JP7541552B2 - SENSOR SHIFT ACTUATOR DEVICE, IMAGING MODULE, AND ELECTRONIC DEVICE - Google Patents

Description

The present invention relates to the field of electrical components technology, and in particular to a sensor shift actuator device, an imaging module, and an electronic device.

When designing a sensor shift actuator, taking an image sensor as an example, it is necessary to electrically connect the image sensor and the actuator body. When considering a one-to-one land connection, misalignment during mounting changes the contact area between the lands on the image sensor and actuator, causing impedance fluctuations and reducing the image quality of the image sensor.

At least one embodiment of the present invention provides a sensor shift actuator device, an imaging module, and an electronic device that can reduce degradation of image quality of an image sensor caused by misalignment of lands when mounting an image sensor and an actuator.

In order to solve the above-mentioned technical problems, the present invention has been made as follows.

In a first aspect, an embodiment of the present invention provides a sensor-shift actuator device that includes a sensor and an actuator, a first substrate of the sensor and a second substrate of the actuator are electrically connected by a land, and a land dimension on the first substrate is different from a land dimension on the second substrate.

In a second aspect, an embodiment of the present invention provides a camera module including a sensor shift actuator device as described above.

In a third aspect, an embodiment of the present invention provides an electronic device including the camera module described above.

Compared to the conventional technology, the sensor shift actuator device, camera module and electronic device provided by the embodiments of the present invention are arranged so that the land dimensions on the first substrate of the sensor are different from the land dimensions on the second substrate of the actuator. This increases the contact area between the lands on the first substrate and the second substrate when the first substrate of the sensor and the second substrate of the actuator are electrically connected by the lands, thereby reducing the reduction in the contact area caused by misalignment of the lands when mounting the image sensor and the actuator, and the impact on the image quality of the image sensor.

1 is a schematic configuration diagram of a sensor shift actuator device according to an embodiment of the present invention. FIG. 1 is a schematic diagram of land contact area when land dimensions are the same. 11A-11C are schematic diagrams of land contact areas for different land sizes according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a land arrangement according to an embodiment of the present invention. FIG. 1 is a schematic diagram of a land arrangement in the prior art. FIG. 2 is a schematic diagram of a land arrangement according to an embodiment of the present invention. FIG. 3 is a schematic diagram of a land arrangement according to an embodiment of the present invention.

The following clearly and completely describes the technical solutions of the embodiments of this application in accordance with the drawings of the embodiments of this application, and it is clear that the described embodiments are only a part of the embodiments of this application, and are not all of them. All other embodiments obtained based on the embodiments of this application without paying creative labor by those skilled in the art are within the scope of protection of this application.

Terms such as "first", "second", etc. in the specification and claims of this application are used to distinguish between similar objects, and are not intended to describe a particular order or sequence of events. Data used in this manner are interchangeable where appropriate, such that the embodiments of this application may be practiced in other orders than those illustrated or described herein, and it should be understood that objects distinguished as "first", "second", etc. are generally of the same kind, and do not limit the number of objects, e.g., a first object may be one or more. Also, "and/or" in the specification and claims represents at least one of the objects connected, and the symbol "/" generally represents an "or" relationship between the related objects before and after.

To help understand the technical solutions related to the present invention, the following describes the relevant concepts related to the present invention.

The sensor in the sensor shift actuator device may be an image sensor or a sensor with another function. Taking an image sensor as an example, it has many signals, each of which is a high-frequency signal, so it is necessary to suppress fluctuations in the impedance of the connection.

As shown in FIG. 1, an embodiment of the present invention provides a sensor shift actuator device 10 including a sensor 11 and an actuator 12, in which a first substrate 13 of the sensor 11 and a second substrate 14 of the actuator 12 are electrically connected by a land 101, and the dimensions of the land on the first substrate 13 are different from the dimensions of the land on the second substrate 14.

As an alternative embodiment, the land dimensions on the first substrate 13 may be larger than the land dimensions on the second substrate 14. As another alternative embodiment, the land dimensions on the second substrate 14 may be larger than the land dimensions on the first substrate 13.

The shape of the land 101 may be a circle, a polygon, an irregular shape, or the like, and the embodiments of the present invention are not limited thereto. For ease of assembly, it is preferable that the shape of the land 101 on the first substrate 13 is the same as or similar to the shape of the land 101 on the second substrate 14. If the shape of the land 101 is a circle, the size of the land 101 can be the diameter of the circle, and if the shape of the land 101 is a polygon or an irregular shape, the size of the land 101 can be expressed by the diameter of the inscribed circle, the diameter of the circumscribed circle, the area of the shape, or the like.

As an optional embodiment, in order to advantageously reduce connection impedance, the multiple lands 101 on the first substrate 13 of the sensor 11 are electrically connected one-to-one with the multiple lands 101 on the second substrate 14 of the actuator 12.

When electrically connecting the lands of two boards by aligning them together, as in flip chip connections, if the land dimensions on the two boards are the same, the connection area will vary due to misalignment. Figure 2(a) shows a schematic diagram of land welding when the land dimensions are the same and there is no misalignment, and Figure 2(b) shows a schematic diagram of land welding when the land dimensions are the same and there is a misalignment. As is clear from these drawings, when the land dimensions are the same, if the contact area changes significantly due to mounting error and there is a large variation in impedance, this will cause speed fluctuations and become a source of noise when exchanging video signals, leading to a deterioration in the quality of the video signal.

Compared to the case where the land dimensions are the same, in the sensor shift actuator device 10 in the embodiment of the present invention, the land dimensions on the first substrate 13 of the sensor 11 are arranged to be different from the land dimensions on the second substrate 14 of the actuator 12. When the first substrate 13 of the sensor 11 and the second substrate 14 of the actuator 12 are electrically connected by the land 101, as shown in FIG. 3, in either the case where there is no misalignment or the case where there is a misalignment, the land 101 on the first substrate 13 is ensured to be within the range of the land 101 on the second substrate 14 as much as possible, or the land 101 on the second substrate 14 is ensured to be within the range of the land 101 on the first substrate 13 as much as possible. Therefore, when the lands of the two substrates are aligned and electrically connected, even if there is a misalignment, the contact area of the land does not change, and the contact area between the land 101 on the first substrate 13 and the land 101 on the second substrate 14 is increased, and further, the reduction in the contact area due to the misalignment of the land when the sensor 11 and the actuator 12 are mounted and the effect on the image quality of the image sensor can be reduced.

As an optional example, the difference between the land dimensions on the first substrate 13 and the land dimensions on the second substrate 14 is determined based on the assembly error between the sensor 11 and the actuator 12.

For example, the dimensional variation of the land on the first substrate 13 and the land on the second substrate 14 is determined based on the mounting accuracy obtained by predicting the mounting error of the lands on the sensor side and the actuator side in advance, and a difference is made between the land dimensions on the first substrate 13 and the land dimensions on the second substrate 14. This increases the contact area between the land 101 on the first substrate 13 and the land 101 on the second substrate 14 when the first substrate 13 of the sensor 11 and the second substrate 14 of the actuator 12 are electrically connected by the land 101, and further ensures that the reduction in the contact area due to misalignment of the lands when the sensor 11 and the actuator 12 are mounted and the effect on the image quality of the image sensor can be reduced.

As an alternative embodiment, the plurality of lands 101 on the first substrate 13 and the plurality of lands 101 on the second substrate 14 are both arranged in multiple rows, and the lands in two adjacent rows are staggered.

As shown in FIG. 4, the land arrangement on the image sensor side and the land arrangement on the actuator side are both staggered, that is, the lands in two adjacent rows are staggered. The staggered arrangement of the lands means that, of the two adjacent rows of lands, each land in one row is arranged between any two lands in the other row, that is, this staggered arrangement is compared to the aligned arrangement of the lands in two adjacent rows shown in FIG. 5.

In this embodiment, when considering the arrangement of multiple lands, the area occupied by the lands 101 on the substrate is reduced by arranging the multiple lands 101 in a staggered pattern; for example, in Fig. 4, the area occupied by the staggered lands is 28.42 ^mm2 , and in Fig. 5, the area occupied by the aligned lands is 30.69 ^mm2 . This allows for stable electrical connection, and realizes stabilization of the image signal of the image sensor. Furthermore, the reduced area occupied by the lands 101 allows for a generous land arrangement, which is advantageous for realizing product miniaturization.

As an alternative embodiment, lands in different rows where the number of rows of lands is an odd number are aligned, and lands in different rows where the number of rows of lands is an even number are aligned.

Continuing to refer to FIG. 4, the lands 101 in the first row are aligned with the lands 101 in the third row, the lands 101 in the second row are aligned with the lands 101 in the fourth row, and the lands 101 in the first row are staggered with the lands 101 in the second row. This ensures that the number of lands 101 that can be arranged in each row is the same, while at the same time reducing the area that the lands 101 occupy on the board, which is advantageous in realizing a more compact product.

As an optional embodiment, at least one of the first substrate 13 and the second substrate 14 is rectangular, and the rectangle has a smaller length or a larger width.

For example, at least one of the first substrate 13 and the second substrate 14 being rectangular means that the first substrate 13 is rectangular, or the second substrate 14 is rectangular, or both the first substrate 13 and the second substrate 14 are rectangular.

For example, when the substrate is rectangular, the warping in the longitudinal direction is large due to the structure. For this reason, in this embodiment, the lands arranged on the substrate are made smaller in the longitudinal direction, i.e., the substrate is made smaller in the longitudinal direction, thereby reducing the effect of the warping. Alternatively, the lands arranged on the substrate are made larger in the width direction, i.e., the substrate is made larger in the width direction, thereby reducing the effect of the warping. Alternatively, the lands arranged on the substrate are made smaller in the longitudinal direction and larger in the width direction, i.e., the substrate is made smaller in the longitudinal direction and larger in the width direction, thereby reducing the effect of the warping. As shown in FIG. 6, the lands on the substrate are 5 vertical x 8 horizontal, and compared to FIG. 4, in which the lands on the substrate are 4 vertical x 10 horizontal, the number of lands is secured and the longitudinal direction is shortened. Therefore, by arranging the lands so that the longitudinal direction is smaller, the effect of the warping can be reduced. As a result, the impedance fluctuation of the electrical signal of the image sensor shown in claim 2 can be reduced, and a more stable video signal can be obtained.

As an optional example, the smallest shape that can be formed by multiple lands with the closest distance between them is an equilateral triangle.

4, the lands 101 on the substrate are arranged in a staggered pattern of equilateral triangles, and compared to Fig. 5 in which the lands 101 on the substrate are arranged in a square grid pattern, the area occupied by the lands 101 on the substrate can be made smaller, for example, the area occupied by the staggered lands in Fig. 4 is 28.42 ^mm2 , while the area occupied by the aligned lands in Fig. 5 is 30.69 ^mm2 . As a result, even if the substrate is warped, the gap between the lands 101 due to the warping is small. The smaller gap allows for stable flip chip connection, which reduces impedance fluctuations in the electrical signal of the image sensor and allows for stable acquisition of video signals.

Also, by changing the orientation of the equilateral triangle of the land arrangement, the longitudinal direction can be shortened. For example, the land arrangement shown in FIG. 6 has smaller dimensions than the land arrangement shown in FIG. 7.

Based on the sensor shift actuator device provided by each of the above embodiments, the embodiment of the present invention further provides an imaging module including the light projecting device shown in FIG. 1. The imaging module may also include a lens assembly, an image processing module, etc., and the embodiments of the present invention are not limited thereto.

Furthermore, an embodiment of the present invention further provides an electronic device, such as a smartphone, that includes the above-mentioned imaging module.

In the embodiment of the present invention, the use of a staggered arrangement of lands with different dimensions is proposed using a sensor shift actuator device applied to an imaging module as an example, but the embodiment of the present invention is not only applicable to sensor shift actuator devices in imaging modules, but also to other devices that are arranged using basic lands.

Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the specific embodiments described above, which are merely illustrative and not restrictive. Those skilled in the art can further create various forms based on the teachings of the present invention without departing from the spirit of the present invention and the scope of protection provided by the claims, and all of these forms are protected by the present invention.

Claims (8)

A sensor;
an actuator;
the first substrate of the sensor and the second substrate of the actuator are electrically connected by lands;
A sensor shift actuator device, characterized in that a land size on the first substrate is different from a land size on the second substrate. The sensor shift actuator device according to claim 1, characterized in that the lands on the first substrate of the sensor are electrically connected one-to-one to the lands on the second substrate of the actuator. The sensor shift actuator device according to claim 1, characterized in that the difference between the land dimensions on the first substrate and the land dimensions on the second substrate is determined based on an assembly error between the sensor and the actuator. The sensor shift actuator device according to claim 3, characterized in that, when the first substrate and the second substrate are electrically connected by lands, the lands on the first substrate are within the range of the lands on the second substrate, or the lands on the second substrate are within the range of the lands on the first substrate. The sensor shift actuator device according to claim 1, characterized in that the multiple lands on the first substrate and the multiple lands on the second substrate are both arranged in multiple rows, and the lands of two adjacent rows are staggered. The sensor shift actuator device of claim 1, wherein at least one of the first substrate and the second substrate is rectangular. An imaging module comprising the sensor shift actuator device according to any one of claims 1 to 6 . An electronic device comprising the imaging module according to claim 7 .