer 3.
At that time, the temperature condition is, for example, 130 to 170°C.
The pressure applied to the semiconductor substrate 4 is, for example, 50 to 500 N/cm ² .

It is preferable that the sealing material layer 5 is provided so as to cover the entire semiconductor substrate 4 on the adhesive layer 3, rather than being provided for each individual semiconductor substrate 4.

Grinding Step The grinding step is a step of grinding the encapsulant portion (encapsulant layer 5) in the encapsulated body after the encapsulation step so as to expose a part of the semiconductor substrate.
Grinding of the sealing material portion is performed by grinding the sealing material layer 5 until it has a thickness substantially equal to that of the semiconductor substrate 4, for example, as shown in FIG.

Regarding the Wiring Layer Forming Step The wiring layer forming step is a step of forming a wiring layer on the exposed semiconductor substrate after the grinding step.
7C, the wiring layer 6 is formed on the semiconductor substrate 4 and the encapsulant layer 5. This makes it possible to obtain the stacked body 120. In the stacked body 120, the semiconductor substrate 4, the encapsulant layer 5, and the wiring layer 6 constitute an electronic device 456.

The wiring layer 6 may be formed, for example, by the following method.
First, a dielectric layer made of silicon oxide (SiO _x ), photosensitive resin, or the like is formed on the sealing material layer 5. The dielectric layer made of silicon oxide can be formed by, for example, a sputtering method, a vacuum deposition method, or the like. The dielectric layer made of a photosensitive resin can be formed by applying the photosensitive resin onto the sealing material layer 5 by, for example, a method such as spin coating, dipping, roller blade, spray coating, or slit coating.

Next, wiring is formed on the dielectric layer using a conductor such as a metal. Methods for forming wiring include known semiconductor process techniques such as lithography processes such as photolithography (resist lithography) and etching processes. Examples of such lithography processes include lithography processes using a positive resist material and lithography processes using a negative resist material.

In the method for manufacturing a laminate according to this embodiment, it is further possible to form bumps or mount elements on the wiring layer 6. Mounting elements on the wiring layer 6 can be performed using, for example, a chip mounter.

(Laminate manufacturing method (3))
The manufacturing method of a laminate according to the fifth aspect of the present invention is a manufacturing method of a laminate in which a support, an adhesive layer, and an electronic device are laminated in this order, and is characterized by having a step of applying the adhesive composition according to the first aspect onto the support to form a layer of the adhesive composition (adhesive composition layer forming step), an electronic device forming step of forming, on the adhesive composition layer, an electronic device which is a composite of a member made of a metal or semiconductor and a resin that seals or insulates the member (electronic device forming step), and a step of curing the adhesive composition layer to form an adhesive layer (adhesive layer forming step).

The laminate obtained by the laminate manufacturing method of this embodiment is a laminate in which a support, an adhesive layer, and an electronic device are laminated in this order, similar to the manufacturing method according to the fourth aspect.

In the manufacturing method of this embodiment, the adhesive composition layer forming step can be carried out in the same manner as in the manufacturing method of the laminate according to the third aspect.

In the manufacturing method of this embodiment, the adhesive composition layer forming step is followed by the electronic device forming step. Such an electronic device forming step may include a wiring layer forming step. The electronic device forming step may further include a semiconductor substrate mounting step, a sealing step, a grinding step, and the like. The electronic device forming step may also be a step of mounting a sealed body in which a semiconductor substrate is sealed with a sealing material on a support via an adhesive composition layer.

The adhesive layer formation process can be carried out in the same manner as in the method for producing a laminate according to the third aspect.

After the adhesive layer formation process, an electronic device formation process may be performed as necessary. Such an electronic device formation process may include, for example, a semiconductor substrate placement process, a sealing process, and a grinding process.

According to the manufacturing method of the laminate according to the third to fifth aspects, the support and the semiconductor substrate or electronic device are temporarily bonded via a highly heat-resistant adhesive layer, so that a laminate in which the support, the adhesive layer, and the semiconductor substrate or electronic device are laminated in this order can be stably manufactured. Such a laminate is a laminate manufactured in a process based on fan-out technology, in which terminals provided on the semiconductor substrate are mounted on a wiring layer that extends outside the chip area.

(Electronic component manufacturing method)
The method for producing an electronic component according to the sixth aspect of the present invention is characterized in that it comprises, after obtaining a laminate by the method for producing a laminate according to any one of the third to fifth aspects, a step of separating the electronic device from the support by irradiating the adhesive layer with light through the support to alter the adhesive layer (hereinafter also referred to as the "separation step"), and a step of removing the adhesive layer by decomposing the urethane bond in the adhesive layer with an acid or alkali (hereinafter also referred to as the "adhesive layer removal step").

Figure 8 is a schematic diagram illustrating one embodiment of a method for manufacturing a semiconductor package (electronic component). Figure 8(a) shows a laminate 120, Figure 8(b) illustrates a separation process, and Figure 8(c) illustrates an adhesive removal process.

[Separation process]
The separation step is a step of irradiating adhesive layer 3 with light (arrow) through support 1 to alter adhesive layer 3, thereby separating electronic device 456 from support 1.
As shown in FIG. 8( a ), in the separation step, adhesive layer 3 is irradiated with light (arrow) through support 1 that transmits light, thereby altering adhesive layer 3 .

The wavelength of the light used in the separation step may be selected from the wavelength range of 300 to 800 nm according to the wavelength of light absorbed by the component (B) contained in the adhesive layer 3 .
The type of light to be irradiated may be appropriately selected depending on the transparency of the support 1, and may be, for example, a solid-state laser such as a YAG laser, a ruby laser, a glass laser, a _YVO4 laser, an LD laser, or a fiber laser, a liquid laser such as a dye laser, a gas laser such as a _CO2 laser, an excimer laser, an Ar laser, or a He-Ne laser, a semiconductor laser, a free electron laser, or a non-laser light. This can alter the adhesive layer 3 to make it possible to easily separate the support 1 and the electronic device 456.

When irradiating with laser light, the following conditions can be given as examples of the laser light irradiation conditions.
The average output value of the laser beam is preferably 1.0 W or more and 5.0 W or less, and more preferably 3.0 W or more and 4.0 W or less. The repetition frequency of the laser beam is preferably 20 kHz or more and 60 kHz or less, and more preferably 30 kHz or more and 50 kHz or less. The scanning speed of the laser beam is preferably 100 mm/s or more and 10,000 mm/s or less.

After the adhesive layer 3 is irradiated with light (arrow) to change the properties of the adhesive layer 3, the support 1 is separated from the electronic device 456 as shown in FIG. 8(b).
For example, the support 1 and the electronic device 456 are separated by applying a force in a direction in which the support 1 and the electronic device 456 move away from each other. Specifically, while one of the support 1 or the electronic device 456 side (wiring layer 6) is fixed to a stage, the other is lifted while being sucked and held by a separation plate equipped with an adsorption pad such as a bellows pad, whereby the support 1 and the electronic device 456 can be separated.
The force applied to the laminate 200 may be appropriately adjusted depending on the size of the laminate 200, and is not limited thereto. For example, in the case of a laminate having a diameter of about 300 mm, the support 1 and the electronic device 456 can be suitably separated by applying a force of about 0.1 to 5 kgf (0.98 to 49 N).

[Adhesive layer removal process]
The method for producing an electronic component according to this embodiment includes an adhesive layer removing step in which urethane bonds in the adhesive layer are decomposed with an acid or an alkali to remove the adhesive layer.
8B , after the separation step, the adhesive layer 3 is attached to the electronic device 456. In this step, the adhesive layer 3 is decomposed using an acid or an alkali, whereby the adhesive layer 3 is removed and the electronic component 50 is obtained.

In this process, the urethane bonds in the adhesive layer 3 are decomposed with an acid or alkali. The adhesive layer 3 contains a urethane resin formed by copolymerization of the above-mentioned (I) and (O) components, or a cross-linked urethane resin formed by polymerization of the above-mentioned (P1) component. These urethane resins are decomposed by breaking the urethane bonds when treated with an acid or alkali. This allows the adhesive layer 3 to be decomposed, and the residue of the adhesive layer 3 adhering to the electronic device 456 to be removed.

The acid or alkali used in this step is not particularly limited as long as it is capable of decomposing urethane bonds. Examples of acids capable of decomposing urethane bonds include, but are not limited to, hydrochloric acid, sulfuric acid, and nitric acid. Examples of alkalis capable of decomposing urethane bonds include, but are not limited to, inorganic bases such as potassium hydroxide and sodium hydroxide; and organic amines such as tetramethylammonium hydroxide and monoethanolamine.

The acid or alkali can be dissolved in a solvent and used as a treatment liquid for removing the adhesive layer. The solvent is preferably a polar solvent, such as dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), diethylene glycol monobutyl ether, diethylene glycol, ethylene glycol, and propylene glycol.
The adhesive removal treatment liquid may contain known additives such as a surfactant in addition to the above components.
The content of the acid or alkali in the treatment liquid is not particularly limited, but may be, for example, 1 to 50% by mass, and the content of the polar solvent in the treatment liquid may be, for example, 50 to 99% by mass.
The treatment liquid for removing the adhesive layer may be a commercially available alkaline treatment liquid or acid treatment liquid, such as ST-120 or ST-121 (both manufactured by Tokyo Ohka Kogyo Co., Ltd.).
By bringing the adhesive layer 3 into contact with the above-mentioned treatment liquid containing an acid or alkali, the urethane bonds in the adhesive layer 3 are decomposed, and the adhesive layer 3 can be removed.

In the method for manufacturing electronic components according to this embodiment, after the adhesive layer removal process, the electronic component 50 may be subjected to further processes such as solder ball formation, dicing, or oxide film formation.

According to the method for producing an electronic component of this embodiment, an adhesive composition containing the compound (B), a urethane resin (P1) containing a polymerizable carbon-carbon unsaturated bond, and a polymerization initiator (A) is used to temporarily bond a semiconductor substrate or the like to a support by curing the adhesive composition. Therefore, it is possible to form an adhesive layer with high heat resistance that can withstand high-temperature treatments in processes such as those for forming electronic devices.
In addition, since the adhesive composition contains the compound (B), the adhesive layer is altered by light irradiation, and the adhesive strength is reduced, so that the semiconductor substrate or the like temporarily bonded to the support can be easily separated even without a separation layer.
Furthermore, any residue of the adhesive layer adhering to the semiconductor substrate or the like separated from the support can be easily removed by decomposing the urethane bonds in the adhesive layer with an acid or alkali.

The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

<Synthesis Example of Urethane Resin (Component (P1))>
In a flask equipped with a stirrer, a dropping funnel, a cooling tube and a thermometer, propylene glycol monomethyl ether acetate (PGMEA), 36 parts of castor oil modified diol, 17 parts of polycarbonate diol (Mw 1,000), 18 parts of pentaerythritol diacrylate, 1 part of neopentyl glycol and an inhibitor were added and mixed uniformly under a nitrogen stream. Next, 7 parts of diphenylmethane diisocyanate (MDI) and 21 parts of hydrogenated xylylene diisocyanate (H6XDI) were charged in the dropping funnel and dropped at a constant speed over 30 minutes. After the dropwise addition, aging was performed for 30 minutes. Then, a bismuth catalyst was added, the temperature was raised to 65°C and aging was performed for 4 to 5 hours. Next, 2HEA (2-hydroxyethyl acrylate) was added, aging was performed for 1 hour, and the reaction was terminated when the isocyanate group (NCO) disappeared. The weight average molecular weight (Mw) of the obtained urethane resin (P1)-1 was 20,000. The C═C equivalent (molecular weight of the urethane resin per equivalent of polymerizable carbon-carbon unsaturated bond) of the urethane resin (P1)-1 was 600 g/eq.

The polycarbonate diol (Mw 1,000) used in the synthesis of the above urethane resin (P1)-1 is a polycarbonate diol represented by the following formula (PC-1-1) (R=-(CH ₂ ) ₆ -, -(CH ₂ ) ₅ -).

<Preparation of Adhesive Composition>
(Examples 1 to 3, Comparative Example 1)
The components shown in Table 1 were mixed to prepare the adhesive compositions of each example.

In Table 1, the abbreviations have the following meanings. The numbers in brackets [ ] indicate the blend amount (parts by mass).
(P1)-1: Urethane resin (P1)-1 synthesized in the above Synthesis Example.
(A)-1: Peroxide (Percumyl (registered trademark) D, NOF Corporation).
(Ad)-1: Polyester-modified polydimethylsiloxane (BYK-310 (trade name), BYK-Chemie).
(S)-1: PGMEA (propylene glycol monomethyl ether acetate).
(B)-1: The following compound (B-1).

<Evaluation>
<Light transmittance measurement>
The adhesive composition of each example was applied onto a bare glass support by a spin coater method. The adhesive composition was heated in an oven under a nitrogen atmosphere at 180°C for 1 hour to be cured, forming an adhesive layer having a thickness as shown in Table 2. The adhesive layer was irradiated with light having a wavelength of 300 to 800 nm using a spectroscopic analyzer UV-3600 (manufactured by Shimadzu Corporation) to measure the light transmittance at a wavelength of 355 nm. The results are shown in Table 2 below.

The results shown in Table 2 confirm that the adhesive layers formed using the adhesive compositions of Examples 1 to 3 had a low level of light transmittance at the measured wavelength and absorbed light in this wavelength range.

<Laser reactivity evaluation>
Under the same conditions as in the above-mentioned "Measurement of Light Transmittance", adhesive layers were formed from the adhesive compositions of Example 3 and Comparative Example 1. The adhesive layers were irradiated with 355 nm laser light using Talon (registered trademark) 355-12 manufactured by Spectra Physics. The adhesive layers were observed to confirm the presence of dents. The results are shown in Table 3 together with the transmittance at 355 nm.

From the results shown in Table 3, it was confirmed that the adhesive layer formed using the adhesive composition of Example 3 had a laser reactivity of 355 nm. On the other hand, no laser reactivity was confirmed in the adhesive layer formed using the adhesive composition of Comparative Example 1.

REFERENCE SIGNS LIST 1 Support 3 Adhesive layer 3' Adhesive composition layer 4 Semiconductor substrate 5 Sealing material layer 6 Wiring layer 20 Laminate 50 Electronic component 100 Laminate 100' Laminate 110 Laminate 120 Laminate 200 Laminate 300 Laminate 400 Laminate 456 Electronic device 645 Electronic device

Claims (8)

An adhesive composition used to form an adhesive layer that temporarily bonds a semiconductor substrate or an electronic device to a light-transmitting support, comprising:
The present invention comprises a urethane resin (P1) containing a polymerizable carbon-carbon unsaturated bond, a compound (B) that absorbs at least a part of light in a wavelength range of 300 to 800 nm and contains a polymerizable carbon-carbon unsaturated bond ( excluding those corresponding to the urethane resin (P1)), and a polymerization initiator (A),
The compound (B) is represented by the following general formula (b):
Adhesive composition.

[In the formula, W is a monovalent group containing a polymerizable carbon-carbon unsaturated bond, Y is a single bond or a divalent group selected from the group consisting of -O-, -CO-, -COO-, and -CONH-, n is an integer of 1 to 6, X is an n-valent atomic group having an anthracene skeleton, a phenanthrene skeleton, a benzophenone skeleton, a dibenzoylmethane skeleton, a dibenzoylbenzene skeleton, or a benzotriazole skeleton, and when n is 2 or more, a plurality of Ws and Ys may be the same or different.] The adhesive composition according to claim 1 , wherein X in the general formula (b) is an n-valent atomic group having a benzotriazole skeleton . The urethane resin (P1) is a reaction product of a polyol and a polyisocyanate,
At least one of the polyol and the polyisocyanate contains the polymerizable carbon-carbon unsaturated bond.
The adhesive composition according to claim 1 or 2. The adhesive composition according to any one of claims 1 to 3, characterized in that the electronic device is a composite of a member made of a metal or semiconductor and a resin that seals or insulates the member, which is laminated on the support via the adhesive layer. A laminate in which a light-transmitting support, an adhesive layer, and a semiconductor substrate or an electronic device are laminated in this order,
The adhesive layer is a cured product of the adhesive composition according to any one of claims 1 to 4.
Laminate. A method for producing a laminate in which a light-transmitting support, an adhesive layer, and a semiconductor substrate are laminated in this order, comprising the steps of:
A step of applying the adhesive composition according to any one of claims 1 to 4 to the support or semiconductor substrate to form an adhesive composition layer;
placing the semiconductor substrate on the support via the adhesive composition layer;
curing the adhesive composition layer to form the adhesive layer;
The method for producing a laminate comprising the steps of: After obtaining a laminate by the laminate manufacturing method according to claim 6, a step of forming an electronic device which is a composite of a member made of a metal or a semiconductor and a resin which seals or insulates the member is further included.
A method for producing a laminate in which a light-transmitting support, an adhesive layer, and an electronic device are laminated in this order. After obtaining a laminate by the method for producing a laminate according to claim 7,
a step of irradiating the adhesive layer with light through the support to alter the adhesive layer, thereby separating the electronic device from the support;
removing the adhesive layer attached to the electronic device by decomposing urethane bonds in the adhesive layer with an acid or an alkali;
The method for manufacturing an electronic component includes the steps of:

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