JP7566095B2 - RFID tag, RFID tag manufacturing device, and RFID tag manufacturing method - Google Patents

Description

The present invention relates to an RFID tag, an RFID tag manufacturing apparatus, and an RFID tag manufacturing method.

Conventionally, RFID tags with an antenna connected to an IC chip have been known. RFID tags are capable of contactlessly outputting information stored in the IC chip to a reader. There are several types of such RFID tags, including active types that have their own power source, and passive types that are powered by radio waves such as UHF bands or microwaves irradiated from a reader. Of these, passive types of RFID tags are inexpensive and are therefore used for a variety of purposes such as distribution and item management.

However, when an RFID tag using a planar antenna is placed near a metal object, the radio waves may be affected by the metal object. For this reason, an RFID tag using a planar antenna may experience a severe deterioration in communication distance when placed near a metal object. To address this issue, it has been found that the use of an antenna with a three-dimensional structure, such as a helical antenna, is effective.

As an antenna with a three-dimensional structure, a wireless IC device using a helical antenna has been proposed (see, for example, Patent Document 1). Also, an antenna with a three-dimensional structure has been proposed as an antenna for communication (see, for example, Patent Document 2).

JP 2009-20835 A Japanese Patent Application Publication No. 11-330833

Patent Document 1 discloses a resin-molded helical conductor as a helical antenna. Patent Document 1 also discloses mounting a wireless IC chip on a power supply conductor that is also resin-molded. Patent Document 2 discloses forming a power supply pattern that serves as an antenna element on the surface of a dielectric sheet. Patent Document 2 also proposes an antenna in which a dielectric sheet is attached to the side of a columnar, cylindrical, or conical dielectric support. In Patent Document 2, the IC is provided externally.

When the helical antenna is resin molded as in Patent Document 1, it is necessary to manufacture the wireless IC device individually, which may increase the cost of the wireless IC device. Also, in molding as in Patent Document 1, it is necessary to mount the wireless IC chip individually, which may increase the cost. Also, when the IC is provided externally as in Patent Document 2, it is necessary to provide a power feed point at the end of the dielectric sheet. And when the antenna also serves as the power feed and matching circuit, it is necessary to connect both ends of the antenna to the IC. For this reason, there are cases where the number of turns and the winding diameter of the antenna are restricted. Therefore, it would be preferable if it were possible to increase the degree of freedom in the number of turns and the winding diameter of the antenna while reducing costs.

The present invention aims to provide an RFID tag, an RFID tag manufacturing device, and an RFID tag manufacturing method that can reduce costs while improving the flexibility of the number of turns and winding diameter of the antenna.

The present invention relates to an RFID tag that includes a strip-shaped substrate, a conductive filament arranged on at least one surface of the substrate and inclined relative to the longitudinal direction of the substrate, and an IC arranged over the filament.

It is also preferable that the distance from one side of the base material in the longitudinal direction of the filament is different at any two points along the longitudinal direction of the base material.

It is also preferable that the filament is inclined at least in part in the direction along the length of the substrate.

It is also preferable that the filament is folded back at one end of the substrate, and the IC is placed over the folded back position of the filament.

It is also preferable that the substrate is wound along its length.

In addition, it is preferable that the RFID tag further includes a cover body that stores the base material, the filament, and the IC in a wound state and maintains the wound state.

It is also preferable that the RFID tag further includes an adjustment unit capable of adjusting the deflection of the substrate.

The present invention also relates to an RFID tag manufacturing device for manufacturing the above-mentioned RFID tags, the RFID tag manufacturing device comprising: a raw material holding section that holds a roll-shaped raw material on which pairs of the IC and the filament are arranged side by side in the width direction so that the roll can be pulled out; a cutter that cuts the pulled-out raw material in the length direction, separating each pair of the IC and the filament; and a winding section that winds up each of the separated raw materials.

The present invention also relates to a method for manufacturing an RFID tag for manufacturing the above-mentioned RFID tag, comprising a paper-passing process for pulling out a roll of raw material on which pairs of the IC and the filament are arranged side by side in the width direction, a cutting process for cutting the pulled-out raw material along the length direction, in which the pairs of the IC and the filament are separated from each other, and a winding process for winding up each of the separated raw material.

The present invention provides an RFID tag, an RFID tag manufacturing device, and an RFID tag manufacturing method that can reduce costs while improving the flexibility of the number of turns and winding diameter of the antenna.

1 is a schematic plan view showing an RFID tag according to a first embodiment of the present invention. FIG. 2 is a plan view showing one surface of a substrate of the RFID tag of the first embodiment. 4A to 4C are schematic diagrams illustrating an example of adjustment by an adjustment unit of the RFID tag of the first embodiment. FIG. 2 is a plan view showing an original sheet of the RFID tag according to the first embodiment. 1 is a schematic plan view showing a manufacturing apparatus for manufacturing an RFID tag according to a first embodiment. 2 is a schematic diagram showing an original sheet of the RFID tag of the first embodiment cut along the length direction. FIG. 1 is a schematic diagram showing an original sheet (RFID roll) cut along the width direction of the RFID tag of the first embodiment. FIG. 11 is a plan view showing one surface of a substrate of an RFID tag according to a second embodiment of the present invention. FIG. FIG. 11 is a plan view showing another example of the base material of the RFID tag according to the second embodiment. FIG. 13 is a plan view showing another example of the base material of the RFID tag according to the third embodiment. FIG. 13 is a plan view showing a base material of an RFID tag according to a modified example. FIG. 13 is a plan view showing a base material of an RFID tag according to a modified example. FIG. 13 is a plan view showing a base material of an RFID tag according to a modified example.

Hereinafter, an RFID tag 1, an apparatus 100 for manufacturing the RFID tag 1, and a method for manufacturing the RFID tag 1 according to each embodiment of the present invention will be described with reference to FIGS.
First, an overview of the RFID tag 1 according to each embodiment will be described.

The RFID tag 1 according to each embodiment is a tag having an antenna with a three-dimensional structure, as shown in FIG. 1, for example. The RFID tag 1 having an antenna with a three-dimensional structure is capable of communication while suppressing deterioration of the communication distance, even when placed near a metal body (not shown). In the RFID tag 1 according to each embodiment, the base material on which the antenna is arranged is wound in multiple layers along one surface, forming a conical spiral antenna whose diameter increases with each winding by the thickness of the base material. In the RFID tag 1 according to each embodiment, an antenna with multiple circumferences of different diameters is formed. Since the frequency bands at which suitable radiation is obtained are different at each circumference, a wideband RFID tag 1 can be obtained.

[First embodiment]
Next, an RFID tag 1, an apparatus 100 for manufacturing the RFID tag 1, and a method for manufacturing the RFID tag 1 according to the first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2 , the RFID tag 1 according to this embodiment includes a substrate 11, a filament 12, an IC 13, a cover 14, and an adjustment section 15.

The substrate 11 is formed of, for example, paper, a plastic film, or the like. As shown in FIG. 2, the substrate 11 is configured in a strip shape. In this embodiment, the substrate 11 is configured in a rectangular shape. The substrate 11 is configured by being wound in the length direction. For example, the substrate 11 is configured in a cylindrical shape by being wound multiple times.

The filament 12 is a so-called antenna. The filament 12 is made of a conductive material such as a metal. For example, as shown in FIG. 2, the filament 12 is arranged on at least one surface of the substrate 11 and is inclined with respect to the longitudinal direction of the substrate 11. In this embodiment, the filament 12 has different distances from one side of the substrate 11 in the longitudinal direction at any two points along the longitudinal direction of the substrate 11. That is, the filament 12 is inclined as a whole with respect to the longitudinal direction of the substrate 11. In addition, in this embodiment, the filament 12 is arranged on the outer surface of the substrate 11 around which it is wound. As a result, the filament 12 is configured in a spiral shape whose diameter gradually increases from one end side to the other end side. That is, the filament 12 is configured in a conical spiral antenna shape whose diameter increases by the thickness of the substrate 11 with each winding of the substrate 11.

The IC 13 is, for example, arranged on top of the filament 12. The IC 13 includes, for example, a resonant circuit (a power supply circuit and a matching circuit). In this embodiment, the IC 13 is arranged on the same surface of the substrate 11 as the surface on which the filament 12 is arranged. The IC 13 is, for example, arranged close to the center position in each of the length direction and width direction of the substrate 11.

The cover body 14 is formed, for example, from a resin material. In this embodiment, the cover body 14 is configured as a bottomed cylinder with one end in the longitudinal direction that is open. The cover body 14 is capable of housing the substrate 11, the filament 12, and the IC 13. In addition, the outer peripheral end of one longitudinal end of the substrate 11 housed inside is attached to the inner peripheral surface of the cover body 14.

The adjustment section 15 is formed, for example, from a resin material. In this embodiment, the adjustment section 15 is a rod-shaped body. The adjustment section 15 includes a body section 151 and an enlarged diameter section 152.

The body 151 is formed with a diameter smaller than the inner diameter of the cover body 14. The body 151 is also formed with a length shorter than the length of the cover body 14. The body 151 is arranged in a state where it is inserted into the interior through the opening of the cover body 14. The body 151 is also arranged with one end of the substrate 11 on the inner diameter side of one of its longitudinal ends attached to its circumferential surface. In other words, the body 151 is arranged with the substrate 11, the filament 12, and the IC 13 wrapped around it.

The enlarged diameter portion 152 is disposed at one end of the body 151. The enlarged diameter portion 152 is formed with a diameter larger than that of the body 151. The enlarged diameter portion 152 is also formed with a diameter larger than the inner diameter of the cover body 14. In this embodiment, the enlarged diameter portion 152 is formed in a substantially conical shape having a bottom (not shown) configured with the same or substantially the same diameter as the outer shape of the cover body 14. The enlarged diameter portion 152 is also disposed with its axis aligned with the axis of the body 151. The enlarged diameter portion 152 is disposed at the position of the opening end of the cover body 14. The enlarged diameter portion 152 is also attached to the cover body 14 so as to be rotatable about the axis. In other words, the enlarged diameter portion 152 is attached to the cover body 14 so as to be rotatable about the axis of the body 151.

Next, the operation of the RFID tag 1 will be described.
The RFID tag 1 is attached to, for example, an object. In response to receiving radio waves from a handheld reader (not shown), the RFID tag 1 radiates information stored in the IC 13 on the radio waves. At this time, the RFID tag 1 radiates radio waves from the filament 12, which is a conical spiral antenna. Therefore, the RFID tag 1 can have a wide band.

When the preferred frequency band is changed, the adjustment unit 15 is rotated relative to the cover body 14. Specifically, the enlarged diameter portion 152 is rotated around the axis relative to the cover body 14. As a result, the body portion 151 rotates around the axis together with the enlarged diameter portion 152. The rotation of the body portion 151 around the axis changes the winding diameter of the substrate 11. That is, the winding diameter of the filament 12 is enlarged or reduced. For example, as shown in the upper part of FIG. 3, the winding diameter of the filament is reduced by rotating the body portion 151 in the direction of winding the substrate. On the other hand, as shown in the lower part of FIG. 3, the winding diameter of the filament is enlarged by rotating the body portion 151 in the direction of unwinding the substrate. The preferred frequency band can be changed by changing the winding diameter of the filament. The winding diameter of the RFID tag 1 can be adjusted using the adjustment unit 15 so that, for example, a handheld reader can receive radio waves.

Next, the manufacturing apparatus 100 for the RFID tag 1 will be described with reference to FIGS.
The manufacturing apparatus 100 for the RFID tag 1 includes an original roll unwinding section 101 , a cutter 102 , and a winding section 103 .

As shown in Figs. 4 and 5, the original roll unwinding section 101 holds the rolled original roll A in which pairs of ICs 13 and filaments 12 are arranged side by side in the width direction so that it can be unwound. The original roll unwinding section 101 holds the rolled original roll A by, for example, axially fixing it. In this embodiment, the original roll unwinding section 101 arranges pairs of ICs 13 and filaments 12 in the unwinding direction as well.

The cutter 102 includes, for example, a rotary cutter 112 and a cutting cutter 113. The rotary cutter 112 cuts the raw roll A along its length (the direction in which it is pulled out). In this way, the rotary cutter 112 separates each set of IC 13 and wire 12. The rotary cutter 112 has, for example, a plurality of blades (not shown) arranged at intervals that correspond to the width of the substrate 11 along the width direction of the raw roll A. In this way, the rotary cutter 112 separates the width direction of the raw roll A into a width that corresponds to the width of the substrate 11, as shown in FIG. 6.

The cutting cutter 113 is disposed after the rotary cutter 112. As shown in FIG. 7, the cutting cutter 113 cuts each piece of the original fabric A, which has been cut along the length direction, in the width direction at a predetermined interval. The cutting cutter 113 cuts the original fabric A at intervals of, for example, 1 m or 3 m. This makes it possible to change the number of turns of the original fabric A.

The winding unit 103 is provided in accordance with the number of the separated original rolls A. The winding unit 103 winds up each of the separated original rolls A. In this way, the winding unit 103 produces a roll of multiple RFID tags 1 (e.g., referred to as an RFID roll B) in which multiple RFID tags 1 are continuously arranged in a strip shape.

Next, a method for manufacturing the RFID tag 1 will be described.
The manufacturing method of the RFID tag 1 includes a paper passing step, a cutting step, and a winding step.

In the paper passing process, a roll-shaped raw material A in which pairs of ICs 13 and filaments 12 are arranged side by side in the width direction as shown in FIG. 4 is set in the raw material unwinding section 101 of the manufacturing device 100. Next, the raw material A set in the raw material unwinding section 101 is pulled out and passed through a predetermined location in the manufacturing device 100.

Next, in the cutting process, the pulled-out original fabric A is cut along the length direction. In the cutting process, the original fabric A is cut to separate each set of IC 13 and filament 12.

Next, in the winding process, each of the separated rolls A is wound up. This produces RFID roll B. RFID tag 1 is produced by further separating RFID roll B in the length direction.

According to the RFID tag 1, the manufacturing apparatus 100 for the RFID tag 1, and the manufacturing method for the RFID tag 1 of the present embodiment described above, the following effects are achieved.
(1) An RFID tag 1 comprising a strip-shaped substrate 11, a conductive filament 12 arranged on at least one surface of the substrate 11 and inclined with respect to the longitudinal direction of the substrate 11, and an IC 13 arranged overlapping the filament 12. This allows the RFID tag 1 to be manufactured by simply arranging the filament 12 and the IC 13 on the substrate 11, thereby reducing costs. In addition, a conical antenna can be formed by simply winding the substrate 11, and the number of turns and the winding diameter can be easily changed by simply changing the winding specifications. This improves the degree of freedom of the number of turns and the winding diameter of the antenna. By changing the number of turns and the winding diameter of the antenna, the impedance characteristics and radiation characteristics of the antenna can be changed.

(2) The filament 12 has two points along the length of the substrate 11 at different distances from one side of the substrate 11. This makes it possible to form a conical spiral antenna with multiple circumferences of different diameters. This makes it possible to make the RFID tag 1 have a wider bandwidth.

(3) The substrate 11 is wound along the length direction. This makes it easier to construct a conical spiral antenna.

(4) The RFID tag 1 further includes a cover body that stores the substrate 11, the filament 12, and the IC 13 in a wound state and maintains the wound state. The RFID tag 1 further includes an adjustment unit that can adjust the deflection of the substrate. The RFID tag 1 further includes a cover body 14 that can store the substrate 11, the filament 12, and the IC 13 and has an adjustment unit 15 that can adjust the deflection of the substrate 11. This allows the winding width and winding diameter to be changed by adjusting the winding direction of the substrate 11 using the adjustment unit 15. Therefore, RFID tags 1 with different radiation characteristics can be easily obtained. In other words, the frequency band that is preferably radiated by the RFID tag 1 can be easily changed, improving the versatility of the RFID tag 1.

(5) A manufacturing apparatus 100 for manufacturing the RFID tag 1 includes a roll-shaped original A holding unit 101 that holds the roll-shaped original A in which pairs of ICs 13 and filaments 12 are arranged side by side along the width direction so that the original A can be pulled out, a cutter 102 that cuts the pulled-out original A along the length direction, the cutter 102 separating each pair of ICs 13 and filaments 12, and a winding unit 103 that winds up each separated original A. A manufacturing method for the RFID tag 1 for manufacturing the RFID tag 1 includes a pulling-out process for pulling out the roll-shaped original A in which pairs of ICs 13 and filaments 12 are arranged side by side along the width direction, a cutting process for cutting the pulled-out original A along the length direction, the cutting process separating each pair of ICs 13 and filaments 12, and a winding process that winds up each separated original A. This makes it possible to easily obtain the RFID tag 1 (RFID roll B) from the original A, and reduces the manufacturing cost of the RFID tag 1. In addition, by using a roll of raw material A, it is possible to use ICs 13 that are continuously mounted on the substrate 11, which is advantageous for mass production compared to mounting ICs 13 on a molded antenna.

[Second embodiment]
Next, an RFID tag 1, an apparatus 100 for manufacturing the RFID tag 1, and a method for manufacturing the RFID tag 1 according to a second embodiment of the present invention will be described with reference to Fig. 8 and Fig. 9. In describing the second embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified.
8 and 9, the RFID tag 1 according to the second embodiment differs from the first embodiment in that the filament 12 is inclined at least in a portion thereof in a direction along the length direction of the base material 11. The filament 12 is configured to include, for example, a position where it is inclined with respect to the length direction and a position where it is not inclined.

The operation of the RFID tag 1 will now be described.
By winding the substrate 11, the filament 12 forms a conical spiral antenna at an inclined position. The filament 12 also forms a spiral antenna at a non-inclined position. The filament 12 affects the reactance at the position of the spiral antenna and contributes to the impedance between the IC 13 and the filament 12. The impedance width can be expanded by changing the location of the non-inclined position in accordance with the impedance characteristics of the IC 13. Therefore, even IC 13 tags with different impedance characteristics can be used in the RFID tag 1 by changing the antenna pattern.

According to the RFID tag 1, the manufacturing apparatus 100 for the RFID tag 1, and the manufacturing method for the RFID tag 1 of the present embodiment described above, the following effects are achieved.
(6) At least a portion of the filament 12 is inclined in the longitudinal direction of the substrate 11. This allows a conical spiral antenna and a spiral antenna to coexist. This makes it easy to configure the RFID tag 1 to correspond to the impedance characteristics of the IC 13.

[Third embodiment]
Next, an RFID tag 1, an apparatus 100 for manufacturing the RFID tag 1, and a method for manufacturing the RFID tag 1 according to a third embodiment of the present invention will be described with reference to Fig. 10. In describing the third embodiment, the same components as those in the above-described embodiments are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified.
The RFID tag 1, the manufacturing apparatus 100 for the RFID tag 1, and the manufacturing method for the RFID tag 1 according to the third embodiment differ from the first and second embodiments in that the filament 12 is folded back and disposed at one end of the base material 11. The RFID tag 1, the manufacturing apparatus 100 for the RFID tag 1, and the manufacturing method for the RFID tag 1 according to the third embodiment also differ from the first and second embodiments in that the IC 13 is disposed overlapping the folded back position of the filament 12.

According to the RFID tag 1, the manufacturing apparatus 100 for the RFID tag 1, and the manufacturing method for the RFID tag 1 of the present embodiment described above, the following effects are achieved.
(7) The filament 12 is folded back at one end of the substrate 11, and the IC 13 is placed overlapping the folded back position of the filament 12. This allows the antenna length of the conical spiral antenna to be longer. In addition, when a metal plate (not shown) is placed in a direction intersecting the axis, the spiral portion functions as a ground with respect to the metal plate, making it less susceptible to the influence of the metal plate. Even if there is no metal plate, the spiral portion functions as a ground to some extent, making it possible to achieve both a conical antenna and a spiral antenna.

Although the preferred embodiments of the RFID tag, the RFID tag manufacturing apparatus 100, and the RFID tag manufacturing method of the present invention have been described above, the present invention is not limited to the above-described embodiments and can be modified as appropriate.
For example, in the above embodiment, the cover body 14 may include an indication portion (not shown) indicating the degree of adjustment of the adjustment portion 15. The indication portion may indicate, for example, the value of a frequency band for setting. The adjustment portion 15 may be aligned with the position of the indication portion to adjust the winding width and the number of windings of the filament 12 to the values of the aligned indication portion.

In the above embodiment, the substrate 11 is wound so that the surface on which the filament 12 is arranged faces outward, but this is not limited thereto. The substrate 11 may be wound so that the surface on which the filament 12 is arranged faces inward.

In the above embodiment, when the filament 12 is folded back at one end of the substrate 11, the folded filament 12 may extend along the length of the substrate 11. This makes it possible to configure a pseudo-end-fire RFID tag 1 in which radiation is greater toward the inclined portion of the filament 12. In the above first embodiment, as shown in FIG. 8, the IC 13 may be disposed at one corner of the substrate 11, and a circular metal plate may be disposed on the widthwise edge of the substrate 11 adjacent to the IC 13. This makes it possible to configure an end-fire RFID tag 1.

In addition, in the above embodiment, the adjustment unit is movable in the circumferential direction of the cover body 14, but this is not limited to the above. For example, the adjustment unit may be configured to be slidable in the longitudinal direction of the cover body 14, so that the axial direction of the filament 12 can be shifted along the longitudinal direction of the cover body 14.

In the above embodiment, the IC 13 may be disposed at one end of the substrate 11 in the longitudinal direction, as shown in FIG. 11. In this case, the metal plate 16 is disposed adjacent to the IC 13 at one end of the substrate 11 in the width direction. This allows an end-fire type RFID tag 1 to be constructed.

In addition, in the above embodiment, an IC 13 having a built-in resonant circuit is exemplified, but this is not limiting. For example, if the IC 13 does not have a resonant circuit, the RDID tag 1 may further include a resonant circuit 17, as shown in Figures 12 and 13.

In the above embodiment, the RFID tag 1 is provided with the adjustment unit 15, but this is not limited to this. In this case, the outer peripheral end of the base material 11 in the wound state may be wrapped and secured with a seal. For example, the outer peripheral end of the base material 11 may be taped to the outer peripheral surface to prevent the base material 11 from becoming unwound. The adjustment unit 15 may be fixed to the cover body 14 in the same shape. The cover body 14 may also prevent the base material 11 from becoming unwound by contacting the outer peripheral surface of the base material 11 with its inner peripheral surface. In this way, RFID tags 1 with the same or approximately the same number of turns and winding diameter can be easily mass-produced.

In addition, in the above embodiment, the adjustment unit 15 is rotated relative to the cover body 14 to adjust the deflection of the base material 11, but this is not limited to the above. The deflection of the base material 11 may be adjusted by rotating the cover body 14 relative to the adjustment unit 15.

REFERENCE SIGNS LIST 1 RFID tag 11 Substrate 12 Wire 13 IC
14 Cover body 15 Adjustment section 100 Manufacturing device 101 Raw roll unwinding section 102 Cutter 103 Winding section A Raw roll

Claims (5)

An RFID tag,
A strip-shaped substrate;
A conductive filament is disposed on at least one surface of the substrate and is inclined with respect to a longitudinal direction of the substrate;
An IC disposed over the filament;
Equipped with
The substrate is wound multiple times,
The filament is a conical spiral antenna having a spiral shape whose diameter gradually increases from one end side to the other end side of the filament .
RFID tag. The RFID tag according to claim 1, wherein the filament has different distances from one side of the base material in the longitudinal direction at any two points along the longitudinal direction of the base material. The RFID tag according to claim 1, wherein the filament is inclined at least in part in a direction along the length of the substrate. The RFID tag according to any one of claims 1 to 3 further comprises a cover body that stores the base material, the filament, and the IC in a wound state and maintains the wound state. The RFID tag according to any one of claims 1 to 3, further comprising an adjustment unit capable of adjusting the deflection of the base material.

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