JP7550366B2 - Electrical equipment - Google Patents

Description

This disclosure relates to an electrical device, and more specifically, to an electrical device having a communication circuit for performing communication, a power supply circuit for supplying power to the communication circuit, and a heat dissipation mechanism for dissipating heat generated by the communication circuit and the power supply circuit to the outside.

Patent Document 1 describes a technology for increasing the efficiency of heat dissipation to the wall in a wall-embedded digital line termination device by constructing the material of the portion that comes into contact with the wall from metal and concentrating high heat generating parts (particularly the two high heat generating parts of the electronic circuit and power supply unit of the digital line termination device) near the portion made of metal (metal portion).

Japanese Patent Application Publication No. 11-340664

However, generally, the amount of heat generated is not the same between the two heat generating parts, and a temperature difference occurs. When a temperature difference occurs between the heat generating parts, heat is transferred from the high temperature side to the low temperature side, causing the temperature of the low temperature side to rise. In this regard, in the digital line termination device of Patent Document 1, the electronic circuit becomes hotter than the power supply unit, and heat is conducted from the electronic circuit side to the power supply unit side via the metal parts, which can cause the temperature of the power supply unit to rise.

The temperature rise in the power supply circuit caused by heat conduction from the board on which the communication circuit is mounted (communication board) to the board on which the power supply circuit is mounted (power supply board), as described above, shortens the lifespan of components such as electrolytic capacitors that make up the power supply circuit.

The objective of the present disclosure is to provide an electrical device that can increase the efficiency of dissipating heat generated in each of the communication board and the power supply board to the outside while suppressing the temperature rise of the power supply board caused by heat conduction from the communication board to the power supply board.

An electric device according to one aspect of the present disclosure includes a heat absorber, a communication board, a housing, a power supply board, an exposed portion, and a heat insulating member. The communication board is disposed on at least one of the front and rear surfaces of the heat absorber. At least a portion of the housing is made of metal. The power supply board is disposed within the housing. The exposed portion is thermally coupled to the heat absorber, and at least a portion of the exposed portion is exposed to the outside of the housing. The heat insulating member is sandwiched between the heat absorber and the metal portion of the housing.

The electrical device disclosed herein has the advantage of being able to increase the efficiency of dissipating heat generated in each of the communication board and the power supply board to the outside, while suppressing the temperature rise in the power supply board caused by heat conduction from the communication board to the power supply board.

FIG. 1 is a front perspective view of an electrical device according to an embodiment of the present disclosure. FIG. 2 is a perspective view of the electric device as viewed from the rear side. FIG. 3 is a perspective view of the electric device from the rear side, with a housing block attached to one corner of the housing body removed. FIG. 4 is an exploded perspective view of the above electric device. FIG. 5 is a front view of a mounting frame constituting the electric device. FIG. 6 is an exploded perspective view, seen from the rear side, of the electric device, showing how the housing body is attached to the front cover constituting the housing by screws via a mounting frame.

The figures described in the following embodiments are schematic diagrams, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Note that the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

(1) Overview As shown in FIGS. 1 to 4 , an electric device 1 according to an embodiment of the present disclosure includes a heat sink A1, a first communication board 11, a second communication board 12, a housing 3, a power supply board 80, an exposed portion B1, and a heat insulating member C1.

The first communication board 11 is disposed on the front side of the heat absorber A1, and the second communication board 12 is disposed on the rear side of the heat absorber A1. At least a portion of the housing 3 is made of metal. The power supply board 80 is disposed within the housing 3. The exposed portion B1 is thermally coupled to the heat absorber A1, and at least a portion of it is exposed to the outside of the housing 3. The heat insulating member C1 is sandwiched between the heat absorber A1 and the metal portion of the housing 3.

The metal part is usually the housing body 32, and may be referred to below as the "metal part (32)". However, the housing 3 may have another metal part in addition to the housing body 32. In that case, it is preferable that the heat insulating member C1 is also sandwiched between the heat absorber A1 and the other metal part, but it is not necessary that it is sandwiched.

Note that the parts of the housing 3 other than the metal part (32) (in Figs. 1 to 4, the front cover 31 and the housing block 32B) are usually made of resin, but may be made of a material other than resin.

In this electrical device 1, heat generated in the first communication board 11 and the second communication board 12 is released to the outside from the exposed part B1 via the heat absorber A1. In other words, the heat absorber A1 and the exposed part B1 function as the main part of the first heat dissipation mechanism that dissipates the heat generated in the first communication board 11 and the second communication board 12.

The heat generated by the power supply board 80 is dissipated to the outside of the housing 3 via the metal housing body 32. In other words, the metal part of the housing 3 functions as a main part of the second heat dissipation mechanism that dissipates the heat generated by the power supply board 80.

This improves the efficiency of dissipating heat generated in each of the communication boards (first communication board 11 and second communication board 12) and the power supply board 80 to the outside.

The heat absorber A1 and the metal part (32) of the housing 3 are thermally insulated (insulated) by the heat insulating member C1, so that the temperature rise of the power supply board 80 caused by heat conduction from the first communication board 11 and the second communication board 12 to the metal part (32) of the housing 3 via the heat absorber A1 is suppressed. As a result, it is possible to prevent the shortening of the lifespan of circuit components such as electrolytic capacitors mounted on the power supply board 80.

(2) Details (2-1) Heat Source The electric device 1 has a wireless communication circuit, a wired communication circuit, and a power supply circuit (none of which are shown).

The wireless communication circuit performs wireless communication. The wireless communication is, for example, Wi-Fi (registered trademark) communication, but the method is not important. The wired communication is, for example, PLC (Power Line Communication), but the method is not important. The power supply circuit supplies power to the wireless communication circuit and the wired communication circuit.

In this electrical device 1, AC power from the power system is supplied to the power supply circuit via wiring (not shown), and the power supply circuit converts the supplied AC power to DC power and supplies the converted DC power to the wireless communication circuit and the wired communication circuit. The wireless communication circuit and the wired communication circuit operate on the DC power supplied from the power supply circuit.

(2-1-1) Communication Board (2-1-1a) First Communication Board The first communication board 11 is a mounting board on which the wireless communication circuit described above is mounted. The wireless communication circuit mounted on the first communication board 11 operates using power from the power supply board 80, and as a result, heat is generated on the first communication board 11. The heat generated on the first communication board 11 is transferred to the heat absorber A1 and released to the outside via the exposed portion B1.

When the heat generated in the first communication board 11 is transferred to the metal part of the housing 3 (housing body 32) via the heat absorber A1, the temperature of the power supply board 80 in the housing 3 rises. However, in the electric device 1, the heat insulating member C1 is interposed between the heat absorber A1 and the metal part (32) of the housing 3, so that the temperature rise of the power supply board 80 caused by the heat generated in the first communication board 11 for wireless communication being transferred to the metal part of the housing 3 via the heat absorber A1 is suppressed.

(2-1-1b) Second Communication Board The second communication board 12 is a mounting board on which the circuit components of the wired communication circuit described above are mounted. The wired communication circuit mounted on the second communication board 12 operates with power from the power supply board 80, and as a result, heat is generated on the second communication board 12. The heat generated on the second communication board 12 is transferred to the heat absorber A1 and is released to the outside via the exposed portion B1.

When the heat generated by the second communication board 12 is transferred to the metal part of the housing 3 via the heat absorber A1, the temperature of the power supply board 80 inside the housing 3 rises. However, in the electrical device 1, the heat insulating member C1 is interposed between the heat absorber A1 and the metal part 32 of the housing 3, so that the temperature rise of the power supply board 80 caused by the heat generated by the second communication board 12 for wired communication being transferred to the metal part of the housing 3 via the heat absorber A1 is suppressed.

(2-1-1c) Modified Examples of Communication Boards Circuit components for a wired communication circuit may be mounted on the first communication board 11 at the front, and circuit components for a wireless communication circuit may be mounted on the second communication board 12 at the rear. In this case, as in the above embodiment, the heat insulating member C1 has the effect of suppressing a rise in temperature of the power supply board 80. In addition, the air layer D1 (see FIG. 3) between the second communication board 12 for wireless communication and the power supply board 80 has the effect of improving the insulation between the two boards.

(2-1-2) Power Supply Board The power supply board 80 is a mounting board on which the power supply circuit described above is mounted. The power supply circuit includes components such as electrolytic capacitors. In general, the lifespan of a component becomes shorter as the temperature of the environment in which it is used increases. This shortening of lifespan due to temperature increases is particularly noticeable in electrolytic capacitors, and it is not rare that the lifespan of the electrolytic capacitor is the same as the lifespan of the electrical device 1.

The power supply circuit is supplied with AC power from the power system via wiring that is inserted through the insertion hole 321 in the housing block 32B and connected to the terminal block 81. The power supply circuit converts the supplied AC power into DC power and supplies the converted DC power to the first communication board 11 and the second communication board 12.

As a result of the power supply circuit operating as described above, heat is generated in the power supply board 80. The heat generated in the power supply board 80 is transferred to the metal part of the housing 3 (the rear surface of the housing body 32) and is released to the outside from the metal part (such as the heat dissipation fins 32F provided on the rear surface of the housing body 32).

The electrical device 1 may include only one of the first communication board 11 and the second communication board 12, and not the other. In other words, the communication board included in the electrical device 1 is at least one of the first communication board 11 and the second communication board 12, and hereinafter, these will be referred to as "communication board (first communication board 11 and/or second communication board 12)" or "communication board (11 and/or 12)."

In the electric device 1, when heat generated in the communication board (first communication board 11 and/or second communication board 12) is transferred to the metal part of the housing 3 via the heat absorber A1, the temperature of the power supply board 80 in the housing 3 rises. However, in the electric device 1, since the heat insulating member C1 is interposed between the heat absorber A1 and the metal part (32) of the housing 3, the temperature rise of the power supply board 80 caused by the heat generated in the communication board (11 and/or 12) being transferred to the metal part of the housing 3 via the heat absorber A1 is suppressed. This prevents the lifespan of components such as electrolytic capacitors mounted on the power supply board 80 from being shortened.

(2-2) Mounting Frame (Main Part of the First Heat Dissipation Mechanism)
In this electrical device 1, the exposed portion B1 constitutes a part of the mounting frame 2. The mounting frame 2 is a frame-shaped member for mounting the housing 3 to a mounting target (not shown). The mounting target is, for example, a switch box, but it may be a device other than a switch box or may be a wall surface, and the type of the mounting target is not important. Note that the switch box in this embodiment is of a type that is embedded in a wall (embedded type), but it may also be of a type that can be mounted in a state exposed from the wall (exposed mounting type).

The heat generated in the communication board (11 and/or 12) is transferred via the heat absorber A1 to the exposed portion B1 constituting the mounting frame 2, and at least a portion of the transferred heat is released to the outside from the exposed portion B1.

The outside refers to the object of attachment, but it can also be anywhere, such as the wall surface, the air inside the wall, or the outside air. Also, some of the heat transferred to the exposed portion B1 may be transferred to another portion of the attachment frame 2 and released to the outside from that other portion.

This allows at least a portion of the mounting frame 2 to contribute to the release (dissipation) of heat generated in the communication board (11 and/or 12) to the outside.

Note that "at least a part" refers to, for example, the exposed portion B1 that constitutes the mounting frame 2, but it may also include a part other than the exposed portion B1, or it may be the entire mounting frame 2.

In addition, in this electrical device 1, the heat absorber A1 and the exposed portion B1 are integrally formed as the same member. In other words, the mounting frame 2, which has a portion that functions as the heat absorber A1 and a portion that functions as the exposed portion B1, is integrally formed from a metal material such as aluminum.

This makes the thermal conductivity the same between the heat absorber A1 and the exposed portion B1, and there is no impediment to heat conduction due to inclusions, improving the efficiency of heat dissipation.

Specifically, the mounting frame 2 is, for example, a mounting frame for a large rectangular interconnect wiring device as shown in FIG. 5 (see Japanese Industrial Standards "JIS C8375 Mounting Frame for Large Rectangular Interconnect Wiring Device"). Many of the outlets and switches used in homes are a type of large rectangular interconnect wiring device. The mounting frame 2 in FIG. 5 has a window 20 through which the outlet block 15 (described below) passes.

This allows at least a portion of the mounting frame of the large rectangular interconnect wiring device to contribute to heat dissipation.

However, the mounting frame 2 may be a mounting frame for wiring devices other than large rectangular interconnect wiring devices, or a mounting frame for devices other than wiring devices.

(2-3) Housing body (main part of the second heat dissipation mechanism)
The housing body 32 is made of metal and has a generally box-like shape. The housing body 32 has an open front and a peripheral end surface 320 that follows the periphery of the open front. In other words, the front side of the housing body 32 is a frame-shaped peripheral end surface 320.

Heat generated in the power supply board 80 inside the housing 3 is transferred to the rear surface of the housing body 32 via the third heat dissipation material T3 and is released to the outside of the housing 3. Heat dissipation fins 32F are formed on the rear surface of the housing body 32, and the heat transferred to the rear surface of the housing body 32 is mainly released to the outside via the heat dissipation fins 32F.

The housing body 32 also has one corner that is open. The corner is one of the multiple corners that the housing body 32 has. In this embodiment, the lower left corner of the housing body 32 is open to match the position of the terminal block 81, which will be described later. Note that if the position of the terminal block 81 is the lower right corner of the air layer D1, as shown in FIG. 3, the corner that is open in the housing body 32 is the lower right corner.

(2-4) Housing Block The housing block 32B is made of resin, and is attached to an open corner of the housing body 32. The housing block 32B has two insertion holes 321. Wires from the power system (L1-phase or L2-phase voltage side wire, and neutral wire: not shown) are inserted into the two insertion holes 321. The wires inserted into the housing 3 from the insertion holes 321 of the housing block 32B are connected to a terminal block 81, which will be described later.

A portion of the heat generated in the power supply board 80 inside the housing 3 and transmitted to the housing body 32 is transmitted to the housing block 32B and dissipated from the housing block 32B to the outside. In other words, the housing block 32B that constitutes the housing 3 also contributes to dissipating the heat generated in the power supply board 80, and is part of the second heat dissipation mechanism.

(2-5) Front Cover The front cover 31 is attached to the open front surface of the housing body 32.

The front cover 31 is attached to the peripheral end surface 320 on the front side of the housing body 32 via the heat sink A1 and the heat insulating member C1.

The front cover 31 has a pair of legs 31F, and the outlet block 15 passes between the pair of legs 31F.

A portion of the heat generated in the communication board (11 and/or 12) is transferred to the front cover 31 via the heat absorber A1 and the exposed portion B1, and is released to the outside from the front cover 31. In other words, the front cover 31 that constitutes the housing 3 contributes to the dissipation of heat generated in the communication board (11 and/or 12) and is part of the first heat dissipation mechanism.

The heat generated by the power supply board 80 inside the housing 3 is not easily transmitted to the front cover 31 because a heat insulating member C1 is interposed between the front cover 31 and the peripheral end surface 320 (described later) of the housing body 32.

(2-6) Heat Dissipation Material The electric device 1 further includes a first heat dissipation material T1, a second heat dissipation material T2, and a third heat dissipation material T3.

The first heat dissipation material T1 is disposed between the heat absorber A1 and the first communication board 11.

The arrangement referred to here means that the first heat dissipation material T1 is sandwiched between the heat absorber A1 and the first communication board 11, and the first heat dissipation material T1 is in direct contact with both the heat absorber A1 and the first communication board 11. However, even if there is an air layer or other intervening material between the first heat dissipation material T1 and at least one of the heat absorber A1 and the first communication board 11, the effect of increasing the heat absorption efficiency can be obtained. Note that such matters also apply to the second heat dissipation material T2 and the third heat dissipation material T3.

This allows the heat generated by the first communication board 11 to be efficiently absorbed by the heat absorber A1 and dissipated from the exposed portion B1.

The second heat dissipation material T2 is disposed between the heat absorber A1 and the second communication board 12. This allows the heat generated in the second communication board 12 to be efficiently absorbed by the heat absorber A1 and dissipated from the exposed portion B1.

The third heat dissipation material T3 is disposed between the power supply board 80 and the metal part (the housing body 32) of the housing 3. More specifically, the third heat dissipation material T3 is sandwiched between the power supply board 80 and the rear surface of the housing body 32. This allows the heat generated by the power supply board 80 to be efficiently transferred to the housing body 32 and dissipated to the outside of the housing 3.

In this way, the first heat dissipation material T1 and the second heat dissipation material T2 are part of the first heat dissipation mechanism and have the effect of improving the heat dissipation efficiency of heat generated on the communication board (first communication board 11 and second communication board 12) side.

On the other hand, the third heat dissipation material T3 is part of the second heat dissipation mechanism and has the effect of improving the efficiency of dissipating heat generated in the power supply board 80. This more effectively prevents the shortening of the life span of components such as electrolytic capacitors mounted on the power supply board 80.

(2-7) Heat Insulating Member The heat insulating member C1 is sandwiched between the heat absorber A1 and the metal portion of the housing 3 (housing body 32).

In this way, by insulating the heat absorber A1 from the metal part of the housing 3 with the insulating member C1, heat conduction from the heat absorber A1 to the housing 3 is inhibited, and the temperature rise of the power supply board 80 inside the housing 3 is suppressed.

In particular, even if the heat dissipation efficiency of the first heat dissipation mechanism is improved by the first heat dissipation material T1 and the second heat dissipation material T2, the increase in heat transferred from the first heat dissipation mechanism side to the second heat dissipation mechanism side is suppressed by the insulating member C1, and the temperature rise of the power supply board 80 is suppressed.

This more effectively avoids shortening the lifespan of components such as electrolytic capacitors mounted on the power supply board 80.

In this embodiment, the heat insulating member C1 is a frame-shaped heat insulating member that is sandwiched between the heat absorber A1 and the peripheral end surface 320 on the front side of the housing body 32. In other words, the heat insulating member C1 has approximately the same shape as the peripheral end surface 320 of the housing body 32.

In this way, by insulating the heat absorber A1 from the peripheral end surface 320 of the housing body 32 with a heat insulating member C1 having the same shape as the peripheral end surface 320, heat conduction from the heat absorber A1 to the housing 3 can be effectively inhibited with a small amount of insulating material.

(2-8) Screw The electric device 1 further includes a screw J1. The screw J1 is a member for fixing the heat sink A1 and the metal portion of the housing 3 (the housing main body 32).

The screw J1 secures the heat sink A1 and the housing body 32, which is the metal part of the housing 3, to the front cover 31, which is the plastic part of the housing 3.

In more detail, the heat sink A1 and the housing body 32 are fixed to the front cover 31 by three screws J1, for example, as shown in FIG. 6.

The heat sink A1 has three insertion holes A11 through which the three screws J1 are respectively inserted. The housing body 32 has three insertion holes 32J through which the three screws J1 are respectively inserted. The front cover 31 has three screw holes 31J through which the three screws J1 are respectively screwed.

The tip ends of the three screws J1 are inserted through the insertion holes 32J and A11 and screwed into the screw holes 31J, thereby fixing the heat sink A1 and the housing body 32 to the front cover 31.

In this embodiment, the screw J1 is made of an insulating material. An insulating material is a material that has electrical insulation properties. The insulating material for the screw J1 is, for example, ceramic, but may also be resin.

By constructing the screw J1 from an insulating material, electrical insulation between the heat sink A1 and the housing body 32 can be ensured.

In addition, by using an insulating material to reduce the thermal conductivity of the screw J1, heat conduction from the communication board (11 and/or 12) to the metal part of the housing 3 (housing body 32) via the screw J1 is inhibited, and the temperature rise of the power supply board 80 inside the housing 3 is further suppressed. As a result, the effect of preventing the shortening of the lifespan of components such as electrolytic capacitors mounted on the power supply board 80 can be further improved.

(2-9) Terminal Block and Insulating Plate The electric device 1 further includes a terminal block 81 and an insulating plate 82. The terminal block 81 is disposed between the second communication board 12 and the power supply board 80 (i.e., the air layer D1 described above). The terminal block 81 in this embodiment is a quick-connect terminal (screwless terminal), and is disposed in the lower left corner of the air layer D1, as shown in FIG.

However, the terminal block 81 may be a type of terminal that uses screws to secure the wiring. Also, the terminal block 81 may be placed in the lower right corner of the air layer D1, or may be placed anywhere in the air layer D1.

The terminal block 81 is connected to the power supply board 80. The above-mentioned wiring inserted into the housing 3 through the insertion hole 321 of the housing block 32B is also connected to the terminal block 81. AC power from the power system is supplied to the power supply board 80 via the wiring and the terminal block 81.

The terminal block 81 may be connected to a terminal block (described later) in the outlet block 15 via a feeder wiring (not shown) (described later). In this case, AC power from the power system to the terminal block 81 is supplied to the power supply board 80 and the load connected to the outlet block 15.

The insulating plate 82 is provided between the second communication board 12 and the terminal block 81. This provides electrical insulation between the second communication board 12 and the terminal block 81.

(2-10) Fixed Plate and Cover Plate The electric device 1 further includes a fixed plate 14 and a cover plate 13 .

The fixed plate 14 is fixed to the exposed portion B1, and the cover plate 13 is attached to the fixed plate 14 so as to cover the front surface of the fixed plate 14.

The fixing plate 14 has an opening 140 through which the outlet block 15 and the front cover 31 penetrate. The cover plate 13 also has a window hole 130 through which the outlet block 15 and the front cover 31 penetrate.

The opening 140 of the fixed plate 14 has a size that is approximately the same as or slightly smaller than the front cover 31. The window hole 130 of the cover plate 13 has a size that is slightly smaller than the opening 140 of the fixed plate 14.

As mentioned above, the outlet block 15 penetrates the front cover 31. The outlet block 15 and the front cover 31 then penetrate the window hole 130 of the cover plate 13 and the opening 140 of the fixing plate 14.

A portion of the heat generated in the communication board (11 and/or 12) and transferred to the exposed portion B1 via the heat absorber A1 is transferred to the cover plate 13 via the fixed plate 14 and is released to the outside of the housing 3. In other words, the cover plate 13 and the fixed plate 14 are also part of the first heat dissipation mechanism and contribute to the dissipation of heat generated in the communication board (11 and/or 12).

(2-11) Outlet Block The electric device 1 further includes an outlet block 15. The outlet block 15 is made of resin, and is connected to wiring (not shown) from an electric power system.

In this embodiment, the outlet block 15 has an insertion hole (not shown) formed on the back side, and a terminal block (not shown) such as a quick-connect terminal is stored inside. Wiring from the power system is inserted into the outlet block 15 from the insertion hole and connected to the terminal block. AC power from the power system is supplied to the outlet block 15 via the wiring and the terminal block.

The outlet block 15 can also be used to connect the plugs of loads such as home appliances. When a load plug is connected to the socket on the front side of the outlet block 15, AC power is output from the power system to the load via the wiring, the outlet block 15, and the plug.

In this embodiment, the wiring inserted into the above-mentioned insertion hole of the outlet block 15 and the wiring inserted into the insertion hole 321 of the housing block 32B are separate wiring. However, the wiring to the outlet block 15 may be a "feed-in wiring" from the terminal block 81 in the housing block 32B.

In other words, the terminal block in the outlet block 15 may be connected to the terminal block 81 in the housing block 32B via the forwarding wiring. In this case, when a load plug is connected to the outlet block 15, a portion of the AC power from the power system to the terminal block 81 is supplied to the power supply board 80, and another portion is supplied to the load via the forwarding wiring and the plug.

(3) Specific Example 1
The electric device 1 in the specific example 1 is an embedded wiring device having a wired communication function for performing wired communication, a wireless communication function for performing wireless communication, a conversion function for performing conversion between wired signals and wireless signals, and a function of an outlet for supplying power from a power system to a load such as a home appliance. The wired communication is PLC, and the wireless communication is Wi-Fi communication.

That is, in specific example 1, the wireless communication circuit implemented on the first communication board 11 is a Wi-Fi circuit that performs Wi-Fi communication, and the wired communication circuit implemented on the second communication board 12 is a PLC circuit that performs PLC.

In addition, in the electrical device 1 of specific example 1, a conversion circuit (not shown) that converts between a PLC-type wired signal (PLC signal) and a Wi-Fi-type wireless signal (Wi-Fi signal) is mounted on the second communication board 12. However, the conversion circuit may be mounted on, for example, the first communication board 11 or on another board (not shown), and its location is not important.

Such an electrical device 1 may be, for example, a wireless access point with a built-in outlet or a router, but the type is not important.

(4) Specific Example 2
The electric device 1 in the second embodiment is the same as the electric device 1 in the first embodiment except that the outlet function is omitted.

That is, in specific example 2, the outlet block 15 is omitted from the configuration of Figures 1 to 4. In addition, the front cover 31 does not have a pair of legs 31F, the mounting frame 2 does not have a window 20, and the window hole 130 of the cover plate 13 is approximately the same size as the front cover 31. Furthermore, the longitudinal sizes of the cover plate 13, the fixing plate 14, and the mounting frame 2 are also shortened in accordance with the omission of the outlet block 15.

Such an electrical device 1 may be, for example, a wireless access point or a router, but the type is not important.

(5) Specific Example 3
The electric device 1 in the third embodiment is the same as the electric device 1 in the second embodiment except that the two functions of wired communication and signal conversion are further omitted.

That is, in specific example 3, the second communication board 12 and the second heat dissipation material T2 are further omitted from the configurations shown in Figures 1 to 4.

Such an electrical device 1 may be, for example, a wireless access point or a wireless router, but the type is not important.

(6) Specific Example 4
The electric device 1 in the fourth embodiment is the same as the electric device 1 in the second embodiment except that the two functions of wireless communication and signal conversion are further omitted.

That is, in specific example 4, the first communication board 11 and the first heat dissipation material T1 are further omitted from the configurations shown in Figures 1 to 4.

Such an electrical device 1 may be, for example, a PLC adapter or a wired router, but the type is not important.

(7) Summary The electric device (1) according to the first aspect includes a heat absorber (A1), a communication board (11 and/or 12), a housing (3), a power supply board (80), an exposed portion (B1), and a heat insulating member (C1). The communication board (11 and/or 12) is disposed on at least one of the front and rear surfaces of the heat absorber (A1). At least a portion of the housing (3) is made of metal. The power supply board (80) is disposed within the housing (3). The exposed portion (B1) is thermally coupled to the heat absorber (A1), and at least a portion of the exposed portion is exposed to the outside of the housing (3). The heat insulating member (C1) is sandwiched between the heat absorber (A1) and a metal portion (housing body 32) of the housing (3).

In this embodiment, heat generated in the communication board is dissipated from the exposed portion to the outside via the heat absorber, and heat generated in the power supply board is dissipated to the outside of the housing via the metal part of the housing. In addition, the heat absorber and the metal part of the housing are thermally insulated (insulated) by a heat insulating member.

This increases the efficiency of dissipating heat generated in the communication board and power board to the outside, while suppressing the temperature rise in the power board caused by heat conduction from the communication board to the metal part of the housing via the heat sink. As a result, it is possible to prevent a shortened life span of circuit components such as electrolytic capacitors mounted on the power board.

In the electrical device (1) according to the second aspect, in the first aspect, the exposed portion (B1) constitutes a part of the mounting frame (2). The mounting frame (2) is a frame for mounting the housing (3) to a mounting target (such as a switch box (not shown)).

According to this aspect, at least a portion of the mounting frame (e.g., a portion other than the heat absorbing portion, or the entire frame) can contribute to heat dissipation.

In the electrical device (1) according to the third aspect, in the second aspect, the mounting frame (2) is a mounting frame for a large rectangular interconnect wiring device.

According to this aspect, at least a portion of the mounting frame of the large rectangular interconnect wiring device can contribute to heat dissipation.

In the electric device (1) according to the fourth aspect, in any one of the first to third aspects, the heat absorber (A1) and the exposed portion (B1) are integrally formed as the same member.

According to this embodiment, the thermal conductivity is the same between the heat absorber and the exposed portion, and there is no impediment to heat conduction due to inclusions, so the heat dissipation efficiency can be improved.

In the electric device (1) according to the fifth aspect, in any of the first to fourth aspects, the communication board (11 and/or 12) includes a first communication board (11) and a second communication board (12). The first communication board (11) is disposed on the front side of the heat absorber (A1), and the second communication board (12) is disposed on the rear side of the heat absorber (A1).

According to this aspect, it is possible to suppress the temperature rise of the power supply board caused by the heat generated by the first and second communication boards arranged on the front and rear sides of the heat absorber being transferred to the metal part of the housing via the heat absorber and the exposed part. As a result, even if a lot of heat is generated by the two communication boards, it is possible to prevent the shortening of the lifespan of components such as electrolytic capacitors mounted on the power supply board.

The electric device (1) according to the sixth aspect is the fifth aspect, further comprising a first heat dissipation material (T1). The first heat dissipation material (T1) is disposed between the heat absorber (A1) and the first communication board (11).

According to this aspect, the heat generated in the first communication board can be efficiently absorbed by the heat absorber.

The seventh aspect of the electrical device (1) is the fifth or sixth aspect, further comprising a second heat dissipation material (T2). The second heat dissipation material (T2) is disposed between the heat absorber (A1) and the second communication board (12).

According to this aspect, the heat generated in the second communication board can be efficiently absorbed by the heat absorber.

The electric device (1) according to the eighth aspect is any one of the fifth to seventh aspects, and further includes a third heat dissipation material (T3). The third heat dissipation material (T3) is disposed between the power supply board (80) and the metal part (housing body 32) of the housing (3).

This allows the heat generated by the power supply board to be efficiently transferred to the metal parts of the housing and dissipated outside the housing.

The ninth aspect of the electrical device (1) is any one of the fifth to eighth aspects, in which one of the first communication board (11) and the second communication board (12) is a mounting board on which circuit components constituting a wireless communication circuit are mounted.

This aspect makes it possible to suppress the temperature rise of the power supply board caused by heat generated in the first communication board for wireless communication being transferred to the metal part of the housing via the heat absorber.

The electrical device (1) according to the tenth aspect is the ninth aspect, in which the other of the first communication board (11) and the second communication board (12) is a mounting board on which circuit components constituting a wired communication circuit are mounted.

This aspect makes it possible to suppress the temperature rise of the power supply board caused by heat generated in the second communication board for wired communication being transferred to the metal part of the housing via the heat absorber.

The electric device (1) according to the eleventh aspect is any one of the fifth to tenth aspects, in which the first communication board (11 or 12) is a mounting board (11) on which circuit components constituting a wireless communication circuit are mounted. The second communication board (12) is a mounting board (12) on which circuit components constituting a wired communication circuit are mounted. An air layer (D1) exists between the second communication board (12) and the power supply board (80).

This aspect improves the insulation between the second communication board for wired communication and the power supply board.

The electric device (1) according to the twelfth aspect is any one of the fifth to eleventh aspects, and further includes a screw (J1). The heat sink (A1) and the metal part (casing body 32) of the housing (3) are fixed by the screw (J1).

This embodiment allows the heat sink to be fixed to the metal part of the housing.

The electrical device (1) according to the thirteenth aspect is the twelfth aspect, in which the screw (J1) is made of a material having electrical insulation properties (insulating material).

According to this aspect, by using an insulating material to reduce the thermal conductivity of the screw, heat conduction from the communication board to the metal part of the housing via the screw is inhibited, and the temperature rise of the power supply board is further suppressed. As a result, it is possible to further prevent the shortening of the lifespan of components such as electrolytic capacitors mounted on the power supply board.

The electric device (1) according to the fourteenth aspect is any one of the fifth to thirteenth aspects, in which the metal part (32) of the housing (3) is a box-shaped housing body (32) with an open front. The heat insulating member (C1) is a frame-shaped heat insulating member sandwiched between the heat absorber (A1) and a peripheral end face (320) of the housing body (32) that runs along the periphery of the open front.

According to this aspect, by insulating the heat absorber and the peripheral end surface of the housing body that houses the power supply board with a frame-shaped insulating member, heat conduction from the heat absorber to the housing body is inhibited, and the temperature rise of the power supply board can be suppressed.

The electric device (1) according to the fifteenth aspect is the electric device (1) according to the fourteenth aspect, further comprising a front cover (31). The front cover (31) is attached to the open front surface of the housing body (32) via the heat absorber (A1) and the heat insulating member (C1).

According to this embodiment, part of the heat generated in the communication board is transferred to the front cover via the heat absorber and is released to the outside from the front cover. In other words, the front cover can also contribute to heat dissipation.

In the electric device (1) according to the 16th aspect, in the 15th aspect, one corner of the housing body (32) is further opened. The electric device (1) further includes a socket block (15) and a housing block (32B). A load plug is connected to the socket block (15). The housing block (32B) is attached to the opened one corner of the housing body (32). The housing block (32B) is made of resin and has an insertion hole (321). A wiring (not shown) to the socket block (15) is inserted into the insertion hole (321).

According to this embodiment, a portion of the heat generated in the communication board is released to the outside from the outlet block. In addition, another portion of the heat generated in the communication board is released to the outside via the insertion block. In other words, the outlet block and the insertion block can also contribute to heat dissipation.

The electric device (1) according to the seventeenth aspect is the same as the sixteenth aspect, but further includes a terminal block (81) and an insulating plate (82). The terminal block (81) is disposed in the air layer (D1) between the second communication board (12) and the power supply board (80), and the wiring inserted through the insertion hole (321) is connected to the terminal block (81). The insulating plate (82) is provided between the second communication board (12) and the terminal block (81).

This aspect provides electrical insulation between the second communication board and the terminal block to which the wiring to the outlet block is connected.

The electric device (1) according to the 18th aspect is the 17th aspect, and further includes a fixing plate (14) and a cover plate (13). The fixing plate (14) is fixed to the exposed portion (B1) and has an opening (140) through which the outlet block (15) and the front cover (31) penetrate. The cover plate (13) is attached to the fixing plate (14) so as to cover the front surface of the fixing plate (14), and has a window hole (130) through which the outlet block (15) and the front cover (31) penetrate.

According to this embodiment, heat generated in the communication board and transferred to the exposed portion via the heat absorber is transferred to the cover plate via the fixing plate and is released outside the housing. In other words, the cover plate and the fixing plate can also contribute to heat dissipation.

1 Electric device 11 First communication board (communication board)
12 Second communication board (communication board)
REFERENCE SIGNS LIST 13 Cover plate 14 Fixing plate 15 Outlet block 2 Mounting frame 3 Housing 31 Front cover 32 Housing body 320 Peripheral end surface 32B Housing block 321 Insertion hole 80 Power supply board 81 Terminal block 82 Insulating plate A1 Heat sink B1 Exposed portion C1 Heat insulating member D1 Air space J1 Screw T1 First heat dissipation material T2 Second heat dissipation material T3 Third heat dissipation material

Claims (18)

A heat absorber;
a communication board disposed on at least one of a front surface and a rear surface of the heat sink;
A housing at least partially made of metal;
a power supply board disposed within the housing;
an exposed portion that is thermally coupled to the heat sink and at least a portion of which is exposed to the outside of the housing;
and a heat insulating member sandwiched between the heat sink and a metal portion of the housing.
Electrical equipment. The exposed portion constitutes a part of a mounting frame for mounting the housing to a mounting object.
10. The electrical device of claim 1. The mounting frame is a mounting frame for a large rectangular interconnect wiring device.
3. An electrical device according to claim 2. The heat sink and the exposed portion are integrally formed as a same member.
An electrical device according to any one of claims 1 to 3. The communication board includes:
A first communication board disposed in front of the heat sink;
A second communication board disposed on a rear surface of the heat sink.
An electrical device according to any one of claims 1 to 4. a first heat dissipation material disposed between the heat sink and the first communication board;
6. An electrical device according to claim 5. Further comprising a second heat dissipation material disposed between the heat sink and the second communication board.
7. An electrical device according to claim 5 or 6. a third heat dissipation material disposed between the power supply board and the metal portion of the housing;
An electrical device according to any one of claims 5 to 7. one of the first communication board and the second communication board is a mounting board on which circuit components constituting a wireless communication circuit are mounted;
An electrical device according to any one of claims 5 to 8. the other of the first communication board and the second communication board is a mounting board on which circuit components constituting a wired communication circuit are mounted;
10. An electrical device according to claim 9. the first communication board is a mounting board on which circuit components constituting a wireless communication circuit are mounted,
the second communication board is a mounting board on which circuit components constituting a wired communication circuit are mounted,
an air layer is present between the second communication board and the power supply board;
An electrical device according to any one of claims 5 to 10. The heat sink further includes a screw for fixing the heat sink and the metal portion of the housing.
An electrical device according to any one of claims 5 to 11. The screw is made of an electrically insulating material.
13. An electrical device according to claim 12. the metal portion of the housing is a box-shaped housing main body having an open front surface,
The heat insulating member is a frame-shaped heat insulating member sandwiched between the heat absorber and a peripheral end surface along the peripheral edge of the open front surface of the housing main body.
An electrical device according to any one of claims 5 to 13. The housing further includes a front cover attached to the open front surface of the housing body via the heat sink and the heat insulating member.
15. An electrical device according to claim 14. The housing body has one corner further opened,
a socket block to which a load plug is connected;
The housing block is made of resin and is attached to the open corner of the housing body. The housing block has an insertion hole into which a wiring to the outlet block is inserted.
16. An electrical device according to claim 15. a terminal block disposed in an air space between the second communication board and the power supply board, the terminal block being connected to the wiring inserted through the insertion hole;
an insulating plate provided between the second communication board and the terminal block,
17. An electrical device according to claim 16. a fixing plate fixed to the exposed portion and having an opening through which the outlet block and the front cover pass;
A cover plate is attached to the fixing plate so as to cover the front surface of the fixing plate, and has a window hole through which the outlet block and the front cover pass.
20. An electrical device according to claim 17.

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