JP7564797B2 - Resin molding device and method for manufacturing resin molded product - Google Patents

Description

The present invention relates to a resin molding device and a manufacturing method for resin molded products.

Patent Document 1 discloses a resin molding device equipped with a pressure sensor that measures the resin pressure inside the cavity (cavity pressure). Specifically, Patent Document 1 discloses a configuration in which pressure sensors are placed near the gate in the cavity and at a position away from the gate. By controlling the operation of the transfer mechanism based on the resin pressure measured by the pressure sensor, it is possible to adjust the resin pressure and the resin filling speed.

JP 2019-1122 A

However, in the technology described in Patent Document 1, because the pressure sensor is installed in the cavity, the resin pressure cannot be measured until the resin material reaches the cavity, making it difficult to measure the resin pressure in detail. Because the resin pressure is used, for example, to control the transfer mechanism and set the cure time, there is a demand for technology that can grasp the resin pressure in more detail.

The present invention was made in consideration of the above situation, and the problem it aims to solve is to provide a resin molding device and a method for manufacturing resin molded products that can grasp the resin pressure in detail.

The problem that the present invention aims to solve is as described above, and in order to solve this problem, the resin molding apparatus of the present invention comprises a lower mold in which a pot is formed for containing resin material, an upper mold arranged opposite the lower mold and having a cull portion formed in a portion facing the pot, a plunger capable of transporting the resin material contained in the pot, a first sensor arranged at a position on the upper mold facing the plunger or at the tip of the plunger and detecting a value related to pressure, a second sensor arranged at a portion of the plunger other than the tip and detecting a value related to the force applied to the plunger, and a control unit that detects the sliding resistance of the plunger by comparing the detection value of the first sensor with the detection value of the second sensor .

The method for manufacturing a resin molded product according to the present invention involves resin molding an object to be molded using the resin molding device.

The present invention allows for detailed understanding of resin pressure.

1 is a schematic plan view showing an overall configuration of a resin molding apparatus according to a first embodiment; 4 is a flowchart showing an example of a method for manufacturing a resin molded product. FIG. FIG. 4 is a schematic diagram showing the arrangement of a transfer mechanism, a pressure sensor, and a load cell. FIG. 4 is a diagram showing an example of a change in resin pressure over time. FIG. 11 is a front cross-sectional view showing a state in which dirt has adhered to the inside of the pot. FIG. 11 is a front cross-sectional view showing the configuration of a molding die according to a second embodiment.

In the following explanation, the directions indicated by the arrows U, D, L, R, F, and B in the figure are defined as the upward direction, downward direction, leftward direction, rightward direction, forward direction, and backward direction, respectively.

<Overall configuration of resin molding device 1>
First, the configuration of a resin molding apparatus 1 according to a first embodiment of the present invention will be described with reference to Fig. 1. The resin molding apparatus 1 resin-seals electronic elements such as semiconductor chips (hereinafter simply referred to as "chips 2a") to manufacture resin molded products. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method.

The resin molding device 1 comprises the following components: a supply module 10, a resin molding module 20, and an unloading module 30. Each component is detachable and replaceable with respect to the other components.

<Supply module 10>
The supply module 10 supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which a chip 2a is mounted, and a resin tablet T to the resin molding module 20. The substrate 2 is one embodiment of a molding object according to the present invention. In this embodiment, a lead frame is exemplified as the substrate 2, but various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) can be used in addition to the lead frame. The supply module 10 mainly includes a frame sending section 11, a frame supply section 12, a resin sending section 13, a resin supply section 14, a loader 15, and a control section 16.

The frame sending section 11 sends out the boards 2 that are not resin-sealed and are stored in an in-magazine unit (not shown) to the frame supplying section 12. The frame supplying section 12 receives the boards 2 from the frame sending section 11, aligns the received boards 2 appropriately, and passes them to the loader 15.

The resin delivery unit 13 receives the resin tablets T from a stocker (not shown) and delivers the resin tablets T to the resin supply unit 14. The resin supply unit 14 receives the resin tablets T from the resin delivery unit 13, aligns the received resin tablets T appropriately, and delivers them to the loader 15.

The loader 15 transports the substrate 2 and resin tablet T received from the frame supply unit 12 and resin supply unit 14 to the resin molding module 20.

The control unit 16 controls the operation of each module of the resin molding device 1. The control unit 16 controls the operation of the supply module 10, the resin molding module 20, and the discharge module 30. The control unit 16 can also be used to arbitrarily change (adjust) the operation of each module.

In this embodiment, an example is shown in which the control unit 16 is provided in the supply module 10, but the control unit 16 can also be provided in other modules. It is also possible to provide multiple control units 16. For example, it is possible to provide a control unit 16 for each module or device, and to control the operations of each module individually while linking them together.

<Resin Molded Module 20>
The resin molding module 20 resin-seals the chip 2a mounted on the substrate 2. In this embodiment, two resin molding modules 20 are arranged side by side. By performing resin sealing of the substrate 2 in parallel using the two resin molding modules 20, it is possible to improve the manufacturing efficiency of resin molded products. The resin molding module 20 mainly includes molding dies (a lower die 110 and an upper die 120) and a die clamping mechanism 21.

The molding dies (lower die 110 and upper die 120) use molten resin material to resin-seal the chip 2a mounted on the substrate 2. The molding dies include a pair of upper and lower dies, that is, the lower die 110 and the upper die 120 (see FIG. 3). The molding dies are provided with a heating unit (not shown) such as a heater.

The mold clamping mechanism 21 clamps or opens the molding dies (lower die 110 and upper die 120) by moving the lower die 110 up and down.

<Exit Module 30>
The unloading module 30 receives and unloads the resin-sealed substrate 2 from the resin molding module 20. The unloading module 30 mainly includes an unloader 31 and a substrate accommodation unit 32.

The unloader 31 holds the resin-sealed substrate 2 and transports it to the substrate storage section 32. The substrate storage section 32 stores the resin-sealed substrate 2.

<Outline of Operation of Resin Molding Apparatus 1>
Next, an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1) will be described with reference to FIGS.

The method for manufacturing a resin molded product according to this embodiment mainly includes a loading process S10, a resin molding process S20, and a removal process S30.

The loading process S10 is a process of loading the substrate 2 and the resin tablet T into the resin molding module 20.

In the loading step S10, the frame sending section 11 sends out the substrates 2 stored in the in-magazine unit (not shown) to the frame supplying section 12. The frame supplying section 12 properly aligns the received substrates 2 and passes them to the loader 15.

The resin delivery unit 13 also sends the resin tablets T received from a stocker (not shown) to the resin supply unit 14. The resin supply unit 14 transfers the required number of the received resin tablets T to the loader 15.

The loader 15 transports the received substrate 2 and resin tablet T to the molding die of the resin molding module 20. After the substrate 2 and resin tablet T are transported to the molding die, the process moves from the loading step S10 to the resin molding step S20.

The resin molding process S20 is a process for resin-sealing the chip 2a mounted on the substrate 2.

In the resin molding process S20, the mold clamping mechanism 21 raises the lower mold 110 to clamp the mold. Then, the resin tablet T is heated and melted by a heating section (not shown) of the mold, and the resulting molten resin is used to resin seal the substrate 2. After a predetermined time (cure time) has elapsed until the resin material hardens, the process moves from the resin molding process S20 to the unloading process S30. Specifically, the cure time refers to the time from when the rise of the transfer shaft 131, which will be described later, stops until the resin material hardens to an extent that at least the resin molded product can be properly released when the mold is opened.

The unloading process S30 is a process of receiving the resin-sealed substrate 2 from the resin molding module 20 and unloading it.

In the removal step S30, the mold clamping mechanism 21 opens the mold. Then, the resin-sealed substrate 2 is released. The unloader 31 then removes the substrate 2 from the mold and stores it in the substrate storage section 32 of the removal module 30. At this time, unnecessary parts of the resin-molded substrate 2 (culls, runners, etc.) are appropriately removed.

<Detailed Configuration of Resin Molded Module 20>
Next, a more detailed description will be given of the configuration of the resin molding module 20. As shown in Fig. 3, the resin molding module 20 mainly includes a lower mold 110, an upper mold 120, a transfer mechanism 130, a pressure sensor 140, a load cell 150, and a mold clamping mechanism 21.

<Lower die 110>
The lower die 110 forms the lower part of the molding die and mainly includes a pot block 111 and a lower die cavity block 112.

The pot block 111 is a portion in which the resin tablets T supplied from the supply module 10 are stored. The pot block 111 has a plurality of through holes (pots 111a) arranged in a front-to-back arrangement (five in this embodiment) for storing the resin tablets T (see FIG. 1).

The lower die cavity block 112 forms the bottom surface of the cavity C. The lower die cavity blocks 112 are arranged on the left and right sides of the pot block 111. A recess having a shape corresponding to the substrate 2 is appropriately formed on the upper surface of the lower die cavity block 112. The substrate 2 can be placed in the recess of the lower die cavity block 112.

<Upper mold 120>
The upper mold 120 forms the upper part of the molding die and mainly includes a cull block 121 and an upper mold cavity block 122.

The cull block 121 is disposed in a position opposite the pot block 111 of the lower mold 110. The lower surface of the cull block 121 is formed with a groove-shaped cull portion 121a and a runner portion 121b for guiding the resin material to the cavity C. The cull portion 121a is formed in a position opposite each pot 111a of the lower mold 110 in the vertical direction.

The upper die cavity block 122 forms the top surface of cavity C. The upper die cavity blocks 122 are disposed on the left and right sides of the cull block 121. The upper die cavity block 122 is disposed opposite the lower die cavity block 112. A recess having a shape corresponding to the resin molded product is appropriately formed on the bottom surface of the upper die cavity block 122.

In this embodiment, the runner portion 121b and the upper surface of the cavity C are formed on the upper mold 120, but the present invention is not limited to this. For example, the lower surface of the runner portion and the cavity C may be formed on the lower mold cavity block 112 of the lower mold 110, etc.

A cavity C having a shape corresponding to the resin molded product is formed between the pair of upper and lower dies 110 and 120 configured in this way. In addition, the lower die 110 can be moved up and down by the die clamping mechanism 21.

<Transfer mechanism 130>
3 and 4 serves to supply the resin material to the cavity C. The transfer mechanism 130 mainly includes a transfer shaft 131, a mounting portion 132, a plunger 133, and a load cell 134.

The transfer shaft 131 is a member that can move up and down. The transfer shaft 131 can be moved up and down as desired by power transmitted from a drive source (not shown), such as a servo motor or an air cylinder. Multiple transfer shafts 131 (two in this embodiment) are provided for one molding die (lower die 110) so as to be aligned in the front-to-rear direction (see FIG. 4).

The mounting portion 132 is for mounting the plunger 133 to the transfer shaft 131. The mounting portion 132 is formed in a substantially rectangular parallelepiped shape. The mounting portion 132 is provided across the upper portions of the multiple transfer shafts 131.

The plunger 133 injects the resin tablet T (resin material) contained in the pot 111a of the pot block 111 and transfers it to the cavity C. The plunger 133 is arranged so that it can move up and down (raise and lower) within the pot 111a. The lower part of the plunger 133 is attached to the upper part of the attachment part 132 via the load cell 150 described later. Multiple plungers 133 (five in this embodiment) are provided so as to be aligned in the front-to-rear direction (see FIG. 4).

The load cell 134 is for detecting the load applied to the transfer shaft 131. The load cell 134 is provided on the upper part of the transfer shaft 131 (between the transfer shaft 131 and the mounting portion 132). In this embodiment, the load cell 134 is provided on one of the multiple transfer shafts 131. By detecting the load applied to the transfer shaft 131 using the load cell 134, it is possible to detect the injection force of the resin material by the transfer mechanism 130 (transfer output). Based on this detection value, the transfer output, the movement speed of the plunger 133, etc. can be controlled.

<Pressure Sensor 140>
The pressure sensor 140 is for detecting the pressure of the resin material being transferred to the cavity C. The pressure sensor 140 is one embodiment of a first sensor for detecting a value related to pressure according to the present invention. The pressure sensor 140 can detect the pressure applied to a detection surface (diaphragm) that is elastically deformable and provided on an end face, based on the amount of deformation of the detection surface. As the pressure sensor 140, for example, a mold pressure sensor for thermosetting resin (model: 6167A) manufactured by Kistler Japan Ltd. can be used.

The pressure sensor 140 is provided in the cull portion 121a of the cull block 121 at a position facing the plunger 133. More specifically, the pressure sensor 140 is provided at a position overlapping the plunger 133 when viewed from the movement direction of the plunger 133 (the vertical direction in this embodiment). In this embodiment, the pressure sensor 140 is provided coaxially with the plunger 133. That is, the pressure sensor 140 is located on a vertical line passing through the center of the plunger 133 in the cross-sectional view shown in FIG. 3. At this time, the pressure sensor 140 is located directly above the plunger 133. The pressure sensor 140 is provided so as to be embedded in the cull block 121 with the detection surface facing downward. The lower end surface (detection surface) of the pressure sensor 140 is arranged on approximately the same plane as the lower surface of the cull portion 121a. By being arranged in this manner, the detection surface of the pressure sensor 140 can directly contact the resin material transferred to the cavity C. In other words, the pressure sensor 140 can directly detect the pressure of the resin material without going through other components.

As shown in FIG. 4, multiple pressure sensors 140 are provided to correspond to multiple plungers 133. In this embodiment, one pressure sensor 140 is provided above each of the five plungers 133. In this way, by providing a pressure sensor 140 corresponding to each plunger 133 in the cull block 121, the resin pressure for each plunger 133 can be detected individually, and this detection result can be used to control the operation of the resin molding device 1 and to understand the state during resin molding.

The load cell 150 is for detecting the load applied to the plunger 133. The load cell 150 is one embodiment of the second sensor for detecting a value related to a force according to the present invention. The load cell 150 is provided below the plunger 133 (between the plunger 133 and the mounting portion 132). In this embodiment, multiple load cells 150 are provided to correspond to the multiple plungers 133. In this embodiment, one load cell 150 is provided below each of the five plungers 133.

<How to determine the cure time>
Next, a method for determining the cure time based on the detection value of the pressure sensor 140 will be described.

Figure 5 shows an example of the change over time in the detection value of the pressure sensor 140 when the resin material is transferred to the cavity C and the substrate 2 is resin-sealed in the resin molding process S20 (see Figure 2). The horizontal axis of Figure 5 indicates the time that has elapsed since the transfer of the resin material by the transfer mechanism 130 began. The vertical axis of Figure 5 indicates the detection value of the pressure sensor 140 (i.e., the pressure of the resin material). For ease of explanation, the pressure of the resin material detected by the pressure sensor 140 will be referred to as the "resin pressure" below.

The transfer mechanism 130 starts to raise the transfer shaft 131, and the transfer of the resin material begins. Then, the resin material pushed out of the pot block 111 by the plunger 133 immediately comes into contact with the pressure sensor 140 located directly above the plunger 133 (see FIG. 3). Therefore, as shown in FIG. 5, the pressure sensor 140 can detect the resin pressure immediately after the transfer of the resin material begins. Note that the three lines shown in FIG. 5 are examples of the detection results from three of the five pressure sensors 140 provided.

When the transfer mechanism 130 starts transferring the resin material, the resin material passes through the cull portion 121a and the runner portion 121b and is supplied to the cavity C. As shown in FIG. 5, from the start of the transfer of the resin material to time t1, the resin pressure fluctuates up and down and gradually increases depending on the flow resistance when the resin material flows through the runner portion 121b, etc.

When the injection of the resin material into the cavity C is completed at time t1, the transfer mechanism 130 stops raising the transfer shaft 131 while applying a predetermined pressure to the injected resin material and maintains this state until the curing time has elapsed after time t1. After the curing time has elapsed (after time t2 has been reached in the example of FIG. 5), the process moves to the unloading step S30 (see FIG. 2), and the resin-sealed substrate 2 is unloaded from the molding die.

Here, the value of the cure time that is determined is important from the standpoint of improving the quality of the resin molded product and increasing production efficiency. In this embodiment, the cure time can be determined to an appropriate value based on the resin pressure detected by the pressure sensor 140.

As shown in FIG. 5, after the injection of the resin material into cavity C is completed (after time t1), the resin pressure gradually decreases. This is because the resin material gradually hardens and shrinks, causing a decrease in the pressure applied to the pressure sensor 140. After a certain amount of time has passed (after time t2), the resin pressure becomes roughly constant. This is because the hardening of the resin material is roughly completed and the shrinkage of the resin material has stopped.

Therefore, by determining the time t2 when the resin pressure stops decreasing and becomes roughly constant as the cure time, it is possible to move to the unloading process S30 after the resin material has hardened without having to wait for a long time unnecessarily. The cure time can be determined in advance by performing test resin molding and detecting the change in resin pressure over time before starting the production of the actual resin molded product.

The cure time can also be determined automatically by the control unit 16. For example, based on the detection result of the pressure sensor 140 shown in FIG. 5, the control unit 16 can automatically determine the cure time to be the time from time t1 when the injection of the resin material into the cavity C is completed to time t2 when the resin pressure becomes approximately constant.

<Method of detecting dirt on pot 111a>
Next, a method for detecting the presence or absence of dirt in the pot 111a by comparing the detection values of the pressure sensor 140 and the load cell 150 will be described.

Figure 6 shows a schematic diagram of the state in which dirt A has adhered to the inside of pot 111a (the inner surface of pot 111a). It is conceivable that by repeatedly performing resin molding, dirt A made of resin material will adhere to the inside of pot 111a as shown in Figure 6. If dirt A adheres to the inside of pot 111a, it may hinder the sliding of plunger 133, preventing normal transfer of resin material to cavity C. Therefore, it is desirable to detect the presence or absence of dirt A in pot 111a and perform cleaning at an appropriate time.

In this embodiment, the presence or absence of dirt A in the pot 111a can be detected by comparing the detection values of the pressure sensor 140 and the load cell 150. Specifically, when dirt A is not attached to the pot 111a, there is a certain relationship between the detection value of the pressure sensor 140 when the plunger 133 is raised to inject the resin material into the cavity C (up to time t1 in FIG. 5) and the detection value of the load cell 150 corresponding to this pressure sensor 140.

In contrast, when dirt A adheres to pot 111a, the sliding resistance of plunger 133 increases, causing the detection value of load cell 150 to increase relative to the detection value of pressure sensor 140. By detecting this change in the relationship between the detection values of pressure sensor 140 and load cell 150, it is possible to detect that dirt A has adhered to pot 111a. Furthermore, by detecting the increase in the detection value of load cell 150 relative to the detection value of pressure sensor 140, it is possible to detect not only the presence or absence of dirt A, but also the amount of dirt A (degree of dirtiness).

In this embodiment, when a resin molded product is manufactured, the control unit 16 compares the detection values of the pressure sensor 140 and the load cell 150 and detects changes in the sliding resistance of the plunger 133, thereby quickly detecting contamination A in the pot 111a and cleaning the pot 111a at an appropriate timing. Here, the time of manufacturing a resin molded product refers to, for example, the time when the plunger 133 is raised to inject resin material into the cavity C.

In particular, in this embodiment, the pressure sensor 140 is positioned directly above the plunger 133 (on an extension of the sliding direction of the plunger 133), so the pressure of the resin material pushed out by the plunger 133 is detected by the pressure sensor 140 without passing through the runner portion 121b or the like. Therefore, the detection value of the pressure sensor 140 is less affected by the flow resistance of the resin material, and the relationship between the detection value of the pressure sensor 140 and that of the load cell 150 can be clearly understood. Therefore, the dirt A can be detected with high accuracy.

It is also possible to detect the presence or absence of dirt A in the pot 111a using the detection value of the load cell 134 (see FIG. 4) provided on the transfer shaft 131, instead of the load cell 150 provided on each plunger 133. In this case, dirt A in the pot 111a can be detected by comparing the sum of the detection values of the load cells 134 provided on the transfer mechanism 130 with the sum of the detection values of the pressure sensor 140 that detects the pressure of the resin transferred by the transfer mechanism 130. For example, in this embodiment (see FIG. 4), dirt A in the pot 111a can be detected by comparing the detection value of one load cell 134 provided on the transfer shaft 131 with the sum of the detection values of the five pressure sensors 140.

Second Embodiment
A modified example (second embodiment) of the arrangement of the pressure sensor 140 will be described below.

In the above-mentioned first embodiment (see FIG. 3, etc.), an example is shown in which the pressure sensor 140 is provided in the cull portion 121a of the cull block 121, but the arrangement of the pressure sensor 140 is not limited to this. In the second embodiment (see FIG. 7), an example is shown in which the pressure sensor 140 is provided at the tip of the plunger 133.

As shown in FIG. 7, the pressure sensor 140 according to the second embodiment is disposed at the center of the plunger 133 (on the axis of the plunger 133). The pressure sensor 140 is embedded in the plunger 133 with the detection surface facing upwards. The upper end surface (detection surface) of the pressure sensor 140 is disposed on approximately the same plane as the upper surface of the plunger 133. By being disposed in this manner, the detection surface of the pressure sensor 140 can directly contact the resin material being transferred to the cavity C.

By using the pressure sensor 140 according to the second embodiment, the resin pressure can be detected immediately after the transfer mechanism 130 starts transferring the resin material, as in the first embodiment. Also, as in the first embodiment, the pressure sensor 140 can be used to determine the cure time and detect dirt A in the pot 111a.

As described above, the resin molding device 1 according to the above embodiment includes a lower mold 110 in which a pot 111a for containing a resin material is formed, an upper mold 120 that is disposed opposite the lower mold 110 and has a cull portion 121a formed in a portion that faces the pot 111a, a plunger 133 that can transfer the resin material contained in the pot 111a, and a pressure sensor 140 (first sensor) that is disposed at a position on the upper mold 120 that faces the plunger 133 (see FIG. 3) or at the tip of the plunger 133 (see FIG. 7) and detects a value related to pressure.

This configuration allows the resin pressure to be grasped in detail. Specifically, the pressure sensor 140, which is provided at a position opposite the plunger 133 or at the tip of the plunger 133, makes it possible to detect the resin pressure immediately after the plunger 133 transfers the resin material. Based on the resin pressure detected in this way, it is possible to determine the cure time and the timing for cleaning the pot 111a, etc.

Furthermore, if a pressure sensor were provided directly in cavity C to detect the resin pressure, a trace of the pressure sensor would be formed on the surface of the product after resin molding. When the resin-sealed product is divided into individual pieces to become the final product, if some of the products have traces of the pressure sensor on the outside and some do not, these products may not be recognized as being of the same quality, which is undesirable. In contrast, in this embodiment (first and second embodiments), the pressure sensor 140 is not provided directly in cavity C, so there is no impact on the quality of the product.

In addition, in order to grasp the resin pressure, a pressure sensor is provided on the ejector pin provided opposite cavity C, and the resin pressure is detected by detecting the pressure applied to the ejector pin. However, due to the sliding resistance of the ejector pin, an error occurs between the actual resin pressure and the detection value of the pressure sensor, making it difficult to detect the resin pressure accurately. In contrast, in this embodiment (first and second embodiments), the pressure sensor 140 is provided in the part that directly contacts the resin material (such as the tip of plunger 133), so no error occurs and the resin pressure can be detected with high accuracy.

In addition, there are also products (resin molding devices 1) that do not generally have a pressure sensor or ejector pin in cavity C. For such products, a configuration in which a pressure sensor 140 is provided at the tip of plunger 133, as in this embodiment (first and second embodiments), is useful.

In addition, multiple pressure sensors 140 are provided corresponding to the multiple plungers 133.

By configuring it in this way, the pressure of the resin transferred by each plunger 133 can be detected individually, allowing for a more detailed understanding of the resin pressure.

The resin molding device 1 further includes a control unit 16 that determines the cure time based on the detection value of the pressure sensor 140.

This configuration makes it easy to determine the cure time. In particular, as in the above embodiment, the cure time can be determined using the resin pressure detected in detail by the pressure sensor 140, so that an appropriate cure time can be set.

The resin molding device 1 further includes a load cell 150 (second sensor) that is provided at a portion of the plunger 133 different from the tip portion and detects a value related to the force applied to the plunger 133, and the control unit 16 compares the detection value of the pressure sensor 140 with the detection value of the load cell 150.

By configuring it in this way, it is possible to compare and understand what value the resin pressure takes in relation to the load applied to the plunger 133. In addition, this comparison result can be used as information to understand the state of the resin molding device 1 (e.g., whether or not there is an abnormality in the resin pressure, etc.).

The control unit 16 also detects the sliding resistance of the plunger 133 by comparing the detection value of the pressure sensor 140 with the detection value of the load cell 150.

This configuration makes it possible to detect the presence or absence of dirt inside the pot 111a in which the plunger 133 is provided. This allows cleaning of the pot 111a at the appropriate time.

Furthermore, the load cells 150 are provided in multiple numbers corresponding to the multiple plungers 133.

By configuring it in this way, the load applied to each plunger 133 can be detected individually. This makes it possible to individually detect whether or not each pot 111a is dirty.

The method for manufacturing a resin molded product according to this embodiment uses a resin molding device 1 to resin mold the object to be molded.

This configuration allows the resin pressure to be monitored in detail. It also allows the appropriate curing time to be determined and the presence or absence of dirt on the pot 111a to be detected, improving the quality of the resin molded product and increasing production efficiency.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical concept of the invention described in the claims.

For example, the components (such as the supply module 10) used in the resin molding apparatus 1 of the above embodiment are examples, and can be attached, detached, or replaced as appropriate. For example, the number of resin molding modules 20 can be changed. In addition, the configurations and operations of the components (such as the supply module 10) used in the resin molding apparatus 1 of this embodiment are examples, and can be changed as appropriate.

In the above embodiment, an example is shown in which a tablet-shaped resin material (resin tablet T) is used, but the present invention is not limited to this. In other words, the resin material can be in any form, such as a powder (including granules and powder), liquid, or not just a tablet.

The number of transfer shafts 131, plungers 133, pots 111a, etc., as exemplified in the above embodiment, is not limited and can be changed as desired. The number of various sensors (load cells 134, pressure sensors 140, and load cells 150) is also not particularly limited and can be changed as desired.

In addition, in the above embodiment, an example was shown in which multiple pressure sensors 140 were provided to correspond to multiple plungers 133, but the present invention is not limited to this. In other words, it is not necessary to provide the same number of pressure sensors 140 as the plungers 133, and the number of pressure sensors 140 can be less than or greater than the number of plungers 133. For example, it is possible to provide only one pressure sensor 140 to correspond to any one of the plungers 133. Similarly, it is not necessary to provide the same number of load cells 150 as the multiple plungers 133, and the number can be set arbitrarily.

In the above first embodiment, the pressure sensor 140 is provided in the cull block 121 (cull portion 121a), but the present invention is not limited to this. The pressure sensor 140 may be provided in a position facing the plunger 133 or at the tip of the plunger 133, and may be capable of detecting the resin pressure immediately after the transfer of the resin begins. There are no limitations on the member to which the pressure sensor 140 can be attached.

In addition, in the above embodiment, an example in which the pressure sensor 140 is provided at a position facing the plunger 133 (cull block 121) (see FIG. 3) and an example in which the pressure sensor 140 is provided at the tip of the plunger 133 (see FIG. 7) are shown, but the present invention is not limited to this. In other words, it is also possible to provide the pressure sensor 140 not only on the cull block 121 or the plunger 133, but on both.

In the above embodiment, the control unit 16 determines the cure time and detects the sliding resistance of the plunger 133 (presence or absence of dirt A), but the present invention is not limited to this, and the cure time, etc. may be determined by human judgment. In this case, for example, the control unit 16 can be configured to notify a person of information necessary for determining the cure time, etc., by outputting the detection values of the pressure sensor 140, etc., and the comparison results between the detection values of the pressure sensor 140 and the load cell 150, etc., to an output device such as a display.

Furthermore, in the above embodiment, the pressure sensor 140 is used, but it is also possible to calculate the pressure from the area and a value detected by a sensor that detects force.
Furthermore, in the above embodiment, the load cell 134 for detecting the load is used, but instead of this, a sensor for detecting a force can also be used.

REFERENCE SIGNS LIST 1 Resin molding device 16 Control unit 110 Lower die 111a Pot 120 Upper die 121a Cul portion 133 Plunger 140 Pressure sensor 150 Load cell

Claims (5)

a lower mold in which a pot for accommodating a resin material is formed;
an upper die provided opposite the lower die and having a cull portion formed in a portion opposite the pot;
a plunger capable of transferring the resin material contained in the pot;
a first sensor provided at a position of the upper die facing the plunger or at a tip of the plunger, the first sensor detecting a value related to pressure;
a second sensor provided at a portion of the plunger different from the tip portion and configured to detect a value related to a force applied to the plunger;
a control unit that detects a sliding resistance of the plunger by comparing a detection value of the first sensor with a detection value of the second sensor;
A resin molding apparatus comprising: The first sensor is provided in a plurality of sensors corresponding to the plurality of plungers.
The resin molding apparatus according to claim 1 . The control unit determines a cure time based on the detection value of the first sensor .
The resin molding apparatus according to claim 1 or 2. The second sensor is provided in a plurality of sensors corresponding to the plurality of plungers.
The resin molding apparatus according to any one of claims 1 to 3 . A resin molding apparatus according to any one of claims 1 to 4 is used to resin mold a molding object.
A method for manufacturing a resin molded product.

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