JP7555396B2 - Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, and temporary support for photosensitive transfer material - Google Patents

Description

The present disclosure relates to a photosensitive transfer material, a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, and a temporary support for a photosensitive transfer material.

Display devices (e.g., organic electroluminescence display devices and liquid crystal display devices) equipped with a touch panel (e.g., a capacitive input device) have a patterned conductive layer inside the touch panel. Examples of the patterned conductive layer include an electrode pattern corresponding to the sensor of the visual recognition area, and wiring (e.g., peripheral wiring and extraction wiring).

In forming a patterned conductive layer, a method using a photosensitive transfer material is widely adopted because the number of steps required to obtain the required pattern shape is small (for example, Patent Document 1). For example, a patterned conductive layer can be formed by providing a photosensitive resin layer on a substrate using a photosensitive transfer material, exposing the photosensitive resin layer through a mask having a desired pattern, and then developing and etching the layer.

JP 2019-128445 A

In a pattern formation method using a photosensitive transfer material, a photosensitive transfer material and an adherend (referring to an object (e.g., a substrate) to be attached to the photosensitive transfer material; the same applies below) are laminated together to provide a photosensitive resin layer on the adherend. In laminating the photosensitive transfer material and the adherend, the photosensitive transfer material is, for example, attached to one or both sides of the adherend. In order to increase the resolution of the pattern, the laminate (hereinafter sometimes simply referred to as the "laminate") obtained by laminating the photosensitive transfer material and the adherend may be heated and pressurized to remove air bubbles present between the photosensitive transfer material and the adherend (hereinafter, the process of removing air bubbles by heating and pressing is referred to as the "defoaming process"). For example, in the roll-to-roll method, the laminate obtained by laminating the photosensitive transfer material and the adherend is wound into a roll, and then the wound laminate is subjected to a defoaming process. On the other hand, when the wound laminate is subjected to a degassing treatment, the adhesiveness between the stacked laminates increases, and the transportability of the wound laminate decreases when it is transported again by a roll-to-roll method. The adhesiveness between the stacked laminates increases particularly when a photosensitive transfer material is attached to both sides of the adherend.

The present disclosure has been made in consideration of the above circumstances.
One aspect of the present disclosure aims to provide a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to a laminate obtained by laminating the photosensitive transfer material and an adherend.
Another aspect of the present disclosure aims to provide a method for producing a resin pattern using a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to the laminate obtained by laminating the photosensitive transfer material and an adherend.
Another aspect of the present disclosure aims to provide a method for manufacturing circuit wiring using a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to the laminate obtained by laminating the photosensitive transfer material and an adherend.
Another aspect of the present disclosure aims to provide a temporary support for use in a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to the laminate obtained by laminating the photosensitive transfer material and an adherend.

The present disclosure includes the following aspects.
<1> A photosensitive transfer material having a temporary support and a photosensitive resin layer on the temporary support, wherein a rate of change in dynamic friction coefficient of a surface of the temporary support opposite to a surface facing the photosensitive resin layer against stainless steel is 0% to 10% before and after heat treatment at 60°C for 3 hours.
<2> The photosensitive transfer material according to <1>, wherein the coefficient of dynamic friction of the surface of the temporary support opposite to the surface facing the photosensitive resin layer against stainless steel is 0.50 or less before heat treatment at 60° C. for 3 hours.
<3> The photosensitive transfer material according to <1> or <2>, wherein the coefficient of dynamic friction of the surface of the temporary support opposite to the surface facing the photosensitive resin layer against stainless steel is 0.10 or more before heat treatment at 60°C for 3 hours.
<4> The photosensitive transfer material according to any one of <1> to <3>, wherein the temporary support has an average thickness of 20 μm or less.
<5> The photosensitive transfer material according to any one of <1> to <4>, wherein the photosensitive resin layer has an average thickness of 6 μm or less.
<6> The photosensitive transfer material according to any one of <1> to <5>, wherein the temporary support has a haze of less than 1.00%.
<7> The photosensitive transfer material according to any one of <1> to <6>, wherein the temporary support has a peel strength of 0.05 mN/mm or more.
<8> The photosensitive transfer material according to any one of <1> to <7>, wherein the temporary support has an arithmetic mean roughness Ra of 10 nm or less on a surface opposite to a surface facing the photosensitive resin layer.
<9> A method for producing a resin pattern, comprising the steps of: laminating the photosensitive transfer material according to any one of <1> to <8> and a substrate, and disposing a photosensitive resin layer on the substrate; exposing the photosensitive resin layer to a pattern; and developing the photosensitive resin layer to form a resin pattern, in this order.
<10> A method for producing circuit wiring, comprising the steps of: laminating the photosensitive transfer material according to any one of <1> to <8> and a substrate having a conductive layer, and disposing a photosensitive resin layer on the substrate; exposing the photosensitive resin layer to a pattern; developing the photosensitive resin layer to form a resin pattern; and etching the conductive layer in an area where the resin pattern is not disposed to form a circuit wiring, in this order.
<11> A temporary support for a photosensitive transfer material, in which the rate of change in dynamic friction coefficient against stainless steel before and after heat treatment at 60° C. for 3 hours is 0% to 10%.

According to one aspect of the present disclosure, there is provided a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to a laminate obtained by laminating the photosensitive transfer material and an adherend.
According to another aspect of the present disclosure, there is provided a method for producing a resin pattern using a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to the laminate obtained by laminating the photosensitive transfer material and an adherend.
According to another aspect of the present disclosure, there is provided a method for manufacturing circuit wiring using a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is applied to the laminate obtained by laminating the photosensitive transfer material and an adherend.
According to another aspect of the present disclosure, there is provided a temporary support for use with a photosensitive transfer material, which suppresses adhesion between laminates when a degassing treatment is applied to the laminate obtained by laminating the photosensitive transfer material and an adherend.

FIG. 2 is a schematic side view showing an example of the configuration of a photosensitive transfer material. FIG. 2 is a schematic plan view showing an example of a pattern of a mask for manufacturing a touch panel. 11 is a schematic plan view showing another example of a pattern of a mask for manufacturing a touch panel. FIG.

The following describes in detail the embodiments of the present disclosure. The present disclosure is not limited to the following embodiments, and may be modified as appropriate within the scope of the purpose of the present disclosure.

When describing embodiments of the present disclosure with reference to the drawings, descriptions of components and symbols that overlap in the drawings may be omitted. Components indicated with the same symbols in the drawings are meant to be the same components. The dimensional ratios in the drawings do not necessarily represent the actual dimensional ratios.

In this disclosure, a numerical range indicated using "~" indicates a range that includes the numerical values described before and after "~" as the lower and upper limits, respectively. In the numerical ranges described in stages in this disclosure, the upper or lower limit described in a certain numerical range may be replaced with the upper or lower limit of another numerical range described in stages. In addition, in the numerical ranges described in this disclosure, the upper or lower limit described in a certain numerical range may be replaced with a value shown in the examples.

In this disclosure, the amount of each component in a composition means the total amount of the multiple substances present in the composition, unless otherwise specified, when multiple substances corresponding to each component are present in the composition.

In this disclosure, the term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from other processes as long as the intended purpose of the process is achieved.

In this disclosure, "mass %" and "weight %" are synonymous, and "parts by mass" and "parts by weight" are synonymous.

In the present disclosure, combinations of two or more preferred aspects are more preferred aspects.

In this disclosure, groups (atomic groups) that do not specify whether they are substituted or unsubstituted include groups that have no substituents and groups that have a substituent. For example, the expression "alkyl group" includes not only alkyl groups that have no substituents (i.e., unsubstituted alkyl groups) but also alkyl groups that have a substituent (i.e., substituted alkyl groups).

In this disclosure, "(meth)acrylic acid" means acrylic acid, methacrylic acid, or both acrylic acid and methacrylic acid.

In this disclosure, "(meth)acryloyl group" means an acryloyl group, a methacryloyl group, or both an acryloyl group and a methacryloyl group.

In this disclosure, "(meth)acrylate" means acrylate, methacrylate, or both acrylate and methacrylate.

In this disclosure, "alkali-soluble" means the property of having a solubility of 0.1 g or more in an aqueous solution of sodium carbonate (100 g, sodium carbonate concentration: 1% by mass) at a liquid temperature of 22°C.

In this disclosure, chemical structural formulas may be described in which hydrogen atoms are omitted.

In this disclosure, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams (e.g., electron beams and ion beams). Examples of light used for exposure include actinic rays (also called active energy rays). Examples of actinic rays include the bright line spectrum of a mercury lamp, far ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV (Extreme ultraviolet lithography) light), and X-rays.

In this disclosure, unless otherwise specified, the weight average molecular weight (Mw) and number average molecular weight (Mn) are molecular weights calculated using polystyrene as a standard substance after detecting compounds in THF (tetrahydrofuran) with a differential refractometer using a gel permeation chromatography (GPC) analyzer using columns of "TSKgel GMHxL", "TSKgel G4000HxL", and "TSKgel G2000HxL" (all product names manufactured by Tosoh Corporation).

In this disclosure, "solids" refers to all components of the object excluding the solvent.

In this disclosure, ordinal numbers (e.g., "first" and "second") are terms used to distinguish components and do not limit the number of components or the superiority or inferiority of the components.

In this disclosure, symbols added to names (e.g., "A" and "B") are symbols used to distinguish components and do not limit the type of components, the number of components, or the superiority or inferiority of components.

In this disclosure, unless otherwise specified, the refractive index is measured using an ellipsometer at a wavelength of 550 nm.

<Photosensitive Transfer Material>
The photosensitive transfer material according to the present disclosure has a temporary support and a photosensitive resin layer on the temporary support, and the rate of change in dynamic friction coefficient against stainless steel of the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 0% to 10% before and after a heat treatment for 3 hours at 60° C. According to the photosensitive transfer material according to the present disclosure, adhesion between the laminates is suppressed when a degassing treatment is performed on the laminate obtained by laminating the photosensitive transfer material and an adherend.

The reason why the photosensitive transfer material according to the present disclosure exhibits the above-mentioned effect is presumed to be as follows. The temporary support in the photosensitive transfer material according to the present disclosure can form the surface layer of the laminate obtained by laminating the photosensitive transfer material and the adherend. For example, when the photosensitive transfer material according to the present disclosure is affixed to one or both sides of the adherend, the temporary support forms the surface layer on one or both sides of the resulting laminate. Then, when the laminates are stacked by a method such as winding up the laminate, at the interface between the stacked laminates, the surface of the temporary support opposite to the surface facing the photosensitive resin layer contacts the surface of the adjacent laminate in the stacking direction. At the interface between the stacked laminates, for example, the temporary support in the lower laminate contacts the temporary support in the upper laminate, or the temporary support in the lower laminate contacts the substrate in the upper laminate. In the photosensitive transfer material according to the present disclosure, the rate of change in the dynamic friction coefficient against stainless steel of the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 0% to 10% before and after a heat treatment at 60° C. for 3 hours, so that the friction characteristics of the surface of the temporary support opposite to the surface facing the photosensitive resin layer can be suppressed from changing before and after a degassing treatment. As a result, it is possible to suppress the adhesion at the interface between the stacked stacks stacked vertically from increasing due to the degassing treatment. Therefore, according to the photosensitive transfer material according to the present disclosure, when a degassing treatment is performed on a stack obtained by laminating the photosensitive transfer material and the adherend, adhesion between the stacks is suppressed.

<<Components>>
The photosensitive transfer material according to the present disclosure has a temporary support and a photosensitive resin layer on the temporary support. The photosensitive resin layer may be laminated directly on the temporary support or via an optional layer. In the photosensitive transfer material according to the present disclosure, an optional layer may be laminated on the photosensitive resin layer. Examples of the optional layer include other layers described later. Hereinafter, the components of the photosensitive transfer material according to the present disclosure will be specifically described.

[Temporary Support]
The photosensitive transfer material according to the present disclosure has a temporary support. The temporary support is a support that can be peeled off from the photosensitive transfer material. The temporary support can support at least a photosensitive resin layer. The structure of the temporary support may be a single-layer structure or a multilayer structure. The layer configuration of the temporary support having a multilayer structure is not limited. The temporary support having a multilayer structure may have a coating layer or a functional layer. Examples of the temporary support having a multilayer structure include a temporary support having a substrate and a coating layer or a functional layer. Examples of the substrate include materials described in the "Composition" section below (e.g., glass substrate, resin film, and paper). The coating layer is a layer that covers a part or all of the surface of any layer (e.g., substrate). Examples of the functional layer include an adhesive layer (adhesion layer), a peeling layer, a slipping layer, an antistatic layer, a layer that prevents components from seeping out of the substrate, a smoothness layer, and a hard coat layer. The coating layer may be a functional layer. In addition, the temporary support having a multilayer structure is formed by a coating method or coextrusion.

(Kinematic Friction Coefficient)
Before and after a heat treatment at 60° C. for 3 hours, the rate of change in the dynamic friction coefficient of the surface of the temporary support opposite to the surface facing the photosensitive resin layer with respect to stainless steel is 0% to 10%. In the present disclosure, the "surface facing the photosensitive resin layer of the temporary support" refers to the surface of the temporary support facing the photosensitive resin layer. For example, when the temporary support is adjacent to the photosensitive resin layer, the surface of the temporary support facing the photosensitive resin layer is the surface of the temporary support that is in contact with the photosensitive resin layer. Hereinafter, the "surface facing the photosensitive resin layer of the temporary support" may be referred to as the "first surface". Hereinafter, the "surface opposite to the surface facing the photosensitive resin layer of the temporary support" may be referred to as the "second surface". When the rate of change in the dynamic friction coefficient of the second surface of the temporary support with respect to stainless steel is 0% to 10%, adhesion between the laminates is suppressed when a degassing treatment is performed on the laminate obtained by laminating the photosensitive transfer material and the adherend. The rate of change in the dynamic friction coefficient is preferably 8% or less, and more preferably 4% or less.

If the kinetic friction coefficient before heat treatment is C1 and the kinetic friction coefficient after heat treatment is C2, the rate of change in the kinetic friction coefficient is calculated according to the following formula, where "|C2-C1|" represents the absolute value of the difference between C2 and C1.
Formula: Rate of change in dynamic friction coefficient (%) = (|C2-C1|)/C1 x 100

The dynamic friction coefficient is measured using a slip tester (200G-15C) manufactured by Toray Industries, Inc., according to a method conforming to "JIS K 7125 (1999)". The specific measurement method is as follows. Two test pieces with a length of 100 mm and a width of 75 mm are prepared from the temporary support. The first test piece is left to stand for 24 hours in an atmosphere of 25°C and 50% RH (relative humidity). The second test piece is left to stand for 3 hours in an atmosphere of 60°C, and then left to stand for 24 hours in an atmosphere of 25°C and 50% RH (relative humidity). The test piece and the sliding piece (an object that applies a load to the test piece, mass: 200 g, base area: 50 mm x 50 mm, shape of the base: square) are stacked in this order on a smooth stainless steel plate (SUS304). When placing the test piece on the stainless steel, the surface of the test piece corresponding to the second surface of the temporary support is brought into contact with the surface of the stainless steel. The surface roughness Ra of the stainless steel plate in contact with the test piece is 30 μm or less. The test piece is taken in the longitudinal direction of the test piece at a speed of 100 mm/min, and the force required to move the test piece is measured. The friction force is divided into a static friction force observed at the critical point where the test piece starts to slide, and a kinetic friction force observed in a stable region after the test piece starts to slide. In this disclosure, the kinetic friction force R (g) is read from the chart, and the kinetic friction coefficient is calculated by the formula expressed as "kinetic friction coefficient μd = R (g) / 200 (g)". The average of the measured values obtained by performing the above measurement three times is the kinetic friction coefficient defined in this disclosure. The kinetic friction coefficient obtained using the first test piece is the "kinetic friction coefficient before heat treatment (C1)". The kinetic friction coefficient obtained using the second test piece is the "kinetic friction coefficient after heat treatment (C2)".

Before heat treatment at 60°C for 3 hours, the dynamic friction coefficient of the second surface of the temporary support against the stainless steel is preferably 0.80 or less, more preferably 0.50 or less, and particularly preferably 0.40 or less, from the viewpoint of suppressing adhesion between the laminates. Before heat treatment at 60°C for 3 hours, the dynamic friction coefficient of the second surface of the temporary support against the stainless steel is preferably 0.05 or more, more preferably 0.10 or more, and particularly preferably 0.20 or more, from the viewpoint of transportability.

A known method can be used to adjust the dynamic friction coefficient (including the rate of change of the dynamic friction coefficient; the same applies hereinafter in this paragraph) of the second surface of the temporary support against stainless steel. The dynamic friction coefficient of the second surface of the temporary support against stainless steel varies, for example, depending on the composition of the temporary support and the surface roughness of the temporary support. For example, the dynamic friction coefficient of the second surface of the temporary support against stainless steel can be adjusted by using wax, which will be described later, as a component of the temporary support. In addition, the dynamic friction coefficient of the second surface of the temporary support against stainless steel can be adjusted by changing the composition of the resin used as a raw material for the temporary support, or by adding a matting agent or inorganic filler as a component of the temporary support.

The above-mentioned properties related to the dynamic friction coefficient may be exhibited at least on the second surface of the temporary support. The first surface of the temporary support may have properties similar to those of the second surface of the temporary support.

(Hayes)
The haze of the temporary support is preferably less than 1.00%, more preferably 0.50% or less, and particularly preferably 0.25% or less. When the haze of the temporary support is in the above range, the resolution of the pattern formed by exposing the photosensitive resin layer through the temporary support can be improved. The lower limit of the haze of the temporary support is not limited. When the lower limit of the haze of the temporary support is set, the haze of the temporary support may be determined in the range of 0% or more. The haze of the temporary support specified in the present disclosure is the haze of the temporary support before heat treatment.

The haze of the temporary support is measured using a haze meter (e.g., NDH-2000, Nippon Denshoku Industries Co., Ltd.) in accordance with a method conforming to "JIS K 7105".

(Peeling Force)
The peeling force of the temporary support is preferably 0.02 mN/m or more, more preferably 0.05 mN/m or more, and particularly preferably 0.07 mN/m or more. Furthermore, the peeling force of the temporary support is preferably 0.1 mN/m or more, more preferably 0.2 mN/m or more, even more preferably 0.5 mN/m or more, and particularly preferably 0.7 mN/m or more. When the peeling force of the temporary support is in the above range, the adhesion between the layer adjacent to the temporary support in the photosensitive transfer material (e.g., the photosensitive resin layer) and the temporary support can be increased. As a result, for example, when the wound laminate is transported again by the roll-to-roll method, peeling of the temporary support caused by adhesion between the laminates stacked up and down can be suppressed. The upper limit of the peeling force of the temporary support is not limited. When the upper limit of the peeling force of the temporary support is set, the peeling force of the temporary support may be determined, for example, in the range of 10 mN/m or less. The upper limit of the peel strength of the temporary support may be, for example, 5 mN/m, 2 mN/m, or 1 mN/m. The peel strength of the temporary support defined in this disclosure is the peel strength of the temporary support before the heat treatment.

The peeling force of the temporary support is measured by the following method. The measuring device is a Tensilon tensile tester (Orientec Co., Ltd., model name: "RTM500") The photosensitive transfer material is cut into a rectangular shape with a width of 25 mm and a length of 80 mm using a cutter. The longitudinal direction of the obtained test piece is fixed along the vertical direction (gravity direction). The lower tip of the temporary support is peeled off from the fixed test piece. The peeled tip of the temporary support is clamped with the chuck (a jig for clamping the test piece) of the Tensilon tensile tester. The chuck clamping the tip of the temporary support is moved upward (i.e., in the direction opposite to the vertical direction) at a tensile speed of 100 mm/min, and the force (adhesive force) when the temporary support is peeled off 180 degrees is measured. However, the measured value of the first 30 mm length after the start of measurement is ignored. The value obtained by averaging the forces measured from the start of peeling the temporary support to the end of peeling is adopted as the adhesive force. The peel strength (mN/mm) of the temporary support is calculated by dividing the adhesive strength by the width (25 mm) of the test piece.

(Roughness)
The arithmetic mean roughness Ra of the second surface of the temporary support is preferably 10 nm or less, more preferably 6 nm or less, and particularly preferably 4 nm or less. The lower limit of the arithmetic mean roughness Ra is not limited. When the lower limit of the arithmetic mean roughness Ra is set, the arithmetic mean roughness Ra of the second surface of the temporary support may be determined, for example, in the range of 0 nm or more.

The arithmetic mean roughness Ra of the first surface of the temporary support is not limited. The arithmetic mean roughness Ra of the first surface of the temporary support may be adjusted within the range of the arithmetic mean roughness Ra of the second surface of the temporary support described above.

The arithmetic mean roughness Ra is measured by the following method. A three-dimensional optical profiler (New View 7300, Zygo) is used to obtain a surface profile of the measurement object under the following conditions. MetroPro ver. 8.3.2 Microscope Application is used as the measurement and analysis software. Next, the above software is used to display the Surface Map screen, and histogram data is obtained in the Surface Map screen. From the obtained histogram data, the arithmetic mean roughness Ra of the surface of the measurement object is obtained. Note that, if the surface of the measurement object is in contact with the surface of another layer, the arithmetic mean roughness Ra of the surface of the measurement object exposed by peeling the measurement object from the other layer may be measured.

(Thickness)
The average thickness of the temporary support is preferably 20 μm or less, more preferably 18 μm or less, and particularly preferably 16 μm or less, from the viewpoint of improving the resolution of the pattern formed by exposing the photosensitive resin layer through the temporary support. The average thickness of the temporary support is preferably 5 μm or more, and more preferably 10 μm or more, from the viewpoints of heat resistance, ease of handling, and versatility.

The average thickness of the temporary support is measured by the following method. A scanning electron microscope (SEM) is used to observe the cross section of the temporary support in a direction perpendicular to the main surface (i.e., the thickness direction). Based on the obtained observation image, the thickness of the temporary support is measured at 10 points. The average thickness of the temporary support is determined by arithmetically averaging the measured values. Note that the above measurement method is not limited to temporary supports having a single-layer structure, but is also applicable to temporary supports having a multi-layer structure.

(Light Transmittance)
The temporary support preferably has light transmittance. When the temporary support has light transmittance, the photosensitive resin layer can be exposed through the temporary support when the photosensitive resin layer is exposed. In the present disclosure, "having light transmittance" means that the transmittance of light of the wavelength used for pattern exposure is 50% or more. In the temporary support, the transmittance of light of the wavelength (preferably a wavelength of 365 nm) used for pattern exposure is preferably 60% or more, more preferably 70% or more, from the viewpoint of improving the exposure sensitivity of the photosensitive resin layer. In the present disclosure, "transmittance" refers to the ratio of the intensity of the emitted light that has passed through the layer to be measured to the intensity of the incident light when the light is incident in a direction perpendicular to the main surface of the layer to be measured (i.e., in the thickness direction). The transmittance is measured using the MCPD Series manufactured by Otsuka Electronics Co., Ltd.

(composition)
Examples of the temporary support include a glass substrate, a resin film, and paper. From the viewpoints of strength, flexibility, and light transmittance, the temporary support is preferably a resin film.

Examples of the resin film include a polyethylene terephthalate film (i.e., a PET film), a cellulose triacetate film, a polystyrene film, and a polycarbonate film. The resin film is preferably a PET film, and more preferably a biaxially oriented PET film.

Examples of temporary supports include a biaxially oriented polyethylene terephthalate film having a thickness of 16 μm, a biaxially oriented polyethylene terephthalate film having a thickness of 12 μm, and a biaxially oriented polyethylene terephthalate film having a thickness of 9 μm.

The temporary support preferably contains wax. When the temporary support contains wax, it is possible to suppress the precipitation of components such as oligomers on the surface of the temporary support, and therefore it is possible to suppress the change in the dynamic friction coefficient of the surface of the temporary support against stainless steel before and after heating. From the same viewpoint as above, it is preferable that the temporary support has a layer containing wax, and it is more preferable that the temporary support has a surface layer (coating layer) containing wax.

As the wax, any known wax can be used. Examples of the wax include natural wax and synthetic wax.

Examples of natural waxes include vegetable waxes (e.g., carnauba wax, candelilla wax, and Japan wax), petroleum waxes (e.g., paraffin wax and microcrystalline wax), mineral waxes (e.g., montan wax), and animal waxes (e.g., beeswax and lanolin).

Examples of synthetic waxes include olefin waxes (e.g., polyethylene wax and polypropylene wax), synthetic hydrocarbon waxes (e.g., Fischer-Tropsch wax), and hydrogenated waxes (e.g., hydrogenated castor oil and hydrogenated castor oil derivatives). Examples of synthetic waxes include esters, amides, bisamides, ketones, or metal salts of stearic acid, oleic acid, erucic acid, lauric acid, behenic acid, palmitic acid, or adipic acid, and derivatives thereof.

The molecular weight of the wax is not limited. From the viewpoint of abrasion resistance, the molecular weight of the wax is preferably 100 or more, and more preferably 300 or more. From the viewpoint of imparting slipperiness, the molecular weight of the wax is preferably 5,000 or less, and more preferably 3,000 or less. When the wax has a molecular weight distribution, the "molecular weight of the wax" means the weight average molecular weight of the wax.

The temporary support may contain one or more types of wax.

The wax content is preferably 0.0001% by mass or more, more preferably 0.005% by mass or more, and particularly preferably 0.001% by mass or more, based on the total mass of the temporary support. The wax content is preferably 0.05% by mass or less, more preferably 0.03% by mass or less, and particularly preferably 0.01% by mass or less, based on the total mass of the temporary support. By keeping the wax content within the above range, it is possible to suppress the change in the dynamic friction coefficient of the surface of the temporary support against stainless steel before and after heating.

(Other properties)
The temporary support (particularly the resin film) is preferably free of, for example, deformation (e.g., wrinkles), scratches, and defects. From the viewpoint of pattern formability during pattern exposure through the temporary support and the transparency of the temporary support, it is preferable that the number of fine particles, foreign matter, defects, and precipitates contained in the temporary support is small. In the temporary support, the number of fine particles, foreign matter, and defects having a diameter of 1 μm or more is preferably 50 pieces/10 mm ² or less, more preferably 10 pieces/10 mm ² or less, even more preferably 3 pieces/10 mm ² or less, and particularly preferably 0 pieces/10 mm ² .

Preferred embodiments of the temporary support are described, for example, in paragraphs 0017 to 0018 of JP 2014-85643 A, paragraphs 0019 to 0026 of JP 2016-27363 A, paragraphs 0041 to 0057 of WO 2012/081680 A, paragraphs 0029 to 0040 of WO 2018/179370 A, and paragraphs 0012 to 0032 of JP 2019-101405 A. The contents of these publications are incorporated herein by reference.

[Photosensitive resin layer]
The photosensitive transfer material according to the present disclosure has a photosensitive resin layer. The photosensitive resin layer is preferably a negative photosensitive resin layer in which the solubility of the exposed portion in a developer is reduced by exposure, and the non-exposed portion is removed by development. However, the photosensitive resin layer is not limited to a negative photosensitive resin layer, and may be a positive photosensitive resin layer in which the solubility of the exposed portion in a developer is improved by exposure, and the exposed portion is removed by development.

In one embodiment, the photosensitive resin layer preferably contains polymer A, polymerizable compound B, and a photopolymerization initiator. In one embodiment, the photosensitive resin layer preferably contains 10% by mass to 90% by mass of polymer A, 5% by mass to 70% by mass of polymerizable compound B, and 0.01% by mass to 20% by mass of the photopolymerization initiator, relative to the total mass of the photosensitive resin layer. The polymer A, the polymerizable compound B, and the photopolymerization initiator will be described later.

(Polymer A)
The photosensitive resin layer preferably contains a polymer A. The polymer A is preferably an alkali-soluble polymer. The alkali-soluble polymer includes polymers that are easily soluble in alkaline substances.

From the viewpoint of suppressing swelling of the photosensitive resin layer by the developer and thereby improving the resolution, the acid value of the polymer A is preferably 220 mgKOH/g or less, more preferably less than 200 mgKOH/g, and particularly preferably less than 190 mgKOH/g. The lower limit of the acid value is not limited. From the viewpoint of improving the developability, the acid value of the polymer A is preferably 60 mgKOH/g or more, more preferably 120 mgKOH/g or more, even more preferably 150 mgKOH/g or more, and particularly preferably 170 mgKOH/g or more. The acid value of the polymer A can be adjusted, for example, by the type of structural unit constituting the polymer A and the content of the structural unit containing an acid group.

In this disclosure, the acid value is the mass (mg) of potassium hydroxide required to neutralize 1 g of sample. In this disclosure, the unit of acid value is written as mgKOH/g. The acid value can be calculated, for example, from the average content of acid groups in the compound.

The weight average molecular weight (Mw) of polymer A is preferably 5,000 to 500,000. A weight average molecular weight of 500,000 or less is preferable from the viewpoint of improving resolution and developability. The weight average molecular weight of polymer A is more preferably 100,000 or less, even more preferably 60,000 or less, and particularly preferably 50,000 or less. On the other hand, a weight average molecular weight of 5,000 or more is preferable from the viewpoint of controlling the properties of the development aggregate, edge fuse property, and cut chip property. The weight average molecular weight of polymer A is more preferably 10,000 or more, even more preferably 20,000 or more, and particularly preferably 30,000 or more. Edge fuse property refers to the degree of ease of protrusion of the photosensitive resin layer from the end face of the roll when the photosensitive transfer material is wound into a roll. Cut chip property refers to the degree of ease of chipping when the unexposed film is cut with a cutter. For example, if chips adhere to the surface of a photosensitive transfer material, the chips will be transferred to the mask during the exposure process, causing defective products.

The dispersity of polymer A is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, even more preferably 1.0 to 4.0, and particularly preferably 1.0 to 3.0. In this disclosure, dispersity is the ratio of weight average molecular weight to number average molecular weight (weight average molecular weight/number average molecular weight).

It is preferable that polymer A has a structural unit derived from a monomer having an aromatic hydrocarbon group, in order to suppress line width thickening and deterioration of resolution when the focus position is shifted during exposure.

Examples of aromatic hydrocarbon groups include substituted or unsubstituted phenyl groups and substituted or unsubstituted aralkyl groups.

The content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group in the polymer A is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more, based on the total mass of the polymer A. There is no upper limit to the content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group. The content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group in the polymer A is preferably 95% by mass or less, more preferably 85% by mass or less, based on the total mass of the polymer A. In addition, when the photosensitive resin layer contains multiple types of polymer A, the content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group is calculated as a weight average value.

Examples of monomers having an aromatic hydrocarbon group include monomers having an aralkyl group, styrene, and polymerizable styrene derivatives (e.g., methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimer, and styrene trimer). The monomer having an aromatic hydrocarbon group is preferably a monomer having an aralkyl group or styrene.

Aralkyl groups include substituted or unsubstituted phenylalkyl groups (excluding benzyl groups) and substituted or unsubstituted benzyl groups, with substituted or unsubstituted benzyl groups being preferred.

An example of a monomer having a phenylalkyl group is phenylethyl (meth)acrylate.

Examples of monomers having a benzyl group include (meth)acrylates having a benzyl group (e.g., benzyl (meth)acrylate and chlorobenzyl (meth)acrylate) and vinyl monomers having a benzyl group (e.g., vinylbenzyl chloride and vinylbenzyl alcohol). The monomer having a benzyl group is preferably benzyl (meth)acrylate.

In one embodiment, when the structural unit in polymer A derived from a monomer having an aromatic hydrocarbon group is a structural unit derived from benzyl (meth)acrylate, the content of the structural unit derived from benzyl (meth)acrylate monomer in polymer A is preferably 50% by mass to 95% by mass, more preferably 60% by mass to 90% by mass, even more preferably 70% by mass to 90% by mass, and particularly preferably 75% by mass to 90% by mass, relative to the total mass of polymer A.

In one embodiment, when the structural unit in polymer A derived from a monomer having an aromatic hydrocarbon group is a structural unit derived from styrene, the content of the structural unit derived from styrene in polymer A is preferably 20% by mass to 60% by mass, more preferably 25% by mass to 55% by mass, and even more preferably 30% by mass to 50% by mass, relative to the total mass of polymer A. When the photosensitive resin layer contains multiple types of polymer A, the content of the structural unit having an aromatic hydrocarbon group is calculated as a weight average value.

In one embodiment, the polymer A having a structural unit derived from a monomer having an aromatic hydrocarbon group is preferably a copolymer obtained by polymerizing a monomer having an aromatic hydrocarbon group and at least one selected from the group consisting of a first monomer described below and a second monomer described below. The copolymer has a structural unit derived from a monomer having an aromatic hydrocarbon group, and at least one selected from the group consisting of a structural unit derived from the first monomer and a structural unit derived from the second monomer.

The polymer A may be a polymer that does not have a structural unit derived from a monomer having an aromatic hydrocarbon group. The polymer A that does not have a structural unit derived from a monomer having an aromatic hydrocarbon group is preferably a polymer obtained by polymerizing at least one type of the first monomer (excluding monomers having an aromatic hydrocarbon group) described later, and more preferably a copolymer obtained by polymerizing at least one type of the first monomer (excluding monomers having an aromatic hydrocarbon group) described later and at least one type of the second monomer (excluding monomers having an aromatic hydrocarbon group) described later.

In one embodiment, polymer A is preferably a polymer obtained by polymerizing at least one type of a first monomer described later, and more preferably a copolymer obtained by polymerizing at least one type of a first monomer described later and at least one type of a second monomer described later. The copolymer has a constituent unit derived from the first monomer and a constituent unit derived from the second monomer.

The first monomer is a monomer having a carboxy group and a polymerizable unsaturated group in the molecule. The first monomer may be a monomer having no aromatic hydrocarbon group in the molecule. Examples of the first monomer include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, and maleic acid half ester. The first monomer is preferably (meth)acrylic acid.

The content of the structural unit derived from the first monomer in polymer A is preferably 5% by mass to 50% by mass, more preferably 10% by mass to 40% by mass, and particularly preferably 15% by mass to 30% by mass, relative to the total mass of polymer A.

The second monomer is a monomer that is non-acidic and has at least one polymerizable unsaturated group in the molecule. The second monomer may be a monomer that does not have an aromatic hydrocarbon group in the molecule. Examples of the second monomer include (meth)acrylate compounds, vinyl alcohol ester compounds, and (meth)acrylonitrile. In this disclosure, "(meth)acrylonitrile" includes acrylonitrile, methacrylonitrile, or both acrylonitrile and methacrylonitrile.

Examples of (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate.

An example of an ester compound of vinyl alcohol is vinyl acetate.

The second monomer is preferably at least one selected from the group consisting of methyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and n-butyl (meth)acrylate, and is more preferably methyl (meth)acrylate.

The content of the structural units derived from the second monomer in polymer A is preferably 5% by mass to 60% by mass, more preferably 15% by mass to 50% by mass, and particularly preferably 20% by mass to 45% by mass, relative to the total mass of polymer A.

From the viewpoint of suppressing line width thickening and deterioration of resolution when the focal position is shifted during exposure, it is preferable that polymer A contains at least one selected from the group consisting of a structural unit derived from a monomer having an aralkyl group and a structural unit derived from styrene. For example, polymer A is preferably at least one selected from the group consisting of a copolymer containing a structural unit derived from methacrylic acid, a structural unit derived from benzyl methacrylate, and a structural unit derived from styrene, and a copolymer containing a structural unit derived from methacrylic acid, a structural unit derived from methyl methacrylate, a structural unit derived from benzyl methacrylate, and a structural unit derived from styrene.

In one embodiment, polymer A is preferably a polymer containing 25% to 60% by mass of structural units derived from a monomer having an aromatic hydrocarbon group, 20% to 55% by mass of structural units derived from a first monomer, and 15% to 55% by mass of structural units derived from a second monomer. It is more preferable that polymer A is a polymer containing 25% to 40% by mass of structural units derived from a monomer having an aromatic hydrocarbon group, 20% to 35% by mass of structural units derived from a first monomer, and 15% to 45% by mass of structural units derived from a second monomer.

In one embodiment, polymer A is preferably a polymer containing 70% to 90% by mass of structural units derived from a monomer having an aromatic hydrocarbon group and 10% to 25% by mass of structural units derived from a first monomer.

The polymer (A) may have a branched structure or an alicyclic structure in the side chain. A branched structure or an alicyclic structure can be introduced into the side chain of the polymer (A) by using a monomer containing a group having a branched structure in the side chain or a monomer containing a group having an alicyclic structure in the side chain.

Examples of monomers containing a group having a branched structure in the side chain include isopropyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, isoamyl (meth)acrylate, tert-amyl (meth)acrylate, sec-amyl (meth)acrylate, 2-octyl (meth)acrylate, 3-octyl (meth)acrylate, and tert-octyl (meth)acrylate. Among the above compounds, isopropyl (meth)acrylate, isobutyl (meth)acrylate, or tert-butyl methacrylate is preferred, and isopropyl methacrylate or tert-butyl methacrylate is more preferred.

Examples of monomers containing a group having an alicyclic structure in the side chain include (meth)acrylates having an alicyclic hydrocarbon group having 5 to 20 carbon atoms. Specific examples of the above-mentioned compounds include (bicyclo[2.2.1]heptyl-2(meth)acrylate, (1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, 3-methyl-1-adamantyl (meth)acrylate, 3,5-dimethyl-1-adamantyl (meth)acrylate, 3-ethyladamantyl (meth)acrylate, 3-methyl-5-ethyl-1-adamantyl (meth)acrylate, 3,5,8-triethyl-1-adamantyl (meth)acrylate, 3,5-dimethyl-8-ethyl-1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, 2-ethyl-2-adamantyl (meth)acrylate, 3-hydroxy-2-propanol (meth)acrylate, and 3-hydroxy-2-propanol (meth)acrylate. hydroxy-1-adamantyl (meth)acrylate, octahydro-4,7-menthanoinden-5-yl (meth)acrylate, octahydro-4,7-menthanoinden-1-ylmethyl (meth)acrylate, 1-menthyl (meth)acrylate, tricyclodecane (meth)acrylate, 3-hydroxy-2,6,6-trimethyl-bicyclo[3.1.1]heptyl (meth)acrylate, 3,7,7-trimethyl-4-hydroxy-bicyclo[4.1.0]heptyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, fenchyl (meth)acrylate, 2,2,5-trimethylcyclohexyl (meth)acrylate, and cyclohexyl (meth)acrylate. Among the above-mentioned compounds, cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, fenchyl (meth)acrylate, 1-menthyl (meth)acrylate, or tricyclodecane (meth)acrylate is preferred, and cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 2-adamantyl (meth)acrylate, or tricyclodecane (meth)acrylate is more preferred.

The glass transition temperature (Tg) of polymer A is preferably 30°C to 135°C. In the photosensitive resin layer, when the Tg of polymer A is 135°C or less, it is possible to suppress line width thickening and deterioration of resolution when the focal position is shifted during exposure. From the above viewpoint, the Tg of polymer A is more preferably 130°C or less, even more preferably 120°C or less, and particularly preferably 110°C or less. In addition, it is preferable that the Tg of polymer A is 30°C or more from the viewpoint of improving edge fuse resistance. From the above viewpoint, the Tg of polymer A is more preferably 40°C or more, even more preferably 50°C or more, particularly preferably 60°C or more, and most preferably 70°C or more.

Polymer A may be a commercially available product or a synthetic product. Polymer A is preferably synthesized, for example, by adding an appropriate amount of a radical polymerization initiator (e.g., benzoyl peroxide or azoisobutyronitrile) to a solution obtained by diluting at least one of the above-mentioned monomers with a solvent (e.g., acetone, methyl ethyl ketone, or isopropanol), and then heating and stirring. In some cases, the synthesis is performed while dropping a part of the mixture into the reaction solution. After the reaction is completed, further solvent may be added to adjust the concentration to the desired level. As a synthesis method, bulk polymerization, suspension polymerization, or emulsion polymerization may be used in addition to solution polymerization.

The photosensitive resin layer may contain one type of polymer A alone, or two or more types of polymer A. When the photosensitive resin layer contains two or more types of polymer A, it is preferable that the photosensitive resin layer contains two or more types of polymer A having a structural unit derived from a monomer having an aromatic hydrocarbon group, or a polymer A having a structural unit derived from a monomer having an aromatic hydrocarbon group and a polymer A having no structural unit derived from a monomer having an aromatic hydrocarbon group. In the latter case, the content ratio of the polymer A having a structural unit derived from a monomer having an aromatic hydrocarbon group is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more, based on the total mass of the polymer A.

The content of polymer A is preferably 10% by mass to 90% by mass, more preferably 30% by mass to 70% by mass, and particularly preferably 40% by mass to 60% by mass, relative to the total mass of the photosensitive resin layer. It is preferable to set the content of polymer A to 90% by mass or less in the photosensitive resin layer from the viewpoint of controlling the development time. On the other hand, it is preferable to set the content of polymer A to 10% by mass or more in the photosensitive resin layer from the viewpoint of improving edge fuse resistance.

(Polymerizable Compound B)
The photosensitive resin layer preferably contains a polymerizable compound B having a polymerizable group. In the present disclosure, the term "polymerizable compound" refers to a compound that is polymerized by the action of a polymerization initiator. The polymerizable compound B is a compound different from the polymer A.

The polymerizable group in the polymerizable compound B is not limited as long as it is a group involved in the polymerization reaction. Examples of the polymerizable group in the polymerizable compound B include groups containing an ethylenically unsaturated bond (e.g., vinyl groups, acryloyl groups, methacryloyl groups, styryl groups, and maleimide groups), and cationic polymerizable groups (e.g., epoxy groups and oxetane groups). The polymerizable group is preferably a group containing an ethylenically unsaturated bond (hereinafter sometimes referred to as an "ethylenically unsaturated group"), and is more preferably an acryloyl group or a methacryloyl group.

In terms of providing a more excellent photosensitivity to the photosensitive resin layer, the polymerizable compound B is preferably a compound having one or more ethylenically unsaturated groups in one molecule (i.e., an ethylenically unsaturated compound), and more preferably a compound having two or more ethylenically unsaturated groups in one molecule (i.e., a polyfunctional ethylenically unsaturated compound). In terms of providing better resolution and peelability, the number of ethylenically unsaturated groups contained in one molecule of the ethylenically unsaturated compound is preferably six or less, more preferably three or less, and particularly preferably two or less.

It is preferable that the ethylenically unsaturated compound is a (meth)acrylate compound having one or more (meth)acryloyl groups in one molecule.

From the viewpoint of achieving a better balance of photosensitivity, resolution, and peelability in the photosensitive resin layer, the polymerizable compound B is preferably at least one selected from the group consisting of compounds having two ethylenically unsaturated groups in one molecule (i.e., bifunctional ethylenically unsaturated compounds) and compounds having three ethylenically unsaturated groups in one molecule (i.e., trifunctional ethylenically unsaturated compounds), and is more preferably a compound having two ethylenically unsaturated groups in one molecule.

In the photosensitive resin layer, the ratio of the content of the bifunctional ethylenically unsaturated compound to the content of the polymerizable compound B is preferably 60% by mass or more, more preferably more than 70% by mass, and particularly preferably 90% by mass or more, from the viewpoint of excellent peelability of the photosensitive resin layer. The upper limit of the content ratio of the bifunctional ethylenically unsaturated compound to the content of the polymerizable compound B is not limited and may be 100% by mass. In other words, all of the polymerizable compounds B contained in the photosensitive resin layer may be bifunctional ethylenically unsaturated compounds.

-Polymerizable compound B1-
The photosensitive resin layer preferably contains a polymerizable compound B1 having one or more aromatic rings and two ethylenically unsaturated groups in one molecule. The polymerizable compound B1 is the above-mentioned polymerizable compound B Among these, it is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule.

In the photosensitive resin layer, the ratio of the content of polymerizable compound B1 to the content of polymerizable compound B is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 55% by mass or more, and particularly preferably 60% by mass or more, from the viewpoint of better resolution. The upper limit of the ratio of the content of polymerizable compound B1 to the content of polymerizable compound B is not limited. From the viewpoint of peelability, the ratio of the content of polymerizable compound B1 to the content of polymerizable compound B is preferably 99% by mass or less, more preferably 95% by mass or less, even more preferably 90% by mass or less, and particularly preferably 85% by mass or less.

Examples of the aromatic ring in the polymerizable compound B1 include aromatic hydrocarbon rings (e.g., benzene ring, naphthalene ring, and anthracene ring), aromatic heterocycles (e.g., thiophene ring, furan ring, pyrrole ring, imidazole ring, triazole ring, and pyridine ring), and condensed rings thereof. The aromatic ring is preferably an aromatic hydrocarbon ring, and more preferably a benzene ring. The aromatic ring may have a substituent.

The polymerizable compound B1 preferably has a bisphenol structure, since this improves resolution by suppressing swelling of the photosensitive resin layer caused by the developer. Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (i.e., 2,2-bis(4-hydroxyphenyl)propane), a bisphenol F structure derived from bisphenol F (i.e., 2,2-bis(4-hydroxyphenyl)methane), and a bisphenol B structure derived from bisphenol B (i.e., 2,2-bis(4-hydroxyphenyl)butane). The bisphenol structure is preferably a bisphenol A structure.

Examples of the polymerizable compound B1 having a bisphenol structure include compounds having a bisphenol structure and two polymerizable groups (preferably (meth)acryloyl groups) bonded to both ends of the bisphenol structure. Each polymerizable group may be bonded directly to the bisphenol structure. Each polymerizable group may be bonded to the bisphenol structure via one or more alkyleneoxy groups. The alkyleneoxy groups added to both ends of the bisphenol structure are preferably ethyleneoxy groups or propyleneoxy groups, and more preferably ethyleneoxy groups. The number of alkyleneoxy groups added to the bisphenol structure is not limited, but is preferably 4 to 16, and more preferably 6 to 14 per molecule.

The polymerizable compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP 2016-224162 A. The contents of the above publication are incorporated herein by reference.

The polymerizable compound B1 is preferably a bifunctional ethylenically unsaturated compound having a bisphenol A structure, and more preferably 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.

Examples of 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (FA-324M, Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane, 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (BPE-500, Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloxydodecaethoxy)phenyl)propane, Examples of such bisphenol A diacrylates include 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (FA-3200MY, Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (BPE-1300, Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (BPE-200, Shin-Nakamura Chemical Co., Ltd.), and ethoxylated (10) bisphenol A diacrylate (NK Ester A-BPE-10, Shin-Nakamura Chemical Co., Ltd.).

Examples of polymerizable compounds B1 include compounds represented by the following general formula (I):

In the general formula (I), R ₁ and R ₂ each independently represent a hydrogen atom or a methyl group, A represents C ₂ H ₄ , B represents C ₃ H ₆ , n ₁ and n ₃ each independently represent an integer of 1 to 39, n ₁ +n ₃ is an integer of 2 to 40, n ₂ and n ₄ each independently represent an integer of 0 to 29, n ₂ +n ₄ is an integer of 0 to 30, and the arrangement of the repeating units of -(A-O)- and -(B-O)- may be random or block. In the case of a block, either -(A-O)- or -(B-O)- may be on the bisphenyl group side. _{n 2} +n ₄ is preferably an integer of 0 to 10, more preferably an integer of 0 to 4, even more preferably an integer of 0 to 2, and particularly preferably 0. n ₁ +n ₂ +n ₃ +n ₄ is preferably an integer of 2 to 20, more preferably an integer of 2 to 16, and particularly preferably an integer of 4 to 12.

The photosensitive resin layer may contain one or more types of polymerizable compound B1.

From the viewpoint of better resolution, the content ratio of the polymerizable compound B1 in the photosensitive resin layer is preferably 10% by mass or more, and more preferably 20% by mass or more, based on the total mass of the photosensitive resin layer. There is no upper limit to the content ratio of the polymerizable compound B1. From the viewpoint of transferability and edge fuse resistance, the content ratio of the polymerizable compound B1 in the photosensitive resin layer is preferably 70% by mass or less, and more preferably 60% by mass or less, based on the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain a polymerizable compound B1 and a polymerizable compound B other than the polymerizable compound B1. Examples of the polymerizable compound B other than the polymerizable compound B1 include a monofunctional ethylenically unsaturated compound (i.e., a compound having one ethylenically unsaturated group in one molecule), a bifunctional ethylenically unsaturated compound without an aromatic ring (i.e., a compound having no aromatic ring and two ethylenically unsaturated groups in one molecule), and a trifunctional or higher ethylenically unsaturated compound (i.e., a compound having three or more ethylenically unsaturated groups in one molecule).

Examples of monofunctional ethylenically unsaturated compounds include ethyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and phenoxyethyl (meth)acrylate.

Examples of bifunctional ethylenically unsaturated compounds not having an aromatic ring include alkylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, urethane di(meth)acrylate, and trimethylolpropane diacrylate.

Examples of alkylene glycol di(meth)acrylates include tricyclodecane dimethanol diacrylate (A-DCP, Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, Shin-Nakamura Chemical Co., Ltd.), ethylene glycol dimethacrylate, 1,10-decanediol diacrylate, and neopentyl glycol di(meth)acrylate.

Examples of polyalkylene glycol di(meth)acrylates include polyethylene glycol di(meth)acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di(meth)acrylate.

Examples of urethane di(meth)acrylates include propylene oxide modified urethane di(meth)acrylates, and ethylene oxide and propylene oxide modified urethane di(meth)acrylates. Commercially available products include 8UX-015A (Taisei Fine Chemical Co., Ltd.), UA-32P (Shin-Nakamura Chemical Co., Ltd.), and UA-1100H (Shin-Nakamura Chemical Co., Ltd.).

Examples of trifunctional or higher ethylenically unsaturated compounds include dipentaerythritol (tri/tetra/penta/hexa)(meth)acrylate, pentaerythritol (tri/tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate (e.g., A-TMPT manufactured by Shin-Nakamura Chemical Co., Ltd.), ditrimethylolpropane tetra(meth)acrylate, trimethylolethane tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate, and alkylene oxide modified versions of these. In this disclosure, "(tri/tetra/penta/hexa)(meth)acrylate" is a concept that includes tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate. In the present disclosure, the term "(tri/tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

Examples of alkylene oxide modified trifunctional or higher ethylenically unsaturated compounds include caprolactone modified (meth)acrylate compounds (e.g., KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., and A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd.), alkylene oxide modified (meth)acrylate compounds (e.g., KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E manufactured by Shin-Nakamura Chemical Co., Ltd., A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., and EBECRYL (registered trademark) manufactured by Daicel-Allnex Corporation). 135), ethoxylated glycerin triacrylate (e.g., A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.), ARONIX (registered trademark) TO-2349 (Toagosei Co., Ltd.), ARONIX M-520 (Toagosei Co., Ltd.), ARONIX M-510 (Toagosei Co., Ltd.), and SR454 (Arkema).

Examples of polymerizable compounds B other than polymerizable compound B1 include the polymerizable compounds having an acid group described in paragraphs 0025 to 0030 of JP-A No. 2004-239942.

In one embodiment, the photosensitive resin layer preferably contains a polymerizable compound B1 and a trifunctional or higher ethylenically unsaturated compound, and more preferably contains a polymerizable compound B1 and two or more trifunctional or higher ethylenically unsaturated compounds. In the above embodiment, the mass ratio of the polymerizable compound B1 to the trifunctional or higher ethylenically unsaturated compounds ([total mass of polymerizable compound B1]: [total mass of trifunctional or higher ethylenically unsaturated compounds] is preferably 1:1 to 5:1, more preferably 1.2:1 to 4:1, and particularly preferably 1.5:1 to 3:1. In one embodiment, the photosensitive resin layer preferably contains a polymerizable compound B1 and two or more trifunctional ethylenically unsaturated compounds.

The molecular weight of polymerizable compound B (meaning the weight average molecular weight (Mw) if polymerizable compound B has a molecular weight distribution) is preferably 200 to 3,000, more preferably 280 to 2,200, and particularly preferably 300 to 2,200.

From the viewpoints of resolution and linearity, the ratio Mm/Mb of the content Mm of the ethylenically unsaturated compound in the photosensitive resin layer to the content Mb of polymer A is preferably 1.0 or less, more preferably 0.9 or less, and particularly preferably 0.5 or more and 0.9 or less.
From the viewpoints of curability and resolution, the ethylenically unsaturated compound in the photosensitive resin layer preferably contains a (meth)acrylic compound, and more preferably contains a (meth)acrylate compound.
Further, from the viewpoints of curability, resolution and linearity, it is more preferable that the ethylenically unsaturated compound in the photosensitive resin layer contains a (meth)acrylic compound, and the content of the acrylic compound relative to the total mass of the (meth)acrylic compound contained in the photosensitive resin layer is 60 mass% or less.

The photosensitive resin layer may contain one or more types of polymerizable compound B.

The content ratio of polymerizable compound B in the photosensitive resin layer is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, and particularly preferably 20% by mass to 50% by mass, relative to the total mass of the photosensitive resin layer.

(Optional ingredients)
The photosensitive resin layer may contain components other than the above-mentioned components (hereinafter, sometimes referred to as "optional components"). The optional components include a photopolymerization initiator, a dye, a surfactant, and additives other than the above-mentioned components.

- Photopolymerization initiator -
The photosensitive resin layer preferably contains a photopolymerization initiator. The photopolymerization initiator is a compound that initiates polymerization of a polymerizable compound (e.g., polymerizable compound B) upon receiving actinic rays (e.g., ultraviolet rays, visible rays, and X-rays).

The photopolymerization initiator is not limited, and any known photopolymerization initiator can be used. Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferred.

Examples of photoradical polymerization initiators include photopolymerization initiators having an oxime ester structure, photopolymerization initiators having an α-aminoalkylphenone structure, photopolymerization initiators having an α-hydroxyalkylphenone structure, photopolymerization initiators having an acylphosphine oxide structure, and photopolymerization initiators having an N-phenylglycine structure.

From the viewpoints of photosensitivity, visibility of exposed areas, visibility of non-exposed areas, and resolution, the photosensitive resin layer preferably contains, as a photoradical polymerization initiator, at least one selected from the group consisting of 2,4,5-triarylimidazole dimer and derivatives of 2,4,5-triarylimidazole dimer. Note that the two 2,4,5-triarylimidazole structures in the 2,4,5-triarylimidazole dimer and its derivatives may be the same or different.

Examples of derivatives of 2,4,5-triarylimidazole dimer include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer.

Examples of photoradical polymerization initiators include the polymerization initiators described in paragraphs 0031 to 0042 of JP 2011-95716 A and paragraphs 0064 to 0081 of JP 2015-14783 A.

Examples of photoradical polymerization initiators include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p,p'-dimethoxybenzyl), and benzophenone.

Commercially available photoradical polymerization initiators include, for example, TAZ-110 (Midori Chemical Co., Ltd.), TAZ-111 (Midori Chemical Co., Ltd.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (Tokyo Chemical Industry Co., Ltd. and Hampford), 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-01, BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (trade name: IRGACURE OXE-02, BASF), and IRGACURE OXE-03 (BASF), IRGACURE OXE-04 (BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, IGM Resins B.V.), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907, IGM Resins B.V.), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one (trade name: Omnirad 127, IGM Resins B.V.) B.V.), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1 (trade name: Omnirad 369, IGM Resins B.V.), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173, IGM Resins B.V.), 1-hydroxycyclohexyl phenyl ketone (trade name: Omnirad 184, IGM Resins B.V.), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad 651, IGM Resins B.V.), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H, IGM Resins Examples of photoinitiators that can be used include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819, IGM Resins B.V.), and oxime ester-based photoinitiators (trade name: Lunar 6, DKSH Japan Co., Ltd.).

A photocationic polymerization initiator (i.e., a photoacid generator) is a compound that generates an acid when exposed to actinic radiation. As a photocationic polymerization initiator, a compound that responds to actinic radiation with a wavelength of 300 nm or more, preferably 300 to 450 nm, and generates an acid is preferred. However, the chemical structure of the photocationic polymerization initiator is not limited. In addition, even if a photocationic polymerization initiator is not directly sensitive to actinic radiation with a wavelength of 300 nm or more, it can be preferably used in combination with a sensitizer as long as it responds to actinic radiation with a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer.

The photocationic polymerization initiator is preferably a photocationic polymerization initiator that generates an acid with a pKa of 4 or less, more preferably a photocationic polymerization initiator that generates an acid with a pKa of 3 or less, and particularly preferably a photocationic polymerization initiator that generates an acid with a pKa of 2 or less. There is no lower limit for the pKa. The pKa of the acid generated from the photocationic polymerization initiator is preferably, for example, -10.0 or more.

Examples of photocationic polymerization initiators include ionic photocationic polymerization initiators and non-ionic photocationic polymerization initiators.

Examples of ionic photocationic polymerization initiators include onium salt compounds (e.g., diaryliodonium salt compounds and triarylsulfonium salt compounds) and quaternary ammonium salt compounds.

Examples of ionic photocationic polymerization initiators include the ionic photocationic polymerization initiators described in paragraphs 0114 to 0133 of JP 2014-85643 A.

Examples of nonionic photocationic polymerization initiators include trichloromethyl-s-triazine compounds, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Examples of trichloromethyl-s-triazine compounds, diazomethane compounds, and imide sulfonate compounds include the compounds described in paragraphs 0083 to 0088 of JP 2011-221494 A. Examples of oxime sulfonate compounds include the compounds described in paragraphs 0084 to 0088 of WO 2018/179640 A.

The photosensitive resin layer preferably contains a photoradical polymerization initiator, and more preferably contains at least one selected from the group consisting of 2,4,5-triarylimidazole dimer and derivatives of 2,4,5-triarylimidazole dimer.

The photosensitive resin layer may contain one or more types of photopolymerization initiators.

The content of the photopolymerization initiator in the photosensitive resin layer is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and particularly preferably 1.0% by mass or more, based on the total mass of the photosensitive resin layer. There is no upper limit to the content of the photopolymerization initiator. The content of the photopolymerization initiator is preferably 10% by mass or less, more preferably 7% by mass or less, based on the total mass of the photosensitive resin layer.

- Pigments -
From the viewpoints of visibility of exposed areas, visibility of unexposed areas, pattern visibility after development, and resolution, the photosensitive resin layer preferably contains a dye (hereinafter sometimes referred to as "dye N") whose maximum absorption wavelength in the wavelength range of 400 nm to 780 nm during color development is 450 nm or more and whose maximum absorption wavelength changes with an acid, a base, or a radical. Although the detailed mechanism is unknown, when the photosensitive resin layer contains dye N, the adhesion with layers adjacent to the photosensitive resin layer (for example, a temporary support and an intermediate layer) is improved, and the resolution is more excellent.

In this disclosure, the term "the maximum absorption wavelength changes due to an acid, a base, or a radical" as used with respect to a dye may mean any of the following: a dye in a colored state is decolorized by an acid, a base, or a radical; a dye in a decolorized state is colored by an acid, a base, or a radical; and a dye in a colored state changes to a colored state of another hue.

Specifically, the dye N may be a compound that changes from a decolorized state to a colored state upon exposure, or may be a compound that changes from a colored state to a decolored state upon exposure. In the above embodiment, the dye N may be a dye whose colored or decolored state changes due to the action of an acid, base, or radical generated upon exposure. The dye N may also be a dye whose colored or decolored state changes due to a change in the state (e.g., pH) in the photosensitive resin layer caused by an acid, base, or radical generated upon exposure. On the other hand, the dye N may be a dye whose colored or decolored state changes upon direct stimulation by an acid, base, or radical without exposure.

From the viewpoints of visibility of exposed areas, visibility of unexposed areas, and resolution, it is preferable that dye N is a dye whose maximum absorption wavelength changes in response to an acid or a radical, and it is more preferable that dye N is a dye whose maximum absorption wavelength changes in response to a radical.

From the standpoint of visibility of exposed areas, visibility of non-exposed areas, and resolution, it is preferable that the photosensitive resin layer contains, as dye N, both a dye whose maximum absorption wavelength changes due to radicals, and a photoradical polymerization initiator.

From the viewpoint of visibility of exposed areas and visibility of non-exposed areas, it is preferable that dye N is a dye that develops color in response to an acid, a base, or a radical.

An example of the color-developing mechanism of dye N is a mode in which a photosensitive resin layer containing a photoradical polymerization initiator, a photocationic polymerization initiator (i.e., a photoacid generator), or a photobase generator is exposed to light, and a radical-reactive dye, an acid-reactive dye, or a base-reactive dye (e.g., a leuco dye) develops color due to the radicals, acids, or bases generated from the photoradical polymerization initiator, the photocationic polymerization initiator, or the photobase generator.

For dye N, the maximum absorption wavelength in the wavelength range of 400 nm to 780 nm during color development is preferably 550 nm or more, more preferably 550 nm to 700 nm, and particularly preferably 550 to 650 nm, from the viewpoints of visibility of exposed areas and visibility of unexposed areas.

In addition, dye N may have one or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm when coloring occurs. If dye N has two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm when coloring occurs, the maximum absorption wavelength having the highest absorbance among the two or more maximum absorption wavelengths may be 450 nm or more.

The maximum absorption wavelength of dye N is measured by measuring the transmission spectrum of a solution containing dye N (liquid temperature 25°C) in the range of 400 nm to 780 nm using a spectrophotometer (UV3100, Shimadzu Corporation) in an atmospheric environment and detecting the wavelength at which the light intensity is minimal (maximum absorption wavelength).

Examples of dyes that develop or lose color upon exposure to light include leuco compounds. Examples of dyes that lose color upon exposure to light include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes. From the viewpoint of visibility of exposed and non-exposed areas, it is preferable that dye N is a leuco compound.

Examples of leuco compounds include leuco compounds having a triarylmethane skeleton (triarylmethane dyes), leuco compounds having a spiropyran skeleton (spiropyran dyes), leuco compounds having a fluoran skeleton (fluoran dyes), leuco compounds having a diarylmethane skeleton (diarylmethane dyes), leuco compounds having a rhodamine lactam skeleton (rhodamine lactam dyes), leuco compounds having an indolylphthalide skeleton (indolylphthalide dyes), and leuco compounds having a leucoauramine skeleton (leucoauramine dyes). The leuco compound is preferably a triarylmethane dye or a fluoran dye, and more preferably a leuco compound having a triphenylmethane skeleton (triphenylmethane dyes) or a fluoran dye.

From the viewpoint of visibility of the exposed portion and the non-exposed portion, the leuco compound preferably has a lactone ring, a sultine ring, or a sultone ring. By reacting the lactone ring, sultine ring, or sultone ring contained in the leuco compound with a radical generated from a photoradical polymerization initiator or an acid generated from a photocationic polymerization initiator, the leuco compound can be changed to a ring-closed state to be decolorized, or the leuco compound can be changed to a ring-open state to be colored. The leuco compound is preferably a compound that has a lactone ring, a sultine ring, or a sultone ring, and that opens the lactone ring, sultine ring, or sultone ring with a radical or an acid to open the lactone ring, sultine ring, or sultone ring to open the lactone ring, sultine ring, or sultone ring to open the lactone ring, sultine ring, or sultone ring to open the lactone ring, sultine ring, or sultone ring to open the lactone ring, sultine ring, or sultone ring to open the lactone ring, sultine ring, or sultone ring to open the lactone ring, sultone ...

Specific examples of leuco compounds include p,p',p"-hexamethyltriaminotriphenylmethane (leuco crystal violet), Pergascript Blue SRB (Ciba-Geigy), crystal violet lactone, malachite green lactone, benzoyl leuco methylene blue, 2-(N-phenyl-N-methylamino)-6-(N-p-tolyl-N-ethyl)aminofluoran, 2-anilino-3-methyl-6-(N-ethyl-p-toluidino)fluoran, 3,6-dimethoxyfluoran, 3-(N,N-diethylamino)-5-methyl-7-(N,N-dibenzylamino)fluoran, 3-(N-cyclohexyl-N-methylamino)-6 -methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-xylidinofluoran, 3-(N,N-diethylamino)-6-methyl-7-chlorofluoran, 3-(N,N-diethylamino)-6-methoxy-7-aminofluoran, 3-(N,N-diethylamino)-7-(4-chloroanilino)fluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-(N,N-diethylamino)- 3-(N,N-diethylamino)-7-benzylaminofluoran, 3-(N,N-diethylamino)-7,8-benzofluoran, 3-(N,N-dibutylamino)-6-methyl-7-anilinofluoran, 3-(N,N-dibutylamino)-6-methyl-7-xylidinofluoran, 3-piperidino-6-methyl-7-anilinofluoran, 3-pyrrolidino-6-methyl-7-anilinofluoran, 3,3-bis(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(1-n-butyl-2-methylindol-3-yl)phthalide, 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(p-dimethylaminophenyl)-6-dimethylaminophthalide, 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)-4-azaphthalide, 3-(4-diethylaminophenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, and 3',6'-bis(diphenylamino)spiroisobenzofuran-1(3H),9'-[9H]xanthen-3-one.

Examples of the pigment N include dyes. Specific examples of dyes include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, rose bengal, metanil yellow, thymolsulfophthalein, xylenol blue, methyl orange, paramethyl red, Congo red, benzopurpurin 4B, α-naphthyl red, Nile blue 2B, Nile blue A, methyl violet, malachite green, parafuchsin, Victoria Pure Blue - naphthalene sulfonate, Victoria Pure Blue BOH (Hodogaya Chemical Industry Co., Ltd.), Oil Blue #603 (Orient Chemical Industry Co., Ltd.), Oil Pink #312 (Orient Chemical Industry Co., Ltd.), Oil Red 5B (Orient Chemical Industry Co., Ltd.), and Oil Scarlet #308 (Orient Chemical Industry Co., Ltd.). Oil Red OG (Orient Chemical Industry Co., Ltd.), Oil Red RR (Orient Chemical Industry Co., Ltd.), Oil Green #502 (Orient Chemical Industry Co., Ltd.), Spiron Red BEH Special (Hodogaya Chemical Co., Ltd.), m-cresol purple, cresol red, rhodamine B, rhodamine 6G, sulforhodamine B, auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p-N,N-bis(hydroxyethyl)amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino-5-pyrazolone, and 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone.

From the viewpoints of visibility of exposed areas, visibility of unexposed areas, pattern visibility after development, and resolution, it is preferable that dye N is a dye whose maximum absorption wavelength changes due to radicals, and it is more preferable that it is a dye that develops color due to radicals.

It is preferred that dye N is leuco crystal violet, crystal violet lactone, brilliant green, or Victoria Pure Blue-naphthalenesulfonate.

The photosensitive resin layer may contain one or more types of dye N.

From the viewpoints of visibility of exposed areas, visibility of unexposed areas, pattern visibility after development, and resolution, the content of dye N is preferably 0.1% by mass or more, more preferably 0.1% by mass to 10% by mass, even more preferably 0.1% by mass to 5% by mass, and particularly preferably 0.1% by mass to 1% by mass, relative to the total mass of the photosensitive resin layer.

The content ratio of dye N means the content ratio of dye when all of the dye N contained in the photosensitive resin layer is in a colored state. Hereinafter, a method for quantifying the content ratio of dye N will be described using a dye that is colored by radicals as an example. Two solutions are prepared by dissolving dye (0.001 g) and dye (0.01 g) in methyl ethyl ketone (100 mL). After adding IRGACURE OXE-01 (BASF) as a photoradical polymerization initiator to each of the obtained solutions, radicals are generated by irradiating light of 365 nm to cause all of the dyes to be in a colored state. Next, the absorbance of each solution at a liquid temperature of 25°C is measured using a spectrophotometer (UV3100, Shimadzu Corporation) in an air atmosphere, and a calibration curve is created. Next, the absorbance of the solution in which all of the dyes have been colored is measured in the same manner as above, except that the photosensitive resin layer (3 g) is dissolved in methyl ethyl ketone instead of the dye. The content of the dye contained in the photosensitive resin layer is calculated from the absorbance of the obtained solution containing the photosensitive resin layer based on a calibration curve.

-Surfactants-
From the viewpoint of thickness uniformity, the photosensitive resin layer preferably contains a surfactant. Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants, and nonionic surfactants are preferred.

Examples of nonionic surfactants include polyoxyethylene higher alkyl ether compounds, polyoxyethylene higher alkyl phenyl ether compounds, polyoxyethylene glycol higher fatty acid diester compounds, silicone-based nonionic surfactants, and fluorine-based nonionic surfactants.

It is preferable that the photosensitive resin layer contains a fluorine-based nonionic surfactant, since this provides better resolution. It is believed that the inclusion of a fluorine-based nonionic surfactant in the photosensitive resin layer suppresses the penetration of the etching solution into the photosensitive resin layer, thereby reducing side etching. Examples of commercially available fluorine-based nonionic surfactants include Megafac (registered trademark) F-551, F-552 (DIC Corporation), and Megafac F-554 (DIC Corporation).

Examples of surfactants include those described in paragraphs 0120 to 0125 of WO 2018/179640, those described in paragraph 0017 of Japanese Patent No. 4,502,784, and those described in paragraphs 0060 to 0071 of JP 2009-237362 A.

As the surfactant, a nonionic surfactant, a fluorine-based surfactant or a silicone-based surfactant is preferred.

Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic (trade name) L10, L 31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic (trade name) 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), Solsperse (trade name) 20000 (all manufactured by Lubrizol Japan Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (all manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.), Paionin (trade name) D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Oil Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.), and the like.

Commercially available fluorine-based surfactants include, for example, Megafac (product name) F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-444, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, and F-558. F-559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-L M, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all DIC stocks) Company), Fluorard (product name) FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon (product name) S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox (product name) PF636, PF656, PF6 320, PF6520, PF7002 (all manufactured by OMNOVA), Futergent (product name) 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, 683 (all manufactured by NEOS Corporation), and the like.
In addition, the fluorosurfactant may be an acrylic compound that has a molecular structure with a functional group containing a fluorine atom, and when heat is applied, the functional group containing the fluorine atom is broken and the fluorine atom is volatilized. Examples of such a fluorosurfactant include the Megafac (product name) DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Business Daily (February 23, 2016)), for example, Megafac (product name) DS-21.

As the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.
As the fluorine-based surfactant, a block polymer can also be used. As the fluorine-based surfactant, a fluorine-containing polymer compound containing a constitutional unit derived from a (meth)acrylate compound having a fluorine atom and a constitutional unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups, propyleneoxy groups) can also be preferably used.
As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated group in the side chain can also be used, such as Megafac (product name) RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).
As the fluorosurfactant, for example, a compound having a linear perfluoroalkyl group having 7 or more carbon atoms may be used. However, from the viewpoint of improving environmental compatibility, it is preferable to use an alternative material to perfluorooctanoic acid (PFOA) or perfluorooctanesulfonic acid (PFOS) as the fluorosurfactant.

Examples of silicone surfactants include linear polymers formed from siloxane bonds, and modified siloxane polymers in which organic groups have been introduced into the side chains or ends.
Specific examples of silicone surfactants include DOWSIL (trade name) 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Dow Corning Toray Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, and KF -945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Chemical Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie).

The photosensitive resin layer may contain one or more types of surfactants.

The surfactant content is preferably 0.001% by mass to 10% by mass, and more preferably 0.01% by mass to 3% by mass, relative to the total mass of the photosensitive resin layer.

-Additives-
The photosensitive resin layer may contain known additives as necessary in addition to the above components. Examples of additives include thermal crosslinking compounds, radical polymerization inhibitors, sensitizers, plasticizers, heterocyclic compounds, benzotriazole compounds, carboxybenzotriazole compounds, resins other than polymer A, and solvents. The photosensitive resin layer may contain one type of additive alone, or two or more types of additives.

The photosensitive resin layer preferably contains a thermally crosslinkable compound from the viewpoints of the strength of the obtained cured film and the adhesion of the obtained uncured film. In this specification, the thermally crosslinkable compound having an ethylenically unsaturated group described later is not treated as an ethylenically unsaturated compound but as a thermally crosslinkable compound.
Examples of the thermally crosslinkable compound include methylol compounds and blocked isocyanate compounds. Among these, blocked isocyanate compounds are preferred from the viewpoints of the strength of the resulting cured film and the adhesion of the resulting uncured film.
Since the blocked isocyanate compound reacts with a hydroxy group and a carboxy group, for example, when the polymer A and/or the ethylenically unsaturated compound has at least one of a hydroxy group and a carboxy group, the hydrophilicity of the formed film tends to decrease, and the function tends to be enhanced when the film obtained by curing the photosensitive resin layer is used as a protective film.
The blocked isocyanate compound refers to a compound having a structure in which the isocyanate group of an isocyanate is protected (so-called masked) with a blocking agent.

The dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably from 100°C to 160°C, and more preferably from 130°C to 150°C.
The dissociation temperature of a blocked isocyanate means "the temperature of an endothermic peak accompanying the deprotection reaction of a blocked isocyanate when measured by DSC (Differential Scanning Calorimetry) analysis using a differential scanning calorimeter."
As the differential scanning calorimeter, for example, a differential scanning calorimeter (model: DSC6200) manufactured by Seiko Instruments Inc. can be suitably used. However, the differential scanning calorimeter is not limited to this.

Examples of blocking agents having a dissociation temperature of 100° C. to 160° C. include active methylene compounds [malonic acid diesters (dimethyl malonate, diethyl malonate, di-n-butyl malonate, di-2-ethylhexyl malonate, etc.)] and oxime compounds (compounds having a structure represented by -C(═N-OH)- in the molecule, such as formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, and cyclohexanone oxime).
Among these, the blocking agent having a dissociation temperature of 100° C. to 160° C. preferably contains an oxime compound, for example, from the viewpoint of storage stability.

The blocked isocyanate compound preferably has an isocyanurate structure from the viewpoints of, for example, improving the brittleness of the film and improving the adhesive strength to the transfer target.
A blocked isocyanate compound having an isocyanurate structure can be obtained, for example, by protecting hexamethylene diisocyanate by converting it into an isocyanurate.
Among blocked isocyanate compounds having an isocyanurate structure, a compound having an oxime structure in which an oxime compound is used as a blocking agent is preferred from the viewpoints that the dissociation temperature can be set in a preferred range more easily and development residues can be reduced more easily than a compound not having an oxime structure.

The blocked isocyanate compound may have a polymerizable group.
The polymerizable group is not particularly limited, and any known polymerizable group can be used, with a radically polymerizable group being preferred.
Examples of the polymerizable group include ethylenically unsaturated groups such as a (meth)acryloxy group, a (meth)acrylamide group, and a styryl group, as well as groups having an epoxy group such as a glycidyl group.
Among these, as the polymerizable group, an ethylenically unsaturated group is preferable, a (meth)acryloxy group is more preferable, and an acryloxy group is even more preferable.

As the blocked isocyanate compound, commercially available products can be used.
Examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP, and the like (all manufactured by Showa Denko K.K.), and the blocked Duranate series (e.g., Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) WT32-B75P, and the like, manufactured by Asahi Kasei Chemicals Corporation).
In addition, as the blocked isocyanate compound, a compound having the following structure can also be used.

The thermally crosslinkable compounds may be used alone or in combination of two or more.
When the photosensitive resin layer contains a thermally crosslinkable compound, the content of the thermally crosslinkable compound is preferably 1% by mass to 50% by mass, and more preferably 5% by mass to 30% by mass, based on the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain a radical polymerization inhibitor. Examples of the radical polymerization inhibitor include the thermal polymerization inhibitors described in paragraph 0018 of Japanese Patent No. 4502784. The radical polymerization inhibitor is preferably phenothiazine, phenoxazine, or 4-methoxyphenol. Other examples of radical polymerization inhibitors include naphthylamine, cuprous chloride, nitrosophenylhydroxyamine aluminum salt, and diphenylnitrosamine. In order not to impair the sensitivity of the photosensitive resin layer, it is preferable to use nitrosophenylhydroxyamine aluminum salt as the radical polymerization inhibitor.

The photosensitive resin layer may contain a benzotriazole compound. Examples of the benzotriazole compound include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis(N-2-ethylhexyl)aminomethylene-1,2,3-benzotriazole, bis(N-2-ethylhexyl)aminomethylene-1,2,3-tolyltriazole, and bis(N-2-hydroxyethyl)aminomethylene-1,2,3-benzotriazole.

The photosensitive resin layer may contain a carboxybenzotriazole compound. Examples of the carboxybenzotriazole compound include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, N-(N,N-di-2-ethylhexyl)aminomethylene carboxybenzotriazole, N-(N,N-di-2-hydroxyethyl)aminomethylene carboxybenzotriazole, and N-(N,N-di-2-ethylhexyl)aminoethylene carboxybenzotriazole. Examples of commercially available carboxybenzotriazole compounds include CBT-1 (Johoku Chemical Industry Co., Ltd.).

The total content ratio of the radical polymerization inhibitor, the benzotriazole compound, and the carboxybenzotriazole compound is preferably 0.01% by mass to 3% by mass, and more preferably 0.05% by mass to 1% by mass, relative to the total mass of the photosensitive resin layer. It is preferable to set the total content ratio of the above-mentioned components to 0.01% by mass or more from the viewpoint of imparting storage stability to the photosensitive resin layer. On the other hand, it is preferable to set the total content ratio of the above-mentioned components to 3% by mass or less from the viewpoint of maintaining sensitivity and suppressing discoloration of the dye.

The photosensitive resin layer may contain a sensitizer. The sensitizer is not limited, and known sensitizers can be used. Dyes and pigments can also be used as the sensitizer. Examples of sensitizers include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds (e.g., 1,2,4-triazole), stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

The photosensitive resin layer may contain one or more types of sensitizers.

When the photosensitive resin layer contains a sensitizer, the content of the sensitizer can be selected appropriately depending on the purpose, but from the viewpoints of improving the sensitivity to the light source and improving the curing speed by balancing the polymerization rate and chain transfer, it is preferable that the content of the sensitizer be 0.01% by mass to 5% by mass, and more preferably 0.05% by mass to 1% by mass, relative to the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain at least one selected from the group consisting of a plasticizer and a heterocyclic compound. Examples of the plasticizer and the heterocyclic compound include the compounds described in paragraphs 0097 to 0103 and paragraphs 0111 to 0118 of WO 2018/179640.

The photosensitive resin layer may contain a resin other than polymer A. Examples of resins other than polymer A include acrylic resins, styrene-acrylic copolymers (limited to copolymers having a styrene content of 40% by mass or less), polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamine, and polyalkylene glycols.

The photosensitive resin layer may contain a solvent. When the photosensitive resin layer is formed from a photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive resin layer. The solvent will be described later.

The photosensitive resin layer may contain, as an additive, at least one selected from the group consisting of metal oxide particles, antioxidants, dispersants, acid multipliers, development accelerators, conductive fibers, thermal radical polymerization initiators, thermal acid generators, UV absorbers, thickeners, crosslinkers, organic suspending agents, and inorganic suspending agents. The additives are described, for example, in paragraphs 0165 to 0184 of JP 2014-85643 A. The contents of the above publications are incorporated herein by reference.

(Impurities, etc.)
The photosensitive resin layer may contain a predetermined amount of impurities. Specific examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and ions thereof. Among the above, halide ions, sodium ions, and potassium ions are easily mixed in as impurities, so it is preferable to set the content to the following.

The content of impurities in the photosensitive resin layer is preferably 80 ppm or less, more preferably 10 ppm or less, and even more preferably 2 ppm or less, by mass. The content of impurities in the photosensitive resin layer can be 1 ppb or more, or 0.1 ppm or more, by mass.

Methods for keeping the amount of impurities within the above range include selecting raw materials with low impurity content as the raw materials for the photosensitive resin layer, preventing impurities from being mixed in when the photosensitive resin layer is formed, and cleaning the manufacturing equipment to remove impurities. By using such methods, the amount of impurities can be kept within the above range.

Impurities can be quantified by known methods, such as ICP (Inductively Coupled Plasma) emission spectrometry, atomic absorption spectrometry, or ion chromatography.

The content of benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive resin layer is preferably low. The content of the above compounds in the photosensitive resin layer is preferably 100 ppm or less, more preferably 20 ppm or less, and even more preferably 4 ppm or less, by mass. The content of the above compounds in the photosensitive resin layer can be 10 ppb or more, or 100 ppb or more, by mass. The content of the above compounds can be suppressed in the same manner as the above metal impurities. They can also be quantified by known measurement methods.

In order to improve reliability and lamination properties, the water content in the photosensitive resin layer is preferably 0.01% by mass to 1.0% by mass, and more preferably 0.05% by mass to 0.5% by mass.

(Residual Monomer)
The photosensitive resin layer may contain residual monomers corresponding to the respective structural units of the polymer A described above.
From the viewpoints of patterning property and reliability, the content of the residual monomer is preferably 5,000 ppm by mass or less, more preferably 2,000 ppm by mass or less, and even more preferably 500 ppm by mass or less, based on the total mass of the polymer A. There is no particular lower limit, but it is preferably 1 ppm by mass or more, and more preferably 10 ppm by mass or more.
From the viewpoints of patterning property and reliability, the residual monomer of each structural unit of polymer A is preferably 3,000 mass ppm or less, more preferably 600 mass ppm or less, and even more preferably 100 mass ppm or less, based on the total mass of the photosensitive resin layer. Although there is no particular lower limit, it is preferably 0.1 mass ppm or more, and more preferably 1 mass ppm or more.

The amount of residual monomers in the synthesis of polymer A by the polymer reaction is also preferably within the above range. For example, when polymer A is synthesized by reacting glycidyl acrylate with a carboxylic acid side chain, the content of glycidyl acrylate is preferably within the above range.
The amount of the residual monomer can be measured by a known method such as liquid chromatography or gas chromatography.

(Thickness)
The average thickness of the photosensitive resin layer is generally 0.1 μm to 300 μm. The average thickness of the photosensitive resin layer is preferably 0.5 μm or more, more preferably 1 μm or more, and even more preferably 3 μm or more. When the average thickness of the photosensitive resin layer is in the above range, the adhesion between the photosensitive resin layer and the layer adjacent to the photosensitive resin layer (for example, temporary support) is increased. The average thickness of the photosensitive resin layer is preferably 100 μm or less, more preferably 50 μm or less, even more preferably 15 μm or less, particularly preferably 10 μm or less, and most preferably 6 μm or less. When the average thickness of the photosensitive resin layer is in the above range, the developability of the photosensitive resin layer is improved, and the resolution can be improved. The average thickness of the photosensitive resin layer is measured by a method similar to the method for measuring the average thickness of the temporary support.

(Transmittance)
In the photosensitive resin layer, the transmittance of light having a wavelength of 365 nm is preferably 10% or more, more preferably 30% or more, and particularly preferably 50% or more, from the viewpoint of superior adhesion. There is no upper limit to the transmittance. In the photosensitive resin layer, the transmittance of light having a wavelength of 365 nm is preferably 99.9% or less.

(Formation method)
The method for forming the photosensitive resin layer is not limited as long as it is a method capable of forming a layer containing the above-mentioned components. For example, the method for forming the photosensitive resin layer includes a method of applying a photosensitive resin composition to the surface of a temporary support and then drying the coating of the photosensitive resin composition.

The photosensitive resin composition may be, for example, a composition containing a polymer A, a polymerizable compound B, an optional component, and a solvent. The photosensitive resin composition preferably contains a solvent to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive resin layer.

The solvent is not limited as long as it can dissolve or disperse the polymer A, the polymerizable compound B, and any optional components, and any known solvent can be used. Examples of the solvent include alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (e.g., methanol and ethanol), ketone solvents (e.g., acetone and methyl ethyl ketone), aromatic hydrocarbon solvents (e.g., toluene), aprotic polar solvents (e.g., N,N-dimethylformamide), cyclic ether solvents (e.g., tetrahydrofuran), ester solvents, amide solvents, and lactone solvents.

It is preferable that the photosensitive resin composition contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. It is more preferable that the photosensitive resin composition contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, and at least one selected from the group consisting of a ketone solvent and a cyclic ether solvent. It is particularly preferable that the photosensitive resin composition contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, a ketone solvent, and a cyclic ether solvent.

Examples of alkylene glycol ether solvents include ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, and dipropylene glycol dialkyl ethers.

Examples of alkylene glycol ether acetate solvents include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, and dipropylene glycol monoalkyl ether acetate.

As the solvent, the solvents described in paragraphs 0092 to 0094 of WO 2018/179640 and the solvents described in paragraph 0014 of JP 2018-177889 A may be used. The contents of these are incorporated herein by reference.

The photosensitive resin composition may contain one or more solvents.

The content of the solvent in the photosensitive resin composition is preferably 50 parts by mass to 1,900 parts by mass, and more preferably 100 parts by mass to 900 parts by mass, per 100 parts by mass of the total solids content in the photosensitive resin composition.

The method for preparing the photosensitive resin composition is not limited. For example, a method for preparing the photosensitive resin composition includes a method in which each component is dissolved in a solvent to prepare a solution in advance, and the resulting solutions are mixed in a predetermined ratio to prepare the photosensitive resin composition. The photosensitive resin composition is preferably filtered using a filter with a pore size of 0.2 μm to 30 μm before forming the photosensitive resin layer.

The method for applying the photosensitive resin composition is not limited, and any known method can be used. Examples of the application method include slit coating, spin coating, curtain coating, and inkjet coating.

The photosensitive resin layer may also be formed by applying a photosensitive resin composition onto a cover film described below and drying it.

[Other layers]
The photosensitive transfer material according to the present disclosure may have layers other than the above-mentioned layers (hereinafter referred to as "other layers"). Examples of the other layers include a cover film, a thermoplastic resin, an intermediate layer, and a contrast enhancement layer (also referred to as a refractive index adjustment layer).

(Cover film)
The photosensitive transfer material according to the present disclosure may have a cover film (also called a protective film). The cover film can protect the surface of a layer (e.g., a photosensitive resin layer) that comes into contact with the cover film.

In one embodiment, the photosensitive transfer material preferably includes a temporary support, a photosensitive resin layer, and a cover film in this order. In the above photosensitive transfer material, the photosensitive resin layer may be laminated directly on the temporary support or via an optional layer. In the above photosensitive transfer material, the cover film may be laminated directly on the photosensitive resin layer or via an optional layer. Examples of the optional layers in the above photosensitive transfer material include other layers described below.

In one embodiment, it is preferable that the photosensitive transfer material has a cover film in contact with the side of the photosensitive resin layer opposite the side facing the temporary support.

Examples of cover films include resin films and paper. From the standpoint of strength and flexibility, it is preferable that the cover film be a resin film.

Examples of resin films include polyethylene films, polypropylene films, polyethylene terephthalate films, cellulose triacetate films, polystyrene films, and polycarbonate films. The resin film is preferably a polyethylene film, a polypropylene film, or a polyethylene terephthalate film.

The thickness of the cover film is not limited. The average thickness of the cover film is preferably 5 μm to 100 μm, more preferably 10 μm to 50 μm, and particularly preferably 10 μm to 20 μm. The average thickness of the cover film is measured by a method similar to the method for measuring the average thickness of the temporary support.

The arithmetic mean roughness Ra of the surface of the cover film on which the photosensitive resin layer is disposed (i.e., the surface of the cover film facing the photosensitive resin layer) is preferably 0.3 μm or less, more preferably 0.1 μm or less, and particularly preferably 0.05 μm or less, from the viewpoint of superior resolution. When the arithmetic mean roughness of the surface of the cover film on which the photosensitive resin layer is disposed is within the above range, the uniformity of the thickness of the photosensitive resin layer and the resin pattern formed is improved. There is no lower limit for the arithmetic mean roughness Ra. The arithmetic mean roughness Ra of the surface of the cover film on which the photosensitive resin layer is disposed is preferably 0.001 μm or more. The arithmetic mean roughness Ra of the surface of the cover film on which the photosensitive resin layer is disposed is measured by a method similar to the method for measuring the arithmetic mean roughness Ra described in the above section on "temporary support".

(Thermoplastic resin layer)
The photosensitive transfer material according to the present disclosure may have a thermoplastic resin layer. In an embodiment, the photosensitive transfer material preferably has a thermoplastic resin layer between the temporary support and the photosensitive resin layer. By having a thermoplastic resin layer between the temporary support and the photosensitive resin layer, the photosensitive transfer material improves the conformability to the substrate in the process of bonding to the substrate, and the inclusion of air bubbles between the substrate and the photosensitive transfer material is suppressed, resulting in improved adhesion between the layers.

- Alkali-soluble resin -
The thermoplastic resin layer preferably contains an alkali-soluble resin as the thermoplastic resin.

Examples of alkali-soluble resins include acrylic resins, polystyrene resins, styrene-acrylic copolymers, polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamine, and polyalkylene glycols.

From the viewpoints of developability and adhesion to layers adjacent to the thermoplastic resin layer, the alkali-soluble resin is preferably an acrylic resin. Here, "acrylic resin" means a resin having at least one selected from the group consisting of structural units derived from (meth)acrylic acid, structural units derived from (meth)acrylic acid esters, and structural units derived from (meth)acrylic acid amides.

In the acrylic resin, the total content ratio of the structural units derived from (meth)acrylic acid, the structural units derived from (meth)acrylic acid esters, and the structural units derived from (meth)acrylic acid amides is preferably 50% by mass or more based on the total mass of the acrylic resin. In the acrylic resin, the total content ratio of the structural units derived from (meth)acrylic acid and the structural units derived from (meth)acrylic acid esters is preferably 30% by mass to 100% by mass, and more preferably 50% by mass to 100% by mass, based on the total mass of the acrylic resin.

In addition, the alkali-soluble resin is preferably a polymer having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group, and the carboxy group is preferred.

From the viewpoint of developability, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH/g or more, and more preferably a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more. There is no upper limit to the acid value. The acid value of the alkali-soluble resin is preferably 200 mgKOH/g or less, and more preferably 150 mgKOH/g or less.

The carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more is not limited, and can be appropriately selected from known resins. Examples of the carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more include the carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more among the polymers described in paragraph 0025 of JP-A-2011-95716, the carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more among the polymers described in paragraphs 0033 to 0052 of JP-A-2010-237589, and the carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more among the binder polymers described in paragraphs 0053 to 0068 of JP-A-2016-224162.

The content of structural units having a carboxy group in the carboxy group-containing acrylic resin is preferably 5% by mass to 50% by mass, more preferably 10% by mass to 40% by mass, and particularly preferably 12% by mass to 30% by mass, relative to the total mass of the carboxy group-containing acrylic resin.

From the standpoint of developability and adhesion to layers adjacent to the thermoplastic resin layer, it is particularly preferable that the alkali-soluble resin is an acrylic resin having structural units derived from (meth)acrylic acid.

The alkali-soluble resin may have a reactive group. The reactive group may be, for example, a group capable of addition polymerization. Examples of the reactive group include an ethylenically unsaturated group, a polycondensable group (e.g., a hydroxy group and a carboxy group), and a polyaddition reactive group (e.g., an epoxy group and a (blocked) isocyanate group).

The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and particularly preferably 20,000 to 50,000.

The thermoplastic resin layer may contain one or more types of alkali-soluble resin.

From the viewpoints of developability and adhesion to layers adjacent to the thermoplastic resin layer, the content of the alkali-soluble resin is preferably 10% by mass to 99% by mass, more preferably 20% by mass to 90% by mass, even more preferably 40% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass, relative to the total mass of the thermoplastic resin layer.

- Pigments -
The thermoplastic resin layer preferably contains a dye (hereinafter, sometimes referred to as "dye B") that has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm during color development and whose maximum absorption wavelength changes with an acid, a base, or a radical. Preferred aspects of dye B are the same as those of dye N described above, except for the points described below.

From the viewpoints of visibility of exposed areas, visibility of unexposed areas, and resolution, it is preferable that dye B is a dye whose maximum absorption wavelength changes in response to an acid or a radical, and it is more preferable that dye B is a dye whose maximum absorption wavelength changes in response to an acid.

From the viewpoints of visibility of exposed areas, visibility of unexposed areas, and resolution, it is preferable that the thermoplastic layer contains, as dye B, a dye whose maximum absorption wavelength changes in response to acid, and a compound that generates acid in response to light, as described below.

The thermoplastic resin layer may contain one or more types of dye B.

From the viewpoint of visibility of the exposed areas and visibility of the non-exposed areas, the content of dye B is preferably 0.2 mass% or more, more preferably 0.2 mass% to 6 mass%, even more preferably 0.2 mass% to 5 mass%, and particularly preferably 0.25 mass% to 3.0 mass%, relative to the total mass of the thermoplastic resin layer.

Here, the content ratio of dye B means the content ratio of dye when all of the dye B contained in the thermoplastic resin layer is in a colored state. Hereinafter, a method for quantifying the content ratio of dye B will be described using a dye that develops color by radicals as an example. Two solutions are prepared by dissolving dye (0.001 g) and dye (0.01 g) in methyl ethyl ketone (100 mL). After adding IRGACURE OXE-01 (BASF) as a photoradical polymerization initiator to each of the obtained solutions, radicals are generated by irradiating light of 365 nm to cause all of the dyes to develop color. Next, the absorbance of each solution with a liquid temperature of 25°C is measured using a spectrophotometer (UV3100, Shimadzu Corporation) in an air atmosphere, and a calibration curve is created. Next, the absorbance of the solution in which all of the dyes have developed color is measured in the same manner as above, except that the thermoplastic resin layer (0.1 g) is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the thermoplastic resin layer, the amount of the dye contained in the thermoplastic resin layer is calculated based on a calibration curve.

- Compounds that generate acids, bases, or radicals when exposed to light -
The thermoplastic resin layer may contain a compound (hereinafter, sometimes referred to as "compound C") that generates an acid, a base, or a radical when exposed to light. Compound C is preferably a compound that generates an acid, a base, or a radical when exposed to actinic light (e.g., ultraviolet light and visible light). Examples of compound C include known photoacid generators, photobase generators, and photoradical polymerization initiators (photoradical generators). Compound C is preferably a photoacid generator.

[Photoacid generator]
From the viewpoint of resolution, the thermoplastic resin layer preferably contains a photoacid generator. Examples of the photoacid generator include the photocationic polymerization initiators that may be contained in the photosensitive resin layer described above, and the preferred aspects are the same as those described below.

From the viewpoints of sensitivity and resolution, it is preferable that the photoacid generator contains at least one selected from the group consisting of an onium salt compound and an oxime sulfonate compound, and from the viewpoints of sensitivity, resolution, and adhesion, it is more preferable that the photoacid generator contains an oxime sulfonate compound.

It is also preferable that the photoacid generator is a photoacid generator having the following structure:

[Photobase Generator]
The thermoplastic resin layer may contain a photobase generator. Examples of the photobase generator include 2-nitrobenzyl cyclohexyl carbamate, triphenylmethanol, O-carbamoyl hydroxylamide, O-carbamoyl oxime, [[(2,6-dinitrobenzyl)oxy]carbonyl]cyclohexylamine, bis[[(2-nitrobenzyl)oxy]carbonyl]hexane 1,6-diamine, 4-(methylthiobenzoyl)-1-methyl-1-morpholinoethane, (4-morpholinobenzoyl)-1-benzyl-1-diamine, and the like. methylaminopropane, N-(2-nitrobenzyloxycarbonyl)pyrrolidine, hexaamminecobalt(III) tris(triphenylmethylborate), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl-4-(2,4-dinitrophenyl)-1,4-dihydropyridine.

[Photoradical polymerization initiator]
The thermoplastic resin layer may contain a photoradical polymerization initiator. Examples of the photoradical polymerization initiator include the photoradical polymerization initiators that may be contained in the photosensitive resin layer described above, and preferred embodiments are also the same.

The thermoplastic resin layer may contain one or more types of compound C.

From the viewpoints of visibility of the exposed areas, visibility of the non-exposed areas, and resolution, the content of compound C is preferably 0.1% by mass to 10% by mass, and more preferably 0.5% by mass to 5% by mass, relative to the total mass of the thermoplastic resin layer.

- Plasticizer -
The thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to layers adjacent to the thermoplastic resin layer, and developability.

The molecular weight of the plasticizer (for the molecular weight of an oligomer or polymer, this refers to the weight average molecular weight (Mw); the same applies hereinafter in this paragraph) is preferably smaller than the molecular weight of the alkali-soluble resin. The molecular weight of the plasticizer is preferably 200 to 2,000.

The plasticizer is not limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity. From the viewpoint of imparting plasticity, the plasticizer is preferably a compound having an alkyleneoxy group in the molecule, and more preferably a polyalkylene glycol compound. The alkyleneoxy group contained in the plasticizer preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

From the viewpoints of resolution and storage stability, it is preferable that the plasticizer contains a (meth)acrylate compound. From the viewpoints of compatibility, resolution, and adhesion to a layer adjacent to the thermoplastic resin layer, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth)acrylate compound.

Examples of (meth)acrylate compounds used as plasticizers include the (meth)acrylate compounds described in the "Polymerizable Compound B" section above. In the photosensitive transfer material, when the thermoplastic resin layer and the photosensitive resin layer are disposed in direct contact with each other, it is preferable that the thermoplastic resin layer and the photosensitive resin layer each contain the same (meth)acrylate compound. This is because the thermoplastic resin layer and the photosensitive resin layer each contain the same (meth)acrylate compound, which suppresses component diffusion between the layers and improves storage stability.

When the thermoplastic resin layer contains a (meth)acrylate compound as a plasticizer, it is preferable that the (meth)acrylate compound does not polymerize even in the exposed areas after exposure, from the viewpoint of adhesion with layers adjacent to the thermoplastic resin layer.

In one embodiment, the (meth)acrylate compound used as a plasticizer is preferably a (meth)acrylate compound having two or more (meth)acryloyl groups in one molecule, from the standpoints of resolution, adhesion to layers adjacent to the thermoplastic resin layer, and developability.

In one embodiment, the (meth)acrylate compound used as a plasticizer is preferably a (meth)acrylate compound having an acid group or a urethane (meth)acrylate compound.

The thermoplastic resin layer may contain one or more types of plasticizers.

From the viewpoints of resolution, adhesion to layers adjacent to the thermoplastic resin layer, and developability, the content of the plasticizer is preferably 1% by mass to 70% by mass, more preferably 10% by mass to 60% by mass, and particularly preferably 20% by mass to 50% by mass, relative to the total mass of the thermoplastic resin layer.

-Surfactants-
From the viewpoint of thickness uniformity, the thermoplastic resin layer preferably contains a surfactant. Examples of the surfactant include the surfactants that may be contained in the photosensitive resin layer described above, and the preferred embodiments are the same.

The thermoplastic resin layer may contain one or more types of surfactants.

The surfactant content is preferably 0.001% by mass to 10% by mass, and more preferably 0.01% by mass to 3% by mass, relative to the total mass of the thermoplastic resin layer.

-Sensitizer-
The thermoplastic resin layer may contain a sensitizer. Examples of the sensitizer include the sensitizers that may be contained in the photosensitive resin layer described above.

The thermoplastic resin layer may contain one or more types of sensitizers.

From the viewpoints of improving sensitivity to the light source, visibility of the exposed areas, and visibility of the non-exposed areas, the content of the sensitizer is preferably 0.01% by mass to 5% by mass, and more preferably 0.05% by mass to 1% by mass, relative to the total mass of the thermoplastic resin layer.

-Additives-
The thermoplastic resin layer may contain known additives, if necessary, in addition to the above components.

The thermoplastic resin layer is described in paragraphs 0189 to 0193 of JP 2014-85643 A. The contents of the above publication are incorporated herein by reference.

-Thickness-
The thickness of the thermoplastic resin layer is not limited. The average thickness of the thermoplastic resin layer is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of adhesion with the layer adjacent to the thermoplastic resin layer. The upper limit of the average thickness of the thermoplastic resin layer is not limited. The average thickness of the thermoplastic resin layer is preferably 20 μm or less, more preferably 10 μm or less, and particularly preferably 5 μm or less, from the viewpoint of developability and resolution. The average thickness of the thermoplastic resin layer is measured by a method similar to the method for measuring the average thickness of the temporary support.

- Formation method -
The method for forming the thermoplastic resin layer is not limited as long as it is a method capable of forming a layer containing the above-mentioned components. For example, the method for forming the thermoplastic resin layer includes a method of applying a thermoplastic resin composition to the surface of a temporary support and drying the coating of the thermoplastic resin composition.

Examples of the thermoplastic resin composition include compositions containing the above-mentioned components. The thermoplastic resin composition preferably contains a solvent to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

The solvent contained in the thermoplastic resin composition is not limited as long as it can dissolve or disperse the components contained in the thermoplastic resin layer. Examples of the solvent include the solvents that may be contained in the photosensitive resin composition described above, and the preferred embodiments are the same.

The thermoplastic resin composition may contain one or more solvents.

The content of the solvent in the thermoplastic resin composition is preferably 50 parts by mass to 1,900 parts by mass, and more preferably 100 parts by mass to 900 parts by mass, per 100 parts by mass of the total solids in the thermoplastic resin composition.

The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out in accordance with the above-mentioned method for preparing the photosensitive resin composition and the method for forming the photosensitive resin layer. For example, a solution in which each component contained in the thermoplastic resin layer is dissolved in a solvent is prepared in advance, and the obtained solutions are mixed in a predetermined ratio to prepare a thermoplastic resin composition. The obtained thermoplastic resin composition is then applied to the surface of a temporary support, and the coating of the thermoplastic resin composition is dried to form a thermoplastic resin layer. In addition, a photosensitive resin layer may be formed on a cover film described later, and then a thermoplastic resin layer may be formed on the surface of the photosensitive resin layer.

(Middle class)
The photosensitive transfer material according to the present disclosure preferably has an intermediate layer between the thermoplastic resin layer and the photosensitive resin layer, which can suppress mixing of components when forming multiple layers and during storage.

From the viewpoints of developability and suppressing mixing of components when applying multiple layers and during storage after application, the intermediate layer is preferably a water-soluble layer. In this disclosure, "water-soluble" means that the solubility in 100 g of water at pH 7.0 and a liquid temperature of 22°C is 0.1 g or more.

An example of an intermediate layer is an oxygen barrier layer having an oxygen barrier function, which is described as a "separation layer" in JP-A-5-72724. When the intermediate layer is an oxygen barrier layer, the sensitivity during exposure is improved, and the time load of the exposure machine is reduced, resulting in improved productivity. The oxygen barrier layer used as the intermediate layer may be appropriately selected from known layers. It is preferable that the oxygen barrier layer used as the intermediate layer is an oxygen barrier layer that exhibits low oxygen permeability and disperses or dissolves in water or an alkaline aqueous solution (a 1% by weight aqueous solution of sodium carbonate at 22°C).

The intermediate layer preferably contains a resin. Examples of the resin contained in the intermediate layer include polyvinyl alcohol resins, polyvinylpyrrolidone resins, cellulose resins, acrylamide resins, polyethylene oxide resins, gelatin, vinyl ether resins, polyamide resins, and copolymers thereof. The resin contained in the intermediate layer is preferably a water-soluble resin.

From the viewpoint of suppressing mixing of components between multiple layers, it is preferable that the resin contained in the intermediate layer is a resin different from both the polymer A contained in the photosensitive resin layer and the thermoplastic resin (alkali-soluble resin) contained in the thermoplastic resin layer.

From the viewpoints of oxygen barrier properties and suppressing mixing of components when multiple layers are applied and during storage after application, the intermediate layer preferably contains polyvinyl alcohol, and more preferably contains polyvinyl alcohol and polyvinylpyrrolidone.

The intermediate layer may contain one or more types of resin.

From the viewpoints of oxygen barrier properties and suppressing mixing of components when multiple layers are applied and during storage after application, the resin content in the intermediate layer is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, even more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass, relative to the total mass of the intermediate layer.

The intermediate layer may also contain additives as necessary. Examples of additives include surfactants.

The thickness of the intermediate layer is not limited. The average thickness of the intermediate layer is preferably 0.1 μm to 5 μm, and more preferably 0.5 μm to 3 μm. By having the thickness of the intermediate layer within the above range, the oxygen barrier properties are not reduced, mixing of components can be suppressed when forming multiple layers and during storage, and an increase in the time required to remove the intermediate layer during development can be suppressed. The average thickness of the intermediate layer is measured by a method similar to the method for measuring the average thickness of the temporary support.

The method for forming the intermediate layer is not limited as long as it is a method capable of forming a layer containing the above-mentioned components. For example, the method for forming the intermediate layer includes a method in which an intermediate layer composition is applied to the surface of a thermoplastic resin layer or a photosensitive resin layer, and then the coating of the intermediate layer composition is dried.

The intermediate layer composition may be, for example, a composition containing a resin and any additive. The intermediate layer composition preferably contains a solvent to adjust the viscosity of the intermediate layer composition and facilitate the formation of the intermediate layer. The solvent is not limited as long as it can dissolve or disperse the resin. The solvent is preferably at least one selected from the group consisting of water and water-miscible organic solvents, and more preferably water or a mixed solvent of water and a water-miscible organic solvent.

Examples of water-miscible organic solvents include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin. The water-miscible organic solvent is preferably an alcohol having 1 to 3 carbon atoms, more preferably methanol or ethanol.

(Contrast Enhancement Layer)
The photosensitive transfer material according to the present disclosure may have a contrast enhancement layer. The contrast enhancement layer is described, for example, in paragraph 0134 of International Publication No. 2018/179640 and paragraphs 0194 to 0196 of JP-A-2014-85643. The contents of these publications are incorporated herein by reference.

[Relationship between temporary support, photosensitive resin layer and cover film]
In the photosensitive transfer material according to the present disclosure, it is preferred that the breaking elongation at 120°C of the cured film obtained by curing the photosensitive resin layer is 15% or more, the arithmetic mean roughness Ra of the surface of the temporary support facing the photosensitive resin layer is 50 nm or less, and the arithmetic mean roughness Ra of the surface of the cover film facing the photosensitive resin layer is 150 nm or less.

In addition, the photosensitive transfer material according to the present disclosure preferably satisfies the following formula (R1).
X×Y<1,500: Formula (R1)
In the above formula (R1), X represents the breaking elongation value (%) of the cured film obtained by curing the photosensitive resin layer at 120°C, and Y represents the arithmetic mean roughness Ra value (nm) of the surface of the temporary support on the photosensitive resin layer side.
It is more preferable that X×Y is 750 or less.

It is preferable that the breaking elongation at 120°C of the cured film obtained by curing the photosensitive resin layer is at least two times larger than the breaking elongation at 23°C.
The breaking elongation is measured by a tensile test using a cured film obtained by exposing a 20 μm-thick photosensitive resin layer to 120 mJ/ ^cm2 using an ultra-high pressure mercury lamp and curing it, and then further exposing it to 400 mJ/ ^cm2 using a high pressure mercury lamp and heating it at 145° C. for 30 minutes.

In addition, the photosensitive transfer material according to the present disclosure preferably satisfies the following formula (R2).
Y≦Z: Formula (R2)
Here, in the above formula (R2), Y represents the value of the arithmetic mean roughness Ra (nm) of the surface of the temporary support facing the photosensitive resin layer, and Z represents the value of the arithmetic mean roughness Ra (nm) of the surface of the cover film facing the photosensitive resin layer.

<<Average thickness>>
The average thickness of the photosensitive transfer material is preferably 5 μm to 55 μm, more preferably 10 μm to 50 μm, and particularly preferably 20 μm to 40 μm. The average thickness of the photosensitive transfer material is measured by a method similar to the method for measuring the average thickness of the temporary support.

<<Shape>>
The shape of the photosensitive transfer material according to the present disclosure is not limited. From the viewpoint of versatility and transportability, the shape of the photosensitive transfer material according to the present disclosure is preferably a roll shape. The photosensitive transfer material can be rolled by winding the photosensitive transfer material.

<<Production method>>
In the method for producing a photosensitive transfer material according to the present disclosure, for example, the method for forming each layer described in the above section "Constituent Elements" can be used. A preferred example of the method for producing a photosensitive transfer material will be described below with reference to FIG. 1. However, the method for producing a photosensitive transfer material is not limited to the method described below.

Figure 1 is a schematic side view showing an example of the configuration of a photosensitive transfer material. A method for producing the photosensitive transfer material 100 shown in Figure 1 includes, for example, a method including a step of forming a photosensitive resin layer 12 by applying a photosensitive resin composition onto a temporary support 10, and a step of placing a cover film 14 on the photosensitive resin layer 12. In the above method, the photosensitive resin composition applied onto the temporary support 10 may be dried as necessary. The drying method is not limited, and any known drying method can be used.

One method for placing the cover film 14 on the photosensitive resin layer 12 is, for example, to press the cover film 14 onto the photosensitive resin layer 12.

By going through the above steps, a photosensitive transfer material 100 having a temporary support 10, a photosensitive resin layer 12, and a cover film 14 can be manufactured. The manufactured photosensitive transfer material 100 may be wound into a roll. The roll-shaped photosensitive transfer material 100 can be used, for example, in a process of laminating the material to a substrate by a roll-to-roll method.

<<Applications>>
The photosensitive transfer material according to the present disclosure can be used, for example, for forming a resin pattern and for forming a circuit wiring. However, the use of the photosensitive transfer material according to the present disclosure is not limited to the above-mentioned uses. The photosensitive transfer material according to the present disclosure can be suitably used for various uses requiring precise microfabrication by photolithography. After patterning the photosensitive resin layer, etching may be performed using the photosensitive resin layer as a coating, or electroforming mainly using electroplating may be performed. The photosensitive transfer material according to the present disclosure can be suitably used for various wiring formation applications of semiconductor packages, printed circuit boards, and sensor boards, touch panels, electromagnetic wave shielding materials, conductive films such as film heaters, liquid crystal sealants, and the formation of structures in the fields of micromachines and microelectronics.

The photosensitive transfer material according to the present disclosure may be used, for example, as a photosensitive transfer material for a wiring protective film. Examples of the layer structure of the photosensitive transfer material preferably used as the photosensitive transfer material for a wiring protective film include the following (1) and (2).
(1) Temporary support/photosensitive resin layer/refractive index adjusting layer/cover film (2) Temporary support/photosensitive resin layer/cover film

The components of the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film are described below. However, the components of the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film are not limited to the components shown below.

[Temporary Support]
Examples of the temporary support include the temporary supports described above in the section "Constituent Elements". Preferred aspects of the temporary support are the same as those described above in the section "Constituent Elements".

[Cover film]
The temporary support may be, for example, the cover film described above in the section "Constituent Elements." Preferred aspects of the cover film are the same as those described above in the section "Constituent Elements."

[Photosensitive resin layer]
(Alkali-soluble resin)
The photosensitive resin layer preferably contains an alkali-soluble resin.
Examples of the alkali-soluble resin include (meth)acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy acrylate resin obtained by reacting an epoxy resin with (meth)acrylic acid, and acid-modified epoxy acrylate resin obtained by reacting an epoxy acrylate resin with an acid anhydride.

One preferred embodiment of the alkali-soluble resin is a (meth)acrylic resin, which has excellent alkali developability and film formability.
In this specification, the (meth)acrylic resin refers to a resin having a structural unit derived from a (meth)acrylic compound. The content of the structural unit derived from the (meth)acrylic compound is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more, based on the total structural units of the (meth)acrylic resin.
The (meth)acrylic resin may be composed only of structural units derived from a (meth)acrylic compound, or may have structural units derived from a polymerizable monomer other than a (meth)acrylic compound. That is, the upper limit of the content of structural units derived from a (meth)acrylic compound is 100% by mass or less based on the total structural units of the (meth)acrylic resin.

Examples of the (meth)acrylic compound include (meth)acrylic acid, (meth)acrylic acid esters, (meth)acrylamide, and (meth)acrylonitrile.
Examples of the (meth)acrylic acid ester include (meth)acrylic acid alkyl esters, (meth)acrylic acid tetrahydrofurfuryl ester, (meth)acrylic acid dimethylaminoethyl ester, (meth)acrylic acid diethylaminoethyl ester, (meth)acrylic acid glycidyl ester, (meth)acrylic acid benzyl ester, 2,2,2-trifluoroethyl (meth)acrylate, and 2,2,3,3-tetrafluoropropyl (meth)acrylate, and (meth)acrylic acid alkyl esters are preferred.
Examples of (meth)acrylamides include acrylamides such as diacetoneacrylamide.

Examples of the (meth)acrylic acid alkyl ester include (meth)acrylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, and dodecyl (meth)acrylate.
As the (meth)acrylic acid ester, a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms is preferred, and methyl (meth)acrylate or ethyl (meth)acrylate is more preferred.

The (meth)acrylic resin may have a structural unit other than the structural unit derived from the (meth)acrylic compound.
The polymerizable monomer that forms the structural unit is not particularly limited as long as it is a compound other than a (meth)acrylic compound that is copolymerizable with a (meth)acrylic compound, and examples thereof include styrene compounds that may have a substituent at the α-position or aromatic ring, such as styrene, vinyl toluene, and α-methylstyrene, vinyl alcohol esters such as acrylonitrile and vinyl-n-butyl ether, maleic acid monoesters such as maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, and monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, and crotonic acid.
These polymerizable monomers may be used alone or in combination of two or more.

In order to improve the alkali developability, the (meth)acrylic resin preferably has a structural unit having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group.
Among these, the (meth)acrylic resin more preferably has a structural unit having a carboxy group, and even more preferably has a structural unit derived from the above-mentioned (meth)acrylic acid.

The content of structural units having an acid group in the (meth)acrylic resin (preferably structural units derived from (meth)acrylic acid) is preferably 10% by mass or more based on the total mass of the (meth)acrylic resin in terms of excellent developability. In addition, the upper limit is not particularly limited, but in terms of excellent alkali resistance, it is preferably 50% by mass or less, and more preferably 40% by mass or less.

Moreover, the (meth)acrylic resin more preferably has a structural unit derived from the above-mentioned alkyl (meth)acrylate ester.
The content of the structural units derived from the (meth)acrylic acid alkyl ester in the (meth)acrylic resin is preferably 50% by mass to 90% by mass, more preferably 60% by mass to 90% by mass, and even more preferably 65% by mass to 90% by mass, based on all structural units of the (meth)acrylic resin.

As the (meth)acrylic resin, a resin having both a structural unit derived from (meth)acrylic acid and a structural unit derived from an alkyl (meth)acrylate is preferred, and a resin composed only of a structural unit derived from (meth)acrylic acid and a structural unit derived from an alkyl (meth)acrylate is more preferred.
Furthermore, as the (meth)acrylic resin, an acrylic resin having a structural unit derived from methacrylic acid, a structural unit derived from methyl methacrylate, and a structural unit derived from ethyl acrylate is also preferred.

From the viewpoint of resolution, the (meth)acrylic resin preferably has at least one selected from the group consisting of structural units derived from methacrylic acid and structural units derived from an alkyl methacrylate ester, and preferably has both structural units derived from methacrylic acid and structural units derived from an alkyl methacrylate ester.
From the viewpoint of resolution, the total content of the structural units derived from methacrylic acid and the structural units derived from methacrylic acid alkyl ester in the (meth)acrylic resin is preferably 40% by mass or more, more preferably 60% by mass or more, based on the total structural units of the (meth)acrylic resin. The upper limit is not particularly limited, and may be 100% by mass or less, and is preferably 80% by mass or less.

From the viewpoint of resolution, it is also preferable that the (meth)acrylic resin has at least one selected from the group consisting of structural units derived from methacrylic acid and structural units derived from an alkyl methacrylate ester, and at least one selected from the group consisting of structural units derived from acrylic acid and structural units derived from an alkyl acrylate ester.
From the viewpoint of resolution, the total content of the structural units derived from methacrylic acid and the structural units derived from an alkyl methacrylate ester is preferably 60/40 to 80/20 in mass ratio relative to the total content of the structural units derived from acrylic acid and the structural units derived from an alkyl acrylate ester.

The (meth)acrylic resin preferably has an ester group at the end, in order to provide excellent developability of the photosensitive resin layer after transfer.
The terminal portion of the (meth)acrylic resin is composed of a portion derived from the polymerization initiator used in the synthesis. The (meth)acrylic resin having an ester group at the terminal can be synthesized by using a polymerization initiator that generates a radical having an ester group.

Moreover, from the viewpoint of developability, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH/g or more.
In addition, the alkali-soluble resin is more preferably a resin having a carboxy group with an acid value of 60 mgKOH/g or more (so-called carboxy group-containing resin), and even more preferably a (meth)acrylic resin having a carboxy group with an acid value of 60 mgKOH/g or more (so-called carboxy group-containing (meth)acrylic resin), from the viewpoint of, for example, being thermally crosslinked with the crosslinking component by heating and easily forming a strong film.
When the alkali-soluble resin is a resin having a carboxy group, the three-dimensional crosslinking density can be increased by, for example, adding a thermally crosslinkable compound such as a blocked isocyanate compound to thermally crosslink the resin. In addition, when the carboxy group of the resin having a carboxy group is dehydrated and hydrophobized, the humidity and heat resistance can be improved.

The carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more is not particularly limited as long as it satisfies the above-mentioned acid value condition, and can be appropriately selected from known (meth)acrylic resins.
For example, among the polymers described in paragraph 0025 of JP-A-2011-095716, carboxyl group-containing acrylic resins having an acid value of 60 mgKOH/g or more, and among the polymers described in paragraphs 0033 to 0052 of JP-A-2010-237589, carboxyl group-containing acrylic resins having an acid value of 60 mgKOH/g or more can be preferably used.

Another preferred embodiment of the alkali-soluble resin is a styrene-acrylic copolymer. In this specification, the term "styrene-acrylic copolymer" refers to a resin having a structural unit derived from a styrene compound and a structural unit derived from a (meth)acrylic compound, and the total content of the structural unit derived from the styrene compound and the structural unit derived from the (meth)acrylic compound is preferably 30% by mass or more, more preferably 50% by mass or more, based on the total structural units of the copolymer.
The content of the structural units derived from the styrene compound is preferably 1% by mass or more, more preferably 5% by mass or more, and even more preferably 5 to 80% by mass, based on all the structural units of the copolymer.
The content of the structural units derived from the (meth)acrylic compound is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass to 95% by mass, based on all structural units of the copolymer.

From the viewpoint of moisture permeability and strength of the resulting cured film, the alkali-soluble resin preferably has an aromatic ring structure, and more preferably has a constituent unit having an aromatic ring structure.
Examples of monomers that form structural units having an aromatic ring structure include styrene compounds such as styrene, tert-butoxystyrene, methylstyrene, and α-methylstyrene, as well as benzyl (meth)acrylate.
Of these, styrene compounds are preferred, and styrene is more preferred.
From the viewpoint of moisture permeability and strength of the resulting cured film, the alkali-soluble resin more preferably has a structural unit represented by the following formula (S) (a structural unit derived from styrene).

When the alkali-soluble resin has a constituent unit having an aromatic ring structure, the content of the constituent unit having an aromatic ring structure is, from the viewpoint of the moisture permeability and strength of the obtained cured film, preferably 5% by mass to 90% by mass, more preferably 10% by mass to 70% by mass, and even more preferably 20% by mass to 60% by mass, relative to all constituent units of the alkali-soluble resin.
Furthermore, the content of the structural unit having an aromatic ring structure in the alkali-soluble resin is, from the viewpoint of the moisture permeability and strength of the resulting cured film, preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 60 mol %, based on all structural units of the alkali-soluble resin.
Furthermore, the content of the structural unit represented by the above formula (S) in the alkali-soluble resin is, from the viewpoint of the moisture permeability and strength of the obtained cured film, preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, even more preferably 20 mol % to 60 mol %, and particularly preferably 20 mol % to 50 mol %, based on all structural units of the alkali-soluble resin.
In this specification, when the content of the "structural unit" is specified by a molar ratio, the "structural unit" is synonymous with the "monomer unit". In addition, in this specification, the "monomer unit" may be modified after polymerization by a polymer reaction or the like. The same applies hereinafter.

From the viewpoints of suppressing development residues, strength of the resulting cured film, and adhesion of the resulting uncured film, it is preferable that the alkali-soluble resin has an aliphatic hydrocarbon ring structure. In other words, it is preferable that the alkali-soluble resin has a structural unit having an aliphatic hydrocarbon ring structure. In particular, it is more preferable that the alkali-soluble resin has a ring structure in which two or more aliphatic hydrocarbon rings are condensed.

Examples of the ring that constitutes the aliphatic hydrocarbon ring structure in the structural unit having an aliphatic hydrocarbon ring structure include a tricyclodecane ring, a cyclohexane ring, a cyclopentane ring, a norbornane ring, and an isoborone ring.
Among these, from the viewpoints of suppression of development residues, strength of the resulting cured film, and adhesion of the resulting uncured film, a ring in which two or more aliphatic hydrocarbon rings are condensed is preferred, and a tetrahydrodicyclopentadiene ring (tricyclo[5.2.1.0 ^2,6 ]decane ring) is more preferred.
Examples of monomers that form a structural unit having an aliphatic hydrocarbon ring structure include dicyclopentanyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate.
[0113] Moreover, from the viewpoints of suppressing development residues, the strength of the resulting cured film, and the adhesion of the resulting uncured film, it is more preferable that the alkali-soluble resin has a constitutional unit represented by the following formula (Cy), and it is even more preferable that the alkali-soluble resin has a constitutional unit represented by the above formula (S) and a constitutional unit represented by the following formula (Cy).

In formula (Cy), R 1 ^M represents a hydrogen atom or a methyl group, and R 1 ^Cy represents a monovalent group having an aliphatic hydrocarbon ring structure.

R 3 ^M in formula (Cy) is preferably a methyl group.
From the viewpoints of suppression of development residues, strength of the resulting cured film, and adhesion of the resulting uncured film, R ^Cy in formula (Cy) is preferably a monovalent group having an aliphatic hydrocarbon ring structure having 5 to 20 carbon atoms, more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 6 to 16 carbon atoms, and even more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 8 to 14 carbon atoms.
The aliphatic hydrocarbon ring structure in R ^Cy of formula (Cy) may be a monocyclic structure or a polycyclic structure.
In addition, from the viewpoints of suppression of development residues, strength of the resulting cured film, and adhesion of the resulting uncured film, the aliphatic hydrocarbon ring structure in R ^Cy of formula (Cy) is preferably a cyclopentane ring structure, a cyclohexane ring structure, a tetrahydrodicyclopentadiene ring structure, a norbornane ring structure, or an isoborone ring structure, more preferably a cyclohexane ring structure or a tetrahydrodicyclopentadiene ring structure, and even more preferably a tetrahydrodicyclopentadiene ring structure.
Furthermore, from the viewpoints of suppressing development residues, the strength of the resulting cured film, and the adhesion of the resulting uncured film, the aliphatic hydrocarbon ring structure in R ^Cy of formula (Cy) is preferably a ring structure in which two or more aliphatic hydrocarbon rings are condensed, and more preferably a ring in which two to four aliphatic hydrocarbon rings are condensed.
Furthermore, from the viewpoints of suppression of development residues, strength of the resulting cured film, and adhesion of the resulting uncured film, R ^Cy in formula (Cy) is preferably a group in which the oxygen atom of -C(=O)O- in formula (Cy) is directly bonded to an aliphatic hydrocarbon ring structure, i.e., an aliphatic hydrocarbon ring group, more preferably a cyclohexyl group or a dicyclopentanyl group, and even more preferably a dicyclopentanyl group.

The alkali-soluble resin may have one type of structural unit having an aliphatic hydrocarbon ring structure, or may have two or more types of structural units having an aliphatic hydrocarbon ring structure.
When the alkali-soluble resin has a structural unit having an aliphatic hydrocarbon ring structure, the content of the structural unit having an aliphatic hydrocarbon ring structure is, from the viewpoints of suppressing development residues, the strength of the resultant cured film, and the adhesion of the resultant uncured film, preferably from 5% by mass to 90% by mass, more preferably from 10% by mass to 80% by mass, and even more preferably from 20% by mass to 70% by mass, relative to all structural units of the alkali-soluble resin.
Furthermore, the content of the structural unit having an aliphatic hydrocarbon ring structure in the alkali-soluble resin is, from the viewpoints of suppressing development residues, the strength of the resulting cured film, and the adhesion of the resulting uncured film, preferably from 5 mol % to 70 mol %, more preferably from 10 mol % to 60 mol %, and even more preferably from 20 mol % to 50 mol %, relative to all structural units of the alkali-soluble resin.
Furthermore, the content of the structural unit represented by the above formula (Cy) in the alkali-soluble resin is, from the viewpoints of suppressing development residues, the strength of the resulting cured film, and the adhesion of the resulting uncured film, preferably from 5 mol % to 70 mol %, more preferably from 10 mol % to 60 mol %, and even more preferably from 20 mol % to 50 mol %, based on the total structural units of the alkali-soluble resin.

When the alkali-soluble resin has a structural unit having an aromatic ring structure and a structural unit having an aliphatic hydrocarbon ring structure, the total content of the structural units having an aromatic ring structure and the structural units having an aliphatic hydrocarbon ring structure is, from the viewpoints of suppressing development residues, the strength of the resultant cured film, and the adhesion of the resultant uncured film, preferably from 10% by mass to 90% by mass, more preferably from 20% by mass to 80% by mass, and even more preferably from 40% by mass to 75% by mass, relative to all structural units of the alkali-soluble resin.
Furthermore, the total content of the structural units having an aromatic ring structure and the structural units having an aliphatic hydrocarbon ring structure in the alkali-soluble resin is, from the viewpoints of suppressing development residues, the strength of the resulting cured film, and the adhesion of the resulting uncured film, preferably from 10 mol % to 80 mol %, more preferably from 20 mol % to 70 mol %, and even more preferably from 40 mol % to 60 mol %, relative to all the structural units of the alkali-soluble resin.
Furthermore, the total content of the structural units represented by the above formula (S) and the structural units represented by the above formula (Cy) in the alkali-soluble resin is, from the viewpoints of suppressing development residues, the strength of the resulting cured film, and the adhesion of the resulting uncured film, preferably 10 mol % to 80 mol %, more preferably 20 mol % to 70 mol %, and even more preferably 40 mol % to 60 mol %, relative to all structural units of the alkali-soluble resin.
Furthermore, in the alkali-soluble resin, the molar amount nS of the constitutional unit represented by the above formula (S) and the molar amount nCy of the constitutional unit represented by the above formula (Cy) preferably satisfy the relationship shown in the following formula (SCy), more preferably satisfy the following formula (SCy-1), and even more preferably satisfy the following formula (SCy-2), from the viewpoints of suppression of development residues, the strength of the resultant cured film, and the adhesion of the resultant uncured film.
0.2≦nS/(nS+nCy)≦0.8: Formula (SCy)
0.30≦nS/(nS+nCy)≦0.75: Formula (SCy-1)
0.40≦nS/(nS+nCy)≦0.70: Formula (SCy-2)

From the viewpoints of developability and adhesion to a substrate, the alkali-soluble resin preferably has a structural unit having an acid group.
Examples of the acid group include a carboxy group, a sulfo group, a phosphonic acid group, and a phosphoric acid group, with the carboxy group being preferred.
As the structural unit having an acid group, a structural unit derived from (meth)acrylic acid shown below is preferred, and a structural unit derived from methacrylic acid is more preferred.

The alkali-soluble resin may have one type of structural unit having an acid group alone, or may have two or more types of structural units having an acid group.
When the alkali-soluble resin has a structural unit having an acid group, the content of the structural unit having an acid group is, from the viewpoints of developability and adhesion to a substrate, preferably 5% by mass to 50% by mass, more preferably 5% by mass to 40% by mass, and even more preferably 10% by mass to 30% by mass, based on the total structural units of the alkali-soluble resin.
Furthermore, the content of the structural unit having an acid group in the alkali-soluble resin is, from the viewpoints of developability and adhesion to a substrate, preferably 5 mol % to 70 mol %, more preferably 10 mol % to 50 mol %, and even more preferably 20 mol % to 40 mol %, based on the total structural units of the alkali-soluble resin.
Furthermore, the content of the structural units derived from (meth)acrylic acid in the alkali-soluble resin is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 50 mol %, and even more preferably 20 mol % to 40 mol %, based on the total structural units of the alkali-soluble resin, from the viewpoints of developability and adhesion to a substrate.

From the viewpoints of curability and strength of the resulting cured film, the alkali-soluble resin preferably has a reactive group, and more preferably has a structural unit having a reactive group.
The reactive group is preferably a radical polymerizable group, more preferably an ethylenically unsaturated group. In addition, when the alkali-soluble resin has an ethylenically unsaturated group, the alkali-soluble resin preferably has a structural unit having an ethylenically unsaturated group in a side chain.
In this specification, the term "main chain" refers to the relatively longest bond chain in the molecule of the polymer compound that constitutes the resin, and the term "side chain" refers to an atomic group branching off from the main chain.
The ethylenically unsaturated group is more preferably an allyl group or a (meth)acryloxy group.
Examples of structural units having a reactive group include, but are not limited to, those shown below.

The alkali-soluble resin may have one type of structural unit having a reactive group, or may have two or more types of structural units having a reactive group.
When the alkali-soluble resin has a structural unit having a reactive group, the content of the structural unit having a reactive group is, from the viewpoints of curability and the strength of the obtained cured film, preferably 5% by mass to 70% by mass, more preferably 10% by mass to 50% by mass, and even more preferably 20% by mass to 40% by mass, based on the total structural units of the alkali-soluble resin.
Furthermore, the content of the structural unit having a reactive group in the alkali-soluble resin is, from the viewpoints of curability and the strength of the resulting cured film, preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the alkali-soluble resin.

Examples of a method for introducing a reactive group into an alkali-soluble resin include a method in which a functional group such as a hydroxy group, a carboxy group, a primary amino group, a secondary amino group, an acetoacetyl group, or a sulfo group is reacted with a compound such as an epoxy compound, a blocked isocyanate compound, an isocyanate compound, a vinyl sulfone compound, an aldehyde compound, a methylol compound, or a carboxylic acid anhydride.
A preferred example of a method for introducing a reactive group into an alkali-soluble resin is to synthesize a polymer having a carboxy group by polymerization, and then react a part of the carboxy group of the obtained resin with glycidyl (meth)acrylate by a polymer reaction to introduce a (meth)acryloxy group into the polymer. By this method, an alkali-soluble resin having a (meth)acryloxy group in the side chain can be obtained.
The polymerization reaction is preferably carried out at a temperature of 70° C. to 100° C., and more preferably at a temperature of 80° C. to 90° C. As the polymerization initiator used in the polymerization reaction, an azo-based initiator is preferable, and for example, V-601 (trade name) or V-65 (trade name) manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd. is more preferable. The polymer reaction is preferably carried out at a temperature of 80° C. to 110° C. In the polymer reaction, it is preferable to use a catalyst such as an ammonium salt.

As the alkali-soluble resin, the resins shown below are preferred because they provide better effects in the present disclosure. Note that the content ratios (a to d) of each of the structural units shown below and the weight average molecular weight Mw can be changed as appropriate depending on the purpose.

In the above resin, it is preferable that a is 20% by mass to 60% by mass, b is 10% by mass to 50% by mass, c is 5.0% by mass to 25% by mass, and d is 10% by mass to 50% by mass.

In the above resin, it is preferable that a is 20% by mass to 60% by mass, b is 10% by mass to 50% by mass, c is 5.0% by mass to 25% by mass, and d is 10% by mass to 50% by mass.

In the above resin, it is preferable that a is 30% by mass to 65% by mass, b is 1.0% by mass to 20% by mass, c is 5.0% by mass to 25% by mass, and d is 10% by mass to 50% by mass.

In the above resin, it is preferable that a is 1.0% by mass to 20% by mass, b is 20% by mass to 60% by mass, c is 5.0% by mass to 25% by mass, and d is 10% by mass to 50% by mass.

The alkali-soluble resin may also contain a polymer having a structural unit with a carboxylic acid anhydride structure (hereinafter, also referred to as "polymer X").
The carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, but is preferably a cyclic carboxylic acid anhydride structure.
The ring of the cyclic carboxylic acid anhydride structure is preferably a 5- to 7-membered ring, more preferably a 5- or 6-membered ring, and even more preferably a 5-membered ring.

The structural unit having a carboxylic acid anhydride structure is preferably a structural unit containing in its main chain a divalent group obtained by removing two hydrogen atoms from a compound represented by the following formula P-1, or a structural unit in which a monovalent group obtained by removing one hydrogen atom from a compound represented by the following formula P-1 is bonded to the main chain directly or via a divalent linking group.

In formula P-1, R ^A1a represents a substituent, n ^1a R ^A1a may be the same or different, Z ^1a represents a divalent group forming a ring containing -C(=O)-O-C(=O)-, and n ^1a represents an integer of 0 or more.

An example of the substituent represented by R ^A1a is an alkyl group.
Z ^1a is preferably an alkylene group having 2 to 4 carbon atoms, more preferably an alkylene group having 2 or 3 carbon atoms, and even more preferably an alkylene group having 2 carbon atoms.
n ^1a represents an integer of 0 or more. When Z ^1a represents an alkylene group having 2 to 4 carbon atoms, n ^1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and further preferably 0.
When n ^1a represents an integer of 2 or more, the multiple R ^A1a may be the same or different. In addition, the multiple R ^A1a may be bonded to each other to form a ring, but it is preferable that they are not bonded to each other to form a ring.

As a structural unit having a carboxylic acid anhydride structure, a structural unit derived from an unsaturated carboxylic acid anhydride is preferred, a structural unit derived from an unsaturated cyclic carboxylic acid anhydride is more preferred, a structural unit derived from an unsaturated aliphatic cyclic carboxylic acid anhydride is even more preferred, a structural unit derived from maleic anhydride or itaconic anhydride is particularly preferred, and a structural unit derived from maleic anhydride is most preferred.

Specific examples of structural units having a carboxylic acid anhydride structure are given below, but the structural units having a carboxylic acid anhydride structure are not limited to these specific examples. In the following structural units, Rx represents a hydrogen atom, a methyl group, a _CH2OH group, or a _CF3 group, and Me represents a methyl group.

The structural unit having a carboxylic acid anhydride structure in polymer X may be of one type alone or of two or more types.

The total content of structural units having a carboxylic acid anhydride structure is preferably 0 mol% to 60 mol%, more preferably 5 mol% to 40 mol%, and even more preferably 10 mol% to 35 mol%, relative to all structural units of polymer X.

The photosensitive resin layer may contain only one type of polymer X, or may contain two or more types.
When the photosensitive resin layer contains the polymer X, from the viewpoints of resolution and developability, the content of the polymer X is preferably 0.1% by mass to 30% by mass, more preferably 0.2% by mass to 20% by mass, even more preferably 0.5% by mass to 20% by mass, and still more preferably 1% by mass to 20% by mass, relative to the total mass of the photosensitive resin layer.

From the viewpoint of improving resolution and developability, the weight average molecular weight (Mw) of the alkali-soluble resin is preferably 5,000 or more, more preferably 10,000 or more, even more preferably 10,000 to 50,000, and particularly preferably 20,000 to 30,000.

The acid value of the alkali-soluble resin is preferably from 10 mgKOH/g to 200 mgKOH/g, more preferably from 60 mgKOH/g to 200 mgKOH/g, still more preferably from 60 mgKOH/g to 150 mgKOH/g, and particularly preferably from 60 mgKOH/g to 110 mgKOH/g.
The acid value of the alkali-soluble resin is a value measured according to the method described in JIS K0070:1992.
The dispersity (weight average molecular weight/number average molecular weight) of the alkali-soluble resin is preferably from 1.0 to 6.0, more preferably from 1.0 to 5.0, even more preferably from 1.0 to 4.0, and particularly preferably from 1.0 to 3.0, from the viewpoint of developability.

The photosensitive resin layer may contain only one type of alkali-soluble resin, or may contain two or more types of alkali-soluble resin.
From the viewpoints of photosensitivity, resolution and developability, the content of the alkali-soluble resin is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 30% by mass to 70% by mass, based on the total mass of the photosensitive resin layer.

(Polymerizable compound)
The photosensitive resin layer may contain a polymerizable compound.
The polymerizable compound is a compound having a polymerizable group. Examples of the polymerizable group include a radical polymerizable group and a cationic polymerizable group, and the radical polymerizable group is preferable.

The polymerizable compound preferably contains a polymerizable compound having an ethylenically unsaturated group (hereinafter, also simply referred to as an "ethylenically unsaturated compound").
The ethylenically unsaturated group is preferably a (meth)acryloxy group.
The ethylenically unsaturated compound in this specification is a compound other than the above-mentioned binder polymer, and preferably has a molecular weight of less than 5,000.
The preferred embodiments of the ethylenically unsaturated compound are the same as those described above in the section "Photosensitive resin layer."

One preferred embodiment of the ethylenically unsaturated compound is a compound represented by the following formula (M) (also simply referred to as "compound M").
Q ² -R ¹ -Q ¹ : Formula (M)
In formula (M), Q ¹ and Q ² each independently represent a (meth)acryloyloxy group, and R ¹ represents a divalent linking group having a chain structure.

In terms of ease of synthesis, it is preferred that Q ¹ and Q ² in formula ⁽ M ⁾ are the same group.
In addition, Q ¹ and Q ² in formula (M) are preferably acryloyloxy groups in terms of reactivity.
In formula (M), R ¹ is preferably an alkylene group, an alkyleneoxyalkylene group (-L ¹ -O-L ¹ -) or a polyalkyleneoxyalkylene group (-(L ¹ -O) _p -L ¹ -), more preferably a hydrocarbon group having 2 to 20 carbon atoms or a polyalkyleneoxyalkylene group, still more preferably an alkylene group having 4 to 20 carbon atoms, and particularly preferably a linear alkylene group having 6 to 18 carbon atoms, from the viewpoints of suppression of development residues, rust prevention, and bending resistance of the resulting cured film.
The hydrocarbon group may have a chain structure at least in a portion thereof, and the portion other than the chain structure is not particularly limited and may be, for example, a branched, cyclic, or linear alkylene group having 1 to 5 carbon atoms, an arylene group, an ether bond, or a combination thereof. An alkylene group or a group combining two or more alkylene groups and one or more arylene groups is preferred, an alkylene group is more preferred, and a linear alkylene group is even more preferred.
Each ^L1 independently represents an alkylene group, preferably an ethylene group, a propylene group, or a butylene group, more preferably an ethylene group or a 1,2-propylene group.
p represents an integer of 2 or more, and is preferably an integer of 2 to 10.

Furthermore, the number of atoms in the shortest linking chain connecting ^Q1 and ^Q2 in compound M is preferably 3 to 50, more preferably 4 to 40, even more preferably 6 to 20, and particularly preferably 8 to 12, from the viewpoints of suppression of development residues, rust prevention, and bending resistance of the resulting cured film.
In this specification, "the number of atoms in the shortest linking chain connecting ^Q1 and ^Q2 " refers to the shortest number of atoms linking from an atom in ^R1 linked to ^Q1 to an atom in ^R1 linked to ^Q2 .

Specific examples of compound M include 1,3-butanediol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,7-heptanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, hydrogenated bisphenol A di(meth)acrylate, hydrogenated bisphenol F di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, poly(ethylene glycol/propylene glycol) di(meth)acrylate, and polybutylene glycol di(meth)acrylate. The above ester monomers can also be used as a mixture.
Among the above compounds, from the viewpoints of suppression of development residues, rust prevention, and bending resistance of the obtained cured film, at least one compound selected from the group consisting of 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate is preferred, at least one compound selected from the group consisting of 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,10-decanediol di(meth)acrylate is more preferred, and at least one compound selected from the group consisting of 1,9-nonanediol di(meth)acrylate and 1,10-decanediol di(meth)acrylate is even more preferred.

One of the preferred embodiments of the ethylenically unsaturated compound is a di- or higher functional ethylenically unsaturated compound.
In this specification, the term "di- or higher functional ethylenically unsaturated compound" means a compound having two or more ethylenically unsaturated groups in one molecule.
As the ethylenically unsaturated group in the ethylenically unsaturated compound, a (meth)acryloyl group is preferred.
As the ethylenically unsaturated compound, a (meth)acrylate compound is preferred.

The difunctional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds.
Examples of the difunctional ethylenically unsaturated compound other than the compound M include tricyclodecane dimethanol di(meth)acrylate and 1,4-cyclohexanediol di(meth)acrylate.

Commercially available bifunctional ethylenically unsaturated compounds include tricyclodecane dimethanol diacrylate (product name: NK Ester A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimenanol dimethacrylate (product name: NK Ester DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (product name: NK Ester A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (product name: NK Ester A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.).

The tri- or higher functional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds.
Examples of the tri- or higher functional ethylenically unsaturated compound include dipentaerythritol (tri/tetra/penta/hexa)(meth)acrylate, pentaerythritol (tri/tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and (meth)acrylate compounds having a glycerin tri(meth)acrylate skeleton.

Examples of ethylenically unsaturated compounds include caprolactone-modified (meth)acrylate compounds (such as KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd.), alkylene oxide-modified (meth)acrylate compounds (such as KAYARAD (registered trademark) RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., and EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Co., Ltd.), and ethoxylated glycerin triacrylate (such as NK Ester A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.).

The ethylenically unsaturated compounds also include urethane (meth)acrylate compounds.
Examples of the urethane (meth)acrylate include urethane di(meth)acrylate, such as propylene oxide modified urethane di(meth)acrylate, and ethylene oxide and propylene oxide modified urethane di(meth)acrylate.
In addition, the urethane (meth)acrylate may be a trifunctional or higher urethane (meth)acrylate. The lower limit of the number of functional groups is more preferably 6 or more, and even more preferably 8 or more. The upper limit of the number of functional groups is preferably 20 or less. Examples of trifunctional or higher urethane (meth)acrylates include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), U-15HA (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), AH-600 (product name) manufactured by Kyoeisha Chemical Co., Ltd., and UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000 (all manufactured by Nippon Kayaku Co., Ltd.).

One of the preferred embodiments of the ethylenically unsaturated compound is an ethylenically unsaturated compound having an acid group.
Acid groups include phosphate groups, sulfo groups, and carboxy groups.
Among these, the acid group is preferably a carboxy group.
Examples of the ethylenically unsaturated compound having an acid group include trifunctional to tetrafunctional ethylenically unsaturated compounds having an acid group [pentaerythritol tri- and tetraacrylate (PETA) skeleton having a carboxy group (acid value: 80 mg KOH/g to 120 mg KOH/g)], and pentafunctional to hexafunctional ethylenically unsaturated compounds having an acid group [dipentaerythritol penta- and hexaacrylate (DPHA) skeleton having a carboxy group (acid value: 25 mg KOH/g to 70 mg KOH/g)].
These tri- or higher functional ethylenically unsaturated compounds having an acid group may be used in combination with a difunctional ethylenically unsaturated compound having an acid group, if necessary.

The ethylenically unsaturated compound having an acid group is preferably at least one selected from the group consisting of di- or higher functional ethylenically unsaturated compounds having a carboxy group and carboxylic acid anhydrides thereof.
When the ethylenically unsaturated compound having an acid group is at least one selected from the group consisting of di- or higher functional ethylenically unsaturated compounds having a carboxy group and carboxylic acid anhydrides thereof, the developability and film strength are further improved.
The di- or higher functional ethylenically unsaturated compound having a carboxy group is not particularly limited and can be appropriately selected from known compounds.
Examples of the difunctional or higher ethylenically unsaturated compound having a carboxy group include ARONIX (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), ARONIX (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and ARONIX (registered trademark) M-510 (manufactured by Toagosei Co., Ltd.).

As the ethylenically unsaturated compound having an acid group, the polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 is preferred, and the contents of this publication are incorporated herein by reference.

Examples of the ethylenically unsaturated compound include compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid, compounds obtained by reacting a glycidyl group-containing compound with an α,β-unsaturated carboxylic acid, urethane monomers such as (meth)acrylate compounds having a urethane bond, phthalic acid compounds such as γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β'-(meth)acryloyloxyethyl-o-phthalate, and β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, and (meth)acrylic acid alkyl esters.
These may be used alone or in combination of two or more kinds.

Examples of compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid include bisphenol A-based (meth)acrylate compounds such as 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane; polyethylene glycol di(meth)acrylates having 2 to 14 ethylene oxide groups; polypropylene glycol di(meth)acrylates having 2 to 14 propylene oxide groups; polyethylene polypropylene glycol di(meth)acrylates having 2 to 14 ethylene oxide groups and 2 to 14 propylene oxide groups; trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxy tri(meth)acrylate, trimethylolpropane diethoxy tri(meth)acrylate, trimethylolpropane triethoxy tri(meth)acrylate, trimethylolpropane tetraethoxy tri(meth)acrylate, trimethylolpropane pentaethoxy tri(meth)acrylate, di(trimethylolpropane) tetraacrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.
Among these, ethylenically unsaturated compounds having a tetramethylolmethane structure or a trimethylolpropane structure are preferred, and tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, trimethylolpropane tri(meth)acrylate, or di(trimethylolpropane)tetraacrylate are more preferred.

Examples of ethylenically unsaturated compounds include caprolactone-modified ethylenically unsaturated compounds (e.g., KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxide-modified ethylenically unsaturated compounds (e.g., KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Corporation, etc.), and ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd., etc.).

As the ethylenically unsaturated compound, from the viewpoint of excellent developability, those containing an ester bond are also preferred.
The ethylenically unsaturated compound containing an ester bond is not particularly limited as long as it contains an ester bond in the molecule. From the viewpoint of excellent curability and developability, an ethylenically unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure is preferred, and tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, trimethylolpropane tri(meth)acrylate, or di(trimethylolpropane)tetraacrylate is more preferred.
From the viewpoint of providing reliability, the ethylenically unsaturated compound preferably contains an ethylenically unsaturated compound having an aliphatic group having 6 to 20 carbon atoms and the above-mentioned ethylenically unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure.
Examples of ethylenically unsaturated compounds having an aliphatic structure having 6 or more carbon atoms include 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and tricyclodecane dimethanol di(meth)acrylate.

One of the preferred embodiments of the ethylenically unsaturated compound is an ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure (preferably a bifunctional ethylenically unsaturated compound).
The above-mentioned ethylenically unsaturated compound is preferably an ethylenically unsaturated compound having a ring structure in which two or more aliphatic hydrocarbon rings are condensed (preferably a structure selected from the group consisting of a tricyclodecane structure and a tricyclodecene structure), more preferably a bifunctional ethylenically unsaturated compound having a ring structure in which two or more aliphatic hydrocarbon rings are condensed, and even more preferably tricyclodecane dimethanol di(meth)acrylate.
As the aliphatic hydrocarbon ring structure, from the viewpoints of the moisture permeability and bending resistance of the obtained cured film, and the adhesion of the obtained uncured film, a cyclopentane structure, a cyclohexane structure, a tricyclodecane structure, a tricyclodecene structure, a norbornane structure, or an isoborone structure is preferred.

The molecular weight of the ethylenically unsaturated compound is preferably from 200 to 3,000, more preferably from 250 to 2,600, even more preferably from 280 to 2,200, and particularly preferably from 300 to 2,200.
Among the ethylenically unsaturated compounds contained in the photosensitive resin layer, the content ratio of ethylenically unsaturated compounds having a molecular weight of 300 or less is preferably 30 mass % or less, more preferably 25 mass % or less, and even more preferably 20 mass % or less, based on the content of all ethylenically unsaturated compounds contained in the photosensitive resin layer.

As one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer preferably contains a difunctional or higher ethylenically unsaturated compound, more preferably contains a trifunctional or higher ethylenically unsaturated compound, and even more preferably contains a trifunctional or tetrafunctional ethylenically unsaturated compound.

In addition, as one of the preferred embodiments of the photosensitive resin layer, it is preferable that the photosensitive resin layer contains a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure and an alkali-soluble resin having a structural unit having an aliphatic hydrocarbon ring.

In addition, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer preferably contains a compound represented by formula (M) and an ethylenically unsaturated compound having an acid group, more preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, and even more preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a succinic acid modified form of dipentaerythritol pentaacrylate.

In addition, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer preferably contains a compound represented by formula (M), an ethylenically unsaturated compound having an acid group, and a thermally crosslinkable compound described later, and more preferably contains a compound represented by formula (M), an ethylenically unsaturated compound having an acid group, and a blocked isocyanate compound described later.

In addition, as one of the preferred embodiments of the photosensitive resin layer, from the viewpoints of suppressing development residues and rust prevention, the photosensitive resin layer preferably contains a bifunctional ethylenically unsaturated compound (preferably a bifunctional (meth)acrylate compound) and a tri- or higher functional ethylenically unsaturated compound (preferably a tri- or higher functional (meth)acrylate compound).
The mass ratio of the difunctional ethylenically unsaturated compound to the tri- or higher functional ethylenically unsaturated compound is preferably from 10:90 to 90:10, and more preferably from 30:70 to 70:30.
The content of the difunctional ethylenically unsaturated compound relative to the total amount of all the ethylenically unsaturated compounds is preferably from 20% by mass to 80% by mass, and more preferably from 30% by mass to 70% by mass.
The content of the bifunctional ethylenically unsaturated compound in the photosensitive resin layer is preferably from 10% by mass to 60% by mass, and more preferably from 15% by mass to 40% by mass, based on the total mass of the photosensitive resin layer.

In one preferred embodiment of the photosensitive resin layer, the photosensitive resin layer preferably contains a compound M and a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure from the viewpoint of rust prevention.
In addition, as one of the preferred embodiments of the photosensitive resin layer, from the viewpoints of substrate adhesion, development residue suppression, and rust prevention, the photosensitive resin layer preferably contains a compound M and an ethylenically unsaturated compound having an acid group, more preferably contains a compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, and an ethylenically unsaturated compound having an acid group, still more preferably contains a compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, a tri- or higher functional ethylenically unsaturated compound, and an ethylenically unsaturated compound having an acid group, and particularly preferably contains a compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, a tri- or higher functional ethylenically unsaturated compound, an ethylenically unsaturated compound having an acid group, and a urethane (meth)acrylate compound.
In addition, as one of the preferred embodiments of the photosensitive resin layer, from the viewpoints of substrate adhesion, development residue suppression, and rust prevention, the photosensitive resin layer preferably contains 1,9-nonanediol diacrylate and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, more preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, dipentaerythritol hexaacrylate, and an ethylenically unsaturated compound having a carboxylic acid group, and particularly preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, an ethylenically unsaturated compound having a carboxylic acid group, and a urethane acrylate compound.

The photosensitive resin layer may contain a monofunctional ethylenically unsaturated compound as the ethylenically unsaturated compound.
The content of the difunctional or higher ethylenically unsaturated compound in the ethylenically unsaturated compound is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass, based on the total content of all ethylenically unsaturated compounds contained in the photosensitive resin layer.

The ethylenically unsaturated compounds may be used alone or in combination of two or more kinds.
The content of the ethylenically unsaturated compound in the photosensitive resin layer is preferably 1% by mass to 70% by mass, more preferably 5% by mass to 70% by mass, still more preferably 5% by mass to 60% by mass, and particularly preferably 5% by mass to 50% by mass, based on the total mass of the photosensitive resin layer.

(Polymerization initiator)
The photosensitive resin layer may contain a polymerization initiator.
The polymerization initiator is preferably a photopolymerization initiator.
The preferred embodiment of the photopolymerization initiator is the same as the preferred embodiment of the photopolymerization initiator explained in the above section "Photosensitive resin layer."
The polymerization initiator may be used alone or in combination of two or more kinds.
The content of the polymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more, based on the total mass of the photosensitive resin layer, and the upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.

(Heterocyclic compounds)
The photosensitive resin layer may contain a heterocyclic compound.
The heterocycle contained in the heterocyclic compound may be either a monocyclic or polycyclic heterocycle.
Examples of the heteroatom contained in the heterocyclic compound include a nitrogen atom, an oxygen atom, and a sulfur atom. The heterocyclic compound preferably contains at least one atom selected from the group consisting of a nitrogen atom, an oxygen atom, and a sulfur atom, and more preferably contains a nitrogen atom.

Examples of heterocyclic compounds include triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, benzoxazole compounds, and pyrimidine compounds.
Among the above, the heterocyclic compound is preferably at least one compound selected from the group consisting of triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzimidazole compounds, and benzoxazole compounds, and more preferably at least one compound selected from the group consisting of triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, and benzoxazole compounds.

Preferred specific examples of heterocyclic compounds are shown below. Examples of triazole compounds and benzotriazole compounds include the following compounds:

Examples of tetrazole compounds include the following compounds:

Examples of thiadiazole compounds include the following compounds:

Examples of triazine compounds include the following compounds:

Examples of rhodanine compounds include the following compounds:

Examples of thiazole compounds include the following compounds:

Examples of benzothiazole compounds include the following compounds:

Examples of benzimidazole compounds include the following compounds:

Examples of benzoxazole compounds include the following compounds:

The heterocyclic compounds may be used alone or in combination of two or more.
When the photosensitive resin layer contains a heterocyclic compound, the content of the heterocyclic compound is preferably 0.01% by mass to 20.0% by mass, more preferably 0.10% by mass to 10.0% by mass, still more preferably 0.30% by mass to 8.0% by mass, and particularly preferably 0.50% by mass to 5.0% by mass, based on the total mass of the photosensitive resin layer.

(Aliphatic thiol compounds)
The photosensitive resin layer may contain an aliphatic thiol compound.
When the photosensitive resin layer contains an aliphatic thiol compound, the aliphatic thiol compound undergoes an ene-thiol reaction with the ethylenically unsaturated compound, thereby suppressing the cure shrinkage of the film formed and reducing stress.

The aliphatic thiol compound is preferably a monofunctional aliphatic thiol compound or a polyfunctional aliphatic thiol compound (that is, a di- or higher functional aliphatic thiol compound).
Among the above, as the aliphatic thiol compound, from the viewpoint of the adhesion of the pattern to be formed (particularly the adhesion after exposure), a polyfunctional aliphatic thiol compound is more preferable.
In this specification, the term "polyfunctional aliphatic thiol compound" refers to an aliphatic compound having two or more thiol groups (also called "mercapto groups") in the molecule.

As the polyfunctional aliphatic thiol compound, a low molecular weight compound having a molecular weight of 100 or more is preferable. Specifically, the molecular weight of the polyfunctional aliphatic thiol compound is more preferably 100 to 1,500, and even more preferably 150 to 1,000.

The number of functional groups of the polyfunctional aliphatic thiol compound is preferably 2 to 10, more preferably 2 to 8, and even more preferably 2 to 6, from the viewpoint of adhesion of the pattern to be formed.

Examples of polyfunctional aliphatic thiol compounds include trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, pentaerythritol tetrakis(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolethane tris(3-mercaptobutyrate), tris[(3-mercaptopropionyloxy)ethyl]isocyanurate, trimethylolpropane tris(3-mercaptopropionyloxy)ethyl ester), pentaerythritol tetrakis(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), ethylene glycol bisthiopropionate, 1,4-bis(3-mercaptobutyryloxy)butane, 1,2-ethanedithiol, 1,3-propanedithiol, 1,6-hexamethylenedithiol, 2,2'-(ethylenedithio)diethanethiol, meso-2,3-dimercaptosuccinic acid, and di(mercaptoethyl)ether.

Among the above, the polyfunctional aliphatic thiol compound is preferably at least one compound selected from the group consisting of trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, and 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

Examples of monofunctional aliphatic thiol compounds include 1-octanethiol, 1-dodecanethiol, β-mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.

The photosensitive resin layer may contain one kind of aliphatic thiol compound alone, or may contain two or more kinds of aliphatic thiol compounds.
When the photosensitive resin layer contains an aliphatic thiol compound, the content of the aliphatic thiol compound is preferably 5% by mass or more, more preferably 5% by mass to 50% by mass, still more preferably 5% by mass to 30% by mass, and particularly preferably 8% by mass to 20% by mass, relative to the total mass of the photosensitive resin layer.

(Thermal crosslinking compound)
The photosensitive resin layer preferably contains a thermally crosslinkable compound from the viewpoints of the strength of the resulting cured film and the adhesion of the resulting uncured film.
Examples of the thermally crosslinkable compound include the thermally crosslinkable compounds described above in the section "Photosensitive resin layer."
The thermally crosslinkable compounds may be used alone or in combination of two or more kinds.
When the photosensitive resin layer contains a thermally crosslinkable compound, the content of the thermally crosslinkable compound is preferably 1% by mass to 50% by mass, and more preferably 5% by mass to 30% by mass, based on the total mass of the photosensitive resin layer.

(Surfactant)
The photosensitive resin layer may contain a surfactant.
Examples of the surfactant include the surfactants described above in the section "Photosensitive resin layer."
The surfactants may be used alone or in combination of two or more.
When the photosensitive resin layer contains a surfactant, the content of the surfactant is preferably 0.01% by mass to 3.0% by mass, more preferably 0.01% by mass to 1.0% by mass, and still more preferably 0.05% by mass to 0.80% by mass, relative to the total mass of the photosensitive resin layer.

(Radical Polymerization Inhibitor)
The photosensitive resin layer may contain a radical polymerization inhibitor.
Examples of the radical polymerization inhibitor include the radical polymerization inhibitors described above in the section "Photosensitive resin layer."
The radical polymerization inhibitor may be used alone or in combination of two or more kinds.
When the photosensitive resin layer contains a radical polymerization inhibitor, the content of the radical polymerization inhibitor is preferably 0.01% by mass to 3% by mass, more preferably 0.05% by mass to 1% by mass, based on the total mass of the photosensitive resin layer. When the content is 0.01% by mass or more, the storage stability of the photosensitive resin layer is more excellent. On the other hand, when the content is 3% by mass or less, the maintenance of sensitivity and the suppression of decolorization of the dye are more excellent.

(Hydrogen Donor Compound)
The photosensitive resin layer may contain a hydrogen donor compound.
The hydrogen donor compound has the effect of further improving the sensitivity of the photopolymerization initiator to actinic rays and suppressing the polymerization inhibition of the polymerizable compound caused by oxygen.
Examples of the hydrogen donor compound include amines and amino acid compounds.

Examples of amines include compounds described in M. R. Sander et al., Journal of Polymer Society, Vol. 10, p. 3173 (1972), JP-B-44-020189, JP-A-51-082102, JP-A-52-134692, JP-A-59-138205, JP-A-60-084305, JP-A-62-018537, JP-A-64-033104, and Research Disclosure No. 33825. More specific examples include 4,4'-bis(diethylamino)benzophenone, tris(4-dimethylaminophenyl)methane (also known as leuco crystal violet), triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyldimethylaniline, and p-methylthiodimethylaniline.
Among these, from the viewpoints of sensitivity, curing speed, and curability, the amine is preferably at least one selected from the group consisting of 4,4'-bis(diethylamino)benzophenone and tris(4-dimethylaminophenyl)methane.

Examples of the amino acid compound include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine.
Among these, from the viewpoints of sensitivity, curing speed, and curability, N-phenylglycine is preferred as the amino acid compound.

Further examples of hydrogen donor compounds include organometallic compounds (such as tributyltin acetate) described in JP-B-48-042965, hydrogen donors described in JP-B-55-034414, and sulfur compounds (such as trithiane) described in JP-A-6-308727.

The hydrogen donor compounds may be used alone or in combination of two or more kinds.
When the photosensitive resin layer contains a hydrogen donor compound, the content of the hydrogen donor compound is preferably 0.01% by mass to 10.0% by mass, more preferably 0.01% by mass to 8.0% by mass, and even more preferably 0.03% by mass to 5.0% by mass, relative to the total mass of the photosensitive resin layer, from the viewpoint of improving the curing rate through a balance between the polymerization growth rate and chain transfer.

(impurities)
The photosensitive resin layer may contain a predetermined amount of impurities.
Examples of the impurities include the impurities described above in the section "Photosensitive resin layer."

(Residual Monomer)
The photosensitive resin layer may contain residual monomers corresponding to the respective structural units of the polymer A described above.
Examples of the residual monomers corresponding to the respective structural units of polymer A in the photosensitive resin layer include the residual monomers corresponding to the respective structural units of polymer A described above in the section "Photosensitive resin layer."

(Other ingredients)
The photosensitive resin layer may contain components other than the components already described (hereinafter, also referred to as "other components"). Examples of the other components include colorants, antioxidants, and particles (e.g., metal oxide particles). Examples of the other components include other additives described in paragraphs 0058 to 0071 of JP-A-2000-310706.

-particle-
The particles are preferably metal oxide particles.
The metals in the metal oxide particles also include metalloids such as B, Si, Ge, As, Sb, and Te.
The average primary particle size of the particles is, for example, preferably from 1 nm to 200 nm, and more preferably from 3 nm to 80 nm, from the viewpoint of the transparency of the cured film.
The average primary particle size of the particles is calculated by measuring the particle sizes of 200 random particles using an electron microscope and arithmetically averaging the measurement results. When the shape of the particles is not spherical, the longest side is taken as the particle size.

When the photosensitive resin layer contains particles, it may contain only one type of particles having different metal species, sizes, etc., or may contain two or more types of particles.
The photosensitive resin layer does not contain particles, or if the photosensitive resin layer contains particles, the particle content is preferably more than 0 mass% and 35 mass% or less, relative to the total mass of the photosensitive resin layer, more preferably the photosensitive resin layer does not contain particles or the particle content is more than 0 mass% and 10 mass% or less, relative to the total mass of the photosensitive resin layer, even more preferably the photosensitive resin layer does not contain particles or the particle content is more than 0 mass% and 5 mass% or less, relative to the total mass of the photosensitive resin layer, even more preferably the photosensitive resin layer does not contain particles or the particle content is more than 0 mass% and 1 mass% or less, relative to the total mass of the photosensitive resin layer, and it is particularly preferable that the photosensitive resin layer does not contain particles.

- Coloring agent -
The photosensitive resin layer may contain a colorant (pigment, dye, etc.), but preferably does not substantially contain a colorant, for example, from the viewpoint of transparency.
When the photosensitive resin layer contains a colorant, the content of the colorant is preferably less than 1% by mass, and more preferably less than 0.1% by mass, based on the total mass of the photosensitive resin layer.

-Antioxidants-
Examples of the antioxidant include 3-pyrazolidones such as 1-phenyl-3-pyrazolidone (also known as phenidone), 1-phenyl-4,4-dimethyl-3-pyrazolidone, and 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone; polyhydroxybenzenes such as hydroquinone, catechol, pyrogallol, methylhydroquinone, and chlorohydroquinone; paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, and paraphenylenediamine.
Among these, from the viewpoints of storage stability and curing property, 3-pyrazolidones are preferred as the antioxidant, and 1-phenyl-3-pyrazolidone is more preferred.

When the photosensitive resin layer contains an antioxidant, the content of the antioxidant is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, and even more preferably 0.01% by mass or more, based on the total mass of the photosensitive resin layer. There is no particular upper limit, but a content of 1% by mass or less is preferable.

(Thickness of photosensitive resin layer)
The thickness (layer thickness) of the photosensitive resin layer is not particularly limited, but from the viewpoint of developability and resolution, it is preferably 30 μm or less, more preferably 20 μm or less, even more preferably 15 μm or less, particularly preferably 10 μm or less, and most preferably 5.0 μm or less. As the lower limit, it is preferably 0.60 μm or more, more preferably 1.5 μm or more, from the viewpoint of excellent strength of the film obtained by curing the photosensitive resin layer.

(Refractive index of photosensitive resin layer)
The refractive index of the photosensitive resin layer is preferably from 1.47 to 1.56, and more preferably from 1.49 to 1.54.

(Color of photosensitive resin layer)
The photosensitive resin layer is preferably achromatic. Specifically, in total reflection (incident angle 8 ^° , light source: D-65 (2° visual field)), the L ^* value is preferably 10 to 90, the a* value is preferably −1.0 to 1.0, and the b ^* value is preferably −1.0 to 1.0 in the CIE1976 (L ^* , ^a *, b ^* ) color space.

The pattern obtained by curing the photosensitive resin layer (cured film of the photosensitive resin layer) is preferably achromatic.
Specifically, in total reflection (incident angle 8°, light source: D-65 (2° field of view)), in the CIE1976 (L ^* , a ^* , b ^* ) color space, the L ^* value of the pattern is preferably 10 to 90, the a ^* value of the pattern is preferably -1.0 to 1.0, and the b ^* value of the pattern is preferably -1.0 to 1.0.

(Moisture permeability of photosensitive resin layer)
The moisture permeability of the pattern obtained by curing the photosensitive resin layer (cured film of the photosensitive resin layer) at a layer thickness of 40 μm is, from the viewpoint of rust prevention, preferably 500 g/( ^m2 ·24 hr) or less, more preferably 300 g/( ^m2 ·24 hr) or less, and even more preferably 100 g/( ^m2 ·24 hr) or less.
The moisture permeability is measured for a cured film obtained by exposing a photosensitive resin layer to i-rays at an exposure dose of 300 mJ/ ^cm2 and then post-baking the photosensitive resin layer at 145°C for 30 minutes to cure the photosensitive resin layer.

[Refractive index adjusting layer]
The photosensitive transfer material preferably has a refractive index adjusting layer.
The refractive index adjusting layer may be a known refractive index adjusting layer. Examples of materials contained in the refractive index adjusting layer include an alkali-soluble resin, an ethylenically unsaturated compound, a metal salt, and particles.
The method for controlling the refractive index of the refractive index adjusting layer is not particularly limited, and examples thereof include a method of using a resin having a predetermined refractive index alone, a method of using a resin and particles, and a method of using a complex of a metal salt and a resin.

Examples of alkali-soluble resins and ethylenically unsaturated compounds include the alkali-soluble resins and ethylenically unsaturated compounds described in the "Photosensitive resin layer" section above.

Examples of the particles include metal oxide particles and metal particles.
The type of metal oxide particles is not particularly limited, and known metal oxide particles can be used. Metals in the metal oxide particles include semimetals such as B, Si, Ge, As, Sb, and Te.

The average primary particle size of the particles is, for example, preferably from 1 nm to 200 nm, and more preferably from 3 nm to 80 nm, from the viewpoint of the transparency of the cured film.
The average primary particle size of the particles is calculated by measuring the particle sizes of 200 random particles using an electron microscope and arithmetically averaging the measurement results. When the shape of the particles is not spherical, the longest side is taken as the particle size.

Specifically, the metal oxide particles are preferably at least one selected from the group consisting of zirconium oxide particles ( _ZrO2 particles), _{Nb2O5 particles} , titanium oxide particles ( _TiO2 particles), silicon dioxide particles ( _SiO2 particles), and composite particles thereof.
Among these, the metal oxide particles are more preferably at least one type selected from the group consisting of zirconium oxide particles and titanium oxide particles, for example, from the viewpoint of ease of adjusting the refractive index.

Commercially available metal oxide particles include calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F04), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F74), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F75), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F76), zirconium oxide particles (Nanouse OZ-S30M, manufactured by Nissan Chemical Industries, Ltd.), and zirconium oxide particles (Nanouse OZ-S30K, manufactured by Nissan Chemical Industries, Ltd.).

The particles may be used alone or in combination of two or more kinds.
The content of the particles in the refractive index adjusting layer is preferably 1% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, and further preferably 40% by mass to 85% by mass, based on the total mass of the refractive index adjusting layer.
When titanium oxide is used as the metal oxide particles, the content of the titanium oxide particles is preferably 1% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, and even more preferably 40% by mass to 85% by mass, relative to the total mass of the refractive index adjusting layer.

The refractive index of the refractive index adjusting layer is preferably higher than the refractive index of the photosensitive resin layer.
The refractive index of the refractive index adjusting layer is preferably 1.50 or more, more preferably 1.55 or more, even more preferably 1.60 or more, and particularly preferably 1.65 or more. The upper limit of the refractive index of the refractive index adjusting layer is preferably 2.10 or less, more preferably 1.85 or less, and particularly preferably 1.78 or less.

The thickness of the refractive index adjusting layer is preferably 50 nm to 500 nm, more preferably 55 nm to 110 nm, and even more preferably 60 nm to 100 nm.

The refractive index adjustment layer is formed, for example, by using a refractive index adjustment layer. The composition for forming the refractive index adjustment layer preferably contains various components and a solvent that form the above-mentioned refractive index adjustment layer. In addition, in the composition for forming the refractive index adjustment layer, the preferred range of the content of each component relative to the total solid content of the composition is the same as the preferred range of the content of each component relative to the total mass of the above-mentioned refractive index adjustment layer.
The solvent is not particularly limited as long as it is capable of dissolving or dispersing the components contained in the refractive index adjusting layer, and at least one selected from the group consisting of water and water-miscible organic solvents is preferred, and water or a mixed solvent of water and a water-miscible organic solvent is more preferred.
Examples of water-miscible organic solvents include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin, with alcohols having 1 to 3 carbon atoms being preferred, and methanol or ethanol being more preferred.
The solvent may be used alone or in combination of two or more.
The content of the solvent is preferably 50 parts by mass to 2,500 parts by mass, more preferably 50 parts by mass to 1,900 parts by mass, and even more preferably 100 parts by mass to 900 parts by mass, relative to 100 parts by mass of the total solid content of the composition.

The method for forming the refractive index adjusting layer is not particularly limited as long as it is a method capable of forming a layer containing the above-mentioned components, and examples include known coating methods (slit coating, spin coating, curtain coating, inkjet coating, etc.).

[Relationship between temporary support, photosensitive resin layer and cover film]
In the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film, it is preferable that the above-mentioned relationship between the temporary support, the photosensitive resin layer, and the cover film is satisfied.

<Method of Manufacturing Resin Pattern>
The method for producing a resin pattern according to the present disclosure is not limited as long as it is a method for producing a resin pattern using the photosensitive transfer material according to the present disclosure. The method for producing a resin pattern according to the present disclosure preferably includes, in this order, a step of laminating the photosensitive transfer material according to the present disclosure and a substrate, and disposing a photosensitive resin layer on the substrate (hereinafter, sometimes referred to as a "lamination step"); a step of exposing the photosensitive resin layer to a pattern (hereinafter, sometimes referred to as an "exposure step"); and a step of developing the photosensitive resin layer to form a resin pattern (hereinafter, sometimes referred to as a "development step"). According to the above aspect, a method for producing a resin pattern using a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is performed on a laminate obtained by laminating the photosensitive transfer material and an adherend is provided.

The method for producing a resin pattern according to the present disclosure is preferably carried out by a roll-to-roll method. The roll-to-roll method includes a process in which a substrate capable of being wound and unwound is used as a substrate, a process in which the substrate or a structure including the substrate is unwound (also referred to as an "unwound process") before any of the processes included in the method for producing a resin pattern, and a process in which the substrate or a structure including the substrate is wound (also referred to as a "winding process") after any of the processes, and at least any of the processes (preferably all of the processes, or all of the processes other than the heating process) are carried out while the substrate or the structure including the substrate is being transported. The unwound method in the unwound process and the winding method in the winding process are not limited, and any known method may be used in a manufacturing method that applies the roll-to-roll method.

Below, each step included in the manufacturing method of the resin pattern according to the present disclosure is described.

<<Bonding process>>
In the lamination step, the photosensitive transfer material according to the present disclosure is laminated to a substrate, and a photosensitive resin layer is disposed on the substrate. The photosensitive resin layer disposed on the substrate is a photosensitive resin layer contained in the photosensitive transfer material. In the lamination step using a photosensitive transfer material having a temporary support and a photosensitive resin layer, the photosensitive resin layer and the temporary support are usually disposed on the substrate in this order.

In the lamination step, it is preferable to bring the photosensitive resin layer (specifically, the surface of the photosensitive resin layer opposite to the surface facing the temporary support) into contact with the substrate, and to press the photosensitive transfer material and the substrate together. According to the above embodiment, the adhesion between the photosensitive resin layer and the substrate is improved, so that the formed resin pattern can be suitably used as an etching resist. When a conductive layer is provided on the surface of the substrate, it is preferable to bring the photosensitive resin layer into contact with the conductive layer.

If the photosensitive transfer material has a cover film, the cover film may be removed from the photosensitive transfer material and then the photosensitive transfer material may be bonded to the substrate.

In the photosensitive transfer material, when a layer other than a cover film (e.g., a high refractive index layer and/or a low refractive index layer) is disposed on the side of the photosensitive resin layer opposite the side facing the temporary support, the photosensitive resin layer and the substrate may be bonded together via a layer other than the cover film.

There are no limitations on the method for pressing the photosensitive transfer material and the substrate, and known transfer and lamination methods can be used. The photosensitive transfer material and the substrate are preferably bonded together by overlapping the photosensitive resin layer and the substrate, and applying pressure and heat using a roll or other means. For the bonding, a laminator, a vacuum laminator, or an auto-cut laminator that can further increase productivity can be used.

[substrate]
The substrate is not limited, and a known substrate can be used. The substrate is preferably a substrate having a conductive layer, and more preferably a substrate having a base material and a conductive layer on a part or the entire surface of the base material. The substrate may have any layer other than the conductive layer as necessary.

Substrates include, for example, glass, silicon, and films.

It is preferable that the substrate is transparent. In this disclosure, "transparent" means that the transmittance of light having a wavelength of 400 to 700 nm is 80% or more.

The refractive index of the substrate is preferably 1.50 to 1.52.

An example of a transparent glass substrate is a tempered glass such as Corning Gorilla Glass. In addition, examples of transparent glass substrates that can be used include the materials described in JP 2010-86684 A, JP 2010-152809 A, and JP 2010-257492 A.

When a film substrate is used as the substrate, it is preferable to use a film substrate that has small optical distortion and/or high transparency. Examples of such film substrates include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

The substrate constituting the substrate used in the roll-to-roll method is preferably a film substrate. In addition, when manufacturing circuit wiring for a touch panel by the roll-to-roll method, the substrate is preferably a sheet-shaped resin composition.

Examples of the conductive layer include conductive layers used in general circuit wiring or touch panel wiring. From the viewpoints of conductivity and fine line formability, the conductive layer is preferably at least one selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer, more preferably a metal layer, and particularly preferably a copper layer or a silver layer.

The substrate may have a single conductive layer or two or more conductive layers. Substrates having two or more conductive layers preferably have multiple conductive layers made of different materials.

Examples of materials for the conductive layer include metals and conductive metal oxides. Examples of metals include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag, and Au. Examples of conductive metal oxides include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO _2. In the present disclosure, "conductive" refers to a volume resistivity of less than 1×10 ⁶ Ωcm. The volume resistivity of the conductive metal oxide is preferably less than 1×10 ⁴ Ωcm.

When producing a resin pattern using a substrate having multiple conductive layers, it is preferable that at least one of the multiple conductive layers contains a conductive metal oxide.

As the conductive layer, an electrode pattern corresponding to the sensor of the visible part used in the capacitive touch panel or wiring of the peripheral extraction part is preferred.

Preferred aspects of the conductive layer are described, for example, in paragraph 0141 of WO 2018/155193, the contents of which are incorporated herein by reference.

The substrate having a conductive layer is preferably a substrate having at least one of a transparent electrode and a lead wiring. Such a substrate can be suitably used as a substrate for a touch panel.
The transparent electrode can suitably function as an electrode for a touch panel. The transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) or IZO (indium zinc oxide), a metal mesh, or a metal thin wire such as a metal nanowire.
Examples of the thin metal wires include thin wires of silver, copper, etc. Among them, conductive silver materials such as silver mesh and silver nanowires are preferred.

The material of the lead wiring is preferably a metal.
Examples of the metal material for the wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, and manganese, and alloys of two or more of these metal elements. The material for the wiring is preferably copper, molybdenum, aluminum, or titanium, and more preferably copper.

<<Exposure process>>
In the exposure step, the photosensitive resin layer is exposed to a pattern.

The detailed arrangement and specific size of the pattern in the pattern exposure are not limited. For example, in order to improve the display quality of a display device (e.g., a touch panel) equipped with an input device having circuit wiring and to reduce the area occupied by the lead wiring, at least a part of the pattern (preferably the electrode pattern of the touch panel and/or the lead wiring part) preferably includes a thin line having a width of 20 μm or less, and more preferably includes a thin line having a width of 10 μm or less.

The light source used for exposure may be any light source that irradiates light of a wavelength capable of exposing the photosensitive resin layer (e.g., 365 nm or 405 nm). Specific light sources include, for example, ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, and LEDs (Light Emitting Diodes).

The exposure dose is preferably from 5 mJ/cm ² to 200 mJ/cm ² , and more preferably from 10 mJ/cm ² to 100 mJ/cm ² .

In the exposure step, the temporary support may be peeled off from the photosensitive resin layer and then pattern exposure may be performed, or the temporary support may be peeled off after pattern exposure via the temporary support. When the temporary support is peeled off before exposure, the mask may be brought into contact with the photosensitive resin layer and exposed, or the mask may be brought close to the photosensitive resin layer without contacting it. When exposing without peeling off the temporary support, the mask may be brought into contact with the temporary support and exposed, or the mask may be brought close to the photosensitive resin layer without contacting it. In order to prevent mask contamination due to contact between the photosensitive resin layer and the mask and to avoid the influence of foreign matter attached to the mask on the exposure, it is preferable to perform pattern exposure without peeling off the temporary support. In the case of contact exposure, the contact exposure method is used, and in the case of non-contact exposure, the proximity exposure method, the projection exposure method of the lens system or mirror system, and the direct exposure method using an exposure laser or the like can be appropriately selected and used. In the case of projection exposure of the mirror of the lens system, an exposure machine having an appropriate lens numerical aperture (NA) can be used according to the required resolution and focal depth. In the case of the direct exposure method, drawing may be performed directly on the photosensitive resin layer, or reduced projection exposure may be performed on the photosensitive resin layer through a lens. Exposure may be performed not only in the atmosphere but also under reduced pressure or vacuum. Exposure may be performed by interposing a liquid such as water between the light source and the photosensitive resin layer.

<<Developing process>>
In the development step, the photosensitive resin layer is developed to form a resin pattern.

The photosensitive resin layer can be developed using a developer. There are no limitations on the type of developer as long as it can remove the image area (exposed area) or non-image area (non-exposed area) of the photosensitive resin layer. As the developer, a known developer (for example, the developer described in JP-A-5-72724) can be used.

The developer is preferably an alkaline aqueous developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 mol/L to 5 mol/L. The developer may contain a water-soluble organic solvent and/or a surfactant. The developer is also preferably the developer described in paragraph 0194 of WO 2015/093271.

The development method is not particularly limited and may be any of paddle development, shower development, shower and spin development, and dip development. Shower development is a development process in which a developer is sprayed onto the photosensitive resin layer after exposure in a shower to remove the exposed or unexposed areas.

After the development process, it is preferable to remove development residues by spraying a cleaning agent in the shower and scrubbing with a brush.

The temperature of the developer is not limited. It is preferable that the temperature of the developer is 20°C to 40°C.

For example, when the photosensitive transfer material includes a thermoplastic resin and an intermediate layer, in the development process, the thermoplastic resin and the intermediate layer are removed together with the image portion (exposed portion) or the non-image portion (non-exposed portion) of the photosensitive resin layer. In addition, in the development process, the thermoplastic resin layer and the intermediate layer may be removed by dissolving or dispersing in the developer.

<<Degassing process>>
The method for producing a resin pattern according to the present disclosure preferably includes a step of heating or pressing the substrate after the lamination step (hereinafter, sometimes referred to as a "defoaming step"). By heating or pressing the substrate after the lamination step, air bubbles between the photosensitive transfer material and the substrate can be removed. The method for producing a resin pattern according to the present disclosure more preferably includes a defoaming step between the lamination step and the exposure step. In the present disclosure, "heating or pressing the substrate" includes heating the substrate, pressing the substrate, or heating and pressing the substrate. The defoaming step does not exclude layers other than the substrate from being heated or pressed. For example, when the substrate is heated or pressed, the photosensitive resin layer disposed on the substrate may also be heated or pressed. In the defoaming step, it is preferable to heat or pressurize the laminate obtained by laminating the photosensitive transfer material and the substrate. The method for producing a resin pattern according to the present disclosure more preferably includes a step of heating and pressing the substrate after the lamination step, and it is particularly preferable to heat and pressurize the laminate obtained by laminating the photosensitive transfer material and the substrate.

The method for heating or pressurizing the substrate is not limited. For example, a method for heating or pressurizing the substrate may be a method using an autoclave. A known autoclave may be used as the autoclave.

The temperature to which the substrate is heated is preferably 25°C to 80°C, more preferably 30°C to 70°C, and especially preferably 30°C to 60°C.

The pressure applied to the substrate is preferably 0.2 MPa to 3 MPa, more preferably 0.3 MPa to 1.0 MPa, and particularly preferably 0.3 MPa to 0.8 MPa.

The time for which the substrate is heated or pressurized is not limited. The time for which the substrate is heated or pressurized may be determined, for example, according to the size of the workpiece and the components of the workpiece. The time for which the substrate is heated or pressurized may be, for example, 0.5 hours to 5 hours.

When the method for producing a resin pattern according to the present disclosure is performed by a roll-to-roll method, the laminate obtained by laminating the photosensitive transfer material and the substrate may be wound up, and then the wound up laminate may be heated or pressurized. Also, two or more laminates obtained by laminating the photosensitive transfer material and the substrate may be stacked, and then the stacked two or more laminates may be heated or pressurized. The method for producing a resin pattern according to the present disclosure may include any step other than the steps described above. Steps other than the steps described above include, for example, the steps described in "Other Steps" below.

<Method of manufacturing circuit wiring>
The method for producing the circuit wiring according to the present disclosure is not limited as long as it is a method for producing the circuit wiring using the photosensitive transfer material according to the present disclosure. The method for producing the circuit wiring according to the present disclosure preferably includes a step of preparing a laminate having, in this order, a base material, a conductive layer, and a resin pattern formed using the photosensitive transfer material according to the present disclosure, and a step of etching the conductive layer in the laminate in an area where the resin pattern is not arranged to form a circuit wiring (hereinafter, sometimes referred to as an "etching step"). The laminate can be produced, for example, by the method for producing a resin pattern described in the above section "Method for producing a resin pattern". The method for producing circuit wiring according to the present disclosure preferably includes, in this order, a step of laminating the photosensitive transfer material according to the present disclosure with a substrate having a conductive layer and disposing a photosensitive resin layer on the substrate (hereinafter, sometimes referred to as a lamination step), a step of exposing the photosensitive resin layer to a pattern (hereinafter, sometimes referred to as an exposure step), a step of developing the photosensitive resin layer to form a resin pattern (hereinafter, sometimes referred to as a development step), and a step of etching the conductive layer in an area where the resin pattern is not disposed to form a circuit wiring. According to the above aspect, a method for producing circuit wiring using a photosensitive transfer material that suppresses adhesion between laminates when a degassing treatment is performed on a laminate obtained by laminating the photosensitive transfer material with an adherend is provided.

The method for manufacturing circuit wiring according to the present disclosure is preferably carried out by a roll-to-roll method. The roll-to-roll method is as described above in the section "Method for manufacturing resin pattern."

<<Bonding process>>
The lamination step in the method for producing circuit wiring according to the present disclosure is the same as the lamination step described in the above section "Method for producing resin pattern" except that a substrate having a conductive layer is used as the substrate. A preferred embodiment of the lamination step in the method for producing circuit wiring according to the present disclosure is the same as the preferred embodiment of the lamination step described in the above section "Method for producing resin pattern".

<<Exposure process>>
The exposure step in the method for producing a circuit wiring according to the present disclosure is the same as the exposure step described in the above section "Method for producing a resin pattern". A preferred aspect of the exposure step in the method for producing a circuit wiring according to the present disclosure is the same as the preferred aspect of the exposure step described in the above section "Method for producing a resin pattern".

<<Developing process>>
The developing step in the method for producing circuit wiring according to the present disclosure is the same as the developing step described above in the section "Method for producing resin pattern". A preferred aspect of the developing step in the method for producing circuit wiring according to the present disclosure is the same as the preferred aspect of the developing step described above in the section "Method for producing resin pattern".

<<Etching process>>
In the etching process, the conductive layer in the area where the resin pattern is not arranged is etched to form the circuit wiring. The "conductive layer in the area where the resin pattern is not arranged" refers to the conductive layer that is not covered by the resin pattern (i.e., the exposed conductive layer).

In the etching process, the conductive layer is etched using the resin pattern as an etching resist. Known methods can be used for the etching process. Examples of the etching process include the method described in paragraphs 0209 to 0210 of JP 2017-120435 A, the method described in paragraphs 0048 to 0054 of JP 2010-152155 A, a wet etching method in which the layer is immersed in an etching solution, and a dry etching method (e.g., plasma etching).

The etching solution used in the wet etching method should be an acidic or alkaline etching solution selected appropriately depending on the object to be etched.

Examples of acidic etching solutions include an aqueous solution of an acidic component selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, and phosphoric acid, and an aqueous solution of a mixture of an acidic component and a salt selected from the group consisting of ferric chloride, ammonium fluoride, and potassium permanganate. The acidic component may be a combination of multiple acidic components.

Examples of alkaline etching solutions include aqueous solutions of an alkaline component selected from the group consisting of sodium hydroxide, potassium hydroxide, ammonia, organic amines, and salts of organic amines (e.g., tetramethylammonium hydroxide), and aqueous solutions of a mixture of an alkaline component and a salt (e.g., potassium permanganate). The alkaline component may be a combination of multiple alkaline components.

<<Removal process>>
The method for producing a circuit wiring according to the present disclosure preferably includes a step of removing the remaining resin pattern (hereinafter, sometimes referred to as a "removing step"). The removing step is preferably performed after the etching step.

An example of a method for removing the remaining resin pattern is a method for removing the remaining resin pattern by chemical treatment. The method for removing the remaining resin pattern is preferably a method for removing the remaining resin pattern using a removal liquid. An example of a method using a removal liquid is a method for immersing the substrate having the remaining resin pattern for 1 minute to 30 minutes in a stirring removal liquid whose liquid temperature is preferably 30°C to 80°C, more preferably 50°C to 80°C.

Examples of the removal solution include a removal solution in which an inorganic or organic alkaline component is dissolved in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution of these. Examples of the inorganic alkaline component include sodium hydroxide and potassium hydroxide. Examples of the organic alkaline component include primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds.

The method of removing the remaining resin pattern using a removal solution is not limited to the immersion method, but may be any known method other than the immersion method (e.g., the spray method, the shower method, and the paddle method).

<<Degassing process>>
The method for producing a circuit wiring according to the present disclosure preferably includes a step of heating or pressurizing the substrate after the lamination step (hereinafter, sometimes referred to as a "degassing step"). A preferred aspect of the degassing step in the method for producing a circuit wiring according to the present disclosure is the same as the preferred aspect of the degassing step described in the above section "Method for producing a resin pattern".

<<Other processes>>
The method for producing circuit wiring according to the present disclosure may include any steps other than the steps described above (hereinafter, may be referred to as "other steps"). Examples of the exposure step, development step, and other steps that can be applied to the method for producing circuit wiring according to the present disclosure include the steps described in paragraphs 0035 to 0051 of JP 2006-23696 A. Examples of the other steps include the steps shown below. However, the other steps are not limited to the steps shown below.

[Step of reducing visible light reflectance]
The method for producing circuit wiring according to the present disclosure may include a step of performing a treatment to reduce the visible light reflectance of a part or all of the conductive layer in the substrate.

An example of a treatment that reduces the visible light reflectance of a conductive layer is an oxidation treatment. When the conductive layer contains copper, the copper is converted to copper oxide by an oxidation treatment, and the conductive layer is blackened, thereby reducing the visible light reflectance of the conductive layer.

The treatment for reducing the visible light reflectance of the conductive layer is described in paragraphs 0017 to 0025 of JP 2014-150118 A and paragraphs 0041, 0042, 0048, and 0058 of JP 2013-206315 A. The contents of these publications are incorporated herein by reference.

[Step of forming an insulating film and step of forming a new conductive layer on the surface of the insulating film]
The method for producing a circuit wiring according to the present disclosure also preferably includes a step of forming an insulating film on a surface of the circuit wiring, and a step of forming a new conductive layer on the surface of the insulating film. Through the above steps, two electrode patterns insulated by the insulating film can be formed.

The method for forming the insulating film is not limited. In the process of forming the insulating film, for example, the insulating film may be formed by a known method for forming a permanent film. Also, an insulating film of a desired pattern may be formed by photolithography using a photosensitive material having insulating properties.

In the process of forming a new conductive layer on an insulating film, for example, a conductive photosensitive material may be used to form a new conductive layer of the desired pattern by photolithography.

In the method for manufacturing circuit wiring according to the present disclosure, it is also preferable to use a substrate having a conductive layer on each of the surfaces of the substrate, and to form circuits on each of the conductive layers, either sequentially or simultaneously. According to the above method, for example, a circuit wiring for a touch panel can be formed in which a first conductive pattern is formed on one surface of the substrate and a second conductive pattern is formed on the other surface of the substrate. It is also preferable to form the circuit wiring for a touch panel on both sides of the substrate by roll-to-roll using the method for manufacturing circuit wiring according to the present disclosure.

<<Circuit wiring applications>>
The circuit wiring manufactured by the method for manufacturing the circuit wiring according to the present disclosure can be applied to various devices. An example of a device equipped with the circuit wiring manufactured by the method for manufacturing the circuit wiring according to the present disclosure is an input device, preferably a touch panel, more preferably a capacitive touch panel. The input device can also be applied to various display devices (e.g., organic electroluminescence display devices and liquid crystal display devices).

<Method of manufacturing touch panel>
The method for producing a touch panel according to the present disclosure is not limited as long as it is a method for producing a touch panel that uses the photosensitive transfer material according to the present disclosure.

The method for producing a touch panel according to the present disclosure preferably includes the steps of preparing a multilayer body having, in this order, a substrate, a conductive layer, and a resin pattern formed using the photosensitive transfer material according to the present disclosure, and etching the conductive layer in an area of the multilayer body where the resin pattern is not arranged to form wiring for a touch panel. The method for producing a touch panel according to the present disclosure more preferably includes, in this order, a step of bonding the photosensitive transfer material according to the present disclosure and a substrate having a conductive layer, and arranging a photosensitive resin layer on the substrate, a step of exposing the photosensitive resin layer to a pattern, a step of developing the photosensitive resin layer to form a resin pattern, and a step of etching the conductive layer in an area where the resin pattern is not arranged to form wiring for a touch panel.

The aspects of each step in the manufacturing method for a touch panel according to the present disclosure are as explained above in the section "Method for manufacturing a resin pattern" and the section "Method for manufacturing circuit wiring", and the preferred aspects are the same. For the manufacturing method for a touch panel according to the present disclosure, reference may be made to known manufacturing methods for touch panels, except that the wiring for a touch panel is formed by the above method. Furthermore, the manufacturing method for a touch panel according to the present disclosure may include any step other than the steps described above.

The pattern of the mask used in the manufacture of the touch panel will be described with reference to FIG. 2 and FIG. 3. FIG. 2 is a schematic plan view showing an example of a pattern of a mask for manufacturing a touch panel. FIG. 3 is a schematic plan view showing another example of a pattern of a mask for manufacturing a touch panel. In FIG. 2 and FIG. 3, DL virtually indicates an alignment frame, and G indicates a non-image portion (light-shielding portion). In FIG. 2, SL indicates a non-image portion (light-shielding portion). In the manufacturing method of the touch panel according to the present disclosure, for example, by exposing a photosensitive resin layer through a mask having a pattern shown in FIG. 2, a touch panel in which circuit wiring having a pattern corresponding to SL and G is formed can be manufactured. Specifically, the touch panel can be manufactured by the method described in FIG. 1 of International Publication No. 2016/190405. In one example of the manufactured touch panel, G is a portion where a transparent electrode (i.e., an electrode for a touch panel) is formed, and SL is a portion where wiring of a peripheral extraction portion is formed.

According to the touch panel manufacturing method of the present disclosure, a touch panel having at least wiring for the touch panel is manufactured. The touch panel preferably has a transparent substrate, an electrode, and an insulating layer or a protective layer.

Detection methods for touch panels include, for example, resistive film, capacitive, ultrasonic, electromagnetic induction, and optical methods. The detection method is preferably capacitive.

Examples of touch panel types include the so-called in-cell type (for example, the configuration shown in Figures 5, 6, 7, and 8 of JP Patent Publication No. 2012-517051), the so-called on-cell type (for example, the configuration shown in Figure 19 of JP Patent Publication No. 2013-168125 and the configuration shown in Figures 1 and 5 of JP Patent Publication No. 2012-89102), the OGS (One Glass Solution) type, the TOL (Touch-on-Lens) type (for example, the configuration shown in Figure 2 of JP Patent Publication No. 2013-54727), various out-cell types (for example, GG, G1/G2, GFF, GF2, GF1, and G1F), and other configurations (for example, the configuration shown in Figure 6 of JP Patent Publication No. 2013-164871).

<Temporary Support for Photosensitive Transfer Material>
The temporary support for photosensitive transfer material according to the present disclosure has a change rate of dynamic friction coefficient against stainless steel of 0% to 10% before and after a 3-hour heat treatment at 60° C. By applying the temporary support for photosensitive transfer material according to the present disclosure to a photosensitive transfer material, adhesion between laminates is suppressed when a degassing treatment is performed on a laminate obtained by laminating the photosensitive transfer material and an adherend.

The temporary support for photosensitive transfer material according to the present disclosure may have at least one surface in which the rate of change in the dynamic friction coefficient against stainless steel is 0% to 10% before and after a heat treatment at 60° C. for 3 hours. When the temporary support for photosensitive transfer material according to the present disclosure is applied to a photosensitive transfer material, the surface of the temporary support for photosensitive transfer material in which the rate of change in the dynamic friction coefficient against stainless steel is 0% to 10% is disposed as the surface opposite to the surface facing the photosensitive resin layer (i.e., the second surface), and as explained in the above "Photosensitive transfer material" section, adhesion between the laminates can be suppressed when a degassing treatment is performed on the laminate obtained by laminating the photosensitive transfer material and the adherend.

In the temporary support for photosensitive transfer material according to the present disclosure, the preferred range of the rate of change of the dynamic friction coefficient is the same as the range described in the above section "Photosensitive transfer material." The method for measuring the rate of change of the dynamic friction coefficient is the same as the method described in the above section "Photosensitive transfer material."

Other than the above, the preferred aspects of the temporary support for the photosensitive transfer material are the same as the preferred aspects of the temporary support described in the above "Photosensitive Transfer Material" section. For the aspects of the temporary support for the photosensitive transfer material according to the present disclosure, reference can be made to the aspects of the temporary support described in the above "Photosensitive Transfer Material" section.

The present disclosure will be described in detail below with reference to examples. However, the present disclosure is not limited to the following examples.

<Synthesis of Polymer A-1>
Propylene glycol 1-monomethyl ether (75.0 g) was placed in a three-neck flask, and the liquid temperature was raised to 90 ° C. under a nitrogen atmosphere. A solution containing styrene (52.0 g), methacrylic acid (29.0 g), methyl methacrylate (19.0 g), and propylene glycol 1-monomethyl ether (75.0 g) was added dropwise over 2 hours to the liquid in the three-neck flask maintained at 90 ° C. ± 2 ° C. After completion of the dropwise addition, the mixture was stirred at 90 ° C. ± 2 ° C. for 2 hours to obtain a solution containing polymer A-1 (solid content concentration: 40.0 mass%). The weight average molecular weight (Mw) of polymer A-1 was 60,000.

<Synthesis of dimethacrylate of polyethylene glycol having an average of 15 moles of ethylene oxide and an average of 2 moles of propylene oxide added to both ends of bisphenol A>
In a pressure-resistant reactor having a capacity of 500 mL, bisphenol A (22.83 g, 0.1 mol), toluene (30 g) as a solvent, and triethylamine (0.3 g) as a catalyst were added. After replacing the inside of the pressure-resistant reactor with nitrogen gas, the nitrogen gas pressure was adjusted to 0.2 kg/ ^cm2 , and the mixture was heated to 80°C while stirring. Ethylene oxide (132.15 g, 3.0 mol) and propylene oxide (23.24 g, 0.4 mol) were successively introduced to maintain the pressure at about 2 kg/ ^cm2 , while heating to 150°C. The mixture was held at 150°C for 1 hour and then cooled. The mixture was neutralized with oxalic acid, and then ion-exchanged water (50 g) was added to the mixture and stirred, and the mixture was allowed to stand to separate, and the organic layer was extracted. The obtained organic layer was washed three times with ion-exchanged water (50 g), and then the solvent was removed by reducing the pressure to 30 Torr at 50° C. to obtain a dihydric alcohol (105.1 g). A three-necked flask with a capacity of 1 L was charged with dihydric alcohol (100.0 g, 0.044 mol), methacrylic acid (11.5 g), 70% by mass methanesulfonic acid aqueous solution (0.9 g), hydroquinone (0.2 g), and toluene (200 mL), and then esterification was performed for 8 hours under toluene reflux. Water generated during the reaction was removed by a Dean-Stark trap. After the reaction, the mixture was cooled to room temperature, and the obtained organic layer was washed once with a 5% sodium hydroxide aqueous solution (50 g) and then three times with ion-exchanged water (50 g). Hydroquinone monomethyl ether (0.09 g) was added to the organic layer, and the pressure was reduced to 30 Torr at 50° C. to remove the solvent, thereby obtaining dimethacrylate of polyethylene glycol (90.0 g) in which an average of 15 moles of ethylene oxide and an average of 2 moles of propylene oxide were added to both ends of bisphenol A.

<Production of temporary support 1>
According to the following method, a coating solution for forming a covering layer was applied to one surface of a polyester film used as a substrate, and then the film was stretched to obtain a temporary support 1.

[Preparation of coating solution for forming coating layer]
The following components were mixed to obtain a coating solution for forming a coating layer. The obtained coating solution was filtered using a filter having a pore size of 2.5 μm (250PG, 3M Japan Ltd.), and then degassed (SEPAREL EF-G5, DIC Corporation).
Acrylic polymer (AS-563A, Daicel FineChem Co., Ltd., solid content: 27.5% by mass): 128.0 parts by mass Nonionic surfactant (Naroacty CL95, Sanyo Chemical Industries, Ltd., solid content: 100% by mass): 0.7 parts by mass Anionic surfactant (Lapisol A-90, NOF Corporation, water dilution solution with solid content of 1% by mass): 111.4 parts by mass Carnauba wax dispersion (Cellosol 524, Chukyo Yushi Co., Ltd., solid content: 30% by mass): 28.0 parts by mass Carbodiimide compound (Carbodilite V-02-L2, Nisshinbo Chemical Inc., water dilution solution with solid content of 10% by mass): 15.7 parts by mass Matting agent (Snowtex XL, Nissan Chemical Industries, Ltd., solid content: 40.5% by mass): 3.0 parts by mass Water: 713 parts by mass

[Extrusion molding]
Pellets of polyethylene terephthalate synthesized using a titanium compound described in Japanese Patent No. 5575671 as a polymerization catalyst were dried until the moisture content was 50 ppm or less. After drying, the pellets were put into a hopper of a twin-screw kneading extruder having a diameter of 30 mm and melted at 280°C. The melt was passed through a filter (hole diameter: 2 μm) and then extruded from a die onto a cooling roll at 25°C to obtain an unstretched film. The melt extruded from the die was brought into close contact with the cooling roll using an electrostatic application method.

[Stretching and Coating]
The unstretched film was subjected to sequential biaxial stretching by the following method.

(a) Longitudinal Stretching The unstretched film was stretched in the longitudinal direction (transport direction) by passing it between two pairs of nip rolls with different peripheral speeds. Specifically, the unstretched film was stretched under the conditions of a preheating temperature of 77° C., a stretching temperature of 110° C., a stretching ratio of 3.0 times, and a stretching speed of 1,300%/sec.

(b) Coating The coating solution for forming the coating layer was applied onto the longitudinally stretched film with a bar coater. The coating amount of the coating solution for forming the coating layer was 5.6 g/ ^m2 .

(c) Transverse Stretching The film coated with the coating solution for forming the covering layer was transversely stretched using a tenter under the following conditions.

-Transverse stretching conditions-
Preheat temperature: 110°C
Stretching temperature: 120°C
Stretching ratio: 4.2 times Stretching speed: 50%/sec

[Heat Fixation and Heat Relaxation]
The transversely stretched film was heat-set under the following conditions: After heat-setting, the tenter width was reduced, and the film was heat-relaxed under the following conditions.

-Heat processing conditions-
Heat fixing temperature: 224℃
Heat fixing time: 5 seconds

- Thermal relaxation conditions -
Thermal relaxation temperature: 212℃
Thermal relaxation rate: 4%

[Winding]
After the thermal relaxation, both ends of the film were trimmed, and then both ends of the film were extruded (i.e., knurled) with a width of 10 mm, and then wound up with a tension of 40 kg/m. The width of the obtained film roll was 1.2 m. The wound length of the obtained film roll was 4,000 m. The obtained film roll was used as the temporary support (temporary support 1) of Example 1. The temporary support 1 has a substrate (polyester film) with a thickness of 16 μm and a coating layer with a thickness of 40 nm. The thermal shrinkage rate of the substrate of the temporary support by heating at 150 ° C. for 30 minutes was 1.4% in MD (machine direction) and 0.8% in TD (transverse direction).

<Production of temporary support 2>
Temporary support 2 was produced in the same manner as for temporary support 1, except that the thickness of the substrate (polyester film) was changed to 25 μm by adjusting the extrusion amount in the extrusion molding.

<Production of temporary support 3>
Temporary support 2 was produced in the same manner as for temporary support 1, except that the thickness of the substrate (polyester film) was changed to 38 μm by adjusting the extrusion amount in the extrusion molding.

<Production of temporary support 4>
Temporary Support 4 was produced in the same manner as Temporary Support 1, except that the amount of the carnauba wax dispersion added was changed to 5.3 parts by mass.

<Production of temporary support 5>
Temporary Support 5 was manufactured using the same procedure as Temporary Support 1, except that the thickness of the substrate (polyester film) was changed to 12 μm by adjusting the extrusion amount in the extrusion molding, and the amount of carnauba wax dispersion added was changed to 2.7 parts by mass.

<Production of temporary support 6>
Temporary Support 6 was produced in the same manner as Temporary Support 1, except that the amount of the carnauba wax dispersion added was changed to 2.7 parts by mass, and the amount of the matting agent (Snowtex XL) added was changed to 2.5 parts by mass.

<Production of temporary support 7>
Temporary support 6 was manufactured by the same procedure as temporary support 1, except that the matting agent (Snowtex XL) was changed to a matting agent (Snowtex XL, Nissan Chemical Co., Ltd., solid content: 40.5 mass%, added amount: 2.95 mass parts) and a matting agent (Aerosil OX50, Nippon Aerosil Co., Ltd., solid content: 10 mass%, form: water dispersion, median diameter: 0.2 μm, added amount: 2.95 mass parts).

<Production of temporary support 8>
Temporary Support 8 was prepared by the same procedure as for Temporary Support 1, except that no carnauba wax dispersion was added.
<Production of temporary support 9>
Temporary Support 9 was manufactured using the same procedure as Temporary Support 1, except that the amount of carnauba wax dispersion added was changed to 21.0 parts by mass, and the matting agent (Snowtex XL) was changed to a matting agent (Snowtex XL, Nissan Chemical Co., Ltd., solid content: 40.5% by mass, added amount: 2.95 parts by mass) and a matting agent (Aerosil OX50, Nippon Aerosil Co., Ltd., solid content: 10% by mass, form: water dispersion, median diameter: 0.2 μm, added amount: 2.95 parts by mass).

<Preparation of Photosensitive Resin Composition>
The components shown in Table 1 were mixed, and then a mixed solvent of methyl ethyl ketone, 1-methoxy-2-propanol, and propylene glycol monomethyl ether acetate (50/25/25, unit: mass%) was added to prepare a photosensitive resin composition (solid content concentration: 25 mass%).

In Table 1, "B-CIM" stands for 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.

Example 1
A photosensitive resin composition was applied to the surface of the base material (polyester film) of the temporary support 1 using a slit nozzle so that the thickness after drying would be 6 μm. The formed coating film of the photosensitive resin composition was dried at 95° C. for 100 seconds to form a photosensitive resin layer. A polyethylene film (Tamapoly Corporation, GF-818, thickness: 19 μm) was pressed onto the surface of the formed photosensitive resin layer as a cover film to prepare a photosensitive transfer material. The obtained photosensitive transfer material was wound up to prepare a roll-shaped photosensitive transfer material.

<Examples 2 to 7 and Comparative Examples 1 to 3>
Photosensitive transfer materials were prepared in the same manner as in Example 1, except that the type of temporary support and the thickness of the photosensitive resin layer were appropriately changed according to the description in Table 2.

<Evaluation>
[Resolution]
A copper layer having a thickness of 200 nm was formed on a polyethylene terephthalate (PET) film having a thickness of 100 μm by sputtering, to prepare a PET substrate with a copper layer. The cover film was peeled off from the photosensitive transfer material, and the photosensitive transfer material and the PET substrate with a copper layer were laminated together by a roll-to-roll method using a vacuum laminator (MCK Corporation, roll temperature: 120° C., linear pressure: 1.0 MPa, linear speed: 0.5 m/min). The layer structure of the obtained laminate was PET film/copper layer/photosensitive resin layer/temporary support. The obtained laminate was pressurized and degassed for 3 hours under conditions of 0.6 MPa and 60° C. using an autoclave device. The photosensitive resin layer was exposed to light using an ultra-high pressure mercury lamp through a line and space pattern mask (the duty ratio was 1:1, and the line width changed stepwise from 1 μm to 20 μm at 1 μm intervals) without peeling off the temporary support. After peeling off the temporary support, the film was developed. Development was performed by shower development for 30 seconds using a 1.0% by mass aqueous sodium carbonate solution at 25°C. The above method was used to determine the exposure dose (hereinafter referred to as the "reference exposure dose") at which the line width of the resin pattern corresponding to the 20 μm line and space pattern of the mask was exactly 20 μm. Next, a resin pattern was formed by the same method as above, except that the photosensitive resin layer was exposed to the reference exposure dose. The resin pattern was observed using a scanning electron microscope (SEM). The minimum line width of the resin pattern without peeling and without residue in the space portion of the resin pattern was evaluated as the resolution. The smaller the value, the better the resolution. The evaluation results are shown in Table 2.

[Adhesion after defoaming treatment]
A copper layer was formed on both sides of a polyethylene terephthalate (PET) film having a thickness of 100 μm by sputtering, thereby preparing a PET substrate with a copper layer. The cover film was peeled off from the photosensitive transfer material, and the photosensitive transfer material and the PET substrate with a copper layer were bonded together by a roll-to-roll method using a vacuum laminator (MCK Corporation, roll temperature: 120° C., linear pressure: 1.0 MPa, linear speed: 0.5 m/min). When the photosensitive transfer material and the PET substrate with a copper layer were bonded together, the photosensitive transfer material was bonded to both sides of the PET substrate with a copper layer. The layer structure of the obtained laminate was temporary support/photosensitive resin layer/copper layer/PET film/copper layer/photosensitive resin layer/temporary support. After the obtained laminate was wound up, it was degassed for 3 hours using an autoclave device under conditions of 0.6 MPa and 60° C. Based on the state of the wound laminate when it was unwound, the adhesiveness of the surface of the temporary support was evaluated according to the following criteria. In the evaluation of adhesiveness, A or B is considered to be acceptable. The evaluation results are shown in Table 2.
A: It is possible to unwind the wound laminate without making any noise.
B: Noise is generated, but the wound laminate can be fed.
C: A loud noise was heard and adhesion marks were observed on the peeled surface (surface of the temporary support).

The properties and average thickness listed in the "Temporary Support" column in Table 2 were measured by the method already described. In Table 2, "heat treatment" refers to the heat treatment at 60°C for 3 hours described in the "Temporary Support" section above. The average thickness of the photosensitive resin layer in Table 2 was measured by the method already described.

The evaluation of "adhesion after degassing treatment" shown in Table 2 indicates that adhesion between laminates (i.e., between temporary supports) is suppressed in Examples 1 to 7 compared to Comparative Examples 1 to 3.

<Formation of Circuit Wiring>
Using each of the photosensitive transfer materials of Examples 1 to 7, circuit wiring was formed according to the following procedure.

(laminate)
A copper layer having a thickness of 200 μm was formed on a copper substrate formed by sputtering copper onto a PET film. The cover film of the photosensitive transfer material was peeled off, and the peeled surface of the photosensitive transfer material was brought into contact with the copper substrate and laminated under the following lamination conditions to obtain a laminate.
-Lamination conditions-
Temperature of copper substrate: 40°C
Temperature of rubber roller: 110°C
Line pressure: 3 N / cm
Conveying speed: 2 m/min

(exposure)
Next, an exposure mask having lines and spaces of multiple widths was vacuum-adhered to the temporary support on the side of the laminate where the photosensitive transfer material was laminated, and the resist pattern was exposed through the exposure mask using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) equipped with an ultra-high pressure mercury lamp, with an exposure amount such that the width of the topmost part of the resist pattern on the side opposite the substrate was the same as the width of the exposed part of the mask.

(developing)
Thereafter, the temporary support was peeled off from the exposed laminate, and the laminate was developed using a 1.0% by mass aqueous solution of sodium carbonate at 26°C for 30 seconds. Then, the laminate was developed using pure water at 26°C for 1.5 times the dissolution time. Then, air was blown onto the surface to remove moisture, and a substrate having a resin pattern was produced. The development and cleaning processes were carried out using a shower-type developer, with a spray pressure of 0.08 MPa.

(Etching and Stripping)
The copper layer of the substrate having the resin pattern was shower etched for 60 seconds using a copper etching solution (Cu-02, manufactured by Kanto Chemical Co., Ltd.) at 25° C. Then, the resin pattern was removed by shower stripping for 2 minutes using a stripping solution (KP-301, manufactured by Kanto Chemical Co., Ltd.) at 60° C. to obtain a circuit wiring.

The circuit wiring obtained using each of the photosensitive transfer materials of Examples 1 to 7 was observed with an optical microscope, and it was confirmed that there were no chips or other defects in the wiring.

<Preparation of Photosensitive Resin Composition>
Photosensitive resin compositions A-1 to A-10 having the compositions shown in the following table were prepared.

(Compound B)
The structure of Compound B is shown below.

(Compound C)
The structure of Compound C is shown below.

(Preparation of P-1 solution)
As the P-1 solution, a 36.3 mass % solids solution of polymer P-1 having the following structure (solvent: propylene glycol monomethyl ether acetate) was used. Polymer P-1 is an alkali-soluble resin. In polymer P-1, the numbers on the bottom right of each structural unit indicate the content ratio (mol %) of each structural unit. The P-1 solution was prepared by the polymerization process and addition process shown below.

- Polymerization process -
Into a 2000 mL flask, propylene glycol monomethyl ether acetate (manufactured by Sanwa Chemical Industry Co., Ltd., product name PGM-Ac) (60 g) and propylene glycol monomethyl ether (manufactured by Sanwa Chemical Industry Co., Ltd., product name PGM) (240 g) were introduced. The obtained liquid was heated to 90° C. while being stirred at a stirring speed of 250 rpm (rounds per minute; the same applies below).
In preparing the dropping liquid (1), methacrylic acid (manufactured by Mitsubishi Rayon Co., Ltd., product name: Acryester M) (107.1 g), methyl methacrylate (manufactured by Mitsubishi Gas Chemical Company, Inc., product name: MMA) (5.46 g), and cyclohexyl methacrylate (manufactured by Mitsubishi Gas Chemical Company, Inc., product name: CHMA) (231.42 g) were mixed and diluted with PGM-Ac (60 g) to obtain the dropping liquid (1).
The dropping liquid (2) was prepared by dissolving dimethyl 2,2'-azobis(2-methylpropionate) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., product name V-601) (9.637 g) in PGM-Ac (136.56 g).
Droplet liquid (1) and droplet liquid (2) were simultaneously dropped into the above-mentioned 2000 mL flask (specifically, the 2000 mL flask containing the liquid heated to 90° C.) over a period of 3 hours.
Next, the container for the dropping liquid (1) was washed with PGM-Ac (12 g), and the washing liquid was dropped into the 2000 mL flask. Next, the container for the dropping liquid (2) was washed with PGM-Ac (6 g), and the washing liquid was dropped into the 2000 mL flask. During these drops, the reaction liquid in the 2000 mL flask was kept at 90° C. and stirred at a stirring speed of 250 rpm. Furthermore, as a post-reaction, the reaction liquid was stirred at 90° C. for 1 hour.
To the reaction solution after the post-reaction, V-601 (2.401 g) was added as the first additional addition of the initiator. Furthermore, the container of V-601 was washed with PGM-Ac (6 g), and the washings were introduced into the reaction solution. Then, the mixture was stirred at 90° C. for 1 hour.
Next, V-601 (2.401 g) was added to the reaction solution as the second additional addition of the initiator. Furthermore, the container for V-601 was washed with PGM-Ac (6 g), and the washings were introduced into the reaction solution. Thereafter, the mixture was stirred at 90° C. for 1 hour.
Next, V-601 (2.401 g) was added to the reaction solution as the third additional addition of the initiator. Furthermore, the container for V-601 was washed with PGM-Ac (6 g), and the washings were introduced into the reaction solution. Thereafter, the mixture was stirred at 90° C. for 3 hours.

-Additional process-
After stirring at 90°C for 3 hours, PGM-Ac (178.66 g) was introduced into the reaction solution. Next, tetraethylammonium bromide (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) (1.8 g) and hydroquinone monomethyl ether (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) (0.8 g) were added to the reaction solution. Furthermore, each container was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction solution. Then, the temperature of the reaction solution was raised to 100°C.
Next, glycidyl methacrylate (product name: Blenmer G, manufactured by NOF Corporation) (76.03 g) was dropped into the reaction solution over 1 hour. The Blenmer G container was washed with PGM-Ac (6 g), and the washings were introduced into the reaction solution. After this, the mixture was stirred at 100° C. for 6 hours as an addition reaction.
Next, the reaction solution was cooled and filtered through a mesh filter (100 mesh) for removing dust to obtain a solution of polymer P-1 (1158 g) (solid content concentration 36.3% by mass). The weight average molecular weight of the obtained polymer P-1 was 27000, the number average molecular weight was 15000, and the acid value was 95 mgKOH/g. The structure of polymer P-1 is shown below. The molar ratio of the repeating units in the formula was 51.5:2:26.5:20, starting from the repeating unit on the left side.

(Preparation of P-2 solution)
A 36.5% by mass solids solution of polymer P-2 was prepared as P-2 solution according to the following method. Polymer P-2 is an alkali-soluble resin. 82.4 g of propylene glycol monomethyl ether was charged into a flask and heated to 90° C. under a nitrogen stream. A solution of 38.4 g of styrene, 30.1 g of dicyclopentanyl methacrylate, and 34.0 g of methacrylic acid dissolved in 20 g of propylene glycol monomethyl ether, and a solution of 5.4 g of polymerization initiator V-601 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) dissolved in 43.6 g of propylene glycol monomethyl ether acetate were simultaneously dropped into this liquid over 3 hours. After the dropwise addition, 0.75 g of V-601 was added three times every hour. The mixture was then allowed to react for another 3 hours. The mixture was then diluted with 58.4 g of propylene glycol monomethyl ether acetate and 11.7 g of propylene glycol monomethyl ether. The reaction solution was heated to 100°C under an air stream, and 0.53 g of tetraethylammonium bromide and 0.26 g of p-methoxyphenol were added. 25.5 g of glycidyl methacrylate (Blenmer GH manufactured by NOF Corporation) was added dropwise over 20 minutes. This was reacted at 100°C for 7 hours to obtain a solution of polymer P-2. The solid content concentration of the obtained solution was 36.5% by mass. For polymer P-2, the weight average molecular weight in standard polystyrene equivalent in GPC was 17000, the dispersity was 2.4, and the acid value was 95 mgKOH/g. The amount of residual monomer measured using gas chromatography was less than 0.1% by mass relative to the solid content of polymer P-2 for each monomer. The structure of polymer P-2 is shown below. The molar ratio of the repeating units in the formula was 41.0:15.2:23.9:19.9, starting from the repeating unit on the left side.

(Preparation of P-3 solution)
A 36.2% by mass solids solution of polymer P-3 was prepared as P-3 solution according to the following method. Polymer P-3 is an alkali-soluble resin. 113.5 g of propylene glycol monomethyl ether was charged into a flask and heated to 90° C. under a nitrogen stream. A solution of 172 g of styrene, 4.7 g of methyl methacrylate, and 112.1 g of methacrylic acid dissolved in 30 g of propylene glycol monomethyl ether, and a solution of 27.6 g of polymerization initiator V-601 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) dissolved in 57.7 g of propylene glycol monomethyl ether were simultaneously dropped into this liquid over 3 hours. After the dropwise addition was completed, 2.5 g of V-601 was added three times every hour. The mixture was then allowed to react for another 3 hours. The mixture was then diluted with 160.7 g of propylene glycol monomethyl ether acetate and 233.3 g of propylene glycol monomethyl ether. The reaction solution was heated to 100°C under an air stream, and 1.8 g of tetraethylammonium bromide and 0.86 g of p-methoxyphenol were added. 71.9 g of glycidyl methacrylate (Blenmer G manufactured by NOF Corporation) was added dropwise over 20 minutes. This was reacted at 100°C for 7 hours to obtain a solution of polymer P-3. The solid content concentration of the obtained solution was 36.2%. For polymer P-3, the weight average molecular weight in standard polystyrene equivalent in GPC was 18000, the dispersity was 2.3, and the acid value was 124 mgKOH/g. The amount of residual monomer measured using gas chromatography was less than 0.1% by mass relative to the solid content of polymer P-3 for each monomer. The structure of polymer P-3 is shown below. The molar ratio of the repeating units in the formula was 55.1:26.5:1.6:16.8, starting from the repeating unit on the left side.

(Preparation of P-4 solution)
In the synthesis of polymer P-3, the type and amount of monomer were changed to prepare a 36.2 mass% solids solution of polymer P-4 (solvent: propylene glycol monomethyl ether acetate) as P-4 solution. Polymer P-4 is an alkali-soluble resin. The weight average molecular weight of the obtained polymer P-4 was 18,000, the dispersity was 2.3, and the acid value was 124 mgKOH/g. The structure of polymer P-4 is shown below. The molar ratio of the repeating units in the formula below was 55.1:24.6:1.6:17.0:1.7, starting from the repeating unit on the left side.

<Preparation of Refractive Index Adjusting Layer Forming Composition>
Next, compositions B-1 to B-4 for forming a refractive index adjusting layer having the compositions shown in the following table were prepared, respectively. The numerical values in the following table represent "parts by mass."

(Polymer A)
Polymer A in the above table was synthesized as follows.
1-Methoxypropanol (manufactured by Tokyo Chemical Industry Co., Ltd.) (270.0 g) was introduced into a 1 L three-neck flask, and the temperature was raised to 70 ° C. under a nitrogen stream while stirring. Meanwhile, allyl methacrylate (45.6 g) (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.) and methacrylic acid (14.4 g) (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.) were dissolved in 1-methoxypropanol (manufactured by Tokyo Chemical Industry Co., Ltd.) (270.0 g), and 3.94 g of V-65 (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.) was further dissolved to prepare a dropping solution, and the dropping solution was dropped into the flask over 2.5 hours. The reaction was carried out while maintaining the stirring state for 2.0 hours.
After that, the temperature was returned to room temperature, and the mixture was dropped into stirred ion-exchanged water (2.7 L) to perform reprecipitation, and a suspension was obtained. The suspension was filtered by introducing it into a Nutsche with filter paper, and the filtrate was further washed with ion-exchanged water to obtain a wet powder. The mixture was subjected to air drying at 45°C, and it was confirmed that the weight was constant, and polymer A was obtained as a powder with a yield of 70%.
The resulting polymer A had a methacrylic acid/allyl methacrylate ratio of 76% by mass/24% by mass, and a weight average molecular weight Mw of 38,000.

<Examples 8 to 23>
On the temporary support 1, using a slit nozzle, the coating amount was adjusted to a coating amount that would result in a film thickness after drying of the thickness shown in the table below, and any one of the photosensitive resin compositions A-1 to A-10 listed in the table below was applied to form a photosensitive resin layer. After the solvent was evaporated in a drying zone at 100 ° C., using a slit nozzle, any one of the refractive index adjustment layer forming compositions B-1 to B-4 in the combination in the table below was applied on the photosensitive resin layer with the coating amount adjusted to an amount that would result in a film thickness after drying of the film thickness shown in the table below, and then dried at a drying temperature of 80 ° C. to form a refractive index adjustment layer. A protective film (Lumirror 16KS40, manufactured by Toray Industries, Inc.) was pressed onto the refractive index adjustment layer to prepare photosensitive transfer materials 1 to 16.

<Evaluation>
[Resolution]
A copper layer having a thickness of 200 nm was formed on a polyethylene terephthalate (PET) film having a thickness of 100 μm by sputtering, to prepare a PET substrate with a copper layer. The protective film was peeled off from the photosensitive transfer material, and the photosensitive transfer material and the PET substrate with a copper layer were laminated together by a roll-to-roll method using a vacuum laminator (MCK Corporation, roll temperature: 120° C., linear pressure: 1.0 MPa, linear speed: 0.5 m/min). The layer structure of the obtained laminate was PET film/copper layer/refractive index adjustment layer/photosensitive resin layer/temporary support. The obtained laminate was pressurized and degassed for 3 hours under conditions of 0.6 MPa and 60° C. using an autoclave device. The photosensitive resin layer was exposed to light using an ultra-high pressure mercury lamp through a line and space pattern mask (the duty ratio was 1:1, and the line width changed stepwise from 5 μm to 100 μm at 5 μm intervals) without peeling off the temporary support. After peeling off the temporary support, the film was developed. Development was performed by shower development for 45 seconds using a 1.0% by mass aqueous solution of sodium carbonate at 33°C. The above method was used to determine the exposure dose (hereinafter referred to as the "reference exposure dose") at which the line width of the resin pattern corresponding to the 70 μm line and space pattern of the mask was exactly 70 μm. Next, a resin pattern was formed by the same method as above, except that the photosensitive resin layer was exposed to the reference exposure dose. The resin pattern was observed using a scanning electron microscope (SEM). The minimum line width of the resin pattern without peeling off and without residue in the space portion of the resin pattern was evaluated as the resolution. The smaller the value, the better the resolution. The evaluation results are shown in Table 6.

[Adhesion after defoaming treatment]
The adhesiveness after the degassing treatment was evaluated by the same method as that of Example 1. The evaluation results are shown in Table 6.

The disclosures of Japanese Patent Application No. 2020-061101, filed on March 30, 2020, Japanese Patent Application No. 2020-172155, filed on October 12, 2020, and Japanese Patent Application No. 2020-207812, filed on December 15, 2020, are incorporated herein by reference in their entirety. All documents, patent applications, and technical standards described herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

10: Temporary support 12: Photosensitive resin layer 14: Cover film 100: Photosensitive transfer material DL: Alignment frame G: Non-image area (light-shielding area)
SL: Non-image area (light-shielding area)

Claims (12)

A temporary support;
A photosensitive resin layer is provided on the temporary support,
the temporary support has a base material and a coating layer containing a wax,
A photosensitive resin layer is provided on the base material of the temporary support,
A photosensitive transfer material, in which the rate of change in dynamic friction coefficient against stainless steel of the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 0% to 10% before and after heat treatment at 60°C for 3 hours, and the arithmetic mean roughness Ra of the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 10 nm or less. The photosensitive transfer material according to claim 1, wherein the coefficient of dynamic friction of the surface of the temporary support opposite to the surface facing the photosensitive resin layer against stainless steel is 0.50 or less before heat treatment at 60°C for 3 hours. The photosensitive transfer material according to claim 1 or 2, wherein the coefficient of dynamic friction of the surface of the temporary support opposite to the surface facing the photosensitive resin layer against stainless steel is 0.10 or more before heat treatment at 60°C for 3 hours. The photosensitive transfer material according to any one of claims 1 to 3, wherein the average thickness of the temporary support is 20 μm or less. The photosensitive transfer material according to any one of claims 1 to 4, wherein the average thickness of the photosensitive resin layer is 6 μm or less. The photosensitive transfer material according to any one of claims 1 to 5, wherein the haze of the temporary support is less than 1.00%. The photosensitive transfer material according to any one of claims 1 to 6, wherein the peel strength of the temporary support is 0.05 mN/m or more. The photosensitive transfer material according to any one of claims 1 to 7, wherein the arithmetic mean roughness Ra of the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 5 nm or less. A step of laminating the photosensitive transfer material according to any one of claims 1 to 8 and a substrate, and disposing a photosensitive resin layer on the substrate;
A step of pattern-exposing the photosensitive resin layer;
developing the photosensitive resin layer to form a resin pattern;
A method for producing a resin pattern comprising the steps of: A step of bonding the photosensitive transfer material according to any one of claims 1 to 8 to a substrate having a conductive layer, and disposing a photosensitive resin layer on the substrate;
A step of pattern-exposing the photosensitive resin layer;
developing the photosensitive resin layer to form a resin pattern;
forming a circuit wiring by etching the conductive layer in an area where the resin pattern is not disposed;
A method for manufacturing circuit wiring comprising the steps of: a substrate and a coating layer containing wax on a surface of the substrate opposite to a surface facing the photosensitive resin layer ;
A temporary support for a photosensitive transfer material, in which the rate of change in dynamic friction coefficient against stainless steel before and after heat treatment at 60°C for 3 hours is 0% to 10%, and the arithmetic mean roughness Ra of the surface of the coating layer opposite to the surface facing the substrate is 10 nm or less. 12. The temporary support for a photosensitive transfer material according to claim 11, wherein the surface of the covering layer opposite to the surface facing the base material has an arithmetic mean roughness Ra of 5 nm or less.