JP7544341B2 - Plating power supply jig - Google Patents

Description

The present invention relates to a plating power supply jig.

When plating a substrate or other object to be plated, a plating power supply jig is used in a plating tank to supply current to the object to be plated. Conventional plating power supply jigs include a power supply section that includes a contact point with the object to be plated, and a connecting section to which the power supply section is fixed and supplies current to the contact point. The power supply section also includes a holding section that holds the object to be plated and supplies current to the contact point, with current being supplied in the following order: connecting section, holding section, contact point. Power is supplied from the connecting section to the power supply section in a sealed state so as not to come into contact with the plating solution (see, for example, Patent Document 1).

Special table 2019-527473 publication

In conventional plating power supply jigs, the contact surface between the connecting part and the power supply part is sealed by a fluororubber coating applied to the power supply part. However, in conventional plating power supply jigs, the coating on the power supply part is simply used for sealing, so if the holding part that constitutes the power supply part moves, the sealing property may change in response to the holding part. Specifically, when the holding part clamps the object to be plated, if the clamped object to be plated is thicker or thinner than intended, or if there is variation in thickness within the object to be plated, a gap may appear where the power supply part and the connecting part come into contact, reducing the sealing property and allowing plating solution to enter the gap.

The present invention was made in consideration of the above points, and aims to provide a plating power supply jig with improved sealing properties.

The present plating power supply jig includes a connecting portion having one and the other main surfaces, a first power supply portion having a first holding portion fixed to one of the main surfaces of the connecting portion and holding an object to be plated on which a plating film is to be formed, a second power supply portion fixed to the other main surface of the connecting portion so as to face the first power supply portion across the connecting portion and having a second holding portion holding the object to be plated, and a second power supply portion disposed between one of the main surfaces of the connecting portion and a first surface of the first power supply portion which is a surface facing the one of the main surfaces of the connecting portion, The connector has a first protrusion portion that provides electrical conductivity between the connecting portion and the second power supply portion , a second protrusion portion that is arranged between the other main surface of the connecting portion and a second surface of the second power supply portion that is the surface opposite the other main surface of the connecting portion, and provides electrical conductivity between the connecting portion and the second power supply portion, a first seal portion that is arranged around the outer peripheral surface of the first protrusion portion and contacts one of the main surfaces of the connecting portion and the first surface of the first power supply portion, and a second seal portion that is arranged around the outer peripheral surface of the second protrusion portion and contacts the other main surface of the connecting portion and the second surface of the second power supply portion.

The disclosed technology can provide a plating power supply jig with improved sealing properties.

1 is a perspective view illustrating a state in which a plating jig according to a first embodiment is attached to a support member; FIG. FIG. 2 is a cross-sectional view illustrating a plating power supply jig according to the first embodiment. FIG. 2 is a partial exploded perspective view illustrating the plating power supply jig according to the first embodiment. 4 is a partial cross-sectional view of the vicinity of a non-conductive portion between a coupling portion and a power supply portion. FIG. FIG. 5 is an exploded view of FIG. FIG. 1 is a partial cross-sectional view (part 1) of the vicinity of the conductive portion between the coupling portion and the power supply portion. FIG. 2 is a partial cross-sectional view (part 2) of the vicinity of the conductive portion between the coupling portion and the power supply portion. FIG. 3 is a partial cross-sectional view (part 3) of the vicinity of the conductive portion between the coupling portion and the power supply portion. FIG. 4 is a partial cross-sectional view of the vicinity of the contact of the power supply portion.

Below, a description will be given of an embodiment of the invention with reference to the drawings. Note that in each drawing, the same components are given the same reference numerals, and duplicate descriptions may be omitted.

First Embodiment
Fig. 1 is a perspective view illustrating a state in which a plating power supply jig according to a first embodiment is attached to a support member. Fig. 1(a) shows a state in which a pair of plating power supply jigs 10 does not hold a plating workpiece W, and Fig. 1(b) shows a state in which the pair of plating power supply jigs 10 hold a plating workpiece W. In Fig. 1, the longitudinal direction of the support member 300 is the X direction, the longitudinal direction of the plating power supply jig 10 is the Y direction, and the direction perpendicular to the X direction and the Y direction is the Z direction.

Figure 2 is a cross-sectional view illustrating a plating power supply jig according to the first embodiment. Figure 2(a) shows a cross section horizontal to the XZ plane at line A-A in Figure 1, and Figure 2(b) is an exploded view of Figure 2(a). Figure 3 is a partially exploded perspective view illustrating a plating power supply jig according to the first embodiment. Figure 4 is a partial cross-sectional view near the non-conductive portion between the connection portion and the power supply portion, showing a cross section horizontal to the XZ plane in Figure 1. Figure 5 is an exploded view of Figure 4. Note that the insulating films are omitted from Figure 3.

Referring to Figures 1 to 5, the plating power supply jig 10 according to the first embodiment holds both sides of a plate- or sheet-shaped object W to be plated and supplies power to the object W when the object W is immersed in a plating solution for plating. The plating power supply jig 10 has a connecting portion 20, power supply portions 30 and 40, and sealing portions 50 and 60.

The plating power supply jigs 10 are supported on both ends of an elongated support member 300 that extends in a substantially horizontal direction. The plating power supply jigs 10 and the support member 300 are mainly made of a conductive material. The connecting portion 20 of one plating power supply jig 10 is supported to be able to swing on one end of the support member 300 and extends in a substantially perpendicular direction to the support member 300. The connecting portion 20 of the other plating power supply jig 10 is supported to be able to swing on the other end of the support member 300 and extends in a substantially perpendicular direction to the support member 300.

One of the plating power supply jigs 10 clamps and holds one end of the object W in the left-right direction (X direction). The other plating power supply jigs 10 clamps and holds the other end of the object W in the left-right direction (X direction). When the object W and a pair of plating power supply jigs 10 clamping the object W from both sides are immersed in a plating solution and power is supplied to the pair of plating power supply jigs 10 via the support member 300, current flows on both sides of the object W, and a plating layer is formed on both sides of the object W. If the pair of plating power supply jigs 10 are structured so that current flows only on one side of the object W, it is also possible to form a plating layer on only one side of the object W.

Hereinafter, each component of the plating power supply jig 10 will be described in detail. The connecting portion 20 has a long and thin plate-like main body 21 extending in the Y direction, a protrusion 22 protruding in the Z+ direction from one main surface side of the main body 21, a protrusion 23 protruding in the Z- direction from the other main surface side of the main body 21, and an insulating film 24. The protrusion 22 is, for example, disk-shaped, and a plurality of protrusions 22 are provided discretely on one main surface of the main body 21. The protrusion 23 is, for example, disk-shaped, and a plurality of protrusions 23 are provided discretely on the other main surface of the main body 21. The heights of the protrusions 22 and 23 are designed to a value that allows the end faces 22a and 23a of the protrusions 22 and 23 to be reliably surface-joined with the main bodies 31 and 41 (described later) even if the thickness of the insulating film 24, the thicknesses of the insulating films 33 and 43 described later, and the thicknesses of the seal portions 50 and 60 vary.

One main surface and the other main surface of the main body 21 are approximately parallel, and the protrusions 22 and 23 are disposed in positions facing each other via the main body 21. The connecting portion 20 is provided with a through hole 20x that penetrates the protrusion 22, the main body 21, and the protrusion 23. The side wall of the through hole 20x is, for example, female-threaded. For example, as shown in Figures 4 and 5, an insert part 80 with a female thread may be inserted into the through hole 20x.

The main body 21, the protrusions 22, and the protrusions 23 are integrally formed from a conductive material. Examples of materials for the main body 21, the protrusions 22, and the protrusions 23 include stainless steel. Except for the end face 22a of the protrusions 22 and the end face 23a of the protrusions 23, the entire surfaces of the main body 21, the protrusions 22, and the protrusions 23 are covered with an insulating film 24. The material for the insulating film 24 is, for example, a fluororesin. The thickness of the insulating film 24 is, for example, about 300 μm. The insulating film 24 is provided to prevent plating from being deposited in unnecessary areas.

The power supply unit 30 is connected to the object W to be plated and is a part that holds the object W to be plated and supplies power to the object W to be plated. The power supply unit 30 has a main body 31, a holding part 32, and an insulating film 33. The main body 31 and the holding part 32 are integrally formed from a conductive material. Examples of materials for the main body 31 and the holding part 32 include stainless steel.

The main body 31 is a long, thin plate-like member extending in the Y direction, and is fixed to one of the main surfaces of the connecting portion 20. The surface of the main body 31 facing the connecting portion 20 is flat, and a part of this surface is exposed from the insulating film 33. The part of the main body 31 exposed from the insulating film 33 and the end face 22a of the protrusion 22 are in contact without the insulating film between them, forming a conductive portion A. In other words, the protrusion 22 provides electrical conductivity between the main body 21 of the connecting portion 20 and the main body 31 of the power supply portion 30, and the protrusion 22 including the conductive portion A becomes part of the path of the current supplied to the plating object W.

The body 31 is covered with an insulating film 33 except for the area near the conductive portion A. The insulating film 33 is made of, for example, a fluororesin. The insulating film 33 has a thickness of, for example, about 300 μm. The insulating film 33 is provided to prevent plating from being deposited in unnecessary areas. The insulating film 33 may be made of the same material as the insulating film 24.

The power supply unit 30 is fixed to the connecting unit 20 by bolt 71A at a portion overlapping the protrusion 22 in a plan view. The power supply unit 30 is also fixed to the connecting unit 20 by bolts 71B and 71C at a portion surrounding the protrusion 22 in a plan view. The main body 31 is formed with countersunk holes 30x into which bolts 71A, 71B, and 71C are inserted for fastening to the connecting unit 20. The bolt 71A is a bolt that fixes the contact portion A. The bolts 71B and 71C are bolts that fix the non-conductive portion where the main body 31 and the connecting unit 20 contact each other via the insulating films 33 and 24. The outer periphery of the threaded portion of bolts 71A, 71B, and 71C is threaded, and bolts 71A, 71B, and 71C are inserted into countersunk holes 30x, so that their tips reach through holes 20x in connecting part 20, fastening main body 31 and connecting part 20 together.

Note that countersunk holes are not necessarily required, and the main body 31 and the connecting portion 20 may be fastened together so that the bolts 71A, B, and C protrude from the connecting portion surface without providing countersunk holes.

Note that a planar view refers to viewing an object from the Z direction in FIG. 1, etc. Also, a planar shape refers to the shape of an object viewed from the Z direction.

The holding portion 32 is a member formed of a thinner plate than the main body 31, extending in the X+ direction from the Z+ side of the end face of the main body 31. The holding portion 32 holds the plating object W on which the plating film is to be formed, and supplies power to the plating object W. The holding portion 32 bends in the Z- direction to form an obtuse angle at a first bending point 32a located further in the X+ direction than the main body 31, bends in the Z+ direction to form an obtuse angle at a second bending point 32b located further in the X+ direction than the first bending point 32a, and forms a substantially V-shaped contact point 34 at the tip.

The side of the contact 34 that faces the power supply 40 (near the bend of the V-shape) is exposed from the insulating film 33, and this part comes into contact with the conductor of the object to be plated W and supplies current to the conductor of the object to be plated W. Note that the holding part 32 is covered with the insulating film 33 except for the side of the contact 34 that faces the power supply 40.

The seal portion 50 is disposed between one of the main surfaces on which the protrusions 22 of the main body 21 of the connecting portion 20 are formed and the main body 31 of the power supply portion 30. The seal portion 50 has a plurality of through holes 50x, and each of the protrusions 22 of the connecting portion 20 is disposed inside the through holes 50x formed at the corresponding positions. One side of the seal portion 50 contacts the main body 21 of the connecting portion 20, and the other side contacts the main body 31 of the power supply portion 30. In other words, the seal portion 50 is disposed around the outer peripheral surface of the protrusions 22, and contacts one of the main surfaces of the main body 21 of the connecting portion 20 and a surface facing one of the main surfaces of the main body 21 of the power supply portion 30.

In this way, the seal portion 50 is disposed between the opposing surfaces of the main body 21 of the connecting portion 20 and the main body 31 of the power supply portion 30, and is in close contact with both. This makes it possible to prevent the plating solution from entering the conductive portion A where no insulating film is formed. The seal portion 50 is preferably formed from a material with high chemical resistance. Examples of materials for the seal portion 50 include fluorine-based rubber and silicone-based rubber. The seal portion 50 may be of any thickness as long as it can be in close contact with the opposing surfaces of the main body 21 of the connecting portion 20 and the main body 31 of the power supply portion 30, but for example, it can be about 1 mm to 2 mm.

The power supply unit 40 is connected to the object W to be plated and is a part that holds the object W to be plated and supplies power to the object W to be plated. The power supply unit 40 is fixed to the other main surface side of the main body 21 of the connecting part 20 so as to face the power supply unit 30 across the connecting part 20. The power supply unit 40 has a main body 41, a holding part 42, and an insulating film 43. The main body 41 and the holding part 42 are integrally formed from a conductive material. Examples of materials for the main body 41 and the holding part 42 include stainless steel. The power supply unit 40 has the same structure as the power supply unit 30, for example.

The main body 41 is a long, thin plate-like member extending in the Y direction, and is fixed to the other main surface of the connecting portion 20. The surface of the main body 41 facing the connecting portion 20 is flat, and a part of this surface is exposed from the insulating film 43. The part of the main body 41 exposed from the insulating film 43 and the end face 23a of the protrusion 23 are in contact without the insulating film between them, forming a conductive portion B. In other words, the protrusion 23 provides electrical conductivity between the main body 21 of the connecting portion 20 and the main body 41 of the power supply portion 40, and the protrusion 23 including the conductive portion B becomes part of the path of the current supplied to the plating object W.

The body 41 is covered with an insulating film 43 except for the area near the conductive portion B. The material of the insulating film 43 is, for example, a fluororesin. The thickness of the insulating film 43 is, for example, about 300 μm. The insulating film 43 is provided to prevent plating from being deposited in unnecessary areas. The insulating film 43 may be formed from the same material as the insulating films 24 and 33.

The power supply unit 40 is fixed to the connecting unit 20 by bolt 72A at a portion overlapping the protrusion 23 in a plan view. The power supply unit 40 is also fixed to the connecting unit 20 by bolts 72B and 72C at a portion surrounding the protrusion 23 in a plan view. The main body 41 is formed with countersunk holes 40x into which bolts 72A, 72B, and 72C are inserted for fastening to the connecting unit 20. The bolt 72A is a bolt that fastens the contact portion B. The bolts 72B and 71C are bolts that fasten the non-conductive portion where the main body 41 and the connecting unit 20 contact each other via the insulating film 43 and the insulating film 24. The outer periphery of the threaded portion of bolts 72A, 72B, and 72C is threaded, and bolts 72A, 72B, and 72C are inserted into countersunk holes 40x, so that their tips reach through holes 20x in the connecting portion 20, fastening the main body 41 and the connecting portion 20 together.

The holding portion 42 is a member formed of a thinner plate than the main body 41, extending in the X+ direction from the Z- side of the end face of the main body 41. The holding portion 42 holds the plating object W on which the plating film is to be formed, and supplies power to the plating object W. The holding portion 42 bends in the Z+ direction at a first bending point 42a located further in the X+ direction than the main body 41 to form an obtuse angle, and bends in the Z- direction to form an obtuse angle at a second bending point 42b located further in the X+ direction than the first bending point 42a, forming a substantially V-shaped contact point 44 at the tip.

The side of the contact 44 that faces the power supply unit 30 (near the bend of the V-shape) is exposed from the insulating film 43, and this part comes into contact with the conductor of the plated object W and supplies current to the conductor of the plated object W. Note that the holding part 42 is covered with the insulating film 43 except for the side of the contact 44 that faces the power supply unit 30.

The seal portion 60 is disposed between the other main surface of the body 21 of the connecting portion 20 on which the protrusion 23 is formed, and the body 41 of the power supply portion 40. The seal portion 60 has a plurality of through holes 60x, and each protrusion 23 of the connecting portion 20 is disposed inside the through hole 60x formed at a corresponding position. One side of the seal portion 60 contacts the body 21 of the connecting portion 20, and the other side contacts the body 41 of the power supply portion 40. In other words, the seal portion 60 is disposed around the outer peripheral surface of the protrusion 23, and contacts the other main surface of the body 21 of the connecting portion 20 and the surface facing the other main surface of the body 21 of the power supply portion 40.

In this way, the seal portion 60 is disposed between the opposing surfaces of the main body 21 of the connecting portion 20 and the main body 41 of the power supply portion 40, and is in close contact with both. This makes it possible to prevent the plating solution from entering the conductive portion B where no insulating film is formed. The seal portion 60 is preferably formed from a material with high chemical resistance. Examples of materials for the seal portion 60 include fluorine-based rubber and silicone-based rubber. The seal portion 60 may be of any thickness as long as it can be in close contact with the opposing surfaces of the main body 21 of the connecting portion 20 and the main body 41 of the power supply portion 40, but for example, it can be about 1 mm to 2 mm.

In the plating power supply jig 10, the holding portion 32 of the power supply unit 30 and the holding portion 42 of the power supply unit 40 function as leaf springs, and the vicinity of the contact 34 of the holding portion 32 of the power supply unit 30 and the vicinity of the contact 44 of the holding portion 42 of the power supply unit 40 elastically deform and return to their original state. The contact 34 extends in the Y direction and contacts almost the entire one end side in the left-right direction (X direction) of one surface of the object to be plated W. The contact 44 extends in the Y direction and contacts almost the entire one end side in the left-right direction (X direction) of the other surface of the object to be plated W.

The other end sides in the left-right direction (X direction) of one surface and the other surface of the plating object W are also held by the power supply parts 30 and 40 of the other plating power supply jig 10. Therefore, current flows from the contact 34 of the power supply part 30 of one plating power supply jig 10 to the contact 34 of the power supply part 30 of the other plating power supply jig 10, forming a plating layer on one surface of the plating object W. In addition, current flows from the contact 44 of the power supply part 40 of one plating power supply jig 10 to the contact 44 of the power supply part 40 of the other plating power supply jig 10, forming a plating layer on the other surface of the plating object W.

In the vicinity of bolts 71B and 71C and bolts 72B and 72C shown in Figures 4 and 5, as described above, the connecting portion 20 is covered with insulating film 24, the power supply portion 30 is covered with insulating film 33, and the power supply portion 40 is covered with insulating film 43. In addition, the inner walls of the holes into which bolts 71B and 71C are inserted are covered with insulating film 33, and the inner walls of the holes into which bolts 72B and 72C are inserted are covered with insulating film 43. Therefore, in this portion, the connecting portion 20 and the power supply portions 30 and 40 are not electrically connected. In other words, the bolts 71B and 71C and bolts 72B and 72C are intended to fix the non-conductive portions of the connecting portion 20 and the power supply portions 30 and 40 together.

By providing bolts 71B and 71C and bolts 72B and 72C to fix the connecting part 20 and the power supply parts 30 and 40, the sealing parts 50 and 60 between the connecting part 20 and the power supply parts 30 and 40 can be pressed more strongly and over a wider range. As a result, the sealing performance of the entire plating power supply jig 10 can be improved. In other words, since the connecting part 20 and the power supply parts 30 and 40 are fixed with sufficient force, the conductive part A is sufficiently sealed by the sealing part 50, and the conductive part B is sufficiently sealed by the sealing part 60. As a result, it is possible to reliably prevent the plating solution from entering the conductive parts A and B.

Conventional plating power supply jigs (see, for example, Patent Document 1) do not have a sealing part as a separate member from the connecting part and the power supply part, and the sealing role is performed by the insulating film. That is, in conventional plating power supply jigs, fluororubber is used as the insulating film, and it is formed thick so that it also serves as a seal. However, fluororubber is brittle, and if it is provided in the part where the bolt is inserted, it will peel off, and there is a risk that the part where the bolt is inserted will become electrically conductive. For this reason, in conventional plating power supply jigs, it is not possible to adopt a method of fixing the connecting part and the power supply part with a bolt, and the fixing force between the connecting part and the power supply part is insufficient.

In contrast, the plating power supply jig 10 has sealing parts 50 and 60 as separate members from the connecting part 20 and the power supply parts 30 and 40. That is, in the plating power supply jig 10, the sealing part 50 and 60 plays the role of sealing, and the insulating film 24, the insulating film 33, and the insulating film 43 play the role of insulating coating. Since the insulating film 24, the insulating film 33, and the insulating film 43 do not need to play the role of sealing, there is no need to use fluororubber for the insulating film 24, the insulating film 33, and the insulating film 43, and it is possible to use a stronger and thinner fluororesin. Therefore, it is possible to fix the connecting part 20 and the power supply parts 30 and 40 while ensuring insulation in the part where the bolt is inserted.

In this way, in the plating power supply jig 10, the sealing parts 50 and 60 are arranged around the protrusions 22 and 23, which serve as conductive parts, so that the plating solution can be prevented from entering the conductive parts.

The plating power supply jig 10 also includes sealing parts 50 and 60 as separate members from the connecting part 20 and the power supply parts 30 and 40. Therefore, the sealing parts 50 and 60 do not follow the movement of the holding parts 32 and 42, and the sealing performance is less likely to deteriorate. Furthermore, the sealing parts 50 and 60 can be made much thicker than the fluororubber coating of conventional plating power supply jigs, so they can deform while maintaining sufficient sealing performance in response to the movement of the holding parts 32 and 42, and the deterioration of the sealing performance can be suppressed.

In addition, because the sealing performance has been improved, the area of the sealing portions 50 and 60 can be reduced and the diameter of the protrusion can be enlarged, making it possible to increase the area of the conductive portion, which is the end face of the protrusion, which is advantageous for supplying a large current to the object to be plated.

In addition, since there is no longer any need for sealing properties in the insulating film (coating material) of the holding part, it is possible to change the coating of the holding part to a fluororesin coating, which is thinner than a fluororubber coating. As a result, even if the contact point with the plating object is made small, it can be exposed from the coating material, allowing the plating power supply jig to be made thinner.

In addition, a thinner insulating film (coating material) reduces unevenness in thickness, eliminating the problem of contacts becoming buried in the coating material and being unable to supply power.

First Modification of the First Embodiment
In the first modification of the first embodiment, an example of a plating power supply jig having a different structure in the vicinity of the conductive portion of the connecting portion and the power supply portion is shown. Note that in the first modification of the first embodiment, the description of the same components as those in the already described embodiment may be omitted.

Figure 6 is a partial cross-sectional view (part 1) of the vicinity of the conductive portion between the connecting portion and the power supply portion, showing a cross section horizontal to the XZ plane of Figure 1. As shown in Figure 6, the plating power supply jig 10A has a connecting portion 20A, power supply portions 30A and 40A, and sealing portions 50 and 60.

In the plating power supply jig 10A, the connecting portion 20A has a main body 21 and an insulating film 24, but does not have the protrusions 22 and 23, which is different from the connecting portion 20 of the plating power supply jig 10. In addition, the power supply portion 30A differs from the power supply portion 30 of the plating power supply jig 10 in that a protrusion 35 is formed on the surface of the main body 31 that faces the connecting portion 20A. In addition, the power supply portion 40A differs from the power supply portion 40 of the plating power supply jig 10 in that a protrusion 45 is formed on the surface of the main body 41 that faces the connecting portion 20A.

One of the main surfaces of the main body 21 of the connecting part 20A facing the power supply part 30A is a flat surface, and a part of this surface is exposed from the insulating film 24. The other main surface of the main body 21 of the connecting part 20A facing the power supply part 40A is a flat surface, and a part of this surface is exposed from the insulating film 24. The end face 35a of the protrusion 35 of the power supply part 30A is exposed from the insulating film 33. The end face 45a of the protrusion 45 of the power supply part 40A is exposed from the insulating film 43.

The portion exposed from the insulating film 24 on one main surface of the body 21 and the end face 35a of the protrusion 35 come into contact without an insulating film between them, forming a conductive portion C. The conductive portion C becomes part of the path of the current supplied to the object W to be plated. The portion exposed from the insulating film 24 on the other main surface of the body 21 and the end face 45a of the protrusion 45 come into contact without an insulating film between them, forming a conductive portion D. The conductive portion D becomes part of the path of the current supplied to the object W to be plated.

The seal portion 50 is disposed between one of the main surfaces of the connecting portion 20A and the main body 31 of the power supply portion 30A. The seal portion 50 has a plurality of through holes 50x, and each of the protrusions 35 of the power supply portion 30A is disposed inside the through holes 50x formed at the corresponding positions. One side of the seal portion 50 contacts the main body 21 of the connecting portion 20A, and the other side contacts the main body 31 of the power supply portion 30A. In other words, the seal portion 50 is disposed around the outer peripheral surface of the protrusions 35, and contacts one of the main surfaces of the main body 21 of the connecting portion 20A and a surface facing one of the main surfaces of the main body 21 of the power supply portion 30A.

The seal portion 60 is disposed between the other main surface of the connecting portion 20A and the main body 41 of the power supply portion 40A. The seal portion 60 has a plurality of through holes 60x, and each protrusion 45 of the power supply portion 40A is disposed inside the through hole 60x formed at a corresponding position. One side of the seal portion 60 contacts the main body 21 of the connecting portion 20A, and the other side contacts the main body 41 of the power supply portion 40A. In other words, the seal portion 60 is disposed around the outer peripheral surface of the protrusion 45, and contacts the other main surface of the main body 21 of the connecting portion 20A and the surface facing the other main surface of the main body 21 of the power supply portion 40A.

In this way, the seal portion is disposed around the conductive portion, but when forming the conductive portion, a protrusion may be provided on the connecting portion side or on the power supply portion side. In either case, the connecting portion and the power supply portion located around the conductive portion are in close contact with the seal portion, preventing the plating solution from penetrating the conductive portion. Note that while Figure 6 describes the structure near the conductive portion between the connecting portion and the power supply portion, a similar structure can also be used near the non-conductive portion between the connecting portion and the power supply portion.

Figure 7 is a partial cross-sectional view (part 2) of the vicinity of the conductive portion between the connecting portion and the power supply portion, showing a cross section horizontal to the XZ plane of Figure 1. As shown in Figure 7, the plating power supply jig 10B has a connecting portion 20, power supply portions 30B and 40B, and sealing portions 50 and 60.

In the plating power supply jig 10B, the power supply unit 30B differs from the power supply unit 30 of the plating power supply jig 10 in that it has a recess 36 that opens on the side of the surface of the main body 31 that faces the connecting unit 20. In addition, the power supply unit 40B differs from the power supply unit 40 of the plating power supply jig 10 in that it has a recess 46 that opens on the side of the surface of the main body 41 that faces the connecting unit 20. In addition, in the plating power supply jig 10B, the height of the protrusions 22 and 23 of the connecting unit 20 may be higher than in the plating power supply jig 10.

No insulating film 33 is formed on the bottom surface of the recess 36, and part of the protrusion 22 of the connecting part 20 enters the recess 36, and the end face 22a of the protrusion 22 contacts the bottom surface of the recess 36 without an insulating film between them, forming a conductive part E. The conductive part E becomes part of the path of the current supplied to the plating object W.

No insulating film 43 is formed on the bottom surface of the recess 46, and part of the protrusion 23 of the connecting part 20 enters the recess 46, and the end face 23a of the protrusion 23 contacts the bottom surface of the recess 46 without an insulating film between them, forming a conductive part F. The conductive part F becomes part of the path of the current supplied to the plating object W.

In this way, a recess may be provided in the power supply section, and part of the protrusion of the connecting section may be inserted into the recess so that the bottom surface of the recess and the end surface of the protrusion come into contact. This structure can ensure a greater distance between the conductive section and the plating solution, further preventing the plating solution from penetrating into the conductive section. Note that while Figure 7 describes the structure near the conductive section between the connecting section and the power supply section, a similar structure can also be used near the non-conductive section between the connecting section and the power supply section.

Figure 8 is a partial cross-sectional view (part 3) of the vicinity of the conductive portion between the connecting portion and the power supply portion, showing a cross section horizontal to the XZ plane of Figure 1. As shown in Figure 8, the plating power supply jig 10C has a connecting portion 20C, power supply portions 30A and 40A, and sealing portions 50 and 60.

In the plating power supply jig 10C, the connecting portion 20C has a recess 25 that opens on one main surface side of the main body 21 and a recess 26 that opens on the other main surface side of the main body 21, which is different from the connecting portion 20A of the plating power supply jig 10A. Note that in the plating power supply jig 10C, the height of the protrusion 35 of the power supply portion 30A and the protrusion 45 of the power supply portion 40A may be higher than in the plating power supply jig 10A.

No insulating film 24 is formed on the bottom surface of the recess 25, and part of the protrusion 35 of the power supply part 30A penetrates into the recess 25, and the end face 35a of the protrusion 35 contacts the bottom surface of the recess 25 without an insulating film between them, forming a conductive part G. The conductive part G becomes part of the path of the current supplied to the plating object W.

No insulating film 24 is formed on the bottom surface of the recess 26, and part of the protrusion 45 of the power supply part 40A penetrates into the recess 26, and the end face 45a of the protrusion 45 contacts the bottom surface of the recess 26 without an insulating film between them, forming a conductive part H. The conductive part H becomes part of the path of the current supplied to the plating object W.

In this way, a recess may be provided in the connecting portion, and part of the protrusion of the power supply portion may be inserted into the recess so that the bottom surface of the recess and the end surface of the protrusion come into contact. This structure can ensure a greater distance between the conductive portion and the plating solution, further preventing the plating solution from penetrating into the conductive portion. Note that while Figure 8 describes the structure near the conductive portion between the connecting portion and the power supply portion, a similar structure can also be used near the non-conductive portion between the connecting portion and the power supply portion.

Second Modification of the First Embodiment
In the second modification of the first embodiment, an example of a plating power supply jig having a different structure of the contacts of the power supply part is shown. Note that in the second modification of the first embodiment, the description of the same components as those in the already described embodiment may be omitted.

Figure 9 is a partial cross-sectional view of the vicinity of the contact point of the power supply unit. As shown in Figures 9(a) and 9(b), instead of bending the holding part 32 to form the contact point, a separate member may be attached to the tip side of the holding part 32 to serve as the contact point.

In FIG. 9(a), the holding portion 32 has a contact 37 at its tip. The holding portion 32 and the contact 37 are electrically connected. The contact 37 has a structure in which, for example, a large-diameter cylindrical portion and a small-diameter cylindrical portion are arranged concentrically. The small-diameter cylindrical portion of the contact 37 is inserted, for example, into a through hole 32x provided at the tip side of the holding portion 32 and fixed by a welding portion 39. The large-diameter cylindrical portion of the contact 37 protrudes toward the holding portion 42. The contact 37 is covered with an insulating film 33 except for the surface that contacts the plating object W.

Similarly, the holding portion 42 has a contact 47 at its tip. The contact 47 has, for example, a structure in which a large-diameter cylindrical portion and a small-diameter cylindrical portion are arranged concentrically. The small-diameter cylindrical portion of the contact 47 is, for example, inserted into a through hole 42x provided at the tip side of the holding portion 42 and fixed by a welded portion 49. The large-diameter cylindrical portion of the contact 47 protrudes toward the holding portion 32. Except for the surface that contacts the plating object W, the contact 47 is covered with an insulating film 43.

The contacts 37 and 47 are arranged to face each other. It is preferable that a plurality of the contacts 37 and 47 are arranged at a predetermined interval along the Y direction. The contacts 37 and 47 are formed from a conductive material such as stainless steel. The contacts 37 and 47 may have a single portion with a rectangular cross-sectional shape extending in the Y direction instead of multiple large-diameter cylindrical portions.

In FIG. 9(b), the holding portion 32 has a contact 38 at its tip. The contact 38 has a structure in which, for example, a hemispherical portion and a cylindrical portion having a smaller diameter than the hemispherical portion are concentrically arranged. The cylindrical portion of the contact 38 is, for example, inserted into a through hole 32x provided on the tip side of the holding portion 32 and fixed by a welded portion 39. The hemispherical portion of the contact 38 protrudes toward the holding portion 42. The contact 38 is covered with an insulating film 33 except for the vicinity of the tip of the hemispherical portion that contacts the plating object W.

Similarly, the holding portion 42 has a contact 48 at its tip. The contact 48 has a structure in which, for example, a hemispherical portion and a cylindrical portion having a smaller diameter than the hemispherical portion are concentrically arranged. The cylindrical portion of the contact 48 is inserted, for example, into a through hole 42x provided on the tip side of the holding portion 42 and fixed by a welding portion 49. The hemispherical portion of the contact 48 protrudes toward the holding portion 32. The contact 48 is covered with an insulating film 43 except for the vicinity of the tip of the hemispherical portion that contacts the plating object W.

The contacts 38 and 48 are arranged to face each other. It is preferable that a plurality of the contacts 38 and 48 are arranged at a predetermined interval along the Y direction. The contacts 38 and 48 are formed from a conductive material such as stainless steel. The contacts 38 and 48 may have a semicircular kamaboko-shaped portion instead of a hemispherical portion. The semicircular kamaboko-shaped portion may be provided in a plurality of portions at a predetermined interval, or may have one kamaboko-shaped portion extending in the Y direction.

In this way, the shape of the contacts can be appropriately determined as needed. In particular, the contacts 38 and 48 shown in FIG. 9(b) are preferable in that they have high conformity to the steps and thickness differences of the plating object W. That is, if the contacts of the holding part have a structure with corners, the contact area with the plating object W will vary greatly due to the steps and thickness differences of the plating object W. If the contact area between the contacts of the holding part and the plating object W becomes small, sparks may occur if the current concentrates in the small area. As shown in FIG. 9(b), the holding part has a contact with the plating object W that has a curved shape (e.g., hemispherical) without corners, so that the contact area between the contacts of the holding part and the plating object W is approximately constant even if the plating object W has steps or thickness differences. Therefore, the generation of sparks at the contacts can be suppressed.

Although the preferred embodiment has been described above in detail, the present invention is not limited to the above-described embodiment, and various modifications and substitutions can be made to the above-described embodiment without departing from the scope of the claims.

10, 10A, 10B, 10C Plating power supply jig 20, 20A, 20C Connecting portion 20x, 32x, 42x, 50x, 60x Through hole 21, 31, 41 Main body 22, 23, 35, 45 Protrusion portion 22a, 23a, 35a, 45a End surface 24, 33, 43 Insulating film 25, 26, 36, 46 Recess 30, 30A, 30B, 40, 40A, 40B Power supply portion 30x, 40x Counterbore hole 32, 42 Holding portion 32a, 42a First bending point 32b, 42b Second bending point 34, 37, 38, 44, 47, 48 Contact point 39, 49 Welding portion 50, 60 Sealing portion 71A, 71B, 71C, 72A, 72B, 72C Bolt 80 Insert parts

Claims (11)

A connecting portion having one and another main surfaces;
a first power supply unit including a first holding unit fixed to one main surface side of the connecting unit and holding an object to be plated on which a plating film is to be formed;
a second power supply part fixed to the other main surface side of the connecting part so as to face the first power supply part across the connecting part, the second power supply part including a second holding part that holds the object to be plated;
a first protrusion disposed between one main surface of the coupling portion and a first surface of the first power supply portion, the first surface being a surface opposite to the one main surface of the coupling portion , and electrically connecting the coupling portion and the first power supply portion;
a second protrusion disposed between the other main surface of the coupling portion and a second surface of the second power supply portion that faces the other main surface of the coupling portion , and electrically connecting the coupling portion and the second power supply portion;
a first seal portion disposed around an outer circumferential surface of the first protrusion portion and in contact with one main surface of the coupling portion and a first surface of the first power supply portion;
a second seal portion disposed around an outer circumferential surface of the second protrusion portion and in contact with the other main surface of the coupling portion and a second surface of the second power supply portion;
A plating power supply jig having the above structure. A connecting portion having one and another main surfaces;
a first power supply unit including a first holding unit fixed to one main surface side of the connecting unit and holding an object to be plated on which a plating film is to be formed;
a second power supply part fixed to the other main surface side of the connecting part so as to face the first power supply part across the connecting part, the second power supply part including a second holding part that holds the object to be plated;
a plurality of first protrusions disposed between one main surface of the coupling portion and a first surface of the first power supply portion, the first protrusions electrically connecting the coupling portion and the first power supply portion;
a plurality of second protrusions disposed between the other main surface of the coupling portion and a second surface of the second power supply portion, and electrically connecting the coupling portion and the second power supply portion;
a first seal portion disposed around an outer circumferential surface of each of the first protrusions and in contact with one of the main surfaces of the coupling portion and a first surface of the first power supply portion;
a second seal portion disposed around an outer circumferential surface of each of the second protrusions and in contact with the other main surface of the coupling portion and a second surface of the second power supply portion;
A plating power supply jig having the above structure. the first protrusion is provided on one main surface of the coupling portion, an end surface of the first protrusion is in contact with a first surface of the first power supply portion,
The plating power supply jig according to claim 1 or 2, wherein the second protrusion is provided on the other main surface of the connecting portion, and an end face of the second protrusion is in contact with a second surface of the second power supply portion. the first power supply portion has a first recess portion that opens to a first surface side,
the second power supply portion has a second recess that opens to a second surface side,
a portion of the first protrusion fits into the first recess and an end surface of the first protrusion contacts a bottom surface of the first recess;
The plating power supply jig according to claim 3 , wherein a portion of the second protrusion fits into the second recess, and an end face of the second protrusion contacts a bottom surface of the second recess. the first protrusion is provided on a first surface of the first power supply part, and an end surface of the first protrusion is in contact with one main surface of the coupling part;
The plating power supply jig according to claim 1 or 2, wherein the second protrusion is provided on a second surface of the second power supply part, and an end face of the second protrusion is in contact with the other main surface of the connecting part. the connecting portion has a first recess that opens to one main surface side and a second recess that opens to the other main surface side,
a portion of the first protrusion fits into the first recess and an end surface of the first protrusion contacts a bottom surface of the first recess;
The plating power supply jig according to claim 5 , wherein a portion of the second protrusion fits into the second recess, and an end face of the second protrusion contacts a bottom surface of the second recess. a portion where the connecting portion or the first power supply portion contacts an end surface of the first protrusion, and a portion where the connecting portion or the second power supply portion contacts an end surface of the second protrusion are conductive portions that serve as paths of current,
7. The plating power supply jig according to claim 1, wherein the surfaces of the connecting portion, the first power supply portion, and the second power supply portion are covered with an insulating film, except for the conductive portion, the portion of the first holding portion that contacts the object to be plated, and the portion of the second holding portion that contacts the object to be plated. The plating power supply jig according to claim 7 , wherein the insulating film is made of a fluorine-based resin. 9. The plating power supply jig according to claim 1, wherein the connecting portion and the first and second power supply portions are fixed with bolts at portions that overlap with the first and second protrusion portions in a planar view. the connecting portion, the first power supply portion, and the second power supply portion are fixed to each other by bolts at peripheral portions of the first protrusion portion and the second protrusion portion in a plan view,
The plating power supply jig according to claim 1 , wherein an inner wall of the hole into which the bolt is inserted is covered with an insulating film. The plating power supply jig according to claim 1 , wherein the first holding portion and the second holding portion have curved contacts that come into contact with the object to be plated.

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