JP7542916B2

JP7542916B2 - LED lighting equipment

Info

Publication number: JP7542916B2
Application number: JP2020174329A
Authority: JP
Inventors: 俊樹門田; 剛安達; 喜彦藤田; 憲一倉野
Original assignee: アール・ビー・コントロールズ株式会社
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2024-09-02
Anticipated expiration: 2040-10-16
Also published as: JP2022065698A

Description

本発明は、ＬＥＤが実装されたＬＥＤ基板と、このＬＥＤ基板上のＬＥＤに給電する電源基板との間に隔絶板を挟んだＬＥＤ照明装置に関する。 The present invention relates to an LED lighting device in which an insulating plate is sandwiched between an LED board on which LEDs are mounted and a power supply board that supplies power to the LEDs on the LED board.

従来のこの種のＬＥＤ照明装置として、長尺のＬＥＤ基板の一方の面に複数個のＬＥＤを並べて設けると共に、各ＬＥＤに給電するため同じく一方の面に電子部品が実装された長尺の電源基板を設けたものが知られている。このものではＬＥＤ基板の他方の面と電源基板の他方の面とを合わせるが、その際に、ＬＥＤ照明装置の金属製筐体の一部を平板状に引き抜き成型して、その平板部分をＬＥＤ基板と電源基板との間に挟まれるように構成している。また、必要に応じて、電源基板の他方の面とこの筐体の平板部分との間にシート状の絶縁部材を挟み込むように構成している（例えば、特許文献１参照）。 A conventional LED lighting device of this type has a long LED board on one side of which a plurality of LEDs are arranged, and a long power supply board on one side of which electronic components are mounted to supply power to each LED. In this device, the other side of the LED board and the other side of the power supply board are mated, and at this time, a part of the metal housing of the LED lighting device is punched out into a flat plate shape, and the flat plate part is sandwiched between the LED board and the power supply board. If necessary, a sheet-like insulating material is sandwiched between the other side of the power supply board and the flat plate part of the housing (see, for example, Patent Document 1).

なお、上記従来のＬＥＤ照明装置のように、筐体の一部を金属製にする場合には、その筐体の一部を平板状にしてＬＥＤ基板と電源基板との間に挟み込むように構成してもよいが、筐体を金属製にしない場合にはこのような構成を採用することができない。そのような場合であっても、電源基板は保全要件のため、電気的な絶縁性を有しており、かつ不燃性を有する材質で覆う必要がある。 When part of the housing is made of metal, as in the case of the conventional LED lighting device described above, part of the housing may be made flat and sandwiched between the LED board and the power supply board, but this configuration cannot be adopted when the housing is not made of metal. Even in such cases, the power supply board needs to be covered with a material that is electrically insulating and non-flammable due to maintenance requirements.

そのため、不燃性の樹脂板を電源基板と同じ形状に形成すると共に、その樹脂板に金属テープを貼着したものを隔絶板として形成し、その隔絶板をＬＥＤ基板と電源基板との間に挟むようにしている。 To achieve this, a non-flammable resin plate is formed into the same shape as the power supply board, and a metal tape is attached to the resin plate to form an insulating plate, which is then sandwiched between the LED board and the power supply board.

特開２０１７－９１９１４号公報（段落［００２５］、［００３５］、図１５）JP 2017-91914 A (paragraphs [0025], [0035], FIG. 15)

上記隔絶板を樹脂板で形成する場合には、隔絶板をプレス加工などで打ち抜く工程が別途必要であり、かつ樹脂板に金属テープを貼着する工数も必要になる。このため、隔絶板のコストが高くなり、ＬＥＤ照明装置自体の価格を下げることが困難になる。 If the above-mentioned isolation plate is made of a resin plate, a separate process is required to punch out the isolation plate using a press or other process, and labor is also required to attach the metal tape to the resin plate. This increases the cost of the isolation plate, making it difficult to reduce the price of the LED lighting device itself.

そこで本発明は、上記の問題点に鑑み、隔絶板のコストを可及的に低く抑えることにより隔絶板のコストを安くすることのできるＬＥＤ照明装置を提供することを課題とする。 In view of the above problems, an object of the present invention is to provide an LED lighting device in which the cost of the isolation plate can be reduced by keeping the cost as low as possible.

上記課題を解決するために本発明によるＬＥＤ照明装置は、一方の面にＬＥＤが実装されたＬＥＤ基板と、電子部品が一方の面に実装され、ＬＥＤ基板に実装されたＬＥＤに給電するための電源基板と、ＬＥＤ基板の他方の面と電源基板の他方の面とによって挟まれる隔絶板とを備えたＬＥＤ照明装置において、上記隔絶板を上記ＬＥＤ基板と同一の基板材料で形成したことを特徴とする。 In order to solve the above problems, the LED lighting device of the present invention is an LED lighting device that includes an LED board with LEDs mounted on one side, a power supply board with electronic components mounted on one side for supplying power to the LEDs mounted on the LED board, and an insulating plate sandwiched between the other side of the LED board and the other side of the power supply board, and is characterized in that the insulating plate is made of the same board material as the LED board.

ＬＥＤ基板を構成する基板材料は不燃性であり、隔絶板として使用することができる。また、ＬＥＤ基板としての電気回路をエッチングする前の段階では銅箔が全面に被着されている。従って、エッチングされていない部分を隔絶板として使用することができる。また、ＬＥＤ基板を打ち抜く際に同時に隔絶板を打ち抜くことができるので、隔絶板を打ち抜くための別途の工程を必要としない。また、１枚の基板材料からＬＥＤ基板を打ち抜く際にＬＥＤ基板として使用することができない、いわゆる「捨て」部分が生じるが、その捨て部分も隔絶板として使用することができる。そして、このようにして隔絶板を作成すると別途金属テープを貼着する工数も不要になる。 The substrate material that constitutes the LED board is non-flammable and can be used as an insulating plate. Furthermore, before etching the electrical circuit of the LED board, the entire surface is covered with copper foil. Therefore, the unetched portion can be used as an insulating plate. Furthermore, since the insulating plate can be punched out at the same time as punching out the LED board, a separate process for punching out the insulating plate is not required. Furthermore, when punching out an LED board from a single sheet of substrate material, so-called "throwaway" portions that cannot be used as LED boards are generated, but these throwaway portions can also be used as insulating plates. Furthermore, creating a insulating plate in this way eliminates the need for the additional labor of attaching metal tape.

なお、上記隔絶板の一方の面は全面が銅箔で覆われており、さらに、その銅箔の表面に上記ＬＥＤ基板の一方の面に塗布されているソルダレジストと同じソルダレジストが塗布されており、かつ、この隔絶板の一方の面が上記ＬＥＤ基板の他方の面に対向するようにＬＥＤ基板と電源基板とによって挟まれるように構成すれば、ソルダレジストが銅箔の絶縁性を確保すると共に、隔絶板の一方の面がＬＥＤの一方の面と同色になるので、隔絶板がＬＥＤ基板からはみ出しても目立つことがない。 One side of the isolation plate is entirely covered with copper foil, and the same solder resist as that applied to one side of the LED board is applied to the surface of the copper foil. If the isolation plate is sandwiched between the LED board and the power board so that one side of the isolation plate faces the other side of the LED board, the solder resist ensures the insulation of the copper foil, and the one side of the isolation plate has the same color as the one side of the LED, so that the isolation plate does not stand out even if it protrudes from the LED board.

以上の説明から明らかなように、本発明は、ＬＥＤ基板と電源基板との間に挟み込む隔絶板の製造コストを低く抑えることができるので、ＬＥＤ照明装置の価格を安くすることができる。 As is clear from the above explanation, the present invention can reduce the manufacturing costs of the isolation plate sandwiched between the LED board and the power supply board, thereby reducing the price of the LED lighting device.

本発明によるＬＥＤ照明装置の外観を示す斜視図FIG. 1 is a perspective view showing the appearance of an LED lighting device according to the present invention; 分解状態のＬＥＤ基板と隔絶板と電源基板を示す図A diagram showing the LED board, isolation plate, and power board in a disassembled state. ＬＥＤ照明装置の断面図Cross-sectional view of an LED lighting device ＬＥＤ基板と隔絶板をプレス加工により打ち抜く際の状態を示す図FIG. 13 is a diagram showing the state when the LED board and the insulating plate are punched out by pressing.

図１を参照して、１は本発明によるＬＥＤ照明装置の一例を示す斜視図である。このＬＥＤ照明装置１は不透明な樹脂製の筐体本体１１と、半透明なカバー１２とが上下に合わさっている。そして、このＬＥＤ照明装置１の内部には、図２に示す長尺のＬＥＤ基板２と電源基板３と、これらＬＥＤ基板２と電源基板３とで挟まれる隔絶板４とが収納されている。これらＬＥＤ基板２と電源基板３と隔絶板４とは図３に示すように互いに密着している。 Referring to FIG. 1, 1 is a perspective view showing an example of an LED lighting device according to the present invention. This LED lighting device 1 is made up of an opaque resin housing body 11 and a semi-transparent cover 12, which are joined together vertically. Inside this LED lighting device 1, a long LED board 2 and a power board 3, as shown in FIG. 2, and an insulating plate 4 sandwiched between the LED board 2 and the power board 3 are stored. The LED board 2, the power board 3, and the insulating plate 4 are in close contact with each other, as shown in FIG. 3.

ＬＥＤ基板２の一方の面（図示状態では上面）２１には複数個のＬＥＤ２３が直列に配置されている。そして、この一方の面２１にはＬＥＤ２３からの光を反射するため、白色のソルダレジストが塗布されている。一方、隔絶板４はＬＥＤ基板２と同一の基板素材の一方の面（図示状態では上面）４１全体に銅箔が被着されており、さらにその銅箔の表面全域に白色のソルダレジストが塗布されている。そして、この一方の面４１がＬＥＤ基板２の他方の面（図示状態では下面）２２と接するように重ねられている。 Multiple LEDs 23 are arranged in series on one surface (top surface in the illustrated state) 21 of the LED board 2. This surface 21 is coated with white solder resist to reflect light from the LEDs 23. On the other hand, the isolation plate 4 is made of the same substrate material as the LED board 2, and has copper foil applied to the entire surface of one surface (top surface in the illustrated state) 41. Furthermore, the entire surface of the copper foil is coated with white solder resist. This surface 41 is then layered so that it is in contact with the other surface (bottom surface in the illustrated state) 22 of the LED board 2.

また、電源基板３の一方の面（図示状態では下面）３１側に必要な電子部品が実装されており、他方の面（図示状態では上面）３２には電子部品が実装されていない。従って、図示のように、電源基板３の他方の面３２が隔絶板４に密着するように重ねられる。 The necessary electronic components are mounted on one side (the bottom side in the illustrated state) 31 of the power supply board 3, and no electronic components are mounted on the other side (the top side in the illustrated state) 32. Therefore, as illustrated, the other side 32 of the power supply board 3 is placed on the isolation plate 4 so that it is in close contact with the isolation plate 4.

上記隔絶板４は、ＬＥＤ基板２を打抜き加工によって作成する際に同時に打ち抜くことによって作成する。図４を参照して、１枚の大きな基板母材５は一方の面の全体が銅箔で覆われている。その状態でＬＥＤ基板となる部分について必要な電気回路が構成されるようにエッチング処理を施して不要な銅箔部分を除去する。その際に、隔絶板４となる部分の銅箔はエッチングしない。エッチング後に、ＬＥＤ基板２のハンダ付け部分以外にソルダレジスト６を塗布する。本実施の形態では、上述のように、ＬＥＤ２３からの光を反射させるため、白色のソルダレジスト６を塗布した。なお、隔絶板４となる部分は全面にソルダレジスト６を塗布する。 The above-mentioned isolation plate 4 is created by punching out at the same time as the LED board 2 is created by punching. Referring to FIG. 4, one side of one large board base material 5 is entirely covered with copper foil. In this state, an etching process is performed to remove unnecessary copper foil so that the necessary electrical circuits are formed in the part that will become the LED board. At that time, the copper foil in the part that will become the isolation plate 4 is not etched. After etching, solder resist 6 is applied to the LED board 2 other than the soldered part. In this embodiment, as described above, white solder resist 6 is applied to reflect light from the LED 23. The part that will become the isolation plate 4 is entirely coated with solder resist 6.

ソルダレジスト６が乾くと、ＬＥＤ基板２となる部分と隔絶板４となる部分とを同時に打ち抜くことによってＬＥＤ基板２と隔絶板４とを作成する。なお、ＬＥＤ基板２についてはその後に一方の面２１にクリームハンダを印刷し、ＬＥＤ２３を実装した後で加熱することによってＬＥＤ２３をＬＥＤ基板２にハンダ付けしてＬＥＤ基板２を完成させる。 When the solder resist 6 has dried, the portion that will become the LED board 2 and the portion that will become the isolation plate 4 are punched out at the same time to create the LED board 2 and isolation plate 4. After that, cream solder is printed on one side 21 of the LED board 2, and after the LEDs 23 are mounted, the board is heated to solder the LEDs 23 to the LED board 2, completing the LED board 2.

なお、本発明は上記した形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更を加えてもかまわない。 The present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the spirit of the present invention.

１照明装置
２ＬＥＤ基板
３電源基板
４隔絶板
５基板母材
６ソルダレジスト
１１筐体本体
１２カバー
２３ＬＥＤ
REFERENCE SIGNS LIST 1 Lighting device 2 LED board 3 Power supply board 4 Isolation plate 5 Board base material 6 Solder resist 11 Housing body 12 Cover 23 LED

Claims

An LED lighting device comprising an LED board with LEDs mounted on one side, a power supply board with electronic components mounted on one side for supplying power to the LEDs mounted on the LED board, and an insulating plate sandwiched between the other side of the LED board and the other side of the power supply board, characterized in that the insulating plate is made of the same substrate material as the LED board.

The LED lighting device according to claim 1, characterized in that one surface of the isolation plate is entirely covered with copper foil, and the same solder resist as that applied to one surface of the LED board is applied to the surface of the copper foil, and the isolation plate is sandwiched between the LED board and the power board so that one surface of the isolation plate faces the other surface of the LED board.