JP7551806B2 - Microphones and Electronics - Google Patents

Description

The present invention relates to a thin microphone, a packaging method used in the manufacture of the microphone, and an electronic device incorporating the microphone.
Background Art

Microphones are widely installed in mobile phones, smartphones, tablet computers, etc. Such microphones are constructed by placing a die equipped with a transducer on a substrate and attaching a cover. An opening is provided in the substrate or cover, and sound waves flow in through the opening and reach the diaphragm of the transducer, causing the diaphragm to vibrate, and the vibrations are converted into an electrical signal and output (e.g., Patent Documents 1 to 4).
A microphone requires an acoustic space, and the acoustic space is the space surrounded by the substrate and cover or the space surrounded by the die and substrate. The substrate on which the die is mounted has electrodes formed thereon for extracting electrical signals from the die, and the die and the electrodes are generally electrically connected by wire bonding. Printed circuit boards and ceramic substrates are often used as such substrates.

US7166910B2 US6781231B1 US2005/0018864A1 US7439616B2

However, in such a microphone, since the die is mounted on a substrate, the thickness of the microphone is approximately the same as the thickness of the substrate, making it difficult to make the microphone thinner.

SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, an object of the present invention is to provide a slimmed-down microphone, a packaging method used in the manufacture of the microphone, and an electronic device incorporating the microphone.

The concept of the present invention is as follows.
[1] A die equipped with a transducer;
a frame having a hole penetrating in the vertical direction and holding the die on a wall surface of the hole via an adhesive layer;
a cover attached to the frame so as to sandwich a space above the die;
Equipped with
The underside of the die substantially constitutes a portion of the outer surface of the microphone.
[2] The microphone according to [1] above,
A mounting substrate on which the microphone is mounted;
An electronic device comprising:
[3] A first step of placing a die having a transducer mounted thereon in a hole of a frame having a hole penetrating in a vertical direction, and holding the die on a wall surface of the hole in the frame via an adhesive layer;
a second step of attaching a cover to the frame so as to surround a space above the die;
A packaging method comprising:

The concept of the present invention is not limited to the above, but also includes what is shown step by step in the embodiments described below.

The present invention allows microphones and electronic devices to be made thinner.

1 is a cross-sectional view illustrating a microphone according to a first embodiment of the present invention. 2 is an enlarged cross-sectional view of a portion where a cover is attached to a frame body shown in FIG. 1 . FIG. 11 is a cross-sectional view illustrating a microphone according to a second embodiment of the present invention. FIG. 11 is a cross-sectional view illustrating a microphone according to a third embodiment of the present invention. FIG. 11 is a cross-sectional view illustrating a microphone according to a fourth embodiment of the present invention. 1A-1D illustrate different stages in a packaging method according to an embodiment of the present invention. FIG. 6B shows the next step of FIG. 6A. FIG. 6C illustrates the next step in FIG. 6B. FIG. 6D shows the next step of FIG. 6C. 13 shows a microphone according to another embodiment of the present invention, particularly showing the relationship between the die, the frame and the cover. FIG. FIG. 8 shows a microphone according to another embodiment of the present invention, illustrating a relationship between the die, the frame, and the cover, which is different from that shown in FIG. 7. FIG. 9 shows a microphone according to another embodiment of the present invention, illustrating a relationship between the die, the frame, and the cover, which is different from that shown in FIGS. 7 and 8. 13 shows a microphone according to another embodiment of the present invention, in which electrodes for external connection are attached to the side of the frame. FIG. FIG. 11 is a bottom view of a frame with a cover in a microphone showing another embodiment of the present invention. FIG. 11B is a cross-sectional view of the frame with cover shown in FIG. 11A. 5A-5D illustrate different stages of a packaging method according to another embodiment of the present invention. FIG. 11D shows the next step in FIG. FIG. 1 is a diagram illustrating a part of an electronic device according to an embodiment of the present invention. 1 is a diagram illustrating an example of a microphone mounting portion on a mounting board in an electronic device according to an embodiment of the present invention. 10 is a diagram illustrating another example of a microphone mounting portion on a mounting board in the electronic device according to the embodiment of the present invention. FIG.

The following describes in detail the embodiment of the present invention with reference to the attached drawings.

[Microphone according to the first embodiment]
1 is a cross-sectional view showing a schematic diagram of a microphone according to a first embodiment of the present invention. The microphone 1 according to the first embodiment of the present invention includes a die 11 on which a transducer is mounted, a frame 12 having a hole 12A penetrating vertically and holding the die 11 on the wall surface of the hole 12A via an adhesive layer 14, and a cover 13 attached to the frame 12 so as to sandwich a space above the die 11, with the underside of the die 11 substantially constituting a part of the outer surface.

The die 11 is equipped with a transducer, and the transducer includes, for example, a membrane and a counter electrode, and converts the vibration of the membrane caused by the acoustic waves into an electric signal. The die 11 may also include a signal processing circuit that processes the electric signal from the transducer.

The frame 12 has a structure that houses the die 11 and surrounds the periphery of the die 11.
2 has a hole (opening) 12A penetrating vertically to accommodate the die 11, and the hole 12
The opening shape of A has an endless shape, for example, an annular shape. The frame 12 has an inner peripheral surface, which is the wall surface of the hole 12A, and an outer peripheral surface. As shown in FIG. 1, the outer peripheral surface of the frame 12 has almost the same dimensions between the upper and lower surfaces. On the other hand, the inner peripheral surface of the frame 12 may have almost the same dimensions between the upper and lower surfaces, but the distance from the approximate center to the inner peripheral surface of the lower surface in a plan view is shorter than that of the upper surface. This is because wiring is provided inside the frame 12, and a terminal 17 on the inside of the wiring and the die 11 are connected by wire 16.

The frame 12 may have, for example, a structure in which ceramic materials are layered and a conductive paste is applied to the wiring portions and baked, or a structure in which conductive and non-conductive layers are multi-layered. In the embodiment shown in Fig. 1, the frame 12 has an inner terminal 17 and an outer terminal 18 electrically connected by internal wiring 19. For example, the terminal 17 is provided on the inner peripheral surface of the frame 12 at the upper end of the surface on which the adhesive layer 14 is provided, on a surface parallel to the surface on which the cover 13 is attached. The outer terminal 18 is provided on the surface on which the cover 13 is attached.

The cover 13 is attached to the upper surface of the frame 12 and is a member that closes the opening at the upper end of the frame 12. The cover 13 may be provided with an inlet/outlet 13A for sound waves at a predetermined position. Whether or not to provide this depends on the specifications.

The adhesive layer 14 is provided between the sidewall of the die 11 and the inner peripheral surface of the frame 12, and the die 11 is held to the frame 12 via the adhesive layer 14. The adhesive layer 14 may be provided between the upper and lower surfaces of the die 11, or may be provided on a part of them. The adhesive layer 14 is formed by curing an adhesive. The adhesive layer 14 may contain a filler, and the filler has either or both of a conductive filler and a non-conductive filler.

The adhesive layer 23 is provided between the upper surface of the frame 12 and the cover 13, and adheres the cover 13 to the frame 12.
The conductive paste is hardened in the adhesive layer 23 in the portion where the internal wiring is to be provided.
The majority of the rest is made of hardened non-conductive adhesive.

In the microphone 1 according to the first embodiment, the die 11 is held from the side by the frame 12 via the adhesive layer 14 on the wall surface of the hole 12A penetrating in the vertical direction, so there is no need to attach a thick substrate to the bottom surface of the die 11 as in the past. Therefore, the bottom surfaces of the die 11 and the frame 12 are attached opposite to the mounting surface 5 of an electronic device such as a mobile phone, a smartphone, or a tablet computer. In this way, since the microphone does not employ a configuration in which a die is placed on a substrate as in the past, the microphone 1 can be made thinner by the thickness of the substrate.

The lower surface of the die 11 and the lower surface of the frame 12 are substantially flush with each other, and the lower surface of the frame 12 substantially constitutes a part of the outer surface. Furthermore, the lower surface of the die 11 substantially constitutes a part of the outer surface.
Here, "substantially" means that the adhesive may be hardened and attached to the lower surfaces of the die 11 and the frame 12, or that the lower surface and the protective layer form the outer surface. This explanation is similar to other embodiments.

Here, the difference between the "frame" 12 in the embodiment of the present invention and the "substrate" in the conventional microphone will be described. The "substrate" in the conventional microphone is a plate-like component on which wiring is formed and which has a surface on which electronic components such as passive elements, active elements, and various chips are mounted, and this mounting surface is a surface perpendicular to the thickness direction. On the other hand, the "frame" 12 in the embodiment of the present invention does not have a plate shape, and the wall surface of the hole 12A has a step as shown in FIG. 1, or is a cylinder as shown in FIGS. 7 and 8 described later. The step is provided to arrange terminals for internal connection. The frame 12 holds the die 11 of the microphone 1 on its inner peripheral surface, which is a surface parallel to the thickness direction , via an adhesive layer 14. Therefore, the frame 12 does not have a function of mounting wiring or components, unlike the substrate of the conventional microphone described above.

The frame 12 has a hole 12A with a size or area that is a predetermined ratio to the size or area of the outer shape of the frame in a plan view. For example, if the size of the hole 12A is a×b (where a≦b), the width of the frame 12 has a size of a/2 or less. To give a specific numerical example, the width of the frame 12 is 1 mm or less. In another example, the area of the hole 12A when viewed from above the die 11 is 1 mm or less than the area of the outer shape of the frame 1.
2. The area occupied by the microphone 1 on the mounting surface 5 can be minimized, that is, the microphone footprint can be minimized relative to that of the die while reducing the height of the microphone 1. Furthermore, when a step is provided on the frame, the height of the wiring by wire bonding can be reduced by providing a terminal for internal connection thereon. These explanations regarding the frame 12 are also applicable to the other embodiments.

Here, in order to provide an adhesive layer 14 between the die 11 and the frame body 12, hardened adhesive may remain on the underside of the die 11 or the underside of the frame body 12, particularly on the underside of the boundary between the die 11 and the frame body 12 and around the boundary.

In the microphone 1 according to the first embodiment, the cover 1 is preferably
A space is defined by the die 11 and adhesive layer 14 from the bottom, and by the frame 12 and adhesive layer 23 from the side. This space is called a package space.
The space in the cavity is distinguished from the space in the cavity provided on the opposite side of the cover 13 across the membrane 1. The package space interacts with the space in the cavity provided by the membrane. For example, when sound waves flow into the membrane from the cavity side, the package space functions as a back volume. Conversely, when sound waves flow into the membrane from the package space side, the space in the cavity functions as a back volume. There are also cases where sound waves flow in from both the package space side and the cavity side, and in this case, the microphone shows directionality. Note that there are also configurations in which the mounting surface 5 of the electronic device is provided with an inlet and outlet for sound waves. The inlet and outlet are not shown. The electronic device may be attached on the cover 13 side, and in that case, the mounting surface 5 of the electronic device is provided on the cover 13 side, but this configuration is not shown in the figure.

In the microphone 1 according to the first embodiment, the frame 12 has a hole (opening) 12A penetrating in the up-down direction, i.e., in the thickness direction. In other words, the frame 12 has a width corresponding to the dimension between the outer peripheral surface and the inner peripheral surface, and this width forms the lower surface of the frame 12. However, this does not prevent the frame 12 from having a part protruding inward from the inner peripheral surface. This protruding part forms a step,
For example, a terminal for internal connection can be arranged on the step, such as by providing a pad for electrical connection between the die and the frame, and the step is intended to facilitate packaging, not to place the die on. In the frame 12, the wall surface of the through hole 12A has a step, so that the height of the wiring by wire bonding can be suppressed, and therefore the height of the microphone 1 can be reduced while minimizing the footprint of the microphone 1 relative to that of the die.

FIG. 2 is an enlarged cross-sectional view of a portion where a cover is attached to the frame shown in FIG.
In the frame body 12, the outer terminal 18 is connected to the upper end of a via as an internal wiring 19. The cover 13 has a via as an internal wiring 20, and a terminal 21 is provided at the lower end of the inner side of the internal wiring 20, and a terminal 22 for mounting is provided at the upper end of the outer side of the internal wiring 20. Thus, a conductive paste serving as a connection portion 24 is provided between the outer terminal 18 of the frame body 12 and the terminal 21 of the cover 13, a non-conductive adhesive serving as an adhesive layer 23 is provided on the upper surface of the frame body 12 and the lower surface of the cover 13, and the conductive paste and the non-conductive adhesive are hardened to adhere the frame body 12 to the cover 13.

[Microphone according to the second embodiment]
3 is a cross-sectional view showing a schematic diagram of a microphone according to a second embodiment of the present invention. Like the microphone 1 according to the first embodiment, the microphone 2 according to the second embodiment includes a die 11 on which a transducer is mounted, a frame 12 having a hole 12A penetrating vertically and holding the die 11 on the wall surface of the hole 12A via an adhesive layer 14, and a cover 13 attached to the frame 12 so as to sandwich a space above the die 11, and the lower surface of the die 11 substantially constitutes a part of the outer surface.

The microphone 2 according to the second embodiment includes a die 11A on which a transducer is mounted and another die 11B on which a signal processing circuit is mounted. The die 11A and the other die 11B are held by a frame 12 via an adhesive layer 14A.
The frame 12 has a structure in which the die 11A and the other die 11B are accommodated in the frame 12 and the frame 12 surrounds the die 11A and the other die 11B as a unit. More specifically, the frame 12 has a through hole (hollow) 12A for accommodating the die 11A and the other die 11B. An adhesive layer 14B is provided between the side surface of the die 11A and the side surface of the other die 11B, and the adhesive layer 14B adheres the die 11A and the other die 11B to each other.
The side on which the adhesive layer 14B is provided is connected to the die 11A and the other die 11B.
B are adjacent side surfaces. The adhesive layer 14A is provided between a certain side surface of the die 11A and the inner peripheral surface of the frame 12, and is also provided between a certain side surface of the other die 11B and the inner peripheral surface of the frame 12, and the adhesive layer 14A holds the die 11A and the other die 11B to the frame 12. The die 11A and the other die 11B are electrically connected by a wire 16A, and the other die 11B and the inner terminal 17 are electrically connected by a wire 16B. The rest of the basic configuration is the same as that of the microphone 1 according to the first embodiment.

In the microphone 2 according to the second embodiment, the die 11A and the other die 11B are held from the sides by the wall surfaces of the hole 12A of the frame body 12.
There is no need to attach a thick substrate to the bottom surface of the die 11A, the other die 11B, and the frame 12 as in the past. Therefore, the bottom surfaces of the die 11A, the other die 11B, and the frame 12 are attached to face the mounting surface 5 of an electronic device such as a mobile phone, a smartphone, or a tablet computer. In this way, since the microphone does not adopt a configuration in which a die is placed on a substrate as in the past, it can be made thinner by the thickness of the substrate. Here, in order to provide an adhesive layer 14B between the die 11A and the other die 11B, and to provide an adhesive layer 14A between the die 11A and the frame 12 and between the other die 11B and the frame 12, there are cases in which hardened adhesive remains on the bottom surface of the die 11, the bottom surface of the other die 11B, and the frame 12, and especially on the bottom surface and the periphery of the boundary portion between the die 11, the other die 11B, and the frame 12.

3, an adhesive layer 14A is provided between the wall surface of the hole 12A in the frame 12 and the outer peripheral surface of the die 11A, an adhesive layer 14B is provided between the die 11A and another die 11B, and an adhesive layer 14A is provided between the wall surface of the hole 12A in the frame 12 and the outer peripheral surface of the other die 11B. In this way, the die 11A and the other die 11B are gathered together, and the components constituting the microphone 2 including the die 11A and the other die 11B are packaged.

[Microphone according to the third embodiment]
4 is a cross-sectional view showing a microphone according to a third embodiment of the present invention. The microphone 4 according to the third embodiment includes one or more dies 11 (11A, 11B), a frame 12, and a cover 13. The dies 11A and 11B are disposed in the frame 12, and the die 11 is disposed in the frame 12.
1A is fixed to the inner peripheral surface of the frame 12 via an adhesive layer 14A, and the die 11A and another die 11B
and the other die 11B is fixed to the wall surface of the hole 12A of the frame 12 via an adhesive layer 14A. The cover 13 is attached to the frame 12 so as to define a space above the dies 11A and 11B.

4, the microphone 3 according to the third embodiment includes a plurality of dies, with the die 11A mounting a transducer and the other die 11B mounting a signal processing circuit. An electric signal converted by the transducer of the die 11A is transmitted to the other die 11B via the wire 16A, and then further via the wire 16B, from the inner terminal 17 through the internal wiring 19, the terminal 18, the connection portion 24, the terminal 21, the internal wiring 20, and the terminal 22 (
2) and outputted to the outside, similarly to the second embodiment, and therefore description thereof will not be repeated.

In the microphone 3 of the third embodiment, the lower surface of the frame 12 is substantially flush with the lower surfaces of the die 11A and the other dies 11B, and a protective layer 15 is provided on both the lower surface of the frame 12 and the lower surfaces of the die 11A and the other dies 11B.

The protective layer 15 is a layer that protects the lower surfaces of the die 11A, the other die 11B, and the frame 12.
The protective layer 15 may be composed of only the adhesive layer 15A, or the protective layer 15 may have filler 15B dispersed in the adhesive layer 15A. The filler 15B preferably has a certain size, for example, a spherical shape, thereby maintaining the protective layer 15 in a certain state and maintaining the thickness of the protective layer 15 within a certain range.

In the microphone 4, the protective layer 15 contains the filler 15B, so that the adhesive layer 1
Even if the adhesive layer 15A is pressed, the adhesive layer 15A is prevented from spreading and becoming thin.

The filler 15B may be subjected to a surface treatment in order to improve wettability with the adhesive, for example, a surface treatment with a silane coupling agent.

Preferably, the filler 15B has electrical conductivity to prevent external noise from being mixed into the signals in the transducer and the signal processing circuit.

Here, the adhesive layer 15A may be made of the same material as either or both of the adhesive layers 14A and 14B. This allows the die 11A and the other die 11B to be held on the frame 12 via the adhesive layer 14A and the protective layer 15 to be formed at the same time.
Examples of materials for the adhesive layers 14A and 14B include epoxy resin, silicone resin, and polyimide resin.

The rest of the configuration is similar to the first and second embodiments, so the explanation will not be repeated.

[Microphone according to the fourth embodiment]
5 is a cross-sectional view showing a schematic diagram of a microphone according to a fourth embodiment of the present invention. In the microphone 4 according to the fourth embodiment, the mesh 30 is fixed to the protective layer 15 in the microphone 3 according to the third embodiment. That is, the mesh 30 is placed in contact with the protective layer 15. Here, the protective layer 15 fixing the mesh 30 includes a case where the mesh 30 is fixed on the lower surface side of the protective layer 15, a case where a part of the mesh 30 overlaps with the protective layer 15 and is provided within the protective layer 15, and a case where the protective layer 15 fixes the mesh 30 with all or most of the mesh 30 being provided within the protective layer 15.

As shown in the cross-sectional view of Fig. 5, the mesh 30 is provided below the lower surfaces of the die 11A and the other die 11B and the lower surface of the frame 12, and is fixed to the protective layer 15. In this way, the protective layer 15 holds the mesh 30. The mesh 30 may be any type of mesh that is crossed vertically or horizontally, and may be made of either metal or non-metal. A thin metal coating may be applied to the surface of a non-metallic mesh. The mesh 30 may have a wire diameter of several tens of µm, for example.
The mesh size is about 100 to several hundreds per inch. Therefore, even if the protective layer 15 and the mesh 30 are provided on the lower surfaces of the die 11A, the other die 11B, and the frame 12, the microphone 4 can be made thin.

Preferably, the mesh 30 is conductive and/or the protective layer 15 contains a conductive filler. This prevents external noise from being mixed into the signals in the transducer and the signal processing circuit. Note that when the protective layer 15 contains a conductive filler, the mesh 30 may be non-conductive.

In the microphone 4, for example, even if the mesh 30 is disposed in contact with the lower surface of the protective layer 15 and pressed from above, the presence of the mesh 30 prevents the protective layer 15 from becoming thin.

The mesh 30 may be subjected to a surface treatment in order to improve wetting with the adhesive, for example, by using a silane coupling agent.

In the fourth embodiment, the protective layer 15 may be made of the same material as the adhesive layers 14A and 14B. This allows the die 11A and the other die 11B to be held on the frame 12 via the adhesive layer 14A and the formation of the protective layer 15 to be performed simultaneously. The other configurations are similar to those of the first, second and third embodiments, and therefore will not be described repeatedly.

As described above, in the microphone according to each embodiment of the present invention, the die 11 carrying the transducer is disposed in the frame 12 and held from the side via the adhesive layer 14, or the die 11A carrying the transducer and the other die 11 carrying the signal processing circuit are disposed in the frame 12 and held from the side via the adhesive layer 14.
B are fixed via an adhesive layer 14B, and the die 11A and another die 11B are disposed within the frame 12 and held from the sides via the adhesive layers 14A, respectively.
A cover 13 is attached to the upper surface of the frame 12.
2 via an adhesive layer 14, or the die 11A and the other die 11B are laterally held by a frame 12 via an adhesive layer 14A.
In other words, in the embodiment of the present invention, the microphone does not adopt a configuration in which a die is mounted on a substrate as in the conventional microphone, and therefore the microphone can be made thinner by the thickness of the substrate.

As in the first and second embodiments, the lower surface of the frame 12 and the die 11 (11A, 11B
The lower surface of the adhesive layer 1 may be flush with the surface of the electronic device, and the lower surface may be in contact with the mounting surface 5 of the electronic device, such as a mobile phone, a smartphone, or a tablet computer. In this case, the adhesive may be partially cured and remain.

In one embodiment, the mounting surface 5 is provided with an inlet/outlet (not shown) for allowing the sound waves to flow into and out of a cavity in the die 11 or die 11A, and the cover 13 is provided with the inlet/outlet (not shown) for allowing the sound waves to flow into and out of a cavity in the die 11 or die 11A.
Unlike the above, the inlet/outlet 13A is not provided, so that the die 11 (11A, 11B), the frame 12,
The space surrounded by the cover 13 and the adhesive layer 14 functions as a back volume.

In another embodiment, no inlet/outlet is provided on the cavity side, and an inlet/outlet 13A is provided on the cover 13 as shown in Figures 1 and 3, so that the cavity on the mounting surface 5 side of the die 11 or die 11A functions as a back volume.

In yet another embodiment, sound waves enter from both the cavity provided in the die 11 or die 11A and the inlet/outlet 13A of the cover 13. In this case, the microphone has directional characteristics.

As in the third and fourth embodiments, the lower surface of the frame 12 and the lower surfaces of the die 11A and the other dies 11B are substantially flush with each other.
A protective layer 15 is provided on the lower surface of the substrate 1B. By providing such a protective layer 15,
The die 11A, the other die 11B and the frame 12 can be protected.

As in the third embodiment, the lower surface of the frame body 12 and the lower surfaces of the die 11A and other dies 11B are substantially flush, a protective layer 15 is provided on the lower surface of the frame body 12 and the lower surfaces of the die 11A and other dies 11B, and the protective layer 15 may contain the same material as the adhesive layer 14. Furthermore, the protective layer 15 holds the filler 15B, so that the thickness of the protective layer 15 is maintained within a certain range by the filler 15B, and the die 11A and other dies 11B are integrated with the frame body 12.
In particular, since the filler 15B is conductive, it can provide electromagnetic shielding, and it is possible to prevent external noise from being mixed into the signals of the transducer and the signal processing circuit. Furthermore, by providing a metal layer on either the front or back surface of the cover 13, it is possible to make it difficult for noise to be generated in the electrical signals in the transducer and the signal processing circuit.

As in the fourth embodiment, the lower surface of the frame 12 and the lower surfaces of the die 11A and the other dies 11B are substantially flush with each other, and a protective layer 15 is provided on the lower surface of the frame 12 and the lower surfaces of the die 11A and the other dies 11B. The protective layer 15 may contain the same material as the adhesive layer 14. Furthermore, the protective layer 15 fixes the mesh 30, and thus the die 11A and the other dies 11B are not adhered to each other.
and the frame 12 are integrated. The mesh 30 is conductive, which provides electromagnetic shielding and prevents external noise from being mixed into the signals of the transducer and the signal processing circuit. In addition, a metal layer is provided on either the front or back surface of the cover 13, which makes it difficult for noise to be generated in the electrical signals of the transducer and the signal processing circuit.

As in the first embodiment, the electrical signal from the die 11 is taken out to the outside via the frame 12, and as in the second to fourth embodiments, the electrical signal from the die 11A is taken out to the outside via the other die 11B and the frame 12, so that packaging and wiring can be efficiently realized without using a substrate. As in the first, second, third and fourth embodiments, the electrical signal is taken out to the outside of the microphones 1, 2, 3 and 4 from above the frame 12. At that time, the electrical signal is taken out from the frame 12 to the outside via the cover 13. As will be described later, as shown in FIG. 9, the electrical signal may be taken out directly from the frame 12 to the outside of the microphone 1C without going through the cover 13. As shown in FIG. 10, the electrical signal may be taken out to the outside from the side of the frame 12.

In each embodiment of the present invention, the inlet and outlet of the sound wave are as shown in Figs. 1, 3 to 5 .
Although the cover 13 is provided with an inlet/outlet 13A, the inlet/outlet 13A is not provided on the mounting surface 5 unlike the illustrated embodiment.
The inlet and outlet for the sound waves may be provided on the die 11 side or on both sides.
Alternatively, in the case where the mesh 30 is provided on the underside of the die 11A, the protective layer 15 is not provided at the inlet and outlet of the sound waves on the underside of the die 11 or 11A, or the mesh is used as is in the portion not covered by the protective layer 15. The presence of the mesh 30 makes it difficult for foreign matter to get into the package,
In this embodiment, the cover 13 does not need to be provided with any openings as inlet/outlet ports.

Conversely, in a configuration in which the inlet and outlet for sound waves are provided in the cover 13, there is also a configuration in which no opening is required in the cavity of the die 11. Simply put, it is sufficient to use a die with a blocked cavity. These selections also depend on the mounting method of the microphone.

[Packaging Method]
Next, a packaging method according to an embodiment of the present invention will be described by taking as an example the case of manufacturing the microphone 4 according to the fourth embodiment shown in FIG. 5. FIGS. 6A to 6D are diagrams showing the manufacturing method of the microphone 4 according to the fourth embodiment, and are also diagrams showing the packaging method. In FIGS. 6A to 6C, the upper part shows a cross section along line II, and the lower part shows a cross section along line II-II. The packaging method shown here assumes the case of manufacturing multiple microphones at the same time, but is similar when manufacturing one microphone. Although only one microphone is shown in the figure, other microphones are manufactured adjacent to each other in the front, back, left and right in a plan view.

First, as shown in FIG. 6A, a mesh 41 is placed on a film 42 having a peelable property. The film 42 may be made of PET (polyethylene terephthalate). Other materials may also be used, and various surface treatments may be applied. For the surface treatment, Teflon (
Examples of coating methods include coating with a registered trademark of the manufacturer, release agent treatment, and precious metal film formation.

Next, an appropriate amount of adhesive is applied to an appropriate location so that the adhesive is provided between the die 43 mounting the transducer and the die 44 mounting the signal processing circuit. For example, the adhesive is applied to the bottom surface of the die 43 and the bottom surface of the die 44. At the same time, or before or after, the adhesive is applied to the frame 45 and the die 44.
In order to provide adhesive between the dies 43, 44, an appropriate amount is applied to an appropriate location. For example, adhesive is applied to the lower surface of the frame 45. If applying adhesive only to the lower surfaces of the dies 43, 44 and the frame 45 is insufficient, adhesive is also applied to the side surfaces. In particular, when no cavity is open on the lower surface of the die 43, adhesive may be applied onto the mesh 41.

Next, as shown in Fig. 6B, the die 43 and the die 44 are placed in close contact on the mesh 41. Then, since the frame 45 has a through opening (hole), as shown in Fig. 6C, the frame 45 is placed on the mesh 41 so that the set of the die 43 and the die 44 is surrounded by the one through opening.

In this state, a pair of dies 43 and 44 are arranged in the opening of the frame 45 and are in close contact with each other.
1 and the film 42, the adhesive is applied between the die 43 and the die 44, and between the die 44 and the die 45.
the adhesive between the dies 43 and 44 and between the die 44 and the frame 45, hardening the adhesive between the dies 43 and 44 and between the die 43 or 44 and the inner peripheral surface of the frame 45 to form an adhesive layer 46, and hardening the adhesive on the lower surfaces of the dies 43 and 44 and the frame 45 to form a protective layer 47 made of adhesive, thereby providing the protective layer 47 on the lower surfaces of the dies 43 and 44 and the frame 45;
The mesh 41 is fixed to the protective layer 47 .

Just before or after the adhesive hardens, the die 43 and die 44 are bonded together with wires 48A, and the die 44 is bonded together with a terminal of the frame 45 with wires 48B. The frame 45 is provided with internal wiring 45a, and terminals 45b and 45c are provided at each end of the internal wiring 45a. This allows electrical signals from the die 43 to be transmitted through the wires 48.
A to the die 44, and further via wire 48B and the internal wiring 45a of the frame 45, the signal can be taken out from the terminal 45c.

6D, a cover 49 is attached to the top surface of the frame 45. A terminal 49a for mounting is formed on the front surface of the cover 49, and a terminal 49c is formed on the back surface of the cover 49.
An internal wiring (via) 49b is provided between the terminal 49a and the terminal 49c.
A cover 49 is attached onto the frame 45 so that the terminals 49c of the terminals 49a on the rear surface of the cover 49 are electrically connected to the internal wiring 45a of the frame 45. Specifically, bumps are formed on the terminals 49c on the rear surface of the cover 49 with conductive paste, and an adhesive is applied thereon. The cover 49 is placed on the frame 45 before the conductive paste and adhesive that will become the adhesive layer 50 harden. Even if the adhesive covers the bumps of the conductive paste, applying an appropriate pressure to the cover 49 will push the adhesive aside, and the terminals 49c on the rear surface of the cover 49 and the terminals 45c of the frame 45 will be electrically connected.
Here, a filler may be mixed into the conductive paste or adhesive to prevent the bumps from being crushed too much and causing a short circuit with adjacent bumps. The upper surface of the frame 45 is adhered to the lower surface of the cover 49 by an adhesive layer 50.

Here, many microphones are placed in an array on the film 42, but the frame 45 is not separate for each microphone, but is integrated. The same goes for the cover 49. Therefore, at the stage where the cover 49 is attached, the microphones are obtained in an array connected form. By dividing this by dicing, individual microphones are manufactured. The array of dies is observed with a camera, an image is captured, and the cover plate is positioned according to the image.

Thereafter, the microphone is peeled off from the film 42. There are several possible timings for peeling off the microphone. For example, as shown in Fig. 6D, the microphone is peeled off after it is manufactured as an individual microphone. In this case, it is possible to prevent foreign matter from entering the inside of the package through holes in the mesh 41 during the process.

Another timing is before wire bonding, after the adhesive has hardened. This timing is effective when film 42 cannot withstand the heat generated during wire bonding. This is because the temperature of film 42 increases to, for example, 150° C. during wire bonding. If this timing is adopted, it is necessary to fix the microphone on the dicing tape during dicing and to block the holes in mesh 41 to prevent cooling water from entering.

In the packaging method according to the embodiment of the present invention, the film 42 is used, and due to the flexibility of the film 42, the film 42 can be peeled off easily by turning it over.
Furthermore, even if the adhesive strength is similar, it can be peeled off more easily with a weaker force. In this manner, the microphone as shown in FIG.

Thus, the method of packaging by fixing a mesh to a protective layer has been described with reference to Figures 6A to 6D. When no mesh is provided, the mesh need not be placed on the film. When the protective layer is made of an adhesive layer and a filler as in the third embodiment, the mesh need not be placed on the film in the state shown in Figure 6A, and when adhesive is applied to the die and frame in Figures 6B and 6C, the filler need not be mixed into the adhesive. Also, when only one die is packaged, the dies need not be integrated with adhesive.

In the packaging method according to the embodiment of the present invention, first, a frame body and a die are arranged so that the frame body surrounds the side of the die carrying a transducer, and the die is held by the frame body via an adhesive layer, and a cover is attached to the frame body so as to surround a space above the die. That is, the method includes a first step of arranging a die carrying a transducer in a hole of a frame body having a hole penetrating in the vertical direction, and holding the die on the wall surface of the hole in the frame body via an adhesive layer, and a second step of attaching a cover to the frame body so as to surround a space above the die. According to this packaging method, it is not necessary to mount the die on a substrate as in the conventional method, and it is possible to realize a thin microphone. According to this, it is possible to minimize the area occupied by the microphone 1 on the mounting surface 5, that is, the height of the microphone 1 is reduced while minimizing the footprint of the microphone relative to that of the die. Here, the wall surface of the hole of the frame body has a step for arranging a terminal for internal connection, or is cylindrical.

In a packaging method according to an embodiment of the present invention, first, an adhesive is applied to a bottom surface and/or a side surface of at least one of a die on which a transducer is mounted and a frame surrounding a side of the die;
Next, the die and the frame are arranged so that the die is surrounded by the frame, and a cover is attached to the frame so as to surround the space above the die. With this packaging method, it is not necessary to mount the die on a substrate as in the conventional method, and it is possible to realize a thin microphone.

Preferably, in the first step, an adhesive is applied to the lower surfaces of the die and the frame or to a film facing the lower surfaces, the die and the frame are placed against the film having releasability, and the die and the frame are pressed against the film to cause the adhesive to penetrate between the die and the frame, and the adhesive is cured to form an adhesive layer, and then the film is peeled off. This allows efficient packaging.

Preferably, in the first step, a mesh is placed on the film, and then the die and the frame are placed on the mesh, whereby a protective layer made of an adhesive and to which the mesh is fixed can be provided on the lower surfaces of the die and the frame, the mesh and the protective layer can be integrated with the frame and the die, and the protective layer can be maintained at a constant thickness.

Preferably, a filler is mixed into the adhesive, and in the first step, the die and the frame are placed on the film, whereby a protective layer made of the adhesive and the filler can be provided on the lower surfaces of the die and the frame, and the protective layer can be maintained at a constant thickness.

Preferably, the filler or the mesh is conductive.
Electromagnetic shielding can be achieved.

Preferably, another die equipped with a signal processing circuit is integrated with the die using an adhesive, the sides of the die and the other die are surrounded by a frame, and a cover is attached to the frame so as to sandwich a space above the die and the other die. This allows conversion to an electrical signal by the transducer and signal processing to be performed in separate locations, making it possible to provide a high-performance, low-cost microphone.

In the embodiment of the present invention, the thickness of the adhesive layer 14 (14A, 14B) is several μm or more and several hundred μm or more.
The mesh has a wire diameter of several tens of microns to several hundred microns, and the number of meshes per inch is about 100 to several hundreds. Therefore, even if the mesh 30 and the protective layer 15 are provided, the microphone can be made thin.

In the microphones according to the first to fourth embodiments, the dimensions of the inner circumferential surface of the frame 12 change stepwise between the upper and lower surfaces, but the inner circumferential surface that holds the die 11 via the adhesive layer 14 may be cylindrical. In this case, wiring by wire bonding is performed on the upper surface of the frame 12, which makes it easier to access the capillary tool for wire bonding as opposed to performing wire bonding on a stepped portion. Fig. 7 shows a microphone 1A according to another embodiment of the present invention, and is a diagram showing in particular the relationship between the die, the frame, and the cover. In the case where the inner circumferential surface of the frame 12 is almost constant without changing between the upper and lower surfaces, the surface wiring 35 is formed on the upper surface of the frame 12.
is provided, and the surface wiring 35 and the die 11 are connected by wires 16. A conductive paste is applied to the lower surface of the cover 13 at a portion on the surface wiring 35 that will become the connection portion 24 that connects to the internal wiring 20, and a non-conductive adhesive is applied to the other portion to become the adhesive layer 23. The cover 13 is attached to the frame 12, and the conductive paste and the non-conductive adhesive are cured to adhere the frame 12 to the cover 13. If necessary, a part of the lower portion of the cover 13 is removed to form a recess 13B, and the wire 16 that connects the die 11 and the surface wiring 35 is provided in the region of the recess 13B. In the embodiment shown in FIG. 7, the surface wiring 35 is provided on the upper surface of the frame 12, but an inner terminal and an outer terminal may be provided on the upper surface of the frame 12, and both terminals may be connected by internal wiring. FIG. 7 shows the case of the first embodiment, but the same applies to other embodiments.

In the microphones according to the first to fourth embodiments, the frame 12 is taller than the die 11, i.e., the lower surface of the frame 12 is substantially flush with the lower surface of the die 11, and the upper surface of the frame 12 is taller than the upper surface of the die 11. However, the frame 12 may have approximately the same height as the die 11, i.e., the lower surface of the frame 12 and the lower surface of the die 11 are substantially flush with each other and the upper surface of the frame 12 and the upper surface of the die 11 are substantially flush with each other.

8 shows a microphone 1B according to another embodiment of the present invention, and in particular shows a different relationship between the die, the frame, and the cover from that shown in FIG. 7. Surface wiring 35 is provided on the upper surface of the frame 12, and the surface wiring 35 and the die 11 are connected by wires 16. The cover 13 is made up of an upper portion 13C and a peripheral portion 13C which extends downward from the outer periphery of the upper portion 13C and has an inner periphery.
The cover 13 has a recess 13B formed of an upper portion 13C and a peripheral portion 13D, and the recess 13B has a shape carved from the lower side. The recess 13B of the cover 13 faces a part of the frame 12 and the die 11. The cover 13 has an inner peripheral surface of the cover 13, an adhesive layer 23,
The frame 12, the adhesive layer 14, and the die 11 surround the package space. The recess 13B is provided with a wire 16 that connects the die 11 to the surface wiring 35. The lower surface of the peripheral portion 13D of the cover 13 is provided with a connection portion 2 that connects to the internal wiring 20 on the surface wiring 35.
A conductive paste is applied to the portion that will become 4, and an adhesive layer 23 is formed on the lower surface of the other peripheral portion 13D.
The frame 12 is adhered to the cover 13 by applying a non-conductive adhesive that forms a conductive paste, attaching the cover 13 to the frame 12, and curing the conductive paste and the non-conductive adhesive. Fig. 8 shows the case of the first embodiment, but the same applies to the other embodiments.

In the microphones according to the first to fourth embodiments, the cover 13 has internal wiring 20, and the outer peripheral edge of the cover 13 overlaps the outer peripheral edge of the frame body 12 in a planar view. However, the cover 13 may not have internal wiring, and the outer peripheral edge of the cover 13 may be closer to the center of the cover 13 than the outer peripheral edge of the frame body 12 in a planar view.

Fig. 9 shows a microphone 1C according to another embodiment of the present invention, and is a diagram showing a different relationship between the die, frame, and cover from Figs. 7 and 8. Internal wiring 19 is provided in the frame 12, and the inner peripheral surface of the frame 12 has a step, and an inner terminal 17 of the internal wiring 19 is provided in part of the step at the height of the die 11 and in a portion parallel to the upper and lower surfaces of the frame 12, and a bonding pad is provided on the upper surface of the frame 12 as a surface wiring 35. Also, a fitting portion 12B is provided at the upper end of the inner peripheral surface of the frame 12 so as to have a shape that fits the edge of the cover 13. Thus, the cover 13 is fixed to the fitting portion 12 by an adhesive.
7 and 8, the top and bottom surfaces of the cover 13 can be made flat, and an electrical signal from the die 11 can be taken out to the surface wiring 35 by using the internal wiring 19 of the frame 12 via the wire 16. Although the first embodiment is shown in FIG. 9, the same applies to the other embodiments.

In the packaging method, as described above, the adhesive may be applied to either or both of the bottom surfaces and side wall surfaces of the die and frame, or may be provided on a film 42 as shown in Fig. 6A, etc., but how the adhesive is applied to each location is appropriately set depending on the number and size of the products packaged in the same process. For example, when packaging a large number of products at the same time, the adhesive may be applied in advance to a separate sheet, and then the die and frame may be pressed onto the adhesive to transfer it to the bottom surfaces of the die and frame.

Fig. 10 shows a microphone according to another embodiment of the present invention, and is a diagram showing a form in which an electrode for external connection is attached to the side of the frame. The microphone 1D includes a die 11 with a transducer mounted thereon, a frame 12 having a hole 12A penetrating in the vertical direction and holding the die 11 on the wall of the hole 12A via an adhesive layer 14, and a cover 13 attached to the frame 12 so as to sandwich a space above the die 11, and the lower surface of the die 11 substantially constitutes a part of the outer surface. The frame 12 is provided with an internal wiring 19, and the wall of the hole 12A has a step, and an inner terminal 17 of the internal wiring 19 is provided at the height of the die 11, which is parallel to the upper and lower surfaces of the frame 12, and a bonding pad is provided on the side of the frame 12 as a side wiring 36. The form shown in Fig. 10 allows the microphone 1D to be thinner than the forms shown in Figs. 1, 7 to 9, and is a preferred mounting form. An electrical signal from the die 11 can be taken out to the side wiring 36 by using the internal wiring 19 of the frame 12 via the wire 16 from the die 11. Although Fig. 10 shows the case of the first embodiment, the same applies to the other embodiments.

FIG. 11A is a bottom view of a frame with a cover in a microphone showing another embodiment of the present invention, FIG. 11B is a cross-sectional view of the frame with the cover shown in FIG. 11A, FIG. 11C is a diagram showing a certain stage of a packaging method according to another embodiment of the present invention, and FIG. 11D is a diagram showing a packaging method according to another embodiment of the present invention.
FIG.

11A and 11B, a method of packaging the die 11 using a frame with cover 61 in which the frame and cover in the above embodiment are integrated will be described. The frame with cover 61 includes a cover portion 61A as an upper portion, a side wall portion 61B extending downward from the periphery of the cover portion 61A, and a partition portion 61B extending downward from a predetermined position of the cover portion 61A.
The side wall portion 61B and the partition portion 61C define a storage portion 63 (63A, 63B
11B, the side wall portion 61B and the partition portion 61C have a step on the wall surface which is the inner side surface, and a plurality of electrodes 62 are provided on the surface of the step which is parallel to the upper and lower surfaces, and specific electrodes 62 are connected to each other by wiring (not shown). Here, the "storage portion 63" corresponds to the "hole 12A" in the first to fourth embodiments. The die 11 (11A
, 11B) are arranged.

In the cover-attached frame 60 as shown in FIGS. 11A and 11B, a storage section 63 (63A
, 63B) from below, and the die 11 (11A, 11B) is inserted into the die 11 (11A, 1
1B) and the electrode 62 are integrated by applying pressure in the vertical direction. This results in a microphone 1E in which the die 11 (11A, 11B) is packaged.
can be obtained.

Furthermore, if necessary, an adhesive layer 64 is provided between the wall surface of the side wall portion 61B and the die 11 (11A, 11B), and an adhesive layer 6 is provided between the wall surface of the partition portion 61C and the die 11 (11A, 11B).
11D, the lower surface of the side wall portion 61B and the die 11 (11A, 11B) may be integrated with the cover-attached frame 61.
11B) may be provided with a protective layer 65 on the underside thereof. The protective layer 65 may hold a filler or a mesh as shown in Figures 4 and 5. The protective layer 65 may be called a surface protective layer since it constitutes a part of the surface.

In the embodiment shown in FIG. 11A to FIG. 11D, each of the two dies is provided in a storage section 63 (63A,
63B), and since there is a partition 61C between the dies 11A and 11B, strength can be ensured. If there is no problem with strength, the partition 61C can be omitted.

As shown in FIG. 11, a configuration in which a plurality of storage sections 63 (63A, 63B) are provided can be adopted in a configuration in which a plurality of dies 11 are packaged, and the same applies to the various configurations shown in FIGS.

11C and 11D, the microphone 1E includes a die 11 (11A, 11B) on which a transducer is mounted, a frame (i.e., a side wall portion 61B) having a hole (i.e., a storage portion 63 (63A, 63B)) penetrating in the vertical direction and holding the die 11 (11A, 11B) on the wall surface of the hole via an adhesive layer 64, and the die 11 (11A, 11B).
and a cover (i.e., cover portion 61A) attached to a frame (i.e., side wall portion 61B) so as to sandwich a space above the die 11, and the lower surface of the die 11 (11A, 11B) substantially constitutes a part of the outer surface.

[Electronic devices]
FIG. 12 is a diagram showing a part of an electronic device according to an embodiment of the present invention. The electronic device 70 includes:
A mounting board 71 such as a printed circuit board is provided with a sound hole 72 for allowing sound waves to flow in and out of the microphone 1. The microphone 1 is mounted in correspondence with the sound hole 72. An electronic element or electronic device 73 such as a capacitor, resistor, LSI or IC is mounted on the mounting board 71. Although not shown in FIG. 12, an equipment exterior member serving as a cover is mounted on the mounting board 71 in the electronic device 70 to incorporate the mounting board 71. This is applicable not only to the microphone shown in FIG. 1 but also to microphones in other forms. According to such electronic device 70, the microphone 1 itself does not have a substrate as in the conventional case, and is directly attached to the mounting board 71, so that the electronic device 70 can be made thin.

13A is a diagram showing an example of a mounting portion of a mounting board on which a microphone is mounted in an electronic device according to an embodiment of the present invention. As shown in FIG. 13A, a microphone 85 has an electrode pad 85A on a side thereof, and the electrode pad 85A is disposed on an electrode 81A on a wiring in a mounting board 81 such as a PCB, and the electrode pad 85A is connected to the electrode 81A by solder 86. The lower surface of the microphone 85, i.e., the lower surface of the die, faces the mounting board 81. An equipment exterior member 84 is attached to the opposite side of the mounting board 81 from the microphone 85 across the mounting board 81. Here, a protrusion 84B extends from the edge of an opening 84A of the equipment exterior member 84 toward the mounting board 81 and abuts against the mounting board 81, and sound waves from the opening 84A flow into the microphone 85 via a sound hole 82 in the mounting board 81. The mounting board 8
In addition to the microphone 85 according to each embodiment described above, various electronic elements and devices are mounted on the microphone 85 as shown in Fig. 12. As a result, the microphone 85 itself does not have a substrate as in the conventional case, and is directly attached to the mounting substrate 81.

13B is a diagram showing another example of a microphone mounting portion on a mounting board in an electronic device according to an embodiment of the present invention. As shown in FIG. 13B, a microphone 95 has an electrode pad 95A on its upper surface. In a mounting board 91 such as a PCB, the electrode pad 95A is disposed on an electrode 91A on a wiring, and the electrode pad 95A is connected to the electrode 91A by solder 96.
12. The upper surface of the microphone 95 faces the mounting substrate 91. An equipment exterior member 94 is attached to the opposite side of the microphone 95 from the mounting substrate 91. A protrusion 94B extends from the edge of an opening 94A of the equipment exterior member 94 to the lower surface of the microphone 95, i.e., the lower surface side of the die, and abuts against the microphone 95, so that sound waves from the opening 94A flow into the microphone 95. In addition to the microphone 95 according to each embodiment described above, various electronic elements and electronic devices are mounted on the mounting substrate 95 as shown in FIG. 12. In this way, the microphone 95 itself does not have a substrate as in the conventional case, and is directly attached to the mounting substrate 91.

The embodiments of the present invention are not limited to the above-mentioned matters or the forms shown in the drawings, and include appropriate modifications within the scope of the claims.

1, 1A, 1B, 1C, 1D, 1E, 2, 3, 4: microphone 5: mounting surface 11, 11A, 11B: die 12: frame 12A: hole 12B: fitting portion 13: cover 13A: inlet/outlet 13B: recess 13C: upper portion 13D: peripheral portion 14, 14A, 14B: adhesive layer 15: protective layer 15A: adhesive layer 15B: filler 16, 16A, 16B: wire 17: terminal 18: terminal 19: internal wiring 20: internal wiring 21: terminal 22: terminal 23: adhesive layer 24: connection portion 30: mesh 35: surface wiring 36: side wiring 41: mesh 42: film 43, 44: die 45: frame 45a: internal wiring 45b, 45 c: Terminal 46: Adhesive layer 47: Protective layer 48A, 48B: Wire 49: Cover 49a: Terminal 49b: Internal wiring 49c: Terminal 50: Adhesive layer 61: Covered frame 61A: Cover section 61B: Side wall section 61C: Partition section 62: Electrode 63 (63A, 63B): Storage section 64: Adhesive layer 65: Protective layer 70: Electronic device 71: Mounting board 72: Sound hole 73: Electronic element or electronic device 81, 91: Mounting board 81A, 91A: Electrodes 82, 92: Sound holes 84, 94: Equipment exterior member 84A, 94A: Opening 84B, 94B: Protrusion 85, 95: Microphone 85A, 95A: Electrode pad 86, 96: Solder

Claims (20)

A microphone,
a frame including an inner wall surface defining a through hole extending in a longitudinal direction;
A die held in the through hole;
a cover disposed opposite the die in the vertical direction to cover the through hole,
The inner wall surface of the frame includes a holding surface that faces an outer surface of the die in a lateral direction,
the frame and the die are configured to share a common outer plane extending in the lateral direction;
a first adhesive layer is formed between the upper surface of the frame and the cover;
the first adhesive layer includes a conductor;
A microphone , wherein the frame does not have surface wiring extending in the laterally direction for mounting electronic components including the die . The microphone of claim 1, wherein the inner wall surface includes a plane that extends continuously from the holding surface in the vertical direction. The microphone of claim 1 or 2, wherein the inner wall surface includes a plane that is laterally offset from the holding surface. The microphone of claim 3, wherein a step is formed by the holding surface and the offset plane. The microphone of claim 4, wherein the step includes a terminal. The microphone of claim 5, wherein the terminals are configured to extract electrical signals from the die via wire bonding. The microphone of claim 5 or 6, wherein the terminal is electrically connected to internal wiring arranged within the frame. The microphone of claim 7, wherein the internal wiring is electrically connected to pads disposed on the outer surface of the frame. the cover includes a via;
The microphone of claim 5 , wherein the terminal is electrically connected to the via through the conductor. A microphone according to any one of claims 1 to 7, wherein a second adhesive layer is formed between the support surface and the outer surface of the die. said inner wall surfaces define an area in said common outer plane of a×b, where a≦b;
The microphone according to claim 1 , wherein the frame has a width around the through hole that is equal to or smaller than a/2. 12. The microphone of claim 11, wherein said area is greater than or equal to 50% of an outer area defined by said housing in said common outer plane. A microphone according to any one of claims 1 to 12, wherein the die includes a transducer. The microphone of claim 13, wherein the transducer includes a membrane and a counter electrode. A microphone as claimed in claim 13 or 14, wherein the cover includes an opening through which sound waves can flow. A microphone according to any one of claims 13 to 15, wherein a package space is formed between the die and the cover. The microphone of claim 16, wherein the die has a cavity formed on an opposite side of the package space. The microphone of claim 17, wherein the package space acts as a back volume when sound waves flow into the cavity. A microphone as claimed in claim 17 or 18, in which the cavity functions as a back volume when sound waves flow into the package space. A microphone according to any one of claims 1 to 19;
and a substrate on which the microphone is formed.