JP7543701B2 - Optical fiber housing component, optical module, and method for manufacturing the optical module - Google Patents

Description

The present invention relates to an optical fiber storage component, an optical module, and a method for manufacturing an optical module.

There is known an optical fiber winding bobbin on which an optical fiber is wound. For example, there is known an optical fiber winding bobbin in which a pair of flanges is fixed to both ends of an axial hole part into which a winding shaft is inserted, a winding body is fixed between the pair of flanges coaxially with the axial hole part, and a cushioning material such as silicone rubber is interposed between the winding body and the axial hole part and the flange.

JP 2012-62138 A

In the field of optical communications, optical fibers are connected to electronic components that have functions such as transmitting or receiving light and photoelectric conversion. If electronic components are configured to have optical fibers already connected to them, problems may arise when they are mounted on a circuit board. For example, the optical fibers extending outward from the electronic component may destabilize the mounting posture of the electronic component on the circuit board, causing it to shift out of position, or may collide with other electronic components mounted together with the electronic component, causing them to shift out of position.

In one aspect, the present invention aims to mount electronic components together with optical fibers with high precision.

In one aspect, an optical fiber storage component is provided that includes a bobbin section having one end detachably attached to an electronic component having an outwardly extending optical fiber and around which the optical fiber is wound, and a flange section provided on the other end of the bobbin section, having a return section at the outer edge that is folded back toward the bobbin section, and containing the optical fiber wound around the bobbin section.

In one aspect, an optical module is provided that is obtained by applying an optical fiber housing component to an electronic component that includes an optical fiber, and a method for manufacturing such an optical module is provided.

On one hand, it will be possible to mount electronic components together with optical fibers with high precision.

FIG. 1 is a diagram illustrating an example of an electronic component. 1A to 1C are diagrams illustrating an example of a mounting method for electronic components. FIG. 1 illustrates an example of an optical module. FIG. 1 is a diagram showing one implementation of an electronic component. 1A to 1C are diagrams illustrating examples of handling of optical fibers in an optical fiber-equipped electronic component. 1A to 1C are diagrams illustrating mounting of an optical fiber-equipped electronic component according to a first embodiment. 13A and 13B are diagrams illustrating an example of an optical fiber housing component according to a second embodiment. 13A to 13C are diagrams illustrating an example of mounting an optical fiber housing component according to a second embodiment to an electronic component with an optical fiber. 13A to 13C are diagrams illustrating an example of winding an optical fiber around an optical fiber housing component according to a second embodiment. 13A to 13C are diagrams illustrating an example of a method for winding an optical fiber around an optical fiber housing component according to a second embodiment. 13A to 13C are diagrams illustrating an example of mounting an electronic component with an optical fiber to which an optical fiber housing component according to a second embodiment is attached. 13A to 13C are diagrams illustrating an example of releasing an optical fiber from an optical fiber housing component according to a second embodiment. 13A to 13C are diagrams illustrating an example of removing the optical fiber housing component according to the second embodiment.

First, one embodiment of the electronic component will be described.
1A and 1B are diagrams showing an example of an electronic component, in which Fig. 1A is a schematic plan view of a main part of the example of the electronic component, and Fig. 1B is a schematic side view of a main part of the example of the electronic component.

The electronic component 100 shown in Fig. 1(A) and Fig. 1(B) is an example of a surface mount device (SMD) mounted on a circuit board such as a printed circuit board using a bonding material such as solder. The electronic component 100 includes a component body 101 incorporating electronic elements and optical elements, solder bumps 102 (terminals) provided on one main surface of the component body 101, and an optical fiber 103 connected to the optical element in the component body 101 and extending outward from one side of the component body 101. One or more optical fibers 103 (one fiber is shown as an example in Fig. 1(A) and Fig. 1(B)) are connected to one electronic component 100. The length of the optical fiber 103 is, for example, about 150 mm to 750 mm. The component body 101 is, for example, an electronic component having a function of transmitting or receiving light or a function of photoelectric conversion, an electronic component having a function of optical modulation, etc. By previously connecting and integrating the optical fiber 103 to the component body 101, it is possible to reduce or omit the optical connector components within the electronic component 100 or within an optical module that uses the electronic component 100, making it possible to achieve what is known as an optical connector-less system.

Hereinafter, such an electronic component in which an optical fiber is previously connected to a component body and integrated therewith will also be referred to as an "electronic component with optical fiber."
2A and 2B are diagrams showing an example of a mounting method for electronic components. Fig. 2A is a schematic perspective view of a main part of an example of an arrangement process for electronic components. Fig. 2B is a schematic perspective view of a main part of an example of a reflow process for electronic components.

When mounting an electronic component 100 with optical fibers (in Figs. 2(A) and 2(B) an electronic component 100 with optical fibers connected to three optical fibers 103 is shown as an example) on a circuit board 200, first, as shown in Fig. 2(A), the electronic component 100 with optical fibers is transported above the circuit board 200 to be mounted using a pickup tool of a mounter (not shown).

Then, the solder bumps 102 of the electronic component with optical fiber 100 are aligned with the electrode pads 202 (or the solder formed thereon) of the circuit board 200, and the electronic component with optical fiber 100 is placed at a predetermined position on the circuit board 200, as shown in FIG. 2(B). Reflow is then performed in this state, and the solder bumps 102 of the electronic component with optical fiber 100 (and the solder formed on the electrode pads 202 of the circuit board 200, if any) are melted by heating 105, and then solidified by cooling.

As a result, the electronic component 100 with optical fiber is mounted on the circuit board 200, and an optical module in which the two are electrically and mechanically connected is obtained.
3A and 3B are diagrams showing an example of an optical module, each of which is a schematic plan view of a main part of an example of the optical module.

The optical module 300a shown in FIG. 3(A) has a configuration in which an electronic component 100 with an optical fiber is mounted on a circuit board 200, on which another electronic component 110 and electronic component 120 are further mounted. The tip side of the optical fiber 103 extending from the electronic component 100 with an optical fiber mounted on the circuit board 200 is connected to the electronic component 110 mounted on the circuit board 200 together with the electronic component 100 with an optical fiber.

The electronic component 110 is an electronic component having a function of transmitting or receiving light or a function of photoelectric conversion, an electronic component having a function of optical modulation, or an optical connector component, in which light is transmitted between the electronic component 100 with the optical fiber through the optical fiber 103. The electronic component 120 is an electronic component having a function such as a transistor, resistor, or capacitor that is electrically connected to the electronic component 100 with the optical fiber or the electronic component 110 through the circuit board 200 (wiring formed thereon, not shown). The electronic components 110 and 120 are mounted on the circuit board 200 using solder bumps, similar to the electronic component 100 with the optical fiber.

The optical module 300b shown in FIG. 3B includes a circuit board 200 on which an optical fiber-equipped electronic component 100 is mounted, and a circuit board 201 on which electronic components 110 and 120 are mounted. The tip side of the optical fiber 103 extending from the optical fiber-equipped electronic component 100 mounted on the circuit board 200 is connected to an electronic component 110 mounted on a circuit board 201 different from the circuit board 200.

The electronic component 110 is an electronic component having a function of transmitting or receiving light or a function of photoelectric conversion, an electronic component having a function of optical modulation, or an optical connector component, in which light is transmitted between the electronic component 100 with the optical fiber through the optical fiber 103. The electronic component 120 is an electronic component having a function such as a transistor, resistor, or capacitor, which is electrically connected to the electronic component 110 through the circuit board 201 (wiring formed thereon, not shown). The electronic components 110 and 120 are each mounted on the circuit board 201 using solder bumps, similar to the electronic component 100 with the optical fiber.

However, when mounting the electronic component 100 with optical fiber as described above, the presence of the optical fiber 103 extending outward may make it difficult to mount it by reflow (also called "reflow mounting"). When mounting multiple electronic components on a circuit board, it is preferable to mount the multiple electronic components collectively by reflow (also called "collectively reflow mounting") from the standpoints of using a common solder material, reducing labor hours, and improving manufacturing efficiency. However, the presence of the optical fiber 103 extending outward may make it difficult to mount it collectively with other electronic components by reflow.

For example, in the case of the optical module 300a shown in FIG. 3A, the optical fiber 103 gets in the way, and it may not be possible to use a mounter or a reflow furnace that can be used to mount the other electronic components 110 and 120 on the electronic component 100 with the optical fiber. In addition, when the electronic component 100 with the optical fiber is reflow mounted, or when the electronic component 100 is reflow mounted together with the other electronic components 110 and 120, the presence of the optical fiber 103 may cause the mounting posture of the electronic component 100 with the optical fiber to become unstable, resulting in misalignment. In the case of the reflow mounting together with the other electronic components 110 and 120, the optical fiber 103 of the electronic component 100 with the optical fiber may collide with the other electronic components 110 and 120, resulting in misalignment of the electronic components 110 and 120, or misalignment of the electronic component 100 with the optical fiber.

In the case of the optical module 300b shown in FIG. 3B above, the same thing can happen when the electronic component 100 with the optical fiber is reflow mounted, or when it is reflow mounted together with the other electronic components 110 and 120.

Fig. 4 is a diagram showing one embodiment of a mounting form of an electronic component, which is a schematic plan view of a main part of one embodiment of a mounting form of an electronic component.
4 shows an example of a form in which the optical fiber-equipped electronic component 100 is mounted on a large-sized circuit board 210 including a plurality of circuit board units 211 (four in FIG. 4 as an example). A cutting area 211a is provided around each circuit board unit 211 for cutting the circuit board units 211 to separate them from the large-sized circuit board 210. The optical fiber-equipped electronic component 100 and other electronic components 130 are mounted on each circuit board unit 211 surrounded by the cutting area 211a. The electronic components 130 are mounted on the circuit board unit 211 using solder bumps, similar to the optical fiber-equipped electronic component 100. The optical fibers 103 of the optical fiber-equipped electronic component 100 may be bundled in a ring shape, for example, as shown in FIG. 4. After the optical fiber-equipped electronic component 100 and the electronic components 130 are mounted, each circuit board unit 211 is cut at the cutting area 211a around the circuit board unit 211 and separated from the large-sized circuit board 210 to obtain individual optical modules.

When mounting the electronic component 100 with optical fiber and the group of electronic components 130, for example, the electronic component 100 with optical fiber and the group of electronic components 130 are placed on all of the multiple circuit board units 211 on the large circuit board 210 before cutting, and collective reflow mounting is performed. In this case, as in the above, the optical fibers 103 extending outward from the electronic component 100 with optical fiber may get in the way, making it impossible to use a mounter or reflow oven that can be used to mount other groups of electronic components 130. In addition, during collective reflow mounting, the presence or collision of the optical fibers 103 may cause the electronic component 100 with optical fiber or the group of electronic components 130 to become misaligned.

In addition, even if the electronic component 100 with optical fiber is reflow mounted separately from other electronic components 130, the optical fiber 103 may cause the mounting posture of the electronic component 100 with optical fiber to become unstable, resulting in misalignment.

Here, as a way of handling the optical fiber 103 extending outward from the electronic component 100 with optical fiber, it is also possible to form the optical fiber 103 into a ring shape and place it on top of the electronic component 100 with optical fiber.

Figure 5 is a diagram showing an example of handling an optical fiber in an electronic component with optical fiber. Figure 5(A) is a diagram explaining an electronic component with optical fiber in which the optical fiber is shaped like a ring, and Figure 5(A) shows a schematic side view of the component. Figures 5(B) and 5(C) are diagrams explaining an electronic component with optical fiber that uses an optical fiber guide, and Figure 5(B) shows a schematic plan view of the component, and Figure 5(C) shows a schematic V-V cross-sectional view of Figure 5(B).

Consider bending the optical fiber 103 extending outward from the electronic component with optical fiber 100 into a ring shape as shown in FIG. 5(A), for example, and placing it on the electronic component with optical fiber 100. However, the optical fiber 103 has elasticity, and when it is bent into a ring shape, a reaction force acts, so it is likely to spread out above and to the sides of the electronic component with optical fiber 100 and break apart, as shown by the arrows in FIG. 5(A). If the optical fiber 103 breaks apart due to the reaction force of the bending, it can lead to instability in the mounting posture of the electronic component with optical fiber 100. Even if the optical fiber 103 is simply formed into a ring shape, it may be difficult to reflow mount the electronic component with optical fiber 100 with high precision, or to reflow mount it together with other electronic components with high precision.

As another example, as shown in Fig. 5(B) and Fig. 5(C), an optical fiber guide 400 having an axis 401 and a pair of walls 402 facing each other across the axis 401 is attached to the top of the electronic component with optical fiber 100, and the optical fiber 103 is arranged in a ring shape around the axis 401. Note that the optical fiber 103 is not shown in Fig. 5(B) for convenience. When such an optical fiber guide 400 is used, the optical fiber 103 is prevented from spreading and scattering above and to the sides of the electronic component with optical fiber 100. However, the optical fiber 103 is likely to spread and scatter below the electronic component with optical fiber 100 as shown by the arrow in Fig. 5(C). If the optical fiber 103 scatters due to the reaction force of bending, it will cause the mounting posture of the electronic component with optical fiber 100 to become unstable. Even if such an optical fiber guide 400 is used, it may be difficult to reflow mount the electronic component 100 with optical fiber with high precision, or to collectively reflow mount it with other electronic components with high precision.

In view of the above, a method as shown in the following embodiment is used to achieve high-precision mounting of an electronic component with an optical fiber that is mounted by reflow, or of an electronic component with an optical fiber and an electronic component that is mounted together with the electronic component by reflow. In other words, high-precision mounting of an electronic component together with an optical fiber is achieved.

[First embodiment]
Fig. 6 is a diagram for explaining mounting of an electronic component with an optical fiber according to the first embodiment. Fig. 6(A) is a schematic cross-sectional view of a main part of a process of winding an optical fiber around an optical fiber housing component. Fig. 6(B) is a schematic cross-sectional view of a main part of a process of mounting an electronic component with an optical fiber. Fig. 6(C) is a schematic cross-sectional view of a main part of a process of removing the optical fiber housing component.

An electronic component 10 with an optical fiber shown in FIG. 6A is an example of an SMD that is mounted on a circuit board such as a printed circuit board by using a bonding material such as solder.
The electronic component 10 with optical fiber includes a component body 11 incorporating an electronic element and an optical element, solder bumps 12 (terminals) provided on one main surface of the component body 11, and an optical fiber 13 connected to the optical element in the component body 11 and extending outward from one side surface of the component body 11. One or more optical fibers 13 are connected to the electronic component 10 with optical fiber. The length of the optical fiber 13 is, for example, about 150 mm to 750 mm. The component body 11 is, for example, an electronic component having a function of transmitting or receiving light or a function of photoelectric conversion, an electronic component having a function of optical modulation, etc. By previously connecting and integrating the optical fiber 13 with the component body 11, it becomes possible to reduce or omit the optical connector components in the electronic component 10 with optical fiber or the optical module using it.

As shown in FIG. 6A, an optical fiber housing component 40 is attached on the electronic component 10 with an optical fiber.
The optical fiber storage component 40 has a bobbin part 41, one end 41a of which is detachably attached to the optical fiber-equipped electronic component 10, and a flange part 42 provided on the other end 41b of the bobbin part 41. As shown in Fig. 6(A), one end 41a of the bobbin part 41 of the optical fiber storage component 40 is attached to the main surface of the optical fiber-equipped electronic component 10 opposite to the main surface on which the solder bumps 12 are provided, and the optical fiber 13 of the optical fiber-equipped electronic component 10 is wound around the bobbin part 41. The flange part 42 has a return part 42a provided on the outer edge. The return part 42a has a shape that extends downward (to the end 41a side of the bobbin part 41 or the optical fiber-equipped electronic component 10 side) from the side edge of the flange part 42 extending laterally from the bobbin part 41, and is further folded back from there to the bobbin part 41 side. The optical fiber 13 (most of it) wound around the bobbin portion 41 is housed inside the flange portion 42 having such a return portion 42a.

The optical fiber 13 is wound around the bobbin portion 41 at a radius equal to or greater than the minimum bending radius required to avoid breakage due to bending. Even if the optical fiber 13 wound around the bobbin portion 41 spreads due to the reaction force caused by bending during winding, it is received on the inside by the flange portion 42 having the return portion 42a. The optical fiber 13 is stored in the optical fiber storage component 40 at a radius equal to or greater than the minimum bending radius.

The electronic component 10 with optical fiber 13 wound around the bobbin part 41 of the optical fiber storage component 40 is placed on the circuit board 20 on which it will be mounted, as shown in FIG. 6(B), and is mounted by reflow.

Here, the optical fiber storage component 40 has a surface 41c on the end 41b side of the bobbin part 41 for suction by the pickup tool of the mounter. The surface 41c of the bobbin part 41 is suctioned by the pickup tool, and the optical fiber-equipped electronic component 10 with the optical fiber storage component 40 attached is transported above the circuit board 20. Then, the solder bumps 12 of the optical fiber-equipped electronic component 10 are aligned with the electrode pads 22 (or the solder formed thereon) of the circuit board 20, and the optical fiber-equipped electronic component 10 is placed at a predetermined position on the circuit board 20 as shown in FIG. 6(B). From that state, reflow is performed to melt the solder bumps 12 of the optical fiber-equipped electronic component 10 (and the solder if formed on the electrode pads 22 side of the circuit board 20), and then solidify by cooling. As a result, the optical fiber-equipped electronic component 10 with the optical fiber storage component 40 attached is mounted on the circuit board 20, and the two are electrically and mechanically connected.

After the electronic component 10 with optical fiber attached to the optical fiber storage component 40 is mounted on the circuit board 20, the optical fiber 13 that was wound around the bobbin portion 41 and housed inside the flange portion 42 with the return portion 42a is released to the outside of the optical fiber storage component 40. The optical fiber storage component 40 from which the optical fiber 13 has been released has the end portion 41a of the bobbin portion 41 released, and is removed from the electronic component 10 with optical fiber as shown in FIG. 6(C). This results in an optical module 1 in which the electronic component 10 with optical fiber is mounted on the circuit board 20.

As described above, the optical fiber storage component 40 can be attached to and detached from the optical fiber-equipped electronic component 10, and can also be adsorbed by a pickup tool. In the optical fiber storage component 40, the optical fiber 13 wound around the bobbin portion 41 is stored inside the flange portion 42 having the return portion 42a, and the optical fiber 13 is prevented from spreading outward from the optical fiber-equipped electronic component 10, i.e., upward, sideways, and downward, and becoming scattered. The electronic component 10 with optical fiber attached is transported to the circuit board 20 by a pickup tool with the optical fiber storage component 40 attached and the optical fiber 13 stored in the optical fiber storage component 40, and is mounted on the circuit board 20 by reflow.

When the electronic component 10 with optical fiber is transported, the optical fiber 13 is stored in the optical fiber storage component 40 (inside the flange portion 42 with its return portion 42a), so the optical fiber 13 is prevented from interfering with the transport. By using the optical fiber storage component 40, it becomes possible to apply the pickup tool of a mounter used in conventional surface mount technology (SMT), that is, the pickup tool of a mounter used to mount electronic components that do not have optical fiber 13, even to the electronic component 10 with optical fiber. It becomes possible to realize automatic adsorption, transport, and placement of the electronic component 10 with optical fiber using the pickup tool.

When mounting the electronic component 10 with optical fiber, the optical fiber 13 is stored in the optical fiber storage component 40 (inside the flange portion 42 with its return portion 42a), so the optical fiber 13 is prevented from destabilizing the mounting posture of the electronic component 10 with optical fiber and causing misalignment. Furthermore, even when other electronic components (not shown) are mounted together with the electronic component 10 with optical fiber by reflow mounting on the circuit board 20, the optical fiber 13 of the electronic component 10 with optical fiber is prevented from colliding with the other electronic components and causing misalignment.

After mounting the electronic component 10 with optical fiber on the circuit board 20, the optical fiber 13 is released from the optical fiber housing component 40, and the optical fiber housing component 40 from which the optical fiber 13 has been released is removed from the electronic component 10 with optical fiber. This results in an optical module 1 that does not include the optical fiber housing component 40 and has a reduced height.

By using the optical fiber housing component 40, it is possible to realize high-precision mounting of the electronic component 10 with optical fiber, and high-precision mounting of electronic components that are reflowed together with the electronic component 10 with optical fiber. In addition, even if the optical fiber housing component 40 is used, it is possible to realize an optical module 1 with a reduced height by making it possible to remove the optical fiber housing component 40.

[Second embodiment]
7A and 7B are diagrams for explaining an example of an optical fiber housing component according to the second embodiment. Fig. 7A is a schematic plan view of a main part of the example of the optical fiber housing component. Fig. 7B is a schematic cross-sectional view of a main part of the example of the optical fiber housing component. Fig. 7B is a view corresponding to the cross section taken along line VII-VII in Fig. 7A.

The optical fiber storage component 80 shown in Figures 7(A) and 7(B) includes a bobbin portion 81, a flange portion 82, an attachment portion 83, a guide portion 84, and a fixing portion 85. The optical fiber storage component 80 is designed to be able to be attached to an electronic component with an optical fiber. In addition, the optical fiber storage component 80 attached to an electronic component with an optical fiber is designed to be able to be removed from the electronic component with an optical fiber. In other words, the optical fiber storage component 80 is designed to be detachable from the electronic component with an optical fiber.

The bobbin portion 81 of the optical fiber storage component 80 is cylindrical, and an attachment portion 83 is provided on one end 81a side thereof, and a flange portion 82 is provided on the other end 81b side thereof. For example, a harder material is used for the bobbin portion 81 than the attachment portion 83 and the flange portion 82. The attachment portion 83 and the flange portion 82 are provided, for example, on the side peripheral surface of the bobbin portion 81, and are formed as an integrally molded product using a softer elastic material than the bobbin portion 81, with the portion on the end 81a side of the bobbin portion 81 being the attachment portion 83, and the portion on the end 81b side being the flange portion 82. For the bobbin portion 81, a relatively hard material such as resin, ceramic, or metal is used, and for the attachment portion 83 and the flange portion 82, a relatively soft material such as rubber or silicone is used. A relatively soft mounting portion 83 and flange portion 82 are integrated with a relatively hard bobbin portion 81 to form an optical fiber storage component 80 having a hard-soft composite bobbin structure. The optical fiber storage component 80 is rotated around the center 80a of the bobbin portion 81, and the optical fiber of the optical fiber-equipped electronic component to which the optical fiber storage component 80 is attached is wound around the bobbin portion 81. In addition, a surface 81c for suction by a pickup tool is provided on the end portion 81b side of the bobbin portion 81.

The mounting portion 83 of the optical fiber storage component 80 can be attached to and detached from an electronic component with an optical fiber. The mounting portion 83 is provided with a hook portion 83a that is hooked onto the end of the electronic component with an optical fiber to maintain the mounting state to the electronic component with an optical fiber. For example, the hook portion 83a has a structure that is engaged with the end of the electronic component with an optical fiber and is released by pressing.

For example, in the case of a planar rectangular electronic component with optical fiber, the hook portion 83a of the mounting portion 83 is provided so as to engage with the ends (corners) of the four corners. Alternatively, the hook portion 83a may be provided so as to engage with two diagonally positioned corners of the four corners of the planar rectangular electronic component with optical fiber. The hook portion 83a may be provided so as to engage with the ends (sides) of the four sides of the planar rectangular electronic component with optical fiber excluding the four corners, or may be provided so as to engage with two opposing sides of the four sides, or with the sides and the corners at both ends of each of the two sides. The hook portion 83a may be provided so as to engage with the ends of the entire circumference of the electronic component with optical fiber.

The mounting part 83 attached to the electronic component with optical fiber is removed from the electronic component with optical fiber by releasing the hook part 83a and releasing the attachment state maintained by the hook part 83a. In other words, by removing the mounting part 83, the optical fiber storage part 80 including the mounting part 83, the flange part 82, and the bobbin part 81 around which they are arranged is removed from the electronic component with optical fiber.

The hook portion 83a of the mounting portion 83 is made of a material that has elasticity such that it can be hooked onto the end of an electronic component with optical fiber when the mounting portion 83 is attached, can be deformed when it is removed from the end, and returns to the shape it had before it was hooked onto the end after it is removed.

The flange portion 82 of the optical fiber storage component 80 has a return portion 82a provided on the outer edge. The return portion 82a extends downward (toward the end portion 81a of the bobbin portion 81 or toward the mounting portion 83) from the side edge of the flange portion 82 that extends laterally from the bobbin portion 81, and then has a shape that turns back from there toward the bobbin portion 81. The optical fiber (most of it) of the electronic component with optical fiber that is wound around the bobbin portion 81 is stored inside the flange portion 82 that has such a return portion 82a.

The folded portion 82a of the flange portion 82 is made of a material that has elasticity that allows it to be deformed by an external force so that it spreads outward, and returns to its original state when the external force is removed.

The flange portion 82 has, for example, four cutout portions 82b in plan view. These cutout portions 82b give the flange portion 82 a shape that extends in all four directions from the bobbin portion 81 in plan view. Here, an example is shown in which four cutout portions 82b are provided and the flange portion 82 has a shape that extends in all four directions, but the number of cutout portions 82b is not limited to this, and for example, three cutout portions 82b can be provided and the flange portion 82 can have a shape that extends in three directions.

By providing the notch 82b in the flange 82, it becomes easier to visually check the state of the optical fiber wound around the bobbin 81, such as the bending radius of the optical fiber wound in a ring shape and the degree of overlap, from the flange 82 side of the optical fiber storage component 80. In addition, by providing the notch 82b, during reflow mounting that involves heating, heat applied from the flange 82 side of the optical fiber storage component 80 passes through the notch 82b and is more easily transmitted to the electronic component with optical fiber placed underneath.

The guide portion 84 of the optical fiber storage component 80 is provided opposite the flange portion 82. A relatively soft elastic material, such as the same material as the flange portion 82 and the mounting portion 83, is used for the guide portion 84. The optical fiber of the electronic component with optical fiber, which is wound around the bobbin portion 81, is housed between the flange portion 82 and the guide portion 84 provided opposite it. The guide portion 84 has the function of preventing the optical fiber housed inside the flange portion 82 with the return portion 82a from falling off toward the mounting portion 83.

The guide portion 84 is made of a material that has elasticity such that it can be deformed even when it hits the optical fiber of an electronic component with optical fiber when it is passed through the inside of the flange portion 82, and returns to its original shape after the optical fiber hits it and is passed through. For example, the guide portion 84 is made of a relatively soft material such as rubber or silicone.

The fixing part 85 of the optical fiber storage component 80 is provided on the end 81b side of the bobbin part 81 where the flange part 82 is provided, facing the flange part 82. The fixing part 85 may be provided with a gap between it and the flange part 82. A relatively soft elastic material, for example the same material as the flange part 82 and the mounting part 83, is used for the fixing part 85. Slit parts 85a are provided on both sides of the fixing part 85 facing the flange part 82, so that the fixing part 85 can deform so that its outer edge part moves away from the flange part 82. The tip of the optical fiber of the electronic component with optical fiber, which is wound around the bobbin part 81 and stored inside the flange part 82, is temporarily fixed by being sandwiched between the fixing part 85 and the flange part 82.

The fixing portion 85 is made of a material that has elasticity such that it can be deformed so that the outer edge of the fixing portion 85 moves away from the flange portion 82 when the optical fiber is sandwiched between the fixing portion 85 and the flange portion 82, and returns to its original shape when the optical fiber is removed from between the fixing portion 85 and the flange portion 82. For example, the fixing portion 85 is made of a relatively soft material such as rubber or silicone.

Figure 8 is a diagram for explaining an example of mounting an optical fiber housing component according to the second embodiment to an electronic component with an optical fiber. Figure 8(A) shows a schematic plan view of the essential parts of an example of the optical fiber housing component mounted state. Figure 8(B) shows a schematic cross-sectional view of the essential parts of an example of the optical fiber housing component mounted state. Figure 8(B) is a diagram corresponding to the VIII-VIII cross section of Figure 8(A).

The optical fiber storage component 80 is attached to the electronic component 50 with optical fiber when the electronic component 50 with optical fiber is mounted on a circuit board, for example, as shown in Figures 8(A) and 8(B).

The electronic component with optical fiber 50 shown in Figures 8(A) and 8(B) is an example of an SMD that is mounted on a circuit board such as a printed circuit board using a bonding material such as solder. For convenience, the position of the electronic component with optical fiber 50 is shown by a solid line in Figure 8(A).

The electronic component with optical fiber 50 includes a component body 51 that incorporates electronic and optical elements, solder bumps 52 (terminals) provided on one main surface of the component body 51, and an optical fiber 53 that is connected to the optical element in the component body 51 and extends outward from one side of the component body 51. One or more optical fibers 53 are connected to the electronic component with optical fiber 50. The length of the optical fiber 53 is, for example, about 150 mm to 750 mm. The component body 51 is, for example, an electronic component with a function of transmitting or receiving light or a function of photoelectric conversion, an electronic component with a function of optical modulation, etc. By previously connecting and integrating the optical fiber 53 with the component body 51, it is possible to reduce or omit the optical connector components in the electronic component with optical fiber 50 or the optical module using it.

As shown in Figures 8(A) and 8(B), an optical fiber storage component 80 is mounted on such an electronic component with optical fiber 50. The optical fiber storage component 80 is mounted on the electronic component with optical fiber 50 by mounting its mounting portion 83 on the main surface of the electronic component with optical fiber 50 opposite the main surface on which the solder bumps 52 are provided. The mounting portion 83 is mounted so that its hook portion 83a is hooked onto the end of the electronic component with optical fiber 50. This maintains the mounting portion 83, i.e., the optical fiber storage component 80 including it, mounted on the electronic component with optical fiber 50.

Figure 9 is a diagram for explaining an example of winding an optical fiber onto an optical fiber storage component according to the second embodiment. Figure 9(A) shows a schematic plan view of the essential parts of an example of the optical fiber winding process. Figure 9(B) shows a schematic cross-sectional view of the essential parts of an example of the optical fiber winding process. Figure 9(B) is a diagram corresponding to the IX-IX cross section of Figure 9(A).

The optical fiber 53 extending outward from the electronic component with optical fiber 50 is wound around the optical fiber housing component 80 attached to the electronic component with optical fiber 50 as described above. When winding the optical fiber 53, first, the electronic component with optical fiber 50 to which the optical fiber housing component 80 is attached is placed on a rotation stage 70 as shown in Figures 9(A) and 9(B).

The rotating stage 70 includes a fixed frame guide 71 and an optical fiber guide 72 .
The fixed frame guide 71 is provided at a position corresponding to an end of the optical fiber-equipped electronic component 50. The optical fiber-equipped electronic component 50 to which the optical fiber housing component 80 is attached is disposed inside the fixed frame guide 71 and is fixed so that lateral movement is restricted.

The optical fiber guide 72 is disposed in the fixed frame guide 71 at a position spaced from the optical fiber-equipped electronic component 50 to which the optical fiber storage component 80 is attached. The optical fiber guide 72 is a columnar or cylindrical member that is sector-shaped in plan view, and is disposed so that the curved surface 72a faces outward. The curved surface 72a of the optical fiber guide 72 is set to a radius 72b equal to or greater than the minimum bending radius that can avoid breakage of the optical fiber 53 due to excessive bending.

The electronic component 50 with optical fiber attached to the optical fiber storage component 80 is placed and fixed inside the fixed frame guide 71. The optical fiber 53 of the electronic component 50 with optical fiber is passed through the outside of the curved surface 72a of the optical fiber guide 72. Then, the rotating stage 70 is rotated in a predetermined direction 70a around the center 80a of the optical fiber storage component 80 (its bobbin part 81).

As the rotating stage 70 rotates, the optical fiber 53 of the electronic component 50 with optical fiber is wound around the bobbin portion 81 of the optical fiber storage component 80 with a minimum bending radius or greater so that it is passed between the return portion 82a and the guide portion 84 of the flange portion 82 and stored inside the flange portion 82. When the optical fiber 53 is wound in this manner, a certain tension (also called "tension") is applied to the optical fiber 53 to prevent it from bending.

Figure 10 is a diagram illustrating an example of a method for winding an optical fiber onto an optical fiber storage component according to the second embodiment. Figure 10(A) shows a schematic cross-sectional view of a main part of an example of a first stage in the optical fiber winding process. Figure 10(B) shows a schematic cross-sectional view of a main part of an example of a second stage in the optical fiber winding process. Figure 10(C) shows a schematic cross-sectional view of a main part of an example of a third stage in the optical fiber winding process.

As shown in FIG. 10(A), as the rotating stage 70 rotates, the optical fiber 53 of the electronic component 50 with optical fiber is gradually wound around the inside of the flange portion 82 around the bobbin portion 81 of the optical fiber storage component 80 with a minimum bending radius or greater. The guide portion 84 prevents the optical fiber 53 from falling off during or after it has been wound.

The optical fiber 53 is wound while being given a certain tension. For example, the tension may be loosened during winding, and the optical fiber 53 wound around the bobbin portion 81 may be spread outward by the reaction force of bending (shown by the solid arrows) as shown in FIG. 10(B), to ensure space inside the flange portion 82 for winding the remaining optical fiber 53. Even if the tension is loosened and the optical fiber 53 is spread, the flange portion 82 with the return portion 82a and the guide portion 84 prevent the optical fiber 53 from spreading outward from the optical fiber storage component 80.

When the flange portion 82 has the notch portion 82b, it becomes easier to visually check the condition of the optical fiber 53 wound around the bobbin portion 81 from the flange portion 82 side, such as its bending radius, the degree of overlap or spread, and whether there is any space remaining for winding.

The tip of the optical fiber 53 wound around the bobbin portion 81 of the optical fiber storage component 80 on the inside of the flange portion 82 is sandwiched and fixed between the fixing portion 85 and the flange portion 82 as shown in FIG. 10(C). This maintains the state in which the optical fiber 53 is wound and stored in the optical fiber storage component 80.

Figure 11 is a diagram for explaining an example of mounting an electronic component with an optical fiber mounted with an optical fiber housing component according to the second embodiment. Figure 11(A) shows a schematic cross-sectional view of a key part of an example of a transport and placement process for an electronic component with an optical fiber mounted with an optical fiber housing component. Figure 11(B) shows a schematic cross-sectional view of a key part of an example of a reflow process for an electronic component with an optical fiber mounted with an optical fiber housing component.

The optical fiber-equipped electronic component 50, in which the optical fiber 53 is wound around the optical fiber storage component 80 as described above, is picked up by a pickup tool 90 of a mounter, as shown in FIG. 11(A). The pickup tool 90 is adsorbed to an adsorption surface 81c provided on the relatively hard bobbin portion 81 of the optical fiber storage component 80. For example, the diameter of the bobbin portion 81 of the optical fiber storage component 80 or the diameter of the surface 81c of the bobbin portion 81 is set based on the size of the adsorption device (nozzle, etc.) of the pickup tool 90 used.

The optical fiber-equipped electronic component 50, in which the optical fiber 53 is wound around the optical fiber storage component 80, is transported above the circuit board 60 by the pickup tool 90, and its solder bumps 52 are aligned with the electrode pads 62 (or the solder formed thereon) of the circuit board 60, and then placed on the circuit board 60.

The optical fiber-attached electronic component 50, which has an optical fiber 53 wound around an optical fiber housing component 80, is transported by a pickup tool 90 and placed on a circuit board 60, which is then sent to a reflow furnace for reflow. In the reflow, as shown in FIG. 11(B), the solder bumps 52 of the optical fiber-attached electronic component 50 (and the solder, if present on the electrode pads 62 of the circuit board 60) are melted by heating 91, and then solidified by cooling. As a result, the optical fiber-attached electronic component 50 is mounted on the circuit board 60, and the two are electrically and mechanically connected.

When the flange portion 82 has the notch portion 82b, during reflow mounting involving heating 91, the heat applied from the flange portion 82 side of the optical fiber housing component 80 passes through the notch portion 82b and is easily transferred to the optical fiber-equipped electronic component 50 and the circuit board 60. This makes it possible to set the heating 91 to a relatively low temperature or to perform the heating 91 for a relatively short period of time, thereby making it possible to suppress damage caused by the heating 91 to the optical fiber-equipped electronic component 50 and the circuit board 60.

When transporting and placing (FIG. 11(A)) and reflow mounting (FIG. 11(B)) the electronic component 50 with optical fiber 53 wound around the optical fiber storage component 80, the optical fiber 53 is stored in the optical fiber storage component 80. Therefore, the optical fiber 53 of the electronic component 50 with optical fiber does not get in the way, and the pickup tool 90 of the mounter used in the conventional surface mounting technology and the pickup tool 90 of the mounter used for mounting electronic components without optical fiber 53 can be applied. It becomes possible to automatically pick up, transport, and place the electronic component 50 with optical fiber using the pickup tool 90.

The optical fiber 53 also prevents the mounting posture of the optical fiber-equipped electronic component 50 from becoming unstable, and prevents the optical fiber-equipped electronic component 50 (its solder bumps 52) from shifting in position relative to the circuit board 60 (its electrode pads 62). Furthermore, even when other electronic components are collectively reflow-mounted on the circuit board 60 together with the optical fiber-equipped electronic component 50, the optical fiber 53 of the optical fiber-equipped electronic component 50 is prevented from colliding with the other electronic components and causing them to shift in position.

By attaching the optical fiber housing component 80 and winding the optical fiber 53 around it, high-precision mounting of the electronic component 50 with optical fiber and high-precision mounting of electronic components that are reflowed together with the electronic component 50 with optical fiber can be achieved.

Figure 12 is a diagram for explaining an example of releasing an optical fiber from an optical fiber storage component according to the second embodiment. Figure 12(A) shows a schematic cross-sectional view of a key part of an example of a deformation process of a return part. Figure 12(B) shows a schematic cross-sectional view of a key part of an example of a process of releasing an optical fiber by deformation of a return part.

After the electronic component 50 with optical fiber is mounted on the circuit board 60, the optical fiber 53 is removed from the optical fiber storage component 80 attached to the electronic component 50 with optical fiber.

At that time, first, the elastic return portion 82a of the relatively soft flange portion 82 of the optical fiber storage component 80 attached to the optical fiber-equipped electronic component 50 is rolled up by an external force and spread outward as shown in Figs. 12(A) and 12(B). In this way, the return portion 82a of the flange portion 82 is spread outward, and further, the tip of the optical fiber 53 fixed to the fixing portion 85 is removed from the fixing portion 85. As a result, as shown in Fig. 12(B), the optical fiber 53 wound around the bobbin portion 81 is spread outward by the reaction force of the bending (shown by the solid arrow), released from the inside of the flange portion 82, and removed from the optical fiber storage component 80. When the external force spreading outward is removed, the return portion 82a of the flange portion 82 returns to its original state before being spread outward due to its elasticity.

Figure 13 is a diagram explaining an example of removing an optical fiber storage component according to the second embodiment. Figure 13(A) shows a schematic cross-sectional view of a main part of an example of a process for releasing a hook portion. Figure 13(B) shows a schematic cross-sectional view of a main part of an example of a process for removing an optical fiber storage component by releasing a hook portion.

The optical fiber housing component 80 from which the optical fiber 53 has been removed is removed from the optical fiber-equipped electronic component 50 .
In this case, first, the elastic hook portion 83a of the relatively soft mounting portion 83 is pressed or otherwise removed from the end of the optical fiber-equipped electronic component 50 as shown in Fig. 13(A). Then, with the hook portion 83a removed, the optical fiber housing component 80 is removed from the optical fiber-equipped electronic component 50 as shown in Fig. 13(B). In this way, the optical module 2 in which the optical fiber-equipped electronic component 50 is mounted on the circuit board 60 is obtained.

In this way, the optical fiber storage component 80 that winds up the optical fiber 53 during the transportation and placement (FIG. 11(A)) and reflow mounting (FIG. 11(B)) of the electronic component 50 with optical fiber is removed after mounting, resulting in an optical module 2 with a reduced height.

By using the optical fiber housing component 80 having the above-mentioned configuration, it becomes possible to mount the electronic component 50 with the optical fiber by applying the pickup tool 90 of a mounter used in conventional surface mounting technology. In addition, the instability of the mounting posture of the electronic component 50 with the optical fiber due to the optical fiber 53 and the resulting positional deviation are suppressed. Furthermore, when the electronic component 50 with the optical fiber and other electronic components are mounted together on the circuit board 60 by reflow mounting, collision of the optical fiber 53 with the other electronic components and the resulting positional deviation of the other electronic components are suppressed.

By attaching the optical fiber housing component 80 and winding the optical fiber 53 around it, high-precision mounting of the electronic component 50 with optical fiber and high-precision mounting of electronic components that are reflowed together with the electronic component 50 with optical fiber can be achieved.

The following supplementary notes are further provided with respect to the embodiment described above.
(Note 1) A bobbin part, one end of which is detachably attached to an electronic component having an optical fiber extending outward, and around which the optical fiber is wound;
a flange portion provided on the other end side of the bobbin portion, the flange portion having a folded portion at an outer edge portion that is folded back toward the bobbin portion, and the flange portion that houses the optical fiber wound around the bobbin portion.

(Additional Note 2) The bobbin portion includes a mounting portion that is provided on the one end side of the bobbin portion and is detachable from the electronic component,
The optical fiber storage component described in Appendix 1 is characterized in that the mounting portion has a hook portion that is hooked onto the electronic component when mounted on the electronic component, and the optical fiber storage component can be removed from the electronic component by releasing the hook portion from the state where it is mounted on the electronic component.

(Additional Note 3) The return portion has elasticity,
3. The optical fiber storage component according to claim 1 or 2, characterized in that the optical fiber wound around the bobbin portion is released by spreading the turned portion outward.

(Appendix 4) The optical fiber storage component according to any one of appendices 1 to 3, characterized in that the bobbin portion has a surface for suction by a pickup tool of a mounter on the other end side where the flange portion is provided.

(Supplementary Note 5) The optical fiber housing component according to any one of Supplementary Notes 1 to 4, wherein the flange portion has a plurality of notches when viewed from the other end side of the bobbin portion.
(Appendix 6) An optical fiber storage component described in any one of Appendices 1 to 5, characterized in that it includes a guide portion provided on the bobbin portion opposite the flange portion, for holding the optical fiber wound around the bobbin portion between the bobbin portion and the flange portion.

(Appendix 7) The optical fiber storage component according to any one of appendices 1 to 6, characterized in that it includes a fixing portion provided on the bobbin portion opposite the flange portion, and which temporarily fixes a portion of the optical fiber wound around the bobbin portion by sandwiching it between the bobbin portion and the flange portion.

(Supplementary Note 8) An electronic component having an optical fiber extending outward;
and an optical fiber housing component attached to the electronic component,
The optical fiber storage component includes:
a bobbin portion having one end attached to the electronic component and around which the optical fiber is wound;
a flange portion provided on the other end side of the bobbin portion, having a folded portion at an outer edge portion that is folded back toward the bobbin portion, and containing the optical fiber wound around the bobbin portion.

(Supplementary Note 9) The optical module according to Supplementary Note 8, further comprising a circuit board on which the electronic component is mounted and on which the optical fiber housing component is attached.
(Additional Note 10) A bobbin part having one end side detachably attached to an electronic component having an optical fiber extending outward, the optical fiber being wound around the bobbin part;
a flange portion provided on the other end side of the bobbin portion, the flange portion having an outer edge portion that is folded back toward the bobbin portion and that houses the optical fiber wound around the bobbin portion, the flange portion including the one end side of the bobbin portion being attached to the electronic component;
and winding the optical fiber around the bobbin portion of the optical fiber housing component attached to the electronic component and housing the optical fiber in the flange portion.

(Additional Note 11) The step of winding the optical fiber around the bobbin portion and storing it in the flange portion includes:
a step of winding a portion of the optical fiber around the bobbin portion while applying tension to the optical fiber and placing the optical fiber in the flange portion;
a step of releasing the tension applied to the optical fiber and spreading out the portion of the wound optical fiber while being housed in the flange portion;
and a step of winding another portion of the optical fiber, which is continuous with the first portion, around the bobbin portion while applying the tension to the optical fiber and placing the other portion around the flange portion.

(Appendix 12) The method for manufacturing an optical module described in appendix 10 or 11, characterized in that it includes a step of mounting the electronic component, in which the optical fiber is wound and housed in the attached optical fiber housing component, on a circuit board.

(Additional Note 13) After mounting the electronic component on the circuit board, releasing the optical fiber that is wound and stored in the optical fiber storage component attached to the electronic component;
and removing the optical fiber housing component from which the optical fiber has been released, from the electronic component mounted on the circuit board.

1, 2, 300a, 300b Optical module 10, 50, 100 Electronic component with optical fiber 11, 51, 101 Component body 12, 52, 102 Solder bump 13, 53, 103 Optical fiber 20, 60, 200, 201, 210 Circuit board 22, 62, 202 Electrode pad 40, 80 Optical fiber housing component 41, 81 Bobbin portion 41a, 41b, 81a, 81b End portion 41c, 81c Surface 42, 82 Flange portion 42a, 82a Return portion 70 Rotating stage 70a Direction 71 Fixed frame guide 72 Optical fiber guide 72a Curved surface 72b Radius 80a Center 82b Cutout portion 83 Mounting portion 83a Hook portion 84 Guide portion 85 Fixing portion 85a Slit portion 90 Pickup tool 91, 105 Heating 110, 120, 130 Electronic component 211 Circuit board unit 211a Cutting region 400 Optical fiber guide 401 Shaft portion 402 Wall portion

Claims (13)

a bobbin portion having one end portion detachable from an external electronic component and another end portion opposite to the one end portion, the bobbin portion having an optical fiber wound therearound;
a flange portion provided at the other end side of the bobbin portion and extending outward from the bobbin portion , the flange portion extending toward the one end side of the bobbin portion at an outer edge of the flange portion and further comprising a return portion that is folded back from the one end side of the portion extending toward the one end side toward the bobbin portion, the flange portion housing the optical fiber wound around the bobbin portion between the return portion and the bobbin portion , wherein a thickness of the flange portion including the return portion is smaller than a height from the one end to the other end of the bobbin portion. The optical fiber storage component according to claim 1, characterized in that the one end of the bobbin portion that extends below the flange portion does not hold the optical fiber. a bobbin portion having one end portion detachable from an external electronic component and another end portion opposite to the one end portion, the bobbin portion having an optical fiber wound therearound;
a flange portion provided at the other end side of the bobbin portion and extending outward from the bobbin portion , the flange portion extending toward the one end side of the bobbin portion at an outer edge of the flange portion and further comprising a return portion that is folded back from the one end side of the portion extending toward the one end side toward the bobbin portion, the flange portion storing the optical fiber wound around the bobbin portion between the return portion and the bobbin portion , wherein the return portion has elasticity, and the optical fiber wound around the bobbin portion is released by the outward deformation of the return portion. An optical fiber storage component according to any one of claims 1 to 3, characterized in that the one end of the bobbin portion includes an attachment portion having a hook portion that can be attached to and detached from the external electronic component. An optical fiber storage component according to any one of claims 1 to 4, characterized in that the other end side of the bobbin part has an adsorption surface for an external pickup tool. The optical fiber storage component according to any one of claims 1 to 5, characterized in that the flange portion has multiple cutouts when viewed from the other end side of the bobbin portion. an electronic component having an outwardly extending optical fiber;
and an optical fiber housing component attached to the electronic component,
The optical fiber storage component includes:
a bobbin portion having one end attached to the electronic component and around which the optical fiber is wound;
an optical fiber 100 provided on the bobbin portion 102 and extending outward from the bobbin portion 102 at the other end side of the bobbin portion, the optical fiber 100 being wound around the bobbin portion 102 and the optical fiber 100 being wound around the bobbin portion 102, the optical fiber 100 being wound around the bobbin portion 102 and the optical fiber 100 being wound around the bobbin portion 102; an electronic component having an outwardly extending optical fiber;
and an optical fiber housing component attached to the electronic component,
The optical fiber storage component includes:
a bobbin portion having one end attached to the electronic component and around which the optical fiber is wound;
a flange portion provided on the other end side of the bobbin portion and extending outward from the bobbin portion , the flange portion extending toward the one end side of the bobbin portion at an outer edge of the flange portion and further including a return portion that is folded back from the one end side of the portion that extends toward the one end side toward the bobbin portion, and the flange portion holds the optical fiber wound around the bobbin portion between the return portion and the bobbin portion ,
The optical module is characterized in that the return portion has elasticity, and the optical fiber wound around the bobbin portion is released by outward deformation of the return portion. The optical module according to claim 7 or 8, characterized in that it includes a circuit board on which the electronic component is mounted and on which the optical fiber housing component is attached. an optical fiber storage component including: a bobbin section, one end of which is detachably attachable to an electronic component having an optical fiber extending outward, around which the optical fiber is wound; and a flange section provided on the other end side of the bobbin section and extending outward from the bobbin section , the flange section including a return section extending toward the one end side of the bobbin section at an outer edge of the flange section and further including a return section that is folded back from the one end side of the portion extending toward the one end side toward the bobbin section, and which stores the optical fiber wound around the bobbin section between the return section and the bobbin section ; and setting a thickness of the flange section including the return section to be smaller than a height from the one end to the other end of the bobbin section;
attaching the one end side of the bobbin portion to the electronic component;
and winding the optical fiber around the bobbin portion of the optical fiber housing component attached to the electronic component and housing the optical fiber in the flange portion. an optical fiber storage component including: a bobbin section, one end of which is detachably attachable to an electronic component having an optical fiber extending outward, around which the optical fiber is wound; and a flange section provided on the other end side of the bobbin section and extending outward from the bobbin section, the flange section including a return section that extends toward the one end side of the bobbin section at an outer edge of the flange section and is further folded back from the one end side of the portion that extends toward the one end side toward the bobbin section, and that stores the optical fiber wound around the bobbin section between the return section and the bobbin section; and forming the return section to have elasticity such that the optical fiber wound around the bobbin section is released by outward deformation of the return section.
attaching the one end side of the bobbin portion to the electronic component;
and winding the optical fiber around the bobbin portion of the optical fiber housing component attached to the electronic component and housing the optical fiber in the flange portion. The method for manufacturing an optical module according to claim 10 or 11, further comprising a step of mounting the electronic component, in which the optical fiber is wound and housed in the attached optical fiber housing component, on a circuit board. a step of releasing the optical fiber that has been wound and housed in the optical fiber housing component attached to the electronic component after the electronic component is mounted on the circuit board;
and removing the optical fiber housing component from which the optical fiber has been released, from the electronic component mounted on the circuit board.

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