JP7539274B2 - Method for processing workpiece - Google Patents

Description

The present invention relates to a method for processing a workpiece.

A processing method is known in which a workpiece fixed to a support substrate via wax is divided into individual pieces using a cutting blade (see, for example, Patent Document 1).

JP 2006-346836 A

When cutting hard workpieces such as sapphire into individual pieces, it is common to fix them to a support substrate using wax, but this poses problems such as the pieces flying off during cutting and the occurrence of large chipping that causes the pieces to break off.

The present invention was made in consideration of these problems, and its purpose is to provide a method for processing a workpiece that can prevent pieces from flying off or chipping during cutting.

In order to solve the above-mentioned problems and achieve the object, the method for processing a workpiece of the present invention is a method for cutting and dividing a workpiece along a plurality of first division lines formed in a first direction and a plurality of second division lines intersecting the first division lines, and is characterized by having a fixing step for fixing the workpiece to a support substrate, a first holding step for holding the support substrate side on a holding table, a first cutting step for cutting the workpiece held on the holding table along the first division lines with a cutting blade to form a plurality of strips, a peeling step for peeling the strips from the support substrate, a storage step for storing the strips in a jig having a groove formed therein for storing the strips and supporting the strips at the bottom and two side surfaces of the groove, a second holding step for holding the jig on the holding table, and a second cutting step for cutting and dividing the strips together with the jig with the cutting blade along the second division lines.

The workpiece may be fixed to the support substrate via wax , and the rectangular piece may be fixed to the jig via wax .

The jig may be in the shape of a strip larger than the strip having one of the grooves, and the second holding step may hold multiple jigs on the holding table via adhesive tape.

The jig may be large enough to cover the holding surface of the holding table, and the surface of the jig may have a plurality of grooves formed in the same direction to accommodate the strips, and the second holding step may involve the holding table holding the back surface of the jig.

The present invention can prevent pieces from flying off or chipping during cutting.

FIG. 1 is a perspective view showing an example of the configuration of a processing device for carrying out a method for processing a workpiece according to a first embodiment. FIG. 2 is a flowchart showing an example of a processing procedure of the workpiece processing method according to the first embodiment. FIG. 3 is a diagram showing an example of the fixing step and the first holding step of FIG. 2. In FIG. FIG. 4 is a diagram showing an example of the first cutting step of FIG. FIG. 5 is a diagram showing an example of the storing step and the second holding step in FIG. 2 . FIG. 6 is a cross-sectional view of FIG. FIG. 7 is a diagram showing an example of the second cutting step in FIG. FIG. 8 is a cross-sectional view of FIG. FIG. 9 is a diagram showing an example of a jig used in the accommodation step of the workpiece processing method according to the second embodiment. FIG. 10 is a diagram illustrating an example of the storing step and the second holding step according to the second embodiment. FIG. 11 is a diagram illustrating an example of a second cutting step according to the second embodiment.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A method for processing a workpiece according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a processing device 1 for carrying out the method for processing a workpiece according to the first embodiment. As shown in Fig. 1, the processing device 1 includes a holding table 10, a processing unit 20, an X-axis moving unit 31, a Y-axis moving unit 32, a Z-axis moving unit 33, and a control unit 40.

The workpiece 100, which is the processing target in the processing method of the workpiece according to the first embodiment, is, for example, a rectangular plate-like object made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, or the like. As shown in FIG. 1, the workpiece 100 has a flat surface 105, and a chip-sized device 103 is formed in an area partitioned by a plurality of first division lines 101 formed along a first direction and a plurality of second division lines 102 formed along a second direction intersecting the first direction. In addition, in the first embodiment, the first and second division lines 101 and 102 are illustrated, but in the case of a substrate without a pattern, the first and second division lines 101 and 102 do not have to be formed so as to be visible on the surface 105 of the workpiece 100. In that case, the lines that cut the workpiece 100 into the desired chip size in the first direction and the second direction are the first and second division lines 101 and 102. In the first embodiment, the workpiece 100 is further formed in a lattice shape with a plurality of first division lines 101 and second division lines 102 perpendicular to each other, but the present invention is not limited to this. In addition, the workpiece 100 in the present invention may be a disk-shaped semiconductor wafer or optical device wafer made of the same material as the base material, or a rectangular package substrate, ceramic plate, or glass plate having a plurality of devices sealed with resin.

The holding table 10 includes a frame body with a rectangular recess formed therein and a rectangular suction part fitted into the recess. The suction part of the holding table 10 is formed of porous ceramics or the like with a large number of porous holes, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction part of the holding table 10 is a holding surface 11 on which the side of the support substrate 210 (see FIG. 3, etc.) to which the workpiece 100 is fixed or the side of the jig 220 (see FIG. 5, etc.) to which the strip 110 is fixed is placed via an adhesive tape 320 (see FIG. 3 and FIG. 5, etc.) and holds the workpiece 100 or the strip 110 via the adhesive tape 320. The holding surface 11 and the upper surface of the frame body of the holding table 10 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The holding table 10 is movable in the X-axis direction, which is one horizontal direction, by the X-axis moving unit 31, and is rotatable around the Z-axis, which is a vertical direction and perpendicular to the XY plane, by a rotation drive source (not shown). The rotation drive source (not shown) is provided with a rotation angle detection unit (not shown) that detects the rotation angle of the holding table 10. The holding surface 11 of the holding table 10 is rectangular in the first embodiment, but the present invention is not limited to this and may be circular or other shapes.

The processing unit 20 has a cutting blade 21. The cutting blade 21 is attached to the tip of a spindle, and is rotated about an axis parallel to the Y-axis direction, which is another horizontal direction and perpendicular to the X-axis direction, to cut the workpiece 100 held on the holding table 10. The processing unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 32 relative to the workpiece 100 held on the holding table 10, and is also provided so as to be movable in the Z-axis direction by a Z-axis moving unit 33.

In the first embodiment, the cutting blade 21 has an annular cutting edge formed to a predetermined thickness and made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bond material such as metal or resin. Here, diamond (equivalent to modified Mohs hardness 15) and CBN (equivalent to modified Mohs hardness 14) used as the abrasive grains of the cutting edge of the cutting blade 21 are harder than silicon (equivalent to modified Mohs hardness 7), sapphire (equivalent to modified Mohs hardness 12), silicon carbide (equivalent to modified Mohs hardness 13), and gallium arsenide (equivalent to modified Mohs hardness 4.5), which are the main base materials of the workpiece 100. Therefore, the cutting blade 21 can cut the workpiece 100 even if the base material of the workpiece 100 is sapphire or silicon carbide, which are harder than the most common material silicon. In the present invention, the hardness is determined by any one of Brinell hardness, Vickers hardness, Knoop hardness, Rockwell hardness, Superficial hardness, Mayer hardness, Durometer hardness, Barcol hardness, Monotron hardness, Martens hardness, Shore hardness, Mohs hardness, and Modified Mohs hardness. Sapphire and silicon carbide are particularly effective for the present invention because they are highly hard and there is a high risk that the individual pieces 120 (see Figures 7 and 8) will fly off when diced, and chipping is also likely to occur.

The processing device 1 rotates the cutting blade 21, and moves the cutting blade 21 relative to the workpiece 100 held on the holding table 10 along the first planned division line 101 or the second planned division line 102 using the X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33, thereby cutting the workpiece 100 and forming a cutting groove along the first planned division line 101 or the second planned division line 102.

As shown in FIG. 1, the processing device 1 further includes an imaging unit 23. In the first embodiment, the imaging unit 23 is fixed to the processing unit 20 so as to move integrally with the processing unit 20. The imaging unit 23 includes an imaging element that images the surface of the workpiece 100 before cutting held on the holding table 10 and the first and second planned division lines 101 and 102. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 23 images the surface of the workpiece 100 before cutting held on the holding table 10, etc., to obtain an image for performing alignment to align the workpiece 100 and the cutting blade 21, and outputs the obtained image to the control unit 40.

The X-axis moving unit 31, the Y-axis moving unit 32 and the Z-axis moving unit 33 are each provided with an X-axis position detection unit (not shown) that detects the position of the holding table 10 in the X-axis direction, a Y-axis position detection unit (not shown) that detects the position of the processing unit 20 in the Y-axis direction, and a Z-axis position detection unit (not shown) that detects the position of the processing unit 20 in the Z-axis direction. The X-axis position detection unit, the Y-axis position detection unit and the Z-axis position detection unit each output the detected position information to the control unit 40.

The control unit 40 controls each component of the processing device 1 to cause the processing device 1 to perform each operation related to the cutting processing of the workpiece 100. The control unit 40 controls the X-axis moving unit 31, the Y-axis moving unit 32, the Z-axis moving unit 33, and the rotation drive source based on the image acquired from the imaging unit 23, the position information in the X-axis direction, the Y-axis direction, and the Z-axis direction acquired from the X-axis position detection unit, the Y-axis position detection unit, the Z-axis position detection unit, and the rotation angle detection unit, respectively, to align the cutting blade 21 of the processing unit 20 with the first and second planned division lines 101 and 102 of the workpiece 100 on the holding table 10, or the second planned division line 102 of the rectangular piece 110.

In the first embodiment, the control unit 40 includes a computer system. The control unit 40 has an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input/output interface device. The arithmetic processing device of the control unit 40 performs arithmetic processing according to a computer program stored in the storage device of the control unit 40, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input/output interface device of the control unit 40.

Next, this specification describes an example of the processing of the workpiece processing method according to the first embodiment with reference to the drawings. FIG. 2 is a flow chart showing an example of the processing procedure of the workpiece processing method according to the first embodiment. As shown in FIG. 2, the workpiece processing method according to the first embodiment has a fixing step 1001, a first holding step 1002, a first cutting step 1003, a peeling step 1004, a storage step 1005, a second holding step 1006, and a second cutting step 1007.

Figure 3 is a diagram showing an example of the fixing step 1001 and the first holding step 1002 in Figure 2. As shown in Figure 3, the fixing step 1001 is a step of fixing the workpiece 100 onto one surface 215 of the support substrate 210 via the wax 310.

Here, in the first embodiment, the support substrate 210 is a rectangular plate-like object made of a material that can be cut by the cutting blade 21 together with the workpiece 100. The support substrate 210 is made of a material that is equal to or lower in hardness than the base material of the workpiece 100, that is, a material that has the same machinability as the base material of the workpiece 100 or a material that is easier to cut than the base material, specifically, made of silicon or carbon (equivalent to a modified Mohs hardness of 1 to 2). Note that the support substrate 210 is not limited to a rectangular plate-like object in the present invention, and may be a plate-like object of other shapes such as a disk shape. In the first embodiment, the wax 310 is a solid wax made of an organic material such as a resin that melts at about 100°C and solidifies at room temperature (for example, about 25°C) or at the temperature during cutting processing. When solid, the wax 310 has a lower hardness than the workpiece 100 and the support substrate 210, so it is cut by the cutting blade 21 together with the workpiece 100 and the support substrate 210.

In the fixing step 1001, specifically, the support substrate 210 is first placed with the surface 215 facing upward, and the wax 310 that has been heated and melted is supplied onto the surface 215. In the fixing step 1001, the workpiece 100 is then placed on the surface 215 via the melted wax 310 with the back surface 106 side of the front surface 105 facing the surface 215 of the support substrate 210, and the melted wax 310 is spread horizontally between the back surface 106 of the workpiece 100 and the surface 215 of the support substrate 210. The workpiece 100 is positioned so that it fits within the surface 215 of the support substrate 210 in a plan view. In the fixing step 1001, the wax 310 is then cooled to room temperature and solidified, so that the back surface 106 side of the workpiece 100 is adhered to the surface 215 of the support substrate 210 via the wax 310, as shown in FIG. 3.

In the first holding step 1002, the control unit 40 controls the holding table 10 to hold the side of the support substrate 210 to which the workpiece 100 is fixed, as shown in FIG. 3, on the holding table 10. Specifically, in the first holding step 1002, first, an adhesive tape 320 having a size and shape to cover the holding surface 11 is attached to the other surface 216 behind the surface 215 to which the workpiece 100 is attached of the support substrate 210, and a frame having an opening in the center (not shown) is attached to the outer edge of the adhesive tape 320. In the first holding step 1002, the support substrate 210 to which the workpiece 100 is fixed is then placed on the holding surface 11 of the holding table 10 with the surface 216 to which the adhesive tape 320 is attached facing the holding surface 11. In the first holding step 1002, the holding table 10 then suction-holds the surface 216 of the support substrate 210 to which the workpiece 100 is fixed on the holding surface 11 via the adhesive tape 320. The support substrate 210 is positioned so as to fit within the holding surface 11 of the holding table 10 in a plan view. In the first holding step 1002, if the surface 216 of the support substrate 210 has a size and shape that covers the holding surface 11 and the support substrate 210 is not completely cut in the first cutting step 1003, the adhesive tape 320 and the frame may be omitted, and the holding table 10 may directly suction-hold the surface 216 of the support substrate 210 to which the workpiece 100 is fixed on the holding surface 11.

Figure 4 is a diagram showing an example of the first cutting step 1003 in Figure 2. In the first cutting step 1003, the control unit 40 controls the processing unit 20, the X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33, etc., to cut the workpiece 100 held on the holding table 10 via the support substrate 210 with the cutting blade 21 along the first planned division line 101, as shown in Figure 4, to form multiple strips 110. In the first cutting step 1003, the workpiece 100 is cut to a depth equal to or greater than the thickness of the workpiece 100. In the first cutting step 1003, the wax 310 and the support substrate 210 may or may not be completely cut (full cut).

The strip 110 formed in the first cutting step 1003 is obtained by cutting the workpiece 100 along the first planned division line 101, and has a rod-like shape extending along the first direction, with the second planned division line 102 remaining formed on the surface 105. Hereinafter, the first direction of the strip 110 will be referred to as the longitudinal direction, the second direction of the strip 110 will be referred to as the width direction, and the length of the strip 110 along the second direction will be referred to as the width, as appropriate.

The peeling step 1004 is a step of peeling the multiple strips 110 from the surface 215 of the support substrate 210. Specifically, in the peeling step 1004, the wax 310 that adheres the multiple strips 110 to the surface 215 of the support substrate 210 is heated and melted, and the multiple strips 110 are separated from the surface 215 of the support substrate 210.

Figure 5 is a diagram showing an example of the accommodation step 1005 and the second holding step 1006 in Figure 2. Figure 6 is a cross-sectional view of Figure 5. As shown in Figures 5 and 6, the accommodation step 1005 is a step in which the strip 110 is accommodated in a groove 225 formed in the jig 220 and supported by the jig 220.

The jig 220 used in the storage step 1005 has a strip shape that is either the same length as the longitudinal length of the strip 110 or extends even longer (larger) in the longitudinal direction than the longitudinal length of the strip 110. As shown in Figures 5 and 6, the jig 220 has a plate-shaped base 221 extending in the longitudinal direction and a pair of side walls 222 extending in the longitudinal direction and erected from the base 221. The pair of side walls 222 are arranged parallel to each other with a gap in the width direction of the base 221, and the gap between them is wider than the width of the strip 110. The base 221 and the pair of side walls 222 of the jig 220 form one groove 225 that stores the strip 110. The surface of the base 221 on which the pair of side walls 222 are erected forms the bottom surface 226 of the groove 225, and the opposing inner wall surfaces of the pair of side walls 222 form the side surface 227 of the groove 225. The depth of the groove 225, i.e., the erect height of the pair of side walls 222 from the bottom surface 226, is less than the thickness of the rectangular piece 110, and is preferably at least half the thickness of the rectangular piece 110. In the first embodiment, the back surface 229 on the back side of the side on which the groove 225 of the jig 220 is formed is a rectangular shape extending in the longitudinal direction, but the present invention is not limited to this, and may be a circular shape or other shape as long as a similar groove 225 is formed.

In the accommodation step 1005, specifically, the jig 220 is first placed with the groove 225 side facing upward, and heated and melted wax 310 is supplied into the groove 225. In the accommodation step 1005, the strip 110 is then placed on the bottom surface 226 of the groove 225 with the back surface 106 side facing the bottom surface 226 of the groove 225 via the melted wax 310, and the melted wax 310 is spread along the longitudinal direction by the back surface 106 of the strip 110 and the bottom surface 226 of the groove 225, and by each side surface 111 of the strip 110 and each side surface 227 of the groove 225 facing each side surface 111 of the strip 110. Here, it is preferable that the strip 110 is positioned so that it fits within the longitudinal range of the jig 220 in a plan view. In the storage step 1005, the wax 310 is then cooled to room temperature and solidified, so that, as shown in Figures 5 and 6, the back surface 106 of the strip 110 is adhered to the bottom surface 226 of the groove 225 of the jig 220, and each side surface 111 of the strip 110 is adhered to each side surface 227 of the opposing groove 225 of the jig 220 via the wax 310.

In the second holding step 1006, the control unit 40 controls the holding table 10 to hold the side of the jig 220 containing the strip 110 on the holding table 10, as shown in Figs. 5 and 6. In the second holding step 1006, specifically, first, an adhesive tape 320 having a size and shape to cover the holding surface 11 is attached to the back surface 229 of the jig 220 containing the strip 110, and a frame having an opening in the center (not shown) is attached to the outer edge of the adhesive tape 320. In the second holding step 1006, a plurality of jigs 220 containing the strips 110 are attached to a single sheet of adhesive tape 320 in an array such that, for example, their longitudinal directions are oriented in the same direction and are parallel to each other. In the second holding step 1006, the multiple jigs 220 containing the strips 110 are then placed on the holding surface 11 with the back surface 229 to which the adhesive tape 320 is attached facing the holding surface 11 of the holding table 10. In the second holding step 1006, the holding table 10 then suction-holds the back surface 229 of the multiple jigs 220 containing the strips 110 on the holding surface 11 via the adhesive tape 320. The multiple jigs 220 are positioned so that they fit within the holding surface 11 of the holding table 10 in a plan view.

Figure 7 is a diagram showing an example of the second cutting step 1007 in Figure 2. Figure 8 is a cross-sectional view of Figure 7. In the second cutting step 1007, the control unit 40 controls the processing unit 20, the X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33, etc., to cut the strip 110 held on the holding table 10 via the jig 220 together with the wax 310 and the jig 220 along the second division line 102 with the cutting blade 21 to separate them into multiple pieces 120, as shown in Figures 7 and 8. In the second cutting step 1007, the strip 110 is cut to a depth equal to or greater than the thickness of the strip 110. In the second cutting step 1007, the wax 310 and the jig 220 may or may not be completely cut (full cut).

Here, when cutting the strips 110 in the second cutting step 1007, there is a risk that the second planned division lines 102 of the multiple strips 110 held by the holding table 10 on the holding surface 11 will not be on the same line. For this reason, in the second cutting step 1007, as shown in Figures 7 and 8, the cutting blade 21 is positioned on the second planned division line 102 for each second planned division line 102 of each strip 110, and while rotating the cutting blade 21, it is lowered vertically to a height at which the strips 110 are cut to perform cutting, and then the cutting blade 21 is raised vertically and withdrawn, in other words, a chopper cut is performed. In the second cutting step 1007, if it is necessary to form a cutting groove that is longer in the width direction of the strip 110 (X direction in Figures 7 and 8) than the cutting groove formed by a single chopper cut, the cutting blade 21 may be rotated while being lowered vertically to a height at which the strip 110 is cut, and then the holding table 10 and the cutting blade 21 may be moved relatively in the X direction to cut the strip 110.

The individual pieces 120 formed in the second cutting step 1007 are removed by heating and melting the wax 310 that adheres the individual pieces 120 to the grooves 225 of the jig 220, and then separating the individual pieces 120 from the grooves 225 of the jig 220.

In the conventional method, when cutting a workpiece having a hardness higher than that of the most common material silicon, such as sapphire or silicon carbide, there is a high possibility that the strips or pieces will move during cutting, which is likely to cause chipping or chipping of the individual pieces 120. However, in the method for processing a workpiece according to the first embodiment having the above configuration, even if the workpiece 100 has such a high hardness, the jig 220 fixes the strips 110 on both sides 111 in addition to the back surface 106, so that the possibility of the strips 110 and the individual pieces 120 moving during cutting can be suppressed, and chipping or chipping of the individual pieces 120 can be suppressed during cutting, thereby achieving the effect of being able to divide the workpiece 100 into individual pieces with good quality. Note that the method for processing a workpiece according to the present invention is not limited to the case where the workpiece 100 has such a high hardness, and the same effect can be achieved even if the workpiece 100 does not have a high hardness.

In addition, in the method for processing a workpiece according to embodiment 1, the workpiece 100 (including the rectangular pieces 110 and the individual pieces 120) is fixed to the support substrate 210 and the jig 220 via the wax 310, so that the workpiece 100 can be easily fixed to the support substrate 210 and the jig 220, and the possibility of the workpiece 100 moving at the temperature during cutting processing of the workpiece 100 can be sufficiently suppressed.

In addition, in the method for processing the workpiece according to embodiment 1, the jig 220 has a rectangular shape larger than the rectangular piece 110 having one groove 225, and in the second holding step 1006, the multiple jigs 220 are held on the holding table 10 via adhesive tape 320, so that the cutting process in the second cutting step 1007 can be performed efficiently.

In addition, in the method for processing a workpiece according to embodiment 1, the depth of the groove 225 of the jig 220 is less than the thickness of the strip 110, so that the individual pieces 120 can be easily removed from the groove 225. In addition, in the method for processing a workpiece according to embodiment 1, the depth of the groove 225 of the jig 220 is more than half the thickness of the strip 110, so that the side surfaces 111 of the strip 110 and the individual pieces 120 can be sufficiently fixed by the jig 220.

[Embodiment 2]
A method for processing a workpiece according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a diagram showing an example of a jig 420 used in a storage step 1005 of the method for processing a workpiece according to the second embodiment. Fig. 10 is a diagram showing an example of a storage step 1005 and a second holding step 1006 according to the second embodiment. Fig. 11 is a diagram showing an example of a second cutting step 1007 according to the second embodiment. In Figs. 9, 10 and 11, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The method for processing a workpiece according to the second embodiment is a modification of the first embodiment in that the storage step 1005, the second holding step 1006, and the second cutting step 1007 are changed. In the storage step 1005 according to the second embodiment, as shown in FIG. 10, instead of the jig 220 of the first embodiment, the strip 110 is stored in a groove 425 formed in a jig 420.

9, the jig 420 used in the storage step 1005 according to the second embodiment has a plate-shaped base 421 having a size and shape that covers the holding surface 11, a plurality of side walls 422 extending in a predetermined direction and erected from the base 421, and a reference wall 423 disposed at one end of the plurality of side walls 422. The plurality of side walls 422 are arranged parallel to each other at intervals in a direction (width direction) perpendicular to the predetermined direction of the base 421, and the intervals between them are wider than the width of the strip 110. The base 421 and the plurality of side walls 422 of the jig 420 form a plurality of grooves 425 that store the strip 110. The longitudinal length of the groove 425 is equal to or greater than the longitudinal length of the strip 110. The plurality of grooves 425 formed in the jig 420 are formed in the same direction. That is, the multiple grooves 425 formed in the jig 420 all extend in a predetermined direction and are arranged parallel to each other. The surface on the side where the pair of side walls 422 of the base 421 are erected forms a bottom surface 426 of the groove 425, and the mutually opposing inner wall surfaces of the pair of side walls 422 form a side surface 427 of the groove 425. The reference wall 423 is a plate-shaped member, and the wall surface 428 closes one end in the longitudinal direction of the multiple grooves 425 formed in the jig 420, and aligns the position of one end in the longitudinal direction of the multiple grooves 425. The depth of the groove 425, i.e., the erection height from the bottom surface 426 of the pair of side walls 422 is preferably less than the thickness of the strip 110 and is equal to or more than half the thickness of the strip 110. In embodiment 2, the back surface 429 of the jig 420 on the side where the groove 425 is formed is rectangular, but the present invention is not limited to this and may be circular or another shape.

In the storage step 1005 according to the second embodiment, one end of each of the multiple strips 110 in the longitudinal direction is aligned with the wall surface 428 of the reference wall 423, and each strip 110 is stored in each groove 425 via the wax 310.

As shown in FIG. 10, the second holding step 1006 according to the second embodiment is the same as that according to the first embodiment except that the application of the adhesive tape 320 and the attachment of the annular frame are omitted. Note that the second holding step 1006 is not limited to this in the present invention, and for example, when the strip 110 and the jig 420 are to be completely cut (full cut), the adhesive tape 320 may be applied to the back surface 429 of the jig 420 and the annular frame may be attached in the same manner as in the first embodiment.

In the second holding step 1006 according to the second embodiment, specifically, the jig 420 containing the multiple strips 110 is placed on the holding surface 11 with the back surface 429 facing the holding surface 11 of the holding table 10. In the second holding step 1006, the holding table 10 then suction-holds the back surface 429 of the jig 420 containing the multiple strips 110 directly on the holding surface 11. The jig 420 is positioned so as to cover the holding surface 11 of the holding table 10 in a plan view.

When cutting the strips 110 in the second cutting step 1007 according to the second embodiment, the multiple strips 110 held by the holding table 10 on the holding surface 11 are accommodated so that they are oriented in the same direction along the groove 425 and are parallel to each other, and one end of each of the multiple strips 110 in the longitudinal direction is aligned with the wall surface 428 of the reference wall 423, so that the second division lines 102 of the multiple strips 110 that are the same number as counted from the end are on the same line. Therefore, in the second cutting step 1007 according to the second embodiment, as shown in FIG. 11, the second division lines 102 of the multiple strips 110 that are on the same line are cut across the multiple strips 100 by positioning the cutting blade 21 on the line and moving the cutting blade 21 and the holding table 10 holding the multiple strips 110 relatively along the line while rotating the cutting blade 21. In addition, in the second cutting step 1007 in embodiment 2, the present invention is not limited to this, and chopper cutting may be performed as appropriate in the same manner as in embodiment 1.

In the method for processing a workpiece according to embodiment 2 having the above-described configuration, the back surface 429 of the jig 420 has a size and shape that covers the holding surface 11 of the holding table 10, so that the holding table 10 can directly suction and hold the back surface 429 side of the jig 420 on the holding surface 11 without using an adhesive tape 320 that has a size and shape that covers the holding surface 11.

In addition, in the method for processing the workpiece according to the second embodiment, multiple grooves 425 for accommodating the rectangular pieces 110 are formed in the same direction on the surface side of the jig 420, and one end of the longitudinal direction of the multiple grooves 425 is aligned with the wall surface 428 of the reference wall 423, so that the second division lines 102 that are the same number of lines counted from the corresponding end of the multiple rectangular pieces 110 accommodated in the jig 420 are on the same line, and the second division lines 102 that are on the same line can be cut together.

The present invention is not limited to the above embodiment. In other words, the present invention can be implemented in various modifications without departing from the gist of the invention.

REFERENCE SIGNS LIST 1 Processing device 10 Holding table 11 Holding surface 21 Cutting blade 100 Workpiece 101 First planned division line 102 Second planned division line 110 Strip piece 120 Individual piece 210 Support substrate 220, 420 Jig 225, 425 Groove 226, 426 Bottom surface 227, 427 Side surface 310 Wax 320 Adhesive tape

Claims (4)

A method for processing a workpiece, comprising cutting the workpiece along a plurality of first division lines formed in a first direction and a plurality of second division lines intersecting the first division lines to separate the workpiece, the method comprising the steps of:
A fixing step of fixing the workpiece to a support substrate;
a first holding step of holding the support substrate side on a holding table;
a first cutting step of cutting the workpiece held on the holding table along the first division line with a cutting blade to form a plurality of rectangular pieces;
a peeling step of peeling the strip from the support substrate;
a housing step of housing the strip in a jig having a groove formed therein for housing the strip and supporting the strip at a bottom surface and two side surfaces of the groove;
a second holding step of holding the jig on the holding table;
a second cutting step of cutting the rectangular piece together with the jig with the cutting blade along the second division line to separate the rectangular piece;
A method for processing a workpiece, comprising: the workpiece is fixed to the support substrate via wax ;
2. The method for processing a workpiece according to claim 1, wherein the rectangular piece is fixed to the jig via wax . the jig has a rectangular shape larger than the rectangular piece having one of the grooves;
2. The method for processing a workpiece according to claim 1, wherein the second holding step holds the plurality of jigs on the holding table via an adhesive tape. the jig has a size that covers the holding surface of the holding table,
A plurality of grooves for accommodating the strips are formed in the same direction on the surface of the jig;
2. The method for machining a workpiece according to claim 1, wherein the second holding step includes holding a rear surface of the jig by the holding table.

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