JP7536263B2 - Cover socket, handling device and semiconductor inspection writing device - Google Patents

Description

The present invention relates to a cover socket, a handling device, a semiconductor inspection writing device, and a semiconductor inspection writing method for efficiently testing semiconductor devices and writing programs, data, etc.

After semiconductor devices are manufactured, they are placed one by one in the storage compartment of a tray and transported to the next work site where they are tested and programs, etc. are written to them. During the testing and writing process, the semiconductor devices are removed from the tray by a pickup device and transferred to a designated socket such as an open-top or clamshell. A lighter, tester, etc. is connected to the socket, and testing and writing are performed on the semiconductor devices while they are placed in the socket. Once testing and writing are complete, the semiconductor devices are again removed from the socket by the pickup device and transferred to a tray, and transported to the next work site where the manufacturing process of incorporating the semiconductor devices into computers, etc. takes place.

As described above, in the process of testing whether semiconductor devices function properly and writing programs, etc., it can be difficult to accurately place the semiconductor device on the socket from the pickup device, and misalignment can make it impossible to perform accurate tests or write programs. In addition, because the semiconductor device must be removed from the tray and then returned to the original tray, there are cases where the terminals (leads) of the semiconductor device come into contact with the resin part of the socket or the corners of the tray when placing it in the socket or returning it to the tray, causing inconvenience such as bending the terminals. Another issue is that the handling time required to pick up the semiconductor device with the pickup device and then return it to the tray is extremely long.

To address these issues, JP 2007-309787 A (Patent Document 1) describes a technology that transfers multiple semiconductor devices from a tray to a designated device at once, and then tests and writes to the multiple semiconductor devices simultaneously using that device.

JP 2007-309787 A

However, the technology described in JP 2007-309787 A was a method with low versatility because it required designing a specific device to have a size and shape that matched the tray in which the semiconductor devices were stored. There were also problems with the device being large-scale and the addition of new processes that had not been done before. The present invention solves the problems that have existed up to now with a different approach to the technology described in JP 2007-309787 A, and provides a technology that can shorten the time required for testing and writing processes for semiconductor devices and prevent damage to the terminals of the semiconductor devices.

Therefore, the present invention provides the following techniques.
One aspect of the present invention is a cover socket used for testing semiconductor devices or writing programs, etc., the cover socket having a tip tool with a device cover portion having a corresponding shape that corresponds to the outer shape of the semiconductor device, and a base tool having a housing portion that houses the tip tool and holds pins that contact terminals of the semiconductor device.
A cover socket used for testing a semiconductor device or writing a program, etc., has a tip tool equipped with a device cover portion having a corresponding shape that corresponds to the external shape of the semiconductor device. By abutting this tip tool against the semiconductor device, the tip tool can be reliably positioned relative to the semiconductor device, and the cover socket can be accurately positioned relative to the semiconductor device to ensure reliable electrical continuity.

The present invention may be a cover socket in which the pins can come into contact with upper surfaces of terminals of the semiconductor device in a state in which the tip tool is in contact with the semiconductor device.
Since the pin is in contact with the upper surface of the terminal of the semiconductor device when the tip tool is in contact with the semiconductor device, the positional relationship between the semiconductor device and the cover socket can be reliably set in a predetermined positional relationship, and misalignment between the semiconductor device and the cover socket can be prevented. Since the pin provided on the cover socket is brought into contact with the upper surface of the terminal of the semiconductor device, even if the semiconductor device is already connected to a circuit and the lower surface of the terminal is already connected to the circuit and not released, it is possible to test the semiconductor device and further write a program, etc. Thereby, it is possible to test not only new semiconductor devices but also used or used semiconductor devices and write a program, etc. In addition, since the pin is brought into contact with the upper surface of the terminal from above, the terminal is less likely to be deformed and damaged than when the pin is brought into contact with the side or bottom surface of the terminal. This is because the lower surface of the terminal is grounded and stable even when the terminal is contacted and pressed from the top surface, whereas the opposite surface is not fixed and unstable when the terminal is contacted and pressed from the side or bottom surface.

The tip may be a cover socket having a cover piece forming the corresponding shape.
Since the tip tool has a cover piece that forms the corresponding shape, the cover piece can be brought into contact with the outer edge of the semiconductor device , and the positional relationship between the tip tool and the semiconductor device can be determined to position them. In addition, since the tip tool is brought into contact with the semiconductor device by the cover piece, the contact state can be easily fine-tuned by adjusting the inclination of the cover piece, etc.

The present invention can provide a cover socket in which the tip tool is vertically movable within the accommodating portion and which has a stopper mechanism for positioning the tip tool between a protruding state and a retracted state.
The tip tool can move up and down within the housing, and has a stopper mechanism for positioning the protruding and retracted states of the tip tool, so that the tip tool can be placed in a predetermined protruding and retracted state. In addition, the tip tool can be held in a predetermined position with a simple structure. Alternatively, since such a stopper mechanism is provided, if the stopper mechanism is set so that the tip tool stops at the position where the pin contacts the terminal, the pin provided on the cover socket will not press excessively against the terminal provided on the semiconductor device. Therefore, deformation such as bending of the terminal and damage can be prevented.

The stopper mechanism can be a cover socket formed by a projection provided on either the housing portion or the tip tool and a groove provided on the other of the housing portion or the tip tool.
Since the stopper mechanism is formed by a protrusion provided on either the housing part or the tip tool, and a groove provided on the other of the housing part or the tip tool, the stopper function can be achieved with a simple fitting configuration of the protrusion and the groove, which simplifies the structure and allows the cover socket to be light in weight.

The present invention may also provide a handling device including the cover socket.
Since the present invention is a handling device having the cover socket, it is possible to perform the desired test or write a program without picking up the semiconductor device to be tested or programmed, etc. Also, a pickup device that is used for multiple purposes can be used or adapted for other purposes.

The present invention may further provide a semiconductor inspection and writing apparatus including the handling apparatus, an apparatus main body section for inspecting the semiconductor device or writing a program or the like, and a control device.
The semiconductor inspection and writing device is provided with the handling device, an apparatus main body section that performs inspections or writes programs, etc., on the semiconductor devices, and a control device, so that the control device can control the operation of the handling device and the apparatus main body section, the handling device can be provided with a cover socket that brings the semiconductor devices into conductive contact, and the apparatus main body section can test the semiconductor devices and write programs, etc.

Alternatively, the present invention can be a semiconductor inspection and writing method for testing a semiconductor device or writing a program, etc., by contacting the semiconductor device from above with a cover socket having a tip tool with a device cover part having a corresponding shape corresponding to the external shape of the semiconductor device, and a base tool having a housing part for housing the tip tool and holding pins that contact the terminals of the semiconductor device, to test the semiconductor device or write a program, etc.

In a semiconductor inspection and writing method for testing semiconductor devices or writing programs, etc., a tip tool with a device cover portion having a corresponding shape corresponding to the external shape of the semiconductor device, and a cover socket having a base tool having a housing portion for housing the tip tool and holding pins that contact the terminals of the semiconductor device are used.This allows the pins to contact the terminals while ensuring proper positioning with the tip tool relative to the semiconductor device, thereby ensuring electrical continuity between the two.
In addition, because the pins provided on the cover socket are contacted from above the semiconductor device, it is possible to test and write programs to semiconductor devices that have already been incorporated into circuits, etc. Therefore, it can be applied not only to new semiconductor devices, but also to semiconductor devices that have already been incorporated into products.

The method can also be a semiconductor inspection and writing method in which the cover socket is provided on a handling device, and the handling device is moved to bring pins of the cover socket into contact with terminals of a semiconductor device.
Since the cover socket is provided on the handling device, the cover socket can be moved relative to the semiconductor device. The handling device is moved to bring the pins of the cover socket into contact with the terminals of the semiconductor device, so there is no need to move the semiconductor device by picking it up or otherwise. This makes it possible to prevent deformation or damage, such as bending of the terminals, caused by moving the semiconductor device. In addition, the handling time required to move the handling device can be shorter than the handling time required to move the semiconductor device, so the work time can be shortened.

The present invention can reduce the time required for testing and writing processes on semiconductor devices and prevent damage to the terminals of the semiconductor devices.

FIG. 2 is a block diagram of a semiconductor test write device. 1A and 1B are a schematic plan view and a partially enlarged view of semiconductor devices accommodated in a tray; FIG. FIG. 4(A) is a perspective view of the tip tool as viewed from above, and FIG. 4(B) is a perspective view of the tip tool as viewed from below. FIG. 11 is an explanatory diagram illustrating the shape of a cover piece provided on a device cover portion of the tip tool. 11 is a front view for explaining the operation of the cover socket, showing the state in which the cover socket moves to a position above a desired semiconductor device. FIG. 11 is a front view for explaining the operation of the cover socket, showing a state in which the tip tool of the cover socket abuts against a desired semiconductor device, and a partially enlarged view thereof. FIG. 13 is a front view for explaining the operation of the cover socket, showing the state in which the tip of the cover socket is further pushed in and inserted deeper into the cover socket, and the pins come into contact with the terminals of the semiconductor device , and a partially enlarged view of the state. FIG. 9A and 9B are side views for explaining the operation of the cover socket, where FIG. 9A shows a state corresponding to FIG. 6, FIG. 9B shows a state corresponding to FIG. 7 and a partially enlarged view thereof, and FIG. 9C shows a state corresponding to FIG. 8 and a partially enlarged view thereof.

The present invention will be described in more detail based on the embodiments. Note that duplicated descriptions of the same parts, materials, functions, effects, etc. in each embodiment will be omitted.

First embodiment:
A block diagram of the semiconductor inspection and writing device 1 of the present invention is shown in Fig. 1. The semiconductor inspection and writing device 1 has an apparatus main body 2 consisting of a reader, writer, etc. that inspects or writes on semiconductor devices (hereinafter also simply referred to as "devices"), a handling device 3 that moves a cover socket 10 to a position where each device is placed and brings the cover socket 10 into contact with the device, and a control device 4 that controls the operation of the apparatus main body 2 and the handling device 3.

The semiconductor inspection and writing device 1 is a device that performs testing and writing of programs, etc. on devices by covering the devices with a cover socket 10 and connecting them to the device body 2, and performs processing such as testing and writing on multiple devices by moving this cover socket 10 to multiple devices one after another. Each part that makes up the semiconductor inspection and writing device 1 will be explained in more detail below.

The device main body 2 can be a conventional device such as a reader or writer for testing or writing programs to the device. The control device 4 is a device that has the function of controlling the operation of the device main body 2 and the handling device 3 described below. The control device 4 can be provided separately from the device main body 2 and the handling device 3, or it can use the control units provided in each of the device main body 2 and the handling device 3.

As shown in FIG. 2, manufactured devices D are usually stored lengthwise and widthwise in recesses U of trays T and brought in for inspection or program writing processes. For such devices D, handling device 3 has the function of moving cover socket 10, which will be described later, to a position above device D, moving cover socket 10 downward so as to contact device D, and moving cover socket 10 away from device D when a specified process is completed. Devices that operate in the same manner as pickup devices that lift up semiconductor chips and place them on wiring boards during semiconductor manufacturing, or pickup devices used when removing devices from trays to inspect or write to them and then returning them to trays T, can be used, and these devices can be modified for use.

The cover socket 10 is a part of the handling device 3 and is the part that comes into contact with the device D placed on the tray. As shown in FIG. 3, the cover socket 10 comprises a base tool 20 having an attachment portion 21 and a storage portion 22, and a tip tool 30. The attachment portion 21 is the part that is attached to the main body (not shown) of the handling device 3, and the storage portion 22 is the part that stores the tip tool 30 and also stores a pin 24. The pin 24 connects the wiring 23 to one end, and the other end is located in a position that contacts the terminal P of the device D.

The wiring 23 extending from one end of the pin 24 is gathered in a through hole 25 provided in the base tool 20 and arranged so as to be connected to the mounting part 21 side and connected to the device main body part 2. A screw 26 is fitted into the housing part 22 from the outside and abuts against a screw groove 35 provided in the tip tool 30 inserted into the housing part 22. Furthermore, an air passage 27 is provided inside the center of the base tool 20, and the air passage 27 is exposed to the tip tool 30 housed in the housing part 22.

The spacing and number of pins 24 may be set to correspond to the number of terminals P of device D, but by providing more pins than the number of terminals of device D, it is possible to create a versatile cover socket 10 that can be applied to various devices D having different numbers of terminals P.
Furthermore, a general-purpose contact probe can be used for the tip of the pin 24, and the tip shape can be a needle or a crown.

The oblique view of the tip tool 30 is shown in Fig. 4(A) and Fig. 4(B). On the lower side of the tip tool 30, a device cover part 33 having a cover piece 32 protruding in a direction intersecting with the lower surface 31 of the tip tool 30 is formed. At least the inner surface 32a of the four cover pieces 32 is formed obliquely as shown in Fig. 5, and the inner surface 32a of the four cover pieces 32 is tapered so that it widens downward from the lower surface 31 of the tip tool 30. Therefore, the four inner surfaces 32a and the upper corners of the device D form a corresponding corresponding shape, and the four cover pieces 32 surround the outer shape of the device D, thereby performing the function of positioning the device D relative to the tip tool 30. In addition, a contained part 34 that is contained in the containing part 22 is formed on the upper side of the tip tool 30, and this contained part 34 is provided with a screw groove 35. By fitting the screw 26 into this screw groove 35, the upper limit of the protruding and retracting states of the tip tool 30 relative to the storage part 22 is determined, and it functions as a stopper mechanism that positions the protruding position of the tip tool 30 relative to the storage part 22. The tip tool 30 has a through hole 36 that penetrates from the top to the bottom.

The shape of the device cover portion 33 of the tip tool 30 is formed so that four cover pieces 32 protrude from the four sides that form the lower surface 31 of the tip tool 30, but cover pieces 32 can also be provided on only two opposing sides. In the case of a long device, it is difficult to abut the four sides, so it is more reasonable to abut with two pieces.

Next, the operation of the semiconductor test and write device 1 will be described.
In the process of inspecting the device D or writing a program or the like to the device D, as shown in Fig. 6 and Fig. 9(A), the cover socket 10 provided at the tip of the main body of the handling device (not shown) moves laterally toward the next device D to be operated, and as shown in Fig. 7 and Fig. 9(B), the cover socket 10 moves downward to cover the upper part of the device D. At this time, the cover piece 32 of the device cover part 33 is formed in a shape that corresponds to the outer shape of the upper part of the device D so as to abut against it, and air is sucked through the air passage 27 and the through hole 36, so that the device D is accurately positioned relative to the tip tool 30 even if there is a slight positional deviation. In this state, as shown in the partially enlarged view R1 in Fig. 7, the tip tool 30 is in contact with the upper part of the device D, but the pin 24 provided on the cover socket 10 is not in contact.

8 and 9(C), when the base tool 20 of the cover socket 10 is further lowered, the tip tool 30 slides upward in the housing section 22, and the pin 24 provided in the housing section 22 comes into contact with the terminal P of the device D, as shown in the enlarged partial view R2 of FIG. 8. At this time, the tip tool 30 slides only to the extent that the screw 26 shown in FIG. 3 can come into contact with the screw groove 35 provided in the tip tool 30, so that the base tool 20 is prevented from descending more than necessary and the pin 24 from excessively pressing the terminal P. In the state where the terminal P and the pin 24 are in contact with each other, the device D is inspected or a program is written, and when this is completed, the suction of the device D is stopped and the cover socket 10 moves to the next unprocessed device D. At this time, the tip tool 30 descends by its own weight to a state where it protrudes further from the housing section 22 of the cover socket 10. Then, the device cover part 33 of the tip tool 30 is brought into contact with the upper surface of the next processing device D. In this way, the above operations are repeated for multiple devices D.

Conventional devices require picking up devices from a tray, moving them to a designated socket, then carrying out inspection or writing programs, etc., before returning them to the original tray. In contrast, with the semiconductor inspection and writing device 1, the cover socket 10 of the handling device 3 only needs to be moved from device to device, making it possible to achieve a significant reduction in handling time.

In conventional devices, devices were attached to a socket adapter for testing and writing programs, so the lead feet (the surface that contacts the board) of the device's terminals were attached on the metal part of the socket adapter. Therefore, the metal part of the socket adapter was lined with gold-plated plates of the same size as the lead feet of the device, and when processing a large number of devices, the problem of poor conductivity due to the accumulation of "solder waste" from the device was likely to occur. In addition, the device terminals could oxidize over time or in an inappropriate environment, causing poor contact with the metal part. However, in the semiconductor inspection and writing device 1, the pins 24 contact the device terminals from above, so the problem of solder waste is unlikely to occur, and since it is the pins 24, not the gold-plated plates, that contact the terminals, their sharp tips can break through the oxide film and ensure reliable conductivity.

In addition, because individual devices are not picked up, there is no risk of damaging the terminals P of the devices when they are picked up from the tray and returned using conventional equipment. In addition, because there is no need to pick up individual devices, it is possible to test or write additional programs, etc. to devices that have already been incorporated into a circuit.
The handling device 3 can be improved by utilizing a pickup device that has been used for conventional device testing and writing of programs, etc., and attaching a cover socket 10 to the tip of the arm portion, thereby making it easy to apply.

In addition, in conventional devices, a socket adapter must be attached to the ROM writer that writes programs, etc., and the device must be accurately stored in the socket adapter to make an electrical connection, so the ROM writer had to be installed within the operating range of the handling arm that handles the device. However, with the semiconductor inspection and writing device 1, it is only necessary to connect the wiring 23 leading to the ROM writer to the cover socket 10, so there is no need to install the ROM writer within the operating range of the handling arm, making it possible to save space.

Furthermore, in conventional devices, even if there were multiple types of ROM writers that could write to a certain type of device, it was only possible to use a socket adapter that was compatible with that ROM writer, so once a socket adapter was decided, the devices that could be used with it were also limited, and various ROM writers could not be used. However, with the semiconductor inspection and writing device 1, the cover socket 10 can be easily connected to various ROM writers, which has the advantage of increasing the options for ROM writers required for work.

Furthermore, in conventional devices, in order to accurately control the position of the device relative to the socket adapter, it was necessary to use a camera for correction, but in the semiconductor inspection and writing device 1, the device can be positioned with high precision by using the tapered shape of the tip tool 30 and suction to the device, so the positioning correction camera used in conventional devices is no longer necessary.

Second embodiment:
In the first embodiment, an example was given in which one cover socket 10 is moved one by one to multiple devices D stored vertically and horizontally in a tray T to test the devices D or write programs, etc., but in the semiconductor inspection and writing device (not shown) of this embodiment, multiple cover sockets 10 are prepared in advance in the handling device 3, and multiple cover sockets 10 can be moved in a single operation to process multiple semiconductor devices D simultaneously.
According to this embodiment, the handling time can be further reduced.

Variations:
In the above embodiment, the handling device 3 is moved relative to the semiconductor devices, but the tray T containing the semiconductor devices may be moved instead. In such a case, a portion for holding the tray T is provided in the handling device 3, and the portion for holding the tray T is configured to move relative to the cover socket 10.

The above embodiment is an example of the present invention, and the present invention is not limited to this embodiment. Various modifications and substitutions can be made without departing from the spirit of the present invention.

REFERENCE SIGNS LIST 1 Semiconductor inspection and writing device 2 Device main body 3 Handling device 10 Cover socket 20 Base device 21 Mounting portion 22 Storage portion 23 Wiring 24 Pin 25 Through hole 26 Screw 27 Air passage 30 Tip tool 31 Underside 32 Cover piece 32a Inner surface 33 Device cover portion 34 Storage portion 35 Screw groove 36 Through hole 4 Control device D Device P (Device) terminal T Tray U Recess R1 to R4 Partially enlarged view

Claims (8)

A cover socket used for testing a semiconductor device or writing a program,
a tip tool including a device cover portion having a shape corresponding to an outer shape of the semiconductor device, and a base tool having a receiving portion for receiving the tip tool and for holding a pin that contacts a terminal of the semiconductor device,
a cover socket having a through hole penetrating from above to below, and a cover piece forming the corresponding shape and an air passage exposed to the tip tool, in which the semiconductor device is sucked in through the air passage and the through hole to adsorb the semiconductor device to the cover piece forming the corresponding shape, thereby determining the position of the semiconductor device relative to the pin. The cover socket according to claim 1, wherein the cover piece does not exert a biasing force on the semiconductor device. The cover socket according to claim 1 or 2, wherein the cover piece consists of four pieces that protrude from the four sides that form the lower surface of the tip tool and abut against the outer edge of the semiconductor device. The semiconductor device is a semiconductor device having electrodes on only one side thereof, and the cover socket according to any one of claims 1 to 3 is used for testing the semiconductor device or writing a program or the like. The cover socket according to any one of claims 1 to 4, in which the tip tool is movable up and down within the housing and has a stopper mechanism that positions the tip tool in the extended and retracted states. A cover socket according to any one of claims 1 to 5, in which the pin can contact the upper surface of the terminal of the semiconductor device when the tip tool is in contact with the semiconductor device. A handling device equipped with the cover socket according to any one of claims 1 to 6. A semiconductor inspection and writing device comprising the handling device according to claim 7, a device main body that inspects the semiconductor device or writes a program, etc., and a control device.

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