JP7565010B2 - Evaporation mask apparatus, method for manufacturing the deposition mask apparatus, and method for manufacturing an organic device - Google Patents

Description

Embodiments of the present disclosure relate to a deposition mask device, a method for manufacturing a deposition mask device, and a method for manufacturing an organic device.

There is a demand in the market for high-definition display devices for electronic devices such as smartphones and tablet PCs. Display devices have pixel densities of, for example, 400 ppi or more or 800 ppi or more.

As such a display device, organic EL display devices with good responsiveness and/or high contrast have been attracting attention. A method of forming pixels in an organic EL display device is known in which the material constituting the pixels is evaporated onto a substrate. In this case, a deposition mask device is first prepared that includes a deposition mask including a through-hole and a frame that supports the deposition mask. Next, in the deposition device, deposition materials such as organic and/or inorganic materials are evaporated with the deposition mask in close contact with the substrate. As a result, the deposition material adheres to the substrate to form a deposition layer. The deposition layer constitutes the display area of the organic EL display device.

The deposition mask is designed so that the positions of the through holes correspond to the size of the display area of the organic EL display device. When forming a new deposition layer for an organic EL display device, a deposition mask corresponding to the size of the display area is prepared.

Patent No. 5382259

As described above, the deposition mask supported by the frame of the deposition mask device has a structure that corresponds to a specific organic EL display device.

The purpose of the present disclosure is to improve versatility.

The deposition mask device according to an embodiment of the present disclosure includes a frame, a deposition mask, and a support. The frame includes a first surface and a second surface located on the opposite side to the first surface. The frame includes a first portion, a second portion facing the first portion across the opening in the first direction, a third portion, and a fourth portion facing the third portion across the opening in a second direction different from the first direction. The deposition mask includes a first end fixed to the first surface of the third portion, a second end fixed to the first surface of the fourth portion, and a plurality of through holes overlapping the opening in a plan view. The support is fixed to the frame. The support is located on the second surface side with respect to the deposition mask. The deposition mask includes a through hole group composed of a plurality of through holes, and a plurality of beams connecting the first end and the second end. The support includes a plurality of cover members arranged in a first direction, the cover members including a third end fixed to a first surface of the third portion and a fourth end fixed to a first surface of the fourth portion. The beams include a first beam located on the first portion side of the through hole group and a second beam located on the second portion side of the through hole group. The cover members include a first cover member and a second cover member located on the second portion side of the first cover member. The first cover member overlaps the first beam in a plan view. The second cover member overlaps the second beam in a plan view. An exposed region that exposes the through holes to the opening is located between the first cover member and the second cover member. The first cover member overlaps some of the through holes in a plan view.

A method for manufacturing a deposition mask device according to an embodiment of the present disclosure includes a step of preparing a frame, a step of fixing a support to the frame, and a step of fixing a deposition mask to the frame. The frame includes a first surface and a second surface located on the opposite side to the first surface. The frame includes a first portion, a second portion facing the first portion across the opening in the first direction, a third portion, and a fourth portion facing the third portion across the opening in a second direction different from the first direction in a plan view. The support includes a support including a plurality of cover members arranged in the first direction. In the step of fixing the support to the frame, a third end of the cover member is fixed to the first surface of the third portion, and a fourth end of the cover member is fixed to the first surface of the fourth portion. After the step of fixing the support, the deposition mask is fixed to the frame. In the step of fixing the deposition mask to the frame, a first end of the deposition mask is fixed to the first surface of the third portion, and a second end of the deposition mask is fixed to the first surface of the fourth portion. The deposition mask is fixed to the frame so that the through holes of the deposition mask overlap the opening in a plan view and the support is located on the second surface side of the deposition mask. The deposition mask includes a through hole group composed of a plurality of through holes and a plurality of beams connecting the first end and the second end. The beams include a first beam located on the first portion side of the through hole group and a second beam located on the second portion side of the through hole group. The cover members include a first cover member and a second cover member located on the second portion side of the first cover member. In the step of fixing the deposition mask, the first cover member overlaps the first beam in a plan view, and the second cover member overlaps the second beam in a plan view. An exposure region that exposes the through holes to the opening is located between the first cover member and the second cover member. The first cover member overlaps some of the through holes in a plan view.

A method for manufacturing an organic device according to an embodiment of the present disclosure includes the steps of preparing the deposition mask device described above, attaching a deposition mask of the deposition mask device to a substrate, and forming a deposition layer by depositing a deposition material on the substrate by passing the deposition material through the openings of the frame, the exposed areas of the deposition mask device, and the through holes. In the step of forming the deposition layer, the deposition layer is formed at a position corresponding to the exposed areas.

Embodiments of the present disclosure can improve versatility.

FIG. 1 is a diagram showing a deposition apparatus including a deposition mask device according to an embodiment of the present disclosure. 2 is a plan view of the deposition mask device of FIG. 1 as viewed from a first surface side of a frame. 3 is a cross-sectional view taken along line AA in FIG. 2. 3 is a cross-sectional view taken along line BB in FIG. 2. 3 is a plan view showing a second surface of the deposition mask of FIG. 2. 3 is a partially enlarged plan view of an effective area of the deposition mask in FIG. 2 as viewed from a second surface side. FIG. 7 is a cross-sectional view taken along line CC in FIG. 6. 3 is a plan view of the mask support mechanism of FIG. 2 as viewed from the first surface side of the frame. 3 is a partially enlarged plan view of the deposition mask device of FIG. 2 as viewed from a second surface side of the frame. FIG. 3 is an enlarged plan view showing an example of an element of an organic EL display device manufactured using the deposition mask device of FIG. 2. 11 is a cross-sectional view taken along line DD of the organic EL display device of FIG. 10. 3 is a plan view showing a substrate on which a single-color organic layer is formed using the deposition mask device of FIG. 2. FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 10 is a partially enlarged plan view showing a modified example of the deposition mask device in FIG. 9 . FIG. 9 is a plan view showing a modified example of the mask support mechanism of FIG. 8 .

In this specification and drawings, unless otherwise specified, terms that refer to a material that is the basis of a certain configuration, such as "substrate," "base material," "plate," "sheet," and "film," are not to be distinguished from one another solely on the basis of differences in name.

Unless otherwise specified, in this specification and drawings, terms that specify shapes, geometric conditions, and the extent of those conditions, such as "parallel" and "orthogonal," and values of lengths and angles, are to be interpreted without being bound by strict meanings, but rather to include a range within which similar functions may be expected.

In this specification and drawings, unless otherwise specified, when a certain configuration such as a certain member or a certain region is described as being "on" or "under", "upper" or "lower" or "above" or "below" another configuration such as another member or another region, this includes the case where the certain configuration is in direct contact with the other configuration. It also includes the case where another configuration is included between a certain configuration and the other configuration, that is, where the configuration is indirectly in contact. Also, unless otherwise specified, the words "on", "upper side", "upper", or "lower", or "lower", "lower side", and "lower" may be used in the up-down direction.

In this specification and drawings, unless otherwise specified, identical parts or parts having similar functions are given the same or similar symbols, and repeated explanations may be omitted. In addition, the dimensional ratios of the drawings may differ from the actual ratios for the convenience of explanation, and some components may be omitted from the drawings.

Unless otherwise specified in this specification and drawings, the present invention may be combined with other embodiments and modified examples as long as no contradictions arise. In addition, other embodiments may be combined with each other, or other embodiments and modified examples may be combined as long as no contradictions arise. Modified examples may be combined as long as no contradictions arise.

Unless otherwise specified in this specification and drawings, when multiple steps are disclosed in a method such as a manufacturing method, other steps that are not disclosed may be performed between the disclosed steps. In addition, the order of the disclosed steps is arbitrary to the extent that no contradiction occurs.

In this specification and drawings, unless otherwise specified, a numerical range expressed by the symbol "to" includes the numerical values before and after the symbol. For example, the numerical range defined by the expression "34 to 38% by mass" is the same as the numerical range defined by the expression "34% by mass or more and 38% by mass or less."

In one embodiment of this specification, an example is described relating to a deposition mask used to pattern an organic material in a desired pattern on a substrate when manufacturing an organic EL display device, and a method for manufacturing the same. However, the present embodiment can be applied to deposition masks used for various purposes without being limited to such applications. For example, the mask of the present embodiment may be used to manufacture a device for displaying or projecting images or videos to represent virtual reality, so-called VR, or augmented reality, so-called AR.

A first aspect of the present disclosure is a method for manufacturing a semiconductor device comprising:
a frame including a first surface and a second surface located on the opposite side of the first surface, the frame including a first portion, a second portion facing the first portion across an opening in a first direction, a third portion, and a fourth portion facing the third portion across the opening in a second direction different from the first direction;
a deposition mask including a first end fixed to the first surface of the third portion, a second end fixed to the first surface of the fourth portion, and a plurality of through holes overlapping with the opening in a plan view;
a support fixed to the frame and positioned on the second surface side of the deposition mask,
the deposition mask includes a through hole group formed of a plurality of the through holes, and a plurality of beams connecting the first end and the second end,
the support body includes a plurality of cover members each including a third end fixed to the first surface of the third portion and a fourth end fixed to the first surface of the fourth portion, the plurality of cover members being arranged in the first direction;
the plurality of beams include a first beam located on a side of the first portion with respect to the through hole group, and a second beam located on a side of the second portion with respect to the through hole group,
The plurality of cover members include a first cover member and a second cover member located on a side of the second portion with respect to the first cover member,
The first cover member overlaps the first beam in a plan view,
The second cover member overlaps the second beam in a plan view,
an exposure region that exposes the through hole to the opening is located between the first cover member and the second cover member;
a deposition mask device, wherein the first cover member overlaps with a part of the through hole in a plan view;
It is.

A second aspect of the present disclosure is a deposition mask apparatus according to the first aspect,
a plurality of the deposition masks arranged in the first direction are fixed to the third portion and the fourth portion,
the plurality of deposition masks include a first deposition mask and a second deposition mask located on a side of the first deposition mask facing the first portion and adjacent to the first deposition mask,
the first cover member overlaps the first beams of the first deposition mask and the second beams of the second deposition mask in a plan view, and overlaps the through hole of a part of the first deposition mask in a plan view,
the second cover member overlaps the second beam of the first deposition mask in a plan view.
This may be done.

A third aspect of the present disclosure is a deposition mask apparatus according to the second aspect,
the first cover member overlaps with the through hole of a part of the second deposition mask in a plan view;
This may be done.

A fourth aspect of the present disclosure is a deposition mask apparatus according to the second aspect or the third aspect,
the plurality of deposition masks include a third deposition mask located on a side of the first deposition mask facing the second portion and adjacent to the first deposition mask,
the second cover member overlaps the first beam of the third deposition mask in a plan view.
This may be done.

A fifth aspect of the present disclosure is a deposition mask apparatus according to the fourth aspect,
the second cover member overlaps with the through hole of a part of the first deposition mask in a plan view.
This may be done.

A sixth aspect of the present disclosure is a deposition mask apparatus according to the fourth aspect or the fifth aspect,
the second cover member overlaps with the through hole of a part of the third deposition mask in a plan view.
This may be done.

A seventh aspect of the present disclosure is a deposition mask apparatus according to any one of the first to sixth aspects described above,
the support includes a support member including a fifth end fixed to the first surface of the first portion and a sixth end fixed to the first surface of the second portion;
the support member overlaps with the through hole group in a plan view,
The support member divides the through hole group into a plurality of the exposed regions.
This may be done.

An eighth aspect of the present disclosure is a deposition mask apparatus according to any one of the first to sixth aspects,
the support includes a support member including a fifth end fixed to the first surface of the first portion and a sixth end fixed to the first surface of the second portion;
the deposition mask includes a plurality of the through-hole groups aligned in the second direction,
the plurality of through hole groups include a first through hole group and a second through hole group located on a side of the fourth portion with respect to the first through hole group and adjacent to the first through hole group,
the deposition mask includes a beam connection portion that is located between the first through hole group and the second through hole group and connects the first beam and the second beam,
The support member overlaps the beam connection portion in a plan view.
This may be done.

A ninth aspect of the present disclosure is a deposition mask apparatus according to the eighth aspect,
The support member overlaps with a portion of the through holes constituting the first through hole group in a plan view.
This may be done.

A tenth aspect of the present disclosure is a deposition mask apparatus according to the eighth or ninth aspect,
The support member overlaps with a portion of the through holes constituting the second through hole group in a plan view.
This may be done.

An eleventh aspect of the present disclosure is a deposition mask apparatus according to any one of the first to tenth aspects described above,
the plurality of cover members includes a third cover member located between the first cover member and the second cover member,
The exposed area is located between the first cover member and the third cover member,
The exposed area is located between the third cover member and the second cover member.
This may be done.

A twelfth aspect of the present disclosure is a deposition mask apparatus according to the eleventh aspect,
the deposition mask includes a plurality of the through-hole groups aligned in the first direction,
the plurality of through hole groups include a third through hole group and a fourth through hole group located on the second portion side with respect to the third through hole group and adjacent to the third through hole group,
the plurality of beams include a third beam located between the third through hole group and the fourth through hole group,
The third cover member overlaps the third beam in a plan view.
This may be done.

A thirteenth aspect of the present disclosure is a deposition mask apparatus according to the twelfth aspect,
The third cover member overlaps with a portion of the through holes of the third through hole group in a plan view.
This may be done.

A fourteenth aspect of the present disclosure is a deposition mask apparatus according to the twelfth aspect or the thirteenth aspect,
the third cover member overlaps with a portion of the through holes of the fourth through hole group in a plan view;
This may be done.

A fifteenth aspect of the present disclosure is a deposition mask apparatus according to the eleventh aspect,
The third cover member divides the through-hole group into a plurality of the exposed regions.
This may be done.

A sixteenth aspect of the present disclosure is a method for manufacturing a semiconductor device comprising:
a step of preparing a frame including a first surface and a second surface located on the opposite side to the first surface, the frame including a first portion, a second portion facing the first portion in a first direction across an opening, a third portion, and a fourth portion facing the third portion in a second direction different from the first direction in a plan view across the opening;
a step of fixing a support body including a plurality of cover members arranged in the first direction to the frame, the step of fixing the support body to the frame such that a third end of the cover members is fixed to the first surface of the third portion and a fourth end of the cover members is fixed to the first surface of the fourth portion;
a step of fixing a first end of a deposition mask to the first surface of the third portion and a second end of the deposition mask to the first surface of the fourth portion, after the step of fixing the support, wherein the deposition mask is fixed to the frame such that a plurality of through holes of the deposition mask overlap with the openings in a plan view and the support is located on a side of the deposition mask facing the second surface,
the deposition mask includes a through hole group formed of a plurality of the through holes, and a plurality of beams connecting the first end and the second end,
the plurality of beams include a first beam located on a side of the first portion with respect to the through hole group, and a second beam located on a side of the second portion with respect to the through hole group,
The plurality of cover members include a first cover member and a second cover member located on a side of the second portion with respect to the first cover member,
a manufacturing method of a deposition mask device, in which, in the step of fixing the deposition mask, the first cover member overlaps the first beam in a plan view, the second cover member overlaps the second beam in a plan view, an exposed region exposing the through hole to the opening portion is located between the first cover member and the second cover member, and the first cover member overlaps a part of the through hole in a plan view;
It is.

A seventeenth aspect of the present disclosure is a method for manufacturing a semiconductor device comprising:
A step of preparing a deposition mask apparatus according to each of the first to fifteenth aspects described above;
bringing the deposition mask of the deposition mask device into close contact with a substrate;
forming a deposition layer by depositing a deposition material on the substrate by passing the deposition material through the opening of the frame, the exposed region of the deposition mask device, and the through-hole;
a deposition layer formed on the substrate in a position corresponding to the exposed region;
It is.

One embodiment of the present disclosure will be described in detail below with reference to the drawings. Note that the embodiment described below is an example of an embodiment of the present disclosure, and the present disclosure should not be interpreted as being limited to only these embodiments.

First, a deposition apparatus 80 for performing a deposition process in which a deposition material is deposited on a target object will be described with reference to FIG. 1. As shown in FIG. 1, the deposition apparatus 80 may include a deposition source 81, a heater 83, and a deposition mask device 10. The deposition source 81, the heater 83, and the deposition mask device 10 are disposed inside the deposition apparatus 80. The deposition apparatus 80 may further include an exhaust means (not shown) for creating a vacuum atmosphere inside the deposition apparatus 80. The deposition source 81 is, for example, a crucible, and contains a deposition material 82 such as an organic light-emitting material. The heater 83 heats the deposition source 81. This causes the deposition material 82 to evaporate under a vacuum atmosphere. The deposition mask device 10 is disposed so as to face the deposition source 81.

The deposition mask device 10 will be described below. As shown in FIG. 1, the deposition mask device 10 may include a frame 15 and a deposition mask 20. The deposition mask 20 may be fixed to the frame 15. The frame 15 supports the deposition mask 20 in a state where it is pulled in a predetermined direction along a first surface 201 described later so as to prevent the deposition mask 20 from bending.

The deposition mask device 10 is placed in the deposition device 80 as described above. In this case, the deposition mask 20 faces and contacts the first surface 110a of the substrate 110, which is the object to which the deposition material 82 is attached, as shown in FIG. 1. The deposition mask 20 has a plurality of through holes 25 that allow the deposition material 82 coming from the deposition source 81 to pass through. In the following description, the deposition mask 20 may include a first surface 201 and a second surface 202. The first surface 201 is located on the side of the substrate 110. The second surface 202 is located on the opposite side to the first surface 201.

As shown in FIG. 1, the deposition apparatus 80 may include a cooling plate 84. The cooling plate 84 is located on the second surface 110b of the substrate 110 opposite the deposition mask 20. The cooling plate 84 may have a flow path for circulating a refrigerant inside the cooling plate 84. In the deposition process, the substrate 110 is cooled by the cooling plate 84, thereby suppressing a rise in temperature of the substrate 110.

The deposition device 80 may include a magnet 85. The magnet 85 is located on the surface of the cooling plate 84 opposite to the deposition mask 20. The deposition mask 20 can be attracted to the substrate 110 by the magnetic force of the magnet 85, and the deposition mask 20 can be closely attached to the substrate 110. This can suppress the occurrence of a shadow in the deposition process. In this case, the dimensional accuracy and positional accuracy of the organic layer 130 to be described later formed on the substrate 110 can be improved. In this specification, a shadow refers to a phenomenon in which the deposition material 82 gets into the gap between the deposition mask 20 and the substrate 110, causing the thickness of the organic layer 130 to become uneven. Instead of the magnet 85, an electrostatic chuck that utilizes electrostatic force may be used to closely attach the deposition mask 20 to the substrate 110.

Figure 2 is a plan view showing the first surface 201 of the deposition mask 20 of the deposition mask device 10. As shown in Figure 2, the deposition mask device 10 may include a plurality of deposition masks 20 arranged in a first direction D1. In this embodiment, each deposition mask 20 has a rectangular shape extending in a second direction D2 intersecting the first direction D1. Both ends of each deposition mask 20 in the second direction D2 may be fixed to the frame 15 by, for example, welding.

As shown in FIG. 2, the deposition mask device 10 may include a support 60. The support 60 is located between the frame 15 and the deposition mask 20. The support 60 may be fixed to the frame 15. The components including the frame 15 and the support 60 are also referred to as a mask support mechanism 75.

The configuration of the deposition mask device 10 will be described in more detail below with reference to Figures 2 to 4. Figure 3 is a cross-sectional view taken along line A-A in Figure 2. Figure 4 is a cross-sectional view taken along line B-B in Figure 2.

First, let's explain frame 15.

As shown in FIG. 2, the frame 15 has a frame body 150 and an opening 155. The frame body 150 is formed in a rectangular frame shape in a plan view. The opening 155 is formed inside the frame body 150. A plan view means that the deposition mask device 10 is viewed along the normal direction of the first surface 16 of the frame 15.

The frame body 150 includes a first portion 151, a second portion 152, a third portion 153, and a fourth portion 154. The first portion 151 and the second portion 152 are located on both sides of the opening 155 in the first direction D1. The third portion 153 and the fourth portion 154 are located on both sides of the opening 155 in the second direction D2.

As described above, the first direction and the second direction may intersect each other. As shown in FIG. 2, the first direction D1 and the second direction D2 may be perpendicular to each other. The first portion 151 and the second portion 152 may extend in the second direction D2. The third portion 153 and the fourth portion 154 may extend in the first direction D1.

As shown in Figures 3 and 4, the frame 15 includes a first surface 16, a second surface 17, a third surface 18, and a fourth surface 19. The first surface 16 is located on the deposition mask 20 side. The second surface 17 is located on the opposite side to the first surface 16. The third surface 18 is located between the first surface 16 and the second surface 17, and faces the opening 155. The fourth surface 19 is located between the first surface 16 and the second surface 17, and is located on the opposite side to the third surface 18 in the horizontal direction.

The first surface 16 may include a fifth surface 161, a sixth surface 162, and a seventh surface 163. The fifth surface 161 may be located on the side of the fourth surface 19, or may be connected to the fourth surface 19. The sixth surface 162 and the seventh surface 163 may be located on the side of the second surface 17 with respect to the fifth surface 161. The sixth surface 162 and the seventh surface 163 may be located on the side of the third surface 18, or may be connected to the third surface 18. The fifth surface 161 may be formed on each of the first portion 151, the second portion 152, the third portion 153, and the fourth portion 154. The sixth surface 162 may be formed on each of the third portion 153 and the fourth portion 154. The seventh surface 163 may be formed on each of the first portion 151 and the second portion 152. In the normal direction of the fifth surface 161, the distance from the fifth surface 161 to the sixth surface 162 may be greater than the distance from the fifth surface 161 to the seventh surface 163. The deposition mask 20 may be fixed to the fifth surface 161 in the third portion 153 and the fourth portion 154.

The cover member 61 of the support 60, which will be described later, may be fixed to a sixth surface 162 in the third portion 153 and the fourth portion 154. The sixth surface 162 may be formed by cutting a part of the fifth surface 161. The sixth surface 162 may extend along the second direction D2 so as to follow the cover member 61. A groove-shaped space is formed by the sixth surface 162, and the third end 603 and the fourth end 604 of the cover member 61 are accommodated in this space. In order to fix the cover member 61 to the sixth surface 162 in a pulled state, the sixth surface 162 may extend from the third surface 18 to the fourth surface 19. In this case, the sixth surface 162 is connected to the third surface 18 and also to the fourth surface 19.

The support member 62 of the support body 60, which will be described later, may be fixed to the seventh surface 163 in the first portion 151 and the second portion 152. The seventh surface 163 may be formed by cutting a part of the fifth surface 161. The seventh surface 163 may extend along the first direction D1 so as to follow the support member 62. A groove-shaped space is formed by the seventh surface 163, and the fifth end 605 and the sixth end 606 of the support member 62 are accommodated in this space. In order to fix the support member 62 to the seventh surface 163 in a tensioned state, the seventh surface 163 may extend from the third surface 18 to the fourth surface 19. In this case, the seventh surface n163 is connected to the third surface 18 and also to the fourth surface 19.

As shown in FIG. 2, the length of the first portion 151 and the length of the second portion 152 of the frame 15 may be shorter than the length of the third portion 153 and the length of the fourth portion 154. The length of the first portion 151 and the length of the second portion 152 refer to the length in the second direction D2. The length of the third portion 153 and the length of the fourth portion 154 refer to the length in the first direction D1.

Next, the deposition mask 20 will be described with reference to FIG. 2 and FIG. 5 to FIG. 7. FIG. 5 is a plan view showing the second surface of the deposition mask of FIG. 2. FIG. 6 is an enlarged plan view showing a part of the effective area 23 on the second surface 202 of the deposition mask 20. FIG. 7 is a cross-sectional view taken along line CC in FIG. 6.

2 and 5, the deposition mask 20 may be formed in a rectangular shape with the second direction D2 as the longitudinal direction. The deposition mask 20 may have a pair of ears 21A, 21B and an intermediate portion 22. The pair of ears 21A, 21B may be portions fixed to the frame 15. The intermediate portion 22 is located between the pair of ears 21A, 21B. In the following description, the portion of the pair of ears 21A, 21B fixed to the third portion 153 of the frame 15 is also referred to as the first end 211. The first end 211 is fixed to the first surface 16 of the third portion 153. The first end 211 may be fixed to the fifth surface 161. The portion fixed to the fourth portion 154 of the frame 15 is also referred to as the second end 212. The second end 212 is fixed to the first surface 16 of the fourth portion 154 of the frame 15. The second end 212 may be fixed to the fifth surface 161.

The intermediate portion 22 of the deposition mask 20 may have at least one effective region 23 and a peripheral region 24. The peripheral region 24 is located around the effective region 23. In the example shown in FIG. 2, the intermediate portion 22 includes one effective region 23. The peripheral region 24 surrounds the effective region 23 in a plan view.

One effective area 23 may correspond to the display areas 105 of multiple organic EL display devices 100. Each deposition mask 20 shown in FIG. 2 is capable of multi-sided deposition of the display areas 105. More specifically, the deposition mask 20 shown in FIG. 2 is capable of producing multiple organic EL display devices 100.

The effective area 23 may have, for example, a substantially rectangular outline in a plan view. The effective area 23 shown in FIG. 2 and FIG. 5 has a substantially rectangular outline with the second direction D2 as the longitudinal direction. Although not shown, the effective area 23 may have an outline of various shapes depending on the shape of the display area 105 of the organic EL display device 100. For example, the effective area 23 may have a circular outline.

The deposition mask 20 includes a plurality of through holes 25. The through holes 25 overlap the openings 155 in a plan view. The through holes 25 are located between the first end 211 and the second end 212 described above. The through holes 25 are located in the effective area 23.

5 and 6, a through hole group 26 composed of a plurality of through holes 25 is located in the effective area 23. One effective area 23 is composed of one through hole group 26. The effective area 23 may be an area occupied by the through hole group 26. The through hole group 26 overlaps the opening 155 of the frame 15 in a plan view. The through hole group 26 may be configured to form a group of two or more through holes 25. The through hole group 26 is used as a term meaning a collection of a plurality of through holes 25 arranged regularly. The through hole 25 on the outer edge of one through hole group 26 is the through hole 25 located on the outermost side among the plurality of through holes 25 arranged in a similar manner. Outside the through hole 25 on the outer edge of one through hole group 26, there may not be a through hole 25 arranged in a similar manner and intended to pass the deposition material 82. As an example of a regular arrangement, the through holes 25 may be arranged in two directions perpendicular to each other, as shown in Figures 5 and 6.

5, the deposition mask 20 may include the above-mentioned through hole group 26 and a plurality of beams 27A and 27B. In this embodiment, the deposition mask 20 includes one through hole group 26. The beams 27A and 27B connect the first end 211 and the second end 212. The plurality of beams 27A and 27B include a first beam 27A and a second beam 27B. The first beam 27A is located on the first portion 151 side with respect to the through hole group 26. The second beam 27B is located on the second portion 152 side with respect to the through hole group 26. The beams 27A and 27B are located on both sides of the through hole group 26 in the first direction D1. The first beam 27A and the second beam 27B extend in the second direction D2 between one ear 21A and the other ear 21B, and connect the pair of ears 21A and 21B. The first beam 27A and the second beam 27B constitute the surrounding area 24.

The through-hole group 26 may have a generally rectangular outline in a plan view, similar to the effective area 23. The through-hole group 26 may include a first group end 261, a second group end 262, a third group end 263, and a fourth group end 264.

The first group end 261 is an end portion of the through-hole group 26 located on the side of the first portion 151. The first group end 261 may be a tangent line that extends along the second direction D2 and circumscribes the through-hole group 26 on the side of the first portion 151. This tangent line circumscribes the through-hole 25 located closest to the first portion 151.

The second group end 262 is an end portion of the through-hole group 26 located on the second portion 152 side. The second group end 262 may be a tangent line that extends along the second direction D2 and circumscribes the through-hole group 26 on the second portion 152 side. This tangent line circumscribes the through-hole 25 located closest to the second portion 152.

The third group end 263 is an end portion of the through-hole group 26 located on the third portion 153 side. The third group end 263 may be a tangent line that extends along the first direction D1 and circumscribes the through-hole group 26 on the third portion 153 side. This tangent line circumscribes the through-hole 25 located closest to the third portion 153.

The fourth group end 264 is an end portion of the through-hole group 26 located on the side of the fourth portion 154. The fourth group end 264 may be a tangent line that extends along the first direction D1 and circumscribes the through-hole group 26 on the side of the fourth portion 154. This tangent line circumscribes the through-hole 25 located closest to the fourth portion 154.

The through-hole group 26 may be defined by the first group end 261, the second group end 262, the third group end 263, and the fourth group end 264. The above-mentioned effective area 23 may be defined by the first group end 261, the second group end 262, the third group end 263, and the fourth group end 264.

As shown in FIG. 7, a plurality of through holes 25 penetrate from the first surface 201 to the second surface 202 of the deposition mask 20. The through hole 25 may have a first recess 30 and a second recess 35 connected to the first recess 30. The first recess 30 is located on the first surface 201. The second recess 35 is located on the second surface 202. The first recess 30 and the second recess 35 are each formed by etching a metal plate, which is the base material of the deposition mask 20, from both sides.

6 and 7, the wall surface 31 of the first recess 30 and the wall surface 36 of the second recess 35 may be connected via a circumferential connecting portion 41. The connecting portion 41 may define a through portion 42 in which the opening area of the through hole 25 is minimized in a plan view of the deposition mask 20.

As shown in FIG. 7, two adjacent first recesses 30 are spaced apart from each other. Two adjacent second recesses 35 may be spaced apart from each other. The second surface 202 may remain between two adjacent second recesses 35. In the following description, the portion of the second surface 512 that remains unetched between two adjacent second recesses 35 is also referred to as a top portion 43. By fabricating the deposition mask 20 so that such a top portion 43 remains, the strength of the deposition mask 20 can be improved. This can prevent the deposition mask 20 from being deformed or damaged, for example, during transportation. The width of this top portion 43 is indicated by the symbol β in FIG. 7.

Although not shown, etching may be performed so that two adjacent second recesses 35 are connected. In other words, there may be a location between two adjacent second recesses 35 where the second surface 512 of the deposition mask 20 does not remain. Also, although not shown, etching may be performed so that two adjacent second recesses 35 are connected over the entire area of the second surface 512.

In FIG. 7, the symbol α is shown, which represents the width of the portion of the effective area 23 of the first surface 201 of the deposition mask 20 that remains unetched. Such a portion is also called a rib portion. In FIG. 7, the symbol r is shown, which represents the dimension of the through portion 42. The width α of the rib portion and the dimension r of the through portion 42 are appropriately determined according to the dimensions and number of display pixels of the organic EL display device 100 described later.

During the deposition process, the first surface 201 of the deposition mask 20 faces and contacts the first surface 110a of the substrate 110. The second surface 202 of the deposition mask 20 faces the crucible 81 holding the deposition material 82. The deposition material 82 passes through the second recess 35 and the first recess 30 and adheres to the first surface 110a of the substrate 110. As shown by the arrow in FIG. 7, the deposition material 82 not only moves from the crucible 81 toward the substrate 110 along the normal direction N of the substrate 110, but also moves in a direction greatly inclined relative to the normal direction N of the substrate 110. If the thickness T of the deposition mask 20 is large, the deposition material 82 moving in the inclined direction is likely to adhere to the top portion 43, the wall surface 36 of the second recess 35, or the wall surface 31 of the first recess 30. As a result, the deposition material 82 that cannot pass through the through hole 25 increases. Therefore, in order to increase the utilization efficiency of the deposition material 82, the thickness T of the deposition mask 20 may be reduced. In this case, the height of the wall surface 36 of the second recess 35 may be reduced, or the height of the wall surface 31 of the first recess 30 may be reduced. The thickness T of the deposition mask 20 may be reduced as much as possible within a range that ensures strength.

The thickness T of the deposition mask 20 may be, for example, 5 μm or more, 8 μm or more, 10 μm or more, or 15 μm or more. By setting the thickness T of the deposition mask 20 to 5 μm or more, the mechanical strength of the deposition mask 20 can be ensured, and damage and deformation of the deposition mask 20 can be suppressed. The thickness T of the deposition mask 20 may be, for example, 20 μm or less, 25 μm or less, 30 μm or less, or 35 μm or less. By setting the thickness T of the deposition mask 20 to 35 μm or less, the occurrence of shadows can be suppressed. The range of the thickness T of the deposition mask 20 may be determined by a first group consisting of 5 μm, 8 μm, 10 μm, and 15 μm, and/or a second group consisting of 20 μm, 25 μm, 30 μm, and 35 μm. The range of the thickness T of the deposition mask 20 may be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the thickness T of the deposition mask 20 may be determined by a combination of any two of the values included in the first group described above. The range of the thickness T of the deposition mask 20 may be determined by a combination of any two of the values included in the second group described above. For example, it may be 5 μm or more and 35 μm or less, 5 μm or more and 30 μm or less, 5 μm or more and 25 μm or less, 5 μm or more and 20 μm or less, 5 μm or more and 15 μm or less, 5 μm or more and 10 μm or less, 5 μm or more and 8 μm or less, 8 μm or more and 35 μm or less, 8 μm or more and 30 μm or less, 8 μm or more and 25 μm or less, 8 μm or more and 20 μm or less, 8 μm or more and 15 μm or less, 8 μm or more and 10 μm or less, 10 μm or more and 35 μm or less, or 10 μm or less. The thickness may be 30 μm or less, 10 μm or more to 25 μm or less, 10 μm or more to 20 μm or less, 10 μm or more to 15 μm or less, 15 μm or more to 35 μm or less, 15 μm or more to 30 μm or less, 15 μm or more to 25 μm or less, 15 μm or more to 20 μm or less, 20 μm or more to 35 μm or less, 20 μm or more to 30 μm or less, 20 μm or more to 25 μm or less, 25 μm or more to 35 μm or less, 25 μm or more to 30 μm or less, or 30 μm or more to 35 μm or less. The thickness is the thickness of the surrounding region 24, that is, the thickness of the portion of the deposition mask 20 where the first recess 30 and the second recess 35 are not formed. Therefore, the thickness can also be said to be the thickness T of the deposition mask 20.

Next, the support 60 will be described with reference to Figures 2 to 4, 8, and 9. Figure 8 is a plan view showing the deposition mask device 10 in Figure 2 with the deposition mask 20 removed in order to clearly show the support 60. Figure 9 is a partially enlarged plan view showing the deposition mask device 10 in Figure 2 from the second surface 17 side.

As shown in Figs. 2 to 4, the support 60 is fixed to the frame 15. As shown in Figs. 3 and 4, the support 60 is located on the second surface 17 side of the deposition mask 20. The support 60 supports the deposition mask 20 from the second surface 17 side. While the deposition mask 20 is in close contact with the substrate 110 by the magnet 85, the support 60 is in close contact with the substrate 110 via the deposition mask 20. The support 60 reinforces the close contact of the deposition mask 20 with the substrate 110.

The support 60 may include a cover member 61 and a support member 62. The cover member 61 and the support member 62 may be formed separately.

As shown in FIG. 8, the support 60 may include a plurality of cover members 61 arranged in the first direction D1. In the example shown in FIG. 8, the support 60 includes ten cover members 61. Each cover member 61 may include an end fixed to the first surface 16 in the third portion 153 of the frame 15 and an end fixed to the first surface 16 in the fourth portion 154 of the frame 15. In the following description, the end of the cover member 61 fixed to the third portion 153 is also referred to as the third end 603, and the end of the cover member 61 fixed to the fourth portion 154 is also referred to as the fourth end 604. The third end 603 of each cover member 61 may be fixed to the sixth surface 162 (see FIG. 4) of the third portion 153. The fourth end 604 of each cover member 61 may be fixed to the sixth surface 162 of the fourth portion 154. Each cover member 61 may be formed in an elongated rectangular shape with the second direction D2 as its longitudinal direction.

As shown in FIG. 9, the cover member 61 may overlap the beams 27A and 27B of the deposition mask 20 in a plan view. In FIG. 9, a first deposition mask 20A, a second deposition mask 20B, and a third deposition mask 20C, which will be described later, are shown as examples of the deposition mask 20. More specifically, the cover member 61 overlaps the gap between adjacent deposition masks 20. The cover member 61 shields this gap during deposition, and prevents the deposition material 82 from passing through this gap.

The cover member 61 is positioned between the frame 15 and the deposition mask 20. While the deposition mask 20 is not attracted by the magnet 85, the cover member 61 supports the deposition mask 20 from below, which is deflected downward due to its own weight. The cover member 61 also deflects downward due to its own weight and the force it receives from the deposition mask 20. The cover member 61 also deflects downward due to the force it receives from the support member 62, which will be described later. "Downward deflection" refers to the state of deflection of the cover member 61 when the second surface 17 of the frame 15 is placed below the first surface 16.

As shown in FIG. 8, the support 60 may include a plurality of support members 62 arranged in the second direction D2. In the example shown in FIG. 8, the support 60 includes seven support members 62. Each support member 62 may include an end fixed to the first surface 16 in the first portion 151 of the frame 15 and an end fixed to the first surface 16 in the second portion 152 of the frame 15. In the following description, the end of the support member 62 fixed to the first portion 151 is also referred to as the fifth end 605, and the end of the support member 62 fixed to the second portion 152 is also referred to as the sixth end 606. The fifth end 605 of each support member 62 may be fixed to the seventh surface 163 of the first portion 151 (see FIG. 3). The sixth end 606 of each support member 62 may be fixed to the seventh surface 163 of the second portion 152. Each support member 62 may be formed in an elongated rectangular shape with the first direction D1 as its longitudinal direction.

As shown in FIG. 2, each support member 62 may overlap a portion of the through-hole group 26 of the deposition mask 20 in a plan view. The support member 62 may cross all of the deposition masks 20 fixed to the frame 15 and may support these deposition masks 20.

As shown in FIG. 3, the support member 62 is located between the cover member 61 and the deposition mask 20. While the deposition mask 20 is not attracted by the magnet 85, the support member 62 supports the deposition mask 20, which is bending downward due to its own weight, from below. The support member 62 also bends downward due to its own weight and the force it receives from the deposition mask 20.

The deposition mask device 10 in this embodiment will be described in more detail using Figure 9.

As shown in FIG. 9, the multiple deposition masks 20 fixed to the frame 15 include a first deposition mask 20A, a second deposition mask 20B, and a third deposition mask 20C. The first deposition mask 20A, the second deposition mask 20B, and the third deposition mask 20C are aligned in a first direction D1. The second deposition mask 20B is located on the first portion 151 side of the first deposition mask 20A. The second deposition mask 20B is adjacent to the first deposition mask 20A. The third deposition mask 20C is located on the second portion 152 side of the first deposition mask 20A. The third deposition mask 20C is adjacent to the first deposition mask 20A.

The multiple cover members 61 fixed to the frame 15 include a first cover member 61A and a second cover member 61B. The second cover member 61B is located on the second portion 152 side relative to the first cover member 61A.

The first cover member 61A may overlap the first beam 27A of the first deposition mask 20A in a planar view. In this case, the first cover member 61A may overlap some of the through holes 25 of the first deposition mask 20A in a planar view. More specifically, the first cover member 61A may overlap a through hole 25 located relatively close to the first group end 261 in the first deposition mask 20A.

The first cover member 61A may overlap the second beam 27B of the second deposition mask 20B in a planar view. In this case, the first cover member 61A may overlap some of the through holes 25 of the second deposition mask 20B in a planar view. More specifically, the first cover member 61A may overlap a through hole 25 located relatively close to the second group end 262 in the second deposition mask 20B.

9 shows an example in which the first cover member 61A overlaps two rows of through holes 25 adjacent to the first group end 261 in the first deposition mask 20A. However, this is not limited to this, and the first cover member 61A may overlap one row of through holes 25 adjacent to the first group end 261, or may overlap three or more rows of through holes 25 adjacent to the first group end 261. Similarly, in FIG. 9, an example in which the first cover member 61A overlaps two rows of through holes 25 adjacent to the second group end 262 in the second deposition mask 20B is shown. However, this is not limited to this, and the first cover member 61A may overlap one row of through holes 25 adjacent to the second group end 262, or may overlap three or more rows of through holes 25 adjacent to the second group end 262. The same applies to the second cover member 61B, which will be described later.

The second cover member 61B may overlap the second beam 27B of the first deposition mask 20A in a planar view. The second cover member 61B may overlap some of the through holes 25 of the first deposition mask 20A in a planar view. More specifically, the second cover member 61B may overlap a through hole 25 located relatively close to the second group end 262 in the first deposition mask 20A. The second cover member 61B may overlap the first beam 27A of the third deposition mask 20C in a planar view. In this case, the second cover member 61B may overlap some of the through holes 25 of the third deposition mask 20C in a planar view. More specifically, the second cover member 61B may overlap a through hole 25 located relatively close to the first group end 261 in the third deposition mask 20C.

The exposed area 70 is located between two adjacent cover members 61. In the example shown in FIG. 9, the first cover member 61A and the second cover member 61B are adjacent to each other. The exposed area 70 is located between the first cover member 61A and the second cover member 61B. The exposed area 70 exposes the through hole 25 to the opening 155.

As shown in FIG. 9, the multiple support members 62 fixed to the frame 15 include a first support member 62A, a second support member 62B, and a third support member 62C. The second support member 62B is located on the fourth portion 154 side relative to the first support member 62A. The third support member 62C is located on the fourth portion 154 side relative to the second support member 62B.

Each of the support members 62A, 62B, and 62C may overlap some of the through holes 25 of the deposition mask 20 in a plan view. More specifically, each of the support members 62A, 62B, and 62C divides one through hole group 26 into a plurality of exposed regions 70. The plurality of exposed regions 70 divided by the support members 62A, 62B, and 62C are located at different positions in the second direction D2. The exposed regions 70 are formed on both sides of the support members 62A, 62B, and 62C in the second direction D2. In other words, the exposed regions 70 are located between the adjacent support members 62. In the example shown in FIG. 9, the exposed region 70 is located between the first support member 62A and the second support member 62B. Another exposed region 70 is located between the second support member 62B and the third support member 62C. The through holes 25 exposed in each of the exposed regions 70 located on both sides of the second support member 62B constitute one through hole group 26.

In FIG. 9, an example is shown in which each of the support members 62A, 62B, and 62C overlaps two rows of through holes 25 among the multiple through holes 25 in the through hole group 26. However, this is not limited to this, and each of the support members 62A, 62B, and 62C may overlap one row of through holes 25, or three or more rows of through holes 25.

Of the multiple support members 62, the support member 62 located closest to the third portion 153 may overlap one ear 21A of the deposition mask 20 in a planar view. An exposed region 70 is located on the side of the support member 62 facing the fourth portion 154, but the exposed region 70 may not be located on the side opposite the fourth portion 154. Also, of the multiple support members 62, the support member 62 located closest to the fourth portion 154 may overlap the other ear 21B of the deposition mask 20 in a planar view. An exposed region 70 is located on the side of the support member 62 facing the third portion 153, but the exposed region 70 may not be located on the side opposite the third portion 153.

The exposed region 70 may have a substantially rectangular outline in plan view. The exposed region 70 may be formed so as to extend along the first direction D1 and the second direction D2. The exposed region 70 may include a first region end 701, a second region end 702, a third region end 703, and a fourth region end 704. The first region end 701 is an end portion located on the side of the first portion 151 of the exposed region 70. The first region end 701 extends along the second direction D2. The second region end 702 is an end portion located on the side of the second portion 152 of the exposed region 70. The second region end 702 extends along the second direction D2. The third region end 703 is an end portion located on the side of the third portion 153 of the exposed region 70. The third region end 703 extends along the first direction D1. The fourth region end 704 is an end portion of the exposed region 70 that is located on the side of the fourth portion 154. The fourth region end 704 extends along the first direction D1.

The exposed region 70 is defined by a first region end 701, a second region end 702, a third region end 703, and a fourth region end 704. The first region end 701 and the second region end 702 may be defined by a cover member 61. The third region end 703 and the fourth region end 704 may be defined by a support member 62. For example, as shown in FIG. 9, the first region end 701 of the exposed region 70 in the first deposition mask 20A may be defined by a first cover member 61A. The second region end 702 of the exposed region 70 may be defined by a second cover member 61B. The third region end 703 of the exposed region 70 may be defined by a first support member 62A. The fourth region end 704 of the exposed region 70 may be defined by a second support member 62B.

In this manner, the exposed regions 70 may be defined by each cover member 61 and each support member 62. In this embodiment, the region occupied by the through-hole group 26 is partitioned into a plurality of exposed regions 70 by a plurality of cover members 61 and a plurality of support members 62. The exposed regions 70 correspond to the display region 105 of the organic EL display device 100 described above. One exposed region 70 corresponds to one display region 105.

The thickness of the cover member 61 may be, for example, 10 μm or more, 20 μm or more, 30 μm or more, or 40 μm or more. By making the thickness of the cover member 61 10 μm or more, it is possible to prevent the amount of bending of the cover member 61 from becoming too large. The thickness of the cover member 61 may be, for example, 60 μm or less, 70 μm or less, 80 μm or less, or 90 μm or less. By making the thickness of the cover member 61 90 μm or less, it is possible to prevent the deposition material 82 that has passed through the opening 155 from adhering to the cover member 61. The range of the thickness of the cover member 61 may be determined by a first group consisting of 10 μm, 20 μm, 30 μm, and 40 μm, and/or a second group consisting of 60 μm, 70 μm, 80 μm, and 90 μm. The range of thicknesses of the cover member 61 may be determined by a combination of any one of the values included in the above-mentioned first group and any one of the values included in the above-mentioned second group. The range of thicknesses of the cover member 61 may be determined by a combination of any two of the values included in the above-mentioned first group. The range of thicknesses of the cover member 61 may be determined by a combination of any two of the values included in the above-mentioned second group. For example, it may be 10 μm or more and 90 μm or less, 10 μm or more and 80 μm or less, 10 μm or more and 70 μm or less, 10 μm or more and 60 μm or less, 10 μm or more and 40 μm or less, 10 μm or more and 30 μm or less, 10 μm or more and 20 μm or less, 20 μm or more and 90 μm or less, 20 μm or more and 80 μm or less, 20 μm or more and 70 μm or less, 20 μm or more and 60 μm or less, 20 μm or more and 40 μm or less, 20 μm or more and 30 μm or more and 30 μm or more and 90 μm or less. Alternatively, it may be 30 μm or more and 80 μm or less, 30 μm or more and 70 μm or less, 30 μm or more and 60 μm or less, 30 μm or more and 40 μm or less, 40 μm or more and 90 μm or less, 40 μm or more and 80 μm or less, 40 μm or more and 70 μm or less, 40 μm or more and 60 μm or less, 60 μm or more and 90 μm or less, 60 μm or more and 80 μm or less, 60 μm or more and 70 μm or less, 70 μm or more and 90 μm or less, 70 μm or more and 80 μm or less, or 80 μm or more and 90 μm or less.

The thickness of the support member 62 may be, for example, 60 μm or more, 70 μm or more, 80 μm or more, or 90 μm or more. By making the thickness of the support member 62 60 μm or more, it is possible to prevent the amount of bending of the support member 62 from becoming too large. The thickness of the support member 62 may be, for example, 110 μm or less, 120 μm or less, 130 μm or less, or 140 μm or less. By making the thickness of the support member 62 140 μm or less, it is possible to prevent the deposition material 82 that has passed through the opening 155 from adhering to the support member 62. The range of the thickness of the support member 62 may be determined by a first group consisting of 60 μm, 70 μm, 80 μm, and 90 μm, and/or a second group consisting of 110 μm, 120 μm, 130 μm, and 140 μm. The range of thicknesses of the support member 62 may be determined by a combination of any one of the values included in the above-mentioned first group and any one of the values included in the above-mentioned second group. The range of thicknesses of the support member 62 may be determined by a combination of any two of the values included in the above-mentioned first group. The range of thicknesses of the support member 62 may be determined by a combination of any two of the values included in the above-mentioned second group. For example, it may be 60 μm or more and 140 μm or less, 60 μm or more and 130 μm or less, 60 μm or more and 120 μm or less, 60 μm or more and 110 μm or less, 60 μm or more and 90 μm or less, 60 μm or more and 80 μm or less, 60 μm or more and 70 μm or less, 70 μm or more and 140 μm or less, 70 μm or more and 130 μm or less, 70 μm or more and 120 μm or less, 70 μm or more and 110 μm or less, 70 μm or more and 90 μm or less, 70 μm or more and 80 μm or less, 80 μm or more and 140 μm or less, 80 μm or more and 150 μm or less, or 160 μm or more. It may be 80 μm or more and 120 μm or less, 80 μm or more and 110 μm or less, 80 μm or more and 90 μm or less, 90 μm or more and 140 μm or less, 90 μm or more and 130 μm or less, 90 μm or more and 120 μm or less, 90 μm or more and 110 μm or less, 110 μm or more and 140 μm or less, 110 μm or more and 130 μm or less, 110 μm or more and 120 μm or less, 120 μm or more and 140 μm or less, 120 μm or more and 130 μm or less, or 130 μm or more and 140 μm or less.

The material of the deposition mask 20 may be, for example, an iron alloy containing nickel. The iron alloy may contain cobalt in addition to nickel. For example, the material of the deposition mask 20 may be an iron alloy in which the total content of nickel and cobalt is 30% by mass or more and 54% by mass or less, and the content of cobalt is 0% by mass or more and 6% by mass or less. Specific examples of the iron alloy containing nickel or the iron alloy containing nickel and cobalt include an Invar material containing 34% by mass or more and 38% by mass or less of nickel, a Super Invar material containing 30% by mass or more and 34% by mass or less of nickel and further containing cobalt, or a low thermal expansion Fe-Ni-based plating alloy containing 38% by mass or more and 54% by mass or less of nickel. By using such an iron alloy, the thermal expansion coefficient of the deposition mask 20 can be reduced. For example, when a glass substrate is used as the substrate 110, the thermal expansion coefficient of the deposition mask 20 can be reduced to the same level as that of the glass substrate. This makes it possible to prevent the dimensional accuracy and positional accuracy of the organic layer 130 formed on the substrate 110 from decreasing due to the difference in thermal expansion coefficient between the deposition mask 20 and the substrate 110 during the deposition process.

The material constituting the frame 15 may be the same as the material of the deposition mask 20 described above. For example, the material constituting the frame 15 may be an iron alloy containing nickel.

The material constituting each cover member 61 and each support member 62 of the support 60 may be the same as the material of the deposition mask 20 described above. For example, the material constituting the cover member 61 and the support member 62 may be an iron alloy containing nickel.

Next, a method for manufacturing the deposition mask device 10 described above will be described.

First, in the frame preparation process, as shown in Figs. 2 and 8, a frame 15 having an opening 155 is prepared. The method for producing the frame 15 is arbitrary. For example, the frame 15 may be produced by cutting.

Subsequently, in the cover member fixing process, as shown in FIG. 8, a plurality of cover members 61 arranged in the first direction D1 are fixed to the frame 15. For example, the third end 603 of the cover member 61 is fixed to the sixth surface 162 (see FIG. 4) of the third portion 153. The fourth end 604 of the cover member 61 is fixed to the sixth surface 162 of the fourth portion 154. Each cover member 61 may be fixed to the frame 15 by welding. Each cover member 61 may be fixed to the frame 15 in a tensioned state. When the second surface 17 of the frame 15 is disposed below the first surface 16, each cover member 61 may be bent downward by its own weight.

In the cover member fixing process, each cover member 61 is positioned to define an exposed area 70 corresponding to the desired display area 105. For example, each cover member 61 may be positioned so as to follow the dimension of the exposed area 70 in the first direction D1. For example, although not shown, the cover member 61 may be aligned with the frame 15 using an alignment mark on the cover member 61 and an alignment mark on the frame 15. This adjusts the dimension of each exposed area 70 in the first direction D1 to the dimension corresponding to the desired display area 105.

Next, as a support member fixing process, as shown in FIG. 8, a plurality of support members 62 arranged in the second direction D2 are fixed to the frame 15. For example, the fifth end 605 of the support member 62 is fixed to the seventh surface 163 (see FIG. 3) of the first portion 151. The sixth end 606 of the support member 62 is fixed to the seventh surface 163 of the second portion 152. Each support member 62 may be fixed to the frame 15 by welding. Each support member 62 may be fixed to the frame 15 in a tensioned state. When the second surface 17 of the frame 15 is disposed below the first surface 16, each support member 62 may be bent downward by its own weight.

In the support member fixing process, each support member 62 is arranged to define an exposed area 70 corresponding to the desired display area 105. For example, each support member 62 may be arranged to follow the dimension of the exposed area 70 in the second direction D2. For example, although not shown, the support member 62 may be aligned with the frame 15 using an alignment mark on the support member 62 and an alignment mark on the frame 15. This adjusts the dimension of each exposed area 70 in the second direction D2 to the dimension corresponding to the desired display area 105.

In this manner, the support 60 including the cover member 61 and the support member 62 is fixed to the frame 15. A mask support mechanism 75 including the frame 15 and the support 60 is obtained.

Next, as a mask fixing process, as shown in FIG. 2, the deposition mask 20 including a plurality of through holes 25 is fixed to the frame 15. For example, the first end 211 of the deposition mask 20 is fixed to the fifth surface 161 of the third portion 153. The second end 212 of the deposition mask 20 is fixed to the fifth surface 161 of the fourth portion 154. Each deposition mask 20 may be fixed to the frame 15 by welding. Each deposition mask 20 may be fixed to the frame 15 in a tensioned state. When the second surface 17 of the frame 15 is disposed below the first surface 16, each deposition mask 20 may be bent downward by its own weight.

In the mask fixing process, the through-hole group 26 of each deposition mask 20 overlaps with the opening 155 in a plan view. The corresponding cover member 61 overlaps with the first beam 27A and the second beam 27B of each deposition mask 20 in a plan view. Each cover member 61 also overlaps with a portion of the through-hole 25 of the corresponding deposition mask 20. Each cover member 61 defines the first area end 70A and the second area end 70B of the exposed area 70.

In the mask fixing process, the support members 62 overlap some of the through holes 25 of each deposition mask 20 in a plan view. Each support member 62 defines a third region end 70C and a fourth region end 70D of the exposed region 70.

In this way, the through-hole group 26 of each deposition mask 20 is partitioned into a plurality of exposed regions 70 as shown in FIG. 9. A deposition mask device 10 having the desired exposed regions 70 is obtained. Each deposition mask 20 is supported by the mask support mechanism 75 described above.

Next, a method for manufacturing the organic EL display device 100 will be described.

The organic EL display device 100 will be described in detail. FIG. 10 is an enlarged plan view showing an example of an element of an organic EL display device produced using the deposition mask of FIG. 2. FIG. 11 is a cross-sectional view of the organic EL display device 100 of FIG. 10 taken along line D-D. FIG. 12 is a plan view showing an example of a substrate 110 on which a single-color organic layer is formed using the deposition mask device 10 of FIG. 2. Note that in FIGS. 10 and 11, the second electrode 140, which is formed after the deposition process and will be described later, is omitted. The organic EL display device 100 is an example of an organic device. The organic EL display device 100 includes an organic layer 130 formed on the substrate 110 by using the deposition mask device 10 according to the present embodiment described above. One organic EL display device 100 may include one display region 105.

As shown in FIG. 11, the organic EL display device 100 includes a substrate 110 and an element 115 located on the substrate 110. The element 115 may include a first electrode 120, an organic layer 130 located on the first electrode 120, and a second electrode 140 located on the organic layer 130.

The organic EL display device 100 may include an insulating layer 160 located between two adjacent first electrodes 120 in a plan view. The insulating layer 160 may include, for example, polyimide. The insulating layer 160 may overlap the ends of the first electrodes 120.

The organic EL display device 100 may be an active matrix type. For example, although not shown, the organic EL display device 100 may include a switch electrically connected to each of the multiple elements 115. The switch may be, for example, a transistor. The switch may control the ON/OFF of a voltage or current for the corresponding element 115.

The substrate 110 may include a first surface 110a on which the element 115 is located, and a second surface 110b located on the opposite side to the first surface 110a. The substrate 110 may be a plate-like member having insulating properties. The substrate 110 may be optically transparent to transmit visible light.

When the substrate 110 has a predetermined optical transparency, the optical transparency of the substrate 110 may be optical transparency that allows light emitted from the organic layer 130 to be transmitted for display. For example, the transmittance of the substrate 110 in the visible light region may be 80% or more, or 90% or more. The transmittance of the substrate 110 may be measured by a test method for total optical transmittance of plastic-transparent materials conforming to JIS K7361-1.

The substrate 110 may be flexible or may not be flexible. The material of the substrate 110 may be selected depending on the application of the organic EL display device 100. For example, the substrate 110 may be a glass substrate.

The element 115 may include a first electrode 120, an organic layer 130 located on the first electrode 120, and a second electrode 140 located on the organic layer 130. The organic layer 130 is an example of a vapor deposition layer.

The element 115 may be configured to realize some function by applying a voltage between the first electrode 120 and the second electrode 140. Alternatively, the element 115 may be configured to realize some function by causing a current to flow between the first electrode 120 and the second electrode 140. For example, when the element 115 is a pixel of the organic EL display device 100, the element 115 may emit light that constitutes an image.

The first electrode 120 includes a material having electrical conductivity. For example, the first electrode 120 may include a metal, a metal oxide having electrical conductivity, or other inorganic material having electrical conductivity. The first electrode 120 may include a metal oxide having optical transparency and electrical conductivity, such as indium tin oxide.

The organic layer 130 includes an organic material. When a current is passed through the organic layer 130, the organic layer 130 can perform some function. Passing a current means that a voltage is applied to the organic layer 130 or that a current flows through the organic layer 130. The organic layer 130 may be a light-emitting layer that emits light when a current is passed through it, or a layer whose light transmittance or refractive index changes when a current is passed through it. The organic layer 130 may include an organic semiconductor material.

10 and 11, the organic layer 130 may include a first organic layer 130A, a second organic layer 130B, and a third organic layer 130C. For example, the first organic layer 130A may be a red light-emitting layer. For example, the second organic layer 130B may be a blue light-emitting layer. For example, the third organic layer 130C may be a green light-emitting layer. In the following description, when describing the configuration of the organic layer that is common to the first organic layer 130A, the second organic layer 130B, and the third organic layer 130C, the term "organic layer 130" and the symbols are used.

The laminated structure including the first electrode 120, the first organic layer 130A, and the second electrode 140 is also referred to as the first element 115A. The laminated structure including the first electrode 120, the second organic layer 130B, and the second electrode 140 is also referred to as the second element 115B. The laminated structure including the first electrode 120, the third organic layer 130C, and the second electrode 140 is also referred to as the third element 115C. Each of the first element 115A, the second element 115B, and the third element 115C is a subpixel.

In the following description, when describing the configuration of the elements common to the first element 115A, the second element 115B, and the third element 115C, the term "element 115" and the reference symbol are used. In a plan view such as FIG. 10, the outline of element 115 may be the outline of organic layer 130 that overlaps with first electrode 120 and second electrode 140 in plan view. When organic EL display device 100 includes insulating layer 160, the outline of element 115 may be the outline of organic layer 130 that overlaps with first electrode 120 and second electrode 140 in plan view but does not overlap with insulating layer 160.

Figure 10 shows an example of the arrangement of each element 115A, 115B, and 115C. However, this is not limited to this, and the arrangement of each element 115A, 115B, and 115C is arbitrary.

When a voltage is applied between the first electrode 120 and the second electrode 140, the organic layer 130 located between them is driven. If the organic layer 130 is an emitting layer, light is emitted from the organic layer 130 and extracted to the outside from the second electrode 140 side or the first electrode 120 side.

When the organic layer 130 is an emissive layer that emits light when an electric current is applied, the organic layer 130 may include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc.

For example, when the first electrode 120 is an anode, the organic layer 130 may have a hole injection transport layer between the light emitting layer and the first electrode 120. The hole injection transport layer may be a hole injection layer having a hole injection function. Alternatively, the hole injection transport layer may be a hole transport layer having a hole transport function, or may have both a hole injection function and a hole transport function. The hole injection transport layer may have a structure in which a hole injection layer and a hole transport layer are stacked.

When the second electrode 140 is a cathode, the organic layer 130 may have an electron injection transport layer between the light emitting layer and the second electrode 140. The electron injection transport layer may be an electron injection layer having an electron injection function. Alternatively, the electron injection transport layer may be an electron transport layer having an electron transport function, or may have both an electron injection function and an electron transport function. The electron injection transport layer may have a structure in which an electron injection layer and an electron transport layer are stacked.

When the organic layer 130 is an emitting layer, the organic layer 130 contains a emitting material. The emitting layer may contain an additive that improves leveling properties. The emitting material may be a known material. For example, the emitting material may be a dye-based material, a metal complex-based material, or a polymer-based material.

The thickness of the organic layer 130 may be any thickness that allows electrons and holes to recombine and emit light. The thickness of the organic layer 130 may be, for example, 1 nm or more, and the thickness of the organic layer 130 may be, for example, 500 nm or less.

The second electrode 140 includes a material having electrical conductivity, such as a metal. The second electrode 140 may be formed on the organic layer 130 by a deposition method using a mask (not shown). The material constituting the second electrode 140 may be platinum, gold, silver, copper, iron, tin, chromium, aluminum, indium, lithium, sodium, potassium, calcium, magnesium, chromium, or carbon. These conductive materials may be used alone or in combination of two or more materials. When two or more materials are used, layers made of each material may be laminated. The conductive material may be an alloy containing two or more materials. For example, the conductive material may be a magnesium alloy such as MgAg, an aluminum alloy such as AlLi, AlCa, or AlMg, an alloy of alkali metals or alkaline earth metals, or the like.

The organic EL display device 100 may include a sealing layer (not shown) that covers elements on the substrate 110, such as the organic layer 130. The sealing layer can prevent water vapor and the like from the outside of the organic EL display device 100 from entering the inside of the organic EL display device 100. This can prevent the organic layer 130 and the like from deteriorating due to moisture. The sealing layer may include, for example, a layer made of an organic material. The organic material may have a refractive index equal to that of the organic layer 130 or may have a refractive index close to that of the organic layer 130 in order to prevent refraction of light in the sealing layer. The organic material may be sealed with an inorganic material, such as silicon nitride (SiN). In this case, the sealing layer may have a laminated structure in which a layer of an organic material and a layer of an inorganic material are laminated. A planarization layer (not shown) may be interposed between the second electrode 140 and the sealing layer. The planarization layer may be a layer for improving the adhesion of the sealing layer by entering the unevenness of the elements on the substrate 110.

The manufacturing method of such an organic EL display device 100 may include a step of attaching a deposition material 82 to a substrate 110 using a deposition mask device 10 to form an organic layer 130. More specifically, the manufacturing method of the organic EL display device 100 according to this embodiment may include a preparation step, an alignment step, a bonding step, a deposition step, and a cutting step.

First, as a preparation step, the deposition mask device 10 described above may be prepared.

After the preparation process, the deposition mask device 10 is aligned with the substrate 110 as an alignment process. In the alignment process, the deposition mask device 10 is attached inside the deposition device 80. At this time, the position of the through hole 25 of the deposition mask 20 with respect to the substrate 110 may be adjusted. For example, although not shown, the position of the through hole 25 with respect to the substrate 110 may be adjusted using an alignment mark of the deposition mask 20 and an alignment mark of the substrate 110.

After the alignment process, the first surface 201 of the deposition mask 20 may be adhered to the first surface 110a of the substrate 110 as a contact process. More specifically, a magnet 85 is disposed on the second surface 110b of the substrate 110. The deposition mask 20 is attracted to the substrate 110 by the magnetic force of the magnet 85. The first surface 201 of the deposition mask 20 is adhered to the first surface 110a of the substrate 110. In addition, each cover member 61 and each support member 62 of the support body 60 are also attracted to the substrate 110 by the magnetic force of the magnet 85. Each cover member 61 and each support member 62 is adhered to the second surface 202 of the deposition mask 20. As a result, the cover member 61 or the support member 62 shields the through holes 25 that overlap in a plan view. The cover member 61 and the support member 62 reinforce the adhesion of the deposition mask 20 to the substrate 110.

After the adhesion process, the deposition process is performed by depositing the deposition material 82 on the substrate 110 to form the organic layers 130A, 130B, and 130C. At this time, the deposition material 82 passes through the opening 155 of the frame 15, the exposed region 70, and the through-hole 25 to reach the substrate 110. The organic layers 130A, 130B, and 130C are formed on the corresponding hole transport layers.

More specifically, the pressure inside the deposition device 80 is reduced to a vacuum atmosphere. The deposition material 82 is then evaporated and caused to fly to the hole transport layer. The vapor deposition material 82 that has flown passes through each through-hole 25 of the deposition mask 20 and adheres to the desired hole transport layer. As a result, the organic layers 130A, 130B, and 130C are formed in the first electrode 120 and the insulating layer 160 in a pattern corresponding to the pattern of the through-holes 25.

Here, the organic layers 130A, 130B, and 130C are formed so as to straddle the first electrode 120 and the insulating layer 160 adjacent to the first electrode 120. Although not shown, the adjacent organic layers 130A, 130B, and 130C on the insulating layer 160 may overlap each other.

In this embodiment, the organic layers 130A, 130B, and 130C are formed at positions of the substrate 110 corresponding to the exposed region 70. The organic layers 130A, 130B, and 130C may be formed separately using the corresponding deposition materials 82. In this case, the organic layers 130A, 130B, and 130C are formed on the substrate 110 in a desired order. FIG. 12 shows, as an example, an example in which the organic layer 130A is formed on the substrate 110 before the organic layers 130B and 130C are formed. The organic layer 130A formed on the substrate 110 is formed to constitute the display region 105 of the organic EL display device 100.

More specifically, the deposition material 82 passes through the exposed region 70 defined by each cover member 61 and each support member 62. At this time, the deposition material 82 passes through the through-hole 25 exposed to the opening 155 in the exposed region 70. The deposition material 82 is prevented from passing through the through-hole 25 that is blocked by the cover member 61 or the support member 62. As a result, the deposition material 82 adheres to the region of the first surface 110a of the substrate 110 that corresponds to the exposed region 70, and an organic layer 130A is formed for each display region 105.

When forming organic layers 130B and 130C of other colors, a deposition mask 20 having through holes 25 corresponding to the pattern of each color is used. In the deposition mask device 10 manufactured using the deposition mask 20 of each color, the exposed area 70 may be formed using each cover member 61 and each support member 62. In this case, the organic layers 130B and 130C are formed on the substrate 110 so as to form each display area 105. The shape, size, and position of the exposed area 70 of the deposition mask device 10 of each color may be the same.

In this manner, organic layers 130A, 130B, and 130C of each color are formed in each display region 105 of the substrate 110. The deposition mask 20 of each color is used to attach the deposition material 82 of each color to the corresponding hole transport layer. For example, a red organic light-emitting material, a green organic light-emitting material, and a blue organic light-emitting material are each deposited on one substrate 110. In this manner, organic layers 130A, 130B, and 130C are formed in each display region 105 of the substrate 110.

After the organic layers 130A, 130B, and 130C are formed, an electron transport layer and an electron injection layer are formed on the organic layers 130A, 130B, and 130C. Then, the second electrode 140 is formed. The second electrode 140 is formed so as to cover each of the organic layers 130A, 130B, and 130C, and is formed on the organic layers 130A, 130B, and 130C so as to straddle the first electrode 120 and the insulating layer 160 adjacent to the first electrode 120. For example, the second electrode 140 may be continuously formed so as to straddle two organic layers 130A, 130B, and 130C adjacent to each other in a planar view.

The above-mentioned planarization layer and sealing layer are formed on the formed second electrode 140. In this way, the elements such as the organic layers 130A, 130B, and 130C provided on the substrate 110 are sealed with the sealing layer.

After the deposition process, the substrate 110 may be cut into individual display regions 105 of the organic EL display device 100 as a cutting process. In this case, for example, the substrate 110 is cut between adjacent display regions 105 using a dicing saw.

In this way, an organic EL display device 100 is obtained having a display area 105 on the substrate 110, in which organic layers 130A, 130B, and 130C of each color are formed.

As described above, according to the present embodiment, the first cover member 61A of the support 60 overlaps with some of the through holes 25 of the deposition mask 20 in a plan view. This allows the organic layers 130A, 130B, and 130C to be formed in the display area 105 having a size different from the size of the through hole group 26 formed in the deposition mask 20. Therefore, the deposition mask 20 can be used to manufacture an organic EL display device 100 having a display area 105 having a size different from the size of the through hole group 26. As a result, the versatility of the deposition mask 20 can be improved. For example, the deposition mask 20 manufactured to manufacture an organic EL display device 100 having a display area 105 of a predetermined size can be used to manufacture an organic EL display device 100 having a display area 105 of a different size. Therefore, when forming the organic layers 130A, 130B, and 130C of the organic EL display device 100 anew, the existing deposition mask 20 can be effectively utilized, making it unnecessary to manufacture a new dedicated deposition mask 20.

In addition, according to this embodiment, as described above, the first cover member 61A of the support 60 overlaps some of the through holes 25 of the deposition mask 20 in a plan view. This allows the dimension of the first cover member 61A in the first direction D1 to be increased. Therefore, when the deposition mask 20 is brought into close contact with the substrate 110, the first cover member 61A can be brought into close contact with the substrate 110 via the deposition mask 20. As a result, the adhesion of the deposition mask 20 to the substrate 110 can be reinforced, and the adhesion between the substrate 110 and the deposition mask 20 can be improved.

In addition, according to this embodiment, the second deposition mask 20B is positioned on the side of the first portion 151 of the frame 15 relative to the first deposition mask 20A, and the first cover member 61A overlaps the first beam 27A of the first deposition mask 20A and the second beam 27B of the second deposition mask 20B in a plan view. This allows the first cover member 61A to support the first deposition mask 20A and the second deposition mask 20B from below. In addition, when the first deposition mask 20A and the second deposition mask 20B are brought into close contact with the substrate 110, the first cover member 61A can be brought into close contact with the substrate 110 via the first deposition mask 20A and the second deposition mask 20B. This allows the adhesion of the deposition masks 20A and 20B to the substrate 110 to be reinforced, and the adhesion between the substrate 110 and the deposition masks 20A and 20B can be improved.

In addition, according to this embodiment, the first cover member 61A overlaps some of the through holes 25 of the first deposition mask 20A in a plan view. This allows some of the through holes 25 in the first deposition mask 20A to be covered by the first cover member 61A, and the position of the first area end 70A of the exposed area 70 corresponding to the first deposition mask 20A can be adjusted. This allows the size of the display area 105 formed on the substrate 110 to be adjusted.

In addition, according to this embodiment, the first cover member 61A overlaps some of the through holes 25 of the second deposition mask 20B in a plan view. This allows some of the through holes 25 in the second deposition mask 20B to be covered by the first cover member 61A, and the position of the second area end 70B of the exposed area 70 corresponding to the second deposition mask 20B can be adjusted. This allows the size of the display area 105 formed on the substrate 110 to be adjusted.

In addition, according to this embodiment, the third deposition mask 20C is positioned on the side of the second portion 152 of the frame 15 relative to the first deposition mask 20A, and the second cover member 61B overlaps the first beam 27A of the third deposition mask 20C in a plan view. This allows the second cover member 61B to support the first deposition mask 20A and the third deposition mask 20C from below. In addition, when the first deposition mask 20A and the third deposition mask 20C are brought into close contact with the substrate 110, the second cover member 61B can be brought into close contact with the substrate 110 via the first deposition mask 20A and the third deposition mask 20C. This allows the adhesion of the deposition masks 20A and 20C to the substrate 110 to be reinforced, and the adhesion between the substrate 110 and the deposition masks 20A and 20C can be improved.

In addition, according to this embodiment, the second cover member 61B overlaps some of the through holes 25 of the first deposition mask 20A in a plan view. This allows some of the through holes 25 in the first deposition mask 20A to be covered by the second cover member 61B, and the position of the second area end 70B of the exposed area 70 corresponding to the first deposition mask 20A can be adjusted. This allows the size of the display area 105 formed on the substrate 110 to be adjusted.

In addition, according to this embodiment, the second cover member 61B overlaps some of the through holes 25 of the third deposition mask 20C in a plan view. This allows some of the through holes 25 in the third deposition mask 20C to be covered by the second cover member 61B, and the position of the first area end 70A of the exposed area 70 corresponding to the third deposition mask 20C can be adjusted. This allows the size of the display area 105 formed on the substrate 110 to be adjusted.

In addition, according to this embodiment, the support member 62 overlaps the through-hole group 26 of the deposition mask 20 in a plan view. The support member 62 divides the through-hole group 26 into a plurality of exposed regions 70. This allows some of the through-holes 25 that constitute the through-hole group 26 to be shielded by the support member 62, and the position of the third region end 70C or the fourth region end 70D of the display region 105 of the organic EL display device 100 can be adjusted. This allows the size of the display region 105 formed on the substrate 110 to be adjusted.

In addition, according to this embodiment, the support member 62 overlaps with the through-hole group 26 in a plan view. This allows the support member 62 to support the deposition mask 20 from below. Furthermore, when the deposition mask 20 is brought into close contact with the substrate 110, the support member 62 can be brought into close contact with the substrate 110 via the deposition mask 20. This makes it possible to reinforce the adhesion of the deposition mask 20 to the substrate 110, thereby improving the adhesion between the substrate 110 and the deposition mask 20.

Note that various modifications can be made to the above-described embodiment. Below, modified examples will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, parts that can be configured similarly to the above-described embodiment will be given the same reference numerals as those used for the corresponding parts in the above-described embodiment, and duplicated descriptions will be omitted. Also, if it is clear that the effects obtained in the above-described embodiment can also be obtained in the modified example, the description may be omitted.

The first variant will be explained.

In the above-described embodiment, an example has been described in which the second cover member 61B of the support 60 overlaps some of the through holes 25 of the first deposition mask 20A in a planar view and overlaps some of the through holes 25 of the third deposition mask 20C in a planar view. However, this is not limited to this. For example, as shown in FIG. 13, the second cover member 61B may not overlap some of the through holes 25 of the first deposition mask 20A in a planar view. Alternatively, for example, the second cover member 61B may not overlap some of the through holes 25 of the third deposition mask 20C in a planar view. Also, as shown in FIG. 13, the second cover member 61B may not overlap some of the through holes 25 of the first deposition mask 20A in a planar view and may not overlap some of the through holes 25 of the third deposition mask 20C in a planar view.

When the second cover member 61B does not overlap the through hole 25 of the first deposition mask 20A, the dimension of the second cover member 61B in the first direction D1 may be smaller than the dimension of the first cover member 61A in the first direction D1. The same is true when the second cover member 61B does not overlap the through hole 25 of the second deposition mask 20B.

The second variant will be explained.

In the above-described embodiment, an example in which each deposition mask 20A to 20C includes one through hole group 26 has been described. However, this is not limited to this. For example, as shown in FIG. 14, each deposition mask 20A to 20C may include a plurality of through hole groups 26 arranged in the second direction D2. The plurality of through hole groups 26 may include a first through hole group 26A and a second through hole group 26B. The second through hole group 26B is located on the fourth portion 154 side with respect to the first through hole group 26A. The first through hole group 26A and the second through hole group 26B are adjacent to each other. The deposition mask 20 may include a beam connection portion 28. The beam connection portion 28 is located between the first through hole group 26A and the second through hole group 26B. The beam connection portion 28C connects the first beam 27A and the second beam 27B. The support member 62 of the support 60 may overlap the beam connection portion 28 in a plan view.

Taking the second support member 62B as an example, the second support member 62B overlaps the beam connection portion 28 located between the first through hole group 26A and the second through hole group 26B in a plan view. The second support member 62B may overlap some of the through holes 25 of the first through hole group 26A in a plan view. More specifically, the second support member 62B may overlap a through hole 25 located relatively close to the fourth group end 264 among the multiple through holes 25 of the first through hole group 26A. In this case, the second support member 62B defines the fourth region end 704 of the exposed region 70 corresponding to the first through hole group 26A. Alternatively, the second support member 62B may overlap some of the multiple through holes 25 of the second through hole group 26B in a plan view. More specifically, the second support member 62B may overlap a through hole 25 located relatively close to the third group end 263 among the multiple through holes 25 of the second through hole group 26B. In this case, the second support member 62B defines the third region end 703 of the exposed region 70 corresponding to the second through hole group 26B. Also, as shown in FIG. 14, the second support member 62B may overlap some of the through holes 25 of the first through hole group 26A in a plan view, and may overlap some of the through holes 25 of the second through hole group 26B in a plan view.

The first support member 62A and the third support member 62C may also be configured similarly to the second support member 62B.

The third variant will be explained.

In the second modified example described above, an example was described in which the second support member 62B of the support body 60 overlaps some of the through holes 25 of the first through hole group 26A in a plan view and overlaps some of the through holes 25 of the second through hole group 26B in a plan view. However, this is not limited to this. For example, as shown in FIG. 15, the second support member 62B may not overlap some of the through holes 25 of the first through hole group 26A in a plan view. Alternatively, for example, the second support member 62B may not overlap some of the through holes 25 of the second through hole group 26B in a plan view. Also, as shown in FIG. 15, the second support member 62B may not overlap some of the through holes 25 of the first through hole group 26A in a plan view and may not overlap some of the through holes 25 of the second through hole group 26B in a plan view.

When the second support member 62B does not overlap the through holes 25 of the first through hole group 26A, the dimension of the second support member 62B in the second direction D2 may be smaller than the dimension of the first support member 62A in the second direction D2. In this case, the dimension of the second support member 62B in the second direction D2 may be smaller than the dimension of the third support member 62C in the second direction D2. The same is true when the second support member 62B does not overlap the through holes 25 of the second through hole group 26B.

The fourth variant will be explained.

In the above-described embodiment, an example in which each deposition mask 20A to 20C includes one through hole group 26 has been described. However, this is not limited to this. For example, as shown in FIG. 16, each deposition mask 20A to 20C may include a plurality of through hole groups 26 arranged in the first direction D1. The plurality of through hole groups 26 may include a third through hole group 26C and a fourth through hole group 26D. The fourth through hole group 26D is located on the second portion 152 side with respect to the third through hole group 26C. The third through hole group 26C and the fourth through hole group 26D are adjacent to each other. The deposition mask 20 may include a third beam 27C. The third beam 27C is located between the third through hole group 26C and the fourth through hole group 26D. The third beam 27C extends in the second direction D2 between one ear 21A and the other ear 21B, connecting the pair of ears 21A and 21B.

The multiple cover members 61 of the support 60 may include a third cover member 61C. The third cover member 61C is located between the first cover member 61A and the second cover member 61B. An exposed area 70 is located between the first cover member 61A and the third cover member 61C. Another exposed area 70 is located between the third cover member 61C and the second cover member 61B.

The third cover member 61C may overlap the third beam 27C located between the third through hole group 26C and the fourth through hole group 26D in a plan view. The third cover member 61C may overlap some of the through holes 25 of the third through hole group 26C in a plan view. More specifically, the third cover member 61C may overlap a through hole 25 located relatively close to the second group end 262 among the multiple through holes 25 of the third through hole group 26C. In this case, the third cover member 61C defines the second area end 702 of the exposed area 70 in the third through hole group 26C. Alternatively, the third cover member 61C may overlap some of the multiple through holes 25 of the fourth through hole group 26D in a plan view. More specifically, the third cover member 61C may overlap a through hole 25 located relatively close to the first group end 261 among the multiple through holes 25 in the fourth through hole group 26D. In this case, the third cover member 61C defines the first area end 701 of the exposed area 70 in the fourth through hole group 26D. Also, as shown in FIG. 16, the third cover member 61C may overlap some of the through holes 25 in the third through hole group 26C in a plan view, and may also overlap some of the through holes 25 in the fourth through hole group 26D in a plan view.

The fifth variant will be explained.

In the above-mentioned fourth modified example, an example was described in which the third cover member 61C of the support 60 overlaps some of the through holes 25 of the third through hole group 26C in a plan view and overlaps some of the through holes 25 of the fourth through hole group 26D in a plan view. However, this is not limited to this. For example, as shown in FIG. 17, the third cover member 61C may not overlap some of the through holes 25 of the third through hole group 26C in a plan view. Alternatively, for example, the third cover member 61C may not overlap some of the through holes 25 of the fourth through hole group 26D in a plan view. Also, as shown in FIG. 17, the third cover member 61C may not overlap some of the through holes 25 of the third through hole group 26C in a plan view and may not overlap some of the through holes 25 of the fourth through hole group 26D in a plan view.

When the third cover member 61C does not overlap the through holes 25 of the third through hole group 26C, the dimension of the third cover member 61C in the first direction D1 may be smaller than the dimension of the first cover member 61A in the first direction D1. In this case, the dimension of the third cover member 61C in the first direction D1 may be smaller than the dimension of the second cover member 61B in the first direction D1. The same is true when the third cover member 61C does not overlap the through holes 25 of the fourth through hole group 26D.

The sixth variant will be explained.

In the fourth modified example described above, an example in which the multiple cover members 61 of the support 60 include the third cover member 61C has been described. However, this is not limited to this. For example, as shown in FIG. 18, the multiple cover members 61 may not include the third cover member 61C. In other words, the other cover members 61 may not be located between the first cover member 61A and the second cover member 61B. In this case, the cover member 61 does not overlap the third beam 27C. The exposed area 70 located between the first cover member 61A and the second cover member 61B exposes the through holes 25 of the third through hole group 26C and the through holes 25 of the fourth through hole group 26D to the opening 155. In the example shown in FIG. 18, the display areas 105 of the two organic EL display devices 100 are formed at positions of the substrate 110 corresponding to the exposed areas 70.

The seventh variant will be explained.

In the fourth modified example described above, an example has been described in which the third cover member 61C overlaps the third beam 27C located between the third through-hole group 26C and the fourth through-hole group 26D in a planar view. However, this is not limited to this. For example, as shown in FIG. 19, the third cover member 61C does not have to overlap the third beam 27C in a planar view.

In the example shown in FIG. 19, each of the deposition masks 20A to 20C may include one through-hole group 26. In other words, each of the deposition masks 20A to 20C shown in FIG. 19 does not have multiple through-hole groups 26 aligned in the first direction D1, as shown in FIG. 16, etc.

The third cover member 71C may overlap some of the through holes 25 of the through hole group 26 in a plan view. The third cover member 71C divides the through hole group 26 into a plurality of exposed regions 70. The exposed regions 70 are formed on both sides of the third cover member 61C in the first direction D1. In other words, the exposed regions 70 are located between the adjacent cover members 61. In the example shown in FIG. 19, the exposed region 70 is located between the first cover member 61A and the third cover member 61C. Another exposed region 70 is located between the third cover member 61C and the second cover member 61B. The through holes 25 exposed in each of the exposed regions 70 located on both sides of the third cover member 61C constitute one through hole group 26.

The dimension of the third cover member 61C in the first direction D1 may be smaller than the dimension of the first cover member 61A in the first direction D1. The dimension of the third cover member 61C in the first direction D1 may be smaller than the dimension of the second cover member 61B in the first direction D1.

The eighth variant will be explained.

In the above embodiment, the cover member 61 and the support member 62 are formed separately. However, the present invention is not limited to this. For example, as shown in FIG. 20, the cover member 61 and the support member 62 may be formed integrally. In this case, the cover member 61 and the support member 62 may be formed by etching a metal plate. Alternatively, the cover member 61 and the support member 62 may be fixed to each other by welding. In this case, the cover member 61 and the support member 62 may be fixed to each other by welding to form the support 60, and then the support 60 may be fixed to the frame 15. Alternatively, the cover member 61 and the support member 62 may be fixed to each other by welding to form the support 60 after the cover member 61 and the support member 62 are fixed to the frame 15.

Although several variations on the above embodiment have been described, it is of course possible to combine multiple variations as appropriate.

Claims (16)

a frame including a first surface and a second surface located on an opposite side to the first surface, the frame including a first portion, a second portion facing the first portion across an opening in a first direction, a third portion, and a fourth portion facing the third portion across the opening in a second direction different from the first direction;
a deposition mask including a first end fixed to the first surface of the third portion, a second end fixed to the first surface of the fourth portion, and a plurality of through holes overlapping with the opening in a plan view;
a support fixed to the frame and positioned between the first surface of the frame and the deposition mask,
the deposition mask includes a through hole group formed of a plurality of the through holes, and a plurality of beams connecting the first end and the second end,
the support body includes a plurality of cover members each including a third end fixed to the first surface of the third portion and a fourth end fixed to the first surface of the fourth portion, the plurality of cover members being arranged in the first direction;
the plurality of beams include a first beam located on a side of the first portion with respect to the through hole group, and a second beam located on a side of the second portion with respect to the through hole group,
The plurality of cover members include a first cover member and a second cover member located on a side of the second portion with respect to the first cover member,
The first cover member overlaps the first beam in a plan view,
The second cover member overlaps the second beam in a plan view,
an exposure region that exposes the through hole to the opening is located between the first cover member and the second cover member;
the first cover member overlaps a portion of the through hole in a plan view,
the plurality of cover members includes a third cover member located between the first cover member and the second cover member,
The exposed area is located between the first cover member and the third cover member,
the exposed area is located between the third cover member and the second cover member . a plurality of the deposition masks arranged in the first direction are fixed to the third portion and the fourth portion,
the plurality of deposition masks include a first deposition mask and a second deposition mask located on a side of the first deposition mask facing the first portion and adjacent to the first deposition mask,
the first cover member overlaps the first beams of the first deposition mask and the second beams of the second deposition mask in a plan view, and overlaps the through hole of a part of the first deposition mask in a plan view,
The deposition mask device according to claim 1 , wherein the second cover member overlaps the second beam of the first deposition mask in a plan view. The deposition mask device according to claim 2, wherein the first cover member overlaps with a portion of the through hole of the second deposition mask in a plan view. the plurality of deposition masks include a third deposition mask located on a side of the first deposition mask facing the second portion and adjacent to the first deposition mask,
The deposition mask device according to claim 2 , wherein the second cover member overlaps with the first beams of the third deposition mask in a plan view. The deposition mask device according to claim 4, wherein the second cover member overlaps with a portion of the through hole of the first deposition mask in a plan view. The deposition mask device according to claim 4 or 5, wherein the second cover member overlaps with a portion of the through hole of the third deposition mask in a plan view. the support includes a support member including a fifth end fixed to the first surface of the first portion and a sixth end fixed to the first surface of the second portion;
the support member overlaps with the through hole group in a plan view,
7. The deposition mask device according to claim 1, wherein the support member divides the through-hole group into a plurality of the exposed regions. the support includes a support member including a fifth end fixed to the first surface of the first portion and a sixth end fixed to the first surface of the second portion;
the deposition mask includes a plurality of the through-hole groups aligned in the second direction,
the plurality of through hole groups include a first through hole group and a second through hole group located on a side of the fourth portion with respect to the first through hole group and adjacent to the first through hole group,
the deposition mask includes a beam connection portion that is located between the first through hole group and the second through hole group and connects the first beam and the second beam,
7. The deposition mask device according to claim 1, wherein the supporting member overlaps with the beam connecting portion in a plan view. The deposition mask device according to claim 8, wherein the support member overlaps with a portion of the through holes that constitute the first through hole group in a plan view. The deposition mask device according to claim 8 or 9, wherein the support member overlaps with a portion of the through holes constituting the second through hole group in a plan view. the deposition mask includes a plurality of the through-hole groups aligned in the first direction,
the plurality of through hole groups include a third through hole group and a fourth through hole group located on the second portion side with respect to the third through hole group and adjacent to the third through hole group,
the plurality of beams include a third beam located between the third through hole group and the fourth through hole group,
11. The deposition mask device according to claim 1, wherein the third cover member overlaps with the third beam in a plan view. The deposition mask device according to claim 11 , wherein the third cover member overlaps with a portion of the through holes of the third through hole group in a plan view. The deposition mask device according to claim 11 , wherein the third cover member overlaps with a portion of the through holes of the fourth through hole group in a plan view. 11. The deposition mask device according to claim 1 , wherein the third cover member divides the through-hole group into a plurality of the exposed regions. a step of preparing a frame including a first surface and a second surface located on the opposite side to the first surface, the frame including a first portion, a second portion facing the first portion in a first direction across an opening, a third portion, and a fourth portion facing the third portion in a second direction different from the first direction in a plan view across the opening;
a step of fixing a support body including a plurality of cover members arranged in the first direction to the frame, the step of fixing the support body to the frame such that a third end of the cover members is fixed to the first surface of the third portion and a fourth end of the cover members is fixed to the first surface of the fourth portion;
a step of fixing a first end of a deposition mask to the first surface of the third portion and a second end of the deposition mask to the first surface of the fourth portion after the step of fixing the support, wherein the deposition mask is fixed to the frame such that a plurality of through holes of the deposition mask overlap with the openings in a plan view and the support is located between the first surface of the frame and the deposition mask,
the deposition mask includes a through hole group formed of a plurality of the through holes, and a plurality of beams connecting the first end and the second end,
the plurality of beams include a first beam located on a side of the first portion with respect to the through hole group, and a second beam located on a side of the second portion with respect to the through hole group,
The plurality of cover members include a first cover member and a second cover member located on a side of the second portion with respect to the first cover member,
in the step of fixing the deposition mask, the first cover member overlaps the first beam in a plan view, the second cover member overlaps the second beam in a plan view, an exposed region exposing the through hole to the opening is located between the first cover member and the second cover member, and the first cover member overlaps a part of the through hole in a plan view,
the plurality of cover members includes a third cover member located between the first cover member and the second cover member,
The exposed area is located between the first cover member and the third cover member,
The method for manufacturing a deposition mask device, wherein the exposed area is located between the third cover member and the second cover member . A step of preparing the deposition mask device according to any one of claims 1 to 14 ;
bringing the deposition mask of the deposition mask device into close contact with a substrate;
forming a deposition layer by depositing a deposition material on the substrate by passing the deposition material through the opening of the frame, the exposed region of the deposition mask device, and the through-hole;
A method for manufacturing an organic device, wherein in the step of forming the deposition layer, the deposition layer is formed at a position corresponding to the exposed region.