JP7555830B2 - Bending device and method for rigid-flex multilayer printed wiring boards - Google Patents
Bending device and method for rigid-flex multilayer printed wiring boards Download PDFInfo
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- JP7555830B2 JP7555830B2 JP2021002438A JP2021002438A JP7555830B2 JP 7555830 B2 JP7555830 B2 JP 7555830B2 JP 2021002438 A JP2021002438 A JP 2021002438A JP 2021002438 A JP2021002438 A JP 2021002438A JP 7555830 B2 JP7555830 B2 JP 7555830B2
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- 238000005452 bending Methods 0.000 title claims description 73
- 238000000034 method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 44
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 6
- 229910001315 Tool steel Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 2
- -1 SKS3 Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
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Description
本発明は、硬質なリジッド基板部と屈曲可能なフレキシブル基板部とを備えたリジッド・フレックス多層プリント配線板、特に多層リジッド基板を切削加工し、当該切削加工で薄層化された部分をフレキシブル基板部として利用するセミフレックスタイプのリジッド・フレックス多層プリント配線板の折り曲げ装置及び折り曲げ方法に関する。 The present invention relates to a bending device and method for a rigid-flex multilayer printed wiring board that has a hard rigid board portion and a bendable flexible board portion, in particular a semi-flex type rigid-flex multilayer printed wiring board in which the multilayer rigid board is cut and the thinned portion is used as the flexible board portion.
近年、機器の小型化、小型化による低コスト化が進められている。車載機器においても例外ではなく、その流れがある。
このような流れの中、最近では、プリント配線板を折り曲げることでプリント配線板の専有面積を減らし、機器を小型化したいという問い合わせが増えてきている。折り曲げ可能なプリント配線板としては、リジッド・フレックス多層プリント配線板がある。
しかし、従来のリジッド・フレックス多層プリント配線板は、屈曲可能なポリイミド樹脂から成るフレキシブル基材を利用したフレキシブル基板部を有しており、容易に折り曲げることができるが、積層工程での基材の熱収縮の差に起因して、貫通めっきスルーホールの接続信頼性が劣るという欠点を有していた。そのため、車載機器の場合、車載カメラ用としては用いられているものの、耐熱性、かつ高信頼性求められるものにおいては、適用が困難であった。
In recent years, there has been a trend toward downsizing devices and reducing costs through miniaturization. In-vehicle devices are no exception to this trend.
In light of this trend, there has been an increase in inquiries recently about reducing the footprint of printed wiring boards by folding them, thereby making it possible to miniaturize devices. An example of a foldable printed wiring board is the rigid-flex multilayer printed wiring board.
However, conventional rigid-flex multilayer printed wiring boards have a flexible substrate made of a flexible base material made of bendable polyimide resin, and can be easily folded, but have the disadvantage that the connection reliability of the through-hole plated through holes is poor due to the difference in thermal contraction of the base material during the lamination process. Therefore, in the case of in-vehicle equipment, although it is used for in-vehicle cameras, it is difficult to apply it to devices that require heat resistance and high reliability.
そこで、多層プリント配線板の一部をザグリ加工により薄層化する、あるいはリジッド基板部を刳り貫き加工することにより薄層化し、この部分を屈曲させるというリジッド・フレックス多層プリント配線板（以降これを「セミフレックス基板」と呼んで説明を進めていく）の適用が検討されている（例えば、特許文献１）。
しかし、セミフレックス基板は、リジッド基板部を薄層化させその部分を屈曲させるため、以下のような問題があった。
すなわち、基板中央部を薄層化した弱い部分から曲がり、中央部で曲がるとは限らず、屈曲部の位置が安定しない。また、薄層化した部分がある程度の剛性を持つため、曲がった部分に力が集中し、薄層化した部分全体で曲がるのではなく、部分的に曲がりその角度が鋭角になってしまい、屈曲部の角度が鋭角になることがあった。
更に、実用上、基板を屈曲する場合は、片側の基板を固定し、フリーな方の基板を動かし薄層部を屈曲するが、その場合、リジッド基板部とフレキシブル基板部の境界部から曲がる可能性が高く、その境界部分に力が集中し基板が破損する恐れがあった。
In response to this, the use of rigid-flex multilayer printed wiring boards (hereinafter, this will be referred to as a "semi-flex board") has been considered, in which part of a multilayer printed wiring board is thinned by countersinking, or the rigid board part is thinned by hollowing out the board, and this part is then bent (for example, Patent Document 1).
However, semi-flex boards have the following problems because the rigid board portion is thinned and bent.
In other words, the board bends from the weak part where the thickness is reduced in the center, and does not necessarily bend in the center, so the position of the bent part is unstable. Also, because the thinned part has a certain degree of rigidity, the force is concentrated in the bent part, and instead of bending the entire thinned part, the bent part bends only partially at an acute angle, which sometimes results in an acute angle at the bent part.
Furthermore, in practice, when bending a substrate, one side of the substrate is fixed and the free substrate is moved to bend the thin layer portion. In that case, however, there is a high possibility that bending will occur from the boundary between the rigid substrate portion and the flexible substrate portion, and force will be concentrated at that boundary portion, which may damage the substrate.
本発明は、上記の如き従来の問題に鑑みてなされたものであり、フレキシブル基板部を硬質な絶縁樹脂層で形成した場合においても、フレキシブル基板部の破損を抑制できるセミフレックスタイプのリジッド・フレックス多層プリント配線板の折り曲げ装置及び折り曲げ方法を提供することを課題とする。 The present invention was made in consideration of the above-mentioned problems of the prior art, and aims to provide a bending device and method for semi-flex type rigid-flex multilayer printed wiring boards that can prevent damage to the flexible board section even when the flexible board section is formed from a hard insulating resin layer.
本発明者は、上記課題を解決すべく鋭意検討を重ねた結果、フレキシブル基板部側に円弧面、及びリジッド基板部側に平坦面を有する屈曲加工部材を用いて、フレキシブル基板部を当該屈曲加工部材の円弧面の円弧に沿って折り曲がるように折り曲げれば、極めて良い結果が得られることを見出し、本発明を完成するに至った。 After extensive research to solve the above problem, the inventors discovered that extremely good results could be obtained by using a bending member that has an arcuate surface on the flexible board side and a flat surface on the rigid board side, and bending the flexible board along the arc of the arcuate surface of the bending member, thus completing the present invention.
すなわち、本発明は、リジッド基板部と屈曲可能なフレキシブル基板部とを備えたリジッド・フレックス多層プリント配線板を折り曲げる折り曲げ装置であって、
一方のリジッド基板部を固定する基準テーブルと、他方のリジッド基板部を固定する前記基準テーブルと略同一の高さの可動テーブルと、前記基準テーブルの上方にフレキシブル基板部を介して配置される屈曲加工部材とを備え、
前記屈曲加工部材は、フレキシブル基板部側に円弧面、及びリジッド基板部側に平坦面を有することを特徴とする折り曲げ装置により上記課題を解決したものである。
また、本発明は、リジッド基板部と屈曲可能なフレキシブル基板部とを備えたリジッド・フレックス多層プリント配線板を折り曲げる方法であって、
一方のリジッド基板部を基準テーブルに固定すると共に、他方のリジッド基板部を前記基準テーブルと略同一の高さの可動テーブルに固定する工程と、フレキシブル基板部側に円弧面、及びリジッド基板部側に平坦面を有する屈曲加工部材を、前記基準テーブル上のリジッド基板部とフレキシブル基板部の境界部分に押し当てる工程と、前記可動テーブルを、フレキシブル基板部が屈曲加工部材の円弧面の円弧に沿って折り曲がるように移動させる工程とを有することを特徴とするリジッド・フレックス多層プリント配線板の折り曲げ方法により上記課題を解決したものである。
That is, the present invention is a bending device for bending a rigid-flex multilayer printed wiring board having a rigid substrate portion and a bendable flexible substrate portion, comprising:
a reference table for fixing one of the rigid board parts, a movable table having substantially the same height as the reference table for fixing the other of the rigid board parts, and a bending member disposed above the reference table via a flexible board part,
The above-mentioned problems are solved by a bending device in which the bending processed member has an arcuate surface on the flexible board portion side and a flat surface on the rigid board portion side.
The present invention also provides a method for bending a rigid-flex multilayer printed wiring board having a rigid substrate portion and a bendable flexible substrate portion, the method comprising the steps of:
The above-mentioned problems are solved by a method for bending a rigid-flex multilayer printed wiring board, comprising the steps of: fixing one rigid board portion to a reference table and fixing the other rigid board portion to a movable table of approximately the same height as the reference table; pressing a bending member having an arcuate surface on the flexible board portion side and a flat surface on the rigid board portion side against the boundary between the rigid board portion and the flexible board portion on the reference table; and moving the movable table so that the flexible board portion is bent along the arc of the arcuate surface of the bending member.
本発明のフレキシブル基板部側に円弧面を有する屈曲加工部材を用い、フレキシブル基板部が当該屈曲加工部材の円弧面の円弧に沿って折り曲がるようにすれば、フレキシブル基板部を折り曲げる際に、リジッド基板部とフレキシブル基板部の境界部分に力が集中することを回避できるので、フレキシブル基板部を硬質な絶縁樹脂層で形成したセミフレックスタイプのリジッド・フレックス多層プリント配線板でも、フレキシブル基板部に破損が発生することを抑制することが可能となる。また、フレキシブル基板部全体で、中央部で曲がるため、屈曲部の角度が鋭角になることもない。 By using a bending member having an arcuate surface on the flexible board section side of the present invention and bending the flexible board section along the arc of the arcuate surface of the bending member, it is possible to avoid concentration of force at the boundary between the rigid board section and the flexible board section when bending the flexible board section, and therefore it is possible to prevent damage to the flexible board section even in a semi-flex type rigid-flex multilayer printed wiring board in which the flexible board section is formed from a hard insulating resin layer. In addition, because the entire flexible board section bends in the center, the angle of the bend does not become acute.
以下本発明の実施の形態を図面と共に説明する。 The following describes an embodiment of the present invention with reference to the drawings.
始めに、リジッド・フレックス多層プリント配線板について図１を用いて説明する。
図１において、Ｐはリジッド・フレックス多層プリント配線板で、硬質のリジッド基板部Ｒと折り曲げ可能なフレキシブル基板部Ｆとから構成されている。
当該リジッド基板部Ｒは、少なくとも、貫通めっきスルーホール１１を備え、その絶縁基材１３は、ガラスクロス１２に樹脂を含浸せしめたものの積層体から成ると共に、当該積層工程の熱プレスにより硬化されている。
また、フレキシブル基板部Ｆも、リジッド基板部Ｒと同様に、絶縁基材１３は、ガラスクロス１２に樹脂を含浸せしめ、予め硬化したものが用いられ、更にそのルーター加工による切削加工、あるいは刳り貫き加工により、折り曲げ可能な厚みまで薄く加工されている。
このように、全層に絶縁基材１３を使用すると、製造工程での基材の熱収縮の差が無くなるため、高密度で精度の高いプリント配線板を製造することが可能となる。特に、車載基板で要求される剛性を保つためには、フレキシブル基板部Ｆにおいても絶縁基材１３を使用することが効果的である。さらに、リジッド・フレックス多層プリント配線板Ｐを、フレキシブル基板部Ｆを中心に折り曲げ筐体に収納し固定する際の横の捩れに対しても強く、絶縁基板上の導体回路１５が断線するのを防ぐ効果がある。
また、フレキシブル基板部Ｆの薄層化加工をルーター加工により行うと、刳り貫き加工と比べて、１０μｍから３０μｍ程度の凹凸がフレキシブル基板の切削加工面１４側に形成されるため、後述する本発明の折り曲げ装置及び折り曲げ方法を利用して折り曲げる際にフレキシブル基板部に破損が発生しにくくなる。
First, a rigid-flex multilayer printed wiring board will be described with reference to FIG.
In FIG. 1, P denotes a rigid-flex multilayer printed wiring board, which is composed of a hard rigid board portion R and a bendable flexible board portion F.
The rigid board portion R has at least plated through holes 11, and its insulating base material 13 is made of a laminate of glass cloth 12 impregnated with resin, and is hardened by the heat pressing in the lamination process.
As with the rigid board section R, the insulating base material 13 of the flexible board section F is made of glass cloth 12 that has been impregnated with resin and pre-cured, and is then thinned by cutting using a router or hollowing out to a thickness that allows it to be bent.
In this way, by using insulating substrate 13 for all layers, there is no difference in thermal shrinkage of the substrate during the manufacturing process, making it possible to manufacture a printed wiring board with high density and high precision. In particular, in order to maintain the rigidity required for an in-vehicle board, it is effective to use insulating substrate 13 also for flexible substrate portion F. Furthermore, rigid-flex multilayer printed wiring board P is resistant to lateral twisting when it is folded around flexible substrate portion F and stored in a housing and fixed therein, and has the effect of preventing breakage of conductor circuit 15 on the insulating substrate.
Furthermore, when the thinning process of the flexible substrate portion F is performed by router processing, unevenness of about 10 μm to 30 μm is formed on the cutting surface 14 of the flexible substrate, compared to hollowing out processing, so that the flexible substrate portion is less likely to be damaged when bending using the bending device and bending method of the present invention described below.
続いて、リジッド・フレックス多層プリント配線板の折り曲げ装置について図２を用いて説明する。
図２において、２０は折り曲げ装置で、当該折り曲げ装置２０は、一方のリジッド基板部２１を固定する基準テーブル２２と、他方のリジッド基板部２３を固定する基準テーブル２２と略同一の高さの可動テーブル２４と、基準テーブル２２の上方にフレキシブル基板部を２５介して配置される屈曲加工部材２６とから構成されている。
Next, a bending device for a rigid-flex multilayer printed wiring board will be described with reference to FIG.
In Figure 2, reference numeral 20 denotes a bending device, which is composed of a reference table 22 for fixing one rigid substrate portion 21, a movable table 24 of approximately the same height as the reference table 22 for fixing the other rigid substrate portion 23, and a bending processing member 26 arranged above the reference table 22 via a flexible substrate portion 25.
当該基準テーブル２２、可動テーブル２４は、そのテーブル上にリジッド・フレックス多層プリント配線板のリジッド基板部２１、２３をそれぞれ固定できるものであれば特に制限されない。
当該基準テーブル２２には、リジッド基板部２１を固定する際にリジッド基板部２１がズレないように、突き当て部（図示なし）を設けてもよい。また、当該基準テーブル２２と可動テーブル２４は、リジッド基板部２１、２３の固定のし易さを考慮して、磁石を備えていてもよい。
当該可動テーブル２４の高さは、基準テーブル２２と略同一の高さである。この略同一の高さは、基準テーブル２２の高さと可動テーブルの高さとの差が０～０．５ｍｍである。
これ以上基準テーブル２２の高さと可動テーブルの高さとの差があると、屈曲加工部材２６の円弧面に沿って折り曲げることが困難となる場合がある。
There are no particular limitations on the reference table 22 and the movable table 24 as long as the rigid board portions 21 and 23 of the rigid-flex multilayer printed wiring board can be fixed onto the tables, respectively.
The reference table 22 may be provided with an abutment portion (not shown) so that the rigid board portion 21 does not shift when the rigid board portion 21 is fixed. The reference table 22 and the movable table 24 may be provided with magnets in consideration of ease of fixing the rigid board portions 21 and 23.
The height of the movable table 24 is substantially the same as that of the reference table 22. This substantially same height means that the difference between the height of the reference table 22 and the height of the movable table is 0 to 0.5 mm.
If the difference in height between the reference table 22 and the movable table is greater than this, it may become difficult to bend the bent member 26 along the arc surface.
図２に示すように、当該屈曲加工部材２６は、フレキシブル基板部２５側に円弧面、及びリジッド基板部２１側に平坦面を有する。その結果、フレキシブル基板部２５を当該円弧面の円弧に沿って折り曲げることができ、リジッド基板部２１とフレキシブル基板部２５の境界部分２７に力が集中することを回避できるので、フレキシブル基板部２５に破損が発生することを抑制することできる。
当該屈曲加工部材２６の円弧面は、フレキシブル基板部２５を折り曲げた際のフレキシブル基板部２５の曲率半径に対応する曲率半径を有することが、フレキシブル基板部２５全体を、またフレキシブル基板部２５の中央部で折り曲げる上で望ましい。
例えば、フレキシブル基板部２５の長さが１０ｍｍで、且つフレキシブル基板部２５の折り曲げ角度が１８０度である場合、フレキシブル基板部２５を折り曲げた際のフレキシブル基板部２５の曲率半径はＲ＝３．１８であり、この時の屈曲加工部材２６の円弧面の曲率半径はＲ＝３．０とする。
また、フレキシブル基板部２５の長さが１５ｍｍで、且つフレキシブル基板部２５の折り曲げ角度が１８０度である場合、フレキシブル基板部２５を折り曲げた際のフレキシブル基板部２５の曲率半径はＲ＝４．７８であり、この時の屈曲加工部材２６の円弧面の曲率半径はＲ＝４．５とする。
2, the bending processed member 26 has an arcuate surface on the flexible board portion 25 side and a flat surface on the rigid board portion 21 side. As a result, the flexible board portion 25 can be bent along the arc of the arcuate surface, and it is possible to prevent force from concentrating on the boundary portion 27 between the rigid board portion 21 and the flexible board portion 25, thereby suppressing damage to the flexible board portion 25.
It is desirable for the arcuate surface of the bending processed member 26 to have a radius of curvature corresponding to the radius of curvature of the flexible substrate portion 25 when the flexible substrate portion 25 is bent, in order to bend the entire flexible substrate portion 25 and at the center of the flexible substrate portion 25.
For example, if the length of flexible board portion 25 is 10 mm and the bending angle of flexible board portion 25 is 180 degrees, the radius of curvature of flexible board portion 25 when flexible board portion 25 is bent is R = 3.18, and the radius of curvature of the arc surface of bending processed member 26 at this time is R = 3.0.
Furthermore, when the length of flexible board portion 25 is 15 mm and the bending angle of flexible board portion 25 is 180 degrees, the radius of curvature of flexible board portion 25 when flexible board portion 25 is bent is R = 4.78, and the radius of curvature of the arc surface of bending processed member 26 at this time is R = 4.5.
屈曲加工部材２６には、極力変形しないことが必要である。材料的には、ＳＫ１０５（旧ＳＫ３）などの炭素工具鋼、ＳＫＳ３などの合金工具鋼、ＳＵＳ４４０Ｃなどのマルテンサイト系ステンレス鋼を用いることができる。さらに、その硬度を上げるために焼入れ戻しを行った炭素工具鋼、合金工具鋼、マルテンサイト系ステンレス鋼を用いることが望ましい。 It is necessary that the bent member 26 does not deform as much as possible. In terms of materials, carbon tool steel such as SK105 (formerly SK3), alloy tool steel such as SKS3, and martensitic stainless steel such as SUS440C can be used. Furthermore, it is preferable to use carbon tool steel, alloy tool steel, or martensitic stainless steel that has been quenched and tempered to increase its hardness.
この実施の形態においては、断面視で半円状の屈曲加工部材２６を示しているが、その形状は断面視で扇形であれば特に限定されず、フレキシブル基板部２５の折り曲げ角度に応じて、例えば、断面視で中心角９０度の扇形の形状等任意に選択することができる。 In this embodiment, the bent processed member 26 is shown to have a semicircular cross section, but the shape is not particularly limited as long as it is fan-shaped in cross section, and can be arbitrarily selected according to the bending angle of the flexible board portion 25, for example, a fan-shaped cross section with a central angle of 90 degrees.
続いて、折り曲げ装置を用いて、リジッド・フレックス多層プリント配線板を折り曲げる方法について図３（ａ）、（ｂ）を用いて説明する。
先ず、一方のリジッド基板部２１を基準テーブル２２に固定すると共に、他方のリジッド基板部２３を基準テーブル２１と略同一の高さの可動テーブル２４に固定する（図２）。リジッド基板部２１、２３を各テーブルに固定する方法としては特に限定されないが、リジッド基板部２１、２３の固定のし易さを考慮して、磁石を用いることが望ましい。例えば、基準テーブル２２と可動テーブル２４に磁石を備え、当該磁石でリジッド基板部２１、２３の配線回路を吸着、固定する。
Next, a method for bending a rigid-flex multilayer printed wiring board using a bending device will be described with reference to FIGS.
First, one rigid board portion 21 is fixed to a reference table 22, and the other rigid board portion 23 is fixed to a movable table 24 that is at approximately the same height as the reference table 21 (FIG. 2). There are no particular limitations on the method for fixing the rigid board portions 21, 23 to the respective tables, but it is preferable to use magnets in consideration of the ease of fixing the rigid board portions 21, 23. For example, magnets are provided on the reference table 22 and the movable table 24, and the wiring circuits of the rigid board portions 21, 23 are attracted and fixed by the magnets.
次に、図３（ａ）に示すように、フレキシブル基板部２５側に円弧面、及びリジッド基板部２１側に平坦面を有する屈曲加工部材２６の端を、基準テーブル２２上のリジッド基板部２１とフレキシブル基板部２５との境界部分２７に押し当てる。 Next, as shown in FIG. 3(a), the end of the bent member 26, which has an arcuate surface on the flexible board section 25 side and a flat surface on the rigid board section 21 side, is pressed against the boundary portion 27 between the rigid board section 21 and the flexible board section 25 on the reference table 22.
次に、図３（ａ）～（ｂ）に示すように、可動テーブル２４を、フレキシブル基板部２５が屈曲加工部材２６の円弧面の円弧に沿って折り曲がるように移動させることによって、フレキシブル基板部２５を折り曲げる。フレキシブル基板部２５が徐々に折り曲がるように可動テーブル２４を移動させることが、フレキシブル基板部の破損を抑制する上で望ましい。 Next, as shown in Figures 3(a)-(b), the movable table 24 is moved so that the flexible board section 25 bends along the arc of the arc surface of the bending member 26, thereby bending the flexible board section 25. It is desirable to move the movable table 24 so that the flexible board section 25 bends gradually in order to prevent damage to the flexible board section.
ここで、リジッド基板部２１、２３の絶縁基材の厚さによっては、可動テーブル２４を、フレキシブル基板部２５が屈曲加工部材２６の円弧面の円弧に沿って折り曲がるように移動させる際に、リジッド基板部２３が屈曲加工部材２６の一部に触れて、フレキシブル基板部２５を所望する折り曲げ角度に折り曲げすることができない場合が考えられる。
リジッド基板部２３が屈曲加工部材２６に触れる恐れがある場合は、図４（ａ）に示すように、屈曲加工部材の両端（円弧端）の一方の面の角度をおとす加工をして、当該面を平坦面としてもよい。面の角度は、例えば、屈曲加工部材の中心へ向かって０．５ｍｍ程おとすことが望ましい。当該加工は、プリント配線板用のＶカットや面取りルーターなどにより行うと、作業工程が少なく、生産性が向上する。
図４（ｂ）～（ｃ）に示すように、上面に平坦面を有する屈曲加工部材２６を用いて、前記と同様にリジッド・フレックス多層プリント配線板を折り曲げれば、リジッド基板部２３が屈曲加工部材２６に触れることなく、フレキシブル基板部２５を所望する折り曲げ角度に折り曲げることができる。
Here, depending on the thickness of the insulating base material of the rigid substrate portions 21 and 23, when the movable table 24 is moved so that the flexible substrate portion 25 is bent along the arc of the arcuate surface of the bending member 26, it is possible that the rigid substrate portion 23 will come into contact with a part of the bending member 26, making it impossible to bend the flexible substrate portion 25 to the desired bending angle.
If there is a risk that the rigid board section 23 may come into contact with the curved member 26, the angle of one of the faces at both ends (arc ends) of the curved member may be rounded off to make the face flat, as shown in Fig. 4(a). It is desirable to round off the face angle by about 0.5 mm toward the center of the curved member, for example. If this processing is performed using a V-cut or chamfering router for printed wiring boards, the number of work steps is reduced and productivity is improved.
As shown in Figures 4(b) to (c), by bending the rigid-flex multilayer printed wiring board in the same manner as described above using a bending member 26 having a flat surface on the upper surface, the flexible board portion 25 can be bent to the desired bending angle without the rigid board portion 23 coming into contact with the bending member 26.
１１：貫通めっきスルーホール
１２：ガラスクロス
１３：絶縁基材
１４：フレキシブル基板の切削加工面
１５：導体回路
２１：一方のリジッド基板部
２２：基準テーブル
２３：他方のリジッド基板部
２４：可動テーブル
２５：フレキシブル基板部
２６：屈曲加工部材
２７：リジッド基板部２１とフレキシブル基板部２５の境界部分
２０：折り曲げ装置
Ｐ：リジッド・フレックス多層プリント配線板
Ｒ：リジッド基板部
Ｆ：フレキシブル基板部
11: Through-plated through hole 12: Glass cloth 13: Insulating substrate 14: Cut surface of flexible substrate 15: Conductive circuit 21: One rigid substrate portion 22: Reference table 23: Other rigid substrate portion 24: Movable table 25: Flexible substrate portion 26: Bending member 27: Boundary portion between rigid substrate portion 21 and flexible substrate portion 25 20: Bending device P: Rigid-flex multilayer printed wiring board R: Rigid substrate portion F: Flexible substrate portion
Claims (6)
一方のリジッド基板部を固定する基準テーブルと、他方のリジッド基板部を固定する前記基準テーブルと略同一の高さの可動テーブルと、前記基準テーブルの上方にフレキシブル基板部を介して配置される屈曲加工部材とを備え、
前記屈曲加工部材は、フレキシブル基板部側に円弧面、及びリジッド基板部側に平坦面を有することを特徴とする折り曲げ装置。 A bending device for bending a rigid-flex multilayer printed wiring board having a rigid substrate portion and a bendable flexible substrate portion, comprising:
a reference table for fixing one of the rigid board parts, a movable table having substantially the same height as the reference table for fixing the other of the rigid board parts, and a bending member disposed above the reference table via a flexible board part,
The bending device is characterized in that the bending processing member has an arcuate surface on the flexible board portion side and a flat surface on the rigid board portion side.
一方のリジッド基板部を基準テーブルに固定すると共に、他方のリジッド基板部を前記基準テーブルと略同一の高さの可動テーブルに固定する工程と、フレキシブル基板部側に円弧面、及びリジッド基板部側に平坦面を有する屈曲加工部材を、前記基準テーブル上のリジッド基板部とフレキシブル基板部の境界部分に押し当てる工程と、前記可動テーブルを、フレキシブル基板部が屈曲加工部材の円弧面の円弧に沿って折り曲がるように移動させる工程とを有することを特徴とするリジッド・フレックス多層プリント配線板の折り曲げ方法。 A method for bending a rigid-flex multilayer printed wiring board having a rigid substrate portion and a bendable flexible substrate portion, comprising the steps of:
A method for bending a rigid-flex multilayer printed wiring board, comprising the steps of: fixing one rigid board portion to a reference table and fixing the other rigid board portion to a movable table of approximately the same height as the reference table; pressing a bending member having an arcuate surface on the flexible board portion side and a flat surface on the rigid board portion side against the boundary between the rigid board portion and the flexible board portion on the reference table; and moving the movable table so that the flexible board portion is bent along the arc of the arcuate surface of the bending member.
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