JP7558697B2 - Component mounting device and component mounting method - Google Patents

Description

This disclosure relates to a component mounting device and a component mounting method.

In the production process of electronic devices, a component mounting device such as that disclosed in Patent Document 1 is used.

JP 2020-013819 A

The component mounting device mounts a component at a target position on a board. There is a possibility that the mounting position (actual position) of the component may deviate from the target position. Therefore, a calibration process is performed to calculate the amount of deviation between the mounting position and the target position. In the calibration process, the component is mounted on a dedicated jig. Based on the image capture results of the component mounted on the jig, the amount of deviation between the mounting position and the target position is calculated. During the period in which the calibration process is performed, the component mounting device cannot perform the mounting process to mount the component on the board. Therefore, the operation rate of the component mounting device may decrease.

The purpose of this disclosure is to efficiently derive the amount of deviation between the mounting position and the target position.

According to the present disclosure, there is provided a component mounting device comprising: an operation parameter acquisition unit that acquires operation parameters of a mounting head; a mounting deviation amount calculation unit that calculates a mounting deviation amount indicating the deviation amount between the mounting position of a component mounted on a board by the mounting head and a target position; a learning model generation unit that generates a learning model in which the operation parameters are input and the deviation amount between the mounting position and the target position is output based on learning data indicating the relationship between the operation parameters and the mounting deviation amount; an estimation unit that inputs the operation parameters to the learning model and outputs an estimated deviation amount indicating an estimated value of the deviation amount between the mounting position and the target position; and an operation command unit that outputs an operation command to operate the mounting head based on the estimated deviation amount so that the component is mounted at the target position.

According to this disclosure, it is possible to efficiently derive the amount of deviation between the mounting position and the target position.

FIG. 1 is a side view that illustrates a component mounting apparatus according to an embodiment. FIG. 2 is a plan view illustrating the component mounting apparatus according to the embodiment. FIG. 3 is a side view showing a nozzle according to the embodiment. FIG. 4 is a functional block diagram showing the control device according to the embodiment. FIG. 5 is a schematic diagram for explaining the operation parameters of the mounting head according to the embodiment. FIG. 6 is a schematic diagram for explaining the operation parameters of the mounting head according to the embodiment. FIG. 7 is a schematic diagram for explaining the operation parameters of the mounting head according to the embodiment. FIG. 8 is a schematic diagram for explaining the operation parameters of the mounting head according to the embodiment. FIG. 9 is a schematic diagram showing a component detection device according to an embodiment. FIG. 10 is a flow chart illustrating a learning phase according to an embodiment. FIG. 11 is a flowchart illustrating the implementation phase according to the embodiment. FIG. 12 is a block diagram showing a computer system according to an embodiment.

Below, embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited thereto. The components of the embodiments described below can be combined as appropriate. Also, some components may not be used.

In the embodiment, an XYZ Cartesian coordinate system is set, and the positional relationship of each part is described with reference to the XYZ Cartesian coordinate system. The XYZ Cartesian coordinate system is a local coordinate system set in the component mounting device 1. The direction parallel to the X axis in a specified plane is the X-axis direction. The direction parallel to the Y axis in a specified plane perpendicular to the X axis is the Y-axis direction. The direction parallel to the Z axis perpendicular to the specified plane is the Z-axis direction. The direction of rotation or tilt around the X axis is the θX direction. The direction of rotation or tilt around the Y axis is the θY direction. The direction of rotation or tilt around the Z axis is the θZ direction. The specified plane is parallel to the horizontal plane. The Z-axis direction is the up-down direction. The specified plane may be inclined with respect to the horizontal plane. In the following description, the specified plane is appropriately referred to as the XY plane.

[Component mounting equipment]
Fig. 1 is a side view that shows a component mounting apparatus 1 according to an embodiment. Fig. 2 is a plan view that shows a component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 mounts a component C on a board W on which cream solder has been printed.

The component mounting device 1 includes a base 11, a support 12, a component supply device 2, a board support device 3, a mounting head 5 having a nozzle 4, a nozzle moving device 6, a head moving device 7, a component recognition device 8, a component detection device 9, and a control device 10.

The base 11 is installed on the floor of an industrial facility in which the component mounting device 1 is used. In the XY plane, the base 11 is long in the X-axis direction. The outer shape of the top surface of the base 11 is rectangular. The support pillars 12 protrude upward from the top surface of the base 11. The support pillars 12 are fixed to the base 11. In the embodiment, the support pillars 12 are disposed at each of the four corners of the top surface of the base 11.

The component supplying device 2 supplies components C. A supply position AP is set in the component mounting device 1. The component supplying device 2 supplies components C to the supply position AP. The component supplying device 2 includes multiple tape feeders. The tape feeder has a reel on which a tape that holds the components C is wound, and a drive device that pays out the tape wound on the reel. The drive device pays out the tape so that the components C held on the tape move to the supply position AP. The component supplying device 2 may also include a tray that holds the components C.

The substrate support device 3 supports the substrate W. A processing position BP is set in the component mounting device 1. The substrate support device 3 supports the substrate W at the processing position BP. The substrate support device 3 is supported on a base 11. The substrate support device 3 includes a substrate transport device that transports the substrate W to the processing position BP, and a substrate support member that supports the substrate W transported to the processing position BP. The substrate transport device includes a conveyor that transports the substrate W in the X-axis direction, and a guide member that guides the substrate W in the X-axis direction. The substrate support member supports the substrate W so that the surface of the substrate W is parallel to the XY plane.

The nozzle 4 holds the part C in a detachable manner. The nozzle 4 is a suction nozzle that suctions the top surface of the part C. An opening is provided at the tip of the nozzle 4. The opening of the nozzle 4 is connected to a vacuum system. With the tip of the nozzle 4 in contact with the top surface of the part C, a suction operation of the opening of the nozzle 4 is performed, thereby suctioning and holding the part C at the tip of the nozzle 4. The suction operation of the opening of the nozzle 4 is released, thereby releasing the part C from the nozzle 4.

The mounting head 5 has multiple nozzles 4. The mounting head 5 mounts the component C held by the nozzles 4 onto the substrate W. The mounting head 5 is movable between a supply position AP and a processing position BP. The supply position AP and the mounting position BP are set at different positions within the XY plane. The mounting head 5 moves to the supply position AP and holds the component C supplied from the component supply device 2 with the nozzles 4. After holding the component C with the nozzles 4 at the supply position AP, the mounting head 5 moves to the processing position BP and mounts it on the substrate W supported by the substrate support device 3.

The mounting head 5 has a shaft 5S on which the nozzle 4 is attached. The nozzle 4 is attached to the lower end of the shaft 5S.

The nozzle moving device 6 moves the nozzle 4 in both the Z-axis direction and the θZ direction. The nozzle moving device 6 includes an actuator provided on the mounting head 5. The nozzle moving device 6 is provided on each of the multiple nozzles 4. The nozzle moving device 6 moves the shaft 5S in the Z-axis direction and the θZ direction, thereby moving the nozzle 4 in the Z-axis direction and the θZ direction.

The head moving device 7 moves the mounting head 5 in both the X-axis direction and the Y-axis direction. The head moving device 7 has an X-axis moving device 13 that moves the mounting head 5 in the X-axis direction, and a Y-axis moving device 14 that moves the mounting head 5 in the Y-axis direction.

The X-axis moving device 13 includes a guide member 13A extending in the X-axis direction, and an actuator 13B that generates power to move the mounting head 5 in the X-axis direction. The mounting head 5 is supported by the guide member 13A. The guide member 13A guides the mounting head 5 in the X-axis direction. At least a portion of the actuator 13B is disposed between the mounting head 5 and the guide member 13A. The mounting head 5 moves in the X-axis direction by the power generated by the actuator 13B while being guided by the guide member 13A.

The Y-axis moving device 14 includes a pair of guide members 14A and an actuator 14B that generates power to move the guide member 13A in the Y-axis direction. One guide member 14A is supported by two supports 12 arranged at the end of the +X side of the base 11. The other guide member 14A is supported by two supports 12 arranged at the end of the -X side of the base 11. The +X side end of the guide member 13A is supported by one guide member 14A. The -X side end of the guide member 13A is supported by the other guide member 14A. The guide member 14A guides the guide member 13A in the Y-axis direction. At least a part of the actuator 14B is arranged between the guide members 13A and 14A. The guide member 13A moves in the Y-axis direction by the power generated by the actuator 14B while being guided by the guide member 14A. The mounting head 5 moves in the Y-axis direction as the guide member 13A moves in the Y-axis direction.

The nozzle 4 can be moved in four directions, the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction, by the nozzle moving device 6 and the head moving device 7. By moving the nozzle 4, the part C held by the nozzle 4 can also be moved in four directions, the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

The component recognition device 8 recognizes the component C held by the nozzle 4. A recognition position CP is set on the component mounting device 1. The component recognition device 8 recognizes the component C at the recognition position CP. The recognition position CP is set between the supply position AP and the processing position BP. The component recognition device 8 includes an imaging device. The component recognition device 8 recognizes the component C held by the nozzle 4 at the supply position AP before being mounted on the board W. The component recognition device 8 recognizes the shape of the component C and the state of the component C being held by the nozzle 4.

The component detection device 9 detects the component C mounted on the substrate W. The component detection device 9 is provided on the mounting head 5. The component detection device 9 includes an imaging device. A plurality of component detection devices 9 are provided to correspond to the plurality of nozzles 4. The component detection device 9 detects the mounting position DP of the component C mounted on the substrate W. The mounting position DP of the component C refers to the actual position of the component C mounted on the surface of the substrate W. The mounting position DP of the component C is a coordinate position defined in the XYZ Cartesian coordinate system.

The control device 10 includes a computer system. The control device 10 outputs an operation command to operate the mounting head 5. The control device 10 stores a production program that indicates the procedure for mounting the component C on the substrate W. The control device 10 outputs an operation command to operate the mounting head 5 based on the production program.

[nozzle]
Fig. 3 is a side view showing the nozzle 4 according to the embodiment. As shown in Fig. 3, the nozzle 4 has a connecting portion 41 connected to the shaft 5S, a first body portion 42 connected to the connecting portion 41, a second body portion 44 connected to the first body portion 42 via a flange portion 43, and a holding portion 45 that holds the component C.

The shaft 5S is pipe-shaped. The connecting portion 41 is columnar. The connecting portion 41 is inserted into the inside of the shaft 5S. The first body portion 42 is connected to the lower portion of the connecting portion 41. The flange portion 43 is connected to the lower portion of the first body portion 42. The second body portion 44 is connected to the lower portion of the flange portion 43. The flange portion 43 is provided at the boundary between the first body portion 42 and the second body portion 44. An opening connected to the vacuum system is provided at the lower end of the holding portion 45. The vacuum system and the opening of the holding portion 45 are connected via the internal space of the shaft 5S.

The nozzle 4 picks up the suction position EP on the top surface of the component C. The suction position EP of the nozzle 4 refers to the position on the top surface of the component C that is picked up by the nozzle 4. In other words, the suction position EP of the nozzle 4 refers to the position where the lower end of the holding portion 45 contacts the top surface of the component C. The control device 10 controls the nozzle 4 so that the center position FP of the top surface of the component C is picked up by the nozzle 4.

The mounting head 5 has a pressure sensor 15 that detects the suction pressure when the nozzle 4 suctions the component C. The pressure sensor 15 is disposed, for example, in the internal space of the shaft 5S. The suction pressure refers to the pressure between the vacuum system and the opening of the holding portion 45 when the nozzle 4 suctions the component C. The suction pressure is a negative pressure.

[Control device]
4 is a functional block diagram showing the control device 10 according to the embodiment. As shown in FIG. 4, the control device 10 is connected to each of the mounting head 5 including the nozzle moving device 6 and the head moving device 7, the component recognition device 8, the component detection device 9, and the pressure sensor 15.

The control device 10 has a production program memory unit 21, an operation parameter acquisition unit 22, an implementation deviation amount calculation unit 23, a learning model generation unit 24, a learning model memory unit 25, an estimation unit 26, a correction amount calculation unit 27, and an operation command unit 28.

The production program storage unit 21 stores a production program. A production program is a computer program that shows the procedure for mounting components C on a board W.

The operation parameter acquisition unit 22 acquires the operation parameters of the mounting head 5. The operation parameters are parameters that specify the operation of the mounting head 5.

Figure 5 is a schematic diagram for explaining the operating parameters of the mounting head 5 according to the embodiment. The operating parameters include operating commands defined by the production program, detection data of the component recognition device 8, detection data of the pressure sensor 15, and calculation data of the control device 10. The operating parameter acquisition unit 22 acquires at least a portion of the operating parameters from the production program storage unit 21. The operating parameter acquisition unit 22 acquires at least a portion of the operating parameters from the component recognition device 8. The operating parameter acquisition unit 22 acquires at least a portion of the operating parameters from the pressure sensor 15. The operating parameter acquisition unit 22 acquires at least a portion of the operating parameters from the correction amount calculation unit 27.

In the embodiment, the operating parameters include the target position GP of the component C to be mounted on the substrate W, the movement conditions of the mounting head 5 to the target position GP, the movement conditions of the nozzle 4 when mounting the component C on the substrate W, the holding conditions of the component C by the nozzle 4, the movement conditions of the component C in the component recognition device 8, and the correction amount calculated by the correction amount calculation unit 27.

Figure 6 is a schematic diagram for explaining the operational parameters of the mounting head 5 according to the embodiment. As shown in Figure 6, the target position GP of the component C refers to the target position of the component C to be mounted on the surface of the substrate W. The target position GP of the component C is a coordinate position defined in the XYZ Cartesian coordinate system. The target position GP of the component C is described in the production program. In other words, the target position GP of the component C is defined based on the operational command.

6, the movement conditions of the mounting head 5 to the target position GP include the movement conditions of the mounting head 5 from the recognition position CP or the supply position AP to the target position GP. In addition, in the case where the mounting head 5 is provided with an alignment device (not shown) and an alignment mark is provided on the substrate W, when the mounting head 5 detects the alignment mark with the alignment device and then moves to the target position GP, the movement conditions of the mounting head 5 to the target position GP include the movement conditions of the mounting head 5 from the alignment mark detection position to the target position GP. The movement conditions of the mounting head 5 to the target position GP include the movement distance, movement speed, and movement direction of the mounting head 5 to the target position GP. The movement distance includes the movement distance of the mounting head 5 in the X-axis direction and the movement distance in the Y-axis direction. The movement speed includes the movement speed of the mounting head 5 in the X-axis direction and the movement speed in the Y-axis direction. The movement direction is the movement direction of the mounting head 5 in the XY plane from the recognition position CP or the supply position AP to the target position GP. The movement conditions of the mounting head 5 to the target position GP are described in the production program. In other words, the movement conditions of the mounting head 5 to the target position GP are specified based on the operation command.

Figure 7 is a schematic diagram for explaining the operating parameters of the mounting head 5 according to the embodiment. As shown in Figure 7, the movement conditions of the nozzle 4 when mounting the component C on the substrate W include the movement distance and movement speed of the nozzle 4 in the Z-axis direction until the component C is mounted on the substrate W. In addition, the movement conditions of the nozzle 4 when mounting the component C on the substrate W include the rotation angle of the nozzle 4 in the θZ direction. The movement conditions of the nozzle 4 when mounting the component C on the substrate W are described in the production program. In other words, the movement conditions of the nozzle 4 when mounting the component C on the substrate W are specified based on the operation command.

Figure 8 is a schematic diagram for explaining the operating parameters of the mounting head 5 according to the embodiment. As shown in Figure 8, the holding conditions of the component C by the nozzle 4 include an adsorption deviation amount ΔB indicating the deviation amount between the adsorption position EP of the nozzle 4 and the center position FP of the upper surface of the component C. The adsorption deviation amount ΔB is detected by the component recognition device 8. In other words, the adsorption deviation amount ΔB is determined based on the detection data of the component recognition device 8.

The holding conditions for component C by nozzle 4 include the suction pressure when nozzle 4 suctions component C. The suction pressure is detected by pressure sensor 15. In other words, the suction pressure is determined based on the detection data of pressure sensor 15.

When the component C held by the nozzle 4 is to be recognized by the component recognition device 8, the mounting head 5 moves the component C at the recognition position CP. The movement conditions of the component C in the component recognition device 8 include the movement distance, movement speed, and movement direction of the component C at the recognition position CP. The movement conditions of the component C in the component recognition device 8 are described in the production program. In other words, the movement conditions of the component C in the component recognition device 8 are specified based on the operation command.

The mounting deviation calculation unit 23 calculates a mounting deviation ΔM indicating the deviation between the mounting position DP of the component C mounted on the board W by the mounting head 5 and the target position GP. As described above, the mounting position DP of the component C refers to the actual position of the component C mounted on the surface of the board W. The target position GP of the component C refers to the target position of the component C to be mounted on the surface of the board W. The mounting position DP of the component C is detected by the component detection device 9. The target position GP of the component C is described in the production program. The mounting deviation calculation unit 23 calculates the mounting deviation ΔM based on the detection data of the component detection device 9 and the production program.

Figure 9 is a schematic diagram showing a component detection device 9 according to an embodiment. The component detection device 9 includes an imaging device. The component detection device 9 is provided on the mounting head 5. The component detection device 9 detects the mounting position DP in the XYZ Cartesian coordinate system of the component C mounted on the board W.

The learning model generation unit 24 generates a learning model in which the operation parameters of the mounting head 5 are input and the amount of deviation between the mounting position DP and the target position GP is output, based on learning data indicating the relationship between the operation parameters of the mounting head 5 and the amount of mounting deviation ΔM. That is, the learning model generation unit 24 performs machine learning based on the operation parameters acquired by the operation parameter acquisition unit 22 and the amount of mounting deviation ΔM calculated by the amount of mounting deviation calculation unit 23. The learning model generation unit 24 performs machine learning based on the operation parameters and the amount of mounting deviation ΔM to generate a learning model.

The learning model storage unit 25 stores the learning model generated by the learning model generation unit 24.

The estimation unit 26 inputs the operation parameters of the mounting head 5 into the learning model to calculate an estimated deviation amount ΔMe indicating an estimated value of the deviation amount between the mounting position DP and the target position GP. The estimation unit 26 outputs the calculated estimated deviation amount ΔMe. The operation parameters of the mounting head 5 are transmitted from the operation parameter acquisition unit 22 to the estimation unit 26. The learning model is transmitted from the learning model generation unit 24 to the estimation unit 26. The estimation unit 26 inputs the operation parameters acquired by the operation parameter acquisition unit 22 into the learning model generated by the learning model generation unit 24, and outputs the estimated deviation amount ΔMe.

The correction amount calculation unit 27 calculates the correction amount for mounting the component C at the target position GP based on the estimated deviation amount ΔMe output from the estimation unit 26. The correction amount is a correction amount related to the position of the mounting head 5 in the XY plane.

The operation command unit 28 outputs an operation command to operate the mounting head 5 so that the component C is mounted at the target position GP based on the estimated deviation amount ΔMe output from the estimation unit 26 and the production program stored in the production program storage unit 21. In the embodiment, the operation command unit 28 corrects the operation command described in the production program based on the correction amount calculated by the correction amount calculation unit 27, and outputs the corrected operation command to the mounting head 5.

As described above, the mounting head 5 has multiple nozzles 4. In the embodiment, the operation parameter acquisition unit 22 acquires operation parameters related to each of the multiple nozzles 4. The estimation unit 26 outputs an estimated deviation amount ΔMe for each of the multiple nozzles 4. The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP for each of the multiple nozzles 4. The operation command unit 28 outputs an operation command so that each of the multiple nozzles 4 mounts the component C at the target position GP.

[Learning Phase]
10 is a flowchart showing the learning phase according to the embodiment. In the learning phase, a learning model is generated in which the operation parameters are input and the deviation amount between the mounting position DP and the target position GP is output.

In the mounting process of the component mounting device 1, the operating parameter acquisition unit 22 acquires the operating parameters of the mounting head 5. Also, in the mounting process of the component mounting device 1, the mounting deviation calculation unit 23 calculates the mounting deviation ΔM based on the production program and the detection data of the component detection device 9. The mounting process of the component mounting device 1 refers to the process of mounting the component C on the substrate W by the mounting head 5. In other words, the mounting process of the component mounting device 1 is the process of producing an electronic device.

The learning model generation unit 24 acquires the operation parameters from the operation parameter acquisition unit 22. The learning model generation unit 24 also acquires the mounting deviation amount ΔM from the mounting deviation amount calculation unit 23. The learning model generation unit 24 acquires learning data including the operation parameters and the mounting deviation amount ΔM when the component C is mounted based on the operation parameters (step SA1).

The learning model generation unit 24 executes machine learning based on the learning data acquired in step SA1 (step SA2). Examples of the machine learning algorithm include at least one of a Neural Network, a Support Vector Machine (SVM), a Decision Tree, a Random Forest, Booting, and a Support Vector Machine (SVM).

The learning model generation unit 24 performs machine learning to generate a learning model in which the operation parameters are input and the deviation amount between the mounting position DP and the target position GP is output (step SA3).

The learning model generation unit 24 stores the learning model generated in step SA3 in the learning model storage unit 25 (step SA4).

[Implementation Phase]
11 is a flowchart showing a mounting phase according to an embodiment. In the mounting phase, operation parameters are input to a learning model, and an estimated deviation amount ΔMe indicating an estimated value of the deviation amount between the mounting position DP and the target position GP is output.

During the mounting process of the component mounting device 1, the operation parameter acquisition unit 22 acquires the operation parameters of the mounting head 5 (step SB1).

The estimation unit 26 inputs the operational parameters acquired in step SB1 into the learning model stored in the learning model storage unit 25, and outputs an estimated deviation amount ΔMe indicating an estimated value of the deviation amount between the mounting position DP and the target position RP (step SB2).

The correction amount calculation unit 27 calculates the correction amount for mounting the component C at the target position GP based on the estimated deviation amount ΔMe output in step SB2 (step SB3).

The operation command unit 28 outputs an operation command to operate the mounting head 5 so that the component C is mounted at the target position GP based on the estimated deviation amount ΔMe output from the estimation unit 26 and the production program stored in the production program storage unit 21. In an embodiment, the operation command unit 28 corrects the operation command described in the production program based on the correction amount calculated in step SB3, and outputs the corrected operation command to the mounting head 5 (step SB4).

This causes component C to be mounted at target position GP on the surface of substrate W.

The mounting head 5 has a plurality of nozzles 4. In the embodiment, the operation parameter acquisition unit 22 acquires operation parameters related to each of the plurality of nozzles 4. The estimation unit 26 outputs an estimated deviation amount ΔMe for each of the plurality of nozzles 4. The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP for each of the plurality of nozzles 4. The operation command unit 28 outputs an operation command so that the component C is mounted at the target position GP by each of the plurality of nozzles 4.

[Computer System]
FIG. 12 is a block diagram showing a computer system 1000 according to an embodiment. The above-mentioned control device 10 includes the computer system 1000. The computer system 1000 has a processor 1001 such as a central processing unit (CPU), a main memory 1002 including a non-volatile memory such as a read only memory (ROM) and a volatile memory such as a random access memory (RAM), a storage 1003, and an interface 1004 including an input/output circuit. The functions of the control device 10 are stored in the storage 1003 as a computer program. The processor 1001 reads the computer program from the storage 1003, expands it in the main memory 1002, and executes the above-mentioned processing according to the computer program. The computer program may be distributed to the computer system 1000 via a network.

According to the above-described embodiment, the computer program can cause the computer system 1000 to perform the following operations: acquire the operation parameters of the mounting head 5; calculate a mounting deviation amount ΔM indicating the deviation amount between the mounting position DP and the target position GP of the component C mounted on the substrate W by the mounting head 5; generate a learning model in which the operation parameters are input and the deviation amount between the mounting position DP and the target position GP is output based on learning data indicating the relationship between the operation parameters and the mounting deviation amount ΔM; input the operation parameters to the learning model and output an estimated deviation amount ΔMe indicating an estimated value of the deviation amount between the mounting position DP and the target position GP; and operate the mounting head 5 based on the estimated deviation amount ΔMe so that the component C is mounted at the target position GP.

[effect]
As described above, according to the embodiment, in the learning phase, based on the learning data showing the relationship between the operation parameters of the mounting head 5 and the mounting deviation amount ΔM, a learning model is generated in which the operation parameters are input and the deviation amount between the mounting position DP and the target position GP is output. In the mounting phase, the operation parameters are input to the learning model, and an estimated deviation amount ΔMe indicating an estimated value of the deviation amount between the mounting position DP and the target position GP is calculated. Based on the calculated estimated deviation amount ΔMe, the mounting head 5 is controlled so that the component C is mounted at the target position GP. The operation parameters of the mounting head 5 are acquired in the mounting process of the component mounting device 1. Therefore, the estimated deviation amount ΔMe between the mounting position DP and the target position GP is efficiently derived without stopping the mounting process of the component mounting device 1. Therefore, the decrease in the operation rate of the component mounting device 1 is suppressed.

The operation parameters include the target position GP of the component C. As described above, the target position GP of the component C is a coordinate position defined in the XYZ Cartesian coordinate system. When mounting the component C on the board W, the mounting head 5 is positioned above the target position GP. Based on the position of the mounting head 5 in the XYZ Cartesian coordinate system, for example, the deformation state of the base 11 or the support 12 may change, the vibration state of the base 11 or the support 12 may change, or the weight balance of the base 11 or the support 12 may change. The change in the deformation state, the change in the vibration state, or the change in the weight balance may cause the mounting deviation amount ΔM to change. In other words, the mounting deviation amount ΔM may change based on the target position GP.

For example, the mounting deviation amount ΔM may be different when the target position GP is set at the center of the substrate W and when the target position GP is set at the peripheral portion of the substrate W. For example, the mounting deviation amount ΔM when the target position GP is set at the peripheral portion of the substrate W may be larger than the mounting deviation amount ΔM when the target position GP is set at the center of the substrate W.

In addition, the amount of mounting deviation ΔM may differ when the target position GP is set at a position close to the alignment mark and when the target position GP is set at a position far from the alignment mark. For example, the amount of mounting deviation ΔM when the target position GP is set at a position far from the alignment mark may be larger than the amount of mounting deviation ΔM when the target position GP is set at a position close to the alignment mark.

By including the target position GP of the component C in the operation parameters, the estimation unit 26 can properly calculate the estimated deviation amount ΔMe for each of the different target positions GP. The correction amount calculation unit 27 can properly calculate the correction amount for each of the different target positions GP. Therefore, the operation command unit 28 can properly mount the component C at each of the different target positions GP.

The operating parameters include the movement conditions of the mounting head 5 to the target position GP of the component C. The movement conditions of the mounting head 5 include the movement distance, movement speed, and movement direction of the mounting head 5 to the target position GP. Based on the movement conditions of the mounting head 5, for example, the deformation state of the base 11 or the support 12 may change, the vibration state of the base 11 or the support 12 may change, or the weight balance of the base 11 or the support 12 may change. The change in the deformation state, the change in the vibration state, or the change in the weight balance may cause the mounting deviation amount ΔM to change. In other words, the mounting deviation amount ΔM may change based on the movement conditions of the mounting head 5.

For example, the mounting deviation amount ΔM may differ when the movement distance of the mounting head 5 to the target position GP is a first movement distance and when it is a second movement distance that is longer than the first movement distance. For example, the mounting deviation amount ΔM when the movement distance of the mounting head 5 is the second movement distance may be larger than the mounting deviation amount ΔM when the movement distance of the mounting head 5 is the first movement distance.

In addition, the mounting deviation amount ΔM may differ when the movement speed of the mounting head 5 to the target position GP is a first movement speed and when the movement speed is a second movement speed that is higher than the first movement speed. For example, the mounting deviation amount ΔM when the movement speed of the mounting head 5 is the second movement speed may be larger than the mounting deviation amount ΔM when the movement speed of the mounting head 5 is the first movement speed.

In addition, the mounting deviation amount ΔM may differ depending on whether the movement direction of the mounting head 5 to the target position GP is the X-axis direction or the Y-axis direction. For example, the mounting deviation amount ΔM when the movement direction of the mounting head 5 is the X-axis direction may be larger than the mounting deviation amount ΔM when the movement direction of the mounting head 5 is the Y-axis direction.

By including the operation parameters as the movement conditions of the mounting head 5, the estimation unit 26 can properly calculate the estimated deviation amount ΔMe for each of the different movement conditions of the mounting head 5. The correction amount calculation unit 27 can properly calculate the correction amount for each of the different movement conditions of the mounting head 5. Therefore, the operation command unit 28 can properly mount the component C at the target position GP under each of the different movement conditions of the mounting head 5.

The operating parameters include the movement conditions of the nozzle 4 when mounting the component C on the board W. The movement conditions of the nozzle 4 include the movement distance and movement speed of the nozzle 4 in the Z-axis direction until the component C is mounted on the board W. In addition, the movement conditions of the nozzle 4 when mounting the component C on the board W include the rotation angle of the nozzle 4 in the θZ direction. Based on the movement conditions of the nozzle 4, for example, the deformation state of the nozzle 4 or the shaft 5S may change, or the vibration state of the nozzle 4 or the shaft 5S may change. The change in the deformation state or the change in the vibration state may change the mounting deviation amount ΔM. In other words, the mounting deviation amount ΔM may change based on the movement conditions of the nozzle 4.

For example, the amount of mounting deviation ΔM may differ when the movement distance of the nozzle 4 is the third movement distance from the amount of mounting deviation ΔM when the movement distance of the nozzle 4 is the fourth movement distance, which is longer than the third movement distance. For example, the amount of mounting deviation ΔM when the movement distance of the nozzle 4 is the fourth movement distance may be larger than the amount of mounting deviation ΔM when the movement distance of the nozzle 4 is the third movement distance.

In addition, the mounting deviation amount ΔM may differ when the movement speed of the nozzle 4 is the third movement speed and when the movement speed is the fourth movement speed, which is higher than the third movement speed. For example, the mounting deviation amount ΔM when the movement speed of the nozzle 4 is the fourth movement speed may be larger than the mounting deviation amount ΔM when the movement speed of the nozzle 4 is the third movement speed.

In addition, the amount of mounting deviation ΔM may differ when the rotation angle of the nozzle 4 is 0° and when it is 90°. For example, due to a slight bend in the shaft 5S or eccentricity of the rotation center, the amount of mounting deviation ΔM when the rotation angle of the nozzle 4 is 90° may be larger than the amount of mounting deviation ΔM when the rotation angle of the nozzle 4 is 0°.

Since the operation parameters include the movement conditions of the nozzle 4, the estimation unit 26 can properly calculate the estimated deviation amount ΔMe for each of the different movement conditions of the nozzle 4. The correction amount calculation unit 27 can properly calculate the correction amount for each of the different movement conditions of the nozzle 4. Therefore, the operation command unit 28 can properly mount the component C at the target position GP under each of the different movement conditions of the nozzle 4.

The operating parameters include the holding conditions of component C by nozzle 4. The holding conditions of component C include a pickup deviation amount ΔB that indicates the deviation amount between the pickup position EP of nozzle 4 and the center position FP of the top surface of component C. The mounting deviation amount ΔM may change based on the pickup deviation amount ΔB.

For example, the mounting deviation amount ΔM may differ when the adsorption deviation amount ΔB is the first adsorption deviation amount and when the adsorption deviation amount ΔB is the second adsorption deviation amount that is larger than the first adsorption deviation amount. For example, the mounting deviation amount ΔM when the adsorption deviation amount ΔB is the second adsorption deviation amount may be larger than the mounting deviation amount ΔM when the adsorption deviation amount ΔB is the first adsorption deviation amount. In general, the mounting head 5 performs the mounting process so that the component C is mounted at the target position GP while taking into account the adsorption deviation amount ΔB. However, if the adsorption deviation amount ΔB is excessively large, when the nozzle 4 holding the component C approaches the target position GP on the board W and releases the component C, the component C may be mounted at a position displaced from the target position GP due to, for example, the weight balance of the component C.

By including the adsorption deviation amount ΔB in the operation parameters, the estimation unit 26 can properly calculate the estimated deviation amount ΔMe for each of the different adsorption deviation amounts ΔB. The correction amount calculation unit 27 can properly calculate the correction amount for each of the different adsorption deviation amounts ΔB. Therefore, the operation command unit 28 can properly mount the component C at the target position GP for each of the different adsorption deviation amounts ΔB.

The component C holding conditions also include the suction pressure when nozzle 4 suctions component C. The mounting misalignment amount ΔM may change based on the suction pressure.

For example, the mounting deviation amount ΔM may differ when the suction pressure is the first suction pressure and when the suction pressure is the second suction pressure, which is higher than the first suction pressure. For example, the mounting deviation amount ΔM when the suction pressure is the second suction pressure may be larger than the mounting deviation amount ΔM when the suction pressure is the first suction pressure. A high suction pressure means that the nozzle 4 has incompletely suctioned the component C. If the suction pressure of the nozzle 4 for the component C is incomplete, when the nozzle 4 holding the component C approaches the target position DP on the board W and releases the component C, the component C may be mounted at a position displaced from the target position GP due to, for example, the weight balance of the component C.

By including the suction pressure in the operation parameters, the estimation unit 26 can properly calculate the estimated deviation amount ΔMe for each of the different suction pressures. The correction amount calculation unit 27 can properly calculate the correction amount for each of the different suction pressures. Therefore, the operation command unit 28 can properly mount the component C at the target position GP at each of the different suction pressures.

The operation parameters include the movement conditions of the component C in the component recognition device 8. As described above, when the component C held by the nozzle 4 is recognized by the component recognition device 8, the mounting head 5 moves the component C at the recognition position CP. The movement conditions of the component C in the component recognition device 8 include the movement distance, movement speed, and movement direction of the component C at the recognition position CP. Based on the movement conditions of the component C in the component recognition device 8, for example, the deformation state of the base 11 or the support 12 may change, the vibration state of the base 11 or the support 12 may change, or the weight balance of the base 11 or the support 12 may change. The recognition result of the component recognition device 8 may change due to the change in the deformation state, the change in the vibration state, or the change in the weight balance. For example, the suction deviation amount ΔB detected by the component recognition device 8 may change. As a result, the mounting deviation amount ΔM may change. That is, the mounting deviation amount ΔM may change based on the movement conditions of the component C in the component recognition device 8.

Since the operation parameters include the movement conditions of part C in the part recognition device 8, the estimation unit 26 can properly calculate the estimated deviation amount ΔMe for each of the different movement conditions of part C in the part recognition device 8. The correction amount calculation unit 27 can properly calculate the correction amount for each of the different movement conditions of part C in the part recognition device 8. Therefore, the operation command unit 28 can properly mount part C at the target position GP under each of the different movement conditions of part C in the part recognition device 8.

The mounting head 5 has a plurality of nozzles 4. In the embodiment, the operation parameter acquisition unit 22 acquires operation parameters related to each of the plurality of nozzles 4. The estimation unit 26 outputs an estimated deviation amount ΔMe for each of the plurality of nozzles 4. The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP for each of the plurality of nozzles 4. The operation command unit 28 outputs an operation command so that the component C is mounted at the target position GP by each of the plurality of nozzles 4. This allows each of the plurality of nozzles 4 to properly mount the component C at the target position GP.

[Other embodiments]
In the embodiment described above, in the learning phase, the mounting position DP of the component C is detected by the component detection device 9. The mounting position DP of the component C may be detected by an inspection device different from the component mounting device 1.

1...Component mounting device, 2...Component supply device, 3...Board support device, 4...Nozzle, 5...Mounting head, 5S...Shaft, 6...Nozzle moving device, 7...Head moving device, 8...Component recognition device, 9...Component detection device, 10...Control device, 11...Base, 12...Support, 13...X-axis moving device, 13A...Guide member, 13B...Actuator, 14...Y-axis moving device, 14A...Guide member, 14B...Actuator, 15...Pressure sensor, 21...Production program memory unit, 22...Operation parameter acquisition unit, 23...Mounting deviation amount calculation unit, 24...Learning model generation unit, 25...Learning Learning model memory unit, 26...estimation unit, 27...correction amount calculation unit, 28...operation command unit, 41...connection unit, 42...first body unit, 43...flange unit, 44...second body unit, 45...holding unit, 1000...computer system, 1001...processor, 1002...main memory, 1003...storage, 1004...interface, C...component, AP...supply position, BP...processing position, CP...recognition position, DP...mounting position, EP...suction position, FP...center position, GP...target position, W...board, ΔB...suction deviation amount, ΔM...mounting deviation amount, ΔMe...estimated deviation amount.

Claims (13)

The base and
A support fixed to the base;
a component supply device that supplies a component to a supply position;
a substrate support device supported by the base and configured to transport a substrate to a processing position;
a mounting head having a plurality of nozzles for detachably holding the components, the mounting head being supported by the support columns via guide members, and configured to hold the components with the nozzles at the supply position and then move to the processing position to mount the components on the substrate;
a component detection device provided in the mounting head for detecting a mounting position, which is an actual position of a component mounted on a board by the mounting head;
A control device,
The control device includes:
an operation parameter acquisition unit that acquires operation parameters of the mounting head;
a mounting deviation amount calculation unit that calculates a mounting deviation amount indicating a deviation amount between the mounting position detected by the component detection device and a target position;
a learning model generation unit that generates a learning model in which the operation parameters are input and the amount of deviation between the mounting position and the target position is output based on learning data indicating a relationship between the operation parameters and the amount of deviation;
an estimation unit that inputs the operation parameters into the learning model and outputs an estimated deviation amount indicating an estimated value of a deviation amount between the mounting position and the target position;
an operation command unit that outputs an operation command to operate the mounting head based on the estimated deviation amount so that the component is mounted at the target position.
Component mounting equipment. The control device includes:
a production program storage unit that stores a production program, which is a computer program that shows a procedure for mounting the components on the board;
The operation parameter acquisition unit acquires the operation parameters from the production program storage unit.
The component mounting device according to claim 1 . The operation parameters include the target position described in the production program stored in the production program storage unit .
The component mounting apparatus according to claim 2 . a component recognition device that recognizes a component held by the nozzle and before being mounted on the board at a recognition position set between the supply position and the processing position,
the operation parameter acquisition unit acquires the operation parameters from the part recognition device;
The component mounting device according to claim 1 . the operation parameters include movement conditions including a movement distance, a movement speed, and a movement direction of the mounting head from the recognition position, the supply position, or the alignment mark detection position to the target position;
The component mounting apparatus according to claim 4 . The control device includes:
a correction amount calculation unit that calculates a correction amount for mounting the component at the target position based on the estimated deviation amount output from the estimation unit,
The operation parameter acquisition unit acquires the operation parameters from the correction amount calculation unit.
The component mounting device according to claim 1 . the operational parameters include movement conditions of the nozzle when mounting the component on the substrate;
The component mounting device according to claim 1 . The operational parameters include a holding condition of the part by the nozzle.
The component mounting device according to claim 1 . a component recognition device that recognizes a component held by the nozzle and before being mounted on the board at a recognition position set between the supply position and the processing position,
The nozzle sucks the upper surface of the component,
the holding condition includes a pickup deviation amount indicating a deviation amount between a pickup position of the nozzle detected by the component recognition device and a center position of the upper surface,
The component mounting apparatus according to claim 8 . a pressure sensor for detecting a suction pressure when the nozzle suctions the component,
The nozzle sucks an upper surface of the component,
the holding condition includes a suction pressure detected by the pressure sensor when the component is sucked.
The component mounting apparatus according to claim 8 . the mounting head has a plurality of the nozzles,
the operation parameter acquisition unit acquires the operation parameters related to each of the plurality of nozzles;
The component mounting device according to any one of claims 1 to 10 . the operation parameters include movement conditions of the component in the component recognition device;
The component mounting apparatus according to claim 4 . The base and
A support fixed to the base;
a component supply device that supplies a component to a supply position;
a substrate support device supported by the base and configured to transport a substrate to a processing position;
a mounting head having a plurality of nozzles for detachably holding the components, the mounting head being supported by the support columns via guide members, and configured to hold the components with the nozzles at the supply position and then move to the processing position to mount the components on the substrate;
a component detection device provided in the mounting head for detecting a mounting position, which is an actual position of a component mounted on a board by the mounting head;
A component mounting method using a component mounting apparatus comprising:
acquiring operational parameters of the mounting head;
calculating a mounting deviation amount indicating a deviation amount between the mounting position detected by the component detection device and a target position;
generating a learning model in which the operation parameters are input and the amount of deviation between the mounting position and the target position is output based on learning data indicating a relationship between the operation parameters and the amount of deviation;
inputting the operation parameters into the learning model and outputting an estimated deviation amount indicating an estimated value of a deviation amount between the mounting position and the target position;
and operating the mounting head based on the estimated deviation amount so that the component is mounted at the target position.
Component mounting method.

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